JP5777658B2 - Electronic component cooler - Google Patents

Description

  The present invention relates to a cooler that cools electronic components, and more particularly, to a cooler that is suitable for cooling an in-vehicle charger mounted on an electric vehicle such as an electric vehicle or a plug-in hybrid vehicle.

  In an electric vehicle such as an electric vehicle or a plug-in hybrid vehicle, electric power from a power source outside the vehicle is charged to a main battery via an in-vehicle charger, and an inverter or a driving motor is driven by electric power supplied from the main battery. The The on-vehicle charger includes electronic components that are heat-generating components such as switching elements. Then, the cooler was mounted in the vehicle-mounted charger, and the electronic component of the vehicle-mounted charger was cooled by the refrigerant circulation pump sending the refrigerant to the cooler.

  In an electric vehicle, charging of the main battery is performed over a long period of time, such as at night, using a commercial AC power source of 100V to 200V. At this time, the on-vehicle charger is operating, but the traveling motor and the inverter are not operating because they are stopped. Therefore, continuously operating the refrigerant circulation pump during charging performed over a long period of time brings about a shortened life of the refrigerant circulation pump. Furthermore, it is necessary to supplement the power consumed by the refrigerant circulation pump, resulting in a long charge time. Therefore, it is desirable to operate the refrigerant circulation pump intermittently. However, in order to operate the refrigerant circulation pump intermittently, the cooler has not only the cooling performance when the refrigerant circulation pump is operating, but also the performance that suppresses the temperature rise of the electronic components when the refrigerant circulation pump is stopped. Required.

  The conventional electronic component cooler is provided on the back surface side of the mounting surface corresponding to the mounting surface on which the electronic component is mounted on the upper surface, the side surface provided on the mounting surface so that the lower side is open, and the position of the electronic component. A member having a radiation fin, a bottom surface fitted to and attached to a side surface, a side surface and a bottom surface, a liquid refrigerant passage including the radiation fin, and an inlet provided on the side surface for introducing the liquid refrigerant into the liquid refrigerant passage An outlet member for leading out the liquid refrigerant from the member and the liquid refrigerant passage, and an inclined portion is formed in the channel from the inlet member to the radiation fin and the channel from the radiation fin to the outlet member on the bottom surface on the radiation fin side. (For example, refer to Patent Document 1).

JP 2006-339229 A

  In the conventional electronic component cooler, since the inclined portion is formed in the channel from the inlet member to the radiation fin and the channel from the radiation fin to the outlet member on the bottom surface on the radiation fin side, The bottom surface and the bottom surface are gently connected to the outlet of the liquid refrigerant, and the flow path resistance is reduced. As a result, generation of eddy currents in the vicinity of the inlet member and the outlet member is avoided, and good cooling performance is maintained. However, in the conventional cooler for electronic components, the cooling performance during operation of the refrigerant circulation pump can be ensured, but no consideration has been given to when the refrigerant circulation pump is stopped.

  In other words, in a conventional electronic component cooler, when the refrigerant circulation pump is stopped, the liquid refrigerant stays in the liquid refrigerant passage, and the liquid in the lower portion of the mounting surface (upper portion of the liquid refrigerant passage) is generated by the heat generated in the electronic component. The refrigerant is heated, and the liquid refrigerant temperature rises rapidly. Therefore, when a conventional electronic component cooler is applied to cooling an in-vehicle charger, if the refrigerant circulation pump is stopped, the liquid refrigerant temperature rises rapidly, so that the refrigerant circulation pump needs to be restarted immediately, and the operation time There was a problem that it was not possible to shorten.

  The present invention has been made to solve such a problem, and has a refrigerant flow path configuration in which the temperature rise of the refrigerant at the time of the refrigerant supply stop is slowed, and the refrigerant supply stop time can be extended. The purpose is to obtain a cooler for electronic components.

An electronic component cooler according to the present invention is produced in a bottomed cylindrical body having a cylindrical peripheral wall portion and a bottom plate that closes the other end opening of the peripheral wall portion, and is arranged with one end opening facing sideways. A main body having an outer surface of the lower wall portion located below the peripheral wall portion as an attachment surface of the electronic component, an upper flow path disposed in the main body, and a lower portion positioned below the upper flow path comprising a partition plate for the passage and the upper channel and the lower channel to form a communication passage that communicates with the bottom plate side, a refrigerant intermittently supplied to the upper SL upper flow path of the electronic component Cooling. And the communicating hole is formed in the said partition plate so that the said upper flow path and the said lower flow path may be connected in the upper position of the said electronic component.

  According to the present invention, at the time of supply of the refrigerant, the refrigerant flows through the upper flow path, is folded on one side in the flow path direction, and flows through the lower flow path. The heat generated in the electronic component is transmitted to the refrigerant flowing through the lower flow path via the lower wall portion located on the lower side of the peripheral wall portion and is discharged together with the refrigerant, so that the electronic component can be effectively cooled. Good cooling performance is ensured.

  When the supply of the refrigerant is stopped, the refrigerant staying in the vicinity of the lower wall portion located on the lower side of the peripheral wall portion is heated and raised by the heat generated in the electronic component, and flows into the upper flow path through the communication hole. . The refrigerant flowing into the upper flow path is cooled and flows into the lower flow path through the communication hole, descends to the vicinity of the lower wall portion located below the peripheral wall portion, and is warmed by the heat generated by the electronic component. To rise. Thus, a convection of the refrigerant is formed between the upper flow path and the lower flow path through the communication hole, and the heat generated in the electronic component is diffused to the refrigerant in both the upper flow path and the lower flow path, The temperature rise becomes a slow temperature rise. Thereby, the time which stops supply of a refrigerant | coolant can be lengthened. Therefore, the operation time of the refrigerant circulation pump for intermittently supplying the refrigerant can be shortened.

It is a perspective view which shows the cooler which concerns on Embodiment 1 of this invention. It is a front view which shows the cooler which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the cooler which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the cooler which concerns on Embodiment 2 of this invention. It is sectional drawing which shows the state in the operation stop of the refrigerant | coolant circulation pump of the cooler concerning Embodiment 3 of this invention. It is sectional drawing which shows the state in driving | operation of the refrigerant | coolant circulation pump of the cooler which concerns on Embodiment 3 of this invention. It is a side view which shows the resin molding used for the cooler which concerns on Embodiment 4 of this invention. It is a perspective view which shows the resin molding used for the cooler which concerns on Embodiment 4 of this invention.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, a preferred embodiment of an electronic component cooler according to the invention will be described with reference to the drawings.

Embodiment 1 FIG.
1 is a perspective view showing a cooler according to Embodiment 1 of the present invention, FIG. 2 is a front view showing the cooler according to Embodiment 1 of the present invention, and FIG. 3 is according to Embodiment 1 of the present invention. It is sectional drawing which shows a cooler. In addition, the arrow in FIG. 3 has shown the flow of the refrigerant | coolant.

  1 to 3, the cooler 1 has a bottomed cylindrical shape in which the other end opening of a peripheral wall portion having a rectangular cross section composed of an upper wall portion 2a, a lower wall portion 2b and a pair of side wall portions 2c is closed by a bottom plate 2d. The main body 2 which is produced in the body and is disposed with the opening at one end facing sideways, and the lower surface of the lower wall portion 2b is the mounting surface of the electronic component 12, and the side wall portion which is spaced apart from the bottom plate 2d of the main body 2 A partition plate 3 that is installed between 2 c and partitions the inside of the main body 2 up and down, and a lid member 5 that is attached to one end of the main body 2 so as to close an opening at one end of the main body 2. Thereby, the space constituted by the main body 2 and the lid member 5 is vertically divided into two by the partition plate 3 except for the bottom plate 2d side, and the upper flow path 4a and the lower flow path 4b are separated by the communication flow path 4c on the bottom plate 2d side. A U-shaped refrigerant flow path 4 to be connected is formed. The cooler 1 is further formed integrally with the lid member 5 and discharges the refrigerant that is formed integrally with the lid member 5 and the refrigerant inlet nipple 6 that supplies the refrigerant to the upper flow path 4a and flows through the lower flow path 4b. The refrigerant outlet nipple 7 is provided, and the communication plate 8 is formed in the partition plate 3 so as to be positioned above the mounting position of the electronic component 12 and communicates the upper flow path 4a and the lower flow path 4b. The partition plate 3 is displaced to the lower wall portion 2b side and installed in the main body 2, and the channel cross-sectional area of the upper channel 4a is larger than the channel cross-sectional area of the lower channel 4b.

  Here, the main body 2 is produced by, for example, aluminum die casting. However, since the lower wall portion 2b of the main body 2 has a function of transmitting heat generated in the electronic component 12 to the refrigerant flowing through the lower flow path 4b, it is desirable that the lower wall portion 2b be made of a good heat conductive material such as aluminum. However, the material of other parts is not particularly limited. Moreover, although the main body 2 is produced in the cross-sectional rectangle, the cross-sectional shape of the main body 2 is not limited to a rectangle.

  Although not shown, an in-vehicle charger mounted on an electric vehicle such as an electric vehicle or a plug-in hybrid vehicle includes an AC / DC converter and an insulated DC / DC converter, and uses a commercial AC power source. Charge the battery.

  The cooler 1 has a lid member 5 that closes an opening at one end of the main body 2 facing sideways, the flow direction of the upper flow path 4a and the lower flow path 4b is substantially horizontal, and the lower wall portion 2b is vertically downward A heating element (electronic component 12) such as a transformer, a coil, or a semiconductor element of an in-vehicle charger is mounted on the mounting surface of the lower wall portion 2b to be used for cooling the in-vehicle charger. . Then, a refrigerant such as cooling water is circulated between the cooler 1 and the heat exchanger (not shown) by a refrigerant circulation pump (not shown) to cool the on-vehicle charger.

  Next, the cooling operation by the cooler 1 will be described. First, when the refrigerant circulation pump is operated, the refrigerant circulates between the cooler 1 and the heat exchanger. The refrigerant is heat-exchanged by the heat exchanger, the temperature is lowered, and the refrigerant is returned to the cooler 1. In the cooler 1, the refrigerant flows from the refrigerant inlet nipple 6 into the upper flow path 4a, flows in the upper flow path 4a to the communication flow path 4c, is turned back in the communication flow path 4c, and passes through the lower flow path 4b. It flows and is discharged from the refrigerant outlet nipple 7. The heat generated in the electronic component 12 is transmitted to the refrigerant flowing through the lower flow path 4b via the lower wall portion 2b, and is discharged from the refrigerant outlet nipple 7 together with the refrigerant. Thereby, the electronic component 12 is cooled.

  When the operation of the refrigerant circulation pump is stopped, the circulation of the refrigerant between the cooler 1 and the heat exchanger is stopped. The heat generated in the electronic component 12 is transferred to the refrigerant staying in the lower flow path 4b through the lower wall portion 2b. Then, the refrigerant staying at the upper portion of the lower wall portion 2b is warmed and rises, and flows into the upper flow path 4a through the communication hole 8 positioned above the electronic component 12. The refrigerant that has flowed into the upper flow path 4a is cooled by exchanging heat with the refrigerant in the upper flow path 4a, passes through the communication holes 8, and descends in the lower flow path 4b to the vicinity of the lower wall portion 2b. 12 is used for endothermic heat generated at 12. In this way, it is heated and raised in the vicinity of the lower wall portion 2b of the lower flow path 4b, flows into the upper flow path 4a from the communication hole 8, is cooled down in the upper flow path 4a, and descends from the communication hole 8. A refrigerant convection flows into the lower flow path 4b and returns to the vicinity of the lower wall 2b of the lower flow path 4b. Thereby, the heat generated in the electronic component 12 is not stored only in the refrigerant staying in the lower flow path 4b, but is diffused to both the upper flow path 4a and the lower flow path 4b. The temperature rise is slow.

  Thus, according to the first embodiment, while the refrigerant circulation pump is in operation, the refrigerant cooled by the heat exchanger is supplied to the cooler 1, so that good cooling performance is maintained. Further, since the temperature rise of the refrigerant becomes a slow temperature increase during the operation of the refrigerant circulation pump, the operation stop time of the refrigerant circulation pump can be extended, and the life of the refrigerant circulation pump that operates intermittently can be extended. Furthermore, the power consumed by the refrigerant circulation pump is reduced, and the charging time can be shortened.

  Further, the partition plate 3 is disposed in the main body 2 so that the cross-sectional area of the upper flow path 4a is larger than the cross-sectional area of the lower flow path 4b. Therefore, the flow rate of the refrigerant in the upper flow path 4a becomes slow, and the pressure loss can be reduced. On the other hand, since the flow rate of the refrigerant in the lower flow path 4b is increased, the heat transfer coefficient is increased, and the electronic component 12 attached to the lower wall 2b can be cooled well.

Embodiment 2. FIG.
FIG. 4 is a cross-sectional view showing a cooler according to Embodiment 2 of the present invention.

In FIG. 4, each cover 9 has an opening 9 a that opens to the downstream side of the upper flow path 4 a, and is attached to the upper surface of the partition plate 3 so as to cover the communication hole 8.
Other configurations are the same as those in the first embodiment.

  In the second embodiment, during operation of the refrigerant circulation pump, the refrigerant flows from the refrigerant inlet nipple 6 into the upper flow path 4a, flows in the upper flow path 4a to the communication flow path 4c, and the flow direction in the communication flow path 4c is changed. It is folded, flows in the lower flow path 4b, and is discharged from the refrigerant outlet nipple 7. The heat generated in the electronic component 12 is transmitted to the refrigerant flowing through the lower flow path 4b via the lower wall portion 2b, and is discharged from the refrigerant outlet nipple 7 together with the refrigerant. Thereby, the electronic component 12 is cooled.

  When the operation of the refrigerant circulation pump is stopped, the refrigerant staying at the upper part of the lower wall 2b is heated and raised by the heat generated in the electronic component 12, passes through the communication hole 8 located above the electronic component 12, and passes through the cover 9 It flows into the upper flow path 4a from the opening 9a. The refrigerant flowing into the upper flow path 4a is cooled and lowered in the upper flow path 4a, flows into the lower flow path 4b from the communication hole 8 through the opening 9a of the cover 9, and then flows into the lower flow path. Return to the vicinity of the lower wall 2b of 4b. Thereby, the heat generated in the electronic component 12 is diffused in the refrigerant in both the upper flow path 4a and the lower flow path 4b, and the temperature rise of the refrigerant becomes a slow temperature rise.

  Therefore, also in the cooler 1A according to the second embodiment, the same effect as in the first embodiment can be obtained.

  Here, in the cooler 1 according to Embodiment 1, the channel cross-sectional area of the upper channel 4a is larger than the channel cross-sectional area of the lower channel 4b. Therefore, the flow rate of the refrigerant flowing in the upper flow path 4a is slow, and the static pressure in the upper flow path 4a is increased. On the other hand, the flow rate of the refrigerant flowing in the lower flow path 4b is fast, and the static pressure in the lower flow path 4b is lowered. Due to the difference in static pressure between the upper channel 4a and the lower channel 4b, the refrigerant flows from the upper channel 4a through the communication hole 8 into the lower channel 4b without passing through the communication channel 4c. End up. Thereby, the flow volume of the refrigerant | coolant which flows through the lower flow path 4b reduces, and there exists a possibility that cooling performance may fall.

  In the cooler 1A according to the second embodiment, the flow passage cross-sectional area of the upper flow passage 4a is larger than the flow passage cross-sectional area of the lower flow passage 4b. Of the refrigerant flowing in the upper flow passage 4a, the cover 9 Since the refrigerant flowing around the refrigerant flows around the cover 9, the flow rate of the refrigerant increases and the static pressure decreases. Therefore, it is possible to prevent the refrigerant from flowing from the upper flow path 4a through the communication hole 8 into the lower flow path 4b due to the difference in static pressure between the upper flow path 4a and the lower flow path 4b. Thereby, the flow volume of the refrigerant | coolant which flows through the lower flow path 4b is ensured, and favorable cooling performance can be maintained.

Embodiment 3 FIG.
FIG. 5 is a sectional view showing a state in which the operation of the refrigerant circulation pump of the cooler according to Embodiment 3 of the present invention is stopped, and FIG. 6 is during operation of the refrigerant circulation pump of the cooler according to Embodiment 3 of the present invention. It is sectional drawing which shows this state. In addition, the arrow in FIG. 6 has shown the flow of the refrigerant | coolant.

5 and 6, the cover 10 is made of a thin plate of a leaf spring that is an elastic member, and its end is fixed to the upstream side of the communication hole 8 on the upper surface of the partition plate 3 to open and close the communication hole 8. It is arranged to be possible. That is, the cover 10 is deformed by the flow of the refrigerant in the upper flow path 4a and closes the communication hole 8, and when the flow of the refrigerant in the upper flow path 4a disappears, the cover 10 is restored and the communication hole 8 is opened.
Other configurations are the same as those in the first embodiment.

  In the cooler 1B according to the third embodiment, when the refrigerant circulation pump is in operation, the cover 10 is deformed by the flow of the refrigerant in the upper flow path 4a and the communication hole 8 is opened as shown in FIG. Block. Therefore, the refrigerant is prevented from flowing into the lower flow path 4b from the upper flow path 4a through the communication hole 8 due to a difference in static pressure between the upper flow path 4a and the lower flow path 4b. . Thereby, the flow volume of the refrigerant | coolant which flows through the lower flow path 4b is ensured, and favorable cooling performance is maintained.

  Further, when the operation of the refrigerant circulation pump is stopped, as shown in FIG. 5, the cover 10 is restored to open the communication hole 8 to increase the opening area. Thereby, it is heated and raised by the heat generated in the electronic component 12, flows into the upper flow path 4a from the communication hole 8, is cooled in the upper flow path 4a, flows into the lower flow path 4b from the communication hole 8, The convection of the refrigerant descending in the lower flow path 4b is maintained, and the slow temperature rise of the refrigerant is maintained.

  In the third embodiment, the cover 10 is deformed by the flow of the refrigerant in the upper flow path 4a and closes the communication hole 8, but the cover 10 does not need to close the communication hole 8, It is only necessary to reduce the opening area of the hole 8 and to suppress the inflow of the refrigerant from the upper flow path 4a side to the lower flow path 4b.

  In the third embodiment, the cover 10 is made of a thin plate of a leaf spring, and the communication hole 8 is opened and closed by elastic deformation of the cover 10, but the cover is made of a thin plate and the end of the cover is partitioned. The communication hole 8 may be arranged to be openable and closable by being attached to the upper surface of the partition plate 3 so as to be rotatable around an axis parallel to the upper surface of the plate 3 and orthogonal to the flow direction of the upper flow channel 4a. In this case, during operation of the refrigerant circulation pump, a force is applied to the cover by the flow of the refrigerant in the upper flow path 4a, and the cover rotates to close the communication hole 8 or reduce the opening area of the communication hole 8. The movement of the refrigerant flowing from the upper flow path 4a through the communication hole 8 into the lower flow path 4b can be prevented or suppressed. Further, during the operation stoppage of the refrigerant circulation pump, the cover is rotated by the rising airflow of the refrigerant heated by the heat generated in the electronic component 12 to open the communication hole 8. Therefore, it is heated and raised by the heat generated in the electronic component 12, flows into the upper flow path 4a from the communication hole 8, is cooled in the upper flow path 4a, flows into the lower flow path 4b from the communication hole 8, and The convection of the refrigerant descending in the flow path 4b is maintained.

  In the first to third embodiments, the main body and the lid member are formed as separate members. However, the main body, the partition plate, and the lid member are integrally formed of, for example, a resin molded body, and the refrigerant inlet nipple is used as the upper flow path. It may be attached to the resin molded body so as to be connected to the resin molded body, and may be attached to the resin molded body so as to connect the refrigerant outlet nipple to the lower flow path. Further, instead of the refrigerant inlet nipple and the refrigerant outlet nipple, a fluid joint or a fluid coupler may be used.

Embodiment 4 FIG.
7 is a side view showing a resin molded body used in a cooler according to Embodiment 4 of the present invention, and FIG. 8 is a perspective view showing a resin molded body used in the cooler according to Embodiment 4 of the present invention. is there.

  7 and 8, the resin molded body 11 is formed by integrally molding the partition plate 3, the cover 9, the lid member 5, the refrigerant inlet nipple 6 and the refrigerant outlet nipple 7 using, for example, polyphenylene sulfide (PPS) resin. Configured.

  In the fourth embodiment, the partition plate 3 is inserted into the main body 2 (not shown), the lid member 5 is fixed so as to close the opening of the main body 2, and the resin molded body 11 is attached to the main body 2. Configure the cooler. Therefore, the number of parts constituting the cooler is reduced, and the cost can be reduced.

  In each of the above embodiments, the cooler is applied to the cooling of the in-vehicle charger. However, the present cooler is not limited to the cooling of the in-vehicle charger, for example, between the rotating electrical machine for the vehicle and the main battery. And may be applied to cooling of a power converter that converts alternating current to direct current or converts alternating current to direct current.

  1, 1A, 1B Cooler, 2 Main body, 2b Lower plate, 2d Bottom plate, 3 Partition plate, 4a Upper flow path, 4b Lower flow path, 4c Communication flow path, 5 Lid member, 6 Refrigerant inlet nipple, 7 Refrigerant outlet nipple , 8 communication holes, 9 cover, 9a opening, 10 cover, 11 resin molding, 12 electronic component.

Claims (7)

It is produced in a bottomed cylindrical body having a cylindrical peripheral wall portion and a bottom plate that closes the other end opening of the peripheral wall portion, and is disposed with the opening at one end facing sideways, and is positioned below the peripheral wall portion. A main body having the outer surface of the lower wall portion to be mounted as an electronic component mounting surface;
A partition plate disposed in the main body and forming an upper channel, a lower channel positioned below the upper channel, and a communication channel that connects the upper channel and the lower channel on the bottom plate side; the equipped, in the cooler of the electronic component for cooling the electronic components to intermittently supplied to the upper SL upper flow path of the refrigerant,
An electronic component cooler, wherein a communication hole is formed in the partition plate so as to communicate the upper flow path and the lower flow path at a position above the electronic component.   2. The electronic component cooler according to claim 1, wherein a flow passage cross-sectional area of the upper flow passage is larger than a flow passage cross-sectional area of the lower flow passage.   The electronic component cooler according to claim 1, wherein the cover has an opening on the downstream side and is formed on an upper surface of the partition plate so as to cover the communication hole.   The cover is attached at one end to the upstream side of the communication hole on the upper surface of the partition plate, and when the refrigerant is supplied to the upper flow path, the communication hole is closed, or the opening area of the communication hole is reduced, 3. The electronic component cooler according to claim 1, wherein the communication hole is configured to open when the supply of the refrigerant to the upper flow path is stopped.   The cover is made of an elastic member, and when the refrigerant is supplied to the upper flow path, the cover is deformed by the flow of the refrigerant flowing through the upper flow path to block the communication hole, or the opening area of the communication hole The electronic component cooler according to claim 4, wherein when the supply of the refrigerant to the upper flow path is stopped, the communication hole is restored and the communication hole is opened. A lid member attached to the main body so as to close one end opening of the main body;
A refrigerant inlet nipple formed in the lid member for supplying a refrigerant to the upper flow path;
A refrigerant outlet ripple for discharging the refrigerant formed in the lid member and flowing through the lower flow path,
The electronic component according to any one of claims 1 to 5, wherein the partition plate, the lid member, the refrigerant inlet nipple, and the refrigerant outlet nipple are integrally formed by resin molding. Cooler.   The electronic component cooler according to any one of claims 1 to 6, wherein the electronic component is an electronic component of an in-vehicle charger mounted on an electric vehicle.

Images