JP5796771B2 - Method for polishing peripheral surface of disk-shaped workpiece and carrier for double-side polishing machine - Google Patents

Description

  The present invention relates to a method for polishing a peripheral surface of a disk-shaped workpiece and a carrier for a double-side polishing machine that can be used in the same method.

  2. Description of the Related Art In recent years, electronic electronic devices have been further reduced in size and weight, and for example, there is a demand for further thinning and diameter reduction in image sensor cover glass and the like. On the other hand, instead of an aluminum substrate, a glass substrate or a crystallized glass substrate excellent in insulation, chemical durability, strength and the like is used as a magnetic disk substrate.

  Conventionally, as a peripheral surface polishing apparatus for polishing the outer peripheral surface of a disk-shaped workpiece made of a brittle material such as glass, crystallized glass, ceramics, etc., the outer peripheral surface of a laminated cylindrical body obtained by stacking a large number of disk-shaped workpieces is used. In addition, what is polished with a polishing brush rotating around an axis parallel to the axis of the laminated cylinder is known (for example, Patent Documents 1 and 2 below). By polishing the outer peripheral surface of a disc-shaped workpiece made of a brittle material using this peripheral surface polishing apparatus, chipping, cracking, etc. of the outer peripheral portion of the workpiece are suppressed, and foreign matter on the main surface of the workpiece caused by these chipping, etc. Prevents adhesion.

JP-A-11-28649 JP 2006-263879 A

  However, the conventional peripheral surface polishing apparatus polishes the outer peripheral surface of the laminated cylindrical body obtained by laminating the disk-shaped workpieces with a polishing brush. Therefore, the smaller the diameter of the disk-shaped workpiece, the more the laminated cylindrical body becomes the axis during polishing. It becomes easy to bend in the direction, the outer peripheral surface cannot be evenly polished, and there is a difficulty that the peripheral surface polishing of each disk-shaped work varies. Therefore, conventionally, as the diameter of the disk-shaped workpiece is reduced, the polishing speed has to be reduced, and the work efficiency is greatly reduced.

  The present invention has been made in view of the above-described problems in the conventional peripheral surface polishing apparatus, and is a disk-shaped workpiece capable of accurately and efficiently polishing the outer peripheral surface of a disk-shaped workpiece. It is an object of the present invention to provide a peripheral surface polishing method and a carrier for a double-side polishing machine that can be used in the peripheral surface polishing method.

The present invention sandwiches a workpiece held by a carrier between a pair of upper and lower upper and lower surface plates each having a polishing pad attached to each other's facing surfaces, and supplies the abrasive while supplying the abrasive. A polishing method for polishing the workpiece by rotating the lower surface plate in reverse directions,
A preparation step of preparing a laminated cylindrical body in which a plurality of disc-shaped workpieces are laminated and integrated; and the laminated cylindrical body, the axis of the laminated cylindrical body being parallel to the opposing surfaces of the upper surface plate and the lower surface plate A sandwiching step between the upper surface plate and the lower surface plate, polishing the outer peripheral surface of the laminated cylindrical body, and separation for separating the laminated cylindrical body whose outer peripheral surface has been polished by the polishing step into a plurality of disk-shaped workpieces In the polishing step, the carrier maintains the posture in which the axial direction of the laminated cylindrical body is inclined with respect to the rotational tangential direction of the upper surface plate and the lower surface plate by the carrier in the polishing step. And is held rotatably about the axis.

  Further, according to the present invention, the preparation step forms a laminated plate body by laminating and integrating a plurality of plate materials to form a laminated plate body, and cutting the laminated plate body into a cylindrical shape. A cutting process.

  Further, the present invention is characterized in that both end portions of the laminated cylindrical body are made of dummy.

Further, the present invention provides a method for sandwiching a work held by a carrier between a pair of upper and lower upper and lower surface plates each having a polishing pad affixed to each other and supplying the polishing material. And a carrier used in a double-side polishing machine that polishes the workpiece by rotating the lower platen in reverse directions,
An annular plate-shaped carrier body, and a laminated cylinder body established in the carrier body and laminated and integrated with a plurality of disc-shaped workpieces, the axis of the laminated cylinder body being parallel to the plate surface of the carrier body A workpiece holding hole that can be rotatably held around an axis, and a fixed tooth portion that is provided in the carrier body and can be fixed to a sun gear of the double-side polishing machine or an internal gear that surrounds the sun gear, The workpiece holding hole is composed of a pair of outer peripheral surface side hole wall portions that support the outer peripheral surface of the laminated cylindrical body, and a pair of end surface side hole wall portions that support the end surface of the laminated cylindrical body, and the outer peripheral surface side hole wall The portion is formed obliquely with respect to the circumferential tangent direction of the carrier body.

  According to the method for polishing a peripheral surface of a disk-shaped workpiece according to the present invention, a laminated cylindrical body obtained by laminating and integrating a plurality of disk-shaped workpieces is fixed with its axis center parallel to the opposing surfaces of the upper surface plate and the lower surface plate. Since the outer peripheral surface of the laminated cylindrical body is polished by sandwiching it between the board and the lower surface plate and rotating the upper surface plate and the lower surface plate reversely to each other, even if the diameter of the disk-shaped workpiece is reduced, the laminated cylinder is bent during polishing. Without deformation, the outer peripheral surface of the laminated cylindrical body can be evenly polished, and the peripheral surface polishing of each disk-like workpiece can be performed efficiently without variation.

  In addition, the laminated cylindrical body is polished by the carrier while maintaining the posture in which the axial center direction is inclined with respect to the rotational tangential direction of the upper surface plate and the lower surface plate while being rotatably held around the axis. The laminated cylinder can be continuously driven and rotated around the axis, and the entire outer peripheral surface of the laminated cylinder can be evenly polished.

  Further, if both end portions of the laminated cylindrical body are constituted by dummy, the circumferential surface polishing of each disk-shaped workpiece in the middle portion of the laminated cylindrical body can be performed more evenly.

  Further, if the carrier body of the carrier is provided with a fixed tooth portion that can be fixed to the sun gear of the double-side polishing machine or the internal gear surrounding the sun gear, the carrier is mounted on the existing double-side polishing machine and the circumference of the disk-shaped workpiece is set. A surface polishing method can be carried out.

It is a schematic perspective view explaining the preparatory process of the peripheral surface grinding | polishing method of the disk shaped workpiece | work of this embodiment. It is a top view of the carrier of this embodiment. It is a schematic plan view explaining the grinding | polishing process of the peripheral surface grinding | polishing method of the disk shaped workpiece | work of this embodiment. It is a schematic plan view explaining the frictional force which acts on a laminated cylinder at the time of the grinding | polishing process of the peripheral surface grinding | polishing method of the disk shaped workpiece | work of this embodiment. (A) a sectional view in the direction of the axis A, and (b) a section in a direction perpendicular to the axis A, explaining the frictional force acting on the laminated cylindrical body during the polishing step of the peripheral surface polishing method of the disk-shaped workpiece of this embodiment. FIG. It is a schematic perspective view explaining the isolation | separation process of the peripheral surface grinding | polishing method of the disk shaped workpiece | work of this embodiment.

  As shown in FIG. 1 to FIG. 6, the method for polishing a peripheral surface of a disk-shaped workpiece according to the present embodiment includes a stacked cylindrical body 3 in which a plurality of disk-shaped workpieces 1, 1. A preparatory process for preparing, and a polishing process for polishing the outer peripheral surface 31 of the multi-layer cylinder 3 by sandwiching the multi-layer cylinder 3 between the upper surface plate 6 and the lower surface plate 7 while holding the multi-layer cylinder 3 with the carrier 4. And a separation step of separating the circumferentially polished laminated cylindrical body 3 into a plurality of disk-shaped workpieces 1.

  The preparation step is performed by forming a laminated cylindrical body 3 in which a plurality of disk-like workpieces 1 are laminated in a cylindrical shape using a coagulant such as wax. In the present embodiment, disk-shaped dummies 2 made of the same material as the disk-shaped work 1 and differing only in thickness are laminated and integrated together with a plurality of disk-shaped works 1. It is composed of As the wax, polyvinyl acetate or the like can be used.

  In addition, as shown in FIG. 1, the preparatory process of the present embodiment includes a laminating process in which a plurality of rectangular plate members 10 and a plurality of rectangular dummy plate members 20 are laminated and integrated to form a laminated plate-like body 30, and this laminated plate shape. And a cutting step of forming the laminated cylindrical body 3 by cutting the body 30 into a cylindrical shape. In the present embodiment, a total of 20 rectangular plate materials 10 made of a glass thin plate material having a thickness of 0.05 mm and two rectangular dummy plate materials 20 made of a glass plate material having a thickness of 5.0 mm are laminated and integrated with a coagulant. Thus, the laminated plate-like body 30 having a thickness of about 11 mm is formed, and then the laminated cylindrical body 3 having a diameter of 7.1 mm (polishing margin: 0.1 mm) is cut out using the coring cutter 40. By this, the some laminated cylinder 3 can be obtained efficiently. Alternatively, the disk-shaped workpieces 1 can be formed one by one, and then the plurality of disk-shaped workpieces 1 can be stacked and integrated to obtain the stacked cylindrical body 3. Various design changes can be made with respect to the thickness of the disk-shaped workpiece 1, the number of stacked layers, the thickness of the disk-shaped dummy 2, and the like.

  As shown in FIGS. 2 to 5, the polishing step is performed by a carrier 4 so that the stacked cylinder 3 has a horizontal posture in which the axis A is parallel to the opposing surfaces of the upper surface plate 6 and the lower surface plate 7 of the double-side polishing machine 5. The outer peripheral surface 31 of the laminated cylindrical body 3 is sandwiched between the upper surface plate 6 and the lower surface plate 7.

  The double-sided polishing machine 5 sandwiches a work between a pair of upper and lower upper surface plates 6 and lower surface plate 7 each having a polishing pad affixed to the opposite surface, and supplies an upper surface plate 6 while supplying slurry-like abrasive. The workpiece is double-side polished by rotating the lower surface plate 7 in the opposite direction. In the present embodiment, a conventionally known double-side polishing machine is used. In this double-side polishing machine 5, a sun gear 52 that rotates independently of the lower surface plate 7 is disposed inside the lower surface plate 7, and the lower surface plate 7 surrounds the sun gear 52 outside the lower surface plate 7. An internal gear 51 that rotates independently from 7 is disposed.

  2 and 3, the carrier 4 is formed in an annular plate-like carrier main body 42 having a circular hole 41 in the center, and the carrier main body 42. A plurality of workpiece holding holes 43 that are rotatably held around the axis A in parallel with the plate surface 421 of the carrier main body 42 and fixed tooth portions 44 provided over the entire outer periphery of the carrier main body 42. ing.

  The carrier body 42 is formed of a 5 mm-thick annular plate made of vinyl chloride resin, and a total of 12 rectangular work holding holes 43 are arranged at equal intervals near the outer periphery of the carrier body 42. It is opened straight through the top and bottom surfaces.

  Each work holding hole 43 includes a pair of outer peripheral surface side hole wall portions 431 for supporting the outer peripheral surface 31 of the stacked cylindrical body 3, and a pair of end surface side hole wall portions 432 for supporting the end surface 32 of the stacked cylindrical body 3. The outer peripheral surface side hole wall portions 431 and the end surface side hole wall portions 432 face each other in parallel, and the outer peripheral surface side hole wall portion 431 and the end surface side hole wall portion 432 are orthogonal to each other. . The outer peripheral surface side hole wall 431 is formed obliquely (angle α) with respect to the circumferential tangent direction T4 of the carrier body 42. In the present embodiment, the angle α is 30 degrees.

  The polishing process of this embodiment is specifically performed according to the following procedure.

  First, in a state where the upper surface plate 6 of the double-side polishing machine 5 is raised with respect to the lower surface plate 7, the fixed tooth portion 44 of the carrier 4 is moved around the entire circumference of the internal gear 51 of the double-side polishing machine 5 as shown in FIG. 3. The carrier 4 is fixed to the internal gear 51 of the double-side polishing machine 5. At this time, there is a gap between the inner peripheral portion of the carrier 4 (hole edge of the circular hole 41) and the sun gear 52 of the double-side polishing machine 5, and the carrier 4 is not fixed to the sun gear 52.

  Next, the stacked cylindrical body 3 is accommodated in each work holding hole 43 of the carrier 4. Thus, the laminated cylindrical body 3 is held in a posture in which the axis A is parallel to the facing surface of the lower surface plate 7 and is inclined (angle α: 30 degrees) with respect to the rotational tangential direction T7 of the lower surface plate 7. To do. Within the work holding hole 43, there is a slight gap between the stacked cylindrical body 3 and the outer peripheral surface side hole wall 431 and the end face side hole wall 432 of the work holding hole 43. The hole 43 is rotatably held around its axis A.

  In the present embodiment, two stacked cylindrical bodies 3 are accommodated in a single work holding hole 43 in a row, but for example, one stacked cylindrical body 3 is stored in one work holding hole 43. May be. The design and the like of the work holding hole 43 can be variously changed in consideration of the diameter, thickness, arrangement, and the like of the disk-shaped work 1 and the laminated cylindrical body 3 to be circumferentially polished.

  Next, by lowering the upper surface plate 6 of the double-side polishing machine 5 with respect to the lower surface plate 7, as shown in FIGS. 4 and 5, the outer peripheral surface 31 of the stacked cylindrical body 3 in the work holding hole 43 is moved upward. It is sandwiched between the surface plate 6 and the lower surface plate 7. And the outer peripheral surface 31 of the laminated cylinder 3 is grind | polished by rotating the upper surface plate 6 and the lower surface plate 7 mutually reversely, supplying an abrasive | polishing material.

  At this time, as shown in FIG. 4, due to the rotational movement R <b> 7 of the lower surface plate 7, a frictional force F <b> 7 acts on each layered column body 3 in the rotational tangential direction T <b> 7. The component force F7a and the component force F7h act in the direction and the circumferential direction, respectively. At the same time, the rotational force R6 of the upper surface plate 6 causes the frictional force F6 to act in the rotational tangential direction T6 of the upper surface plate 6, thereby laminating. The component force F6a and the component force F6h act in the axial direction A and the circumferential direction of the cylindrical body 3, respectively. Thus, as shown in FIG. 5A, when the outer peripheral surface 31 of the laminated cylindrical body 3 is polished at the line contact portion between the lower surface plate 7 and the upper surface plate 6 by the component force F7a and the component force F6a. At the same time, as shown in FIG. 5B, the laminated cylinder 3 itself is driven to rotate around its axis A by the component forces F7h and F6h, and the entire outer peripheral surface 31 of the laminated cylinder 3 is evenly distributed. Polished.

  In the present embodiment, as shown in FIG. 3, in the polishing process, the internal gear 51 of the double-side polishing machine 5 is rotated in the same direction as the rotational movement R <b> 7 of the lower surface plate 7 at a lower speed than the lower surface plate 7. Rotate 4 By this rotational movement R4 of the carrier 4, each laminated cylindrical body 3 itself can be moved, and more uniform polishing is possible. Note that the carrier 4 may not be rotated as necessary.

  As shown in FIG. 6, the separation step is performed by liquefying a coagulant such as wax integrated with the laminated cylindrical body 3. In this embodiment, the circumferentially polished laminated cylindrical body 3 is separated into a plurality of disk-shaped workpieces 1 by placing them in an atmosphere maintained at a temperature at which the coagulant liquefies. And each disc-shaped workpiece | work 1 isolate | separated is wash | cleaned and dried. Thus, a plurality of disk-shaped workpieces 1 whose peripheral surfaces are polished can be obtained.

  As described above, according to the method for polishing the peripheral surface of the disk-shaped workpiece of the present embodiment, the laminated cylindrical body 3 obtained by laminating and integrating the plurality of disk-shaped workpieces 1 has its axis A as the upper surface plate 6 and the lower surface plate 7. Since the upper surface plate 6 and the lower surface plate 7 are sandwiched between the upper surface plate 6 and the lower surface plate 7 in parallel with the opposing surface and the upper surface plate 6 and the lower surface plate 7 are rotated in reverse to each other, the outer peripheral surface 31 of the laminated cylindrical body 3 is polished. Even if the diameter of the workpiece 1 is reduced, the laminated cylindrical body 3 is not bent and deformed at the time of polishing, and the outer circumferential surface of the laminated cylindrical body 3 can be evenly polished. Highly efficient.

  In addition, the carrier 4 rotates the laminated cylinder 3 around the axis A while maintaining the posture in which the axis A direction is inclined with respect to the rotational tangential direction (T6, T7) of the upper surface plate 6 and the lower surface plate 7. Since polishing is performed while being freely held, the laminated cylindrical body 3 can be continuously driven and rotated about the axis A during polishing, and the entire outer peripheral surface 31 of the laminated cylindrical body 3 can be evenly polished.

  In addition, according to the method for polishing the peripheral surface of the disk-shaped workpiece of the present embodiment, since both end portions of the stacked cylindrical body 3 are configured by the disk-shaped dummy 2, each disk-shaped work in the middle portion of the stacked cylindrical body 3. 1 can be more evenly polished. Further, the disk-shaped dummy 2 can improve the stability of the posture of the stacked cylindrical body 3 in the work holding hole 43.

  Further, the carrier 4 of the present embodiment is provided with the fixed tooth portion 44 that can be fixed to the internal gear 51 of the double-side polishing machine 5 on the outer periphery of the annular plate-shaped carrier main body 42, so that the existing double-side polishing machine 5 By mounting the carrier 4 on the peripheral surface, a method for polishing the peripheral surface of the disk-shaped workpiece can be carried out.

  As mentioned above, although the peripheral surface grinding | polishing method of the disk shaped workpiece | work of this embodiment was demonstrated, this invention can be implemented also in other embodiment.

  For example, in the above embodiment, both end portions of the laminated cylindrical body 3 are constituted by the disk-shaped dummy 2, but the laminated cylindrical body 3 may be formed by stacking and integrating only a plurality of disk-shaped workpieces 1.

  Further, in the above embodiment, the outer peripheral surface side hole wall portion 431 of the work holding hole 43 of the carrier 4 is formed obliquely at an angle α (30 degrees) with respect to the circumferential tangential direction T4 of the carrier body 42. The inclination angle α can be variously modified in consideration of, for example, the frictional force in the axial direction A and the circumferential direction of the laminated cylindrical body 3 that works during polishing.

  Further, in the above embodiment, the outer peripheral surface side hole wall portion 431 of the work holding hole 43 of the carrier 4 is inclined inward of the lower surface plate 7 toward the upstream side of the rotation of the lower surface plate 7. It is not limited to this, and it may be inclined to the outside of the lower surface plate 7.

  In the above embodiment, the fixed tooth portion 44 that can be fixed to the internal gear 51 of the double-side polishing machine 5 is provided on the outer periphery of the carrier main body 42 of the carrier 4, but double-side polishing is performed only on the inner periphery of the carrier main body 42. A fixed tooth portion that can be fixed to the sun gear 52 of the machine 5 may be provided.

  In addition, the present invention can be carried out in a mode in which various improvements, modifications and variations are added based on the knowledge of those skilled in the art without departing from the spirit of the present invention. It may be implemented in a form in which any invention specific matter is replaced with another technology within a range where the same action or effect occurs, or the invention specific matter configured integrally may be constituted by a plurality of members. In addition, the invention specific items constituted by a plurality of members may be implemented in an integrated configuration.

DESCRIPTION OF SYMBOLS 10 Plate material 20 Dummy plate material 30 Laminated plate-shaped body 1 Disc-shaped work 2 Dummy 3 Laminated cylindrical body 31 Outer surface 32 End surface 4 Carrier 41 Circular hole 42 Carrier main body 43 Workpiece holding hole 431 Outer surface side hole wall portion 432 End surface side hole wall portion 44 Fixed tooth portion 5 Double-side polishing machine 51 Internal gear 52 Sun gear 6 Upper surface plate 7 Lower surface plate A Center axis of laminated cylinder T4 Circumferential tangent direction T6 of carrier body T6 rotational surface tangent direction of upper surface plate T7 rotational tangent surface of lower surface plate direction

Claims (4)

A workpiece held by a carrier is sandwiched between a pair of upper and lower upper and lower surface plates each having a polishing pad affixed to each other, and the upper surface plate and the lower surface plate are connected to each other while supplying abrasive. A polishing method in which the workpiece is polished by reverse rotation,
A preparation step of preparing a laminated cylindrical body obtained by laminating and integrating a plurality of disc-shaped workpieces;
The laminated cylinder is sandwiched between the upper platen and the lower platen with the axis of the laminated cylinder parallel to the opposing surfaces of the upper platen and the lower platen, and the outer circumferential surface of the laminated cylinder Polishing step for polishing,
Separating the laminated cylindrical body whose outer peripheral surface has been polished by the polishing step into a plurality of disk-shaped workpieces, and
In the polishing step,
The carrier holds the laminated cylinder so as to be rotatable about the axis while maintaining an attitude in which the axial direction of the laminated cylinder is inclined with respect to the rotational tangential direction of the upper and lower surface plates. ,
A method for polishing a peripheral surface of a disk-shaped workpiece, wherein the carrier is rotated in the same direction as the lower surface plate at a speed smaller than the lower surface plate . The preparation step includes
A laminating step of laminating and integrating a plurality of plate materials to form a laminated plate-like body;
A cutting step of cutting the laminated plate-like body into a cylindrical shape to form the laminated cylindrical body,
The peripheral surface grinding | polishing method of the disk shaped workpiece | work of Claim 1 containing this.   The method for polishing a peripheral surface of a disk-shaped workpiece according to claim 1 or 2, wherein both end portions of the laminated cylindrical body are made of dummy. A workpiece held by a carrier is sandwiched between a pair of upper and lower upper and lower surface plates each having a polishing pad affixed to each other, and the upper surface plate and the lower surface plate are connected to each other while supplying abrasive. A carrier used in a double-side polishing machine for rotating the workpiece in the reverse direction,
And the circular ring-shaped carry ya body,
The opened to the carry ya body, a plurality of disk-shaped laminate cylindrical body work was laminated and integrated, the axis of the laminated cylindrical body rotatably to the axis about the center and parallel to the plate surface of the carrier Ya body A work holding hole capable of holding;
Wherein provided on the carrier ya body, and a fixing tooth portion fixable to the internal gear that surrounds the sun gear or the sun gear of the double-side polishing machine,
The workpiece holding hole is composed of a pair of outer peripheral surface side hole wall portions that support the outer peripheral surface of the laminated cylindrical body and a pair of end surface side hole wall portions that support the end surface of the laminated cylindrical body, and the outer peripheral surface side hole A carrier for a double-side polishing machine, wherein a wall portion is formed obliquely with respect to a circumferential tangential direction of the carrier body.

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