JP5827053B2 - Water-based metal surface treatment agent and metal material treated with the treatment agent - Google Patents
Water-based metal surface treatment agent and metal material treated with the treatment agent Download PDFInfo
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- JP5827053B2 JP5827053B2 JP2011157013A JP2011157013A JP5827053B2 JP 5827053 B2 JP5827053 B2 JP 5827053B2 JP 2011157013 A JP2011157013 A JP 2011157013A JP 2011157013 A JP2011157013 A JP 2011157013A JP 5827053 B2 JP5827053 B2 JP 5827053B2
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- iii
- surface treatment
- compound
- treatment agent
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- 229910052751 metal Inorganic materials 0.000 title claims description 85
- 239000002184 metal Substances 0.000 title claims description 84
- 239000007769 metal material Substances 0.000 title claims description 59
- 239000012756 surface treatment agent Substances 0.000 title claims description 58
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims description 30
- 229910001868 water Inorganic materials 0.000 title claims description 30
- 239000003795 chemical substances by application Substances 0.000 title claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 55
- 238000004381 surface treatment Methods 0.000 claims description 47
- 150000002484 inorganic compounds Chemical class 0.000 claims description 44
- 150000002894 organic compounds Chemical class 0.000 claims description 42
- -1 methylol group Chemical group 0.000 claims description 35
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 32
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 32
- 229910010272 inorganic material Inorganic materials 0.000 claims description 26
- 229910052726 zirconium Inorganic materials 0.000 claims description 11
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 9
- 229910052714 tellurium Inorganic materials 0.000 claims description 9
- 229910052719 titanium Inorganic materials 0.000 claims description 9
- 125000000524 functional group Chemical group 0.000 claims description 8
- 125000003172 aldehyde group Chemical group 0.000 claims description 6
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 5
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 5
- 229910052684 Cerium Inorganic materials 0.000 claims description 4
- 150000003682 vanadium compounds Chemical class 0.000 claims description 2
- 150000001298 alcohols Chemical class 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 37
- 239000011347 resin Substances 0.000 description 37
- 238000000576 coating method Methods 0.000 description 29
- 239000002253 acid Substances 0.000 description 27
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- 238000000034 method Methods 0.000 description 22
- 238000012545 processing Methods 0.000 description 22
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- 125000005595 acetylacetonate group Chemical group 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- 229910052712 strontium Inorganic materials 0.000 description 12
- 229910052725 zinc Inorganic materials 0.000 description 11
- 239000011701 zinc Substances 0.000 description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 10
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- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 9
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- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 8
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- 239000011572 manganese Substances 0.000 description 7
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 6
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- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 6
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 6
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 6
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- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 6
- 239000008151 electrolyte solution Substances 0.000 description 6
- 229910052744 lithium Inorganic materials 0.000 description 6
- 229910001416 lithium ion Inorganic materials 0.000 description 6
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- 239000011591 potassium Substances 0.000 description 6
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- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 5
- 238000009820 dry lamination Methods 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
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- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 4
- 229910052735 hafnium Inorganic materials 0.000 description 4
- 229910052746 lanthanum Inorganic materials 0.000 description 4
- 229910052758 niobium Inorganic materials 0.000 description 4
- 239000010955 niobium Substances 0.000 description 4
- 239000005022 packaging material Substances 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- IATRAKWUXMZMIY-UHFFFAOYSA-N strontium oxide Chemical compound [O-2].[Sr+2] IATRAKWUXMZMIY-UHFFFAOYSA-N 0.000 description 4
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 4
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
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- 229910052779 Neodymium Inorganic materials 0.000 description 3
- 229910000990 Ni alloy Inorganic materials 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000002981 blocking agent Substances 0.000 description 3
- 229910052792 caesium Inorganic materials 0.000 description 3
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 3
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 3
- 239000000292 calcium oxide Substances 0.000 description 3
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 3
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Inorganic materials [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 3
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 3
- 229940021013 electrolyte solution Drugs 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- SHXXPRJOPFJRHA-UHFFFAOYSA-K iron(iii) fluoride Chemical compound F[Fe](F)F SHXXPRJOPFJRHA-UHFFFAOYSA-K 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
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- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 3
- DCKVFVYPWDKYDN-UHFFFAOYSA-L oxygen(2-);titanium(4+);sulfate Chemical compound [O-2].[Ti+4].[O-]S([O-])(=O)=O DCKVFVYPWDKYDN-UHFFFAOYSA-L 0.000 description 3
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- QPBYLOWPSRZOFX-UHFFFAOYSA-J tin(iv) iodide Chemical compound I[Sn](I)(I)I QPBYLOWPSRZOFX-UHFFFAOYSA-J 0.000 description 3
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- KSYYQSWFZAUPQO-QRPNPIFTSA-N (2S)-2-amino-3-phenylpropanoic acid iron Chemical compound [Fe].N[C@@H](CC1=CC=CC=C1)C(=O)O KSYYQSWFZAUPQO-QRPNPIFTSA-N 0.000 description 2
- OMAWWKIPXLIPDE-UHFFFAOYSA-N (ethyldiselanyl)ethane Chemical compound CC[Se][Se]CC OMAWWKIPXLIPDE-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- LPOSZYSKJWFIQH-UHFFFAOYSA-N 2-aminoacetic acid;iron Chemical compound [Fe].NCC(O)=O LPOSZYSKJWFIQH-UHFFFAOYSA-N 0.000 description 2
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- JZUFKLXOESDKRF-UHFFFAOYSA-N Chlorothiazide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC2=C1NCNS2(=O)=O JZUFKLXOESDKRF-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
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- ZNZYKNKBJPZETN-WELNAUFTSA-N Dialdehyde 11678 Chemical class N1C2=CC=CC=C2C2=C1[C@H](C[C@H](/C(=C/O)C(=O)OC)[C@@H](C=C)C=O)NCC2 ZNZYKNKBJPZETN-WELNAUFTSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
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- 229910021569 Manganese fluoride Inorganic materials 0.000 description 2
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 2
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
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- SJPVUFMOBDBTHQ-UHFFFAOYSA-N barium(2+);dioxido(dioxo)tungsten Chemical compound [Ba+2].[O-][W]([O-])(=O)=O SJPVUFMOBDBTHQ-UHFFFAOYSA-N 0.000 description 2
- VKJLWXGJGDEGSO-UHFFFAOYSA-N barium(2+);oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[Ti+4].[Ba+2] VKJLWXGJGDEGSO-UHFFFAOYSA-N 0.000 description 2
- JHXKRIRFYBPWGE-UHFFFAOYSA-K bismuth chloride Chemical compound Cl[Bi](Cl)Cl JHXKRIRFYBPWGE-UHFFFAOYSA-K 0.000 description 2
- AKLNLVOZXMQGSI-UHFFFAOYSA-N bufetolol Chemical compound CC(C)(C)NCC(O)COC1=CC=CC=C1OCC1OCCC1 AKLNLVOZXMQGSI-UHFFFAOYSA-N 0.000 description 2
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- BIOOACNPATUQFW-UHFFFAOYSA-N calcium;dioxido(dioxo)molybdenum Chemical compound [Ca+2].[O-][Mo]([O-])(=O)=O BIOOACNPATUQFW-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 2
- VYLVYHXQOHJDJL-UHFFFAOYSA-K cerium trichloride Chemical compound Cl[Ce](Cl)Cl VYLVYHXQOHJDJL-UHFFFAOYSA-K 0.000 description 2
- HSJPMRKMPBAUAU-UHFFFAOYSA-N cerium(3+);trinitrate Chemical compound [Ce+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O HSJPMRKMPBAUAU-UHFFFAOYSA-N 0.000 description 2
- OZECDDHOAMNMQI-UHFFFAOYSA-H cerium(3+);trisulfate Chemical compound [Ce+3].[Ce+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O OZECDDHOAMNMQI-UHFFFAOYSA-H 0.000 description 2
- VIEXQFHKRAHTQS-UHFFFAOYSA-N chloroselanyl selenohypochlorite Chemical compound Cl[Se][Se]Cl VIEXQFHKRAHTQS-UHFFFAOYSA-N 0.000 description 2
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- 239000003792 electrolyte Substances 0.000 description 2
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- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- KERAIHUXFJXRLF-UHFFFAOYSA-H I[In](I)I.I[In](I)I Chemical class I[In](I)I.I[In](I)I KERAIHUXFJXRLF-UHFFFAOYSA-H 0.000 description 1
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- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 229910017569 La2(CO3)3 Inorganic materials 0.000 description 1
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- 229910013870 LiPF 6 Inorganic materials 0.000 description 1
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- WSMYVTOQOOLQHP-UHFFFAOYSA-N Malondialdehyde Chemical compound O=CCC=O WSMYVTOQOOLQHP-UHFFFAOYSA-N 0.000 description 1
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- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- RSBNPUNXBGVNNB-UHFFFAOYSA-M S(=O)(=O)([O-])[O-].[NH4+].[Co+] Chemical compound S(=O)(=O)([O-])[O-].[NH4+].[Co+] RSBNPUNXBGVNNB-UHFFFAOYSA-M 0.000 description 1
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
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- FYLFRDDRHSTCIC-UHFFFAOYSA-M [Hf]F Chemical class [Hf]F FYLFRDDRHSTCIC-UHFFFAOYSA-M 0.000 description 1
- PFYRERIAJQIGKB-UHFFFAOYSA-H [K].F[Zr](F)(F)(F)(F)F Chemical compound [K].F[Zr](F)(F)(F)(F)F PFYRERIAJQIGKB-UHFFFAOYSA-H 0.000 description 1
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- QUEDYRXQWSDKKG-UHFFFAOYSA-M [O-2].[O-2].[V+5].[OH-] Chemical compound [O-2].[O-2].[V+5].[OH-] QUEDYRXQWSDKKG-UHFFFAOYSA-M 0.000 description 1
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- CZZFYYDYXANBNG-UHFFFAOYSA-H [Ti].F[Ti](F)(F)(F)(F)F Chemical class [Ti].F[Ti](F)(F)(F)(F)F CZZFYYDYXANBNG-UHFFFAOYSA-H 0.000 description 1
- NDZRILJASQYFSY-UHFFFAOYSA-J [Zr+4].OP(O)([O-])=O.OP(O)([O-])=O.OP(O)([O-])=O.OP(O)([O-])=O Chemical compound [Zr+4].OP(O)([O-])=O.OP(O)([O-])=O.OP(O)([O-])=O.OP(O)([O-])=O NDZRILJASQYFSY-UHFFFAOYSA-J 0.000 description 1
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- 230000000996 additive effect Effects 0.000 description 1
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- 239000003513 alkali Substances 0.000 description 1
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- 229940009827 aluminum acetate Drugs 0.000 description 1
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- ICPMTQOYWXXMIG-OPDGVEILSA-K aluminum;(2r,3s,4r,5r)-2,3,4,5,6-pentahydroxyhexanoate Chemical compound [Al+3].OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O ICPMTQOYWXXMIG-OPDGVEILSA-K 0.000 description 1
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- MXZRMHIULZDAKC-UHFFFAOYSA-L ammonium magnesium phosphate Chemical compound [NH4+].[Mg+2].[O-]P([O-])([O-])=O MXZRMHIULZDAKC-UHFFFAOYSA-L 0.000 description 1
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- APUPEJJSWDHEBO-UHFFFAOYSA-P ammonium molybdate Chemical compound [NH4+].[NH4+].[O-][Mo]([O-])(=O)=O APUPEJJSWDHEBO-UHFFFAOYSA-P 0.000 description 1
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- 150000008064 anhydrides Chemical class 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
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- QBLDFAIABQKINO-UHFFFAOYSA-N barium borate Chemical compound [Ba+2].[O-]B=O.[O-]B=O QBLDFAIABQKINO-UHFFFAOYSA-N 0.000 description 1
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- OYLGJCQECKOTOL-UHFFFAOYSA-L barium fluoride Chemical compound [F-].[F-].[Ba+2] OYLGJCQECKOTOL-UHFFFAOYSA-L 0.000 description 1
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- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- SGUXGJPBTNFBAD-UHFFFAOYSA-L barium iodide Chemical compound [I-].[I-].[Ba+2] SGUXGJPBTNFBAD-UHFFFAOYSA-L 0.000 description 1
- 229910001638 barium iodide Inorganic materials 0.000 description 1
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- 150000001844 chromium Chemical class 0.000 description 1
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- VQWFNAGFNGABOH-UHFFFAOYSA-K chromium(iii) hydroxide Chemical compound [OH-].[OH-].[OH-].[Cr+3] VQWFNAGFNGABOH-UHFFFAOYSA-K 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
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- 229910000152 cobalt phosphate Inorganic materials 0.000 description 1
- 229910000361 cobalt sulfate Inorganic materials 0.000 description 1
- 229940044175 cobalt sulfate Drugs 0.000 description 1
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 1
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 1
- AVWLPUQJODERGA-UHFFFAOYSA-L cobalt(2+);diiodide Chemical compound [Co+2].[I-].[I-] AVWLPUQJODERGA-UHFFFAOYSA-L 0.000 description 1
- ZBDSFTZNNQNSQM-UHFFFAOYSA-H cobalt(2+);diphosphate Chemical compound [Co+2].[Co+2].[Co+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O ZBDSFTZNNQNSQM-UHFFFAOYSA-H 0.000 description 1
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- MULYSYXKGICWJF-UHFFFAOYSA-L cobalt(2+);oxalate Chemical compound [Co+2].[O-]C(=O)C([O-])=O MULYSYXKGICWJF-UHFFFAOYSA-L 0.000 description 1
- MCRYNZNMVNTSPG-UHFFFAOYSA-L cobalt(2+);oxido hydrogen carbonate Chemical compound [Co+2].OC(=O)O[O-].OC(=O)O[O-] MCRYNZNMVNTSPG-UHFFFAOYSA-L 0.000 description 1
- ATORBMMJNYFMAK-UHFFFAOYSA-L cobalt(2+);selenate Chemical compound [Co+2].[O-][Se]([O-])(=O)=O ATORBMMJNYFMAK-UHFFFAOYSA-L 0.000 description 1
- QAHREYKOYSIQPH-UHFFFAOYSA-L cobalt(II) acetate Chemical compound [Co+2].CC([O-])=O.CC([O-])=O QAHREYKOYSIQPH-UHFFFAOYSA-L 0.000 description 1
- BZRRQSJJPUGBAA-UHFFFAOYSA-L cobalt(ii) bromide Chemical compound Br[Co]Br BZRRQSJJPUGBAA-UHFFFAOYSA-L 0.000 description 1
- PFQLIVQUKOIJJD-UHFFFAOYSA-L cobalt(ii) formate Chemical compound [Co+2].[O-]C=O.[O-]C=O PFQLIVQUKOIJJD-UHFFFAOYSA-L 0.000 description 1
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- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- JUPWRUDTZGBNEX-UHFFFAOYSA-N cobalt;pentane-2,4-dione Chemical compound [Co].CC(=O)CC(C)=O.CC(=O)CC(C)=O.CC(=O)CC(C)=O JUPWRUDTZGBNEX-UHFFFAOYSA-N 0.000 description 1
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- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
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- 230000007797 corrosion Effects 0.000 description 1
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- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 239000011642 cupric gluconate Substances 0.000 description 1
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- XAYGUHUYDMLJJV-UHFFFAOYSA-Z decaazanium;dioxido(dioxo)tungsten;hydron;trioxotungsten Chemical compound [H+].[H+].[NH4+].[NH4+].[NH4+].[NH4+].[NH4+].[NH4+].[NH4+].[NH4+].[NH4+].[NH4+].O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.[O-][W]([O-])(=O)=O.[O-][W]([O-])(=O)=O.[O-][W]([O-])(=O)=O.[O-][W]([O-])(=O)=O.[O-][W]([O-])(=O)=O.[O-][W]([O-])(=O)=O XAYGUHUYDMLJJV-UHFFFAOYSA-Z 0.000 description 1
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- 238000013461 design Methods 0.000 description 1
- VBXWCGWXDOBUQZ-UHFFFAOYSA-K diacetyloxyindiganyl acetate Chemical compound [In+3].CC([O-])=O.CC([O-])=O.CC([O-])=O VBXWCGWXDOBUQZ-UHFFFAOYSA-K 0.000 description 1
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- IZRTVYMPRPTBAI-UHFFFAOYSA-K dibenzoyloxybismuthanyl benzoate Chemical compound [Bi+3].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 IZRTVYMPRPTBAI-UHFFFAOYSA-K 0.000 description 1
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- BEQZMQXCOWIHRY-UHFFFAOYSA-H dibismuth;trisulfate Chemical compound [Bi+3].[Bi+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O BEQZMQXCOWIHRY-UHFFFAOYSA-H 0.000 description 1
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- 235000019821 dicalcium diphosphate Nutrition 0.000 description 1
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- GIIBVORKUMBCJK-UHFFFAOYSA-L dicesium;selenate Chemical compound [Cs+].[Cs+].[O-][Se]([O-])(=O)=O GIIBVORKUMBCJK-UHFFFAOYSA-L 0.000 description 1
- RCJVRSBWZCNNQT-UHFFFAOYSA-N dichloridooxygen Chemical compound ClOCl RCJVRSBWZCNNQT-UHFFFAOYSA-N 0.000 description 1
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- FWBOFUGDKHMVPI-UHFFFAOYSA-K dicopper;2-oxidopropane-1,2,3-tricarboxylate Chemical compound [Cu+2].[Cu+2].[O-]C(=O)CC([O-])(C([O-])=O)CC([O-])=O FWBOFUGDKHMVPI-UHFFFAOYSA-K 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- NAAXGLXYRDSIRS-UHFFFAOYSA-L dihydrogen phosphate;manganese(2+) Chemical compound [Mn+2].OP(O)([O-])=O.OP(O)([O-])=O NAAXGLXYRDSIRS-UHFFFAOYSA-L 0.000 description 1
- AUYOHNUMSAGWQZ-UHFFFAOYSA-L dihydroxy(oxo)tin Chemical compound O[Sn](O)=O AUYOHNUMSAGWQZ-UHFFFAOYSA-L 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
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- 239000003759 ester based solvent Substances 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 239000005431 greenhouse gas Substances 0.000 description 1
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- 229920001519 homopolymer Polymers 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
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- 238000005342 ion exchange Methods 0.000 description 1
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- AQBLLJNPHDIAPN-LNTINUHCSA-K iron(3+);(z)-4-oxopent-2-en-2-olate Chemical compound [Fe+3].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O AQBLLJNPHDIAPN-LNTINUHCSA-K 0.000 description 1
- LIKBJVNGSGBSGK-UHFFFAOYSA-N iron(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Fe+3].[Fe+3] LIKBJVNGSGBSGK-UHFFFAOYSA-N 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
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- LQFNMFDUAPEJRY-UHFFFAOYSA-K lanthanum(3+);phosphate Chemical compound [La+3].[O-]P([O-])([O-])=O LQFNMFDUAPEJRY-UHFFFAOYSA-K 0.000 description 1
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- 239000007788 liquid Substances 0.000 description 1
- KQALUZNDXAKIIQ-UHFFFAOYSA-M lithium hydrogen selenite Chemical compound [Li+].O[Se]([O-])=O KQALUZNDXAKIIQ-UHFFFAOYSA-M 0.000 description 1
- NMHMDUCCVHOJQI-UHFFFAOYSA-N lithium molybdate Chemical compound [Li+].[Li+].[O-][Mo]([O-])(=O)=O NMHMDUCCVHOJQI-UHFFFAOYSA-N 0.000 description 1
- PJJZFXPJNUVBMR-UHFFFAOYSA-L magnesium benzoate Chemical compound [Mg+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 PJJZFXPJNUVBMR-UHFFFAOYSA-L 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
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- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- UHNWOJJPXCYKCG-UHFFFAOYSA-L magnesium oxalate Chemical compound [Mg+2].[O-]C(=O)C([O-])=O UHNWOJJPXCYKCG-UHFFFAOYSA-L 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
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- GMDNUWQNDQDBNQ-UHFFFAOYSA-L magnesium;diformate Chemical compound [Mg+2].[O-]C=O.[O-]C=O GMDNUWQNDQDBNQ-UHFFFAOYSA-L 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
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- 229940118019 malondialdehyde Drugs 0.000 description 1
- 150000002696 manganese Chemical class 0.000 description 1
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- 235000006748 manganese carbonate Nutrition 0.000 description 1
- 229940093474 manganese carbonate Drugs 0.000 description 1
- IPJKJLXEVHOKSE-UHFFFAOYSA-L manganese dihydroxide Chemical compound [OH-].[OH-].[Mn+2] IPJKJLXEVHOKSE-UHFFFAOYSA-L 0.000 description 1
- AMWRITDGCCNYAT-UHFFFAOYSA-L manganese oxide Inorganic materials [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 1
- KVGMATYUUPJFQL-UHFFFAOYSA-N manganese(2+) oxygen(2-) Chemical compound [O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++] KVGMATYUUPJFQL-UHFFFAOYSA-N 0.000 description 1
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 description 1
- RGVLTEMOWXGQOS-UHFFFAOYSA-L manganese(2+);oxalate Chemical compound [Mn+2].[O-]C(=O)C([O-])=O RGVLTEMOWXGQOS-UHFFFAOYSA-L 0.000 description 1
- PPNAOCWZXJOHFK-UHFFFAOYSA-N manganese(2+);oxygen(2-) Chemical compound [O-2].[Mn+2] PPNAOCWZXJOHFK-UHFFFAOYSA-N 0.000 description 1
- 229910000016 manganese(II) carbonate Inorganic materials 0.000 description 1
- VASIZKWUTCETSD-UHFFFAOYSA-N manganese(II) oxide Inorganic materials [Mn]=O VASIZKWUTCETSD-UHFFFAOYSA-N 0.000 description 1
- XMWCXZJXESXBBY-UHFFFAOYSA-L manganese(ii) carbonate Chemical compound [Mn+2].[O-]C([O-])=O XMWCXZJXESXBBY-UHFFFAOYSA-L 0.000 description 1
- QWYFOIJABGVEFP-UHFFFAOYSA-L manganese(ii) iodide Chemical compound [Mn+2].[I-].[I-] QWYFOIJABGVEFP-UHFFFAOYSA-L 0.000 description 1
- KNLQKHUBPCXPQD-UHFFFAOYSA-N manganese;sulfuric acid Chemical compound [Mn].OS(O)(=O)=O KNLQKHUBPCXPQD-UHFFFAOYSA-N 0.000 description 1
- ALTWGIIQPLQAAM-UHFFFAOYSA-N metavanadate Chemical compound [O-][V](=O)=O ALTWGIIQPLQAAM-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 150000002751 molybdenum Chemical class 0.000 description 1
- PDKHNCYLMVRIFV-UHFFFAOYSA-H molybdenum;hexachloride Chemical compound [Cl-].[Cl-].[Cl-].[Cl-].[Cl-].[Cl-].[Mo] PDKHNCYLMVRIFV-UHFFFAOYSA-H 0.000 description 1
- NFSAPTWLWWYADB-UHFFFAOYSA-N n,n-dimethyl-1-phenylethane-1,2-diamine Chemical compound CN(C)C(CN)C1=CC=CC=C1 NFSAPTWLWWYADB-UHFFFAOYSA-N 0.000 description 1
- QHMGFQBUOCYLDT-RNFRBKRXSA-N n-(diaminomethylidene)-2-[(2r,5r)-2,5-dimethyl-2,5-dihydropyrrol-1-yl]acetamide Chemical compound C[C@@H]1C=C[C@@H](C)N1CC(=O)N=C(N)N QHMGFQBUOCYLDT-RNFRBKRXSA-N 0.000 description 1
- BPLYVSYSBPLDOA-GYOJGHLZSA-N n-[(2r,3r)-1,3-dihydroxyoctadecan-2-yl]tetracosanamide Chemical compound CCCCCCCCCCCCCCCCCCCCCCCC(=O)N[C@H](CO)[C@H](O)CCCCCCCCCCCCCCC BPLYVSYSBPLDOA-GYOJGHLZSA-N 0.000 description 1
- AOSHTALYABIEJR-UHFFFAOYSA-N neodymium(3+) hexanitrate Chemical class [Nd+3].[Nd+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O AOSHTALYABIEJR-UHFFFAOYSA-N 0.000 description 1
- DZNFWGVDYGAMJB-UHFFFAOYSA-K neodymium(3+);phosphate Chemical compound [Nd+3].[O-]P([O-])([O-])=O DZNFWGVDYGAMJB-UHFFFAOYSA-K 0.000 description 1
- KETUDCKOKOGBJB-UHFFFAOYSA-K neodymium(3+);triacetate Chemical compound [Nd+3].CC([O-])=O.CC([O-])=O.CC([O-])=O KETUDCKOKOGBJB-UHFFFAOYSA-K 0.000 description 1
- LBWLQVSRPJHLEY-UHFFFAOYSA-K neodymium(3+);tribromide Chemical compound Br[Nd](Br)Br LBWLQVSRPJHLEY-UHFFFAOYSA-K 0.000 description 1
- UTWHRPIUNFLOBE-UHFFFAOYSA-H neodymium(3+);tricarbonate Chemical compound [Nd+3].[Nd+3].[O-]C([O-])=O.[O-]C([O-])=O.[O-]C([O-])=O UTWHRPIUNFLOBE-UHFFFAOYSA-H 0.000 description 1
- AARCLZBTVAUMJK-UHFFFAOYSA-K neodymium(3+);triformate Chemical compound [Nd+3].[O-]C=O.[O-]C=O.[O-]C=O AARCLZBTVAUMJK-UHFFFAOYSA-K 0.000 description 1
- DKSXWSAKLYQPQE-UHFFFAOYSA-K neodymium(3+);triiodide Chemical compound I[Nd](I)I DKSXWSAKLYQPQE-UHFFFAOYSA-K 0.000 description 1
- RHVPCSSKNPYQDU-UHFFFAOYSA-H neodymium(3+);trisulfate;hydrate Chemical compound O.[Nd+3].[Nd+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O RHVPCSSKNPYQDU-UHFFFAOYSA-H 0.000 description 1
- ATINCSYRHURBSP-UHFFFAOYSA-K neodymium(iii) chloride Chemical compound Cl[Nd](Cl)Cl ATINCSYRHURBSP-UHFFFAOYSA-K 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- 229910000159 nickel phosphate Inorganic materials 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- OHYIAOLALQLWLC-UHFFFAOYSA-J nickel(2+) dicarbonate Chemical compound [Ni+2].[Ni+2].[O-]C([O-])=O.[O-]C([O-])=O OHYIAOLALQLWLC-UHFFFAOYSA-J 0.000 description 1
- BMGNSKKZFQMGDH-FDGPNNRMSA-L nickel(2+);(z)-4-oxopent-2-en-2-olate Chemical compound [Ni+2].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O BMGNSKKZFQMGDH-FDGPNNRMSA-L 0.000 description 1
- GAIQJSWQJOZOMI-UHFFFAOYSA-L nickel(2+);dibenzoate Chemical compound [Ni+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 GAIQJSWQJOZOMI-UHFFFAOYSA-L 0.000 description 1
- IPLJNQFXJUCRNH-UHFFFAOYSA-L nickel(2+);dibromide Chemical compound [Ni+2].[Br-].[Br-] IPLJNQFXJUCRNH-UHFFFAOYSA-L 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- DOLZKNFSRCEOFV-UHFFFAOYSA-L nickel(2+);oxalate Chemical compound [Ni+2].[O-]C(=O)C([O-])=O DOLZKNFSRCEOFV-UHFFFAOYSA-L 0.000 description 1
- OHPFZXJAABILIK-UHFFFAOYSA-J nickel(2+);phosphonato phosphate Chemical compound [Ni+2].[Ni+2].[O-]P([O-])(=O)OP([O-])([O-])=O OHPFZXJAABILIK-UHFFFAOYSA-J 0.000 description 1
- 229910000008 nickel(II) carbonate Inorganic materials 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- ZULUUIKRFGGGTL-UHFFFAOYSA-L nickel(ii) carbonate Chemical compound [Ni+2].[O-]C([O-])=O ZULUUIKRFGGGTL-UHFFFAOYSA-L 0.000 description 1
- BFSQJYRFLQUZKX-UHFFFAOYSA-L nickel(ii) iodide Chemical compound I[Ni]I BFSQJYRFLQUZKX-UHFFFAOYSA-L 0.000 description 1
- AIBQNUOBCRIENU-UHFFFAOYSA-N nickel;dihydrate Chemical compound O.O.[Ni] AIBQNUOBCRIENU-UHFFFAOYSA-N 0.000 description 1
- 150000002821 niobium Chemical class 0.000 description 1
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Inorganic materials O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 description 1
- WPCMRGJTLPITMF-UHFFFAOYSA-I niobium(5+);pentahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[Nb+5] WPCMRGJTLPITMF-UHFFFAOYSA-I 0.000 description 1
- UJVRJBAUJYZFIX-UHFFFAOYSA-N nitric acid;oxozirconium Chemical compound [Zr]=O.O[N+]([O-])=O.O[N+]([O-])=O UJVRJBAUJYZFIX-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
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- DTEMQJHXKZCSMQ-UHFFFAOYSA-J phosphonato phosphate;zirconium(4+) Chemical compound [Zr+4].[O-]P([O-])(=O)OP([O-])([O-])=O DTEMQJHXKZCSMQ-UHFFFAOYSA-J 0.000 description 1
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- 229960001763 zinc sulfate Drugs 0.000 description 1
- HTOFKHJTNDESBL-UHFFFAOYSA-L zinc tellurite Chemical compound [Zn+2].[O-][Te]([O-])=O HTOFKHJTNDESBL-UHFFFAOYSA-L 0.000 description 1
- VRGNUPCISFMPEM-ZVGUSBNCSA-L zinc;(2r,3r)-2,3-dihydroxybutanedioate Chemical compound [Zn+2].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O VRGNUPCISFMPEM-ZVGUSBNCSA-L 0.000 description 1
- WDHVIZKSFZNHJB-UHFFFAOYSA-L zinc;butanoate Chemical compound [Zn+2].CCCC([O-])=O.CCCC([O-])=O WDHVIZKSFZNHJB-UHFFFAOYSA-L 0.000 description 1
- VOSQOLXQDQZVCL-UHFFFAOYSA-L zinc;chloride;hydroxide Chemical compound [OH-].[Cl-].[Zn+2] VOSQOLXQDQZVCL-UHFFFAOYSA-L 0.000 description 1
- JDLYKQWJXAQNNS-UHFFFAOYSA-L zinc;dibenzoate Chemical compound [Zn+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 JDLYKQWJXAQNNS-UHFFFAOYSA-L 0.000 description 1
- ZPEJZWGMHAKWNL-UHFFFAOYSA-L zinc;oxalate Chemical compound [Zn+2].[O-]C(=O)C([O-])=O ZPEJZWGMHAKWNL-UHFFFAOYSA-L 0.000 description 1
- NHXVNEDMKGDNPR-UHFFFAOYSA-N zinc;pentane-2,4-dione Chemical compound [Zn+2].CC(=O)[CH-]C(C)=O.CC(=O)[CH-]C(C)=O NHXVNEDMKGDNPR-UHFFFAOYSA-N 0.000 description 1
- PEUPCBAALXHYHP-UHFFFAOYSA-L zinc;selenite Chemical compound [Zn+2].[O-][Se]([O-])=O PEUPCBAALXHYHP-UHFFFAOYSA-L 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
- XJUNLJFOHNHSAR-UHFFFAOYSA-J zirconium(4+);dicarbonate Chemical compound [Zr+4].[O-]C([O-])=O.[O-]C([O-])=O XJUNLJFOHNHSAR-UHFFFAOYSA-J 0.000 description 1
- ZXAUZSQITFJWPS-UHFFFAOYSA-J zirconium(4+);disulfate Chemical compound [Zr+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O ZXAUZSQITFJWPS-UHFFFAOYSA-J 0.000 description 1
- 229910000350 zirconium(IV) sulfate Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
- ATYZRBBOXUWECY-UHFFFAOYSA-N zirconium;hydrate Chemical compound O.[Zr] ATYZRBBOXUWECY-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D129/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Coating compositions based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Coating compositions based on derivatives of such polymers
- C09D129/02—Homopolymers or copolymers of unsaturated alcohols
- C09D129/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Paints Or Removers (AREA)
- Chemical Treatment Of Metals (AREA)
Description
本発明は、金属材料とラミネートフィルム又は樹脂塗膜とが剥離することを防ぐことができる密着性及び耐薬品密着維持性に優れた表面処理皮膜を形成するための水系金属表面処理剤及びその金属表面処理剤で処理してなる金属材料に関する。詳しくは、金属材料に樹脂フィルムをラミネートし又は樹脂塗膜を形成し、その後に深絞り加工、しごき加工又はストレッチドロー加工等の厳しい成形加工を施した場合であっても、そのラミネートフィルム等が剥離しないような高い密着性を付与することができ、さらに酸、有機溶剤等に曝されても高い密着性を維持し得る耐薬品密着維持性に優れた6価クロムフリー表面処理皮膜を形成するための水系金属表面処理剤等に関する。 The present invention relates to a water-based metal surface treatment agent for forming a surface-treated film excellent in adhesion and chemical-resistant adhesion maintenance capable of preventing peeling of a metal material and a laminate film or a resin coating film, and the metal The present invention relates to a metal material processed with a surface treatment agent. Specifically, even if a resin film is laminated to a metal material or a resin coating film is formed, and then severe molding processing such as deep drawing processing, ironing processing or stretch drawing processing is performed, the laminated film etc. Forms a hexavalent chromium-free surface-treated film that is capable of imparting high adhesion that does not peel off and that is excellent in chemical adhesion maintenance that can maintain high adhesion even when exposed to acids, organic solvents, etc. The present invention relates to an aqueous metal surface treatment agent for the purpose.
ラミネート加工は、樹脂製のフィルム(以下、「樹脂フィルム」又は「ラミネートフィルム」という。)を金属材料の表面(以下、単に「金属表面」ともいう。)に加熱圧着する加工手段であり、金属表面を保護すること又は意匠性を付与することを目的とした金属表面の被覆方法の一つであり、様々な分野で使用されている。このラミネート加工は、樹脂組成物を溶剤中に溶解又は分散させたものを金属表面に塗布乾燥することによって樹脂塗膜を形成する方法に比べ、乾燥時に発生する溶剤や二酸化炭素等の廃棄ガス又は温暖化ガスの発生量が少ない。そのため、環境保全の面において好ましく適用され、その用途は拡大し、例えば、アルミニウム薄板材、スチール薄板材、包装用アルミニウム箔又はステンレス箔等を素材とした食品用缶のボディー若しくは蓋材、食品用容器又は乾電池容器等に用いられている。 Lamination is a processing means for thermocompression bonding a resin film (hereinafter referred to as “resin film” or “laminate film”) to the surface of a metal material (hereinafter also simply referred to as “metal surface”). This is one of methods for coating a metal surface for the purpose of protecting the surface or imparting design properties, and is used in various fields. Compared with the method of forming a resin coating film by applying a resin composition dissolved or dispersed in a solvent to a metal surface and drying it, the laminating process is a waste gas such as a solvent generated during drying or carbon dioxide or the like. There is little generation of greenhouse gas. Therefore, it is preferably applied in terms of environmental protection, and its uses are expanded. For example, a body or lid of a food can made of aluminum thin plate material, steel thin plate material, aluminum foil for packaging or stainless steel foil, etc. Used in containers and dry battery containers.
特に最近では、携帯電話、電子手帳、ノート型パソコン又はビデオカメラ等に用いられるモバイル用リチウムイオン2次電池の外装材及びタブリード材として、軽量でバリアー性の高いアルミニウム箔又はステンレス箔等の金属箔が好ましく用いられており、こうした金属箔の表面にラミネート加工が適用されている。また、電気自動車又はハイブリッド自動車の駆動エネルギーとしてリチウムイオン2次電池が検討されているが、その外装材としても、ラミネート加工した金属箔が検討されている。 Recently, metal foils such as aluminum foil and stainless steel foil that are lightweight and have high barrier properties as exterior materials and tab lead materials for mobile lithium-ion secondary batteries used in mobile phones, electronic notebooks, notebook computers, video cameras, and the like. Is preferably used, and a lamination process is applied to the surface of the metal foil. In addition, lithium ion secondary batteries have been studied as driving energy for electric vehicles or hybrid vehicles, and laminated metal foils have also been examined as exterior materials.
こうしたラミネート加工に用いるラミネートフィルムは、直接金属材料に貼り合わせた後に加熱圧着する。そのため、樹脂組成物を塗布乾燥してなる一般的な樹脂塗膜に比べて、原材料のムダを抑制できる、ピンホール(欠陥部)が少ない及び加工性が優れる等の利点がある。ラミネートフィルムの材料としては、一般に、ポリエチレンテレフタレート及びポリエチレンナフタレート等のポリエステル系樹脂や、ポリエチレン及びポリプロピレン等のポリオレフィンが用いられている。 The laminate film used for such a lamination process is directly bonded to a metal material and then heat-pressed. Therefore, compared to a general resin coating film formed by applying and drying a resin composition, there are advantages such as suppression of waste of raw materials, fewer pinholes (defects), and excellent workability. As materials for the laminate film, polyester resins such as polyethylene terephthalate and polyethylene naphthalate, and polyolefins such as polyethylene and polypropylene are generally used.
金属表面に化成処理等の処理を施さないでラミネート加工を行うと、金属表面からラミネートフィルムが剥離したり、金属材料に腐食が生じたりするという問題がある。例えば、食品用容器又は包材においては、ラミネート加工後の容器又は包材に内容物を加えた後に殺菌を目的とした加熱処理を施すが、その加熱処理時に金属表面からラミネートフィルムが剥離することがある。また、リチウムイオン2次電池の外装材等においては、その製造工程で加工度の高い加工を受ける。さらに、長期使用されると、大気中の水分が容器内に浸入し、これが電解質と反応してフッ化水素酸を生成し、これがラミネートフィルムを透過して金属表面とラミネートフィルムとの剥離を発生させるとともに、金属表面を腐食するという問題がある。 When laminating is performed without performing a chemical conversion treatment or the like on the metal surface, there is a problem that the laminate film is peeled off from the metal surface or the metal material is corroded. For example, in food containers or packaging materials, the contents are added to the container or packaging material after lamination, and then heat treatment for sterilization is performed, but the laminate film is peeled off from the metal surface during the heat treatment. There is. Moreover, in the exterior material etc. of a lithium ion secondary battery, processing with a high degree of processing is received in the manufacturing process. In addition, when used for a long time, moisture in the atmosphere enters the container, which reacts with the electrolyte to produce hydrofluoric acid, which permeates the laminate film and causes the metal surface and the laminate film to peel off. And the problem of corroding the metal surface.
こうした問題に対し、ラミネートフィルムを金属表面にラミネート加工する際、ラミネートフィルムと金属表面との密着性及び金属表面の耐食性を向上させるために、金属表面を脱脂洗浄した後、通常、リン酸クロメート等の化成処理等が施される。しかしながら、こうした化成処理は、処理後に余剰の処理液を除去するための洗浄工程が必要であり、その洗浄工程から排出される洗浄水の廃水処理にコストがかかる。特にリン酸クロメート等の化成処理等は、6価クロムを含む処理液が用いられるので、近年の環境的配慮から敬遠される傾向にある。 In order to improve the adhesion between the laminate film and the metal surface and the corrosion resistance of the metal surface when laminating the laminate film to the metal surface for such a problem, the metal surface is usually degreased and washed, and usually phosphoric acid chromate, etc. The chemical conversion treatment is performed. However, such a chemical conversion treatment requires a washing step for removing excess treatment liquid after the treatment, and costs for waste water treatment of washing water discharged from the washing step. In particular, chemical conversion treatment such as phosphoric acid chromate tends to be avoided from environmental considerations in recent years because a treatment solution containing hexavalent chromium is used.
例えば、特許文献1では、特定量の水溶性ジルコニウム化合物と、特定構造の水溶性又は水分散性アクリル樹脂と、水溶性又は水分散性熱硬化型架橋剤とを含有する下地処理剤が提案されている。また、特許文献2では、特定量の水溶性ジルコニウム化合物及び/又は水溶性チタン化合物と、有機ホスホン酸化合物と、タンニンとからなるノンクロム金属表面処理剤が提案されている。また、特許文献3では、アミノ化フェノール重合体と、Ti及びZr等の特定の金属化合物とを含有し、pHが1.5〜6.0の範囲である金属表面処理薬剤が提案されている。また、特許文献4では、アミノ化フェノール重合体と、アクリル系重合体と、金属化合物と、さらに必要に応じてリン化合物とを含有する樹脂膜が提案されている。
For example,
本発明の目的は、金属材料とラミネートフィルム又は樹脂塗膜とが剥離することを防ぐことができる密着性及び耐薬品密着維持性に優れた表面処理皮膜を形成するための水系金属表面処理剤を提供すること及びその金属表面処理剤で処理してなる金属材料を提供することにある。詳しくは、金属材料に樹脂フィルムをラミネートし又は樹脂塗膜を形成し、その後に深絞り加工、しごき加工又はストレッチドロー加工等の厳しい成形加工を施した場合であっても、そのラミネートフィルム又は樹脂塗膜が剥離しないような高い密着性を有するとともに、酸等に曝されても高い密着性を維持し得る耐薬品密着維持性に優れた6価クロムフリー表面処理皮膜を形成するための金属表面処理剤を提供すること及びその金属表面処理剤で処理してなる金属材料を提供することにある。 An object of the present invention is to provide an aqueous metal surface treatment agent for forming a surface-treated film excellent in adhesion and chemical-resistant adhesion maintenance that can prevent a metal material and a laminate film or a resin film from peeling off. It is providing and providing the metal material processed with the metal surface treating agent. Specifically, even if a resin film is laminated on a metal material or a resin coating film is formed, and then severe molding processing such as deep drawing processing, ironing processing or stretch drawing processing is performed, the laminated film or resin Metal surface for forming a hexavalent chromium-free surface-treated film that has high adhesion such that the coating film does not peel off and has excellent chemical adhesion maintenance that can maintain high adhesion even when exposed to acids, etc. The object is to provide a treatment agent and a metal material treated with the metal surface treatment agent.
上記課題を解決するための本発明に係る水系金属表面処理剤は、ポリビニルアルコール系化合物(A)と、前記ポリビニルアルコール系化合物(A)と反応しうる官能基を有する架橋性有機化合物(B1)及び前記ポリビニルアルコール系化合物(A)と反応しうる元素を含む架橋性無機化合物(B2)から選ばれる1種又は2種以上の架橋性化合物(B)とを含有し、前記架橋性化合物(B)として少なくとも前記架橋性無機化合物(B2)を含有する(ただし、バナジウム化合物を含有しない)ことを特徴とする。 The water-based metal surface treatment agent according to the present invention for solving the above-mentioned problems is a polyvinyl alcohol compound (A) and a crosslinkable organic compound (B1) having a functional group capable of reacting with the polyvinyl alcohol compound (A). And one or more crosslinkable compounds (B) selected from crosslinkable inorganic compounds (B2) containing an element capable of reacting with the polyvinyl alcohol compound (A), and the crosslinkable compound (B ) At least the crosslinkable inorganic compound (B2) (however, it does not contain a vanadium compound) .
この発明によれば、ポリビニルアルコール系化合物(A)と上記した架橋性化合物(B)とを含有するので、その水系金属表面処理剤で処理して得られる表面処理皮膜は、高い密着性を有するとともに、酸等に曝されても高い密着性を維持することができる。その結果、金属材料に樹脂フィルムをラミネートし又は樹脂塗膜を形成し、その後に深絞り加工、しごき加工又はストレッチドロー加工等の厳しい成形加工を施した場合であっても、また、さらに酸や有機溶剤等に曝された場合であっても、そのラミネートフィルム又は樹脂塗膜が金属材料から剥離することを防ぐことができる。 According to this invention, since the polyvinyl alcohol compound (A) and the crosslinkable compound (B) described above are contained, the surface treatment film obtained by treatment with the aqueous metal surface treatment agent has high adhesion. In addition, high adhesion can be maintained even when exposed to an acid or the like. As a result, even when a resin film is laminated to a metal material or a resin coating film is formed, and then severe molding processing such as deep drawing processing, ironing processing or stretch drawing processing is performed, an acid or Even when exposed to an organic solvent or the like, the laminate film or the resin coating film can be prevented from peeling off from the metal material.
本発明に係る水系金属表面処理剤において、前記架橋性有機化合物(B1)が、グリシジルエーテル基、イソシアネート基、メチロール基及びアルデヒド基から選ばれる1種以上の官能基を有する。 In the aqueous metal surface treatment agent according to the present invention, the crosslinkable organic compound (B1) has one or more functional groups selected from a glycidyl ether group, an isocyanate group, a methylol group, and an aldehyde group.
この発明によれば、架橋性有機化合物(B1)が上記した官能基を有するので、その水系金属表面処理剤で処理して得られる表面処理皮膜は、より密着性が優れ、また、有機溶剤や酸に曝されても長期間にわたってより安定した密着性を維持することができる。 According to this invention, since the crosslinkable organic compound (B1) has the functional group described above, the surface treatment film obtained by treatment with the aqueous metal surface treatment agent has better adhesion, and the organic solvent or Even when exposed to an acid, more stable adhesion can be maintained over a long period of time.
本発明に係る水系金属表面処理剤において、前記架橋性無機化合物(B2)が、Cr(III)、Zr、Ti、Si、Ce、及びTeから選ばれる1種又は2種以上の元素を含む。 In the aqueous metal surface treatment agent according to the present invention, the crosslinkable inorganic compound (B2) contains one or more elements selected from Cr (III), Zr, Ti, Si, Ce, and Te .
この発明によれば、架橋性無機化合物(B2)が上記した元素を含むので、その水系金属表面処理剤で処理して得られる表面処理皮膜は、より密着性が優れ、また、有機溶剤や酸に曝されても長期間にわたってより安定した密着性を維持することができる。 According to the present invention, since the crosslinkable inorganic compound (B2) contains the above-described elements, the surface treatment film obtained by treatment with the aqueous metal surface treatment agent has better adhesion, and an organic solvent or acid. Even when exposed to water, more stable adhesion can be maintained over a long period of time.
上記課題を解決するための本発明に係る金属材料は、本発明に係る水系金属表面処理剤を塗布して形成された表面処理皮膜を有することを特徴とする。 The metal material according to the present invention for solving the above-described problems has a surface treatment film formed by applying the water-based metal surface treatment agent according to the present invention.
この発明によれば、上記本発明に係る水系金属表面処理剤を塗布して形成された表面処理皮膜を有するので、その表面処理皮膜を有する金属材料にラミネート加工を施し、その後に深絞り加工、しごき加工又はストレッチドロー加工等の厳しい成形加工を施した場合であっても、さらに酸等に曝された場合であっても、金属材料の表面に形成されたラミネートフィルム又は樹脂塗膜が剥離することを防ぐことができる。 According to this invention, since it has a surface treatment film formed by applying the aqueous metal surface treatment agent according to the present invention, the metal material having the surface treatment film is subjected to laminating, and then deep drawing, The laminate film or resin coating formed on the surface of the metal material is peeled off even when subjected to severe molding such as ironing or stretch drawing, or even when exposed to acid or the like. Can be prevented.
本発明に係る水系金属表面処理剤によれば、金属材料とラミネートフィルム又は樹脂塗膜とが剥離することを防ぐことができる密着性及び耐薬品密着維持性に優れた表面処理皮膜を形成するための水系金属表面処理剤を提供することができる。 According to the water-based metal surface treatment agent according to the present invention, in order to form a surface treatment film excellent in adhesion and chemical adhesion maintaining ability that can prevent the metal material and the laminate film or resin coating film from peeling off. An aqueous metal surface treatment agent can be provided.
本発明に係る金属材料によれば、そのような表面処理皮膜を有する金属材料を提供することができる。 The metal material according to the present invention can provide a metal material having such a surface treatment film.
以下、本発明に係る水系金属表面処理剤及びその金属表面処理剤を金属材料の表面に塗布して形成された表面処理皮膜を有する金属材料について説明する。なお、以下の説明及び図面の形態により本発明の技術的範囲が限定されるものではない。 Hereinafter, a metal material having a surface treatment film formed by applying the aqueous metal surface treatment agent according to the present invention and the metal surface treatment agent to the surface of the metal material will be described. The technical scope of the present invention is not limited by the following description and the form of the drawings.
[水系金属表面処理剤]
本発明に係る水系金属表面処理剤は、図1に示すように、基材である金属材料1(以下、「基材金属1」という。)の表面に、ラミネートフィルム又は樹脂塗膜3の下地用の表面処理皮膜2を形成するための処理剤である。その特徴は、ポリビニルアルコール系化合物(A)と、架橋性有機化合物(B1)及び架橋性無機化合物(B2)から選ばれる1種又は2種以上の架橋性化合物(B)とを含有することにある。「含有する」とは、水系金属表面処理剤中にポリビニルアルコール系化合物(A)及び架橋性化合物(B)以外の化合物を含んでいてもよいことを意味している。そうした化合物としては、例えば、界面活性剤、消泡剤、レベリング剤、防菌防ばい剤、着色剤等を挙げることができる。これらの化合物を、本発明の趣旨及び皮膜性能を損なわない範囲で含有することができる。
[Water-based metal surface treatment agent]
As shown in FIG. 1, the water-based metal surface treatment agent according to the present invention is a base of a laminate film or a resin coating 3 on the surface of a metal material 1 (hereinafter referred to as “
以下、本発明の構成を詳しく説明する。 Hereinafter, the configuration of the present invention will be described in detail.
(ポリビニルアルコール系化合物(A))
ポリビニルアルコール系化合物(A)は、ポリビニルアルコール及びその誘導体から選ばれる1種又は2種以上の化合物である。ポリビニルアルコール系化合物(A)と架橋性化合物(B)とを含むことによって、その水系金属表面処理剤で処理して得られる表面処理皮膜の密着性及び耐薬品密着維持性を高めることができる。
(Polyvinyl alcohol compound (A))
The polyvinyl alcohol compound (A) is one or more compounds selected from polyvinyl alcohol and derivatives thereof. By including the polyvinyl alcohol compound (A) and the crosslinkable compound (B), it is possible to improve the adhesion and chemical adhesion maintenance of the surface treatment film obtained by treatment with the aqueous metal surface treatment agent.
ポリビニルアルコール及びその誘導体としては、ポリ酢酸ビニルの鹸化物や、酢酸ビニルと他のモノマーとの共重合物の鹸化物等を用いることができる。この鹸化物は、部分鹸化物であってもよいし、完全鹸化物であってもよい。 As polyvinyl alcohol and derivatives thereof, a saponified product of polyvinyl acetate, a saponified product of a copolymer of vinyl acetate and other monomers, or the like can be used. This saponified product may be a partially saponified product or a completely saponified product.
酢酸ビニルと共重合される他のモノマーとしては、例えば、アクリル酸、メタクリル酸、イタコン酸、マイレン酸及びこれらの塩等のアニオン性コモノマー;スチレン、アクリロニトリル、ビニルエーテル、(メタ)アクリルアミド、N−メチロール(メタ)アクリルアミド、メチル(メタ)アクリレート、ヒドロキシエチル(メタ)アクリレート、ビニルピロリドン、アクロイルモルホリン、酢酸ビニル等のノニオン性コモノマー;アミノエチル(メタ)アクリレート、N−ヒドロキシプロピルアミノエチル(メタ)アクリレート、ビニルイミダゾール、N,N−ジメチルジアリルアミン等のカチオン性コモノマー;を挙げることができる。 Examples of other monomers copolymerized with vinyl acetate include anionic comonomers such as acrylic acid, methacrylic acid, itaconic acid, maleic acid and salts thereof; styrene, acrylonitrile, vinyl ether, (meth) acrylamide, N-methylol. Nonionic comonomers such as (meth) acrylamide, methyl (meth) acrylate, hydroxyethyl (meth) acrylate, vinylpyrrolidone, acroylmorpholine, vinyl acetate; aminoethyl (meth) acrylate, N-hydroxypropylaminoethyl (meth) acrylate And cationic comonomers such as vinylimidazole and N, N-dimethyldiallylamine.
また、上記のポリビニルアルコールおよびその誘導体にをジケテンと反応させる事によりアセトアセチル化させたものであっても良い。 Moreover, the above-mentioned polyvinyl alcohol and its derivatives may be acetoacetylated by reacting with diketene.
ポリビニルアルコール系化合物(A)の含有量は、水系金属表面処理剤に含まれる全固形分に対して、10質量%〜90質量%であることが好ましく、10質量%〜80質量%であることがより好ましく、20質量%〜80質量%であることが特に好ましい。10質量%〜90質量%とすることで、得られる表面処理皮膜の密着性及び耐薬品密着維持性をより高めることができる。 The content of the polyvinyl alcohol compound (A) is preferably 10% by mass to 90% by mass, and preferably 10% by mass to 80% by mass with respect to the total solid content contained in the aqueous metal surface treatment agent. Is more preferable, and 20% by mass to 80% by mass is particularly preferable. By setting it as 10 mass%-90 mass%, the adhesiveness of the surface treatment film obtained and chemical-resistant adhesion maintenance property can be improved more.
なお、「全固形分」とは、水系金属表面処理剤を構成する成分のうち、溶剤等の揮発成分等を除いた固形分のことであり、具体的には、ポリビニルアルコール系化合物(A)と、架橋性有機化合物(B1)及び架橋性無機化合物(B2)から選ばれる1種又は2種以上の架橋性化合物(B)との合計量のことである。したがって、ポリビニルアルコール系化合物(A)の含有量は、ポリビニルアルコール系化合物(A)と架橋性化合物(B)との合計量(全固形分)に対して10質量%〜90質量%であることが好ましく、10質量%〜80質量%であることがより好ましく、20質量%〜80質量%であることが特に好ましい。 The “total solid content” is a solid content excluding volatile components such as a solvent among the components constituting the aqueous metal surface treatment agent. Specifically, the polyvinyl alcohol compound (A) And the total amount of one or more crosslinkable compounds (B) selected from the crosslinkable organic compound (B1) and the crosslinkable inorganic compound (B2). Therefore, the content of the polyvinyl alcohol compound (A) is 10% by mass to 90% by mass with respect to the total amount (total solid content) of the polyvinyl alcohol compound (A) and the crosslinkable compound (B). Is preferable, it is more preferable that it is 10 mass%-80 mass%, and it is especially preferable that it is 20 mass%-80 mass%.
(架橋性化合物(B))
架橋性化合物(B)は、架橋性有機化合物(B1)及び架橋性無機化合物(B2)から選ばれる1種又は2種以上の化合物である。水系金属表面処理剤が架橋性化合物(B)を含むことによって、その水系金属表面処理剤で処理して得られる表面処理皮膜の密着性及び耐薬品密着維持性を高めることができる。
(Crosslinkable compound (B))
The crosslinkable compound (B) is one or more compounds selected from a crosslinkable organic compound (B1) and a crosslinkable inorganic compound (B2). By including the crosslinkable compound (B) in the aqueous metal surface treatment agent, it is possible to improve the adhesion and chemical resistance adhesion maintaining property of the surface treatment film obtained by the treatment with the aqueous metal surface treatment agent.
(架橋性有機化合物(B1))
架橋性有機化合物(B1)は、ポリビニルアルコール(A)と反応しうる官能基を有する化合物である。「反応しうる」とは、ポリビニルアルコール(A)と接触してそれらに反応することができるという意味である。「有する」とは、これらの官能基以外に他の官能基や結合単位を有していてもよいという意味である。
(Crosslinkable organic compound (B1))
The crosslinkable organic compound (B1) is a compound having a functional group capable of reacting with the polyvinyl alcohol (A). “Can react” means that the polyvinyl alcohol (A) can be contacted to react with them. “Having” means that it may have other functional groups or bonding units in addition to these functional groups.
架橋性有機化合物(B1)としては、例えば、グリシジルエーテル基、イソシアネート基、メチロール基及びアルデヒド基から選ばれる1種又は2種以上を有する有機化合物を挙げることができる。 As a crosslinkable organic compound (B1), the organic compound which has 1 type, or 2 or more types chosen from a glycidyl ether group, an isocyanate group, a methylol group, and an aldehyde group can be mentioned, for example.
グリシジルエーテル基を有する有機化合物としては、従来公知の多価グリシジルエーテル化合物を用いることができる。多価グリシジルエーテル化合物としては、例えば、エチレングリコールジグリシジルエーテル、ジエチレングリコールジグリシジルエーテル、ポリエチレングリコールジグリシジルエーテル、ポリプロピレングリコールジグリシジルエーテル、グリセロールジグリシジルエーテル、グリセロールトリグリシジルエーテル、グリセロールポリグリシジルエーテル、ジグリセロールリグリシジルエーテル、ポリグリセロールトリグリシジルエーテル、ペンタエリトリトールテトラグリシジルエーテル、トリメチロールプロパンジグリシジルエーテル、トリメチロールプロパントリグリシジルエーテル、ソルビトールポリグリシジルエーテル等を挙げることができる。 As the organic compound having a glycidyl ether group, a conventionally known polyvalent glycidyl ether compound can be used. Examples of the polyvalent glycidyl ether compound include ethylene glycol diglycidyl ether, diethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, glycerol diglycidyl ether, glycerol triglycidyl ether, glycerol polyglycidyl ether, and diglycerol. Examples include liglycidyl ether, polyglycerol triglycidyl ether, pentaerythritol tetraglycidyl ether, trimethylolpropane diglycidyl ether, trimethylolpropane triglycidyl ether, sorbitol polyglycidyl ether, and the like.
イソシアネート基を有する有機化合物としては、例えば、トリレンジイソシアネートの異性体類;4,4’−ジフェニルメタンジイソシアネート等の芳香族ジイソシアネート類;キシリレンジイソシアネート等の芳香脂肪族ジイソシアネート類;イソホロンジイソシアネート、4,4’−ジシクロヘキシルメタンジイソシアネート等の脂環式ジイソシアネート;ヘキサメチレンジイソシアネート、2,2,4−トリメチルヘキサメチレンジイソシアネート等の脂肪族ジイソシアネート類;等を挙げることができる。これらのイソシアネート化合物は、特に限定されないが、水系金属表面処理剤の安定性の点から、各種ブロック剤でブロック化したイソシアネート化合物を用いることが好ましい。ブロック剤としては、例えば、フェノール系、アルコール系、オキシム系、活性メチレン系、酸アミド系、カルバミン酸塩系、亜硫酸塩系等の各種ブロック剤を挙げることができる。 Examples of the organic compound having an isocyanate group include isomers of tolylene diisocyanate; aromatic diisocyanates such as 4,4′-diphenylmethane diisocyanate; araliphatic diisocyanates such as xylylene diisocyanate; isophorone diisocyanate, 4,4 And alicyclic diisocyanates such as' -dicyclohexylmethane diisocyanate; aliphatic diisocyanates such as hexamethylene diisocyanate and 2,2,4-trimethylhexamethylene diisocyanate; and the like. These isocyanate compounds are not particularly limited, but it is preferable to use isocyanate compounds blocked with various blocking agents from the viewpoint of the stability of the aqueous metal surface treatment agent. Examples of the blocking agent include various blocking agents such as phenol, alcohol, oxime, active methylene, acid amide, carbamate, and sulfite.
メチロール基を有する有機化合物としては、例えば、レゾール型フェノール樹脂、メチロールメラミン、N−メチロールアクリルアミドモノマーの単独重合体、N−メチロールアクリルアミドモノマーと他のモノマーとの共重合体等を挙げることができる。 Examples of the organic compound having a methylol group include a resol type phenol resin, methylol melamine, a homopolymer of N-methylol acrylamide monomer, a copolymer of N-methylol acrylamide monomer and other monomers, and the like.
アルデヒド基を有する有機化合物としては、例えば、グリオキサール、マロンジアルデヒド、サクシンジアルデヒド、グルタルジアルデヒド、アジピンジアルデヒド、ヘプタンジアール等のジアルデヒド化合物や、三つ以上のアルデヒド基を有する化合物等を挙げることができる。 Examples of organic compounds having an aldehyde group include dialdehyde compounds such as glyoxal, malondialdehyde, succindialdehyde, glutardialdehyde, adipine dialdehyde, heptane dial, and compounds having three or more aldehyde groups. Can be mentioned.
(架橋性無機化合物(B2))
架橋性無機化合物(B2)は、ポリビニルアルコール系化合物(A)と反応しうる元素を含む化合物である。「反応しうる」とは、ポリビニルアルコール系化合物(A)と接触してそれらに反応することができるという意味である。「含む」とは、これらの元素以外に他の元素を有していてもよいことを意味している。
(Crosslinkable inorganic compound (B2))
The crosslinkable inorganic compound (B2) is a compound containing an element that can react with the polyvinyl alcohol compound (A). The term “reactable” means that the polyvinyl alcohol compound (A) can be contacted with and reacted with them. “Including” means that other elements may be included in addition to these elements.
架橋性無機化合物(B2)としては、例えば、Mg、Al、Ca、Mn、Co、Ni、Cr(III)、Zn、Fe、Zr、Ti、Si、Sr、W、Ce、Mo、V、Sn、Bi、Ta、Te、In、Ba、Hf、Se、Sc、Nb、Cu、Y、Nd及びLaから選ばれる1種又は2種以上の元素を含む無機化合物を用いることができる。中でも、Mg、Al、Ca、Mn、Cr(III)、Zn、Fe、Zr、Ti、Si、Ce、Te及びHfから選ばれる1種又は2種以上の元素を含む無機化合物がより好ましく、Cr(III)、Zr、Ti、Si、Ce及びTeから選ばれる1種又は2種以上の元素を含む無機化合物がさらに好ましい。 Examples of the crosslinkable inorganic compound (B2) include Mg, Al, Ca, Mn, Co, Ni, Cr (III), Zn, Fe, Zr, Ti, Si, Sr, W, Ce, Mo, V, and Sn. Inorganic compounds containing one or more elements selected from Bi, Ta, Te, In, Ba, Hf, Se, Sc, Nb, Cu, Y, Nd, and La can be used. Among these, inorganic compounds containing one or more elements selected from Mg, Al, Ca, Mn, Cr (III), Zn, Fe, Zr, Ti, Si, Ce, Te, and Hf are more preferable. Inorganic compounds containing one or more elements selected from (III), Zr, Ti, Si, Ce and Te are more preferred.
具体的には、Mg、Al、Ca、Mn、Co、Ni、Cr(III)、Zn、Fe、Zr、Ti、Si、Sr、W、Ce、Mo、V、Sn、Bi、Ta、Te、In、Ba、Hf、Se、Sc、Nb、Cu、Y、Nd及びLaから選ばれる1種又は2種以上の元素を含む塩、錯化合物又は金属水和酸化物(以下、「塩等」ともいう。)を挙げることができる。 Specifically, Mg, Al, Ca, Mn, Co, Ni, Cr (III), Zn, Fe, Zr, Ti, Si, Sr, W, Ce, Mo, V, Sn, Bi, Ta, Te, A salt, complex compound or metal hydrated oxide (hereinafter referred to as “salt etc.”) containing one or more elements selected from In, Ba, Hf, Se, Sc, Nb, Cu, Y, Nd and La. Say).
より具体的には、ビス(アセチルアセトナト)ジアクアマグネシウム(II)、アルミン酸マグネシウム、安息香酸マグネシウム、蟻酸マグネシウム、蓚酸マグネシウム、タングステン酸マグネシウム、メタニオブ酸マグネシウム、ホウ酸マグネシウム、モリブデン酸マグネシウム、ヨウ化マグネシウム、ニリン酸マグネシウム、硝酸マグネシウム、硫酸マグネシウム、炭酸マグネシウム、水酸化マグネシウム、フッ化マグネシウム、リン酸アンモニウムマグネシウム、リン酸水素マグネシウム、酸化マグネシウム等のマグネシウム塩等;
硝酸アルミニウム、硫酸アルミニウム、硫酸カリウムアルミニウム、硫酸ナトリウムアルミニウム、硫酸アンモニウムアルミニウム、リン酸アルミニウム、炭酸アルミニウム、酸化アルミニウム、水酸化アルミニウム、酸化アルミニウム、フッ化アルミニウム、ヨウ化アルミニウム、酢酸アルミニウム、安息香酸アルミニウム、クエン酸アルミニウム、グルコン酸アルミニウム、セレン酸アルミニウム、蓚酸アルミニウム、酒石酸アルミニウム、乳酸アルミニウム、パルチミン酸アルミニウム等のアルミニウム塩等;
ビス(アセチルアセトナト)ジアクアカルシウム(II)、安息香酸カルシウム、クエン酸カルシウム、メタスズ酸カルシウム、セレン酸カルシウム、タングステン酸カルシウム、炭酸カルシウム、四ホウ酸カルシウム、モリブデン酸カルシウム、マレイン酸カルシウム、リンゴ酸カルシウム、ニリン酸カルシウム、フッ化カルシウム、ホスフィン酸カルシウム、硝酸カルシウム、水酸化カルシウム、酸化カルシウム、シュウ酸カルシウム、酸化カルシウム、酢酸カルシウム等のカルシウム塩等;
ビス(アセチルアセトナト)ジアクアマンガン(II)、四酸化三マンガン、酸化マンガン(II)、酸化マンガン(III)、酸化マンガン(IV)、臭化マンガン(II)、蓚酸マンガン(II)、過マンガン酸(VII)、過マンガン酸カリウム(VII)、過マンガン酸ナトリウム(VII)、リン酸二水素マンガン(II)、硝酸マンガン(II)、硫酸マンガン(II)、硫酸マンガン(III)、硫酸マンガン(IV)、フッ化マンガン(II)、フッ化マンガン(III)、炭酸マンガン(II)、酢酸マンガン(II)、酢酸マンガン(III)、硫酸アンモニウムマンガン(II)、ヨウ化マンガン(II)、水酸化マンガン(II)等のマンガン塩等又はマンガン酸塩等;
ビス(アセチルアセトナト)ジアクアコバルト(II)、トリス(アセチルアセトナト)コバルト(III)、スルファミン酸コバルト(II)、塩化コバルト(II)、クロロペンタアンミンコバルト塩化物(III)、ヘキサアンミンコバルト塩化物(III)、ジアンミンテトラニトロコバルト(III)酸アンモニウム、硫酸コバルト(II)、硫酸アンモニウムコバルト、硝酸コバルト(II)、酸化コバルト二アルミニウム、水酸化コバルト(II)、酸化コバルト(II)、リン酸コバルト、酢酸コバルト(II)、蟻酸コバルト(II)、四酸化三コバルト、臭化コバルト(II)、蓚酸コバルト(II)、セレン酸コバルト(II)、タングステン酸コバルト(II)、ヒドロキシ炭酸第一コバルト(II)、モリブデン酸コバルト(II)、ヨウ化コバルト(II)、リン酸コバルト(II)等のコバルト塩等;
二スルファミン酸ニッケル(II)、安息香酸ニッケル(II)、硝酸ニッケル(II)、硫酸ニッケル(II)、炭酸ニッケル(II)、ニッケルアセチルアセトネート(II)、塩化ニッケル(II)、ヘキサアンミンニッケル塩化物、酸化ニッケル、水酸化ニッケル(II)、酸化ニッケル(II)、酢酸ニッケル、クエン酸ニッケル(II)、コハク酸ニッケル(II)、臭化ニッケル(II)、蓚酸ニッケル(II)、酒石酸ニッケル(II)、セレン酸ニッケル(II)、ヒドロキシ炭酸ニッケル(II)、乳酸ニッケル(II)、モリブデン酸ニッケル(II)、ヨウ化ニッケル(II)、二リン酸ニッケル(II)等のニッケル塩等;
蟻酸クロム(III)、フッ化クロム(III)、硝酸クロム(III)、硫酸クロム(III)、蓚酸クロム(III)、酢酸クロム(III)、重燐酸クロム(III)、水酸化クロム(III)、酸化クロム(III)、臭化クロム(III)、ヨウ化クロム(III)等のクロム塩等;
ビス(アセチルアセトナト)亜鉛(II)、安息香酸亜鉛(II)、ヒドロキシ塩化亜鉛(II)、蟻酸亜鉛(II)、クエン酸亜鉛(II)、臭化亜鉛(II)、蓚酸亜鉛(II)、酒石酸亜鉛(II)、メタスズ酸亜鉛(II)、セレン酸亜鉛(II)、タングステン酸亜鉛(II)、フッ化亜鉛(II)、モリブデン酸亜鉛(II)、酪酸亜鉛(II)、ニリン酸亜鉛(II)、硫酸亜鉛(II)、炭酸亜鉛(II)、塩化亜鉛(II)、ヨウ化亜鉛(II)、水酸化亜鉛(II)、酸化亜鉛(II)等の亜鉛塩等;
ビス(アセチルアセトナト)ジアクア鉄(II)、トリス(アセチルアセトナト)鉄(III)、三蓚酸鉄三カリウム、蟻酸鉄(II)、四バナジン酸鉄(III)、臭化鉄(III)、酒石酸鉄(III)、乳酸鉄(II)、フッ化鉄(II)、フッ化鉄(III)、塩化鉄(II)、塩化鉄(III)、ヨウ化鉄(II)、ヨウ化鉄(III)、硫酸鉄(II)、硫酸鉄(III)、硝酸鉄(II)、硝酸鉄(III)、酢酸鉄(II)、酢酸鉄(III)、クエン酸鉄(II)クエン酸鉄(III)、グリシン鉄(II)、グリシン鉄(III)、蓚酸鉄(II)、蓚酸鉄(III)、ピコリン酸鉄(II)、ピコリン酸鉄(III)、L−フェニルアラニン鉄(II)、L−フェニルアラニン鉄(III)、マロン酸鉄(II)、マロン酸鉄(III)、水酸化鉄(II)、水酸化鉄(III)、酸化鉄(II)、酸化鉄(III)、四酸化三鉄等の鉄塩等;
ビス(アセチルアセトナト)ジアクアストロンチウム(II)、蟻酸ストロンチウム(II)、クエン酸ストロンチウム(II)タングステン酸ストロンチウム、メタスズ酸ストロンチウム、酸化ストロンチウム(IV)、酸化ストロンチウム(II)、蓚酸ストロンチウム、メタニオブ酸ストロンチウム、モリブデン酸ストロンチウム、ヨウ化ストロンチウム、硝酸ストロンチウム、硫酸ストロンチウム、炭酸ストロンチウム、酢酸ストロンチウム、塩化ストロンチウム、リン酸ストロンチウム、乳酸ストロンチウム等のストロンチウム塩等;
オキシ二蓚酸チタン二アンモニウム、オキシ二蓚酸チタン二カリウム、酸化チタン(II)、酸化チタン(III)、酸化チタン(IV)、オキシ硫酸第二チタン、塩基性リン酸チタン、臭化チタン(IV)、メタチタン酸、メタチタン酸亜鉛(II)、チタン酸アルミニウム(III)、メタチタン酸カリウム、メタチタン三コバルト(II)、チタン酸ジルコニウム、メタチタン酸ストロンチウム、メタチタン三鉄(III)、メタチタン酸銅(II)、チタン酸ナトリウム、二チタン酸ネオジム(III)、メタチタン酸バリウム、メタチタン酸ビスマス(III)、メタチタン酸マグネシウム、チタン酸マグネシウム、メタチタン酸マンガン(II)、二チタン酸ランタン(III)、メタチタン酸リチウム、ヘキサフルオロチタン(IV)酸アンモニウム、ヘキサフルオロチタン(IV)酸カリウム、ヨウ化チタン(IV)、硫酸チタン(III)、硫酸チタン(IV)、塩化チタン、硝酸チタン、硫酸チタニル、フッ化チタン(III)、フッ化チタン(IV)、ヘキサフルオロチタン酸、乳酸チタン、ペルオキソチタン酸、チタンラウレート、チタニウムアセチルアセトネート、水酸化チタン(IV)等のチタン塩等又はチタン酸塩等;
テトラキス(アセチルアセトナト)ジルコニウム(IV)、塩化酸化ジルコニウム(IV)、塩化ジルコニウム(IV)、ケイ酸ジルコニウム、酢酸酸化ジルコニウム(IV)、酸化ジルコニウム(IV)、硝酸酸化ジルコニウム(IV)、メタジルコニウム酸セシウム、メタジルコニウム酸リチウム、メタジルコニウム酸亜鉛(II)、メタジルコニウム酸アルミニウム(III)、メタジルコニウム酸カルシウム、メタジルコニウム酸コバルト(II)、メタジルコニウム酸ストロンチウム、メタジルコニウム酸銅(II)、メタジルコニウム酸ナトリウム、メタジルコニウム酸ニッケル(II)、メタジルコニウム酸バリウム、メタジルコニウム酸ビスマス(III)、メタジルコニウム酸マグネシウム、オキシ炭酸ジルコニウム、ヘキサフルオロジルコニウム(IV)酸アンモニウム、ヘキサフルオロジルコニウム(IV)酸カリウム、ヨウ化ジルコニウム、リン酸二水素酸化ジルコニウム(IV)、塩基性炭酸ジルコニウム、炭酸ジルコニウムアンモニウム、炭酸ジルコニルアンモニウム、硝酸ジルコニウム、硝酸ジルコニル、硫酸ジルコニウム(IV)、硫酸ジルコニル、ヘキサフルオロジルコニウム酸、オキシリン酸ジルコニウム、ピロリン酸ジルコニウム、リン酸二水素ジルコニル、オキシ塩化ジルコニウム、フッ化ジルコニウム、酢酸ジルコニル、酸化ジルコニウム、水酸化ジルコニウム等のジルコニウム塩等;
ヘキサフルオロケイ酸、シリカ等のケイ酸塩等;
塩化タングステン(VI)、酸化タングステン酸鉄(III)、塩化タングステン(VI)、オキシ二塩化タングステン、二酸化タングステン、三酸化タングステン、メタタングステン酸、メタタングステン酸アンモニウム、メタタングステン酸ナトリウム、パラタングステン酸、パラタングステン酸アンモニウム、パラタングステン酸ナトリウム、タングステン酸亜鉛(II)、タングステン酸カリウム、タングステン酸カルシウム、タングステン酸コバルト(II)、タングステン酸ストロンチウム、タングステン酸セシウム、タングステン酸銅(II)、タングステン酸ニッケル、タングステン酸バリウム、タングステン酸マグネシウム、タングステン酸マンガン(II)、タングステン酸リチウム、リンタングステン酸、リンタングステン酸アンモニウム、リンタングステン酸ナトリウム等のタングステン塩等又はタングステン酸塩等;
トリス(アセチルアセトナト)セリウム(III)、塩化セリウム(III)、酸化セリウム(III)、酸化セリウム(IV)、臭化セリウム(III)、蓚酸セリウム(III)、水酸化セリウム(IV)、硫酸第二セリウムアンモニウム(IV)、硫酸第一セリウムアンモニウム(III)、炭酸セリウム(III)、硫酸セリウム、酢酸セリウム(III)、硝酸セリウム(III)、硫酸セリウム(IV)、フッ化セリウム(III)、ヨウ化セリウム(III)、リン酸セリウム(III)等のセリウム塩等;
塩化モリブデン(V)、酸化モリブデン(IV)、酸化モリブデン(VI)、モリブデン酸亜鉛(II)、モリブデン酸カリウム、モリブデン酸カルシウム、モリブデン酸コバルト(II)、モリブデン酸セシウム、モリブデン酸ニッケル(II)、モリブデン酸バリウム、モリブデン酸ビスマス(III)、モリブデン酸マグネシウム、モリブデン酸リチウム、パラモリブデン酸リチウム、モリブデン酸ストロンチウム、リンモリブデン酸、リンモリブデン酸アンモニウム、リンモリブデン酸ナトリウム、モリブデン酸、モリブデン酸アンモニウム、パラモリブデン酸アンモニウム、モリブデン酸ナトリウム等のモリブデン塩等又はモリブデン酸塩等;
オキシ二塩化バナジウム、オキシ三塩化バナジウム、三塩化バナジウム、酸化バナジウム、四バナジン酸鉄(III)、臭化バナジウム(III)、オキシ蓚酸バナジウム、ヨウ化バナジウム(II)、五酸化バナジウム、メタバナジン酸、ピロバナジン酸ナトリウム、バナジン酸ナトリウム、メタバナジン酸アンモニウム、メタバナジン酸ナトリウム、メタバナジン酸カリウム、オキシ三塩化バナジウム、三酸化バナジウム、二酸化バナジウム、オキシ硫酸バナジウム、バナジウムオキシアセチルアセテート、バナジウムアセチルアセテート、リンバナドモリブデン酸等のバナジウム塩等又はバナジン酸塩等;
塩化スズ(II)、酢酸スズ(II)、蓚酸スズ(II)、酒石酸スズ(II)、酸化スズ(IV)、硝酸スズ、硫酸スズ、フッ化スズ(II)、ヨウ化スズ(II)、ヨウ化スズ(IV)、ピロリン酸スズ(II)、メタスズ酸、メタスズ酸亜鉛、メタスズ酸カルシウム、メタスズ酸ストロンチウム、メタスズ酸バリウム、メタスズ酸マグネシウム等のスズ塩又はスズ酸塩等;
安息香酸ビスマス(III)、塩化酸化ビスマス(III)、クエン酸ビスマス(III)、オキシ酢酸ビスマス(III)、酸化酒石酸ビスマス(III)、酸化ビスマス(III)、オキシ硫酸二ビスマス、臭化ビスマス(III)、酒石酸ビスマス(III)、水酸化ビスマス(III)、オキシ炭酸二ビスマス、ジルコニウム酸ビスマス(III)、オキシ硝酸ビスマス、四チタン酸ビスマス(III)、三チタン酸ビスマス(III)、フッ化ビスマス(III)、モリブデン酸ビスマス(III)、ヨウ化ビスマス(III)、硝酸ビスマス(III)、塩化ビスマス(III)、硫酸ビスマス(III)、酢酸ビスマス(III)、リン酸ビスマス(III)等のビスマス塩等;
塩化タンタル(V)、酸化タンタル(V)、臭化タンタル(V)、タンタル酸、六タンタル酸カリウム、メタタンタル酸ストロンチウム、メタタンタル酸ナトリウム、メタタンタル酸リチウム、ヨウ化タンタル(V)、タンタルオキシアセチルアセトネート、メタタンタル酸、メタタンタル酸アンモニウム、ヘプタフルオロタンタル酸カリウム等のタンタル塩等又はタンタル酸塩等;
テルル酸、メタテルル酸アンモニウム、メタテルル酸カリウム、メタテルル酸ナトリウム、ヨウ化テルル(IV)、テルル酸カリウム、テルル酸ナトリウム、亜テルル酸、亜テルル酸カリウム、亜テルル酸ナトリウム、亜テルル酸バリウム、亜テルル酸リチウム、塩化テルル(IV)、酸化テルル(IV)、臭化テルル(IV)、水酸化硝酸三酸化二テルル、亜テルル酸亜鉛等のテルル塩等又はテルル酸塩等;
トリス(アセチルアセトナト)インジウム(III)、アミド硫酸インジウム(III)、二塩化インジウム、塩化インジウム(I)、塩化インジウム(III)、酢酸インジウム(III)、臭化インジウム(III)、ヨウ化インジウム(III)、硝酸インジウム(III)、硫酸インジウム(III)、フッ化インジウム(III)、酸化インジウム(III)、水酸化インジウム(III)等のインジウム塩等;
ビス(アセチルアセトナト)ジアクアバリウム(II)、亜セレン酸バリウム、亜テルル酸バリウム、安息香酸バリウム、アルミン酸バリウム、塩化バリウム、蟻酸バリウム、クエン酸バリウム、酸化バリウム、臭化バリウム、蓚酸バリウム、酒石酸バリウム、メタジルコニウム酸バリウム、水酸化バリウム、メタスズ酸バリウム、タングステン酸バリウム、メタチタン酸バリウム、メタニオブ酸バリウム、乳酸バリウム、メタホウ酸バリウム、モリブデン酸バリウム、ヨウ化バリウム、リン酸水素バリウム、炭酸バリウム、フッ化バリウム等のバリウム塩等;
テトラキス(アセチルアセトナト)ハフニウム(IV)、塩化ハフニウム(IV)、酸化ハフニウム(IV)、ヨウ化ハフニウム(IV)、硫酸ハフニウム(IV)、硝酸ハフニウム(IV)、オキシ蓚酸ハフニウム(IV)、フルオロハフニウム酸、フルオロハフニウム酸塩、フッ化ハフニウム等のハフニウム塩等又はハフニウム酸塩等;
亜セレン酸カリウム、亜セレン酸水素カリウム、亜セレン酸三水素セシウム、亜セレン酸水素ナトリウム、亜セレン酸水素リチウム、亜セレン酸銅(II)、亜セレン酸ナトリウム、亜セレン酸バリウム、オキシ塩化セレン、塩化セレン(I)、塩化セレン(IV)、酸化セレン(IV)、セレン酸アルミニウム、セレン酸、亜セレン酸亜鉛、セレン酸カリウム、セレン酸アンモニウム、セレン酸カルシウム、セレン酸セシウム、セレン酸コバルト、セレン酸銅(II)、セレン酸ニッケル、セレン酸ナトリウム、セレン酸バリウム、セレン酸亜鉛等のセレン塩等又はセレン酸塩等;
塩化スカンジウム(III)、蟻酸スカンジウム(III)、酢酸スカンジウム(III)、硝酸スカンジウム(III)、酸化スカンジウム(III)、フッ化スカンジウム(III)、ヨウ化スカンジウム(III)、硫酸スカンジウム(III)等のスカンジウム塩等;
酸化ニオブ(II)、酸化ニオブ(V)、五(蓚酸水素)ニオブ、水酸化ニオブ(V)、ニオブオキシアセチルアセトネート、メタニオブ酸、メタニオブ酸カルシウム、メタニオブ酸ストロンチウム、メタニオブ酸バリウム、メタニオブ酸マグネシウム、メタニオブ酸リチウム、メタニオブ酸アンモニウム、メタニオブ酸ナトリウム、五塩化ニオブ等のニオブ塩等又はニオブ酸塩等;
アミド硫酸銅(II)、安息香酸銅(II)、テトラアンミン銅(II)硝酸塩、クエン酸銅(II)、酸化銅(I)、臭化銅(I)、蓚酸銅(II)、蟻酸銅(II)、酢酸銅(II)、プロピオン酸銅(II)、吉草酸銅(II)、グルコン酸銅(II)、酒石酸銅(II)、塩化銅(II)、臭化銅(II)、水酸化銅(II)、酢酸銅(II)、硝酸銅(II)、硫酸銅(II)、炭酸銅(II)、酸化銅(II)、ヒドロキシ硝酸第二銅、タングステン酸銅(II)、炭酸水酸化銅(II)、乳酸銅(II)、フッ化銅(II)、ヨウ化銅(I)等の銅塩等;
トリス(アセチルアセトナト)イットリウム(III)、塩化イットリウム(III)、蟻酸イットリウム(III)、クエン酸イットリウム(III)、酢酸イットリウム(III)、酸化イットリウム(III)、蓚酸イットリウム(III)、硝酸イットリウム(III)、炭酸イットリウム(III)、フッ化イットリウム(III)、ヨウ化イットリウム(III)、硫酸イットリウム(III)、リン酸イットリウム(III)等のイットリウム塩等;
トリス(アセチルアセトナト)ランタン(III)、塩化ランタン(III)、蟻酸ランタン(III)、酢酸ランタン(III)、酸化ランタン(III)、蓚酸ランタン(III)、硝酸ランタン(III)、炭酸ランタン(III)、フッ化ランタン(III)、二チタン酸ランタン(III)、硫酸ランタン(III)、リン酸ランタン(III)、ヨウ化ランタン(III)等のランタン塩等;
トリス(アセチルアセトナト)ネオジム(III)、塩化ネオジム(III)、蟻酸ネオジム(III)、酢酸ネオジム(III)、酸化ネオジム(III)、臭化ネオジム(III)、蓚酸ネオジム(III)、硝酸ネオジム(III)、炭酸ネオジム(III)、二チタン酸ネオジム(III)、フッ化ネオジム(III)、ヨウ化ネオジム(III)、硫酸ネオジム(III)、リン酸ネオジム(III)等のネオジウム塩等;を挙げることができる。これらの化合物は無水物であってもよいし、水和物であってもよい。また、単独で使用してもよいし、2種以上組み合わせて使用してもよい。さらに、水系金属表面処理剤溶剤中に溶解していてもよいし、分散していてもよい。
More specifically, bis (acetylacetonato) diaquamagnesium (II), magnesium aluminate, magnesium benzoate, magnesium formate, magnesium oxalate, magnesium tungstate, magnesium metaniobate, magnesium borate, magnesium molybdate, iodine Magnesium salts such as magnesium phosphide, magnesium diphosphate, magnesium nitrate, magnesium sulfate, magnesium carbonate, magnesium hydroxide, magnesium fluoride, ammonium magnesium phosphate, magnesium hydrogen phosphate, magnesium oxide, etc .;
Aluminum nitrate, aluminum sulfate, potassium sulfate aluminum, sodium aluminum sulfate, aluminum sulfate aluminum, aluminum phosphate, aluminum carbonate, aluminum oxide, aluminum hydroxide, aluminum oxide, aluminum fluoride, aluminum iodide, aluminum acetate, aluminum benzoate, citric acid Aluminum salts such as aluminum acid, aluminum gluconate, aluminum selenate, aluminum oxalate, aluminum tartrate, aluminum lactate, aluminum palmitate, etc .;
Bis (acetylacetonato) diaqua calcium (II), calcium benzoate, calcium citrate, calcium metastannate, calcium selenate, calcium tungstate, calcium carbonate, calcium tetraborate, calcium molybdate, calcium maleate, apple Calcium salts such as calcium oxide, calcium diphosphate, calcium fluoride, calcium phosphinate, calcium nitrate, calcium hydroxide, calcium oxide, calcium oxalate, calcium oxide, and calcium acetate;
Bis (acetylacetonato) diaquamanganese (II), trimanganese tetraoxide, manganese (II) oxide, manganese (III) oxide, manganese (IV) oxide, manganese bromide (II), manganese oxalate (II), peroxy Manganic acid (VII), potassium permanganate (VII), sodium permanganate (VII), manganese dihydrogen phosphate (II), manganese nitrate (II), manganese sulfate (II), manganese sulfate (III), sulfuric acid Manganese (IV), manganese fluoride (II), manganese fluoride (III), manganese carbonate (II), manganese acetate (II), manganese acetate (III), ammonium manganese sulfate (II), manganese iodide (II), Manganese salts such as manganese hydroxide (II) or manganates;
Bis (acetylacetonato) diaquacobalt (II), Tris (acetylacetonato) cobalt (III), Cobalt (II) sulfamate, Cobalt (II) chloride, Chloropentamminecobalt chloride (III), Hexaamminecobalt Chloride (III), diammine tetranitrocobalt (III) ammonium, cobalt sulfate (II), ammonium cobalt sulfate, cobalt nitrate (II), cobalt aluminum oxide, cobalt hydroxide (II), cobalt oxide (II), phosphorus Cobalt oxide, cobalt acetate (II), cobalt formate (II), cobalt trioxide, cobalt bromide (II), cobalt oxalate (II), cobalt selenate (II), cobalt tungstate (II), hydroxy carbonate Cobalt (II), cobalt molybdate (II), cobalt iodide (II), cobalt phosphate II) cobalt salts such like;
Nickel (II) disulfamate, nickel (II) benzoate, nickel (II) nitrate, nickel (II) sulfate, nickel (II) carbonate, nickel acetylacetonate (II), nickel chloride (II), hexaammine nickel Chloride, nickel oxide, nickel hydroxide (II), nickel oxide (II), nickel acetate, nickel citrate (II), nickel succinate (II), nickel bromide (II), nickel oxalate (II), tartaric acid Nickel salts such as nickel (II), nickel selenate (II), nickel nickel carbonate (II), nickel lactate (II), nickel molybdate (II), nickel iodide (II), nickel diphosphate (II) etc;
Chromium formate (III), chromium fluoride (III), chromium nitrate (III), chromium sulfate (III), chromium oxalate (III), chromium acetate (III), chromium biphosphate (III), chromium hydroxide (III) Chromium salts such as chromium (III) oxide, chromium (III) bromide and chromium (III) iodide;
Bis (acetylacetonato) zinc (II), zinc benzoate (II), hydroxy zinc chloride (II), zinc formate (II), zinc citrate (II), zinc bromide (II), zinc oxalate (II) , Zinc tartrate (II), zinc metastannate (II), zinc selenate (II), zinc tungstate (II), zinc fluoride (II), zinc molybdate (II), zinc butyrate (II), diphosphoric acid Zinc salts such as zinc (II), zinc sulfate (II), zinc carbonate (II), zinc chloride (II), zinc iodide (II), zinc hydroxide (II), zinc oxide (II), etc .;
Bis (acetylacetonato) diaqua iron (II), tris (acetylacetonato) iron (III), tripotassium iron trisuccinate, iron (II) formate, iron (III) tetravanadate, iron (III) bromide, tartaric acid Iron (III), iron lactate (II), iron fluoride (II), iron fluoride (III), iron chloride (II), iron chloride (III), iron iodide (II), iron iodide (III) , Iron sulfate (II), iron sulfate (III), iron nitrate (II), iron nitrate (III), iron acetate (II), iron acetate (III), iron citrate (II) iron citrate (III), Glycine iron (II), glycine iron (III), iron oxalate (II), iron oxalate (III), iron picolinate (II), iron picolinate (III), L-phenylalanine iron (II), L-phenylalanine iron (III), iron malonate (II), iron malonate (III), iron hydroxide (II), iron hydroxide (III), iron oxide (II), iron oxide (III), triiron tetroxide, etc. Iron salt, etc .;
Bis (acetylacetonato) diaquastrontium (II), strontium formate (II), strontium citrate (II) strontium tungstate, strontium metastannate, strontium oxide (IV), strontium oxide (II), strontium oxalate, metaniobic acid Strontium salts such as strontium, strontium molybdate, strontium iodide, strontium nitrate, strontium sulfate, strontium carbonate, strontium acetate, strontium chloride, strontium phosphate, and strontium lactate;
Titanium diammonium oxalate, dipotassium oxybisuccinate, titanium (II) oxide, titanium (III) oxide, titanium (IV) oxide, titanium oxysulfate, basic titanium phosphate, titanium bromide (IV) , Metatitanic acid, zinc metatitanate (II), aluminum titanate (III), potassium metatitanate, trititanium tricobalt (II), zirconium titanate, strontium metatitanate, metatitanium triiron (III), copper metatitanate (II) , Sodium titanate, neodymium (III) dititanate, barium metatitanate, bismuth (III) metatitanate, magnesium metatitanate, magnesium titanate, manganese metatitanate (II), lanthanum dititanate (III), lithium metatitanate , Ammonium hexafluorotitanium (IV), hexafluorotitanium ( IV) Potassium acid, titanium iodide (IV), titanium sulfate (III), titanium sulfate (IV), titanium chloride, titanium nitrate, titanyl sulfate, titanium fluoride (III), titanium fluoride (IV), hexafluorotitanium Titanium salts such as acid, titanium lactate, peroxotitanic acid, titanium laurate, titanium acetylacetonate, titanium hydroxide (IV), etc. or titanates;
Tetrakis (acetylacetonato) zirconium (IV), zirconium chloride (IV), zirconium chloride (IV), zirconium silicate, zirconium acetate oxide (IV), zirconium oxide (IV), zirconium oxide nitrate (IV), metazirconium Cesium acid, Lithium metazirconate, Zinc (II) metazirconate, Aluminum (III) metazirconate, Calcium metazirconate, Cobalt (II) metazirconate, Strontium metazirconate, Copper (II) metazirconate, Sodium metazirconate, nickel metazirconate (II), barium metazirconate, bismuth metazirconate (III), magnesium metazirconate, zirconium oxycarbonate, hexafluorozirconium (IV) acid Monium, potassium hexafluorozirconium (IV), zirconium iodide, zirconium dihydrogen oxide (IV), basic zirconium carbonate, ammonium zirconium carbonate, zirconyl ammonium carbonate, zirconium nitrate, zirconyl nitrate, zirconium (IV) sulfate, Zirconyl sulfate, hexafluorozirconic acid, zirconium oxyphosphate, zirconium pyrophosphate, zirconium dihydrogen phosphate, zirconium oxychloride, zirconium fluoride, zirconium fluoride, zirconium acetate, zirconium oxide, zirconium hydroxide, etc .;
Silicates such as hexafluorosilicic acid and silica;
Tungsten chloride (VI), iron (III) oxide tungstate, tungsten chloride (VI), tungsten oxychloride, tungsten dioxide, tungsten trioxide, metatungstic acid, ammonium metatungstate, sodium metatungstate, paratungstic acid, Ammonium paratungstate, sodium paratungstate, zinc tungstate (II), potassium tungstate, calcium tungstate, cobalt tungstate (II), strontium tungstate, cesium tungstate, copper (II) tungstate, nickel tungstate , Barium tungstate, magnesium tungstate, manganese (II) tungstate, lithium tungstate, phosphotungstic acid, ammonium phosphotungstate Tungsten salt or tungstate such as sodium phosphotungstic acid;
Tris (acetylacetonato) cerium (III), cerium (III) chloride, cerium (III) oxide, cerium (IV) oxide, cerium bromide (III), cerium (III) oxalate, cerium hydroxide (IV), sulfuric acid Ceric ammonium (IV), ceric ammonium sulfate (III), cerium carbonate (III), cerium sulfate, cerium acetate (III), cerium nitrate (III), cerium sulfate (IV), cerium fluoride (III) Cerium salts such as cerium (III) iodide and cerium (III) phosphate;
Molybdenum chloride (V), molybdenum oxide (IV), molybdenum oxide (VI), zinc molybdate (II), potassium molybdate, calcium molybdate, cobalt molybdate (II), cesium molybdate, nickel (II) molybdate , Barium molybdate, bismuth molybdate (III), magnesium molybdate, lithium molybdate, lithium paramolybdate, strontium molybdate, phosphomolybdic acid, ammonium phosphomolybdate, sodium phosphomolybdate, molybdate, ammonium molybdate, Molybdenum salts such as ammonium paramolybdate and sodium molybdate, or molybdates;
Vanadium oxydichloride, vanadium oxytrichloride, vanadium trichloride, vanadium oxide, iron (III) tetravanadate, vanadium (III) bromide, vanadium oxyoxalate, vanadium iodide (II), vanadium pentoxide, metavanadate, Sodium pyrovanadate, sodium vanadate, ammonium metavanadate, sodium metavanadate, potassium metavanadate, vanadium oxytrichloride, vanadium trioxide, vanadium dioxide, vanadium oxysulfate, vanadium oxyacetyl acetate, vanadium acetyl acetate, phosphovanadomolybdic acid, etc. Vanadium salt or vanadate, etc .;
Tin (II) chloride, tin (II) acetate, tin (II) oxalate, tin (II) tartrate, tin (IV) oxide, tin nitrate, tin sulfate, tin fluoride (II), tin iodide (II), Tin salts such as tin (IV) iodide, tin (II) pyrophosphate, metastannic acid, zinc metastannate, calcium metastannate, strontium metastannate, barium metastannate, magnesium metastannate, etc .;
Bismuth (III) benzoate, bismuth chloride (III) chloride, bismuth citrate (III), bismuth oxyacetate (III), bismuth oxide tartrate (III), bismuth oxide (III), dibismuth oxysulfate, bismuth bromide ( III), bismuth tartrate (III), bismuth hydroxide (III), dibismuth oxycarbonate, bismuth zirconate (III), bismuth oxynitrate, bismuth tetratitanate, bismuth trititanate (III), fluoride Bismuth (III), bismuth molybdate (III), bismuth iodide (III), bismuth nitrate (III), bismuth chloride (III), bismuth sulfate (III), bismuth acetate (III), bismuth phosphate (III), etc. Bismuth salt, etc .;
Tantalum (V), tantalum oxide (V), tantalum bromide (V), tantalum acid, potassium hexatantalate, strontium metatantalate, sodium metatantalate, lithium metatantalate, tantalum iodide (V), tantalumoxyacetylacetate Tantalum salts such as nate, metatantalic acid, ammonium metatantalate, potassium heptafluorotantalate, etc. or tantalates;
Telluric acid, ammonium metatellurate, potassium metatellurate, sodium metatellurate, tellurium iodide (IV), potassium tellurate, sodium tellurate, tellurite, potassium tellurite, sodium tellurite, barium tellurite, sublimation Tellurium salts such as lithium tellurate, tellurium chloride (IV), tellurium oxide (IV), tellurium bromide (IV), ditellurium hydroxide trioxide, zinc tellurite, etc. or telluric acid salts;
Tris (acetylacetonato) indium (III), indium amidosulfate (III), indium dichloride, indium chloride (I), indium chloride (III), indium acetate (III), indium bromide (III), indium iodide Indium salts such as (III), indium (III) nitrate, indium (III) sulfate, indium (III) fluoride, indium (III) oxide, indium (III) hydroxide;
Bis (acetylacetonato) diaquabarium (II), barium selenite, barium tellurite, barium benzoate, barium aluminate, barium chloride, barium formate, barium citrate, barium oxide, barium bromide, barium oxalate , Barium tartrate, barium metazirconate, barium hydroxide, barium metastannate, barium tungstate, barium metatitanate, barium metaniobate, barium lactate, barium metaborate, barium molybdate, barium iodide, barium hydrogen phosphate, carbonic acid carbonate Barium salts such as barium and barium fluoride;
Tetrakis (acetylacetonato) hafnium (IV), hafnium chloride (IV), hafnium oxide (IV), hafnium iodide (IV), hafnium sulfate (IV), hafnium nitrate (IV), hafnium oxysuccinate (IV), fluoro Hafnium salts such as hafnium acid, fluorohafnate, hafnium fluoride, or the like;
Potassium selenite, potassium hydrogen selenite, cesium trihydrogen selenite, sodium hydrogen selenite, lithium hydrogen selenite, copper selenite (II), sodium selenite, barium selenite, oxychloride Selenium, selenium chloride (I), selenium chloride (IV), selenium oxide (IV), aluminum selenate, selenate, zinc selenite, potassium selenate, ammonium selenate, calcium selenate, cesium selenate, selenate Selenium salts such as cobalt, copper (II) selenate, nickel selenate, sodium selenate, barium selenate, zinc selenate, etc. or selenates;
Scandium chloride (III), scandium formate (III), scandium acetate (III), scandium nitrate (III), scandium oxide (III), scandium fluoride (III), scandium iodide (III), scandium sulfate (III), etc. Scandium salts of
Niobium (II) oxide, niobium (V) oxide, niobium (hydrogen oxalate), niobium hydroxide (V), niobium oxyacetylacetonate, metaniobic acid, calcium metaniobate, strontium metaniobate, barium metaniobate, magnesium metaniobate , Lithium metaniobate, ammonium metaniobate, sodium metaniobate, niobium salts such as niobium pentachloride, or niobate salts;
Copper amidosulfate (II), copper benzoate (II), tetraammine copper (II) nitrate, copper citrate (II), copper oxide (I), copper bromide (I), copper oxalate (II), copper formate ( II), copper acetate (II), copper propionate (II), copper (II) valerate, copper (II) gluconate, copper (II) tartrate, copper (II) chloride, copper (II) bromide, water Copper (II) oxide, Copper acetate (II), Copper nitrate (II), Copper sulfate (II), Copper carbonate (II), Copper oxide (II), Cupric hydroxy nitrate, Copper tungstate (II), Carbonic acid Copper salts such as copper hydroxide (II), copper lactate (II), copper fluoride (II), copper iodide (I), etc .;
Tris (acetylacetonato) yttrium (III), yttrium chloride (III), yttrium formate (III), yttrium citrate (III), yttrium acetate (III), yttrium oxide (III), yttrium oxalate (III), yttrium nitrate Yttrium salts such as (III), yttrium carbonate (III), yttrium fluoride (III), yttrium iodide (III), yttrium sulfate (III), and yttrium phosphate (III);
Tris (acetylacetonato) lanthanum (III), lanthanum chloride (III), lanthanum formate (III), lanthanum acetate (III), lanthanum oxide (III), lanthanum oxalate (III), lanthanum nitrate (III), lanthanum carbonate ( III), lanthanum salts such as lanthanum fluoride (III), lanthanum dititanate (III), lanthanum sulfate (III), lanthanum phosphate (III), lanthanum iodide (III), etc .;
Tris (acetylacetonato) neodymium (III), neodymium (III) chloride, neodymium (III) formate, neodymium (III) acetate, neodymium (III) oxide, neodymium (III) bromide, neodymium oxalate (III), neodymium nitrate Neodymium salts such as (III), neodymium carbonate (III), neodymium dititanate (III), neodymium fluoride (III), neodymium iodide (III), neodymium sulfate (III), and neodymium phosphate (III); Can be mentioned. These compounds may be anhydrides or hydrates. Moreover, you may use individually and may be used in combination of 2 or more type. Furthermore, it may be dissolved or dispersed in the aqueous metal surface treatment agent solvent.
架橋性有機化合物(B1)及び架橋性無機化合物(B2)から選ばれる1種又は2種以上の架橋性化合物(B)の含有量の総計(B=B1+B2)は、水系金属表面処理剤に含まれる全固形分に対して、10質量%〜90質量%とすることが好ましく、20質量%〜90質量%とすることがより好ましく、30質量%〜85質量%とすることが特に好ましい。架橋性化合物(B)の含有量が10質量%〜90質量%の範囲にあると、その水系金属処理剤で処理して得られる表面処理皮膜の密着性及び耐薬品密着維持性がさらに向上する。 The total content (B = B1 + B2) of one or more crosslinkable compounds (B) selected from the crosslinkable organic compound (B1) and the crosslinkable inorganic compound (B2) is included in the aqueous metal surface treatment agent. The total solid content is preferably 10% by mass to 90% by mass, more preferably 20% by mass to 90% by mass, and particularly preferably 30% by mass to 85% by mass. When the content of the crosslinkable compound (B) is in the range of 10% by mass to 90% by mass, the adhesion of the surface treatment film obtained by the treatment with the aqueous metal treating agent and the chemical adhesion maintaining property are further improved. .
(溶剤)
本発明に係る水系金属表面処理剤は、金属材料表面に塗布する際の作業性を良くするために、必要に応じて各種の溶剤を含有することができる。
(solvent)
The aqueous metal surface treatment agent according to the present invention may contain various solvents as required in order to improve workability when applied to the surface of the metal material.
溶剤としては、例えば、水;ヘキサン、ペンタン等のアルカン系溶剤;ベンゼン、トルエン等の芳香族系溶剤;エタノール、1−ブタノール、エチルセロソルブ等のアルコール系溶剤;テトラヒドロフラン、ジオキサン等のエーテル系溶剤;酢酸エチル、酢酸ブトキシエチル等のエステル系溶剤;ジメチルホルムアミド、N−メチルピロリドン等のアミド系溶剤;ジメチルスルホキシド等のスルホン系溶剤;ヘキサメチルリン酸トリアミド等のリン酸アミド系溶剤;等が挙げられる。これらの溶剤は、上記各溶剤のうち1種類を用いてもよいし、2種以上を混合して用いてもよい。このうち、環境上、経済上有利である理由から、水が好ましい。 Examples of the solvent include water; alkane solvents such as hexane and pentane; aromatic solvents such as benzene and toluene; alcohol solvents such as ethanol, 1-butanol and ethyl cellosolve; ether solvents such as tetrahydrofuran and dioxane; Ester solvents such as ethyl acetate and butoxyethyl acetate; amide solvents such as dimethylformamide and N-methylpyrrolidone; sulfone solvents such as dimethyl sulfoxide; phosphoric acid amide solvents such as hexamethylphosphoric triamide; . One of these solvents may be used, or two or more of these solvents may be mixed and used. Of these, water is preferred because it is environmentally and economically advantageous.
(その他の添加剤)
本発明に係る水系金属表面処理剤は、界面活性剤、消泡剤、レベリング剤、防菌防ばい剤、着色剤等を、本発明の趣旨及び皮膜性能を損なわない範囲で含有することができる。
(Other additives)
The water-based metal surface treatment agent according to the present invention can contain a surfactant, an antifoaming agent, a leveling agent, an antibacterial and antifungal agent, a colorant and the like within a range not impairing the gist and film performance of the present invention. .
(水系金属表面処理剤の調製方法)
本発明に係る水系金属表面処理剤の製造方法は、特に限定されない。例えば、ポリビニルアルコール系化合物(A)と架橋性化合物(B)は、任意に含まれる添加剤及び任意に含まれる溶媒等と混ぜ、混合ミキサー等の攪拌機を用いて十分に混合することによって調製することができる。
(Method for preparing aqueous metal surface treatment agent)
The method for producing the aqueous metal surface treatment agent according to the present invention is not particularly limited. For example, the polyvinyl alcohol-based compound (A) and the crosslinkable compound (B) are prepared by mixing with an optional additive, an optional solvent, and the like, and sufficiently mixing using a stirrer such as a mixing mixer. be able to.
[金属材料]
本発明に係る金属材料10は、図1に示すように、基材金属1と、その表面に本発明に係る水系金属表面処理剤を塗布して形成された表面処理皮膜2を有する。「塗布」とは、後述する塗布工程によって、基材金属1の表面に水系金属表面処理剤を塗ることをいう。「有する」とは、基材金属1及び表面処理皮膜2以外に他の構成を有していてもよいことを意味している。例えば、表面処理皮膜2の上にラミネート加工によって形成された樹脂フィルム3を有していてもよい。表面処理皮膜2は、上記した本発明に係る水系金属表面処理剤を基材金属1に塗布して形成されるので、密着性及び耐薬品密着維持性に優れている。
[Metal material]
As shown in FIG. 1, a
金属材料10は、そのような表面処理皮膜2を有するので、表面処理皮膜2の上に樹脂フィルム3又は樹脂塗膜3を形成した後、深絞り加工、しごき加工又はストレッチドロー加工等の厳しい成形加工を施した場合であっても、また、さらに酸等に曝された場合であっても、樹脂フィルム3又は樹脂塗膜3が金属材料10から剥離することを防ぐことができる。
Since the
なお、図1では、基材金属1の一方の表面に、表面処理皮膜2と、樹脂フィルム3又は樹脂塗膜3とを形成した例を示しているが、基材金属1の両面に、すなわち他方の表面にも表面処理皮膜2を形成し、さらに樹脂フィルム3又は樹脂塗膜3を設けてもよい。
In addition, in FIG. 1, although the example which formed the surface treatment film | membrane 2 and the resin film 3 or the resin coating film 3 on one surface of the
基材金属1の種類は、特に限定されず、各種のものを適用できる。例えば、食品用缶のボディー又は蓋材、食品用容器、乾電池容器、2次電池の外装材等に適用可能な金属材料を挙げることができるが、これらに限定されず、広い用途に応用可能な金属材料を用いることができる。特に、携帯電話、電子手帳、ノート型パソコン又はビデオカメラ等に用いられるモバイル用リチウムイオン2次電池の外装材、電気自動車又はハイブリッド自動車の駆動エネルギーとして用いるリチウムイオン2次電池の外装材として利用可能な金属材料を挙げることができる。これらの金属材料のうち、その表面に表面処理皮膜を形成することができ、さらに表面処理皮膜の上に樹脂フィルムをラミネート等することができ、その後に深絞り加工、しごき加工又はストレッチドロー加工等の厳しい成形加工を施すことができる金属材料を好ましく用いることができる。
The kind of
そうした金属材料としては、例えば、純銅、銅合金等の銅材料、純アルミニウム、アルミニウム合金等のアルミニウム材料、普通鋼、合金鋼等の鉄材料、純ニッケル、ニッケル合金等のニッケル材料等を挙げることができる。 Examples of such metal materials include copper materials such as pure copper and copper alloys, aluminum materials such as pure aluminum and aluminum alloys, iron materials such as ordinary steel and alloy steel, and nickel materials such as pure nickel and nickel alloys. Can do.
銅合金としては、銅を50質量%以上含有するものが好ましく、例えば、黄銅等を用いることができる。銅合金における銅以外の合金成分としては、例えば、Zn、P、Al、Fe、Ni等を挙げることができる。アルミニウム合金としては、アルミニウムを50質量%以上含有するものが好ましく、例えば、Al−Mg系合金等を用いることができる。アルミニウム合金におけるアルミニウム以外の合金成分としては、例えば、Si、Fe、Cu、Mn、Cr、Zn、Ti等を挙げることができる。合金鋼としては、鉄を50質量%以上含有するものが好ましく、例えば、ステンレス鋼等を用いることができる。合金鋼における鉄以外の合金成分としては、例えば、C、Si、Mn、P、S、Ni、Cr、Mo等を挙げることができる。ニッケル合金としては、ニッケルを50質量%以上含有するものが好ましく、例えば、Ni−P合金等を用いることができる。ニッケル合金におけるニッケル以外の合金成分としては、例えば、Al、C、Co、Cr、Cu、Fe、Zn、Mn、Mo、P等を挙げることができる。 As a copper alloy, what contains 50 mass% or more of copper is preferable, For example, brass etc. can be used. Examples of alloy components other than copper in the copper alloy include Zn, P, Al, Fe, and Ni. As the aluminum alloy, one containing 50% by mass or more of aluminum is preferable. For example, an Al—Mg alloy or the like can be used. Examples of alloy components other than aluminum in the aluminum alloy include Si, Fe, Cu, Mn, Cr, Zn, and Ti. As alloy steel, what contains 50 mass% or more of iron is preferable, for example, stainless steel etc. can be used. Examples of alloy components other than iron in the alloy steel include C, Si, Mn, P, S, Ni, Cr, and Mo. As a nickel alloy, what contains 50 mass% or more of nickel is preferable, for example, a Ni-P alloy etc. can be used. Examples of alloy components other than nickel in the nickel alloy include Al, C, Co, Cr, Cu, Fe, Zn, Mn, Mo, and P.
基材金属1は、上記した金属材料以外の金属材料、セラミックス材料又は有機材料の表面に、上記した金属元素を含む皮膜を形成したものであってもよい。そのような金属皮膜は、例えば、めっき、蒸着、クラッド等の手法により形成することができる。また、基材金属1の形状、構造等は特に限定されず、例えば、板状又は箔状の金属材料を用いることができる。
The
以上説明したように、本発明に係る水系金属表面処理剤によれば、上記したポリビニルアルコール系化合物(A)と、上記した架橋性有機化合物(B1)及び上記した架橋性無機化合物(B2)から選ばれる1種又は2種以上の架橋性化合物(B)とを含むので、その水系金属表面処理剤で処理して得られる表面処理皮膜が高い密着性を有するとともに、酸等に曝されても高い密着性を維持することができる。その結果、表面処理皮膜が形成された金属材料に樹脂フィルムをラミネートし又は樹脂塗膜を形成し、その後に深絞り加工、しごき加工又はストレッチドロー加工等の厳しい成形加工を施した場合であっても、さらに酸や有機溶剤等に曝された場合であっても、そのラミネートフィルム又は樹脂塗膜が金属材料から剥離することを防ぐことができる。 As described above, according to the water-based metal surface treatment agent according to the present invention, from the polyvinyl alcohol compound (A), the crosslinkable organic compound (B1), and the crosslinkable inorganic compound (B2) described above. Since one or two or more types of crosslinkable compounds (B) are selected, the surface treatment film obtained by treatment with the aqueous metal surface treatment agent has high adhesion and is exposed to an acid or the like. High adhesion can be maintained. As a result, when a resin film is laminated or a resin coating film is formed on a metal material on which a surface treatment film is formed, and then a severe forming process such as deep drawing, ironing or stretch drawing is performed. In addition, even when exposed to an acid, an organic solvent, or the like, the laminate film or the resin coating film can be prevented from peeling from the metal material.
[表面処理方法]
水系金属表面処理剤を用いた金属表面の処理方法は、水系金属表面処理剤を基材金属の表面に塗布する塗布工程と、塗布工程の後、水洗することなく乾燥し、表面処理皮膜を形成する乾燥工程とによって形成することができる。
[Surface treatment method]
A metal surface treatment method using a water-based metal surface treatment agent is a coating process in which a water-based metal surface treatment agent is applied to the surface of a base metal, and after the coating process, it is dried without washing to form a surface treatment film. And a drying step.
(塗布工程)
塗布工程は、水系金属表面処理剤を基材金属の表面に塗布する工程である。塗布する方法は、特に限定されず、例えば、スプレーコート、ディップコート、ロールコート、カーテンコート、スピンコート、又はこれらを組み合わせた方法を用いることができる。水系金属表面処理剤の使用条件は、特に限定されない。例えば、塗布する際の水系金属表面処理剤及び金属材料の温度は、10℃〜90℃であることが好ましく、20℃〜60℃であることがより好ましい。温度が60℃以下であると、無駄なエネルギーの使用を抑制することができる。また、塗布する時間及び塗布する量は、得られる表面処理皮膜の求められる膜厚に応じて適宜設定することができる。
(Coating process)
An application process is a process of apply | coating an aqueous metal surface treating agent to the surface of a base metal. The method of applying is not particularly limited, and for example, spray coating, dip coating, roll coating, curtain coating, spin coating, or a combination of these can be used. The conditions for using the aqueous metal surface treatment agent are not particularly limited. For example, the temperature of the aqueous metal surface treatment agent and the metal material at the time of application is preferably 10 ° C to 90 ° C, and more preferably 20 ° C to 60 ° C. Use of useless energy can be suppressed as temperature is 60 degrees C or less. Moreover, the application time and the application amount can be appropriately set according to the required film thickness of the obtained surface treatment film.
(乾燥工程)
乾燥工程は、塗布工程後、水洗することなく乾燥し、表面処理皮膜を形成する工程である。乾燥温度は、使用する溶剤に合わせた温度とすることができる。例えば、水を溶剤として用いた場合には、50℃〜260℃の範囲であることが好ましい。乾燥装置は特に限定されないが、バッチ式、連続式又は熱風循環式の乾燥炉、コンベアー式熱風乾燥炉又はIHヒーターを用いた電磁誘導加熱炉等を用いることができ、その風量と風速等は任意に設定することができる。
(Drying process)
A drying process is a process of drying, without washing with water after an application process, and forming a surface treatment coat. The drying temperature can be a temperature that matches the solvent used. For example, when water is used as the solvent, the temperature is preferably in the range of 50 ° C to 260 ° C. The drying apparatus is not particularly limited, but a batch type, continuous type or hot air circulation type drying furnace, a conveyor type hot air drying furnace, an electromagnetic induction heating furnace using an IH heater, or the like can be used. Can be set to
こうして得られる表面処理皮膜は、その上にさらに樹脂フィルム(ラミネートフィルム)又は樹脂塗膜を形成後、深絞り加工、しごき加工又はストレッチドロー加工等の厳しい成形加工を施した場合であっても、また、さらに酸等に曝されても、ラミネートフィルム又は樹脂塗膜からなる樹脂皮膜が剥離することを防ぐことができる。 Even if the surface treatment film obtained in this way is subjected to severe molding processing such as deep drawing processing, ironing processing or stretch drawing processing after forming a resin film (laminate film) or resin coating film thereon, Further, even when exposed to an acid or the like, it is possible to prevent the laminate film or the resin film made of the resin film from peeling off.
なお、得られる表面処理皮膜の膜厚は、0.01μm〜1μmとすることが好ましく、0.02μm〜0.05μmとすることがより好ましい。この範囲とすることで、表面処理皮膜の密着性及び耐薬品密着維持性をより高めることができる。 In addition, it is preferable that it is 0.01 micrometer-1 micrometer, and, as for the film thickness of the surface treatment film | membrane obtained, it is more preferable to set it as 0.02 micrometer-0.05 micrometer. By setting it as this range, the adhesiveness of a surface treatment film and chemical-resistant adhesion maintenance property can be improved more.
以下、実施例及び比較例により本発明をさらに詳しく説明する。本発明は以下の実施例により限定されるものではない。なお、以下において、「部」とは「質量部」のことであり、「質量%」は「重量%」と同義であり、以下では特に断らない限り単に「%」と表すこともある。「ppm」は「mg/L」と同義である。 Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples. The present invention is not limited by the following examples. In the following, “part” means “part by mass”, “mass%” is synonymous with “wt%”, and hereinafter, it may be simply expressed as “%” unless otherwise specified. “Ppm” is synonymous with “mg / L”.
[ポリビニルアルコール系化合物(A)]
用いたポリビニルアルコール系化合物(A)を以下に示す。
Aa:鹸化度96%、粘度25mPa・Sのポリビニルアルコール
Ab:鹸化度99%、粘度12mPa・S、アセトアセチル化度9.8%のアセトアセチル化ポリビニルアルコール
[Polyvinyl alcohol compound (A)]
The polyvinyl alcohol compound (A) used is shown below.
Aa: polyvinyl alcohol having a saponification degree of 96% and a viscosity of 25 mPa · S Ab: acetoacetylated polyvinyl alcohol having a saponification degree of 99%, a viscosity of 12 mPa · S, and an acetoacetylation degree of 9.8%
[架橋性化合物(B)]
(架橋性有機化合物(B1))
グリシジルエーテル基を有する有機化合物(B1a)として、グリセロールポリグリシジルエーテル(3官能、エポキシ当量144、粘度170mPa・S)を用いた。また、イソシアネート基を有する有機化合物(B1b)として、ヘキサメチレンジイソシアネート−アセト酢酸エチルブロック体を用いた。また、メチロール基を有する有機化合物(記号B1c)として、メチロールメラミンを用いた。また、アルデヒド基を有する有機化合物(B1d)として、グリオキサールを用いた。
[Crosslinking Compound (B)]
(Crosslinkable organic compound (B1))
As the organic compound (B1a) having a glycidyl ether group, glycerol polyglycidyl ether (trifunctional, epoxy equivalent 144, viscosity 170 mPa · S) was used. Moreover, the hexamethylene diisocyanate-ethyl acetoacetate block body was used as an organic compound (B1b) which has an isocyanate group. Moreover, methylol melamine was used as an organic compound having a methylol group (symbol B1c). In addition, glyoxal was used as the organic compound (B1d) having an aldehyde group.
(架橋性無機化合物(B2))
用いた架橋性無機化合物(B2)を以下に示す。
(Crosslinkable inorganic compound (B2))
The crosslinkable inorganic compound (B2) used is shown below.
B2a:チタンフッ化水素酸(濃度40.0質量%)
B2b:ジルコニウムフッ化水素酸(濃度40.0質量%)
B2c:シリカゾル(表面電荷カチオン、粒子径10〜20nm、19.0質量%、pH=4.7)
B2d:乳酸チタン(濃度44.0質量%)
B2e:非晶質ジルコニアゾル(不揮発分濃度10.0質量%、粒子径10〜30nm、pH=2.8)
B2f:ケイフッ化水素酸(濃度40.0質量%)
B2g:フッ化クロム(III)(Cr濃度1.0質量%)
B2h:フッ化鉄(III)(Fe濃度2.5質量%)
B2i;酸化セレン(IV)
B2j;酸化セリウムゾル(不揮発分濃度15%、pH=3.5)
B2k;酢酸クロム(III)
B2a: Titanium hydrofluoric acid (concentration: 40.0% by mass)
B2b: zirconium hydrofluoric acid (concentration: 40.0% by mass)
B2c: silica sol (surface charge cation,
B2d: Titanium lactate (concentration 44.0% by mass)
B2e: Amorphous zirconia sol (nonvolatile content concentration 10.0% by mass,
B2f: silicofluoric acid (concentration: 40.0% by mass)
B2g: Chromium fluoride (III) (Cr concentration: 1.0% by mass)
B2h: Iron (III) fluoride (Fe concentration: 2.5% by mass)
B2i; selenium oxide (IV)
B2j; cerium oxide sol (non-volatile content 15%, pH = 3.5)
B2k; chromium (III) acetate
[水系金属表面処理剤]
ポリビニルアルコール系化合物Aa及び/又はAbと、架橋性有機化合物B1a〜B1d及び架橋性無機化合物B2a〜B2gから選ばれる1種又は2種以上とを所定の含有量で組み合わせ、溶剤を水として、表1〜表3に示す実施例1〜41及び比較例1〜18の水系金属表面処理剤を準備した。なお、表1〜表3における「濃度」は、水系金属表面処理剤に含まれる各化合物の不揮発分濃度(質量%)を示す。また、「A濃度」は、水系金属表面処理剤中の全固形分に対するポリビニルアルコール系化合物(A)の合計含有量(質量%)を示し、「B1+B2濃度」は、水系金属表面処理剤中の全固形分に対する架橋性化合物(B)の含有量であって、架橋性有機化合物B1と架橋性無機化合物B2との合計含有量(質量%)を示す。なお、以下において、Cr(III)、Zr、Ti、Si、Ce及びTe以外の金属元素を含む架橋性無機化合物B2h及びB2iを含む実施例35及び40、並びに、架橋性無機化合物(B2)を含まない実施例1,3,5,8,9,26,28及び39は、比較例である。
[Water-based metal surface treatment agent]
A combination of polyvinyl alcohol compound Aa and / or Ab, one or more selected from crosslinkable organic compounds B1a to B1d and crosslinkable inorganic compounds B2a to B2g at a predetermined content, and a solvent as water. 1- Examples 1 to 41 shown in Table 3 and aqueous metal surface treatment agents of Comparative Examples 1 to 18 were prepared. In addition, "concentration" in Tables 1 to 3 indicates the nonvolatile content concentration (% by mass) of each compound contained in the aqueous metal surface treatment agent. “A concentration” indicates the total content (% by mass) of the polyvinyl alcohol compound (A) with respect to the total solid content in the aqueous metal surface treatment agent, and “B1 + B2 concentration” It is content of the crosslinkable compound (B) with respect to the total solid content, Comprising: Total content (mass%) of crosslinkable organic compound B1 and crosslinkable inorganic compound B2 is shown. In the following, Examples 35 and 40 containing crosslinkable inorganic compounds B2h and B2i containing metal elements other than Cr (III), Zr, Ti, Si, Ce and Te, and the crosslinkable inorganic compound (B2) Examples 1, 3, 5, 8, 9, 26, 28, and 39 not included are comparative examples.
[金属材料]
基材金属として用いた金属材料を以下に示す。
Al:A1100P、厚さ0.3mm
Cu:C1020P、厚さ0.3mm
Ni:純ニッケル板:(純度99質量%以上)、厚さ0.3mm
SUS:SUS304板、厚さ0.3mm
NiめっきCu:電気NiめっきCu板(厚さ0.3mm、Niめっき厚2μm)
これら金属材料から、表1〜表3の「基材」欄に示す金属材料を選択し、実施例1〜41及び比較例1〜22の基材金属として準備した。
[Metal material]
The metal material used as the base metal is shown below.
Al: A1100P, thickness 0.3mm
Cu: C1020P, thickness 0.3 mm
Ni: Pure nickel plate: (purity 99% by mass or more), thickness 0.3 mm
SUS: SUS304 plate, thickness 0.3mm
Ni plating Cu: Electric Ni plating Cu plate (thickness 0.3 mm, Ni plating thickness 2 μm)
From these metal materials, metal materials shown in the “base material” column of Tables 1 to 3 were selected and prepared as base metals of Examples 1 to 41 and Comparative Examples 1 to 22.
[供試材の作製]
(表面処理)
表1〜表3に示した実施例1〜41及び比較例1〜18の基材金属を、ファインクリーナー359E(日本パーカライジング株式会社製のアルカリ脱脂剤)の3%水溶液で65℃、1分間スプレー脱脂した後、水洗して表面を清浄した。続いて、金属材料の表面の水分を蒸発させるために、80℃で1分間、加熱乾燥した。脱脂洗浄した基材金属の表面に、それぞれ、表1〜表3に示した実施例1〜41及び比較例1〜18の水系金属表面処理剤を#3SUSマイヤーバーを用い、バーコートによって塗布し(塗布工程)、熱風循環式乾燥炉内で200℃、1分間乾燥し(乾燥工程)、表面処理皮膜を有する金属材料を得た。なお、同種の水系金属表面処理剤を用いて表面処理した金属材料をそれぞれ2つずつ準備し、以下に示すように、表面処理皮膜の上にそれぞれ別の方法でラミネート加工を施した。
[Production of test materials]
(surface treatment)
Spray the base metals of Examples 1 to 41 and Comparative Examples 1 to 18 shown in Tables 1 to 3 with a 3% aqueous solution of Fine Cleaner 359E (alkali degreasing agent manufactured by Nihon Parkerizing Co., Ltd.) at 65 ° C. for 1 minute. After degreasing, it was washed with water to clean the surface. Then, in order to evaporate the water | moisture content on the surface of a metal material, it heat-dried at 80 degreeC for 1 minute. The surface of the base metal that has been degreased and washed is coated with the aqueous metal surface treatment agents of Examples 1 to 41 and Comparative Examples 1 to 18 shown in Tables 1 to 3 by bar coating using a # 3SUS Meyer bar, respectively. (Coating process), dried in a hot air circulation drying oven at 200 ° C. for 1 minute (drying process) to obtain a metal material having a surface treatment film. In addition, two metal materials each surface-treated with the same kind of water-based metal surface treatment agent were prepared, and as described below, lamination was performed on the surface treatment film by different methods.
また、比較例19〜22に記載の金属材料を準備し、水系金属表面処理剤を塗布しないで、上記と同様に脱脂、水洗の後に加熱乾燥し、表面処理皮膜を有しない金属材料を得た。なお、同種の金属材料を2つずつ準備し、以下に示すように、それぞれ別の方法で表面にラミネート加工を施した。 Moreover, the metal material as described in Comparative Examples 19-22 was prepared, and without applying an aqueous metal surface treating agent, it was heat-dried after degreasing and rinsing in the same manner as described above to obtain a metal material having no surface treatment film. . In addition, two metal materials of the same kind were prepared, and the surface was laminated by different methods as shown below.
(ラミネート加工)
2つずつ準備した表面処理皮膜を有する金属材料の1つについて、その表面処理皮膜の上に、ヒートラミネーションによるラミネート加工を施した。他の1つの表面処理皮膜の上に、ドライラミネーションによるラミネート加工を施した。表面処理皮膜を有しない金属材料についても、2つのうち1つの片側表面にヒートラミネーションを施し、他の1つの片側表面にドライラミネーションを施した。
(Lamination)
About one of the metal materials having the surface treatment film prepared two by two, lamination processing by heat lamination was performed on the surface treatment film. Lamination by dry lamination was performed on another surface treatment film. For the metal material having no surface treatment film, heat lamination was applied to one side surface of the two, and dry lamination was applied to the other one side surface.
ヒートラミネーションによるラミネート加工は、次のように行った。酸変性ポリプロピレンのディスパージョン(三井化学株式会社製、「R120K」、不揮発分濃度20質量%)を#8SUSマイヤーバーを用い、バーコートによって塗布した後、熱風循環式乾燥炉内で200℃、1分間乾燥することで接着剤層を形成した。その後、この接着剤層と、厚さ30μmのポリプロピレンフィルム(東セロ株式会社製、「CPPS」)とを、190℃、2MPaで10分間熱圧着することでヒートラミネーションによるラミネート加工を行い、ポリプロピレンフィルムが積層された金属材料を得た。 Lamination by heat lamination was performed as follows. A dispersion of acid-modified polypropylene (“R120K” manufactured by Mitsui Chemicals, Inc., nonvolatile content concentration 20 mass%) was applied by bar coating using a # 8SUS Meyer bar, and then heated at 200 ° C. in a hot-air circulating drying oven. The adhesive layer was formed by drying for minutes. Thereafter, this adhesive layer and a 30 μm-thick polypropylene film (“CPPS” manufactured by Tosero Co., Ltd.) are thermocompression bonded at 190 ° C. and 2 MPa for 10 minutes to perform lamination by heat lamination. A laminated metal material was obtained.
ドライラミネーションによるラミネート加工は、次のように行った。ウレタン系ドライラミネート接着剤(東洋モートン株式会社製、「AD−503/CAT10」、不揮発分濃度25質量%)を、#8SUSマイヤーバーを用い、バーコートによって塗布した後、熱風循環式乾燥炉内で80℃、1分間乾燥し、その後、この接着剤層と30μmの未延伸ポリプロピレンフィルム(二村化学工業株式会社製、「FCZX」)のコロナ放電処理面とを100℃、1MPaで圧着後、40℃で4日間養生することで、ドライラミネーションによるラミネート加工を行い、ポリプロピレンフィルムが積層された金属材料を得た。 Lamination by dry lamination was performed as follows. Apply urethane-type dry laminate adhesive (Toyo Morton Co., Ltd., “AD-503 / CAT10”, non-volatile content 25% by mass) by bar coating using # 8SUS Meyer bar, and then in hot air circulation drying oven The adhesive layer and a corona discharge-treated surface of an unstretched polypropylene film of 30 μm (manufactured by Futaki Chemical Co., Ltd., “FCZX”) at 100 ° C. and 1 MPa are then bonded. By curing at 4 ° C. for 4 days, laminating by dry lamination was performed to obtain a metal material on which a polypropylene film was laminated.
(成形加工)
ヒートラミネーションによって得たポリプロピレンフィルム積層金属材料と、ドライラミネーションによって得たポリプロピレンフィルム積層金属材料とを、それぞれ絞りしごき加工試験で深絞り加工した。直径160mmに打ち抜いた被覆金属板を絞り加工(1回目)し、直径100mmのカップを作製した。続いて、そのカップを直径75mmに再度絞り加工(2回目)し、さらに直径65mmに絞り加工(3回目)し、供試材である缶を作製した。なお、1回目の絞り加工、2回目の絞り加工、3回目の絞り加工におけるしごき(薄肉化分)率は、それぞれ、5%、15%、15%であった。
(Molding)
The polypropylene film laminated metal material obtained by heat lamination and the polypropylene film laminated metal material obtained by dry lamination were each deep drawn in a drawing and ironing test. The coated metal plate punched to a diameter of 160 mm was drawn (first time) to produce a cup having a diameter of 100 mm. Subsequently, the cup was again drawn to a diameter of 75 mm (second time), and further drawn to a diameter of 65 mm (third time) to prepare a can as a test material. Note that the ironing (thinning) ratios in the first drawing, the second drawing, and the third drawing were 5%, 15%, and 15%, respectively.
[性能評価]
(密着性)
成形加工後の缶について、ポリプロピレンフィルムの剥離の有無(以下、「初期密着性」という。)を評価した。缶が作製でき、フィルムの剥離がなく初期密着性に優れるものを3点とし、フィルムの一部が剥離したものを2点とし、フィルムが全面剥離したものを1点とした。評価試験の結果を表4及び表5に示す。
[Performance evaluation]
(Adhesion)
About the can after a shaping | molding process, the presence or absence of peeling of a polypropylene film (henceforth "initial adhesiveness") was evaluated. Cans were prepared, and there was no peeling of the film and excellent initial adhesion, and 3 points were given. A part of the film was peeled 2 points, and a case where the film was completely peeled was 1 point. The results of the evaluation test are shown in Tables 4 and 5.
(耐薬品密着維持性)
耐薬品密着維持性のうち、ここでは、電解液に対する密着維持性(以下、「耐電解液密着維持性」という。)について評価した。詳しくは、次のようにして、成形加工後にさらに電解液に浸漬した後の缶について、ポリプロピレンフィルムの剥離の有無を評価した。
(Chemical resistance adhesion maintenance)
Among the chemical resistance adhesion maintaining properties, here, the adhesion maintaining properties with respect to the electrolytic solution (hereinafter referred to as “electrolytic solution adhesion maintaining property”) were evaluated. In detail, the presence or absence of peeling of a polypropylene film was evaluated about the can after having been further immersed in electrolyte solution after a shaping | molding process as follows.
深絞り加工した後の缶を、密閉容器中に充填された、イオン交換水を1000ppm添加したリチウムイオン2次電池用電解液(電解質;1mol/LのLiPF6、溶剤;EC:DMC:DEC=1:1:1(体積%))中に浸漬した後、60℃恒温槽中に7日間投入した。なお、「EC」はエチレンカーボネートのことであり、「DMC」はジメチルカーボネートのことであり、「DEC」はジエチルカーボネートのことである。 The can after deep drawing was filled in a sealed container, and an electrolyte solution for lithium ion secondary batteries to which 1000 ppm of ion exchange water was added (electrolyte; 1 mol / L LiPF 6 , solvent; EC: DMC: DEC = After being immersed in 1: 1: 1 (volume%), it was put into a 60 ° C. constant temperature bath for 7 days. “EC” refers to ethylene carbonate, “DMC” refers to dimethyl carbonate, and “DEC” refers to diethyl carbonate.
その後、供試材を取り出し、イオン交換水中に1分間浸漬、揺動することで洗浄した後、熱風循環式乾燥炉内で、100℃で10分間乾燥した。その後フィルム面をピンセットの先で引っ掻き、フィルムの剥離がなく耐電解液密着維持性に優れるものを3点、フィルムの一部が剥離したものを2点とし、フィルムが全面剥離したものを1点として評価した。評価試験の結果を表4及び表5に示す。 Thereafter, the sample material was taken out, washed by immersing in ion-exchanged water for 1 minute and swung, and then dried at 100 ° C. for 10 minutes in a hot-air circulating drying furnace. The film surface is then scratched with the tip of a tweezers, with 3 points for the film having no peeling of the film and excellent electrolyte solution adhesion maintaining ability, 2 points for partially peeling the film, and 1 point for peeling the entire film. As evaluated. The results of the evaluation test are shown in Tables 4 and 5.
表4及び表5に示すように、実施例1〜41に記載の水系金属表面処理剤を塗布して形成された表面処理皮膜を有する金属材料は、初期密着性及び耐電解液密着維持性に非常に優れることが確認された。 As shown in Table 4 and Table 5, the metal material having the surface treatment film formed by applying the aqueous metal surface treatment agent described in Examples 1-41 has an initial adhesion property and an electrolytic solution adhesion maintenance property. It was confirmed that it was excellent.
1 基材金属
2 表面処理皮膜
3 樹脂フィルム(ラミネートフィルム)又は樹脂塗膜
10 表面処理皮膜を有する金属材料
DESCRIPTION OF
Claims (4)
前記架橋性化合物(B)として少なくとも前記架橋性無機化合物(B2)を含有し、
前記架橋性有機化合物(B1)が、グリシジルエーテル基、イソシアネート基、メチロール基及びアルデヒド基から選ばれる1種以上の官能基を有し、
前記架橋性無機化合物(B2)が、Cr(III)、Zr、Ti、Si、Ce、及びTeから選ばれる1種又は2種以上の元素を含む、水系金属表面処理剤。 Crosslinkability comprising a polyvinyl alcohol compound (A), a crosslinkable organic compound (B1) having a functional group capable of reacting with the polyvinyl alcohol compound (A), and an element capable of reacting with the polyvinyl alcohol compound (A). 1 type or 2 types or more of crosslinkable compounds (B) chosen from inorganic compound (B2) (however, it does not contain a vanadium compound) ,
Containing at least the crosslinkable inorganic compound (B2) as the crosslinkable compound (B),
The crosslinkable organic compound (B1) has one or more functional groups selected from a glycidyl ether group, an isocyanate group, a methylol group, and an aldehyde group,
A water-based metal surface treatment agent, wherein the crosslinkable inorganic compound (B2) contains one or more elements selected from Cr (III), Zr, Ti, Si, Ce, and Te .
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