JP5824274B2 - Substrate transfer device and drawing device - Google Patents

Description

  The present invention relates to various substrates such as semiconductor substrates, printed substrates, color filter substrates, glass substrates for flat panel displays, optical disk substrates, solar cell panels (hereinafter simply referred to as “panels for solar cells”) included in liquid crystal display devices and plasma display devices. The present invention relates to a technique for placing and transferring a substrate).

  Various processing on the substrate (for example, irradiation of light to the photosensitive material formed on the substrate, application of various coating solutions to the substrate, etc.) is performed with the substrate to be processed placed on a flat stage. (See, for example, Patent Document 1). In such a substrate processing apparatus, generally, a step of performing a predetermined process on a substrate and a step of loading / unloading the substrate onto / from the stage are at different positions (processing position, delivery position). In this case, the stage is configured to be movable between the processing position and the delivery position.

  By the way, in an apparatus configuration in which the stage is moved between the processing position and the delivery position, when the supply of power to the apparatus is urgently interrupted due to an abnormality or a power failure, the stage that has lost its driving power is arbitrarily There is a risk of unexpected accidents due to movement. Therefore, in order to avoid such a situation, for example, Patent Document 2 discloses a configuration in which when the supply of power to the apparatus is urgently cut off, the brake mechanism is activated to urgently stop the stage. Patent Document 3 discloses a configuration in which a stage is urgently stopped by applying a brake when an overspeed of the stage is detected.

Japanese Patent No. 3815761 JP 2005-291398 A JP-A-1-259405

  As in the technologies disclosed in Patent Documents 2 and 3, if the stage is forcibly stopped when the driving force of the stage is lost, for example, when the power supply to the apparatus is cut off, the driving force is lost. It is possible to avoid the occurrence of a situation in which the stage moves without permission and collides with other members. However, in this configuration, there is a possibility that the brake may be damaged when the brake is applied while the stage is moving at high speed, and the stage may not be stopped safely. In addition, in this configuration, the stage may be forcibly stopped at any position on the transport path. Therefore, depending on the position where the stage is stopped, it may take time to restart the operation when power supply is restored. It was also a problem.

  The present invention has been made in view of the above problems, and avoids the occurrence of a collision accident between members when the driving force of the stage is lost, for example, when the power supply to the apparatus is interrupted. The purpose is to provide a technology that can smoothly resume work.

A substrate transfer apparatus according to a first aspect includes a base, a stage having a mounting surface on which an upper surface is mounted, a drive unit that moves the stage relative to the base, and the stage , and a braking unit for braking so as not to move from a delivery position in which transfer of a substrate is performed on the stage, the lift pins provided to be retractable relative to the mounting surface, the lift pins, the tip of prior A lift pin drive mechanism that moves up and down between an upper position protruding from the placement surface and a lower position where the tip is equal to or lower than the placement surface, and a braking control unit that controls the braking unit includes: When the lift pin is disposed at the upper position, the brake is caused to brake the stage .

  A second aspect is a substrate transfer apparatus according to the first aspect, provided between a pair of guide members laid on the base, the stage and the pair of guide members, and the stage And a support portion that floats and supports the guide member on the guide member in a non-contact manner.

A 3rd aspect is a drawing apparatus, Comprising: The stage in which the mounting surface which mounts a board | substrate on the upper surface was formed, and the optical unit which irradiates light with respect to the board | substrate mounted in the said stage When a driving unit for moving the stage relative to the base, the stage, and a braking unit for braking so as not to move from the transfer position to transfer the substrate is performed on the stage, the mounting surface A lift pin provided so as to be able to protrude and retract, and a lift pin for moving the lift pin up and down between an upper position where the tip protrudes from the mounting surface and a lower position where the tip is equal to or lower than the mounting surface A braking mechanism that controls the braking unit, and causes the braking unit to brake the stage when the lift pin is disposed at the upper position .

In the 1st- 3rd aspect, the brake part which brakes so that a stage may not move from a delivery position is provided. If the stage is in the delivery position, the stage may be in the board delivery state, and if the stage driving force is lost in this state, there may be a collision between members, According to this configuration, even if the driving force of the stage at the transfer position is lost, the stage that has lost the driving force can be braked so that it does not move from the transfer position. It can be avoided. On the other hand, since the stage is not braked at any place other than the delivery position, there is no possibility of taking time and effort for the restarting operation.

It is a side view of a drawing apparatus. It is a top view of a drawing apparatus. It is a side view of a substrate transfer device. It is a top view of a substrate transfer device. It is a side view of a substrate transfer device in a state where a stage is in a delivery position. It is a top view of the board | substrate transfer apparatus in the state which has a stage in a delivery position. It is a block diagram which shows the hardware constitutions of a control part. It is a figure which shows typically the functional block implement | achieved in a drawing apparatus and each part relevant to this. It is a figure which shows the flow of the process with respect to the board | substrate performed with a drawing apparatus. It is a figure for demonstrating a drawing process. It is a figure which shows the flow of a process when a braking control part controls a braking part in a 1st aspect. It is a figure which shows the flow of a process when a braking control part controls a braking part in a 2nd aspect. It is a figure which shows the flow of a process when a braking control part controls a braking part in a 3rd aspect.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The following embodiment is an example embodying the present invention, and does not limit the technical scope of the present invention.

<1. Device configuration>
The configuration of the drawing apparatus 1 will be described with reference to FIGS. FIG. 1 is a side view schematically showing the configuration of the drawing apparatus 1. FIG. 2 is a plan view schematically showing the configuration of the drawing apparatus 1.

  The drawing apparatus 1 is an apparatus that exposes a pattern by irradiating light onto the upper surface of a substrate W on which a layer of a photosensitive material such as a resist is formed. The substrate W is any of various substrates such as a semiconductor substrate, a printed substrate, a color filter substrate, a glass substrate for a flat panel display, a substrate for an optical disc, a solar cell panel, etc. provided in a liquid crystal display device or a plasma display device There may be. In the figure, a circular semiconductor substrate is shown.

  The drawing apparatus 1 includes a main body inside formed by attaching cover panels (not shown) to the ceiling surface and the peripheral surface of the skeleton formed of the main body frame 101, and an outer main body that is outside the main body frame 101. It has a configuration in which various components are arranged.

  The inside of the main body of the drawing apparatus 1 is divided into a processing area 102 and a delivery area 103. In the processing region 102, the substrate transfer device 10, the measurement unit 20, the two optical units 30 and 30, and the imaging unit 40 are mainly arranged. In the delivery area 103, a transfer device 50 for carrying the substrate W in and out of the processing area 102 and a pre-alignment unit 60 are arranged.

  An illumination unit 70 that supplies illumination light to the imaging unit 40 is disposed outside the main body of the drawing apparatus 1. Further, a cassette mounting portion 80 for mounting the cassette C is disposed outside the main body of the drawing apparatus 1 and at a position adjacent to the transfer area 103. The transfer device 50 arranged in the delivery area 103 takes out the unprocessed substrate W accommodated in the cassette C placed on the cassette placement section 80 and carries it into the processing area 102 and has been processed from the processing area 102. The substrate W is unloaded and accommodated in the cassette C. Delivery of the cassette C to the cassette mounting portion 80 is performed by an external transfer device (not shown).

  Further, the drawing apparatus 1 is provided with a control unit 90 that is electrically connected to each part of the drawing apparatus 1 and controls the operation of each part.

  Below, the structure of each part with which the drawing apparatus 1 is provided is demonstrated.

<1-1. Substrate Transfer Device 10>
The configuration of the substrate transfer apparatus 10 will be described with reference to FIGS. 3 to 6 in addition to FIGS. FIG. 3 is a side view of the substrate transfer apparatus 10. FIG. 4 is a plan view of the substrate transfer apparatus 10. FIG. 5 is a side view of the substrate transfer apparatus 10 in which the stage 12 is in a delivery state. FIG. 6 is a plan view of the substrate transfer apparatus 10 shown in FIG. 3 to 6, among the units included in the drawing apparatus 1, only the units constituting the substrate transfer apparatus 10 are extracted and illustrated, and the other units are not illustrated or illustrated with virtual lines. It is shown.

  The substrate transfer apparatus 10 includes a base 11, a stage 12, a plurality of lift pins 13, a lift pin drive mechanism 14, a stage drive mechanism 15, and a braking unit 16. The substrate transfer apparatus 10 includes a stage position sensor 17 and a pin position sensor 18. The control unit 90 also functions as a control unit that controls each unit included in the substrate transfer apparatus 10.

<Stage 12>
The stage 12 has a flat outer shape, and is a holding unit that places and holds the substrate W in a horizontal posture on the upper surface (mounting surface 120) thereof. A plurality of suction holes (not shown) are formed in the mounting surface 120, and a negative pressure (suction pressure) is formed in the suction holes, whereby the substrate W placed on the mounting surface 120 is mounted. It can be fixedly held on the mounting surface 120. The mounting surface 120 is formed with a plurality of through holes 121 through which the lift pins 13 can be inserted.

<Lift pin 13>
The plurality of lift pins 13 are members for raising and lowering the substrate W with respect to the placement surface 120 of the stage 12, and each of the plurality of lift pins 13 is inserted through each through hole 121 formed in the placement surface 120. It is provided so as to be able to appear and disappear in synchronization with the mounting surface 120. Each lift pin 13 is supported by a common support member 131, and the lift pin drive mechanism 14 is coupled to the support member 131.

  As will become apparent below, the lift pin 13 is driven by the lift pin drive mechanism 14 while the substrate W is transferred between the transfer device 50 and the stage 12, and the tip of the lift pin 13 protrudes from the placement surface 120. It is reciprocated between an upper position (protruding position) and a lower position (retreat position) whose tip is below the mounting surface 120. Hereinafter, a state in which the lift pins 13 slightly protrude from the placement surface 120 of the stage 12 (that is, a state in which the lift pins 13 are not disposed at the lower position) is also referred to as a “substrate W delivery state”.

<Lift pin drive mechanism 14>
The lift pin drive mechanism 14 is a functional unit that moves the plurality of lift pins 13 up and down in the vertical direction (Z-axis direction) through the support member 131, and is installed below the stage 12, for example. Specifically, the lift pin drive mechanism 14 moves each lift pin 13 up and down between an upper position and a lower position. As a result, the group of lift pins 13 appears and disappears with respect to the mounting surface 120 of the stage 12.

  The lift pin drive mechanism 14 reciprocates the lift pin 13 between a lower position and an upper position when the substrate W is transferred between the transport device 50 and the stage 12. For example, when the unprocessed substrate W held by the transport device 50 is placed on the placement surface 120, the lift pin drive mechanism 14 moves the group of lift pins 13 from the lower position to the upper position. When the transport device 50 inserts the hand 51 on which the unprocessed substrate W is placed along the placement surface 120 while the group of lift pins 13 are in the upper position, and further moves the hand 51 downward, the hand 51 The upper substrate W is transferred onto the group of lift pins 13. When the hand 51 is pulled out, the lift pin drive mechanism 14 moves the group of lift pins 13 from the upper position to the lower position. Then, the substrate W supported by the group of lift pins 13 protruding from the placement surface 120 is placed on the placement surface 120. Further, for example, when the processed substrate W placed on the placement surface 120 is received by the transport device 50, the lift pin drive mechanism 14 moves the group of lift pins 13 from the lower position to the upper position. Then, the lower surface of the substrate W is supported by the group of lift pins 13, lifted from the stage 12, and peeled off from the placement surface 120. In this state, when the transfer device 50 inserts the hand 51 between the lower surface of the substrate W and the placement surface 120 and further moves the hand 51 upward, the substrate W is transferred from the group of lift pins 13 onto the hand 51. Will be posted.

<Stage drive mechanism 15>
The stage drive mechanism 15 is a mechanism that moves the stage 12 with respect to the base 11, and moves the stage 12 in the main scanning direction (Y-axis direction), sub-scanning direction (X-axis direction), and rotation direction (around the Z-axis). Move in the rotation direction (θ-axis direction). Specifically, the stage drive mechanism 15 includes a rotation mechanism 151 (FIG. 1) that rotates the stage 12. The stage drive mechanism 15 further includes a support plate 152 that supports the stage 12 via the rotation mechanism 151 and a sub-scanning mechanism 153 that moves the support plate 152 in the sub-scanning direction. The stage drive mechanism 15 further includes a base plate 154 that supports the support plate 152 via the sub-scanning mechanism 153, and a main scanning mechanism 155 that moves the base plate 154 in the main scanning direction.

  As shown in FIG. 1, the rotation mechanism 151 rotates the stage 12 about a rotation axis A that passes through the center of the placement surface 120 and is perpendicular to the placement surface 120. The rotation mechanism 151 has, for example, an upper end fixed to the back surface of the stage 12 and extending along the vertical axis, and a driving unit that is provided at the lower end of the rotation shaft 1511 and rotates the rotation shaft 1511. (For example, a rotary motor) 1512 can be configured. In this configuration, the stage 15 rotates around the rotation axis A in the horizontal plane when the drive unit 1512 rotates the rotation shaft 1511.

  The sub-scanning mechanism 153 includes a linear motor 1531 that includes a mover attached to the lower surface of the support plate 152 and a stator laid on the upper surface of the base plate 154. The base plate 154 is provided with a pair of guide members 1532 extending in the sub-scanning direction. The guide members 1532 slide between the guide members 1532 and the support plate 152 while sliding on the guide members 1532. A ball bearing 1533 is provided that can move along. That is, the support plate 152 is supported on the pair of guide members 1532 through the ball bearing 1533. When the linear motor 1531 is operated in this configuration, the support plate 152 moves smoothly along the sub-scanning direction while being guided by the guide member 1532.

  The main scanning mechanism 155 includes a linear motor 1551 that includes a moving element attached to the lower surface of the base plate 154 and a stator laid on the base 11 of the drawing apparatus 1. In addition, a pair of guide members 1552 extending in the main scanning direction is laid on the base 11, and an air bearing 1553 is installed between each guide member 1552 and the base plate 154. Air is always supplied to the air bearing 1553 from utility equipment, and the base plate 154 is supported by the air bearing 1553 so as to float on the guide member 1552 without contact. When the linear motor 1551 is operated in this configuration, the base plate 154 smoothly moves without friction along the main scanning direction while being guided by the guide member 1552.

  The main scanning mechanism 155 moves the base plate 154 along the main scanning direction, so that the stage 12 can be moved between the delivery position Q and the processing position. Here, the delivery position Q is the position of the stage 12 when the substrate W is delivered between the transport device 50 and the stage 12, and is, for example, a movement range (guide member) of the base plate 154 along the main scanning direction. 1552 extending range) near the end on the + Y side. On the other hand, the processing position is the position of the stage 12 when various processes are performed on the substrate W placed on the stage 12. As will be apparent later, in the drawing apparatus 1, the processing for the substrate W is performed while moving the stage 12 along the main scanning direction or the like. Accordingly, a certain range region (however, the delivery position Q is excluded) in which the stage 12 is moved while the processing on the substrate W is performed becomes the processing position of the stage 12.

<Brake part 16>
The brake unit 16 is a functional unit that brakes the movement of the stage 12 along the main scanning direction, and brakes the stage 12 so as not to move from the delivery position Q. The substrate transfer apparatus 10 includes two braking portions 16, and each braking portion 16 has a side wall on the ± X side of the base plate 154 that supports the stage 12 in a state where the stage 12 is disposed at the transfer position Q. 1540 are arranged at positions facing each of 1540.

  The braking unit 16 includes a pressing member 161, an air cylinder 162 that functions as a driving unit that moves the pressing member 161 forward and backward, and a drive circuit 163 that gives an operation signal to the air cylinder 162.

  The pressing member 161 is a plate-like member, and is disposed with the flat main surface facing the side wall 1540 of the base plate 154. The pressing member 161 is preferably formed of a member that can cause a large friction on the contact surface when the pressing member 161 is in contact with the side wall 1540, and is made of rubber, for example.

  The air cylinder 162 is connected to the pressing member 161 at the tip end of the rod 1621, and the rod 1621 is arranged along a direction orthogonal to the extending direction of the guide member 1552. The air cylinder 162 is configured such that the rod 1621 moves forward and backward in response to an operation signal from the drive circuit 163. However, the drive circuit 163 that operates the air cylinder 162 is constituted by a self-holding circuit having a self-holding function, and can hold the operation circuit without continuous energization.

  When the rod 1621 of the air cylinder 162 is extended, the pressing member 161 attached to the tip of the rod 1621 is pressed against the side wall 1540 of the base plate 154. As a result, the base plate 154 is braked so as not to move along the guide member 1552. That is, the stage 12 supported by the base plate 154 cannot move along the main scanning direction. When the rod 1621 is contracted and accommodated in the main body 1622, the pressing member 161 attached to the tip of the rod 1621 is separated from the side wall 1540 of the base plate 154. As a result, braking of the base plate 154 is released. That is, the stage 12 supported by the base plate 154 is in a state of being freely movable along the main scanning direction. As described above, since the base plate 154 is supported by the air bearing 1553 in a non-contact manner on the guide member 1552, the base plate 154 is braked only by lightly pressing the pressing member 161 against the side wall 1540.

<Stage position sensor 17>
The stage position sensor 17 is a sensor that detects whether or not the stage 12 is at the delivery position Q, and is configured to output a detection signal to the control unit 90. The stage position sensor 17 can be configured using, for example, a photo sensor, an infrared sensor, an ultrasonic sensor, a capacitance sensor, or the like.

<Pin position sensor 18>
The pin position sensor 18 is a sensor that detects the position of the lift pin 13 and is configured to be able to output a detection signal to the control unit 90. The pin position sensor 18 can be configured using, for example, a photo sensor, an infrared sensor, an ultrasonic sensor, a capacitance sensor, or the like.

<1-2. Measuring unit 20>
Refer to FIGS. 1 and 2 again. The measuring unit 20 is a mechanism that measures the position of the stage 12, emits laser light from the outside of the stage 12 toward the stage 12, receives the reflected light, and from the interference between the reflected light and the emitted light, the stage 12. (Specifically, the Y position along the main scanning direction and the θ position along the rotation direction) are measured by an interference type laser length measuring device.

  For example, the measurement unit 20 is attached to the side surface on the −Y side of the stage 12 and has a plane mirror 21 having a reflective surface perpendicular to the main scanning direction on the −Y side surface, and the base 11 on the −Y side of the stage. (Specifically, the laser light source 22, the splitter 23, the first linear interferometer 24, the first receiver 25, the second linear interferometer 26, and the second receiver 27). be able to.

  In the measurement unit 20, the laser light emitted from the laser light source 22 is divided into two by the splitter 23, and one part of the laser light enters the first part on the plane mirror 21 via the first linear interferometer 24. Then, the reflected light from the plane mirror 21 interferes with a part of the original laser light (which is used as reference light) in the first linear interferometer 24 and is received by the first receiver 25. Based on the intensity change after the interference between the reflected light and the reference light in the first receiver 25, the distance in the main scanning direction between the first linear interferometer 24 and the plane mirror 21 is specified. Based on the output from the first receiver 25, the position of the stage 12 in the main scanning direction is obtained by a specialized arithmetic circuit (not shown).

  On the other hand, a part of the other laser beam emitted from the laser light source 22 and divided by the splitter 23 passes through the mounting base 28 from the + X side to the −X side, and passes through the second linear interferometer 26. Incident on the plane mirror 21. Here, the laser light from the second linear interferometer 137 is incident on the second part on the plane mirror 21 that is separated from the first part on the plane mirror 21 by a certain distance in the sub-scanning direction. The reflected light from the plane mirror 21 interferes with part of the original laser light in the second linear interferometer 26 and is received by the second receiver 27. Based on the intensity change after the interference between the reflected light and the reference light in the second receiver 27, the distance between the second linear interferometer 137 and the plane mirror 21 in the main scanning direction is specified. Based on the output from the second receiver 27 and the output from the first receiver 25 described above, the rotation angle of the stage 12 is obtained by a specialized arithmetic circuit (not shown).

<1-3. Optical unit 30>
The optical unit 30 is a mechanism for exposing the upper surface of the substrate W held on the stage 12 by irradiating light. As described above, the drawing apparatus 1 includes the two optical units 30 and 30. One optical unit 30 is responsible for the + X side half exposure of the substrate W, and the other optical unit 30 is responsible for the −X side half exposure of the substrate W. These two optical units 30 and 30 are fixed to a frame 107 installed on the base 11 so as to straddle the stage 12 and the stage driving mechanism 15 with a space therebetween. Note that the interval between the two optical units 30 and 30 does not necessarily have to be fixed, and a mechanism that can change the position of one or both of the optical units 30 and 30 is provided to adjust the interval between them. It may be possible.

  The two optical units 30 and 30 have the same configuration. That is, each optical unit 30 is housed in a laser drive unit 31, a laser oscillator 32, and an illumination optical system 33 disposed inside a box forming a top plate, and an attached box attached to the + Y side of the frame 107. The head unit 300 is provided. The head unit 300 mainly includes a spatial light modulation unit 34 and a projection optical system 35.

  The laser oscillator 32 receives driving from the laser driving unit 31 and emits laser light from an output mirror (not shown). The illumination optical system 33 converts the light (spot beam) emitted from the laser oscillator 32 into linear light having a uniform intensity distribution (line beam whose light beam cross section is linear light). The light emitted from the laser oscillator 32 and converted into a line beam by the illumination optical system 33 is incident on the head unit 300 and is subjected to spatial modulation according to the pattern data D (see FIG. 7) and then applied to the substrate W. Irradiated.

  Specifically, the light incident on the head unit 300 enters the spatial light modulation unit 34 through the mirror 36 at a predetermined angle. The spatial light modulator 34 spatially modulates the incident light to reflect the necessary light that contributes to pattern drawing and the unnecessary light that does not contribute to pattern drawing in different directions. However, spatially modulating light specifically means changing the spatial distribution of light (amplitude, phase, polarization, etc.).

  Specifically, the spatial light modulator 34 includes a spatial light modulator 341 that spatially modulates incident light by electrical control. The spatial light modulator 341 is arranged such that the normal line of the reflecting surface thereof is inclined with respect to the optical axis of incident light incident via the mirror 36, and the incident light is spatially modulated based on the control of the control unit 90. Let The spatial light modulator 341 uses, for example, a diffraction grating type spatial modulator (for example, GLV (Grating Light Valve) (registered trademark of Silicon Light Machines (San Jose, California)). The diffraction grating type spatial modulator is a diffraction grating capable of changing the depth of the grating, and is manufactured using, for example, a semiconductor device manufacturing technique.

  The spatial light modulator 341 has a configuration in which a plurality of spatial light modulation elements are arranged one-dimensionally. The operation of each spatial light modulator is controlled by turning on / off the voltage. That is, for example, when the voltage is turned off, the surface of the spatial light modulator is flat, and when light enters the spatial light modulator in this state, the incident light is regularly reflected without being diffracted. Thereby, regular reflection light (0th order diffracted light) is generated. On the other hand, for example, when the voltage is turned on, a plurality of parallel grooves are periodically formed on the surface of the spatial light modulator. When light enters the spatial light modulator in this state, the specularly reflected light (0th order diffracted light) cancels out and disappears, and other orders of diffracted light (± 1st order diffracted light, ± 2nd order diffracted light, and higher order light) Diffracted light). More precisely, the intensity of the 0th-order diffracted light is minimized, and the intensity of other orders of diffracted light is maximized. The spatial light modulator 341 includes a driver circuit unit that can independently apply a voltage to each of the plurality of spatial light modulation elements, and the voltage of each spatial light modulation element can be switched independently. .

  The projection optical system 35 blocks the unnecessary light that should not contribute to the pattern drawing out of the light spatially modulated by the spatial light modulator 341 and only the necessary light that should contribute to the pattern drawing. To form an image on the surface. However, the light spatially modulated by the spatial light modulator 341 includes zero-order diffracted light, diffracted light of orders other than the zeroth order (specifically, ± first-order diffracted light, ± second-order diffracted light, and relatively The 0th-order diffracted light is necessary light that should contribute to pattern drawing, and other diffracted light should not contribute to pattern drawing. It is. The necessary light and the unnecessary light are emitted along different directions. That is, the necessary light is emitted in the −Z direction along the Z axis, and the unnecessary light is emitted in the −Z direction along an axis slightly inclined in the ± X direction from the Z axis. The projection optical system 35 blocks, for example, unnecessary light traveling along an axis slightly inclined in the ± X direction from the Z axis by a blocking plate, and allows only necessary light traveling along the Z axis to pass therethrough. In addition to the blocking plate, the projection optical system 35 includes a plurality of lenses that form a zoom unit that widens (or narrows) the incident light, an objective lens that forms an image of the incident light on the substrate W as a predetermined magnification, And the like.

  When causing the optical unit 30 to perform a drawing operation, the control unit 90 drives the laser driving unit 31 to emit light from the laser oscillator 32. The emitted light is converted into a line beam by the illumination optical system 33 and is incident on the spatial light modulator 341 of the spatial light modulator 34 via the mirror 36. In the spatial light modulator 341, a plurality of spatial light modulation elements are arranged side by side along the sub-scanning direction (X-axis direction), and incident light has its linear light beam cross section arranged as an array of spatial light modulation elements. The light is incident on a plurality of spatial light modulation elements arranged in a row so as to be along the direction. The control unit 90 gives an instruction to the driver circuit unit based on the pattern data D, and applies a voltage to the spatial light modulation element instructed by the driver circuit unit. As a result, light individually spatially modulated by each spatial light modulator is formed and emitted toward the substrate W. If the number of spatial light modulation elements provided in the spatial light modulator 341 is “N”, spatially modulated light for N pixels along the sub-scanning direction is emitted from the spatial light modulator 341. . The light spatially modulated by the spatial light modulator 341 enters the projection optical system 35, where unnecessary light is blocked and only the necessary light is guided to the surface of the substrate W to have a predetermined magnification. The image is formed on the surface of the substrate W.

  The optical unit 30 continues to irradiate the spatially modulated light of N pixels along the sub-scanning direction in this way (that is, continuously project pulse light on the surface of the substrate W repeatedly). It is moved relative to the substrate W along the scanning direction (Y-axis direction). Therefore, when the optical unit 30 crosses the substrate W once along the main scanning direction, one pattern group having a width of N pixels along the sub-scanning direction is drawn on the surface of the substrate W. Become. One pattern drawing area having a width corresponding to N pixels is also referred to as “one stripe area” in the following description.

  The head unit 300 includes an optical path correction unit that slightly shifts the path of light modulated by the spatial light modulation unit 34 between the spatial light modulation unit 34 and the projection optical system 35 along the sub-scanning direction. Further, it may be provided. In this case, the position of the light applied to the substrate W can be finely adjusted along the sub-scanning direction by shifting the light path to the optical path correction unit as necessary. The optical path correction unit includes, for example, two wedge prisms (prisms that can change the optical path of incident light by providing a non-parallel optical surface) and one wedge prism with respect to the other wedge prism. It can be realized by a wedge prism moving mechanism that moves linearly along the direction of the optical axis (Z-axis direction). In this configuration, incident light can be shifted by a necessary amount by driving and controlling the wedge prism moving mechanism to adjust the separation distance between the two wedge prisms.

<1-4. Imaging unit 40>
The imaging unit 40 images the alignment mark formed on the upper surface of the substrate W. The imaging unit 40 includes a lens barrel, an objective lens, and a CCD image sensor (all not shown) including, for example, an area image sensor (two-dimensional image sensor). The imaging unit 40 is connected to a fiber 71 extending from the illumination unit 70. The light emitted from the illumination unit 70 is guided to the lens barrel by the fiber 71 and guided to the upper surface of the substrate W through the lens barrel. The reflected light is received by the CCD image sensor via the objective lens. Thereby, imaging data of the upper surface of the substrate W is acquired. The CCD image sensor acquires imaging data in response to an instruction from the control unit 90 and transmits the acquired imaging data to the control unit 90. Note that the imaging unit 40 may further include an autofocus unit capable of autofocusing.

<1-5. Conveying device 50>
The transport apparatus 50 includes two hands 51 and 51 for supporting the substrate W, and a hand drive mechanism 52 that moves the hands 51 and 51 independently. Each hand 51 is moved forward and backward and moved up and down by being driven by the hand drive mechanism 52, and delivers the substrate W to the mounting surface 120 of the stage 12.

<1-6. Pre-alignment unit 60>
The pre-alignment unit 60 is a device that roughly corrects the rotational position of the substrate W. The pre-alignment unit 60 includes, for example, a mounting table that is configured to be rotatable, and a notch (for example, a notch, an orientation flat, or the like) formed on a part of the outer peripheral edge of the substrate W mounted on the mounting table. It can comprise from the sensor which detects a position, and the rotation mechanism which rotates a mounting base. In this case, in the pre-alignment process in the pre-alignment unit 60, first, the position of the notch of the substrate W placed on the mounting table is detected by the sensor, and then the rotation mechanism determines whether the position of the notch is This is performed by rotating the mounting table so that the position becomes a predetermined position (for example, the direction of the notch is parallel to the moving direction of the stage 12 (for example, the X direction)).

<1-7. Control unit 90>
The control unit 90 is electrically connected to each unit included in the drawing apparatus 1 and controls the operation of each unit of the drawing apparatus 1 while executing various arithmetic processes.

  FIG. 7 is a block diagram illustrating a hardware configuration of the control unit 90. The control unit 90 is configured by, for example, a general computer in which a CPU 91, a ROM 92, a RAM 93, an external storage device 94, and the like are interconnected via a bus line 95. The ROM 92 stores basic programs and the like, and the RAM 93 is used as a work area when the CPU 91 performs predetermined processing. The external storage device 94 is configured by a nonvolatile storage device such as a flash memory or a hard disk device. A program P is stored in the external storage device 94, and various functions are realized by the CPU 91 as a main control unit performing arithmetic processing according to the procedure described in the program P. . The program P is normally stored and used in advance in a memory such as an external storage device 94, but is recorded in a recording medium such as a CD-ROM or DVD-ROM or an external flash memory (program product). ) (Or provided by downloading from an external server via a network, etc.) and stored in a memory such as the external storage device 94 in addition or exchange. Note that some or all of the functions realized in the control unit 90 may be realized in hardware by a dedicated logic circuit or the like.

  In the control unit 90, an input unit 96, a display unit 97, and a communication unit 98 are also connected to the bus line 95. The input unit 96 includes various switches, a touch panel, and the like, and receives various input setting instructions from an operator. The display unit 97 includes a liquid crystal display device, a lamp, and the like, and displays various types of information under the control of the CPU 91. The communication unit 98 has a data communication function via a LAN or the like.

  The external storage device 94 stores data (pattern data) D describing a pattern to be exposed on the substrate W. The pattern data D is, for example, raster data obtained by rasterizing CAD data generated using CAD, and represents a circuit pattern or the like. Prior to a series of processes for the substrate W, the control unit 90 acquires the pattern data D and stores it in the external storage device 94. The pattern data D may be acquired by receiving from an external terminal device connected via, for example, a network or by reading from a recording medium.

<2. Functional configuration>
Next, various functional units realized in the drawing apparatus 1 will be described with reference to FIG. FIG. 8 is a block diagram schematically showing functional units realized in the drawing apparatus 1 and respective units related thereto.

  The drawing apparatus 1 includes a braking control unit 901 that controls the driving of the braking unit 16. In addition, the drawing apparatus 1 includes a power cutoff unit 902 and an energization state detection unit 903 as functional units that manage the energization state of the drawing apparatus 1.

  The braking control unit 901 is realized by the control unit 90, for example, when the CPU 91 performs predetermined arithmetic processing according to the program P, or by hardware using a dedicated logic circuit or the like. A mode in which the braking control unit 901 controls the driving of the braking unit 16 will be described later.

  The power cut-off unit 902 is a functional unit that forcibly cuts off power to the drawing apparatus 1 when an abnormality or the like occurs in the drawing apparatus 1. The power shutdown unit 902 detects an abnormality (for example, when an emergency stop button provided in the input unit 96 is operated, when an earthquake is notified, when an earthquake is detected). In addition, the power supply cable that supplies power from the main power source to the drawing apparatus 1 is forcibly set to a non-energized state, and the power supply to the drawing apparatus 1 is forcibly cut off. The power shut-off unit 902 can be configured by, for example, a relay circuit that operates in response to an operation of an emergency stop button or the like.

  The energization state detection unit 903 is a functional unit that detects the energization state of the drawing apparatus 1, and can be configured by a relay circuit that operates in accordance with the energization state of the power supply cable to the drawing apparatus 1, for example. When the power cut-off unit 902 forces the power supply cable to be in a non-energized state, or when the power supply cable is in a non-energized state due to a power failure or the like, the energized state detection unit 903 detects this.

  Even when the power supply cable is in a non-energized state, the drawing apparatus 1 is supplied with standby power from a standby power source or the like in the factory, and receives some power (for example, a part of the control unit 90). Will continue to receive power. However, this reserve power is not normally supplied to each part of the drawing apparatus 1, and no reserve power is supplied to each part with relatively large power consumption such as the stage drive mechanism 15. That is, when the power supply cable is in a non-energized state, the supply of power to the stage drive mechanism 15 is cut off.

<3. Process Flow for Substrate W>
Next, a flow of a series of processing for the substrate W executed in the drawing apparatus 1 will be described with reference to FIG. FIG. 9 is a diagram showing the flow of the processing. A series of operations described below is performed under the control of the control unit 90.

  First, the transport device 50 takes out the unprocessed substrate W from the cassette C placed on the cassette placement unit 80 and carries it into the drawing device 1 (specifically, the pre-alignment unit 60) (step S1).

  Subsequently, a pre-alignment process is performed on the substrate W in the pre-alignment unit 60 (step S2). As described above, in the pre-alignment process, for example, the position of the notch portion of the substrate W placed on the placement table is detected by a sensor, and the placement table is set so that the position of the notch portion is a predetermined position. This is done by rotating. As a result, the substrate W placed on the mounting table is roughly aligned with the predetermined rotational position.

  Subsequently, the transport device 50 unloads the pre-aligned substrate W from the pre-alignment unit 60 and places it on the mounting surface 120 of the stage 12 (step S3). Specifically, this process is performed as follows. First, the stage drive mechanism 15 moves the stage 12 to the delivery position Q. When the stage 12 is disposed at the delivery position Q, the lift pin driving mechanism 14 moves the group of lift pins 13 from the lower position to the upper position. As a result, the group of lift pins 13 protrude from the placement surface 120. Subsequently, the transport device 50 inserts the hand 51 supporting the pre-aligned substrate W along the placement surface 120 and further moves the hand 51 downward. As a result, the substrate W placed on the hand 51 is transferred onto the group of lift pins 13. Subsequently, when the hand 51 is pulled out, the lift pin drive mechanism 14 moves the group of lift pins 13 from the upper position to the lower position. As a result, the substrate W is placed on the placement surface 120.

  When the substrate W is placed on the placement surface 120, processing for fine alignment (fine alignment) is then performed so that the substrate W comes to an appropriate rotation position (step S4). Specifically, first, the stage drive mechanism 15 moves the stage 12 from the delivery position Q to a position below the imaging unit 40. When the stage 12 is disposed below the imaging unit 40, the imaging unit 40 subsequently images the alignment mark on the substrate W and acquires the imaging data. Subsequently, the control unit 90 performs image analysis on the imaging data acquired by the imaging unit 40 to detect the position of the alignment mark, and calculates the amount of deviation from the appropriate position of the rotation position of the substrate W based on the detected position. To do. When the deviation amount is calculated, the rotation mechanism 151 rotates the stage 12 by the calculated deviation amount. As a result, alignment is performed so that the substrate W comes to an appropriate rotational position.

  When the substrate W is placed at an appropriate rotational position, a pattern drawing process is subsequently performed (step S5). The drawing process will be described with reference to FIG. FIG. 10 is a diagram for explaining the drawing process.

  The drawing process is spatially modulated from each of the optical units 30 and 30 onto the upper surface of the substrate W while the stage driving mechanism 15 moves the substrate W placed on the stage 12 relative to the optical units 30 and 30. This is done by irradiating with light.

  Specifically, the stage drive mechanism 15 first optically moves the substrate W by moving the stage 12 disposed below the imaging unit 40 in the + Y direction along the main scanning direction (Y-axis direction). The units 30 and 30 are moved relative to the main scanning direction (main scanning). When viewed from the substrate W, each optical unit 30 crosses the substrate W in the −Y direction along the main scanning direction (arrow AR11). While the main scanning is performed, each of the optical units 30 transmits light on which spatial modulation according to the pattern data D is formed (specifically, light that has been spatially modulated for N pixels along the sub-scanning direction) to the substrate. Irradiation is continued intermittently toward W (that is, pulsed light is repeatedly projected onto the surface of the substrate W). That is, each optical unit 30 traverses the substrate W along the main scanning direction while continuously irradiating the spatially modulated light for N pixels along the sub-scanning direction. Therefore, when the optical unit 30 crosses the substrate W once along the main scanning direction, one pattern group having a width of N pixels along the sub-scanning direction is drawn on the surface of the substrate W. Become. Here, since the two optical units 30 simultaneously traverse the substrate W, two pattern groups are drawn by one main scanning.

  When one main scanning is completed, the stage driving mechanism 15 moves the stage 12 in the + X direction along the sub-scanning direction (X-axis direction) by a distance corresponding to the width of one stripe, thereby moving the substrate W. The optical units 30 and 30 are moved relatively along the sub inspection direction (sub scanning). When viewed from the substrate W, each optical unit 30 moves by the width of one stripe in the −X direction along the sub-scanning direction (arrow AR12).

  When the sub-scanning is finished, the main scanning is performed again. That is, the stage moving mechanism 15 moves the substrate 12 relative to the optical units 30 and 30 in the main scanning direction by moving the stage 12 in the −Y direction along the main scanning direction. When this is viewed from the substrate W, each optical unit 30 crosses the substrate W by moving in the + Y direction along the main scanning direction next to the drawing region for one stripe drawn in the previous main scanning. (Arrow AR13). Also here, each optical unit 30 traverses the substrate W along the main scanning direction while continuously irradiating the light on which spatial modulation according to the pattern data D is formed toward the substrate W. As a result, an area for one stripe is drawn next to the drawing area for one stripe drawn in the previous main scanning. Thereafter, similarly, main scanning and sub-scanning are repeated, and when a pattern is drawn on the entire surface of the substrate W, the drawing process ends.

  When the drawing process is completed, the transport device 50 receives the processed substrate W placed on the placement surface 120, carries it out of the drawing device 1, and stores it in the cassette C placed on the cassette placement unit 80. (Step S6). The process in which the transfer device 50 receives the substrate W from the placement surface 120 is specifically performed as follows. First, the stage drive mechanism 15 moves the stage 12 to the delivery position Q. When the stage 12 is disposed at the delivery position Q, the lift pin drive mechanism 14 subsequently moves the group of lift pins 13 from the lower position to the upper position. As a result, the lower surface of the substrate W is supported by the group of lift pins 13, lifted from the stage 12, and peeled off from the placement surface 120. Subsequently, the transport device 50 inserts the hand 51 between the placement surface 120 and the lower surface of the substrate W, and further raises the hand 51. As a result, the substrate W supported on the group of lift pins 13 is transferred onto the hand 51. Subsequently, when the hand 51 is pulled out, the lift pin drive mechanism 14 moves the group of lift pins 13 from the upper position to the lower position.

<4. Flow of processing related to braking of stage 12>
Next, a mode in which the braking control unit 901 controls the braking unit 16 will be described. In the following, three modes in which the braking control unit 901 controls the braking unit 16 will be exemplified. In the drawing apparatus 1, the braking control unit 901 may control the braking unit 16 in any manner. Moreover, it is good also as a structure which an operator can select which aspect the braking control part 901 controls the braking part 16 is.

<4-1. First Aspect>
The flow of processing according to the first aspect will be described with reference to FIG. FIG. 11 is a diagram showing a flow of a series of processes when the braking control unit 901 controls the braking unit 16 in the first mode. When the braking control unit 901 controls the braking unit 16 in the first mode, the braking control unit 901 and the drive circuit 163 are spared until at least a certain period of time has elapsed since the power feeding cable has been turned off. It is assumed that power is supplied. However, as described above, the drive circuit 163 includes a self-holding circuit having a self-holding function, and thus can hold the operation circuit without continuous energization.

  First, the braking control unit 901 determines whether or not the stage 12 is at the delivery position Q based on the detection result from the stage position sensor 17 (step S11).

  Here, when it is not detected that the stage 12 is disposed at the delivery position Q (NO in step S11), the brake control unit 901 returns to the process of step S11 again. On the other hand, when it is detected that the stage 12 is arranged at the delivery position Q (YES in step S11), the braking control unit 901 subsequently continues to draw the drawing device 1 based on the detection result from the energized state detection unit 903. It is determined whether or not the power supply to is interrupted (step S12).

  If it is determined that the power supply to the drawing apparatus 1 is not interrupted (NO in step S12), the braking control unit 901 returns to the process of step S11 again. On the other hand, when it is determined that the power supply to the drawing apparatus 1 is interrupted (YES in step S12), the braking control unit 901 causes the braking unit 16 to brake the base plate 154 (step S13). When the brake unit 16 brakes the base plate 154, the stage 12 supported by the base plate 154 is in a state where it cannot move from the delivery position Q.

  As described above, in the first aspect, the braking control unit 901 is configured such that when the supply of power to the stage driving mechanism 15 is interrupted in a state where the stage 12 is disposed at the delivery position Q, the braking unit 16 The base plate 154 is braked. Accordingly, the base plate 154 that has lost the driving force is braked so as not to move along the guide member 1552 (that is, the stage 12 does not move from the transfer position Q).

<4-2. Second Aspect>
The flow of processing according to the second aspect will be described with reference to FIG. FIG. 12 is a diagram illustrating a flow of a series of processes when the braking control unit 901 controls the braking unit 16 in the second mode. Note that when the braking control unit 901 controls the braking unit 16 in the second mode, it is not necessary to supply the reserve power to the braking control unit 901 and the drive circuit 163 of the braking unit 16.

  First, the braking control unit 901 determines whether or not the stage 12 is at the delivery position Q based on the detection result from the stage position sensor 17 (step S21).

  Here, when it is not detected that the stage 12 is arranged at the delivery position Q (NO in step S21), the brake control unit 901 returns to the process of step S21 again. On the other hand, when it is detected that the stage 12 is disposed at the delivery position Q (YES in step S21), the braking control unit 901 causes the braking unit 16 to brake the base plate 154 (step S22). When the brake unit 16 brakes the base plate 154, the stage 12 supported by the base plate 154 is in a state where it cannot move from the delivery position Q.

  Subsequently, the braking control unit 901 determines whether the lift pin 13 has been moved from the upper position to the lower position based on the detection result from the pin position sensor 18 (step S23).

  When it is detected that the lift pin 13 has been moved from the upper position to the lower position (YES in step S23), the braking control unit 901 causes the braking unit 16 to release the braking of the base plate 154 (step S24). When the braking unit 16 releases the braking of the base plate 154, the base plate 154 can move freely along the guide member 1552. That is, the stage 12 can move freely from the delivery position Q.

  Thus, in the second mode, the braking control unit 901 causes the braking unit 16 to brake the base plate 154 when the stage 12 is disposed at the delivery position Q, and the lift pin 13 is moved from the upper position to the lower position. This braking state is continued until. Therefore, even if the supply of electric power to the stage drive mechanism 15 is interrupted while the stage 12 is in the state of transferring the substrate W at the transfer position Q, the base plate 154 that has lost the drive force moves along the guide member 1552. The brake is applied so that the stage 12 does not start (that is, the stage 12 does not start moving from the transfer position Q).

<4-3. Third aspect>
The flow of processing according to the third aspect will be described with reference to FIG. FIG. 13 is a diagram showing a flow of a series of processes when the braking control unit 901 controls the braking unit 16 in the third mode. Note that, when the braking control unit 901 controls the braking unit 16 in the third mode, it is not necessary for the reserve power to be supplied to the braking control unit 901 and the drive circuit 163 of the braking unit 16.

  First, the braking control unit 901 determines whether the lift pin 13 has been moved from the lower position to the upper position based on the detection result from the pin position sensor 18 (step S31).

  When it is detected that the lift pin 13 has started to move from the lower position to the upper position (YES in step S31), the braking control unit 901 causes the braking unit 16 to brake the base plate 154 (step S32). When the brake unit 16 brakes the base plate 154, the stage 12 supported by the base plate 154 is in a state where it cannot move from the delivery position Q.

  Subsequently, the braking control unit 901 determines whether the lift pin 13 has been moved from the upper position to the lower position based on the detection result from the pin position sensor 18 (step S33).

  When it is detected that the lift pin 13 has been moved from the upper position to the lower position (YES in step S33), the braking control unit 901 causes the braking unit 16 to release the braking of the base plate 154 (step S34). When the braking unit 16 releases the braking of the base plate 154, the base plate 154 can move freely along the guide member 1552. That is, the stage 12 can move freely from the delivery position Q.

  As described above, in the third mode, the braking control unit 901 causes the braking unit 16 to brake the base plate 154 while the lift pin 13 is not in the lower position (that is, while the substrate W is in a delivery state). Therefore, even if the supply of electric power to the stage drive mechanism 15 is interrupted while the stage 12 is in the state of transferring the substrate W at the transfer position Q, the base plate 154 that has lost the drive force moves along the guide member 1552. The brake is applied so that the stage 12 does not start (that is, the stage 12 does not start moving from the transfer position Q).

<5. Effect>
When the power supply to the drawing apparatus 1 is interrupted, the supply of electric power to the stage drive mechanism 15 is interrupted, and the base plate 154 and the like that support the stage 12 are in a state in which the driving force is lost. On the other hand, since the supply of air to the air bearing 1553 is performed from the utility facility, the supply of air is not stopped even when the power supply to the drawing apparatus 1 is interrupted. That is, when power supply to the drawing apparatus 1 is interrupted, the base plate 154 is supported in a floating manner on the guide member 1552 in a non-contact manner (that is, in a state where there is no friction with the guide member 1552). The driving force is lost. For this reason, when power supply to the drawing apparatus 1 is interrupted, the base plate 154 starts to move along the guide member 1552 according to, for example, a slight inclination of the guide member 1552 or a slight force applied from a cable bear or the like. there is a possibility.

  By the way, when the stage 12 is disposed at the delivery position Q, the stage 12 may be in a delivery state of the substrate W (that is, a state in which the lift pins 13 protrude even slightly from the placement surface 120). Here, it is not assumed in the normal operation that the stage 12 moves to a position other than the transfer position Q while the substrate W is being transferred. Therefore, when such a situation occurs, an unexpected collision accident may occur. For example, when the base plate 154 on which the stage 12 is placed moves in the −Y direction along the guide member 1552 in a state where the lift pins 13 protrude from the placement surface 120, the lift pins 13 that protrude from the placement surface 120 (in some cases Furthermore, there is a possibility that an accident occurs in which the substrate W) supported by the lift pins 13 collides with members such as the optical unit 30 (see FIG. 5). Further, for example, when the base plate 154 on which the stage 12 is placed moves in the + Y direction along the guide member 1552 with the lift pins 13 protruding from the placement surface 120, the lift pins 13 are supported in a state of being lifted from the placement surface 120. For example, an accident may occur in which the substrate W collides with the hand 51 of the transfer apparatus 50 inserted in the processing region 102 (see FIG. 5).

  Here, according to the above-described embodiment, the brake unit 16 that brakes the stage 12 so as not to move from the delivery position Q is provided. In particular, when the braking control unit 901 controls the braking unit 16 in the first mode, if the supply of electric power to the stage driving mechanism 15 is interrupted in a state where the stage 12 is disposed at the delivery position Q, the braking unit 16 brakes the base plate 154. Further, when the braking control unit 901 controls the braking unit 16 in the second mode, the braking unit 16 brakes the base plate 154 when the stage 12 is disposed at the delivery position Q. When the braking control unit 901 controls the braking unit 16 in the third mode, when the lift pin 13 starts to move from the lower position to the upper position (that is, when the lift pin 13 protrudes from the placement surface 120). The braking unit 16 brakes the base plate 154. In any aspect, the stage 12 that has lost the driving force is braked so as not to move from the transfer position Q while the substrate W is being transferred. Therefore, the occurrence of the collision accident as described above is avoided.

  In the above-described embodiment, when the stage 12 is disposed at a position other than the delivery position Q, the stage 12 is not braked even when the supply of power to the stage drive mechanism 15 is interrupted. According to this configuration, when the supply of power to the drawing apparatus 1 is restored, the base plate 154 on which the stage 12 is placed can be moved to an arbitrary Y position without difficulty. Therefore, the resuming operation can be performed smoothly. In this case, there is a possibility that the base plate 154 that has lost the driving force starts to move along the guide member 1552 while the power supply to the drawing apparatus 1 is interrupted. However, in the state where the stage 12 is arranged at a position other than the delivery position Q, the lift pin 13 is always in the lower position (that is, the stage 12 is brought into the delivery state of the substrate W at a position other than the delivery position Q. Absent). Since it is assumed that the base plate 154 on which the stage 12 is placed reciprocates along the guide member 1552 in a state where the lift pins 13 are in the lower position, it is assumed that the base plate 154 is guided in this state. Regardless of the position along the member 1552, the stage 12 and the substrate W placed on the placement surface 120 do not collide with other members.

<6. Modification>
In the above embodiment, the air cylinder 162 is used as a drive unit that moves the pressing member 161 forward and backward, but various drive devices such as a hydraulic cylinder, an actuator, and a motor can be used as the drive unit. For example, when the braking control unit 901 controls the braking unit 16 in the first and third modes, it is preferable to use an air cylinder or the like having a relatively fast response speed. On the other hand, when the braking control unit 901 controls the braking unit 16 in the second mode, for example, a motor or the like can be used.

  Further, in the above embodiment, the braking unit 16 is configured to abut the pressing member 161 against the side wall 1540 of the base plate 154 to brake the base plate 154, but the pressing member 161 abuts against the air bearing 1553. The base plate 154 may be braked.

  In the above embodiment, for example, when the substrate W is deformed (shape change such as distortion, contraction / expansion), this is detected as the amount of deviation of the alignment mark detection position from the target position. It will be. Therefore, before the drawing process is executed, a process of correcting the pattern data D may be performed based on the detection position of the alignment mark of the substrate W placed on the stage 12. In this case, the pattern data D may be deformed in the same manner as the substrate W by correcting the pattern described in the pattern data D to be shifted by the detected shift amount. For the correction of the pattern data D, detection information of the alignment mark used for fine alignment may be used. Further, the detection information and detection information of another alignment mark may be used together.

  In each of the above embodiments, the spatial light modulator 341 uses a GLV which is a diffraction grating type spatial light modulator in which a fixed ribbon as a modulation unit and a movable ribbon are arranged one-dimensionally. It is not limited to such a form. For example, not only GLV but a form using a spatial light modulator in which modulation units such as mirrors are arranged one-dimensionally may be used. For example, a spatial light modulator in which micromirrors that are modulation units, such as DMD (Digital Micromirror Device: registered trademark of Texas Instruments), are two-dimensionally arranged may be used.

  Further, in each of the above embodiments, the substrate W is circular, but the substrate W is not necessarily circular, and may be rectangular, for example.

  In the above embodiment, the substrate transfer apparatus 10 is mounted on the drawing apparatus 1 that forms a pattern on the substrate W by irradiating the substrate W with light. 10 can be incorporated into various substrate processing apparatuses other than the drawing apparatus 1.

DESCRIPTION OF SYMBOLS 1 Drawing apparatus 10 Board | substrate transfer apparatus 11 Base 12 Stage 13 Lift pin 14 Lift pin drive mechanism 15 Stage drive mechanism 16 Braking part 17 Stage position sensor 18 Pin position sensor 90 Control part 901 Braking control part W board | substrate

Claims (3)

The base,
A stage having a mounting surface on which a substrate is mounted;
A drive unit for moving the stage relative to the base;
A braking unit that brakes the stage so as not to move from a delivery position where the substrate is delivered to the stage; and
Equipped with a,
Lift pins provided so as to be able to appear and retract with respect to the mounting surface,
A lift pin drive mechanism for moving the lift pin up and down between an upper position where the tip protrudes from the placement surface and a lower position where the tip is equal to or less than the placement surface;
Further comprising
A braking control unit for controlling the braking unit,
A substrate transfer apparatus that causes the braking unit to brake the stage when the lift pin is disposed at the upper position . The substrate transfer apparatus according to claim 1,
A pair of guide members laid on the base;
A support portion provided between the stage and the pair of guide members, and supporting the stage in a non-contact manner on the guide member;
A substrate transfer apparatus comprising:   The base,
  A stage having a mounting surface on which a substrate is mounted;
  An optical unit for irradiating light onto the substrate placed on the stage;
  A drive unit for moving the stage relative to the base;
  A braking unit that brakes the stage so as not to move from a delivery position where the substrate is delivered to the stage; and
With
  Lift pins provided so as to be able to appear and retract with respect to the mounting surface,
  A lift pin drive mechanism for moving the lift pin up and down between an upper position where the tip protrudes from the placement surface and a lower position where the tip is equal to or less than the placement surface;
Further comprising
  A braking control unit for controlling the braking unit,
  A drawing apparatus that causes the brake to brake the stage when the lift pin is disposed at the upper position.

Images