JP5868732B2 - Connection apparatus and connection method - Google Patents

Description

  The present invention relates to a connection device and a connection method for electrically connecting an end portion of a linear body formed of an amorphous material and a terminal.

  As this type of connection method, an amorphous alloy joining method disclosed in Japanese Examined Patent Publication No. 2-32077 is known. In this bonding method, a material formed of an amorphous alloy (hereinafter also referred to as “amorphous alloy material”) or a material formed of an amorphous alloy material and another metal (hereinafter also referred to as “other metal material”) is used. Each material is sandwiched between the vibrating bar and the anvil. Next, an ultrasonic wave is applied to the vibrating rod to vibrate (ultrasonic vibration). Thereby, each material is ultrasonically bonded.

Japanese Examined Patent Publication No. 2-32077 (page 1-2, Fig. 1)

  However, the above bonding method has the following problems. That is, in this joining method, the amorphous alloy materials or the amorphous alloy material and another metal material are ultrasonically joined by applying ultrasonic waves to the vibrating bars. However, amorphous alloys have physical properties that are hard and brittle. For this reason, for example, when an amorphous alloy material formed in a wire shape (linear shape) with an amorphous alloy and another metal material are joined by this joining method, the amorphous alloy material may be broken by ultrasonic vibration.

  The present invention has been made in view of such a problem, and a connection device capable of preventing breakage of a linear body when electrically connecting an end portion of a linear body formed of an amorphous material and a terminal. And providing a connection method.

In order to achieve the above object, the connection device according to claim 1 is characterized in that each end portion and each terminal in a state where each end portion of a linear body formed of an amorphous material is placed on a pair of terminals, respectively. A connecting device configured to be electrically connectable to each other, the pressing member for pressing the solder pile formed on each of the terminals so as to cover each of the end portions, and the solder pile A pressing mechanism that presses the pressing member, and a control unit that controls the pressing mechanism, and the control unit controls the pressing mechanism and includes a total area in a plan view of the solder pile. From the non-pressed state to the end of pressing, a part of the linear body that is located closer to the end side than the edge of the linear part in the longitudinal direction and at least a part of the linear body is at least region, said end by pressing at the pressing member including Wherein the terminal by crimping to electrically connect the.

  Further, the connection device according to claim 2 is the connection device according to claim 1, wherein the pressing member has a tip surface formed in a rectangular shape, and the control unit controls the pressing mechanism, and The solder pile is pressed by the pressing member so that the length direction of the distal end surface is orthogonal to the length direction of the linear body.

According to a third aspect of the present invention, there is provided a connection method in which each end and each terminal are electrically connected in a state where each end of a linear body formed of an amorphous material is placed on a pair of terminals. A soldering method is formed on each terminal so as to cover each end, and the soldering is pressed from a non-pressed state in the entire area in a plan view of each soldering. Until the end of pressing , a portion located at the end side of the edge of the linear body in the longitudinal direction and including at least a part of the linear body is pressed. The end portion and the terminal are pressed and pressed by a member to be electrically connected.

  The connection method according to claim 4 is the connection method according to claim 3, wherein a member having a rectangular tip end surface is used as the pressing member, and the length direction of the tip end surface is the linear body. The solder pile is pressed by the pressing member so as to be orthogonal to the length direction.

In the connection device according to claim 1 and the connection method according to claim 3, the non-pressed state in the entire area in a plan view of the solder pile formed on each terminal so as to cover each end of the linear body Until the pressing is completed , only a part of the region positioned on the end side of the edge of the linear body in the longitudinal direction is pressed by the pressing member. For this reason, according to this connection device and connection method, the above-mentioned region on the edge side of the solder piling (the region between the non-pressed state and the end of pressing rather than the partial region pressed by the pressing member) Without stretching the region located on the edge side) between the tip surface of the pressing member and the terminal, and extending or deforming in a direction (for example, upward or diagonally upward) different from the direction toward the center of the linear body It can be maintained in a possible state. Therefore, according to the connection device and the connection method, the whole area of the solder pile is pressed with the pulling force toward the center portion acting on the linear body as the solder pile extends toward the center of the linear body. It can be made sufficiently smaller than the configuration and method (the tensile force accompanying stretching and deformation can be dispersed in each direction). As a result, it is possible to reliably prevent the linear body from being broken by a pulling force toward the center of the linear body. Moreover, according to this connection apparatus and connection method, since ultrasonic waves are not used, it is possible to reliably prevent breakage of the linear body due to ultrasonic vibration. Further, according to the connection device and the connection method, since the region pressed by the pressing member includes at least a part of the linear body in plan view, the part of the linear body is pressed against the terminal to As a result of being able to be securely crimped, both can be electrically and reliably connected.

  Moreover, according to the connection apparatus of Claim 2, and the connection method of Claim 4, it is a pressing member so that the elongate side of the front end surface formed in the rectangular shape may be orthogonal to the length direction of a linear body. By pressing the solder pile, the region including at least a part of the linear body in a plan view can be surely pressed, so that a part of the linear body can be reliably pressed against the terminal. Both can be electrically connected more reliably.

2 is a configuration diagram showing a configuration of a connection device 1. FIG. It is a side view of the state which connected the edge parts 301a and 301b of the amorphous wire 300 to the terminals 200a and 200b, respectively. 3 is a perspective view of a pressing member 12. FIG. FIG. 3 is a side view of a state in which end portions 301a and 301b of an amorphous wire 300 are placed on terminals 200a and 200b. It is a side view in the state where solder heaps 400a and 400b were formed on terminals 200a and 200b. FIG. 6 is a side view of a state in which a solder pile 400a is pressed by a pressing member 12. FIG. 6 is a plan view of a state in which a solder pile 400a is pressed by a pressing member 12. FIG. 5 is a side view of a state in which a solder pile 400b is pressed by a pressing member 12. FIG. 6 is a plan view of a state in which a solder pile 400b is pressed by a pressing member 12. It is explanatory drawing explaining the connection method as a comparative example. It is a result figure which shows the result of a verification experiment. It is explanatory drawing explaining other embodiment of the connection method. It is explanatory drawing explaining other embodiment of the connection method.

  Hereinafter, an embodiment of a connection device and a connection method will be described with reference to the accompanying drawings.

  First, the configuration of the connection device 1 shown in FIG. 1 will be described. As shown in FIG. 2, the connection device 1 includes an end portion 301a, 301b (hereinafter also referred to as “end portion 301” when not distinguished) of an amorphous wire 300 (a linear body formed of an amorphous material) and a substrate. 100 is an apparatus for electrically connecting terminals 200a and 200b (hereinafter also referred to as “terminal 200” when not distinguished from each other) formed of metal (for example, copper) disposed on 100, as an example. As shown in FIG. 1, the substrate fixing table 11, the pressing member 12, the pressing mechanism 13, the operation unit 14, the storage unit 15, and the control unit 16 are provided.

  The substrate fixing base 11 is configured to be able to fix the substrate 100 on which the terminals 200a and 200b are disposed, for example, by suction. The pressing member 12 is formed of a material harder than solder (for example, stainless steel). As an example, as shown in FIG. 3, the pressing member 12 has, for example, a distal end surface 21 formed in a rectangular parallelepiped shape (rectangular prism shape). Note that the pressing member 12 is used with the front end surface 21 facing downward, but in the same figure, the pressing member 12 is illustrated with the front end surface 21 facing upward. Further, as shown in FIG. 7, the pressing member 12 has a direction (the same as the length direction of the amorphous wire 300 in the state in which the end portion 301 is placed on the upper surface 201 of the terminal 200 (the horizontal direction in the figure)). The length L2 on the long side of the distal end surface 21 is longer than the length L1 of the upper surface 201 along the vertical direction in the drawing. Moreover, the shape of the front end surface should just be a rectangle, and the shape of the press member 12 is not restricted to a rectangular parallelepiped shape, and can be comprised by arbitrary shapes, such as a side view trapezoid shape and a side view drum shape.

  The pressing mechanism 13 moves the pressing member 12 along a direction (XY direction) parallel to the mounting surface of the substrate fixing base 11 under the control of the control unit 16. Further, the pressing mechanism 13 moves the pressing member 12 along a direction (Z direction) that approaches and separates from the mounting surface of the substrate fixing base 11 according to the control of the control unit 16, whereby a solder pile 400 a described later. , 400b (refer to FIG. 2; hereinafter, also referred to as “solder pile 400” when not distinguished), the pressing member 12 is pressed.

  The operation unit 14 is configured to be capable of various operations such as an operation for instructing the control unit 16 to execute a crimping process to be described later. The storage unit 15 stores crimping data Dc used in the crimping process executed by the control unit 16. In this case, the crimp data Dc includes information indicating the arrangement position of each terminal 200 on the substrate 100 (specifically, the position of the center 202 of the upper surface 201 shown in FIGS. 6 and 7).

  The control unit 16 controls the pressing mechanism 13 based on the crimping data Dc stored in the storage unit 15 to move the pressing member 12, thereby crimping the end 301 of the amorphous wire 300 and the terminal 200. A crimping process for electrically connecting the two is performed.

  Next, an example of a connection method for electrically connecting the end portions 301a and 301b of the amorphous wire 300 and the pair of terminals 200a and 200b provided on the substrate 100 using the connection device 1 will be described.

  First, the end portions 301a and 301b of the amorphous wire 300 and the terminals 200a and 200b of the substrate 100 are soldered (temporarily connected). Specifically, as shown in FIG. 4, the end portions 301a and 301b are placed on the upper surfaces 201 of the terminals 200a and 200b, and the amorphous wire 300 is bridged between the terminals 200a and 200b.

  Next, as shown in FIG. 5, solder is placed so as to cover the end portions 301 a and 301 b placed on the upper surface 201 of each terminal 200 a and 200 b, and the top of each terminal 200 a and 200 b (on the upper surface 201). ) To form solder puddles 400a and 400b, respectively. In this case, as shown in FIG. 7 and FIG. 7, solder is deposited so that each solder pile 400a, 400b does not protrude from the upper surface 201 and the end 301 is reliably covered. Thereby, each edge part 301a, 301b and each terminal 200a, 200b are soldered.

  Subsequently, the substrate 100 on which the end portions 301 a and 301 b and the terminals 200 a and 200 b are soldered is placed on the placement surface (upper surface) of the substrate fixing base 11 in the connection device 1. At this time, the substrate 100 is positioned at a predetermined position on the mounting surface. Next, the substrate 100 is fixed by suction.

  Subsequently, the operation unit 14 is operated to instruct execution of the crimping process. In response to this, the control unit 16 executes the crimping process. In this crimping process, the control unit 16 reads the crimping data Dc from the storage unit 15. Next, the control unit 16 specifies the position of the center 202 on the upper surface 201 of one of the terminals 200a and 200b (for example, the terminal 200a) on the substrate 100 based on the crimping data Dc. Subsequently, the control unit 16 causes the center 22 of the distal end surface 21 of the pressing member 12 to oppose the pressing member 12 when the soldering member 400a placed on the terminal 200a is pressed by the pressing member 12 (hereinafter referred to as “opposing position”). Is specified based on the position of the specified terminal 200a.

In this case, as shown in FIGS. 6 and 7, the control unit 16 continues from the non-pressed state (the state in which the solder pile 400 a is not pressed ) out of the entire area in the plan view of the solder pile 400 a until the pressing ends. A part of the amorphous wire 300 in a plan view, which is a part of the region located closer to the end 301a of the amorphous wire 300 than the edge 401 on the central portion 302 side in the length direction of the amorphous wire 300 A position where at least a region including the area can be pressed by the pressing member 12 is designated as an opposing position. Specifically, as an example, the control unit 16 causes the pressing member 12 to press the region located in the central portion in the left-right direction (the length direction of the amorphous wire 300) of all the regions in the plan view of the solder pile 400. In this way, the center 202 of the upper surface 201 is designated as the facing position.

  Next, the control unit 16 controls the pressing mechanism 13 to move the pressing member 12 along the XY direction so that the center 202 of the upper surface 201 and the center 22 of the distal end surface 21 coincide with each other at the terminal 200a as the opposing position. Let Subsequently, the control unit 16 controls the pressing mechanism 13 to move the pressing member 12 in a direction (downward) close to the terminal 200a along the Z direction.

  At this time, as shown in FIGS. 6 and 7, the tip surface 21 (tip portion) of the pressing member 12 presses the solder pile 400a. As a result, the solder pile 400a is deformed, and the end 301a of the amorphous wire 300 is pressed against the upper surface 201 of the terminal 200a by the pressing force from the pressing member 12, and the end 301a and the terminal 200a are pressure-bonded. Next, the control unit 16 controls the pressing mechanism 13 to move the pressing member 12 in a direction (upward) away from the terminal 200a along the Z direction.

Subsequently, the control unit 16 causes the center 22 of the distal end surface 21 of the pressing member 12 when the pressing member 12 presses the solder pile 400b placed on the other of the terminals 200a and 200b (in this example, the terminal 200b). Specify the facing position to face each other. In this case, as shown in FIGS. 8 and 9, the control unit 16 has a central portion 302 side of the amorphous wire 300 between the non-pressed state and the pressing end in the entire area of the solder overlay 400 b in plan view. Position where a portion of the solder pile 400b located on the end portion 301b side of the edge 401 of the metal plate 400b can be pressed at least including a portion of the amorphous wire 300 in plan view (center 202 of the upper surface 201) Is designated as the facing position.

  Subsequently, the control unit 16 controls the pressing mechanism 13 to move the pressing member 12 along the XY direction so that the center 202 of the upper surface 201 and the center 22 of the front end surface 21 coincide with each other. Later, the pressing member 12 is moved in the direction close to the terminal 200b along the Z direction. At this time, as shown in FIG. 8, the tip of the pressing member 12 presses the solder pile 400b. As a result, the solder pile 400b is deformed, and the end 301b of the amorphous wire 300 is pressed against the upper surface 201 of the terminal 200b by the pressing force of the pressing member 12, and the end 301b and the terminal 200b are pressure-bonded. Next, the control unit 16 controls the pressing mechanism 13 to move the pressing member 12 in a direction (upward) away from the terminal 200b along the Z direction.

  Here, as shown in FIG. 10, for example, the entire surface of the solder pile 400 is pressed using a plate-like pressing member 112 in which the front end surface 121 (the lower surface in FIG. 10) is formed wider than the upper surface 201 of the terminal 200. In the configuration and method, since the entire solder pile 400 is sandwiched between the front end surface 121 and the upper surface 201, the solder pile 400 is entirely extended by the pressing force of the pressing member 112. At this time, since the portion on the edge 401 side of the solder pile 400 extends toward the central portion 302 side of the amorphous wire 300, a force (tensile force) that is pulled toward the central portion 302 side by this stretching is the amorphous wire 300. Will act. For this reason, in this configuration and method, the amorphous wire 300 may be broken by a tensile force.

On the other hand, in this connection device 1 and the connection method, the end portion of the amorphous wire 300 rather than the edge portion 401 side from the non-pressed state to the end of pressing in the entire area of the solder pile 400 in plan view. Only a part of the region located on the 301 side is pressed by the pressing member 12. For this reason, in the region on the edge 401 side of the solder pile 400 (the region located on the edge 401 side from the non-pressed state to the end of pressing than the part of the pressed region), the pressing member 12 Since the front end surface 21 and the upper surface 201 of the terminal 200 are not sandwiched, the amorphous wire 300 can be stretched or deformed in a direction (for example, upward or obliquely upward) different from the direction toward the central portion 302 side. ing. For this reason, in this connection device 1 and the connection method, the tensile force toward the center portion 302 acting on the amorphous wire 300 presses the entire area of the solder deposit 400 as the solder deposit 400 extends toward the center portion 302 side. And smaller than the method (the tensile force accompanying stretching and deformation is dispersed in each direction). As a result, it is possible to reliably prevent the amorphous wire 300 from being broken by the pulling force toward the central portion 302 side. In addition, since the connection device 1 and the connection method do not use ultrasonic waves, the amorphous wire 300 is reliably prevented from being broken by ultrasonic vibration. Furthermore, in this connection device 1 and the connection method, the region pressed by the pressing member 12 is a region including at least a part of the amorphous wire 300 in a plan view (a part located above the amorphous wire 300 in a side view). For this reason, the amorphous wire 300 can be pressed against the terminal 200 by pressing by the pressing member 12 and the both can be securely bonded together, so that both can be electrically connected reliably.

  The inventor conducted the following verification experiment in order to verify the effect of the connection device 1 and the connection method. In this verification experiment, eight samples in which the ends 301a and 301b of the amorphous wire 300 and the terminals 200a and 200b were connected by the above-described connection method using the connection device 1 were produced as the example samples. In this case, copper terminals 200a and 200b each having an upper surface 201 formed in a square shape having a side of 1.5 mm are arranged 4 mm apart. The ends 301a and 301b of the amorphous wire 300 having a diameter of 30 μm and a length of 6 mm were placed on the upper surfaces 201 of the terminals 200a and 200b, respectively, and the amorphous wire 300 was bridged between the terminals 200a and 200b. In addition, solder overlays 400a and 400b are formed on the upper surfaces 201 of the terminals 200a and 200b so as to cover the end portions 301a and 301b, respectively.

Further, using the pressing member 12 in which the distal end surface 21 is formed in a rectangle having a short side of 0.5 mm and a long side of 2 mm, each solder pile 400a, 400b is pressed to crimp the terminals 200a, 200b and the amorphous wire 300 together. The crimping process was performed. In this case, the center 22 of the distal end surface 21 of the pressing member 12 is positioned on a straight line passing through the center 202 of the upper surface 201 of the terminal 200 with the long side of the distal end surface 21 being orthogonal to the length direction of the amorphous wire 300. In this way, the solder piles 400a and 400b were pressed. In addition, the force applied to the pressing member 12 was adjusted so that the pressing force applied to the solder piles 400a and 400b from the front end surface 21 was about 5 kgf / mm ² .

In addition, as a comparative example sample, 8 samples in which the crimping process is performed using the above-described pressing member 112 instead of the pressing member 12 and the ends 301a and 301b of the amorphous wire 300 and the terminals 200a and 200b are connected to each other. Individually produced. In this case, the front end surface 121 of the pressing member 112 was formed in a circular shape having a diameter of 3 mm. Further, by adjusting the force applied to the pressing member 12 so that the pressing force applied from the front end surface 121 to the solder piles 400a and 400b is about 5 kgf / mm ² , the entire area of the solder piles 400a and 400b is pressed by the pressing member 112. did.

  Further, in this verification experiment, the resistance value between the terminals 200a and 200b in each sample before crimping (before the crimping process) was measured, and the resistance value between the terminals 200a and 200b in each sample after crimping was measured. . As a result, as shown in FIG. 11, in each example sample, the resistance value after crimping tends to be lower than the resistance value before crimping, and the resistance value after crimping in each example sample is almost equal. It became. On the other hand, in each of the comparative example samples, the amorphous wire 300 was broken in 6 out of 8, and the resistance value could not be measured.

  From the above experimental results, it is clear that in the connection device 1 and the connection method, the end portions 301a and 301b and the terminals 200a and 200b are electrically and reliably connected without breaking the amorphous wire 300. is there.

As described above, in the connection device 1 and the connection method, the solder overlay 400 is formed on each terminal 200 so as to cover each end portion 301 of the amorphous wire 300 placed on each terminal 200, and soldering is performed. A portion of the amorphous wire 300 that is positioned closer to the end portion 301 than the edge portion 401 on the central portion 302 side in the length direction of the amorphous wire 300 from the non-pressed state to the end of pressing in the entire region in plan view. Only the region is pressed by the pressing member 12. Therefore, according to the connection device 1 and the connection method, the region on the edge 401 side of the solder pile 400 (the edge 401 side in the period from the non-pressed state to the end of pressing rather than the part of the pressed region) Without being sandwiched between the distal end surface 21 of the pressing member 12 and the upper surface 201 of the terminal 200, the direction toward the central portion 302 side of the amorphous wire 300 (for example, upward or obliquely upward) Stretching and deformation can be maintained in a possible state. Therefore, according to the connection device 1 and the connection method, the tensile force toward the center portion 302 acting on the amorphous wire 300 is pressed on the entire area of the solder deposit 400 as the solder deposit 400 extends toward the center portion 302 side. It can be made sufficiently smaller than the configuration and method (the tensile force accompanying stretching and deformation can be dispersed in each direction). As a result, it is possible to reliably prevent the amorphous wire 300 from being broken by the pulling force toward the central portion 302 side. Moreover, according to this connection apparatus 1 and the connection method, since an ultrasonic wave is not used, the fracture | rupture of the amorphous wire 300 by ultrasonic vibration can be prevented reliably. Moreover, according to this connection apparatus 1 and the connection method, since the area | region pressed with the press member 12 contains at least one part of the amorphous wire 300 in planar view, the amorphous wire 300 is pressed with respect to the terminal 200, and both are ensured. As a result of being able to be pressure-bonded to each other, both can be electrically and reliably connected.

  Further, according to the connection device 1 and the connection method, the solder pile 400 is pressed by the pressing member 12 so that the long side of the end surface 21 formed in a rectangular shape is orthogonal to the length direction of the amorphous wire 300. Thus, the region including at least a part of the amorphous wire 300 in a plan view can be surely pressed, so that a part of the amorphous wire 300 can be reliably pressed against the terminal 200. Thus, the connection can be ensured.

  The connection device 1 and the connection method are not limited to the above configuration and method. For example, the example in which only the central region of the entire area in the plan view of the solder pile 400 is pressed by the pressing member 12 has been described above, but the area pressed by the pressing member 12 is not limited to this, and the solder pile 400a Of all the regions in plan view, as long as it is a part of the region located closer to the end 301 of the amorphous wire 300 than the edge 401 and includes at least a part of the amorphous wire 300 in plan view, It can be defined arbitrarily.

  Moreover, although the example using the rod-shaped pressing member 12 in which the length L2 of the front end surface 21 is formed longer than the length L1 of the upper surface 201 has been described above, as illustrated in FIG. A configuration and a method using a rod-like pressing member 512 in which the length L3 of the distal end surface 521 is formed short can also be adopted. Further, instead of the pressing member 12 in which the tip surface 21 is formed in a rectangular shape, a configuration and a method using a columnar (bar-shaped) pressing member 612 in which the tip surface 621 is formed in a circle are adopted as shown in FIG. You can also

  Further, regardless of the control of the control unit 16, the pressing mechanism 13 is controlled by the operation of the operation unit 14 (manual operation), and the solder pile 400 is pressed by the pressing member 12 or the pressing members 512 and 612 to perform pressure bonding. A connection method can also be adopted. Further, it is possible to employ a connection method in which the pressing member 12 and the pressing members 512 and 612 are manually pressed (bumped) against the solder pile 400 to perform pressure bonding without using the pressing mechanism 13. In this connection method, “a part of the entire area of the solder pile 400 a that is located on the end 301 side of the amorphous wire 300 with respect to the edge 401 and is located above the amorphous wire 300. A region that satisfies the condition “including at least a part” can be arbitrarily selected while visually confirming, and the region can be pressed to perform pressure bonding.

DESCRIPTION OF SYMBOLS 1 Connection apparatus 12,512,612 Press member 13 Press mechanism 16 Control part 21,521,621 Tip surface 200a, 200b Terminal 201 Top surface 300 Amorphous wire 301a, 301b End part 302 Center part 400a, 400b Solder pile 401 Edge part

Claims (4)

A connection device configured to be able to electrically connect each end to each terminal in a state where each end of the linear body formed of an amorphous material is placed on a pair of terminals. And
A pressing member for pressing the solder pile formed on each of the terminals so as to cover each end, a pressing mechanism for pressing the pressing member against the solder pile, and the pressing mechanism A control unit for controlling,
The control unit controls the pressing mechanism so that it is on the center side in the length direction of the linear body from the non-pressed state in the entire area in the plan view of the solder pile to the end of pressing . the region including at least a portion of a part the linear member than the end portion located on the end portion side, by pushing to bond the said terminal and the end portion electrically with the pressing member Connection device to be connected. The pressing member is formed in a rectangular shape on the tip surface,
The said control part controls the said press mechanism, and presses the said solder pile with the said press member so that the length direction of the said front end surface may orthogonally cross with respect to the length direction of the said linear body. Connection device. In a state where each end portion of the linear body formed of an amorphous material is placed on a pair of terminals, respectively, the connection method for electrically connecting each end portion and each terminal,
Forming a solder pile on each terminal so as to cover each end,
One position that is located closer to the end than the edge on the center side in the length direction of the linear body from the non-pressed state to the end of pressing in the entire area of each solder pile in plan view. A connection method in which an area including at least a part of the linear body is pressed by a pressing member and the end portion and the terminal are crimped and electrically connected.   Using a member having a tip end surface of a rectangular shape as the pressing member, the pressing member presses the solder pile so that the length direction of the tip end surface is orthogonal to the length direction of the linear body. The connection method according to claim 3.

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