JP2013003534A - Drawing device and drawing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To secure high drawing accuracy by definitely removing a thermal influence of light, which is reflected by a spatial light modulator and does not contribute to drawing, on a peripheral member.SOLUTION: An optical unit comprises a head part that comprises a spatial light modulator for spatially modulating light emitted from a laser oscillator and for reflecting necessary light L1 allowed to contribute to pattern drawing and unnecessary light L0 not allowed to contribute to the pattern drawing in mutually different directions. The optical unit additionally comprises: a second blocking plate 232 for blocking the unnecessary light L0 while allowing passage of the necessary light L1; and a cooling part for cooling the second blocking plate 232. In a target area portion including an incident area of the unnecessary light L0 in the second blocking plate 232, a diffusely-reflecting surface 42 for diffusely reflecting incident light is formed.

Description

  The present invention irradiates various substrates (hereinafter simply referred to as “substrates”) such as semiconductor substrates, glass substrates for flat panel displays, optical disk substrates, solar cell panels, etc. The present invention relates to a technique that directly exposes the light.

  In forming a pattern such as a circuit on a photosensitive material applied on a substrate, an exposure apparatus that exposes the photosensitive material in a planar shape using a light source and a photomask is well known. On the other hand, in recent years, a drawing apparatus that directly exposes a pattern on a photosensitive material by scanning the photosensitive material on the substrate with a light beam modulated according to CAD data or the like without using a photomask has attracted attention. ing. The drawing apparatus includes a spatial light modulator for on / off-modulating a light beam to the photosensitive material in units of pixels. In a reflective spatial light modulator, an exposure pattern is divided into an on state in which a light beam supplied from a light source is reflected and applied to the substrate, and an off state in which the light beam is reflected in a direction different from the on state. Switching is performed in units of pixels according to the expressed control signal.

  By the way, high drawing accuracy is required in the drawing apparatus. That is, a function capable of irradiating the target position on the photosensitive material with high accuracy with the light beam modulated by the spatial light modulator is required.

  One of the factors that reduce the drawing accuracy is deformation of a member accompanying heat generation. For example, when the spatial light modulator is driven, it generates heat, and the member that supports the spatial light modulator is deformed due to the thermal effect, resulting in a deviation in the orientation of the spatial light modulator, which is the drawing accuracy. May be adversely affected. In this regard, Patent Document 1 discloses a configuration in which a heat radiating member is disposed near the spatial light modulator to reduce the thermal influence of the heat generated by the spatial light modulation on the peripheral members.

  For example, when light that does not contribute to drawing reflected by the spatial light modulator (that is, reflected light from the spatial light modulator in the off state) is incident on a member disposed in the optical head, the member is There is a possibility of deformation due to thermal effects. For example, if a member that accommodates and supports an optical component such as a lens disposed in the optical head is deformed, the posture of the optical component is deviated, which may deteriorate the drawing accuracy. In this regard, Patent Document 2 proposes a device for reducing the thermal influence of light not contributing to drawing on peripheral members by guiding light that does not contribute to drawing to a heat radiating member via a mirror. .

JP 2005-331717 A JP 2004-301914 A

  By the way, the light beam used in the drawing apparatus tends to have higher energy in recent years. For this reason, the thermal influence which the light which does not contribute to the drawing reflected by the spatial light modulator gives to a peripheral member is also increasing. On the other hand, the drawing accuracy required for the drawing apparatus is increasing year by year, and slight thermal deformation of peripheral members is not allowed.

  As in Patent Document 2, in the configuration in which light that does not contribute to drawing reflected by the spatial light modulator is guided to the heat radiating member via a mirror and radiated here, when a high-energy light beam is employed There is no guarantee that the thermal deformation of the peripheral members can be sufficiently suppressed, and there is a possibility that the required high level of drawing accuracy cannot be ensured.

  The present invention has been made in view of the above-described problems, and is a technology capable of ensuring high drawing accuracy by reliably eliminating the thermal influence on peripheral members of light that does not contribute to drawing reflected by the spatial light modulator. The purpose is to provide.

  A 1st aspect is a drawing apparatus which irradiates light with respect to a board | substrate from an optical unit, and draws a pattern on the said board | substrate, Comprising: The said optical unit spatially modulates the light from a light source and the said light source. The spatial light modulator that reflects the necessary light that contributes to the pattern drawing and the unnecessary light that does not contribute to the pattern drawing in different directions, and is disposed between the spatial light modulator and the substrate. A blocking plate that blocks the unnecessary light while allowing light to pass through, a cooling unit that cools the blocking plate, and a target region portion including the incident region of the unnecessary light on the blocking plate, diffuses the incident light. An irregular reflection surface.

  A 2nd aspect is a drawing apparatus which concerns on a 1st aspect, Comprising: The said irregular reflection surface is formed when the said target area | region part in the said shielding board is made uneven | corrugated shape.

  A 3rd aspect is a drawing apparatus which concerns on a 1st aspect, Comprising: The said optical unit is provided with the irregular reflection member by which the uneven | corrugated shape was formed in the upper surface, The said irregular reflection surface is the said target area part in the said shielding board. It is formed by mounting the irregular reflection member.

  A 4th aspect is a drawing apparatus which concerns on a 3rd aspect, Comprising: The said irregular reflection member is formed of a member with higher heat conductivity than the said shielding board.

  A fifth aspect is the drawing apparatus according to any one of the second to fourth aspects, wherein the concave-convex shape is a shape in which a plurality of convex portions are arranged on lattice points, and the unnecessary light is a light beam cross-section. Is a linear line beam having a certain width, and the width direction of the unnecessary light incident on the irregular reflection surface is not parallel to the lattice direction of the plurality of convex portions.

  A sixth aspect is a drawing apparatus according to any one of the first to fifth aspects, and is between the shielding plate and a target member disposed between the shielding plate and the spatial light modulator. And a cover member that blocks the light irregularly reflected by the irregular reflection surface from entering the target member.

  A seventh aspect is a drawing method for irradiating a substrate with light and drawing a pattern on the substrate, and a) spatially modulates light emitted from a light source by a spatial light modulator, A step of reflecting necessary light that contributes to pattern drawing and unnecessary light that does not contribute to pattern drawing in different directions; and b) a blocking plate disposed between the spatial light modulator and the substrate. A step of blocking the unnecessary light while allowing the necessary light to pass through; and c) a step of cooling the blocking plate. In the step b), a part of the unnecessary light is absorbed by the blocking plate. At the same time, the remainder is irregularly reflected by the irregular reflection surface formed in the target area including the incident area of the unnecessary light on the blocking plate.

  An eighth aspect is the drawing method according to the seventh aspect, wherein the irregular reflection surface is formed by making the target area portion of the blocking plate an uneven shape.

  A ninth aspect is the drawing method according to the seventh aspect, wherein the irregular reflection surface is placed on the target area portion of the blocking plate with an irregular reflection member having an irregular shape formed on the upper surface. It is formed.

  A tenth aspect is a drawing method according to the ninth aspect, wherein the irregular reflection member is formed of a member having higher thermal conductivity than the blocking plate.

  An eleventh aspect is a drawing method according to any one of the eighth to tenth aspects, wherein the concavo-convex shape is a shape in which a plurality of convex portions are arranged on lattice points, and the unnecessary light is a light beam cross section. Is a linear line beam having a certain width, and the width direction of the unnecessary light incident on the irregular reflection surface is not parallel to the lattice direction of the plurality of convex portions.

  A twelfth aspect is a drawing method according to any one of the seventh to eleventh aspects. D) In step b), unnecessary light irregularly reflected by the irregular reflection surface is converted into the irregular reflection surface and the spatial light. And a step of blocking so as not to be incident on a target member arranged between the modulation unit.

  According to the first and seventh aspects, a part of unnecessary light that does not contribute to the drawing reflected by the spatial light modulator is absorbed by the shielding plate, and the accompanying temperature rise of the shielding plate is suppressed by cooling. On the other hand, the remaining light that has not been absorbed by the blocking plate is weakened by being irregularly reflected by the irregular reflection surface. Therefore, it is possible to reliably eliminate the thermal influence of unnecessary light on the peripheral members and ensure high drawing accuracy.

  According to the second and eighth aspects, since the irregular reflection surface is formed by making the target region portion of the shielding plate have an uneven shape, the temperature of the irregular reflection surface is also suppressed by cooling the shielding plate.

  According to the third and ninth aspects, since the irregular reflection surface is formed by the irregular reflection member separate from the shielding plate, the irregular reflection member can be exchanged independently of the shielding plate.

  According to the fourth and tenth aspects, since the irregular reflection member is formed of a member having higher thermal conductivity than the blocking plate, the temperature rise of the irregular reflection member is suppressed.

  According to the fifth and eleventh aspects, on the irregular reflection surface, the plurality of convex portions are arranged along a direction non-parallel to the extending direction of the unnecessary light. According to this configuration, it is possible to reliably diffuse the unnecessary light on the irregular reflection surface.

  According to the sixth and twelfth aspects, the light irregularly reflected by the irregular reflection surface does not easily enter the target member disposed between the irregular reflection surface and the spatial light modulator. Therefore, even a slight thermal effect of unnecessary light on the target member can be surely eliminated.

It is a side view of a drawing apparatus. It is a top view of a drawing apparatus. It is the schematic of a head part. It is a figure which shows typically the structural example of a spatial light modulator. It is a figure which shows the spatial light modulation element of the state by which the voltage is turned off. It is a figure which shows the spatial light modulation element of the state in which the voltage is turned on. It is a sectional side view which shows a part of head part typically. It is the top view which looked at the 2nd shielding board from the upper surface side. It is the flowchart which showed the flow of operation | movement of the drawing apparatus. It is a figure for demonstrating a drawing process. It is a sectional side view which shows typically a part of head part which concerns on 2nd Embodiment. It is the top view which looked at the 2nd shielding board concerning a 2nd embodiment from the upper surface side. It is a sectional side view which shows typically a part of head part which concerns on 3rd Embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The following embodiment is an example embodying the present invention, and does not limit the technical scope of the present invention.

<I. First Embodiment>
<1. Device configuration>
The configuration of the drawing apparatus 1 will be described with reference to FIGS. FIG. 1 is a side view schematically showing the configuration of the drawing apparatus 1. FIG. 2 is a plan view schematically showing the configuration of the drawing apparatus 1.

  The drawing apparatus 1 is an apparatus that exposes a pattern by irradiating light onto the upper surface of a substrate W on which a layer of a photosensitive material such as a resist is formed. The substrate W may be any of various substrates such as a semiconductor substrate, a printed substrate, a color filter substrate, a glass substrate for flat panel display provided in a liquid crystal display device or a plasma display device, and an optical disk substrate. In the figure, a circular semiconductor substrate is shown.

  The drawing apparatus 1 includes a main body inside formed by attaching cover panels (not shown) to the ceiling surface and the peripheral surface of the skeleton formed of the main body frame 101, and an outer main body that is outside the main body frame 101. It has a configuration in which various components are arranged.

  The inside of the main body of the drawing apparatus 1 is divided into a processing area 102 and a delivery area 103. In the processing area 102, a stage 11, a stage moving mechanism 12, a stage position measuring unit 13, two optical units 14 and 14, and an alignment unit 15 are mainly arranged. In the delivery area 103, a transfer device 16 that carries the substrate W in and out of the processing area 102 is arranged.

  An illumination unit 17 that supplies illumination light to the alignment unit 15 is disposed outside the main body of the drawing apparatus 1. Further, the main body is provided with a control unit 18 that is electrically connected to each unit included in the drawing apparatus 1 and controls the operation of each unit. In addition, a cassette mounting portion 19 for mounting the cassette C is disposed outside the main body of the drawing apparatus 1 and at a position adjacent to the transfer area 103. The transfer device 16 arranged in the delivery area 103 takes out the unprocessed substrate W accommodated in the cassette C placed on the cassette placement section 19 and carries it into the processing area 102 and has processed it from the processing area 102. The substrate W is unloaded and accommodated in the cassette C. Delivery of the cassette C to the cassette mounting portion 19 is performed by an external transfer device (not shown).

  Below, the structure of each part 11-15 arrange | positioned at the process area | region 102 is demonstrated.

<Stage 11>
The stage 11 has a flat outer shape, and is a holding unit that holds and holds the substrate W in a horizontal posture on the upper surface thereof. A plurality of suction holes (not shown) are formed on the upper surface of the stage 11, and the substrate W placed on the stage 11 is placed on the stage 11 by forming a negative pressure (suction pressure) in the suction holes. It can be fixedly held on the upper surface of the.

<Stage moving mechanism 12>
The stage moving mechanism 12 is a mechanism that moves the stage 11 in the main scanning direction (Y-axis direction), the sub-scanning direction (X-axis direction), and the rotating direction (rotating direction around the Z-axis (θ-axis direction)). The stage moving mechanism 12 includes a rotating mechanism 121 that rotates the stage 11 and a support plate 122 that supports the stage 11 via the rotating mechanism 121. Further, the stage moving mechanism 12 includes a sub-scanning mechanism 123 that moves the support plate 122 in the sub-scanning direction, and a base plate 124 that supports the support plate 122 via the sub-scanning mechanism 123. Furthermore, the stage moving mechanism 12 includes a main scanning mechanism 125 that moves the base plate 124 in the main scanning direction.

  The rotation mechanism 121 rotates the stage 11 about the rotation axis perpendicular to the upper surface of the substrate W on the support plate 122.

  The sub-scanning mechanism 123 has a linear motor 123 a configured by a mover attached to the lower surface of the support plate 122 and a stator laid on the upper surface of the base plate 124. A pair of guide portions 123b extending in the sub-scanning direction is provided between the support plate 122 and the base plate 124. For this reason, when the linear motor 123a is operated, the support plate 122 moves in the sub-scanning direction along the guide portion 123b on the base plate 124.

  The main scanning mechanism 125 includes a linear motor 125 a that includes a moving element attached to the lower surface of the base plate 124 and a stator laid on the base 106 of the drawing apparatus 1. A pair of guide portions 125b extending in the main scanning direction is provided between the base plate 124 and the base 106. Therefore, when the linear motor 125a is operated, the base plate 124 moves in the main scanning direction along the guide portion 125b on the base 106.

<Stage position measurement unit 13>
The stage position measurement unit 13 is a mechanism that measures the position of the stage 11. The stage position measurement unit 13 irradiates laser light toward the plane mirror 130 fixed to the stage 11 and measures the position of the stage 11 using interference between the reflected light and the emitted light, for example. Can be configured. In this case, the stage position measurement unit 13 includes, for example, an emission unit 131 that emits laser light, a beam splitter 132, a beam bender 133, a first interferometer 134, and a second interferometer 135.

  The laser light emitted from the emission unit 131 first enters the beam splitter 132 and is branched into first branched light that goes to the beam bender 133 and second branched light that goes to the second interferometer 135. The first branched light is reflected by the beam bender 133, enters the first interferometer 134, and is irradiated from the first interferometer 134 to the first part of the plane mirror 130. Then, the first branched light reflected by the first part is incident on the first interferometer 134 again. The first interferometer 134 is a position corresponding to the position of the first part based on the interference between the first branched light traveling toward the first part of the plane mirror 130 and the first branched light reflected by the first part. Measure parameters. The position parameter acquired by the first interferometer 134 is sent to the control unit 18, and the control unit 18 specifies the Y position of the stage 11 based on the transmitted position parameter.

  On the other hand, the second branched light is incident on the second interferometer 135, and the second part of the plane mirror 130 from the second interferometer 135 (however, the second part is at a position different from the first part. ). Then, the second branched light reflected by the second part is incident on the second interferometer 135 again. The second interferometer 135 is a position corresponding to the position of the second part based on the interference between the second branched light toward the second part of the plane mirror 130 and the second branched light reflected by the second part. Measure parameters. The position parameter acquired by the second interferometer 135 is sent to the control unit 18, and the control unit 18 determines the θ position of the stage 11 based on the transmitted position parameter and the position parameter acquired from the first interferometer 134. Is identified.

<Optical unit 14>
The optical unit 14 is a mechanism for irradiating the upper surface of the substrate W held on the stage 11 with light for exposure. As described above, the drawing apparatus 1 includes the two optical units 14 and 14. One optical unit 14 is responsible for exposure of the + X side half of the substrate W, and the other optical unit 14 is responsible for exposure of the −X side half of the substrate W. These two optical units 14 and 14 are fixed to a frame 107 installed on the base 106 so as to straddle the stage 11 and the stage moving mechanism 12 with a space therebetween. Note that the interval between the two optical units 14 and 14 does not necessarily have to be fixed, and a mechanism that can change the position of one or both of the optical units 14 and 14 is provided to adjust the interval between them. It may be possible.

  The two optical units 14 and 14 have the same configuration. That is, each optical unit 14 is accommodated in a laser driving unit 141, a laser oscillator 142, an illumination optical system 143, and an attachment box attached to the + Y side of the frame 107, which are arranged inside the box forming the top plate. The head part 144 is provided.

  The laser oscillator 142 receives driving from the laser driving unit 141 and emits laser light from an output mirror (not shown). The illumination optical system 143 converts the light (spot beam) emitted from the laser oscillator 142 into linear light having a uniform intensity distribution (line beam whose light beam cross section is linear light). The light emitted from the laser oscillator 142 and converted into a line beam by the illumination optical system 143 is incident on the head unit 144, and is subjected to spatial modulation in accordance with pattern data, which will be described later, and is applied to the substrate W. The The configuration of the head portion 144 will be described later.

<Alignment unit 15>
The alignment unit 15 images the alignment mark formed on the upper surface of the substrate W. The alignment unit 15 includes a lens barrel, an objective lens, and a CCD image sensor (both not shown) including, for example, an area image sensor (two-dimensional image sensor).

  The alignment unit 15 is connected to a fiber 170 extending from the illumination unit 17. Light emitted from the illumination unit 17 is guided to the lens barrel by the fiber 170 and is guided to the upper surface of the substrate W through the lens barrel. The reflected light is received by the CCD image sensor via the objective lens. Thereby, imaging data of the upper surface of the substrate W is acquired. The CCD image sensor acquires imaging data in response to an instruction from the control unit 18 and transmits the acquired imaging data to the control unit 18. The alignment unit 15 may further include an autofocus unit capable of autofocusing.

<Control unit 18>
The control unit 18 is electrically connected to the units 11 to 17 included in the drawing apparatus 1 and controls the operations of the units 11 to 17 while executing various arithmetic processes. The control unit 18 includes, for example, a CPU for performing various arithmetic processes, a ROM for storing a boot program, a RAM serving as a work area for the arithmetic processes, a storage unit (for example, a hard disk) for storing programs and various data files, and various displays. And a computer having an input unit composed of a display, a keyboard and a mouse, a data communication unit having a data communication function via a LAN, etc., and the computer operates according to a program installed in the computer Thus, the computer functions as the control unit 18 of the drawing apparatus 1. Each functional unit realized by the control unit 18 may be realized by a program being executed by a computer, or may be realized by dedicated hardware.

  Data (pattern data) describing a pattern to be exposed on the substrate W is stored in the storage unit included in the control unit 18. The pattern data is, for example, CAD data generated using CAD and represents a circuit pattern or the like. Prior to a series of processes for the substrate W, the control unit 18 acquires pattern data and stores it in the storage unit. The acquisition of pattern data may be performed by receiving from an external terminal device connected via a network or the like, or may be performed by reading from a recording medium.

<2. Head 144>
The configuration of the head unit 144 provided in the optical unit 14 will be described with reference to FIG. FIG. 3 is a diagram schematically illustrating the configuration of the head unit 144.

  The head unit 144 mainly includes a spatial light modulation unit 21, an optical path correction unit 22, and a projection optical system 23.

<2-1. Spatial Light Modulator 21>
The light emitted from the laser oscillator 142 (FIG. 1) and converted into a line beam by the illumination optical system 143 (FIG. 1) is incident on the head unit 144 and is passed through the mirror 20 at a predetermined angle. 21 is incident. The spatial light modulator 21 spatially modulates the incident light to reflect necessary light that contributes to pattern drawing and unnecessary light that does not contribute to pattern drawing in different directions. However, spatially modulating light specifically means changing the spatial distribution of light (amplitude, phase, polarization, etc.).

  Specifically, the spatial light modulator 21 includes a spatial light modulator 3 that spatially modulates incident light by electrical control. The spatial light modulator 3 is arranged such that the normal line of the reflecting surface thereof is inclined with respect to the optical axis of the incident light incident through the mirror 20, and the incident light is spatially modulated based on the control of the control unit 18. Let

  The configuration of the spatial light modulator 3 will be described in detail with reference to FIGS. FIG. 4 is a diagram schematically illustrating a configuration example of the spatial light modulator 3. The spatial light modulator 3 uses, for example, a diffraction grating type spatial modulator (for example, GLV (Grating Light Valve) (registered trademark of Silicon Light Machines (San Jose, California)). The diffraction grating type spatial modulator is a diffraction grating capable of changing the depth of the grating, and is manufactured using, for example, a semiconductor device manufacturing technique.

  The spatial light modulator 3 has a configuration in which a plurality of movable ribbons 301 and a plurality of fixed ribbons 302 are alternately arranged on a substrate 300 with their longitudinal directions parallel to each other. The widths of the ribbons 301 and 302 along the short direction may be substantially the same, or may be slightly different in consideration of contrast and reflectance.

  Here, when the movable ribbon 301 and the fixed ribbon 302 adjacent to each other are referred to as “ribbon pair 303”, a ribbon pair set 304 including three or more (in this embodiment, four) ribbon pairs 303 adjacent to each other. Corresponds to one pixel (pixel unit) of the drawn pattern. That is, one ribbon pair set 304 constitutes the spatial light modulation element 31 corresponding to one pixel. That is, the spatial light modulator 3 has a configuration in which a plurality of spatial light modulation elements 31 are arranged one-dimensionally. The pixel size of the drawing light which is divided by the spatial light modulator 3 and individually modulated and then reduced and projected onto the exposure surface through the projection optical system 23 described later is, for example, “about 2.5 μm (micrometer)”. is there. That is, in this case, the spatial light modulator 3 spatially modulates the incident light in units of “about 2.5 μm (micrometers)” (drawing resolution).

  The configuration of the spatial light modulator 31 will be described in more detail with reference to FIGS. The surface of each ribbon 301, 302 forms a belt-like reflecting surface. The fixing ribbon 302 is disposed on the substrate 300 via a spacer (not shown), and is fixed at a position separated from the substrate 300 by a certain distance. Therefore, the surface of the fixed ribbon 302 forms a fixed reflection surface 302f fixed to the reference surface 300f in a posture parallel to the surface of the substrate 300 (hereinafter referred to as “reference surface 300f”).

  On the other hand, the movable ribbon 301 has the same position as the fixed ribbon 302 (that is, a position separated from the substrate 300 by a certain distance) (see FIG. 5) and a position pulled down toward the reference plane 300f (see FIG. 6). It is possible to move between. Accordingly, the surface of the movable ribbon 301 forms a movable reflective surface 301f that can move with respect to the reference surface 300f while maintaining a posture parallel to the reference surface 300f.

  The operation of the spatial light modulator 31 is controlled by turning on / off a voltage applied between the movable ribbon 301 and the substrate 300.

  That is, in a state where the voltage is turned off, the movable ribbon 301 is at a position where the distance from the reference surface 300f is equal to the fixed ribbon 302, and the movable reflective surface 301f and the fixed reflective surface 302f are flush with each other ( State shown in FIG. That is, in the state where the voltage is turned off, the surface of the spatial light modulator 31 is flat. In this state, when light is incident on the spatial light modulator 31, the incident light L is regularly reflected without being diffracted. Thereby, regular reflection light (0th order diffracted light) L1 is generated.

  On the other hand, in a state where the voltage is turned on, the movable ribbon 301 is in a position pulled down to the reference surface 300f side, and the movable reflective surface 301f is pulled down to the reference surface 300f side from the fixed reflective surface 302f. (State shown in FIG. 6). That is, in a state where the voltage is turned on, a plurality of parallel grooves are periodically formed on the surface of the spatial light modulator 31. When light enters the spatial light modulator 31 in this state, an optical path difference is generated between the reflected light reflected by the movable reflecting surface 301f and the reflected light reflected by the fixed reflecting surface 302f. However, in the spatial light modulator 31, as will be described below, this optical path difference (hereinafter referred to as “d”) is “d = (n + ½) λ (where λ is the wavelength of the incident light L, n Can take any integer value). Therefore, the specularly reflected light (0th order diffracted light) cancels and disappears, and other orders of diffracted light (± 1st order diffracted light, ± 2nd order diffracted light, and higher order diffracted light) L0 are generated. More precisely, the intensity of the 0th-order diffracted light is minimized, and the intensity of other orders of diffracted light is maximized.

  In the above, a state is formed in which the movable ribbon 301 and the fixed ribbon 302 are at the same position (a position spaced apart from the reference plane 300f by an equal distance and where the 0th-order diffracted light is generated) when the voltage is off. However, the relationship between the voltage and the position of each ribbon 301, 302 is not necessarily limited to this, and at an arbitrary voltage, it becomes an equal position (position where the 0th-order diffracted light is generated), and another voltage. It may be configured to be a position where diffracted light of an order other than the 0th order is generated.

  The optical path difference d is obtained by using the distance Df between the movable reflective surface 301f and the fixed reflective surface 302f in the state where the voltage is turned on, the wavelength λ of the incident light L, and the incident angle α of the incident light L (Equation 1). It is prescribed by. However, “incident angle α of incident light L” refers to an angle formed by the optical axis of incident light L and the normal direction of reflecting surfaces 301f and 302f.

d = 2Df · cosα (Formula 1)
That is, in the spatial light modulator 31, the separation distance Df and the incident angle α of the incident light L are adjusted to values that satisfy the relationship of (Expression 2).

(N + 1/2) λ = 2Df · cosα (Expression 2)
For example, when the optical path difference d is to be “d = (7/2) λ”, the separation distance Df is “(7/4) λ / cos α”.

  However, the optical axis of the incident light L incident on the spatial light modulator 31 is inclined by an angle α with respect to the normal direction of the reflecting surfaces 301f and 302f, and the arrangement direction of the ribbons 301 and 302 (that is, each ribbon) The direction perpendicular to the longitudinal direction of 301, 302). Here, the incident light L is slightly condensed with respect to the optical axis and the direction perpendicular to the arrangement direction of the ribbons 301 and 302 and is in a parallel state with respect to the arrangement direction. That is, the incident light L is linear light having a long cross section in the arrangement direction.

  Refer to FIG. 4 again. The spatial light modulator 3 includes a driver circuit unit 32 that can apply a voltage independently to each of the plurality of spatial light modulation elements 31.

  The driver circuit unit 32 is connected to the control unit 18 and applies a voltage to the instructed spatial light modulation element 31 in accordance with an instruction from the control unit 18. As described above, the surface state of each spatial light modulator 31 is a state in which the 0th-order diffracted light L1 is emitted according to a voltage applied from the driver circuit unit 32 (hereinafter referred to as “input voltage”) (shown in FIG. 5). State) and diffracted light of orders other than 0th order (± 1st order diffracted light, ± 2nd order diffracted light, and higher order diffracted light) L0 is emitted (state shown in FIG. 6). It is done.

<2-2. Optical path correction unit 22>
Refer to FIG. 3 again. The optical path correction unit 22 slightly shifts the path of the light modulated by the spatial light modulation unit 21 along the sub-scanning direction. The control unit 18 finely adjusts the position of the light applied to the substrate W along the sub-scanning direction by shifting the light path to the optical path correction unit 22 as necessary.

  The optical path correction unit 22 includes, for example, two wedge prisms (prisms that can change the optical path of incident light by providing non-parallel optical surfaces) 221, 222, one wedge prism 222, and the other wedge prism 221. On the other hand, it can be realized by the wedge prism moving mechanism 223 that moves linearly along the optical axis direction (Z-axis direction) of incident light. In this configuration, the path of incident light is greatly shifted as the separation distance between one wedge prism 222 and the other wedge prism 221 increases (or decreases). Therefore, by controlling the wedge prism moving mechanism 223 and adjusting the separation distance between the two wedge prisms 221 and 222, the incident light can be shifted by a necessary amount.

<2-3. Projection Optical System 23>
As described above, the light spatially modulated by the optical path correction unit 22 includes zero-order diffracted light L1, diffracted light of orders other than the zeroth order (specifically, ± first-order diffracted light, ± second-order diffracted light, and A relatively small amount of ± 3rd order or higher order diffracted light) L0 is included, and these are emitted along different directions. That is, the 0th-order diffracted light L1 is emitted in the −Z direction along the Z axis (see FIG. 7). The other diffracted light L0 is emitted in the −Z direction along an axis slightly inclined in the ± X direction from the Z axis (see FIG. 7). However, the diffracted light is emitted in a direction inclined at a larger angle with respect to the Z axis as the order increases. Here, the 0th-order diffracted light L1 is light that should be contributed to pattern drawing (hereinafter also referred to as “necessary light L1”), and the other diffracted light L0 is light that should not be contributed to pattern drawing (hereinafter referred to as “required light L1”). Unnecessary light L0 ”). The projection optical system 23 blocks the unnecessary light L0 and guides only the necessary light L1 to the surface of the substrate W to form an image on the surface.

  Specifically, the projection optical system 23 includes two blocking plates 231 and 232 and a plurality of optical components 233 to 238. Each of the shielding plates 231 and 232 is supported in a cantilevered state so as to be movable up and down on a support shaft 200 extending in the Z direction. Further, the optical components 233 to 238 are supported in a state of being accommodated in a predetermined posture in the accommodation member 201 (for example, a lens bracket) supported in a cantilevered state on the support shaft 200. However, in each housing member 201, for example, windows are formed on the upper surface and the lower surface so as not to hinder the progress of light passing through the optical component housed inside.

  Each of the blocking plates 231 and 232 is a member that blocks a part of incident light while blocking the rest, and is formed of a member that does not transmit light, and is a through hole that allows only a part of light to pass (for example, a circular hole). It is comprised by the plate-shaped member in which the through-hole) was formed. Each of the blocking plates 231 and 232 is arranged so that the necessary light L1 passes through the vicinity of the center of the through hole.

  Of the two blocking plates 231 and 232, the blocking plate (first blocking plate) 231 disposed on the + Z side is a high-order diffracted light (± second or higher order diffracted light) included in the unnecessary light L0. (± 3rd order or higher diffracted light). In other words, the first blocking plate 231 allows low-order diffracted light to pass through the through hole and blocks high-order diffracted light out of the light included in the incident light.

  On the other hand, the blocking plate (second blocking plate) 232 disposed on the −Z side of the first blocking plate 231 passes through the 0th-order diffracted light (necessary light) L1 among the low-order diffracted light that has passed through the first blocking plate 231. While passing through the hole 2320, other light (that is, unnecessary light (mainly ± first-order diffracted light and ± second-order diffracted light) not blocked by the first blocking plate 231) L0 is blocked.

  Among the optical components 233 to 238 included in the projection optical system 23, for example, the lens 234 and the lens 235 disposed between the first blocking plate 231 and the second blocking plate 232 widen the width of incident light ( It also functions as a zoom unit. In addition, the lens 236 disposed between the lenses 234 and 235 and the second blocking plate 232 constituting the zoom unit functions as a refractive lens that refracts diffracted light other than the 0th-order diffracted light (see FIG. 7). Further, the lens 238 disposed on the −Z side of the second blocking plate 232 has a function as an objective lens that forms an image of the incident light on the substrate W with a predetermined magnification. In the projection optical system 23, one or more optical components may be added to the above aspect, and one or more optical components may be omitted from the above aspect.

<2-4. Configuration related to blocking unnecessary light L0>
As described above, the head unit 144 blocks unnecessary light L0 (mainly ± first-order diffracted light and ± second-order diffracted light) while allowing the necessary light L1 out of the light that has passed through the first blocking plate 231. A second blocking plate 232 is provided. Here, the unnecessary light L0 to be blocked has a large light energy equivalent to that of the necessary light L1. Therefore, there is a possibility that the members arranged in the vicinity are affected by the light energy of the unnecessary light L0 blocked here.

  Therefore, the head unit 144 includes a cooling unit 41 and an irregular reflection surface 42 as a configuration for eliminating this thermal influence. The configuration of each of these units 41 and 42 will be described with reference to FIGS. FIG. 7 is a side sectional view schematically showing a part of the head portion 144. FIG. 8 is a plan view of the second blocking plate 232 as viewed from the upper surface side.

<Cooling unit 41>
The cooling unit 41 is a mechanism that cools the second blocking plate 232. The cooling unit 41 can be realized by, for example, a cooling pipe 411 embedded in a meandering state inside the second blocking plate 232 and a mechanism for circulating and moving the cooling water CL in the cooling pipe 411.

  A part of the unnecessary light L0 incident on the upper surface of the second blocking plate 232 is absorbed by the second blocking plate 232. Then, the second blocking plate 232 generates heat due to the absorbed light energy of the unnecessary light L0, and the cooling unit 41 cools the second blocking plate 232, so that the temperature rise of the second blocking plate 232 is suppressed. Become.

<Random reflection surface 42>
However, even if the temperature of the second blocking plate 232 is appropriately suppressed by the cooling unit 41, the peripheral components of the second blocking plate 232 (particularly, the components arranged on the + Z side of the second blocking plate 232) still remain. It was found that there was a thermal effect. When the inventor considered this cause, a part of the unnecessary light L0 is not absorbed by the second blocking plate 232 but is reflected on the upper surface thereof, and this reflected light has a thermal influence on the peripheral components. I found something. For example, even if the upper surface of the second blocking plate 232 is formed in black, a part of the unnecessary light L0 is still reflected on the upper surface without being absorbed by the second blocking plate 232, and heat is applied to the peripheral components. The influence will be exerted.

  Therefore, the inventor formed an irregular reflection surface 42 that irregularly reflects (diffusely reflects) incident light in an area portion (hereinafter referred to as “target area portion”) including an incident area of unnecessary light L0 in the second blocking plate 232. Then, it was confirmed that the thermal influence that could not be eliminated only by cooling the second blocking plate 232 was reliably eliminated. That is, in this configuration, a part of the unnecessary light L0 is absorbed by the second blocking plate 232, and the temperature rise of the second blocking plate 232 accompanying this is suppressed by the cooling unit 41, while the second blocking plate 232 Unnecessary unwanted light L0 that has not been absorbed is weakened by being irregularly reflected by the irregular reflection surface 42, thereby reliably eliminating the thermal influence of the unwanted light L0 on the peripheral components.

  The irregular reflection surface 42 is formed, for example, by subjecting the target region portion of the second blocking plate 232 to machining or the like to form an uneven shape. For example, the uneven shape may be a shape in which a plurality of convex portions 421 are arranged on lattice points of an orthogonal lattice. Each convex part 421 should just be made into square shape whose length of one side is about 1 mm by plane view, for example, and the height should be about 5 mm.

  However, as described above, the unnecessary light L0 is a linear line beam having a constant cross section of the light beam. Here, each of the lattice directions AR1 and AR2 of the orthogonal grating in which the plurality of convex portions 421 are arranged is preferably not parallel to the width direction AR3 of the unnecessary light L0 incident on the irregular reflection surface. In particular, the angle formed by the grating directions AR1 and AR2 and the width direction AR3 of the unnecessary light L0 is preferably about 45 °. If the plurality of convex portions 421 are arranged on lattice points of an orthogonal lattice whose lattice direction is not parallel to the width direction AR3 of the unnecessary light L0, a row of convex portions and a group of convex portions arranged in parallel therewith The extending direction of the groove formed between and the width direction AR3 of the unnecessary light L0 does not become parallel. Therefore, it is possible to reliably avoid a situation in which the irregular reflection effect is reduced because the unnecessary light L0 is incident along the groove. That is, the unwanted light L0 can be reliably diffused.

<3. Operation of Optical Unit 14>
The operation of the optical unit 14 will be described mainly with reference to FIG.

  When causing the optical unit 14 to perform a drawing operation, the control unit 18 drives the laser driving unit 141 to emit light from the laser oscillator 142 (FIG. 1). The emitted light is converted into a line beam by the illumination optical system 143 (FIG. 1) and enters the spatial light modulator 3 of the spatial light modulator 21 via the mirror 20. In the spatial light modulator 3, a plurality of spatial light modulation elements 31 (FIG. 4) are arranged side by side along the sub-scanning direction (X-axis direction), and incident light spatially crosses the linear light beam cross section. The light is incident on the plurality of spatial light modulation elements 31 arranged in a line so as to be along the arrangement direction of the light modulation elements 31.

  On the other hand, the control unit 18 gives an instruction to the driver circuit unit 32 (FIG. 4) based on the pattern data, and the driver circuit unit 32 applies a voltage to the designated spatial light modulation element 31. As a result, light individually spatially modulated by each spatial light modulator 31 is formed and emitted toward the substrate W. If the number of the spatial light modulation elements 31 included in the spatial light modulator 3 is “N”, the spatial light modulator 3 emits spatially modulated light for N pixels along the sub-scanning direction. Become.

  The light spatially modulated by the spatial light modulator 3 is incident on the projection optical system 23 after the optical path is corrected by the optical path correction unit 22 as necessary.

  The light incident on the projection optical system 23 first enters the first blocking plate 231. The first blocking plate 231 allows low-order diffracted light to pass through while blocking high-order diffracted light among the light included in the incident light.

  The light that has passed through the first blocking plate 231 passes through the lens 233, and is further expanded (or narrowed) as necessary by the lens 234 and the lens 235, and then enters the refractive lens 236. To do. In the refractive lens 236, the unnecessary light L0 is refracted in a direction (+ X direction or −X direction) away from the necessary light L1 (FIG. 7).

  The light that has passed through the refractive lens 236 then enters the second blocking plate 232. As shown in FIGS. 7 and 8, the second blocking plate 232 allows only the necessary light L1 out of the light included in the incident light to pass through the through hole 2320 and blocks the unnecessary light L0. Specifically, the unnecessary light L <b> 0 is incident on the upper surface of the second blocking plate 232 and in a region where the through hole 2320 is not formed, and a part thereof is absorbed by the second blocking plate 232. Here, the second blocking plate 232 is cooled by the cooling unit 41. For this reason, the temperature rise of the 2nd shielding board 232 accompanying absorbing a part of unnecessary light L0 is suppressed. Therefore, the peripheral member is not thermally affected by the temperature rise of the second blocking plate 232. On the other hand, the unnecessary light L0 that has not been absorbed by the second blocking plate 232 is diffusely reflected by the irregular reflection surface 42 and weakened. For this reason, peripheral parts are not thermally affected by the unnecessary light L0 that is not absorbed by the second blocking plate 232.

  The necessary light L1 that has passed through the second blocking plate 232 passes through the lens 237, and is further imaged on the surface of the substrate W at a magnification determined by the objective lens 238.

  As will be described later, the optical unit 14 continuously irradiates N-pixel spatially modulated light along the sub-scanning direction (that is, repeatedly projects pulsed light on the surface of the substrate W). ) And move relative to the substrate W along the main scanning direction (Y-axis direction). Therefore, when the optical unit 14 crosses the substrate W once along the main scanning direction, one pattern group having a width of N pixels along the sub-scanning direction is drawn on the surface of the substrate W. Become. One pattern drawing area having a width corresponding to N pixels is also referred to as “one stripe area” in the following description.

<4. Operation of the drawing apparatus 1>
The operation of the drawing apparatus 1 will be described with reference to FIG. FIG. 9 is a diagram illustrating a flow of operation of the drawing apparatus 1.

  When the transport device 16 carries in the substrate W to be processed and places it on the stage 11, a series of processing for the substrate W is started (step S1).

  First, the alignment mark formed on the substrate W is imaged (step S2). Specifically, the stage moving mechanism 12 moves the stage 11 in accordance with an instruction from the control unit 18 to move the substrate W relative to the alignment unit 15, and below the alignment unit 15, The substrate W is moved so that a predetermined position (alignment mark formation position) of the substrate W is placed. When the substrate W is moved to the target position, the alignment unit 15 images the surface of the substrate W in accordance with an instruction from the control unit 18. Thereby, imaging data of the alignment mark is obtained. This operation is repeated a predetermined number of times, thereby obtaining each imaging data of the alignment marks respectively formed at different positions on the substrate W. The alignment mark is, for example, a mark portion used for alignment in the front-rear direction of the substrate W (long mark portion along the front-rear direction of the substrate W) and a mark portion used for alignment of the substrate W in the left-right direction. (A long mark portion along the inspection direction of the substrate W) and a cross mark.

  Subsequently, the position of the stage 11 is adjusted (step S3). In this process, the control unit 18 first specifies the position and orientation of the substrate W relative to the stage 11 based on the plurality of imaging data obtained in step S2. When the position and orientation of the substrate W with respect to the stage 11 are specified, the control unit 18 controls the stage position measurement unit 13 and the stage moving mechanism 12 to adjust the position of the stage 11. Specifically, the position of the stage 11 is adjusted so that the substrate W placed on the stage 11 has a position and orientation determined with respect to each optical unit 14. Note that the processing in step S3 may be handled by correcting the pattern data so that the position of the substrate W with respect to each optical unit 14 is adjusted. That is, the process of step S3 may be performed by correcting the pattern data instead of adjusting the position of the stage 11.

  Subsequently, pattern data correction processing is performed (step S4). In this process, the control unit 18 first detects the position of the alignment mark from the plurality of imaging data obtained in step S2. Then, the width of deviation from the ideal position of the detection position (the position of the alignment mark to be detected when the substrate W is not deformed) is detected as the amount of deviation. If the substrate W is deformed (changes in shape such as distortion, contraction / expansion), this is detected as a deviation amount. When the substrate W is deformed, the position of the base pattern formed on the deformed substrate W is also predicted to be shifted by the detected displacement amount. Therefore, the control unit 18 corrects the pattern data so as to match the predicted background pattern formation position. That is, the pattern described in the pattern data is deformed in the same manner as the substrate W by correcting the pattern described in the pattern data so as to be shifted by the detected deviation amount. This process may be performed in parallel with the process of step S3.

  When the processes in steps S3 and S4 are completed, a pattern drawing process on the substrate W is performed based on the corrected pattern data obtained in step S4 (step S5). The process of step S5 will be described with reference to FIG. FIG. 10 is a diagram for explaining the drawing process.

  In the pattern drawing process on the substrate W, the control unit 18 controls the stage moving mechanism 12 to move the substrate W placed on the stage 11 relative to the optical units 14, 14. , 14 is applied by irradiating the upper surface of the substrate W with spatially modulated light.

  Specifically, the stage moving mechanism 12 moves the stage 11 along the main scanning direction (+ Y-axis direction) in accordance with an instruction from the control unit 18 to move the substrate W relative to the optical units 14 and 14. Are moved relatively along the main scanning direction (arrow AR11) (main scanning). While the substrate W is relatively moved along the main scanning direction, each optical unit 14 receives the corrected pattern data (specifically, rasterized corrected data in accordance with an instruction from the control unit 18. The light on which the spatial modulation according to the pattern data) is formed (specifically, the light subjected to spatial modulation for N pixels along the sub-scanning direction) is continuously emitted toward the substrate W (that is, Continue to project pulsed light repeatedly on the surface of the substrate W). That is, each optical unit 14 is relatively irradiated with respect to the substrate W along the main scanning direction (Y-axis direction) while continuously irradiating the spatially modulated light of N pixels along the sub-scanning direction. Moving. Therefore, when the optical unit 14 crosses the substrate W once along the main scanning direction, one pattern group having a width of N pixels along the sub-scanning direction is drawn on the surface of the substrate W. Become. Here, since the two optical units 14 simultaneously traverse the substrate W, two pattern groups are drawn by one main scanning.

  When one main scan is completed, the stage moving mechanism 12 moves the stage 11 in the reverse direction (−Y-axis direction) along the main scan direction to move the substrate W to the original position (main scan start position). (Arrow AR12). Further, the stage moving mechanism 12 moves the stage 11 along the sub-scanning direction (X-axis direction) by a distance corresponding to the width of one stripe, thereby sub-inspecting the substrate W with respect to the optical units 14 and 14. Move relatively along the direction (arrow AR13) (sub-scan).

  When the sub-scanning is completed, the main scanning is performed again (arrow AR14). Also here, each optical unit 14 continues to irradiate the substrate W intermittently with light on which spatial modulation according to the corrected pattern data is formed in accordance with an instruction from the control unit 18. As a result, an area for one stripe is drawn next to the drawing area for one stripe drawn in the previous main scanning. Thereafter, similarly, main scanning and sub-scanning are repeated, and when a pattern is drawn on the entire surface of the substrate W, the drawing process ends.

  Refer to FIG. 9 again. When the pattern drawing process on the substrate W is completed, the transfer device 16 unloads the processed substrate W, and a series of processes on the substrate W is completed (step S6).

<5. Effect>
According to the above embodiment, a part of the unnecessary light L0 that does not contribute to the drawing reflected by the spatial light modulator 21 is absorbed by the second blocking plate 232, and the temperature rise of the second blocking plate 232 accompanying this is cooled. It is suppressed by the part 41. On the other hand, the remaining light that has not been absorbed by the second blocking plate 232 is weakened by being irregularly reflected by the irregular reflection surface 42. Therefore, the thermal influence which the unnecessary light L0 gives to the member in the head part 144 can be excluded reliably, and the situation that the member in the head part 144 deforms due to the thermal influence is surely avoided. As a result, the drawing accuracy is not lowered and high drawing accuracy can be ensured.

  In addition, according to the above embodiment, the irregular reflection surface 42 is formed integrally with the second blocking plate 232, so that the temperature rise of the irregular reflection surface 42 is also suppressed by cooling the second blocking plate 232 by the cooling unit 41. Is done. Moreover, since a part of 2nd interruption | blocking board 232 is uneven | corrugated shape, the heat dissipation of the 2nd interruption | blocking board 232 increases and it becomes difficult to heat up.

  Further, by arranging the plurality of convex portions 421 on the irregular reflection surface 42 along a direction non-parallel to the extending direction of the unnecessary light L0, the irregular reflection surface 42 can reliably diffuse the unnecessary light L0.

<II. Second Embodiment>
<1. Configuration>
A drawing apparatus 1a according to the second embodiment will be described. In the drawing apparatus 1a, similarly to the drawing apparatus 1 according to the first embodiment, the irregular reflection surface 42a is formed on the second blocking plate 232a provided in the head portion 144a. Here, the drawing apparatus 1a is different from the drawing apparatus 1 according to the first embodiment in the formation mode of the irregular reflection surface 42a.

  The formation mode of the irregular reflection surface 42a in the drawing apparatus 1a will be described with reference to FIGS. FIG. 11 is a side sectional view schematically showing a part of the head portion 144a. FIG. 12 is a plan view of the second blocking plate 232a included in the head portion 144a as viewed from the upper surface side. In the following, the description of the same configuration as that of the drawing apparatus 1 according to the first embodiment is omitted and the same reference numerals are given.

  In this embodiment, the irregular reflection surface 42a is formed by placing the irregular reflection member 5 having a concavo-convex shape on the upper surface in a target region portion of the second blocking plate 232a. Specifically, the irregular reflection member 5 includes a base material 51 having substantially the same size as the target region portion in plan view, and a plurality of convex portions 52 erected on the upper surface of the base material 51. Here, the plurality of convex portions 52 may be arranged on lattice points of an orthogonal lattice, for example. In this case, it is preferable that each of the lattice directions AR1 and AR2 of the orthogonal lattice in which the plurality of convex portions 52 are arranged is not parallel to the width direction AR3 of the unnecessary light L0 incident on the irregular reflection surface 42a.

  Moreover, it is preferable that the irregular reflection member 5 is formed of a member having higher thermal conductivity than the second blocking plate 232a. If the irregular reflection member 5 is formed of a member having higher thermal conductivity than the second blocking plate 232a, the temperature rise of the irregular reflection member 5 is suppressed.

<2. Effect>
According to this embodiment, the irregular reflection surface 42a is formed by the irregular reflection member 5 separate from the second blocking plate 232a, so that the irregular reflection member 5 can be exchanged independently of the second blocking plate 232a.

<III. Third Embodiment>
<1. Configuration>
A drawing apparatus 1b according to the third embodiment will be described. The drawing apparatus 1b includes a cover unit 43 in addition to the same configuration as the drawing apparatus 1 according to the first embodiment.

  The cover 43 provided in the drawing apparatus 1b will be described with reference to FIG. FIG. 13 is a side view schematically showing a part of the head portion 144b included in the drawing apparatus 1b. In the following, the description of the same configuration as that of the drawing apparatus 1 according to the first embodiment is omitted and the same reference numerals are given.

  In addition to the cooling unit 41 and the irregular reflection surface 42, the head unit 144b is configured to eliminate the thermal influence received by the members disposed around by the light energy of the unnecessary light L0 blocked by the second blocking plate 232, A cover part 43 is provided.

  The cover 43 is disposed between the second blocking plate 232 and a member disposed above the cover plate 232 (here, the housing member 201 of the refractive lens 236), and the light irregularly reflected by the irregular reflection surface 42 is accommodated in the housing member 201. To prevent it from entering. Specifically, the cover portion 43 is formed of a member that does not transmit light, and is formed in a box shape in which an upper surface that accommodates the accommodating member 201 in an nested manner is opened. However, a through hole 430 is formed at the bottom of the cover 43 so as not to hinder the progress of light that has passed through the refractive lens 236.

  When the drawing operation is executed by the optical unit 14, the light that has not been absorbed by the second blocking plate 232 among the unnecessary light L0 incident on the second blocking plate 232 is diffusely reflected by the irregular reflection surface 42 as described above. . In this embodiment, the cover portion 43 blocks the unnecessary light L0 diffusely reflected by the irregular reflection surface 42 so as not to enter the accommodation member 201. Accordingly, a part of the weak diffused light weakened by the irregular reflection surface 42 does not easily reach the housing member 201 disposed above the second blocking plate 232.

<2. Effect>
In this embodiment, the provision of the cover 43 makes it difficult for some of the weak light irregularly reflected by the irregular reflection surface 42 to enter the housing member 201. Therefore, the slight thermal influence which the unnecessary light L0 gives to the accommodation member 201 can be excluded reliably. As a result, the housing member 201 is not deformed even under slight influence by thermal influence, and it is possible to ensure high drawing accuracy.

<IV. Modification>
In each of the above embodiments, the first blocking plate 231 may be provided with a mechanism for cooling the first blocking plate 231, and an irregular reflection surface may be disposed in a region including the incident region of high-order diffracted light on the upper surface. As a mechanism for cooling the first blocking plate 231, the same configuration as the cooling unit 41 described above can be employed. Moreover, as an aspect which forms an irregular reflection surface in the 1st shielding board 231, the same thing as the aspect which forms the irregular reflection surfaces 42 and 42a in the 2nd shielding board 232,232a is employable. However, the amount of high-order diffracted light of ± 3 or more included in the unnecessary light L0 incident on the projection optical system 23 is relatively small. That is, the energy of light to be blocked by the first blocking plate 231 is not as great as the energy of light to be blocked by the second blocking plate 232. For this reason, the thermal influence which the light interrupted by the 1st shielding board 231 has on a peripheral member is comparatively small. Therefore, it is possible to omit the formation of the irregular reflection surface as a configuration in which only the cooling unit is provided on the first blocking plate 231. If the irregular reflection surface is formed on the first blocking plate 231, an advantage that the optical influence of the light reflected by the first blocking plate 231 on the spatial light modulator 21 can be obtained.

  Further, in each of the embodiments described above, the irregular reflection surfaces 42 and 42a have a concavo-convex shape in which a plurality of convex portions 421 and 52 are arranged on lattice points of an orthogonal lattice. However, the mode in which the plurality of convex portions are arranged is not necessarily limited. This is not a limitation. For example, the concavo-convex shape may be formed by arranging a plurality of convex portions on lattice points of a non-orthogonal lattice. However, also in this case, it is preferable that each of the lattice directions of the non-orthogonal lattice in which the plurality of convex portions are arranged is not parallel to the width direction of the unnecessary light L0 incident on the irregular reflection surface. Moreover, you may form an uneven | corrugated shape by arranging a some convex part aperiodically. In addition, the irregular reflection surfaces 42 and 42a are not necessarily formed by an uneven shape in which a plurality of convex portions are arranged. For example, the target area portion of the second blocking plate 232 (or the upper surface of the irregular reflection member 5) is roughened or formed into a non-flat shape by forming a plurality of grooves, thereby forming the irregular reflection surface. You can also.

  In the third embodiment, the cover portion 43 is formed in a box shape with the upper surface opened, but the shape of the cover portion 43 is not necessarily limited thereto. For example, the plate shape which abbreviate | omitted the side wall which covers the side surface of the accommodating member 201 may be sufficient.

  In each of the above embodiments, the spatial light modulator 3 is a GLV that is a diffraction grating type spatial light modulator in which a fixed ribbon 302 and a movable ribbon 301 that are modulation units are arranged one-dimensionally. However, it is not limited to such a form. For example, not only GLV but a form using a spatial light modulator in which modulation units such as mirrors are arranged one-dimensionally may be used. For example, a spatial light modulator in which micromirrors that are modulation units, such as DMD (Digital Micromirror Device: registered trademark of Texas Instruments), are two-dimensionally arranged may be used.

  In each of the above embodiments, the substrate W is moved by the stage moving mechanism 12 so that the light emitted from the optical units 14 and 14 and the substrate are relatively moved. The mode of moving the substrate W relative to the 14, 14 is not limited to this. For example, the optical units 14 and 14 may be moved along the main scanning direction and the sub-scanning direction to relatively move the light emitted from the optical units 14 and 14 and the substrate W.

  Further, in each of the above embodiments, the substrate W is circular, but the substrate W is not necessarily circular, and may be rectangular, for example.

1, 1a, 1b Drawing device 14 Optical unit 142 Laser oscillator 144, 144a, 144b Head unit 21 Spatial light modulation unit 23 Projection optical system 231 First blocking plate 232, 232a Second blocking plate 41 Cooling unit 42, 42a Diffuse reflection surface 421 , 52 Convex part 43 Cover part 5 Diffuse reflection member W Substrate

Claims (12)

A drawing device for drawing a pattern on the substrate by irradiating the substrate with light from an optical unit,
The optical unit is
A light source;
A spatial light modulator that spatially modulates light from the light source to reflect required light that contributes to pattern drawing and unnecessary light that does not contribute to pattern drawing in different directions;
A blocking plate that is disposed between the spatial light modulator and the substrate and blocks the unnecessary light while allowing the necessary light to pass through;
A cooling unit for cooling the blocking plate;
An irregular reflection surface that is formed in a target area portion including an incident area of the unnecessary light in the blocking plate, and diffusely reflects incident light;
A drawing apparatus comprising: The drawing apparatus according to claim 1,
The drawing apparatus in which the irregular reflection surface is formed by forming the target area portion of the blocking plate into an uneven shape. The drawing apparatus according to claim 1,
The optical unit is
An irregular reflection member having an uneven shape on the upper surface,
With
The drawing apparatus, wherein the irregular reflection surface is formed by placing the irregular reflection member on the target area portion of the blocking plate. The drawing apparatus according to claim 3,
The irregular reflection member is
A drawing apparatus formed of a member having higher thermal conductivity than the blocking plate. The drawing apparatus according to any one of claims 2 to 4,
The concavo-convex shape is a shape in which a plurality of convex portions are arranged on lattice points,
Drawing in which the unnecessary light is a linear line beam having a constant cross section of light flux, and the width direction of the unnecessary light incident on the irregular reflection surface and the lattice direction of the plurality of convex portions are non-parallel. apparatus. The drawing apparatus according to any one of claims 1 to 5,
A cover member that is disposed between the blocking plate and a target member that is disposed between the blocking plate and the spatial light modulator, and blocks the light diffusely reflected by the irregular reflection surface from entering the target member. ,
A drawing apparatus comprising: A drawing method for irradiating a substrate with light and drawing a pattern on the substrate,
a) a step of spatially modulating light emitted from a light source by a spatial light modulation unit to reflect necessary light that contributes to pattern drawing and unnecessary light that does not contribute to pattern drawing in different directions; ,
b) a step of blocking the unnecessary light while allowing the necessary light to pass through a blocking plate disposed between the spatial light modulator and the substrate;
c) cooling the blocking plate;
With
In the step b), a part of the unnecessary light is absorbed by the blocking plate, and the rest is diffusely reflected by an irregular reflection surface formed in a target region portion including the incident region of the unnecessary light on the blocking plate. . The drawing method according to claim 7, wherein
The drawing method in which the irregular reflection surface is formed by forming the target region portion of the blocking plate into an uneven shape. The drawing method according to claim 7, wherein
The drawing method, wherein the irregular reflection surface is formed by placing an irregular reflection member having an uneven shape on an upper surface in the target region portion of the blocking plate. The drawing method according to claim 9, wherein
The irregular reflection member is
A drawing method formed by a member having higher thermal conductivity than the blocking plate. A drawing method according to any one of claims 8 to 10,
The concavo-convex shape is a shape in which a plurality of convex portions are arranged on lattice points,
Drawing in which the unnecessary light is a linear line beam having a constant cross section of light flux, and the width direction of the unnecessary light incident on the irregular reflection surface and the lattice direction of the plurality of convex portions are non-parallel. Method. The drawing method according to any one of claims 7 to 11,
d) In the step b), the step of blocking the unnecessary light irregularly reflected by the irregular reflection surface so as not to enter the target member disposed between the irregular reflection surface and the spatial light modulator,
A drawing method comprising:

Images