JP5834693B2 - Direct drawing type waterless planographic printing plate precursor - Google Patents

Description

  The present invention relates to a direct-drawing waterless lithographic printing plate precursor, and more particularly to a direct-drawing waterless lithographic printing plate precursor that can be directly made with a laser beam.

  So far, various printing plates for performing lithographic printing without using dampening water (hereinafter referred to as waterless lithographic printing) using silicone rubber or fluororesin as an ink repellent layer have been proposed. Waterless lithographic printing uses the difference in ink adhesion, with the image area and non-image area present on the same plane, with the image area as the ink receiving layer and the non-image area as the ink repellent layer. This is a lithographic printing method in which ink is applied only to an image area and then transferred to a printing medium such as paper, and printing is performed without using dampening water.

  Various exposure methods for waterless planographic printing plate precursors have been proposed. These are broadly classified into a method of irradiating ultraviolet rays through an original image film and a computer-to-plate (hereinafter referred to as CTP) method in which an image is directly written from an original without using the original image film. Examples of the CTP method include a method of irradiating a laser beam, a method of writing with a thermal head, a method of partially applying a voltage with a pin electrode, and a method of forming an ink repellent layer or an ink receiving layer by inkjet. Among these methods, the method of irradiating laser light is superior to other methods in terms of resolution and plate making speed.

  There are two methods for irradiating laser light: a photon mode method using a photoreaction and a heat mode method in which photothermal conversion is performed to cause a thermal reaction. In particular, the heat mode method has become more useful due to the advantages of handling in a bright room and the rapid progress of semiconductor lasers as light sources.

Various proposals have been made so far for the direct-drawing waterless planographic printing plate precursor corresponding to such a heat mode method. Among these, as a direct-drawing waterless lithographic printing plate precursor that can be made with less laser irradiation energy and has good image reproducibility, a direct-drawing waterless lithographic printing plate precursor having bubbles in the heat-sensitive layer (see, for example, Patent Document 1) ) Has been proposed. In addition, as a method for producing a direct-drawing waterless planographic printing plate precursor that can be made with less laser irradiation energy and has good image reproducibility, a thermosensitive material containing an organic solvent having a solubility parameter of 17.0 (MPa) ^1/2 or less. A method for producing a direct-drawing waterless lithographic printing plate precursor having a step of applying a layer composition solution and a step of drying the thermosensitive layer composition has been proposed (for example, see Patent Document 2).

Japanese Patent Laying-Open No. 2005-300586 (Claims) JP-A-2005-331924 (Claims)

  Direct-drawing waterless lithographic printing plate precursors obtained by the techniques described in Patent Documents 1 and 2 have high sensitivity and can be developed simply by applying a physical force after exposure. However, the highly sensitive direct-drawing waterless lithographic printing plate precursor, in the process of producing a waterless lithographic printing plate, causes a phenomenon called “blistering” in which the silicone rubber layer in the exposed area is lifted, and exposure machine and automatic development In some cases, the silicone rubber layer was transferred to the conveying roller in the machine. The silicone rubber layer transferred to the transport roller may be retransferred to the plate surface of the next plate to be processed, which may cause exposure inhibition or development inhibition.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve such problems of the prior art and to provide a direct drawing type waterless lithographic printing plate precursor having high sensitivity and being less susceptible to blistering, that is, having a wide latitude.

  The present invention is a direct-drawing waterless lithographic printing plate precursor having at least a heat-sensitive layer and a silicone rubber layer in this order on a substrate, wherein the heat-sensitive layer contains non-photosensitive particles, and the average particle diameter of the non-photosensitive particles However, it is a direct-drawing waterless lithographic printing plate precursor characterized in that it is at least ½ times the average thickness of the heat-sensitive layer where no non-photosensitive particles are present.

  According to the present invention, it is possible to obtain a direct-drawing waterless lithographic printing plate precursor having high sensitivity and excellent blister resistance and a wide latitude.

The direct-drawing waterless lithographic printing plate precursor according to the present invention is a direct-drawing waterless lithographic printing plate precursor having at least a heat-sensitive layer and a silicone rubber layer in this order on a substrate, wherein the heat-sensitive layer contains non-photosensitive particles. In addition, the average particle diameter of the non-photosensitive particles is at least ½ times the average thickness of the heat-sensitive layer in the portion where the non-photosensitive particles are not present. The direct-drawing waterless lithographic printing plate precursor of the present invention is a direct-drawing waterless lithographic printing plate precursor having at least a heat-sensitive layer and a silicone rubber layer in this order on a substrate, and the heat-sensitive layer has non-photosensitive particles. The average particle diameter of the non-photosensitive particles is at least 1/2 times the average thickness of the heat-sensitive layer in the portion where the non-photosensitive particles are not present, and the heat-sensitive layer in the portion where the non-photosensitive particles are not present; The total thickness of the silicone rubber layer is equal to or less than the total thickness. The direct-drawing waterless lithographic printing plate precursor of the present invention is a direct-drawing waterless lithographic printing plate precursor having at least a heat-sensitive layer and a silicone rubber layer in this order on a substrate, and the heat-sensitive layer has non-photosensitive particles. The average particle diameter of the non-photosensitive particles is ½ times or more the average thickness of the heat-sensitive layer in the portion where the non-photosensitive particles are not present, and the CV value of the non-photosensitive particles is 15% or less It is characterized by being. The direct-drawing waterless lithographic printing plate precursor of the present invention is a direct-drawing waterless lithographic printing plate precursor having at least a heat-sensitive layer and a silicone rubber layer in this order on a substrate, and the heat-sensitive layer has non-photosensitive particles. Wherein the non-photosensitive particles have a mean particle size of ½ times or more of the heat-sensitive layer average film thickness of the non-photosensitive particles, and the non-photosensitive particles have a cross-linked structure. It is a characteristic organic particle. Here, the waterless lithographic printing plate precursor refers to a lithographic printing plate precursor that can be printed without using dampening water, and the direct-drawing waterless lithographic printing plate precursor is directly from a document using a laser beam. Waterless planographic printing plate precursor that can write images.

  The direct-drawing waterless planographic printing plate precursor of the present invention will be described below.

  The direct-drawing waterless planographic printing plate precursor of the present invention has at least a heat-sensitive layer and a silicone rubber layer in this order on a substrate.

  As the substrate, known dimensionally stable paper, metal, glass, film, etc., which have been conventionally used as a printing plate substrate, can be used. Specifically, paper, paper laminated with plastic (polyethylene, polypropylene, polystyrene, etc.), aluminum (including aluminum alloy), zinc, copper and other metal plates, soda lime, quartz and other glass plates, silicon wafers, Examples thereof include plastic films such as cellulose acetate, polyethylene terephthalate, polyethylene, polyester, polyamide, polyimide, polystyrene, polypropylene, polycarbonate, and polyvinyl acetal, and paper or plastic film on which the above metal is laminated or vapor-deposited. The plastic film may be transparent or opaque. From the viewpoint of plate inspection, an opaque film is preferable.

  Of these substrates, an aluminum plate is particularly preferable because it is extremely dimensionally stable and inexpensive. A polyethylene terephthalate film is particularly preferable as a flexible substrate for light printing.

  The thickness of the substrate is not particularly limited, and a thickness corresponding to a printing machine used for lithographic printing may be selected.

  Next, the thermosensitive layer that can be preferably used in the present invention will be described. As the heat-sensitive layer, a layer whose physical properties are changed by laser drawing and / or a layer whose adhesive force with the silicone rubber layer is lowered by laser drawing is preferable. For example, a layer obtained by applying a composition containing an active hydrogen-containing polymer, a crosslinking agent and a photothermal conversion substance, or a polymer containing an active hydrogen, an organic complex compound and a photothermal conversion substance, and drying (heating) Can be mentioned.

  The present invention is characterized in that the heat-sensitive layer contains non-photosensitive particles, and the average particle diameter of the non-photosensitive particles is ½ times or more of the heat-sensitive layer average film thickness of the portion where the non-photosensitive particles are not present. To do. The highly sensitive direct-drawing waterless lithographic printing plate precursor as described in Patent Documents 1 and 2 can be developed simply by applying a physical force after exposure. For this reason, in the process of producing a waterless lithographic printing plate, a phenomenon called “fire blistering” occurs in which the silicone rubber layer of the exposed portion is lifted, and exposure is performed when transporting the directly drawn waterless lithographic printing plate precursor after exposure. In some cases, a silicone rubber layer is transferred to a transport roller in a machine or an automatic processor. The silicone rubber layer transferred to the transport roller is retransferred to the plate surface of the next plate to be processed, which causes exposure inhibition and development inhibition. This blistering phenomenon becomes more pronounced as the direct-drawing waterless lithographic printing plate precursor has higher sensitivity and as the exposure amount increases. The direct-drawing waterless lithographic printing plate precursor of the present invention contains the non-photosensitive particles as described above in the heat-sensitive layer, thereby locally reducing the sensitivity of the heat-sensitive layer and maintaining the adhesive force with the silicone rubber layer. The blistering phenomenon can be suppressed. That is, the blister resistance is improved. The average particle diameter of the non-photosensitive particles is ½ times or more of the heat-sensitive layer average film thickness of the portion where the non-photosensitive particles are not present, preferably 3/4 times or more, more preferably 1 time or more. More preferably 4 times or more. When the average particle size of the non-photosensitive particles is less than ½ times the average thickness of the heat-sensitive layer where the non-photosensitive particles are not present, the resistance to blistering is improved as in the case where the non-photosensitive particles are not included. The effect is not obtained. On the other hand, from the viewpoint of suppressing scumming in the non-image area at the time of printing due to non-photosensitive particles, the average particle diameter of the non-photosensitive particles is a portion of the heat-sensitive layer and the silicone rubber where no non-photosensitive particles exist. It is preferable that it is below the total average film thickness of a layer.

  In the present invention, the particle diameter of the non-photosensitive particles refers to an equivalent volume sphere equivalent diameter when the particles are assumed to be true spheres. The average particle size of the non-photosensitive particles refers to a number average value calculated from a plurality of particles having the above particle sizes. The average particle diameter of the non-photosensitive particles contained in the heat-sensitive layer can be determined by observation with a transmission electron microscope (TEM). More specifically, a sample is prepared from a direct-drawing waterless lithographic printing plate precursor by a continuous (ultra-thin) section method, and TEM observation of the thermosensitive layer is performed under the conditions of an acceleration voltage of 100 kV and a magnification of 2000 times. The average particle diameter can be obtained by measuring the particle diameter of 50 randomly selected non-photosensitive particles based on the three-dimensional information of the horizontal section and calculating the number average value thereof. A method for measuring the average film thickness of the heat-sensitive layer and the silicone rubber layer will be described later.

  In addition, the non-photosensitive particles in the present invention absorb at least light in a wavelength range of 700 to 1500 nm used for exposure, preferably light in a wavelength range of 750 to 1100 nm, or hardly absorb light (particle light. This refers to particles that do not undergo chemical reactions or physical changes such as combustion, melting, decomposition, vaporization, and explosion of the heat-sensitive layer components other than the particles themselves or particles caused by absorption), and within a generally known wavelength range of 700 to 1500 nm. It is clearly different from the photothermal conversion particles (carbon black and other pigments having photothermal conversion ability) that absorb the light and convert it into heat. The presence of non-photosensitive particles contained in the heat-sensitive layer can be observed morphologically by observing the vertical and horizontal cross sections of the heat-sensitive layer using an analytical instrument such as TEM.

  As the kind of non-photosensitive particles, whether they are inorganic particles, organic particles, or inorganic / organic hybrid particles, the effect of improving the blister resistance of the present invention is exhibited. Two or more of these may be included.

Examples of the inorganic particles include non-photosensitive inorganic particles such as SiO ₂ , Al ₂ O ₃ , TiO ₂ , SnO ₂ , Sb ₂ O ₅ , Fe ₂ O ₃ , ZrO ₂ , CeO ₂ , and Y ₂ O _3. It is done. Examples of commercially available non-photosensitive inorganic particles include, as silica particles, functional spherical silica HPS series (manufactured by Toagosei Co., Ltd.), “Sea Hoster” (registered trademark) KE series (manufactured by Nippon Shokubai Co., Ltd.), “ Alumina particles such as “particle size standard particles” 8000 series (Thermo Fisher Scientific), “Admafine” series (manufactured by Admatechs), “Hypleshica” (registered trademark) series (manufactured by Ube Nitto Kasei Co., Ltd.) "Alumina spherical fine particles" series (manufactured by Nippon Steel Materials Micron), "Admafine" series (manufactured by Admatechs), "Alumina" series (manufactured by Nippon Light Metal Co., Ltd.), "Alumina beads" CB series (Made by Showa Denko KK). Among these, silica particles are preferable.

  Organic particles include (meth) acrylic acid, (meth) acrylic acid derivatives, styrene, vinyl acetate, acrylonitrile, olefin polymers, copolymers thereof, polyester, polyamide, latex, polyurethane, phenolic resin, benzoguanamine, Non-photosensitive organic particles such as melamine resin, polyethersulfone resin, silicone resin, cellulose, fluororesin, poly (fluoromethyl methacrylate) and the like can be mentioned. Here, (meth) acrylic acid is a general term for acrylic acid and methacrylic acid. Among these, (meth) acrylic acid and / or (meth) acrylic acid derivatives, styrene polymers, copolymers thereof, and silicone resins are preferable. As commercially available non-photosensitive organic particles, for example, as a polymer of (meth) acrylic acid and / or (meth) acrylic acid derivatives, “micromer” series (manufactured by Corefront Co., Ltd.), “Chemisnow” (registered trademark) ) MX series, “Chemisnow” MR series, “Chemisnow” MP series (manufactured by Soken Chemical Co., Ltd.), “Toughtic” (registered trademark) series (manufactured by Toyobo Co., Ltd.), “Crosslinked particles” SX8703 (A) series (Manufactured by JSR Corporation), “Finesphere” (registered trademark) series (manufactured by Nippon Paint Co., Ltd.), “Eposter” (registered trademark) MA series, “Eposter” YS series (manufactured by Nippon Shokubai Co., Ltd.), "Matsumoto Microsphere" (registered trademark) M series, "Matsumoto Microsphere" S series (Matsumoto Yushi Seiyaku Co., Ltd.) "Grossdale" (registered trademark) series (Mitsui Chemicals Co., Ltd.), "Riosphere" (registered trademark) series (Toyo Ink Manufacturing Co., Ltd.), etc. Soken Chemical Co., Ltd.), "Crosslinked Particles" SX8705 (P) series (manufactured by JSR Corporation), "STADEX" (registered trademark) series (manufactured by JSR Corporation), "DYNOSPHERES" series (JSR Corporation) )), “Fine Sphere” series (manufactured by Nippon Paint Co., Ltd.), “Particle Size Standard Particles” 2000, 3000, 4000, 5000, 7000 series (Thermo Fisher Scientific), etc. As a polyamide such as “Series” (manufactured by Toyobo Co., Ltd.), “Amilan” ( (Registered trademark) series (manufactured by Toray Industries, Inc.), polyphenylene sulfide, "Trepearl" (registered trademark) PPS series (manufactured by Toray Industries, Inc.), etc., latex, "CSM latex" series (Sumitomo Seika Co., Ltd.) "Solex" (registered trademark) IR100K series (manufactured by Sumitomo Seika Co., Ltd.), "Nipol" (registered trademark) series (manufactured by Nippon Zeon Co., Ltd.), etc. ) Series (manufactured by Sanyo Chemical Industries, Ltd.), “Dymic Beads” (registered trademark) series (manufactured by Dainichi Seika Kogyo Co., Ltd.), “Art Pearl” (registered trademark) series (manufactured by Negami Kogyo Co., Ltd.) As a phenolic resin, "Belle Pearl" (registered trademark) series (Air Water Co., Ltd.), etc. As an epoxy resin, "Trepearl" "EP Series (Toray Industries, Inc.)" and other polyethersulfone resins, "Trepearl" PES Series (Toray Industries, Ltd.) and other silicone resins, "Tospearl" (registered trademark) series (Momentive Performance Materials) "Flowen" (registered trademark) series, "Flowsen" UF series, "Flow beads" (registered trademark) series (manufactured by Sumitomo Seika Co., Ltd.), "Sunfine" (registered trademark) ) Series (manufactured by Asahi Kasei Kogyo Co., Ltd.), polypropylene, “Flowbren” (registered trademark) series (manufactured by Sumitomo Seika Co., Ltd.), etc., ethylene-vinyl acetate copolymer, “flow back” (registered) Trademark) series (manufactured by Sumitomo Seika Co., Ltd.), etc. "Lublon" (registered trademark) as a fluororesin such as "Avicell" series (Asahi Kasei Kogyo), "Cellulo beads" series (Daito Kasei Kogyo Co., Ltd.), etc. ) Series, “Polyflon” (registered trademark) MPA series (produced by Daikin Industries, Ltd.), etc., as benzoguanamine / formaldehyde condensate, “Eposter” (registered trademark) series (produced by Nippon Shokubai Co., Ltd.), etc., benzoguanamine / melamine・ Examples of formaldehyde condensate include “Eposter” series and “Eposter” GP series (manufactured by Nippon Shokubai Co., Ltd.), and examples of melamine / formaldehyde condensate include “Eposter” series (manufactured by Nippon Shokubai Co., Ltd.). it can.

  Further, as the organic particles, core-shell type non-photosensitive organic particles having a core-shell structure in which different organic components constitute a core part and a shell part, respectively, can be used. Specific examples of the core-shell type non-photosensitive organic particles include, for example, “Paraloid” EXL-2655 (manufactured by Kureha Chemical Industry Co., Ltd.), acrylic ester / methacrylic ester composed of butadiene / alkyl methacrylate / styrene copolymer. “Staffroid” AC-3355, “Staffroid” TR-2105, “Staffroid” TR-2102, “Staffroid” TR-2122, “Staffroid” IM-101, “Stuffoid” IM -203, "STAPHYLOID" IM-301, "STAPHYLOID" IM-401 (manufactured by Takeda Pharmaceutical Co., Ltd.), "PARALLOID" EXL-2314 (manufactured by Kureha Chemical Industry Co., Ltd.), "PARALLOID" EXL-2611 "Paraloid" EXL-3387 (Rohm & Haas), "Zeon Kurirurejin "F-351 (manufactured by Nippon Zeon Co., Ltd.), an acrylic acid ester-acrylonitrile-styrene copolymer" STAPHYLOID "IM-601 (manufactured by Takeda Chemical Industries, Ltd.) and the like.

  Non-photosensitive inorganic and organic hybrid particles include, for example, “Soliostar” (registered trademark) series (made by Nippon Shokubai Co., Ltd.) made of silica / acrylic, “Traceram” with fine particle zirconium oxide attached to the surface layer of nylon particles. “(Registered trademark) powder ZP-4000,“ Traceram ”powder BPS-2000 (manufactured by Toray Industries, Inc.) with plate-like boron nitride attached to the surface layer of crosslinked polystyrene particles, and the like.

  Since these non-photosensitive particles are usually used by being dispersed in the heat-sensitive layer composition solution, it is preferable that the non-photosensitive particles have excellent dispersion stability in the heat-sensitive layer composition solution and are not likely to spontaneously settle. Among the above-mentioned non-photosensitive particles, organic particles generally have a smaller density than inorganic particles, and are more preferable in terms of dispersion stability in the heat-sensitive layer composition solution.

  The non-photosensitive particles are preferably insoluble in the heat-sensitive layer composition solution. In general, inorganic particles are difficult to dissolve in an organic solvent, but uncrosslinked organic particles may be dissolved in an organic solvent. Therefore, when organic particles are used, it is preferable to use organic particles having a crosslinked structure, and polymers having a crosslinked structure of (meth) acrylic acid, (meth) acrylic acid derivatives, styrene, vinyl acetate, acrylonitrile, and olefins. And copolymers having these crosslinked structures, crosslinked polyesters, crosslinked polyamides, crosslinked latexes, crosslinked polyurethanes, crosslinked phenol resins, crosslinked benzoguanamine / melamine resins, crosslinked polyethersulfone resins, crosslinked silicone resins, crosslinked cellulose, and crosslinked fluorine resins. And non-photosensitive organic particles such as crosslinked poly (fluoromethyl methacrylate). Among the specific examples of the non-photosensitive organic particles, the non-photosensitive organic particles having a cross-linked structure include “Chemisnow” MX series as a cross-linked polymer of (meth) acrylic acid and / or (meth) acrylic acid derivatives. , “Chemisnow” MR series (manufactured by Soken Chemical Co., Ltd.), “Toughtic” series (manufactured by Toyobo Co., Ltd.), “Crosslinked particles” SX8703 (A) series (manufactured by JSR Corporation), “Eposter” MA series (Manufactured by Nippon Shokubai Co., Ltd.), “Matsumoto Microsphere” M series, “Matsumoto Microsphere” S series (Matsumoto Yushi Seiyaku Co., Ltd.), “Grossdale” series (Mitsui Chemicals Co., Ltd.), As a cross-linked styrene polymer such as “Riosphere” series (Toyo Ink Manufacturing Co., Ltd.), “Chemisnow” SX series (Soken Chemical Co., Ltd.), “ Bridge particles such as “SX8705 (P) series (manufactured by JSR Corporation)”, “Dymic beads” series (manufactured by Dainichi Seika Kogyo Co., Ltd.), “Art Pearl” series (manufactured by Negami Kogyo Co., Ltd.) ), Etc., as a cross-linked phenolic resin, “Belle Pearl” series (produced by Air Water Co., Ltd.), etc., as a cross-linked epoxy resin, “Trepearl” EP series (produced by Toray Industries, Inc.), etc., as a cross-linked silicone resin, “Tospearl” Cross-linked benzoguanamine / formaldehyde condensate such as “Series” (Momentive Performance Materials) “Eposter” series such as “Eposter” series (manufactured by Nippon Shokubai Co., Ltd.) , "Eposter" GP series (Co., Ltd.) As a cross-linked melamine / formaldehyde condensate such as Nippon Shokubai Co., Ltd., “Eposter” series (manufactured by Nippon Shokubai Co., Ltd.) can be cited. Among these non-photosensitive organic particles having a crosslinked structure, it is preferable to use a crosslinked polymer of (meth) acrylic acid and / or a (meth) acrylic acid derivative, a crosslinked styrene polymer, or a crosslinked silicone resin.

  The core-shell type non-photosensitive organic particles having a cross-linked structure include “Paraloid” EXL-2655 (manufactured by Kureha Chemical Industry Co., Ltd.) made of butadiene / alkyl methacrylate / styrene copolymer, acrylic ester / methacrylic acid. “Staffroid” AC-3355, “Staffroid” TR-2105, “Staffroid” TR-2102, “Staffroid” TR-2122, “Staffroid” IM-101, “Stuffoid” made of ester copolymer IM-203, “STAPHYLOID” IM-301, “STAPHYLOID” IM-401 (manufactured by Takeda Pharmaceutical Co., Ltd.), “PARALLOID” EXL-2314 (manufactured by Kureha Chemical Industries, Ltd.), “PARALLOID” EXL- 2611, “Paraloid” EXL-3387 (Rohm & Haas), “ On Acrylic Resin "F-351 (manufactured by Nippon Zeon Co., Ltd.), an acrylic acid ester-acrylonitrile-styrene copolymer" STAPHYLOID "IM-601 (manufactured by Takeda Chemical Industries, Ltd.) and the like.

  As the shape of the non-photosensitive particles, spherical, hemispherical, irregular spherical, middle concave spherical, flat shape, lens shape, cubic shape, columnar shape, plate shape, flake shape, granular shape, rod shape, needle shape, fibrous shape, lump shape, A dendritic shape, a spongy shape, a square shape, a horn shape, a round shape, and the like can be mentioned, and any shape exhibits an effect of improving the blister resistance. Among these, spherical particles are particularly preferable in that they have no directivity unlike other shapes, and thus the effect of improving the blister resistance can be stably expressed.

  As the particle size of the non-photosensitive particles, it is preferable to use particles having a narrow distribution and close to monodispersion. A CV (Coefficient of Variation) value (CV value [%] = (standard deviation / average particle size) × 100) is generally used as an index representing the monodispersity of particles. The CV value of the conductive particles is preferably 15% or less, more preferably 10% or less, and further preferably 5% or less. When the CV value of the non-photosensitive particles is 15% or less, the blister resistance can be more effectively improved even if the content of the non-photosensitive particles is small.

  The CV value of the non-photosensitive particles can be determined by using a general laser diffraction / scattering particle size distribution analyzer (for example, “SALD (registered trademark)” series (manufactured by Shimadzu Corporation)) or dynamic light scattering particle size distribution. It is obtained from the above formula from the average particle diameter and standard deviation measured using a measuring device (for example, “LB” series (manufactured by Horiba, Ltd.)). In the case of spherical non-photosensitive particles, an image is taken with a digital camera connected to a transmission optical microscope (preferably an objective lens with a magnification of 100 times or more) (total magnification on the monitor is 2000 times). The average particle diameter and standard deviation are measured by image analysis measurement software (for example, “WinROOF” (manufactured by Mitani Corp.)) and applied to the above formula to obtain the CV value. The CV value of the non-photosensitive particles in the direct-drawing waterless lithographic printing plate precursor is the equivalent volume sphere equivalent diameter of 50 or more non-photosensitive particles obtained by the particle size measuring method of the non-photosensitive particles described above. From the above information, the number average particle diameter and the standard deviation are calculated, and these values are applied to the above formula. If the same non-photosensitive particles are used, the CV value is the same regardless of whether the non-photosensitive particles or the direct-drawing waterless planographic printing plate precursor is used.

  In addition, for the purpose of improving the dispersibility of the non-photosensitive particles in the heat-sensitive layer composition solution, improving the affinity with other components, and securing the cross-linking point, the surface of the non-photosensitive particles has a carboxyl group, a hydroxyl group, and an epoxy. A functional group such as a group, glycidyl group, acryloyl group, methacryloyl group, vinyl group or allyl group may be introduced.

  In the direct-drawing waterless planographic printing plate precursor of the present invention, the in-plane occupation ratio of the non-photosensitive particles in the heat-sensitive layer is preferably 40 area% or less, and 30 area% or less in the total area (100 area%) of the heat-sensitive layer. Is more preferable. If the non-photosensitive particle occupancy is 40 area% or less, the non-photosensitive particles are unlikely to overlap in the depth direction of the heat-sensitive layer, thereby preventing exposure inhibition during exposure and non-image area smearing during printing. can do. On the other hand, from the viewpoint of further improving the blistering resistance, the in-plane occupation ratio of the non-photosensitive particles is preferably 0.5 area% or more, and more preferably 1.0 area% or more. Here, the in-plane occupation ratio of the non-photosensitive particles in the heat-sensitive layer refers to a ratio (area%) of the non-photosensitive particles in an arbitrary horizontal section of the heat-sensitive layer. The in-plane occupation ratio of the non-photosensitive particles in the heat-sensitive layer can be obtained by TEM observation. More specifically, a sample is prepared from a direct-drawing waterless lithographic printing plate precursor by a continuous (ultra-thin) section method, and a TEM observation of the horizontal section of the thermosensitive layer is performed under the conditions of an acceleration voltage of 100 kV and a magnification of 2000 times. By calculating the area occupied by the non-photosensitive particles in the unit area, the in-plane occupancy ratio (area%) of the non-photosensitive particles can be obtained.

  Among the direct-drawing waterless lithographic printing plate precursors of the present invention, in an embodiment showing a good effect, in the TEM observation of the horizontal cross section of the heat-sensitive layer, there is a film thickness reduction region of the heat-sensitive layer caused by non-photosensitive particles. Observed. It can be inferred that the region where the thickness of the heat sensitive layer is reduced serves as a low sensitivity portion of the local heat sensitive layer. When the film thickness reduction region is defined as a region where the film thickness of the heat sensitive layer from the surface of the heat sensitive layer facing the silicone rubber layer is reduced to 0.1 μm or less, the film thickness reduction region is parallel to the substrate surface. The projected figure projected onto a flat surface is the horizontal projected figure of the film thickness reduction region, and the entire area of the horizontal projected figure on the entire surface of the thermal layer projected onto the plane parallel to the substrate surface, The area ratio of the film thickness reduction region to the surface of the heat sensitive layer, calculated by the ratio of the total area of the horizontal projection pattern of the film thickness reduction region, is preferably 1 area% or more, and more preferably 3 area% or more. .

  Further, among the direct-drawing waterless lithographic printing plate precursors of the present invention, in an embodiment showing a good effect, in the TEM observation of the horizontal section of the heat-sensitive layer, the inclined region of the heat-sensitive layer due to non-photosensitive particles is present. Observed. It is inferred that the inclined region of the heat-sensitive layer is a low sensitivity portion of the local heat-sensitive layer. When the inclined area is defined as a planar area having a gradient of 10 degrees or more, forming a raised structure, and being continuous at least partially, the projected area is projected onto a plane parallel to the substrate surface The area of the horizontal projection figure of the inclined area is compared to the area of the horizontal projection figure of the entire surface of the thermal layer, which is a horizontal projection figure of the inclined area, and the entire surface of the thermal layer is projected onto a plane parallel to the substrate surface. The area ratio of the inclined region with respect to the surface of the heat-sensitive layer, calculated by the ratio occupied by the total, is preferably 1 area% or more, and more preferably 3 area% or more. For example, if the inclined region is a partial surface of the hemispherical raised structure, the horizontal projection figure is a ring formed by projecting the portion excluding the region of less than 10 degrees near the top of the hemisphere from above.

In the present invention, the polymer having a preferably active hydrogen used in the heat-sensitive layer, for _{example, -OH, -SH, -NH 2,} -NH -, - CO-NH 2, -CO-NH -, - OC (= O) -NH -, - NH- CO-NH -, - CO-OH, -CS-OH, -CO-SH, -CS-SH, -SO 3 H, -PO 3 H 2, -SO 2 -NH ₂ , a polymer having a structural unit having active hydrogen, such as —SO ₂ —NH— or —CO—CH ₂ —CO—. Examples of the polymer having such a structural unit include a homopolymer or copolymer of a monomer containing a carboxyl group such as (meth) acrylic acid, hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate. Homopolymers or copolymers of (meth) acrylic acid esters containing hydroxyl groups such as N-alkyl (meth) acrylamide, homopolymers or copolymers of (meth) acrylamide, amines and (meth) acrylic acid A homopolymer or copolymer of an ethylenically unsaturated monomer having active hydrogen such as a homopolymer or copolymer of a reaction product with glycidyl or allyl glycidyl, a homopolymer or copolymer of p-hydroxystyrene or vinyl alcohol Combined (active hydrogen Other ethylenically unsaturated monomers may be used, and ethylenically unsaturated monomers containing no active hydrogen may be used.), Polyurethanes, polyureas, polyamides (nylon resins), epoxy resins, polyalkyleneimines, novolaks Examples thereof include condensates having a structural unit having active hydrogen in the main chain, such as resins, resol resins, and cellulose derivatives. Two or more of these may be contained.

  Among them, a polymer having an alcoholic hydroxyl group, a phenolic hydroxyl group, or a carboxyl group is preferable, and a polymer having a phenolic hydroxyl group (a homopolymer or copolymer of p-hydroxystyrene, a novolac resin, a resole resin, etc.) is more preferable. A resin is more preferable. Examples of novolak resins include phenol novolac resins and cresol novolac resins.

  The content of the polymer having active hydrogen is preferably 20% by weight to 95% by weight, more preferably 50% by weight to 90% by weight, based on the total solid content of the heat-sensitive layer.

  It is also preferable to contain a polymer having active hydrogen and a film-forming polymer that does not have active hydrogen (referred to as another polymer). Other polymers include homopolymers or copolymers of (meth) acrylic acid esters such as polymethyl (meth) acrylate and polybutyl (meth) acrylate, homopolymers of styrene monomers such as polystyrene and α-methylstyrene, or Copolymers, various synthetic rubbers such as isoprene and styrene-butadiene, homopolymers such as vinyl esters such as polyvinyl acetate, copolymers such as vinyl acetate-vinyl chloride, various condensation polymers such as polyester and polycarbonate, etc. Is mentioned.

  The content of these other polymers is preferably 50% by weight or less, more preferably 30% by weight or less, and still more preferably 10% by weight or less in the total solid content of the heat-sensitive layer.

  Examples of the crosslinking agent include known polyfunctional compounds having crosslinkability. For example, polyfunctional isocyanate, polyfunctional blocked isocyanate, polyfunctional epoxy compound, polyfunctional (meth) acrylate compound, polyfunctional aldehyde, polyfunctional mercapto compound, polyfunctional alkoxysilyl compound, polyfunctional amine compound, polyfunctional carboxylic acid, A polyfunctional vinyl compound, a polyfunctional diazonium salt, a polyfunctional azide compound, hydrazine, etc. are mentioned.

  The organic complex compound is composed of a metal and an organic compound, and functions as a crosslinking agent for a polymer having active hydrogen and / or as a catalyst for a thermosetting reaction. Even when the organic complex compound functions as a cross-linking agent, the heat-sensitive layer may further contain the above-described cross-linking agent.

  Examples of the organic complex compound in the present invention include an organic complex salt in which an organic ligand is coordinated to a metal, an organic inorganic complex salt in which an organic ligand and an inorganic ligand are liganded to a metal, and a metal and an organic molecule through oxygen. Metal alkoxides covalently bonded to each other. Among these, the metal chelate compound in which the ligand has two or more donor atoms and forms a ring containing a metal atom, the stability of the organic complex compound itself, the stability of the thermosensitive layer composition solution, etc. It is preferably used from the aspect of.

  The main metals forming the organic complex compounds are Al (III), Ti (IV), Mn (II), Mn (III), Fe (II), Fe (III), Co (II), Co (III ), Ni (II), Ni (IV), Cu (I), Cu (II), Zn (II), Ge, In, Sn (II), Sn (IV), Zr (IV), Hf (IV) Is preferred. Al (III) is particularly preferable from the viewpoint that the effect of improving the sensitivity is easily obtained, and Ti (IV) is particularly preferable from the viewpoint that resistance to the printing ink and the ink cleaning agent is easily exhibited.

Moreover, as a ligand, the compound which has a coordination group which has oxygen, nitrogen, sulfur, etc. as a donor atom is mentioned. Specific examples of the coordinating group include oxygen as a donor atom: -OH (alcohol, enol and phenol), -COOH (carboxylic acid),> C = O (aldehyde, ketone, quinone), -O - (ether), - COOR (ester, R: represents an aliphatic or aromatic hydrocarbon), - N = O (nitroso compounds), - NO ₂ (nitro compound),> NO (N-oxide), Examples of —SO ₃ H (sulfonic acid) and —PO ₃ H ₂ (phosphorous acid) that use nitrogen as a donor atom include —NH ₂ (primary amine, amide, hydrazine),> NH (secondary amine). , hydrazine),> N- (3 amine), - N = N- (azo compounds, heterocyclic compounds), = N-OH (oxime), - NO ₂ (nitro compound), - N = O (nitroso compounds ),> C = N- ( Examples of compounds having sulfur as a donor atom, such as -CBS (heterocyclic compound),> C = NH (aldehyde, ketone imine, enamines), -NCS (isothiocyanato), -SH (thiol), -S- (thioether) ),> C = S (thioketone, thioamide), = S- (heterocyclic compound), -C (= O) -SH, -C (= S) -OH, -C (= S) -SH (thiocarboxylic acid) ), -SCN (thiocyanato) and the like.

  Among the organic complex compounds formed from the above metals and ligands, the compounds preferably used include Al (III), Ti (IV), Fe (II), Fe (III), and Mn (III). , Co (II), Co (III), Ni (II), Ni (IV), Cu (I), Cu (II), Zn (II), Ge, In, Sn (II), Sn (IV), Zr (IV), Hf (IV) and other metal β-diketones, amines, alcohols, complex compounds with carboxylic acids, and Al (III), Fe (II), Fe (III) Ti (IV), acetylacetone complex of Zr (IV), acetoacetate complex and the like are particularly preferable complex compounds.

  Specific examples of such compounds include the following compounds. Aluminum tris (acetylacetonate), aluminum tris (ethyl acetoacetate), aluminum tris (propyl acetoacetate), aluminum tris (butyl acetoacetate), aluminum tris (hexyl acetoacetate), aluminum tris (nonyl acetoacetate), aluminum tris (Hexafluoropentadionate), aluminum tris (2,2,6,6-tetramethyl-3,5-heptanedionate), aluminum bis (ethyl acetoacetate) mono (acetylacetonate), aluminum bis (acetylacetate) Nate) mono (ethyl acetoacetate), aluminum bis (propyl acetoacetate) mono (acetylacetonate), aluminum bis (butyl acetoacetate) G) Mono (acetylacetonate), aluminum bis (hexyl acetoacetate) mono (acetylacetonate), aluminum bis (propyl acetoacetate) mono (ethyl acetoacetate), aluminum bis (butyl acetoacetate) mono (ethyl acetoacetate) Aluminum bis (hexyl acetoacetate) mono (ethyl acetoacetate), Aluminum bis (nonyl acetoacetate) mono (ethyl acetoacetate), Aluminum dibutoxide mono (acetylacetonate), Aluminum diisopropoxide mono (acetylacetonate) Aluminum diisopropoxide mono (ethyl acetoacetate), aluminum-s-butoxide bis (ethyl acetoacetate), aluminum di-s- Tokishidomono (ethylacetoacetate), aluminum di-isopropoxide mono (9-octadecenyl acetoacetate), etc.. Titanium triisopropoxide mono (allyl acetoacetate), titanium diisopropoxide bis (triethanolamine), titanium di-n-butoxide bis (triethanolamine), titanium diisopropoxide bis (acetylacetonate), titanium Di-n-butoxide bis (acetylacetonate), titanium diisopropoxide bis (2,2,6,6-tetramethyl-3,5-heptanedionate), titanium diisopropoxide bis (ethyl acetoacetate) Titanium di-n-butoxide bis (ethyl acetoacetate), titanium tri-n-butoxide mono (ethyl acetoacetate), titanium triisopropoxide mono (methacryloxyethyl acetoacetate), titanium oxide Dobisu (acetylacetonate), titanium tetra (2-ethyl-3-hydroxyhexyl oxide), titanium dihydroxy bis (lactate), and titanium (ethylene glycolate) bis (dioctyl phosphate). Zirconium di-n-butoxide bis (acetylacetonate), zirconium tetrakis (hexafluoropentanedionate), zirconium tetrakis (trifluoropentanedionate), zirconium tri-n-propoxide mono (methacryloxyethylacetoacetate), zirconium Tetrakis (acetylacetonate), zirconium tetrakis (2,2,6,6-tetramethyl-3,5-heptanedionate), triglycolate zirconate, trilactate zirconate and the like. Iron (III) acetylacetonate, dibenzoylmethane iron (II), tropolone iron, tristroporono iron (III), hinokitiol iron, tris hinokitioro iron (III), acetoacetate iron (III), iron (III) benzoyl Acetonate, iron (III) diphenylpropane dionate, iron (III) tetramethylheptane dionate, iron (III) trifluoropentane dionate, etc. Two or more of these may be contained.

  The content of such an organic complex compound is preferably 0.5 to 50% by weight, more preferably 3 to 30% by weight, based on the total solid content of the heat-sensitive layer. By making the content of the organic complex compound 0.5% by weight or more, the above effects can be further enhanced. On the other hand, when the content is 50% by weight or less, high printing durability of the printing plate can be maintained.

  The photothermal conversion substance is not particularly limited as long as it absorbs laser light, and pigments and dyes that absorb infrared rays or near infrared rays are preferable. For example, black pigments such as carbon black, carbon graphite, aniline black, cyanine black, phthalocyanine, naphthalocyanine-based green pigment, crystal water-containing inorganic compounds, iron, copper, chromium, bismuth, magnesium, aluminum, titanium, zirconium, cobalt Metal powders such as vanadium, manganese, and tungsten, or sulfides, hydroxides, silicates, sulfates, phosphates, diamine compound complexes, dithiol compound complexes, phenolthiol compound complexes, mercaptophenol compound complexes of these metals, etc. Can be mentioned.

  In addition, as dyes that absorb infrared rays or near infrared rays, they are dyes for electronics and recording, and cyanine dyes, azurenium dyes, squarylium dyes, croconium dyes, azo dyes having a maximum absorption wavelength in the range of 700 nm to 1500 nm. Disperse dyes, bisazostilbene dyes, naphthoquinone dyes, anthraquinone dyes, perylene dyes, phthalocyanine dyes, naphthalocyanine metal complex dyes, polymethine dyes, dithiol nickel complex dyes, indoaniline metal complex dyes, molecules Intercalated CT dyes, benzothiopyran spiropyrans, nigrosine dyes and the like are preferably used.

Among these dyes, those having a large molar absorbance coefficient ε are preferably used. Specifically, ε is preferably 1 × 10 ⁴ or more, more preferably 1 × 10 ⁵ or more. If ε is 1 × 10 ⁴ or more, the initial sensitivity can be further improved.

  You may contain 2 or more types of these photothermal conversion substances. By containing two or more kinds of photothermal conversion substances having different absorption wavelengths, it is possible to cope with two or more kinds of lasers having different emission wavelengths.

  Among these, carbon black, dyes that absorb infrared rays or near infrared rays are preferable from the viewpoint of photothermal conversion, economic efficiency, and handleability.

  The content of these photothermal conversion substances is preferably 0.1 to 70% by weight, more preferably 0.5 to 40% by weight, based on the total solid content of the heat-sensitive layer. By making the content of the photothermal conversion substance 0.1% by weight or more, the sensitivity to laser light can be further improved. On the other hand, the high printing durability of a printing plate can be maintained by setting it as 70 weight% or less.

  In the direct-drawing waterless planographic printing plate precursor of the present invention, the heat-sensitive layer may contain various additives as necessary. For example, a silicone surfactant or a fluorine surfactant may be contained in order to improve the coating property. Further, a silane coupling agent, a titanium coupling agent, or the like may be contained in order to enhance the adhesiveness with the silicone rubber layer. The content of these additives varies depending on the purpose of use, but is generally 0.1 to 30% by weight in the total solid content of the heat-sensitive layer.

  For the purpose of increasing sensitivity, the direct-drawing waterless lithographic printing plate precursor of the present invention may have bubbles in the heat-sensitive layer. Examples of the method for forming bubbles in the heat-sensitive layer include the methods described in JP-A-2005-300586 and JP-A-2005-331924.

  Furthermore, for the purpose of maintaining high sensitivity even after lapse of time in addition to high sensitivity immediately after the original plate is produced, the direct-drawing waterless lithographic printing plate precursor of the present invention may have liquid bubbles in the heat-sensitive layer. . The heat-sensitive layer preferably has a liquid bubble containing a liquid having a boiling point in the range of 210 to 270 ° C., whereby a direct-drawing waterless lithographic printing plate precursor capable of maintaining high sensitivity for a long period of time can be obtained. it can. That is, by including a liquid having a boiling point of 210 ° C. or higher, it is easy to maintain the form as a liquid bubble for a long period of time, and high sensitivity can be maintained for a long period of time. On the other hand, by including a liquid having a boiling point of 270 ° C. or lower, the initial sensitivity can be further increased, and the bleeding of the liquid to the surface of the heat-sensitive layer and the peeling of the silicone rubber layer during development are suppressed. Can do. The direct-drawing waterless lithographic printing plate precursor having such a liquid bubble in the heat-sensitive layer has a high initial sensitivity and a high sensitivity after the lapse of time, and thus tends to cause blistering. The present invention is particularly effective for such a highly sensitive original.

  In the present invention, the boiling point of the liquid refers to the boiling point under atmospheric pressure. In addition, when the liquid bubble includes two or more kinds of liquids, the ratio of the liquid having a boiling point in the range of 210 to 270 ° C. is preferably 60% by weight or more, and 80% by weight or more. More preferably, it is 90% by weight or more, and further preferably 100% by weight.

  The liquid contained in the liquid bubble can be identified by collecting the generated gas by heat generation gas analysis and analyzing the gas composition.

Further, the solubility parameter of the liquid contained in the liquid bubbles is preferably 17.0 (MPa) ^1/2 or less, and more preferably 16.5 (MPa) ^1/2 or less. Since a liquid having a solubility parameter of 17.0 (MPa) ^1/2 or less has low compatibility with the above-described polymer, the solubility of the polymer in the liquid and / or the solubility of the liquid in the polymer is low, and the heat-sensitive layer It can be easily present as a liquid bubble (in a polymer having film-forming ability).

In the present invention, the solubility parameter refers to the solubility parameter of Hildebrand, and refers to an amount δ defined by δ = (ΔH / V) ^1/2 where ΔH is the heat of molar evaporation of the liquid and V is the molar volume. The unit of the solubility parameter is (MPa) ^1/2 . (Cal · cm ⁻³ ) ^1/2 is often used as the unit of the solubility parameter, and δ (MPa) ^1/2 = 2.0455 × δ (cal · cm ⁻³ ) is used between both units. ) There is a ^1/2 relational expression. Specifically, the solubility parameter 17.0 (MPa) ^1/2 is 8.3 (cal · cm ⁻³ ) ^1/2 . Examples of the liquid having a solubility parameter of 17.0 (MPa) ^1/2 or less include, but are not limited to, aliphatic hydrocarbons, alicyclic hydrocarbons, and alkylene oxide dialkyl ethers. From the viewpoints of economy and safety, aliphatic saturated hydrocarbons are preferred.

  The solubility parameter of the liquid contained in the liquid bubble can also be confirmed from the literature value by analyzing the gas composition generated by the heat generation gas analysis and specifying the structure.

As a liquid having a boiling point in the range of 210 to 270 ° C. and a solubility parameter of 17.0 (MPa) ^1/2 or less, for example, a linear, branched or cyclic hydrocarbon having 12 to 18 carbon atoms, Diethylene glycol butyl methyl ether (boiling point: 212 ° C., solubility parameter: 16.0 (MPa) ^1/2 ), diethylene glycol dibutyl ether (boiling point: 256 ° C., solubility parameter: 15.8 (MPa) ^1/2 ), triethylene glycol Dimethyl ether (boiling point: 216 ° C., solubility parameter: 16.2 (MPa) ^1/2 ), triethylene glycol butyl methyl ether (boiling point: 261 ° C., solubility parameter: 16.2 (MPa) ^1/2 ), tripropylene glycol Dimethyl ether (boiling point: 215 ° C, solubility parameter 15.1 ^{(MPa) 1/2),} and the like alkylene glycol dialkyl ethers such as. Two or more of these may be included.

From the viewpoint of further improving the initial sensitivity and the sensitivity after lapse of time, it is preferable that at least one liquid bubble is present within the irradiation area of the laser beam scanned in the exposure step when producing the waterless lithographic printing plate. The irradiation area of the laser beam of a general exposure machine is about 100 μm ² (a square with a side of about 10 μm).

The number of liquid bubbles contained in the heat-sensitive layer where no non-photosensitive particles are present can be determined by TEM observation. More specifically, a sample is prepared from a direct-drawing waterless lithographic printing plate precursor by a continuous (ultra-thin) section method, and TEM observation of the thermosensitive layer is performed under the conditions of an acceleration voltage of 100 kV and a magnification of 8000 times. Based on the three-dimensional information of the horizontal section, the liquid bubbles (diameter: 0.01 μm or more) in the depth direction of the horizontal section 1 μm ² ((vertical) 1 μm × (horizontal) 1 μm) of the heat-sensitive layer in the portion where non-photosensitive particles do not exist The number of liquid bubbles can be obtained by counting the total number of.

The spatial distribution of the liquid bubbles in the heat-sensitive layer may be uniform or modulated in the depth direction. From the viewpoint of further improving the initial sensitivity and the sensitivity after aging, the heat-sensitive layer 0.5 μm ³ ((longitudinal) 1 μm × ((longitudinal)) where no non-photosensitive particles from the interface with the silicone rubber layer to a depth of 0.5 μm are present. Horizontal) 1 μm × (depth from the interface with the silicone rubber layer) 0.5 μm), the number of liquid bubbles having a diameter of 0.01 μm or more is preferably 2 or more, more preferably 20 or more.

  The diameter of the liquid bubble is preferably 0.01 μm or more, more preferably 0.05 μm or more, and more preferably 0.1 μm or more. On the other hand, 1 μm or less is preferable, 0.5 μm or less is more preferable, and 0.3 μm or less is more preferable. The liquid bubbles having a diameter in the above range are preferably contained in an amount of 50% by volume or more, more preferably 80% by volume or more, and still more preferably 90% by volume or more of the entire liquid bubbles. The average diameter of the liquid bubbles is preferably 0.1 to 1 μm, more preferably 0.1 to 0.3 μm, and further preferably 0.25 μm or less. If the size of the liquid bubble is within the above range, the initial sensitivity and the sensitivity after aging are further improved.

  In the present invention, the diameter of the liquid bubble refers to the equivalent volume sphere equivalent diameter when the liquid bubble is assumed to be a true sphere. Moreover, the average diameter of a liquid bubble refers to the number average value calculated from a plurality of liquid bubbles having the above-mentioned diameter. The average diameter of the liquid bubbles contained in the heat-sensitive layer where no non-photosensitive particles are present can be determined by TEM observation. More specifically, a sample is prepared from a direct-drawing waterless lithographic printing plate precursor by a continuous (ultra-thin) section method, and TEM observation of the thermosensitive layer is performed under the conditions of an acceleration voltage of 100 kV and a magnification of 8000 times. The average diameter can be obtained by measuring the diameter of 50 randomly selected liquid bubbles based on the three-dimensional information of the horizontal section and calculating the number average value thereof.

  The content of the liquid bubbles in the heat-sensitive layer is preferably 0.1% by volume or more, more preferably 1% by volume or more, and more preferably 5% by volume or more of the part of the heat-sensitive layer where non-photosensitive particles are not present. On the other hand, from the viewpoint of solvent resistance and printing durability, 50% by volume or less is preferable, 40% by volume or less is more preferable, and 20% by volume or less is more preferable.

  When the heat-sensitive layer has liquid bubbles, the heat softening point of the heat-sensitive layer is preferably 50 ° C. or higher, and more preferably 60 ° C. or higher. If the thermal softening point is 50 ° C. or higher, the flow of the heat-sensitive layer at room temperature can be suppressed, and thus the sensitivity after aging can be further improved. The heat softening point of the heat sensitive layer largely depends on the heat softening point of the polymer having active hydrogen which is the main component of the heat sensitive layer. For this reason, it is preferable to use a polymer having a thermal softening point of 50 ° C. or higher as the polymer having active hydrogen. Among them, a polymer having an alcoholic hydroxyl group, a phenolic hydroxyl group, and a carboxyl group having a thermal softening point of 50 ° C. or higher is more preferable, and a polymer having a phenolic hydroxyl group having a thermal softening point of 50 ° C. or higher (p-hydroxystyrene homopolymer). Or a copolymer, a novolak resin, a resole resin, etc.) are more preferable.

  In the direct-drawing waterless planographic printing plate precursor of the present invention, the average film thickness of the heat-sensitive layer in the portion where non-photosensitive particles are not present is preferably 0.3 μm or more, more preferably 0.8 μm or more. On the other hand, it is preferably 10 μm or less, and more preferably 7 μm or less. When the average film thickness of the heat-sensitive layer where the non-photosensitive particles are not present is 0.3 μm or more, the developability is hardly lowered, and when it is 10 μm or less, the effect of improving the blister resistance is easily exhibited. It is not disadvantageous from an economic point of view. Here, the average film thickness of the heat-sensitive layer where no non-photosensitive particles are present can be determined by TEM observation. More specifically, a sample is prepared from a direct-drawing waterless lithographic printing plate precursor by an ultrathin section method, and TEM observation is performed under the conditions of an acceleration voltage of 100 kV and a magnification of 2000 times. In a TEM photograph of a vertical cross section, the film thickness was measured at 10 locations randomly selected from the heat-sensitive layer in a smooth portion without non-photosensitive particles, and the average film thickness was calculated by calculating the number average value thereof. Can be sought.

  In the direct-drawing waterless planographic printing plate precursor of the present invention, as the silicone rubber layer, a layer obtained by applying an addition reaction type silicone rubber layer composition or a condensation reaction type silicone rubber layer composition, Examples include a layer obtained by applying a solution and (heating) drying.

  The addition reaction type silicone rubber layer composition preferably contains at least a vinyl group-containing organopolysiloxane, a SiH group-containing compound (addition reaction type crosslinking agent) and a curing catalyst. Furthermore, you may contain reaction inhibitor.

The vinyl group-containing organopolysiloxane has a structure represented by the following general formula (I) and has a vinyl group at the end of the main chain or in the main chain. Of these, those having a vinyl group at the end of the main chain are preferred. Two or more of these may be contained.
-(SiR ¹ R ² -O-) _n- (I)
In the formula, n represents an integer of 2 or more, and R ¹ and R ² may be the same or different and each represents a saturated or unsaturated hydrocarbon group having 1 to 50 carbon atoms. The hydrocarbon group may be linear, branched or cyclic and may contain an aromatic ring.

In the above formula, 50% or more of R ¹ and R ² are preferably methyl groups from the viewpoint of ink repellency of the printing plate. Further, from the viewpoints of handleability, ink repellency of the printing plate, and scratch resistance, the vinyl group-containing organopolysiloxane preferably has a weight average molecular weight of 10,000 to 600,000.

  Examples of the SiH group-containing compound include organohydrogenpolysiloxanes and organic polymers having a diorganohydrogensilyl group, and organohydrogenpolysiloxanes are preferred. Two or more of these may be contained.

Organohydrogenpolysiloxane has a linear, cyclic, branched, and network molecular structure, with both molecular chain terminal trimethylsiloxy group-capped polymethylhydrogensiloxane and molecular chain both terminal trimethylsiloxy group-capped dimethylsiloxane methyl. Hydrogen siloxane copolymer, trimethylsiloxy group-capped dimethylsiloxane / methylhydrogensiloxane / methylphenylsiloxane copolymer, molecular chain dimethylhydrogensiloxy group-capped dimethylpolysiloxane, molecular chain both-end dimethylhydro Jenshirokishi group dimethylsiloxane-methylphenylsiloxane copolymers, both molecular terminals with dimethylhydrogensiloxy groups at methylphenyl polysiloxane, formula siloxane represented by R ₃ SiO _1/2 Units and _formula siloxane units represented by the formula R 2 _{HSiO 1/2:} organopolysiloxane copolymers composed of siloxane units represented by _{SiO 4/2, wherein:} the siloxane units represented by R 2 _{HSiO 1/2} Organopolysiloxane copolymer comprising a siloxane unit represented by the formula: SiO _4/2 , a siloxane unit represented by the formula: RHSiO _2/2 and a siloxane unit represented by the formula: RSiO _3/2 or a formula: HSiO _3/2 And an organopolysiloxane copolymer comprising a siloxane unit represented by Two or more of these organopolysiloxanes may be used. In the above formula, R is a monovalent hydrocarbon group other than an alkenyl group, and may be substituted. For example, alkyl groups such as methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group; aryl groups such as phenyl group, tolyl group, xylyl group, naphthyl group; benzyl group, phenethyl group, etc. Aralkyl groups; halogenated alkyl groups such as chloromethyl group, 3-chloropropyl group and 3,3,3-trifluoropropyl group are exemplified.

  Examples of the organic polymer having a diorganohydrogensilyl group include dimethylhydrogensilyl group-containing (meth) acrylic monomers such as dimethylhydrogensilyl (meth) acrylate, dimethylhydrogensilylpropyl (meth) acrylate, and ( Methyl) methacrylate, ethyl (meth) acrylate, butyl (meth) acrylate, ethyl hexyl (meth) acrylate, lauryl (meth) acrylate, styrene, α-methylstyrene, maleic acid, vinyl acetate, allyl acetate, etc. And oligomers obtained by copolymerization with the above monomers.

  The content of the SiH group-containing compound is preferably 0.5% by weight or more, more preferably 1% by weight or more in the silicone rubber layer composition from the viewpoint of curability of the silicone rubber layer. Moreover, 20 weight% or less is preferable and 15 weight% or less is more preferable.

  Examples of the reaction inhibitor include nitrogen-containing compounds, phosphorus compounds and unsaturated alcohols, and acetylene group-containing alcohols are preferably used. Two or more of these may be contained. By containing these reaction inhibitors, the curing rate of the silicone rubber layer can be adjusted. The content of the reaction inhibitor is preferably 0.01% by weight or more, more preferably 0.1% by weight or more in the silicone rubber layer composition, from the viewpoint of the stability of the silicone rubber layer composition or its solution. Further, from the viewpoint of curability of the silicone rubber layer, the content is preferably 20% by weight or less, more preferably 15% by weight or less in the silicone rubber layer composition.

  The curing catalyst is selected from known ones. Preferred are platinum compounds, and specific examples include platinum alone, platinum chloride, chloroplatinic acid, olefin coordinated platinum, platinum alcohol-modified complexes, platinum methylvinylpolysiloxane complexes, and the like. Two or more of these may be contained. The content of the curing catalyst is preferably 0.001% by weight or more, more preferably 0.01% by weight or more in the silicone rubber layer composition from the viewpoint of curability of the silicone rubber layer. Further, from the viewpoint of the stability of the silicone rubber layer composition and the solution thereof, the content is preferably 20% by weight or less, more preferably 15% by weight or less in the silicone rubber layer composition.

  In addition to these components, hydroxyl group-containing organopolysiloxane, hydrolyzable functional group-containing silane (or siloxane), known fillers such as silica for the purpose of improving rubber strength, and known for the purpose of improving adhesiveness. The silane coupling agent may be contained. As the silane coupling agent, alkoxysilanes, acetoxysilanes, ketoximinosilanes and the like are preferable, and those having a vinyl group or an allyl group are particularly preferable.

  The condensation reaction type silicone rubber layer composition preferably contains at least a hydroxyl group-containing organopolysiloxane, a crosslinking agent and a curing catalyst.

  The hydroxyl group-containing organopolysiloxane has a structure represented by the general formula (I) and has a hydroxyl group at the end of the main chain or in the main chain. Of these, those having a hydroxyl group at the end of the main chain are preferred. Two or more of these may be contained.

Examples of the crosslinking agent include silicon compounds such as a deacetic acid type, a deoxime type, a dealcohol type, a deacetone type, a deamide type, and a dehydroxylamine type represented by the following general formula (II).
(R ³ ) _4-m SiX _m (II)
In the formula, m represents an integer of 2 to 4, R ³ may be the same or different, and represents a substituted or unsubstituted alkyl group, alkenyl group, aryl group having 1 or more carbon atoms, or a combination thereof. Show. X may be the same or different and represents a hydrolyzable group. Hydrolyzable groups include acyloxy groups such as acetoxy group, ketoxime groups such as methylethylketoxime group, alkoxy groups such as methoxy group, ethoxy group, propoxy group, butoxy group, alkenyloxy groups such as isopropenoxy group, acetylethylamino group And an aminoxy group such as a dimethylaminoxy group. In the above formula, the number m of hydrolyzable groups is preferably 3 or 4.

  Specific compounds include methyltriacetoxysilane, ethyltriacetoxysilane, vinyltriacetoxysilane, allyltriacetoxysilane, phenyltriacetoxysilane, tetraacetoxysilane and other acetoxysilanes, vinylmethylbis (methylethylketoximino) silane , Methyl tris (methyl ethyl ketoximino) silane, ethyl tris (methyl ethyl ketoximino) silane, vinyl tris (methyl ethyl ketoximino) silane, allyl tris (methyl ethyl ketoximino) silane, phenyl tris (methyl ethyl ketoximino) silane, tetrakis (methyl ethyl ketoximino) silane, etc. Ketoximinosilanes, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethylto Alkoxysilanes such as ethoxysilane, tetraethoxysilane, tetrapropoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, allyltriethoxysilane, vinyltriisopropoxysilane, vinyltrisisopropenoxysilane, diisopropenoxydimethylsilane Alkenyloxysilanes such as triisopropenoxymethylsilane, tetraallyloxysilane, and the like, but are not limited thereto. Among these, acetoxysilanes and ketoximinosilanes are preferable from the viewpoint of the curing speed of the silicone rubber layer, handling properties, and the like. Two or more of these may be contained.

  The content of the crosslinking agent is preferably 0.5% by weight or more and more preferably 1% by weight or more in the silicone rubber layer composition from the viewpoint of the stability of the silicone rubber layer composition and the solution thereof. Further, from the viewpoint of the strength of the silicone rubber layer and the scratch resistance of the printing plate, the content is preferably 20% by weight or less, more preferably 15% by weight or less in the silicone rubber layer composition.

  Examples of the curing catalyst include organic carboxylic acids, acids, alkalis, amines, metal alkoxides, metal diketenates, organic acid salts of metals such as tin, lead, zinc, iron, cobalt, calcium, and manganese. Specific examples include dibutyltin diacetate, dibutyltin dioctate, dibutyltin dilaurate, zinc octylate, and iron octylate. Two or more of these may be contained.

  The content of the curing catalyst is preferably 0.001% by weight or more, and more preferably 0.01% by weight or more in the silicone rubber layer composition from the viewpoints of curability and adhesiveness of the silicone rubber layer. Further, from the viewpoint of the stability of the silicone rubber layer composition and its solution, it is preferably 15% by weight or less, more preferably 10% by weight or less in the silicone rubber layer composition.

  In addition to these components, a known filler such as silica may be contained for the purpose of improving rubber strength.

  Further, for the purpose of imparting plate inspection properties to the waterless lithographic printing plate after development, it is preferable to contain a colored pigment in the silicone rubber layer. Here, in the present invention, the colored pigment refers to a pigment that absorbs any light in the visible light wavelength region (380 to 780 nm).

  In general, pigments are insoluble in solvents such as water and aliphatic hydrocarbons. Therefore, by including pigments, water and organic chemicals used in the development process can be used compared to the case of containing dyes that are soluble in water and solvents. Dye extraction with solvents and various cleaning agents in the ink used in the printing process is remarkably suppressed.

  Examples of the plate inspection property of the waterless planographic printing plate after development include visual plate inspection property by visual inspection and device plate inspection property by a halftone dot area ratio measuring device. In general, since the image inspection ability is lower than the visual inspection ability, the waterless lithographic printing plate having good inspection performance often has good visual inspection ability.

A general halftone dot area ratio measuring device has blue light (wavelength 400 to 500 nm), green light (wavelength 500 to 600 nm), red light (wavelength 600 to 700 nm), on a halftone dot portion formed on a printing plate. Alternatively, white light (wavelength of 400 to 700 nm) is irradiated, and the halftone dot area ratio is calculated from the difference in the amount of reflected light between the image area / non-image area. For this reason, when the difference in the amount of reflected light between the image area and the non-image area is small, or when there is no difference in the amount of reflected light, it is difficult to measure the dot area ratio, and the device inspection performance is degraded. Many of the organic compounds that make up the heat-insulating and heat-sensitive layers of direct-drawing waterless lithographic printing plate precursors absorb blue light, so use a silicone rubber layer colored with colored pigments such as yellow and orange that absorb blue light. In this case, the difference in the amount of reflected light between the image area / non-image area is reduced, and the device inspection is deteriorated. Furthermore, visual inspection performance may also deteriorate. For these reasons, it is preferable to use a colored pigment that absorbs green light or red light from the viewpoints of instrument inspection and visual inspection. Furthermore, among colored pigments that absorb green light or red light, colored pigments having a density of 3 g / cm ³ or less are preferable from the viewpoint of dispersibility in the silicone rubber layer composition and its solution. Among colored pigments that absorb green light or red light, those having a density of 3 g / cm ³ or less include cobalt blue, bitumen, hydrous oxalate, ultramarine, carbon black, extender pigments (lime carbonate powder, precipitated) Printing pigments in which basic calcium carbonate, gypsum, asbestos, clay, silica powder, diatomaceous earth, talc, basic magnesium carbonate, alumina white) are dyed with dyes such as rhodamine, methyl violet, peacock blue, alkali blue, malachite green, alizarin , Alkali blue, aniline black, resol red, lake red C, brilliant carmine 6B, watch young red, Bordeaux 10B, para red, lake red 4R, naphthol red, chromophthalscarlet RN, phthalocyanine blue, fast sky blue, Examples include phthalocyanine green, anthraquinone pigment, perylene red, thioindigo red, indanthrone blue, quinacridone red, quinacridone violet, dioxazine violet, and naphthol green B. Two or more of these may be contained.

  In the direct-drawing waterless planographic printing plate precursor of the present invention, the content of the colored pigment is preferably 0.1% by volume or more, more preferably 0.2% by volume or more in the silicone rubber layer. Moreover, from a viewpoint of maintaining the ink repellency of a silicone rubber layer, 20 volume% or less is preferable and 10 volume% or less is more preferable.

  In order to improve the dispersibility of the colored pigment in the silicone rubber layer, the silicone rubber layer composition preferably contains a pigment dispersant. By containing the pigment dispersant, it is possible to suppress the aggregation of the colored pigment that occurs with time in the silicone rubber layer composition or its solution when the silicone rubber layer composition is diluted with a solvent. As the pigment dispersant, a pigment dispersant that wets the pigment surface well and has good affinity with low-polar compounds such as organopolysiloxane and a solvent used for diluting the colored pigment-containing silicone liquid described later is preferable. If it is such a pigment dispersant, a well-known pigment dispersant can be used. The pigment dispersant is sometimes used as a name such as a surfactant or a surface modifier. Examples of the pigment dispersant include an organic complex compound composed of a metal and an organic compound, an amine pigment dispersant, an acid pigment dispersant, and a nonionic surfactant. Among these, an organic complex compound composed of a metal and an organic compound or an amine pigment dispersant is preferable.

  Examples of the metal and organic compound that form the organic complex compound include the metal and organic compound that form the metal complex compound exemplified above as the crosslinking agent of the heat-sensitive layer. Among these, as the organic compound, acid compounds such as carboxylic acid, phosphoric acid, and sulfonic acid, and diketones, ketoesters, and diester compounds capable of forming a chelate ring with a metal are preferable from the viewpoint of coordination power with the metal.

  The simplest organic complex compound used as a pigment dispersant can be obtained by stirring the organic compound and metal alkoxide at room temperature or under heating and exchanging the ligand. It is preferable to coordinate one or more molecules of the organic compound to one metal.

  An example of a commercially available organic complex compound composed of a metal and an organic compound is given below. Aluminum type: “Octope” (registered trademark) Al, “Olyp” AOO, AOS (above, manufactured by Hope Pharmaceutical Co., Ltd.), “Plenact” (registered trademark) AL-M (produced by Ajinomoto Fine Techno Co., Ltd.), and the like. Titanium-based: “Pureact” KR-TTS, KR46B, KR55, KR41B, KR38S, KR138S, KR238S, KR338X, KR9SA (above, manufactured by Ajinomoto Fine Techno Co., Ltd.), “KEN-REACT” (registered trademark) TTS-B, 5, 6, 7, 10, 11, 12, 15, 26S, 37BS, 43, 58CS, 62S, 36B, 46B, 101, 106, 110S, 112S, 126S, 137BS, 158DS, 201, 206, 212, 226, 237, 262S (above, manufactured by KENRICH).

  The organic complex compound can be suitably used particularly for an addition reaction type silicone rubber layer. In particular, organic complex compounds that do not contain primary or secondary amines, phosphorus, or sulfur in the molecule do not act as catalyst poisons for platinum catalysts. Therefore, when used for addition reaction type silicones that promote curing using platinum catalysts. It is very suitable for.

  On the other hand, as the amine pigment dispersant, there are a monoamine type having one amino group in the molecule and a polyamine type having a plurality of amino groups in the molecule, both of which can be suitably used. Specific examples include “Solsperse” (registered trademark) 9000, 13240, 13650, 13940, 17000, 18000, 19000, 28000 (above, manufactured by LUBRIZOL).

The pigment dispersant is preferably contained in an amount of ² to 30 mg / m ^{2 with} respect to the surface area of the pigment. In other words, for example, when 10 g of a pigment having a specific surface area of 50 m ² / g is contained, the content of the pigment dispersant is preferably 1 to 15 g.

In the direct-drawing waterless lithographic printing plate precursor according to the present invention, the average film thickness of the silicone rubber layer on the heat-sensitive layer where no non-photosensitive particles are present is preferably 0.5 to 20 μm. By setting the average film thickness of the silicone rubber layer on the heat-sensitive layer where no non-photosensitive particles are present to 0.5 g / m ² or more, the ink repellency, scratch resistance, and printing durability of the printing plate become sufficient. / M ² or less is not disadvantageous from an economic standpoint, and developability and ink mileage are unlikely to decrease. Here, the average film thickness of the silicone rubber layer on the heat-sensitive layer where no non-photosensitive particles are present can be determined by TEM observation. More specifically, a sample is prepared from a direct-drawing waterless lithographic printing plate precursor by an ultrathin section method, and TEM observation is performed under the conditions of an acceleration voltage of 100 kV and a magnification of 2000 times. In a TEM photograph of a vertical section, the film thickness was measured at 10 locations randomly selected from the silicone rubber layer on the heat-sensitive layer in a smooth portion without the presence of non-photosensitive particles, and the number average value was calculated. The average film thickness can be obtained.

  For the purpose of improving adhesion between the substrate and the heat-sensitive layer, preventing light halation, improving plate inspection, improving heat insulation, and improving printing durability, a heat insulating layer may be provided on the substrate. As a heat insulation layer used for this invention, the heat insulation layer described in Unexamined-Japanese-Patent No. 2004-199016, Unexamined-Japanese-Patent No. 2004-334025, Unexamined-Japanese-Patent No. 2006-276385 etc. can be mentioned, for example.

  The direct-drawing waterless planographic printing plate precursor of the present invention may have a protective film and / or a slip sheet for the purpose of protecting the silicone rubber layer.

  As the protective film, a film having a thickness of 100 μm or less that transmits light of an exposure light source wavelength favorably is preferable. Typical examples include polyethylene, polypropylene, polyvinyl chloride, polyethylene terephthalate, cellophane, and the like. In addition, for the purpose of preventing exposure of the original plate due to exposure, various protective materials such as various light absorbers, photobleachable substances, and photochromic substances described in JP-A-2-063050 may be provided. Good.

The slip sheet is preferably one weighing 30 to 120 g / ^{m 2,} more preferably from 30~90g / ^{m 2.} If the weight is 30 g / m ² or more, the mechanical strength is sufficient, and if it is 120 g / m ² or less, not only is it economically advantageous, but a laminate of a direct-drawing waterless lithographic printing plate precursor and paper is used. Thinning and workability are advantageous. Examples of interleaving paper preferably used include, for example, information recording base paper 40 g / m ² (manufactured by Nagoya Pulp Co., Ltd.), metal interleaving paper 30 g / m ² (manufactured by Nagoya Pulp Co., Ltd.), unbleached kraft paper 50 g / m. ² (manufactured by Chuetsu Pulp Industries Co., Ltd.), NIP paper 52 g / m ² (manufactured by Chuetsu Pulp Industries Co., Ltd.), pure white roll paper 45 g / m ² (manufactured by Oji Paper Co., Ltd.), Kurpack 73 g / m ² (Oji But not limited to these.

  Next, a method for producing the direct-drawing waterless planographic printing plate precursor of the present invention will be described. Examples of the method for producing a direct-drawing waterless lithographic printing plate precursor according to the present invention include (a) a thermosensitive layer composition solution in which non-photosensitive particles are dispersed on a substrate or a substrate on which a heat insulating layer is laminated. A step of applying, (b) a step of drying the heat-sensitive layer composition solution to form a heat-sensitive layer, and (c) a step of applying a silicone rubber layer composition on the heat-sensitive layer to form a silicone rubber layer. The method which has is mentioned. Further, instead of the step (c), (d) a step of applying a silicone rubber layer composition solution on the heat-sensitive layer, and (e) drying the silicone rubber layer composition solution to form a silicone rubber layer. You may have a process.

  First, (a) a step of applying a heat-sensitive layer composition solution in which non-photosensitive particles are dispersed on a substrate or a substrate on which a heat insulating layer is laminated will be described. As a method for dispersing the non-photosensitive particles in the heat-sensitive layer composition solution, for example, a dispersion liquid in which the non-photosensitive particles are dispersed in advance in a solvent or a resin dilution solution constituting the heat-sensitive layer composition solution is prepared. Examples thereof include a method of mixing the obtained dispersion and other components, and a method of mixing and dispersing non-photosensitive particles and a solution prepared by mixing all components constituting the other heat-sensitive layer composition solution.

  For the dispersion of the non-photosensitive particles, a general disperser such as a three-roll, paint shaker, ball mill, bead mill, sand mill, disperser, homogenizer, attritor, or ultrasonic disperser can be used.

In the heat-sensitive layer composition solution, the solubility parameter is 17.0 (MPa) ^1/2 or less, the solvent has a boiling point in the range of 210 to 270 ° C., and the solubility parameter is 17.0 (MPa). By including a solvent exceeding ^1/2 , a liquid bubble containing a liquid having a boiling point in the range of 210 to 270 ° C. can be formed in the heat-sensitive layer.

Specific examples of the solvent having a solubility parameter of 17.0 (MPa) ^1/2 or less and having a boiling point in the range of 210 to 270 ° C. include straight chain, branched or 12 to 18 carbon atoms. Cyclic hydrocarbon, normal paraffin grade M (boiling point: 219 to 247 ° C., solubility parameter: 16.2 (MPa) ^1/2 (manufactured by Nippon Oil Corporation)), normal paraffin grade H (boiling point: 244 to 262) ° C, solubility parameter: 16.2 (MPa) ^1/2 (manufactured by Nippon Oil Corporation)), “NS Clean” 230 (boiling point: 227 ° C., solubility parameter: 16.2 (MPa) ^1/2 (( Co., Ltd.) JOMO San Energy)), "Isopar" (registered trademark) M (boiling point: 223~254 ℃, solubility parameter: 14.7 ^{(MPa) 1/2} (Esso chemical (Co. Ltd.)), "IP Solvent" 2028 (boiling point: 213~262 ℃, solubility parameter: 14.3 ^{(MPa) 1/2} (Idemitsu Kosan Co., Ltd.)), "IP clean" HX (boiling point: 222-261 ° C, solubility parameter: 14.3 (MPa) ^1/2 (made by Idemitsu Kosan Co., Ltd.)) and other saturated aliphatic hydrocarbons, “Naphthezol” (registered trademark) 220 (boiling point: 221 to 240 ° C., solubility parameter: 16.4 (MPa) ^1/2 (manufactured by Nippon Oil Corporation)) and the like, diethylene glycol butyl methyl ether (boiling point: 212 ° C., solubility parameter: 16.0 (MPa) ^1/2 ) , diethylene glycol dibutyl ether (boiling point: 256 ° C., solubility parameter: 15.8 ^{(MPa) 1/2),} triethylene glycol dimethyl Agent Le (boiling point: 216 ° C., solubility parameter: 16.2 ^{(MPa) 1/2),} triethylene glycol butyl methyl ether (boiling point: 261 ° C., solubility parameter: 16.2 ^{(MPa) 1/2),} tripropylene glycol Examples include alkylene glycol dialkyl ethers such as dimethyl ether (boiling point: 215 ° C., solubility parameter: 15.1 (MPa) ^1/2 ). Two or more of these may be included.

Further, as a solvent having a solubility parameter of 17.0 (MPa) ^1/2 or less and having a boiling point in a part of the range of 210 to 270 ° C., specifically, “naphthethol” 200 (boiling point: 201 ˜217 ° C., solubility parameter: 16.2 (MPa) ^1/2 (manufactured by Nippon Oil Corporation), “Dust Clean” 300 (boiling point: 201-217 ° C., solubility parameter: 16.2 (MPa) ^{1 / 2} (Matsumura Oil Co., Ltd.)), “Dust Clean” 300AF (boiling point: 201-217 ° C., solubility parameter: 16.2 (MPa) ^1/2 (Matsumura Oil Co., Ltd.)), polyethylene glycol dimethyl ether (Boiling point: 264 to 294 ° C., solubility parameter: 16.6 (MPa) ^1/2 ) and the like. Two or more of these may be included.

The ratio of the liquid having a boiling point in the range of 210 to 270 ° C. is preferably 80% by weight or more, and 90% by weight or more in a solvent having a solubility parameter contained in the heat-sensitive layer composition solution of 17.0 (MPa) ^1/2 or less. Is more preferable, 95% by weight or more is more preferable, and 100% by weight is further preferable.

The content of the solvent whose solubility parameter is 17.0 (MPa) ^1/2 or less and has a boiling point in the range of 210 to 270 ° C. 0.1 parts by weight or more is preferable with respect to 100 parts by weight per minute, and 1 part by weight or more is more preferable. On the other hand, from the viewpoint of applicability of the heat-sensitive layer composition solution, 60 parts by weight or less is preferable with respect to 100 parts by weight of the heat-sensitive layer solid content, and 25 parts by weight or less is more preferable. Further, from the viewpoint of further improving the initial sensitivity and sensitivity after aging, the content in the heat-sensitive layer composition solution is preferably 0.1% by weight or more, and more preferably 0.5% by weight or more. On the other hand, from the viewpoint of applicability of the heat-sensitive layer composition solution, it is preferably 10% by weight or less, more preferably 7% by weight or less, and more preferably 5% by weight or less in the heat-sensitive layer composition solution.

As the solvent having a solubility parameter exceeding 17.0 (MPa) ^1/2 , those capable of dissolving or dispersing the heat-sensitive layer constituents are preferable. For example, alcohols, ethers, ketones, esters, amides and the like can be mentioned. Two or more of these may be contained.

  Examples of alcohols include methanol, ethanol, 1-propanol, isopropanol, 1-butanol, isobutanol, 2-butanol, 2-methyl-2-propanol, 1-pentanol, 2-methyl-1-butanol, 3 -Methyl-1-butanol, 2-pentanol, 3-pentanol, 2-methyl-2-butanol, 1-hexanol, 2-hexanol, 3-hexanol, 4-methyl-2-pentanol, 2-ethylbutanol 1-heptanol, 2-heptanol, 3-heptanol, 2,4-dimethylpent-3-ol, 1-octanol, 2-octanol, 2-ethylhexanol, 1-nonanol, 2,6-dimethyl-4-heptanol , 1-decanol, ethylene glycol, diethylene glycol , Triethylene glycol, tetraethylene glycol, propylene glycol, dipropylene glycol, 1,4-butylene glycol, 2,3-butylene glycol, 2-ethyl-1,3-hexanediol, glycerin, benzyl alcohol, α-methyl Examples include benzyl alcohol, cyclopentanol, cyclohexanol, methylcyclohexanol, furfuryl alcohol, and tetrahydrofurfuryl alcohol.

  Examples of ethers include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, ethylene glycol monoethyl hexyl ether, ethylene glycol monophenyl ether, ethylene glycol monobenzyl ether, ethylene glycol dimethyl ether. , Ethylene glycol diethyl ether, ethylene glycol dipropyl ether, ethylene glycol dibutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monopropyl ether, diethylene glycol monobutyl ether, diethylene glycol dimethyl ether, diethylene glycol Cole diethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, tetraethylene glycol dimethyl ether, tetraethylene glycol dibutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, propylene glycol dimethyl ether, Propylene glycol diethyl ether, propylene glycol dipropyl ether, propylene glycol dibutyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monobutyl ether Ter, dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, dipropylene glycol dipropyl ether, dipropylene glycol dibutyl ether, tripropylene glycol monomethyl ether, methyl phenyl ether, dimethoxymethane, diether acetal, propylene oxide, dioxane, dimethyl dioxane , Trioxane, dioxolane, methyldioxolane, tetrahydrofuran, tetrahydropyran and the like.

  Examples of ketones include acetone, methyl ethyl ketone, methyl propyl ketone, diethyl ketone, methyl butyl ketone, methyl isobutyl ketone, ethyl propyl ketone, ethyl butyl ketone, dipropyl ketone, dibutyl ketone, diisobutyl keron, methyl pentyl ketone, methyl hexyl. Ketone, ethyl pentyl ketone, propyl butyl ketone, ethyl hexyl ketone, propyl pentyl ketone, propyl hexyl ketone, butyl pentyl ketone, butyl hexyl ketone, dipentyl ketone, pentyl hexyl ketone, dihexyl ketone, methyl isobutenyl ketone, diacetone alcohol, cyclohexane Pentanone, cyclohexanone, methylcyclohexanone, methyl phenyl ketone, isophorone, acetylacetone, acetonyl Acetone and the like.

  Examples of esters include methyl formate, ethyl formate, butyl formate, pentyl formate, methyl acetate, ethyl acetate, propyl acetate, isopropyl acetate, butyl acetate, isobutyl acetate, pentyl acetate, hexyl acetate, cyclohexyl acetate, phenyl acetate, propion Methyl acetate, ethyl propionate, propyl propionate, butyl propionate, pentyl propionate, methyl butyrate, ethyl butyrate, butyl butyrate, pentyl butyrate, ethyl crotonate, butyl crotonate, methyl benzoate, ethyl benzoate, benzyl benzoate , Methyl lactate, ethyl lactate, propyl lactate, butyl lactate, pentyl lactate, hexyl lactate, cyclohexyl lactate, methyl salicylate, ethyl salicylate, ethylene glycol monomethyl ether acetate, ethylene glycol Ethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, triethylene glycol monomethyl ether acetate, methoxybutyl acetate, dimethyl oxalate, diethyl oxalate, dimethyl malonate, diethyl malonate, dimethyl maleate Diethyl maleate, γ-butyrolactone, γ-valerolactone, ethylene carbonate, propylene carbonate, dimethyl carbonate, diethyl carbonate and the like.

  Examples of amides include N, N-dimethylformamide, N, N-dimethylacetamide, N-methyl-2-pyrrolidone and the like.

  In addition, methyl carbamate, ethyl carbamate, tetramethyl urea, 1,3-dimethyl-2-imidazolidinone, dimethyl sulfoxide, sulfolane, acetonitrile and the like may be contained.

Among the above solvents, a solvent having a solubility parameter of 17.0 (MPa) ^1/2 or less and compatible with a liquid having a boiling point in the range of 210 to 270 ° C. is particularly preferable.

The size of the liquid bubbles is closely related to the boiling point of the solvent having a solubility parameter exceeding 17.0 (MPa) ^1/2 and the ambient temperature when the heat-sensitive layer composition solution is applied. As a solvent having a solubility parameter exceeding 17.0 (MPa) ^1/2 , when a low-boiling solvent that easily evaporates at the ambient temperature when applying the heat-sensitive layer composition solution is used, the low-boiling solvent is quickly used. In order to evaporate and dry before the adjacent liquid bubble forming components gather, small liquid bubbles are formed in the heat sensitive layer. On the other hand, when a high-boiling solvent that does not easily evaporate at the ambient temperature when applying the heat-sensitive layer composition solution is used, the high-boiling solvent evaporates slowly and dries while the adjacent liquid bubble forming components gather. Large liquid bubbles are formed in the heat-sensitive layer.

In the solvent having the solubility parameter exceeding 17.0 (MPa) ^1/2 , the solvent having a boiling point of 30 to 200 ° C. is preferably 80% by weight or more, and more preferably 95% by weight or more. Moreover, it is more preferable to contain 80 weight% or more of solvent with a boiling point of 80 degrees C or less, and it is more preferable to contain 95 weight% or more. Moreover, it is more preferable to contain 80 weight% or more of solvent with a boiling point of 70 degrees C or less, and it is more preferable to contain 95 weight% or more. By containing 80% by weight or more of a solvent having a boiling point of 30 ° C. or higher, a stable coating solution can be easily prepared at room temperature without using a special cooling device. Further, by containing 80% by weight or more of a solvent having a boiling point of 200 ° C. or less, it can be easily removed from the heat-sensitive layer by drying described later.

Further, when the boiling point of the solvent having a solubility parameter exceeding 17.0 (MPa) ^1/2 is lower than the thermal softening point of the polymer having active hydrogen, it is advantageous for the formation of liquid bubbles.

The heat-sensitive layer composition solution has the above-mentioned heat-sensitive layer components and solubility parameter of 17.0 (MPa) ^1/2 or less, a solvent having a boiling point in the range of 210 to 270 ° C., and a solubility parameter of 17.0. (MPa) ^Contains more than ^1/2 solvent and other components as required. The concentration of the total solid content in the heat-sensitive layer composition solution is preferably 2 to 50% by weight.

  The heat-sensitive layer composition solution may be applied directly on the substrate, or if necessary, a heat-sensitive layer composition solution may be applied after a resin layer such as a heat insulating layer is laminated on the substrate. It is preferable to degrease the coated surface of the substrate.

  Examples of coating devices include slit die coaters, direct gravure coaters, offset gravure coaters, reverse roll coaters, natural roll coaters, air knife coaters, roll blade coaters, variver roll blade coaters, two stream coaters, rod coaters, and dip coaters. , Curtain coater, spin coater and the like. A slit die coater, a gravure coater, and a roll coater are particularly preferable in terms of coating film accuracy, productivity, and cost.

The coating weight of the heat-sensitive layer composition solution is suitably in the range of 0.1 to 10 g / m ² in terms of weight after drying from the viewpoint that the printing durability of the printing plate and the diluting solvent easily evaporate and is excellent in productivity. Is in the range of 0.5-7 g / m ² .

  Next, the step (b) of forming the heat sensitive layer by drying the heat sensitive layer composition solution will be described. Drying of the heat-sensitive layer composition solution is performed without heating or under heating. In the case of heating, it is preferable to dry at a temperature of 30 to 190 ° C., more preferably 50 to 150 ° C. for 30 seconds to 5 minutes using a hot air dryer or an infrared dryer.

  Next, (c) a step of applying a silicone rubber layer composition on the heat-sensitive layer to form a silicone rubber layer, (d) a step of applying a silicone rubber layer composition solution on the heat-sensitive layer, and (e) A process of drying the silicone rubber composition solution to form a silicone rubber layer will be described. Here, the silicone rubber layer composition is a solventless liquid composed of a material forming the silicone rubber layer, and the silicone rubber layer composition solution is a dilute solution containing the silicone rubber layer composition and a solvent. .

Examples of the solvent used in the dispersion of the colored pigment and the silicone rubber layer composition solution include aliphatic saturated hydrocarbons, aliphatic unsaturated hydrocarbons, alicyclic hydrocarbons, halogenated hydrocarbons, ethers, and the like. It is done. The solubility parameter of these solvents is preferably 17.0 (MPa) ^1/2 or less, and more preferably 15.5 (MPa) ^1/2 or less. For example, hexane, heptane, octane, nonane, decane, undecane, dodecane, isooctane, “Isopar” C, “Isopar” E, “Isopar” G, “Isopar” H, “Isopar” K, “Isopar” L, “Isopar” "Molecular saturated hydrocarbons such as M (manufactured by Exxon Chemical Co., Ltd.), aliphatic unsaturated hydrocarbons such as hexene, heptene, octene, nonene and decene, and alicyclic hydrocarbons such as cyclopentane, cyclohexane and methylcyclohexane And halogenated hydrocarbons such as trifluorotrichloroethane, ethers such as diethyl ether, diisopropyl ether, and diisobutyl ether. Two or more of these may be used. From the viewpoints of economy and safety, aliphatic and alicyclic hydrocarbons are preferred. These aliphatic and alicyclic hydrocarbons preferably have 4 to 20 carbon atoms, and more preferably 6 to 15 carbon atoms.

  Below, the specific preparation method of (i) silicone rubber layer composition and (ii) silicone rubber layer composition solution is described.

(I) Silicone rubber layer composition (solvent-free)
For example, a silicone paste is obtained by uniformly dispersing and mixing a hydroxyl or vinyl group-containing organopolysiloxane and, if necessary, a colored pigment, a pigment dispersant, and fine particles with a disperser. Examples of the disperser include three rolls, a ball mill, a bead mill, a sand mill, a disperser, a homogenizer, an attritor, and an ultrasonic disperser. In the resulting silicone paste, add a cross-linking agent, reaction catalyst, and other additives (reaction inhibitor, etc.) as necessary. Stir to homogenize the components and remove air bubbles mixed in the liquid. By removing, a silicone rubber layer composition is obtained. The defoaming may be natural defoaming or vacuum defoaming, but vacuum defoaming is more preferable.

(Ii) Silicone rubber layer composition solution (containing solvent)
For example, a silicone paste is obtained by uniformly dispersing and mixing a hydroxyl group or vinyl group-containing organopolysiloxane and, if necessary, a colored pigment, a pigment dispersant, and fine particles with the above-described disperser, and this is diluted with a solvent while stirring. . It is preferable to filter this using a general filter such as paper, plastic, or glass to remove impurities (such as giant particles of colored pigment that are not sufficiently dispersed) in the diluent. It is preferable to remove the water in the system by bubbling with dry air, dry nitrogen or the like from the diluted solution after filtration. Add the cross-linking agent, reaction catalyst, and other additives (such as reaction inhibitors) as necessary to the diluted liquid after sufficient water removal, and stir it to make the components uniform. Remove foam. Defoaming may be natural defoaming or vacuum defoaming.

  Further, as another method for producing a silicone rubber layer composition solution containing a colored pigment, there is a method in which a colored pigment dispersion and a silicone liquid or a silicone dilution liquid are separately prepared in advance, and then both liquids are mixed. Can be mentioned. The colored pigment dispersion is obtained by adding a colored pigment and, if necessary, fine particles to a solution containing at least a pigment dispersant and a solvent, and uniformly dispersing and mixing them with the above-described disperser. On the other hand, the silicone liquid is obtained by mixing a hydroxyl group or vinyl group-containing organopolysiloxane, a crosslinking agent, a reaction catalyst, and other additives (such as a reaction inhibitor) as necessary. Moreover, a silicone dilution liquid can be obtained by diluting the obtained silicone liquid with a solvent.

  When applying the silicone rubber layer composition or the silicone rubber layer composition solution, it is preferable from the viewpoint of adhesiveness to remove moisture adhering to the surface of the heat sensitive layer as much as possible. Specifically, a method in which the silicone rubber layer composition or the silicone rubber layer composition solution is applied in a space in which moisture is removed by filling or continuously supplying a dry gas can be mentioned.

  When the silicone rubber layer composition solution is applied, the silicone rubber layer composition solution is then dried to form a silicone rubber layer. You may heat-process for drying and hardening. The silicone rubber layer composition and the silicone rubber layer composition solution are preferably heated immediately after application from the viewpoint of curability and heat-sensitive layer adhesion.

  On the obtained direct-drawing waterless lithographic printing plate precursor, it is preferable to provide a protective film and / or slip paper for storage from the viewpoint of plate surface protection.

  Next, a method for producing a waterless planographic printing plate from the direct-drawing waterless planographic printing plate precursor of the present invention will be described. Here, the waterless lithographic printing plate is a printing plate having a silicone rubber layer pattern as an ink repellent layer on the surface, wherein the silicone rubber layer pattern is defined as a non-image area and a portion without a silicone rubber layer. Used as a printing method in which ink is applied only to the image area using the difference in ink adhesion between the non-image area and the image area, and then the ink is transferred to the printing medium such as paper. Printed version. The method for producing a waterless lithographic printing plate comprises a step of exposing the direct-drawing waterless lithographic printing plate precursor of the present invention according to an image with a laser beam (exposure step), and exposing the exposed direct-drawing waterless lithographic printing plate precursor to water. Alternatively, it includes a step (developing step) of rubbing in the presence of a liquid obtained by adding a surfactant to water to remove the silicone rubber layer in the exposed portion.

  First, the exposure process will be described. The direct-drawing waterless lithographic printing plate precursor of the present invention is exposed according to an image by a laser beam scanned by digital data. When the direct-drawing waterless lithographic printing plate precursor has a protective film, it is preferable to expose after peeling off the protective film. Examples of the laser light source used in the exposure step include those having an emission wavelength region in the range of 700 to 1500 nm. Among these, a semiconductor laser or a YAG laser having an emission wavelength region in the vicinity of the near infrared region is preferably used. Specifically, from the viewpoint of handling of the plate material in a bright room, 780 nm, 830 nm, and 1064 nm. A laser beam having a wavelength is preferably used for exposure.

  Next, the development process will be described. The exposed original plate is rubbed in the presence of water or a solution obtained by adding a surfactant to water (hereinafter referred to as developer) to remove the silicone rubber layer in the exposed area. As the friction treatment, (i) for example, a method of wiping the plate surface with a non-woven fabric impregnated with a developer, absorbent cotton, cloth, sponge, etc., (ii) a rotating brush while pre-treating the plate surface with a developer and showering tap water, etc. (Iii) A method of jetting high-pressure water, hot water, or water vapor onto the plate surface.

  Prior to development, a pretreatment in which a plate is immersed in a pretreatment solution for a certain time may be performed. As the pretreatment liquid, for example, water or water added with a polar solvent such as alcohol, ketone, ester or carboxylic acid, polar solvent such as aliphatic hydrocarbons, aromatic hydrocarbons, etc. A solvent added or a polar solvent is used. In addition, a known surfactant can be freely added to the developer composition. As the surfactant, those having a pH of 5 to 8 when made into an aqueous solution are preferable from the viewpoints of safety and cost for disposal. The content of the surfactant is preferably 10% by weight or less of the developer. Such a developer has high safety and is preferable from the viewpoint of economy such as disposal cost. Furthermore, it is preferable to use a glycol compound or glycol ether compound as a main component, and it is more preferable that an amine compound coexists.

  Examples of the pretreatment liquid and the developer are described in JP-A-63-179361, JP-A-4-163557, JP-A-4-343360, JP-A-9-34132, and JP-A-3716429. Further, a pretreatment liquid and a developer can be used. Specific examples of the pretreatment liquid include PP-1, PP-3, PP-F, PP-FII, PTS-1, PH-7N, CP-1, NP-1, DP-1 (all of which are Toray Industries, Inc. ) Made).

  In addition, for the purpose of improving the visibility of the image area and the measurement accuracy of the halftone dots, dyes such as crystal violet, Victoria pure blue, and Astrazone red are added to these developers to develop ink reception at the same time as the development. The layer can also be dyed. Furthermore, it can also dye | stain with the liquid which added said dye after image development.

  Part or all of the development process can be automatically performed by an automatic developing machine. As an automatic processor, a device having only a developing unit, a preprocessing unit, a device in which a developing unit is provided in this order, a preprocessing unit, a developing unit, a device in which a post-processing unit is provided in this order, a preprocessing unit, a developing unit, The apparatus etc. which were provided with the post-processing part and the water washing part in this order can be used. Specific examples of such an automatic processor include TWL-650 series, TWL-860 series, TWL-1160 series (all manufactured by Toray Industries, Inc.), JP-A-4-2265, and JP-A-5- Examples thereof include automatic developing machines disclosed in Japanese Patent No. 2272, Japanese Patent Application Laid-Open No. 5-6000, and the like, and these can be used alone or in combination.

  When the development-processed waterless planographic printing plates are stacked and stored, it is preferable to sandwich a slip sheet between the plates for the purpose of protecting the plate surface.

  Hereinafter, the present invention will be described in more detail with reference to examples.

<Preparation of non-photosensitive particle dispersion>
A bead mill “Star Mill” Minizea (manufactured by Ashizawa Finetech Co., Ltd.) filled with zirconia beads (φ0.3 mm) at room temperature with a mixture of methyl ethyl ketone (80 wt%) and non-photosensitive particles (20 wt%) To obtain a non-photosensitive particle dispersion.

<Evaluation method in each example and comparative example>
(1) CV value of non-photosensitive particles A sample obtained by adhering a small amount of non-photosensitive particles of powder (solvent-free) on a slide glass was subjected to an optical microscope: “ECLIPSE” L200 (manufactured by Nikon Corporation, transmission mode, Digital camera connected to objective lens: “CFI LU Plan Apo EPI” 150 × (made by Nikon Corporation): “DXM” 1200F (made by Nikon Corporation) was photographed (total magnification on monitor: 3000 times), the average particle size and standard deviation of the non-photosensitive particles were measured by image analysis measurement software: “WinROOF” (manufactured by Mitani Corporation). The CV value was calculated from the following formula.
CV value [%] = (standard deviation / average particle size) × 100
(2) TEM observation of direct-drawing waterless lithographic printing plate precursor A sample was prepared from the direct-drawing waterless lithographic printing plate precursor before laser irradiation by an ultrathin section method, and a transmission electron microscope H-1700FA type (manufactured by Hitachi) ) Was used to observe the heat-sensitive layer and the silicone rubber layer of the direct-drawing waterless planographic printing plate precursor at an acceleration voltage of 100 kV and a magnification of 2000 times (only liquid bubble observation was 8000 times). Average film thickness of heat-sensitive layer, average particle size of non-photosensitive particles and in-plane occupation ratio of non-photosensitive particles, area ratio of heat-sensitive layer surface of film thickness reduced area, area ratio of heat-sensitive layer surface of inclined area, The number, average diameter, and average film thickness of the silicone rubber layer were measured by the methods described below.

(2-1) Average film thickness of heat-sensitive layer In a TEM photograph of a vertical section of a direct-drawing waterless lithographic printing plate precursor obtained by an ultra-thin slice method, the heat-sensitive portion of a smooth portion without the presence of non-photosensitive particles The film thickness was measured for the layers (10 randomly selected locations), and the number average value was taken as the average film thickness of the heat-sensitive layer.

(2-2) Average particle size and in-plane occupancy of non-photosensitive particles Non-photosensitive from the three-dimensional information of the horizontal section of the direct-drawing waterless planographic printing plate precursor obtained by the continuous (ultra-thin) section method The average particle size and in-plane occupancy of the particles were calculated. The particle size (equivalent volume sphere equivalent diameter) of 50 randomly selected non-photosensitive particles was measured, and the number average value was taken as the average particle size. Further, the ratio of the non-photosensitive particles in the unit area was defined as the in-plane occupation ratio (area%) of the non-photosensitive particles.
(Example of in-plane occupancy ratio of non-photosensitive particles)
Total horizontal cross section: 100 μm ²
Number of non-photosensitive particles: 20 Average particle diameter of non-photosensitive particles: 1 μm (radius: 0.5 μm)
Non-photosensitive particle occupancy = 100 × π (0.5 <μm>) ² × 20 <piece> / 100 <μm ² > = 15.7 <area%>
(2-3) Area ratio of the film thickness reduction region to the surface of the heat-sensitive layer Three-dimensional information on the vertical and horizontal cross sections of the direct-drawing waterless planographic printing plate precursor obtained by the continuous (ultra-thin) section method The area ratio to the heat-sensitive layer surface of the film thickness reduction region where the film thickness of the heat-sensitive layer from the heat-sensitive layer surface facing the silicone rubber layer is reduced to 0.1 μm or less by analyzing using the original display / analysis software Was measured.

(2-4) Area ratio of inclined region to heat-sensitive layer surface Existing 3D display of 3D information of vertical and horizontal sections of direct-drawing waterless planographic printing plate precursor obtained by continuous (ultra-thin) section method -By analyzing using analysis software, the area ratio with respect to the thermosensitive layer surface of the inclined area which is a planar area | region which has a gradient of 10 degree | times or more, comprised the protruding structure, and was continuous at least partially was measured.

(2-5) Number of liquid bubbles In the three-dimensional information of the horizontal section of the direct-drawing waterless lithographic printing plate precursor obtained by the continuous (ultra-thin) section method, the depth from the interface with the silicone rubber layer to 0.5 μm in depth Liquid bubbles (diameter: 0.01 μm) in the heat-sensitive layer 0.5 μm ³ ((longitudinal) 1 μm × (horizontal) 1 μm × (depth from the interface with the silicone rubber layer) 0.5 μm) in the part where non-photosensitive particles are not present The total number of the above was counted. The liquid bubbles on the line defining the observation area were counted when more than half of the volume of the liquid bubbles was in the observation area, and were not counted when less than half.

(2-6) Liquid Bubble Average Diameter The average diameter of the liquid bubbles was calculated from the three-dimensional information of the horizontal section of the direct-drawing waterless lithographic printing plate precursor obtained by the continuous (ultra-thin) section method. The diameters of 50 liquid bubbles selected at random from the heat-sensitive layer where no non-photosensitive particles are present were measured, and the number average value was taken as the average diameter.

(2-7) Average thickness of silicone rubber layer In a TEM photograph of a vertical section of a direct-drawing waterless lithographic printing plate precursor obtained by an ultrathin section method, a smooth portion without non-photosensitive particles is present. The film thickness was measured for the silicone rubber layer (10 randomly selected locations) on the heat sensitive layer, and the number average value was taken as the average film thickness of the silicone rubber layer.

(3) Analysis of liquid bubbles (3-1) Pretreatment to gas chromatograph / mass measurement A directly drawn waterless lithographic printing plate precursor cut into 1 cm ² (1 × 1 cm square) is collected in a heating glass container, and then nitrogen is added. The generated gas when heated at 320 ° C. for 20 minutes while aeration of gas (flow rate: 100 ml / min) was collected in an adsorption tube (for JTD505II). This adsorption tube was heated at 320 ° C. for 15 minutes, and the thermally desorbed gas component was analyzed by gas chromatography / mass measurement. A glass container was analyzed under the same conditions as a blank.

(3-2) Gas chromatograph / mass measurement condition Thermal desorption apparatus: JTD505II type (manufactured by Nippon Analytical Industries, Ltd.)
Secondary heat desorption temperature: 340 ° C., 180 seconds Gas chromatograph apparatus: HP5890 (manufactured by Hewlett Packard)
Column: DB-5 (manufactured by J & W)
30m × 0.25mmID, film thickness 0.5μm, US7119416H
Column temperature: 40 ° C. (4 minutes) → 340 ° C. (heating rate: 10 ° C./min)
Mass measuring device: JMS-SX102A mass spectrometer (manufactured by JEOL Ltd.)
Ionization method: EI
Scanning range: m / z 10-500 (1.2 seconds / scan)
TIC mass range: m / z 29-500
(3-3) Preparation of calibration curve A solvent having a solubility parameter of 17.0 (MPa) ^1/2 or less used in each Example and Comparative Example was collected in a measuring flask, and a standard solution (3375 μg / ml, 5095 μg / ml) was collected. 30265 μg / ml). From each of these standard solutions, 1 μl was sampled and analyzed under the same conditions as the sample. The absolute amount of the solvent having an injected solubility parameter of 17.0 (MPa) ^1/2 or less and a gas chromatograph / mass measurement total ion chromatogram A calibration curve was created from the relationship of peak areas.

(4) Evaluation of sensitivity and blistering resistance (4-1) Evaluation of blistering resistance maximum exposure amount The obtained direct-drawing waterless planographic printing plate precursor (1030 × 800 mm) was used as an exposure machine “PlateRite” 8800E (large The product was mounted on Nippon Screen Manufacturing Co., Ltd., and was exposed at an irradiation energy of 80 mJ / cm ² . The surface of the full exposure plate discharged from the exposure machine was visually observed to evaluate whether the silicone rubber layer was lifted. If the silicone rubber layer was not lifted, the irradiation energy was increased by 10 mJ / cm ^{2 and} the same evaluation was performed until the silicone rubber layer was lifted. The exposure amount was defined as the maximum amount of blistering resistance.

(4-2) Evaluation of minimum exposure amount for solid reproduction Using the automatic developing machine “TWL-1160F” (manufactured by Toray Industries, Inc.), the entire surface exposure plate obtained by the method described in (4-1) above, Development was performed under conditions of pretreatment liquid: none, developer: tap water (room temperature), post-treatment liquid: tap water (room temperature), and plate speed: 80 cm / min. The obtained printing plate was visually observed, and the lowest exposure amount at which the silicone rubber layer of the entire exposed portion was completely peeled was defined as the solid reproduction minimum exposure amount.

(4-3) Latitude The latitude was calculated by the following equation from the maximum blistering resistance exposure and the solid reproduction minimum exposure obtained by the above method.
Latitude (mJ / cm ² ) = Maximum exposure amount to withstand blistering (mJ / cm ² ) −Lowest solid reproduction minimum exposure amount (mJ / cm ² )
(5) Evaluation of scumming in non-image area The direct drawing type waterless lithographic printing plate precursor is mounted on a printing machine: “OLIVER” 466SD (manufactured by Sakurai Graphic Systems Co., Ltd.), and ink: “Aquares Echo” (Registered trademark) Neo (manufactured by Toyo Ink Manufacturing Co., Ltd.) was used to print on high-quality paper under the conditions of the plate surface temperature: 27 ° C. and the printing speed: 10,000 sheets / hour. When the obtained printed matter is visually observed, no stain is found (score: ◯), poor if the stain is partially recognized (score: △), and if the stain is found on the entire surface. It was evaluated as bad (score: x).

(6) Evaluation of dispersion stability of non-photosensitive particles in the heat-sensitive layer composition solution The heat-sensitive layer composition solution in which the non-photosensitive particles are dispersed is placed in a sealed container and allowed to stand for 1 hour, in the heat-sensitive layer composition solution. The dispersion stability of the non-photosensitive particles was evaluated. When the container after 1 hour has been slowly turned over, if no non-photosensitive particles are precipitated at the bottom, the dispersion stability is good (score: ○), and non-photosensitive particles are precipitated. Was evaluated as bad (score: x).

Example 1
The following heat insulating layer composition solution was applied onto a 0.24 mm thick degreased aluminum substrate (Mitsubishi Aluminum Co., Ltd.) and dried at 200 ° C. for 90 seconds to provide a heat insulating layer having a thickness of 6.0 μm. In addition, the heat insulation layer composition solution was obtained by stirring and mixing the following components at room temperature.

<Insulation layer composition solution>
(A) Polymer having active hydrogen: Epoxy resin: “Epicoat” (registered trademark) 1010 (manufactured by Japan Epoxy Resin Co., Ltd.): 35 parts by weight (b) Polymer having active hydrogen: Polyurethane: “Samprene” (registered trademark) ) LQ-T1331D (manufactured by Sanyo Chemical Industries, solid content concentration: 20% by weight): 375 parts by weight (c) Aluminum chelate: “aluminum chelate” ALCH-TR (manufactured by Kawaken Fine Chemical Co., Ltd.): 10 weight Part (d) Leveling agent: “Disparon” (registered trademark) LC951 (manufactured by Enomoto Kasei Co., Ltd., solid content: 10% by weight): 1 part by weight (e) Titanium oxide: “Typaque” (registered trademark) CR-50 N, N-dimethylformamide dispersion (Ishihara Sangyo Co., Ltd.) (titanium oxide 50% by weight): 60 parts by weight (f) N, N-dimethylformamide: 30 parts by weight (g) Methyl ethyl ketone: 250 parts by weight Subsequently, by applying the heat-sensitive layer composition solution -1 below on the heat insulating layer, and heated for 30 seconds at 120 ° C., was provided a heat-sensitive layer. The heat sensitive layer composition solution-1 was obtained by stirring and mixing the following components at room temperature.

<Thermosensitive layer composition solution-1>
(A) Infrared absorbing dye: “PROJET” 825LDI (manufactured by Avecia): 6.6 parts by weight (b) Organic complex compound: titanium di-n-butoxide bis (acetylacetonate): “Narsem” (registered trademark) titanium (Nippon Chemical Industry Co., Ltd., concentration: 73 wt%, n-butanol as a solvent (boiling point: 117 ° C., solubility parameter: 23.3 (MPa) ^1/2 ): 27 wt% included): 7.3 Part by weight (c) Phenol formaldehyde novolak resin: “Sumilite Resin” (registered trademark) PR50731 (manufactured by Sumitomo Bakelite Co., Ltd., thermal softening point: 95 ° C.): 49.5 parts by weight (d) Polyurethane: “Nipporan” ( Registered trademark) 5196 (manufactured by Nippon Polyurethane Co., Ltd., concentration: 30% by weight, methyl ethyl ketone as a solvent (boiling point: 80 ° C., solubility buffer) Meter: 19.0 ^(MPa) 1/2): 35 wt%, cyclohexanone (boiling point: 155 ° C., solubility parameter: 20.3 ^(MPa) 1/2): containing 35% by weight): 13.2 parts by weight (E) Non-photosensitive crosslinked acrylic resin particle dispersion: “Liosphere” (registered trademark) RSP3021 (manufactured by Toyo Ink Co., Ltd., average particle size: 0.6 μm, CV value: 18.9%, specific gravity: 1 .20, concentration: 20% by weight, methyl ethyl ketone as a dispersion medium: 80% by weight): 15.0 parts by weight (f) tetrahydrofuran (boiling point: 66 ° C., solubility parameter: 18.6 (MPa) ^1/2 ): 1401.8 parts by weight (g) A liquid having a solubility parameter of 17.0 (MPa) ^1/2 or less and a boiling point in the range of 210 to 270 ° C .: aliphatic saturated hydrocarbon: “iso Par "(registered trademark) M (manufactured by Esso Chemical Co., Ltd., boiling point: 223-254 ° C., solubility parameter: 14.7 (MPa) ^1/2 ): 6.6 parts by weight Solid content of the thermosensitive layer composition solution The concentration is 4.6% by weight, the solubility parameter is 17.0 (MPa) ^1/2 or less, and the content of a liquid having a boiling point in the range of 210 to 270 ° C. is 0.44% by weight.

  Next, the following silicone rubber layer composition solution prepared immediately before coating is applied on the heat-sensitive layer, heated at 130 ° C. for 90 seconds, and provided with a 1.8 μm thick silicone rubber layer, thereby providing a direct-drawing waterless lithographic plate. A printing plate master was obtained.

<Silicone rubber layer composition solution>
A bitumen dispersion was obtained by dispersing the following (a) to (c) with a bead mill “Star Mill” (registered trademark) Minizea (manufactured by Ashizawa Finetech Co., Ltd.) filled with zirconia beads (φ0.3 mm). . On the other hand, a silicone diluent was obtained by mixing (d) to (h). While stirring the bitumen dispersion, the silicone diluent was added and stirred well until uniform. The resulting liquid was naturally degassed.
(A) N650 bitumen (manufactured by Dainichi Seika Co., Ltd.): 4 parts by weight
(B) "Plenact" (registered trademark) KR-TTS (Ajinomoto Fine Techno Co., Ltd.): 1.5 parts by weight (c) "Isopar" G (Esso Chemical Co., Ltd.): 83 parts by weight (d) α, ω-divinylpolydimethylsiloxane: “DMS” V52 (weight average molecular weight 155000, manufactured by GELEST Inc.): 83 parts by weight (e) methylhydrogensiloxane “SH” 1107 (manufactured by Toray Dow Corning Co., Ltd.): 4 Part by weight (f) Vinyltris (methylethylketooxyimino) silane: 3 parts by weight (g) Platinum catalyst “SRX” 212 (manufactured by Toray Dow Corning): 6 parts by weight (h) “Isopar” E (Esso Chemical Co., Ltd.) )): 817 parts by weight The obtained direct-drawing waterless lithographic printing plate precursor was subjected to TEM observation by the above-mentioned method. Average particle size of the non-photosensitive particles is 0.6 .mu.m, the average thickness of the heat-sensitive layer of the non-photosensitive particles is no portion was 0.5 [mu] m. The in-plane occupation ratio of the non-photosensitive particles was 5.0 area%. In addition, 42 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ where no non-photosensitive particles were present, and the average diameter of the liquid bubbles was 0.15 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as gas was 5.34 μg. there were.

Resistant highest exposure blister fire was evaluated by the method 160 mJ / cm ^2, solid reproducibility minimum exposure amount was 140 mJ / cm ^2, had a latitude of 20 mJ / cm ^2. When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

(Example 2)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-2.

<Thermosensitive layer composition solution-2>
(A) "PROJET" 825LDI: 6.6 parts by weight (b) "Narsem" titanium: 7.3 parts by weight (c) "Sumilite resin" PR50731: 49.5 parts by weight (d) "Nipporan" 5196: 13 .2 parts by weight (e) Non-photosensitive crosslinked acrylic resin particle dispersion: “Liosphere” RSP3015 (manufactured by Toyo Ink Co., Ltd., average particle size: 1.4 μm, CV value: 3.5%, specific gravity: 1 .20, concentration: 20% by weight, including methyl ethyl ketone as dispersion medium: 80% by weight): 35.0 parts by weight (f) tetrahydrofuran: 1381.8 parts by weight (g) “Isopar” M: 6.6 parts by weight The solid content concentration of the thermosensitive layer composition solution is 4.8% by weight, the solubility parameter is 17.0 (MPa) ^1/2 or less, and the content of the liquid having a boiling point in the range of 210 to 270 ° C. is 0. .44% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 1.4 μm, and the average film thickness of the heat-sensitive layer in the portion without the non-photosensitive particles was It was 0.5 μm. The in-plane occupation ratio of the non-photosensitive particles was 5.0 area%. Moreover, the area ratio with respect to the heat sensitive layer surface of a film thickness reduction area | region was 5.0 area%, and the area ratio with respect to the heat sensitive layer surface of an inclination area | region was 4.6 area%. In addition, 44 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ where no non-photosensitive particles were present, and the average diameter of the liquid bubbles was 0.15 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as gas was 5.39 μg. there were.

The maximum blister-proof exposure dose evaluated by the above method was 180 mJ / cm ² , the solid reproduction minimum exposure dose was 140 mJ / cm ² , and had a latitude of 40 mJ / cm ² . When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

(Example 3)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-3.

<Thermosensitive layer composition solution-3>
(A) "PROJET" 825LDI: 6.6 parts by weight (b) "Narsem" titanium: 7.3 parts by weight (c) "Sumilite resin" PR50731: 49.5 parts by weight (d) "Nipporan" 5196: 13 .2 parts by weight (e) Non-photosensitive crosslinked acrylic resin particle dispersion: “Lyosphere” RSP3031 (manufactured by Toyo Ink Manufacturing Co., Ltd., average particle size: 1.7 μm, CV value: 2.9%, specific gravity: 1 .20, concentration: 20% by weight, including methyl ethyl ketone as a dispersion medium: 80% by weight): 42.5 parts by weight (f) Tetrahydrofuran: 1374.3 parts by weight (g) “Isopar” M: 6.6 parts by weight The solid content concentration of the thermosensitive layer composition solution is 4.9% by weight, the solubility parameter is 17.0 (MPa) ^1/2 or less, and the content of the liquid having a boiling point in the range of 210 to 270 ° C. is 0. .44% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 1.7 μm, and the average film thickness of the heat-sensitive layer in the portion without the non-photosensitive particles was It was 0.5 μm. The in-plane occupation ratio of the non-photosensitive particles was 5.0 area%. Moreover, the area ratio with respect to the heat sensitive layer surface of a film thickness reduction area | region was 5.0 area%, and the area ratio with respect to the heat sensitive layer surface of an inclination area | region was 4.2 area%. In addition, 41 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ in a portion where non-photosensitive particles were not present, and the average diameter of the liquid bubbles was 0.15 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as a gas was 5.30 μg. there were.

The maximum blister-proof exposure dose evaluated by the above method was 180 mJ / cm ² , the solid reproduction minimum exposure dose was 140 mJ / cm ² , and had a latitude of 40 mJ / cm ² . When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

Example 4
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-4.

<Thermosensitive layer composition solution-4>
(A) "PROJET" 825LDI: 6.6 parts by weight (b) "Narsem" titanium: 7.3 parts by weight (c) "Sumilite resin" PR50731: 49.5 parts by weight (d) "Nipporan" 5196: 13 .2 parts by weight (e) Non-photosensitive crosslinked acrylic resin particle dispersion: “Lyosphere” RSP3019 (manufactured by Toyo Ink Co., Ltd., average particle size: 2.1 μm, CV value: 2.3%, specific gravity: 1 .20, concentration: 20% by weight, including methyl ethyl ketone as dispersion medium: 80% by weight): 52.5 parts by weight (f) Tetrahydrofuran: 1364.3 parts by weight (g) “Isopar” M: 6.6 parts by weight The solid content concentration of the thermosensitive layer composition solution is 5.1 wt%, the solubility parameter is 17.0 (MPa) ^1/2 or less, and the content of the liquid having a boiling point in the range of 210 to 270 ° C. is 0. .44% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 2.1 μm, and the average film thickness of the heat-sensitive layer in the portion without the non-photosensitive particles was It was 0.5 μm. The in-plane occupation ratio of the non-photosensitive particles was 5.0 area%. Moreover, the area ratio with respect to the thermosensitive layer surface of a film thickness reduction area | region was 5.0 area%, and the area ratio with respect to the thermosensitive layer surface of an inclination area | region was 3.6 area%. In addition, 40 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ where no non-photosensitive particles were present, and the average diameter of the liquid bubbles was 0.16 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as gas was 5.48 μg. there were.

The maximum blister-proof exposure dose evaluated by the above method was 180 mJ / cm ² , the solid reproduction minimum exposure dose was 140 mJ / cm ² , and had a latitude of 40 mJ / cm ² . When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

(Example 5)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-5.

<Thermosensitive layer composition solution-5>
(A) "PROJET" 825LDI: 6.6 parts by weight (b) "Narsem" titanium: 7.3 parts by weight (c) "Sumilite resin" PR50731: 49.5 parts by weight (d) "Nipporan" 5196: 13 .2 parts by weight (e) Non-photosensitive crosslinked acrylic resin particle dispersion: “Lyosphere” RSP3009 (manufactured by Toyo Ink Co., Ltd., average particle size: 2.6 μm, CV value: 1.9%, specific gravity: 1 .20, concentration: 20% by weight, methyl ethyl ketone as dispersion medium: 80% by weight): 65.0 parts by weight (f) Tetrahydrofuran: 1351.8 parts by weight (g) "Isopar" M: 6.6 parts by weight The solid content concentration of the thermosensitive layer composition solution is 5.2% by weight, the solubility parameter is 17.0 (MPa) ^1/2 or less, and the content of the liquid having a boiling point in the range of 210 to 270 ° C. is 0. .44% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 2.6 μm, and the average film thickness of the heat-sensitive layer in the portion where there was no non-photosensitive particles was It was 0.5 μm. The in-plane occupation ratio of the non-photosensitive particles was 5.0 area%. Moreover, the area ratio with respect to the heat sensitive layer surface of a film thickness reduction area | region was 5.0 area%, and the area ratio with respect to the heat sensitive layer surface of an inclination area | region was 3.1 area%. In addition, 46 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ where no non-photosensitive particles were present, and the average diameter of the liquid bubbles was 0.15 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as gas was 5.56 μg. there were.

The maximum blister-proof exposure dose evaluated by the above method was 180 mJ / cm ² , the solid reproduction minimum exposure dose was 140 mJ / cm ² , and had a latitude of 40 mJ / cm ² . When the above method was used to evaluate the background stain on the non-image area, the background was found on the entire surface of the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

(Example 6)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-6.

<Thermosensitive layer composition solution-6>
(A) "PROJET" 825LDI: 13.3 parts by weight (b) "Narsem" titanium: 14.6 parts by weight (c) "Sumilite resin" PR50731: 99.4 parts by weight (d) "Nipporan" 5196: 26 .5 parts by weight (e) Non-photosensitive silica particle dispersion: “HI-PRECICA” (registered trademark) UF-N3N (manufactured by Ube Nitto Kasei Co., Ltd., average particle size: 1.1 μm, CV value: 3.6%, Specific gravity: 2.10, Concentration: 20% by weight, including methyl ethyl ketone: 80% by weight as dispersion medium): 48.2 parts by weight (f) Tetrahydrofuran: 1284.9 parts by weight (g) “Isopar” M: 13.3 Part by weight The solid content concentration of the heat-sensitive layer composition solution is 9.4% by weight, the solubility parameter is 17.0 (MPa) ^1/2 or less, and a liquid having a boiling point in the range of 210 to 270 ° C. amount Is 0.88% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 1.1 μm, and the average film thickness of the heat-sensitive layer in the portion without the non-photosensitive particles was It was 1.0 μm. The in-plane occupation ratio of the non-photosensitive particles was 5.0 area%. In addition, 38 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ where no non-photosensitive particles were present, and the average diameter of the liquid bubbles was 0.16 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as gas was 10.72 μg. there were.

Resistant highest exposure blister fire was evaluated by the method 160 mJ / cm ^2, solid reproducibility minimum exposure amount was 130 mJ / cm ^2, had a latitude of 30 mJ / cm ^2. When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, precipitation of non-photosensitive particles was observed.

(Example 7)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-7.

<Thermosensitive layer composition solution-7>
(A) "PROJET" 825LDI: 13.3 parts by weight (b) "Narsem" titanium: 14.7 parts by weight (c) "Sumilite resin" PR50731: 100.0 parts by weight (d) "Nipporan" 5196: 26 .7 parts by weight (e) Non-photosensitive acrylic particle dispersion: “Liosphere” RSP3015: 35.0 parts by weight (f) Tetrahydrofuran: 1297.0 parts by weight (g) “Isopar” M: 13.3 parts by weight The solid content concentration of the heat-sensitive layer composition solution is 9.3% by weight, the solubility parameter is 17.0 (MPa) ^1/2 or less, and the content of the liquid having a boiling point in the range of 210 to 270 ° C. is 0. .89% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 1.4 μm, and the average film thickness of the heat-sensitive layer in the portion without the non-photosensitive particles was It was 1.0 μm. The in-plane occupation ratio of the non-photosensitive particles was 5.0 area%. Further, the area ratio of the film thickness reduction region to the surface of the heat sensitive layer was 4.6 area%, and the area ratio of the inclined region to the surface of the heat sensitive layer was 4.1 area%. In addition, 42 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ where no non-photosensitive particles were present, and the average diameter of the liquid bubbles was 0.15 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as gas was 10.63 μg. there were.

Resistant highest exposure blister fire was evaluated by the method 170 mJ / cm ^2, solid reproducibility minimum exposure amount was 130 mJ / cm ^2, had a latitude of 40 mJ / cm ^2. When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

(Example 8)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-8.

<Thermosensitive layer composition solution-8>
(A) "PROJET" 825LDI: 13.3 parts by weight (b) "Narsem" titanium: 14.7 parts by weight (c) "Sumilite resin" PR50731: 100.0 parts by weight (d) "Nipporan" 5196: 26 .7 parts by weight (e) Non-photosensitive acrylic particle dispersion: “Lyosphere” RSP3031: 42.5 parts by weight (f) Tetrahydrofuran: 1289.5 parts by weight (g) “Isopar” M: 13.3 parts by weight The solid content concentration of the heat-sensitive layer composition solution is 9.4% by weight, the solubility parameter is 17.0 (MPa) ^1/2 or less, and the content of the liquid having a boiling point in the range of 210 to 270 ° C. is 0. .89% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 1.7 μm, and the average film thickness of the heat-sensitive layer in the portion without the non-photosensitive particles was It was 1.0 μm. The in-plane occupation ratio of the non-photosensitive particles was 5.0 area%. Moreover, the area ratio with respect to the heat sensitive layer surface of a film thickness reduction area | region was 5.0 area%, and the area ratio with respect to the heat sensitive layer surface of an inclination area | region was 4.8 area%. In addition, 40 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ where no non-photosensitive particles were present, and the average diameter of the liquid bubbles was 0.15 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as gas was 10.75 μg. there were.

Resistant highest exposure blister fire was evaluated by the method 170 mJ / cm ^2, solid reproducibility minimum exposure amount was 130 mJ / cm ^2, had a latitude of 40 mJ / cm ^2. When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

Example 9
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-9.

<Thermosensitive layer composition solution-9>
(A) "PROJET" 825LDI: 16.0 parts by weight (b) "Narsem" titanium: 17.6 parts by weight (c) "Sumilite resin" PR50731: 120.0 parts by weight (d) "Nipporan" 5196: 32 0.0 part by weight (e) Non-photosensitive acrylic particle dispersion: “Liosphere” RSP3015: 35.0 parts by weight (f) Tetrahydrofuran: 1263.4 parts by weight (g) “Isopar” M: 16.0 parts by weight The solid content concentration of the thermosensitive layer composition solution is 11.0% by weight, the solubility parameter is 17.0 (MPa) ^1/2 or less, and the content of the liquid having a boiling point in the range of 210 to 270 ° C. is 1 0.07% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 1.4 μm, and the average film thickness of the heat-sensitive layer in the portion without the non-photosensitive particles was It was 1.2 μm. The in-plane occupation ratio of the non-photosensitive particles was 5.0 area%. In addition, 40 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ where no non-photosensitive particles were present, and the average diameter of the liquid bubbles was 0.16 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as a gas was 12.84 μg. there were.

Resistant highest exposure blister fire was evaluated by the method 150 mJ / cm ^2, solid reproducibility minimum exposure amount was 120 mJ / cm ^2, had a latitude of 30 mJ / cm ^2. When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

(Example 10)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-10.

<Thermosensitive layer composition solution-10>
(A) "PROJET" 825LDI: 16.0 parts by weight (b) "Narsem" titanium: 17.6 parts by weight (c) "Sumilite resin" PR50731: 120.0 parts by weight (d) "Nipporan" 5196: 32 0.0 part by weight (e) Non-photosensitive acrylic particle dispersion: “Lyosphere” RSP3031: 42.5 parts by weight (f) Tetrahydrofuran: 1255.9 parts by weight (g) “Isopar” M: 16.0 parts by weight The solid content concentration of the thermosensitive layer composition solution is 11.1% by weight, the solubility parameter is 17.0 (MPa) ^1/2 or less, and the content of a liquid having a boiling point in the range of 210 to 270 ° C. is 1 0.07% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 1.7 μm, and the average film thickness of the heat-sensitive layer in the portion without the non-photosensitive particles was It was 1.2 μm. The in-plane occupation ratio of the non-photosensitive particles was 5.0 area%. Further, the area ratio of the film thickness reduction region to the surface of the heat sensitive layer was 4.6 area%, and the area ratio of the inclined region to the surface of the heat sensitive layer was 4.2 area%. In addition, 39 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ where no non-photosensitive particles were present, and the average diameter of the liquid bubbles was 0.15 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as a gas was 12.99 μg. there were.

Resistant highest exposure blister fire was evaluated by the method 160 mJ / cm ^2, solid reproducibility minimum exposure amount was 120 mJ / cm ^2, had a latitude of 40 mJ / cm ^2. When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

(Example 11)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-11.

<Thermosensitive layer composition solution-11>
(A) "PROJET" 825LDI: 20.0 parts by weight (b) "Narsem" titanium: 22.0 parts by weight (c) "Sumilite Resin" PR50731: 150.3 parts by weight (d) "Nipporan" 5196: 40 .1 part by weight (e) Non-photosensitive crosslinked styrene resin particle dispersion: “Chemisnow” SX130H (manufactured by Soken Chemical Co., Ltd., average particle size: 1.3 μm, CV value: 5.0%, specific gravity: 1.05 Concentration: 20% by weight, including methyl ethyl ketone as a dispersion medium: 80% by weight): 28.5 parts by weight (f) Tetrahydrofuran: 1219.0 parts by weight (g) “Isopar” M: 20.0 parts by weight The solid content concentration of the composition solution is 13.6% by weight, the solubility parameter is 17.0 (MPa) ^1/2 or less, and the content of a liquid having a boiling point in the range of 210 to 270 ° C. is 1 .34% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 1.3 μm, and the average film thickness of the heat-sensitive layer in the portion without the non-photosensitive particles was It was 1.5 μm. The in-plane occupation ratio of the non-photosensitive particles was 5.0 area%. In addition, 41 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ in a portion where non-photosensitive particles were not present, and the average diameter of the liquid bubbles was 0.15 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as gas was 16.21 μg. there were.

The maximum blister-proof exposure dose evaluated by the above method was 140 mJ / cm ² , the solid reproduction minimum exposure dose was 120 mJ / cm ² , and had a latitude of 20 mJ / cm ² . When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

(Example 12)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-12.

<Thermosensitive layer composition solution-12>
(A) "PROJET" 825LDI: 20.0 parts by weight (b) "Narsem" titanium: 22.0 parts by weight (c) "Sumilite Resin" PR50731: 150.0 parts by weight (d) "Nipporan" 5196: 40 0.0 part by weight (e) Non-photosensitive crosslinked acrylic resin particle dispersion: “Liosphere” RSP3015: 35.0 parts by weight (f) Tetrahydrofuran: 1213.1 parts by weight (g) “Isopar” M: 20.0 parts by weight Part The content of a liquid having a solid content concentration of 13.7% by weight, a solubility parameter of 17.0 (MPa) ^1/2 or less, and a boiling point in the range of 210 to 270 ° C. Is 1.33% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 1.4 μm, and the average film thickness of the heat-sensitive layer in the portion without the non-photosensitive particles was It was 1.5 μm. The in-plane occupation ratio of the non-photosensitive particles was 5.0 area%. In addition, 41 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ in a portion where non-photosensitive particles were not present, and the average diameter of the liquid bubbles was 0.15 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as a gas was 16.17 μg. there were.

Resistant highest exposure blister fire was evaluated by the method 150 mJ / cm ^2, solid reproducibility minimum exposure amount was 120 mJ / cm ^2, had a latitude of 30 mJ / cm ^2. When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

(Example 13)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-13.

<Thermosensitive layer composition solution-13>
(A) "PROJET" 825LDI: 20.5 parts by weight (b) "Narsem" titanium: 22.6 parts by weight (c) "Sumilite resin" PR50731: 153.8 parts by weight (d) "Nipporan" 5196: 41 0.0 part by weight (e) Non-photosensitive crosslinked acrylic resin particle dispersion: “Lyosphere” RSP3015: 7.0 parts by weight (f) Tetrahydrofuran: 1234.6 parts by weight (g) “Isopar” M: 20.5 parts by weight Part The content of the liquid having a solid content concentration of 13.6% by weight, a solubility parameter of 17.0 (MPa) ^1/2 or less, and a boiling point in the range of 210 to 270 ° C. Is 1.37% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 1.4 μm, and the average film thickness of the heat-sensitive layer in the portion without the non-photosensitive particles was It was 1.5 μm. Further, the in-plane occupation ratio of the non-photosensitive particles was 1.0 area%. In addition, 40 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ where no non-photosensitive particles were present, and the average diameter of the liquid bubbles was 0.15 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as gas was 16.59 μg. there were.

The maximum blister-proof exposure dose evaluated by the above method was 130 mJ / cm ² , the solid reproduction minimum exposure dose was 120 mJ / cm ² , and had a latitude of 10 mJ / cm ² . When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

(Example 14)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-14.

<Thermosensitive layer composition solution-14>
(A) "PROJET" 825LDI: 19.4 parts by weight (b) "Narsem" titanium: 21.3 parts by weight (c) "Sumilite Resin" PR50731: 145.1 parts by weight (d) "Nipporan" 5196: 38 .7 parts by weight (e) Non-photosensitive crosslinked acrylic resin particle dispersion: “Lyosphere” RSP3015: 70.0 parts by weight (f) Tetrahydrofuran: 1186.2 parts by weight (g) “Isopar” M: 19.4 parts by weight Part The content of a liquid having a solid content concentration of 13.7% by weight, a solubility parameter of 17.0 (MPa) ^1/2 or less, and a boiling point in the range of 210 to 270 ° C. Is 1.29% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 1.4 μm, and the average film thickness of the heat-sensitive layer in the portion without the non-photosensitive particles was It was 1.5 μm. The in-plane occupation ratio of the non-photosensitive particles was 10.0 area%. In addition, 42 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ where no non-photosensitive particles were present, and the average diameter of the liquid bubbles was 0.15 μm. When the liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as gas was 15.65 μg. there were.

Resistant highest exposure blister fire was evaluated by the method 160 mJ / cm ^2, solid reproducibility minimum exposure amount was 130 mJ / cm ^2, had a latitude of 30 mJ / cm ^2. When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

(Example 15)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-15.

<Thermosensitive layer composition solution-15>
(A) "PROJET" 825LDI: 18.1 parts by weight (b) "Narsem" titanium: 19.9 parts by weight (c) "Sumilite Resin" PR50731: 135.5 parts by weight (d) "Nipporan" 5196: 36 .1 part by weight (e) Non-photosensitive crosslinked acrylic resin particle dispersion: “Liosphere” RSP3015: 140.0 parts by weight (f) Tetrahydrofuran: 1132.3 parts by weight (g) “Isopar” M: 18.1 parts by weight Part The content of the liquid having a solid content concentration of 13.8% by weight, a solubility parameter of 17.0 (MPa) ^1/2 or less, and a boiling point in the range of 210 to 270 ° C. Is 1.20% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 1.4 μm, and the average film thickness of the heat-sensitive layer in the portion without the non-photosensitive particles was It was 1.5 μm. The in-plane occupation ratio of the non-photosensitive particles was 20.0 area%. In addition, 41 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ in a portion where non-photosensitive particles were not present, and the average diameter of the liquid bubbles was 0.15 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as gas was 14.61 μg. there were.

The maximum blister-proof exposure dose evaluated by the above method was 190 mJ / cm ² , the solid reproduction minimum exposure dose was 150 mJ / cm ² , and the latitude was 40 mJ / cm ² . When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

(Example 16)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-16.

<Thermosensitive layer composition solution-16>
(A) "PROJET" 825LDI: 16.8 parts by weight (b) "Narsem" titanium: 18.5 parts by weight (c) "Sumilite resin" PR50731: 125.9 parts by weight (d) "Nipporan" 5196: 33 .6 parts by weight (e) Non-photosensitive crosslinked acrylic resin particle dispersion: “Lyosphere” RSP3015: 210.0 parts by weight (f) Tetrahydrofuran: 1078.5 parts by weight (g) “Isopar” M: 16.8 parts by weight Part The content of the liquid having a solid content concentration of 13.9% by weight, a solubility parameter of 17.0 (MPa) ^1/2 or less and having a boiling point in the range of 210 to 270 ° C. Is 1.12% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 1.4 μm, and the average film thickness of the heat-sensitive layer in the portion without the non-photosensitive particles was It was 1.5 μm. The in-plane occupation ratio of the non-photosensitive particles was 30.0 area%. In addition, 39 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ where no non-photosensitive particles were present, and the average diameter of the liquid bubbles was 0.16 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as gas was 13.57 μg. there were.

Resistant highest exposure blister fire was evaluated by the method 210 mJ / cm ^2, solid reproducibility minimum exposure amount was 170 mJ / cm ^2, had a latitude of 40 mJ / cm ^2. When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

(Example 17)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-17.

<Thermosensitive layer composition solution-17>
(A) "PROJET" 825LDI: 15.5 parts by weight (b) "Narsem" titanium: 17.1 parts by weight (c) "Sumilite Resin" PR50731: 116.3 parts by weight (d) "Nipporan" 5196: 31 0.0 part by weight (e) Non-photosensitive crosslinked acrylic resin particle dispersion: “Liosphere” RSP3015: 280.0 parts by weight (f) Tetrahydrofuran: 1024.7 parts by weight (g) “Isopar” M: 15.5 parts by weight Part The content of the liquid having a solid content concentration of 14.0% by weight, a solubility parameter of 17.0 (MPa) ^1/2 or less, and a boiling point in the range of 210 to 270 ° C. Is 1.03% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 1.4 μm, and the average film thickness of the heat-sensitive layer in the portion without the non-photosensitive particles was It was 1.5 μm. The in-plane occupation ratio of the non-photosensitive particles was 40.0 area%. In addition, 40 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ where no non-photosensitive particles were present, and the average diameter of the liquid bubbles was 0.15 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as gas was 12.54 μg. there were.

The maximum blister-proof exposure dose evaluated by the above method was 230 mJ / cm ² , the solid reproduction minimum exposure dose was 190 mJ / cm ² , and the latitude was 40 mJ / cm ² . When the above-described method was used to evaluate the background stain on the non-image area, a partial background stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

(Example 18)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-18.

<Thermosensitive layer composition solution-18>
(A) "PROJET" 825LDI: 20.0 parts by weight (b) "Narsem" titanium: 22.0 parts by weight (c) "Sumilite Resin" PR50731: 150.0 parts by weight (d) "Nipporan" 5196: 40 0.0 part by weight (e) Non-photosensitive crosslinked acrylic resin particle dispersion: “Chemisnow” (registered trademark) MX150 (manufactured by Soken Chemical Co., Ltd., average particle size: 1.5 μm, CV value: 9.0%, specific gravity : 1.20, concentration: 20% by weight, methyl ethyl ketone as a dispersion medium: 80% by weight): 37.5 parts by weight (f) Tetrahydrofuran: 1210.5 parts by weight (g) "Isopar" M: 20.0 parts by weight Part of this thermosensitive layer composition solution is a liquid having a solid content concentration of 13.7% by weight, a solubility parameter of 17.0 (MPa) ^1/2 or less, and a boiling point in the range of 210 to 270 ° C. The content is 1.33% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 1.5 μm, and the average film thickness of the heat-sensitive layer in the portion without the non-photosensitive particles was It was 1.5 μm. The in-plane occupation ratio of the non-photosensitive particles was 5.0 area%. In addition, 41 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ in a portion where non-photosensitive particles were not present, and the average diameter of the liquid bubbles was 0.15 μm. When the liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as a gas was 16.19 μg. there were.

Resistant highest exposure blister fire was evaluated by the method 150 mJ / cm ^2, solid reproducibility minimum exposure amount was 120 mJ / cm ^2, had a latitude of 30 mJ / cm ^2. When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

(Example 19)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-19.

<Thermosensitive layer composition solution-19>
(A) "PROJET" 825LDI: 20.0 parts by weight (b) "Narsem" titanium: 22.0 parts by weight (c) "Sumilite Resin" PR50731: 150.0 parts by weight (d) "Nipporan" 5196: 40 0.0 part by weight (e) Non-photosensitive crosslinked acrylic resin particle dispersion: “Lyosphere” RSP3031: 42.5 parts by weight (f) Tetrahydrofuran: 1205.5 parts by weight (g) “Isopar” M: 20.0 parts by weight Part The content of the liquid having a solid content concentration of 13.8% by weight, a solubility parameter of 17.0 (MPa) ^1/2 or less, and a boiling point in the range of 210 to 270 ° C. Is 1.33% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 1.7 μm, and the average film thickness of the heat-sensitive layer in the portion without the non-photosensitive particles was It was 1.5 μm. The in-plane occupation ratio of the non-photosensitive particles was 5.0 area%. In addition, 42 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ where no non-photosensitive particles were present, and the average diameter of the liquid bubbles was 0.15 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as gas was 16.37 μg. there were.

Resistant highest exposure blister fire was evaluated by the method 150 mJ / cm ^2, solid reproducibility minimum exposure amount was 120 mJ / cm ^2, had a latitude of 30 mJ / cm ^2. When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

(Example 20)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-20.

<Thermosensitive layer composition solution-20>
(A) "PROJET" 825LDI: 26.7 parts by weight (b) "Narsem" titanium: 29.3 parts by weight (c) "Sumilite resin" PR50731: 200.0 parts by weight (d) "Nipporan" 5196: 53 .3 parts by weight (e) Non-photosensitive crosslinked acrylic resin particle dispersion: “Lyosphere” RSP3015: 35.0 parts by weight (f) Tetrahydrofuran: 1129.0 parts by weight (g) “Isopar” M: 26.7 parts by weight Part The content of the liquid having a solid content concentration of 18.1% by weight, a solubility parameter of 17.0 (MPa) ^1/2 or less, and a boiling point in the range of 210 to 270 ° C. Is 1.78% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 1.4 μm, and the average film thickness of the heat-sensitive layer in the portion without the non-photosensitive particles was It was 2.0 μm. The in-plane occupation ratio of the non-photosensitive particles was 5.0 area%. In addition, 39 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ where no non-photosensitive particles were present, and the average diameter of the liquid bubbles was 0.16 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as gas was 21.76 μg. there were.

The maximum blister-proof exposure dose evaluated by the above method was 130 mJ / cm ² , the solid reproduction minimum exposure dose was 120 mJ / cm ² , and had a latitude of 10 mJ / cm ² . When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

(Example 21)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-21.

<Thermosensitive layer composition solution-21>
(A) "PROJET" 825LDI: 26.7 parts by weight (b) "Narsem" titanium: 29.3 parts by weight (c) "Sumilite resin" PR50731: 200.0 parts by weight (d) "Nipporan" 5196: 53 .3 parts by weight (e) Non-photosensitive crosslinked acrylic resin particle dispersion: “Liosphere” RSP3031: 42.5 parts by weight (f) Tetrahydrofuran: 1121.5 parts by weight (g) “Isopar” M: 26.7 parts by weight Part The content of the liquid having a solid content concentration of 18.2% by weight, a solubility parameter of 17.0 (MPa) ^1/2 or less, and a boiling point in the range of 210 to 270 ° C. Is 1.78% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 1.7 μm, and the average film thickness of the heat-sensitive layer in the portion without the non-photosensitive particles was It was 2.0 μm. The in-plane occupation ratio of the non-photosensitive particles was 5.0 area%. In addition, 43 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ where no non-photosensitive particles were present, and the average diameter of the liquid bubbles was 0.15 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as gas was 21.88 μg. there were.

The maximum blister-proof exposure dose evaluated by the above method was 140 mJ / cm ² , the solid reproduction minimum exposure dose was 120 mJ / cm ² , and had a latitude of 20 mJ / cm ² . When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

(Example 22)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-22.

<Thermosensitive layer composition solution-22>
(A) “PROJET” 825LDI: 26.6 parts by weight (b) “Narsem” titanium: 29.3 parts by weight (c) “Sumilite resin” PR50731: 199.5 parts by weight (d) “Nipporan” 5196: 53 .2 parts by weight (e) Non-photosensitive crosslinked silicone particle dispersion: “Tospearl” (registered trademark) 120 (manufactured by Momentive Performance Materials, average particle size: 2.0 μm, CV value: 5.0%, Specific gravity: 1.32, Concentration: 20% by weight, Methyl ethyl ketone as dispersion medium: 80% by weight): 55.0 parts by weight (f) Tetrahydrofuran: 1109.9 parts by weight (g) “Isopar” M: 26.6 Part by weight This heat-sensitive layer composition solution has a solid content concentration of 18.3% by weight, a solubility parameter of 17.0 (MPa) ^1/2 or less, and 210 to 270 ° C. The content of liquid having a boiling point in the range is 1.77% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 2.0 μm, and the average film thickness of the heat-sensitive layer in the portion without the non-photosensitive particles was It was 2.0 μm. The in-plane occupation ratio of the non-photosensitive particles was 5.0 area%. In addition, 42 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ where no non-photosensitive particles were present, and the average diameter of the liquid bubbles was 0.15 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as gas was 21.51 μg. there were.

Resistant highest exposure blister fire was evaluated by the method 150 mJ / cm ^2, solid reproducibility minimum exposure amount was 120 mJ / cm ^2, had a latitude of 30 mJ / cm ^2. When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

(Comparative Example 1)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-23.

<Thermosensitive layer composition solution-23>
(A) "PROJET" 825LDI: 20.6 parts by weight (b) "Narsem" titanium: 22.7 parts by weight (c) "Sumilite resin" PR50731: 154.8 parts by weight (d) "Nipporan" 5196: 41 .3 parts by weight (e) Tetrahydrofuran: 1240.0 parts by weight (g) “Isopar” M: 20.6 parts by weight The solid content concentration of the thermosensitive layer composition solution was 13.6% by weight, and the solubility parameter was 17.0. (MPa) The content of a liquid having a boiling point in the range of 210 to 270 ° C. of ^½ or less is 1.38% by weight.

When evaluated in the same manner as in Example 1, no non-photosensitive particles were observed in the cross section of the heat sensitive layer, and the average film thickness of the heat sensitive layer was 1.5 μm. In addition, 41 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ in a portion where non-photosensitive particles were not present, and the average diameter of the liquid bubbles was 0.15 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as gas was 16.69 μg. there were.

The maximum blister-proof exposure dose evaluated by the above method was 120 mJ / cm ² , the solid exposure minimum exposure dose was 120 mJ / cm ² , and had no latitude. When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material.

(Comparative Example 2)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-24.

<Thermosensitive layer composition solution-24>
(A) "PROJET" 825LDI: 20.4 parts by weight (b) "Narsem" titanium: 22.4 parts by weight (c) "Sumilite resin" PR50731: 152.7 parts by weight (d) "Nipporan" 5196: 40 .7 parts by weight (e) Non-photosensitive crosslinked acrylic resin particle dispersion: “Lyosphere” RSP3021: 15.0 parts by weight (f) Tetrahydrofuran: 1228.4 parts by weight (g) “Isopar” M: 20.4 parts by weight Part The content of the liquid having a solid content concentration of 13.6% by weight, a solubility parameter of 17.0 (MPa) ^1/2 or less, and a boiling point in the range of 210 to 270 ° C. Is 1.36% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 0.6 μm, and the average film thickness of the heat-sensitive layer in the portion having no non-photosensitive particles was It was 1.5 μm. The in-plane occupation ratio of the non-photosensitive particles was 5.0 area%. In addition, 38 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ where no non-photosensitive particles were present, and the average diameter of the liquid bubbles was 0.16 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as a gas was 16.47 μg. there were.

The maximum blister-proof exposure dose evaluated by the above method was 120 mJ / cm ² , the solid exposure minimum exposure dose was 120 mJ / cm ² , and had no latitude. When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

(Comparative Example 3)
A direct-drawing waterless lithographic printing plate precursor was obtained in the same manner as in Example 1 except that the heat-sensitive layer composition solution-1 was changed to the following heat-sensitive layer composition solution-25.

<Thermosensitive layer composition solution-25>
(A) "PROJET" 825LDI: 47.5 parts by weight (b) "Narsem" titanium: 52.3 parts by weight (c) "Sumilite resin" PR50731: 356.3 parts by weight (d) "Nipporan" 5196: 95 0.0 part by weight (e) Non-photosensitive crosslinked acrylic resin particle dispersion: “Liosphere” RSP3015: 35.0 parts by weight (f) Tetrahydrofuran: 866.4 parts by weight (g) “Isopar” M: 47.5 parts by weight Part The content of the liquid having a solid content concentration of 31.8% by weight, a solubility parameter of 17.0 (MPa) ^1/2 or less, and a boiling point in the range of 210 to 270 ° C. Is 3.17% by weight.

When the evaluation was performed in the same manner as in Example 1, the average particle diameter of the non-photosensitive particles observed in the cross section of the heat-sensitive layer was 1.4 μm, and the average film thickness of the heat-sensitive layer in the portion without the non-photosensitive particles was It was 3.5 μm. The in-plane occupation ratio of the non-photosensitive particles was 5.0 area%. In addition, 40 liquid bubbles were observed in the heat-sensitive layer 0.5 μm ³ where no non-photosensitive particles were present, and the average diameter of the liquid bubbles was 0.15 μm. When liquid bubbles were analyzed, the presence of a liquid having a boiling point in the range of 223 to 254 ° C. derived from “Isopar” M was confirmed, and the amount of liquid derived from “Isopar” M generated as gas was 38.42 μg. there were.

The maximum blister-proof exposure dose evaluated by the above method was 120 mJ / cm ² , the solid exposure minimum exposure dose was 120 mJ / cm ² , and had no latitude. When the above method was used to evaluate the background stain on the non-image area, no stain was observed on the printed material. When the non-photosensitive particle dispersion stability in the heat-sensitive layer composition solution was evaluated by the above method, no precipitation of non-photosensitive particles was observed.

  The evaluation results are shown in Table 1 for Examples 1-22 and Comparative Examples 1-3.

  The direct-drawing waterless planographic printing plate precursor of the present invention can be used in general printing fields (commercial printing, newspaper printing, printing on a film, a resin plate, or a non-absorbent such as metal). Further, the present invention can be applied to the display field such as PDP and LCD, and further to the field of printable electronics in which a wiring pattern is produced by a printing method.

Claims (8)

A direct-drawing waterless lithographic printing plate precursor having at least a heat-sensitive layer and a silicone rubber layer in this order on a substrate, wherein the heat-sensitive layer contains non-photosensitive particles, and the average particle size of the non-photosensitive particles is non-photosensitive der least half of the heat-sensitive layer the average thickness of the portion sexual particles are not present is, and an average thickness less der Rukoto the sum of the heat-sensitive layer and the silicone rubber layer of the portion non-photosensitive particles are not present A direct-drawing waterless lithographic printing plate precursor characterized by 2. The direct-drawing waterless lithographic printing plate precursor according to claim 1, wherein the in-plane occupation ratio of the non-photosensitive particles in the heat-sensitive layer is 0.5 area% or more. The non-photosensitive claim 1 or claim 2 directly imageable waterless planographic printing plate precursor according to CV value is equal to or more than 15% of the particles. The direct-drawing waterless lithographic printing plate precursor according to any one of claims 1 to 3 , wherein the non-photosensitive particles are spherical particles. The direct-drawing waterless lithographic printing plate precursor according to any one of claims 1 to 4 , wherein the non-photosensitive particles are non-photosensitive organic particles. 6. The direct-drawing waterless lithographic printing plate precursor according to claim 5 , wherein the non-photosensitive organic particles have a crosslinked structure. A direct-drawing waterless lithographic printing plate precursor having at least a heat-sensitive layer and a silicone rubber layer in this order on a substrate, wherein the heat-sensitive layer contains non-photosensitive particles, and the average particle size of the non-photosensitive particles is non-photosensitive Direct-drawing waterless lithographic printing plate characterized in that it is at least 1/2 times the average thickness of the heat-sensitive layer where no photosensitive particles are present and the CV value of the non-photosensitive particles is 15% or less Original edition. A direct-drawing waterless lithographic printing plate precursor having at least a heat-sensitive layer and a silicone rubber layer in this order on a substrate, wherein the heat-sensitive layer contains non-photosensitive particles, and the average particle size of the non-photosensitive particles is non-photosensitive No direct-drawing water characterized in that the non-photosensitive particles are non-photosensitive organic particles having a cross-linked structure that are at least 1/2 times the average thickness of the heat-sensitive layer in the absence of the photosensitive particles A lithographic printing plate precursor.