JP5811788B2 - Directional coupler - Google Patents

Description

  The present invention relates to a directional coupler.

  The following documents are disclosed as related to the directional coupler.

  Patent Document 1 relates to a substrate manufactured using a prepreg and a method for manufacturing a laminated electronic component manufactured using the substrate. An object of the present invention is to provide a laminated electronic component or the like that has a high strength of fixing a conductor to a base material, is excellent in high-frequency characteristics, and can be obtained by a relatively simple process. The present invention forms a coupling agent layer having a functional group formed on a substrate made of a resin or a material obtained by mixing a functional material powder in a resin, and a conductor layer formed by plating on the base. The main technical feature is that the surface roughness between the material and the conductor layer is 3 μm or less.

  Patent Document 2 relates to a coupled line type directional coupler mainly used in a microwave band and a millimeter wave band. The object of the present invention is to prevent the problem of characteristic variations due to manufacturing variations and the like, ensure high power durability, and reduce manufacturing costs. The present invention includes a multilayer dielectric substrate formed by laminating a plurality of dielectric substrates, two coupling portion line patterns arranged in close proximity to the center of the surface of the multilayer dielectric substrate, and a multilayer Four input / output line patterns arranged at the end of the surface of the dielectric substrate and respectively connected to the longitudinal ends of the two coupling portion line patterns, and a first provided in the inner layer of the multilayer dielectric substrate An inner layer ground conductor pattern, a back surface ground conductor pattern provided on the back surface of the multilayer dielectric substrate, and a plurality of conductor pillars connecting the first inner layer ground conductor pattern and the back surface ground conductor pattern. The ground conductor pattern has a hole wider than a region provided in a position corresponding to the stacking direction in a region where the two coupling portion line patterns exist, and the plurality of conductor pillars are formed of the first inner layer ground conductor pattern. The main thing that is provided around the hole And operative features.

  Patent Document 3 relates to a directional coupler, and more particularly, to an inverted Δβ directional coupler used in an optical switch or an optical modulator. An object of the present invention is to reduce the driving voltage, to allow a traveling wave electrode to be designed relatively freely, and to enable high-speed operation. According to the present invention, in the action portion of the optical waveguide where the electric field of the control electrode acts, the center line of the pair of optical waveguides is a boundary, and the polarization direction of the substrate is different on the left and right of the center line and the longitudinal direction along the optical waveguide The main technical feature is that one or a plurality of transverse lines crossing the center line is used as a boundary so that the action part is divided into a plurality of regions, and the polarization direction of the substrate is different before and after the transverse line.

  Patent Document 4 relates to a directional coupler. An object of the present invention is to prevent an increase in cost and reduce the possibility of a failure occurring in a bridge between coupled lines. The present invention is to connect a strip-shaped derivative substrate having an appropriate height, width and length to a microstrip line formed on the upper surface of a general substrate, not on a thin film substrate, and having a conductor pattern formed on both side surfaces. Main technical features.

  Patent Document 5 relates to a directional coupler configured by a microstrip line. An object of the present invention is to easily and surely obtain a coupling amount as designed with a simple configuration. The present invention includes a pair of coupling portions that capacitively couple a part of the main signal by arranging a conductor via a dielectric on the main line, and a coupling portion connection line that connects the coupling portions. Main technical features.

  Patent Document 6 relates to a directional coupler. In the present invention, the substrate is inserted into the coaxial line, the main line is the central conductor of the coaxial line, and the ground electrode is connected to the coupled line portion over the range including the entire line width of the coupled line portion through the substrate. The main technical feature is that it is composed of a portion that is opposed to the substrate, and a portion that is cut out in a range including the entire line width of the coupled line portion from the edge of the substrate in the line width direction of the coupled line portion. To do. As a result, it is possible to obtain the directivity necessary for monitoring the transmission power, and it is claimed that the change in directivity due to the positional deviation between the line portion and the ground electrode at the time of electrode pattern formation can be reduced. ing.

JP 2004-363553 A JP 2010-258659 A JP 2011-075928 A JP-A 62-104202 JP 09-055608 A Japanese Patent No. 4103927

  18 to 23 are for explaining the problems of the conventional directional coupler. FIG. 18 shows a first example of a general directional coupler. 19 is a cross-sectional view taken along the line XIX-XIX in FIG. The directional coupler 101 according to this example includes a main line 103 and a sub line 104 formed on the surface of one substrate 102. The main line 103 connects the input port 111 and the output port 112. The sub line 104 connects the isolation port 113 and the coupling port 114. The main line 103 and the sub line 104 have proximity portions 121 and 122, respectively. Both proximity parts 121 and 122 are formed so as to be close to each other in parallel at a predetermined interval. With this configuration, when a signal is input from the input port 111 and output from the output port 112, the main line 3 and the sub line 4 are electromagnetically connected via the proximity portions 121 and 122.

  The coupling amount (attenuation amount) in the electromagnetic field connection is determined by the length / width of the proximity portion 122 of the sub line 4, the distance between the proximity portions 121 and 122, and the like. Therefore, in order to obtain desired electrical characteristics, the length of the proximity portion 122 and the like must be designed to meet predetermined conditions. However, such a design may be difficult due to restrictions such as the area of the substrate 2. In particular, when both the main line 3 and the sub line 4 are formed on one substrate 102 as in the present example, such difficulties are often encountered.

  FIG. 20 shows the electrical characteristics of the directional coupler 101. In the figure, a solid line X1 indicates the relationship between the frequency of the signal input from the input port 111 and output from the output port 112 and the attenuation. An alternate long and short dash line Y1 indicates the relationship between the frequency of the signal input from the input port 111 and output from the isolation port 113 and the attenuation. A broken line Z1 indicates the relationship between the frequency of the signal input from the input port 111 and output from the coupling port 114 and the attenuation.

  The amount of coupling indicated by the one-dot chain line Y1 and the broken line Z1 can be increased by measures such as increasing the length of the proximity portion 122 and reducing the distance between the proximity portions 121 and 122. However, when such a treatment cannot be performed due to restrictions on the substrate 2, the amount of coupling cannot be increased to a desired level.

  FIG. 21 shows a second example of a general directional coupler. 22 is a cross-sectional view taken along the line XXII-XXII in FIG. The directional coupler 201 according to this example has another layer structure. The electromagnetic connection between the main line and the sub-line is formed in the land pattern 203 formed on the surface of the substrate 202, the via 204 connected to the land pattern 203 and drilled from the surface of the substrate 202, and the substrate 202. This is done through an internal pattern 205 connected to the via 204.

  According to such a configuration, the shape of the internal pattern 205 can be adjusted regardless of restrictions on the surface of the substrate 202. However, when such another layer structure is adopted, in addition to problems such as an increase in manufacturing cost, a problem of performance deterioration occurs.

  FIG. 23 shows the electrical characteristics of the directional coupler 201. In the figure, a solid line X2 indicates the relationship between the frequency of the signal input from the input port 211 and output from the output port 212 and the attenuation. An alternate long and short dash line Y2 indicates the relationship between the frequency of the signal input from the input port 211 and output from the isolation port 213 and the attenuation. A broken line Z2 indicates the relationship between the frequency of the signal input from the input port 211 and output from the coupling port 214 and the attenuation.

  As shown in FIG. 23, according to the configuration of this example, the pass characteristic (X2), the isolation characteristic (Y2), and the coupling characteristic (Z2) are greatly deteriorated as the frequency increases. The reason is considered that it is necessary to pass through the via 204.

  Accordingly, an object of the present invention is to improve the degree of freedom of design for obtaining desired electrical characteristics without causing an increase in cost, performance degradation, or the like.

  According to one aspect of the present invention, a main line that connects an input port and an output port formed on a surface of a substrate, and a main part and an electromagnetic field via a proximity part that is close to the main line with a predetermined interval therebetween A sub-line to be connected, and the main line is provided with a three-dimensional conductive part in which a part of a conductive part connecting the input port and the output port is raised from the surface, and the three-dimensional conductive part and the proximity Is a directional coupler that establishes the electromagnetic field connection.

  According to the present invention, the degree of freedom of design on a substrate can be greatly improved without causing an increase in cost, performance degradation, or the like. Thereby, it becomes easy to realize a design for obtaining desired electrical characteristics.

It is a top view which shows the structure of the directional coupler which concerns on the 1st Embodiment of this invention, and a 1st mounting example. It is II-II sectional drawing of FIG. 6 is a graph showing electrical characteristics of the directional coupler according to the first mounting example of the first embodiment. It is sectional drawing of the part corresponded to the II-II line which shows the 2nd mounting example of the directional coupler which concerns on 1st Embodiment. 6 is a graph showing electrical characteristics of a directional coupler according to a second implementation example of the first embodiment. It is sectional drawing of the part corresponded to the II-II line which shows the 3rd mounting example of the directional coupler which concerns on Embodiment 1. FIG. It is sectional drawing of the part corresponded to the II-II line which shows the 4th example of implementation of the directional coupler which concerns on Embodiment 1. FIG. It is a graph which shows the change of the passage characteristic accompanying the change of coupling amount (attenuation amount). It is a graph which shows the change of the isolation characteristic accompanying the change of the amount of bonds. It is a graph which shows the change of the coupling characteristic accompanying the change of the amount of coupling | bonding. It is a top view which shows the structure of the directional coupler which concerns on Embodiment 2 of this invention, and a 1st mounting example. FIG. 10 is a top view showing a second implementation example of the directional coupler according to Embodiment 2. It is a top view which shows the state except the three-dimensionally conductive part of the directional coupler which concerns on Embodiment 2. FIG. It is sectional drawing of the part corresponded to the II-II line | wire which shows the structure and mounting example of the directional coupler which concerns on Embodiment 3 of this invention. It is sectional drawing of the part corresponded to the II-II line | wire which shows the structure and mounting example of the directional coupler which concerns on Embodiment 4 of this invention. It is a top view which shows the structure and mounting example of the directional coupler which concerns on Embodiment 5 of this invention. It is XVII-XVII sectional drawing of FIG. It is a top view which shows the structure of the 1st example of a general directional coupler. It is XIX-XIX sectional drawing of FIG. It is a graph which shows the electrical property in the 1st example of a general directional coupler. It is a top view which shows the structure of the 2nd example of a general directional coupler. It is XXII-XXII sectional drawing of FIG. It is a graph which shows the electrical property in the 2nd example of a general directional coupler.

Embodiment 1
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a configuration of the directional coupler 1 according to the first embodiment and a first mounting example. 2 is a cross-sectional view taken along the line II-II in FIG.

  The directional coupler 1 includes a substrate 2, a main line 3, and a sub line 4.

  The substrate 2 is made of a dielectric 5, a main line 3 and a sub line 4 are formed on the front surface, and a ground pattern 6 is formed on the back surface.

  The main line 3 is a conductive portion that connects the input port 11 and the output port 12 formed on the surface of the substrate 2. The main line 3 includes a substrate conductive portion 20 formed directly on the surface of the substrate 2 and a three-dimensional conductive portion 21 formed so as to protrude from the surface of the substrate 2.

  The three-dimensional conductive portion 21 includes a chip member 25, a connection terminal 26, and solder 27. The chip member 25 is made of a rectangular parallelepiped dielectric 30, and a conductive pattern 31 is formed on one of the upper and lower surfaces of the dielectric 30 (the upper surface in the present embodiment).

  The connection terminal 26 is a conductive member, and is interposed between the conductive pattern 31 and the solder 27. The solder 27 is interposed between the board conductive portion 20 and the connection terminal 26, and holds the chip member 25 and the connection terminal 26 in a state of being spaced upward from the surface of the board 2. A space is formed between the lower portion of the chip member 25 and the surface of the substrate 2.

  The sub line 4 is a conductive portion that connects the isolation port 13 and the coupling port 14 formed on the surface of the substrate 2. The sub line 4 has a proximity portion 35 that is close to the main line 3. The proximity portion 35 is formed so as to sink into the lower portion of the chip member 25 on the surface of the substrate 2. As a result, the conductive pattern 31 and the proximity portion 35 are arranged close to each other at a predetermined interval, and the main line 3 and the sub line 4 are electromagnetically connected via the conductive pattern 31 and the proximity portion 35.

  With the above configuration, the high frequency signal input from the input port 11 is output from the output port 12 via the conductive pattern 31 of the chip member 25. The connection from the input port 11 to the isolation port 13 is performed via the chip member 25. At this time, it is preferable to design the length of the proximity portion 35 below the chip member 25 to be λ / 4 of the frequency of the signal to be handled.

  FIG. 3 shows the electrical characteristics of the directional coupler 1. The vertical axis represents attenuation, and the horizontal axis represents frequency. In the figure, a solid line A indicates a passing characteristic of a signal input from the input port 11 and output from the output port 12, and an alternate long and short dash line B indicates an isolator of the signal input from the input port 11 and output from the isolation port 13. The broken line C indicates the coupling characteristic of a signal that is input from the input port 11 and output from the coupling port 14.

  According to the above configuration, the electromagnetic field connection is established by the conductive pattern 31 of the three-dimensional conductive portion 21 of the main line 3 and the proximity portion 35 of the sub line 4. The electrical characteristics of the directional coupler 1 are determined by the length and width of the proximity portion 35, the distance between the proximity portion 35 and the conductive pattern 31, and the like. When an electromagnetic field connection between the main line and the sub line is to be established only on one substrate 2 as in the prior art, the conditions for obtaining desired electrical characteristics must be satisfied due to restrictions such as the area of the substrate 2 There are many cases where this is not possible. However, if the three-dimensional conductive part 21 as in the present embodiment is employed, the lower part of the three-dimensional conductive part 21 can also be used as a part for disposing the proximity part 35, and desired electrical characteristics can be obtained. The degree of freedom of design for obtaining is improved. In the present embodiment, only a part of the main line 3 involved in the electromagnetic field connection, that is, the part of the conductive pattern 31 has a three-dimensional shape. Therefore, compared to the conventional case where the entire substrate is made of another layer structure, it is possible to suppress an increase in cost, an increase in product size, and the like, and performance deterioration due to vias does not occur.

  FIG. 4 shows a second implementation example of the directional coupler 1. The chip member 25 in this mounting example is disposed so that the conductive pattern 31 faces the surface of the substrate 2. Thereby, the space | interval of the conductive pattern 31 and the proximity part 35 becomes small, and the coupling | bonding amount of the main line 3 and the subline 4 becomes large.

  FIG. 5 shows electrical characteristics in the mounting example shown in FIG. An alternate long and short dash line B1 indicates the isolation characteristic according to FIG. 4, and an alternate long and short dash line B indicates the isolation characteristic according to FIG. A broken line C1 indicates the coupling characteristic according to FIG. 4, and a broken line C indicates the coupling characteristic according to FIG. The coupling amount between both lines B1 and C1 according to FIG. 4 is larger than the coupling amount between both lines B and C according to FIG.

  As described above, the amount of coupling between the main line 3 and the sub-line 4 can be changed only by reversing the direction of the chip member 25 up and down, so that the design of the components of the directional coupler 1 is not changed. The amount of coupling can be adjusted.

  FIG. 6 shows a third implementation example of the directional coupler 1. In this mounting example, the amount of solder 27A is larger than that in the first mounting example (FIG. 1). Therefore, the position of the chip member 25 is high, and the interval between the conductive pattern 31 and the proximity portion 35 is large. Thereby, compared with the 1st mounting example, the coupling | bonding amount of the main line 3 and the subline 4 becomes small.

  FIG. 7 shows a fourth implementation example of the directional coupler 1. In this mounting example, the amount of solder 27B is smaller than that in the second mounting example (FIG. 4). Therefore, the position of the chip member 25 is low, and the distance between the conductive pattern 31 and the proximity portion 35 is small. Thereby, compared with the 2nd mounting example, the coupling | bonding amount of the main line 3 and the subline 4 becomes large.

  FIG. 8 shows a change in the passage characteristic accompanying a change in the coupling amount. FIG. 9 shows changes in the isolation characteristics accompanying changes in the amount of binding. FIG. 10 shows a change in coupling characteristics accompanying a change in the amount of coupling.

  By reducing the amount of the solder 27, the amount of coupling increases. Along with this, as shown in FIG. 8, the coupling amount of the pass characteristic decreases as a whole, and as shown in FIGS. 9 and 10, the coupling amount of the isolation characteristic and the coupling characteristic increases as a whole.

  As described above, the amount of coupling between the main line 3 and the sub-line 4 can be changed only by adjusting the amount of the solder 27. Therefore, the amount of coupling can be changed without changing the design of the components of the directional coupler 1. Can be adjusted.

Embodiment 2
Hereinafter, although other embodiments of the present invention will be described, the same reference numerals are given to the portions having the same or similar effects as those of the first embodiment, and the description thereof will be omitted. FIG. 11 shows a configuration of the directional coupler 51 according to the second embodiment and a first implementation example. FIG. 12 shows a configuration of the directional coupler 51 and a second implementation example. FIG. 13 shows a state in which the three-dimensional conductive portion 21 of the directional coupler 51 is removed.

  The directional coupler 51 according to the present embodiment has a connection part 52. The connection portion 52 is a wiring pattern formed on the substrate 2, and connects the substrate conductive portion 20 and the three-dimensional conductive portion 21 of the main line 3 via the connection terminal 26 and the solder 27. The connection unit 52 includes a first connection unit 55 and a second connection unit 56.

  The first connection portion 55 is formed so as to overlap the substrate conductive portion 20. When the three-dimensionally conductive portion 21 is connected to the first connecting portion 55, the three-dimensionally conductive portion 21 and the proximity portion 35 of the sub line 4 are overlapped as shown in FIG.

  The second connection portion 56 is formed in a direction perpendicular to the substrate conductive portion 20 and away from the sub line 4. When the three-dimensionally conductive part 21 is connected to the second connecting part 56, the three-dimensionally conductive part 21 and the proximity part 35 do not overlap as shown in FIG.

  The interval between the conductive pattern 31 of the three-dimensionally conductive portion 21 and the proximity portion 35 in the state shown in FIG. 12 is larger than the interval in the state shown in FIG. That is, the coupling amount between the main line 3 and the sub-line 4 in the state of FIG. 12 is smaller than the coupling amount in the state of FIG.

  As described above, according to the directional coupler 51 according to the present embodiment, the amount of coupling between the main line 3 and the sub line 4 is changed only by changing the place where the three-dimensional conductive portion 21 is installed, and the electrical Characteristics can be changed. Further, in addition to the configuration according to the present embodiment, by combining the configuration related to the reversal of the chip member 21 and the adjustment of the amount of solder 27 shown in the first embodiment, the range of adjustment of the coupling amount can be further expanded. Can do.

Embodiment 3
FIG. 14 shows a configuration and mounting example of the directional coupler 61 according to the third embodiment.

  The directional coupler 61 according to the present embodiment is characterized by the shape of the solder 62. The solder 62 has a ball shape and is interposed between the lower end portion of the connection terminal 26 and the substrate conductive portion 20.

  In such a configuration, the coupling amount between the main line 3 and the sub line 4 can be changed by changing the diameter of the solder 62. In addition to the configuration according to this embodiment, the range of adjustment of the coupling amount can be further widened by appropriately combining the configurations shown in the other embodiments.

Embodiment 4
FIG. 15 shows a configuration and mounting example of the directional coupler 71 according to the fourth embodiment.

  The directional coupler 71 according to the present embodiment is characterized in that a ferroelectric 72 is disposed in a space formed between the lower portion of the chip member 25 and the surface of the substrate 2.

  Thereby, compared with the case where nothing is arrange | positioned in the said space, the coupling | bonding amount of the main line 3 and the subline 4 can be enlarged.

Embodiment 5
FIG. 16 shows a configuration and an implementation example of the directional coupler 81 according to the fifth embodiment. 17 is a cross-sectional view taken along the line XVII-XVII in FIG.

  In the directional coupler 81 according to the present embodiment, two three-dimensional conductive portions 21 are formed on one main line 3, and two adjacent portions 35 are formed on one sub-line 4 correspondingly. It is characterized by being.

  Such a configuration is effective when the length of the proximity portion 35 cannot be sufficiently secured by the one three-dimensional conductive portion 21. For example, when the frequency of the signal to be handled is low, the distance of the proximity portion 35 necessary to realize the relationship of λ / 4 becomes large. In such a case, a plurality of distances are required as in the present embodiment. Use of the three-dimensional conductive portion 21 is effective.

  Note that the present invention is not limited to the above-described embodiment, and can be modified as appropriate without departing from the spirit of the present invention.

1, 51, 61, 71, 81 Directional coupler 2 Substrate 3 Main line 4 Sub line 11 Input port 12 Output port 13 Isolation port 14 Coupling port 20 Substrate conductive part 21 Three-dimensional conductive part 25 Chip member 26 Connection terminal 27 , 27A, 27B, 62 Solder 30 Dielectric 31 Conductive pattern 35 Proximity portion 52 Connection portion 55 First connection portion 56 Second connection portion 72 Ferroelectric material

Claims (8)

A main line connecting the input port and the output port formed on the surface of the substrate;
A sub line that is electromagnetically connected to the main line through a proximity portion that is close to the main line with a predetermined interval;
With
The main line includes a three-dimensional conductive part formed by raising a part of a conductive part connecting the input port and the output port from the surface;
The three-dimensional conductive portion includes a chip member that is installed via a conductive member at a position spaced upward from the surface of the substrate, and a conductive pattern is formed on one surface of a pair of parallel surfaces,
The conductive pattern and the proximity portion establish the electromagnetic field connection;
Directional coupler.   When installing the chip member, by selecting whether to face the surface on which the conductive pattern is formed on the surface of the substrate or to face the surface on which the conductive pattern is not formed, It is possible to change the interval with the proximity portion,
The directional coupler according to claim 1. A space is formed between the lower part of the three-dimensional conductive part and the surface of the substrate,
The proximity portion is formed in the space.
The directional coupler according to claim 1 or 2 . The conductive member includes solder,
By changing the amount or shape of the solder, the distance between the conductive pattern and the proximity portion can be changed.
The directional coupler according to claim 1, 2 or 3 . A plurality of connecting portions on the surface of the substrate;
By selecting which connection portion to connect the three-dimensional conductive portion, the interval between the three-dimensional conductive portion and the proximity portion can be changed.
The directional coupler according to any one of claims 1 to 4. Ferroelectric material is disposed in the space,
The directional coupler according to claim 3 . A plurality of the three-dimensional conductive portions are provided on one main line,
The directional coupler according to any one of claims 1 to 6. One end of the sub-line is connected to an isolation port,
The other end of the sub-line is connected to a coupling port;
The directional coupler according to any one of claims 1 to 7.

Images