JP5889170B2 - PCB contaminated element processing equipment - Google Patents

PCB contaminated element processing equipment Download PDF

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JP5889170B2
JP5889170B2 JP2012264786A JP2012264786A JP5889170B2 JP 5889170 B2 JP5889170 B2 JP 5889170B2 JP 2012264786 A JP2012264786 A JP 2012264786A JP 2012264786 A JP2012264786 A JP 2012264786A JP 5889170 B2 JP5889170 B2 JP 5889170B2
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exhaust gas
pcb
combustion furnace
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condensed water
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JP2014108407A (en
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塚原 千幸人
千幸人 塚原
土橋 晋作
晋作 土橋
川元 昇
昇 川元
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Mitsubishi Heavy Industries Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description

本発明は、PCB汚染素子の処理装置に関するものである。   The present invention relates to a processing apparatus for PCB contaminated elements.

PCBは、従来からトランスやコンデンサなどの絶縁油として広く使用されてきた経緯があるが、その毒性が強いことにより、PCBを処理する必要がある。このため、PCBを無害化処理する種々の分解処理方法が提案されている(特許文献1乃至5参照)。   Although PCB has been widely used as an insulating oil for transformers, capacitors, and the like, it is necessary to treat PCB due to its strong toxicity. For this reason, various decomposition processing methods for detoxifying PCB have been proposed (see Patent Documents 1 to 5).

特開平11−253795号公報Japanese Patent Laid-Open No. 11-253895 特開平11−253796号公報Japanese Patent Laid-Open No. 11-253796 特開2000−126588号公報JP 2000-126588 A 特開2004−311235号公報JP 2004-31235 A 特開2005−21830号公報JP 2005-21830 A

しかしながら、従来におけるPCBに汚染された絶縁紙、木の素子無害化処理においては、以下のような問題がある。
1)PCB汚染物を真空加熱処理し、PCB分離後にスラリー化して水熱分解処理装置に送り、この水熱分解処理での分解後、その処理液について、PCBが処理基準(排水中のPCB濃度3ppb以下)を満たしているかの廃水処理判定法の場合、スラリー化のための粉砕ミルで破砕・粉砕できないものがある。これは、スラリー化の粉砕ミル処理装置では、粉砕入口条件が3mm以下となっているので、それ以上のものは、細断不可能であり、全ての処理ができないという問題がある。
However, conventional insulation paper and wood element detoxification processing contaminated with PCB has the following problems.
1) PCB contaminants are vacuum-heated, slurried after PCB separation, sent to a hydrothermal decomposition apparatus, and after decomposition in this hydrothermal decomposition process, the PCB is treated according to the treatment standard (PCB concentration in wastewater) In the case of a wastewater treatment determination method that satisfies 3 ppb or less), there are some that cannot be crushed and pulverized by a pulverizing mill for slurrying. This is because, in the slurrying pulverization mill processing apparatus, the pulverization inlet condition is 3 mm or less, so that the pulverization inlet condition cannot be shredded, and all processing cannot be performed.

そこで、2)真空加熱分離後に、真空加熱処理物を溶剤洗浄装置により洗浄処理を行い、この洗浄後に溶出試験判定で、処理基準以下となっているか否かを判定する方法があるが、溶出試験での卒業判定に妨害となる洗浄に使用した有機溶剤(例えば、IPA、イソプロピルアルコール、他の炭化水素系溶剤)と、素子が真空加熱によって分解されたセルロース由来木酢液成分が、PCBを貯めているために、卒業判定操作時に同伴溶出してくるので、溶出液中のPCB濃度が3ppb以下の卒業判定ができないという問題がある。この結果、無害化処理においては、水熱分解処理法によらねばならないこととなるが、水熱分解処理法では、一日あたりの処理量に限界があり、また、残渣(汚泥)が発生する、という課題がある。   Therefore, 2) After vacuum heat separation, there is a method in which the vacuum heat-treated product is washed with a solvent washing device, and after this washing, it is judged whether the elution test is below the treatment standard in the elution test judgment. The organic solvent (for example, IPA, isopropyl alcohol, and other hydrocarbon solvents) used for cleaning that interferes with the graduation decision at the factory, and the cellulose-derived wood vinegar component whose elements were decomposed by vacuum heating stored PCB Therefore, there is a problem that graduation determination cannot be performed when the PCB concentration in the eluate is 3 ppb or less because the elution is accompanied during the graduation determination operation. As a result, in the detoxification treatment, the hydrothermal decomposition treatment method must be used, but in the hydrothermal decomposition treatment method, there is a limit to the amount of treatment per day and a residue (sludge) is generated. There is a problem.

現在わが国におけるPCB処理事業においては、多量のPCB含有汚染物を処理しているが、さらに迅速な処理技術の出現が切望されている。   Currently, in the PCB processing business in Japan, a large amount of PCB-containing contaminants are processed, but there is an urgent need for more rapid processing technology.

本発明は、前記問題に鑑み、PCB汚染物である絶縁紙、木等を迅速に処理することができるPCB汚染素子の処理装置を提供することを課題とする。   In view of the above problems, an object of the present invention is to provide a processing apparatus for PCB contaminated elements that can rapidly process insulating paper, wood, and the like, which are PCB contaminants.

上述した課題を解決するための本発明の第1の発明は、PCBを含有するPCB含有素子を真空加熱処理する真空加熱乾燥装置と、前記真空加熱乾燥装置で加熱処理した加熱処理物を燃焼焼却する燃焼炉と、前記燃焼炉の後流側に設けられ、前記燃焼炉からの排ガスを冷却し、前記排ガス中の水分を凝縮水として除去する冷却器と、前記凝縮水を回収する凝縮水回収タンクと、除湿した前記排ガス中の煤塵を除去する煤塵除去手段と、を具備することを特徴とするPCB汚染素子の処理装置にある。 The first invention of the present invention for solving the above-mentioned problems is a vacuum heating drying apparatus for vacuum heating treatment of a PCB-containing element containing PCB, and combustion incineration of a heat-treated product heat-treated by the vacuum heating drying apparatus. A combustion furnace that is provided on the downstream side of the combustion furnace , cools the exhaust gas from the combustion furnace and removes moisture in the exhaust gas as condensed water, and condensate water recovery that recovers the condensed water there are a tank, a dust removing means for removing dust in the exhaust gas dehumidified, the processor of PCB pollution device characterized by comprising a.

第2の発明は、PCBを含有するPCB含有素子を真空加熱処理する真空加熱乾燥装置と、前記真空加熱乾燥装置の排出口と連通し、加熱処理した加熱処理物を徐々に供給して燃焼焼却する燃焼炉と、前記真空加熱乾燥装置内部からの排気ガスを、燃焼炉に導入する第1の排気ガス導入ラインと、前記燃焼炉の後流側に設けられ、前記燃焼炉からの排ガスを冷却し、前記排ガス中の水分を凝縮水として除去する冷却器と、前記凝縮水を回収する凝縮水回収タンクと、除湿した前記排ガス中の煤塵を除去する煤塵除去手段と、を具備することを特徴とするPCB汚染素子の処理装置にある。 The second invention communicates with a vacuum heat drying device for vacuum heat treatment of a PCB-containing element containing PCB, and a discharge port of the vacuum heat drying device, and gradually supplies the heat-treated heat-treated product for combustion incineration. A combustion furnace, a first exhaust gas introduction line for introducing exhaust gas from the vacuum heating and drying apparatus into the combustion furnace, and a downstream side of the combustion furnace to cool the exhaust gas from the combustion furnace and, wherein a cooler, a condensed water recovery tank for collecting the condensed water, a dust removing means for removing dust in the exhaust gas dehumidified, by including the removal of moisture in the exhaust gas as condensed water It is in the processing apparatus of the PCB contaminated element.

第3の発明は、第1の発明において、前記燃焼炉の排ガスを再度燃焼炉に戻す排ガス戻しラインと、前記排ガス中の残留芳香族化合物濃度を検知する芳香族化合物検知手段と、前記芳香族化合物検知手段の計測の結果、排ガス中の芳香族化合物の濃度が所定値以上の場合、燃焼炉側に排ガスを導入するために排ガス流路を切替える制御を行う制御装置と、を具備することを特徴とするPCB汚染素子の処理装置にある。   According to a third invention, in the first invention, an exhaust gas return line for returning the exhaust gas of the combustion furnace to the combustion furnace again, an aromatic compound detection means for detecting a residual aromatic compound concentration in the exhaust gas, and the aromatic A control device that performs control to switch the exhaust gas flow path in order to introduce the exhaust gas to the combustion furnace side when the concentration of the aromatic compound in the exhaust gas is equal to or higher than a predetermined value as a result of the measurement of the compound detection means. It is in the processing apparatus of the PCB contamination element characterized.

第4の発明は、第2の発明において、前記燃焼炉の排ガスを前記真空加熱乾燥装置の周囲に戻す排ガス戻しラインと、前記真空加熱乾燥装置の周囲を加熱した排ガスを、燃焼炉に導入する第2の排気ガス導入ラインと、を具備することを特徴とするPCB汚染素子の処理装置にある。 The fourth invention is the second invention, an exhaust gas return line returning the exhaust gas of the combustion furnace around the vacuum heating drying device, the exhaust gas which has heated the surroundings before Symbol vacuum heat drying apparatus, introduced into the combustion furnace And a second exhaust gas introduction line. The PCB contamination element processing apparatus is provided.

第5の発明は、第1乃至4のいずれか一つの発明において、前記冷却器で凝縮した凝縮水中のPCB濃度を検知する第1のPCB検知手段と、前記集塵機の後流側の排ガス中のPCB濃度を検知する第2のPCB検知手段と、を具備することを特徴とするPCB汚染素子の処理装置にある。   According to a fifth invention, in any one of the first to fourth inventions, the first PCB detection means for detecting the PCB concentration in the condensed water condensed by the cooler, and the exhaust gas on the downstream side of the dust collector And a second PCB detecting means for detecting the PCB concentration.

第6の発明は、第1乃至5のいずれか一つの発明において、前記燃焼炉が、ロータリーキルンと再燃焼室とを備えたロータリーキルン炉であることを特徴とするPCB汚染素子の処理装置にある。   According to a sixth aspect of the invention, there is provided the processing apparatus for a PCB contamination element according to any one of the first to fifth aspects, wherein the combustion furnace is a rotary kiln furnace provided with a rotary kiln and a recombustion chamber.

本発明によれば、真空加熱乾燥装置で、PCB汚染物を低濃度PCBに処理し、その後さらに燃焼炉で、完全燃焼処理することで、紙、木等のPCB汚染素子の無害化処理を効率良く実施することができる。   According to the present invention, PCB contaminants are processed into low-concentration PCB with a vacuum heating and drying apparatus, and then further completely burned with a combustion furnace, thereby efficiently detoxifying PCB contaminated elements such as paper and wood. Can be implemented well.

図1は、実施例1に係るPCB汚染素子の処理装置の概略図である。FIG. 1 is a schematic diagram of a PCB contaminated element processing apparatus according to a first embodiment. 図2は、実施例2に係るPCB汚染素子の処理装置の概略図である。FIG. 2 is a schematic diagram of the PCB contaminated element processing apparatus according to the second embodiment.

以下に添付図面を参照して、本発明の好適な実施例を詳細に説明する。なお、この実施例により本発明が限定されるものではなく、また、実施例が複数ある場合には、各実施例を組み合わせて構成するものも含むものである。   Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by this Example, Moreover, when there exists multiple Example, what comprises combining each Example is also included.

図1は、実施例1に係るPCB汚染素子の処理装置の概略図である。
図1に示すように、本実施例に係るPCB汚染素子の処理装置10Aは、PCBを含有する絶縁紙、木のPCB含有素子(以下「PCB含有素子」)11を真空加熱処理する真空加熱乾燥装置12と、真空加熱乾燥装置12で加熱処理した加熱処理物である脆化した素子13を燃焼焼却する燃焼炉14と、燃焼炉14の後流側に設けられ、燃焼炉14からの排ガス15中の水分を凝縮水16として除去する冷却器17と、除湿した排ガス15中の煤塵18を除去する集塵除去手段である集塵器19と、を具備するものである。
本実施例では、燃焼炉14と冷却器17の間に廃熱ボイラ20を介装し、空気20aを加熱しており、加熱された空気20bは燃焼炉14内に導入されている(なお、空気20aの導入の図示は省略する)。
ここで、本実施例では、燃焼炉14として、ロータリーキルン14aと重油等を供給して再燃焼する再燃焼室14bとを備えたロータリーキルン炉としている。
ロータリーキルン14aには、プッシャー22により脆化した素子13を徐々に供給している。
なお、図1中、符号21は素子を供給するホッパー、23は再燃焼室14bの下部に設けた、スラグ24を排出するスラグコンベヤ、25はスラグ24を保管するスラグバンカ、26は凝縮水16を貯留する凝縮水タンク、27は灰排出容器、28は排ガス15を外部へ排出する煙突を各々図示する。
FIG. 1 is a schematic diagram of a PCB contaminated element processing apparatus according to a first embodiment.
As shown in FIG. 1, a PCB contaminated element processing apparatus 10A according to the present embodiment is a vacuum heating drying process in which an insulating paper containing PCB and a wooden PCB containing element (hereinafter, “PCB containing element”) 11 are vacuum heat treated. An apparatus 12, a combustion furnace 14 that combusts and incinerates an embrittled element 13 that is a heat-treated product heat-treated by the vacuum heating and drying apparatus 12, and an exhaust gas 15 from the combustion furnace 14 that is provided on the downstream side of the combustion furnace 14. A cooler 17 that removes moisture therein as condensed water 16, and a dust collector 19 that is dust collection means for removing the soot 18 in the dehumidified exhaust gas 15 are provided.
In the present embodiment, a waste heat boiler 20 is interposed between the combustion furnace 14 and the cooler 17 to heat the air 20a, and the heated air 20b is introduced into the combustion furnace 14 (note that The illustration of the introduction of the air 20a is omitted).
Here, in this embodiment, the combustion kiln 14 is a rotary kiln furnace provided with a rotary kiln 14a and a recombustion chamber 14b for supplying heavy oil or the like to reburn.
The element 13 embrittled by the pusher 22 is gradually supplied to the rotary kiln 14a.
In FIG. 1, reference numeral 21 denotes a hopper for supplying elements, 23 denotes a slag conveyor for discharging the slag 24 provided at the lower part of the recombustion chamber 14b, 25 denotes a slag bunker for storing the slag 24, and 26 denotes condensed water 16. A condensed water tank to be stored, 27 is an ash discharge container, and 28 is a chimney for discharging the exhaust gas 15 to the outside.

本実施例では、さらに再燃焼室14bからの排ガス15を再度燃焼炉14のロータリーキルン14a側に戻すための排ガス戻しラインL2が排ガス排出ラインL1から流路切替手段30により分岐されている。 In this embodiment, an exhaust gas return line L 2 for returning the exhaust gas 15 from the recombustion chamber 14 b to the rotary kiln 14 a side of the combustion furnace 14 is further branched from the exhaust gas discharge line L 1 by the flow path switching means 30.

また、排ガス排出ラインL1には、排ガス15中の残留芳香族化合物濃度を検知する芳香族化合物検知手段31が介装され、排ガス15中の残留芳香族化合物の濃度を計測している。 Further, the exhaust gas discharge line L 1 is provided with an aromatic compound detection means 31 for detecting the residual aromatic compound concentration in the exhaust gas 15 to measure the concentration of the residual aromatic compound in the exhaust gas 15.

そして、前記芳香族化合物検知手段31の計測の結果、排ガス15中の芳香族化合物の濃度が所定値以上の場合、燃焼炉14のロータリーキルン14a側に排ガス15を導入するために、流路切替手段30を図示しない制御装置で制御するようにしている。   Then, as a result of the measurement by the aromatic compound detection means 31, when the concentration of the aromatic compound in the exhaust gas 15 is equal to or higher than a predetermined value, in order to introduce the exhaust gas 15 to the rotary kiln 14a side of the combustion furnace 14, the flow path switching means 30 is controlled by a control device (not shown).

また、本実施例では、さらに冷却器17で凝縮した凝縮水16中のPCB濃度を検知する第1のPCB検知手段32である液中のPCB濃度検知手段と、集塵機19の後流側の排ガス15中のPCB濃度を検知する第2のPCB検知手段33である気中のPCB濃度検知手段と、前記集塵機19からの集塵した煤塵18中のPCB濃度を検知する第3のPCB検知手段34である固体中のPCB濃度検知手段とを設け、各々排出基準内であることを確認している。   Further, in this embodiment, the PCB concentration detecting means in the liquid which is the first PCB detecting means 32 for detecting the PCB concentration in the condensed water 16 condensed by the cooler 17 and the exhaust gas on the downstream side of the dust collector 19. 15, a second PCB detection means 33 for detecting the PCB concentration in the air, and a third PCB detection means 34 for detecting the PCB concentration in the dust 18 collected from the dust collector 19. The PCB concentration detecting means in the solid is provided, and it is confirmed that each is within the discharge standard.

このようなPCB汚染素子の処理装置10Aを用いてPCB汚染素子を処理する一例を説明する。   An example of processing a PCB contaminated element using such a PCB contaminated element processing apparatus 10A will be described.

1) 保管されたPCB含有素子11を真空加熱乾燥装置12内に所定量投入し、温度230℃で、真空条件(例えば230〜250℃、6〜7Pa程度)で、所定時間真空加熱処理し、PCB含有素子12を脆化させる。 1) A predetermined amount of the PCB-containing element 11 stored is put into the vacuum heating and drying apparatus 12, and is subjected to vacuum heat treatment at a temperature of 230 ° C. under a vacuum condition (for example, about 230 to 250 ° C., about 6 to 7 Pa) for a predetermined time. The PCB-containing element 12 is embrittled.

2) 次に、脆化した素子13をホッパー21に投入し、プッシャー22によりロータリーキルン14a内へ徐々に搬送する。 2) Next, the embrittled element 13 is put into the hopper 21 and is gradually conveyed by the pusher 22 into the rotary kiln 14a.

3) ロータリーキルン14a内では、脆化した素子13を回転搬送しながら燃焼する。ここで、ほとんどの脆化した素子13が燃焼し、一部は気化して二次燃焼炉である再燃焼室14bへ流れる。この燃焼により発生した灰やスラグ24は、スラグコンベヤ23側に落下し、その後スラグバンカ25に捕集搬出される。 3) In the rotary kiln 14a, the embrittled element 13 is burned while being rotated and conveyed. Here, most of the embrittled elements 13 are combusted, and part of them are vaporized and flow to the recombustion chamber 14b which is a secondary combustion furnace. Ashes and slag 24 generated by this combustion fall to the slag conveyor 23 side, and then are collected and carried out to the slag bunker 25.

4) 再燃焼室14b内では重油等の燃料及び空気が供給され、二次燃焼がなされ、排ガス中に残留するPCB他有害有機物を完全燃焼する。
ここで、ロータリーキルン14aと再燃焼室14bの燃焼温度は、ダイオキシンが発生等しても燃焼無害化できる温度である例えば850℃以上、1,100℃が適当である。しかしながら、素子中に無機物を多く含む場合には、無機物が断熱作用を呈することから、燃焼温度を1,300℃程度まで上昇させて処理するようにしてもよい。
4) Fuel and air, such as heavy oil, are supplied in the recombustion chamber 14b, secondary combustion is performed, and PCBs and other harmful organic substances remaining in the exhaust gas are completely burned.
Here, the combustion temperature in the rotary kiln 14a and the recombustion chamber 14b is, for example, 850 ° C. or more and 1,100 ° C., which are temperatures that can be made harmless even if dioxins are generated. However, when the element contains a large amount of an inorganic substance, the inorganic substance exhibits a heat insulating action, so that the combustion temperature may be increased to about 1,300 ° C. for processing.

5) 再燃焼室14bの炉出口では、排ガス排出ラインL1に介装された芳香族化合物検知手段31により、排ガス15中の未処理有機物を監視するようにしている。
この芳香族化合物検知手段31としては、例えばUV吸収法による計測(波長274nm)により、芳香族のベンゼン環二重結合を測定するようにしている。
これにより、PCB由来の芳香族分解物があるか否かを監視するようにしている。
5) In the furnace exit of the re-combustion chamber 14b, the aromatics detecting means 31 interposed in the exhaust gas discharge line L 1, and so as to monitor the unprocessed organic matter in the exhaust gas 15.
As this aromatic compound detection means 31, the aromatic benzene ring double bond is measured, for example, by measurement using a UV absorption method (wavelength 274 nm).
Thereby, it is made to monitor whether there exists any PCB-derived aromatic decomposition product.

6) 芳香族化合物検知手段31の計測により、排ガス15中に残存するベンゼン環物質を検知した際には、流路切替手段30を図示しない制御装置により切替え、ロータリーキルン14aへ戻して、再燃焼処理し、排ガス中の芳香族化合物濃度を所定値以下としている。 6) When the benzene ring substance remaining in the exhaust gas 15 is detected by the measurement of the aromatic compound detection means 31, the flow path switching means 30 is switched by a control device (not shown) and returned to the rotary kiln 14a for recombustion processing. However, the aromatic compound concentration in the exhaust gas is set to a predetermined value or less.

7) 処理後の排ガス15は、廃熱ボイラ20により、燃焼空気の予熱源として利用される。 7) The treated exhaust gas 15 is used by the waste heat boiler 20 as a preheating source of combustion air.

8) 排ガス15は、さらに冷却器17に導入され、排ガス中に含有する水分を凝縮水16として冷却凝縮して、凝縮水タンク26に回収している。 8) The exhaust gas 15 is further introduced into the cooler 17, the water contained in the exhaust gas is cooled and condensed as condensed water 16, and collected in the condensed water tank 26.

9) 凝縮水タンク26内の凝縮水16を液中の第1のPCB検知手段32により、水中のPCB濃度が3ppb以下であることを確認し、合格であれば排水する。なお、不合格の際は、水熱分解処理装置に別途導入して分解処理する。
液中の第1のPCB検知手段32としては、液中のPCBを固相抽出し、抽出物を例えばECD/GC等の分析装置で分析している。
9) The condensed water 16 in the condensed water tank 26 is confirmed by the first PCB detection means 32 in the liquid to have a PCB concentration in water of 3 ppb or less. In addition, when it fails, it introduces into a hydrothermal decomposition processing apparatus separately, and decomposes.
As the first PCB detection means 32 in the liquid, the PCB in the liquid is subjected to solid phase extraction, and the extract is analyzed by an analyzer such as ECD / GC.

10) 除湿後の排ガス15は、集塵器(例えば電気集塵やバグフィルタ等)19で除塵して煤塵18を除去する。煤塵除去後の排ガスは、気中の第2のPCB検知手段33により分析し、気中PCBが0.1mg/m3以下であることを確認して排出する。
気中の第2のPCB検知手段33としては、TOFMS法や公定法により計測している。
10) The exhaust gas 15 after dehumidification is dust-removed by a dust collector (for example, electric dust collector or bag filter) 19 to remove the dust 18. The exhaust gas after the dust removal is analyzed by the second PCB detection means 33 in the air, and it is discharged after confirming that the air PCB is 0.1 mg / m 3 or less.
The second PCB detection means 33 in the air is measured by the TOFMS method or the official method.

また、集塵器19から排出された灰や固形物等の煤塵18は、第3のPCB検知手段34で固体中のPCB濃度を確認して、溶出試験で3ppb以下であることを確認後に排出する。なお、不合格の場合は、別途溶剤洗浄装置で洗浄後に溶出試験で判定後排出する。   Moreover, the dust 18 such as ash and solid matter discharged from the dust collector 19 is discharged after confirming the PCB concentration in the solid by the third PCB detecting means 34 and confirming that it is 3 ppb or less in the elution test. To do. In addition, in the case of disqualification, it discharges after judging by a dissolution test after washing with a separate solvent washing device.

本PCB汚染素子の処理装置10Aによれば、真空加熱乾燥装置12で、約5,000ppm以下のPCB濃度に処理し、その後さらにロータリーキルン14aと再燃焼室14bとを備えた燃焼炉14で、完全燃焼処理することで、紙、木等のPCB汚染素子の無害化処理を効率良く実施することができる。   According to this PCB contamination element processing apparatus 10A, the vacuum heating / drying apparatus 12 performs processing to a PCB concentration of about 5,000 ppm or less, and then further completes in a combustion furnace 14 equipped with a rotary kiln 14a and a recombustion chamber 14b. By performing the combustion treatment, it is possible to efficiently carry out the detoxification treatment of the PCB-polluting elements such as paper and wood.

この結果、従来のような真空加熱乾燥装置の処理温度を高温(例えば500度)で実施し、長時間に亙って加熱処理をすることがなくなり、処理の迅速化を図ることができる。   As a result, the processing temperature of the conventional vacuum heating and drying apparatus is carried out at a high temperature (for example, 500 degrees), so that the heat treatment is not performed for a long time, and the processing can be speeded up.

また、5,000ppm(mg/kg)の微量PCB汚染物であるので、処理速度が速くなり、一日で多量のPCB汚染物の処理を行うことができる。   Moreover, since it is a trace amount PCB contamination of 5,000 ppm (mg / kg), the processing speed is increased, and a large amount of PCB contamination can be processed in one day.

また、燃焼炉14として、ロータリーキルン14aと再燃焼室14bとを備えたロータリーキルン炉を用い、再燃焼室14bとして二段火炎とすることで、PCB汚染物の確実な燃焼処理が可能となる。また、各所のPCBを計測することで、施設からの有害物の排出がない処理を実施することができる。   Further, by using a rotary kiln furnace provided with a rotary kiln 14a and a recombustion chamber 14b as the combustion furnace 14, and using a two-stage flame as the recombustion chamber 14b, a reliable combustion treatment of PCB contaminants becomes possible. In addition, by measuring the PCBs at various locations, it is possible to carry out a process in which no harmful substances are discharged from the facilities.

本実施例では、燃焼炉14として、ロータリーキルン炉を用いて説明したが、本発明はこれに限定されず、脆化した素子13を燃焼処理するものであれば、いずれの焼却炉を用いるようにしてもよい。   In the present embodiment, the rotary kiln furnace is used as the combustion furnace 14. However, the present invention is not limited to this, and any incinerator may be used as long as it can burn the embrittled element 13. May be.

図2は、実施例2に係るPCB汚染素子の処理装置の概略図である。なお、実施例1の構成と同一の構成部材については、同一符号を付してその説明は省略する。
図2に示すように、本実施例に係るPCB汚染素子の処理装置10Bは、PCBを含有するPCB含有素子11を真空加熱処理する真空加熱乾燥装置41と、この真空加熱乾燥装置41を覆う外室43と、前記真空加熱乾燥装置41を覆う外室43の排出口と連通口44で連通し、加熱処理した脆化した素子13を徐々に供給して燃焼焼却する燃焼炉14と、前記真空加熱乾燥装置41内部からの排気ガス46を、燃焼炉14側に導入する第1の排気ガス導入ラインL11と、前記燃焼炉14の後流側に設けられ、前記燃焼炉14からの排ガス15中の水分を除去する冷却器17と、除湿した排ガス中の煤塵18を除去する集塵器19と、を具備するものである。
FIG. 2 is a schematic diagram of the PCB contaminated element processing apparatus according to the second embodiment. In addition, about the same component as the structure of Example 1, the same code | symbol is attached | subjected and the description is abbreviate | omitted.
As shown in FIG. 2, the PCB contaminated element processing apparatus 10 </ b> B according to the present embodiment includes a vacuum heating / drying apparatus 41 that vacuum heat-treats the PCB-containing element 11 containing PCB, and an outside covering the vacuum heating / drying apparatus 41. A combustion furnace 14 that communicates with the chamber 43 through a communication port 44 and a discharge port of the outer chamber 43 that covers the vacuum heating and drying apparatus 41, gradually supplies the heat-treated embrittled element 13 and burns it; and the vacuum A first exhaust gas introduction line L 11 for introducing the exhaust gas 46 from the inside of the heating and drying apparatus 41 to the combustion furnace 14 side, and an exhaust gas 15 from the combustion furnace 14 provided on the downstream side of the combustion furnace 14. It comprises a cooler 17 that removes moisture in the interior, and a dust collector 19 that removes soot 18 in the dehumidified exhaust gas.

実施例1では、別途独立して設けた真空加熱乾燥装置12を用い、脆化したPCB素子13を徐々にホッパ21を介して導入していたが、本実施例は、真空加熱乾燥装置41を備えた燃焼炉14を用いることで、脆化したPCB素子13を連続して供給するようにしている。   In the first embodiment, the vacuum heating / drying device 12 provided separately is used, and the embrittled PCB element 13 is gradually introduced through the hopper 21. However, in this embodiment, the vacuum heating / drying device 41 is installed. By using the combustion furnace 14 provided, the embrittled PCB elements 13 are continuously supplied.

また、本実施例では、排ガス中の芳香族化合物検知手段31でガス中の残留する芳香族化合物を計測するが、残存のベンゼン環物質を検知したか否かの有無にかかわらず、真空加熱乾燥装置41の熱源として利用し、真空加熱乾燥装置41の加熱を補完するようにしている。   In the present embodiment, the aromatic compound remaining in the gas is measured by the aromatic compound detection means 31 in the exhaust gas, but vacuum heating drying is performed regardless of whether or not the remaining benzene ring substance is detected. It is used as a heat source for the device 41 and complements the heating of the vacuum heating and drying device 41.

真空加熱乾燥装置41の周囲の外室43に導入した排ガス15の排気は、燃焼炉14側に第2の排気ガス導入ラインL12を介して導入しロータリーキルン14a内で処理するようにしている。 The exhaust gas 15 introduced into the outer chamber 43 around the vacuum heating and drying apparatus 41 is introduced into the combustion furnace 14 via the second exhaust gas introduction line L 12 and processed in the rotary kiln 14a.

なお、真空加熱乾燥装置41の真空ポンプ42からの排がう46は、微量のPCBガスを含むことから、第1の排気ガス導入ラインL11を介してプッシャー22側に押し込んで、脆化した素子13と同伴しつつ、ロータリーキルン14a内で処理するようにしている。 The exhaust 46 from the vacuum pump 42 of the vacuum heating and drying apparatus 41 contains a small amount of PCB gas, so that it is pushed into the pusher 22 side via the first exhaust gas introduction line L 11 and becomes brittle. Processing is performed in the rotary kiln 14 a while accompanying the element 13.

従来においては、高濃度処理として採用されてきた、真空加熱乾燥装置を燃焼炉14と連通するように付帯することで、脆化した素子13の保管や、搬送における手間がかかっていたが、本実施例によれば、これらの手間等を省くことができ、一気通貫に近い連続した処理が可能となる。   Conventionally, it has been troublesome to store and transport the embrittled element 13 by attaching a vacuum heating and drying apparatus, which has been adopted as a high concentration treatment, to communicate with the combustion furnace 14. According to the embodiment, it is possible to save these troubles and the like, and it is possible to perform continuous processing that is almost continuous.

10A、10B PCB汚染素子の処理装置
11 PCBを含有する絶縁紙、木のPCB含有素子(PCB含有素子)
12 真空加熱乾燥装置
13 脆化した素子
14 燃焼炉
15 排ガス
16 凝縮水
17 冷却器
18 煤塵
19 煤塵器
20 廃熱ボイラ
10A, 10B PCB contaminated element processing equipment 11 Insulated paper containing PCB, wood PCB containing element (PCB containing element)
DESCRIPTION OF SYMBOLS 12 Vacuum heating drying apparatus 13 Embrittlement element 14 Combustion furnace 15 Exhaust gas 16 Condensed water 17 Cooler 18 Dust 19 Dust collector 20 Waste heat boiler

Claims (6)

PCBを含有するPCB含有素子を真空加熱処理する真空加熱乾燥装置と、
前記真空加熱乾燥装置で加熱処理した加熱処理物を燃焼焼却する燃焼炉と、
前記燃焼炉の後流側に設けられ、前記燃焼炉からの排ガスを冷却し、前記排ガス中の水分を凝縮水として除去する冷却器と、
前記凝縮水を回収する凝縮水回収タンクと、
除湿した前記排ガス中の煤塵を除去する煤塵除去手段と、を具備することを特徴とするPCB汚染素子の処理装置。
A vacuum heating and drying apparatus for vacuum heating a PCB-containing element containing PCB;
A combustion furnace for burning and incinerating the heat-treated product heat-treated by the vacuum heating and drying apparatus;
A cooler that is provided on the downstream side of the combustion furnace , cools the exhaust gas from the combustion furnace, and removes moisture in the exhaust gas as condensed water ;
A condensed water recovery tank for recovering the condensed water;
Processor of PCB pollution element characterized by comprising a dust removing means for removing dust in the exhaust gas dehumidified, the.
PCBを含有するPCB含有素子を真空加熱処理する真空加熱乾燥装置と、
前記真空加熱乾燥装置の排出口と連通し、加熱処理した加熱処理物を徐々に供給して燃焼焼却する燃焼炉と、
前記真空加熱乾燥装置内部からの排気ガスを、燃焼炉に導入する第1の排気ガス導入ラインと、
前記燃焼炉の後流側に設けられ、前記燃焼炉からの排ガスを冷却し、前記排ガス中の水分を凝縮水として除去する冷却器と、
前記凝縮水を回収する凝縮水回収タンクと、
除湿した前記排ガス中の煤塵を除去する煤塵除去手段と、を具備することを特徴とするPCB汚染素子の処理装置。
A vacuum heating and drying apparatus for vacuum heating a PCB-containing element containing PCB;
A combustion furnace that communicates with the discharge port of the vacuum heating and drying apparatus, gradually supplies the heat-treated heat-treated product, and burns and incinerates;
A first exhaust gas introduction line for introducing exhaust gas from the vacuum heating and drying apparatus into a combustion furnace;
A cooler that is provided on the downstream side of the combustion furnace , cools the exhaust gas from the combustion furnace, and removes moisture in the exhaust gas as condensed water ;
A condensed water recovery tank for recovering the condensed water;
Processor of PCB pollution element characterized by comprising a dust removing means for removing dust in the exhaust gas dehumidified, the.
請求項1において、
前記燃焼炉の排ガスを再度燃焼炉に戻す排ガス戻しラインと、
前記排ガス中の残留芳香族化合物濃度を検知する芳香族化合物検知手段と、
前記芳香族化合物検知手段の計測の結果、排ガス中の芳香族化合物の濃度が所定値以上の場合、燃焼炉側に排ガスを導入するために排ガス流路を切替える制御を行う制御装置と、を具備することを特徴とするPCB汚染素子の処理装置。
In claim 1,
An exhaust gas return line for returning the exhaust gas of the combustion furnace to the combustion furnace again;
An aromatic compound detection means for detecting the concentration of residual aromatic compound in the exhaust gas;
A control device that performs control to switch the exhaust gas flow path in order to introduce the exhaust gas to the combustion furnace side when the concentration of the aromatic compound in the exhaust gas is equal to or higher than a predetermined value as a result of the measurement by the aromatic compound detection means; A device for treating a PCB contaminated element.
請求項2において、
前記燃焼炉の排ガスを前記真空加熱乾燥装置の周囲に戻す排ガス戻しラインと
記真空加熱乾燥装置の周囲を加熱した排ガスを、燃焼炉に導入する第2の排気ガス導入ラインと、を具備することを特徴とするPCB汚染素子の処理装置。
In claim 2,
An exhaust gas return line for returning the exhaust gas of the combustion furnace to the periphery of the vacuum heating and drying device ;
Processor of PCB contaminated elements of the exhaust gas which has heated the surroundings, characterized in that it comprises a second exhaust gas introduction line for introducing into the combustion furnace, the pre-Symbol vacuum heat drying apparatus.
請求項1乃至4のいずれか一つにおいて、
前記冷却器で凝縮した凝縮水中のPCB濃度を検知する第1のPCB検知手段と、
集塵機の後流側の排ガス中のPCB濃度を検知する第2のPCB検知手段と、を具備することを特徴とするPCB汚染素子の処理装置。
In any one of Claims 1 thru | or 4,
First PCB detecting means for detecting the PCB concentration in the condensed water condensed by the cooler;
And a second PCB detecting means for detecting the PCB concentration in the exhaust gas on the downstream side of the dust collector.
請求項1乃至5のいずれか一つにおいて、
前記燃焼炉が、ロータリーキルンと再燃焼室とを備えたロータリーキルン炉であることを特徴とするPCB汚染素子の処理装置。
In any one of Claims 1 thru | or 5,
The apparatus for treating a PCB contamination element, wherein the combustion furnace is a rotary kiln furnace having a rotary kiln and a recombustion chamber.
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