JP5832826B2 - Substrate processing apparatus and substrate processing method - Google Patents

Description

  The present invention relates to an apparatus and method for processing a substrate with a processing liquid. Examples of substrates to be processed include semiconductor wafers, liquid crystal display substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photo Mask substrates, ceramic substrates, solar cell substrates and the like are included.

  Patent Document 1 discloses a cleaning head having a configuration in which a supply pipe is connected to a primary side opening of a cylindrical body in which a large number of discharge holes are formed on the bottom surface, and a discharge pipe is connected to a secondary side opening of the cylindrical body. ing. The supply pipe is connected to a cleaning liquid supply source, and a pressure pump is interposed in the path. A valve (hereinafter referred to as “secondary valve”) is provided in the middle of the discharge pipe. The pump is continuously operated at all times, cleaning the cleaning head when it is waiting at the retracted position, moving from the retracted position to the cleaning position on the substrate, and when the cleaning liquid should be supplied to the substrate. A cleaning liquid is fed to the head (paragraph 0046 of Patent Document 1). When the cleaning liquid is supplied to the substrate and the cleaning process is performed, the secondary side valve is closed. Thereby, the liquid pressure of the cleaning liquid inside the cylindrical body is increased, and thereby the cleaning liquid is discharged from the discharge hole.

JP 2011-29315 A

Patent Document 1 describes that when the secondary side valve is opened, the cleaning liquid fed into the cylindrical body is directly discharged from the discharge pipe to the outside of the apparatus.
However, in reality, when the cleaning liquid is being supplied from the pressure pump, the cleaning liquid does not come out from the discharge hole at all, and a small amount of cleaning liquid leaks from the discharge hole due to the liquid pressure and gravity inside the cylindrical body. It is inevitable to fall. Therefore, when the cleaning head is moved from the retracted position to the cleaning position, and when the cleaning head is moved from the cleaning position to the retracted position, the cleaning liquid may fall on the substrate, thereby deteriorating the substrate processing quality.

  This problem can be solved by providing a valve (hereinafter referred to as “primary side valve”) in the course of the supply piping and closing the primary side valve when the cleaning liquid is not discharged. If the primary side valve is closed, there is no destination of the cleaning liquid sent from the pressure pump, and the pressure in the supply pipe may be excessive. Therefore, when closing the primary side valve, the operation of the pressure pump must be stopped.

  However, such a configuration causes another problem that the time required for substrate processing becomes long and productivity deteriorates. That is, after the cleaning head is moved to the cleaning position on the substrate, the primary side valve is opened, the secondary side valve is closed, and the operation of the pressure feed pump is started. The liquid discharge from the discharge hole does not start until the rise. That is, preparation time (pressing time, for example, about 2 seconds) before liquid discharge is required. Furthermore, when the cleaning head is finished and the cleaning head is returned to the retracted position, the operation of the pressure pump is stopped, the secondary valve is opened, the primary valve is closed, and the interior of the cylindrical body is closed. You must wait until the fluid pressure drops. That is, post-processing time after completion of processing (pressure release time, for example, about 15 seconds) is required. Therefore, in addition to the actual cleaning processing time for discharging the cleaning liquid from the cleaning head, the pressing time and the pressure releasing time are required, so that the substrate processing time becomes long and the productivity deteriorates.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of avoiding the dropping of the processing liquid onto the substrate and realizing excellent productivity.

The invention described in claim 1 for achieving the above object is a substrate processing apparatus having a first processing unit and a second processing unit for processing a substrate with a processing liquid, wherein the pump is configured to pressurize and send the processing liquid. A treatment liquid supply path connected to the pump; a first branch path branched from the treatment liquid supply path; a second branch path branched from the treatment liquid supply path; and the first branch path; A first nozzle disposed in the first processing unit, a second nozzle connected to the second branch path and disposed in the second processing unit, and a first primary interposed in the first branch path A side valve, a second primary valve interposed in the second branch path, a first drain path connected to the first nozzle, and a second drain path connected to the second nozzle , A first secondary valve interposed in the first drainage passage, A second secondary side valve interposed in 2 drains, when closing the first primary valve, while maintaining the pump driving state, the second primary valve and the second secondary And a control means for opening the side valve .

  According to this configuration, when the first primary side valve is opened, the processing liquid pressurized and sent out from the pump is supplied to the first nozzle disposed in the first processing unit. Further, when the second primary side valve is opened, the processing liquid pressurized and sent out from the pump is supplied to the second nozzle disposed in the second processing unit. Accordingly, by selecting and opening one of the first primary side valve and the second primary side valve, one pump can be shared for processing in the first and second processing units, so that the configuration is simplified and the substrate processing is performed. The cost of the apparatus can be reduced. When the first primary side valve is closed, the second primary side valve is opened, and the pump is held in the driving state. Therefore, while the processing liquid discharge from the first nozzle is immediately stopped, the processing liquid can be quickly discharged from the second nozzle as necessary. That is, since the pump is held in the drive state, both the press-in time and the pressure-release time can be eliminated, so that the substrate processing time in the first and second processing units can be shortened and the substrate processing productivity can be improved. . In addition, when the first primary side valve is closed, the second primary side valve is opened, so there is no possibility that the liquid pressure becomes excessive in the processing liquid supply path or the like. Further, by closing the first primary side valve, the processing liquid does not come out from the first nozzle, so that it is possible to avoid the processing liquid from dropping from the first nozzle onto the substrate. As described above, according to the present invention, it is possible to provide a substrate processing apparatus capable of realizing excellent productivity while avoiding the dropping of the processing liquid onto the substrate, and also capable of simplifying the configuration and reducing the cost.

Further, in the present invention, when the first primary side valve is closed, the second primary side valve and the second secondary side valve are opened. Thereby, the processing liquid sent out from the pump goes to the second branch path from the processing liquid supply path, and is discharged to the second drain path through the second nozzle. Therefore, it is possible to prevent the processing liquid from leaking from the first nozzle by closing the first primary valve while avoiding a pressure increase in the pipe while keeping the pump in a driving state. Since the second secondary valve is opened, the pressure in the second nozzle does not increase, so that the processing liquid is not discharged from the second nozzle. However, it is preferable that the second nozzle is retracted from the substrate because some processing liquid may leak out.

The invention according to claim 2 further includes a first nozzle moving mechanism for moving the first nozzle between a retracted position and a processing position, and the control means is configured such that the first nozzle moving mechanism causes the first nozzle to move. when moving between said processing position and said retracted position, closes the first primary side valve, a substrate processing apparatus according to claim 1.
According to this configuration, since the first primary valve is closed when the first nozzle is moved between the retracted position and the processing position, the processing liquid does not leak from the first nozzle. Accordingly, it is possible to prevent the processing liquid from inadvertently dropping on the substrate, so that the substrate processing quality can be improved. Moreover, since the pump is held in the drive state, after the first primary side valve is opened after the movement from the retracted position to the processing position, the discharge of the processing liquid from the first nozzle can be started immediately. Therefore, the time required for substrate processing can be shortened and productivity can be improved.

The control means preferably closes the first primary valve also when the first nozzle moving mechanism moves the first nozzle from the processing position to the retracted position. Thereby, it can avoid that a process liquid falls carelessly on the board | substrate after a process.
According to a third aspect of the present invention, the first nozzle includes a first primary side opening connected to the first branch passage, a first secondary side opening connected to the first drainage passage, and a plurality of first openings. A first treatment liquid head having a hollow first nozzle body formed with a discharge hole and discharging a droplet of a treatment liquid from the plurality of first discharge holes; and the second nozzle A hollow second nozzle in which a second primary side opening connected to the second branch path, a second secondary side opening connected to the second drainage path, and a plurality of second discharge holes are formed. has a body, has the form of a second treatment liquid head which ejects droplets of the treatment liquid from the plurality of second discharge holes, a substrate processing apparatus according to claim 1 or 2.

  According to this configuration, the first and second nozzles are formed in the nozzle body while the processing liquid is introduced into the hollow nozzle body from the primary side opening and the processing liquid is discharged from the secondary side opening. It has a form of a processing liquid head that discharges droplets of processing liquid from a plurality of discharge holes. Therefore, when the primary side valve is opened while the secondary side valve is closed, the liquid pressure in the internal space of the nozzle body is increased, and droplets of the processing liquid are discharged from the discharge holes. When both the primary side valve and the secondary side valve are opened, the liquid pressure in the nozzle body does not increase, so the processing liquid supplied from the primary side opening passes through the nozzle body and flows out to the secondary side opening. However, the processing liquid is not discharged from the discharge holes. However, since the processing liquid may leak out, it is preferable to arrange the nozzle at a position retracted from the substrate when both the primary side valve and the secondary side valve are opened. In the present invention, when the first primary valve is closed, the second primary valve and the second secondary valve are opened, so that the processing liquid is not discharged from the first nozzle and from the discharge hole from the second nozzle. The processing liquid will leak slightly. In the second nozzle, since both the primary side valve and the secondary side valve are opened, an excessive increase in the hydraulic pressure in the pipe does not occur. Therefore, the pump drive state can be maintained while the processing liquid is not discharged from both the first and second nozzles. At this time, even if the first nozzle is disposed on the substrate or moved on the substrate, the processing liquid does not drop from the first nozzle onto the substrate.

According to a fourth aspect of the present invention, there is provided a substrate processing apparatus having a first processing unit, a second processing unit, and a third processing unit for processing a substrate with a processing liquid, wherein the pump is configured to pressurize and send the processing liquid; , A first branch path branched from the processing liquid supply path, a second branch path branched from the processing liquid supply path, and a third branch path branched from the processing liquid supply path A first nozzle connected to the first branch path and disposed in the first processing unit; a second nozzle connected to the second branch path and disposed in the second processing unit; A third nozzle connected to the three branch path and disposed in the third processing unit, a first primary valve interposed in the first branch path, and a second nozzle interposed in the second branch path A primary valve and the third branch. A third primary-side valve, said a first drainage path connected to the first nozzle, the second drain path connected to the second nozzle, third drains connected to said third nozzle A first secondary valve interposed in the first drainage path, a second secondary valve interposed in the second drainage path, and a third drainage path. When the third secondary valve and the first primary valve are closed, the second primary valve and the second secondary valve, or the third primary are kept while the pump is kept in the driving state. A substrate processing apparatus including a side valve and control means for opening the third secondary valve .

  According to this configuration, when the first primary side valve is opened, the processing liquid pressurized and sent out from the pump is supplied to the first nozzle disposed in the first processing unit. Further, when the second primary side valve is opened, the processing liquid pressurized and sent out from the pump is supplied to the second nozzle disposed in the second processing unit. And when the 3rd primary side valve is opened, the processing liquid pressurized and sent out from the pump is supplied to the 3rd nozzle arranged at the 3rd processing unit. Accordingly, by selecting and opening any one of the first primary side valve, the second primary side valve, and the third primary side valve, one pump can be processed in the first, second, and third processing units. Since it can be shared, the configuration is simplified and the cost of the substrate processing apparatus can be reduced. When the first primary side valve is closed, the second primary side valve or the third primary side valve is opened, and the pump is held in the driving state. Therefore, while the processing liquid discharge from the first nozzle is immediately stopped, the processing liquid can be quickly discharged from the second nozzle or the third nozzle as necessary. That is, since the pump is held in the driving state, both the press-in time and the pressure-release time can be eliminated. Therefore, the substrate processing time in the first, second, and third processing units is shortened, and the substrate processing productivity is reduced. Can be improved. Moreover, when the first primary side valve is closed, the second primary side valve or the third primary side valve is opened, so that there is no possibility that the liquid pressure becomes excessive in the processing liquid supply path or the like. Further, by closing the first primary side valve, the processing liquid does not come out from the first nozzle, so that it is possible to avoid the processing liquid from dropping from the first nozzle onto the substrate. As described above, according to the present invention, it is possible to provide a substrate processing apparatus capable of realizing excellent productivity while avoiding the dropping of the processing liquid onto the substrate, and also capable of simplifying the configuration and reducing the cost.

In the present invention, when the first primary side valve is closed, the set of the second primary side valve and the second secondary side valve or the set of the third primary side valve and the third secondary side valve is opened. Either one of these sets of valves may be opened, or both sets of valves may be opened. When the first primary side valve is closed, the processing liquid sent out from the pump goes from the processing liquid supply path to the second or third branch path, passes through the second or third nozzle, and the second or third drainage path. Is discharged. Therefore, it is possible to prevent the processing liquid from leaking from the first nozzle by closing the first primary valve while avoiding a pressure increase in the pipe while keeping the pump in a driving state. Since the set of the second primary side valve and the second secondary side valve, or the set of the third primary side valve and the third secondary side valve is opened, pressure is applied in both the second nozzle and the third nozzle. Since the height is not increased, the processing liquid is not discharged from either the second nozzle or the third nozzle. However, since some processing liquid may leak, it is preferable that the nozzles of the second nozzle and the third nozzle that open the primary side valve are retracted from the substrate.
The invention according to claim 5 opens the first primary valve or the third primary valve while holding the pump in the driving state when the control means closes the second primary valve. A substrate processing apparatus according to claim 4 .
According to this configuration, when the second primary side valve is closed, the first primary side valve or the third primary side valve is opened, and the pump is held in the driving state. Therefore, while the processing liquid discharge from the second nozzle is immediately stopped, the processing liquid can be discharged quickly from the first nozzle or the third nozzle as necessary. Thereby, productivity of substrate processing can be improved. In addition, when the second primary side valve is closed, the first primary side valve or the third primary side valve is opened, so there is no possibility that the liquid pressure becomes excessive in the processing liquid supply path or the like. Further, by closing the second primary side valve, the processing liquid does not come out from the second nozzle, so that the processing liquid can be prevented from dropping from the second nozzle onto the substrate.

According to a sixth aspect of the present invention, when the control means closes the third primary side valve, the first primary side valve or the second primary side valve is opened while the pump is kept in a driving state. A substrate processing apparatus according to claim 4 or 5 .
According to this configuration, when the third primary side valve is closed, the first primary side valve or the second primary side valve is opened, and the pump is held in the driving state. Accordingly, the discharge of the processing liquid from the third nozzle is immediately stopped, while the processing liquid can be quickly discharged from the first nozzle or the second nozzle as necessary. Thereby, productivity of substrate processing can be improved. In addition, when the third primary side valve is closed, the first primary side valve or the second primary side valve is opened, so there is no possibility that the liquid pressure becomes excessive in the processing liquid supply path or the like. Further, by closing the third primary side valve, the processing liquid does not come out from the third nozzle, so that the processing liquid can be prevented from dropping from the third nozzle onto the substrate.

According to a seventh aspect of the present invention, when the control means closes the second primary valve, the first primary valve and the first secondary valve, or The substrate processing apparatus according to claim 4 , wherein the third primary side valve and the third secondary side valve are opened.
According to this configuration, when the second primary side valve is closed, the set of the first primary side valve and the first secondary side valve or the set of the third primary side valve and the third secondary side valve is opened. Either one of these sets of valves may be opened, or both sets of valves may be opened. When the second primary side valve is closed, the processing liquid sent out from the pump goes from the processing liquid supply path to the first or third branch path, passes through the first or third nozzle, and the first or third drainage path. Is discharged. Therefore, it is possible to prevent the processing liquid from leaking from the second nozzle by closing the second primary valve while avoiding an increase in pressure in the pipe while keeping the pump in a driving state. Since the first primary side valve and the first secondary side valve group or the third primary side valve and the third secondary side valve group is opened, pressure is applied in both the first nozzle and the third nozzle. Since the height is not increased, the processing liquid is not discharged from either the first nozzle or the third nozzle. However, since some of the processing liquid may leak, it is preferable that the nozzle that opens the primary side valve among the first nozzle and the third nozzle is retracted from the substrate.

According to an eighth aspect of the present invention, when the control means closes the third primary side valve, the first primary side valve and the first secondary side valve or opening said second primary-side valve and said second secondary side valve, a substrate processing apparatus according to claim 4 or 7.
According to this configuration, when the third primary side valve is closed, the set of the first primary side valve and the first secondary side valve or the set of the second primary side valve and the second secondary side valve is opened. Either one of these sets of valves may be opened, or both sets of valves may be opened. When the third primary side valve is closed, the processing liquid sent out from the pump is directed from the processing liquid supply path to the first or second branch path, and passes through the first or second nozzle to the first or second drainage path. Is discharged. Therefore, it is possible to prevent the processing liquid from leaking from the third nozzle by closing the third primary side valve while avoiding a pressure increase in the pipe while keeping the pump in a driving state. Since the set of the first primary side valve and the first secondary side valve or the set of the second primary side valve and the second secondary side valve is opened, pressure is applied in both the first nozzle and the second nozzle. Since the height does not increase, the processing liquid is not discharged from either the first nozzle or the second nozzle. However, since some of the processing liquid may leak, it is preferable that the nozzle that opens the primary side valve among the first nozzle and the second nozzle is retracted from the substrate.

The invention according to claim 9 is a first nozzle moving mechanism for moving the first nozzle between the retracted position and the processing position, and a second nozzle for moving the second nozzle between the retracted position and the processing position. A moving mechanism; and a third nozzle moving mechanism for moving the third nozzle between a retracted position and a processing position, wherein the control means causes the first nozzle moving mechanism to move the first nozzle to the retracted position. And when the second nozzle moving mechanism moves the second nozzle between the retracted position and the processing position, the first primary valve is closed. closing the second primary side valve, when said third nozzle moving mechanism moves the third nozzle between said processing position and said retracted position, closes the third primary valve, to claim 7 group of claim 8 according It is a processing apparatus.

  According to this configuration, since the first primary valve is closed when the first nozzle is moved between the retracted position and the processing position, the processing liquid does not leak from the first nozzle. Accordingly, it is possible to prevent the processing liquid from inadvertently dropping on the substrate, so that the substrate processing quality can be improved. In addition, since the pump is maintained in the driving state, after the first nozzle reaches the processing position, the discharge of the processing liquid from the first nozzle can be started immediately by opening the first primary side valve. In addition, immediately after the process is completed, the first primary valve can be closed and the first nozzle can be quickly returned to the retracted position. Similarly, when the second nozzle is moved between the retracted position and the processing position, the second primary side valve is closed, so that the processing liquid does not leak from the second nozzle. Accordingly, it is possible to prevent the processing liquid from inadvertently dropping on the substrate, so that the substrate processing quality can be improved. In addition, since the pump is maintained in the driving state, after the second nozzle reaches the processing position, the discharge of the processing liquid from the second nozzle can be started immediately by opening the second primary side valve. Moreover, after the process is completed, the second primary valve can be immediately closed and the second nozzle can be quickly returned to the retracted position. Furthermore, when the third nozzle is moved between the retracted position and the processing position, the third primary side valve is closed, so that the processing liquid does not leak from the third nozzle. Accordingly, it is possible to prevent the processing liquid from inadvertently dropping on the substrate, so that the substrate processing quality can be improved. Moreover, since the pump is held in the drive state, after the third nozzle reaches the processing position, the discharge of the processing liquid from the third nozzle can be started immediately by opening the third primary side valve. In addition, immediately after the process is completed, the third primary valve can be closed and the third nozzle can be quickly returned to the retracted position. In this way, productivity required can be improved by shortening the time required for substrate processing.

According to a tenth aspect of the present invention, the first nozzle includes a first primary side opening connected to the first branch path, a first secondary side opening connected to the first drainage path, and a plurality of first nozzles. A first treatment liquid head having a hollow first nozzle body formed with a discharge hole and discharging a droplet of a treatment liquid from the plurality of first discharge holes; and the second nozzle A hollow second nozzle in which a second primary side opening connected to the second branch path, a second secondary side opening connected to the second drainage path, and a plurality of second discharge holes are formed. A second processing liquid head configured to discharge a droplet of the processing liquid from the plurality of second discharge holes, wherein the third nozzle is connected to the third branch path; 3 a hollow third nozzle body having a primary side opening, a third secondary side opening connected to the third drainage passage, and a plurality of third discharge holes. It has the form of a third treatment liquid head for ejecting the treatment liquid droplets from the plurality of third ejecting holes, a substrate processing apparatus according to any one of claims 4-9.

  According to this configuration, the first, second, and third nozzles introduce the treatment liquid from the primary side opening to the hollow nozzle body, discharge the treatment liquid from the secondary side opening, and supply the treatment liquid to the nozzle body. It has a form of a processing liquid head for discharging droplets of the processing liquid from the plurality of formed discharge holes. Therefore, when the primary side valve is opened while the secondary side valve is closed, the liquid pressure in the internal space of the nozzle body is increased, and droplets of the processing liquid are discharged from the discharge holes. When both the primary side valve and the secondary side valve are opened, the liquid pressure in the nozzle body does not increase, so the processing liquid supplied from the primary side opening passes through the nozzle body and flows out to the secondary side opening. However, the processing liquid is not discharged from the discharge holes. However, since the processing liquid may leak out, it is preferable to arrange the nozzle at a position retracted from the substrate when both the primary side valve and the secondary side valve are opened. In the present invention, when the first primary valve is closed, the set of the second primary valve and the second secondary valve, or the set of the third primary valve and the third secondary valve is opened. The processing liquid is not discharged from the nozzle, and the processing liquid slightly leaks from the discharge hole from the second nozzle or the third nozzle in which the primary side valve is opened. Regarding the second nozzle or the third nozzle, both the primary side valve and the secondary side valve are opened, so that an excessive increase in hydraulic pressure in the pipe does not occur. Therefore, it is possible to maintain the driving state of the pump while the processing liquid is not discharged from any of the first, second, and third nozzles. At this time, even if the first nozzle is disposed on the substrate or moved on the substrate, the processing liquid does not drop from the first nozzle onto the substrate.

  The first nozzle may further include a first piezoelectric element that is fixed to the nozzle body and imparts vibration to the processing liquid stored in the internal space of the first nozzle body. Similarly, the second nozzle may further include a second piezoelectric element that is fixed to the nozzle body and imparts vibrations to the processing liquid stored in the internal space of the second nozzle body. Similarly, the third nozzle may further include a third piezoelectric element that is fixed to the nozzle body and imparts vibration to the processing liquid stored in the internal space of the third nozzle body. Thereby, since the liquid flow flowing out from the discharge hole formed in the nozzle body is divided by the vibration of the piezoelectric element, a good droplet can be discharged. That is, if the piezoelectric element is driven at a constant frequency, droplets having a uniform particle diameter can be ejected.

The invention described in claim 11 is a substrate processing method executed in a substrate processing apparatus having a first processing unit and a second processing unit for processing a substrate with a processing liquid, wherein the substrate processing apparatus adds a processing liquid. A pump that pumps out, a processing liquid supply path connected to the pump, a first branch path branched from the processing liquid supply path, a second branch path branched from the processing liquid supply path, and the first branch A first nozzle disposed in the first processing unit, a second nozzle disposed in the second processing unit and disposed in the second branch unit, and a first nozzle disposed in the first processing unit. The first primary side valve, the second primary side valve interposed in the second branch path, the first drainage path connected to the first nozzle, and the second primary side valve connected to the second nozzle. 2 drainage channels and the first drainage channel. A first secondary side valve, and a second secondary side valve interposed in the second drainage path, the substrate processing method, when closing the first primary side valve, drives said pump The substrate processing method includes a step of opening the second primary side valve and the second secondary side valve while maintaining the state. This method corresponds to the substrate processing apparatus of claim 1.

The invention according to claim 12 further includes a first nozzle moving mechanism for moving the first nozzle from a retracted position to a processing position, and the substrate processing method is characterized in that the first nozzle moving mechanism includes the first nozzle moving mechanism. The substrate processing method according to claim 11 , further comprising a step of closing the first primary valve when moving the first nozzle from the retracted position to the processing position. This method corresponds to the substrate processing apparatus of claim 2 .

According to a thirteenth aspect of the present invention, the first nozzle includes a first primary side opening connected to the first branch passage, a first secondary side opening connected to the first drainage passage, and a plurality of first openings. A first treatment liquid head having a hollow first nozzle body formed with a discharge hole and discharging a droplet of a treatment liquid from the plurality of first discharge holes; and the second nozzle A hollow second nozzle in which a second primary side opening connected to the second branch path, a second secondary side opening connected to the second drainage path, and a plurality of second discharge holes are formed. has a body, has the form of a second treatment liquid head which ejects droplets of the treatment liquid from the plurality of second discharge holes, a substrate processing method according to claim 11 or 12. This method corresponds to the substrate processing apparatus of the third aspect .

The invention described in claim 14 is a substrate processing method executed in a substrate processing apparatus having a first processing unit, a second processing unit, and a third processing unit for processing a substrate with a processing liquid, wherein the substrate processing apparatus includes: A pump for pressurizing and feeding the processing liquid, a processing liquid supply path connected to the pump, a first branch path branched from the processing liquid supply path, and a second branch path branched from the processing liquid supply path A third branch path branched from the processing liquid supply path, a first nozzle connected to the first branch path, arranged in the first processing unit, connected to the second branch path, and the second branch path. A second nozzle disposed in the processing unit, a third nozzle connected to the third branch path and disposed in the third processing unit, and a first primary valve interposed in the first branch path; , Via the second branch A second primary valve that is, a third primary side valve interposed in the third branch passage, a first drainage path connected to said first nozzle, the second being connected to said second nozzle 2 drainage passages, a third drainage passage connected to the third nozzle, a first secondary valve interposed in the first drainage passage, and a second drainage passage. A second secondary side valve and a third secondary side valve interposed in the third drainage path , wherein the substrate processing method is configured to turn off the pump when closing the first primary side valve. The substrate processing method includes a step of opening the second primary side valve and the second secondary side valve, or the third primary side valve and the third secondary side valve while maintaining the driving state. This method corresponds to the substrate processing apparatus of claim 4 .

The invention according to claim 15 further includes the step of opening the first primary valve or the third primary valve while holding the pump in a driving state when the second primary valve is closed. Item 15. The substrate processing method according to Item 14 . This method corresponds to the substrate processing apparatus of claim 5 .
The invention according to claim 16 further includes the step of opening the first primary valve or the second primary valve while holding the pump in a driving state when the third primary valve is closed. Item 16. The substrate processing method according to Item 14 or 15 . This method corresponds to the substrate processing apparatus of the seventh aspect.

According to a seventeenth aspect of the present invention, when the second primary side valve is closed, the first primary side valve and the first secondary side valve or the third primary side are kept while the pump is kept in a driving state. The substrate processing method according to claim 14 , comprising the step of opening a valve and the third secondary valve. This method corresponds to the substrate processing apparatus of the seventh aspect .
According to an eighteenth aspect of the present invention, when the third primary side valve is closed, the first primary side valve and the first secondary side valve or the second primary side are kept while the pump is kept in a driving state. includes a valve and then opening the second secondary valve is a substrate processing method according to claim 14 or 17. This method corresponds to the substrate processing apparatus of the eighth aspect .

According to a nineteenth aspect of the present invention, the substrate processing apparatus includes: a first nozzle moving mechanism that moves the first nozzle between a retracted position and a processing position; and the second nozzle between the retracted position and the processing position. And a third nozzle moving mechanism for moving the third nozzle between a retracted position and a processing position, and the substrate processing method includes: the first nozzle moving mechanism: A step of closing the first primary valve when the first nozzle is moved between the retracted position and the processing position; and the second nozzle moving mechanism moves the second nozzle to the retracted position and the processing position. The second primary valve is closed, and when the third nozzle moving mechanism moves the third nozzle between the retracted position and the processing position, the first primary valve is closed. 3 Primary Closing the valve and a step, which is a substrate processing method according to claim 18 according to claim 17. This method corresponds to the substrate processing apparatus of the ninth aspect .

The invention according to claim 20 is characterized in that the first nozzle has a first primary side opening connected to the first branch path, a first secondary side opening connected to the first drainage path, and a plurality of first nozzles. A first treatment liquid head having a hollow first nozzle body formed with a discharge hole and discharging a droplet of a treatment liquid from the plurality of first discharge holes; and the second nozzle A hollow second nozzle in which a second primary side opening connected to the second branch path, a second secondary side opening connected to the second drainage path, and a plurality of second discharge holes are formed. A second processing liquid head configured to discharge a droplet of the processing liquid from the plurality of second discharge holes, wherein the third nozzle is connected to the third branch path; 3 a hollow third nozzle body having a primary side opening, a third secondary side opening connected to the third drainage passage, and a plurality of third discharge holes. It has the form of a third treatment liquid head for ejecting the treatment liquid droplets from the plurality of third ejecting holes, a substrate processing method according to any one of claims 14-19. This method corresponds to the substrate processing apparatus of claim 10 .

FIG. 1 is a conceptual diagram for explaining the overall configuration of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is an illustrative sectional view for explaining a common configuration example of the first to third processing units. FIG. 3A is a schematic side view of the droplet discharge nozzle and the protective liquid nozzle, and FIG. 3B is a schematic plan view of the droplet discharge nozzle and the protective liquid nozzle. 4A and 4B are timing charts for explaining opening and closing operations of the first to third primary side valves and the first to third secondary side valves. FIG. 5 is a diagram for explaining a progress example (example) of processing in the first to third processing units. FIG. 6 is a diagram for explaining an example of processing progress in the configuration of the comparative example.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a conceptual diagram for explaining the overall configuration of a substrate processing apparatus according to an embodiment of the present invention. The substrate processing apparatus includes a first processing unit 1, a second processing unit 2, and a third processing unit 3. The first, second, and third processing units 1, 2, and 3 are single wafer processing units that process the substrate W one by one. The substrate processing apparatus further includes a pump 5 that pumps the processing liquid from the processing liquid supply source 4, pressurizes and sends the processing liquid, and a processing liquid supply path 6 connected to the pump 5. A first branch path 11, a second branch path 12, and a third branch path 13 are branched from the processing liquid supply path 6. In the first processing unit 1, a first nozzle N1 connected to the first branch path 11 is disposed. The second processing unit 2 is provided with a second nozzle N2 connected to the second branch path 12. Further, the third processing unit 3 is provided with a third nozzle N3 connected to the third branch path 13. A first drain path 21 is connected to the first nozzle N1, a second drain path 22 is connected to the second nozzle N2, and a third drain path 23 is connected to the third nozzle N3. Has been. A first primary side valve P1 is interposed in the first branch path 11, a second primary side valve P2 is interposed in the second branch path 12, and a third primary path is provided in the third branch path 13. A side valve P3 is interposed. Further, a first secondary side valve S1 is interposed in the first drainage path 21, and a second secondary side valve S2 is interposed in the second drainage path 22, so that the third drainage A third secondary valve S3 is interposed in the path 23. The first, second and third drainage passages 21, 22 and 23 merge with the drain pipe 24.

  The first, second, and third processing units 1, 2, and 3 include spin chucks C1, C2, and C3 as substrate holding and rotating mechanisms that hold the substrate W in a horizontal posture and rotate it around a vertical axis, respectively. Yes. The first, second, and third processing liquid nozzles N1, N2, and N3 are configured to supply the processing liquid to the upper surface of the substrate W held by the spin chucks C1, C2, and C3, respectively. The first, second, and third processing units 1, 2, 3, respectively, have a first for moving the first, second, and third nozzles N1, N2, N3 between the processing position and the retracted position, respectively. Second and third nozzle moving mechanisms M1, M2 and M3 are provided. The processing position means that the first, second and third nozzles N1, N2, and N3 are positioned above the substrate W held by the spin chucks C1, C2, and C3, and supply the processing liquid to the substrate W. Position. The retracted position is a position away from the upper space of the substrate W held by the spin chucks C1, C2, and C3, and may be a position on the side of the spin chucks C1, C2, and C3, for example.

  The substrate processing apparatus further controls the operation of the pump 5, the opening and closing of the valves P1 to P3, S1 to S3, the operations of the spin chucks C1 to C3, the operations of the first, second and third nozzle moving mechanisms M1 to M3. As a control means for this purpose, a control device 7 is provided. The control device 7 includes a microcomputer and necessary memory and other storage media. The control device 7 causes the substrate processing operation in the processing units 1, 2, 3 to be executed in accordance with a substrate processing procedure (recipe) set in advance.

FIG. 2 is a schematic sectional view for explaining a common configuration example of the processing units 1, 2, 3.
The processing units 1, 2, and 3 are single-wafer type substrate processing units that process disk-like substrates W such as semiconductor wafers one by one. The processing units 1, 2, and 3 include spin chucks C1, C2, and C3 (hereinafter collectively referred to as “spin chuck C”) that hold and rotate the substrate W horizontally, and a cylindrical cup that surrounds the spin chuck C. 15, a rinsing liquid nozzle 16 for supplying a rinsing liquid to the substrate W, the aforementioned nozzles N 1, N 2, N 3 (hereinafter collectively referred to as “nozzle N”), and a protective liquid nozzle for supplying a protective liquid to the substrate W 17. The nozzle N has a form of a droplet nozzle that causes a droplet of the processing liquid to collide with the substrate W.

  The spin chuck C holds the substrate W horizontally and can rotate around a vertical rotation axis L1 passing through the center of the substrate W, and a spin motor 19 that rotates the spin base 18 around the rotation axis L1. Including. The spin chuck C may be a chuck that holds the substrate W horizontally with the substrate W held in the horizontal direction, or by adsorbing the back surface (lower surface) of the substrate W that is a non-device forming surface. A vacuum chuck that holds the substrate W horizontally may be used. FIG. 2 schematically shows a clamping chuck.

  The rinse liquid nozzle 16 is connected to a rinse liquid supply pipe 31 in which a rinse liquid valve 30 is interposed. When the rinse liquid valve 30 is opened, the rinse liquid is discharged from the rinse liquid nozzle 16 toward the center of the upper surface of the substrate W. On the other hand, when the rinse liquid valve 30 is closed, the discharge of the rinse liquid from the rinse liquid nozzle 16 is stopped. As the rinsing liquid supplied to the rinsing liquid nozzle 16, pure water (deionized water), carbonated water, electrolytic ionic water, hydrogen water, ozone water, hydrochloric acid water having a diluted concentration (for example, about 10 to 100 ppm), etc. It can be illustrated.

  In this embodiment, the nozzle N is an inkjet nozzle that ejects a large number of droplets by an inkjet method, and has a form of a treatment liquid head. The nozzle N is referred to as a branch path 11, 12, 13 (hereinafter referred to as a branch path 10 when collectively referred to). ) To the processing liquid supply path 6. As described above, the primary side valves P1, P2, and P3 (hereinafter, collectively referred to as “primary side valves P”) are interposed in the branch path 10. Further, the nozzle N is connected to the drain pipe 24 via drainage paths 21, 22 and 23 (hereinafter collectively referred to as “drainage path 20”). As described above, the drainage passage 20 is provided with secondary side valves S1, S2, S3 (hereinafter collectively referred to as “secondary side valve S”).

As described above, the pump 5 is always driven during operation of the substrate processing apparatus. Then, the processing liquid is always supplied to the processing liquid supply path 6 at a predetermined pressure (for example, 10 MPa or less). Examples of the processing liquid supplied to the nozzle N include pure water, carbonated water, and SC-1 (mixed liquid containing NH ₄ OH and H ₂ O ₂ ).
Further, the nozzle N includes a piezoelectric element 34 (piezo element) disposed therein. The piezoelectric element 19 is connected to the drive circuit 36 via the wiring 35. Drive circuit 36 includes, for example, an inverter. The drive circuit 36 applies an alternating voltage to the piezoelectric element 34. When an AC voltage is applied to the piezoelectric element 34, the piezoelectric element 34 vibrates at a frequency corresponding to the frequency of the applied AC voltage. The control device 7 can change the frequency of the AC voltage applied to the piezoelectric element 34 to an arbitrary frequency (for example, several hundred KHz to several MHz) by controlling the drive circuit 36. Therefore, the frequency of vibration of the piezoelectric element 34 is controlled by the control device 7.

  The processing units 1, 2, and 3 further include nozzle moving mechanisms M1, M2, and M3 (hereinafter collectively referred to as “nozzle moving mechanism M”). The nozzle moving mechanism M includes a nozzle arm 40 that holds the nozzle N, a rotating mechanism 41 connected to the nozzle arm 40, and an elevating mechanism 42 connected to the rotating mechanism 41. The rotation mechanism 41 includes, for example, a motor. The elevating mechanism 42 includes, for example, a ball screw mechanism and a motor that drives the ball screw mechanism. The rotation mechanism 41 rotates the nozzle arm 40 around a vertical rotation axis L2 provided around the spin chuck C. The nozzle N rotates around the rotation axis L2 together with the nozzle arm 40. Thereby, the nozzle N moves in the horizontal direction. On the other hand, the elevating mechanism 42 elevates and lowers the rotating mechanism 41 in the vertical direction. The nozzle N and the nozzle arm 40 move up and down together with the rotation mechanism 41 in the vertical direction. As a result, the nozzle N moves in the vertical direction.

  The rotation mechanism 41 moves the nozzle N horizontally in a horizontal plane including the upper side of the spin chuck C. More specifically, the rotation mechanism 41 moves the nozzle N horizontally along an arc-shaped locus passing through the center of rotation of the substrate W above the substrate W held by the spin chuck C. When the lifting mechanism 42 lowers the nozzle N in a state where the nozzle N is positioned above the substrate W held by the spin chuck C, the nozzle N comes close to the upper surface of the substrate W. In a state where the nozzle N is close to the upper surface of the substrate W, the control device 7 controls the rotation mechanism 41 to rotate the nozzle arm 40 and controls the spin motor 19 to rotate the substrate W. Thus, the entire upper surface of the substrate W can be scanned with the droplets ejected from the nozzle N.

  The protective liquid nozzle 17 is held by the nozzle arm 40. Therefore, the nozzle N and the protective liquid nozzle 17 move in a state where the mutual positional relationship is kept constant. The protective liquid nozzle 17 is connected to a protective liquid supply pipe 45 in which a protective liquid valve 43 and a flow rate adjusting valve 44 are interposed. When the protective liquid valve 43 is opened, the protective liquid is discharged from the protective liquid nozzle 17 toward the upper surface of the substrate W. The discharge speed of the protective liquid from the protective liquid nozzle 17 is changed by the control device 7 adjusting the opening degree of the flow rate adjusting valve 44. Examples of the protective liquid supplied to the protective liquid nozzle 17 include a rinse liquid and a chemical liquid such as SC-1.

  When the droplets are supplied to the surface of the substrate W by the nozzle N, the protective liquid is simultaneously discharged from the protective liquid nozzle 17. Accordingly, the droplets from the nozzle N are ejected in a state where the protective liquid film is formed on the surface of the substrate W. Thereby, the foreign matter on the surface of the substrate W can be removed by the impact of the droplets discharged from the nozzles N while protecting the pattern on the surface of the substrate W with the protective liquid.

3A is a schematic side view of the nozzle N (N1, N2, N3) and the protective liquid nozzle 17, and FIG. 3B is a schematic plan view of the nozzle N (N1, N2, N3) and the protective liquid nozzle 17. is there. In FIG. 3B, only the lower surface Na (opposing surface facing the substrate W) of the nozzle N is shown.
The nozzle N includes a nozzle body 46 that ejects droplets of the processing liquid, a cover 47 that covers the nozzle body 46, a piezoelectric element 34 that is covered by the cover 47, and a seal that is interposed between the nozzle body 46 and the cover 47. 48. The nozzle body 46 and the cover 47 are both made of a chemical resistant material. The nozzle body 46 is made of, for example, quartz. The cover 47 is made of, for example, a fluorine resin. The seal 48 is made of an elastic material such as EPDM (ethylene-propylene-diene rubber). The nozzle body 46 is hollow and has a strength that can withstand high pressure (internal fluid pressure). A part of the nozzle body 46 and the piezoelectric element 34 are accommodated in the cover 47. An end of the wiring 35 is connected to the piezoelectric element 34 inside the cover 47 by, for example, solder. The inside of the cover 47 is sealed with a seal 48.

  The nozzle body 46 is formed in a hollow shape, and includes a supply port 49 as a primary side opening through which a processing liquid is supplied, a discharge port 50 as a secondary side opening through which the processing liquid is discharged, a supply port 49 and a discharge port. And a plurality of discharge holes 52 connected to the processing liquid flow passage 51. The processing liquid flow passage 51 defines an internal space of the nozzle body 46. The supply port 49, the discharge port 50, and the discharge hole 52 are opened on the surface of the nozzle body 46. The supply port 49 and the discharge port 50 are located above the discharge hole 52. The lower surface of the nozzle body 46 forms the lower surface Na of the nozzle N, and is, for example, a horizontal flat surface. The plurality of discharge holes 52 are opened at the lower surface Na. The discharge holes 52 are fine holes having a diameter of several μm to several tens of μm, for example. The branch path 10 and the drainage path 20 are connected to a supply port 49 and a discharge port 50, respectively.

  As shown in FIG. 3B, the plurality of ejection holes 52 constitutes a plurality (for example, four) of rows L. Each row L is constituted by a large number (for example, 10 or more) of ejection holes 52 arranged at equal intervals. Each row L extends linearly along the horizontal longitudinal direction D1. Each row L is not limited to a straight line, but may be a curved line. The four rows L are parallel. Two of the four rows L are adjacent to each other in a horizontal direction orthogonal to the longitudinal direction D1. Similarly, the remaining two rows L are adjacent to each other in the horizontal direction orthogonal to the longitudinal direction D1. Two adjacent rows L form a pair. In a pair of two rows L, a plurality of discharge holes 52 (discharge holes 52a in FIG. 3B) constituting one row L and a plurality of discharge holes 52 (discharge holes 52b in FIG. 3B) constituting the other row L. Is shifted in the longitudinal direction D1. The nozzle N is held by the nozzle arm 40 so that, for example, the four rows L intersect the movement locus of the nozzle N when viewed from the vertical direction.

  When the primary nozzle P is open, the processing liquid supplied to the supply port 49 via the branch path 10 is supplied to the processing liquid flow passage 51. At this time, when the secondary side valve S is closed, the pressure (fluid pressure) of the treatment liquid in the treatment liquid flow passage 51 is high, so that the treatment liquid is ejected from each discharge hole 52 by the liquid pressure. Further, when an AC voltage is applied to the piezoelectric element 34 with the secondary side valve S closed, vibration of the piezoelectric element 34 is imparted to the processing liquid flowing through the processing liquid flow passage 51, and each discharge hole 52. The processing liquid sprayed from is divided by this vibration. Therefore, when an alternating voltage is applied to the piezoelectric element 34 with the secondary valve S closed, a droplet of the processing liquid is ejected from each discharge hole 52. Thereby, a large number of droplets of the treatment liquid having a uniform particle size are simultaneously ejected at a uniform speed.

  On the other hand, in the state where the secondary side valve S is opened, the processing liquid supplied to the processing liquid flow path 51 is discharged from the discharge port 50 to the drainage path 20, so that the liquid in the processing liquid flow path 51 is The pressure is not high enough. Therefore, the processing liquid supplied to the processing liquid flow passage 51 is discharged from the discharge port 50 to the liquid discharge path 20 without being ejected from the discharge holes 52 that are fine holes. However, a small amount of processing liquid may leak from the discharge hole 52.

  When the processing liquid droplets collide with the upper surface of the substrate W, the control device 7 moves the nozzle N by the nozzle moving mechanism M (see FIG. 3), so that the lower surface Na of the nozzle N (the lower surface of the nozzle body 46). ) Is brought close to the upper surface of the substrate W. Then, the control device 7 opens the primary side valve P and closes the secondary side valve S in a state where the lower surface Na of the nozzle N faces the upper surface of the substrate W, and increases the pressure of the processing liquid flow passage 51. At the same time, the piezoelectric element 34 is driven to vibrate the processing liquid in the processing liquid flow passage 51. Thereby, a large number of droplets of the processing liquid having a uniform particle diameter are simultaneously ejected at a uniform speed and supplied to the upper surface of the substrate W. A large number of droplets ejected from the nozzle N are sprayed onto the two ejection regions T1 in the upper surface of the substrate W. That is, one ejection region T1 is a region immediately below one pair of the two rows L, and the droplets of the processing liquid ejected from the ejection holes 52 constituting the two rows L are in one ejection region. Sprayed to T1. Similarly, the other ejection area T1 is an area immediately below the other pair of two rows L, and the droplets of the processing liquid ejected from the ejection holes 52 constituting the two rows L are ejected from the other ejection area. Sprayed onto the region T1. Each injection region T1 has a rectangular shape in plan view extending in the longitudinal direction D1, and the two injection regions T1 are parallel to each other.

  The protective liquid nozzle 17 has a discharge port 53 for discharging the protective liquid. The protective liquid nozzle 17 discharges the protective liquid in the discharge direction D2 from the discharge port 53 toward the target position P1 on the substrate W. The target position P1 is a position upstream of the injection region T1 with respect to the rotation direction Dr of the substrate W. The discharge direction D2 is a direction from the discharge port 53 toward the target position P1, and is a direction from the discharge port 53 toward the nozzle N in plan view. The discharge direction D2 is inclined with respect to the longitudinal direction D1.

The protective liquid discharged from the protective liquid nozzle 17 changes its direction by colliding with the upper surface of the substrate W at the target position P1, and flows along the upper surface of the substrate W toward the ejection region T1 while spreading on the substrate W. As a result, the protective liquid enters between the nozzle N and the upper surface of the substrate W, and the protective liquid is supplied to the ejection region T1.
4A and 4B are timing charts for explaining the opening / closing operations of the first to third primary side valves P1 to P3 and the first to third secondary side valves S1 to S3. The control device 7 opens and closes the valves P1 to P3 and S1 to S3 as shown in FIG. 4A or 4B. In this example, one step as the control unit time is, for example, 5 seconds.

First, the first operation example shown in FIG. 4A will be described.
Steps 1 and 2 are in a standby state. Step 3 is a first nozzle moving step in the first processing unit 1 for moving the first nozzle N1 from the retracted position to the processing position. Step 4-9 is a first nozzle processing step in which droplets of the processing liquid are ejected from the first nozzle N1 in the first processing unit 1. Step 10 is a first nozzle moving step for moving the first nozzle N1 from the processing position to the retracted position, and at the same time, the second nozzle for moving the second nozzle N2 from the retracted position to the processing position in the second processing unit 2. It is a moving step. Step 11-16 is a second nozzle processing step for causing the processing liquid droplets to be ejected from the second nozzle N 2 in the second processing unit 2. Step 17 is a second nozzle moving step for moving the second nozzle N2 from the processing position to the retracted position. At the same time, in the third processing unit 3, the third nozzle N3 is moved from the retracted position to the processing position. It is a moving step. Step 18-23 is a third nozzle processing step in which droplets of the processing liquid are ejected from the third nozzle N3 in the third processing unit 3. Step 24 is a third nozzle moving step for moving the third nozzle N3 from the processing position to the retracted position. At the same time, in the first processing unit 1, the first nozzle for moving the first nozzle N1 from the retracted position to the processing position. It is a moving step. By returning to step 4 after step 24, the substrate processing in the first, second, and third processing units 1, 2, and 3 can be cyclically repeated. When the substrate processing is interrupted to enter the standby state, the process returns to step 1.

  In Steps 1 and 2 (standby state), the first, second, and third nozzles N1, N2, and N3 are all located at their retracted positions, and the control device 7 performs the operations of the first, second, and second nozzles. The three primary side valves P1, P2, P3 and the first, second, and third secondary side valves S1, S2, S3 are all controlled to be in the open state. Further, the control device 7 always keeps the pump 5 in an operating state during the operation of the substrate processing apparatus. At this time, the processing liquid sent out from the pump 5 branches from the processing liquid supply path 6 to the first, second, and third branch paths 11, 12, and 13, respectively, the first, second, and third primary sides, respectively. First, second and second valves P1, P2, P3, first, second and third nozzles N1, N2, N3, and first, second and third secondary valves S1, S2, S3, respectively. The third drainage passages 21, 22 and 23 join the drain pipe 24 and are drained. Although a small amount of processing liquid may leak from the discharge holes 52 of the first, second, and third nozzles N1, N2, and N3, the first, second, and third nozzles N1, N2, and N3 are all retracted. Since it is in the position, there is no possibility that the processing liquid falls on the substrate W.

  In step 3 (first nozzle movement step), the control device 7 closes the first primary side valve P1, and controls the second and third primary side valves P2 and P3, and the first, second and third secondary sides. Valves S1, S2, and S3 are all controlled to be in an open state. Accordingly, since the processing liquid is not supplied to the first nozzle N1, the processing liquid does not leak from the first nozzle N1. In this state, the control device 7 controls the first nozzle moving mechanism M1 to move the first nozzle N1 from the retracted position to the processing position. At this time, the processing liquid sent out from the pump 5 branches from the processing liquid supply path 6 to the second and third branch paths 12 and 13, respectively, and the second and third primary side valves P2, P3, second and third, respectively. Through the third nozzles N2 and N3 and the second and third secondary valves S2 and S3, respectively, the second and third drainage passages 22 and 23 join the drain pipe 24 and are drained. Therefore, even if the first primary valve P1 is closed, the hydraulic pressure in the pipe does not become excessive. Although a small amount of processing liquid may leak from the discharge holes 52 of the second and third nozzles N2 and N3, both the second and third nozzles N2 and N3 are in the retracted position, and thus the processing is performed on the substrate W. There is no risk of the liquid falling. In step 3, the first secondary valve S <b> 1 may be closed, but FIG. 4A shows an example of controlling them to the open state.

  In step 4-9 (first nozzle processing step), the control device 7 opens the first primary valve P1 and closes the first secondary valve S1. Further, the control device 7 closes the second and third primary side valves P2 and P3. The second and third secondary side valves S2 and S3 may be in an open state or a closed state. FIG. 4A shows an example of controlling them to an open state. In this way, in the first nozzle N1, the first primary valve P1 is opened and the second secondary valve S1 is closed, so that the hydraulic pressure in the internal space of the nozzle body 46 increases. As a result, droplets are discharged from the discharge holes 52 of the first nozzle N1 and supplied onto the substrate W held by the spin chuck C1. Since the second and third primary valves P2 and P3 are closed, the flow paths passing through the second or third nozzles N2 and N3 are both blocked, so that a sufficient hydraulic pressure is applied to the first nozzle N1. Treatment liquid can be supplied.

  In step 10 (first nozzle moving step and second nozzle moving step), the control device 7 closes the first primary valve P1 and the second primary valve P2, the third primary valve P3, and the first, The second and third secondary side valves S1, S2, S3 are controlled to be opened. Accordingly, since the processing liquid is not supplied to the first nozzle N1 and the second nozzle N2, the processing liquid does not leak from the first nozzle N1 and the second nozzle N2. In this state, the control device 7 controls the first nozzle moving mechanism M1 to move the first nozzle N1 from the processing position to the retracted position. Further, the control device 7 controls the second nozzle moving mechanism M2 to move the second nozzle N2 from the retracted position to the processing position. At this time, the processing liquid sent out from the pump 5 branches from the processing liquid supply path 6 to the third branch path 13, and the third primary side valve P3, the third nozzle N3, and the third secondary side valve S3 are sequentially supplied. Then, the liquid is drained from the third drainage path 22 to the drain pipe 24. Therefore, even if the first primary valve P1 and the second primary valve P2 are closed, the hydraulic pressure in the pipe does not become excessive. Although a small amount of processing liquid may leak from the ejection hole 52 of the third nozzle N3, the third nozzle N3 is in the retracted position, so there is no possibility that the processing liquid will fall on the substrate W. In step 10, the first secondary valve S1 and the second secondary valve S2 may be closed. FIG. 4A shows an example of controlling them to the open state.

  In step 11-16 (second nozzle processing step), the control device 7 opens the second primary valve P2 and closes the second secondary valve S2. Furthermore, the control device 7 closes the first and third primary valves P1, P3. The first and third secondary valves S1 and S3 may be in an open state or a closed state. FIG. 4A shows an example of controlling them to an open state. In this way, in the second nozzle N2, the second primary side valve P2 is opened and the second secondary side valve S2 is closed, so that the hydraulic pressure in the internal space of the nozzle body 46 increases. As a result, droplets are discharged from the discharge holes 52 of the second nozzle N2 and supplied onto the substrate W held by the spin chuck C2. Since the first and third primary valves P1 and P3 are closed, the flow paths passing through the first or third nozzles N1 and N3 are both blocked, so that a sufficient hydraulic pressure is applied to the second nozzle N2. Treatment liquid can be supplied.

  In step 17 (second nozzle moving step and third nozzle moving step), the control device 7 closes the second primary side valve P2 and the third primary side valve P3, the first primary side valve P1, and the first, The second and third secondary side valves S1, S2, S3 are controlled to be opened. Accordingly, since the processing liquid is not supplied to the second nozzle N2 and the third nozzle N3, the processing liquid does not leak from the second nozzle N2 and the third nozzle N3. In this state, the control device 7 controls the second nozzle moving mechanism M2 to move the second nozzle N2 from the processing position to the retracted position. Further, the control device 7 controls the third nozzle moving mechanism M3 to move the third nozzle N3 from the retracted position to the processing position. At this time, the processing liquid sent out from the pump 5 branches from the processing liquid supply path 6 to the first branch path 11, and the first primary side valve P1, the first nozzle N1, and the first secondary side valve S1 are sequentially arranged. Then, the liquid is drained from the first drainage path 21 to the drain pipe 24. Therefore, even if the second primary side valve P2 and the third primary side valve P3 are closed, the hydraulic pressure in the pipe does not become excessive. Although a small amount of processing liquid may leak from the discharge hole 52 of the first nozzle N1, the first nozzle N1 is in the retracted position, so there is no possibility that the processing liquid will fall on the substrate W. In step 17, the second secondary side valve S2 and the third secondary side valve S3 may be closed, but FIG. 4A shows an example of controlling them to the open state.

  In step 18-23 (third nozzle processing step), the control device 7 opens the third primary side valve P3 and closes the third secondary side valve S3. Further, the control device 7 closes the first and second primary side valves P1, P2. The first and second secondary valves S1 and S2 may be in an open state or a closed state. FIG. 4A shows an example of controlling them to an open state. In this way, in the third nozzle N3, the third primary valve P3 is opened and the third secondary valve S3 is closed, so that the hydraulic pressure in the internal space of the nozzle body 46 increases. As a result, droplets are discharged from the discharge hole 52 of the third nozzle N3 and supplied onto the substrate W held by the spin chuck C3. Since the first and second primary valves P1 and P2 are closed, the flow paths passing through the first or second nozzles N1 and N2 are both blocked, so that a sufficient hydraulic pressure is applied to the third nozzle N3. Treatment liquid can be supplied.

  In step 24 (third nozzle moving step and first nozzle moving step), the control device 7 closes the first primary valve P1 and the third primary valve P3, the second primary valve P2, and the first, The second and third secondary side valves S1, S2, S3 are controlled to be opened. Accordingly, since the processing liquid is not supplied to the first nozzle N1 and the third nozzle N3, the processing liquid does not leak from the first nozzle N1 and the third nozzle N3. In this state, the control device 7 controls the third nozzle moving mechanism M3 to move the third nozzle N3 from the processing position to the retracted position. Further, the control device 7 controls the first nozzle moving mechanism M1 to move the first nozzle N1 from the retracted position to the processing position. At this time, the processing liquid sent out from the pump 5 branches from the processing liquid supply path 6 to the second branch path 12, and the second primary side valve P2, the second nozzle N2, and the second secondary side valve S2 are sequentially arranged. Then, the liquid is drained from the second drainage path 22 to the drain pipe 24. Therefore, even if the first primary side valve P1 and the third primary side valve P3 are closed, the hydraulic pressure in the pipe does not become excessive. Although a small amount of processing liquid may leak from the discharge hole 52 of the second nozzle N2, the second nozzle N2 is in the retracted position, so there is no possibility that the processing liquid will fall on the substrate W. In step 24, the first secondary side valve S1 and the third secondary side valve S3 may be closed, but FIG. 4A shows an example of controlling them to the open state.

  Next, a second operation example shown in FIG. 4B will be described. In the second operation example, during the execution of the processing step in one processing unit, simultaneously, the nozzle movement step for moving the nozzle from the retracted position to the processing position is performed in parallel in another processing unit. During the execution of the processing step in the other processing unit, a nozzle moving step for moving the nozzle from the processing position to the retracted position is simultaneously performed in the one processing unit. Hereinafter, a difference from the first operation example of FIG. 4A will be specifically described.

  In the second operation example shown in FIG. 4B, steps 10, 17, and 24 described in the first operation example are omitted. That is, when the processing step 4-9 in the first processing unit 1 is completed, the processing step 11-16 in the first processing unit 2 is immediately started. Further, when the processing step 11-16 in the second processing unit 2 is completed, the processing step 18-23 in the third processing unit 3 is immediately started. Further, when the processing step 18-23 in the third processing unit 3 is completed, the processing step 4-9 in the first processing unit 1 is immediately started. However, step 24 is executed when the standby state is set after the processing step in the second processing unit 3.

  On the other hand, in the last step 9 (or previous step) of the processing steps 4-9 in the first processing unit 1, the second processing unit 2 moves the second nozzle N2 from the retracted position to the processing position. The second nozzle moving step is performed in parallel. That is, the control device 7 controls the second nozzle moving mechanism M2 while the substrate processing using the first nozzle N1 is being performed in the first processing unit 1, and processes the second nozzle N2 from the retracted position. Move to position. At this time, since the second primary side valve P2 is controlled to be closed, the processing liquid does not fall on the substrate W from the second nozzle N2. Further, in the first step 11 (or subsequent steps) of the processing steps 11-16 in the second processing unit 2, in the first processing unit 1, the first nozzle N1 is moved from the processing position to the retracted position. The first nozzle moving step is performed in parallel. That is, the control device 7 controls the first nozzle moving mechanism M1 while the substrate processing using the second nozzle N2 is performed in the second processing unit 2, and retracts the first nozzle N1 from the processing position. Move to position. At this time, since the first primary valve P1 is controlled to be closed, the processing liquid does not fall on the substrate W from the first nozzle N1.

  Similarly, in the last step 16 (or previous step) of the processing steps 11-16 in the second processing unit 2, the third processing unit 3 moves the third nozzle N3 from the retracted position to the processing position. The third nozzle moving step for performing the operation is performed in parallel. That is, the control device 7 controls the third nozzle moving mechanism M3 to process the third nozzle N3 from the retracted position while the substrate processing using the second nozzle N2 is performed in the second processing unit 2. Move to position. At this time, since the third primary side valve P3 is controlled to be closed, the processing liquid does not fall on the substrate W from the third nozzle N3. Furthermore, in the first step 18 (or subsequent steps) of the processing steps 18-23 in the third processing unit 3, the second processing unit 2 moves the second nozzle N2 from the processing position to the retracted position. The second nozzle moving step is performed in parallel. That is, the control device 7 controls the second nozzle moving mechanism M2 while the substrate processing using the third nozzle N3 is being performed in the third processing unit 3, and retracts the second nozzle N2 from the processing position. Move to position. At this time, since the second primary side valve P2 is controlled to be closed, the processing liquid does not fall on the substrate W from the second nozzle N2.

  Similarly, in the last step 23 (or previous step) of the processing steps 18-23 in the third processing unit 3, the first processing unit 1 moves the first nozzle N1 from the retracted position to the processing position. The first nozzle moving step for moving is performed in parallel. That is, the control device 7 controls the first nozzle moving mechanism M1 to process the first nozzle N1 from the retracted position while the substrate processing using the third nozzle N3 is performed in the third processing unit 3. Move to position. At this time, since the first primary valve P1 is controlled to be closed, the processing liquid does not fall on the substrate W from the first nozzle N1. Further, in the first step 4 (or subsequent steps) of the processing steps 4-9 in the first processing unit 1, in the third processing unit 3, the third nozzle N3 is moved from the processing position to the retracted position. The third nozzle moving step is performed in parallel. That is, the control device 7 controls the third nozzle moving mechanism M3 while the substrate processing using the first nozzle N1 is performed in the first processing unit 1, and retracts the third nozzle N3 from the processing position. Move to position. At this time, since the third primary side valve P3 is controlled to be closed, the processing liquid does not fall on the substrate W from the third nozzle N3.

When the standby state is set after step 23, it is only necessary to return to step 1 after executing step 24 (movement of the third nozzle N3 to the retracted position).
FIG. 5 is a diagram for explaining a progress example (example) of processing in the first to third processing units 1, 2, 3. The total processing time executed on the substrate W in each processing unit 1, 2 and 3 is 95 seconds, of which spray processing using the nozzles N1, N2 and N3 is 30 seconds (6 steps). To do. In the remaining 65 seconds, for example, liquid processing (chemical processing or rinsing processing) for supplying a processing liquid onto the substrate W using another nozzle, or the spin chucks C1, C2, and C3 are rotated at high speed on the substrate W. A spin dry process is performed to shake off the liquid.

  The progress example of the process shown in FIG. 5 follows the operation example of FIG. 4B. That is, the processing step (spray processing) in the second processing unit 2 starts immediately after the end of the processing step (spray processing) in the first processing unit 1. Further, immediately after the end of the processing step (spray processing) in the second processing unit 2, the processing step (spray processing) in the third processing unit 3 starts. Since the total time of the processing steps (spray processing) in the first, second and third processing units 1, 2 and 3 is 90 seconds (= 30 seconds × 3), 5 seconds with respect to 95 seconds of the total processing time. I can afford. Thus, while the pump 5 is shared by the three processing units 1, 2, and 3, the substrate W can be efficiently processed to improve productivity.

  FIG. 6 is a diagram for explaining an example of processing progress in the configuration of the comparative example. In this comparative example, the first nozzle N1 is moved between the retracted position and the processing position, the second nozzle N2 is moved between the retracted position and the processing position, and the third nozzle N3 is moved to the retracted position. When moving between the processing positions, the pump 5 is stopped. Then, after the nozzle moves from the retracted position to the processing position, the pump 5 starts to operate, and after the press-in step (for example, 5 seconds), the discharge of droplets onto the substrate W starts. Further, after the processing step (spray processing) using the liquid droplets is finished, the operation of the pump 5 is stopped, and the pressure releasing step (for example, for releasing the pressure of the liquid droplets in the nozzle so that the processing liquid does not come out) 5 seconds). Therefore, a pressing step and a depressurizing step (10 seconds in total) are required between the processing step in the first processing unit 1 and the processing step in the second processing unit 2. Similarly, a compression step and a depressurization step (10 seconds in total) are required between the processing step in the second processing unit 2 and the processing step in the third processing unit 3. Therefore, as compared with the example of FIG. 5, the time required for processing one substrate W in one processing unit is increased by 10 seconds. Moreover, there is only a margin of 5 steps (25 seconds) from the end of the processing step and the depressurization step in the second processing unit 2 to the start of the next press-in step in the first processing unit 1, so that within this period The processing step in the third processing unit 3 cannot be completed. Therefore, in order to share the pump 5 among the three processing units 1, 2, 3, it is inevitable that a waiting time is generated in each processing unit 1, 2, 3. Therefore, productivity is not good compared with the process example of FIG.

  As described above, according to this embodiment, by selecting and opening any one of the first primary valve P1, the second primary valve P2, and the third primary valve P3, one pump 5 can be opened. Since the process can be shared by the first, second and third processing units 1, 2 and 3, the configuration is simplified and the cost of the substrate processing apparatus can be reduced. When the primary side valve P corresponding to one of the nozzles N is closed, the set of the primary side valve P and the secondary side valve S corresponding to another nozzle N is opened, and the pump 5 is held in a driving state. The For example, when closing the first primary valve P1, the set of the second primary valve P2 and the second secondary valve S2, or the set of the third primary valve P3 and the third secondary valve S2, is opened. The pump 5 is kept in a driving state. Therefore, while the processing liquid discharge from the nozzle N which closed the primary side valve P is stopped immediately, the processing liquid can be discharged from the other nozzles N as soon as necessary. That is, since the pump 5 is maintained in the driving state, both the press-in time and the pressure-release time can be eliminated, so that the substrate processing time in the first, second and third processing units 1, 2, 3 can be shortened. The productivity of substrate processing can be improved. Moreover, when the primary valve P of one nozzle N is closed, the set of the primary nozzle P and the secondary nozzle S of another nozzle N is opened, so that the liquid pressure in the processing liquid supply path 6 and the like is excessive. There is no risk of becoming. Further, by closing the primary side valve, the processing liquid does not come out from the corresponding nozzle N, so that the processing liquid can be prevented from dropping from the nozzle N onto the substrate W. In this way, it is possible to provide a substrate processing apparatus that can realize excellent productivity while avoiding the dropping of the processing liquid onto the substrate W, and can simplify the configuration and reduce the cost.

  In this embodiment, the primary valve P corresponding to the nozzle N is closed during the period in which the nozzle N is moved between the retracted position and the processing position. Accordingly, since the processing liquid does not leak from the nozzle N, it is possible to avoid the processing liquid from inadvertently dropping on the substrate W during the movement of the nozzle N, and the substrate processing quality can be improved. In addition, since the pump is held in the driving state, after the nozzle N is moved from the retracted position to the processing position, when the primary valve P corresponding to the nozzle N is opened, the processing liquid is immediately discharged from the nozzle N. Can start. Further, immediately after the processing by the nozzle N is completed, the primary valve P corresponding to the nozzle can be closed and the nozzle N can be quickly returned to the retracted position. In this way, productivity required can be improved by shortening the time required for substrate processing.

  As mentioned above, although one Embodiment of this invention was described, this invention can also be implemented with another form. For example, in the above-described embodiment, an example in which one processing unit 1, 2, and 3 share one pump 5 has been described. However, two processing units share one pump or four or more processing units. A unit may share a single pump. Furthermore, in the above-described embodiment, the nozzle N having the form of the treatment liquid head having the plurality of discharge holes 52 is exemplified, but a nozzle having a smaller number of discharge holes (for example, one discharge hole) may be used. . In the above-described embodiment, the processing units 1, 2, and 3 including the spin chuck C as a substrate holding mechanism that holds the substrate W are exemplified. However, another form of substrate that holds the substrate W in a non-rotating state. A holding mechanism may be used. Furthermore, in the above-described embodiment, the circular substrate W is illustrated, but the present invention may be applied to processing a substrate having another shape such as a square. Furthermore, although the primary side valves P1, P2, and P3 are individually shown in the drawings used for the description of the above-described embodiment, these may be integrated into one valve unit. Similarly, the secondary side valves S1, S2, and S3 may be individual units or may be a single integrated valve unit.

  In addition, various design changes can be made within the scope of matters described in the claims.

N Nozzle N1 First nozzle N2 Second nozzle N3 Third nozzle P Primary side valve P1 First primary side valve P2 Second primary side valve P3 Third primary side valve S Secondary side valve S1 First secondary side valve S2 First 2 Secondary valve S3 Third secondary valve C Spin chuck C1 Spin chuck C2 Spin chuck C3 Spin chuck M Nozzle movement mechanism M1 First nozzle movement mechanism M2 Second nozzle movement mechanism M3 Third nozzle movement mechanism 1 First processing Unit 2 second processing unit 3 third processing unit 4 processing liquid supply source 5 pump 6 processing liquid supply path 7 control device 10 branch path 11 first branch path 12 second branch path 13 third branch path 20 drainage path 21 first 1 drainage path 22 second drainage path 23 third drainage path 24 drain piping 34 piezoelectric element 36 drive circuit 40 nozzle arm 41 times Moving mechanism 42 Elevating mechanism 46 Nozzle body 49 Supply port 50 Discharge port 51 Treatment liquid flow path 52 Discharge hole

Claims (20)

A substrate processing apparatus having a first processing unit and a second processing unit for processing a substrate with a processing liquid,
A pump for pressurizing and feeding the processing liquid;
A treatment liquid supply path connected to the pump;
A first branch path branched from the treatment liquid supply path;
A second branch path branched from the processing liquid supply path;
A first nozzle connected to the first branch path and disposed in the first processing unit;
A second nozzle connected to the second branch path and disposed in the second processing unit;
A first primary valve interposed in the first branch path;
A second primary side valve interposed in the second branch path;
A first drainage channel connected to the first nozzle;
A second drainage path connected to the second nozzle;
A first secondary valve interposed in the first drainage path;
A second secondary side valve interposed in the second drainage path;
And a control means for opening the second primary valve and the second secondary valve while keeping the pump in a driving state when the first primary valve is closed. A first nozzle moving mechanism for moving the first nozzle between a retracted position and a processing position;
2. The substrate processing according to claim 1 , wherein the control unit closes the first primary valve when the first nozzle moving mechanism moves the first nozzle between the retracted position and the processing position. 3. apparatus. The first nozzle is a hollow in which a first primary side opening connected to the first branch path, a first secondary side opening connected to the first drainage path, and a plurality of first discharge holes are formed. A first processing liquid head that discharges liquid droplets of the processing liquid from the plurality of first discharge holes,
The second nozzle is a hollow in which a second primary side opening connected to the second branch passage, a second secondary side opening connected to the second drainage passage, and a plurality of second discharge holes are formed. the second has a nozzle body, has the form of a second treatment liquid head which ejects droplets of the treatment liquid from the plurality of second discharge holes, the substrate processing apparatus according to claim 1 or 2. A substrate processing apparatus having a first processing unit, a second processing unit, and a third processing unit for processing a substrate with a processing liquid,
A pump for pressurizing and feeding the processing liquid;
A treatment liquid supply path connected to the pump;
A first branch path branched from the treatment liquid supply path;
A second branch path branched from the processing liquid supply path;
A third branch path branched from the treatment liquid supply path;
A first nozzle connected to the first branch path and disposed in the first processing unit;
A second nozzle connected to the second branch path and disposed in the second processing unit;
A third nozzle connected to the third branch path and disposed in the third processing unit;
A first primary valve interposed in the first branch path;
A second primary side valve interposed in the second branch path;
A third primary side valve interposed in the third branch path;
A first drainage channel connected to the first nozzle;
A second drainage path connected to the second nozzle;
A third drainage channel connected to the third nozzle;
A first secondary valve interposed in the first drainage path;
A second secondary side valve interposed in the second drainage path;
A third secondary valve interposed in the third drainage path;
When the first primary valve is closed, the second primary valve and the second secondary valve, or the third primary valve and the third secondary side are maintained while the pump is maintained in a driving state. A substrate processing apparatus including control means for opening a valve . 5. The substrate processing according to claim 4 , wherein when the second primary side valve is closed, the control unit opens the first primary side valve or the third primary side valve while maintaining the pump in a driving state. 6. apparatus. Said control means, when closing the third primary valve, while maintaining the pump driving state, opening the first primary side valve or the second primary side valve, according to claim 4 or 5 Substrate processing equipment. When the control means closes the second primary side valve, the first primary side valve and the first secondary side valve, or the third primary side valve and the The substrate processing apparatus according to claim 4 , wherein the third secondary side valve is opened. When the control means closes the third primary side valve, the first primary side valve and the first secondary side valve, or the second primary side valve and the The substrate processing apparatus of Claim 4 or 7 which opens a 2nd secondary side valve | bulb. A first nozzle moving mechanism for moving the first nozzle between a retracted position and a processing position;
A second nozzle moving mechanism for moving the second nozzle between a retracted position and a processing position;
A third nozzle moving mechanism for moving the third nozzle between a retracted position and a processing position;
The control means closes the first primary valve when the first nozzle moving mechanism moves the first nozzle between the retracted position and the processing position, and the second nozzle moving mechanism When the second nozzle is moved between the retracted position and the processing position, the second primary valve is closed, and the third nozzle moving mechanism moves the third nozzle between the retracted position and the processing position. when moving between, closing said third primary-side valve, the substrate processing apparatus of claim 8 according to claim 7. The first nozzle is a hollow in which a first primary side opening connected to the first branch path, a first secondary side opening connected to the first drainage path, and a plurality of first discharge holes are formed. A first processing liquid head that discharges liquid droplets of the processing liquid from the plurality of first discharge holes,
The second nozzle is a hollow in which a second primary side opening connected to the second branch passage, a second secondary side opening connected to the second drainage passage, and a plurality of second discharge holes are formed. A second processing liquid head for discharging liquid droplets of the processing liquid from the plurality of second discharge holes,
The third nozzle is a hollow in which a third primary side opening connected to the third branch passage, a third secondary side opening connected to the third drainage passage, and a plurality of third discharge holes are formed. A third processing liquid head having a third nozzle main body and discharging a liquid droplet of the processing liquid from the plurality of third discharge holes, according to any one of claims 4 to 9. Substrate processing equipment. A substrate processing method executed in a substrate processing apparatus having a first processing unit and a second processing unit for processing a substrate with a processing liquid,
The substrate processing apparatus is
A pump for pressurizing and feeding the processing liquid;
A treatment liquid supply path connected to the pump;
A first branch path branched from the treatment liquid supply path;
A second branch path branched from the processing liquid supply path;
A first nozzle connected to the first branch path and disposed in the first processing unit;
A second nozzle connected to the second branch path and disposed in the second processing unit;
A first primary valve interposed in the first branch path;
A second primary side valve interposed in the second branch path ;
A first drainage channel connected to the first nozzle;
A second drainage path connected to the second nozzle;
A first secondary valve interposed in the first drainage path;
A second secondary side valve interposed in the second drainage path ,
The substrate processing method includes a step of opening the second primary valve and the second secondary valve while holding the pump in a driving state when the first primary valve is closed. . The substrate processing apparatus further includes a first nozzle moving mechanism that moves the first nozzle between a retracted position and a processing position,
The substrate processing method, when the first nozzle moving mechanism moves the first nozzle between said processing position and said retracted position, comprising the step of closing the first primary valve, to claim 11 The substrate processing method as described. The first nozzle is a hollow in which a first primary side opening connected to the first branch path, a first secondary side opening connected to the first drainage path, and a plurality of first discharge holes are formed. A first processing liquid head that discharges liquid droplets of the processing liquid from the plurality of first discharge holes,
The second nozzle is a hollow in which a second primary side opening connected to the second branch passage, a second secondary side opening connected to the second drainage passage, and a plurality of second discharge holes are formed. the second has a nozzle body, has the form of a second treatment liquid head which ejects droplets of the treatment liquid from the plurality of second discharge holes, the substrate processing method according to claim 11 or 12. A substrate processing method executed in a substrate processing apparatus having a first processing unit, a second processing unit, and a third processing unit for processing a substrate with a processing liquid,
The substrate processing apparatus includes:
A pump for pressurizing and feeding the processing liquid;
A treatment liquid supply path connected to the pump;
A first branch path branched from the treatment liquid supply path;
A second branch path branched from the processing liquid supply path;
A third branch path branched from the treatment liquid supply path;
A first nozzle connected to the first branch path and disposed in the first processing unit;
A second nozzle connected to the second branch path and disposed in the second processing unit;
A third nozzle connected to the third branch path and disposed in the third processing unit;
A first primary valve interposed in the first branch path;
A second primary side valve interposed in the second branch path;
A third primary side valve interposed in the third branch path ;
A first drainage channel connected to the first nozzle;
A second drainage path connected to the second nozzle;
A third drainage channel connected to the third nozzle;
A first secondary valve interposed in the first drainage path;
A second secondary side valve interposed in the second drainage path;
A third secondary valve interposed in the third drainage path ,
In the substrate processing method, when the first primary side valve is closed, the second primary side valve and the second secondary side valve, or the third primary side valve and the pump are kept in a driving state. A substrate processing method comprising the step of opening the third secondary valve . The substrate processing method according to claim 14 , further comprising the step of opening the first primary valve or the third primary valve while holding the pump in a driving state when the second primary valve is closed. . 16. The substrate according to claim 14 , further comprising the step of opening the first primary valve or the second primary valve while holding the pump in a driving state when closing the third primary valve. Processing method. When the second primary side valve is closed, the first primary side valve and the first secondary side valve, or the third primary side valve and the third secondary side are maintained while the pump is kept in a driving state. The substrate processing method according to claim 14 , comprising the step of opening a valve. When the third primary valve is closed, the first primary valve and the first secondary valve, or the second primary valve and the second secondary side are maintained while the pump is maintained in a driving state. The substrate processing method of Claim 14 or 17 including the step which opens a valve | bulb. The substrate processing apparatus includes:
A first nozzle moving mechanism for moving the first nozzle between a retracted position and a processing position;
A second nozzle moving mechanism for moving the second nozzle between a retracted position and a processing position;
A third nozzle moving mechanism for moving the third nozzle between a retracted position and a processing position;
The substrate processing method includes a step of closing the first primary valve when the first nozzle moving mechanism moves the first nozzle between the retracted position and the processing position; and the second nozzle moving Closing a second primary valve when the mechanism moves the second nozzle between the retracted position and the processing position; and the third nozzle moving mechanism moves the third nozzle to the retracted position. wherein when moving between a processing position and a step of closing said third primary-side valve, the substrate processing method according to claim 18 according to claim 17. The first nozzle is a hollow in which a first primary side opening connected to the first branch path, a first secondary side opening connected to the first drainage path, and a plurality of first discharge holes are formed. A first processing liquid head that discharges liquid droplets of the processing liquid from the plurality of first discharge holes,
The second nozzle is a hollow in which a second primary side opening connected to the second branch passage, a second secondary side opening connected to the second drainage passage, and a plurality of second discharge holes are formed. A second processing liquid head for discharging liquid droplets of the processing liquid from the plurality of second discharge holes,
The third nozzle is a hollow in which a third primary side opening connected to the third branch passage, a third secondary side opening connected to the third drainage passage, and a plurality of third discharge holes are formed. a third nozzle body, has the form of a third treatment liquid head for ejecting the treatment liquid droplets from the plurality of third ejecting hole, according to any one of claims 14-19 Substrate processing method.

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