JP5785026B2 - Polishing pad groove processing machine and polishing pad groove processing method - Google Patents

Description

  The present invention is a cutting device provided with a cutting blade for cutting and forming multiple grooves on the surface of the polishing pad by acting on the surface of the polishing pad, and located on the rear side in the cutting direction of the cutting blade, A polishing pad grooving machine and a polishing machine comprising: a rear air blow device that blows air toward the cutting edge; and a dust introduction part that is located near the periphery of the cutting blade and sucks and collects chips generated by cutting The present invention relates to a pad groove processing method.

  The manufacturing process of a semiconductor device includes a step of forming a conductive film on the surface of a semiconductor wafer and forming a wiring layer by photolithography or etching, a step of forming an interlayer insulating film on the wiring layer, and the like. Although included, these steps cause irregularities made of a conductor such as metal or an insulator on the wafer surface. In recent years, miniaturization of wiring and multilayer wiring have progressed for the purpose of increasing the density of semiconductor integrated circuits, and a technique for flattening the unevenness of the wafer surface is important. As a method for flattening the unevenness on the wafer surface, a CMP (chemical mechanical polishing) method is generally employed.

  In carrying out CMP, it is necessary that the slurry is uniformly supplied to the wafer surface and does not stay in a certain place on the wafer surface, and is updated to a newly supplied slurry. Therefore, multiple grooves are formed on the polishing surface of a conventionally used polishing pad. In Patent Document 1 below, as a tool for cutting such a groove, a plurality of cutting blades are arranged in a protruding manner to form a multi-blade unit, and a groove processing configured so that multiple grooves can be formed simultaneously by cutting. A tool is disclosed.

  By the way, when cutting and forming a plurality of grooves on a polishing pad, there are cases where ribbon-like or thread-like elongated chips are generated, and since the polishing pad is made of a polymer material, it is easily charged by friction due to cutting. For this reason, there is a problem that chips are entangled with the cutting edge of the tool and the processing accuracy is deteriorated. In particular, in the case of grooves that are concentrically or spirally continuous, the above-mentioned problem becomes noticeable because the chips are easily elongated.

  Therefore, in the following Patent Document 1, an air blow device is provided, and air is blown to the cutting blade to remove chips from the cutting blade. The removed chips are sucked and collected by a collecting device disposed on the rear side in the cutting direction of the cutting device. The collection device includes a dust collection casing having a dust collection port, and chips are sucked and collected through the dust collection port.

Japanese Patent Laid-Open No. 2008-200767

  When polishing the groove of the polishing pad, as described above, elongated chips that form ribbons or threads may be generated, and in order to reliably remove from the cutting blade, the air blow pressure may be increased, If it is too high, dust cannot be collected at the dust collecting port, and it will jump out to the front side in the cutting direction (outside the collecting device) from the collecting device. If it does so, the collection | recovery efficiency of chips will fall, and chips will fly to circumference | surroundings, and will become a factor which increases unnecessary maintenance work.

  The present invention has been made in view of the above circumstances, and the problem is that a polishing pad groove processing machine and a polishing pad groove capable of reliably removing chips entangled with a cutting blade and enhancing chip recovery efficiency. It is to provide a processing method.

In order to solve the above problems, a polishing pad groove processing machine according to the present invention is:
A cutting device provided with a cutting blade for acting on the surface of the polishing pad to cut and form multiple grooves on the surface of the polishing pad, and the direction of the cutting blade located behind the cutting direction of the cutting blade In a polishing pad grooving machine comprising a rear side air blowing device that blows air toward and a dust introduction part that is located near the periphery of the cutting blade and sucks and collects chips generated by cutting,
The dust introduction part is
A dust collection housing portion having a dust collection port that can be set at a position facing the surface of the polishing pad;
E Bei a rectifying means for guiding the chips located in the dust port upward,
A front-side air blowing device that blows air from above onto the surface of the polishing pad is provided on the front side in the cutting direction of the dust collecting casing .

  The operation and effect of the polishing pad groove processing machine having such a configuration will be described. In this polishing pad grooving machine, a rear air blow device is provided on the rear side in the cutting direction of the cutting blade of the cutting device, and a dust introduction portion is provided in the vicinity of the periphery. Chips generated by cutting are removed by blowing air with a rear air blow device, and then sucked and collected from the dust collecting port of the dust collecting casing. At this time, the dust collection port is provided with a rectifying means, and the rectifying means acts so that the chips are guided upward, so that the chips are prevented from jumping out to the front or the periphery of the dust introduction portion and collected. Efficiency can be increased. As a result, it is possible to provide a polishing pad grooving machine capable of reliably removing chips entangled with the cutting blade and increasing the efficiency of collecting chips.

  The rectifying means according to the present invention is preferably arranged as a rectifying plate that is arranged on the front side in the cutting direction of the dust collecting port and is inclined toward the front side in the cutting direction as it goes upward.

  According to this configuration, the chips are guided upward along the current plate. Since this current plate is inclined to the front side in the cutting direction as it goes upward, it corresponds to the air flow direction (from the rear to the front) from the air blowing device, and the blowing force is used to rectify the chips. Can be raised along the plate.

  In the present invention, it is preferable that a second rectifying means is further arranged on the rear side in the cutting direction of the dust collecting port.

  By providing the rectifying means not only on the front side in the cutting direction but also on the rear side in the cutting direction, chips can be guided more efficiently and the collection efficiency can be increased.

  The rectifying means according to the present invention preferably has a function of reducing the opening area of the dust collection port. By reducing the opening area, the suction speed can be increased without increasing the suction force, and chips can be reliably sucked and collected.

  In the present invention, it is preferable that a front-side air blow device that blows air from above on the surface of the polishing pad is provided on the front side in the cutting direction of the dust collecting housing.

  By providing the front air blow device, an air wall can be formed on the outer side of the front side of the recovery device. Thereby, it is possible to prevent chips from flying out to the front side of the dust introduction part, and to further improve the recovery efficiency by the dust introduction part.

In order to solve the above problems, a polishing pad groove processing method according to the present invention is as follows.
A step of causing the cutting blade to act on the surface of the polishing pad to form a plurality of grooves on the surface of the polishing pad; and air is blown toward the cutting blade at a position on the front side in the cutting direction of the cutting blade. A polishing pad groove processing method comprising: a step and a step of sucking and collecting chips generated by cutting at a position near the periphery of the cutting blade,
The sucking and collecting step includes
Wherein a position facing the surface of the polishing pad in proximity to the dust collecting port of the dust collecting casing, and have a step of guiding the cutting chips from the dust collecting port upward by rectifying means,
A step of blowing air onto the surface of the polishing pad from above is provided on the front side in the cutting direction of the dust collecting casing .

  The operation and effect of the polishing pad groove processing method with such a configuration is as described above, and the dust collection port is provided with a rectifying means, and the rectifying means acts so that chips are guided upward, Chips can be prevented from jumping out to the front of the dust introduction part, and the recovery efficiency can be increased.

  In this invention, it is preferable to have the process of blowing air from the upper direction on the surface of the said polishing pad in the said cutting direction front side of the said dust collection housing | casing part.

  Thereby, as mentioned above, it is possible to prevent chips from flying out to the front side of the dust introduction part, and to further improve the recovery efficiency by the dust introduction part.

The side view which shows roughly an example of a structure of the polishing pad groove processing machine which concerns on this invention Front view of cutting device and front air blow device provided in grooving machine The top view which shows schematic structure at the time of giving a groove process to a polishing pad The figure which shows the state which separated the polishing pad groove processing machine from the polishing pad Conceptual diagram showing the configuration of the dust inlet Conceptual diagram explaining the effect of current plate Conceptual diagram explaining the effect of the front air blow device Flowchart explaining operation of polishing pad groove processing machine Figure showing experimental results The figure which shows the polishing pad groove processing machine which concerns on another embodiment 1 The figure which shows the polishing pad groove processing machine which concerns on another embodiment 2

<Configuration of polishing pad groove processing machine>
A preferred embodiment of a polishing pad groove processing machine according to the present invention will be described with reference to the drawings. FIG. 1 is a side view schematically showing an example of the configuration of a polishing pad groove processing machine according to the present invention. FIG. 2 is a front view of the cutting device and the air blowing device provided in the grooving machine as viewed from the left in FIG. FIG. 3 is a plan view showing a schematic configuration when the polishing pad is grooved. FIG. 4 is a view showing a state in which the polishing pad groove processing machine is separated from the polishing pad.

  This polishing pad grooving machine 100 (hereinafter sometimes simply referred to as a grooving machine) includes a cutting device 2 having a cutting edge 20 for cutting the surface of the polishing pad 1, and adjacent to the cutting device 2. The rear air blow device 3 arranged, a dust introduction portion 4 (corresponding to the collection device) for sucking and collecting chips generated by cutting, and a front air blow device 5 arranged adjacent to the dust introduction portion 4. And comprising. Although not shown, a cleaning device having a brush for cleaning the cutting blade 20 may be provided.

  As shown in FIG. 3, the polishing pad 1 is rotated around the central axis 14, and the surface thereof moves from left to right in FIG. The multiple grooves are extended toward the left in FIG. 1 using the rotation of the polishing pad 1. Accordingly, the left side in FIG. 1 is the front side in the cutting direction, and the right side in FIG. 1 is the rear side in the cutting direction. In the present embodiment, the rear air blow device 3 is disposed on the rear side in the cutting direction of the cutting device 2, and the dust introduction portion 4 is disposed on the front side in the cutting direction (corresponding to the vicinity of the periphery of the cutting blade). Further, a front air blow device 5 is arranged further forward in the cutting direction of the dust introduction portion 4.

  The cutting device 2, the air blowing devices 3, 5, and the dust introduction unit 4 are integrally formed as a unit, and are configured to be laterally movable together by a moving mechanism 10 (see FIG. 3). This lateral movement is movement of the polishing pad 1 in the radial direction, and in FIG. 1 is movement in the vertical direction of the paper surface. As shown in FIGS. 1 and 4, the cutting device 2, the air blowing devices 3 and 5, and the dust introduction unit 4 are configured to be moved up and down together by a moving mechanism 10. The control device 12 also controls these operations by the moving mechanism 10.

  As shown in FIG. 2, the cutting device 2 includes a multi-blade tool 21 in which a plurality of cutting blades 20 are arranged and projected in a lateral direction at a predetermined pitch P. The multi-blade tool 21 is formed by alternately laminating the cutting blades 20 and spacers for maintaining the pitch P between the cutting blades 20 to form a multi-blade unit, or by laminating the cutting blades 20 integrated with the spacers. It can be configured by forming a blade unit and mounting the multi-blade unit so that it can be replaced with a holder. The pitch P between the cutting edges 20 is set according to the groove pitch to be formed.

  Each cutting edge 20 is moved up and down by the cutting device 2 described above, so that the cutting position close to the surface of the polishing pad 1 (see FIG. 1) and the non-cutting position separated from the surface of the polishing pad 1 (see FIG. 4). It is displaced between. Groove machining for the polishing pad 1 is performed when each cutting edge 20 is in a cutting position. In a state where cutting is actually performed, the cutting edge of the cutting blade 20 is lowered to a position where it enters the surface of the polishing pad 1.

  In the present invention, the shape of the cutting blade 20 is not particularly limited, and the blade angle, the front clearance angle, and the lateral clearance angle can be appropriately changed depending on conditions such as the material to be processed, the groove shape, and the blade material. The material of the cutting blade 20 is not particularly limited, and examples thereof include carbon steel, alloy steel, high speed steel, cemented carbide, cermet, stellite, ultra high pressure sintered body, ceramic, and the like. However, from the viewpoint of preventing metal residue on the surface of the polishing pad 1 and suppressing metal contamination on the wafer surface, the material of the cutting blade 20 is preferably a non-metal such as diamond.

  The rear-side air blow device 3 has a function of blowing air (shown by broken arrows) held at room temperature or lower from the jet port 30 and blowing it to the cutting blade 20 to cool it. The flow rate of the air can be adjusted as appropriate. In the present embodiment, each of the jet ports 30 is opened facing the cutting blades 20 and is arranged in the horizontal direction at a pitch corresponding to the pitch P between the cutting blades 20. Moreover, the angle of the jet nozzle 30 can be changed as needed.

  As shown in FIG. 2, the ejection port 30 of the front air blow device 3 which is the front side in the processing direction of the cutting device 2 is obliquely above the cutting edge of the cutting blade 20 while making the phase in the lateral direction substantially the same as that of the cutting blade 20. Is provided. As a result, when the cutting blade 20 is cooled, it acts so as to push down the attached chips from diagonally forward and upward, so that the chips can be easily separated from the cutting blade 20.

  A dust collector (not shown) collects the chips separated from the cutting blade 20 by the negative pressure through the dust introduction part 4 by suction. FIG. 5 is a conceptual diagram showing a configuration of a dust collection box 40 (corresponding to a dust collection housing portion) of the dust introduction unit 4. The dust collection box 40 has a substantially cubic shape, and the internal space functions as a space (or a passage) for collecting chips to a predetermined collection place.

  A dust collection port 40a is formed on the bottom surface of the dust collection box 40, and chips are collected through the dust collection port 40a. The dust collection port 40a is formed not only on the bottom surface but also on the bottom side surface on the rear side. The length of the dust collection port 40a on the bottom is indicated by L1. The height of the dust collection port 40a on the bottom side surface on the rear side is indicated by L2. By forming in this way, the chips separated from the cutting blade 20 can be collected smoothly by the force of air.

  Further, as shown in FIG. 1, a front rectifying plate 41 functioning as a rectifying unit and a rear rectifying plate 42 (corresponding to a second rectifying unit) are provided inside the dust collection box 40. The front-side rectifying plate 41 is installed in an inclined state in the dust collection box 40, and is installed in an inclined state toward the front side as it goes upward. This front side rectifying plate 41 prevents the chips entering through the dust collection port 40a from staying in the vicinity of the dust collection port 40a, and smoothly guides them upward. The purpose is to increase. Moreover, it is along the air blowing direction from the back side air blow apparatus 3, and can raise chips smoothly with air.

  The rear side rectifying plate 42 has the same length as the front side rectifying plate 41 and is attached to the inner wall surface of the dust collection box 40 on the rear side of the dust collection port 40a. The rear current plate 42 is installed in a vertical posture, prevents chips from being caught at the dust collection port 40a, and can collect the chips smoothly. Further, grooves 41a and 42a are formed in the front side rectifying plate 41 and the rear side rectifying plate 42, respectively, along the flow direction of the chips so that the chips can be efficiently collected. The size, shape, and direction of the grooves 41a and 42a can be set as appropriate.

  A support portion 40b is provided integrally with the dust collection box 40 at the lower portion of the front side rectifying plate 41, and holds the front side rectifying plate 41 in a stable state. Compared with the case where these rectifying plates 41 and 42 are not provided, the area of the dust collection port 40a is reduced. Therefore, the air flow rate at the dust collection port 40a can be increased without increasing the suction capability of the fan of the dust collector (not shown), and chips can be efficiently collected.

  FIG. 6 is a conceptual diagram illustrating the effect of the rectifying plates 41 and 42. Without the rectifying plates 41, 42, the area of the dust collection port 40a also increases, and the chips collide with the inner wall surface on the front side of the dust collection box 40 and cannot rise smoothly (the chips are indicated by W). In order to ascend reliably, the suction capacity of the fan may be increased, but there is a problem that the apparatus becomes large. Therefore, by providing the rectifying plates 41 and 42 as described above, the chips can be smoothly separated from the cutting blade 20 and the recovery efficiency can be increased. Also, it is not necessary to increase the suction capacity of the fan.

  Further, as shown in FIG. 1, a front air blow device 5 is provided on the front side of the dust introduction portion 4, and air is blown onto the surface of the polishing pad 1 in a vertically downward direction. Thereby, an air wall is formed on the front side of the dust introduction portion 4.

  FIG. 7 is a conceptual diagram illustrating the effect of the front air blow device 5. When the front air blow device 5 is not provided, chips may be scattered on the front side of the dust introduction part 4 (chips are indicated by W). In particular, in order to extrude chips to the front side without being entangled with the cutting blade 20, the air in the rear air blow device 3 must be strengthened to some extent, but if it is too strong, the chips are collected via the dust introduction part 4. It may be pushed forward before it is done.

  This is because a gap D (see FIG. 7) exists between the dust introduction part 4 and the surface of the polishing pad 1. In order to prevent the scattering of chips, it is conceivable to eliminate the gap D. However, in reality, the bottom surface of the dust introduction part 4 and the polishing pad 1 as the work come into contact with each other, so the gap D is necessary. It is. Therefore, by providing the front air blow device 5 as described above and blowing air onto the surface of the polishing pad 1, it is possible to form an air wall and prevent chips from scattering forward.

  In the present embodiment, the air blow device 5 is provided only on the front side of the dust introduction portion 4, but the air blow device is disposed so as to surround the dust introduction portion 4 and the cutting device 2, and scattering of chips around is prevented. be able to. It is most effective to provide the air blow device 5 on the front side of the dust introduction portion 4.

<About polishing pad>
In the present invention, a known polishing pad in the technical field of CMP can be used without limitation as the polishing pad 1 to be grooved. Hereinafter, the polishing pad 1 will be briefly described.

  The polishing pad 1 is constituted by a polishing sheet alone or by attaching a cushion sheet made of a nonwoven fabric or the like to the back surface of the polishing sheet. The surface to be the polishing surface of the polishing pad 1 is constituted by a polishing sheet, and multiple grooves are formed in the polishing sheet. The thickness of the polishing sheet is not particularly limited, but is generally 1 to 3 mm.

  The material for forming the abrasive sheet is not particularly limited. For example, polyurethane resin, polyester resin, polyamide resin, acrylic resin, polycarbonate resin, halogen resin (polyvinyl chloride, polytetrafluoroethylene, polyvinylidene fluoride, etc.), polystyrene, Examples thereof include olefin resins (polyethylene, polypropylene, etc.), epoxy resins, and photosensitive resins. These may be used alone or in combination of two or more. The abrasive sheet may be either a foam or a non-foam, and can be arbitrarily selected according to the material to be polished and the polishing conditions, but is preferably a foam from the standpoint of slurry retention and scratches.

  As described above, multiple grooves are formed on the surface of the polishing pad 1 in order to hold and renew the slurry. The groove shape is not particularly limited, and XY lattice grooves, concentric grooves, spiral grooves, eccentric circular grooves, radial grooves, and the like can be provided continuously or intermittently. Further, the groove cross-sectional shape is not particularly limited, and a rectangular groove, a semicircular groove, a U-shaped groove, a V-shaped groove, or the like can be provided.

<Operation of groove processing machine>
Next, a method for cutting and forming multiple grooves on the surface of the polishing pad 1 using the above groove processing machine will be described. FIG. 3 is a plan view showing a schematic configuration when the polishing pad is grooved. The polishing pad 1 is placed on a table 13 that is rotationally driven by a driving device 11, and rotates along the R direction around the central axis 14. The groove processing machine described above is disposed above the polishing pad 1. 1 and 4 are side views when FIG. 3 is viewed from the left direction, and the illustration of the table 13 is omitted. The rotation of the polishing pad 1, that is, the operation of the driving device 11 is controlled by the control device 12.

  The polishing pad 1 is preferably provided with a uniform groove in the widest possible range from the vicinity of the central axis 14 to the vicinity of the outer peripheral edge. In the present embodiment, an example in which multiple grooves extending continuously concentrically are formed by cutting. In the case of such concentric grooves and spiral grooves, the amount of chips generated in one cutting process tends to increase the length of the chips, and the chips tend to become entangled with the cutting blade 20 to deteriorate the processing accuracy. Problems are likely to occur. Such a tendency is remarkable in a polishing pad having a relatively large diameter of φ500 mm or more, particularly 600 mm or more, and more preferably φ700 mm or more.

  In the case of cutting and forming multi-grooves continuously extending concentrically, the multi-blade tool 21 is sequentially moved from the radially inner side to the outer side of the polishing pad 1 or from the radially outer side to the inner side. However, the moving direction of the multi-blade tool 21 is not particularly limited as long as it is possible to appropriately form concentric and equally spaced grooves. In the present embodiment, an example in which the multi-blade tool 21 is moved from the radially inner side to the outer side of the polishing pad 1 is shown.

<Grooving procedure>
FIG. 8 is a flowchart showing the procedure of groove processing. First, the polishing pad 1 to be subjected to grooving is placed on the table 17, and the grooving machine above it is placed at a predetermined height (S1). At this stage, as shown in FIG. 4, the cutting device 2, the air blowing devices 3, 5 and the dust introduction part 4 are raised, and the cutting blade 20 is in the non-cutting position. Hereinafter, such a state of the grooving machine is referred to as a standby state. The horizontal position (the horizontal position in FIG. 2) of the multi-blade tool 21 is in the vicinity of the central axis 14 as shown in FIG.

  Next, the table 13 is driven to rotate, and the grooving machine is lowered to a predetermined height (S2), the cutting blade 20 is brought close to the surface of the rotating polishing pad 1, and the cutting edge is moved to a predetermined depth. Intrude with. As a result, multiple grooves can be formed by cutting at intervals corresponding to the pitch P between the cutting edges 20 (S3, corresponding to the cutting step). At this stage, as shown in FIG. 1, the cutting device 2, the air blow devices 3, 5 and the dust collector 4 are lowered, and the cutting blade 20 is displaced to the cutting position. FIG. 3 shows a state in which the polishing pad 1 has rotated about 3/4 after the start of cutting.

  Of the chips generated by cutting, short pieces are relatively easily sucked and collected by the dust introduction part 4, but the long and narrow chips in the form of ribbons and threads are entangled with the cutting blade 20 and cannot be easily collected by suction. It becomes. While cutting the surface of the polishing pad 1, air is blown onto the cutting blade 20 by the rear air blow device 3. Chips made of a resin material easily adhere to the cutting blade 20 due to a temperature rise, but by cooling the cutting blade 20 by blowing such air, the viscosity of the chip can be lowered and easily separated from the cutting blade 20. it can. Moreover, since an air wall is formed by the front side air blow device 5, it is possible to prevent chips from being scattered and to improve the collection efficiency.

  The air blowing by the air blowing devices 3 and 5 may be performed constantly until the groove processing on the entire surface of the polishing pad 1 is completed, or may be performed at an appropriate timing according to each process. In the latter case, it is desirable to control the spraying timing by the control device 12.

  When the polishing pad 1 is rotated one or more times after the start of cutting and a multi-annular groove is formed, the groove processing machine is raised to a predetermined height (S4), and the cutting blade 20 is moved to the polishing pad 1 It is separated from the surface and displaced to a non-cutting position to enter a standby state (S5, corresponding to the separation step).

  When the cleaning device is provided, the cleaning device is driven while the cutting blade 20 is separated from the surface of the polishing pad 1, and the brush is brought into contact with the cutting blade 20 for cleaning. The tangled elongated chips are removed (S6, corresponding to the cleaning step). At this stage, as shown in FIG. 4, the cutting device 2, the air blowing devices 3, 5 and the dust introduction part 4 are raised, and the cutting blade 20 is in the non-cutting position.

  After cleaning the cutting blade 20, the brush is displaced to the retracted position, and if the grooving to the entire surface of the polishing pad 1 has been completed, the rotation of the table 13 is stopped and the grooving is completed. If not, the grooving machine is moved in the lateral direction, and the steps after S1 are repeated to cut and form new grooves on the outer peripheral side of the formed grooves (S7, S8). Whether or not the groove processing on the entire surface of the polishing pad 1 has been completed can be determined based on, for example, the lateral position of the groove processing machine.

  According to the above method, chips can be reliably removed from the cutting blade 20, and grooving of the polishing pad 1 can be performed stably. In addition, chip recovery efficiency can be increased. Note that the rotation of the table 13 and the vertical movement and lateral movement of the grooving machine are controlled by the control device 12. A control program for that purpose can be input and set in advance in the control device 12, and the above-described groove machining can be performed automatically (semi-automatically or fully automatically).

<Example>
An experiment was conducted to confirm the effect of the present invention. In the first embodiment, only the front side rectifying plate 41 is disposed inside the dust collection box 40. In Example 2, in addition to Example 1, the front side air blow device 5 was added. FIG. 9 shows the experimental results. As evaluation items, a chip adhesion state (evaluation 1) to the cutting blade 20 and a chip scattering state (evaluation 2) were performed. As a comparative example, an experiment was conducted without a current plate and a front air blower.

  As shown in FIG. 9A, in Example 1, the evaluation 1 was “good” and the evaluation 2 was “good”, and in the example 2, the evaluations 1 and 2 were both “good”. In the comparative example, the evaluations 1 and 2 were x. Also from this result, it was confirmed that the chip collection efficiency could be improved by providing the current plate and the front air blow device.

<Another embodiment 1 of the cutting apparatus>
FIG. 10 is a view showing a polishing pad groove processing machine according to another embodiment, and particularly shows another embodiment of the cutting device 2. The cutting blade 20 is configured as a roller cutter. A plurality of roller cutters shown in the figure are arranged in the direction perpendicular to the paper surface, whereby multiple grooves can be processed simultaneously. Since the other configuration is the same as that of the embodiment shown in FIG. 1, members having the same functions are denoted by the same reference numerals and description thereof is omitted.

<Another embodiment 2 of the cutting apparatus>
FIG. 11 shows still another embodiment in which a roller cutter is used. In this embodiment, the dust collection box 40 of the dust introduction part 4 is disposed so as to surround the cutting blade 20 (arranged in the vicinity of the periphery of the cutting blade). A part of the rear air blow device 3 also enters the dust collection box 40. A front side rectifying plate 41 and a rear side rectifying plate 42 are arranged above the dust collection box 40 to guide chips toward the tube 40c. The front rectifying plate 41 and the rear rectifying plate 42 are preferably formed with grooves as illustrated in FIG. Even with such a configuration, chips can be efficiently collected.

<Still another embodiment>
In the present embodiment, an air blowing device may be provided on the front side of the cutting device 2, that is, between the cutting device 2 and the dust introduction part 4. Thereby, the chips entangled with the cutting blade 20 can be more efficiently separated.

DESCRIPTION OF SYMBOLS 1 Polishing pad 2 Cutting device 3 Back side air blow device 4 Dust introduction part 5 Front side air blow device 10 Movement mechanism 11 Drive mechanism 12 Control device 20 Cutting blade 40 Dust collection box 40a Dust collection port 41 Front side current plate 42 Back side current plate 100 Polishing pad groove processing machine

Claims (5)

A cutting device provided with a cutting blade for acting on the surface of the polishing pad to cut and form multiple grooves on the surface of the polishing pad;
A rear side air blow device that is located on the rear side in the cutting direction of the cutting blade and blows air toward the cutting edge;
In a polishing pad grooving machine provided with a dust introduction part that is located in the vicinity of the periphery of the cutting blade and sucks and collects chips generated by cutting,
The dust introduction part is
A dust collection housing portion having a dust collection port that can be set at a position facing the surface of the polishing pad;
E Bei a rectifying means for guiding the chips located in the dust port upward,
A polishing pad grooving machine comprising a front air blow device that blows air from above on the surface of the polishing pad on the front side in the cutting direction of the dust collecting casing . The said rectification | straightening means is arrange | positioned as a rectification | straightening board which is arrange | positioned in the cutting direction front side of the said dust collection opening | mouth, and is inclined in the said cutting direction front side, so that it goes upwards. The polishing pad groove processing machine described. The polishing pad grooving machine according to claim 2, wherein a second rectifying means is further arranged on the rear side in the cutting direction of the dust collecting port. The polishing pad groove processing machine according to any one of claims 1 to 3, wherein the rectifying means has a function of reducing an opening area of the dust collecting port. A step of causing a cutting edge to act on the surface of the polishing pad to form multiple grooves on the surface of the polishing pad;
A step of blowing air toward the cutting edge at a position on the rear side in the cutting direction of the cutting edge; and
A step of sucking and collecting chips generated by cutting at a position near the periphery of the cutting blade, and a polishing pad groove processing method comprising:
The sucking and collecting step includes
Wherein a position facing the surface of the polishing pad in proximity to the dust collecting port of the dust collecting casing, and have a step of guiding the cutting chips from the dust collecting port upward by rectifying means,
A polishing pad groove machining method comprising a step of blowing air from above to the surface of the polishing pad on the front side in the cutting direction of the dust collecting casing .

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