JP5887837B2 - UV fluorescent lamp - Google Patents

Description

  Embodiments described herein relate generally to an ultraviolet fluorescent lamp.

  Ultraviolet fluorescent lamps are used for ultraviolet treatment in manufacturing processes of semiconductors, liquid crystals, PDPs, ELs, and the like. For example, in a semiconductor application, it is used when replacing a wear holding member used in a process of dividing a wafer into a plurality of semiconductor chips. The constituent members of the wafer holding member are bonded with a pressure-sensitive adhesive whose adhesive strength is reduced by irradiation with ultraviolet rays, and this is irradiated with ultraviolet rays to peel off the pressure-sensitive adhesive body.

  The above-mentioned fluorescent lamp is required to perform ultraviolet treatment efficiently and at the same time extend the life of the ultraviolet fluorescent lamp.

JP-A-10-27768 JP 2003-109541 A

  The problem to be solved by the present invention is to provide an ultraviolet fluorescent lamp having a high adhesive releasability and a long lifetime in a pressure-sensitive adhesive peeling process in which adhesive strength is reduced by ultraviolet irradiation.

The ultraviolet fluorescent lamp of the present embodiment is an ultraviolet fluorescent lamp used in a pressure-sensitive adhesive peeling process in which adhesive strength is reduced by ultraviolet irradiation, and includes a discharge vessel, a discharge medium enclosed in the discharge vessel, and the discharge medium. An electrode for supplying electric power; and a phosphor layer applied to the inside of the discharge vessel, and includes a first phosphor YPO ₄ : Ce and a second phosphor SrB ₄ O ₇ : Eu. The weight ratio of the first phosphor YPO ₄ : Ce to the total amount of the first phosphor YPO ₄ : Ce and the second phosphor SrB ₄ O ₇ : Eu in the phosphor layer is 60 to 95%. It is.

It is sectional drawing for demonstrating 1st Embodiment of an ultraviolet fluorescent lamp. FIG. 2 is a spectral distribution diagram of two types of phosphors YPO ₄ : Ce and phosphors SrB ₄ O ₇ : Eu used in the ultraviolet fluorescent lamp of FIG. 1. Phosphor _YPO 4: Ce phosphor _SrB 4 _O 7: is a spectral distribution diagram of the ultraviolet fluorescent lamp mixed with Eu. Phosphor _YPO 4: Ce phosphor _SrB 4 _O 7: is a table for Eu per wavelength of the relative energy of the mixed ultraviolet fluorescent lamp and illustrating the intensity ratio. It is the schematic for demonstrating the peeling process of the adhesive which adhesive force falls by ultraviolet irradiation. It is a table | surface for demonstrating the peeling condition of the adhesive after ultraviolet irradiation, and the lifetime of an ultraviolet fluorescent lamp.

  Hereinafter, embodiments for carrying out the invention will be described.

(First embodiment)
The ultraviolet fluorescent lamp of 1st Embodiment is demonstrated with reference to drawings. FIG. 1 is a sectional view of an ultraviolet fluorescent lamp, FIG. 2 is a spectral distribution diagram of two types of phosphors used in the ultraviolet fluorescent lamp, and FIG. 3 is a spectral distribution diagram of an ultraviolet fluorescent lamp in which two types of phosphors are mixed.

  The configuration of the ultraviolet fluorescent lamp 100 will be described below. The ultraviolet fluorescent lamp 100 is, for example, a hot cathode fluorescent lamp shown in FIG. The discharge vessel 101 of the ultraviolet fluorescent lamp 100 is, for example, a glass tube made of soft glass such as soda glass, and both ends 101a and 101b are hermetically sealed with a stem or the like to form an internal space 102. As the discharge medium, for example, argon having an enclosure pressure of 1 Torr to 10 Torr and mercury having an enclosure amount of 1 mg to 10 mg are enclosed in the internal space 102. The dimensions of the glass tube of the discharge vessel 101 are, for example, an outer diameter of 14 mm to 34 mm, a wall thickness of 0.4 mm to 1.0 mm, and a length of about 135 mm to 2400 mm.

  Two lead wires 103a and 104a and 103b and 104b are hermetically sealed at both ends 101a and 101b of the discharge vessel 101, respectively. The lead wires 103a, 104a, 103b, and 104b are metal wires that are adjusted with the expansion coefficient of the glass tube used in the discharge vessel 101, and for example, jumet wires, iron / nickel alloy wires, or the like are used.

Electrodes 105a and 105b are electrically connected to leading ends of the introduction lines 103a and 104a and the introduction lines 103b and 104b on the inner space 102 side, respectively. The electrodes 105a and 105b are, for example, hot cathodes, and have a configuration in which tungsten having a wire diameter of 15 μm to 30 μm, a rhenium-tungsten alloy, or the like is processed into a double coil or triple coil shape and an emitter material is applied to the surface thereof. As the emitter material, for example, a mixture of BaO, SrO, and CaO having a low work function, and a material added with ZrO ₂ that suppresses evaporation of the emitter material are used. When an electric current is passed through the filaments of the electrodes 105a and 105b, the filament is heated to a temperature of 600 ° C. to 1100 ° C., and thermionic emission is emitted from the emitter coated on the surface, and the starting voltage and tube voltage of the ultraviolet fluorescent lamp 100 are increased. Can be reduced.

  At both ends of the discharge vessel 101, for example, caps 106a and 106b are connected and fixed via cement (not shown) or the like. Two power supply pins 107a and 108a and 107b and 108b are attached to the caps 106a and 106b, respectively, and these are electrically connected to the introduction lines 103a and 104a and the introduction lines 103b and 104b. Yes.

  On the inner wall excluding both ends of the discharge vessel 101, for example, a protective film 109 such as alumina or silica is formed in a thickness of 0.5 μm to 5 μm, and on the inner surface side, the phosphor layer 110 is formed in a thickness of 5 to 30 μm. Is formed.

The phosphor layer 110 includes a first phosphor YPO ₄ : Ce (cerium-activated yttrium phosphate) having a spectral distribution shown in FIG. 2A and a second phosphor having a spectral distribution shown in FIG. The phosphor SrB ₄ O ₇ : Eu (europium-activated strontium borate) was mixed and applied. In addition to the above-described phosphors, the phosphor layer 110 has a borate binder such as 0.3CaO.0.7BaO.1.6B ₂ O ₃ in order to improve the film strength of the phosphor layer 110. A material, a calcium-based binder such as Ca ₂ P ₂ O ₇ , or an alumina-based binder such as Al ₂ O ₃ is added alone or mixed. In addition, Al ₂ O ₃ for improving the discharge delay in the dark can also be added.

  When a sine wave voltage having a frequency effective value of 50 to 1000 V is applied between the electrodes 105 a and 105 b by a lighting circuit (not shown), for example, at a frequency of 20 kHz to 80 kHz, mercury and argon in the internal space 102 are discharged. Then, ultraviolet rays having wavelengths of 185 nm and 254 nm are emitted from mercury. When the ultraviolet rays from the mercury hit the phosphor layer 110, the phosphor is excited and the ultraviolet rays are emitted from the phosphor layer 110.

FIG. 3 shows a spectral distribution diagram emitted from the ultraviolet fluorescent lamp according to the weight ratio of the first phosphor YPO ₄ : Ce and the second phosphor SrB ₄ O ₇ : Eu contained in the phosphor layer 110. Show. FIG. 3A shows a case where the weight ratio of the first phosphor YPO ₄ : Ce to the sum of the first phosphor YPO ₄ : Ce and the second phosphor SrB ₄ O ₇ : Eu is 90%. 3B shows the case of 80%, FIG. 3C shows the case of 60%, FIG. 3D shows the case of 40%, and FIG. 3E shows the case of 20%. . The weight ratio of the phosphor contained in the phosphor layer 110 is qualitatively determined by destroying the ultraviolet fluorescent lamp 100 and taking out the powder of the phosphor layer 110, for example, using an electronic probe microanalyzer (JXA-8200 manufactured by JEOL Ltd.). Each phosphor component and the content ratio can be measured by an analysis method or the like, and the weight ratio can be converted from this data.

By mixing the first phosphor YPO ₄ : Ce and the second phosphor SrB ₄ O ₇ : Eu, ultraviolet light emitted from these phosphors is synthesized, so these phosphors are used alone. Thus, it is possible to obtain a wide range of ultraviolet radiation in the wavelength range of 320 nm to 400 nm.

The relative energies of the first phosphor YPO ₄ : Ce emission peak wavelengths 337 nm and 355 nm and the second phosphor SrB ₄ O ₇ : Eu emission peak wavelength 369 nm are A, B, and C, respectively. As shown in FIG. The ratio A / C (%) of the relative energy A at a wavelength of 337 nm to the relative energy C at a wavelength of 369 nm is also shown. The relative value of the relative energy of ultraviolet rays is measured with, for example, a spectroscope (MSR-7000 manufactured by Opt Research Co., Ltd.), and the obtained intensity is corrected between the values determined by relative energy. Can be obtained.

By increasing the weight ratio of the first phosphor YPO ₄ : Ce, the ratio of short-wavelength ultraviolet light to long-wavelength ultraviolet light can be increased.

  For example, as shown in FIG. 5A, the ultraviolet fluorescent lamp 100 is interposed between the objects to be bonded 200 and 300, and is bonded to the pressure-sensitive adhesive body 400 bonded to the ultraviolet light as shown in FIG. Irradiation 500 is performed, and as shown in FIG. 5 (c), the adhesive force of the pressure-sensitive adhesive body 400 is reduced to be used in a process of separating the objects to be bonded 200 and 300.

  The pressure-sensitive adhesive 400 is, for example, a double-sided tape in which a first pressure-sensitive adhesive 402a and a second pressure-sensitive adhesive 402b are coated on both surfaces of a pressure-sensitive adhesive support 401, and at least one pressure-sensitive adhesive loses adhesive strength when irradiated with ultraviolet light. The agent is used.

  The pressure-sensitive adhesive support 401 is a resin sheet having a high ultraviolet transmittance, such as polyvinyl chloride, polyester, polybutene, polybutadiene, and polyethylene. The thickness of the adhesive support 401 is, for example, 5 μm to 100 μm. Moreover, the structure which abbreviate | omits the adhesive support body 401, and apply | coat and adhere the adhesive which an adhesive force falls directly by ultraviolet irradiation to the adhesion target object 200 or 300 may be sufficient.

  The first pressure-sensitive adhesive 402a is, for example, an ultraviolet curable resin that loses adhesive force by being cured by ultraviolet irradiation. The ultraviolet curable resin is, for example, a silicone resin, an acrylic resin, a urethane resin, an epoxy resin, or the like, and has a configuration in which a tackifier resin, an ultraviolet crosslinkable oligomer and / or monomer, and a photopolymerization initiator are added. is there. The thickness of the 1st adhesive 402a is 5-100 micrometers, for example. The second pressure-sensitive adhesive 402b may have the same configuration as this, or may be a pressure-sensitive adhesive that is not UV-cured.

  The tackifying resin is a resin for improving the tackiness, and for example, a temper resin or a rosin resin is used.

  The ultraviolet-crosslinkable oligomer and / or monomer is for curing the entire pressure-sensitive adhesive by a polymerization initiator that has been irradiated with ultraviolet rays, and reducing its adhesive strength. As the UV-crosslinkable oligomer and / or monomer, for example, an acrylate compound, a urethane acrylate oligomer, or the like is used. Polymerization initiators include, for example, benzoin, benzoimethyl ether, benzoiethyl ether, benzoiisopropyl ether, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, β-chloranthra Use quinone or the like.

  FIG. 6 shows the results of evaluating the peeling state of the first pressure-sensitive adhesive 402a by irradiating the pressure-sensitive adhesive body 400 with ultraviolet rays from the ultraviolet fluorescent lamp 100 according to the weight ratio of the fluorescent bodies. The mark ◎ in the figure shows the state where the first pressure-sensitive adhesive 402a and the object to be bonded 300 are exfoliated cleanly, and the mark ○ indicates the state where a small amount of the first pressure-sensitive adhesive 402a remains on the object to be bonded 300 but peels off. These are in a state where there is no practical problem. On the other hand, the mark X is a state in which a large amount of the first pressure-sensitive adhesive 402a remains on the bonding target object 300 or a state in which the first pressure-sensitive adhesive 402a does not peel from the bonding target object 300, and is not practically used due to insufficient peeling. Indicates an incapable state.

The weight ratio of the first phosphor YPO ₄ : Ce to the sum of the first phosphor YPO ₄ : Ce and the second phosphor SrB ₄ O ₇ : Eu in the phosphor layer 110 is in the range of 60% to 95%. In this case, a release characteristic having no practical problem can be obtained, and a good release characteristic can be obtained when the weight ratio is in the range of 80% to 90%.

  In addition, according to the relationship with FIG. 4, when the ratio A / C of the relative energy A at a wavelength of 337 nm to the relative energy C at a wavelength of 369 nm is in the range of 60% to 225%, a practically no problem is obtained. When the ratio A / C is in the range of 120% to 180%, good peeling characteristics can be obtained.

  Of the radiation from the ultraviolet fluorescent lamp 100, ultraviolet light on the short wavelength side is strong in light energy, but is easily absorbed by the first adhesive 402a, and thus contributes to the surface curing of the first adhesive 402a on the light irradiation side. To do. On the other hand, although the ultraviolet light on the long wavelength side of the ultraviolet radiation has a light energy weaker than that of the short wavelength ultraviolet light, it penetrates into the inside of the first adhesive 402a. Contributes to curing. By setting the above-mentioned ratio of the short wavelength and the long wavelength to the weight ratio of the phosphor that can be obtained, both the surface and inner UV curing of the first pressure-sensitive adhesive 402a can be promoted, and the peeling characteristics are improved. be able to.

FIG. 6 shows the lifetime when the initial ultraviolet illuminance value decreases to a value of 70%. When the phosphor BaSi ₂ O ₃ : Pb of the comparative example is about 1000 hours, the first phosphor YPO ₄ : Ce and the second phosphor SrB ₄ O ₇ : Eu in the first embodiment are mixed. In the configuration, it becomes as long as about 1700 hours. Phosphor BaSi ₂ O ₃ : Pb is a material in which Pb easily reacts with mercury and amalgam, so that mercury adheres to the phosphor during lighting and inhibits ultraviolet absorption from mercury and emission from the phosphor. . On the other hand, the phosphor YPO ₄ : Ce and SrB ₄ O ₇ : Eu can reduce the formation of amalgam with mercury, and thus can extend the lifetime.

In addition, the first phosphor YPO ₄ : Ce and the second phosphor SrB ₄ O ₇ : Eu do not contain Pb or the like as an environmental load substance unlike the phosphor BaSi ₂ O ₃ : Pb of the comparative example. Due to the configuration, for example, there is no possibility of polluting the environment when the ultraviolet fluorescent lamp is discarded.

  As described above, the ultraviolet fluorescent lamp according to the first embodiment has a property that the pressure-sensitive adhesive is highly peelable and has a long lifetime in the pressure-sensitive adhesive peeling process in which the adhesive strength is reduced by ultraviolet irradiation.

  The present invention is not limited to the above embodiment, and various modifications are possible.

  In addition to the hot cathode fluorescent lamp, the ultraviolet fluorescent lamp 100 can also take the form of a cold cathode fluorescent lamp, an external electrode fluorescent lamp, an electrodeless fluorescent lamp, or the like. In addition to the straight tube shape, the ultraviolet fluorescent lamp has any shape such as U-shape, C-shape, U-shape, L-shape, W-shape, flat plate shape, etc. by heat-processing the lamp. Can be taken. The discharge medium can be constituted by neon, argon, krypton, or xenon alone or in a mixture of at least one kind instead of argon added together with mercury. Moreover, the structure which mixes xenon and other rare gas which irradiate an ultraviolet-ray, without enclosing mercury can also be taken.

In addition to the first phosphor YPO ₄ : Ce and the second phosphor SrB ₄ O ₇ : Eu, another phosphor may be added to the phosphor layer 110. In this case, the weight ratio of the first phosphor YPO ₄ : Ce and the second phosphor SrB ₄ O ₇ : Eu, and the ratio A / C of the relative energy A of wavelength 337 nm to the relative energy C of wavelength 369 nm The relationship shall be satisfied.

  Although an example of a semiconductor application is shown, any process may be used as long as it peels off an object to which a pressure-sensitive adhesive that reduces adhesive strength when irradiated with ultraviolet rays is applied. Is.

  The pressure-sensitive adhesive whose adhesive strength is reduced by irradiation with ultraviolet rays has been described as an ultraviolet curable resin, but other ultraviolet foaming resins that are foamed by irradiation with ultraviolet rays to reduce the adhesive strength can be used.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

100 UV fluorescent lamp 101 Discharge vessel 102 Internal space 103a, 103b Lead wires 104a, 104b Lead wires 105a, 105b Electrodes 106a, 106b Base 107a, 107b Supply pins 108a, 108b Supply pin 109 Protective film 110 Phosphor layer

Claims (2)

It is an ultraviolet fluorescent lamp used in the peeling process of the pressure-sensitive adhesive whose adhesive strength is reduced by ultraviolet irradiation,
A first phosphor YPO ₄ , comprising: a discharge vessel; a discharge medium enclosed in the discharge vessel; an electrode for supplying power to the discharge medium; and a phosphor layer applied to the inside of the discharge vessel. : Ce and second phosphor SrB ₄ O ₇ : Eu in the phosphor layer with respect to the total amount of the first phosphor YPO ₄ : Ce and the second phosphor SrB ₄ O ₇ : Eu, An ultraviolet fluorescent lamp in which a weight ratio of the first phosphor YPO ₄ : Ce is 60 to 95%. A first phosphor YPO ₄ , comprising: a discharge vessel; a discharge medium enclosed in the discharge vessel; an electrode for supplying power to the discharge medium; and a phosphor layer applied to the inside of the discharge vessel. : Ce and second phosphor SrB ₄ O ₇ : Eu in the phosphor layer with respect to the total amount of the first phosphor YPO ₄ : Ce and the second phosphor SrB ₄ O ₇ : Eu, The ratio A / C of the relative energy A of the radiation at a wavelength of 337 nm to the relative energy C of the radiation at a wavelength of 369 nm from the phosphor layer , wherein the weight ratio of the first phosphor YPO ₄ : Ce is 60 to 95%. Is an ultraviolet fluorescent lamp having 60 to 225%.

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