JP5877087B2 - Adhesive film and wafer processing tape - Google Patents

Description

  The present invention relates to an adhesive film having an adhesive layer to be bonded to a semiconductor wafer, and a wafer processing tape having an adhesive layer on the adhesive layer of an adhesive film having an adhesive layer on a substrate film.

The assembly of the semiconductor chip is generally performed after the pick-up process for peeling the semiconductor wafer from the dicing tape, followed by the bonding process to be mounted on the substrate or other chip, the electrode pads of the semiconductor chip and the external electrodes (posts) of the lead frame. It consists of a wire bonding step for connecting with a gold wire, and a sealing step for hardening the semiconductor chip and the gold wire with a sealing material in order to protect them from external stress, moisture and contaminants.
In recent years, the use of organic substrates such as bismaleimide-triazine substrates and polyimide substrates in place of lead frames is increasing for higher density and higher integration. However, when these organic substrates are used, the surface of the organic substrate has a step more than the lead frame. The embedding of such a step was an improvement of the adhesive film, and the embedding of the step was made using the pressure at the time of encapsulating the sealing material, but if this embedding is insufficient, the adhesive film is melted after the heat treatment A method for adjusting the viscosity has been proposed (see Patent Document 1).
On the other hand, when a semiconductor chip is stacked on another semiconductor chip and bonded, voids are generated due to unevenness caused by wiring or wire bonding on the semiconductor chip to be bonded. In order to fill these irregularities and prevent voids from being formed, the melt viscosity and tack strength before curing can be adjusted (see Patent Document 2), and specific polymers, epoxy resins and fillers Adjustment of each content (refer patent document 3) is proposed.
However, these technologies are not always sufficient for the thinning of semiconductor chips and the increase in the number of stacked layers that progress year by year.

JP 2007-88489 A JP 2007-270125 A JP 2006-183020 A

In view of such circumstances, the present inventors have examined the generation of voids in the bonding process performed continuously with the pick-up process. In the pick-up process, the present inventors used vacuum suction to extract semiconductor chips. Voids are generated by the suction holes of the collet. That is, when air is sucked from the suction hole of the collet, the semiconductor chip portion where the semiconductor chip and the suction hole are in contact is deformed so as to be sucked into the suction hole side by decompression as shown in FIG. In this way, the deformed semiconductor chip is bonded to the substrate, and as a result, voids that are air-containing cavities are generated in contact with the substrate, resulting in chip cracks due to the unevenness and making wire bonding difficult. I understood. Moreover, since residual voids disappear before entering the wire bonding process, it is difficult to eliminate residual voids depending on the type of resin, especially acrylic copolymer, even if post-cure is performed under normal pressure heating conditions. It was found that the condition to do was necessary. The heating under pressure requires expensive equipment such as an open that can be pressurized.
Accordingly, an object of the present invention is to provide an adhesive film and a wafer processing tape capable of eliminating residual voids by heating at normal pressure without using expensive equipment such as a pressure oven. It is another object of the present invention to provide an adhesive film and a wafer processing tape that can obtain a package in which thinned chips are stacked in multiple stages at low cost.

The above problems have been solved by the following means.
(1) An adhesive film having an adhesive layer to be bonded to a semiconductor wafer, the adhesive layer containing phenoxy resin , epoxy resin , epoxy resin curing agent, curing accelerator and filler as essential components, The epoxy resin is a bisphenol A type, bisphenol AD type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type or biphenyl type epoxy resin, and a phenol novolac type or orthocresol novolac type epoxy resin. The loss tangent (tan δ) of the adhesive layer before curing was 60 in the range of 40 ° C. to 200 ° C., measured at a frequency of 1 Hz, a temperature increase rate of 20 ° C./min, and a strain of 0.3%. 1.0 or more in a temperature range of 10 K or more continuous at least in the range of ℃ to 180 ℃ And bonding the minimum value of the complex viscosity adhesive layer before curing in the range of 60 ° C. to 180 ° C. as measured under the above conditions (eta ^*) is equal to or less than 300 Pa · s or more 10000 Pa · s the film.
(2) The adhesive film according to (1), wherein the epoxy resin is contained in an amount of 100 parts by mass or more in solid content with respect to 100 parts by mass in solid content of the phenoxy resin.
(3) The epoxy resin comprises a combination of at least one epoxy compound represented by the following general formula (EP-A) and at least one epoxy compound represented by the following general formula (EP-B). The adhesive film as described in (1) or (2) above.

In the general formulas (EP-A) and (EP-B), X represents a single bond or a divalent linking group. R ^a represents a hydrogen atom or an alkyl group. m and n each independently represents 0 or a number of 1 or more.
(4) An adhesive film having an adhesive layer to be bonded to a semiconductor wafer, the adhesive layer containing phenoxy resin, epoxy resin, epoxy resin curing agent, curing accelerator and filler as essential components, The epoxy resin is a bisphenol A type, bisphenol AD type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type or biphenyl type epoxy resin, and a phenol novolac type or orthocresol novolac type epoxy resin. The loss tangent (tan δ) of the adhesive layer before curing was 60 in the range of 40 ° C. to 200 ° C., measured at a frequency of 1 Hz, a temperature increase rate of 20 ° C./min, and a strain of 0.3%. 1.0 or more in a temperature range of 10 K or more continuous at least in the range of ℃ to 180 ℃ And die, wherein the minimum value of the complex viscosity adhesive layer before curing in the range of 60 ° C. to 180 ° C. as measured under the above conditions (eta ^*) is less than 300 Pa · s or more 10000 Pa · s Adhesive film for bonding.
( 5 ) For wafer processing, comprising the adhesive film according to any one of (1) to (3) on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive film having a pressure-sensitive adhesive layer on the base film. tape.
(6) The wafer processing tape has the dividing the adhesive film for each semiconductor chip by expanding, characterized in that it is a tape used to obtain a plurality of semiconductor chips with the adhesive film (5) The tape for wafer processing as described.

  According to the present invention, it is possible to provide an adhesive film and a tape for wafer processing that can eliminate residual voids by normal pressure heating without using expensive equipment such as a pressure oven, and multi-layer lamination of thinned chips. The package can be provided at low cost.

It is sectional drawing which shows the tape for wafer processing which concerns on one Embodiment of this invention. It is a schematic diagram including the partial enlarged view which shows the deformation | transformation of the semiconductor chip by the suction from the suction hole of the adsorption collet in the pickup process. It is a schematic diagram containing the elements on larger scale of the void produced when bonding on a board | substrate. It is the photograph which binarized the image which scanned the void generation | occurrence | production of the comparative example 4 by the transmission method using the ultrasonic survey apparatus (SAT). It is the photograph which binarized the image which scanned the void of Example 6 by the transmission method using the ultrasonic survey apparatus (SAT).

The present invention is described in detail below.
First, the adhesive film of the present invention will be described.
<Adhesive film>
The adhesive film of the present invention is an adhesive film having an adhesive layer bonded to a semiconductor wafer.

<< Adhesive layer >>
The adhesive layer of the present invention has at least one phenoxy resin and at least one epoxy resin as essential resin components.

1. Phenoxy resin The phenoxy resin is preferably a resin obtained by a method of reacting various bisphenols with epichlorohydrin or a method of reacting a liquid epoxy resin with bisphenol. As the bisphenol, bisphenol A, bisphenol bisphenol AF, bisphenol AD, Bisphenol F and bisphenol S are mentioned.
A resin preferable as the phenoxy resin used in the present invention is a resin having a repeating unit represented by the following general formula (I).

In general formula (I), X represents a single bond or a divalent linking group.
Examples of the divalent linking group include an alkylene group, a phenylene group, —O—, —S—, —SO—, and —SO ₂ —.
Here, the alkylene group is preferably an alkylene group having 1 to 10 carbon atoms, and more preferably —C (R ¹ ) (R ² ) —. R ¹ and R ² represent a hydrogen atom or an alkyl group, and the alkyl group is preferably a linear or branched alkyl group having 1 to 8 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, isooctyl, 2 -Ethylhexyl, 1,3,3-trimethylbutyl and the like. The alkyl group may be substituted with a halogen atom, and examples thereof include a trifluoromethyl group.
X is preferably an alkylene group, —O—, —S— or —SO ₂ —, more preferably an alkylene group, —SO ₂ —. Of _{these, -C (CH 3) 2 -} , - CH (CH 3) -, - CH 2 -, - SO 2 - are _{preferred, -C (CH 3) 2 -} , - CH (CH 3) -, - CH ₂ — is more preferable, and —C (CH ₃ ) ₂ — is particularly preferable.

If the phenoxy resin used in the present invention has a repeating unit represented by the general formula (I), even if these X are resins having a plurality of different repeating units, the same X is repeated. You may be comprised only from the unit.
In the present invention, a resin in which X is composed of only the same repeating unit is preferable.

  The mass average molecular weight of the phenoxy resin used in the present invention is preferably 5,000 to 150,000, more preferably 5,000 to 100,000, and further preferably 10,000 to 100,000. Further, the glass transition temperature (Tg) is preferably −50 to 120 ° C., more preferably 50 to 120 ° C., and still more preferably 55 to 110 ° C.

Phenoxy resins are PCHHB, PKHC, PKHH, PKHJ, PKFEPHHP-200 manufactured by InChem, YP-50, YP-50S, YP-55U manufactured by Nippon Steel Chemical Co., Ltd., and 1256 manufactured by Mitsubishi Chemical Corporation. 4250, 4275, and the like.
In the present invention, the phenoxy resin is preferably contained in the adhesive layer in an amount of 10 to 50% by mass, more preferably 20 to 30% by mass in terms of solid content.

2. Epoxy resin The epoxy resin used in the present invention preferably has at least two epoxy groups. For example, bisphenol A type, bisphenol AD type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated biss Bifunctional glycidyl ether type epoxy resin such as phenol A type, biphenyl type bisphenyl group epoxy compound, polyalkylene glycol type, alkylene glycol type epoxy compound, naphthalene ring epoxy compound, fluorene group epoxy compound, etc. , Phenol novolac type, orthocresol novolak type, trishydroxyphenyl methane type, tetraphenylol ethane type and other polyfunctional glycidyl ether type epoxy resins, synthetic fatty acid glycerides such as dimer acid Like sidyl ester type epoxy resin, N, N, N ′, N′-tetraglycidyldiaminodiphenylmethane (TGDDM), tetraglycidyl-m-xylylenediamine, triglycidyl-p-aminophenol, N, N-diglycidylaniline An aromatic epoxy resin having a glycidylamino group, an epoxy compound having a tricyclodecane ring (for example, obtained by polymerizing cresols such as dicyclopentadiene and m-cresol, or phenols and then reacting with epichlorohydrin. Epoxy compound).

  Among these bisphenol resins, in the present invention, bisphenol A type, bisphenol AD type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, and biphenyl type bisphenyl groups are used. Preferred epoxy compound, phenol novolac type, orthocresol novolak type polyfunctional glycidyl ether type epoxy resin, bisphenol A type, bisphenol AD type, bisphenol F type, bisphenol S type epoxy compound having phenolic group, phenol A polyfunctional glycidyl ether type epoxy resin of novolac type or orthocresol novolac type is more preferable.

  The epoxy equivalent of the epoxy resin is preferably 120 to 250 g / equivalent (eq), and more preferably 150 to 230 g / equivalent (eq).

  Examples of the epoxy resin include EOCN series, EPPN series, NC series, BREN series, RE series, GAN series, GOT series, and AK series manufactured by Nippon Kayaku Co., Ltd., and 806 and 807 manufactured by Mitsubishi Chemical Corporation. 827, 828, 828EL, 828XA, 834, 4005P, 4007P, 4010P, and the like.

Epoxy resins may be used in combination of two or more types may be one, you combination of two or more kinds in the present invention. The epoxy resin used in the present invention includes bisphenol A type, bisphenol AD type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, and biphenyl type epoxy compound having a bisphenyl group; , Phenol novolac type, ortho cresol novolac type polyfunctional glycidyl ether type epoxy resin .
A preferable combination of these epoxy resins is a combination of an epoxy compound represented by the following general formula (EP-A) and an epoxy compound represented by the following general formula (EP-B).

In the general formulas (EP-A) and (EP-B), X has the same meaning as X in the general formula (I), and the preferred range is also the same. R ^a represents a hydrogen atom or an alkyl group. m and n each independently represents 0 or a number of 1 or more.

The alkyl group in R ^a is linear or branched, and preferably has 1 to 8 carbon atoms, more preferably 1 to 4, more preferably a methyl group and an ethyl group, and particularly preferably a methyl group.
R ^a is preferably a hydrogen atom or a methyl group.
The epoxy compound represented by the general formula (EP-B) is preferably 10 to 500 parts by mass with respect to 100 parts by mass of the solid content of the epoxy compound represented by the general formula (EP-A).

  In addition, an epoxy resin such as a (meth) acrylic ester or a (meth) acrylic resin having a repeating unit obtained therefrom (preferably a mass average molecular weight) further containing glycidyl (meth) acrylate as a copolymerization component in a preferable combination thereof. It is also preferable to combine 10000 to 1000000 and a glass transition temperature of −50 to 50 ° C.).

The epoxy resin is preferably contained in the adhesive layer in an amount of 20 to 40% by mass, more preferably 25 to 35% by mass in terms of solid content.
The epoxy resin is preferably 100 to 500 parts by mass, more preferably 100 to 300 parts by mass, further preferably 100 to 250 parts by mass, and 110 to 250 parts by mass with respect to 100 parts by mass of the solid content of the phenoxy resin. Is particularly preferred.

3. Other Resins The adhesive layer of the present invention may contain other resins in addition to the phenoxy resin and epoxy resin.
Examples of such resins include (meth) acrylic resins (adhesives or adhesives), known polyimide resins used for adhesives, polyamide resins, polyetherimide resins, polyamideimide resins, polyester resins, and polyesterimide resins. , Polysulfone resin, polyether sulfone resin, polyphenylene sulfide resin, polyether ketone resin, chlorinated polypropylene resin, polyurethane resin, silicon oligomer, and the like.
Among these, (meth) acrylic resins are preferable.
In this invention, it is preferable to contain only the said phenoxy resin and an epoxy resin.

4). Additives It is preferable that the adhesive layer of the present invention contains additives such as a curing agent for epoxy resins, a curing accelerator, and a filler in addition to the above resins. The adhesive layer used in the present invention contains an epoxy resin curing agent, a curing accelerator and a filler.

1) Curing agent for epoxy resin and curing accelerator In the present invention, as the curing agent or curing accelerator for epoxy resin, those usually used as curing agents for epoxy resins can be used. Examples of such epoxy resin curing agents or accelerators include dicyandiamide, boron trifluoride complex compounds, organic hydrazide compounds, amines, polyamide resins, imidazole compounds, urea or thiourea compounds, polymercaptan compounds, mercapto compounds. Examples thereof include polysulfide resins having terminal groups, acid anhydrides, and light / ultraviolet curing agents.
Among these, boron trifluoride complex compounds include boron trifluoride-amine complexes with various amine compounds (preferably primary amine compounds), and organic hydrazide compounds include isophthalic acid dihydrazide.

  Examples of amines include chain aliphatic amines (diethylenetriamine, triethylenetetramine, hexamethylenediamine, N, N-dimethylpropylamine, benzyldimethylamine, 2- (dimethylamino) phenol, 2,4,6-tris (dimethyl). Aminomethyl) phenol, m-xylenediamine, etc.), cyclic aliphatic amines (N-aminoethylpiperazine, bis (3-methyl-4-aminocyclohexyl) methane, bis (4-aminocyclohexyl) methane, mensendiamine, Foronediamine, 1,3-bis (aminomethyl) cyclohexane, etc.), heterocyclic amines (piperazine, N, N-dimethylpiperazine, triethylenediamine, melamine, guanamine, etc.), aromatic amines (metaphenylenediamine, 4,4 ′) -Diaminodiph Nilmethane, diamino, 4,4′-diaminodiphenylsulfone, etc.), polyamide resin (polyamideamine is preferred, a condensation product of dimer acid and polyamine), imidazole compound (2-phenyl-4,5-dihydroxymethylimidazole, 2-methyl) Imidazole, 2,4-dimethylimidazole, 2-n-heptadecylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, epoxy-imidazole adduct, etc., urea or thiourea compound (N, N-dialkylurea) Compounds, N, N-dialkylthiourea compounds, etc.), polymercaptan compounds, polysulfide resins with terminal mercapto groups, acid anhydrides (tetrahydrophthalic anhydride, etc.), light / ultraviolet curing agents (diphenyliodine and um hexafluorophosphate) Feto, triphenylsulfonium hexafluorophosphate and the like) are exemplified.

These may be used alone or in combination of two or more. In the present invention, it is preferable to use two of them together.
In the present invention, the epoxy resin curing agent or accelerator is preferably dicyandiamide, an organic hydrazide compound, an amine, a polyamide resin, an imidazole compound, urea, or a thiourea compound. Among them, dicyandiamide is preferable as a curing agent, and a curing accelerator. In particular, it is particularly preferable to use it together with an imidazole compound.

The content of the epoxy resin curing agent or curing accelerator in the adhesive layer is not particularly limited, and the optimal content varies depending on the type of curing agent or curing accelerator, but with respect to 100 parts by mass of the epoxy resin, 0.5-20 mass parts is preferable and 1-10 mass parts is more preferable.
Of these, the content of the curing accelerator is preferably less than the content of the curing agent, preferably 0.001 to 0.95 parts by mass of the mass of the curing agent, and 0.01 to 0.5 parts by mass. Further preferred.

2) Filler The adhesive layer of the present invention preferably contains a filler. The filler may be either an organic filler or an inorganic filler, but an inorganic filler is preferred in the present invention.
As inorganic filler, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, alumina, aluminum nitride, talc, aluminum borate whisker, boron nitride, crystalline silica , Amorphous silica, antimony oxide and the like.
Here, the inorganic filler may or may not be surface-treated with a silane coupling agent or an organic acid.
Among these, in the present invention, an inorganic filler containing silicon as a constituent component is preferable in order to improve dicing properties, and silica is particularly preferable.

0.05-20 micrometers is preferable and, as for the average particle diameter of an inorganic filler, 0.1-10 micrometers is more preferable.
The filler may be used alone or in combination of two or more.
The filler is preferably 30 to 180 parts by weight, more preferably 40 to 150 parts by weight, and even more preferably 40 to 120 parts by weight with respect to 100 parts by weight of the total solid content of the phenoxy resin and the epoxy resin in the adhesive layer.

3. Other additives In addition to the above, the adhesive layer contains a silane coupling agent, a flame retardant, an antistatic agent, a conductivity imparting agent, a lubricant, a slidability imparting agent, a surfactant, a colorant, etc. You may contain.

<< Method for producing adhesive film >>
In the production of the adhesive film, the adhesive layer is prepared by mixing and mixing the above-mentioned resins and additives using an organic solvent to produce an adhesive varnish, and releasing the treated polypropylene (PP) and polyethylene ( PE), polyethylene terephthalate (PET), etc. are applied to a release film (protective film as a base material), subjected to a heat treatment not higher than the curing start temperature of the resin mixture, and dried. In use, the release film is peeled off and used as an adhesive film.
Examples of the organic solvent include ketone solvents such as dimethylformamide, dimethylacetamide, N-methylpyrrolidone, acetone, methyl ethyl ketone, and cyclohexanone, toluene, xylene, and the like. It is preferable to use methyl ethyl ketone and cyclohexanone because the drying speed is fast and the price is low.
5-100 micrometers is preferable and, as for the thickness after drying of an adhesive bond layer, 5-20 micrometers is more preferable.

<< Characteristics of adhesive layer before curing >>
The adhesive layer before curing of the present invention has a loss tangent (tan δ) measured in the range of 40 ° C. to 200 ° C. under the conditions of a frequency of 1 Hz, a heating rate of 20 ° C./min, and a strain amount of 0.3%. It is 1.0 or more at a continuous temperature range of 10 K or more in the range of 180 ° C.
Here, the loss tangent (tan δ) is expressed by the following formula (1).

G ′ (G prime) is a storage elastic modulus and represents an ability to hold stress stored inside, that is, an elastic component. G ″ (Gee Double Prime) is a loss elastic modulus, which means a viscous component in which the applied energy escapes as heat. The storage elastic modulus is based on external factors (stress, strain). The loss elastic modulus is an element that escapes as thermal energy against external factors (stress, strain) and an element that follows Newton's law.
When tan δ is 1 or more, it means that the contribution of the viscous component is larger than that of the elastic component. The tan δ becomes harder as tan δ becomes smaller, and the viscosity becomes larger as tan δ becomes larger.

  Specifically, using a dynamic viscoelasticity measuring apparatus (for example, ARES (trade name) manufactured by Rheology), a sample thickness of 1 mm, a plate diameter of 8 mmΦ, and a frequency of 1 Hz with respect to the adhesive layer (sample) before curing. The loss tangent (tan δ) at 60 ° C. to 180 ° C. when the temperature was raised from 40 ° C. to 200 ° C. at a rate of temperature increase of 20 ° C./min under shear conditions of 0.3% strain was obtained. The loss tangent (tan δ) is calculated from the difference (K) between the maximum temperature and the minimum temperature in the continuous temperature range where the loss tangent (tan δ) is 1 or more, and it is determined whether the continuous temperature range where the loss tangent (tan δ) is 1 or more is 10K or more. .

In the present invention, the continuous temperature range in which the loss tangent (tan δ) is 1 or more is preferably 10 to 1100K, more preferably 20 to 100K, and still more preferably 30 to 100K.
If the continuous temperature range in which the loss tangent (tan δ) is 1 or more is less than 10K, residual voids cannot be eliminated by normal pressure heating.

Further, in the present invention, the adhesive layer has a complex viscosity (η ^* ) of 60 to 180 ° C. measured in the range of 40 to 200 ° C. under the conditions of a frequency of 1 Hz, a heating rate of 20 ° C./min, and a strain of 0.3% ^. ) Is 300 Pa · s or more and less than 10,000 Pa · s. The minimum value of the complex viscosity (η ^* ) is preferably 400 Pa · s or more and less than 10,000 Pa · s.
The complex viscosity (η ^* ) is represented by the following formula (2).

G '(Gee prime) and G "(Gee double prime) are synonymous with Formula (1).
The complex viscosity (η ^* ) corresponds to the length of a straight line drawn when the storage elastic modulus and the loss elastic modulus are respectively placed on the XY axes. Therefore, the smaller the complex viscosity (η ^* ), the easier the deformation.
It is considered that the air that is moderately easily deformed is likely to discharge air that has been caught during bonding, and in the present invention, the complex viscosity (η ^* ) is preferably controlled to the above value. If the complex viscosity (η ^* ) is too large, it is difficult to deform and voids may be difficult to disappear. If it is too small, chip movement from the die bond position may occur during normal pressure heating.

Similar to the loss tangent (tan δ), the complex viscosity (η ^* ) is a sample thickness of 1 mm, a plate diameter of 8 mmΦ, a frequency of 1 Hz with respect to the adhesive layer (sample) before curing. It is obtained by measuring the minimum complex viscosity at 60 ° C. to 180 ° C. when the temperature is raised from 40 ° C. to 200 ° C. at a rate of temperature increase of 20 ° C./min under shear conditions of 0.3% strain.

<Wafer processing tape>
Next, the wafer processing tape of the present invention will be described.
The wafer processing tape 10 of the present invention is a tape that is used to obtain a plurality of semiconductor chips with an adhesive film by dividing the adhesive film 13 (or only the adhesive layer 13b) into each semiconductor chip by expanding. It is preferable.
In the tape 10 for wafer processing of the present invention, in the pressure-sensitive adhesive film 12 having the pressure-sensitive adhesive layer 12b on the base film 12a, the above-mentioned adhesive film 13 (only the adhesive layer 13b may be provided) on the pressure-sensitive adhesive layer 12b. I have it.

<< Adhesive film >>
The adhesive film has sufficient adhesive strength so that the semiconductor wafer does not peel when dicing the semiconductor wafer, and low adhesive strength so that it can be easily peeled off from the adhesive layer when picking up the semiconductor chip after dicing. I have it.

  As the base film of the adhesive film, any conventionally known film can be used without any particular limitation. However, as described later, in the present embodiment, as the adhesive layer, an energy curable material Among these, since a radiation curable material is used, it is preferable to use a material having radiation transparency.

  For example, as the material of the base film, polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, Homopolymer or copolymer of α-olefin such as ethylene-methyl acrylate copolymer, ethylene-acrylic acid copolymer, ionomer or a mixture thereof, polyurethane, styrene-ethylene-butene copolymer or pentene copolymer Polymers, thermoplastic elastomers such as polyamide-polyol copolymers, and mixtures thereof can be listed. Further, the base film may be a mixture of two or more materials selected from these groups, or may be a single layer or a multilayer. The thickness of the base film is not particularly limited and may be set as appropriate, but is preferably 50 to 200 μm.

  In this embodiment, the adhesive layer is cured by irradiating the adhesive film with radiation such as ultraviolet rays, and the adhesive layer is easily peeled off from the adhesive layer. , Known chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin, addition reaction type organopolysiloxane resin, silicon acrylate resin, ethylene-vinyl acetate copolymer, ethylene-acrylic used for adhesives Radiation-polymerizable to various elastomers such as ethyl acrylate copolymer, ethylene-methyl acrylate copolymer, ethylene-acrylic acid copolymer, polyisoprene, styrene / butadiene copolymer and its hydrogenated products, and mixtures thereof It is preferable to prepare a pressure-sensitive adhesive by appropriately blending the compounds. Various surfactants and surface smoothing agents may be added. The thickness of the pressure-sensitive adhesive layer is not particularly limited and may be appropriately set, but is preferably 5 to 30 μm.

  Such a radiation-polymerizable compound is, for example, a low molecular weight compound having at least two photopolymerizable carbon-carbon double bonds in a molecule that can be three-dimensionally networked by light irradiation, or a photopolymerizable carbon-carbon double bond. A polymer or oligomer having a group as a substituent is used. Specifically, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene glycol diacrylate, 1,6 hexanediol diacrylate For example, acrylate, polyethylene glycol diacrylate, oligoester acrylate, silicon acrylate, etc., acrylic acid, copolymers of various acrylic esters, and the like are applicable.

  In addition to the above acrylate compounds, urethane acrylate oligomers can also be used. The urethane acrylate oligomer includes a polyol compound such as a polyester type or a polyether type, and a polyvalent isocyanate compound (for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diene). A terminal isocyanate urethane prepolymer obtained by reacting isocyanate, 1,4-xylylene diisocyanate, diphenylmethane 4,4-diisocyanate, etc.) with an acrylate or methacrylate having a hydroxyl group (for example, 2-hydroxyethyl) Acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, polyethylene glycol acrylate, polyethylene glycol methacrylate, etc.) Obtained by the reaction. The pressure-sensitive adhesive layer may be a mixture of two or more selected from the above resins.

  In addition to the radiation polymerizable compound that cures the pressure-sensitive adhesive layer by irradiating the pressure-sensitive adhesive film to the resin of the pressure-sensitive adhesive layer, an acrylic pressure-sensitive adhesive, a photopolymerization initiator, a curing agent, and the like are appropriately blended and adhered. An agent layer can also be prepared.

  When using a photopolymerization initiator, for example, isopropyl benzoin ether, isobutyl benzoin ether, benzophenone, Michler's ketone, chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, benzyldimethyl ketal, α-hydroxycyclohexyl phenyl ketone, 2-hydroxymethylphenyl Propane or the like can be used. The blending amount of these photopolymerization initiators is preferably 0.01 to 5 parts by mass with respect to 100 parts by mass of the acrylic copolymer.

<< How to use wafer processing tape >>
In the semiconductor device manufacturing process, the wafer processing tape is used as follows.
Specifically, the contents of paragraph numbers 0032 to 0036 of JP 2010-219293 A and FIGS. 1 to 5 of the patent publication are preferably incorporated in the present specification as they are.

  The semiconductor wafer and the ring frame are attached to the wafer processing tape, the adhesive layer of the adhesive film is attached to the ring frame, and the semiconductor wafer is attached to the adhesive layer. There is no restriction | limiting in these sticking orders, You may affix the adhesive layer of an adhesive film to a ring frame, after bonding a semiconductor wafer to an adhesive bond layer. Further, the adhesion of the adhesive film to the ring frame and the adhesion of the semiconductor wafer to the adhesive layer may be performed simultaneously.

  Then, a dicing process of the semiconductor wafer is performed, and then a process of irradiating the adhesive film with energy rays such as ultraviolet rays is performed. Specifically, since the semiconductor wafer and the adhesive layer are diced by a dicing blade, the wafer processing tape is sucked and supported from the adhesive film surface side by the suction stage. Then, the semiconductor wafer and the adhesive layer are cut into semiconductor chips by a dicing blade and separated into individual pieces, and then energy rays are irradiated from the lower surface side of the adhesive film. By this energy ray irradiation, the pressure-sensitive adhesive layer is cured to reduce its adhesive strength. In addition, it may replace with irradiation of an energy ray and may reduce the adhesive force of the adhesive layer of an adhesive film by external stimuli, such as a heating. When the pressure-sensitive adhesive layer is formed by laminating two or more pressure-sensitive adhesive layers, one or all of the pressure-sensitive adhesive layers are cured by energy ray irradiation, and one of the pressure-sensitive adhesive layers or The adhesive strength of all layers may be reduced.

  Thereafter, an expanding step is performed in which the adhesive film holding the diced semiconductor chip and the adhesive layer is stretched in the circumferential direction of the ring frame. Specifically, with respect to the adhesive film holding a plurality of diced semiconductor chips and an adhesive layer, a hollow cylindrical push-up member is raised from the lower surface side of the adhesive film, and the adhesive film is Stretch in the circumferential direction. The expanding process widens the distance between the semiconductor chips, improves the recognizability of the semiconductor chip 2 by a CCD camera or the like, and prevents re-adhesion of the semiconductor chips caused by contact between adjacent semiconductor chips during pickup. be able to.

  After carrying out the expanding process, a picking up process for picking up the semiconductor chip is carried out with the adhesive film expanded. Specifically, the semiconductor chip is pushed up by a pin from the lower surface side of the adhesive film, and the semiconductor chip 2 is picked up by an adsorption jig from the upper surface side of the adhesive film, so that the separated semiconductor chip is picked up together with the adhesive layer. To do.

  Then, after performing the pickup process, the die bonding process is performed. Specifically, the semiconductor chip is bonded to a lead frame, a package substrate, or the like by an adhesive layer picked up together with the semiconductor chip in the pickup process.

  Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited thereto.

(Examples 1-8, Comparative Examples 1-13)
<Preparation of adhesive film>
Each adhesive varnish was prepared by adding methyl ethyl ketone to each of the adhesive compositions having the formulations shown in Tables 1, 2 and 3 and stirring and mixing them. This adhesive varnish was coated on a release film so that the thickness after drying was 10 μm, and dried at 110 ° C. for 3 minutes to prepare each adhesive film. Next, the release film was peeled from the adhesive film to produce adhesive films of Examples 1 to 8 and Comparative Examples 1 to 13.

In Tables 1, 2 and 3, the unit of the blending ratio of each component is part by mass. Moreover, the following were used for each component. Phenoxy resin: PKHH (trade name manufactured by INCEM, mass average molecular weight of about 52,000, glass transition temperature 92 ° C.) Acrylic resin: SG-708-6 (trade name, mass average molecular weight of 700,000 manufactured by Nagase ChemteX Corporation) Epoxy resin A: 828 (trade name, manufactured by Mitsubishi Chemical Corporation, bisphenol A type epoxy resin, epoxy equivalent 187 g / eq) Epoxy resin B: EOCN1020 (trade name, manufactured by Nippon Kayaku Co., Ltd.) Cresol novolac type epoxy resin, epoxy equivalent 200 g / eq) Curing agent: Dyhard 100SF (trade name, manufactured by Degussa, dicyandiamide) Curing accelerator: Curesol 2PHZ (trade name, manufactured by Shikoku Kasei Co., Ltd., 2-phenyl-4,5-dihydroxymethyl Imidazole) Silica filler A: SO-C2 (Admafine) Trade name) manufactured by, mean particle size 0.5 [mu] m) Silica Filler B: SO-C1 (ADMAFINE (trade name) manufactured, average particle diameter 0.25 [mu] m)

<Measurement of continuous temperature range where loss tangent is 1 or more at 60 to 180 ° C.>
Using the dynamic viscoelasticity measuring device ARES (manufactured by Rheologica), the above-mentioned adhesive film is laminated by thermocompression bonding to a thickness of 1 mm, and the plate diameter is 8 mmΦ, the frequency is 1 Hz, and the strain amount is 0.3%. Loss tangent (tan δ) at 60 ° C. to 180 ° C. when the temperature was raised from 40 ° C. to 200 ° C. under a shearing condition at a rate of temperature increase of 20 ° C./min was measured. It was calculated from the difference between the maximum temperature and the minimum temperature in the range.
The loss tangent (tan δ) was calculated by the above-described equation (1).

<Measurement of minimum value of complex viscosity at 60 to 180 ° C.>
Using a dynamic viscoelasticity measuring device ARES (manufactured by Rheology), the sample is heated from 40 ° C to 200 ° C under shear conditions of sample thickness 1mm, plate diameter 8mmΦ, frequency 1Hz, strain 0.3%. The minimum complex viscosity (η ^* ) at 60 ° C. to 180 ° C. when the temperature was raised at a rate of 20 ° C./min was measured.
The complex viscosity (η ^* ) was calculated by the above formula (2).

<Void amount after normal pressure curing>
A silicon chip of 50 μm thickness and 10 mm square was die-bonded on a 42 alloy metal substrate (surface roughness Rz = 1 μm) plated with silver using the adhesive films of Examples and Comparative Examples at 130 ° C., 10 N, and 500 msec. Later, an oven was used for heat curing at 160 ° C. for 1 hour to prepare an evaluation sample.
An image obtained by scanning the produced sample using an ultrasonic survey apparatus (SAT) by the transmission method was binarized to obtain a black portion area ratio, which was defined as a void amount.
Further, Example 6 is shown in FIG. 5, and Comparative Example 4 is shown in FIG.
10% or less is a practical level at an acceptable level.

<Chip position change>
Die bond under conditions of 130 ° C., 10 N, 500 msec on a 42 alloy metal substrate (surface roughness Rz = 1 μm) plated with 50 μm thick 10 mm square silicon chips using the adhesive films of Examples and Comparative Examples Further, after another chip was stacked on the die-bonded chip by offsetting 100 μm both vertically and horizontally under the same conditions, an evaluation sample was prepared by heating and curing at 160 ° C. for 1 hour using an oven.
The first and second chip positions of the evaluation sample are measured using a scanning electron microscope (SEM), the amount of chip movement from the die bond position is measured, and this is the chip position change rate from the initial position. Was calculated by the following formula.
10% or less is a practical level at an acceptable level.

Chip position change rate = 100 × | offset before curing−offset after curing | ÷ offset before curing

  These results are summarized in Tables 1, 2 and 3 below.

  It can be seen that the adhesive films of Examples 1 to 8 each have a low void amount after normal pressure curing and a small chip position change rate.

In addition, each dicing tape (made by Furukawa Electric Co., Ltd., trade name: UC-334EP-110) as the supporting base material having the pressure-sensitive adhesive layer was used for each of the adhesive films of Examples 1 to 8 and Comparative Examples 1 to 13 described above. The wafer processing tape using the adhesive film of the present invention is pre-cut together with the above, and all of the tapes for wafer processing using the adhesive film of the present invention have very few residual voids under normal pressure heating (160 ° C. for 1 hour). confirmed.
Moreover, after bonding each said tape for wafer processing to the chip | tip cut | disconnected previously, it confirmed that an adhesive film divided | segmented for every chip | tip by expanding.

DESCRIPTION OF SYMBOLS 10 Wafer processing tape 12 Adhesive film 12a Base film 12b Adhesive layer 13 Adhesive film 13a Release liner 13b Adhesive layer 21 Adsorption collet 22 Semiconductor chip 23 Substrate 24 Air (void)

Claims (6)

An adhesive film having an adhesive layer stuck to the semiconductor wafer, comprising a phenoxy resin adhesive layer as essential components, an epoxy resin, an epoxy resin curing agent, a curing accelerator and a filler, respectively, the epoxy resin Bisphenol A type, bisphenol AD type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type or biphenyl type epoxy resin and phenol novolac type or orthocresol novolac type epoxy resin In addition, the loss tangent (tan δ) of the adhesive layer before curing measured in the range of 40 ° C. to 200 ° C. under the conditions of a frequency of 1 Hz, a heating rate of 20 ° C./min, and a strain amount of 0.3% is 60 ° C. to 180 °. In the range of 10 ° C., at least in the continuous temperature range of 10K or more, or Adhesive film the minimum value of the complex viscosity the adhesive layer before curing in the range of 60 ° C. to 180 ° C. as measured under the above conditions (eta ^*) is equal to or less than 300 Pa · s or more 10000 Pa · s.   2. The adhesive film according to claim 1, wherein the epoxy resin is contained in an amount of 100 parts by mass or more in terms of solid content with respect to 100 parts by mass of the solid content of the phenoxy resin. The epoxy resin, characterized by comprising a combination of at least one of the at least one epoxy compound represented by the following general formula (EP-B) of the epoxy compound represented by the following general formula (EP-A) The adhesive film according to claim 1 or 2.

In the general formulas (EP-A) and (EP-B), X represents a single bond or a divalent linking group. R ^a represents a hydrogen atom or an alkyl group. m and n each independently represents 0 or a number of 1 or more. An adhesive film having an adhesive layer to be bonded to a semiconductor wafer, the adhesive layer containing phenoxy resin, epoxy resin, epoxy resin curing agent, curing accelerator and filler as essential components, Bisphenol A type, bisphenol AD type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type or biphenyl type epoxy resin and phenol novolac type or orthocresol novolac type epoxy resin In addition, the loss tangent (tan δ) of the adhesive layer before curing measured in the range of 40 ° C. to 200 ° C. under the conditions of a frequency of 1 Hz, a heating rate of 20 ° C./min, and a strain amount of 0.3% is 60 ° C. to 180 °. In the range of 10 ° C., at least in the continuous temperature range of 10K or more, or Complex viscosity the adhesive layer before curing in the range of 60 ° C. to 180 ° C. as measured under the above conditions (eta ^* ) Is at least 300 Pa · s and less than 10,000 Pa · s.   The tape for wafer processing which has the adhesive film of any one of Claims 1-3 on this adhesive layer of the adhesive film which has an adhesive layer on a base film. The wafer processing tape has a dividing an adhesive film for each semiconductor chip by expanding wafer of claim 5, wherein a tape used to obtain a plurality of semiconductor chips with the adhesive film Tape for processing.

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