JP2010213476A - Spindle motor and disk drive device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a wire from interfering with other members by regulating the sag of a wire drawn out from winding end portion of a coil. <P>SOLUTION: A spindle motor includes: a base member 31 which expands in the direction orthogonal to a central axis 9 extending vertically, a coil 33 arranged above the base member 31, a rotating portion 4 which rotates around the central axis 9, and a circuit board 34 which has a soldered portion 341 connecting the wire 331 drawn out from the coil 33. The wire 331 is drawn out below the base member 31 through a through-hole 31c which connects the upper surface with a first lower surface 31a of the base member 31. A guide portion 342, which guides the wire 331 along the undersurface of the base member, is provided between the through-hole 31c and the soldered portion 341. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a spindle motor and a disk drive device.

  A hard disk device or an optical disk device is equipped with a spindle motor for rotating the disk around its central axis. The spindle motor has a stationary part fixed to the housing of the apparatus and a rotating part that rotates while supporting the disk. The spindle motor generates torque about the central axis by the magnetic flux generated between the stationary part and the rotating part, and thereby rotates the rotating part with respect to the stationary part.

The stationary part has a coil for generating magnetic flux. The end of the coil winding is led out of the spindle motor and connected to a predetermined substrate. For example, in paragraph 0023 of Japanese Patent Application Laid-Open No. 2005-210787 and paragraph 0018 of Japanese Patent Application Laid-Open No. 2005-210836, the winding end of the coil is led out to the outside of the motor and soldered to the land of the flexible wiring board. It is described that it is connected.
Japanese Patent Laid-Open No. 2005-210787 JP 2005-210836 A

  In the spindle motor described in Japanese Patent Laid-Open No. 2005-210787 and Japanese Patent Laid-Open No. 2005-210836, a flexible wiring board is attached to the back surface of the base, and winding is performed through holes formed in the base and the flexible wiring board. The end of is derived. And the edge part of a coil | winding is connected to the land part provided in the vicinity of the said hole.

  In order to make the spindle motor thinner, it is conceivable to form a second lower surface that is one step higher than the hole formed in the first lower surface of the base, and fix the substrate to the second lower surface. However, if the conductor led out to the first lower surface side through the hole is guided to the second lower surface and connected to the land portion of the substrate, the conductor is lifted in the vicinity of the boundary between the first lower surface and the second lower surface. appear. The floated conductor may interfere with other members and cause a disconnection or a short circuit.

  An object of the present invention is to provide a spindle motor that limits the floating of a conducting wire in the vicinity of the boundary between the first lower surface and the second lower surface and prevents interference between the conducting wire and other members.

  The first invention of the present application is based on a base member extending in a direction orthogonal to a central axis extending vertically, a coil disposed above the base member, and the base member rotating about the central axis. And a circuit board having a solder portion for connecting a conductor drawn from the coil, and the lower surface of the base member has a first lower surface, a radially outer side than the first lower surface, and an axial direction. A second lower surface located on the upper side, the circuit board is fixed to the second lower surface of the base member, and the conductive wire penetrates the upper surface of the base member and the first lower surface. A spindle that is pulled out below the base member through a hole, and is provided with a guide portion that guides the conductive wire along the lower surface of the base member between the through hole and the solder portion. Motor .

  According to the first invention of the present application, it is possible to limit the floating of the conducting wire in the vicinity of the boundary between the first lower surface and the second lower surface. Thereby, interference with a conducting wire and other members can be prevented.

FIG. 1 is a diagram showing a configuration of a spindle motor. FIG. 2 is a longitudinal sectional view of the disk drive device. FIG. 3 is a longitudinal sectional view of the spindle motor. FIG. 4 is a partially enlarged longitudinal sectional view of the spindle motor. FIG. 5 is a bottom view of the spindle motor. FIG. 6 is a perspective view of the spindle motor as viewed from the lower surface side. FIG. 7 is a cross-sectional view of a portion other than the wiring pattern of the circuit board. FIG. 8 is a cross-sectional view of the solder portion. FIG. 9 is a cross-sectional view of the guide portion. FIG. 10 is a cross-sectional view of a guide unit according to a modification. FIG. 11 is a bottom view of a spindle motor according to a modification. FIG. 12 is a bottom view of a spindle motor according to a modification.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In the following, the shape and positional relationship of each member will be described with the direction along the central axis 9 as the vertical direction and the coil 33 side as the upper side with respect to the base member 31. However, this is only defined in the vertical direction for convenience of explanation, and does not limit the installation posture when the spindle motor and the disk drive device according to the present invention are mounted on an actual device. .

<1. Spindle motor according to one embodiment>
FIG. 1 is a diagram showing a configuration of a spindle motor 1 according to an embodiment of the present invention. As shown in FIG. 1, the spindle motor 1 includes a base member 31, a coil 33, and a rotating unit 4. The base member 31 extends in a direction perpendicular to the central axis 9 extending vertically. The coil 33 is disposed above the base member 31. The rotating unit 4 rotates about the central axis 9 with respect to the base member 31.

  The lower surface of the base member 31 has a first lower surface 31a and a second lower surface 31b located radially outside and axially above the first lower surface 31a. A circuit board 34 is fixed to the second lower surface 31 b of the base member 31. The base member 31 is formed with a through hole 31c that communicates the upper surface with the first lower surface 31a. The conducting wire 331 led out from the coil 33 is guided to the lower side of the base member 31 through the through hole 31c and connected to the solder portion 341 provided on the circuit board 34.

  The spindle motor 1 has a guide portion 342 between the through hole 31c and the solder portion 341. The guide part 342 guides the conducting wire 331 along the lower surface of the base member 31. For this reason, the floating of the conducting wire 331 near the boundary between the first lower surface 31a and the second lower surface 31b is limited. Thereby, interference with conducting wire 331 and other members is prevented.

<2. More specific embodiment>
<2-1. Configuration of disk drive>
Subsequently, a more specific embodiment of the present invention will be described.

  FIG. 2 is a longitudinal sectional view of the disk drive device 2. The disk drive device 2 is a device that reads and / or writes information from and to the disk 22 while rotating the magnetic disk 22 (hereinafter simply referred to as “disk 22”). As shown in FIG. 2, the disk drive device 2 includes a device housing 21, a disk 22, an access unit 23, and the spindle motor 1.

  The device housing 21 is a housing that accommodates the disk 22, the access unit 23, and the spindle motor 1. The access unit 23 moves the head 231 along the recording surface of the disk 22 supported by the spindle motor 1 to read and / or write information on the disk 22.

<2-2. Spindle motor configuration>
Next, the configuration of the spindle motor 1 will be described. FIG. 3 is a longitudinal sectional view of the spindle motor 1. As shown in FIG. 3, the spindle motor 1 includes a stationary portion 3 fixed to the device housing 21 of the disk drive device 2, and a rotating portion 4 that rotates about the central axis 9 while supporting the disk 22. ing.

  The stationary part 3 includes a base member 31, a stator core 32, a coil 33, a circuit board 34, and a stationary bearing unit 35.

  The base member 31 is a part of the device housing 21 (see FIG. 2) of the disk drive device 2 and is formed integrally with other parts of the device housing 21. The base member 31 includes a cylindrical portion 311, a first flat plate portion 312, an inclined portion 313, and a second flat plate portion 314. The base member 31 as a whole extends in the radial direction (a direction orthogonal to the central axis 9; the same applies hereinafter).

  The cylindrical portion 311 protrudes upward from the inner edge portion of the first flat plate portion 312 and holds the stationary bearing unit 35 on the radially inner side. The first flat plate portion 312 extends in the radial direction outside the cylindrical portion 311. The inclined portion 313 spreads radially outward and obliquely upward from the outer edge portion of the first flat plate portion 312. The second flat plate portion 314 extends radially outward from the outer edge portion of the inclined portion 313.

  The stator core 32 and the coil 33 function as a magnetic flux generator that generates a magnetic flux according to the drive current. The stator core 32 has an annular core back 321 fitted to the outer peripheral surface of the cylindrical portion 311 of the base member 31 and a plurality of teeth portions 322 protruding outward from the core back 321 in the radial direction. ing. The stator core 32 is obtained, for example, by punching a laminated steel sheet in which electromagnetic steel sheets are laminated in the axial direction (the direction along the central axis 9; the same applies hereinafter). Further, the coil 33 is constituted by a conducting wire 331 wound around each tooth portion 322 of the stator core 32. The coil 33 is located above the first flat plate portion 312 of the base member 31.

  The coil 33 according to the present embodiment is configured by three conducting wires 331 for flowing three-phase AC currents. Each end portion on the input side of the three conducting wires 331 is led out to the lower surface side of the base member 31 through a through hole 31c formed in the first flat plate portion 312. In addition, although illustration is abbreviate | omitted, each edge part in the output side of the three conducting wires 331 is bundled, and comprises one common wire. The common wire is covered with insulation and is accommodated above the base member 31.

  The circuit board 34 is a board on which an electronic circuit for supplying a drive current to the coil 33 is mounted. The circuit board 34 of this embodiment is configured by a flexible printed board (FPC) that can be bent flexibly. The circuit board 34 is fixed to the lower surface of the portion from the inclined portion 313 to the second flat plate portion 314 of the base member 31 with an adhesive. In addition, a solder portion 341 is formed in a portion fixed to the inclined portion 313 of the circuit board 34. The solder portion 341 is connected to an input side end portion of a conducting wire led out from the coil 33.

  The stationary bearing unit 35 is a mechanism for rotatably supporting the shaft 41 on the rotating unit 4 side. The stationary bearing unit 35 is fixed inside the cylindrical portion 311 of the base member 31. The stationary bearing unit 35 includes a substantially cylindrical sleeve 351 and a cap 352 that closes an opening at a lower portion of the sleeve 351. Lubricating oil is filled between the inner peripheral surface of the sleeve 351 and the outer peripheral surface of the shaft 41.

  The rotating unit 4 includes a shaft 41, a hub 42, and a rotor magnet 43.

  The shaft 41 is a substantially cylindrical member extending in the vertical direction along the central axis 9. The shaft 41 is rotatably supported with respect to the stationary bearing unit 35 while being inserted inside the sleeve 351. The hub 42 is a member that is fixed to the shaft 41 and rotates together with the shaft 41. The hub 42 has a support surface that supports the disk 22.

  The rotor magnet 43 is fixed to the hub 42. The rotor magnet 43 has an annular shape centered on the central axis 9, and the inner peripheral surface thereof opposes the outer peripheral surfaces of the plurality of teeth portions 322 of the stator core 32 in the radial direction. The inner peripheral surface of the rotor magnet 43 is a magnetic pole surface in which N poles and S poles are alternately arranged.

  In such a spindle motor 1, when a driving current is applied to the coil 33 through the circuit board 34, radial magnetic flux is generated in the plurality of teeth portions 322 of the stator core 32. Then, circumferential torque is generated by the action of magnetic flux between the teeth portion 322 and the rotor magnet 43, and the rotating portion 4 rotates about the central axis 9 with respect to the stationary portion 3. The disk 22 supported by the hub 42 rotates around the central axis 9 together with the shaft 41 and the hub 42.

<2-3. Wiring from the coil to the solder part>
Subsequently, the wiring of the conducting wire 331 from the coil 33 to the solder portion 341 will be further described. FIG. 4 is a partially enlarged longitudinal sectional view of the spindle motor 1 including the wiring path of the conducting wire 331 from the coil 33 to the solder portion 341. 5 and 6 are a bottom view of the spindle motor 1 and a perspective view as seen from the bottom surface side.

  As shown in FIG. 4, the lower surface of the base member 31 is a first lower surface 31 a corresponding to the lower surface of the cylindrical portion 311 and the first flat plate portion 312, and a lower surface of the inclined portion 313 and the second flat plate portion 314. 2 lower surface 31b. The second lower surface 31b is located radially outside and axially upper than the first lower surface 31a. The second lower surface 31 b includes an inclined surface 313 b that is the lower surface of the inclined portion 313 and an outer lower surface 314 b that is the lower surface of the second flat plate portion 314. The outer lower surface 314b expands in the radial direction on the outer side in the radial direction and on the upper side in the axial direction than the first lower surface 31b. The inclined surface 313b is a surface that connects the outer edge portion of the first lower surface 31b and the inner edge portion of the outer lower surface 314b.

  In the present embodiment, as shown in FIGS. 5 and 6, an inclined surface 313 b is partially formed around the central axis 9. However, the inclined surface 313b may be formed around the center axis 9 over the entire circumference.

  The first flat plate portion 312 of the base member 31 is formed with a through hole 31c that communicates the upper surface and the lower surface thereof. Further, a groove portion 31d extending from the opening on the lower surface side of the through hole 31c toward the radially outer side is formed on the lower surface of the first flat plate portion 312. The end portion on the input side of the conducting wire 331 is drawn from the coil 33 to the lower side of the first flat plate portion 312 through the through hole 31c, and led to the circuit board 34 side through the inside of the groove portion 31d. The conducting wire 331 is fixed with an adhesive 36 inside the groove 31d.

  The circuit board 34 is fixed to the outer lower surface 314b and the inclined surface 313b of the base member 31. The circuit board 34 has three solder portions 341 provided in a portion fixed to the inclined surface 313b. The three solder portions 341 are connected to the input side end portions of the three conducting wires 331, respectively.

  A guide portion 342 is formed at the radially inner end of the circuit board 34. As shown in FIGS. 5 and 6, the guide portion 342 is formed in a hook shape capable of hooking the conducting wire 331. The guide portion 342 is connected to the radially inner end of the circuit board 34 only at one end, and a slit is formed between the other end of the guide 342 and the end of the circuit board 34. ing. For this reason, the conducting wire 331 can be easily hung on the guide part 342 through the slit.

  The conducting wire 331 is hung on the guide portion 342 at a position radially inward of the solder portion 341. The guide part 342 restricts the conducting wire 331 from being spaced apart from the inclined surface 313 b by a certain amount or more, and guides the conducting wire 331 along the lower surface of the base member 31. Thereby, the floating of the conducting wire 331 near the boundary between the first lower surface 31a and the second lower surface 31b is restricted, and interference between the conducting wire 331 and other members is prevented.

  The guide portion 342 plays a role of restricting the floating of the conducting wire 331, but does not always need to be in contact with the conducting wire 331. In other words, the guide portion 342 only needs to have a portion disposed below the conducting wire 331 so that the downward movement of the conducting wire 331 can be restricted when a downward force is applied to the conducting wire 331.

  The circuit board 34 is fixed to the second lower surface 31 b of the base member 31 at a portion other than the guide portion 342. That is, the guide part 342 is released with respect to the inclined surface 313 b of the base member 31. Moreover, the guide part 342 extends a part of base material layer of the circuit board 34 which is a flexible printed circuit board, and can be bent flexibly. For this reason, it is possible to make the guide part 342 in the state spaced apart from the inclined surface 313b. The conducting wire 331 is guided below the circuit board 34 through a notch provided in the guide portion 342 from between the inclined surface 313b and the guide portion 342, and is connected to the solder portion 341.

  As shown in FIG. 4, the length d1 from the connection position 343 between the guide portion 342 and the circuit board 34 to the radially inner end of the guide portion 342 is a height from the connection position 343 to the first lower surface 31a. It is smaller than d2. For this reason, even when the guide portion 342 is separated from the inclined surface 313b, the end portion on the radially inner side of the guide portion 342 is prevented from projecting downward from the first lower surface 31a. Thereby, interference with the guide part 342 and another member is prevented.

  FIG. 7 is a cross-sectional view of a portion of the circuit board 34 other than the wiring pattern. FIG. 8 is a cross-sectional view of the solder portion 341 of the circuit board 34. In FIG. 8, illustration of solder itself is abbreviate | omitted. As shown in FIGS. 7 and 8, the circuit board 34 is formed by laminating four base material layers of a cover layer 34a, a copper layer 34b, a base layer 34c, and an adhesive layer 34d.

  The cover layer 34a and the base layer 34c are made of, for example, an insulating resin such as polyimide. The adhesive layer 34 d is composed of an adhesive for fixing the circuit board 34 to the second lower surface 31 b of the base member 31. The copper layer 34 b is made of conductive copper and is formed along the wiring pattern on the circuit board 34. Therefore, the portion other than the wiring pattern has a three-layer structure of the cover layer 34a, the base layer 34c, and the adhesive layer 34d as shown in FIG. As shown in FIG. 8, in the solder part 341, an opening is formed in the cover layer 34a, and the copper layer 34b is exposed on the surface in the opening.

  FIG. 9 is a longitudinal sectional view of the guide portion 342. The guide portion 342 is formed by extending a cover layer 34a and a base layer 34c of the circuit board 34. That is, the guide portion 342 is configured with fewer layers than other portions of the circuit board 34, and the thickness thereof is thinner than the thickness of other portions of the circuit board 34. For this reason, the guide part 342 is more flexible than the other part of the circuit board 34. Therefore, the conducting wire 331 can be easily hung on the guide portion 342. Further, since the flexibility of the guide portion 342 is particularly high, it is possible to prevent a large force from being applied to other portions of the circuit board 34 even when the guide portion 342 is separated from the inclined surface 313b. For this reason, it is prevented that the other part of the circuit board 34 peels from the 2nd lower surface 31b of the base member 31. FIG.

  As described above, in the present embodiment, the base member 31 has the first lower surface 31a and the second lower surface 31b, and the circuit board 34 is fixed to the second lower surface 31b. A guide portion 342 for guiding the conducting wire 331 is provided between the through hole 31 c and the solder portion 341. For this reason, it is prevented that the conducting wire 331 is separated from the lower surface of the base member 31 beyond a certain distance in the vicinity of the boundary between the first lower surface 31 a and the second lower surface 31 b of the base member 31. Therefore, the floating of the conducting wire 331 is limited, and interference between the conducting wire 331 and other members is prevented.

  In particular, in this embodiment, an inclined surface 313b is formed between the first lower surface 31a and the outer lower surface 314b of the base member 31. For this reason, compared with the case where the boundary of the 1st lower surface 31a and the 2nd lower surface 31b has stood | started up sharply, the conducting wire 331 can be made to fit along the lower surface of the base member 31 without difficulty. In the present embodiment, a solder portion 341 is formed in a portion fixed to the inclined surface 313 b of the circuit board 34. For this reason, floating of the conducting wire 331 is less likely to occur.

  The floating of the conducting wire 331 is relatively likely to occur below the second lower surface 31b, which is the higher surface of the first lower surface 31a and the second lower surface 31b. In this regard, in the present embodiment, the guide portion 342 is provided below the second lower surface 31b where the conductive wire 331 is likely to be lifted. For this reason, the floating of the conducting wire 331 can be prevented more appropriately.

  Moreover, in this embodiment, the circuit board 34 and the guide part 342 are comprised with the continuous single member. For this reason, the guide portion 342 can be provided without fixing a member separate from the circuit board 34 to the base member 31 or processing the base member 31 itself. Thereby, the increase in the manufacturing cost of the spindle motor 1 by providing the guide part 342 can be suppressed.

  In the present embodiment, a single through hole 31c and a single groove 31d are formed in the first flat plate portion 312 of the base member 31, and three conductors 331 are passed through the through hole 31c and the groove 31d. Yes. For this reason, the base member 31 can be reduced in thickness while suppressing the loss of rigidity of the base member 31 as compared with the case where a plurality of the through holes 31c and the groove portions 31d are formed.

<3. Modification>
As mentioned above, although main embodiment of this invention was described, this invention is not limited to said embodiment.

  The guide part 342 may be composed of two layers of the cover layer 34a and the base layer 34c as in the above embodiment, or may be composed of one layer or three layers. For example, as illustrated in FIG. 10, the guide portion 342 may be configured only by the base layer 34 c.

  Moreover, the guide part 342 may be formed in the substantially center of the edge of the circuit board 34 like the above-mentioned embodiment, for example, as shown in FIG. 11, the position where the guide part 342 is biased It may be formed. In the example of FIG. 11, the end portion on one side in the circumferential direction of the guide portion 342 (arrow 91 side in the drawing) is located at the position on the other side in the circumferential direction (arrow 92 side in the drawing) with respect to a part of the solder portions 341. The circuit board 34 is connected to the radially inner end side. In this way, the conductor 331 can be more securely hung on the guide portion 342.

  Further, the guide portion 342 may be connected to the circuit board only at one end in the circumferential direction as in the above-described embodiment, or both ends in the circumferential direction may be connected to the circuit as shown in FIG. It may be connected to the substrate 34. In this case, after passing the conducting wire 331 through the hole formed in the guide portion 342, the end portion of the conducting wire 331 may be connected to the solder portion 341. In this way, the guide part 342 can hold the conducting wire 331 more firmly.

  In addition, one guide portion 342 may be provided as in the above-described embodiment, or a plurality of guide portions 342 may be provided between the through hole 31c and the solder portion 341. For example, three guide portions 342 corresponding to each of the three conductive wires 331 may be provided. Further, each conducting wire 331 may reach the solder portion 341 via a plurality of guide portions 342.

  Further, the guide portion 342 may not be fixed to the inclined surface 313b of the base member 31 as in the above embodiment, or an adhesive is applied after the conducting wire 331 is hung on the guide portion 342, As a result, the guide part 342 and the conducting wire 331 may be fixed to the inclined surface 313b.

  Further, as in the above embodiment, only one through hole 31c may be formed in the base member 31, or a plurality of through holes 31c may be formed. For example, three through holes 31 c corresponding to the three conductive wires 331 may be formed in the first flat plate portion 312 of the base member 31.

  Moreover, the three conducting wires 331 may be fixed by an adhesive inside the groove portion 31d as in the above embodiment, or may not be fixed. Moreover, the groove part 31d may be formed in the lower surface of the base member 31 like the said embodiment, and does not need to be formed.

  The spindle motor of the present invention may be for rotating a magnetic disk as in the above embodiment, or may be for rotating another disk such as an optical disk. In particular, since a spindle motor for a magnetic disk is strongly demanded to be thin, the technical significance of applying the present invention to a spindle motor for a magnetic disk is great.

  The present invention can be used for a spindle motor and a disk drive device.

DESCRIPTION OF SYMBOLS 1 Spindle motor 2 Disc drive device 3 Stationary part 4 Rotating part 9 Central shaft 21 Apparatus housing 22 Disk 23 Access part 31 Base member 31a 1st lower surface 31b 2nd lower surface 31c Through-hole 31d Groove part 32 Stator core 33 Coil 34 Circuit board 34a Cover layer 34b Copper layer 34c Base layer 34d Adhesive layer 35 Static bearing unit 36 Adhesive 41 Shaft 42 Hub 43 Rotor magnet 311 Cylindrical portion 312 First flat plate portion 313 Inclined portion 313b Inclined surface 314 Flat plate portion 314b Outer lower surface 331 Conductor 341 Guide 342 Solder portion 342 Part

Claims (14)

A base member extending in a direction perpendicular to the central axis disposed above and below;
A coil disposed above the base member;
A rotating part that rotates about the central axis with respect to the base member;
A circuit board having a solder portion for connecting a conductor drawn from the coil;
With
The lower surface of the base member has a first lower surface and a second lower surface located radially outward and axially above the first lower surface,
The circuit board is fixed to the second lower surface of the base member;
The conducting wire is led out below the base member through a through hole that communicates the upper surface of the base member and the first lower surface,
A spindle motor in which a guide portion is provided between the through hole and the solder portion to guide the conductive wire along the lower surface of the base member. The spindle motor according to claim 1,
The guide portion is a spindle motor provided below the second lower surface. The spindle motor according to claim 1 or 2,
The second lower surface is
On the radially outer side and the axially upper side of the first lower surface, an outer lower surface extending in a direction orthogonal to the central axis,
An inclined surface connecting the first lower surface and the outer lower surface;
Have
The solder motor is a spindle motor provided at a portion fixed to the inclined surface of the circuit board. In the spindle motor according to any one of claims 1 to 3,
The spindle motor is formed of a cover layer and / or a base layer of the circuit board. The spindle motor according to claim 4, wherein
The guide motor is a spindle motor that is separated from the second lower surface. The spindle motor according to claim 5, wherein
The lead wire is guided from below between the second lower surface and the guide portion through a hole or notch provided in the guide portion and below the circuit board, and connected to the solder portion. motor. In the spindle motor according to claim 5 or 6,
The guide part is formed in a bowl shape,
A spindle motor in which one end portion of the guide portion is connected to the circuit board. The spindle motor according to claim 7, wherein
The guide part is a spindle motor in which one end in the circumferential direction is connected to the circuit board at a position on the other side in the circumferential direction from the solder part. In the spindle motor according to any one of claims 5 to 8,
A spindle motor, wherein a length from a connection position between the guide portion and the circuit board to a radially inner end of the guide portion is smaller than a height of the connection position with respect to the first lower surface. In the spindle motor according to any one of claims 4 to 9,
A spindle motor, wherein the circuit board is a flexible circuit board. In the spindle motor according to any one of claims 4 to 10,
A spindle motor in which the guide portion is thinner than the circuit board. In the spindle motor according to any one of claims 1 to 11,
The first lower surface has a groove extending from the through hole toward the circuit board side,
A spindle motor in which the conducting wire is accommodated in the groove. In the spindle motor according to any one of claims 1 to 12,
The spindle motor is fixed to the lower surface of the base member via an adhesive. A spindle motor according to any one of claims 1 to 13,
An access unit that performs at least one of reading and writing of information with respect to the disk supported by the rotating unit of the spindle motor;
A housing for housing the spindle motor and the access unit;
A disk drive device comprising:

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