JP2011210776A - Liquid cooling type cooling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid cooling type cooling device capable of efficiently recovering heat by directly contacting liquid coolant with a surface of an object to be cooled, radiating heat after conducting the recovered heat to a predetermined location, and preventing heat dissipation into a room where the device is installed.SOLUTION: The liquid cooling type cooling device 1 recovering the heat of the object 2 to be cooled using the liquid coolant 30 includes: a cup-shaped heat receiving part 10 in a shape of a hollow cup having an opening, in which an inlet 14 and an outlet 15 of the liquid coolant 30 are in communication with the hollow; and a circulation path 20 connected to the inlet 14 and the outlet 15 of the cup-shaped heat receiving part 10 and circulating the liquid coolant 30 in the hollow, wherein the liquid coolant 30 is circulated in the hollow in a state where an opening periphery 11b of the cup-shaped heat receiving part 10 is in tight contact with a surface of the object 2, thereby directly contacting the liquid coolant 30 with the surface of the object 2 to recover the heat.

Description

  The present invention relates to a liquid cooling type cooling apparatus that can be widely applied to an object to be cooled, such as an electronic device such as a personal computer, a display panel, a server device, or an internal combustion engine, and in particular, a liquid on the surface of the object to be cooled. The present invention relates to a liquid-cooling type cooling device capable of effectively recovering heat by directly contacting a refrigerant.

  For example, as a means for cooling high heat generating elements such as CPU (Central Processing Unit) package, IGBT (Insulated Gate Bipolar Transistor) package, or high heat generating devices such as personal computers, display panels, server devices, etc. It has been known.

  As a conventional water-cooled cooling device, for example, Patent Document 1 proposes a liquid-cooled jacket having a structure in which a jacket main body through which a heat transport fluid flows is provided and the jacket main body is brought into contact with the CPU via a thermal diffusion sheet. (See FIG. 3 and FIG. 4 of Patent Document 1).

  Patent Document 2 includes a heat receiving jacket provided with a flow path through which a liquid refrigerant flows, and the heat receiving jacket is brought into contact with the surface of the CPU to transfer the heat of the CPU to the refrigerant flowing in the heat receiving jacket. A liquid cooling system has been proposed (see FIG. 1 of Patent Document 2).

  Patent Document 3 discloses that a radiator can be passed through a liquid cooling heat sink (heat receiving plate) in thermal contact with a heating element such as a CPU through a liquid pump and a pipe in a computer casing. A cooling device for a connected computer has been proposed (see FIG. 2 of Patent Document 3).

In Patent Document 4, the heat receiving member is brought into contact with the CPU in the housing of the electronic device, the heat radiating member is brought into contact with the inner surface of the display panel, the heat receiving member and the heat radiating member are connected by a tube, and the liquid medium is placed in the tube. Electronic devices having a distributed configuration have been proposed (see FIG. 1 of Patent Document 4).
JP 2008-135757 A JP 2006-235914 A JP 2005-122397 A JP 2004-312032 A

  In each of the above-described water-cooled cooling devices of Patent Documents 1 to 4, a heat receiving member (jacket or heat receiving plate) through which liquid refrigerant flows is brought into contact with a heating element such as a CPU to conduct heat conduction in the solid portion of the wall of the heat receiving member. The heat of the heating element is transmitted to the liquid refrigerant. However, the wall portion of the heat receiving member has a large thermal resistance, and this portion is the rate of heat flux. For this reason, the conventional water-cooled cooling device has a problem that the heating element cannot be efficiently cooled. This problem is caused by the heat conduction in the solid part of the wall of the heat receiving member. For example, the wall of the heat receiving member is made of metal having high thermal conductivity, and the wall of the heat receiving member and the heating element are interposed. Even if a highly heat-conductive sheet or grease was interposed, the loss of heat transfer from the heating element to the liquid refrigerant could not be eliminated.

  Moreover, in the water-cooling type cooling devices of Patent Documents 1 to 4 described above, the heat recovered from the heating element is transported as latent heat of the liquid refrigerant, and finally the exhaust heat means such as a radiator or a heat radiating pipe is used for the electronic device. It was discharged outside the housing (usually the room where the electronic equipment was installed). However, when the calorific value of a device such as a personal computer, display panel, or server device is large or the number of devices is large, the indoor temperature rises due to the heat released from these devices. There was also a problem that the entropy in the heat transfer between the two increased. In addition to the loss of heat transfer from the heating element to the liquid refrigerant described above, the heat released into the room further reduces the cooling efficiency, and the conventional water-cooled cooling device effectively uses a server device having a large heat generation amount. Could not be cooled. In addition to this, the temperature rise in the room increases the amount of power consumed by the air conditioner, leading to the problem of hindering energy saving.

  In recent years, in a technical field such as a supercomputer, a method is adopted in which the entire circuit is immersed in an electrically insulating cryogenic liquid refrigerant, and the liquid refrigerant is brought into direct contact with the heating element for cooling. However, this cooling method requires a heat insulating container of a size that can accommodate the entire circuit and a refrigerator for cooling the liquid refrigerant, and the entire cooling device becomes large and expensive, so it is limited to special applications. There was a problem of being.

  The present invention has been made in view of the above problems, and can effectively recover heat by bringing a liquid refrigerant into direct contact with the surface of an object to be cooled, and transporting the recovered heat to a predetermined place. The object is to provide a liquid-cooled cooling device that can radiate heat and prevent diffusion of heat into the room where the equipment is installed.

  In order to achieve the above object, the liquid cooling type cooling apparatus of the present invention is a liquid cooling type cooling apparatus that recovers the heat of an object to be cooled with a liquid refrigerant, and has a hollow cup shape having an opening. A cup-shaped heat receiving part in which the inlet and outlet of the liquid refrigerant communicate with each other in the hollow, and a circulation connected to the inlet and outlet of the cup-shaped heat receiving part to circulate the liquid refrigerant in the hollow The liquid refrigerant is circulated in the hollow with the periphery of the opening of the cup-shaped heat receiving part in close contact with the surface of the object to be cooled, and the liquid refrigerant is circulated on the surface of the object to be cooled. In this configuration, the heat is recovered by direct contact with the surface.

  According to the above configuration, the liquid refrigerant can be brought into direct contact with the surface of the object to be cooled by the cup-shaped heat receiving portion to be cooled. Thereby, the thermal resistance between the object to be cooled and the liquid refrigerant can be eliminated, the heat transfer from the object to be cooled to the liquid refrigerant becomes good, and the cooling efficiency can be greatly improved.

  Here, the “cooling object” in the present invention includes a heating element such as a CPU that generates heat itself, a substrate on which the heating element is mounted, a device incorporating the heating element, a rack for housing the device, and the like. included.

  Preferably, as the liquid refrigerant, a substance whose vapor pressure is negative than atmospheric pressure is used, and the periphery of the opening of the cup-shaped heat receiving part is in close contact with the surface of the object to be cooled. According to such a configuration, the cup-shaped heat receiving unit can be brought into close contact with the cooling target under atmospheric pressure using the properties of the cooling target, and the cooling target is sealed in the hollow of the cup-shaped heat receiving unit. It is possible to stop.

  Preferably, a depressurizing means for maintaining the inside of the circulation path at a negative pressure from the atmospheric pressure is provided, and the periphery of the opening of the cup-shaped heat receiving part is in close contact with the surface of the object to be cooled. According to such a configuration, the cup-shaped heat receiving unit and the object to be cooled can be kept in close contact by the decompression unit, and combined with the configuration in which the vapor pressure of the liquid refrigerant is a negative pressure, It becomes possible to make the sealing of the cooling object in the hollow of the part more reliable.

  Preferably, a nozzle is provided in the hollow of the cup-shaped heat receiving part, and the liquid refrigerant supplied from the inlet is jetted from the nozzle onto the surface of the object to be cooled.

  According to the above configuration, by injecting the liquid refrigerant from the nozzle onto the surface of the object to be cooled, the temperature boundary layer between the liquid refrigerant and the object to be cooled can be thinned, and heat transfer from the object to be cooled to the liquid refrigerant Can be promoted.

  Preferably, it is set as the structure provided with the holding member which presses the said cup-shaped heat receiving part on the surface of the said cooling target object.

  As described above, in the cooling device of the present invention, the cup-shaped heat receiving portion is brought into close contact with the surface of the object to be cooled by setting the vapor pressure of the liquid refrigerant to a negative pressure and / or setting the inside of the circulation path to a negative pressure. However, the liquid refrigerant can be more reliably prevented from leaking by mechanically bringing them into close contact with each other by the holding member. When the cup-shaped heat receiving part and the object to be cooled are kept in close contact with only the holding member, the vapor pressure of the liquid refrigerant is not limited to a negative pressure, and the inside of the circulation path is not set to a negative pressure. May be. Even in such a configuration, it is possible to efficiently cool the liquid refrigerant by directly contacting the surface of the object to be cooled in the hollow of the cup-shaped heat receiving portion.

  Preferably, exhaust heat means for releasing the heat recovered by the liquid refrigerant is connected to the circulation path, and the exhaust heat means is arranged outside the space where the object to be cooled is installed.

  According to the above configuration, the heat recovered by the liquid refrigerant is prevented from diffusing around the object to be cooled, and an increase in entropy in the movement of heat between the room temperature and the device temperature can be suppressed. Thereby, the cooling of the present invention in which the liquid refrigerant is brought into direct contact with the surface of the object to be cooled is more effectively performed, and the power consumption of the air conditioner for managing the air conditioning in the room where the object to be cooled is installed is reduced. Can do. The cooling device of the present invention having the above configuration is particularly effective for cooling a device having a large calorific value such as a server device.

  Preferably, in the above-described cooling device of the present invention, the plurality of cup-shaped heat receiving portions are in close contact with the surfaces of the plurality of cooling objects, and the heat recovered from each cooling object is at least one of the heat exhausting units. May be adopted.

  According to the said structure, the heat collect | recovered from the several cooling target object can be collected in at least 1 waste heat | fever means, and it can discharge | release to the space where each cooling target object was installed. This makes it possible to efficiently cool a plurality of high-heat-generating devices, and to process a large amount of heat collected from each device in a place that does not affect these devices.

  As described above, according to the liquid cooling type cooling apparatus of the present invention, the liquid refrigerant can be directly brought into contact with the surface of the object to be cooled to effectively recover the heat, and the recovered heat is conveyed to a predetermined place. Then, it is possible to dissipate heat and prevent diffusion of heat into the room where the equipment is installed.

It is a schematic circuit diagram which shows the whole liquid cooling type cooling device which concerns on embodiment of this invention. One Embodiment of the cup-shaped heat receiving part which comprises the said cooling device is shown, The figure (a) is sectional drawing, The figure (b) is a back view. It is sectional drawing which shows the sealed expansion tank (pressure reduction means) which comprises the said cooling device. An embodiment in the case where the cooling device is applied to a CPU of a personal computer is shown, in which FIG. (A) is an overall schematic circuit diagram, and (b) is a sectional view of a cup-shaped heat receiving portion. An embodiment in the case where the cooling device is applied to a plurality of server devices is shown. FIG. 4A is an overall schematic circuit diagram, and FIG. 4B is a cross-sectional view of a cup-shaped heat receiving portion. It is a fragmentary sectional view which shows embodiment which made the said cup-shaped heat receiving part closely_contact | adhere to the surface of CPU with the holding member.

  Hereinafter, a liquid cooling type cooling apparatus according to an embodiment of the present invention will be described with reference to the drawings.

[Configuration of liquid cooling system]
First, the overall configuration of the liquid cooling type cooling apparatus according to the present embodiment will be described with reference to FIG. In the figure, a liquid cooling type cooling device 1 includes a cup-shaped heat receiving part 10, a circulation path 20, a liquid refrigerant 30, a sealed expansion tank (decompression unit) 40, a pump 50, a radiator (exhaust heat unit) 60, and a cooling fan 70. It is the composition provided with.

  The cup-shaped heat receiving unit 10 is in close contact with the surface of the object to be cooled (CPU in this embodiment) 2 and recovers heat by bringing the liquid refrigerant 30 into direct contact with the surface of the CPU 2. The circulation path 20 is connected to the inflow port 14 and the outflow port 15 of the cup-shaped heat receiving unit 10, and allows the liquid refrigerant 30 to flow into and out of the hollow 12 in the cup-shaped heat receiving unit 10. The hermetic expansion tank 40 is connected between the outlet of the radiator 60 in the circulation path 20 and the inlet 14 of the cup-shaped heat receiving unit 10, and keeps the inside of the circulation path 20 at a negative pressure rather than atmospheric pressure. . The pump 50 sucks and delivers the liquid refrigerant 30 to circulate in the circulation path 20. The radiator 60 releases the heat recovered by the liquid refrigerant 30.

<Cup-shaped heat receiving part>
The configuration of the cup-shaped heat receiving unit 10 according to one embodiment of the present invention will be described with reference to FIGS. 2 (a) and 2 (b). In FIG. 2A, a cup-shaped heat receiving portion 10 is a molded product made of, for example, a synthetic resin, and has a cup-shaped main body 11 having a hollow 12 inside. The size of the main body 11, the size of the opening, the shape of the opening peripheral edge 11b, and the like are determined according to the size, heat generation amount, surface shape, and the like of the CPU 2 that is the cooling target.

  The hollow 12 in the main body 11 is divided into a storage chamber 12A and a cooling chamber 12B by a partition wall 11a. An inflow port 14 communicates with the upper storage chamber 12A, and an outflow port 15 communicates with the lower cooling chamber 12B. Moreover, in the cup-shaped heat receiving part 10 of this embodiment, the structure which provided the four nozzles 13, 13, 13, 13 (refer FIG.2 (b)) which protrudes in the cooling chamber 12B from the lower surface of the partition wall 11a. Is adopted. Each nozzle 13 ejects the liquid refrigerant 30 sent into the storage chamber 12 </ b> A toward the opening of the main body 11.

  In this embodiment, the opening of the main body 11 has a substantially rectangular shape corresponding to the shape and area of the upper surface of the CPU 2, and a similar gasket 16 having a slightly narrower width is attached to the opening periphery 11b. . This gasket 16 is in close contact with the surface of the CPU 2 to prevent the liquid refrigerant 30 from leaking.

  As will be described in detail later, in the present embodiment, since the liquid refrigerant 30 is made of a substance having a predetermined conductivity and vapor pressure (for example, ethyl alcohol), the gasket 16 is excellent in airtightness and heat resistance. A material that does not easily deform even when used for many years and has chemical resistance corresponding to the type of the liquid refrigerant 30 is selected. For example, if ethyl alcohol is used as the liquid refrigerant 30, the material of the gasket 16 is PTFE (polytetrafluoroethylene), PCTFE (polychlorotrifluoroethylene), which is a fluororesin having good chemical resistance to ethyl alcohol, and the like. Is preferred. In addition, resin materials such as PVDF (polyvinylidene fluoride) and PA (polyamide) can be used.

<Liquid refrigerant>
As described above, in the present embodiment, a substance having a predetermined conductivity and vapor pressure is used as the liquid refrigerant 30. The electrical conductivity of the liquid refrigerant 30 takes into account leakage when the liquid cooling type cooling device 1 is applied to an electronic device such as a personal computer.

  That is, the close contact between the cup-shaped heat receiving unit 10 and the CPU 2 can be sufficiently ensured by the vapor pressure of the liquid refrigerant 30 described later, the reduced pressure by the sealed expansion tank 40, or the holding member 90 shown in FIG. The conductivity of the liquid refrigerant 30 used in the liquid cooling type cooling device 1 is not particularly limited. However, even if the close contact between the cup-shaped heat receiving unit 10 and the CPU 2 is ensured, the liquid refrigerant 30 does not necessarily leak 100% in every situation (for example, when performing maintenance or repair). Therefore, a substance having a low conductivity is used as the liquid refrigerant 30.

  Next, it is preferable to use a material whose vapor pressure of the liquid refrigerant 30 is negative rather than atmospheric pressure. By setting the vapor pressure of the liquid refrigerant 30 to a negative pressure, the inside of the hollow 12 of the cup-shaped heat receiving part 10 through which the liquid refrigerant 30 circulates can be set to a negative pressure, and the cup-shaped heat receiving part 10 can be placed under atmospheric pressure. It becomes possible to adhere to the surface of CPU2.

  As such a liquid refrigerant 30, for example, a substance having a lower conductivity than tap water (conductivity of about 100 μS / cm) can be widely used. Preferably, ethyl alcohol used as a cleaning liquid for a printed wiring board, By applying a fluorine-based solvent, ultrapure water, pure water, or the like, even if the liquid refrigerant 30 leaks, a short circuit problem does not occur.

<Sealed expansion tank>
In FIG. 1, a sealed expansion tank 40 is a decompression unit that keeps the inside of the circulation path 20 at a negative pressure rather than an atmospheric pressure. The configuration of the sealed expansion tank 40 is shown in FIG. In the figure, a sealed expansion tank 40 mainly has a tank body 41 connected to the circulation path 20, and the inside of the tank body 41 is divided by a partition film 42 that can be elastically deformed, and a lower liquid chamber 41 </ b> A. And the upper air chamber 41B is formed.

  An air vent 43 is formed in the air chamber 41 </ b> B, and a suction valve 45 is attached to the outlet of the air vent 43 via a check valve 44. The check valve 44 is configured to open only in the direction in which air escapes from the air chamber 41B to the outside. A suction means such as a piston (not shown) is connected to the suction valve 45.

  In such a sealed expansion tank 40, when the air in the air chamber 41B is sucked through the suction valve 45 and the check valve 44, the partition film 42 expands toward the air chamber 41B according to the sucked air amount. Then, the liquid refrigerant 30 is sucked into the liquid chamber 41A to make the inside of the circulation path 20 have a negative pressure. Thereafter, the partition film 42 expands or contracts in accordance with the pressure change in the circulation path 20, and maintains the inside of the circulation path 20 in a predetermined negative pressure state. Thereby, the cup-shaped heat receiving unit 10 can be brought into close contact with the surface of the CPU 2 under atmospheric pressure.

<Pump>
In FIG. 1, the pump 50 is not limited to a method such as a centrifugal pump, a diaphragm pump, a plunger pump, a piston pump, a vane pump, or a roller pump as long as the liquid refrigerant 30 can be circulated at a sufficient pressure.

<Radiator>
As shown in FIG. 1, the radiator 60 that is a means for exhausting heat from the liquid refrigerant 30 includes a meandering pipe 61 that is connected to the circulation path 20 and in which the liquid refrigerant 30 circulates. The fin 62 is provided. A cooling fan 70 driven by a motor 71 is installed in the vicinity of the radiator 60, and the heat radiation fins 62 are air-cooled by the cooling fan 70 to release the heat of the liquid refrigerant 30 to the outside. The exhaust heat means of the liquid refrigerant 30 is not limited to the radiator 60. Well-known cooling means capable of cooling the liquid refrigerant 30 can be widely applied.

[First Embodiment]
Next, as a first embodiment of the liquid cooling type cooling apparatus 1 described above, a case where it is applied to a CPU of a personal computer will be described with reference to FIGS. 4 (a) and 4 (b). The first to third embodiments described below exemplify a preferable configuration when the liquid cooling type cooling device 1 described above is applied to a personal computer, a server device, or the like. Therefore, when actually implementing the liquid cooling type cooling device of the present invention, various modes can be selected as necessary, and the present invention is not limited to the contents of each embodiment described below.

<Concept>
In FIG. 4A, when the liquid cooling type cooling device 1 is applied to the CPU 2 of the personal computer 3, it is preferable that all the components of the liquid cooling type cooling device 1 are accommodated in the housing 3 a of the personal computer 3. .

  The personal computer 3 such as a notebook type or a desktop type is required to be an integrated type in which all necessary components are housed in a casing from the viewpoints of simplification, reduction of installation space, and elimination of carrying and handling. . Further, in the personal computer 3 such as a notebook type or a desktop type, the CPU 2 is small, and its heat generation is relatively small (core temperature at idle to full load = about 40 ° C. to about 75 ° C.).

  Therefore, when cooling such a CPU 2, the cup-shaped heat receiving unit 10, the sealed expansion tank 40, the pump 50, the radiator 60, and the cooling fan 70 shown in FIG. It can be easily stored in the housing 3a of the computer 3. On the other hand, in the notebook type or desktop type personal computer 3, the heat generation amount of the CPU 2 is relatively small. Therefore, the radiator 60 is disposed in the casing 3 a, and the heat of the liquid refrigerant 30 is transferred to the environment around the personal computer 3 ( For example, even if it is released indoors, there is almost no effect on the cooling efficiency.

<Configuration of cup-shaped heat receiving part>
As shown in FIG. 4 (b), in this embodiment, the nozzle 13 (see FIG. 2) is not provided on the partition wall 11a of the cup-shaped heat receiving part 10, and the storage chamber 12A and the cooling chamber 12B are communicated with each other. It is set as the structure connected through the holes 11c, 11c .... In such a configuration, the liquid refrigerant 30 in the storage chamber 12A is supplied to the cooling chamber 12B as a liquid, and the liquid refrigerant 30 filled in the cooling chamber 12B directly contacts the surface of the CPU 2 to recover heat. I do.

<Vapor pressure and boiling point of liquid refrigerant>
As the liquid refrigerant 30, a substance whose vapor pressure is more negative than atmospheric pressure, such as ethyl alcohol, is used, and the cup-shaped heat receiving unit 10 is brought into close contact with the surface of the CPU 2 under atmospheric pressure. Further, the inside of the circulation path 20 is kept at a negative pressure by the hermetic expansion tank 40, and the close contact between the cup-shaped heat receiving unit 10 and the CPU 2 is more sure.

<Cooling operation>
In FIG. 4A, the liquid refrigerant 30 flowing through the circulation path 20 flows into the storage chamber 12A of the cup-shaped heat receiving unit 10 through the inlet 14, and is cooled through the communication holes 11C of the partition wall 11a. The liquid is supplied as it is into the chamber 12B. As shown in FIG. 2B, the liquid refrigerant 30 filled in the cooling chamber 12B directly contacts the surface of the CPU 2 and recovers the heat of the CPU 2 without any thermal resistance. At this time, the CPU 2 has a boiling point of the liquid refrigerant 30 (the boiling point of ethanol is 78.4 ° C. under atmospheric pressure, but in the present embodiment, the pressure in the circulation path 20 is reduced, so it is lower than 78.4 ° C. ), The liquid refrigerant 30 in the cooling chamber 12B partially evaporates.

  After that, the liquid refrigerant 30 that has recovered the heat in the cooling chamber 12B is sucked from the outlet 15 to the pump 50 side and sent out from the pump 50 to the radiator 60 side in a state of containing the evaporated gas. The liquid refrigerant 30 that has recovered the heat is cooled by the radiation fins 62 and the cooling fan 70 in the process of passing through the meandering pipe 61 of the radiator 60, and the heat recovered by the liquid refrigerant 30 is Is released. The liquid refrigerant 30 that has passed through the radiator 60 passes through the circulation path 20 and is supplied again into the storage chamber 12A of the cup-shaped heat receiving unit 10.

  The liquid refrigerant 30 circulated through the path as described above expands or contracts due to a temperature change in the process. In such a case, the partition film 42 of the sealed expansion tank 40 expands or contracts, and the circulation path 20 The internal pressure is kept at a constant negative pressure.

<Effect>
When the CPU 2 of the personal computer 3 is cooled, since the heat generation amount of the CPU 2 is relatively small, each component of the liquid cooling type cooling device 1 is also small, and all these components are contained in the housing 3a of the personal computer 3. Can be stored. Then, the liquid refrigerant 30 filled in the cooling chamber 12B of the cup-shaped heat receiving unit 10 can be brought into direct contact with the surface of the CPU 2 so that the heat of the CPU 2 can be efficiently recovered.

[Second Embodiment]
Next, as a second embodiment of the liquid cooling type cooling apparatus 1 described above, a case where it is applied to a plurality of server apparatuses will be described with reference to FIGS. 5 (a) and 5 (b). In addition, about the part similar to 1st Embodiment mentioned above, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.

<Concept>
Conventionally, server devices have a large amount of heat generation and have serious heat problems. In particular, a rack mount type or blade type server device has a configuration in which each unit constituting the unit includes a heat generating component such as a CPU and a hard disk, and a plurality of units are accommodated in a rack or a housing. Generates heat. Furthermore, in a server room where multiple server devices are gathered in one room, cooling by CPU, cooling by unit, and cooling by rack are necessary, and the room temperature of the server room must be constantly managed. There wasn't.

  Therefore, in the present embodiment, a plurality of server apparatuses are effectively cooled using a plurality of liquid cooling type cooling apparatuses 1, and a large amount of heat recovered from each server apparatus is transferred to a predetermined place other than the server room. The structure which conveys and discharge | releases is illustrated.

<Overall configuration>
In FIG. 5A, reference numeral 4 denotes a server room, in which a plurality of server devices 4A to 4N are installed. Each unit constituting each of the server apparatuses 4A to 4N incorporates the cup-shaped heat receiving portion 10 and the IN / OUT circulation path 20 of the liquid cooling type cooling apparatus 1, and the CPUs 2, 2, 2 of the plurality of units are incorporated. Are in close contact with the cup-shaped heat receiving portions 10, 10, 10. That is, FIG. 4A illustrates a configuration in which the server apparatuses 4A to 4N are cooled in units of CPUs.

  The IN / OUT circulation paths 20, 20, 20... In each of the server apparatuses 4A to 4N are respectively connected to an IN port 6A and an OUT port 6B embedded in a wall separating the server room 4 and the adjacent exhaust heat chamber 5. It is connected to the radiator 60 installed in the exhaust heat chamber 5 through the IN port 6A and the OUT port 6B. A closed expansion tank 40 is connected to the circulation path 20 that connects the outlet of the radiator 60 and the IN port 6A. On the other hand, the circulation path 20 that connects the inlet of the radiator 60 and the OUT port 6B is connected to the circulation path 20. The pump 50 is connected. Further, a cooling fan 70 is disposed in the vicinity of the radiator 60, and heat released from the radiator 60 is exhausted to the outside of the exhaust heat chamber 5 by the cooling fan 70.

  Unlike the first embodiment, in the liquid cooling type cooling apparatus 1 of the present embodiment, a common sealed expansion tank 40, pump 50, radiator 60 and cooling are used for the plurality of cup-shaped heat receiving units 10, 10, 10,. A fan 70 is provided, and these perform pressure reduction management in the circulation path 20 in the entire liquid cooling type cooling device 1, circulation of the cooling medium 30, and heat recovery from the cooling medium 30. Further, since the liquid cooling type cooling device 1 of the present embodiment cools the plurality of server devices 4A to 4N having a large calorific value, these hermetic expansion tank 40, pump 50, radiator 60 and cooling fan 70 are cooled. However, if a dedicated room is secured as the server room 4 and the exhaust heat chamber 5, the problem of noise does not occur. Furthermore, the closed expansion tank 40, the pump 50, the radiator 60, and the cooling fan 70 may be installed outdoors without providing the exhaust heat chamber 5. The liquid cooling type cooling device 1 of the present embodiment is characterized in that a large amount of heat generated by the server devices 4A to 4N is exhausted at a place other than the server room.

<Configuration of cup-shaped heat receiving part>
As shown in FIG. 5B, in this embodiment, four nozzles 13 project from the partition wall 11 a of the cup-shaped heat receiving unit 10, and the liquid refrigerant 30 is injected from the nozzles 13 onto the surface of the CPU 2. It is the composition which makes it cool.

<Cooling operation>
In FIG. 5 (a), the liquid refrigerant 30 flowing through the circulation path 20 flows into the storage chamber 12A of the cup-shaped heat receiving part 10 through the inlet 14, and from each nozzle 13 of the partition wall 11a to the surface of the CPU 2. Be injected. As shown in FIG. 5B, the liquid refrigerant 30 is injected onto the surface of the CPU 2, so that the temperature boundary layer between the liquid refrigerant 30 and the CPU 2 becomes thin, and heat transfer from the CPU 2 to the liquid refrigerant 30 is promoted. It becomes possible.

  The liquid refrigerant 30 in the cooling chamber 12B is sucked from the outlet 15 to the pump 50 side and sent from the pump 50 to the radiator 60 side. Thereafter, the liquid refrigerant 30 is cooled by the radiation fins 62 and the cooling fan 70 in the process of passing through the meandering pipe 61 of the radiator 60. At this time, the heat recovered by the liquid refrigerant 30 is exhausted to the outside of the exhaust heat chamber 5 by the cooling fan 70. Then, the cooled liquid refrigerant 30 passes through the circulation path 20 and is supplied again into the storage chamber 12 </ b> A of the cup-shaped heat receiving unit 10.

<Example of change>
In the above-described embodiment, the configuration in which the server apparatuses 4A to 4N are cooled in units of CPUs is exemplified, but the present invention is not limited to this. For example, by providing the cup-shaped heat receiving part 10 corresponding to the shape and area of the surface of one unit constituting each server device 4A to 4N, each server device 4A to 4N can be cooled in units. Further, by providing the cup-shaped heat receiving unit 10 corresponding to the shape and area of the back and side surfaces of the rack that stores the units, it is possible to cool the server devices 4A to 4N in units of racks.

<Effect>
When cooling a plurality of server devices 4A to 4N, since heat-generating components such as the CPU 2 generate extremely large heat, more effective cooling is necessary. According to the liquid cooling type cooling apparatus 1 of the present embodiment, the temperature boundary layer between the liquid refrigerant 30 and the object to be cooled can be thinned by injecting the liquid refrigerant 30 from each nozzle 13 of the cup-shaped heat receiving unit 10. It is possible to promote heat transfer from the object to be cooled to the liquid refrigerant 30.

  In addition, the radiator 60 and the cooling fan 70 as exhaust heat means are installed in the exhaust heat chamber 5 isolated from the server room 4, and the heat recovered by the liquid refrigerant 30 is transported to the exhaust heat chamber 5 and exhausted. As a result, the recovered heat is prevented from diffusing into the server room 4, and an increase in entropy in the heat transfer between the room temperature of the server room 4 and the device temperature of each of the server apparatuses 4A to 4N is suppressed. It becomes possible. As a result, cooling by the liquid cooling type cooling device 1 is performed more effectively, and the power consumption of the air conditioner that manages the air conditioning of the server room 4 can be reduced.

[Third Embodiment]
FIG. 6 shows a third embodiment of the liquid cooling type cooling apparatus 1 described above. Hereinafter, the third embodiment of the liquid cooling type cooling apparatus 1 will be described with reference to FIG. In the embodiments described below, the same parts as those in the first and second embodiments described above are denoted by the same reference numerals, and detailed description thereof is omitted.

<Composition of cup-shaped heat receiving part and holding member>
In the figure, the liquid cooling type cooling apparatus 1 according to the present embodiment includes a holding member 90 that presses the cup-shaped heat receiving portion 80 against the surface of the CPU 2. First, the configuration of the cup-shaped heat receiving portion 80 will be described. A flange-shaped flange portion 81a is coupled to the opening peripheral edge 81b of the cup-shaped heat receiving portion 80. A gasket 82 surrounding the opening of the heat receiving portion 80 is attached. In addition, the inlet 83 and the outlet 84 of the liquid refrigerant 30 project from the upper portion of the main body 81 so that the main body 81 of the cup-shaped heat receiving portion 80 is inserted into the holding member 90.

  On the other hand, the holding member 90 includes a bracket 91 and a plate 92. A holding hole 91 a is formed at the center of the bracket 91, and the holding hole 91 a has substantially the same shape and size as the main body 81 of the cup-shaped heat receiving portion 80. The bracket 91 has four leg portions 91b, 91b, 91b, 91b bent in a substantially L shape, and each leg portion 91b has a through hole 91c, 91c, 91c, 91c, respectively. It is drilled. On the other hand, the plate 92 has four through holes 92a corresponding to the through holes 91c of the leg portions 91b.

<Retaining structure>
First, the cup-shaped heat receiving unit 80 is placed on the surface of the CPU 2. In this state, the main body 81 of the cup-shaped heat receiving portion 80 is inserted into the holding hole 91a of the bracket 91, and the bracket 91 is brought into contact with the flange portion 81a of the cup-shaped heat receiving portion 80. Next, the plate 92 is overlaid on the back side of the printed circuit board 7 on which the CPU 2 is mounted, and the through holes 91c of the bracket 91, the through holes 7a of the printed circuit board 7, and the through holes 92a of the plate 92 are made to coincide with each other. In this state, the screw 93 is inserted into the through holes 91c, 7a and 92a communicating with each other, and the bracket 91 and the plate 92 are fastened. Thereby, the bracket 91 presses the flange portion 81a of the cup-shaped heat receiving portion 80, and the opening peripheral edge 81b of the cup-shaped heat receiving portion 80 is firmly attached to the surface of the CPU 2.

<Effect>
As in the first and second embodiments described above, in this embodiment as well, the cup-shaped heat receiving unit 80 is connected to the CPU 2 by setting the vapor pressure of the liquid refrigerant 30 to a negative pressure and setting the inside of the circulation path 20 to a negative pressure. However, it is possible to more reliably prevent the liquid refrigerant 30 from leaking by mechanically bringing them into close contact with each other by the holding member 90. In addition, when it is set as the structure which maintains the close_contact | adherence with the cup-shaped heat receiving part 80 and CPU2 only with the holding member 90, the vapor pressure of the liquid refrigerant 30 is not limited to a negative pressure, Moreover, the inside of the circulation path 20 is a negative pressure. You don't have to. Even in such a configuration, the liquid refrigerant 80 can be brought into direct contact with the surface of the CPU 2 and efficiently cooled in the hollow of the cup-shaped heat receiving unit 80.

1 Liquid cooling type cooling device 2 CPU (Cooling object)
DESCRIPTION OF SYMBOLS 3 Personal computer 3a Case 4 Server room 4A, 4B Server 5 Heat exhaust chamber 6A IN port 6B OUT port 7 Printed circuit board 7a Through-hole 10 Cup-shaped heat receiving part 11 Main body 11a Partition wall 11b Opening edge periphery 11c Communication hole 12 Hollow 12A Storage Chamber 12B Cooling chamber 13 Nozzle 14 Inlet 15 Outlet 16 Gasket 20 Circulation path 30 Liquid refrigerant 40 Sealed expansion tank (pressure reduction means)
41 tank body 41A liquid chamber 41B air chamber 42 partition membrane 43 air vent 44 check valve 45 suction valve 50 pump 60 radiator (heat exhausting means)
61 Pipe 62 Radiation fin 70 Cooling fan 71 Motor 80 Cup-shaped heat receiving part 81 Main body 81a Flange part 81b Opening peripheral edge 82 Gasket 83 Inlet 84 Outlet 90 Holding member 91 Bracket 91a Holding hole 91b Leg part 91c Through hole 92 Plate 92a Through Hole 93 screw

Claims (7)

A liquid cooling type cooling device that recovers heat of an object to be cooled with a liquid refrigerant,
A cup-shaped heat receiving portion having a hollow cup shape having an opening, and communicating the liquid refrigerant inflow port and outflow port in the hollow;
A circulation path connected to the inlet and the outlet of the cup-shaped heat receiving part and circulating the liquid refrigerant in the hollow,
In a state where the periphery of the opening of the cup-shaped heat receiving part is in close contact with the surface of the object to be cooled, the liquid refrigerant is circulated in the hollow, and the liquid refrigerant is brought into direct contact with the surface of the object to be cooled to heat. The liquid cooling type cooling device characterized by performing collection | recovery.   The liquid cooling type cooling device according to claim 1, wherein a substance having a vapor pressure that is more negative than atmospheric pressure is used as the liquid refrigerant, and the periphery of the opening of the cup-shaped heat receiving part is brought into close contact with the surface of the object to be cooled. .   The liquid cooling type cooling apparatus according to claim 1 or 2, wherein a decompression means for maintaining the inside of the circulation path at a negative pressure from the atmospheric pressure is provided, and the periphery of the opening of the cup-shaped heat receiving part is brought into close contact with the surface of the object to be cooled. .   The liquid according to any one of claims 1 to 3, wherein a nozzle is provided in a hollow of the cup-shaped heat receiving portion, and the liquid refrigerant supplied from the inlet is sprayed from the nozzle onto the surface of the object to be cooled. Cold cooling device.   The liquid cooling type cooling device of any one of Claims 1-4 provided with the holding member which presses the said cup-shaped heat receiving part on the surface of the said cooling target object.   The exhaust heat means for releasing the heat recovered by the liquid refrigerant is connected to the circulation path, and the exhaust heat means is disposed outside the space where the object to be cooled is installed. The liquid cooling type cooling apparatus as described.   The liquid cooling type according to claim 8, wherein the plurality of cup-shaped heat receiving portions are in close contact with the surfaces of the plurality of cooling objects, and the heat recovered from each cooling object is released by at least one of the exhaust heat means. Cooling system.

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