JP5915100B2 - Mirror device, mirror device manufacturing method, optical scanner, and image forming apparatus - Google Patents

Description

  The present invention relates to a mirror device, a mirror device manufacturing method, an optical scanner, and an image forming apparatus.

For example, Patent Document 1 discloses an optical scanner that scans light two-dimensionally as an optical scanner for performing drawing by optical scanning with a projector, a printer, or the like.
The optical scanner described in Patent Document 1 includes a frame-shaped drive member and a pair of first shaft members that support the drive member so that the drive member can be rotated about the X axis. The movable plate is supported on both sides of the drive member so that the first vibration system, the movable plate provided inside the drive member, and the movable plate can be rotated around the Y axis orthogonal to the X axis. A second vibration system composed of a pair of second shaft members, a permanent magnet provided on the drive member, a coil provided to face the permanent magnet, and a voltage applied to the coil The driving unit includes a voltage applying unit, and a spacer interposed between the driving member and the permanent magnet so as to form a space that prevents interference (contact) with the movable plate. The permanent magnet is provided such that a line segment connecting both poles is inclined with respect to the X axis and the Y axis in a plan view of the movable plate. The permanent magnet is joined to the spacer by an adhesive.

However, the optical scanner described in Patent Document 1 requires a step of forming a spacer and a step of bonding a permanent magnet to the spacer with an adhesive in the manufacture thereof, and there is a problem that it takes time and effort to manufacture. .
Further, since the permanent magnet and the spacer are joined by the adhesive, there is a problem that the permanent magnet is peeled off from the spacer in a high temperature and high humidity environment.

JP 2008-216920 A

  An object of the present invention is to reduce the size and cost of the apparatus, reduce the labor for manufacturing, prevent the magnet from peeling, and make the movable plate orthogonal to the first axis and the first axis. An object of the present invention is to provide a mirror device, a mirror device manufacturing method, an optical scanner, and an image forming apparatus that can be rotated (swinged) around a second axis.

Such an object is achieved by the present invention described below.
A mirror device of the present invention includes a light reflecting portion having light reflectivity, and a movable plate that can swing around a first axis;
A first shaft member connected to both ends of the movable plate in the direction along the first axis;
A frame-shaped member that surrounds the movable plate, is connected to the first shaft member, and is swingable around a second axis orthogonal to the first axis;
A second shaft member connected to both ends of the frame-shaped member in a direction along the second axis;
A magnet that is disposed on the frame-shaped member and has a longitudinal shape in which one magnetic pole and the other magnetic pole are disposed to sandwich the first axis and the second axis, respectively.
The frame-shaped member and the magnet are joined between the frame-shaped member and the magnet so as to form a space for preventing the movable plate and the magnet from coming into contact with each other. One solder layer and a second solder layer;
A first base layer interposed between the frame-shaped member and the first solder layer and having higher wettability of the solder than the frame-shaped member; the frame-shaped member and the second solder layer; And a second underlayer having higher wettability of the solder than the frame-shaped member.
Thereby, the movable plate can be rotated (swinged) around the first axis and the second axis orthogonal to the first axis while reducing the size and cost of the apparatus.

In addition, since the first solder layer and the second solder layer each have a function of joining the frame-shaped member and the magnet and a function of a spacer, a step of separately forming a spacer during manufacturing. Can be eliminated, and the labor for manufacturing can be reduced.
Moreover, since the frame-shaped member and the magnet are joined by the first solder layer and the second solder layer, the frame-shaped member and the magnet can be firmly joined, and even in a high-temperature and high-humidity environment. It can prevent that a magnet peels from a frame-shaped member.

In the mirror device of the present invention, the volumes of the first solder layer and the second solder layer are equal,
One end of the magnet in the longitudinal direction is joined by the first solder layer, and the other end in the longitudinal direction of the magnet is joined by the second solder layer,
The areas of the first underlayer and the second underlayer are equal,
An end of the first underlayer opposite to the second underlayer in the longitudinal direction of the magnet, and an end of the second underlayer opposite to the first underlayer in the longitudinal direction of the magnet. It is preferable that the distance between the ends is longer than the length of the magnet in the longitudinal direction.
As a result, the heights of the first solder layer and the second solder layer are equal, and the separation distance from the frame-shaped member at one end of the magnet and the separation distance from the frame-shaped member at the other end And the movable plate can be smoothly rotated around the first axis and the second axis.

In the mirror device of the present invention, the volumes of the first solder layer and the second solder layer are equal,
One end of the magnet in the longitudinal direction is joined by the first solder layer, and the other end in the longitudinal direction of the magnet is joined by the second solder layer,
The areas of the first underlayer and the second underlayer are equal,
The first underlayer protrudes from the one end of the magnet in the longitudinal direction of the magnet, and the second underlayer protrudes from the other end of the magnet in the longitudinal direction of the magnet. Preferably it is.
As a result, the heights of the first solder layer and the second solder layer are equal, and the separation distance from the frame-shaped member at one end of the magnet and the separation distance from the frame-shaped member at the other end And the movable plate can be smoothly rotated around the first axis and the second axis.

In the mirror device of the present invention, it is preferable that each of the first underlayer and the second underlayer is made of metal.
Thereby, the wettability of the solder of the first underlayer and the second underlayer can be improved.
In the mirror device of the present invention, a third underlayer interposed between the magnet and the first solder layer and having higher wettability of the solder than the magnet, the magnet and the second solder layer And a fourth underlayer having higher solder wettability than the magnet.
Thereby, a frame-shaped member and a magnet can be joined more firmly.
In the mirror device of the present invention, it is preferable that each of the third underlayer and the fourth underlayer is made of metal.
Thereby, the wettability of the solder of the third underlayer and the fourth underlayer can be improved.

The method for manufacturing a mirror device of the present invention comprises a light reflecting portion having light reflectivity, and a movable plate that can swing around a first axis;
A first shaft member connected to both ends of the movable plate in the direction along the first axis;
A frame-shaped member that surrounds the movable plate, is connected to the first shaft member, and is swingable around a second axis orthogonal to the first axis;
A second shaft member connected to both ends of the frame-shaped member in a direction along the second axis;
A method of manufacturing a mirror device, comprising: a magnet having a longitudinal shape disposed on the frame-shaped member, wherein one of the magnetic poles and the other magnetic pole are disposed with the first axis and the second axis interposed therebetween, respectively. There,
Forming each of the first underlayer and the second underlayer having higher solder wettability than the frame-shaped member on the frame-shaped member;
Solder is disposed on each of the first underlayer and the second underlayer, the solder is melted, a first solder layer is formed, and the first solder layer is used to form the magnet or before magnetization. Joining the magnet to the first underlayer, forming a second solder layer, and joining the magnet or the magnet before magnetization to the second underlayer by the second solder layer, Forming a space for preventing contact between the movable plate and the magnet by the first solder layer and the second solder layer.
Thereby, the mirror device of this invention can be manufactured easily and reliably.

That is, since the first solder layer and the second solder layer each have a function of joining the frame-shaped member and the magnet and a function of a spacer, a step of separately forming a spacer during manufacturing. Can be eliminated, and the labor for manufacturing can be reduced.
In addition, when joining magnets after magnetization or before magnetization, the magnet is automatically moved to an appropriate position by the molten solder on the first underlayer and the second underlayer, and the magnet Therefore, the magnet can be easily and reliably positioned at an appropriate position.

In the method for manufacturing a mirror device according to the present invention, after the first underlayer and the second underlayer are respectively formed at predetermined positions on the substrate, the substrate is processed into a predetermined shape, and the frame-shaped member and Preferably, the first shaft member, the movable plate, and the second shaft member are respectively formed.
Thereby, when forming the frame-shaped member, at the same time, the first base layer and the second base layer in the frame-shaped member can be respectively positioned, thereby reducing the manufacturing process, Moreover, the position of the 1st foundation layer and the 2nd foundation layer in a frame-shaped member can be set correctly.

In the method for manufacturing a mirror device of the present invention, the solder disposed on the first underlayer and the second underlayer is a solder ball,
The height of the first solder layer is adjusted by the number of solder balls arranged on the first underlayer, and the second solder is adjusted by the number of solder balls arranged on the second underlayer. It is preferable to adjust the height of the layer.
Thereby, the heights of the first solder layer and the second solder layer can be adjusted reliably.

An optical scanner of the present invention includes a light reflecting portion having light reflectivity, and a movable plate that can swing around a first axis;
A first shaft member connected to both ends of the movable plate in the direction along the first axis;
A frame-shaped member that surrounds the movable plate, is connected to the first shaft member, and is swingable around a second axis orthogonal to the first axis;
A second shaft member connected to both ends of the frame-shaped member in a direction along the second axis;
A magnet that is disposed on the frame-shaped member and has a longitudinal shape in which one magnetic pole and the other magnetic pole are disposed to sandwich the first axis and the second axis, respectively.
The frame-shaped member and the magnet are joined between the frame-shaped member and the magnet so as to form a space for preventing the movable plate and the magnet from coming into contact with each other. One solder layer and a second solder layer;
A first base layer interposed between the frame-shaped member and the first solder layer and having higher wettability of the solder than the frame-shaped member; the frame-shaped member and the second solder layer; A second underlayer having a higher wettability of the solder than the frame-shaped member,
A coil that is disposed opposite to the frame-like member and generates a magnetic field that acts on the magnet by application of a voltage;
Voltage application means for applying a voltage to the coil,
The voltage applying means includes: a first voltage generating unit that generates a first voltage having a first frequency; a second voltage generating unit that generates a second voltage having a second frequency different from the first frequency; A voltage superimposing unit that superimposes the first voltage and the second voltage, and applying the voltage superimposed by the voltage superimposing unit to the coil, thereby moving the movable plate at the first frequency. It is configured to swing around the second axis and swing around the first axis at the second frequency.
Thereby, the movable plate can be rotated (swinged) around the first axis and the second axis orthogonal to the first axis while reducing the size and cost of the apparatus.

In addition, since the first solder layer and the second solder layer each have a function of joining the frame-shaped member and the magnet and a function of a spacer, a step of separately forming a spacer during manufacturing. Can be eliminated, and the labor for manufacturing can be reduced.
Moreover, since the frame-shaped member and the magnet are joined by the first solder layer and the second solder layer, the frame-shaped member and the magnet can be firmly joined, and even in a high-temperature and high-humidity environment. It can prevent that a magnet peels from a frame-shaped member.

An image forming apparatus according to the present invention includes a light reflecting portion having light reflectivity, and a movable plate that can swing around a first axis;
A first shaft member connected to both ends of the movable plate in the direction along the first axis;
A frame-shaped member that surrounds the movable plate, is connected to the first shaft member, and is swingable around a second axis orthogonal to the first axis;
A second shaft member connected to both ends of the frame-shaped member in a direction along the second axis;
A magnet that is disposed on the frame-shaped member and has a longitudinal shape in which one magnetic pole and the other magnetic pole are disposed to sandwich the first axis and the second axis, respectively.
The frame-shaped member and the magnet are joined between the frame-shaped member and the magnet so as to form a space for preventing the movable plate and the magnet from coming into contact with each other. One solder layer and a second solder layer;
A first base layer interposed between the frame-shaped member and the first solder layer and having higher wettability of the solder than the frame-shaped member; the frame-shaped member and the second solder layer; A second underlayer having a higher wettability of the solder than the frame-shaped member,
A coil that is disposed opposite to the frame-like member and generates a magnetic field that acts on the magnet by application of a voltage;
Voltage application means for applying a voltage to the coil,
The voltage applying means includes: a first voltage generating unit that generates a first voltage having a first frequency; a second voltage generating unit that generates a second voltage having a second frequency different from the first frequency; A voltage superimposing unit that superimposes the first voltage and the second voltage, and applying the voltage superimposed by the voltage superimposing unit to the coil, thereby moving the movable plate at the first frequency. It is configured to swing around the second axis and swing around the first axis at the second frequency.
Thereby, the movable plate can be rotated (swinged) around the first axis and the second axis orthogonal to the first axis while reducing the size and cost of the apparatus.

In addition, since the first solder layer and the second solder layer each have a function of joining the frame-shaped member and the magnet and a function of a spacer, a step of separately forming a spacer during manufacturing. Can be eliminated, and the labor for manufacturing can be reduced.
Moreover, since the frame-shaped member and the magnet are joined by the first solder layer and the second solder layer, the frame-shaped member and the magnet can be firmly joined, and even in a high-temperature and high-humidity environment. It can prevent that a magnet peels from a frame-shaped member.

It is a top view which shows 1st Embodiment of the optical scanner of this invention. It is the sectional view on the AA line of FIG. It is a block diagram which shows the voltage application means of the drive means with which the optical scanner shown in FIG. 1 is provided. It is a figure which shows an example of the voltage generated in the 1st voltage generation part shown in FIG. 3, and a 2nd voltage generation part. It is a top view which shows the mirror device of the optical scanner shown in FIG. It is sectional drawing for demonstrating the 1st manufacturing method of the mirror device of the optical scanner shown in FIG. It is sectional drawing for demonstrating the 1st manufacturing method of the mirror device of the optical scanner shown in FIG. It is sectional drawing for demonstrating the 1st manufacturing method of the mirror device of the optical scanner shown in FIG. It is sectional drawing for demonstrating the 2nd manufacturing method of the mirror device of the optical scanner shown in FIG. It is sectional drawing for demonstrating the 2nd manufacturing method of the mirror device of the optical scanner shown in FIG. It is sectional drawing for demonstrating the 2nd manufacturing method of the mirror device of the optical scanner shown in FIG. It is a top view which shows 2nd Embodiment of the optical scanner of this invention. It is CC sectional view taken on the line of FIG. 1 is a diagram schematically showing an embodiment of an image forming apparatus of the present invention.

Preferred embodiments of a mirror device, a mirror device manufacturing method, an optical scanner, and an image forming apparatus according to the present invention will be described below with reference to the accompanying drawings. In the following embodiment, a case where the mirror device of the present invention is applied to an optical scanner will be described as a representative example.
<First Embodiment>
1 is a plan view showing a first embodiment of the optical scanner of the present invention, FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1, and FIG. 3 is a voltage application of driving means provided in the optical scanner shown in FIG. FIG. 4 is a block diagram showing the means, and FIG. 4 is a diagram showing an example of the voltage generated in the first voltage generator and the second voltage generator shown in FIG. In the following, for convenience of explanation, the front side of the paper in FIG. 1 is called “up”, the back side of the paper is called “down”, the right side is called “right”, the left side is called “left”, and the upper side in FIG. The upper side, the lower side is called “lower”, the right side is called “right”, and the left side is called “left”.

  As shown in FIGS. 1 and 2, the optical scanner 10 includes a mirror device 1, a holder 17, a coil 30, and a voltage applying unit 40 that applies a voltage to the coil 30. The mirror device 1 includes a movable plate 11 including a movable plate main body 110 and a light reflecting portion 12 having light reflectivity, a pair of shaft members (first shaft members) 13a and 13b, a frame-shaped member 14, and 1 Solder for joining the pair of shaft members (second shaft members) 15 a and 15 b, the support frame 16, the permanent magnet (magnet) 20, the frame-shaped member 14, and the permanent magnet 20 to form the space 23. A layer (first solder layer) 21a, a solder layer (second solder layer) 21b, a base layer (first base layer) 22a interposed between the frame-shaped member 14 and the solder layer 21a, and a frame shape A base layer (second base layer) 22b interposed between the member 14 and the solder layer 21b; a base layer (third base layer) 22c interposed between the permanent magnet 20 and the solder layer 21a; An underlayer (fourth underlayer) 22d interposed between the magnet 20 and the solder layer 21b. There. The light reflecting portion 12 is provided on the upper surface of the movable plate main body 110.

  Movable plate 11 (light reflecting portion 12), shaft members 13a and 13b, frame member 14, shaft members 15a and 15b, permanent magnet 20, solder layers 21a and 21b, and base layers 22a, 22b and 22c. , 22d constitutes a second vibration system having the shaft members 15a, 15b as pivot axes, and the movable plate 11 (light reflecting portion 12) and the shaft members 13a, 13b constitute the shaft members 13a, 13b. A first vibration system having a rotation axis is configured.

The frame-like member 14 is supported on the support frame 16 by shaft members 15a and 15b. The movable plate 11 is disposed inside the frame-shaped member 14 and supported by the frame-shaped member 14 by shaft members 13a and 13b. That is, the frame-shaped member 14 surrounds the movable plate 11. The support frame 16 is supported by the holder 17.
The shape of the movable plate 11 is circular in a plan view in the illustrated configuration, but is not limited thereto, and may be, for example, a polygon such as an ellipse or a rectangle in a plan view. Further, the shape of the frame-like member 14 in the illustrated configuration has a circular outer shape in plan view, but is not particularly limited as long as it is a frame shape, and the outer shape in plan view is, for example, circular, It may be a polygon such as an ellipse or a rectangle.

  The shaft members 13a and 13b and the shaft members 15a and 15b can be elastically deformed, respectively. The shaft members 15a and 15b connect the frame-shaped member 14 and the support frame 16 so that the frame-shaped member 14 can rotate (swing) around the X axis (second axis) shown in FIG. . In this case, the shaft members 15 a and 15 b are connected to both ends of the frame-shaped member 14 in the direction along the X axis, and support the frame-shaped member 14 on both sides of the support frame 16. Further, the shaft members 13a and 13b connect the movable plate 11 and the frame-like member 14 so that the movable plate 11 can be rotated (swinged) around the Y axis (first axis) shown in FIG. Yes. In this case, the shaft members 13 a and 13 b are connected to both ends of the movable plate 11 in the direction along the Y axis, and support the movable plate 11 on both sides of the frame-like member 14. Note that the X axis and the Y axis are orthogonal to each other. Further, the center of the frame member 14 and the center of the movable plate 11 are located on the intersection of the X axis and the Y axis in the plan view of FIG. The axis lines of the shaft members 15a and 15b coincide with the X axis, and the axis lines of the shaft members 13a and 13b coincide with the Y axis.

By making the frame-like member 14 rotatable about the X axis and allowing the movable plate 11 to rotate about the Y axis, the movable plate 11 can be rotated about two axes orthogonal to the X axis and the Y axis. Can do.
The movable plate 11, the shaft members 13a and 13b, the frame member 14, the shaft members 15a and 15b, and the support frame 16 are integrally formed with, for example, silicon as a main material. By using silicon as a main material, it is possible to realize excellent rotation characteristics and to exhibit excellent durability. Further, fine processing (processing) is possible, and the optical scanner 10 can be downsized. These may be formed using a substrate having a laminated structure such as an SOI substrate. In this case, the movable plate 11, the shaft members 13a and 13b, the frame member 14, the shaft members 15a and 15b, and the support frame 16 are used. Are preferably formed of one layer of a laminated substrate.

The holder 17 is made of, for example, glass or silicon as a main material. The shape of the holder 17 is a concave shape in the configuration shown in the figure and is a quadrangle in plan view, but is not particularly limited as long as the support frame 16 can be supported. The joining method of the support frame 16 and the holder 17 is not specifically limited, For example, you may join using an adhesive agent and may join by anodic bonding. Further, for example, a SiO ₂ layer composed of SiO ₂ as a main material may be interposed between the support frame 16 and the holder 17.

  A permanent magnet 20 is provided on the lower surface of the frame member 14 (the surface facing the holder 17). The permanent magnet 20 is interposed via the underlayers 22a, 22b, 22c, and 22d by solder layers 21a and 21b having a spacer function for forming a space 23 that prevents interference (contact) between the permanent magnet 20 and the movable plate 11. Are joined to the frame-like member 14. That is, one end in the longitudinal direction of the permanent magnet 20 is joined to the frame-shaped member 14 by the solder layer 21a, and the other end in the longitudinal direction of the permanent magnet 20 is joined to the frame-shaped member 14 by the solder layer 20b. Yes. An underlayer 22a is interposed between the frame-shaped member 14 and the solder layer 21a, an underlayer 22b is interposed between the end of the frame-shaped member 14 and the solder layer 21b, and one end of the permanent magnet 20 A base layer 22c is interposed between the solder layer 21a and a base layer 22d is interposed between the other end of the permanent magnet 20 and the solder layer 21b.

A coil 30 that generates a magnetic field that acts on the permanent magnet 20 is provided on the upper surface of the holder 17. The coil 30 is electrically connected to the voltage applying means 40. The permanent magnet 20, the coil 30, and the voltage applying unit 40 constitute a driving unit that rotates the movable plate 11 and the frame-shaped member 14.
The permanent magnet 20 has a longitudinal shape, in the illustrated configuration, a plate-like and straight rod shape, and is magnetized in the longitudinal direction. That is, the direction of the line segment that connects the south pole and the north pole of the permanent magnet 20 coincides with the longitudinal direction of the permanent magnet 20. In other words, the line segment connecting the south pole and the north pole of the permanent magnet 20 coincides with the axis of the permanent magnet 20. The shape of the permanent magnet 20 is not particularly limited as long as it is a longitudinal shape.

  The permanent magnet 20 is arranged such that both poles sandwich the X axis and the Y axis, respectively. In other words, the permanent magnet 20 is disposed so that both end portions (each magnetic pole) are located in two regions divided by the X axis and in two regions divided by the Y axis. That is, the permanent magnet 20 is arranged so that the center thereof coincides with the center of the movable plate 11 and the axis thereof is inclined with respect to each of the X axis and the Y axis in the plan view of FIG.

  The angle θ between the X axis, that is, the axis of the shaft members 15a and 15b and the axis of the permanent magnet 20 (the inclination angle of the axis of the permanent magnet 20 with respect to the X axis) θ is not particularly limited, but is 30 ° or more and 60 ° or less. It is preferable that it is 40 ° or more and 50 ° or less, and more preferably 45 °. By providing the permanent magnet 20 in this manner, the movable plate 11 can be smoothly and reliably rotated around the X axis and the Y axis. On the other hand, if the inclination angle θ is less than the lower limit value, the movable plate 11 can be smoothly rotated around the X axis depending on various conditions such as the strength of the voltage applied to the coil 30 by the voltage applying means 40. It may not be possible to On the other hand, when the inclination angle θ exceeds the upper limit value, the movable plate 11 can be smoothly rotated around the Y axis depending on various conditions such as the strength of the voltage applied to the coil 30 by the voltage application means 40. There are cases where it is not possible.

As permanent magnet 20, what magnetized hard magnetic materials, such as a neodymium magnet, a ferrite magnet, a samarium cobalt magnet, an alnico magnet, and a bond magnet, can be used conveniently, for example.
When the optical scanner 10 is manufactured, the optical scanner 10 may be installed on the frame-shaped member 14 that has already been magnetized to become the permanent magnet 20, and a hard magnetic material before magnetization is used as the frame-shaped member 14. Then, the permanent magnet 20 may be obtained by magnetizing the hard magnetic material.

  The solder layers 21a and 21b are each made of solder. The solder to be used is not particularly limited. For example, Sn—Pb, Sn—Pb—Bi, Sn—Pb—Ag, Sn—Sb, Sn—Cu, Sn—Pb—Sb, Sn— Pb-Cu, Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi-Cu, Sn-In-Ag-Bi, Sn-Zn, Sn-Zn-Bi, Sn-Bi System, Sn-In system, Pb-Ag system, Au system and the like.

The solder layers 21a and 21b may each contain a material other than solder, for example, a compound having a flux function (activity).
The permanent magnet 20 is joined to the frame-shaped member 14 by solder layers 21a and 21b via base layers 22a, 22b, 22c and 22d. Thereby, the frame-shaped member 14 and the permanent magnet 20 can be joined firmly, and it can prevent that the permanent magnet 20 peels from the frame-shaped member 14 also in a hot and humid environment.

  In addition, the solder layers 21 a and 21 b have a function of a spacer that forms a space 23 that prevents interference (contact) between the permanent magnet 20 and the movable plate 11. Thereby, in the manufacture of the mirror device 1, a process of forming a separate spacer is not required, and the labor for manufacturing the mirror device 1 can be reduced, and the manufacture of the mirror device 1 can be simplified. Moreover, by forming such a space 23, the movable plate 11 can be rotated around the Y axis very smoothly.

The solder layer 21a, the base layers 22a and 22c, and the solder layer 21b and the base layers 22b and 22d constitute spacers, respectively.
The underlayers 22a and 22b are respectively provided on the lower surface of the frame-shaped member 14 (the surface facing the holder 17), and are configured so that the wettability of the solder on the surface is higher than that of the frame-shaped member 14. ing. Thereby, when the permanent magnet 20 is joined by the solder layers 21a and 21b, the solder can be surely and uniformly spread on the base layers 22a and 22b.

  The underlayers 22c and 22d are provided on one end portion in the longitudinal direction of the permanent magnet 20 and on the other end portion, respectively. Is also configured to be higher. Thereby, when the permanent magnet 20 is joined by the solder layers 21a and 21b, the solder can be surely and uniformly spread on the base layers 22a and 22b.

Accordingly, the base layers 22a and 22b are interposed between the frame-shaped member 14 and the solder layers 21a and 21b, and the base layers 22c and 22d are interposed between the permanent magnet 20 and the solder layers 21a and 21b. The frame-like member 14 and the permanent magnet can be reliably bonded through the underlying layers 22a, 22b, 22c, and 22d.
In the present embodiment, the areas of the base layer 22a and the base layer 22b are set to be equal in the plan view of FIG. The volumes of the solder layer 21a and the solder layer 21b are set equal. When the permanent magnets 20 are joined by the solder layers 21a and 21b, the solder wets and spreads over the entire surface of the underlying layers 22a and 22b. The distance from the frame-shaped member 14 at one end of the magnet 20 can be made equal to the distance from the frame-shaped member 14 at the other end. Thereby, the movable plate 11 can be smoothly rotated around the X axis and the Y axis.

In the present embodiment, the areas of the base layer 22c and the base layer 22d are set to be equal in the plan view of FIG.
In the plan view of FIG. 1, the areas of the base layer 22a and the base layer 22b may be different, the areas of the base layer 22c and the base layer 22d may be different, and solder The volume of the layer 21a and the solder layer 21b may be different.

  The constituent material of the base layers 22a and 22b is not particularly limited as long as the wettability of the solder on the surface of the base layers 22a and 22b is higher than that of the frame member 14, respectively. It is preferable to use it. By constituting the underlayers 22a and 22b with metal, the solder wettability of the underlayers 22a and 22b can be improved. The metal includes alloys and the like.

  The constituent materials of the base layers 22c and 22d are not particularly limited as long as the solder wettability of the surfaces of the base layers 22c and 22d is higher than that of the permanent magnet 20, respectively. Is preferably used. By configuring the base layers 22c and 22d with metal, the wettability of the solder of the base layers 22c and 22d can be improved. The metal includes alloys and the like.

In addition, each of the base layers 22a, 22b, 22c, and 22d may be a single layer or may be a stack of a plurality of layers.
As specific examples of the case where the underlayers 22a, 22b, 22c, and 22d are formed of three layers, for example, a Cr layer (first layer) made of Cr and a Ni layer (second layer) made of Ni, respectively. Layer) and an Au layer (third layer) made of Au in this order. Each of the base layers 22a, 22b, 22c, and 22d is formed so that the Au layer is positioned on the solder layers 21a and 21b side.

  Here, the Cr layer improves the adhesion between the Ni layer and the frame-like member 14 or the permanent magnet 20. Further, the Ni layer prevents the diffusion of the solder constituent material to the frame-shaped member 14 when the solder is melted to form the solder layers 21 and 22b while maintaining the adhesion between the Cr layer and the Au layer. Is. Further, the Au layer improves the wettability of the solder, improves the adhesion with the solder layers 21 and 22b, and prevents the Ni layer and the Cr layer from being oxidized.

In place of the Cr layer, for example, a layer made of Ni—Cr alloy, Ti, Ta, or the like can be used.
Further, instead of the Ni layer, for example, a layer made of Ni—Cr alloy, Cr, Ti, Ta or the like can be used.
Further, for example, a layer made of Pd or the like can be used instead of the Au layer.

  In addition, specific examples of the case where the underlayers 22a, 22b, 22c, and 22d are formed of two layers include, for example, a Cr layer (first layer) made of Cr and an Au layer made of Au ( The second layer) is laminated so that the Au layer is located on the solder layer 21a, 21b side, the Cr layer made of Cr (first layer), and the Ni layer made of Ni (second layer) Are stacked such that the Ni layer is positioned on the solder layer 21a, 21b side, a Ni layer (first layer) made of Ni, and an Au layer (second layer) made of Au. Are laminated so as to be located on the solder layers 21a, 21b side, a Ti layer (first layer) made of Ti, and an Au layer (second layer) made of Au, the Au layer being the solder layer 21a , Layered so as to be positioned on the 21b side, a W layer (first layer) composed of W, and Au. Been Au layer (second layer) and the Au layer is a solder layer 21a, such as those obtained by laminating so as to be located on 21b side thereof.

A coil 30 is provided immediately below the permanent magnet 20. That is, the coil 30 is provided so as to face the lower surface of the movable plate 11 and the frame-like member 14. Thereby, the magnetic field generated from the coil 30 can be efficiently applied to the permanent magnet 20. Thereby, power saving and size reduction of the optical scanner 10 can be achieved.
The coil 30 is electrically connected to the voltage applying means 40. Then, when a voltage is applied to the coil 30 by the voltage applying means 40, a magnetic field having a magnetic flux orthogonal to the X axis and the Y axis is generated from the coil 30. The coil 30 may be wound around a magnetic core.

As shown in FIG. 3, the voltage applying means 40 includes a first voltage generator 41 that generates a first voltage V1 for rotating the movable plate 11 around the X axis, and a movable plate 11 around the Y axis. A second voltage generator 42 for generating a second voltage V2 for rotating the first voltage V2, and a voltage superimposing unit for superimposing the first voltage V1 and the second voltage V2 and applying the voltage to the coil 30. 43.
As shown in FIG. 4A, the first voltage generator 41 generates a first voltage V1 (vertical scanning voltage) that periodically changes at a period T1.

  The first voltage V1 has a waveform like a sawtooth wave. Therefore, the optical scanner 10 can effectively perform vertical scanning (sub-scanning) of light. Note that the waveform of the first voltage V1 is not limited to this. Here, the frequency (1 / T1) of the first voltage V1 is not particularly limited as long as it is a frequency suitable for vertical scanning, but is preferably 30 to 80 Hz (about 60 Hz).

In the present embodiment, the frequency of the first voltage V1 includes the movable plate 11, the shaft members 13a and 13b, the frame member 14, the shaft members 15a and 15b, the permanent magnet 20, and the solder layers 21a and 21b. In addition, the frequency is adjusted to be different from the torsional resonance frequency (resonance frequency) of the second vibration system composed of the base layers 22a, 22b, 22c, and 22d.
On the other hand, as shown in FIG. 4B, the second voltage generator 42 generates a second voltage V2 (horizontal scanning voltage) that periodically changes at a period T2 different from the period T1. .

The second voltage V2 has a waveform like a sine wave. Therefore, the optical scanner 10 can effectively perform main scanning with light. Note that the waveform of the second voltage V2 is not limited to this.
The frequency of the second voltage V2 (second frequency) is preferably larger than the frequency of the first voltage V1 (first frequency). That is, the period T2 is preferably shorter than the period T1. Thereby, it is possible to rotate the movable plate 11 around the Y axis at the second frequency while rotating the movable plate 11 around the X axis at a second frequency more reliably and smoothly.

  The second frequency is not particularly limited as long as it is different from the first frequency and is suitable for horizontal scanning, but is preferably 10 to 40 kHz. As described above, the frequency of the second voltage V2 is set to 10 to 40 kHz, and the frequency of the first voltage V1 is set to about 60 Hz as described above, so that the movable plate 11 can be moved at a frequency suitable for drawing on the display. It can be rotated around each of two axes (X axis and Y axis) orthogonal to each other. However, the combination of the frequency of the first voltage V1 and the frequency of the second voltage V2 is not particularly limited as long as the movable plate 11 can be rotated around each of the X axis and the Y axis.

  In the present embodiment, the second frequency is equal to the torsional resonance frequency (f2) of the first vibration system using the shaft members 13a and 13b composed of the movable plate 11 and the shaft members 13a and 13b as the rotation shaft. It is set to be. That is, the first vibration system is designed (manufactured) so that its torsional resonance frequency f2 is a frequency suitable for horizontal scanning. Thereby, the rotation angle of the movable plate 11 around the Y axis can be increased. The first frequency includes the movable plate 11, the shaft members 13a and 13b, the frame member 14, the shaft members 15a and 15b, the permanent magnet 20, the solder layers 21a and 21b, the base layers 22a and 22b, It is desirable that it is 1/10 or less of the torsional resonance frequency (f1) of the second vibration system with the shaft members 15a and 15b constituted by 22c and 22d as the rotation axis. In order to drive the second vibration system in a non-resonant state (amplitude gain is 1), the first frequency needs to be set to 1/10 or less of f1. This is because driving at a frequency greater than 1/10 may cause resonance of the second vibration system.

  The second frequency is preferably set to 10 times or more of the first frequency in order to drive the second vibration system in a non-resonant state (amplitude gain is 1). If the second frequency is less than 10 times the first frequency, when the second voltage V2 is applied to the coil 30, the second vibration system also rotates, causing crosstalk of the drive signal. End up. As described above, since the first frequency is desirably one tenth or less of f1, it is desirable that the second frequency is higher than the first frequency from these relationships.

  Further, when the torsional resonance frequency of the second vibration system is f1 [Hz] and the torsional resonance frequency of the first vibration system is f2 [Hz], f1 and f2 satisfy the relationship of f2> f1. Is preferable, and it is more preferable to satisfy the relationship of f2 ≧ 10f1. As a result, the movable plate 11 can be rotated more smoothly around the Y axis at the frequency of the second voltage V2 while being rotated at the frequency of the first voltage V1. When f2 ≦ f1, there is a possibility that the first vibration system vibrates at the first frequency.

The first voltage generation unit 41 and the second voltage generation unit 42 are connected to the control unit 70 and driven based on signals from the control unit 70. A voltage superimposing unit 43 is connected to the first voltage generating unit 41 and the second voltage generating unit 42 as described above.
The voltage superimposing unit 43 includes an adder 43 a for applying a voltage to the coil 30. The adder 43 a receives the first voltage V <b> 1 from the first voltage generator 41 and receives the second voltage V <b> 2 from the second voltage generator 42, and superimposes and applies these voltages to the coil 30. It has become.

  Next, a method for driving the optical scanner 10 will be described. In the present embodiment, as described above, the frequency of the first voltage V1 is set to a value different from the torsional resonance frequency of the second vibration system, and the frequency of the second voltage V2 is the first value. Is set to be equal to and greater than the frequency of the first voltage V1 (for example, the frequency of the first voltage V1 is 60 Hz and the frequency of the second voltage V2). Is 15 kHz).

For example, the first voltage V 1 as shown in FIG. 4A and the second voltage V 2 as shown in FIG. 4B are superimposed by the voltage superimposing unit 43, and the superimposed voltage is applied to the coil 30. Apply.
Then, the first voltage V <b> 1 tries to attract the vicinity of the joint between the frame-shaped member 14 and the N pole of the permanent magnet 20 to the coil 30, and the joint between the frame-shaped member 14 and the S pole of the permanent magnet 20. While trying to separate the vicinity of the magnetic field (this magnetic field is referred to as “magnetic field A1”) from which the vicinity is to be separated from the coil 30 and the joint between the frame member 14 and the N pole of the permanent magnet 20 from the coil 30, A magnetic field (this magnetic field is referred to as “magnetic field A2”) that tries to attract the vicinity of the joint between the frame-shaped member 14 and the south pole of the permanent magnet 20 to the coil 30 is alternately switched.

  Here, as described above, the permanent magnet 20 is disposed such that each end (magnetic pole) is located in two regions divided by the X axis. That is, in the plan view of FIG. 1, the N pole of the permanent magnet 20 is located on one side of the X axis and the S pole is located on the other side. Therefore, by alternately switching between the magnetic field A1 and the magnetic field A2, the frame member 14 and the movable plate 11 rotate around the X axis at the frequency of the first voltage V1 while twisting and deforming the shaft members 15a and 15b. Move.

  Note that the frequency of the first voltage V1 is set to be extremely lower than the frequency of the second voltage V2. The torsional resonance frequency of the second vibration system is designed to be lower than the torsional resonance frequency of the first vibration system (for example, 1/10 or less of the torsional resonance frequency of the first vibration system). That is, since the second vibration system is designed to vibrate more easily than the first vibration system, the frame-like member 14 rotates around the X axis by the first voltage V1. That is, it is possible to prevent the frame-like member 14 from rotating around the X axis by the second voltage V2.

  On the other hand, the second voltage V2 tries to attract the vicinity of the joint between the frame member 14 and the N pole of the permanent magnet 20 to the coil 30 and the joint between the frame member 14 and the S pole of the permanent magnet 20. While trying to separate the vicinity of the magnetic field (this magnetic field is referred to as “magnetic field B1”) from which the vicinity is to be separated from the coil 30 and the joint between the frame member 14 and the N pole of the permanent magnet 20 from the coil 30, A magnetic field (this magnetic field is referred to as “magnetic field B2”) that is to be attracted to the coil 30 near the joint between the frame member 14 and the south pole of the permanent magnet 20 is switched alternately.

Here, as described above, the permanent magnet 20 is disposed such that each end (magnetic pole) is located in two regions divided by the Y axis. That is, in the plan view of FIG. 1, the N pole of the permanent magnet 20 is located on one side of the Y axis and the S pole is located on the other side. Therefore, by alternately switching the magnetic field B1 and the magnetic field B2, the movable plate 11 rotates around the Y axis at the frequency of the second voltage V2 while twisting and deforming the shaft members 13a and 13b.
The frequency of the second voltage V2 is equal to the torsional resonance frequency of the first vibration system. Therefore, the movable plate 11 can be rotated around the Y axis by the second voltage V2. That is, it is possible to prevent the movable plate 11 from rotating around the Y axis by the first voltage V1.

Next, an example of a manufacturing method of the mirror device 1 will be described.
<First manufacturing method>
5 is a plan view showing a mirror device of the optical scanner shown in FIG. 1, and FIGS. 6 to 8 are sectional views for explaining a first manufacturing method of the mirror device of the optical scanner shown in FIG. In this case, FIGS. 6 to 8 correspond to the sectional view taken along the line BB of FIG. In the following, for convenience of explanation, the front side of the sheet in FIG. 5 is referred to as “upper”, the rear side of the sheet is referred to as “lower”, the right side is referred to as “right”, and the left side is referred to as “left”. 6 to 8 are upside down with respect to FIG. 2, but the upper side in FIGS. 6 to 8 is “upper”, the lower side is “lower”, the right side is “right”, and the left side. Is called “left”.

First, a substrate (silicon substrate) 5 made of silicon is prepared.
Next, as shown in FIG. 6A, the substrate 5 is thermally oxidized to form an oxide film 51 on the surface of the substrate 5. Then, the shape of the oxide film 51 on the lower surface side of the substrate 5 is made to correspond to the shape of the mirror device 1 in plan view on the upper surface side in FIG.
Next, as shown in FIG. 6B, the substrate 5 is etched from the lower surface side using the oxide film 51 as a mask.

As an etching method, for example, one or more of physical etching methods such as plasma etching, reactive ion etching, beam etching, and light-assisted etching, and chemical etching methods such as wet etching are used in combination. be able to. The same method can be used for each of the following steps and etching in the second manufacturing method described later. An example of each of the following etching and etching in the second manufacturing method described later will be described.
In the etching of the substrate 5 using the oxide film 51 as a mask, for example, wet etching is performed using tetramethylammonium hydroxide or the like as an etchant.

Next, as shown in FIG. 6C, the oxide film 51 is removed. In this case, for example, hydrofluoric acid or the like can be used. Then, the substrate 5 is thermally oxidized to form an oxide film 52 on the surface of the substrate 5.
Next, as shown in FIG. 6D, the oxide film 52 on the upper surface side of the substrate 5 is removed by etching. In this etching, for example, reactive ion etching is performed.

  Next, as illustrated in FIG. 6E, a resist film 61 is formed on the upper surface of the substrate 5 so as to cover other than the portions where the base layers 22 a and 22 b are formed on the upper surface of the substrate 5. The positions of the portions where the underlayers 22a and 22b are formed are set so that the permanent magnet 20 is positioned at an appropriate position when the permanent magnet 20 is positioned by molten solder 64a and 64b described later. Then, on the upper surface of the substrate 5, a layer 62 including a portion that becomes the base layers 22 a and 22 b is formed. The constituent material of the layer 62 is the same as the constituent material of the foundation layers 22a and 22b.

Next, as shown in FIG. 7A, the resist film 61 is removed. Thereby, base layers 22 a and 22 b are formed at predetermined positions on the upper surface of the substrate 5.
Next, as shown in FIG. 7B, on the upper surface of the substrate 5 and the upper surfaces of the base layers 22a and 22b, the movable plate main body 110 (movable plate 11), the shaft members 13a and 13b, the frame-shaped member 14 and Then, a resist film 63 having a shape corresponding to the shape in plan view of the shaft members 15a and 15b and the support frame 16 is formed.

Next, as shown in FIG. 7C, the substrate 5 is etched from the upper surface side using the resist film 63 as a mask. In this etching, for example, inductively coupled reactive ion etching is performed.
Next, as shown in FIG. 7D, the oxide film 51 is removed. In this case, for example, hydrofluoric acid or the like can be used.

  Next, as shown in FIG. 7E, the resist film 63 is removed. Thereby, the board | substrate 5 provided with the movable plate main body 110, the shaft-shaped members 13a and 13b, the frame-shaped member 14 provided with the foundation layers 22a and 22b, the shaft members 15a and 15b, and the support frame 16 is obtained. . Then, the light reflecting portion 12 is formed on the lower surface of the movable plate main body 110. Thus, the movable plate 11 having the light reflecting portion 12, the shaft members 13a and 13b, the frame member 14 provided with the base layers 22a and 22b, the shaft members 15a and 15b, and the support frame 16 are provided. A substrate 5 is obtained.

Next, as shown in FIG. 8 (a), a compound having a flux function is applied on the underlayers 22a and 22b to form a flux film (not shown), and solder (not shown) is formed on each flux film. Place the ball and melt the solder ball. As a result, the solders 64a and 64b spread over the entire underlayers 22a and 22b, respectively.
Here, the height of the solder layer 21a formed on the base layer 22a is adjusted by the number of solder balls arranged on the base layer 22a, and the base layer 22b is adjusted by the number of solder balls arranged on the base layer 22b. The height of the solder layer 21b to be formed is adjusted. Thereby, the heights of the solder layers 21a and 21b can be adjusted reliably.

Next, as shown in FIG. 8B, base layers 22 c and 22 d are formed at both ends in the longitudinal direction of the permanent magnet 20. The underlayers 22c and 22d can be formed using, for example, a predetermined mask. And the compound which has a flux function is apply | coated on the foundation | substrate layers 22c and 22d, respectively, and the flux films | membranes 65a and 65b are formed.
Next, as shown in FIG. 8C, the solder 64a on the base layer 22a of the frame-shaped member 14 and the flux film 65a on the base layer 22c on the permanent magnet 20 side coincide with each other, and The permanent magnet 20 is placed on the frame-shaped member 14 so that the solder 64b and the flux film 65b on the base layer 22d match.

  Next, as shown in FIG. 8 (d), the solder 64a and 64b are melted to form the solder layers 21a and 21b, and the frame member 14 and the permanent magnet are formed by the solder layer 21a via the base layers 22a and 22c. 20 is joined to one end of the frame member 14 and the solder layer 21b is used to join the frame member 14 and the other end of the permanent magnet 20 via the underlayers 22b and 22d. Between the frame-shaped member 14 and the permanent magnet 20, solder layers 21a and 21b and base layers 22a, 22b, 22c and 22d are interposed, and a space 23 is formed. As described above, the mirror device 1 is manufactured.

When the solder 64a, 64b is melted, the permanent magnet 20 is automatically moved to an appropriate position by the solder 64a, 64b, and the permanent magnet 20 is positioned. Thereby, the permanent magnet 20 can be easily and reliably positioned at an appropriate position.
Further, by providing flux films on the base layers 22a and 22b and providing flux films 65a and 65b on the base layers 22c and 22d, when the solder balls are melted to form the solder layers 21a and 21b, the solder layers 21a , 21b can be removed, or oxidation can be prevented.

<Second production method>
9 to 11 are cross-sectional views for explaining a second manufacturing method of the mirror device shown in FIG. In this case, FIGS. 9 to 11 correspond to the cross-sectional view taken along the line BB of FIG. 9 to 11 are upside down with respect to FIG. 2, but for the sake of convenience, the upper side in FIGS. 9 to 11 is “upper”, the lower side is “lower”, and The right side is called “right” and the left side is called “left”. Further, the structure of the support frame 16 is slightly different from the case of the first manufacturing method described above.

Hereinafter, the second manufacturing method will be described focusing on the differences from the first manufacturing method described above, and description of similar matters will be omitted.
First, an SOI substrate 7 is prepared. In the SOI substrate 7, a Si layer (first Si layer) 7a, a SiO ₂ layer 7b, and a Si layer (second Si layer) 7c are laminated in this order from the upper side to the lower side in FIG. A laminated structure substrate.

Next, as shown in FIG. 9A, the SOI substrate 7 is thermally oxidized, and an oxide film 71 is formed on the surface of the SOI substrate 7.
Next, as shown in FIG. 9B, the oxide film 71 on the upper surface side of the SOI substrate 7 is removed by etching. In this etching, for example, reactive ion etching is performed.
Next, as shown in FIG. 9C, a resist film 81 is formed on the upper surface of the Si layer 7a of the SOI substrate 7 so as to cover the upper surface of the Si layer 7a except for the portions where the base layers 22a and 22b are to be formed. To do. The positions of the portions where the underlayers 22a and 22b are formed are set so that the permanent magnet 20 is positioned at an appropriate position when the permanent magnet 20 is positioned by molten solder 64a and 64b described later. Then, a layer 82 including portions to be the base layers 22a and 22b is formed on the upper surface of the Si layer 7a. The constituent material of the layer 82 is the same as that of the base layers 22a and 22b.

Next, as shown in FIG. 9D, the resist film 81 is removed. Thereby, base layers 22a and 22b are formed at predetermined positions on the upper surface of the Si layer 7a.
Next, as shown in FIG. 9E, the shape of the oxide film 71 on the lower surface side of the Si layer 7c is made to correspond to the shape of the mirror device 1 in plan view on the upper surface side in FIG. As described above, the shape of the upper surface side in FIG. 2 of the mirror device 1 manufactured by the second manufacturing method is slightly different from that of the mirror device 1 shown in FIG.

Next, as shown in FIG. 10A, on the upper surface of the Si layer 7a and the upper surfaces of the base layers 22a and 22b, the movable plate body 110 (movable plate 11), the shaft members 13a and 13b, and the frame-shaped member 14 are formed. Then, a resist film 83 having a shape corresponding to the planar view shape of the shaft members 15a and 15b and the support frame 16 is formed.
Next, as shown in FIG. 10B, the Si layer 7a is etched from the upper surface side using the resist film 83 as a mask. In this etching, for example, inductively coupled reactive ion etching is performed. At this time, the SiO ₂ layer 7b functions as an etching stop layer.

Next, as shown in FIG. 10C, the Si layer 7c is etched from the lower surface side using the resist film 83 as a mask. In this etching, for example, inductively coupled reactive ion etching is performed. At this time, the SiO ₂ layer 7b functions as an etching stop layer.
Next, as shown in FIG. 10D, the oxide film 71 on the lower surface side of the Si layer 7c and the exposed SiO ₂ layer 7b are removed by etching. In this etching, for example, reactive ion etching is performed.

  Next, as shown in FIG. 10E, the resist film 83 is removed. Thereby, the SOI substrate 7 including the movable plate main body 110, the shaft members 13a and 13b, the frame member 14 provided with the base layers 22a and 22b, the shaft members 15a and 15b, and the support frame 16 is obtained. It is done. Then, the light reflecting portion 12 is formed on the lower surface of the movable plate main body 110. Thus, the movable plate 11 having the light reflecting portion 12, the shaft members 13a and 13b, the frame member 14 provided with the base layers 22a and 22b, the shaft members 15a and 15b, and the support frame 16 are provided. An SOI substrate 7 is obtained.

Next, as shown in FIG. 11 (a), a compound having a flux function is applied on the base layers 22a and 22b to form a flux film (not shown), and solder (not shown) is further formed on each flux film. Place the ball and melt the solder ball. As a result, the solders 64a and 64b spread over the entire underlayers 22a and 22b, respectively.
Next, as shown in FIG. 11B, base layers 22 c and 22 d are formed at both ends in the longitudinal direction of the permanent magnet 20. The underlayers 22c and 22d can be formed using, for example, a predetermined mask. And the compound which has a flux function is apply | coated on the foundation | substrate layers 22c and 22d, respectively, and the flux films | membranes 65a and 65b are formed.

Next, as shown in FIG. 11C, the solder 64a on the base layer 22a of the frame member 14 and the flux film 65a on the base layer 22c on the permanent magnet 20 side coincide with each other, and The permanent magnet 20 is placed on the frame-shaped member 14 so that the solder 64b and the flux film 65b on the base layer 22d match.
Next, as shown in FIG. 11 (d), the solder 64a and 64b are melted to form the solder layers 21a and 21b, and the frame member 14 and the permanent magnet are formed by the solder layer 21a via the base layers 22a and 22c. 20 is joined to one end of the frame member 14 and the solder layer 21b is used to join the frame member 14 and the other end of the permanent magnet 20 via the underlayers 22b and 22d. Between the frame-shaped member 14 and the permanent magnet 20, solder layers 21a and 21b and base layers 22a, 22b, 22c and 22d are interposed, and a space 23 is formed. As described above, the mirror device 1 is manufactured.

  As described above, according to the present embodiment, by applying a voltage obtained by superimposing the first voltage V1 and the second voltage V2 to the coil 30, the movable plate 11 is moved around the X axis in the first direction. While rotating at the frequency of the voltage V1, it is possible to rotate at the frequency of the second voltage V2 around the Y axis. As a result, the cost and size of the apparatus can be reduced, and the movable plate 11 can be rotated around the X axis and the Y axis.

In particular, since the number of permanent magnets and coils serving as driving sources can be reduced, a simple and compact configuration can be achieved.
Further, since the permanent magnet 20 is joined to the frame-like member 14 by the solder layers 21a, 21b via the base layers 22a, 22b, 22c, 22d, the frame-like member 14 and the permanent magnet 20 are firmly joined. It is possible to prevent the permanent magnet 20 from being peeled off from the frame-like member 14 even in a hot and humid environment.

In addition, since the solder layers 21a and 21b have a function of a spacer for forming the space 23, a process of forming a separate spacer is not necessary in the manufacture of the mirror device 1, and the labor for manufacturing the mirror device 1 is reduced. Can be reduced.
Further, when the permanent permanent magnet 20 after magnetizing or before magnetizing is joined in the manufacture of the mirror device 1, the permanent magnet 20 is automatically placed in an appropriate position by the melted solder on the base layers 22a and 22b. Since the permanent magnet 20 is moved and positioned, the permanent magnet 20 can be easily and reliably positioned at an appropriate position.

  Further, when manufacturing the mirror device 1, the base layers 22 a and 22 b are respectively formed at predetermined positions of the substrate 5, and then the substrate 5 is processed into a predetermined shape, and the frame-shaped member 14 and the shaft members 15 a and 15 b are processed. Since the movable plate 11 and the shaft members 13a and 13b are respectively formed, the base layers 22a and 22b in the frame-like member 14 can be positioned at the same time when the frame-like member 14 is formed. Thereby, the manufacturing process can be reduced, and the positions of the base layers 22a and 22b in the frame-like member 14 can be set accurately.

In addition, by appropriately changing the first voltage V1 and the second voltage V2, desired vibration characteristics can be obtained without changing the structures of the second vibration system and the first vibration system.
In the optical scanner 10, a permanent magnet 20 is provided on the frame-shaped member 14, and a coil 30 is provided on the holder 17 so as to face the permanent magnet 20. That is, the coil 30 that is a heating element is not provided on the second vibration system and the first vibration system. Therefore, it is possible to prevent or suppress the vibration system from being bent and the resonance frequency from being changed due to heat generated from the coil 30 by energization. As a result, the optical scanner 10 can exhibit desired vibration characteristics even when used continuously for a long time.

Second Embodiment
12 is a plan view showing a second embodiment of the optical scanner of the present invention, and FIG. 13 is a cross-sectional view taken along the line CC of FIG.
Hereinafter, the second embodiment will be described with a focus on the differences from the first embodiment described above, and the description of the same matters will be omitted.

  As shown in FIGS. 12 and 13, in the optical scanner 10 of the second embodiment, the end of the base layer 22a opposite to the base layer 22b in the longitudinal direction of the permanent magnet 20, and the permanent magnet 20 of the base layer 22b A distance L2 between the base layer 22a in the longitudinal direction and the opposite end is set to be longer than the length L1 of the permanent magnet 20 in the longitudinal direction. That is, the base layer 22 a protrudes from one end of the permanent magnet 20 in the longitudinal direction of the permanent magnet 20, and the base layer 22 b protrudes from the other end of the permanent magnet 20 in the longitudinal direction of the permanent magnet 20.

Similarly, the solder layer 21 a protrudes in the longitudinal direction of the permanent magnet 20 from one end of the permanent magnet 20, and the solder layer 21 b protrudes in the longitudinal direction of the permanent magnet 20 from the other end of the permanent magnet 20.
Accordingly, when the permanent magnet 20 after magnetization or before magnetization is joined to the frame-shaped member 14, the permanent magnet 20 can be surely positioned by the molten solder, and the permanent magnet 20 and the frame-shaped member can be reliably positioned. The member 14 can be firmly joined.

The underlayer 22 a protrudes from one end of the permanent magnet 20 in a direction perpendicular to the longitudinal direction of the permanent magnet 20, and the underlayer 22 b extends from the other end of the permanent magnet 20 in the longitudinal direction of the permanent magnet 20. It protrudes in the direction orthogonal to.
Similarly, the solder layer 21 a protrudes from one end of the permanent magnet 20 in a direction perpendicular to the longitudinal direction of the permanent magnet 20, and the solder layer 21 b extends from the other end of the permanent magnet 20 to the longitudinal direction of the permanent magnet 20. It protrudes in a direction perpendicular to the direction.

Thereby, when joining the permanent magnet 20 to the frame-shaped member 14, positioning of the permanent magnet 20 by the molten solder can be performed more reliably, and the permanent magnet 20 and the frame-shaped member 14 can be more firmly fixed. Can be joined.
Since the optical scanner 10 as described above includes the light reflecting section 12, for example, a laser printer, a barcode reader, a scanning confocal laser microscope, a projector, a head-up display (HUD), a head-mounted display ( It can be suitably applied to an optical scanner provided in an image forming apparatus such as an imaging display such as an HMD.

<Embodiment of Image Forming Apparatus>
FIG. 14 is a diagram schematically showing an embodiment of the image forming apparatus of the present invention.
In this embodiment, a case where the optical scanner 10 is used as an optical scanner of an imaging display will be described as an example of an image forming apparatus. The longitudinal direction of the screen S is referred to as “lateral direction”, and the direction perpendicular to the longitudinal direction is referred to as “vertical direction”. Further, the X axis, that is, the rotation center axis X is parallel to the horizontal direction of the screen S, and the Y axis, that is, the rotation center axis Y is parallel to the vertical direction of the screen S.

The image forming apparatus (projector) 9 includes a light source device (light source) 91 that emits light such as a laser, a plurality of dichroic mirrors 92, 92, 92, and an optical scanner 10.
The light source device 91 includes a red light source device 911 that emits red light, a blue light source device 912 that emits blue light, and a green light source device 913 that emits green light.

Each dichroic mirror 92 is an optical element that combines light emitted from each of the red light source device 911, the blue light source device 912, and the green light source device 913.
Such a projector 9 combines light emitted from the light source device 91 (red light source device 911, blue light source device 912, green light source device 913) by a dichroic mirror 92 based on image information from a host computer (not shown). The combined light is two-dimensionally scanned by the optical scanner 10 to form a color image on the screen S.

During the two-dimensional scanning, the light reflected by the light reflecting portion 12 by the rotation of the movable plate 11 of the optical scanner 10 around the rotation center axis Y is scanned (main scanning) in the horizontal direction of the screen S. On the other hand, the light reflected by the light reflecting portion 12 due to the rotation of the movable plate 11 of the optical scanner 10 about the rotation center axis X is scanned (sub-scanned) in the vertical direction of the screen S.
In FIG. 14, the light synthesized by the dichroic mirror 92 is two-dimensionally scanned by the optical scanner 10, and then the light is reflected by the fixed mirror K and then an image is formed on the screen S. However, the fixed mirror K may be omitted, and the screen S may be directly irradiated with light two-dimensionally scanned by the optical scanner 10.

As described above, the mirror device, the manufacturing method of the mirror device, the optical scanner, and the image forming apparatus of the present invention have been described based on the illustrated embodiment, but the present invention is not limited to this, and the configuration of each unit is as follows. Any structure having a similar function can be substituted. Moreover, other arbitrary structures and processes may be added to the present invention.
Further, the present invention may be a combination of any two or more configurations (features) of the above embodiments.
In the embodiment, a permanent magnet is used as the magnet. However, in the present invention, an electromagnet may be used as the magnet.
In the present invention, the foundation layers 22c and 22d may be omitted.

DESCRIPTION OF SYMBOLS 1 ... Mirror device 10 ... Optical scanner 11 ... Movable plate 110 ... Movable plate main body 111 ... Recessed part 12 ... Light reflection part 13a, 13b ... Shaft member 14 ... Frame-shaped member 15a, 15b ... Shaft member 16 ... Support frame 17 ... Holder 20 ... permanent magnets 21a, 21b ... solder layers 22a, 22b, 22c, 22d ... foundation layer 23 ... space 30 ... coil 40 ... voltage application means 41 ... first voltage generator 42 ... second voltage generator 43 ... voltage superposition Part 43a ... Adder 70 ... Control part 5 ... Substrate 51, 52 ... Oxide film 61, 63 ... Resist film 62 ... Layer 64a, 64b ... Solder 65a, 65b ... Flux film 7 ... SOI substrate 7a, 7c ... Si layer 7b ... SiO ₂ layer 71 ... oxide film 81, 83 ... resist film 82 ... layer 9 ... projector 91 ... light source device 911 ... red light source device 912 ... blue light source instrumentation 913 ... green light source device 92 ... dichroic mirror

Claims (10)

A movable plate provided with a light reflecting portion having light reflectivity and swingable about a first axis;
A first shaft member connected to both ends of the movable plate in the direction along the first axis;
A frame-shaped member that surrounds the movable plate, is connected to the first shaft member, and is swingable around a second axis that intersects the first axis;
A second shaft member connected to both ends of the frame-shaped member in a direction along the second axis;
A first underlayer and a second underlayer provided on the frame member;
A magnet disposed on the frame-shaped member, wherein one magnetic pole and the other magnetic pole are disposed with the first axis and the second axis interposed therebetween,
Between the movable plate and the magnet, the first base layer, the second base layer, and the magnet are interposed between the magnet and the frame-shaped member and the magnet. A first solder layer and a second solder layer;
Said first underlayer and the second underlayer, wettability of the solder than the frame-like member is rather high,
The magnet has a longitudinal shape,
One end of the magnet in the longitudinal direction is joined by the first solder layer, and the other end in the longitudinal direction of the magnet is joined by the second solder layer,
An end of the first underlayer opposite to the second underlayer in the longitudinal direction of the magnet, and an end of the second underlayer opposite to the first underlayer in the longitudinal direction of the magnet. The distance between the end portions is longer than the length in the longitudinal direction of the magnet . Equal volumes of the previous SL first solder layer and the second solder layer,
Said first base layer and the second base layer and the mirror device area according to have equal claim 1. The volume of the first solder layer and the second solder layer is equal,
One end of the magnet in the longitudinal direction is joined by the first solder layer, and the other end in the longitudinal direction of the magnet is joined by the second solder layer,
The areas of the first underlayer and the second underlayer are equal,
The first underlayer protrudes from the one end of the magnet in the longitudinal direction of the magnet, and the second underlayer protrudes from the other end of the magnet in the longitudinal direction of the magnet. The mirror device according to claim 1.   4. The mirror device according to claim 1, wherein each of the first underlayer and the second underlayer is made of metal.   Interposed between the magnet and the first solder layer, interposed between the magnet and the second solder layer, a third base layer having higher solder wettability than the magnet, The mirror device according to any one of claims 1 to 4, further comprising a fourth underlayer having higher wettability of the solder than the magnet.   The mirror device according to claim 5, wherein each of the third underlayer and the fourth underlayer is made of metal. A movable plate provided with a light reflecting portion having light reflectivity and swingable about a first axis;
A first shaft member connected to both ends of the movable plate in the direction along the first axis;
A frame-shaped member that surrounds the movable plate, is connected to the first shaft member, and is swingable around a second axis that intersects the first axis;
A second shaft member connected to both ends of the frame-shaped member in a direction along the second axis;
A first underlayer and a second underlayer provided on the frame member;
A magnet disposed on the frame-like member, wherein one magnetic pole and the other magnetic pole are disposed with the first axis and the second axis interposed therebetween, respectively,
Forming each of the first underlayer and the second underlayer having higher solder wettability than the frame-shaped member on the frame-shaped member;
After forming the first underlayer and the second underlayer at predetermined positions on the substrate, respectively, the substrate is processed into a predetermined shape, the frame-shaped member, the first shaft member, Forming each of the movable plate and the second shaft member;
Solder is disposed on each of the first underlayer and the second underlayer, the solder is melted, a first solder layer is formed, and the first solder layer is used to form the magnet or before magnetization. Joining the magnet to the first underlayer, forming a second solder layer, and joining the magnet or the magnet before magnetization to the second underlayer by the second solder layer; A method of manufacturing a mirror device, comprising: The solder disposed on the first underlayer and the second underlayer is a solder ball, respectively.
The height of the first solder layer is adjusted by the number of solder balls arranged on the first underlayer, and the second solder is adjusted by the number of solder balls arranged on the second underlayer. The manufacturing method of the mirror device of Claim 7 which adjusts the height of a layer. A movable plate provided with a light reflecting portion having light reflectivity and swingable about a first axis;
A first shaft member connected to both ends of the movable plate in the direction along the first axis;
A frame-shaped member that surrounds the movable plate, is connected to the first shaft member, and is swingable around a second axis that intersects the first axis;
A second shaft member connected to both ends of the frame-shaped member in a direction along the second axis;
A first underlayer and a second underlayer provided on the frame member;
A magnet disposed on the frame-shaped member, wherein one magnetic pole and the other magnetic pole are disposed with the first axis and the second axis interposed therebetween,
Between the movable plate and the magnet, the first base layer, the second base layer, and the magnet are interposed between the magnet and the frame-shaped member and the magnet. A first solder layer and a second solder layer;
A coil that is disposed opposite to the frame-like member and generates a magnetic field that acts on the magnet by application of a voltage;
Voltage application means for applying a voltage to the coil,
The first underlayer and the second underlayer have higher solder wettability than the frame-shaped member,
The voltage applying means includes: a first voltage generating unit that generates a first voltage having a first frequency; a second voltage generating unit that generates a second voltage having a second frequency different from the first frequency; A voltage superimposing unit that superimposes the first voltage and the second voltage, and applying the voltage superimposed by the voltage superimposing unit to the coil, thereby moving the movable plate at the first frequency. And configured to swing about the second axis and swing about the first axis at the second frequency;
The magnet has a longitudinal shape,
One end of the magnet in the longitudinal direction is joined by the first solder layer, and the other end in the longitudinal direction of the magnet is joined by the second solder layer,
An end of the first underlayer opposite to the second underlayer in the longitudinal direction of the magnet, and an end of the second underlayer opposite to the first underlayer in the longitudinal direction of the magnet. The distance between an end part is longer than the length of the said magnet in the longitudinal direction, The optical scanner characterized by the above-mentioned . A movable plate provided with a light reflecting portion having light reflectivity and swingable about a first axis;
A first shaft member connected to both ends of the movable plate in the direction along the first axis;
A frame-shaped member that surrounds the movable plate, is connected to the first shaft member, and is swingable around a second axis that intersects the first axis;
A second shaft member connected to both ends of the frame-shaped member in a direction along the second axis;
A first underlayer and a second underlayer provided on the frame member;
A magnet disposed on the frame-shaped member, wherein one magnetic pole and the other magnetic pole are disposed with the first axis and the second axis interposed therebetween,
The frame-shaped member and the magnet are joined to be interposed between the first base layer, the second base layer, and the magnet so as to form a space between the movable plate and the magnet. A first solder layer and a second solder layer made of solder;
A coil that is disposed opposite to the frame-like member and generates a magnetic field that acts on the magnet by application of a voltage;
Voltage application means for applying a voltage to the coil,
The first underlayer and the second underlayer have higher solder wettability than the frame-shaped member,
The voltage applying means includes: a first voltage generating unit that generates a first voltage having a first frequency; a second voltage generating unit that generates a second voltage having a second frequency different from the first frequency; A voltage superimposing unit that superimposes the first voltage and the second voltage, and applying the voltage superimposed by the voltage superimposing unit to the coil, thereby moving the movable plate at the first frequency. And configured to swing about the second axis and swing about the first axis at the second frequency;
The magnet has a longitudinal shape,
One end of the magnet in the longitudinal direction is joined by the first solder layer, and the other end in the longitudinal direction of the magnet is joined by the second solder layer,
An end of the first underlayer opposite to the second underlayer in the longitudinal direction of the magnet, and an end of the second underlayer opposite to the first underlayer in the longitudinal direction of the magnet. An image forming apparatus , wherein a distance between the end portions is longer than a length in a longitudinal direction of the magnet .

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