JP5795946B2 - Manufacturing method of transparent wiring sheet - Google Patents

Description

  The present invention relates to a method for manufacturing a transparent wiring sheet provided in an input device for a touch panel.

In recent years, touch panels have been widely used in mobile phones, game machines, office office equipment, and the like. The touch panel usually includes an input device for coordinate detection on the front surface of an image display device such as a liquid crystal display.
Conventionally, in a touch panel input device, a transparent wiring sheet having a pair of conductive pattern forming sheets in which a conductive pattern is formed on one side of a transparent insulating base material has been used. Moreover, the transparent wiring sheet was produced by bonding a pair of conductive pattern forming sheets with a double-sided pressure-sensitive adhesive sheet (Patent Document 1).
However, when the conductive pattern forming sheet is bonded with the double-sided pressure-sensitive adhesive sheet, bubbles are likely to be mixed, and the light transmittance of the input device may be lowered. Therefore, the visibility of the image may be lowered. Moreover, since the optical double-sided pressure-sensitive adhesive sheet is expensive, it tends to be expensive.
Therefore, it is conceivable that conductive patterns are formed on both surfaces of a transparent insulating base material and the use of a double-sided pressure-sensitive adhesive sheet is omitted. Patent Documents 2 and 3 disclose a method of forming a conductive pattern on both surfaces of a transparent insulating substrate using laser light. However, if the methods described in Patent Documents 2 and 3 are applied as they are, the conductive patterns on the front and back sides become the same, and it is difficult to manufacture a wiring sheet that can be used as a wiring sheet for a touch panel input device. It was. Moreover, it is thought that it becomes a complicated process in order to make the front and back conductive patterns different.

JP 2011-018194 A Japanese Patent Laid-Open No. 11-170072 JP 2010-087204 A

  An object of this invention is to provide the manufacturing method of the transparent wiring sheet which can manufacture easily the transparent wiring sheet suitable for the input devices of a touch panel which formed the conductive pattern on both surfaces of the transparent insulating base material.

The present invention has the following aspects.
[1] A second transparent conductive layer is provided on a conductive substrate including a first transparent conductive layer provided on one surface of a transparent insulating substrate and a second transparent conductive layer provided on the other surface of the transparent insulating substrate. A transparent wiring sheet manufacturing method in which an insulating portion is formed in each of the first transparent conductive layer and the second transparent conductive layer to provide a conductive pattern by irradiating a laser beam in a pattern, and the focal length is A first insulating portion is formed in the first transparent conductive layer and a third insulating portion is formed in the second transparent conductive layer by condensing the laser beam with an optical system of 100 mm or more and irradiating the conductive substrate. A first insulating step and a second insulating portion different from the first insulating portion by condensing laser light by a condensing means having a numerical aperture of 0.30 to 0.85 and irradiating the first transparent conductive layer; A second irradiation step formed on the first transparent conductive layer, and a numerical aperture of 0.30; Third irradiation for forming a fourth insulating portion different from the third insulating portion on the second transparent conductive layer by condensing the laser beam by the condensing means of 0.85 and irradiating the second transparent conductive layer. And a process for producing a transparent wiring sheet.
[2] The method for producing a transparent wiring sheet according to [1], wherein the conductive substrate is placed on an opaque stage so that the first transparent conductive film is in contact therewith.
[3] After performing the second irradiation process after aligning the laser beam condensing point with the stage surface, the laser beam condensing point is raised by 20 to 80% of the thickness of the conductive substrate, and then the third irradiation step. Irradiation process is performed, The manufacturing method of the transparent wiring sheet as described in [2] characterized by the above-mentioned.
[4] At least one of the first transparent conductive layer and the second transparent conductive layer contains a layered transparent substrate and conductive ultrafine fibers arranged in a two-dimensional network inside the transparent substrate. The method for producing a transparent wiring sheet according to any one of [1] to [3].
[5] The method for producing a transparent wiring sheet according to [4], wherein each insulating portion is formed by evaporating and removing conductive ultrafine fibers without melting the transparent substrate by irradiation with laser light.

  According to the method for producing a transparent wiring sheet of the present invention, a transparent wiring sheet suitable for an input device for a touch panel in which conductive patterns are formed on both surfaces of a transparent insulating substrate can be easily produced.

In one Embodiment of the manufacturing method of the transparent wiring sheet of this invention, it is a top view which shows the 1st transparent conductive layer which comprises a transparent wiring sheet. In one Embodiment of the manufacturing method of the transparent wiring sheet of this invention, it is a top view which shows the 2nd transparent conductive layer which comprises a transparent wiring sheet. It is I-I 'sectional drawing of FIG. It is an electron micrograph of parts other than the insulating part of a transparent conductive layer. It is a top view which extracts and shows the 1st insulating part in the 1st transparent conductive layer of FIG. 1, and the 3rd insulating part in the 2nd transparent conductive layer of FIG. It is a top view which extracts and shows the 2nd insulating part in the 1st transparent conductive layer of FIG. It is an electron micrograph of the insulating part of a transparent conductive layer. It is a top view which extracts and shows the 4th insulating part in the 2nd transparent conductive layer of FIG. It is sectional drawing which shows an example of a 1st irradiation process. It is sectional drawing which shows an example of a 2nd irradiation process. It is sectional drawing which shows an example of a 3rd irradiation process. In other embodiment of the transparent wiring sheet of this invention, it is a top view which shows the part which a 3rd insulation part and a 4th insulation part cross | intersect. In other embodiment of the transparent wiring sheet of this invention, it is a top view which shows the part which a 3rd insulation part and a 4th insulation part cross | intersect.

<Transparent wiring sheet>
The transparent wiring sheet manufactured by one Embodiment of the manufacturing method of the transparent wiring sheet of this invention is demonstrated.
The transparent wiring sheet in this embodiment is shown in FIGS. The transparent wiring sheet 1 in the present embodiment is provided on the transparent insulating substrate 10, the first transparent conductive layer 20 provided on one surface of the transparent insulating substrate 10, and the other surface of the transparent insulating substrate 10. And a second transparent conductive layer 30.
In the present invention, “transparent” means that the light transmittance measured according to JIS K7105 is 50% or more. “Insulation” means that the electric resistance value is 1 MΩ or more, preferably 10 MΩ or more, and “conducting” means that the electric resistance value is less than 1 MΩ.

(Transparent insulating substrate)
Examples of the material of the transparent insulating substrate 10 include glass, polycarbonate, polyester such as polyethylene terephthalate (PET), acrylic resin, and the like.
The thickness of the transparent insulating substrate 10 is preferably 10 to 250 μm, and more preferably 25 to 188 μm. If the thickness of the transparent insulating substrate 10 is equal to or greater than the lower limit value, sufficient strength and rigidity can be ensured, and if the thickness is equal to or smaller than the upper limit value, the touch panel can be easily thinned.

(First transparent conductive layer)
The first transparent conductive layer 20 contains a layered transparent base B and conductive ultrafine fibers W arranged in a two-dimensional network inside the transparent base B (see FIG. 4), and the first insulating portion 21. When the second insulating portion 22 is formed, the first conductive pattern P ₁ is provided.

The first insulating portion 21 is formed in a substantially rectangular frame line portion 21a, a plurality of first straight portions 21b formed in the X direction (left-right direction in FIG. 5), and the Y direction (up-down direction in FIG. 5). The plurality of second straight portions 21c, a first connection assisting portion 21d intersecting the second straight portion 21c, and a routing circuit forming portion 21e (see FIG. 5).
A plurality of first straight portions 21b are formed inside the frame portion 21a, and the inside of the frame portion 21a is divided so that a plurality of conductive regions along the X direction are formed. However, the first straight line portion 21b is interrupted between the second straight line portions 21c and 21c, and is an intermittent straight line.
A plurality of second straight portions 21c are formed inside the frame portion 21a, and the inside of the frame portion 21a is divided so that a plurality of conductive regions along the Y direction are formed. However, the second straight portion 21c is interrupted between the first straight portions 21b and 21b, and is an intermittent straight line.
21 d of 1st connection assistance parts are formed in the vicinity of the part which the 2nd straight part 21c interrupted.
The second insulating portion 22 is linear and is formed so as to span the first straight portions 21b and 21b and continuously insulate the X direction along the first straight portions 21b (FIGS. 1 and 6). reference). In the present embodiment, the first straight portion 21b and the second straight portion 21c intersect each other. Therefore, even if the 2nd insulation part 22 is arrange | positioned so that the 2nd linear parts 21c and 21c may be spanned, the target insulation can be obtained.
In the present embodiment, the frame line portion 21a and the first straight line portion 21b, the frame line portion 21a and the second straight line portion 21c, and the second straight line portion 21c and the first connection auxiliary portion 21d are formed so as to intersect each other. If they are crossed, they can be connected even if they are not aligned with high precision during the production of the transparent wiring sheet.

  In the first transparent conductive layer 20 in the present embodiment, the first insulating portion 21 and the second insulating portion 22 are connected to continuously insulate the X direction, and the conductive region α for detecting the X coordinate is formed. Is formed.

  The first insulating portion 21 and the second insulating portion 22 are obtained by evaporating and removing the conductive ultrafine fibers without melting the transparent base B to form voids V (see FIG. 7). Remaining. Therefore, it is difficult to distinguish since the optical characteristics are almost the same as those of the conductive region containing the conductive ultrafine fibers.

  Although the width | variety of the 1st insulating part 21 and the 2nd insulating part 22 obtained by one time laser beam irradiation is based also on the wavelength of the condensing means and the laser beam to irradiate, it is 10-100 micrometers normally. When an insulating portion having a width of 100 μm is formed by laser irradiation, irradiation may be performed in a plurality of times.

The conductive ultrafine fibers are irregularly present along the surface direction of the surface of the transparent insulating base material 10 so as to face a random direction, and are densely packed so that at least a part of them are in contact with each other. It is arranged in a dimensional mesh. With such an arrangement, the conductive microfibers are electrically connected to each other to form a conductive network structure.
In addition, most of the conductive ultrafine fibers are embedded in the transparent substrate, but a part of the fibers protrudes from the surface of the transparent substrate.

  Conductive ultrafine fibers include metal nanowires and metal nanotubes made of copper, platinum, gold, silver, nickel, etc., fibrous members such as silicon nanowires and silicon nanotubes, metal oxide nanotubes, carbon nanotubes, carbon nanofibers, and graphite fibrils And the metal-coated member thereof. Among these, the metal nanowire (silver nanowire) which has silver as a main component from a transparency and electroconductivity point is preferable. The conductive ultrafine fiber preferably has a diameter of 0.3 to 100 nm and a length of 1 to 100 μm.

As a resin for forming a transparent substrate, transparent thermoplastic resin (polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polymethyl methacrylate, nitrocellulose, chlorinated polyethylene, chlorinated polypropylene, vinylidene fluoride), heat, Examples thereof include transparent curable resins (silicone resins such as melamine acrylate, urethane acrylate, epoxy resin, polyester resin, polyimide resin, and acrylic-modified silicate) that are cured by active energy rays (ultraviolet rays, electron beams, radiation).
The transparent substrate is preferably made of the same material as that of the transparent insulating substrate 10 in terms of adhesiveness and transparency. For example, when the transparent insulating substrate is a polyethylene terephthalate film, it is preferable to select a polyester resin as the transparent substrate.

(Second transparent conductive layer)
The second transparent conductive layer 30 contains a layered transparent substrate B and conductive ultrafine fibers W arranged in a two-dimensional network inside the transparent substrate B (see FIG. 4), and a third insulating portion. 31 the fourth and the insulating portion 32 is formed, the second conductive pattern P ₂ is provided.
As the transparent substrate and the conductive ultrafine fibers in the second transparent conductive layer 30, the same materials as those included in the first transparent conductive layer can be used. In the third insulating portion 31 and the fourth insulating portion 32, like the first insulating portion 21 and the second insulating portion 22, the conductive ultrafine fibers are evaporated and removed without melting the transparent base to form a gap. (See FIG. 7).

The third insulating portion 31 is formed in a substantially rectangular frame line portion 31a, a plurality of third straight portions 31b formed in the X direction (left-right direction in FIG. 5), and the Y direction (up-down direction in FIG. 5). The plurality of fourth straight portions 31c, a second connection auxiliary portion 31d intersecting the fourth straight portions 31c, and a routing circuit forming portion 31e (see FIG. 5).
A plurality of third straight portions 31b are formed inside the frame portion 31a, and the inside of the frame portion 31a is divided so that a plurality of conductive regions along the X direction are formed. However, the third straight part 31b is interrupted between the fourth straight parts 31c, 31c, and is an intermittent straight line.
A plurality of fourth linear portions 31c are formed inside the frame line portion 31a, and the inside of the frame line portion is divided so that a plurality of conductive regions along the Y direction are formed. However, the fourth straight portion 31c is interrupted between the third straight portions 31b and 31b and is an intermittent straight line.
The second connection assisting part 31d is formed in the vicinity of the interrupted portion of the fourth straight part 31c.
The fourth insulating portion 32 is linear, and is formed so as to continuously insulate the Y direction along the fourth straight portion 31c across the second connection auxiliary portions 31d and 31d (FIG. 2, FIG. 2). 8).
In the present embodiment, the second connection auxiliary portion 31d of the third insulating portion 31 and the fourth insulating portion 32 are formed so as to intersect each other. When the second connection auxiliary portion 31d and the fourth insulating portion 32 intersect, even when the second connection auxiliary portion 31d and the fourth insulating portion 32 are not accurately aligned at the time of manufacturing the transparent wiring sheet, These can be connected.
In the present embodiment, the frame line portion 31a and the third straight line portion 31b, and the frame line portion 31a and the fourth straight line portion 31c are formed so as to intersect each other.

  In the second transparent conductive layer 30 in the present embodiment, the Y-direction is continuously insulated by connecting the third insulating portion 31 and the fourth insulating portion 32, and the conductive region β for detecting the Y coordinate is formed. Is formed.

  The widths of the third insulating part 31 and the fourth insulating part 32 obtained by one laser beam irradiation are normally 10 to 100 μm, like the first insulating part 21 and the second insulating part 22. When an insulating portion having a width of 100 μm is formed by laser irradiation, the irradiation may be performed in a plurality of times.

(Outline mark, positioning mark)
The first transparent conductive layer 20 and the second transparent conductive layer 30 are provided with a visible outline mark surrounding the conductive pattern. Specifically, outline mark 23 of the first transparent conductive layer 20 is surrounds the conductive pattern P _1, outline mark 33 of the second transparent conductive layer 30 is surrounds the conductive pattern P _2, these external marks 23 and 33 Have the same shape so as to overlap each other.
The first transparent conductive layer 20 and the second transparent conductive layer 30 are provided with visible positioning marks 24 and 34 outside the outer shape marks 23 and 33. The positioning mark 24 of the first transparent conductive layer 20 and the positioning mark 34 of the second transparent conductive layer 30 have the same shape so as to overlap each other.
In addition, the 1st insulating part 21 provided in the 1st transparent conductive layer 20 and the 3rd insulating part 31 provided in the 2nd transparent conductive layer 30 are formed so that it may mutually overlap. More specifically, the first insulating portion 21 provided in the first transparent conductive layer 20 has a shape obtained by projecting the third insulating portion 31 provided in the second transparent conductive layer 30 onto the first transparent conductive layer 20. .

<Method for producing transparent wiring sheet>
Next, the manufacturing method of the transparent wiring sheet 1 of this embodiment is demonstrated using FIGS.
The manufacturing method of the transparent wiring sheet 1 of this embodiment has a transparent conductive layer formation process and a conductive pattern formation process.

(Transparent conductive layer forming process)
In the transparent conductive layer forming step, the first transparent conductive layer 20 is provided on one surface of the transparent insulating base material 10, the second transparent conductive layer 30 is provided on the other surface of the transparent insulating base material 10, and the conductive substrate is formed. It is a process to obtain.
As a method of providing the first transparent conductive layer 20, a dispersion liquid containing conductive ultrafine fibers is applied to one surface of the transparent insulating base material 10, and a paint containing a resin that forms a transparent substrate is formed thereon. Examples of the method include coating and filling a resin that forms a transparent substrate between conductive ultrafine fibers and then curing the resin.
As a method of providing the second transparent conductive layer 30, a dispersion containing conductive ultrafine fibers is applied to the other surface of the transparent insulating substrate 10, and a paint containing a resin that forms a transparent substrate is formed thereon. Examples of the method include coating and filling a resin that forms a transparent substrate between conductive ultrafine fibers and then curing the resin.
A known method may be applied as a dispersion coating method and a resin curing method.

(Conductive pattern formation process)
The conductive pattern forming step is a step of forming a conductive pattern by irradiating a conductive substrate with laser light to form an insulating portion.
Specifically, the conductive pattern forming step includes a first irradiation step of irradiating a laser beam in a predetermined pattern to form the first insulating portion 21 and the third insulating portion 31, and a step of forming the second insulating portion 22. A second irradiation step of irradiating the laser beam in a predetermined pattern; a third irradiation step of irradiating the laser beam in a predetermined pattern to form the fourth insulating portion 32; and a laser beam for forming the outer shape mark and the positioning mark. A fourth irradiation step of irradiating with a predetermined pattern.
Examples of the laser light used in the conductive pattern forming step include pulsed laser light such as YAG and YVO ₄ and continuous wave laser light such as a carbon dioxide gas laser. Among these, a pulsed laser beam having a wavelength of 1064 nm such as YAG or YVO ₄ or a second harmonic thereof and a pulse width of 1 to 200 nsec is preferable because it is simple. For applications in which the laser irradiation trace is not conspicuous, an ultrashort pulse laser having a wavelength of 1600 to 600 nm and a pulse width of 10 f to 100 p seconds is preferable.
In the pulsed laser, it is preferable to irradiate the conductive substrate while moving the position of the spot of the laser beam little by little so that the spots overlap each other.

  In the portions of the first transparent conductive layer 20 and the second transparent conductive layer 30 irradiated with laser light, the conductive ultrafine fibers are evaporated and removed without melting the transparent substrate, thereby forming voids. In this gap, there is no contact between the conductive ultrafine fibers, and the conductive network is disconnected, so that it becomes an insulating portion.

The insulating part is formed by a pulsed laser, and the pulse width is sufficiently shorter than the scanning speed. Therefore, the focused spot is substantially circular, and the width of the insulating part is equal to the focused spot diameter.
The irradiation energy density per pulse of the laser beam is defined as the irradiation energy per pulse of the laser beam divided by the focused spot area. The value is 1 × 10 ⁴ to 1 × 10 ⁵ J / m ² regardless of the wavelength of the laser beam when the pulse width is in the range of 10 fsec to 200 nsec.
In addition, in order to form a continuous insulating portion, it is necessary that individual focused spots formed by moving by scanning overlap each other. Especially in a transparent conductive layer containing silver nanowires, the insulating portion is visually recognized. From the standpoint of difficulty and insulation stability, the number of overlaps is preferably about 1.5 to 10 times. In addition, when the outer shape marks 23 and 33 and the positioning marks 24 and 34 are intended to be visually recognized, the overlap count is set to 25 times or more, or the overlap count is set to 25 times by a plurality of scans. It is preferable to make it above.

When irradiating a laser beam, the conductive substrate is usually placed on a stage so as to be slidable in the X and Y directions in advance. As the stage, a light scattering and opaque plate is preferable. Here, the term “opaque” means that the light transmittance measured according to JIS K7105 is 10% or less. Examples of the light-scattering and opaque plate include a plate with irregularities formed on the surface, a plate containing filler or air inside, and a plate coated with colored ink on the surface.
The 1st transparent conductive layer 20 and the 2nd transparent conductive layer 30 are transparent, and it is hard to match | combine focus (the condensing point of a laser beam). However, in the case of using a light-scattering and opaque plate as the stage, the first transparent conductive layer 20 is focused and irradiated with laser light by focusing on the opaque stage in the second irradiation step. be able to. In the third irradiation step, the second transparent conductive layer 30 is focused and irradiated with laser light by raising the focus by 20 to 80% of the thickness of the conductive substrate A after the second irradiation step. be able to. Therefore, even if the first transparent conductive layer 20 and the second transparent conductive layer 30 are transparent, each of the first transparent conductive layer 20 and the second transparent conductive layer 30 can be easily focused, and the second insulation The part 22 and the fourth insulating part 32 can be easily formed.
Moreover, it is preferable that the stage can be sucked in order to fix the conductive substrate.

[First irradiation step]
In the first irradiation step, the patterns of the first insulating portion 21 and the third insulating portion 31 are formed on the conductive substrate A placed on the stage 50 using the laser light L ₁ condensed by the long focal length optical system. In this way, irradiation is performed from the second transparent conductive layer 30 side (see FIG. 9). Part of the irradiated laser light heats and evaporates the conductive microfibers W in the second transparent conductive layer 30, thereby destroying the conductive network and forming the third insulating portion 31. Most of the remaining laser light passes through the second transparent conductive layer 30 and reaches the first transparent conductive layer 20 to break the conductive network, thereby forming the first insulating portion. Here, the long focal length means that the focal length is 100 mm or more. In terms of practicality, the focal length is preferably 500 mm or less. Further, the long focal length optical system preferably has a numerical aperture of 0.1 or less, more preferably 0.05 or less, and further preferably 0.02 or less. If the numerical aperture of the optical system is less than the upper limit, since the width of the laser beam L ₁ (diameter) tends to a constant, to improve the first insulating portion 21 the identity of the pattern of the third insulating section 31 Can do. On the other hand, when the numerical aperture of the optical system exceeds the upper limit, since gradually decreases as the width of the laser beam L ₁ (diameter) approaches the conductive substrate A, the laser beam L applied to the second transparent conductive layer 30 _first diameter is larger than the laser beam diameter of L ₁ irradiated to the first transparent conductive layer 20. Therefore, the width of the third insulating portion 31 is larger than the width of the first insulating portion 21.
A galvanometer mirror is mentioned as an optical system of the super focal distance which has the said numerical aperture. When a galvano mirror is used as the long focal length optical system, the laser beam L _{1 is applied} to the conductive substrate A by controlling the position (orientation) of the galvano mirror without sliding the stage in the X direction or the Y direction. Can be scanned. Since the position control of the galvanometer mirror can be accurately and rapidly, formed according to the scanning of the laser beam L ₁ with galvanometer mirror, accurately and quickly the first insulating portion 21 and the third insulating portion 31 of the pattern of interest it can.

[Second irradiation step]
In the second irradiation step, irradiating a laser beam L ₂ condensed by the high numerical aperture of the focusing means so the focal point is positioned on the first transparent conductive layer 20 (see FIG. 10). Irradiation pattern of the laser beam L ₂ is a pattern in which the second insulating portion 22 is formed.
Here, the high numerical aperture is 0.30 to 0.85, preferably 0.50 to 0.80. As the high numerical aperture condensing means, an objective lens or a single lens can be used. The laser beam L ₂ condensed by the high numerical aperture of the focusing means is gradually reduced as the width (diameter) approaches the conductive substrate A. Therefore, since the energy is high at the condensing point, the conductive ultrafine fibers can be removed by evaporation. However, if the distance from the condensing point is reached, the energy becomes low, and the conductive ultrafine fibers cannot be removed. Therefore, by adjusting the position of the condensing point to the first transparent conductive layer 20, only the first transparent conductive layer 20 can remove the conductive ultrafine fibers. In addition, when a condensing point is match | combined with the 2nd transparent conductive layer 30, only the 2nd transparent conductive layer 30 can remove a conductive microfiber.
In the second irradiation step, in order to irradiate the laser beam L ₂ to the conductive substrate in a pattern of purposes, it is sufficient to slide the stage 50 at least one of X and Y directions.

[Third irradiation step]
In the third irradiation step, after the condensing point of the laser light L ₂ condensed by the high numerical aperture condensing means is changed to the second transparent conductive layer 30, the second transparent conductive layer 30 is irradiated with the laser light L ₂ . (See FIG. 11). Irradiation pattern of the laser beam L ₂ is a pattern fourth insulating portion 32 is formed. By forming the fourth insulating part 32 in the second transparent conductive layer 30, the transparent wiring sheet 1 can be obtained.
In the third irradiation step, in order to irradiate the laser beam L ₂ to the conductive substrate A in the desired pattern, it is sufficient to slide the stage 50 at least one of X and Y directions.
In the third irradiation step in the present embodiment, it is difficult to accurately connect and connect the end of the fourth insulating portion 32 to the end of the third insulating portion 31, and thus the second connection of the third insulating portion 31. The fourth insulating portion 32 is formed so as to intersect the auxiliary portion 31d. When the fourth insulating portion 32 intersects the second connection assisting portion 31d, the end in the formation direction of the fourth insulating portion 32 protrudes from the second connection assisting portion 31d.

[Fourth irradiation step]
In the fourth irradiation step, a laser beam L ₁ was condensed by an optical system of long focal length to the conductive substrate A, irradiated in a pattern outline marks 23, 33 and the positioning marks 24, 34 are formed. In more該工, to enable viewing the external marks 23, 33 and the positioning marks 24, 34 is irradiated with laser light L ₁ is colored a transparent substrate at a higher energy than the first irradiation step. As a method for irradiating a laser beam L ₁ at a higher energy than the first irradiation step, a method of slowing the scanning speed of the laser beam L _1, a method of irradiating a plurality of times with a laser beam L ₁ in the same position, the laser beam L ₁ The method of raising the output of is mentioned.
Note that the fourth irradiation step may be performed at any timing, for example, before the first irradiation step, after the third irradiation step, or between the first irradiation step and the second irradiation step. It may be between the second irradiation step and the third irradiation step.

(Function and effect)
In the first irradiation step in the method for manufacturing the transparent wiring sheet 1, the first insulation of the first transparent conductive layer 20 is performed by irradiating the conductive substrate A with the laser light L ₁ collected by the long focal length optical system. The part 21 and the third insulating part 31 of the second transparent conductive layer 30 are formed simultaneously. In the second irradiation step, the laser beam L ₂ condensed by the high numerical aperture of the focusing means by irradiating the first transparent conductive layer 20, a second insulating portion 22 of the first transparent conductive layer 20 To do. In the third irradiation step, the laser beam L ₂ condensed by the high numerical aperture of the focusing means by irradiating the second transparent conductive layer 30, forming a fourth insulating portion 32 of the second transparent conductive layer 30 To do. Therefore, since an insulating part can be formed only by laser light irradiation L ₁ and L ₂ , the transparent wiring sheet 1 in which the conductive patterns P ₁ and P ₂ are formed on both surfaces of the transparent insulating substrate 10 can be easily manufactured.
In the manufacturing method of the transparent wiring sheet, the conductive pattern P ₁ by forming a first insulating portion 21 and the second insulating portion 22 on the first transparent conductive layer 20 provided on one surface of the transparent insulating substrate 10 Is provided to form a conductive region α for X coordinate detection. The third insulating section 31 and the conductive for Y coordinate detection provided with conductive patterns P ₂ by forming a fourth insulating portion 32 to the second transparent conductive layer 30 provided on the other surface of the transparent insulating substrate 10 Region β is formed. The formation direction of the conductive region α for X coordinate detection and the formation direction of the conductive region β for Y coordinate detection are orthogonal, and when used as an input device for a touch panel, the conductive region for X coordinate detection The X coordinate can be detected by α, and the Y coordinate can be detected by the conductive region β for Y coordinate detection. That is, the transparent wiring sheet 1 is suitable for an input device for a touch panel.
Therefore, in the obtained transparent wiring sheet 1, when manufacturing the input device for touch panels, it is not necessary to bond a pair of conductive pattern formation sheet, and it is not necessary to use a double-sided adhesive sheet. Therefore, the input device can be manufactured with excellent image visibility and at a low cost.

(Other embodiments)
In addition, this invention is not limited to the said embodiment.
The second insulating portion and the fourth insulating portion are not linear but may be curved. As shown in FIG. 12, when the fourth insulating portion 32 has a curved shape, the fourth insulating portion 32 is added to the third insulating portion 31 even if the second connection auxiliary portion is omitted in the third insulating portion 31. Can be crossed.
In particular, when crosstalk suppression between adjacent electrodes is important, as shown in FIG. 13, two or more (two in the illustrated example) sandwiching the conductive portions 30a and 30b having a width of about 0.1 to 1 mm are sandwiched. It is preferable to form the third insulating parts 31 and 31 and the fourth insulating parts 32 and 32 in parallel. By forming the insulating portion in this way, the coupling capacity with the adjacent electrode can be efficiently reduced even with a short laser light irradiation time.
A protective film for protecting these may be provided on the exposed surface of the first transparent conductive layer and the exposed surface of the second transparent conductive layer. As a material for forming the protective film, for example, the same resin as that for forming the transparent base of the first transparent conductive layer and the second transparent conductive layer can be used.
Moreover, the formation direction of the conductive region of the first conductive pattern and the formation direction of the conductive region of the second conductive pattern do not have to be orthogonal to each other as long as they are in a twisted position. However, the angle between the formation direction of the conductive region of the first conductive pattern and the formation direction of the conductive region of the second conductive pattern is preferably 60 ° to 90 °.

The first transparent conductive layer may contain a conductive substance other than the conductive ultrafine fibers. However, in order to collectively form the second transparent conductive layer and the first transparent conductive layer by irradiation through the second transparent conductive layer using a long focal length optical system in the first irradiation step, the second The transparent conductive layer preferably contains conductive ultrafine fibers, particularly silver nanowires. When conductive parts are included in the insulator with non-uniform size at the wavelength level of the irradiated light, including conductive ultrafine fibers, the processing traces are difficult to see and the appearance is important (for example, capacitance Type touch panel).
On the other hand, the second transparent conductive layer is a uniform conductive layer such as an ink coating layer containing a conductive polymer-based conductive agent obtained by blending a polyethylenedioxythiophene-polystyrenesulfonic acid composite with a high conductive agent or stabilizer. In some cases, when the first transparent conductive layer is formed via the second transparent conductive layer, processing traces may be generated in the second transparent conductive layer. In addition, the first transparent conductive layer may not be sufficiently insulated.

After applying and drying an ink containing a metal ultrafine fiber (trade name Ohm of Cambrios, wire diameter of metal nanofiber of about 50 nm, length of about 15 μm) on one side of a transparent polyethylene terephthalate film (PET film) having a thickness of 125 μm, UV-curable polyester resin ink was overcoated, dried and UV-treated. This provided the 1st transparent conductive layer in which the metal ultrafine fiber was contained in the inside of the polyester resin on the PET film in the shape of a two-dimensional network. Moreover, after providing the 2nd transparent conductive layer similarly to the formation method of a 1st transparent conductive layer in the other surface of the said PET film, it cut | judged to A4 size and obtained the conductive substrate. The surface resistance of each transparent conductive layer of the conductive substrate was 200 to 250Ω / □, and the light transmittance was 93%.
Next, the obtained conductive substrate was placed on a stage having a thickness of 5 mm made of polyacetal (Duracon manufactured by Polyplastics) so that the first transparent conductive layer was in contact therewith.
Next, using a double-wave YVO ₄ laser having a wavelength of 532 nm, an output of 6 W, a pulse width of 20 ns, a repetition frequency of 100 kHz, and a beam diameter of 6.7 mm, and using a condensing lens with a focal length FL = 300 mm and a galvanomirror The substrate was irradiated with laser light at a scanning speed of 2000 mm / sec. In this laser light irradiation, the first insulating portion 21 as shown in FIG. 5 was formed on the first transparent conductive layer, and the third insulating portion 31 was formed on the second transparent conductive layer.
In addition, when drawing was performed by irradiating a 125 μm thick aluminum vapor-deposited film with laser light under the same conditions, it was confirmed that the width of the aluminum vapor-deposited layer was 50 μm and the diameter of the focused spot was 50 μm. did.
Next, laser light is irradiated under the same conditions as described above except that the scanning speed is 100 m / sec, and the first and second transparent conductive layers are positioned with the external marks 23 and 33 as shown in FIGS. Marks 24 and 34 were formed. The outline marks 23 and 33 and the positioning marks 24 and 34 were visible.

Next, the conductive substrate on which the first insulating portion and the third insulating portion were formed was transferred onto a stage made of a ceramic porous plate that was slidable and adsorbable in the X direction and the Y direction, and was fixed by suction.
Next, an objective lens having a numerical aperture of 0.8, a pupil diameter of 2.1 mm, and a focal length of 2 mm is used as a condensing means, and the aperture is stopped down to the pupil diameter of a laser beam lens having a wavelength of 532 nm, a pulse width of 20 nsec, and a repetition frequency of 1 kHz The beam intensity was adjusted so that the output was 18 mW in the measurement after passing through the objective lens.
Next, the position of the objective lens was adjusted so that the focus (condensing point) of the laser light was focused on the stage using visible light.
In this state, positioning was performed with reference to the positioning mark 24, and the stage was moved so that the scanning speed was 10 mm / second, and the second insulating portion 22 as shown in FIG. 6 was formed in the first transparent conductive layer 20. .
Next, the fourth insulating portion 32 as shown in FIG. 8 is used under the same conditions as the formation of the second insulating portion 22 except that the objective lens is raised by 100 μm and adjusted so that the output becomes 12 mW in the measurement after passing through the objective lens. Was formed on the second transparent conductive layer 30.
In addition, the pattern width of the 2nd insulating part 22 and the 4th insulating part 32 was 15 micrometers, and the condensing point (spot diameter) was 15 micrometers.
As described above, the first insulating portion and the second insulating portion are formed on the first transparent conductive film to provide the conductive pattern, and the third insulating portion and the fourth insulating portion are formed on the second transparent conductive layer to form the conductive pattern. A transparent wiring sheet was obtained.

About the 1st transparent conductive layer and 2nd transparent conductive layer of the obtained transparent wiring sheet, when the electrical resistance of the mutually adjacent conductive region was measured with the commercially available digital tester, it was 10 MΩ or more, and sufficient insulation was ensured. It had been.
Moreover, when the electrical resistance in each conductive region was measured, it was 10 kΩ or less, and sufficient conductivity was ensured.
In the manufacturing method of the said Example, the transparent wiring sheet which formed the conductive pattern on both surfaces of PET film was able to be manufactured simply.

DESCRIPTION OF SYMBOLS 1 Transparent wiring sheet 10 Transparent insulation base material 20 1st transparent conductive layer 21 1st insulation part 21a Frame line part 21b 1st straight line part 21c 2nd straight line part 21d 1st connection auxiliary | assistant part 21e Leading circuit formation part 22 2nd insulation part 23 outline mark 24 positioning mark 30 2nd transparent conductive layer 31 3rd insulation part 31a frame line part 31b 3rd straight line part 31c 4th straight line part 31d 2nd connection auxiliary part 31e routing circuit formation part 32 4th insulation part 33 outline mark 34 Positioning Mark 50 Stage A Conductive Substrate B Transparent Base V Gap W Conductive Ultrafine Fiber L ₁ , L ₂ Laser Light P ₁ First Conductive Pattern P ₂ Second Conductive Pattern

Claims (5)

A laser is passed through a second transparent conductive layer to a conductive substrate comprising a first transparent conductive layer provided on one side of the transparent insulating base and a second transparent conductive layer provided on the other side of the transparent insulating base. A method for producing a transparent wiring sheet in which an insulating part is formed in each of a first transparent conductive layer and a second transparent conductive layer by irradiating light in a pattern, and a conductive pattern is provided,
By condensing the laser beam with an optical system having a focal length of 100 mm or more and irradiating the conductive substrate, the first insulating portion is formed on the first transparent conductive layer and the third insulating portion is formed on the second transparent conductive layer. A first irradiation step to be formed;
By condensing the laser beam by a condensing unit having a numerical aperture of 0.30 to 0.85 and irradiating the first transparent conductive layer, a second insulating portion different from the first insulating portion is formed on the first transparent conductive layer. A second irradiation step to be formed on,
By condensing laser light by a condensing means having a numerical aperture of 0.30 to 0.85 and irradiating the second transparent conductive layer, a fourth insulating portion different from the third insulating portion is provided in the second transparent conductive layer. And a third irradiation step to be formed on the transparent wiring sheet.   The method for producing a transparent wiring sheet according to claim 1, wherein the conductive substrate is placed on an opaque stage so that the first transparent conductive film is in contact therewith.   After performing the second irradiation step after aligning the laser beam condensing point with the stage surface, the laser beam condensing point is raised by 20 to 80% of the thickness of the conductive substrate, and then the third irradiation step is performed. The method for producing a transparent wiring sheet according to claim 2, wherein the method is performed.   At least one of the first transparent conductive layer and the second transparent conductive layer contains a layered transparent substrate and conductive ultrafine fibers arranged in a two-dimensional network inside the transparent substrate. The manufacturing method of the transparent wiring sheet as described in any one of Claims 1-3.   5. The method for producing a transparent wiring sheet according to claim 4, wherein the insulating portions are formed by evaporating and removing the conductive fine fibers without melting the transparent substrate by irradiation with laser light.