JP5806556B2 - Drawing production method - Google Patents

Description

  The present invention relates to a method for producing a drawing obtained by performing drawing using a drawing member on a substrate having an electron beam resist formed on the surface, a drawing member used for injection of electrons into the electron beam resist, and the drawing The present invention relates to a drawing apparatus for use in manufacturing.

  Scanning probe lithography is known as one of lithography techniques for patterning a substrate. This scanning probe lithography is a technique used for a scanning probe microscope (hereinafter referred to as “SPM”) such as a scanning tunnel microscope (hereinafter referred to as “STM”) or an atomic force microscope (hereinafter referred to as “AFM”). Is applied to the substrate on which the electron beam resist is formed. More specifically, for example, the substrate and the probe are relatively moved while the so-called probe is in contact with or close to the electron beam resist of the substrate having the electron beam resist formed on the surface. In this technique, a voltage is applied between the substrate and the probe to inject electrons into the electron beam resist, and then the electron beam resist is developed. The electron beam resist has a property that its physical properties are changed by injecting electrons, and a positive type in which a portion where electrons are not injected after development and a negative type in which portions where electrons are injected remain. There is.

  As an apparatus for performing the scanning probe lithography, for example, an apparatus disclosed in Japanese Patent Laid-Open No. 10-206435 (hereinafter referred to as “conventional apparatus”) has been proposed. This conventional apparatus is a combination of so-called STM and AFM, a stage on which a substrate is placed on an upper surface, an XY drive control apparatus that controls driving of the stage in the XY direction, and an upper part of the stage. , A Z-axis drive control device that controls the drive of the probe in the Z-axis direction, a voltage application device that applies a voltage between the substrate and the probe, an XY drive control device, and a Z-axis drive A control computer for controlling the control device, the voltage application device, and the like is provided.

  In this conventional apparatus, as described above, the tip of the probe is brought into contact with or approached to the electron beam resist on the substrate having the electron beam resist formed on the surface thereof by operating the Z-axis drive control device. While driving the drive control device and moving the stage horizontally, a voltage is applied between the substrate and the probe by the voltage application device, and electrons are injected from the tip of the probe to perform drawing processing.

  Moreover, as a probe used when performing the said scanning probe lithography, the probe disclosed by Unexamined-Japanese-Patent No. 10-332714 is proposed, for example. This probe has a minute tip having a sharp tip, and the tip of the minute tip is made of a conductor layer. The conductor layer is made of, for example, platinum or gold.

  When performing drawing processing by a conventional apparatus using the probe, the tip of the microtip is contacted or approached to the electron beam resist formed on the substrate, and the tip of the microtip is applied to the electron beam resist. Inject electrons.

Japanese Patent Laid-Open No. 10-206435 Japanese Patent Laid-Open No. 10-332714

  By the way, the conventional apparatus provided with the probe has a short total distance (hereinafter referred to as “drawing distance”) that can be drawn on the substrate with one probe when performing drawing processing on the substrate using this, Since the problem arises that the width of a line drawn on the substrate (hereinafter referred to as “drawing line width”) gradually increases, the practicality is poor.

  Below, the detail of the problem mentioned above is demonstrated.

  The inventors of the present application conducted an experiment in which a drawing process is performed on a substrate using a probe whose conductor layer is made of gold, and the tip of the probe after the drawing process has been performed on the substrate is performed before the drawing process. In comparison, it was found that the sharpness was lowered.

  The sharpness of the tip of the probe decreases before and after the drawing process because the tip is moved by friction generated between the substrate surface and the tip by moving the substrate and the tip of the probe in contact with each other. This is probably because the part gradually wears.

  Moreover, the current density flowing at the tip of the probe is very high because of its small cross-sectional area, and a large amount of heat is generated when a current flows between the substrate and the probe due to application of a voltage. As a result, the tip of the probe is easily plasticized and worn by heat. This is also considered to affect the reduction of sharpness.

  Then, due to a change in the shape of the tip portion accompanied by a decrease in the sharpness of the tip portion of the probe, finally, electrons cannot be injected from the tip portion of the probe into the electron beam resist, and drawing processing cannot be performed. Therefore, it is considered that when the sharpness reduction speed of the tip portion is high, the drawing distance is shortened because electrons cannot be injected into the electron beam resist quickly.

  In addition, as the sharpness gradually decreases, the drawing line width gradually increases as the contact area of the probe tip with the electron beam resist gradually increases. It is thought that it becomes impossible to keep the constant.

  The present invention has been made in view of the above circumstances, and suppresses a decrease in sharpness at the tip of the probe sharpened portion, extends the drawing distance as compared with the conventional technique, and makes the drawing line width uniform. Another object of the present invention is to provide a drawing member manufacturing method that can perform the drawing, and further to provide a drawing member capable of suppressing a reduction in sharpness and a drawing device including the drawing member.

A drawing production method for solving the above-described problems is as follows.
Using a drawing member consisting of a conductive sharp tip with a sharp tip and a support that supports the sharp tip, the drawing object having an electron beam resist formed on the surface is subjected to a drawing process. A method for producing a drawing obtained by
Forming a film containing a fluorine-containing compound so as to cover a part or the whole of the electron beam resist of the drawing object;
The tip of the sharp part and the coating film of the drawing object are moved relative to each other, and a voltage is applied between the drawing object and the sharp part, and the tip of the sharp part Injecting electrons from the part into the electron beam resist via the coating;
The present invention relates to a method for producing a drawn product including a step of developing a drawing target in which electrons are injected into the electron beam resist.

  According to this drawing product manufacturing method, first, a film containing a fluorine-containing compound is formed so as to cover a part or the whole of the electron beam resist of the drawing object on which the electron beam resist is formed.

  Next, while the voltage is applied between the drawing object and the sharp part, the surface of the drawing object on which the electron beam resist is formed (covered object) while the film and the tip of the sharp part are in contact with each other. While relatively moving in a plane parallel to the drawing surface, electrons are injected from the tip portion into the electron beam resist through the coating.

  Thereafter, the drawing object in which electrons are injected into the electron beam resist is developed to obtain a drawing object. The electron beam resist may be either positive type or negative type. In the case of the positive type, the portion into which electrons are injected is removed during development, and in the case of the negative type, The portion where electrons are not injected is removed.

  In this case, the drawing distance can be extended as compared with the case where the drawing process is performed on the drawing object on which the film is not formed. This is because, by forming a film containing a fluorine-containing compound on the surface of the drawing object so as to cover the electron beam resist, the tip part of the tip part due to friction generated between the tip part of the sharp part in contact with the film is formed. It is thought that this is because wear is suppressed and a decrease in sharpness is suppressed.

  As will be described in detail later, when the inventors conducted an experiment using a drawing member in which the surface of the tip of the sharpened portion was made of gold, the drawing target was not formed with a film and was subjected to a drawing process. The drawing distance was 160 μm, while the drawing distance when the drawing object was subjected to the drawing process was 590 μm, and the drawing distance was clearly increased.

  The sharp portion may be formed with an inner layer made of gold and an outer layer made of platinum at the tip portion.

  In this case, the drawing distance can be further extended and the drawing line width can be made uniform. This is because the surface of the tip of the sharp part is made of platinum having a high melting point and high hardness, so that the surface of the tip becomes harder than before, and the surface of the drawing object and the tip of the sharp part are between This is thought to be due to the suppression of wear at the tip, which is thought to be due to the friction that occurs in the surface. In addition, since the melting point of platinum is high, plasticization of the tip when the voltage is applied and current flows is suppressed, the tip becomes difficult to wear, and the decrease in sharpness is further suppressed. It is done.

  In this regard, as will be described later, the inventors of the present application have a drawing member in which only a layer made of gold is formed at the tip of the sharp portion, and a drawing member in which an inner layer made of gold and an outer layer made of platinum are formed. When the drawing object on which the coating film containing the fluorine-containing compound was formed was subjected to drawing treatment, the former drawing distance was 590 μm, while the latter drawing distance was increased to 1500 μm or more. In addition, when a drawing process was performed on a drawing object on which the film was not formed, the drawing distance when drawing was performed using a drawing member formed only of a layer made of gold was 160 μm. When drawing was performed using a drawing member in which an inner layer made of gold and an outer layer made of platinum were formed, the drawing distance was 500 μm, and the drawing distance was extended. Furthermore, when a drawing object having a coating film containing the fluorine-containing compound is drawn using a drawing member in which an inner layer made of gold and an outer layer made of platinum are formed, the drawing start point and the drawing are drawn. While almost no change in the line width at the end point was observed, a drawing process was performed on the drawing object on which the film containing the fluorine-containing compound was formed using a drawing member in which only a gold layer was formed. In the case of performing the drawing process, and in the case of performing the drawing process on the drawing object on which the film containing the fluorine-containing compound is not formed using the drawing member in which the inner layer made of gold and the outer layer made of platinum are formed, There was also a change in the line width of 10 nm.

  The outer layer made of platinum preferably has a thickness of 5 nm to 60 nm. If it does in this way, layer thickness required in order to suppress a fall of sharpness can be secured, and a sharp part can be made suitable size.

In addition, as a drawing member used in the drawing object manufacturing method ,
A drawing member for injecting electrons into the electron beam resist of the drawing object having an electron beam resist formed on a surface thereof to perform a drawing process on the drawing object,
Consisting of a sharp point having conductivity, the tip formed sharply, and a support that supports the sharp part,
The pointed portion is in its said distal end portion, there is a drawing member outer layer of the inner layer and the platinum made of gold is formed.

  According to this drawing member, it is possible to extend the drawing distance and make the drawing line width uniform. This is because the surface of the tip of the sharp part is covered with a platinum layer having a high melting point and high hardness, so that the wear at the tip of the sharp part is suppressed when the drawing member is used for the drawing process. Also, it is considered that plasticization of the tip portion due to heat generation caused by applying a voltage can be suppressed, the tip portion is less likely to be worn, and a decrease in sharpness at the tip portion of the sharp portion is suppressed.

  The outer layer made of platinum preferably has a thickness of 5 nm to 60 nm. If it does in this way, layer thickness required in order to suppress a fall of sharpness can be secured, and a sharp part can be made into a suitable size.

In addition, as a drawing apparatus used in the said drawing thing manufacturing method ,
A drawing apparatus for performing a drawing process on a drawing object having an electron beam resist formed on a surface thereof,
A base for holding the drawing object;
A drawing member composed of a sharp point having conductivity, a tip having a sharp tip, and a support that supports the sharp part,
A support mechanism for supporting the drawing member so that the sharp portion faces a drawing surface of a drawing object held on the base;
A moving mechanism for moving the base and the support member relatively in a plane parallel to the drawing surface of the drawing object and a plane orthogonal thereto;
A voltage application mechanism for applying a voltage between the drawing object held on the base and the sharp portion;
In a drawing apparatus comprising a control mechanism for controlling the operation of the moving mechanism and the voltage application mechanism,
The pointed portion is in its said distal end portion, there is a drawing apparatus outer layer of the inner layer and the platinum made of gold is formed.

  According to this drawing apparatus, first, the drawing object is held by a base. Next, the moving mechanism relatively moves the base and the support member in a plane perpendicular to the drawing surface of the drawing object held on the base, and the drawing surface is made of gold. The inner layer is brought into contact with the tip portion on which the outer layer made of platinum is formed.

  Thereafter, the base and the support member are moved relative to each other in a plane parallel to the drawing surface, and a voltage is applied between the drawing object and the sharp portion, to thereby form an electron beam resist. Electrons are injected from the tip of the sharp part into the drawing surface on which the is formed.

  In this case, the drawing distance can be extended as compared with the conventional case, and the change in the drawing line width can be suppressed. This is because a layer made of platinum having a high melting point and high hardness is formed on the surface of the tip portion of the sharp portion, so that when the tip portion of the sharp portion and the drawing surface are brought into contact with each other, the tip portion It is possible to suppress the wear of the tip that is thought to be due to friction generated between the tip and the drawing surface, and to suppress the plasticization of the tip due to the heat generated by applying a voltage, making it difficult to wear the tip. This is thought to be because the drawing process can be performed on the drawing object while suppressing a decrease in sharpness at the tip of the sharp portion.

  The outer layer made of platinum preferably has a thickness of 5 nm to 60 nm. If it does in this way, layer thickness required in order to suppress a fall of sharpness can be secured, and a sharp part can be made into a suitable size.

As described above, according to the drawing material producing how according to the present invention, it is possible to extend the drawing distance can be achieved even uniform drawing line width.

It is the block diagram which showed schematic structure of the drawing apparatus which concerns on one Embodiment of this invention. (A) is a side view of the drawing member which concerns on one Embodiment of this invention, (b) is the figure seen from the arrow A direction, (c) is seen from the arrow B direction. FIG. It is a side view of the board | substrate in one Embodiment of this invention, (a) is a board | substrate before film formation, (b) is a board | substrate after film formation. It is explanatory drawing for demonstrating the drawing path | route in the experiment which performs a drawing process on a board | substrate.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a configuration diagram showing a schematic configuration of a drawing apparatus 1 according to an embodiment of the present invention. As shown in FIG. 1, the drawing apparatus 1 of this example includes a base 2 on which a substrate K (see FIG. 3A) on which an electron beam resist R is formed is placed, and the base 2. The base movement mechanism 3 to be moved, the drawing member 10 that performs drawing processing on the substrate K, the support member 4 that supports the drawing member 10, and the drawing member movement that moves the drawing member 10 via the support member 4 A mechanism 5; a displacement detection mechanism 20 that detects the displacement of the support 11 described later; a voltage application mechanism 6 that applies a voltage to the substrate K and the drawing member 10; the base movement mechanism 3; and the drawing member movement mechanism. 5 and a control device 7 for controlling the operation of the displacement detection mechanism 20 and the voltage application mechanism 6.

  The base 2 is placed with the substrate K placed on the surface to be drawn, that is, the surface on which the electron beam resist R is formed, and is moved in the three orthogonal directions by the base moving mechanism 3. Is done.

  As shown in FIG. 2, the drawing member 10 is provided with a flat plate-like support body 11 and a sharpened portion 12 having a substantially triangular pyramid shape provided so as to protrude from one surface of the support body 11. The sharp portion 12 is formed with a gold layer 13 as an inner layer and a platinum layer 14 as an outer layer so as to cover the whole. In addition, the inside of the said support body 11 and the sharp part 12 is comprised with the silicon | silicone, and the adhesion layer (not shown) which consists of chromium etc. between the silicon which comprises the inside of the sharp part 12, and the said gold layer 13 is comprised. ). The platinum layer 14 preferably has a thickness of 5 nm to 60 nm.

  The drawing member 10 is supported by the support member 4 above the base 2 so that the tip of the sharpened portion 12 faces the drawing surface of the substrate K, and the drawing member movement is performed. The mechanism 5 is moved in the Z-axis direction via the support member 4.

  The displacement detection mechanism 20 includes a laser light source 21 that emits laser light toward the upper surface of the support 11, a light receiving unit 22 that receives the laser light reflected from the upper surface of the support 11, and the light receiving unit 22 And a displacement calculating mechanism 23 that calculates the displacement based on the laser beam, and detects the displacement of the support 11 by a so-called optical lever method.

  The voltage application mechanism 6 is configured to apply a voltage between the substrate K placed on the upper surface of the base 2 and the sharp portion 12. In addition, when applying a voltage, even if it applies a voltage directly to the said sharp part 12, for example, a voltage is indirectly applied to the said sharp part 12 via the said support member 4 and the support body 11. You may do it.

  The control device 7 moves the base 2 and the drawing member 10 relative to each other in the Z-axis direction so that the drawing surface of the substrate K placed on the base 2 and the tip of the sharpened portion 12 contact each other. The operation of the base moving mechanism 3 and the drawing member moving mechanism 5 is controlled so that the base 2 is moved in the X-axis and Y-axis directions, and the tip of the sharp portion 12 is on the substrate K. The operation of the base moving mechanism 3 is controlled so as to pass on predetermined coordinates and follow a predetermined drawing path. The operations of the base moving mechanism 3 and the drawing member moving mechanism 5 are controlled so that the displacement of the support 11 calculated by the displacement calculating mechanism 23 does not exceed a preset value. Further, the operation of the voltage application mechanism 6 is controlled so that a predetermined voltage is applied between the substrate K and the sharp portion 12.

  The process of producing a drawing by performing drawing processing on the substrate K using the drawing apparatus 1 having the above configuration will be described in detail below.

  First, a film C made of a fluorine-containing compound is formed so as to cover a part or the whole of the electron beam resist R formed on the surface of the substrate K (see FIG. 3B). Specifically, after immersing the substrate K in a solution in which a film forming agent containing a fluorine-containing compound is dissolved, the substrate K is taken out of the solution and dried naturally to form the coating C on the electron beam resist R. Let Other methods for forming the film C include, for example, a method in which a solution in which a film forming agent is dissolved is applied and dried, a method using a so-called vapor deposition method, and the like. In addition, the electron beam resist R formed on the surface of the substrate K in this example is assumed to be a positive type, but is not limited thereto, and may be a negative type electron beam resist.

  Next, the substrate K on which the coating C is formed on the electron beam resist R is placed on the base 2 so that the drawing surface faces the sharp portion 12, and under the control of the control device 7, The base 2 and the drawing member 10 are moved relative to each other in the Z-axis direction by the base moving mechanism 3 and the drawing member moving mechanism 5, and the coating C formed on the electron beam resist R and the tip of the sharpened portion 12. Contact the part.

  Thereafter, under the control of the control device 7, the voltage application mechanism 6 applies a voltage between them so that the substrate K side becomes an anode and the sharp portion 12 side becomes a cathode, and the tip portion of the sharp portion 12 The control device is configured to inject electrons into the electron beam resist R through the coating C, and so that the tip of the sharp portion 12 passes a predetermined coordinate on the substrate K and follows a predetermined drawing path. 7, the base 2 is moved in the X-axis and Y-axis directions by the base moving mechanism 3. Thereby, in the electron beam resist R formed on the substrate K, a portion where electrons are injected is subjected to so-called electron exposure in which a chemical reaction is caused to a compound constituting the electron beam resist R.

  Thereafter, the substrate K is lowered from the base 2, and the substrate K is developed to remove the electron beam resist R in the electron-exposed portion from the substrate K, thereby completing the drawing process.

  In this connection, the result of an experiment in which a drawing target is a silicon substrate having a 40-nm-thick positive electron beam resist coated on the surface and a drawing process is performed on the substrate using a drawing member will be described below. In addition, the drawing member was formed with a drawing layer (single layer drawing member) in which only a gold layer was formed at a sharp portion, and a platinum layer having a layer thickness of about 45 nm so as to cover the gold layer of the single layer drawing member. A drawing member (two-layer drawing member) was used.

  In the experiment, the applied voltage was -37.0 V (substrate side grounding), the drawing member relative scanning speed with respect to the substrate was 2 μm / s, and the tip of the sharp part was brought into contact with the drawing surface on the substrate. As shown, after the base is moved so that the tip of the sharp point moves from the point S on the substrate in the direction of the arrow, a voltage is continuously applied between the substrate and the drawing member, and then the electron beam resist And the substrate after the electron beam resist development was evaluated. Note that the height position of the drawing member is not adjusted until the base is moved with the absolute height position of the drawing member fixed to the height position at the start of drawing, and the voltage application is completed. Further, the displacement of the support caused by the contact between the tip of the sharp part and the drawing surface is calculated by a displacement calculating mechanism, and the base moving mechanism is controlled by the control device so that the displacement is maintained at a preset value. Controls the operation and adjusts the absolute height position of the substrate.

  When the electron beam resist formed on the surface of the silicon substrate was subjected to a drawing process using the two-layer drawing member, the drawing distance was 500 μm, whereas the drawing process was performed using a single-layer drawing member. In this case, the drawing distance was 160 μm. That is, when the drawing process is performed using the two-layer drawing member as compared with the case where the drawing process using the single-layer drawing member is performed, the drawing distance is increased by about three times. The drawing distance is extended by forming the platinum layer so as to cover the gold layer.

  Next, after the silicon substrate is immersed in a solution having a concentration of the film forming agent of 0.1% by weight for 1 minute and then naturally dried, a film having a film thickness of 2 to 3 nm is formed on the electron beam resist. The result of conducting an experiment in which a silicon substrate on which this film is formed is subjected to a drawing process to produce a drawing object will be described below. In addition, “OPTOOL DSX (trade name)” (manufactured by Daikin Industries, Ltd.) was used as the film forming agent, and the single-layer drawing member and the two-layer drawing member were used as the drawing member. The experimental conditions are the same as described above.

  When a drawing process is performed on a substrate on which a film is formed using a two-layer drawing member, drawing of 1500 μm or more is possible, and when a drawing process is performed using a single-layer drawing member, the drawing distance is 590 μm. there were. When this result is compared with the case where the drawing process is performed on the substrate on which the film is not formed, the drawing distance is increased both when the two-layer drawing member is used and when the single-layer drawing member is used. That is, the drawing distance is extended by forming a film on the electron beam resist.

  Furthermore, in the case of a single layer drawing member, the drawing distance was 590 μm, whereas in the two layer drawing member, drawing of 1500 μm or more was possible. Even if it exists, the drawing distance is further extended by forming a platinum layer so that the gold layer formed in the sharp part may be covered.

  In addition, when a drawing process was performed using a two-layer drawing member and a drawing process was performed on a substrate on which the film was formed and a substrate on which the film was not formed, the film was not formed. When the drawing process was performed on the substrate, the drawing line width immediately after the start of drawing was 80 nm, whereas the drawing line width after 500 μm drawing was 90 nm, and a change of 10 nm was observed between the two. On the other hand, when the drawing process is performed on the substrate on which the film is formed, the drawing line width immediately after the start of drawing is 80 nm, and the drawing line width after drawing of 1500 μm is also 80 nm. It was hardly seen. That is, the change in the drawing line width is suppressed by forming the film on the substrate.

  Thus, according to the drawn object manufacturing method and the drawing apparatus 1 of this example, the drawing distance can be extended as compared with the conventional case, and the drawing line width can be made uniform. This is because the coating C having a small friction coefficient formed of a fluorine-containing compound is formed on the electron beam resist R, and the coating C and the sharp portion 12 are moved in contact with each other. This is thought to be due to the reduction in sharpness at the tip of the sharpened portion 12 caused by friction with the surface. Furthermore, since the gold layer 13 as the inner layer and the platinum layer 14 as the outer layer are formed at the tip portion of the sharp portion 12, the tip portion of the sharp portion 12 is covered with platinum having a high melting point and high hardness. It is considered that the sharpness at the tip due to wear due to friction is prevented from being lowered, the tip of the sharpened portion 12 is prevented from being plasticized and easily worn, and the sharpness from being lowered. .

  As mentioned above, although one Embodiment of this invention was described, the specific aspect which this invention can take is not limited to this at all.

  In this example, the drawing object is manufactured by the drawing apparatus including the drawing member 10 in which the gold layer 13 and the platinum layer 14 are formed on the sharp portion 12, but the invention is not limited thereto. Using a drawing apparatus provided with a drawing member in which only the gold layer 13 is formed on the sharp part 12, a drawing process may be performed on the substrate K on which the coating C is formed on the surface to produce a drawing object. good.

DESCRIPTION OF SYMBOLS 1 Drawing apparatus 2 Base 3 Base moving mechanism 4 Support member 5 Drawing member moving mechanism 6 Voltage application mechanism 7 Control apparatus 10 Drawing member 11 Support body 12 Sharp part 13 Gold layer 14 Platinum layer 20 Displacement detection mechanism 21 Laser light source 22 Light reception Part 23 Displacement calculation mechanism K Substrate R Electron beam resist C Coating

Claims (3)

Using a drawing member consisting of a conductive sharp tip with a sharp tip and a support that supports the sharp tip, the drawing object having an electron beam resist formed on the surface is subjected to a drawing process. A method for producing a drawing obtained by
Forming a film containing a fluorine-containing compound so as to cover a part or the whole of the electron beam resist of the drawing object;
The tip of the sharp part and the coating film of the drawing object are moved relative to each other, and a voltage is applied between the drawing object and the sharp part, and the tip of the sharp part Injecting electrons from the part into the electron beam resist via the coating;
And a step of developing a drawing object in which electrons are injected into the electron beam resist.   The drawn article manufacturing method according to claim 1, wherein an inner layer made of gold and an outer layer made of platinum are formed at the tip of the sharp portion.   3. The drawn article manufacturing method according to claim 2, wherein the outer layer made of platinum has a thickness of 5 nm to 60 nm.

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