JP5754931B2 - 画像解析装置、画像解析方法及びプログラム - Google Patents

画像解析装置、画像解析方法及びプログラム Download PDF

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Publication number
JP5754931B2
JP5754931B2 JP2010285052A JP2010285052A JP5754931B2 JP 5754931 B2 JP5754931 B2 JP 5754931B2 JP 2010285052 A JP2010285052 A JP 2010285052A JP 2010285052 A JP2010285052 A JP 2010285052A JP 5754931 B2 JP5754931 B2 JP 5754931B2
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Japan
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JP2010285052A
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Japanese (ja)
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JP2012133587A (ja
JP2012133587A5 (enExample
Inventor
新之介 大澤
新之介 大澤
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2010285052A priority Critical patent/JP5754931B2/ja
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Publication of JP2012133587A5 publication Critical patent/JP2012133587A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Image Analysis (AREA)
JP2010285052A 2010-12-21 2010-12-21 画像解析装置、画像解析方法及びプログラム Expired - Fee Related JP5754931B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010285052A JP5754931B2 (ja) 2010-12-21 2010-12-21 画像解析装置、画像解析方法及びプログラム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010285052A JP5754931B2 (ja) 2010-12-21 2010-12-21 画像解析装置、画像解析方法及びプログラム

Publications (3)

Publication Number Publication Date
JP2012133587A JP2012133587A (ja) 2012-07-12
JP2012133587A5 JP2012133587A5 (enExample) 2014-02-13
JP5754931B2 true JP5754931B2 (ja) 2015-07-29

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ID=46649114

Family Applications (1)

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JP2010285052A Expired - Fee Related JP5754931B2 (ja) 2010-12-21 2010-12-21 画像解析装置、画像解析方法及びプログラム

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JP (1) JP5754931B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101472853B1 (ko) 2013-07-17 2014-12-16 (주)탑중앙연구소 카메라 모듈의 광축 정합성 평가 시스템 및 이를 사용한 카메라 모듈의 광축 정합성 평가 방법
JPWO2015093231A1 (ja) * 2013-12-16 2017-03-16 西谷 隆夫 画像処理装置
KR101874471B1 (ko) 2016-11-07 2018-07-04 광주과학기술원 객체 검색 후보 영역을 개선하기 위한 방법, 컴퓨터-판독가능 저장 매체 및 장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3657463B2 (ja) * 1999-06-29 2005-06-08 シャープ株式会社 動作認識システムおよび動作認識プログラムを記録した記録媒体
JP4379052B2 (ja) * 2003-08-29 2009-12-09 ソニー株式会社 動体検出装置、動体検出方法、及びロボット装置
JP2005196252A (ja) * 2003-12-26 2005-07-21 Konica Minolta Photo Imaging Inc 目標物領域検出装置、撮影装置、目標物領域検出方法、およびコンピュータプログラム
JP2007156626A (ja) * 2005-12-01 2007-06-21 Nissan Motor Co Ltd 物体種別判定装置及び物体種別判定方法
JP2010055468A (ja) * 2008-08-29 2010-03-11 Nikon Corp 画像処理装置、およびカメラ

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JP2012133587A (ja) 2012-07-12

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