JP5748397B2 - Organic EL device - Google Patents

Description

  The present invention relates to an organic EL device.

The organic EL device has characteristics such as high luminance and low power consumption, and is used for, for example, a lighting device and a backlight for a display.
The organic EL device is, for example, interposed between a transparent glass substrate, a transparent anode electrode provided on the glass substrate, a cathode electrode disposed opposite to the transparent anode electrode, and the transparent anode electrode and the cathode electrode. And an organic EL layer. A laminated structure composed of a transparent anode electrode, an organic EL layer, and a cathode electrode is an organic EL element that generates light in an organic EL device.

  When a voltage is applied between the transparent anode electrode and the cathode electrode, holes are injected from the transparent anode electrode and electrons are injected from the cathode electrode into the organic compound layer. Thereby, electrons and holes are recombined in the light emitting layer of the organic EL layer, and light is generated. Thus, the organic EL element emits light.

JP 2003-17245 A

In recent years, there has been a demand for an organic EL element having a large area and high brightness in order to expand the application of the organic EL device. As a countermeasure, for example, it is conceivable to apply a higher voltage between the transparent anode electrode and the cathode electrode to increase the applied current and improve the luminance of the organic EL element.
However, as the applied current increases, the voltage drop per unit area at each electrode increases. Therefore, in each electrode, the difference between the voltage at the feeding point and the voltage at a position away from the feeding point becomes large. As a result, there is a problem that uneven supply of holes and electrons to the organic EL layer occurs, resulting in large variations in luminance in the light emitting region of the organic EL element.

To cope with such a problem, it is conceivable to reduce the resistance per unit area of the electrode by increasing the thickness of the electrode. However, when the thickness of the electrode is increased, another problem such as a decrease in the flexibility of the organic EL element occurs. Further, when the thickness of the transparent anode electrode is increased, there is a problem that the light transmittance is lowered.
The objective of this invention is providing the organic EL apparatus which can suppress the variation in the brightness | luminance in the light emission area | region of an organic EL element, suppressing the fall of characteristics, such as flexibility of an organic EL element.

The invention of claim 1, wherein in order to achieve the above object, a first substrate, a rectangular shape in plan view a first electrode, the first electrode to the oppositely disposed rectangular in plan view of the second electrode, and the first An organic compound layer interposed between one electrode and the second electrode, the organic EL element provided on the first substrate, and the organic EL element provided on the first substrate and covering the organic EL element A conductive sealing layer for sealing the organic EL element, and a first terminal and a second terminal provided on the first substrate and connected to the first electrode and the second electrode, respectively . The first electrode is an electrode film having a sheet resistance larger than the resistance of the second electrode, and the shape of the peripheral portion of the first electrode exposed outside the outer periphery of the organic compound layer in a plan view is a U-shaped plan configuration in which the second terminal side is opened, the second electrode, prior to By outwardly extends from one side end which is not surrounded by the peripheral portion of the first electrode, the second terminal is formed, the conductive sealing layer is spaced in the thickness direction of the first substrate A conductive cap portion disposed opposite to the organic EL element and covering the organic EL element in plan view, and provided on the surface of the conductive cap portion on the first substrate side, corresponding to the second terminal And a conductive seal portion formed in a substantially square annular shape in plan view surrounding the periphery of the organic EL element except for the portion to be formed, and the conductive seal portion includes the first seal portion. In contact with the peripheral portion of the electrode in a line shape in a U shape in plan view, and electrically connected to the first terminal, the first substrate and the conductive sealing layer In the formed hollow portion for accommodating the organic EL element Insulator insulating layer is formed by being filled, an organic EL device.

According to this configuration, it can be used as an electrode for forming an electrical contact for the first electrodes, the conductive sealing layer for sealing the organic EL element by covering the organic EL element. Conductive sealing layer and is formed in a large area so as to cover the organic EL element can be connected with a large area for the first electrodes. Thus, Oite the first electrodes to the conductive sealing layer is connected, it is possible to the area of the equipotential portions increased.

As a result, without increasing the thickness of the first electrodes, it is possible to reduce the supply unevenness of electrons and holes to the organic compound layer. Therefore, it is possible to suppress variation in luminance in the light emitting region of the organic EL element while suppressing deterioration in characteristics such as flexibility of the organic EL element. Therefore, the organic EL element can be increased in area and brightness.

Moreover, since the organic EL element is sealed with the conductive sealing layer, it is possible to suppress the deterioration of the organic EL element due to oxygen, moisture, or the like.
In other words, the organic EL device (particularly an organic compound layer) oxygen or moisture inhibiting conductive sealing layer intrusion into, are also used for feeding to the first electrodes. Thereby, suppression of characteristic deterioration of the organic EL element and reduction of luminance unevenness are simultaneously achieved.

  As a measure for suppressing potential unevenness in the light emitting region of the first electrode and / or the second electrode, for example, an auxiliary wiring is provided along the outer periphery of the first electrode and the second electrode, and the auxiliary wiring is connected to the first electrode and the second electrode. It may be considered to contact the outer periphery of the electrode. However, such a measure requires a space for installing the auxiliary wiring outside the first electrode and the second electrode. For this reason, there arises a problem that the organic EL element becomes complicated and large. Further, it may be considered to increase the thickness of the auxiliary wiring in order to reduce the protruding amount of the auxiliary wiring to the outside of the electrode as much as possible while maintaining the resistance of the auxiliary wiring. However, when it does so, the flexibility of an organic EL element will fall.

In contrast, according to the organic EL device according to claim 1, using a conductive sealing layer for sealing the organic EL element, electrical contacts against the first electrodes are formed. In this case, space for forming the electrical contacts than the case of providing the auxiliary wiring to the outer periphery of the first electrodes, small. As a result, the organic EL element can be simplified and thinned.

The conductive sealing layer is connected to an electrode film (first electrode) having a sheet resistance larger than that of the second electrode. Therefore, the uneven supply of electrons or holes to the organic compound layer can be reduced more effectively.

In addition, since the conductive seal portion of the conductive sealing layer is in linear contact with the peripheral portion of the first electrode in a U shape in plan view , light is extracted to the central portion surrounded by the peripheral portion of the first electrode. Therefore, a sufficient area can be secured. Therefore, the conductive sealing layer can be brought into contact with the first electrode in a large area while suppressing a decrease in light extraction efficiency of the organic EL element. Furthermore, the intrusion of oxygen and moisture can be more effectively suppressed by sealing the linear connection portion ( conductive seal portion ) from the side surface of the organic EL element.

Note that a plurality of the conductive seal portions may be provided along the peripheral portion of the first electrode with a predetermined interval.
According to a second aspect of the present invention, the conductive sealing layer is provided at a portion corresponding to the second terminal, is insulated and separated from the first region, and is electrically connected to the second electrode. The organic EL device according to claim 1, wherein the organic EL device has a second region.
The invention according to claim 3 is the organic EL device according to claim 1 or 2, further comprising an insulating second substrate that supports the conductive sealing layer.

  In this configuration, since the first region and the second region are supported by the insulating second substrate, the two conductive regions connected to the first electrode and the second electrode are integrated into one second substrate. be able to. Therefore, the structure of the organic EL element can be simplified. Such a 1st area | region and a 2nd area | region can be easily formed, for example by patterning the electrically conductive film of an insulating board | substrate with a electrically conductive film (such as a polyimide board with a copper foil) beforehand.

The front Kishirubeden sealing layer includes a conductive layer facing the first substrate across the organic EL device, a conductive bump that is interposed between the peripheral edge portion of the first electrode and the conductive layer the may be including Ndei.
In this configuration, the conductive sealing layer has a conductive layer and a conductive bump. When electrically connecting the conductive sealing layer to the peripheral portion of the first electrode, first, a conductive bump is formed at a predetermined position on the peripheral portion of the first electrode, and then the conductive layer is brought into contact with the conductive bump. That's fine. That is, the contact position of the conductive sealing layer with respect to the peripheral portion of the first electrode is determined by the alignment of the conductive bump with respect to the peripheral portion of the first electrode. The conductive bump can be manufactured by a conventionally known bump forming technique such as a plating method or a transfer method. Therefore, the electrical contact of the conductive sealing layer with respect to the peripheral portion of the first electrode can be easily formed, and further, the contact position can be precisely controlled.

Moreover, the invention according to claim 4 is the conductive bump according to any one of claims 1 to 3 , wherein the conductive seal portion is a conductive bump including a core made of a resin material and a conductive coating film covering the core . The organic EL device according to one item .
In this configuration, since the entire conductive bump is not a conductive material and its core is a resin material, the amount of conductive material used can be reduced. As a result, cost can be reduced. Further, if the resin material is, for example, a thermosetting resin, it is difficult to soften even if the organic EL element generates heat, so that the bending resistance of the organic EL element can be improved.

Moreover, invention of Claim 5 is an organic EL apparatus as described in any one of Claims 1-4 which further contains the barrier layer which coat | covers at least one of the said electroconductive sealing layer and the said organic EL element. .
In this configuration, since at least one of the conductive sealing layer and the organic EL element is covered with the barrier layer, deterioration of the organic EL element due to oxygen, moisture, or the like can be further suppressed.

Moreover, invention of Claim 6 is an organic electroluminescent apparatus as described in any one of Claims 1-5 with which the said 1st board | substrate has flexibility.
In this configuration, since the first substrate has flexibility, it can be suitably used for various industrial products that require flexibility, for example. In the case where the organic EL device includes the second substrate, it is preferable that both the first substrate and the second substrate have flexibility.
According to a seventh aspect of the present invention, the first terminal is a pair of terminals disposed so as to sandwich the second terminal, and the pair of first terminals is a U-shaped peripheral portion in plan view. The organic EL device according to claim 1, which is disposed on an extension line of a pair of sides facing each other.
The invention according to claim 8 is the organic EL device according to claim 7 , wherein the conductive sealing layer is formed so as to expose end portions of the pair of first terminals and the second terminals. It is.
The invention according to claim 9 is that the first electrode is made of an electrode film made of a transparent electrode material,
The second electrode is made of the electrode film made of a metal material, an organic EL device according to any one of claims 1-8.
The invention according to claim 10 is the organic EL device according to claim 9 , wherein the first substrate is formed of a transparent substrate, and the first electrode is formed on an upper surface of the first substrate.
The invention according to claim 11 is the organic EL device according to any one of claims 1 to 10 , wherein the first electrode is an anode electrode and the second electrode is a cathode electrode.

FIG. 1 is a schematic plan view of an organic EL device according to the first embodiment of the present invention. 2A, 2B, and 2C are cross-sectional views of the organic EL device of FIG. 1, in which FIG. 2A is a cut surface taken along a cutting line IIa-IIa, and FIG. 2B is a cutting line IIb. FIG. 2C shows a cut surface taken along the cutting line IIc-IIc. 3A to 3E are views showing the method of manufacturing the organic EL device shown in FIGS. 1 and 2 in the order of steps. FIG. 4 is a schematic plan view of an organic EL device according to the second embodiment of the present invention. 5A, 5B, and 5C are cross-sectional views of the organic EL device of FIG. 4, in which FIG. 5A is a cut surface taken along the cutting line Va-Va, and FIG. 5B is a cutting line Vb. FIG. 5C shows a cut surface taken along the cutting line Vc-Vc. 6A to 6E are views showing the method of manufacturing the organic EL device shown in FIGS. 3 and 4 in the order of steps. FIG. 7 is a diagram illustrating a first modification of the organic EL device according to the first embodiment, and is a cross-sectional view corresponding to FIG. FIG. 8 is a view showing a second modification of the organic EL device of the first embodiment, and is a cross-sectional view corresponding to FIG. FIG. 9 is a view showing a third modification of the organic EL device of the first embodiment, and is a cross-sectional view corresponding to FIG. FIG. 10 is a view showing a fourth modification of the organic EL device of the first embodiment, and is a cross-sectional view corresponding to FIG. FIG. 11 is a diagram illustrating a first modification of the organic EL device according to the second embodiment, and is a cross-sectional view corresponding to FIG. FIG. 12 is a diagram illustrating a second modification of the organic EL device according to the second embodiment, and is a cross-sectional view corresponding to FIG. FIG. 13 is a view showing a third modification (top emission type) of the organic EL device of the second embodiment, and is a cross-sectional view corresponding to FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a schematic plan view of an organic EL device according to the first embodiment of the present invention. 2A, 2B, and 2C are cross-sectional views of the organic EL device of FIG. 1, in which FIG. 2A is a cut surface taken along a cutting line IIa-IIa, and FIG. 2B is a cutting line IIb. FIG. 2C shows a cut surface taken along the cutting line IIc-IIc.

The organic EL device 1 is used for, for example, an illumination device, a display backlight, and the like. The organic EL device 1 includes a first substrate 2. In this embodiment, the first substrate 2 is formed in a rectangular shape in plan view, and has a pair of short sides and a pair of long sides.
Hereinafter, for convenience, a direction (width direction) parallel to the short side of the first substrate 2 is defined as an X direction, and a direction parallel to the long side of the first substrate 2 (length direction) is defined as a Y direction. This embodiment will be described with the direction parallel to the thickness direction of the substrate 2 as the Z direction. Further, the Z direction may be referred to as the vertical direction with reference to the basic posture of the organic EL device 1 on which the first substrate 2 is disposed on the lower side.

  For example, a glass substrate, a plastic substrate, or a SUS substrate can be applied as the first substrate 2. When a transparent substrate such as a glass substrate or a plastic substrate is applied as the first substrate 2, the organic EL device 1 is configured as a bottom emission type that extracts light to the first substrate 2 side (lower side). On the other hand, when an opaque substrate such as a SUS substrate is applied as the first substrate 2, the organic EL device 1 is configured as a top emission type that extracts light to the opposite side (upper side) of the first substrate 2. Moreover, the thickness of the 1st board | substrate 2 is a value of the grade which the 1st board | substrate 2 has flexibility, for example, and is 0.01-1 mm specifically ,. Hereinafter, the present embodiment will be described on the assumption that the organic EL device 1 is a bottom emission type.

On the first substrate 2, an anode terminal 3 and a cathode terminal 4 are provided along one short side of the first substrate 2. An organic EL element 5 is provided on the first substrate 2 on the side opposite to the side where the terminals are arranged (terminal side) in the Y direction.
The organic EL device 1 includes a conductive sealing layer 6 for sealing the terminals 3 and 4 and the organic EL element 5, and a second substrate 7 for supporting the conductive sealing layer 6. Yes. FIG. 1 shows the organic EL device 1 with the second substrate 7 removed.

The organic EL element 5 includes an anode electrode 9 as a first electrode formed on the upper surface 8 (one surface) of the first substrate 2, a cathode electrode 10 as a second electrode disposed opposite to the anode electrode 9, and an anode An organic compound layer 11 interposed between the electrode 9 and the cathode electrode 10 is included.
As the anode electrode 9, for example, an electrode film made of a transparent electrode material such as ITO (solid solution of indium oxide and tin oxide), IZO (indium zinc oxide), ZnO (zinc oxide) can be applied. The film thickness of the anode electrode 9 is, for example, 0.1 to 1 μm. The resistance of such a transparent electrode film is, for example, a sheet resistance of about 3Ω / □. In addition, the anode electrode 9 is formed in a rectangular shape in plan view in this embodiment.

  The organic compound layer 11 extends in the Y direction terminal side along the upper surface of the anode electrode 9, and is formed in an L shape in cross section that wraps around one side surface in the length direction of the anode electrode 9. The planar shape of the organic compound layer 11 is a rectangle that is smaller in length and width than the anode electrode 9 in this embodiment. Between the outer periphery of the organic compound layer 11 and the outer periphery of the anode electrode 9, a first gap 12 having a U-shape in a plan view with the Y-direction terminal side opened is provided. In the first gap 12, the peripheral edge portion 13 of the anode electrode 9 is exposed in a U shape in a plan view.

The organic compound layer 11 has a structure in which, for example, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are stacked in this order from the anode electrode 9 side in the Z direction. .
Examples of the material for the hole injection layer include those usually used as the material for the hole injection layer, such as arylamines and phthalocyanines (for example, copper phthalocyanine).

Examples of the material for the hole transport layer include those usually used as the material for the hole transport layer, such as arylamines.
The light emitting layer is configured by, for example, doping a metal complex material showing fluorescence such as Alq ₃ with a fluorescent dye. For example, as a material of the red light emitting layer, Alq ₃ is doped with DCM, for example, as a material of the green light emitting layer, Alq ₃ is doped with Coumarin, for example, a material of the blue light emitting layer. For example, Alq ₃ doped with Perylene (perylene) may be used.

Examples of the material for the electron transport layer include those usually used as the material for the electron transport layer, such as aluminum complexes, oxadiazoles, triazoles, and phenanthrolines.
Examples of the material for the electron injection layer include those commonly used as materials for the electron injection layer, such as alkali metals such as lithium, lithium fluoride, lithium oxide, and lithium complexes.

Note that the hole injection layer and the electron injection layer may be omitted.
As the cathode electrode 10, for example, an electrode film made of a metal material such as Al (aluminum), Ca (calcium), Mg—Al (magnesium-aluminum alloy), Al—Li (aluminum-lithium) alloy can be applied. The film thickness of the cathode electrode 10 is, for example, 0.01 to 0.5 μm. The resistance of such a metal electrode film is generally lower than that of the transparent electrode film described above. For example, the sheet resistance is about 1 Ω / □.

  The cathode electrode 10 extends in the Y direction terminal side along the upper surface of the organic compound layer 11, and is formed in an L shape in sectional view that wraps around one side surface in the length direction of the organic compound layer 11. The planar shape of the cathode electrode 10 is a rectangle having a width smaller than that of the organic compound layer 11 in this embodiment. A cathode terminal 4 is integrally connected to a portion of the cathode electrode 10 that wraps around the organic compound layer 11.

In addition, a second gap 14 having a U-shape in plan view with the Y-direction terminal opened is provided between the outer periphery of the cathode electrode 10 and the outer periphery of the organic compound layer 11. In the second gap 14, the peripheral edge 15 of the organic compound layer 11 is exposed in a U shape in plan view.
The anode terminal 3 is made of the same material as the cathode electrode 10, for example. In this embodiment, the anode terminal 3 is separated from the anode electrode 9 and is formed in a square shape in plan view. The anode terminal 3 is disposed on each of a pair of extension lines of a peripheral portion 13 having a U-shape in plan view with the Y-direction terminal side open. Therefore, a pair of anode terminals 3 and cathode terminals 4 are arranged on the upper surface 8 of the first substrate 2 in a straight line in the X direction at a distance from each other.

In the organic EL element 5 having such a structure, a region surrounded by an alternate long and short dash line in which the anode electrode 9, the organic compound layer 11 and the cathode electrode 10 overlap in a plan view emits light by recombination of electrons and holes (light emission). Region 16).
As the second substrate 7, for example, an insulating substrate such as a polyimide substrate, a glass substrate, or a plastic substrate can be applied. Moreover, the thickness of the 2nd board | substrate 7 is a value of the grade which the 2nd board | substrate 7 has flexibility, for example, and is 0.01-1 mm specifically ,.

The conductive sealing layer 6 includes a cap portion 17 disposed opposite to the organic EL element 5 with a gap in the Z direction, and a seal portion for sealing the organic EL element 5 between the cap portion 17 and the first substrate 2. 18 integrally. The conductive sealing layer 6 is made of, for example, a metal material such as copper (Cu) or aluminum (Al).
The cap portion 17 is formed in a thin film shape over almost the entire inner surface 19 (the surface facing the first substrate 2) of the second substrate 7 so that the ends of the anode terminal 3 and the cathode terminal 4 are exposed. The whole area of the organic EL element 5 is opposed to the anode terminal 3 and the cathode terminal 4. Moreover, the thickness of the cap part 17 is 0.1-50 micrometers, for example.

  The seal portion 18 is formed in a substantially square annular shape in a plan view surrounding the periphery of the organic EL element 5, contacts the U-shaped peripheral portion 13 exposed from the first gap 12 linearly, and A pair of anode terminals 3 disposed on an extension of the gap 12 and a cathode terminal 4 disposed between the pair of anode terminals 3 are in contact with each other. The thickness of the seal portion 18 is, for example, 1 to 200 μm.

  In the conductive sealing layer 6 as described above, a removed region 27 from which a part thereof is removed is formed in the vicinity of the cathode terminal 4. As a result, the conductive sealing layer 6 has the anode region 20 as the first region electrically connected to the peripheral portion 13 of the anode electrode 9 and the anode terminal 3, and the second electrically connected to the cathode terminal 4. It is insulated and separated from the cathode region 21 as a region. Each of the cap part 17 and the seal part 18 includes a first cap part 22 on the anode region 20 side and a first seal part 23 as a linear connection part, and a second cap part 24 and a second seal part 25 on the cathode region 21 side. And separated.

In this embodiment, the cathode region 21 has a rectangular shape in plan view. The removal region 27 surrounding the cathode region 21 is formed in a U shape in plan view, and is open to the Y direction terminal side.
The organic EL element 5 is accommodated in a hollow portion 26 formed by the first substrate 2 and the conductive sealing layer 6, and the entire periphery thereof is surrounded by the seal portion 18. The hollow portion 26 can be circulated to the outside only through the removal region 27.

An insulating layer 28 is formed in the hollow portion 26 by being filled with an insulator. Examples of the material of the insulating layer 28 include materials usually used as a sealing resin such as an epoxy resin.
3A to 3E are views showing a method of manufacturing the organic EL device shown in FIGS. 1 and 2 in the order of steps.

  In order to manufacture the organic EL device 1, for example, as shown in FIG. 3A, the anode electrode 9, the organic compound layer 11, and the cathode electrode 10 are formed on the first substrate 2 by vapor deposition, sputtering, or the like. And the cathode terminal 4 is formed in order so that it may become an above-described shape. The cathode terminal 4 and the anode terminal 3 are formed by patterning simultaneously in the step of forming the cathode electrode 10.

  On the other hand, as shown in FIG. 3B, a second substrate 7 on which a conductive thin film (for example, the same thickness as the seal portion 18) is prepared, and the conductive thin film is patterned, Separated into an anode region 20 and a cathode region 21. After patterning the conductive thin film, the conductive thin film in each region is etched back into a predetermined pattern, whereby the seal portion 18 (the first seal portion 23 and the second seal portion 25) is formed.

  Then, as shown in FIG. 3C, the first substrate 2 and the second substrate 7 are aligned, and the peripheral portion 13 of the anode electrode 9 exposed from the first gap 12, the anode terminal 3, and the cathode terminal 4 On the other hand, the seal part 18 is joined. Thereby, as shown in FIG. 3D, the organic EL element 5 is sealed in the hollow portion 26 formed by the first substrate 2 and the conductive sealing layer 6.

Thereafter, as shown in FIG. 3 (e), a sealing resin is injected into the outer periphery of the hollow portion 26 and the seal portion 18. Specifically, resin is injected into the hollow portion 26 from between the first seal portion 23 and the second seal portion 25 (gap), and resin is injected from the end face of the organic EL device 1 to the outer periphery of the seal portion 18. . Thereby, the insulating layer 28 is formed.
Through the above steps, the organic EL device 1 shown in FIGS. 1 and 2 is obtained.

  In the organic EL device 1, by applying a voltage between the anode terminal 3 and the cathode terminal 4, the anode region 20 and the cathode region 21 of the conductive sealing layer 6 are respectively applied to the anode electrode 9 and the cathode electrode 10. A voltage is applied via Specifically, a voltage is applied to the anode electrode 9 by the first seal portion 23 in the anode region 20 joined to the U-shaped peripheral edge portion 13.

By applying a voltage, holes are injected from the anode electrode 9 and electrons are injected from the cathode electrode 10 into the organic compound layer 11, whereby the electrons and holes are recombined in the light emitting layer of the organic compound layer 11. , Light is generated. The generated light is extracted to the first substrate 2 side.
According to the organic EL device 1, as an electrode for forming an electrical contact with the anode electrode 9, the cap portion 17 facing the entire area of the organic EL element 5 and the seal portion surrounding the periphery of the organic EL element 5. 18 can be used. And the 1st seal | sticker part 23 is contacting linearly with the peripheral part 13 of the anode electrode 9 exposed in planar view U-shape. Therefore, the conductive sealing layer 6 can be connected to the anode electrode 9 with a large area. Thereby, the area of the equipotential portion of the anode electrode 9 to which the conductive sealing layer 6 is connected can be increased, and the light emitting region 16 of the organic EL element 5 can be formed on the equipotential surface having a U-shape in plan view. Can be surrounded.

  As a result, since the entire peripheral edge portion 13 of the anode electrode 9 becomes equipotential when a voltage is applied, potential unevenness in the light emitting region 16 of the anode electrode 9 can be suppressed. Therefore, it is possible to reduce the uneven supply of holes to the organic compound layer 11 without increasing the thickness of the anode electrode 9. In addition, since the first seal portion 23 is connected to the anode electrode 9 having a sheet resistance larger than that of the cathode electrode 10, it is possible to more effectively reduce the uneven supply of holes to the organic compound layer 11. it can.

Therefore, variation in luminance within the surface of the organic EL element 5 can be suppressed while suppressing a decrease in characteristics such as flexibility of the organic EL element 5. Therefore, the organic EL element 5 can be increased in area and brightness.
Further, since the first seal portion 23 is linearly contacted along the peripheral edge portion 13 of the anode electrode 9, a sufficient area of the central portion (that is, the light emitting region 16) surrounded by the peripheral edge portion 13 of the anode electrode 9 is ensured. be able to. Therefore, it is possible to suppress a decrease in light extraction efficiency of the organic EL element 5.

  In addition, since the organic EL element 5 is accommodated in the hollow portion 26 formed by the first substrate 2 and the conductive sealing layer 6, and the entire periphery thereof is surrounded by the seal portion 18, oxygen, moisture, etc. Intrusion into the hollow portion 26 can be blocked. As a result, deterioration of the organic EL element 5 can be suppressed. In other words, the conductive sealing layer 6 that suppresses the intrusion of oxygen or moisture into the organic EL element 5 (particularly, the organic compound layer 11) is also used for supplying power to the anode electrode 9. Thereby, suppression of the characteristic deterioration of the organic EL element 5 and reduction of luminance unevenness are simultaneously achieved.

  On the other hand, in the organic EL device 1 configured as described above, as a measure for suppressing potential unevenness in the light emitting region 16 of the anode electrode 9, for example, an auxiliary wiring is provided along the outer periphery of the anode electrode 9. It is conceivable to contact the outer peripheral edge of the anode electrode 9. However, such a measure requires a space for installing the auxiliary wiring outside the anode electrode 9. For this reason, the organic EL element 5 becomes complicated and large. Further, it may be considered to increase the thickness of the auxiliary wiring in order to reduce the protruding amount of the auxiliary wiring to the outside of the anode electrode 9 as much as possible while maintaining the resistance of the auxiliary wiring. However, if it does so, the flexibility of the organic EL element 5 will fall.

  On the other hand, according to the organic EL device 1 described above, an electrical contact with the anode electrode 9 is formed using the conductive sealing layer 6 for sealing the organic EL element 5. In this case, the space for forming the electrical contact may be smaller than when the auxiliary wiring is provided on the outer periphery of the anode electrode 9. As a result, the organic EL element 5 can be simplified and thinned.

  In addition, since the anode region 20 and the cathode region 21 of the conductive sealing layer 6 are supported by the insulating second substrate 7, two conductive regions connected to the anode electrode 9 and the cathode electrode 10 are provided as one It can be concentrated on the second substrate 7. Therefore, the structure of the organic EL element 5 can be simplified. Further, as shown in FIG. 3B, the anode region 20 and the cathode region 21 can be easily formed by preparing the second substrate 7 on which the conductive thin film is formed and patterning the conductive thin film. .

Furthermore, in this organic EL device 1, since both the first substrate 2 and the second substrate 7 have flexibility, they can be suitably used for various industrial products that require flexibility, for example.
FIG. 4 is a schematic plan view of an organic EL device according to the second embodiment of the present invention. 5A, 5B, and 5C are cross-sectional views of the organic EL device of FIG. 4, in which FIG. 5A is a cut surface taken along the cutting line Va-Va, and FIG. 5B is a cutting line Vb. FIG. 5C shows a cut surface taken along the cutting line Vc-Vc. 4 and FIG. 5, the same reference numerals are assigned to the portions corresponding to the respective portions shown in FIG. 1 and FIG. Further, in the following, detailed description of the parts denoted by the same reference numerals is omitted. FIG. 4 shows the organic EL device with the conductive substrate removed.

  In the first embodiment, the conductive sealing layer 6 integrally includes the cap portion 17 and the seal portion 18. However, in the organic EL device 31 of the second embodiment, the conductive sealing layer 32 is: In order to seal the organic EL element 5 between the conductive substrate 33 and the first substrate 2 as a conductive layer disposed opposite to the organic EL element 5 with an interval in the thickness direction of the first substrate 2. The conductive bumps 34 are separately provided. 4 shows the organic EL device 31 with the conductive substrate 33 removed.

The conductive substrate 33 is made of a metal material such as copper (Cu), aluminum (Al), tin (Sn), or the like. The conductive substrate 33 faces the entire area of the organic EL element 5, the anode terminal 3, and the cathode terminal 4 so that the ends of the anode terminal 3 and the cathode terminal 4 are exposed. Moreover, the thickness of the conductive substrate 33 is, for example, 0.01 to 1 mm.
The conductive bumps 34 are made of, for example, a metal material such as copper (Cu), aluminum (Al), gold (Au), or solder. In addition, the conductive bump 34 is formed in a substantially square annular shape in plan view surrounding the periphery of the organic EL element 5, and is in linear contact with the U-shaped peripheral edge portion 13 exposed from the first gap 12. A pair of anode terminals 3 disposed on an extension line of the first gap 12 are in contact with each other. The conductive bump 34 is eutectic bonded to the peripheral portion 13 of the conductive substrate 33 and the anode electrode 9, thereby electrically connecting the anode electrode 9 and the anode terminal 3 via the conductive substrate 33. Yes.

On the other hand, the conductive bump 34 is partially opened between the pair of anode terminals 3 sandwiching the cathode terminal 4. Thereby, the conductive bump 34 is not in contact with the cathode terminal 4 and electrically insulates the conductive substrate 33 and the cathode terminal 4. Moreover, the height of the conductive bump 34 is, for example, 1 to 200 μm.
The organic EL element 5 is accommodated in a hollow portion 35 formed by the first substrate 2 and the conductive substrate 33, and the entire periphery thereof is surrounded by the conductive bumps 34. The hollow portion 35 can be circulated to the outside only through the opening 36 formed by partially opening the conductive bump 34.

Other configurations are the same as those of the first embodiment described above, and the operations are also the same.
6A to 6E are views showing the method of manufacturing the organic EL device shown in FIGS. 4 and 5 in the order of steps.
In order to manufacture the organic EL device 31, for example, as shown in FIG. 6A, the anode electrode 9 is formed on the first substrate 2 by the vapor deposition method, the sputtering method, or the like so as to have the shape described above. It is formed.

Next, as shown in FIG. 6B, the conductive bumps 34 are formed to have the above-described shape by, for example, a plating method or a transfer method.
Next, as shown in FIG. 6C, the organic compound layer 11, the cathode electrode 10, and the cathode terminal 4 are sequentially formed on the anode electrode 9 by the vapor deposition method, the sputtering method, or the like so as to have the above-described shape. The The cathode terminal 4 and the anode terminal 3 are formed by patterning simultaneously with the patterning of the cathode electrode 10 in the step of forming the cathode electrode 10.

Next, as shown in FIG. 6D, the first substrate 2 and the conductive substrate 33 are aligned, and heat and pressure are applied, so that the conductive substrate 33 is eutectic bonded to the conductive bumps 34. As a result, the organic EL element 5 is sealed in the hollow portion 35 formed by the first substrate 2 and the conductive substrate 33.
Thereafter, as shown in FIG. 6E, a sealing resin is injected from the opening 36 (not shown in FIG. 6) to form the insulating layer 28.

Through the above steps, the organic EL device 31 shown in FIGS. 4 and 5 is obtained.
According to the organic EL device 31, the conductive sealing layer 32 has the conductive substrate 33 and the conductive bumps 34. Then, when electrically connecting the conductive sealing layer 6 to the anode electrode 9, conductive bumps 34 are formed as shown in FIG. 6B, and then, as shown in FIG. The conductive substrate 33 may be eutectic bonded to the conductive bumps 34 by aligning the substrate 1 and the conductive substrate 33 and applying heat and pressure.

  That is, the contact position of the conductive sealing layer 32 with respect to the anode electrode 9 is determined by the formation of the conductive bump 34 with respect to the anode electrode 9. The conductive bumps 34 can be produced by a conventionally known bump forming technique such as a plating method or a transfer method. Therefore, the electrical contact of the conductive sealing layer 32 to the anode electrode 9 can be easily formed, and further, the contact position can be precisely controlled.

In addition, description is abbreviate | omitted about the effect similar to the above-mentioned 1st Embodiment.
FIG. 7 is a diagram illustrating a first modification of the organic EL device according to the first embodiment, and is a cross-sectional view corresponding to FIG.
In the organic EL device 41 according to the first modification of the first embodiment, the conductive sealing layer 6 is not supported by the second substrate 7 and is disposed to face the organic EL element 5 with an interval in the Z direction. A cap portion 17 with an outer surface 42 opposite to the inner surface 43 facing the organic EL element 5 exposed, and a seal portion 18 for sealing the organic EL element 5 between the cap portion 17 and the first substrate 2. Are integrated.

Moreover, as a material of the insulating layer 28, what is normally used as insulating films, such as silicon nitride and a silicon oxide, is mentioned, for example.
In order to manufacture the organic EL device 41 according to the first modification, for example, the anode electrode 9, the organic compound layer 11, the cathode electrode 10, and the cathode terminal are manufactured by the same method as that shown in FIG. 4 and the anode terminal 3 are formed, and then the insulating layer 28 is formed prior to the formation of the conductive sealing layer 6 by, for example, vapor deposition or sputtering. After the formation of the insulating layer 28, the insulating layer 28 is patterned into a pattern corresponding to the shape of the seal portion 18, for example, by photolithography. Then, the material for the conductive sealing layer 6 is deposited by, for example, vapor deposition or sputtering. Thereby, the seal part 18 and the cap part 17 are formed simultaneously, and the conductive sealing layer 6 is formed.

According to the organic EL device 41 according to the first modification of the first embodiment, the outer surface 42 of the cap portion 17 is exposed without the conductive sealing layer 6 being supported by the second substrate 7. Even if the organic EL element 5 generates heat, the heat can be efficiently dissipated from the outer surface 42 of the cap portion 17. As a result, the heat dissipation of the organic EL device 41 can be improved.
FIG. 8 is a view showing a second modification of the organic EL device of the first embodiment, and is a cross-sectional view corresponding to FIG.

The organic EL device 51 according to the second modification of the first embodiment further includes a first barrier layer 52 that covers the organic EL element 5.
The first barrier layer 52 is made of an inorganic material film such as silicon nitride, for example. The first barrier layer 52 covers the entire surface of the cathode electrode 10 from the peripheral portion 13 of the anode electrode 9 through the peripheral portion 15 of the organic compound layer 11. As a result, the interface 53 between the anode electrode 9 and the organic compound layer 11 and the interface 54 between the cathode electrode 10 and the organic compound layer 11 are sealed by the first barrier layer 52.

The first barrier layer 52 is formed after the anode electrode 9, the organic compound layer 11, the cathode electrode 10, the cathode terminal 4, and the anode terminal 3 are formed by the method shown in FIG. Thus, it can be formed by depositing and patterning an inorganic material.
According to the organic EL device 51 according to the second modification of the first embodiment, the interface 53 between the anode electrode 9 and the organic compound layer 11 and the interface 54 between the cathode electrode 10 and the organic compound layer 11 are the first barrier layer. Thus, even if residual moisture or oxygen is present in the hollow portion 26, contact between the residual moisture and oxygen and the organic compound layer 11 can be effectively suppressed. As a result, deterioration of the organic EL element 5 due to oxygen, moisture, or the like can be further suppressed.

FIG. 9 is a view showing a third modification of the organic EL device of the first embodiment, and is a cross-sectional view corresponding to FIG.
The organic EL device 61 according to the third modification of the first embodiment further includes a second barrier layer 62 that covers the conductive sealing layer 6.
The second barrier layer 62 is made of an inorganic material film such as silicon nitride, for example. The second barrier layer 62 covers the entire area of the inner side surface 43 of the cap portion 17 and fills the removal region 27 without any gaps.

After the conductive thin film (not shown) is etched back and the seal portion 18 is formed as shown in FIG. 3B, the second barrier layer 62 conducts an inorganic material by, for example, vapor deposition or sputtering. It can be formed by depositing on the sealing layer 6 and patterning.
According to the organic EL device 61 according to the third modification of the first embodiment, since the inner side surface 43 and the removal region 27 of the cap part 17 are sealed by the second barrier layer 62, in particular, from the removal region 27 to the hollow portion. Intrusion of moisture, oxygen, and the like into H.26 can be effectively suppressed. As a result, deterioration of the organic EL element 5 due to oxygen, moisture, or the like can be further suppressed.

FIG. 10 is a view showing a fourth modification of the organic EL device of the first embodiment, and is a cross-sectional view corresponding to FIG.
The organic EL device 71 according to the fourth modification of the first embodiment further includes a third barrier layer 72 that covers the conductive sealing layer 6.
The third barrier layer 72 is made of an inorganic material film such as silicon nitride, for example. The third barrier layer 72 is interposed in the entire area between the second substrate 7 and the cap part 17.

The third barrier layer 72 is laminated on the surface of the second substrate 7 by, for example, vapor deposition or sputtering, and then a conductive thin film (not shown) is formed on the third barrier layer 72, thereby It can be interposed between the two substrates 7 and the cap portion 17 (conductive thin film).
According to the organic EL device 71 according to the fourth modification of the first embodiment, since the cap portion 17 and the removal region 27 are sealed not only by the second substrate 7 but also by the third barrier layer 72, Intrusion of moisture, oxygen, and the like from the removal region 27 into the hollow portion 26 can be effectively suppressed. As a result, deterioration of the organic EL element 5 due to oxygen, moisture, or the like can be further suppressed.

FIG. 11 is a diagram illustrating a first modification of the organic EL device according to the second embodiment, and is a cross-sectional view corresponding to FIG.
In the organic EL device 81 according to the first modification of the second embodiment, the conductive bump 34 includes a resin core 82 and a conductive coating film 83 that covers the resin core 82.
Examples of the material of the resin core 82 include an epoxy resin and a polyurethane resin. The height of the resin core 82 is, for example, 1 to 200 μm.

Examples of the material of the conductive coating film 83 include metals such as gold (Au). Moreover, the thickness of the conductive coating film 83 is, for example, 0.01 to 1 μm.
Such a conductive bump 34 is formed after the anode electrode 9 is formed on the first substrate 2 as shown in FIG. 6A, for example, a resin paste is formed in the pattern of the conductive bump 34, and then vapor deposition is performed. It can be formed by depositing and patterning a metal material by a method, a sputtering method or the like.

  According to the organic EL device 81 according to the first modification of the second embodiment, since the entire conductive bump 34 is not a metal material and its core is a resin material, the amount of the metal material used can be reduced. . As a result, cost can be reduced. Further, if the resin material is, for example, a thermosetting resin, it is difficult to soften even if the organic EL element 5 generates heat, so that the bending resistance of the organic EL element 5 can be improved.

Further, by using a resin having a low Young's modulus as the material of the resin core 82, the stress generated when the organic EL element 5 is bent can be efficiently dispersed.
FIG. 12 is a diagram illustrating a second modification of the organic EL device according to the second embodiment, and is a cross-sectional view corresponding to FIG.
The organic EL device 91 according to the second modification of the second embodiment further includes an adhesion layer 92 interposed between the conductive bump 34 and the anode electrode 9.

The adhesion layer 92 is made of a metal material such as gold (Au), for example. The adhesion layer 92 is formed in, for example, an L-shape in a cross-sectional view that extends outward from the surface of the peripheral edge 13 of the anode electrode 9 and wraps around the entire side surface of the anode electrode 9. The whole area is covered.
The conductive bump 34 is bonded to a portion on the peripheral edge portion 13 of the anode electrode 9 in the adhesion layer 92.

  Such an adhesion layer 92 is patterned by depositing a metal material by, for example, vapor deposition or sputtering after the anode electrode 9 is formed on the first substrate 2 as shown in FIG. 6A. Thus, it can be formed. Then, the conductive bumps 34 may be formed on the adhesion layer 92 so as to have a predetermined shape by a method similar to the method shown in FIG.

  According to the organic EL device 91 according to the second modification of the second embodiment, the adhesion layer 92 is interposed between the conductive bump 34 and the anode electrode 9. Therefore, if the anode electrode 9 and the adhesion layer 92 are a combination with good bonding properties (for example, a combination in which the anode electrode 9 is ITO and the adhesion layer 92 is Au), the conductive bump 34 and the anode electrode 9 Bondability can be improved. Therefore, the sealing performance by the conductive bumps 34 can be improved.

In addition, since the entire area of the outer peripheral edge of the anode electrode 9 is covered with the adhesion layer 92, contact between the side surface of the anode electrode 9 and moisture can be suppressed. Therefore, even when a material that is relatively permeable to moisture is applied as the material of the anode electrode 9, contact between the anode electrode 9 and moisture is suppressed, so that moisture entering the anode electrode 9 can be reduced.
As mentioned above, although embodiment of this invention was described, this invention can also be implemented with another form.

For example, in the first embodiment, the conductive sealing layer 6 is electrically connected to both the anode electrode 9 and the cathode electrode 10, but may be connected to only one of them. On the other hand, in the second embodiment, the conductive sealing layers 6 and 32 are electrically connected only to the anode electrode 9, but may be connected to both the anode electrode 9 and the cathode electrode 10.
Further, the present invention can be applied to both a top emission type and a bottom emission type organic EL device.

  For example, the organic EL device 101 shown in FIG. 13 is a top emission type. The organic EL device 101 includes an opaque first substrate 2 such as a SUS substrate, an insulating layer 102 formed over the entire upper surface 8 of the first substrate 2, an anode electrode 9, an organic layer stacked on the insulating layer 102 in order. A compound layer 11 and a cathode electrode 10 are provided. The material of the anode electrode 9 is not particularly limited, and may be either a transparent electrode material or an opaque electrode material. The material of the cathode electrode 10 is a transparent electrode material such as ITO. Transparent materials are also used for the insulating layer 28 (such as epoxy resin), the conductive sealing layer 6 (such as ITO), the third barrier layer 72 (such as SiN), and the second substrate 2. Therefore, the light generated in the organic compound layer 11 passes through the transparent cathode electrode 10, the insulating layer 28, the conductive sealing layer 32, and the third barrier layer 72 and is extracted from the second substrate 7.

Further, it is not necessary to form one contact of the conductive sealing layers 6 and 32 with the anode electrode 9 along the entire circumference of the peripheral edge portion 13 of the anode electrode 9, for example, along the peripheral edge portion 13 of the anode electrode 9. A plurality of linear connection portions that are in linear contact with each other may be formed at predetermined intervals along the circumferential direction of the anode electrode 9.
In addition, various design changes can be made within the scope of the matters described in the claims.

DESCRIPTION OF SYMBOLS 1 Organic EL apparatus 2 1st board | substrate 5 Organic EL element 6 Conductive sealing layer 7 2nd board | substrate 9 Anode electrode 10 Cathode electrode 11 Organic compound layer 13 Peripheral part (of anode electrode) 20 Anode area | region 21 Cathode area | region 23 1st seal | sticker part 31 Organic EL Device 32 Conductive Sealing Layer 33 Conductive Substrate 34 Conductive Bump 41 Organic EL Device 51 Organic EL Device 52 First Barrier Layer 61 Organic EL Device 62 Second Barrier Layer 71 Organic EL Device 72 Third Barrier Layer 81 Organic EL Device 82 Resin core 83 Conductive coating 91 Organic EL device

Claims (11)

A first substrate;
A first electrode having a rectangular shape in plan view , a second electrode having a rectangular shape in plan view arranged opposite to the first electrode, and an organic compound layer interposed between the first electrode and the second electrode An organic EL device provided on the first substrate;
A conductive sealing layer provided on the first substrate and sealing the organic EL element by covering the organic EL element ;
A first terminal and a second terminal provided on the first substrate and connected to the first electrode and the second electrode, respectively ;
The first electrode is an electrode film having a sheet resistance larger than the resistance of the second electrode, and the shape of the peripheral portion of the first electrode exposed outside the outer periphery of the organic compound layer in a plan view is The second terminal side is an open U shape in plan view ,
The second electrode is pulled out from one side not surrounded by the peripheral edge of the first electrode , whereby the second terminal is formed ,
The conductive sealing layer is disposed to face the organic EL element with a space in the thickness direction of the first substrate, and covers the organic EL element in plan view, and the conductive cap A conductive seal portion provided on the surface of the first substrate side of the portion and formed in a substantially square annular shape in plan view surrounding the periphery of the organic EL element except for a portion corresponding to the second terminal A first region formed,
The conductive seal portion is electrically connected in contact with the peripheral edge portion of the first electrode in a line shape in a U shape in plan view, and is electrically connected in contact with the first terminal.
An organic EL device, wherein an insulating layer is formed by filling an insulating material in a hollow portion that is formed by the first substrate and the conductive sealing layer and that accommodates the organic EL element . The conductive sealing layer is provided in a portion corresponding to the second terminal, and has a second region electrically isolated from the first region and electrically connected to the second electrode. Item 2. The organic EL device according to Item 1.   The organic EL device according to claim 1, further comprising an insulating second substrate that supports the conductive sealing layer. The conductive seal portion includes a core made of a resin material, a conductive bump formed of a conductive coating film covering the core, the organic EL device according to any one of claims 1 to 3. At least one further comprising a barrier layer covering the organic EL device according to any one of claims 1-4 of the electrically Denfu sealing layer and the organic EL element. Wherein the first substrate has flexibility, the organic EL device according to any one of claims 1-5.   The first terminals are a pair of terminals arranged so as to sandwich the second terminal, and the pair of first terminals is an extension line of a pair of opposite sides of the peripheral portion in a U shape in plan view. The organic EL device according to claim 1, wherein the organic EL device is disposed on the substrate. The organic EL device according to claim 7 , wherein the conductive sealing layer is formed so as to expose end portions of the pair of first terminals and the second terminals. The first electrode is made of an electrode film made of a transparent electrode material,
Wherein the second electrode consists of an electrode film made of a metal material, an organic EL device according to any one of claims 1-8. The first substrate comprises a transparent substrate;
The organic EL device according to claim 9 , wherein the first electrode is formed on an upper surface of the first substrate. The first electrode is an anode electrode;
The second electrode is a cathode electrode, the organic EL device according to any one of claims 1-10.

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