JP5899649B2 - Motor and disk drive device - Google Patents

Description

  The present invention relates to a motor and a disk drive device.

A disk drive device such as an optical disk drive is equipped with a brushless motor for rotating the disk. A conventional brushless motor is described in, for example, Japanese Patent Application Laid-Open No. 7-75315. The gazette describes that a connection board for connecting windings and a circuit board on which drive circuit components are mounted are assembled to a bracket (summary, etc.).
JP-A-7-75315

  Conventionally, a circuit board of a brushless motor uses a double-sided board. The double-sided substrate has electronic wiring on both the upper surface and the lower surface of the substrate. For this reason, when using a double-sided board, for example, a circuit board is arranged on the upper surface of a metal mounting plate via a resin insulating sheet. Thereby, the electronic wiring on the lower surface side of the circuit board and the mounting plate are insulated.

  However, the process of placing the insulating sheet between the mounting plate and the circuit board is difficult to automate. In addition, the resin insulating sheet has a large environmental load. For this reason, the technique which can insulate a mounting board and a circuit board, reducing the use of an insulating sheet is calculated | required.

  In this regard, the brushless motor disclosed in JP-A-7-75315 does not use an insulating sheet. However, in the drawings of the publication, it is unclear how some of the lead wires and drive circuit components are in contact with the bracket and how insulation between the bracket and the circuit board is realized.

  The objective of this invention is providing the technique which can insulate a mounting board and a circuit board, reducing the use of an insulating sheet in the motor using a double-sided board.

An exemplary first invention of the present application includes a metal mounting plate that extends in a direction substantially orthogonal to a central axis that extends vertically, a stationary portion that is fixed to the mounting plate, and a rotating portion that rotates about the central axis. And a circuit board disposed on the upper surface side of the mounting plate, and the circuit board is a double-sided board having an upper surface side wiring provided on the upper surface and a lower surface side wiring provided on the lower surface The mounting plate protrudes upward from the upper surface thereof, and is provided with three or more pedestal portions that contact the lower surface of the circuit board, and further protrudes upward from the pedestal portion, and is provided in the circuit board. Two or more burring portions that are inserted into the holes and come into contact with an upper surface of the circuit board or an edge of the first through hole, and an upper end portion of the burring portion is caulked outward, and the circuit board there is a gap Surumo is between the mounting plate and Is another.

  According to the exemplary first invention of the present application, a gap can be secured between the mounting plate and the circuit board. Thereby, an attachment board and the lower surface side wiring of a circuit board can be insulated. In particular, if three or more pedestals are arranged according to the layout of the lower surface side wiring, a gap can be reliably maintained between the mounting plate and the circuit board in a desired region. Further, the mounting plate and the circuit board can be easily fixed using burring.

FIG. 1 is a side view of the motor. FIG. 2 is a longitudinal sectional view of the disk drive device. FIG. 3 is a longitudinal sectional view of the brushless motor. FIG. 4 is a top view of the brushless motor. FIG. 5 is a bottom view of the brushless motor. FIG. 6 is a partial longitudinal sectional view of the mounting plate and the vicinity of the first pedestal portion of the circuit board. FIG. 7 is a partial longitudinal sectional view of the mounting plate and the vicinity of the second pedestal portion of the circuit board. FIG. 8 is a top view of the brushless motor. FIG. 9 is a partial longitudinal sectional view of the vicinity of the mounting plate and the base portion of the circuit board.

  Hereinafter, exemplary embodiments of the present invention will be described with reference to the drawings. In the following, the shape and positional relationship of each part will be described with the direction along the central axis of the motor as the vertical direction and the circuit board side with respect to the mounting plate. However, this defines the vertical direction for the convenience of explanation, and does not limit the direction when the motor and the disk drive device according to the present invention are used.

<1. Motor according to one embodiment>
FIG. 1 is a side view of a motor 13A according to an embodiment of the present invention. As shown in FIG. 1, the motor 13A includes a stationary part 2A, a rotating part 3A, a mounting plate 4A, and a circuit board 5A.

  The stationary part 2A is fixed to the mounting plate 4A. The rotating unit 3A rotates around the central axis 9A. The mounting plate 4A is a metal plate that extends in a direction substantially orthogonal to the central axis 9A. The circuit board 5A is disposed on the upper surface side of the mounting plate 4A. The circuit board 5A is a double-sided board having upper surface side wiring provided on the upper surface and lower surface side wiring provided on the lower surface.

  The mounting plate 4A has three or more pedestals 41A to 43A. The pedestal portions 41A to 43A protrude upward from the upper surface of the mounting plate 4A. The upper surfaces of the pedestals 41A to 43A are in contact with the lower surface of the circuit board 5A. Thereby, a gap 60A is secured between the mounting plate 4A and the circuit board 5A. As a result, the mounting plate 4A and the lower surface side wiring of the circuit board 5A are insulated. If three or more of such pedestal portions are arranged according to the layout of the lower surface side wiring, a gap can be reliably maintained between the mounting plate 4A and the circuit board 5A in a desired region.

  In addition, burring portions 411A and 421A are provided above the two or more pedestal portions 41A and 42A. The burring portions 411A and 421A protrude further upward from the pedestal portions 41A and 42A, and are inserted into the first through holes 57A provided in the circuit board 5A. It is in contact. Thereby, the mounting plate 4A and the circuit board 5A are fixed.

<2. More specific embodiment>
<2-1. Configuration of disk drive>
Subsequently, a more specific embodiment of the present invention will be described.

  FIG. 2 is a longitudinal sectional view of the disk drive device 1. The disk drive device 1 is a device that reads and writes information from and to the optical disk 90 while rotating the optical disk 90 about the central axis 9. As shown in FIG. 2, the disk drive device 1 includes a housing 11, a disk tray 12, a brushless motor 13, and an access unit 14.

  The housing 11 is a housing that accommodates the disk tray 12, the brushless motor 13, and the access unit 14 therein. The disk tray 12 slides between the outside and the inside of the housing 11, thereby loading and unloading the optical disk 90. The brushless motor 13 is fixed to the disc tray 12. The optical disk 90 is held by the rotating unit 3 of the brushless motor 13 and is rotated about the central axis 9 by the brushless motor 13.

  The access unit 14 has a head 141 having an optical pickup function. The access unit 14 reads and writes information by moving the head 141 along the recording surface of the optical disc 90 rotated by the brushless motor 13. Note that the head 141 of the access unit 14 may perform only one of reading and writing of information with respect to the optical disc 90.

<2-2. Overall configuration of brushless motor>
Next, the configuration of the brushless motor 13 will be described.

  FIG. 3 is a longitudinal sectional view of the brushless motor 13. FIG. 4 is a top view of the brushless motor 13. FIG. 5 is a bottom view of the brushless motor 13. As shown in FIGS. 3 to 5, the brushless motor 13 of this embodiment includes a stationary part 2, a rotating part 3, a mounting plate 4, and a circuit board 5.

  The stationary part 2 is fixed to the mounting plate 4 and is relatively stationary with respect to the mounting plate 4 and the circuit board 5. The stationary part 2 has a bearing unit 21 and a stator unit 22. The bearing unit 21 includes a fixing member 211 fixed to the mounting plate 4 and a substantially cylindrical sleeve 212. The sleeve 212 is fixed to the inner peripheral surface of the fixing member 211. The shaft 31 on the rotating unit 3 side is inserted inside the sleeve 212 and is rotatably supported by the sleeve 212. The stator unit 22 includes a stator core 23 having a plurality of teeth 231 and a coil 24 wound around each tooth 231.

  The rotating unit 3 rotates about the central axis 9. The rotating unit 3 includes a shaft 31, a turntable 32, a rotor magnet 33, and a chucking unit 34. The shaft 31 is a substantially cylindrical member that extends vertically along the central axis 9. The turntable 32 is a member that is fixed to the shaft 31 and rotates together with the shaft 31. The rotor magnet 33 is an annular magnet disposed on the radially outer side of the stator unit 22. N poles and S poles are alternately magnetized in the circumferential direction on the inner peripheral surface of the rotor magnet 33.

  The turntable 32 of this embodiment has an inner cylindrical portion 321, a flat plate portion 322, and an outer cylindrical portion 323. The inner cylindrical portion 321 is fixed to the upper end portion of the shaft 31. The flat plate portion 322 extends radially outward from the lower end portion of the inner cylindrical portion 321. The outer cylindrical portion 323 extends downward from the radially outer edge of the flat plate portion 322. The rotor magnet 33 is fixed to the inner peripheral surface of the outer cylindrical portion 323.

  A rubber mounting member 35 is fixed to the upper surface of the flat plate portion 322 of the turntable 32. The optical disk 90 is placed on the turntable 32 with its lower surface in contact with the upper surface of the mounting member 35. Further, the inner peripheral portion of the optical disc 90 is held by the chucking portion 34. That is, in the present embodiment, the turntable 32, the mounting member 35, and the chucking unit 34 constitute a holding unit that holds the optical disc 90.

  When a drive current is applied to the coil 24 of the stationary part 2, magnetic flux is generated in the plurality of teeth 231 of the stator core 23. Then, circumferential torque is generated by the action of magnetic flux between the teeth 231 and the rotor magnet 33. As a result, the rotating unit 3 rotates about the central axis 9 with respect to the stationary unit 2. The optical disk 90 held by the rotating unit 3 rotates around the central axis 9 together with the rotating unit 3.

  The mounting plate 4 is a plate material that spreads in a direction orthogonal to the central axis 9. The mounting plate 4 is made of a metal such as a galvanized steel plate, SUS, or an aluminum alloy that has higher rigidity than the circuit board 5. In the present embodiment, the mounting plate 4 is fixed to the disk tray 12 of the disk drive device 1. Specifically, a fixing tool such as a screw is inserted into the three mounting holes 62 to 64 provided in the mounting plate 4, and the fixing tool is fastened to the disc tray 12. The three attachment holes 62 to 64 are arranged so as to surround the stationary part 2 and the rotating part 3. The stationary part 2 and the circuit board 5 are fixed to the mounting plate 4. The mounting plate 4 has a plurality of pedestal portions 41 to 47 and burring portions 411, 421 and 431 for holding the circuit board 5. Details of the pedestal portions 41 to 47 and the burring portions 411, 421, and 431 will be described later.

  The circuit board 5 is a board on which electronic wiring for performing drive control of the brushless motor 13 is mounted. The circuit board 5 is made of, for example, glass epoxy resin or paper phenol. In the brushless motor 13, a double-sided board having electronic wirings on both the upper and lower surfaces is used as the circuit board 5. Hereinafter, the electronic wiring provided on the upper surface of the circuit board 5 is referred to as “upper surface side wiring”, and the electronic wiring provided on the lower surface of the circuit board 5 is referred to as “lower surface side wiring”.

  As shown in FIGS. 4 and 5, a first connector 51 and a second connector 52 smaller than the first connector 51 are provided on the upper surface of the circuit board 5. The second connector 52 is disposed at a position approximately 90 ° away from the first connector 51 with respect to the central axis 9. The circuit board 5 has a first region 501 extending from the lower position of the coil 24 to the first connector 51 side, and a second region 502 extending from the lower position of the coil 24 to the second connector 52 side. In the present embodiment, the second region 502 is narrower than the first region 501.

  A third connector 53 smaller than the first connector 51 is provided on the lower surface of the first region 501 of the circuit board 5. The first connector 51 and the third connector 53 are arranged at positions that overlap each other in plan view. In the brushless motor 13, the first connector 51 exchanges main electrical signals with other electronic circuits in the disk drive device 1. For this reason, each terminal pin of the first connector 51 is electrically connected to the second connector 52, the third connector 53, and the coil 24.

  As shown in FIGS. 4 and 5, the inter-connector wiring 54 that electrically connects the first connector 51 and the second connector 52 partially passes through the lower surface side of the circuit board 5. That is, the inter-connector wiring 54 includes an upper surface side wiring 541 and a lower surface side wiring 542. The inter-connector wiring 55 that electrically connects the first connector 51 and the third connector 53 also includes an upper surface side wiring 551 and a lower surface side wiring 552, and both the wirings 551 and 552 are connected via the through holes 56. It is connected.

  4 and 5, since all the electronic wirings between the connectors 51, 52, 53 are illustrated, the drawings are complicated, so only the representative inter-connector wirings 54, 55 are shown.

<2-3. About pedestal and burring>
As shown in FIGS. 3 to 5, the mounting plate 4 includes three first pedestals 41 to 43 and four second pedestals 44 to 47. The upper surfaces of these pedestal portions 41 to 47 protrude upward from the upper surfaces of other regions of the mounting plate 4. The upper surfaces of the pedestals 41 to 47 are in contact with the lower surface of the circuit board 5. Thereby, a gap 60 is secured between the upper surface of the mounting plate 4 and the lower surface of the circuit board 5. As a result, the mounting plate 4 and the lower surface side wiring of the circuit board 5 are insulated without using an insulating sheet.

  FIG. 6 is a partial longitudinal sectional view of the mounting plate 4 and the circuit board 5 in the vicinity of the first pedestal portion 42. A burring portion 421 is provided on the first pedestal portion 42. The burring portion 421 protrudes further upward from the upper surface of the first pedestal portion 42. Further, the burring portion 421 is inserted into the first through hole 57 provided in the circuit board 5 and is in contact with the upper surface of the circuit board 5 or the edge of the first through hole 57.

When the first pedestal portion 42 and the burring portion 421 are formed, first, the first pedestal portion 42 is formed on the mounting plate 4 by half punching. Subsequently, a pilot hole is formed in the center of the first pedestal portion 42, and the edge of the pilot hole is protruded upward by burring to form a substantially cylindrical burring portion 421 . Thereafter, the burring portion 421 is inserted into the first through hole 57 of the circuit board 5. Then, the upper end portion of the burring portion 421 is caulked to the outside, and the burring portion 421 is brought into contact with the upper surface of the circuit board 5 or the edge of the first through hole 57. Accordingly, the circuit board 5 is fixed between the upper end portion of the burring portion 421 and the upper surface of the first pedestal portion 42.

  As shown in FIGS. 4 and 6, a ground pattern 58 is partially formed on the upper surface of the circuit board 5. The ground pattern 58 is a pattern for taking the reference potential of the electronic circuit on the circuit board 5. In the present embodiment, the burring portion 421 is in contact with the ground pattern 58. For this reason, the ground pattern 58 and the mounting plate 4 are electrically connected via the burring portion 421. As a result, the potential of the ground pattern 58 is maintained at the reference potential. That is, the burring portion 421 of the present embodiment plays both the role of fixing the circuit board 5 to the mounting plate 4 and the role of electrically connecting the ground pattern 58 and the mounting plate 4.

  The other two first pedestal portions 41 and 43 and the burring portions 411 and 431 are not in contact with the ground pattern 58, and the first pedestal portion 42 and the burring portion 421 shown in FIG. Has an equivalent structure.

  FIG. 7 is a partial longitudinal sectional view of the mounting plate 4 and the circuit board 5 in the vicinity of the second pedestal portion 44. A burring portion is not formed on the upper portion of the second pedestal portion 44. For this reason, the outer diameter d2 of the second pedestal portion 44 in plan view is set smaller than the outer diameter d1 (see FIG. 6) of the first pedestal portion 42 in plan view. If the area occupied by the second pedestal 44 is reduced, a wide wiring area on the lower surface side of the circuit board 5 can be secured. The other four second pedestals 45 to 47 have the same structure as the second pedestal 44 shown in FIG.

  If the height d3 of each pedestal portion 41 to 47 is too low, contact between the mounting plate 4 and the lower surface side wiring tends to occur. Specifically, the lower surface side wiring may come into contact with the mounting plate 4 at a position away from the pedestals 41 to 47 due to the curvature of the circuit board 5 or the like. On the other hand, if the height d3 of the pedestals 41 to 47 is too high, the axial dimension of the brushless motor 13 becomes large. Accordingly, the height d3 of each pedestal portion 41 to 47 is appropriately set in consideration of both the point where the mounting plate 4 and the lower surface side wiring should be insulated and the demand for thinning the brushless motor 13. It is preferable.

  Specifically, the height d3 of the base parts 41 to 47 may be set to, for example, 50 μm or more and 250 μm or less. More preferably, the height d3 of the pedestal portions 41 to 47 is set to 70 μm or more and 200 μm or less. If importance is attached to the insulation, the height of the pedestals 41 to 47 may be set to about 200 μm, for example. If the demand for thinning is emphasized, the height of the pedestal portions 41 to 47 may be set to approximately 70 μm, for example.

  In order to prevent contact between the mounting plate 4 and the lower surface side wiring of the circuit board 5, it is preferable that the plurality of pedestal portions 41 to 47 are arranged with no deviation from the circuit board 5. For example, it is preferable that the center of gravity of the circuit board 5 is arranged inside a polygon connecting the plurality of pedestals 41 to 47. Further, the circuit board 5 may be warped due to caulking of the burring portion. In order to suppress such warpage, it is preferable that the three burring portions 411, 421, 431 are arranged without deviation. For example, it is preferable that the center of gravity of the circuit board 5 is disposed inside a polygon connecting three burring portions 411, 421, 431.

  As shown in FIGS. 4 and 5, in the present embodiment, two pedestals 41 and 42 are disposed in the vicinity of the lower surface side wiring 542 connecting the first connector 51 and the second connector 52. Further, one pedestal portion 43 is disposed in the vicinity of the lower surface side wiring 552 and the through hole 56 that connect the first connector 51 and the third connector 53. As described above, if the pedestal portion is disposed in the vicinity of the lower surface side wiring, the contact between the mounting plate 4 and the lower surface side wiring can be further suppressed.

  Further, in the present embodiment, the lower surface side wiring 542 extends between the pedestal portions 41 and 42 and the pedestal portions 46 and 47. In this way, if the lower surface side wiring is arranged between the pair of pedestal portions, the contact between the mounting plate 4 and the lower surface side wiring can be further suppressed.

  In the present embodiment, two pedestals 44 and 45 are disposed below the second connector 52. For this reason, even when an external force is applied when the cable is connected to the second connector 52, the deformation of the circuit board 5 due to the external force is suppressed. As a result, contact between the mounting plate 4 and the lower surface side wiring is further suppressed.

  On the upper surface of the circuit board 5, the upper surface side wiring 59 extends from the first connector 51 toward the lower side of the rotating unit 3. A land portion for soldering the conductive wire drawn from the coil 24 is provided at the terminal portion of the upper surface side wiring 59. In the present embodiment, the two pedestal portions 46 and 47 are arranged below the rotating portion 3. That is, two pedestal portions 46 and 47 are disposed in the vicinity of the land portion. For this reason, even when an external force is applied when soldering the land portion, the deformation of the circuit board 5 due to the external force is suppressed. As a result, contact between the mounting plate 4 and the lower surface side wiring is further suppressed.

  Further, as shown in FIG. 5, the mounting plate 4 of the present embodiment has two second through holes 61. The two second through holes 61 are arranged at positions that overlap a part of the lower surface side wiring 542 connecting the first connector 51 and the second connector 52 in a plan view. A part of the lower surface side wiring 552 that connects the first connector 51 and the third connector 53 is disposed outside the mounting plate 4. Outside the second through hole 61 and the mounting plate 4, the lower surface side wires 542, 552 and the mounting plate 4 can not contact each other. Thereby, the contact with the mounting plate 4 and the lower surface side wirings 542 and 552 is further suppressed.

  When electronic components such as a resistor, a capacitor, and a connector are provided on the lower surface side of the circuit board 5, it is preferable to arrange these electronic components outside the second through hole 61 and the mounting plate 4. That is, it is preferable to arrange the mounting plate 4 and these electronic components so as not to overlap in plan view. In the present embodiment, the second connector 52 is disposed outside the mounting plate 4. In this way, the height of the circuit board 5 relative to the mounting plate 4 can be suppressed. Therefore, the axial dimension of the brushless motor 13 can be suppressed.

  In the present embodiment, the three burring portions 411, 421, 431 are arranged along the vicinity of the outer peripheral surface of the turntable 32. Thereby, the floating of the circuit board 5 in the vicinity of the stationary part 2 and the rotating part 3 is suppressed. As a result, the contact between the coil 24 or the turntable 32 and the circuit board 5 is suppressed.

<3. Other embodiments>
FIG. 8 is a top view of a brushless motor 13B according to another embodiment. The brushless motor 13B in FIG. 8 is different from the brushless motor 13 in the shapes of the mounting plate 4B and the circuit board 5B. Hereinafter, the brushless motor 13B of FIG. 8 will be described focusing on the differences from the above embodiment.

  As shown in FIG. 8, a first connector 51B and a second connector 52B smaller than the first connector 51B are provided on the upper surface of the circuit board 5B of the brushless motor 13B. A third connector 53B is provided on the lower surface of the circuit board 5B. The circuit board 5B has a constricted shape in the vicinity of the first connector 51B. The circuit board 5B includes a substantially triangular first region 501B extending from the vicinity of the first connector 51B to the third connector 53B side, and a substantially triangular first area 501B extending from the vicinity of the first connector 51B to the second connector 52B side. 2 regions 502B. In the present embodiment, the second region 502B is wider than the first region 501B. The stationary part and the rotating part 3B are arranged in the second region 502. The first connector 51B is closer to the third connector 53B than the second connector 52B.

  The inter-connector wiring 54B that electrically connects the first connector 51B and the second connector 52B partially passes through the lower surface side of the circuit board 5B. That is, the inter-connector wiring 54B includes the upper surface side wiring 541B and the lower surface side wiring 542B. Further, the inter-connector wiring 55B that electrically connects the first connector 51B and the third connector 53B also partially passes through the lower surface side of the circuit board 5B. That is, the inter-connector wiring 55B includes the upper surface side wiring 551B and the lower surface side wiring 552B.

  The mounting plate 4 of the present embodiment has three first pedestal portions 41B to 43B and six second pedestal portions 44B to 49B. Burling portions 411B, 421B, and 431B are provided on the upper portions of the three first pedestal portions 41B to 43B, respectively.

  In the present embodiment, three pedestals 41B, 42B, and 46B are arranged in the vicinity of the lower surface side wiring 542B that connects the first connector 51B and the second connector 52B. Further, one pedestal portion 43B is disposed in the vicinity of the lower surface side wiring 552B that connects the first connector 51B and the third connector 53B. As a result, contact between the mounting plate 4B and the lower surface side wires 542B and 552B is prevented.

  In the present embodiment, the lower surface side wiring 542B extends between the pedestal portions 41B and 47B and the pedestal portions 42B and 46B. Thereby, the contact of the mounting plate 4B, the lower surface side wiring, and 542B is further suppressed.

<4. Modification>
As mentioned above, although exemplary embodiment of this invention was described, this invention is not limited to said embodiment.

  The shapes of the mounting plate and the circuit board may be different from those shown in FIGS. 4, 5, and 8. Further, the pedestal portion and the burring portion may be arranged at positions different from those in FIGS. 4, 5, and 8. There may be at least three pedestal portions, and at least two of them may be provided with burring portions. If three or more pedestals are arranged according to the layout of the lower surface side wiring, a gap can be reliably maintained between the mounting plate and the circuit board in a desired region.

  It is not always necessary that all the pedestal portions provided on the mounting plate are in contact with the circuit board. For example, in the example of FIG. 4 and FIG. 5 described above, the plurality of second pedestal portions 44 to 47 may include those not in contact with the circuit board 5.

  The heights of the upper surfaces of the plurality of pedestal portions may be set to be equal or may be set to different heights. For example, when the circuit board has the property of being easily bent in a specific direction, the height of each pedestal portion may be individually set according to the property.

  The circuit board may be fixed to the mounting plate only by the burring portion, and fixing means such as screwing, eyelets, rivets may be used in combination.

  The circuit board may have an insulating resist film that partially covers the upper and lower surfaces. When the lower surface side wiring has a portion covered with the resist film and a portion exposed from the resist film, it is preferable to dispose the pedestal portion in the vicinity of the portion exposed from the resist film.

  FIG. 9 is a partial vertical cross-sectional view of the mounting plate 4C and the circuit board 5C according to a modification. In the example of FIG. 9, a ground pattern 58C is provided on the lower surface side of the circuit board 5C. The pedestal portion 42C is disposed at a position overlapping the ground pattern 58C in plan view. In this way, the ground pattern 58C and the mounting plate 4C can be electrically connected using the pedestal portion 42C.

  The lower surface of the circuit board 5C may be covered with an insulating resist film, but the ground pattern 58C is preferably exposed from the resist film in at least a part of the region overlapping the pedestal portion 42C. In particular, the boundary portion between the pedestal portion 42C and the burring portion 421C is likely to come into contact with the peripheral edge portion of the first through hole 57C. For this reason, if the ground pattern 58C is exposed from the resist film at the periphery of the first through hole 57C, the ground pattern 58C and the mounting plate 4C can be easily electrically connected.

  The circuit board of the present invention may be one in which an electronic circuit is formed on only two layers, the upper surface and the lower surface, or an electronic circuit formed on three or more layers.

  Further, the motor of the present invention may be fixed to the disk tray as in the above embodiment, or may be fixed to the housing of the disk drive device via a chassis.

  Further, the motor of the present invention may be a motor for rotating an optical disk as in the above embodiment, or may be a motor for rotating another recording disk such as a magnetic disk.

  Moreover, you may combine suitably each element which appeared in said embodiment and modification in the range which does not produce inconsistency.

  The present invention can be used for a motor and a disk drive device.

DESCRIPTION OF SYMBOLS 1 Disc drive device 2,2A Static part 3,3A, 3B Rotating part 4,4A, 4B, 4C Mounting board 5,5A, 5B, 5C Circuit board 9,9A Center axis 11 Housing 12 Disc tray 13, 13B Brushless motor 13A Motor 14 Access part 21 Bearing unit 22 Stator unit 31 Shaft 32 Turntable 33 Rotor magnet 34 Chucking part 41-43, 41A-43A, 41B-43B First base part 42C Base part 44-47, 44B-49B Second base Portions 51, 51B First connector 52, 52B Second connector 53, 53B Third connector 54, 55, 54B, 55B Inter-connector wiring 56 Through hole 57, 57A, 57C First through hole 58, 58C Ground pattern 59 Upper surface side wiring 60,60A clearance 61 Second through hole 62 to 64 Mounting hole 90 Optical disk 411, 421, 431, 411A, 421A, 411B, 421B, 431B, 421C Burring part 541, 551, 541B, 551B Upper surface side wiring 542, 552, 542B, 552B Lower surface side wiring

Claims (15)

A metal mounting plate extending in a direction substantially perpendicular to the central axis extending vertically;
A stationary part fixed to the mounting plate;
A rotating part that rotates about the central axis;
A circuit board disposed on the upper surface side of the mounting plate;
With
The circuit board is a double-sided board having an upper surface side wiring provided on the upper surface and a lower surface side wiring provided on the lower surface,
The mounting plate is
Three or more pedestals projecting upward from the upper surface and contacting the lower surface of the circuit board;
Two or more burring portions protruding further upward from the pedestal portion, inserted into a first through hole provided in the circuit board, and abutting against an upper surface of the circuit board or an edge of the first through hole; Have
A motor in which an upper end portion of the burring portion is caulked outward, and a gap exists between the circuit board and the mounting plate. The motor according to claim 1,
A motor in which at least one pedestal is disposed in the vicinity of the lower surface side wiring. The motor according to claim 1 or 2,
The motor in which the lower surface side wiring extends between the two pedestals. In the motor according to any one of claims 1 to 3,
A motor in which the center of gravity of the circuit board is disposed inside a polygon connecting the three or more pedestals. In the motor according to any one of claims 1 to 4,
A motor in which the burring portion is in contact with a ground pattern on the circuit board. In the motor according to any one of claims 1 to 5,
A ground pattern is provided on the lower surface of the circuit board,
The motor in which at least one of the pedestal portions is arranged at a position overlapping the ground pattern in plan view. The motor according to claim 6, wherein
The lower surface of the circuit board is partially covered with an insulating resist film,
The motor in which at least a part of a region overlapping the pedestal portion of the ground pattern is exposed from the resist film. The motor according to claim 7, wherein
A motor in which a peripheral portion of the first through hole is exposed from the resist film. In the motor according to any one of claims 1 to 8,
A motor in which at least one of the burring portions is disposed in the vicinity of the rotating portion. In the motor according to any one of claims 1 to 9,
The three or more pedestals are:
A first pedestal portion on which the burring portion is formed;
A second pedestal portion in which the burring portion is not formed;
Including
In plan view, the second pedestal portion is smaller than the first pedestal portion. In the motor according to any one of claims 1 to 10,
The mounting plate has a second through hole,
The second through hole is a motor arranged at a position overlapping at least a part of the lower surface side wiring in a plan view. The motor according to any one of claims 1 to 11,
The said base part is a motor which is a protrusion part by which the lower side was formed in the hollow shape with respect to the surface contact | abutted to the said circuit board . The motor according to any one of claims 1 to 12,
The circuit board has a first connector and a second connector provided on the upper surface side, and a third connector provided on the lower surface side,
In plan view, the first connector and the third connector are arranged at positions where they overlap each other, and the second connector is arranged at a position different from them,
The inter-connector wiring that electrically connects the first connector and the second connector partially passes through the lower surface side of the circuit board,
The first connector and the third connector are electrically connected through a through hole provided in the circuit board,
The three or more pedestals are:
A pedestal portion disposed along the wiring between the connectors;
A pedestal disposed in the vicinity of the through hole;
Including motor. The motor according to any one of claims 1 to 12,
The circuit board has a first connector and a second connector provided on the upper surface side, and a third connector provided on the lower surface side,
In plan view, the first connector is closer to the third connector than the second connector,
A part of the inter-connector wiring that electrically connects the first connector and the second connector and a part of the inter-connector wiring that electrically connects the first connector and the third connector are partially Through the bottom side of the circuit board,
A motor in which the pedestal is disposed in the vicinity of the inter-connector wiring. A motor according to any one of claims 1 to 14,
An access unit that performs at least one of reading and writing of information with respect to the disk held by the rotating unit of the motor;
A housing for housing the motor and the access unit;
A disk drive device comprising:

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