JP5879754B2 - Circuit board manufacturing method - Google Patents

Description

The present invention relates to the production how the circuit board.

Conventionally, when a conductive pattern such as a circuit or wiring is formed on a substrate, a metal thin film is formed on the substrate and then patterned by photoetching, etc., and unnecessary metal thin film is removed to remove the conductive film. In many cases, a sex pattern is formed.
Since such a manufacturing method requires many steps, in recent years, a conductive pattern is also formed by bonding a metal foil sheet on a substrate and punching the metal foil with a punching blade.
For example, in Patent Document 1, in order to form an antenna pattern of an IC tag, a metal foil sheet having a metal foil and an adhesive layer and a base material are overlapped and heated using a punching blade. A method is described in which punching and temporary fixing are performed, and unnecessary portions are removed with a suction machine or the like to form a conductive pattern serving as an antenna.

JP 2007-76288 A

However, the method for forming a conductive pattern by punching out the metal foil sheet as described above and the substrate having the conductive pattern manufactured thereby have the following problems.
In the drawing of Patent Document 1, it is described as if the adhesive layer has been completely removed, but after the metal foil sheet is punched out, the unnecessary portion of the metal foil and the adhesive layer on the back side thereof are sucked. In order to form such a shape by removing with a machine, it is necessary to cut the adhesive layer together with the metal foil sheet in the punching process. For this reason, it is necessary to cut the punching blade to the lower substrate of the adhesive layer. In this case, sharp surface scratches by the punching blade remain along the conductive pattern on the surface of the substrate, so that when the external force is applied, the substrate is easily damaged and the durability is deteriorated. When the substrate is a thin resin sheet, the durability is particularly deteriorated.
Therefore, in practice, it is necessary to stop the punching blade within the adhesive layer so that the substrate is not damaged by the punching blade, and it is difficult to completely cut the adhesive layer. For this reason, since the adhesive layer between the metal foils to be sucked and the metal foil necessary for forming the conductive pattern may be removed together, the adhesive layer between the metal foils is completely removed by suction. It was also difficult to remove.
If an adhesive layer remains between metal foils adjacent to each other, a weak current flows between the metal foils through the adhesive layer on the substrate, so that the deterioration of the adhesive layer progresses over time, causing so-called migration. Therefore, there is a problem that durability and reliability are lowered.
For this reason, for example, in a solar cell module that is required to be used continuously for a long period of about 10 to 50 years, it cannot be used for applications such as a wiring board that electrically connects solar cells. There's a problem.

The present invention has been made in view of the above problems, and even when a metal foil is cut to form a plurality of metal electrodes, the circuit can be easily manufactured and has excellent durability and reliability. and to provide a method for manufacturing a board.

In order to solve the above problem, in the invention according to claim 1, by cutting the metal foil of the metal foil sheet holding the metal foil on the holding sheet, by removing a part of the metal foil, A metal electrode forming step for forming a plurality of metal electrodes spaced from each other on the holding sheet, and an adhesive for forming an adhesive layer on the entire surface of the plurality of metal electrodes formed in the metal electrode forming step A layer forming step, a base material adhering step for adhering the adhesive layer to the base material and adhering to the base material, and peeling the holding sheet from the surfaces of the plurality of metal electrodes to form the base material on the base material a metal electrode transfer step of transferring the adhesive layer and the plurality of metal electrodes, and a method of Ru with a.

According to a second aspect of the present invention, in the method for manufacturing a circuit board according to the first aspect, the metal foil sheet holds the metal foil via an adhesive layer provided on a surface of a holding sheet, and the metal In the electrode forming step, the metal foil is cut by punching with a punching blade, and a gap is formed between the part of the metal foil and the adhesive layer on the side of the punching blade due to deformation accompanying the pressing of the punching blade. After forming the peeling part which has, it is set as the method of removing the said one part metal foil.

According to a third aspect of the present invention, in the method for manufacturing a circuit board according to the second aspect, the dimension of the protruding height of the punching blade is larger than the thickness dimension of the metal foil, and The method is smaller than the sum of the thickness dimension and the thickness dimension of the adhesive layer .

According to the method for manufacturing a circuit board of the present invention, it does not remain adhesive layer continuous between adjacent metal electrodes to form respective metal electrodes on the plurality of adhesive layer formed at a clearance from one another, Even when the metal foil is cut to form a plurality of metal electrodes, the metal foil can be easily manufactured, and the durability and reliability are excellent .

It is typical sectional drawing which shows the structure of the circuit board and solar cell module of embodiment of this invention. It is a flowchart which shows the process flow of the manufacturing method of the circuit board of embodiment of this invention. It is typical sectional drawing explaining the metal foil sheet | seat formation process and the metal electrode formation process in the manufacturing method of the circuit board of embodiment of this invention. It is typical sectional drawing explaining the adhesive bond layer formation process in the manufacturing method of the circuit board of embodiment of this invention. It is typical sectional drawing explaining the base-material adhesion | attachment process and the metal electrode transfer process in the manufacturing method of the circuit board of embodiment of this invention. It is typical sectional drawing explaining an example of the metal electrode formation process in the manufacturing method of the circuit board of embodiment of this invention. It is typical sectional drawing explaining an example of the metal electrode formation process following FIG. 6, and typical sectional drawing which shows the structure of the circuit board manufactured by this. It is typical sectional drawing which shows the example of an apparatus structure for implementing an example of the metal electrode formation process in the manufacturing method of the circuit board of embodiment of this invention. It is typical sectional drawing which shows the structure of the modification of the circuit board of embodiment of this invention.

Below, the circuit board of the embodiment of the present invention, its manufacturing method, and a solar cell module are explained with reference to an accompanying drawing.
FIG. 1 is a schematic cross-sectional view showing configurations of a circuit board and a solar cell module according to an embodiment of the present invention.

The circuit board 2 of the present embodiment is a plate-like or sheet-like member having a conductive pattern formed on the surface, and includes a base material 3, an adhesive layer 4, and a metal electrode 5, as shown in FIG. .
Examples of the conductive pattern include a land part for soldering an electric / electronic component, a wiring pattern for conducting between the land parts, for example, a circuit pattern or an electrode pattern used as an antenna or a sensor, or two or more of these. And the like.
The electrical product using the circuit board 2 is not particularly limited, but is particularly suitable for applications that require high durability and high reliability in long-term use over time. Below, the example in the case of being used for the solar cell module 50 is demonstrated as an example of such an electric product as which high durability and high reliability are calculated | required.

The substrate 3 is a plate-like or sheet-like member having electrical insulation.
In this embodiment, as an example, a resin sheet made of polyethylene terephthalate having a thickness of 0.05 mm to 0.2 mm is employed, and it has good flexibility.

The adhesive layer 4 is for fixing the metal electrode 5 on the base material 3, and a plurality of adhesive layers 4 are formed on the base material surface 3 a of the base material 3 with a gap therebetween.
As the material of the adhesive layer 4, an appropriate material can be adopted according to the material of the metal electrode 5, the operating temperature, and the required adhesive strength. For example, an epoxy adhesive, a urethane adhesive, an acrylic adhesive, or the like can be employed.
In this embodiment, as an example, a urethane adhesive is employed.

The metal electrodes 5 are made of a metal thin film that forms a conductive pattern, and are formed on the adhesive layer 4 one by one. Therefore, a plurality of metal electrodes 5 are provided according to the number of adhesive layers 4.
Below, in each metal electrode 5, the surface closely adhered to the adhesive layer 4 is referred to as a first surface 5a, and the surface opposite to the first surface 5a is referred to as a second surface 5b.
In the present embodiment, the shape of each metal electrode 5 in plan view is the same as that of the adhesive layer 4. For this reason, as shown in FIG. 1, in the cross section of the thickness direction, it laminate | stacks with the adhesive layer 4 and the same width.
As the material of the metal electrode 5, an appropriate metal material having good electrical conductivity can be adopted. For example, examples of the metal electrode 5 include copper, aluminum, nickel, brass, gold, silver, lead and the like.

An appropriate thickness can be adopted as the thickness of the metal electrode 5 as long as necessary electrical conductivity is obtained. However, when the metal electrode 5 is formed by punching from a metal foil using, for example, a die having a punching blade, the metal electrode 5 has a thickness of 5 μm or more and 1 mm in consideration of the die-cutting property of the die. The following is desirable. If it is less than 5 μm, handling of the metal foil is difficult, and if it exceeds 1 mm, it is difficult to perform die cutting. Furthermore, considering the durability of the mold, the thickness of the metal foil is desirably 200 μm or less.
In this embodiment, what cut | disconnected the 35-micrometer-thick copper foil is employ | adopted as an example.

Next, a schematic configuration of the solar cell module 50 of the present embodiment including the circuit board 2 will be described.
The solar cell module 50 is a so-called back contact type solar cell module in which connection terminals (not shown) of electrodes of the built-in solar cells 7 are provided on the side opposite to the light receiving surface. Examples of the back contact method include a method using a through electrode and a method in which no light receiving surface electrode is provided, and any method may be used.
The schematic configuration of the solar cell module 50 includes a back sheet 1, a circuit board 2, solar cells 7, and a glass panel 9. In the following, as shown in FIG. 1, the back sheet 1 is arranged on the lower side in the drawing, and the glass panel 9 is arranged on the upper side in the drawing. It will be described as being done.

The backsheet 1 is a support member that supports the base material 3 of the circuit board 2 on the surface opposite to the side on which the adhesive layer 4 is provided. In this embodiment, the backsheet 1 is the outermost surface on the lower surface side of the solar cell module 50. It constitutes the outer surface.
Thereby, the circuit board 2 is fixed on the back sheet 1 with the metal electrode 5 facing the upper side opposite to the back sheet 1.
A plurality of solar cells 7 are arranged above some of the plurality of metal electrodes 5 on the circuit board 2, and connection terminals (not shown) of electrodes facing downward are connected via the solder joints 6. It is electrically connected to some of the plurality of metal electrodes 5 of the substrate 2.
The metal electrode 5 of the circuit board 2 electrically connects the solar cells 7 in the solar cell module 50 to each other, and outputs the electric power of each solar cell 7 to the solar cell module 50 (not shown). The pattern is formed so that it can be taken out from the terminal.
As the connection pattern of each solar battery cell 7, a connection pattern in which series connection and parallel connection are appropriately combined can be adopted as necessary.
The glass panel 9 is a member that is disposed above the solar battery cell 7 and transmits external light toward the solar battery cell 7, and constitutes the outermost surface on the upper surface side of the solar battery module 50.
Between the base material surface 3a of the base material 3 and the glass panel 9, in order to fix each photovoltaic cell 7 and to insulate between conductors, the light-transmitting sealing material 8 is filled. Thereby, the solar cell module 50 is configured in a plate shape sandwiched between the back sheet 1 and the glass panel 9.
As a material of the sealing material 8, for example, ethylene / vinyl acetate copolymer resin (EVA resin) can be employed.
FIG. 1 shows a part of a cross section, and the solar cell 7 has a configuration in which the illustrated pattern is repeated in the illustrated horizontal direction and the depth direction in the drawing.
Further, the outer shape of the solar cell module 50 in a plan view has a rectangular shape, although not particularly illustrated.

Next, a method for manufacturing the circuit board 2 having such a configuration will be described.
FIG. 2 is a flowchart showing a process flow of the circuit board manufacturing method according to the embodiment of the present invention. 3A and 3B are schematic cross-sectional views illustrating a metal foil sheet forming step and a metal electrode forming step in the method for manufacturing a circuit board according to the embodiment of the present invention. 4A and 4B are schematic cross-sectional views illustrating an adhesive layer forming step in the circuit board manufacturing method according to the embodiment of the present invention. FIGS. 5A and 5B are schematic cross-sectional views illustrating a base material bonding step and a metal electrode transfer step in the method for manufacturing a circuit board according to the embodiment of the present invention.

  As shown in FIG. 2, the manufacturing method of the circuit board 2 of the present embodiment includes a metal foil sheet forming step S1, a metal electrode forming step S2, an adhesive layer forming step S3, a base material bonding step S4, and a metal electrode transfer step. This is a method of performing S5 in this order.

First, metal foil sheet formation process S1 is performed. This step is a step of forming a metal foil sheet holding the metal foil on the holding sheet.
In this embodiment, as shown to Fig.3 (a), the sheet member by which the holding sheet 17, the adhesion layer 16, and the metal foil layer 15 (metal foil) were laminated | stacked in this order as the metal foil sheet 14 is formed.
In addition, the arrangement | positioning attitude | position of the metal foil sheet | seat 14 can be arrange | positioned in the suitable attitude | position which can implement each process mentioned later without trouble. However, for the sake of simplicity, the following description will be made assuming that the holding sheet 17 is on the lower side and the metal foil layer 15 is on the upper side, as shown in FIG.

The metal foil layer 15 is formed of a metal foil of the same thickness and the same material as the metal electrode 5 in order to form the metal electrode 5 by cutting, and the range in which the metal electrode 5 is formed on the base material 3 of the circuit board 2 It has a size that can cover.
In this embodiment, the base material 3 is cut in the width, made of a copper foil having a thickness of t _{1 =} 35 (μm).

The adhesive layer 16 is formed to have a uniform thickness on the holding sheet 17, is in close contact with one surface of the metal foil layer 15, and fixes the metal foil layer 15 on the holding sheet 17. Hereinafter, one surface of the metal foil layer 15 in close contact with the adhesive layer 16 is referred to as a second surface 15b, and the other surface is referred to as a first surface 15a.
The adhesive layer 16 is made of a material that adheres to the metal foil layer 15 with a force weaker than the adhesive force between the adhesive layer 4 and the metal electrode 5 described later.
The adhesion between the adhesive layer 16 and the metal foil layer 15 can also be adjusted by subjecting the metal foil layer 15 to a surface treatment.

The holding sheet 17 maintains the relative positional relationship of the plurality of metal electrodes 5 when being cut until the metal foil layer 15 is cut to form the shape of the metal electrode 5 and transferred to the substrate 3. It is the sheet | seat member to hold | maintain.
An appropriate resin sheet can be adopted as the holding sheet 17.

When the metal foil layer 15 is punched and cut, the total thickness of the adhesive layer 16 and the holding sheet 17 is half-cut to cut the metal foil layer 15 without cutting the holding sheet 17 with a punching blade. Use a thickness that allows the construction method. In this case, the total thickness of the adhesive layer 16 and the holding sheet 17 is desirably 50 μm or more. If the total thickness is less than 50 μm, it is difficult to stop the cutting edge of the punching blade at the intermediate portion in the thickness direction of the holding sheet 17.
In the present embodiment, as an example, the adhesive layer 16 employs an acrylic urethane-based adhesive material and has a thickness t ₂ = 7 (μm). The holding sheet 17 employs, for example, a polyethylene terephthalate resin sheet member having a thickness t ₃ = 50 (μm).

The metal foil sheet 14 can be manufactured by a known appropriate process.
For example, in the present embodiment, the metal foil layer 15 is bonded to a pressure-sensitive adhesive sheet in which the pressure-sensitive adhesive layer 16 is previously applied onto the holding sheet 17 wound in a roll shape. As such a manufacturing process, for example, a roll-to-roll laminating process can be used.
Above, metal foil sheet formation process S1 is complete | finished.

However, when a three-layer sheet member product suitable as the metal foil sheet 14 is available, this step may be a step of forming the metal foil sheet 14 by shaping the product into a necessary size. it can.
Further, when the size of the sheet member product matches the size of the desired metal foil sheet 14, it is not necessary to shape the sheet member, so the metal foil sheet forming step S <b> 1 is omitted, and the sheet member product itself is replaced with the metal foil sheet 14. Can be used as

Next, a metal electrode forming step S2 is performed. This step is a step of forming a plurality of metal electrodes 5 spaced apart from each other on the holding sheet 17 by cutting the metal foil layer 15 of the metal foil sheet 14 and removing some of the metal foil. .
In this step, for example, as shown in FIG. 3 (b), the metal foil layer 15 is cut in the thickness direction in accordance with the position where the outer peripheral surface 5d of the metal electrode 5 of the circuit board 2 is formed. The removal part metal foil 18 corresponding to between the adjacent metal electrodes 5 is peeled off from the adhesive layer 16 and removed. As a result, the plurality of metal electrodes 5 having the outer peripheral surfaces 5d formed on the sides by cutting remain on the adhesive layer 16 in close contact with the adhesive layer 16.
At this time, in this embodiment, since the adhesive force between the adhesive layer 16 and the metal foil layer 15 is weak, the adhesive layer 16 after the removal portion metal foil 18 peels is hardly deformed by the force received during peeling. For this reason, since the height change of the upper surface of the adhesion layer 16 hardly occurs, a step substantially equal to the thickness of the metal electrode 5 occurs between each first surface 5a after peeling and the upper surface of the adhesion layer 16. As a result, a gap in the illustrated horizontal direction is formed between the outer peripheral surfaces 5d of the adjacent metal electrodes 5.
However, the upper surface of the pressure-sensitive adhesive layer 16 may be uneven as long as it does not protrude beyond the first surface 5a and does not hinder the adhesive layer forming step S3 described later.

The cutting method of the metal foil layer 15 that can be used in this step is not particularly limited as long as the metal foil layer 15 can be reliably cut in the thickness direction. For example, a cutting method by a press using a punching die having a punching blade, a cutting method in which a cutting tool is moved on the metal foil layer 15, a cutting method by laser light irradiation, and the like can be given. Of these, details of examples of the cutting method using a press will be described later.
3B is a schematic diagram, and the outer peripheral surface 5d is drawn so as to be formed in a direction orthogonal to the first surface 15a. However, depending on the cutting method, the outer peripheral surface 5d is appropriately inclined. May be. Moreover, although the adhesion layer 16 is drawn so that there is no deformation, as long as the holding sheet 17 is not broken and the metal electrode 5 excluding the removal portion metal foil 18 is bonded to the adhesion layer 16. The adhesive layer 16 may be deformed or damaged.

Moreover, in this process, the metal foil layer 15 is cut | disconnected reliably along the shape of the metal electrode 5, and the adhesive force of the adhesion layer 16 is compared with the adhesive force with respect to the metal electrode 5 of the adhesive bond layer 4 mentioned later. weak. For this reason, the peeling method of the removal part metal foil 18 can employ | adopt an appropriate peeling method.
For example, mechanical peeling using a peeling jig or the like, peeling by suction with a suction machine, peeling by blowing compressed air, or the like can be employed.

Next, adhesive layer formation process S3 is performed. This step is a step of forming the adhesive layer 4 on the first surface 5 a that is the surface of the plurality of metal electrodes 5.
First, the adhesive agent which forms the adhesive bond layer 4 is apply | coated to the surface of the plate-shaped or roll-shaped adhesive bond layer holding body 19 (refer Fig.4 (a)).
Depending on the material of the adhesive forming the adhesive layer 4, the surface of the adhesive layer holding body 19 has an adhesive force with the adhesive layer 4 that is smaller than the adhesive force between the metal electrode 5 and the adhesive layer 16. Apply surface treatment.
Next, as shown in FIG. 4A, the adhesive layer holding body 19 is moved toward the first surface 5a to bring the adhesive layer 4 and the first surface 5a into close contact with each other.
At this time, since there is a horizontal gap between the metal electrodes 5, the adjacent metal electrodes 5 are surrounded by the upper surface of the adhesive layer 16, the outer peripheral surface 5 d facing each other, and the surface of the adhesive layer 4. A gap S is formed.

Next, as shown in FIG. 4B, the adhesive layer holder 19 is relatively moved in a direction away from the metal electrode 5. As a result, the adhesive layer 4 is more closely attached to the first surface 5 a than the adhesive layer holding body 19 on the first surface 5 a, so that the adhesive layer 4 is peeled from the adhesive layer holding body 19. To do. On the other hand, the adhesive layer 4 between the metal electrodes 5 adjacent to each other is in close contact with only the adhesive layer holding body 19 because there is a gap S. Therefore, the untransferred adhesive layer 4A moves while being in close contact with the adhesive layer holding body 19, and is separated from the portion of the adhesive layer 4 that is in close contact with the first surface 5a.
As a result, the adhesive layer 4 having the same shape as the first surface 5 a remains on the first surface 5 a of each metal electrode 5. Thereby, in this embodiment, the same number of adhesive layers 4 as the cut shape of each metal electrode 5 is formed with the metal electrode 5.
The laminate formed by the holding sheet 17, the pressure-sensitive adhesive layer 16, each metal electrode 5, and each adhesive layer 4 formed in this way is hereinafter referred to as an intermediate laminate M.
The adhesive layer forming step S3 is thus completed.

Next, base material adhesion process S4 is performed. This step is a step of bringing the adhesive layer 4 into close contact with the substrate 3 and bonding it to the substrate 3.
For example, as shown in FIG. 5 (a), the intermediate laminate M and the base material 3 are opposed to each other with the adhesive layer 4 interposed therebetween, and the intermediate laminate M is moved relative to the base material 3 so as to adhere. It adheres on the base material 3 from the agent layer 4 side. And it hold | maintains until sufficient adhesive force expresses between the adhesive bond layer 4 and the base material 3. FIG.
Thereby, each adhesive layer 4 of the intermediate laminate M is bonded to the base material 3.
At this time, since a gap is formed between adjacent metal electrodes 5 of the intermediate laminate M, the adhesive layer 16 between the metal electrodes 5 is separated from the base material 3.
Above, base material adhesion process S4 is complete | finished.

Next, a metal electrode transfer step S5 is performed. This step is a step of transferring each adhesive layer 4 and each metal electrode 5 to the substrate 3 by peeling the holding sheet 17 from each metal electrode 5.
As shown in FIG. 5B, when the holding sheet 17 is relatively moved in the direction away from the base material 3, the second surface 5 b and the adhesive layer are compared with the adhesive force between the first surface 5 a and the metal electrode 5. Since the adhesive force with 16 is weak, the adhesive layer 16 is separated from the second surface 5 b, and the holding sheet 17 is peeled off together with the adhesive layer 16.
Thereby, the laminated part which consists of the metal electrode 5 and the adhesive bond layer 4 among the intermediate | middle laminated bodies M is transcribe | transferred on the base material 3. FIG.
Thus, the metal electrode transfer step S5 is completed.
In this way, the circuit board 2 is manufactured.

Here, the example of metal electrode formation process S2 at the time of using the cutting method by press is demonstrated in detail.
6A and 6B are schematic cross-sectional views illustrating an example of a metal electrode forming process in the method for manufacturing a circuit board according to the embodiment of the present invention. FIGS. 7A and 7B are schematic cross-sectional views for explaining an example of the metal electrode formation step subsequent to FIG. 6B. FIG.7 (c) is typical sectional drawing which shows the structure of the circuit board manufactured through this metal electrode formation process. FIG. 8 is a schematic cross-sectional view showing an apparatus configuration example for carrying out an example of the metal electrode forming step in the circuit board manufacturing method of the embodiment of the present invention.

First, the structure of the punching die 30 used in this step will be described.
As shown in FIG. 6A, the punching die 30 is provided with a plurality of punching blades 30b and 30c on the die surface 30a.
The punching blade 30 b is provided in a shape along the outer shape of each metal electrode 5. For example, in FIG. 6A, punching blades 30b ₂ , 30b ₁ , 30b ₁ , 30b ₃ are provided as the punching blades 30b from the left side to the right side in the figure. Here, the punching blades 30b ₁ and 30b ₁ punch the outer peripheral shape of one metal electrode 5B (see FIG. 6B) having a width w ₁ . The punching blades 30b ₂ and 30b ₃ punch the outer peripheral shapes of the metal electrodes 5C and 5D (see FIG. 6B) adjacent to the metal electrode 5B, respectively.
The punching blade 30c is provided to subdivide and remove the metal foil layer 15 between the metal electrodes 5. For example, in FIG. 6 (a), the the punching blade 30c ₁ punching the metal electrodes 5C, the metal foil layer 15 having a width _{w 2} between 5B 2 equal portions two removal portions metallic foil 5A, the metal electrodes 5B, 5D a punching blade 30c ₂ of the metal foil layer 15 having a width w ₃ between 2 aliquoted and punching the two removal portions metallic foil 5A is provided.
The installation interval of the punching blades 30c can be appropriately set according to the size of the gap between the metal electrodes 5.

The punching blades 30b and 30c extend in parallel with the mold surface 30a, and a cross section formed by a plane orthogonal to the longitudinal direction is formed in an isosceles triangle shape that narrows in the protruding direction, and a cutting edge C is formed at the tip in the protruding direction. . The angle α of the cutting edge C is desirably formed at an acute angle. As the angle α is reduced, the burrs formed on the metal foil layer 15 at the time of cutting are reduced, but the durability of the punching die 30 is reduced. In general, the angle α is preferably about 40 ° to 60 °.
The height h of the punching blade 30b, from the mold surface 30a of 30c to the tip of the cutting edge C is greater than the thickness _{t 1} of the metal foil layer 15, the thickness even when the first surface 5a and the mold surface 30a is in close contact _{t 2} The height of the adhesive layer 16 is not penetrated. That is, t ₁ <h <t ₁ + t ₂ .
Furthermore, when the metal foil layer 15 is punched by the punching blades 30b and 30c, the height h is from a minute gap at which the adhesiveness is lost between the metal foil layer 15 and the adhesive layer 16 on the side of each cutting edge C. The dimension which can form the peeling part which becomes is set.
The range in which the peeling portion is formed includes specifications such as the material (hardness) of the holding sheet 17 and the adhesive strength of the adhesive layer 16, specifications of the material and thickness of the metal foil layer 15, and the materials and shapes of the punching blades 30b and 30c. If the specifications such as the above and the depth that the tip of the cutting edge C reaches at the time of punching are determined, it is uniquely determined. For this reason, the height h for forming an appropriate size of the peeled portion is determined in advance through experiments and the like.
In the present embodiment, the adhesive layer 16 is formed from the second surface 5b of the removal portion metal foil 5A between the adjacent punching blades 30b and 30c and between the adjacent punching blades 30c and 30c by an experiment using an actually used material in advance. By setting the conditions so that the metal electrode 5 and the adhesive layer 16 are kept in partial contact within the width of the punching blades 30b, 30b that completely peel and form one metal electrode 5, The height h is set.

  The punching die 30 can be a corrosion die, a cutting die or the like, but is not limited thereto. Pre-hardened steel, quenching and tempering steel, precipitation hardened steel, alloys of tungsten carbide and cobalt, other superhard alloys, etc. can be used as the material for forming the punching die 30. There is no limit.

In order to perform the metal electrode forming step S2 using the punching die 30, the punching die 30 is aligned on the metal foil layer 15 of the metal foil sheet 14, as shown in FIG.
Next, the metal foil sheet 14 is pressed by the punching die 30.
Thereby, as shown in FIG.6 (b), each punching blade 30b and 30c penetrates the metal foil layer 15, and the die | dye surface 30a and the 1st surface 15a contact | adhere. At this time, each blade edge C cuts the metal foil layer 15 and the tip of the blade edge C reaches the adhesive layer 16.
The metal foil layer 15 is plastically deformed along the side surface shape of the punching blades 30b and 30c to form a V-shaped groove shape to which the outer shape of the punching blades 30b and 30c is transferred.
Since stress concentrates at the tip of the cutting edge C, the metal foil layer 15 is cut along the longitudinal direction of the punching blades 30b and 30c. For this reason, the metal foil layer 15 will be in the state cut | disconnected by the metal electrode 5 and the removal part metal foil 5A.

On the second surface 5b side of the metal electrode 5 and the removal portion metal foil 5A, a protruding portion 5c protruding toward the adhesive layer 16 side is formed by plastic deformation.
Thereby, the second surface 5b around the protruding portion 5c is curved, and the second surface 5b is combined with this and the adhesive layer 16 being pushed down toward the holding sheet 17 by the tip of the blade edge C and curved. And the upper surface of the pressure-sensitive adhesive layer 16 are separated from each other, and peeling portions 31 and 32 each including a minute gap are formed.

Here, the peeling portion 31 is formed from the side of the punching blade 30b toward the metal electrode 5 with which the punching die 30 contacts, and is formed in a range of a width R from the center of the punching blade 30b to the side. The Although not particularly illustrated, in the illustrated depth direction, a similar shape is formed at various locations along the cutting edge C.
Since the width R is narrower than half of the minimum width of each metal electrode 5, a close contact portion with the adhesive layer 16 remains on the second surface 5 b of each metal electrode 5.
Moreover, the peeling part 32 is formed between the punching blades 30b and 30c adjacent to each other or between the punching blades 30c adjacent to each other, and is formed on the second surface 5b side of the removing portion metal foil 5A. The In the present embodiment, by setting the width between the adjacent punching blades 30b, 30c or between the adjacent punching blades 30c to be at most about twice the width R, the peeling portion 32 is It is formed over the entire second surface 5b of the removal portion metal foil 5A. Thereby, in the 2nd surface 5b of 5 A of removal part metal foil, the contact | adherence part of 5 A of removal part metal foil and the adhesion layer 16 can be lose | disappeared.

Next, the punching die 30 is retracted in the direction opposite to the pressing direction, that is, in the direction away from the holding sheet 17. Thereby, as shown in FIG. 7A, the metal foil layer 15 is cut to form a punched sheet 33 having a three-layer structure in which the metal electrode 5 and the removal portion metal foil 5A are formed. At this time, since the holding sheet 17 is not cut by the half-cut method using the punching die 30, the size of the punched sheet 33 in plan view is the same as that of the holding sheet 17.
Next, as shown in FIG. 7B, the removed portion metal foil 5 </ b> A is removed from the punched sheet 33 to form an unnecessary metal foil removed sheet 34.
In the punched sheet 33, each removed portion metal foil 5A is peeled off from the adhesive layer 16, and therefore can be peeled off more easily by any of the peeling methods described above.
Since the unnecessary metal foil-removed sheet 34 is formed by pressing as described above, the outer peripheral surface 5d is exposed from the first surface 5a toward the second surface 5b according to the inclination of the side surface of the punching blade 30b. It is inclined in the direction of a taper surface having an angle α / 2.
Thus, the metal electrode forming step S2 in the case where the cutting method using a press is used is completed.

Next, using this unnecessary metal foil removed sheet 34, the adhesive layer forming step S3, the base material adhering step S4, and the metal electrode transfer step S5 are performed in the same manner as described above.
Thereby, the circuit board 2 having the cross-sectional shape shown in FIG. That is, the adhesive layer 4 is formed on each first surface 5a by the adhesive layer forming step S3, thereby forming an intermediate laminate M (not shown) having the same layer configuration as that in FIG. 4B. . Next, the intermediate laminate M is bonded to the substrate 3 by the substrate bonding step S4. Thereby, the above-described unnecessary metal foil removed sheet 34 is bonded to the base material 3 through the adhesive layer 4.
Next, the holding sheet 17 is peeled from the intermediate laminate M by the metal electrode transfer step S5. Thereby, the adhesive layer 16 is peeled from each second surface 5b together with the holding sheet 17, and the circuit board 2 having a cross-sectional shape as shown in FIG. 7C is formed.

The circuit board 2 shown in FIG. 7C is subjected to a metal electrode forming step S2 using a press cutting method so that each outer peripheral surface 5d is angled outwardly from the first surface 5a toward the second surface 5b. Inclined by α / 2. Moreover, the protrusion part 5c which protrudes from the 2nd surface 5b toward the opposite side direction to the base material 3 is formed in the outer edge part of each 2nd surface 5b.

The metal electrode forming step S2 and the adhesive layer forming step S3 using such a press cutting method can be performed continuously using the processing device 48 shown in FIG.
The processing device 48 conveys the metal foil sheet 14 from the left side to the right side in the figure, and by the action of the die-cutting roller 40, the compressed air blowing portion 42, and the application roller 46 that are sequentially arranged from the upstream side to the downstream side in the conveyance direction. The punched sheet 33, the unnecessary metal foil removed sheet 34, and the intermediate laminate M are sequentially formed.
The punching roller 40 is provided with a punching die 30 on the outer peripheral surface, and is rotatably supported facing the pressing roller 41. For this reason, the metal foil layer 14 with the metal foil layer 15 facing the mold release roller 40 and the holding sheet 17 facing the pressure roller 41 is inserted between the mold release roller 40 and the pressure roller 41, and the mold release roller 40 is inserted. Is rotated, the punching die 30 is continuously punched. Thereby, the punched sheet 33 is formed from the metal foil sheet 14.
In this example, the metal foil sheet 14 is conveyed with the holding sheet 17 facing upward and the metal foil layer 15 facing downward. For this reason, with the metal foil sheet 14 interposed therebetween, the die removing roller 40 is disposed on the lower side and the pressing roller 41 is disposed on the upper side.

The compressed air blowing part 42 blows compressed air on the removed metal foil 5A on the punched sheet 33 conveyed through the die-cutting roller 40 to peel the removed metal foil part 5A from the adhesive layer 16. On the downstream side of the punching roller 40, the punched sheet 33 is disposed in the vicinity of the surface on which the metal electrode 5 and the removed metal foil portion 5A are formed.
Below the punched sheet 33 and between the die-cutting roller 40 and the compressed air blowing part 42, in the vicinity of the compressed air blowing part 42, a removing part metal that collects the removed metal foil 5A peeled off from the punched sheet 33. A foil collection container 44 is arranged.
Further, a back surface holding stage 43 that supports the punched sheet 33 from the holding sheet 17 side when the compressed air spraying part 42 is sprayed is provided at a position facing the arrangement position of the compressed air spraying part 42 across the punched sheet 33. ing.
The removal portion metal foil 5 </ b> A is peeled off and removed by the compressed air blowing portion 42. The removed metal foil portion 5A falls into the removed metal foil collection container 44 and is collected. Thereby, the punched sheet 33 becomes an unnecessary metal foil removed sheet 34 and is conveyed toward the application roller 46.

The application roller 46 is a rotating roller that supplies an adhesive 49 that forms the adhesive layer 4 on the second surface 5b of the sheet 34 with the unnecessary metal foil removed, and an adhesive storage section in which the adhesive 49 is stored. The lower part of the roller is immersed in 45.
A conveying roller 47 that rotates and conveys the holding sheet 17 of the unnecessary metal foil-removed sheet 34 is disposed on the upper side of the application roller 46 so as to be opposed thereto.
Therefore, when the unnecessary metal foil removed sheet 34 is inserted between the application roller 46 and the conveyance roller 47, the adhesive 49 is applied on the second surface 5b of each metal electrode 5, and the adhesive layer 4 is formed. The formed intermediate laminate M is formed.

  According to the processing device 48, while the metal foil sheet 14 is being conveyed, the formation of the adhesive layer 4 is successively performed by cutting the metal foil, peeling off, removing and recovering the removal portion metal foil 5 </ b> A, and applying the adhesive 49. Therefore, the metal electrode forming step S2 and the adhesive layer forming step S3 of the circuit board manufacturing method of the present embodiment can be performed efficiently and quickly.

As described above, the circuit board 2 according to the present embodiment is formed between the adjacent metal electrodes 5 because the metal electrodes 5 are formed on the plurality of adhesive layers 4 formed with a gap therebetween. Even when the adhesive layer 4 is not left and the plurality of metal electrodes 5 are formed by cutting the metal foil, it can be easily manufactured.
Further, such a circuit board 2 is excellent in mechanical durability of the circuit board 2 because the base material 3 is not damaged even if a punching method is used.
Further, in such a circuit board 2, since the adhesive layers 4 that join the adjacent metal electrodes 5 to the base material 3 are separated from each other, the adhesive layer 4 is interposed between the adjacent metal electrodes 5. No weak current flows therethrough, and there is no possibility of causing a short circuit due to the deterioration of the adhesive layer 4 due to this, so-called migration. As a result, even if it is used for a long time, it is excellent in electrical durability and reliability.
Thus, since the circuit board 2 of this embodiment does not have the adhesive layer 4 which continues between the adjacent metal electrodes 5 which cause migration, for example, for a long period of time such as 10 to 50 years, It is particularly suitable for an electric product that requires high durability and high reliability, such as a solar cell module, used in an outdoor environment where light is continuously irradiated.

Moreover, according to the circuit board 2 of this embodiment and its manufacturing method, the adhesive layer 4 is not formed on the base material 3 between the spaced apart adhesive layers 4. For this reason, compared with the case where the adhesive bond layer 4 is formed in the whole surface of the base material 3, the usage-amount of the adhesive agent for forming the adhesive bond layer 4 can be reduced, and manufacturing cost can be reduced. .
Further, compared to the case where the removal process is performed after the adhesive layer 4 is formed on the entire surface, in addition to the amount of adhesive used, the removal process of the adhesive layer 4 can be omitted, thereby further reducing the manufacturing cost. can do.

  Moreover, according to the solar cell module 50 of this embodiment, since the circuit board 2 is used, it is excellent in durability and reliability.

[Modification]
Next, a circuit board according to a modification of this embodiment will be described.
FIG. 9 is a schematic cross-sectional view showing a configuration of a modified example of the circuit board according to the embodiment of the present invention.

As shown in FIG. 9, the circuit board 2 </ b> A of this modification includes an adhesive layer 4 </ b> B instead of the adhesive layer 4 of the circuit board 2 of the above embodiment. Hereinafter, a description will be given focusing on differences from the above embodiment.
The adhesive layer 4B is different from the adhesive layer 4 in that the adhesive layer outer peripheral surface 4d is located on the outer side of the outer peripheral surface 5d in each metal electrode 5.
For this reason, the adhesive layer 4B protrudes to the side of each metal electrode 5 when the circuit board 2A is viewed from the second surface 5b side. However, the adhesive layer outer peripheral surfaces 4d of the adjacent adhesive layers 4B are separated from each other.
Although FIG. 9 shows an example in which all the metal electrodes 5 are laminated on the adhesive layer 4B, the circuit board 2A has a portion where the adhesive layer 4 and the metal electrodes 5 are laminated. You may do it.

Next, an example of a manufacturing method of the circuit board 2A according to this modification will be described.
First, in the same manner as in the above embodiment, a metal electrode laminated body in which a plurality of metal electrodes 5 are arranged separately on the adhesive layer 16 shown in FIG. 3B is formed (metal electrode laminated body forming step). In addition, this metal electrode laminated body may be formed by press work, and in this case, the unnecessary metal foil removed sheet 34 of the above embodiment becomes the metal electrode laminated body.
Next, the adhesive layer laminated body which patterned the adhesive layer 4B previously on the base material 3 is formed (adhesive layer laminated | stacking formation process).
The patterning means is not particularly limited. For example, a patterning unit that draws a pattern of the adhesive layer 4B by relatively moving the adhesive discharge unit and the substrate 3 while discharging the adhesive from the adhesive discharge unit can be employed.
However, the order of these forming steps may be changed or performed in parallel.

Next, the metal electrode laminate and the adhesive layer laminate are aligned, the first surface 5a of the metal electrode 5 and the adhesive layer 4B are brought into close contact with each other, and the adhesive strength is awaited (laminate). Adhesion process). When the adhesive strength is developed, the holding sheet 17 is peeled off together with the adhesive layer 16 (holding sheet peeling step).
In this way, the circuit board 2A is manufactured.

  It should be noted that all the constituent elements described in the above embodiments can be implemented by appropriately changing or deleting combinations within the scope of the technical idea of the present invention.

DESCRIPTION OF SYMBOLS 1 Back sheet 2, 2A Circuit board 3 Base material 3a Base material surface 4, 4B Adhesive layer 4d Adhesive layer outer peripheral surface 5, 5B, 5C, 5D Metal electrode 5A Removal part Metal foil 5c Protrusion part 5d Outer peripheral surface 7 Solar cell Cell 14 Metal foil sheet 15 Metal foil layer (metal foil)
16 adhesive layer 17 holds the sheet 19 the adhesive layer holding member 30 cutting die 30a-type surface _{30b, 30b 1, 30b 2,} 30b 3, 30c, 30c 1, 30c 2 punching blade 31 peeling unit 33 punched already sheet 34 unnecessary metal Foil-removed sheet 40 Die cutting roller 42 Compressed air spray section 46 Application roller 48 Processing device 49 Adhesive 50 Solar cell module C Cutting edge M Intermediate laminate S1 Metal foil sheet forming step S2 Metal electrode forming step S3 Adhesive layer forming step S4 Substrate adhesion process S5 Metal electrode transfer process

Claims (3)

A metal that forms a plurality of metal electrodes spaced apart from each other on the holding sheet by cutting the metal foil of the metal foil sheet holding the metal foil on the holding sheet and removing a part of the metal foil. An electrode forming step;
An adhesive layer forming step of forming an adhesive layer on the entire surface of the plurality of metal electrodes formed in the metal electrode forming step;
A base material adhesion step of adhering the adhesive layer to the base material and adhering to the base material;
A metal electrode transfer step of transferring the adhesive layer and the plurality of metal electrodes onto the substrate by peeling the holding sheet from the surfaces of the plurality of metal electrodes;
A method of manufacturing a circuit board comprising: The metal foil sheet holds the metal foil via an adhesive layer provided on the surface of the holding sheet,
In the metal electrode forming step, the metal foil is cut by punching with a punching blade, and between the part of the metal foil and the adhesive layer on the side of the punching blade due to deformation accompanying the pressing of the punching blade. The method for manufacturing a circuit board according to claim 1, wherein the part of the metal foil is removed after the peeling portion having a gap is formed. The dimension of the protruding height of the punching blade is:
3. The circuit board manufacturing method according to claim 2, wherein the thickness is larger than the thickness of the metal foil and smaller than the sum of the thickness of the metal foil and the thickness of the adhesive layer. Method.

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