JP5778373B2 - Deposition method - Google Patents

Description

  The present invention relates to a film forming method using an aerosol deposition method.

  The aerosol deposition method using the collisional solidification phenomenon of powder is a unique technique that enables the formation of ceramic films at room temperature. In addition, a film forming apparatus (hereinafter referred to as an aerosol deposition apparatus) used for the aerosol deposition method has a simple configuration and is inexpensive.

  FIG. 1 is a configuration diagram of an aerosol deposition apparatus 2. In the aerosol deposition method, for example, a ceramic film is formed on a substrate using such an apparatus according to the following procedure.

  First, compressed gas is supplied from the gas cylinder 6 into the powder 4 subjected to vibration stirring, and an aerosol (a mixture of fine particles and gas forming the powder) is formed.

  Next, the aerosol is ejected from the slit-shaped nozzle 14 toward the substrate 16 in the film forming chamber 12 which is decompressed (for example, 50 to 1 kPa).

At this time, the fine particles in the aerosol rush toward the substrate 16 at a speed higher than the speed of sound and collide with the substrate 16 to form a film (Non-Patent Document 1).
"High-frequency passive device integration technology by aerosol deposition", Yoshihiko Imanaka, Jun Akira Watanabe, Ceramics, Vol.39, No8, 584-589 (2004).

  There are many reports on the aerosol deposition method, but most are related to the formation of ceramic films. For this reason, there are many unclear points about aerosol deposition of substances other than ceramics, for example, metal.

  Therefore, the present inventor has attempted to form a metal film by an aerosol deposition method for the purpose of application to an electronic component (for example, an electrolytic capacitor) or a wiring board. However, there are cases where a metal film having a sufficient thickness can be obtained even if the film is formed by the same process, and there are cases where the metal film is not so.

  Accordingly, an object of the present invention is to provide an aerosol deposition method capable of forming a thick metal film with good reproducibility.

In order to achieve the above object, according to one aspect of the present invention, a powder in which metal fine particles with exposed surfaces are gathered is aerosolized, and the aerosolized powder is sprayed toward a substrate.

  According to the above aspect, since the foreign matter that inhibits collision solidification does not cover the surface of the fine particles, a sufficiently thick metal film can be formed with good reproducibility.

  According to the present invention, a sufficiently thick metal film can be formed with good reproducibility by the aerosol deposition method.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the technical scope of the present invention is not limited to these embodiments, but extends to the matters described in the claims and equivalents thereof.

(Comparative Example 1)
First, for comparison, a case where it is difficult to form a metal film will be described.

  FIG. 2 is a flowchart for explaining the procedure of the film forming method according to this comparative example.

  First, a glass substrate 16 is prepared (step S2).

  Next, the glass substrate 16 is mounted on the aerosol deposition apparatus 2. The film forming chamber 12 has a stage 36 movable in the X and Y directions, and the substrate 16 prepared in step S2 is attached to the stage 36 (step S4).

  Next, the inside of the film forming chamber 12 is evacuated to a vacuum by the mechanical booster pump 8 and the vacuum pump 10 and is decompressed to 10 Pa or less in advance. At this time, the first valve 18 provided in the gas pipe connecting the gas cylinder 6 and the aerosol generating container 38 is closed. Further, the second valve 20 provided in the gas pipe connecting the aerosol generating container 38 and the film forming chamber 12 is also closed (step S6).

  Next, copper (Cu) powder (hereinafter referred to as Cu powder) formed by the pulverization method is placed in the aerosol generation container 38 as the raw material powder 4. Thereafter, the raw material powder 4 is heated to about 50 degrees and vacuum degassed for 30 minutes in a state where ultrasonic waves are applied to the entire aerosol generation container 38 by the vibrator 40. By such pretreatment, moisture adsorbed on the surface of the raw material powder 4 is removed (step S8).

  Here, the average particle diameter of the fine particles forming the Cu powder is 10 μm, and the standard deviation thereof is ± 5 μm (hereinafter, in this case, the average particle diameter is expressed as 10 μm ± 5 μm). The average particle diameter and the standard deviation of the particle diameter of the Cu fine particles are measured by a centrifugal particle size analyzer SA-CP3 (centrifugal particle size analyzer; SA-CP3) manufactured by Shimazu (fine particles described below) This also applies to the measurement of the average particle diameter and the standard deviation of the particle diameter.

Next, the first valve 18 is opened, and a compressed gas composed of high-purity helium gas (gas pressure: 2 kg / cm ² , gas flow rate: 8 l / min.) Is introduced into the aerosol generator 38 for pretreatment. The applied raw material powder 4 is aerosolized (floating dust). The gas flow rate is measured by the mass flow meter 22 (step S10).

  Next, the second valve 20 is opened, and the aerosolized raw material powder 4 is fed into the film forming chamber 12 through the nozzle 14. That is, the aerosolized raw material powder 4 is sprayed from the nozzle 14 toward the glass substrate 16. The spraying time (film formation time) is 20 minutes. During the aerosol injection, the pressure in the chamber is kept at a constant value of 200 Pa. In addition, the nozzle 14 in which a spiral groove is formed is used. (Step S12).

  Table 1 summarizes data (film formation conditions and film formation results) according to this comparative example, comparative example 2 described later, and exemplary embodiments 1 and 2 described later.

As shown in Table 1, the thickness of the copper film (hereinafter referred to as Cu film) formed on the glass substrate 16 by the film forming procedure according to this comparative example is only 0.1 μm. The resistivity of the Cu film is 5 Ω · cm, which is much higher than the resistivity of Cu bulk, 1.9 Ω · cm. The adhesion strength between the Cu film and the substrate 16 is 3 kg / mm ² or more, and the Cu film is firmly adhered to the substrate 16.

  That is, when Cu powder formed by the pulverization method is used as a raw material powder, only an extremely thin Cu film can be formed. Also, the physical properties of the formed Cu film are greatly altered from that of bulk Cu.

(Comparative Example 2)
This comparative example relates to a film forming method in which the raw material powder 4 is aerosolized using the atmosphere instead of the high purity helium gas to form a Cu film. As shown in Table 1, the film forming method according to this comparative example is the same as the film forming method according to comparative example 1 except that the atmosphere is used as a film forming gas (a gas for aerosolizing the raw material powder 4). is there.

As shown in Table 1, the thickness of the Cu film formed according to this comparative example is 2 μm. The resistivity of the Cu film according to this comparative example is 10 Ω · cm, which is much higher than the bulk resistivity of 1.9 Ω · cm. The adhesion strength between the Cu film and the substrate 16 is 3 kg / mm ² or more, and the Cu film is firmly adhered to the substrate 16.

  That is, when a Cu powder formed by a pulverization method is used as a raw material powder and the atmosphere is a film forming gas, only a thin Cu film can be formed. Also, the physical properties of the formed Cu film are greatly altered from that of bulk Cu. Here, the reason why the physical properties of the Cu film differed greatly from that of bulk Cu is considered that Cu was slightly oxidized because the Cu powder was coated with an organic substance and the atmosphere was used as a film forming gas.

(Embodiment 1)
The present embodiment relates to a film forming method in which Cu powder formed by a wet method is aerosolized and the aerosolized powder is sprayed toward a substrate in a vacuum.

  In Comparative Examples 1 and 2, a Cu film is formed using Cu powder formed by a pulverization method as a raw material powder. The grinding method is a mechanical powder manufacturing process.

  In the pulverization method, a group of metal particles having a large particle size produced by another powder production method (for example, a wet method or the like) is pulverized into fine particles by milling to form a metal powder. For example, the Cu powder used in Comparative Examples 1 and 2 is a Cu powder obtained by pulverizing Cu particles having a large particle size by a ball mill for 2 hours.

  However, as is well known, metals are easily oxidized. For this reason, when pulverizing metal particles, the metal particles may react with oxygen in the atmosphere and be heated to ignite.

  In order to prevent such ignition, in the pulverization method, the metal particle surface is coated with an organic substance such as an organic fatty acid (called a lubricant) so that the surface of the metal particle is not directly exposed to the atmosphere. Is crushed. This organic material for preventing ignition remains in the powder after pulverization, and continues to cover the surface of the fine particles forming the powder.

  By the way, the film formation process of the aerosol deposition method is such that the aerosolized fine particles are brought into close contact with the fine particles previously fixed to the substrate by an impact at the time of collision with the substrate.

  The organic matter covering the surface of the fine particles forming the raw material powder is a foreign matter when viewed from the metal fine particles, and prevents the metal fine particles from directly adhering to each other. Therefore, the organic substance that coats the surface of the fine particles of the raw material powder inhibits film formation by the aerosol deposition method.

  Moreover, the organic substance that coats the surface of the fine particles of the raw material powder is a foreign substance for the film formed by the aerosol deposition method, and changes the physical properties of the film to be formed.

  Therefore, in order to eliminate such foreign matters, in the present embodiment, a powder in which metal fine particles whose surface is not coated with an organic substance is aggregated (that is, a powder in which metal fine particles having an exposed surface are aggregated) is used. Aerosolized. Then, the aerosolized powder is sprayed toward the substrate in a vacuum, thereby forming a metal film having a sufficiently thick and close physical property.

  Specifically, in the present embodiment, Cu powder formed by a wet method is used as the raw material powder 4. The wet method is a powder production method for producing metal powder by causing a reducing agent to act on a salt solution to precipitate metal fine particles. As described above, in the wet method, metal fine particles are formed in an aqueous solution, so that a lubricant (for example, organic fatty acid) for preventing ignition is unnecessary.

  In the present embodiment, a Cu film is formed by the same procedure as in Comparative Example 1 using Cu powder formed by a wet method as raw material powder 4. As in Comparative Example 1, the average particle size of the Cu fine particles forming the raw material powder 4 is 10 μm ± 5 μm. The film forming conditions are the same as those in Comparative Example 1.

As shown in Table 1, according to the present embodiment, a Cu film having a thickness of 10 μm can be formed on the glass substrate 16. The resistivity is 2 μm · cm which is substantially the same as that of bulk copper. The adhesion strength between the Cu film and the substrate 16 is 3 kg / mm ² or more, and the Cu film is firmly adhered to the substrate 16.

  As is apparent from Table 1, according to the present embodiment, it is possible to form a much thicker Cu film as compared with Comparative Examples 1 and 2. Unlike the comparative examples 1 and 2, the physical properties (for example, resistivity) of the formed Cu film are substantially the same as bulk Cu. That is, according to the present embodiment, it is possible to form a Cu film that is sufficiently thick and has substantially the same physical properties as the bulk with good reproducibility.

(Embodiment 2)
The present embodiment relates to a film forming method in which Cu powder formed by an atomizing method is aerosolized, and the aerosolized powder is sprayed toward a substrate in a vacuum.

  The atomization method is a powder manufacturing method in which either one or both of a gas and a liquid are sprayed on a molten metal flowing out from a nozzle to solidify the molten metal to form a powder. The surface of the powdered metal fine particles produced by this method is not coated with organic matter.

  That is, also in the present embodiment, as in the first embodiment, a powder in which metal fine particles whose surface is not coated with an organic substance is aggregated (that is, a powder in which metal fine particles having an exposed surface are aggregated) is an aerosol. And aerosolized powder is sprayed toward the substrate in a vacuum.

  As shown in Table 1, the average particle size of the Cu fine particles of the raw material powder by the atomization method used in the present embodiment is 10 μm ± 5 μm, as in Comparative Example 1. In other respects, the film forming conditions and procedure of the film forming method according to the present embodiment are the same as those in Comparative Example 1.

As shown in Table 1, according to the present embodiment, a Cu film having a thickness of 15 μm can be formed. The resistivity is 2 μm · cm which is substantially the same as that of bulk copper. The adhesion strength between the Cu film and the substrate 16 is 3 kg / mm ² or more, and the Cu film is firmly adhered to the substrate 16.

  That is, according to the present embodiment, as in the first embodiment, it is possible to form a much thicker Cu film with better reproducibility than Comparative Examples 1 and 2. Further, the physical properties (for example, resistivity) of the Cu film to be formed are substantially the same as bulk Cu, unlike Comparative Examples 1 and 2. Therefore, according to the present embodiment, it is possible to form a Cu film that is sufficiently thick and has substantially the same physical properties as the bulk.

  By the way, the raw material powder used in Examples 1 and 2 was manufactured by different manufacturing methods such as a wet method and an atomizing method. Both are common in that the surface of the fine particles is exposed, but they are also common in that the fine particles formed without applying mechanical processing to the metal are powders.

  In the aerosol deposition method, fine particles that collide with a substrate undergo plastic deformation (that is, deformation in a state where distortion caused by an external force remains), whereby fine particles are brought into close contact with each other to form a film.

  In a powder formed by applying mechanical processing to a metal as in the pulverization method, each fine particle forming the powder is already distorted before the aerosol deposition is performed. When such a powder is used, since sufficient plastic deformation does not occur during film formation, film formation is difficult even if the surface of the metal fine particles is not coated with an organic substance (that is, the surface is exposed). . (See Comparative Example 3 below).

  From this point of view, the aerosol deposition method using raw material powder, which is a collection of fine particles (that is, plastically deformable fine particles) formed without applying mechanical processing to metal, such as the atomization method and wet method, is effective. It is.

(Comparative Example 3)
This comparative example relates to a film forming method in which a Cu film is formed by aerosolizing Cu powder from which organic fatty acids that coat the surface of fine particles are formed after forming by a pulverization method.

  The film forming method according to this comparative example is the same as the film forming method according to comparative example 1 except that Cu powder from which organic fatty acids that coat the surface of fine particles after being formed by a pulverization method are used is used as a raw material powder. .

  Table 2 summarizes data (film formation conditions and film formation results) according to Comparative Example 5 (Comparative Example 3) to Comparative Example 5 described later and data according to Example 3 below.

As shown in Table 2, the thickness of the Cu film formed according to this comparative example is 0 to 0.02 μm. That is, in the film formation according to this comparative example, it is difficult to form a Cu film. Moreover, the resistivity of the Cu film according to this comparative example is 20 Ω · cm, which is much higher than the resistivity of the Cu bulk of 1.9 Ω · cm. The adhesion strength between the Cu film and the substrate 16 is 3 kg / mm ² or more, and the Cu film is firmly adhered to the substrate 16.

  That is, when a powder formed by a pulverization method is used as a raw material powder, it is difficult to form a film even if an organic substance covering the surface of the metal fine particles is removed.

(Comparative Examples 4 and 5)
This comparative example relates to an aerosol deposition method in which a raw material powder is a metal powder in which fine particles having an average particle diameter of 1 μm or less whose surface is coated with an organic fatty acid is collected to prevent ignition.

  In a method for producing a metal powder without adding mechanical processing (for example, a wet method or an atomizing method), there is no risk of ignition of the fine particles being produced, so the metal powder is produced without coating the surface of the particles. The

  However, when the metal powder has an average particle size of 1 μm or less, it may spontaneously ignite simply by being stored in the atmosphere. In order to prevent such spontaneous ignition, the surface of the fine particles having an average particle diameter of 1 μm or less is coated with an organic substance such as a fatty acid regardless of the production method.

  In this comparative example, such a powder (specifically, a Cu powder formed by an atomizing method and having an average particle diameter of 1 μm, and the surface of the fine particles coated with an organic fatty acid after the powder formation) is used as a raw material. The result of forming a metal film by powder deposition using an aerosol deposition method will be described. In this comparative example, a glass substrate or a resin substrate is used as the substrate 16. The case where a glass substrate is used is Comparative Example 4, and the case where a resin substrate (resin printed board; Ajinomoto ABF-GX13) is used is Comparative Example 5.

  The film forming conditions and the film forming procedure are the same as those in Comparative Example 1 except that the raw material powder 4 is different.

  As shown in Table 2, in the film forming method according to this comparison, only a thin Cu film of 0 to 0.1 μm is formed.

The resistivity of the Cu film according to the present embodiment is 20 μm · cm (Comparative Example 4) or 25 μm · cm (Comparative Example 5), which is much higher than that of bulk copper. The adhesion strength between the Cu film and the substrate 16 is 3 kg / mm ² or more, and the Cu film is firmly adhered to the substrate 16.

  That is, since the average particle diameter is 1 μm or less, if a powder whose surface is coated with an organic substance is used as a raw material powder, film formation becomes difficult regardless of the type of powder production method.

(Embodiment 3)
The present embodiment relates to an aerosol deposition method in which a metal powder formed by agglomeration of fine particles whose surface is not coated with an organic fatty acid despite having an average particle diameter of 1 μm is used as a raw material powder.

  In this embodiment, Cu powder formed by an atomizing method and having an average particle diameter of 1 μm and the surface of the fine particles of which is not coated with an organic fatty acid is used as a raw material powder, and a Cu film is formed by an aerosol deposition method. The results of film formation will be described.

  The film forming conditions and the film forming procedure are the same as those in Comparative Example 1 (see Table 2).

  The raw material powder is Cu powder having an average particle diameter of 1 μm manufactured by an atomizing method, and Cu powder (average particle diameter of 1 μm) before the surface of fine particles is coated with an organic fatty acid is used as a manufacturer of Cu powder (Japan) Atomized processing company).

  That is, the present embodiment is a powder in which metal fine particles whose surfaces are not coated with an organic substance are aggregated (that is, a powder in which metal fine particles having an exposed surface are aggregated), and the average particle diameter of the fine particles is This is a film forming method in which a powder of 1 μm or less and greater than 0 μm is aerosolized, and the aerosolized powder is sprayed toward a substrate in a vacuum. The substrate is made of glass.

As shown in Table 2, according to the film forming method according to the present embodiment, unlike Comparative Examples 4 and 5, a thick Cu film of 15 μm is formed. Further, the resistivity of the Cu film according to the present embodiment is 2 μm · cm, which is substantially the same as that of bulk copper. The adhesion strength between the Cu film and the substrate 16 is 3 kg / mm ² or more, and the Cu film is firmly adhered to the substrate 16.

  That is, according to the film forming method according to the present embodiment, a Cu film having a sufficiently thick and substantially the same physical property as the bulk is formed with good reproducibility even when a metal powder having an average particle size of 1 μm or less is used as a raw material powder. It becomes possible.

  In this embodiment, Cu powder having an average particle diameter of 1 μm manufactured by the atomizing method is used. However, even if Cu powder having an average particle diameter of 1 μm manufactured by a wet method (made by Mitsui Metals) is used, it is almost same. The same result is obtained.

(Comparative Example 6)
This comparative example relates to a film forming method in which an Al powder formed by pulverization is aerosolized as a raw material powder to form an Al film.

  Table 3 summarizes data (film formation conditions and film formation results) according to this comparative example and Embodiments 4 and 5 described later.

  As shown in Table 3, the film forming method according to this comparative example is the same as the film forming method according to comparative example 1 except that Al powder is used as the raw material powder.

  In Comparative Example 1, a powder prepared by a pulverization method and having Cu fine particles with an average particle diameter of 10 μm ± 5 μm whose surface is coated with an organic fatty acid is used as a raw material powder. On the other hand, in this comparative example, a powder produced by a pulverization method and having a collection of Al fine particles having an average particle diameter of 10 μm ± 5 μm whose surface is coated with an organic fatty acid is used as a raw material powder.

As shown in Table 3, the thickness of the Al film formed according to this comparative example is 0.2 μm. The adhesion strength between the Al film and the substrate 16 is 3 kg / mm ² or more, and the Al film is firmly adhered to the substrate 16.

  That is, when an Al powder formed by a pulverization method is used as a raw material powder, only an extremely thin Al film can be formed.

(Embodiment 4)
The present embodiment relates to a film forming method in which an Al powder (hereinafter referred to as Al powder) formed by an atomizing method is aerosolized, and the aerosolized powder is sprayed toward a substrate in a vacuum.

  As shown in Table 3, the film forming method according to the present embodiment is the same as the film forming method according to Comparative Example 1 except that Al powder manufactured by the atomizing method is used as the raw material powder.

As shown in Table 3, according to the film forming method according to the present embodiment, an Al film having a thickness of 10 μm can be formed. That is, according to the present embodiment, it is possible to form a much thicker Al film as compared with Comparative Example 6 in which the Al powder formed by the pulverization method is used as the raw material powder. The adhesion strength between the Al film and the substrate 16 is 3 kg / mm ² or more, and the Al film is firmly adhered to the substrate 16.

(Embodiment 5)
This embodiment relates to a film forming method in which an Al powder having a fine particle diameter of 4 μm formed by an atomization method is aerosolized and the aerosolized powder is sprayed toward a substrate in a vacuum.

  The film forming method according to the present embodiment is the same as the film forming method according to the fourth embodiment, except that the average particle diameter of the Al fine particles forming the raw material powder is 4 μm. (See Table 3).

As shown in Table 3, according to this embodiment, Al having a thickness of 20 μm can be formed. The adhesion strength between the Al film and the substrate 16 is 3 kg / mm ² or more, and the Al film is firmly adhered to the substrate 16.

  That is, according to the present embodiment, even if the average particle diameter of the raw material powder is 4 μm, a much thicker Al film is formed with good reproducibility compared with Comparative Example 6 in which the Al powder formed by the pulverization method is used as the raw material powder. It becomes possible.

(Embodiment 6)
The present embodiment relates to a film forming method in which an Al powder having a particle size of 10 μm ± 5 μm formed by an atomization method is aerosolized, and the aerosolized powder is sprayed toward an aluminum foil in a vacuum. It is.

  Table 4 summarizes data (film formation conditions and film formation results) according to this comparative example and later-described Embodiments 7 to 8.

  The film forming method according to the present embodiment is the same as the film forming method according to the fourth embodiment, except that aluminum foil is used as the substrate (see Table 4).

As shown in Table 4, according to the present embodiment, Al having a thickness of 12 μm can be formed. The adhesion strength between the Al film and the substrate 16 is 3 kg / mm ² or more, and the Al film is firmly adhered to the substrate 16.

  As shown in Table 4, according to the present embodiment, even if the substrate is an aluminum foil, as in the fourth embodiment, Al is much thicker than Comparative Example 6 in which the Al powder formed by the pulverization method is used as the raw material powder. A film can be formed with good reproducibility.

(Embodiment 7)
The present embodiment relates to a film forming method in which an Al powder having an average particle diameter of 4 μm formed by an atomizing method is aerosolized, and the aerosolized powder is sprayed toward a substrate (aluminum foil) in a vacuum. .

  The film forming method according to the present embodiment is the same as the film forming method according to the sixth embodiment, except that the average particle diameter of the Al fine particles forming the raw material powder is 4 μm. (See Table 4).

As shown in Table 4, according to the present embodiment, an Al film having a thickness of 25 μm can be formed. The adhesion strength between the Al film and the substrate 16 is 3 kg / mm ² or more, and the Al film is firmly adhered to the substrate 16.

  That is, according to the present embodiment, even if the average particle diameter of the raw material powder is 4 μm, a much thicker Al film is formed as compared with Comparative Example 6 in which the Al powder formed by the pulverization method is used as the raw material powder and the glass substrate is used. It becomes possible to form with good reproducibility.

(Embodiment 8)
In the present embodiment, Cu powder formed by an atomization method and having a particle size of 1 μm is aerosolized, and the aerosolized powder is sprayed toward a resin substrate (resin printed circuit board; Ajinomoto ABF-GX13) in vacuum. The present invention relates to a film forming method.

  The film formation method according to the present embodiment is the same as the film formation method according to the third embodiment, except that a resin substrate is used as the substrate (see Table 4).

As shown in Table 4, according to the present embodiment, a 2 μm Cu film can be formed also on the resin substrate. The resistivity of the Cu film according to the present embodiment is 2.2 Ω · cm, which is close to the resistivity of bulk copper. The adhesion strength between the Cu film and the substrate 16 is 3 kg / mm ² or more, and the Cu film is firmly adhered to the substrate 16.

  That is, according to the present embodiment, a Cu film that is sufficiently thick and has substantially the same physical properties as the bulk can be formed on a resin substrate such as a printed circuit board with good reproducibility.

(Modification)
The raw material powder used in the film forming method according to the first to eighth embodiments is made of Cu or Al. However, powders made of other metals such as copper, silver, valve metals other than Al, and silicon may be used as the raw material powder.

  Further, the substrate used in Embodiments 1 to 8 is formed of any of glass, aluminum foil, and resin. However, you may use the board | substrate formed with other materials, for example, metals other than ceramics and Al.

  The above embodiment is summarized as follows.

(Appendix 1)
Aerosolize the powder with a collection of fine metal particles exposed on the surface,
A film forming method for spraying the aerosolized powder toward a substrate in a vacuum.

(Appendix 2)
The powder is a collection of fine metal particles whose surface is not coated with organic matter.
A film forming method for spraying the aerosolized powder toward a substrate in a vacuum.

(Appendix 3)
In the method for forming a film according to appendix 1 or 2,
A film forming method, wherein the fine particles are plastically deformable.

(Appendix 4)
In the method for forming a film according to appendix 1 or 2,
The powder is
The film forming method, wherein the fine particles are formed without applying mechanical processing to the metal.

(Appendix 5)
In the film forming method according to any one of appendices 1 to 4,
The powder is
A film-forming method manufactured by a wet method in which a reducing agent is allowed to act on a salt solution to deposit fine particles to form a powder.

(Appendix 6)
In the film forming method according to any one of appendices 1 to 4,
The powder is
A film forming method manufactured by an atomizing method in which either one or both of a gas and a liquid are sprayed on a molten metal flowing out from a nozzle to solidify the molten metal to form a powder.

(Appendix 7)
In the film forming method according to any one of appendices 1 to 6,
An average particle diameter of the fine particles is 1 μm or less and larger than 0 μm.

(Appendix 8)
In the film forming method according to any one of appendices 1 to 7,
The film forming method, wherein the metal is any element selected from the group consisting of copper, silver, valve metal, and silicon.

(Appendix 9)
In the film forming method according to any one of appendices 1 to 7,
A method of forming a film, wherein the substrate is formed of any material selected from the group consisting of glass, ceramics, resin, and metal.

It is a figure explaining the structure of an aerosol deposition apparatus. It is a flowchart explaining the procedure of the film-forming method according to the aerosol deposition method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 ... Aerosol deposition apparatus 4 ... Raw material powder 6 ... Gas cylinder 8 ... Mechanical booster pump 10 ... Vacuum pump 12 ... Deposition chamber 14 ... Nozzle 16 ... Substrate 18 ... first valve 20 ... second valve 22 ... mass flow meter 36 ... stage 38 ... aerosol generating container 40 ... vibrator

Claims (1)

The molten metal flowing out of the nozzle, by spraying either or both of the gas and liquid, solidifying the molten metal produced by the atomizing method to form a powder, the average particle size that is not coated with organic matter There aerosolized following metal fine particles or Ranaru powder 1 [mu] m,
A film forming method that shines injection toward the base plate the powder aerosolized in vacuo.

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