JP5725993B2 - Surface treatment equipment - Google Patents

Description

  The present invention relates to a surface treatment apparatus and a surface treatment method, and more particularly, to a surface treatment apparatus and a surface for treating a surface of an object to be processed by irradiating an object to be processed disposed outside a discharge region with active particles generated by discharge. It relates to the processing method.

  A technique for generating plasma by electric discharge and using it for the surface treatment process has been widely introduced. For example, improvement in adhesion of engineering plastics and resin coatings, pre-cleaning of metal bonding surfaces, and large area devices such as FPDs. It is applied to cleaning. However, in order to apply plasma processing, it is necessary to suppress damage due to discharge on the surface due to charge-up of the object to be processed and to suppress damage to the surface structure due to particles with excessively high energy such as ions. is there. In addition, process simplification and high throughput are also required. As a technique for solving these demands, plasma processing by in-line processing using neutral radicals by atmospheric pressure remote plasma has attracted attention.

  While atmospheric pressure remote plasma solves the above-mentioned problems, active radicals that are responsible for surface reactions are under high pressure at atmospheric pressure, particularly in atmospheric pressure remote plasma in an air atmosphere containing about 20% oxygen. The problem is that the processing efficiency cannot be increased due to the disadvantage of being deactivated in a very short time due to the collision. In addition, in order not to inactivate radicals and increase discharge efficiency, there is a problem in that rare gases are consumed as atmospheric gas and discharge gas, and special equipment and additional costs are required to procure these gases. It has become.

  For example, Patent Document 1 discloses a surface treatment apparatus using an integrated electrode that discharges in a hole opened in an insulating base material by a laminated dielectric and a metal printed electrode. Hereinafter, Patent Document 1 will be described with reference to FIG. As shown in FIG. 15, a plurality of through holes 2 are formed in the insulating base material 1, and discharge is generated in the through holes 2 between the discharge electrode pairs 3 and 4 connected to the power source 6. At this time, the discharge gas G is supplied from the upper part of the through hole 2, and the discharge gas G passes through the discharge region in the through hole 2 to become a gas containing active radicals, and is placed downstream of the gas. Processing of the workpiece 5 is realized.

  According to Patent Document 1, a plurality of through-holes 2 are distributed on a planar insulating base material 1 so that the processing range can be increased and uniform processing can be performed with a small gas consumption (low running cost). It can be performed. Further, by arranging the electrode 3 on the gas outlet 2b side of the through hole 2 and forming it as a ground electrode, an increase in potential difference between the electrode 3 and the object to be processed 5 is suppressed, thereby The irradiation of charged particles can be suppressed, and the object to be processed 5 can be avoided from damage from charging.

  Patent Document 2 discloses a remote plasma irradiation apparatus having segmented high-voltage electrodes. Hereinafter, Patent Document 2 will be described with reference to FIG. In Patent Document 2, a voltage is applied between the high-voltage electrode 115 provided facing the hollow dielectric sleeve 155 having the hole 160 and the ground electrode 150, thereby generating a discharge plasma near atmospheric pressure. generate. The high voltage electrode 115 is provided with a capillary 120, which is a hollow passage, to circulate gas. On the ground electrode 150 side, a number of gas ejection portions 160 provided in the dielectric sleeve 155 are provided in alignment with the center of the capillary 120, and are generated by discharge plasma through the holes 160. By irradiating the substrate to be treated with the reacted gas, cleaning and reforming are performed. Further, Patent Document 2 includes an example in which the capillary of the high-voltage electrode 715 shown in FIG. 17 is integrated with the ground-side dielectric sleeve, and the flow path is limited for each high-voltage electrode.

  According to Patent Document 2, remote plasma can be realized by the above structure, and plasma and charged particles can be irradiated close to the object to be processed regardless of the height of the object to be processed.

Japanese Patent Laying-Open No. 2005-123159 (FIG. 1) Japanese translation of PCT publication No. 2004-535041 (FIGS. 1, 2, 8)

  However, the prior art has the following problems. That is, in the surface treatment apparatus described in Patent Document 1, plasma is generated by creeping discharge in a limited hole, so that the discharge power is limited to a low level and the density of active particles cannot be increased. Further, since the exposed thin ground electrode or the structure having a dielectric coating covering the exposed thin ground electrode is provided, the trapping ability of charged particles passing therethrough is low, and the outflow of charged particles to a downstream target object may occur. Therefore, although the electrode 3 that is a ground electrode is introduced, the through-hole length is extended, and among the active particles that are responsible for the surface treatment, particles having a short life pass through the extended through-hole length. There is a possibility that the processing time cannot be kept high because time increases and attenuation increases according to the extension length. The electrical energy used for the attenuated radical generation is not used for the surface treatment, but only affects the temperature of the discharge gas, thus reducing the energy efficiency of the treatment. Furthermore, when the temperature of the discharge gas rises excessively, there is a possibility that damage to the instrument such as electrode cracking may occur due to thermal stress.

  Also, in the atmospheric pressure plasma irradiation apparatus described in Patent Document 2, similarly, the ground electrode is covered with a dielectric, the charged particle removal ability is low, and the outflow of charged particles to the downstream target object is prevented. May occur. Further, when processing an object having a large area, a large number of parts such as a large number of high-voltage electrodes, capillaries, and grounding-side dielectric sleeves are required, which poses a problem that the assembly is complicated and the man-hour is excessive and the assembly cost is increased.

  The present invention has been made to solve the above-described problems. The charged particles reaching the material to be treated are sufficiently suppressed, and a radical having a short lifetime is rapidly transferred from the atmospheric pressure plasma generation site. An object of the present invention is to provide a surface treatment apparatus and a surface treatment method capable of suppressing radical density attenuation by transporting and performing surface treatment with high energy efficiency.

The present invention includes a flat high-voltage electrode having a high-voltage conductor coated with a dielectric, a ground electrode having a conductor surface disposed opposite to the high-voltage electrode and having through-holes formed therein, and the high-voltage conductor. A discharge space formed between an electrode and the ground electrode, a gas supply means for introducing gas into the discharge space, and a high-frequency high-voltage power source for applying an alternating voltage to the high-voltage electrode, and at a predetermined speed Gas is introduced into the discharge space, and the alternating voltage is applied to the high-voltage electrode in a state where the pressure in the discharge space is kept higher than the outlet pressure of the through-hole, thereby generating a discharge. the resulting gas containing active particles, wherein the through micropores, the blown in through the workpiece placed opposite the micropores, the a surface treatment apparatus for performing surface treatment of the object to be processed, wherein Opposite to the high voltage conductor The high-voltage conductive material is arranged such that the end of the high-voltage conductor exists at a position shifted to the upstream side in the gas flow direction in the discharge space with respect to the installation position of the through-hole formed in the ground electrode. A body is disposed, and the ground electrode has a ground electrode projection formed by projecting a part of the ground electrode toward the high-voltage electrode in the periphery of the through-hole, and the ground electrode projection is The surface treatment apparatus is provided at a position shifted to the upstream side in the gas flow direction in the discharge space with respect to the installation position of the through minute hole .

The present invention includes a flat high-voltage electrode having a high-voltage conductor coated with a dielectric, a ground electrode having a conductor surface disposed opposite to the high-voltage electrode and having through-holes formed therein, and the high-voltage conductor. A discharge space formed between an electrode and the ground electrode, a gas supply means for introducing gas into the discharge space, and a high-frequency high-voltage power source for applying an alternating voltage to the high-voltage electrode, and at a predetermined speed Gas is introduced into the discharge space, and the alternating voltage is applied to the high-voltage electrode in a state where the pressure in the discharge space is kept higher than the outlet pressure of the through-hole, thereby generating a discharge. the resulting gas containing active particles, wherein the through micropores, the blown in through the workpiece placed opposite the micropores, the a surface treatment apparatus for performing surface treatment of the object to be processed, wherein Opposite to the high voltage conductor The high-voltage conductive material is arranged such that the end of the high-voltage conductor exists at a position shifted to the upstream side in the gas flow direction in the discharge space with respect to the installation position of the through-hole formed in the ground electrode. A body is disposed, and the ground electrode has a ground electrode projection formed by projecting a part of the ground electrode toward the high-voltage electrode in the periphery of the through-hole, and the ground electrode projection is Since the surface treatment apparatus is provided at a position shifted to the upstream side in the gas flow direction in the discharge space from the installation position of the through-holes, the charged particles that reach the material to be processed are sufficiently provided. In addition, the radical density decay can be suppressed by transporting the short-lived radicals at high speed from the atmospheric pressure plasma generation site, and surface treatment with high energy efficiency can be performed.

It is sectional drawing which shows the surface treatment apparatus by Embodiment 1 of this invention. It is sectional drawing which shows the high voltage conductor of the high voltage electrode of the surface treatment apparatus by Embodiment 1 of this invention. It is a top view which shows the positional relationship of the high voltage electrode and spacer of the surface treatment apparatus by Embodiment 1 of this invention. It is sectional drawing which cuts the edge part spacer part of the surface treatment apparatus by Embodiment 1 of this invention. It is sectional drawing which cuts the gas introduction hole part of the surface treatment apparatus by Embodiment 1 of this invention. It is a figure which shows the ground electrode of the surface treatment apparatus by Embodiment 1 of this invention. It is an example of sectional drawing which shows the high voltage conductor of the high voltage electrode of the surface treatment apparatus by Embodiment 1 of this invention. It is sectional drawing which shows the discharge space of the surface treatment apparatus by Embodiment 2 of this invention. It is sectional drawing seen from the direction perpendicular | vertical to FIG. 8 which shows the discharge space of the surface treatment apparatus by Embodiment 2 of this invention. It is a figure which shows attenuation | damping of the oxygen atom in dry air in nitrogen. It is a figure which shows the resin processing result by Embodiment 2 of this invention. It is a figure which shows the structure of the surface treatment apparatus by Embodiment 3 of this invention. It is a figure which shows the structure of the surface treatment apparatus by Embodiment 4 of this invention. It is sectional drawing which shows the surface treatment apparatus by Embodiment 5 of this invention. It is the figure which showed the prior art of patent document 1. It is the figure which showed the prior art of patent document 2. FIG. It is the figure which showed the prior art of patent document 2. FIG.

Embodiment 1 FIG.
FIG. 1 is a cross-sectional view showing a configuration of a surface treatment apparatus according to Embodiment 1 of the present invention. As shown in FIG. 1, the surface treatment apparatus according to the first embodiment includes a discharge space 1 inside. The housing of the surface treatment apparatus is provided on the upper part of the side frame 3 so as to face the ground electrode 6, the side frame 3 having a substantially rectangular frame shape, the ground electrode 6 provided at the bottom of the side frame 3, and the ground electrode 6. It consists of a presser lid 2. The side frame 3, the installation electrode 6, and the pressing lid 2 are all made of a conductor. The discharge space 1 has an airtight structure surrounded by the side frame 6, the ground electrode 6, and the pressing lid 2. The discharge space 1 communicates with the outside only slightly by a gas introduction hole 42 (see FIG. 5) and a through microhole group 15 described later. A rubber-like elastic body 8 is interposed between the holding lid 2 and the side frame 3 and between the ground electrode 6 and the side frame 3, and the holding lid 2, the side frame 3, and the ground electrode 6. Are fastened with screws to compress the rubber-like elastic body 8 interposed between them and ensure airtightness.

  In the discharge space 1, the heat spreader 7, the high-voltage electrode 4, and the discharge part spacer 52 are arranged in the vertical direction between the presser lid 2 and the ground electrode 6 in order from the top. The heat spreader 7 is provided in close contact with the lower surface of the pressing lid 2. However, only in the vicinity where a gas introduction hole 42 for introducing a supply gas 43 described later is provided, the heat spreader 7 and the lower surface of the holding lid 2 are not in close contact with each other, and a predetermined gap (groove) is provided. 9 is formed. A high voltage electrode 4 is fixed on the lower surface of the heat spreader 7. As will be described later, each of the heat spreader 7 and the high-voltage electrode 4 has an elongated rod shape having a substantially rectangular cross section. As shown in FIGS. 1 and 5, the width of the heat spreader 7 is configured to be shorter than the width of a pair of opposed inner walls of the four inner walls of the side frame 3. The width of the high voltage electrode 4 is further shorter than the width of the heat spreader 7. Therefore, as shown in FIGS. 1 and 5, the end surfaces of the heat spreader 7 and the high-voltage electrode 4 are not in contact with the pair of inner walls of the side frame 3, and each end faces a predetermined gap 10. It is provided between the inner wall of the frame 3. The length (in the longitudinal direction) of the high-voltage electrode 4 is the same as the length of the heat spreader 7, and the end surface of the high-voltage electrode 4 and the end surface of the heat spreader 7 are respectively connected to the other pair of inner walls of the side frame 3. In contact. As described above, there is a gap (groove) 9 between the upper surface of the heat spreader 7 and the lower surface of the pressing lid 2 at the location where the gas introduction hole 42 is provided. Since the gap (groove) 9 communicates with the discharge space 1 via the gap 10 between the end face of the heat spreader 7 and the inner wall of the side frame 3, the supply gas 43 supplied from the gas introduction hole 42 is Then, it is introduced into the discharge space 1 through the gaps 9 and 10. Further, a discharge portion spacer 52 is fixed between the lower surface of the high-voltage electrode 4 and the upper surface of the installation electrode 6, and supports the high-voltage electrode 4 from below. By pressing the heat spreader 7, the high voltage electrode 4, and the discharge portion spacer 52 described above against the holding lid 2 and the ground electrode 6, the gap height of the discharge space 1 is kept constant, and the contact between each component is maintained. It has a structure that reduces thermal resistance.

  The presser lid 2 is provided with two through holes, and in one of them, the power feeding bar 17 connected to the high-frequency high-voltage power supply 30 is inserted and arranged in the vertical direction. The other through-hole is a gas introduction hole 42 for supplying the supply gas 43 into the discharge space 1, as shown in FIG. The power feeding bar 17 and the pressing lid 2 are mechanically joined via an insulator 16 while maintaining electrical insulation and airtightness. The feeding bar 17 extends in the vertical direction through the holding lid 2 and the heat spreader 7, and the tip of the feeding bar 17 reaches the high voltage electrode 4, and the conductive elastic body 18 is connected to the high voltage conductor 11 disposed in the high voltage electrode 4. It is electrically connected via. The elastic deformation range of the conductive elastic body 18 connected to the power supply bar 17 is set to be larger than the crushing margin of the rubber elastic body 8, and not only at the time of assembly but also at the start of discharge, the high-voltage electrode 4 and the ground electrode 6 Further, even after the temperature of the heat spreader 7 is greatly increased and deformation is caused by thermal expansion, the conductive elastic body 18 is deformed, and the pressing to the high voltage electrode 4 is favorably performed.

  The heat spreader 7 is installed in close contact with the high voltage electrode 4 except that a through hole through which the power feeding bar 17 is passed is formed. The holding lid 2, the side frame 3, and the ground electrode 6 are electrically connected to each other and maintained at the ground potential. As shown in FIGS. 2, 3, and 7, the high-voltage electrode 4 has a substantially rectangular plate-like shape, and its cross section is substantially rectangular (rectangular) as shown in FIGS. It has become. As shown in FIG. 2 or 7, the surface layer is covered with a dielectric coating 12, and a high-voltage conductor 11 having a predetermined pattern is formed inside. As shown in FIG. 1, the discharge region 40 in the discharge space 1 is defined by the width of the high-voltage conductor 11 and the grounding position. That is, a region between the high voltage conductor 11 and the ground electrode 6 facing the high voltage conductor 11 is defined as the discharge region 40. The high-voltage conductor 11 may be constituted by a single bar-like conductor having a width over the entire discharge region 40 of FIG. 1 across the discharge portion spacer 52, as in the example (pattern) of FIG. Alternatively, as shown in the example (pattern) in FIG. 7, the high-voltage conductor 11 is provided in an area where the discharge portion spacer 52 is in contact with the high-voltage electrode 4. Alternatively, the two thin plate rod-like conductors can be electrically connected to each other through the bus line 14 to achieve internal conduction.

  As described above, a plurality of types of patterns can be considered as the pattern of the high-voltage conductor 11, and a common feature among them is that the high-voltage conductor 11 is formed in the through microhole 15 provided in the ground electrode 6 facing it. On the other hand, it is provided in the vicinity of the inlet of the through-microhole 15 and biased upstream of the discharge space 1 in the gas flow direction. That is, in FIG. 6, a range indicated by a broken line is a region where the high-voltage conductor 11 of the high-voltage electrode 4 facing the ground electrode 6 is provided. The range in the vicinity is preferably within the radical reach distance described later. The supply gas 43 supplied from the gas introduction hole 42 flows through the gaps 9 and 10 in the gas flow direction as indicated by arrows in FIG. 5, and in the discharge region 40 between the high-voltage electrode 4 and the ground electrode 6. The gas is supplied in the gas flow direction indicated by the arrow in FIG. Therefore, the left and right directions in FIG. 6 are upstream in the gas flow path direction, and the inlet side of the through-hole 15 in the center of FIG. 6 is downstream in the gas flow path direction. At this time, when comparing the two rows of through-microholes 15 and the positions of broken lines parallel to them, the broken lines are located on the left and right outside of the rows of through-microholes 15 on both the left and right sides. I understand. Therefore, this indicates that the high-voltage conductor 11 is provided not at a position directly above the through-hole 15 but at a position shifted by a predetermined distance upstream of the position of the through-hole 15 in the gas flow direction. Yes. In the present specification, the shift to the upstream side in the gas flow direction is referred to as being biased to the upstream side in the gas flow direction. In the example of FIG. 2, the high-voltage conductor 11 is provided not only on the upstream side in the gas flow direction of the through-hole 15 but also at a position directly above the through-hole 15. Although there is no particular problem, it is not always necessary to provide it. Therefore, as shown in FIG. 7, the high-voltage conductor 11 may be eliminated at a position directly above the through-hole 15. Any pattern may be used. However, the high voltage conductor 11 is always provided on the upstream side in the gas flow direction.

  The upper surface appearance of the high-voltage electrode 4 is shown in FIG. 3, and the portion where the dielectric coating 12 is not provided and the high-voltage conductor 11 is exposed as the feed hole 21 is the discharge space 1 of the high-voltage electrode 4. Is formed on the opposite surface (the upper surface of the high-voltage electrode 4). The power supply bar 17 connected to the high frequency high voltage power supply 30 is electrically connected to the high voltage conductor 11 exposed through the power supply hole 21 through the conductive elastic body 18. Further, as shown in FIG. 3, end spacers 51 are provided at both ends of the high voltage electrode 4. FIG. 4 is a cross-sectional view of the surface treatment apparatus taken along the line AA in FIG. As shown in FIG. 4, the end spacer 51 is disposed at the lower part of both ends of the high-voltage electrode 4, and is intimately fixed to the upper surface of the ground electrode 6 and the inner wall of the side frame 3. 4 is supported and pressed against the heat spreader 7. The end spacers 51 are vertically connected to the above-described discharge part spacers 52 as shown in FIG. 3, and these spacers have an I-shape as a whole. The discharge part spacer 52 is also provided below the high-voltage electrode 4, supports the high-voltage electrode 4 from below and presses it against the heat spreader 7. Therefore, the end spacer 51 and the discharge spacer 52 connect the high-voltage electrode 4 to the heat spreader. 7, the position of the high-voltage electrode 4 is stabilized, and the gap height of the discharge space 1 is kept constant. In the following description, the end spacer 51 and the discharge spacer 52 are collectively referred to as the spacer 5.

  As shown in FIG. 5, the supply gas 43 supplied to the discharge space 1 is poured through a gas introduction hole 42 formed at a position different from the power supply bar 17. In the vicinity of the position where the gas supply hole 42 is provided, as described above, the heat spreader 7 is structured not to be in close contact with the pressing lid 2, and a gap (groove) 9 is formed. The supply gas 43 passes through the gap (groove) 9 portion, passes through the gap 10 between the side surface of the heat spreader 7 and the side frame 3, and flows from the side in the flow path indicated by the arrow in FIG. Flows into 1. At this time, since there is a pressure difference between the discharge space 1 side and the outlet side of the through-hole 15, the stress generated by this pressure difference distorts the center of the ground electrode 6 toward the downstream side. Therefore, in order to make the height of the discharge space 1 (discharge gap length) uniform, the thickness of the ground electrode 6 is determined so that the strain amount is 5% or less of the gap length. As shown in FIG. 6, the ground electrode 6 is formed with a plurality of through-holes 15 arranged in two rows in the longitudinal direction. The positions of these two rows of through microholes 15 are not arranged in the width direction but are shifted in position so as to be alternated. The shift amount is about ½ of the arrangement interval between adjacent through-holes 15 in one row. Therefore, the through micro holes 15 in the other row are positioned so as to exist between the adjacent through micro holes 15 in one row. The supply gas 43 passes through the discharge region 40 in the discharge space 1 to become an active particle-containing gas 41 containing active particles, passes through the through micropores 15, and is downstream of the through micropores 15. The object to be processed (not shown) placed outside is irradiated.

  Next, the operation of the surface treatment apparatus according to Embodiment 1 will be described. Here, a description will be given of a surface treatment in which dry air is used as the supply gas 43, dry air is used as a raw material, nitrogen radicals and oxygen radicals are generated as active particles by discharge, and these radicals are brought into contact with an object to be processed. Dry air (supply gas 43) is supplied from the gas introduction hole 42 to the discharge space 1 at a flow rate of 14 liters per minute. The diameter of the through microholes 15 formed in the ground electrode 6 is, for example, 0.12 mm, and the number of through microholes 15 is, for example, 112. Under this condition, the outlet pressure of the through-hole 15 is atmospheric pressure, and the conductance of the gas flow of the supply gas 43 is limited by the through-hole 15, so the gauge pressure in the discharge space 1 is about 25 kPaG. The pressure in the discharge space 1 is kept higher than the outlet pressure of the through micropores 15. Here, the flow rate of 14 liters per minute is used as the constant speed for introducing the gas. However, the flow rate is not limited to this case, and the pressure in the discharge space 1 can be kept higher than the outlet pressure of the through-hole 15. The speed can be determined as appropriate. At this time, by applying an alternating high voltage from the high-frequency high-voltage power supply 30 to the high-voltage conductor 11 in the high-voltage electrode 4 through the power supply bar 17, the region where the high-voltage conductor 11 exists in the discharge space 1 A dielectric barrier discharge is caused in the discharge region 40 sandwiched between the ground electrode 6 facing the active electrode 6 and active radicals are generated. The radicals generated by the discharge collide with a target object (not shown) placed through the through microhole 15 and directly opposite to the outlet of the through microhole 15 on the downstream, and the surface treatment of the target object is performed. To do.

  In the first embodiment, the high voltage conductor 11 to which a high voltage is applied is in the vicinity of the through microhole 15 and in the discharge space 1 with respect to the through microhole 15 provided in the ground electrode 6 facing it. It is biased toward the upstream side in the gas flow direction. Therefore, the discharge region 40 is not the entire discharge space 1 but a region slightly biased to the upstream side in the gas flow direction from the through microhole 15 in the vicinity of the entrance of the through microhole 15. In the example of FIG. 1, since the high-voltage conductor 11 has the pattern shown in FIG. 2, the discharge region 40 extends right above the entrance of the through microhole 15, but in the case of the pattern shown in FIG. The discharge region 40 is only a region near the entrance of the through microhole 15 and slightly deviated upstream of the through microhole 15 in the gas flow direction (the vicinity of the discharge portion spacer 52 does not become the discharge region 40). With this configuration, radicals generated by discharge upstream of the gas flow are efficiently sucked into the through-holes 15 immediately after the generation of radicals on the gas flow, so that the transport distance of the active particle-containing gas 41 is greatly increased. The radicals generated by the discharge are shortened and can be ejected from the through-hole 15 toward the object to be processed without being attenuated, and the discharge energy is mainly used for radical generation, so that the gas temperature is excessively increased. And the density of radicals contributing to the surface treatment can be increased while keeping the gas temperature low.

  This will be described in more detail below. In general, radicals generated by discharge are deactivated with a certain lifetime due to collision with gas in the discharge space and the subsequent transport space to the object to be processed. FIG. 10 shows the results of calculating the lifetime of oxygen radicals (oxygen atoms) under an absolute pressure of 1 atm, and each of a nitrogen atmosphere and an air atmosphere (oxygen concentration 21%) mixed with 0.01% oxygen. In FIG. 10, the result shown as “0.01% −O 2 / N 2” is a case of a nitrogen atmosphere, and the result shown as “dry air” is a case of an air atmosphere.

In the example of FIG. 10, the existence of oxygen atoms 10 ²⁰ m ⁻³ (10 ¹⁴ cm ⁻³ ) is assumed in the initial stage, and attenuation is calculated by a rate equation. If the radical lifetime is 1/10 of the initial density, the lifetime of oxygen atoms is about 100 ms in the nitrogen atmosphere, but the life is shortened to about 70 μs in the air atmosphere. Neutral radicals are transported only by gas advection without the effect of an electric field. Therefore, for the transport of radicals, the gas flow rate from the discharge space 1, the inside of the through microhole 15, and the ejection port of the through microhole 15 to the object to be processed plays an important role. The approximate gas flow rate flowing in the discharge space is a value obtained by dividing the gas flow rate by the area determined by the height of the discharge space and the electrode width of the high voltage electrode in the gas flow direction. The radical reach distance is obtained by multiplying the gas flow rate and the radical lifetime. The radicals generated beyond the radical reach distance are attenuated before reaching the through micropores 15, and the contribution to the surface treatment is reduced.

  For example, when the height of the discharge space is 1 mm, the electrode width in the gas flow direction of the high-voltage electrode is 100 mm, and gas flows into the high-voltage electrode from both sides at a rate of 14 L / min. The inflow rate is 7L / min), the gas flow velocity in the discharge region is about 1.2m / s, the radical arrival distance is 120mm when the lifetime of oxygen atoms in nitrogen is 100ms, and the arrival of radicals when the lifetime of oxygen atoms in air is 70μs. The distance is 84 μm. Radicals generated by discharging at a distance far from the through-hole 15 are deactivated by one digit or more when reaching the through-hole, and the radical activation energy is used to increase the gas temperature by the recombination process. . That is, most of the discharge energy input to the region beyond the radical reach distance is heated, and does not contribute to the surface treatment, and only promotes the gas temperature rise.

  Therefore, in the first embodiment, the height in the discharge region 40 of the discharge space 1 is reduced to 0.1 mm. As a configuration for reducing the height in the discharge region 40 of the discharge space 1 to 0.1 mm, a thick heat spreader 7 is provided on the lower surface of the holding lid 2, and a high voltage electrode 4 is provided on the lower surface of the heat spreader 7. did. The height of the discharge region 40 in the discharge space 1 can be lowered by the amount of the heat spreader 17 provided. As described above, when the height of the discharge space 1 is reduced to 0.1 mm, the gas flow rate in the discharge region 40 is approximately 12 m / s under the same gas flow rate condition as described above, and the radical reach distance in the discharge region 40 is oxygen atoms. Becomes 1200 mm and oxygen atoms becomes 840 μm, and the radical reach distance is expanded about 10 times. In the first embodiment, as shown in FIG. 2 or 7, the high-voltage conductor 11 is formed into an elongated plate-bar shape, and the width of the high-voltage conductor 11 from the end of the discharge part spacer 52 is set to about the radical reach distance. Therefore, discharge energy is effectively used, and surface treatment with high efficiency can be realized. Here, an example in which the gas flow rate is approximately 12 m / s has been described. However, the present invention is not limited to this, and the gas flow rate in the discharge region 40 may be 10 m / s or more. The surface treatment of the treatment body can be performed.

  As described above, the first embodiment has a flat plate-like high-voltage electrode 4 composed of the high-voltage conductor 11 covered with the dielectric coating 12, and a conductor surface on which one or more through-holes 15 are formed. The ground electrode 6 is opposed to each other, the supply gas 43 is introduced between the discharge electrodes 4, 6, and the pressure of the discharge space 1 formed between the discharge electrodes 4, 6 is made higher than the outlet pressure of the through-hole 15. A high voltage is applied to the high voltage electrode 4 by the high frequency high voltage power source 30 to generate a discharge, and the discharge activates the supply gas 43 to form an active particle-containing gas 41 containing active particles. In the surface treatment apparatus for treating the surface of the object to be treated by blowing the active particle-containing gas 41 on the opposite object to be treated (not shown), the high voltage conductor 11 to which a high voltage is applied by the high voltage electrode 4 Opposite contact The through holes 15 formed in the electrode 6 are applied in the vicinity of the through holes 15 and on the upstream side in the gas flow direction of the discharge space 1 with respect to the positions of the through holes 15. It is assumed that the radicals are deactivated by limiting the flow to flow into the through microholes 15 and to generate discharge only in the vicinity of the through microholes 15 depending on the position of the high-voltage conductor 11. It is possible to suppress discharge in a region beyond the radical reach distance, efficiently eject the radical generated by the discharge from the through-hole 15 toward the object to be processed without attenuation, and mainly use the energy of the discharge. By being used for radical generation, energy input that does not contribute to the surface treatment of the object to be processed is reduced, radical density is not lowered, and excessive rise in gas temperature is suppressed, keeping the gas temperature low. It remains, it is possible to increase the density of contributing neutral active particles to the surface treatment of the object to be processed. As described above, in the first embodiment, a discharge is generated between the ground electrode 6 having the through-hole 15 and the dielectric-coated high-voltage conductor 11, and the high-voltage conductor 11 is placed near the through-hole 15. The discharge region 40 is limited to correspond to the high-voltage conductor 11 and can be extracted before being subjected to attenuation. In the first embodiment, since the ground electrode 6 having a thickness and not covered with the dielectric coating is used as compared with the ground electrode of Patent Document 1, the through microhole 15 is used. Or the charged particle capturing ability is high, and the outflow of charged particles to the downstream object can be suppressed.

Further, since the radical reach distance is obtained by multiplying the gas flow rate and the radical lifetime, the size (width) of the discharge region 40 in the upstream direction of the gas flow defined in a biased manner with respect to the through-hole 15 is determined by the discharge. Surface treatment can be performed with high energy efficiency by setting the gas flow velocity in the region 40 within the distance obtained by multiplying the value of the radical lifetime (ie, 70 μs for air discharge and 100 ms for nitrogen discharge containing a trace amount of oxygen). Specifically, the half width of the high-voltage conductor 11 is set within the radical reach distance so that the discharge region 40 has the size. Similarly, it is desirable that the height of the discharge region 40, that is, the distance from the lower surface of the high-voltage electrode 4 to the through microhole 15 is also within the radical reach distance. With this configuration, the disappearance of radicals on the surfaces of the ground electrode 6 and the through-hole 15 is suppressed, and the density of radicals reaching the object to be processed can be improved. Alternatively, processing can be performed with a low-temperature jet gas while keeping the radical density reaching the object to be processed at a predetermined value, so that processing can also be applied to materials that are altered or damaged by temperature rise. Can do.
Furthermore, in order to increase the energy efficiency of the treatment, the decay of radicals that reach from the discharge region farthest from the micropores is within 1/2 times the radical arrival distance, which is within about 1/2 of the initial density at the time of generation by discharge. It is more desirable to do. Specifically, the half width of the high-voltage conductor 11 is set within ½ times the radical reach distance. In addition, it is more desirable that the height of the discharge region 40, that is, the distance from the lower surface of the high-voltage electrode 4 to the through minute hole 15 is also within ½ times the radical arrival distance. With this configuration, the disappearance of radicals on the surface of the ground electrode 6 and the through-hole 15 is suppressed, and the density of radicals that reach the object to be processed can be improved with higher energy efficiency. Alternatively, since the treatment can be performed with a lower temperature jet gas while keeping the radical density reaching the object to be processed at a predetermined value, the treatment is also applied to a material that is altered or damaged by a temperature rise. be able to.

  Further, in the first embodiment, the height of the discharge region 40, the width of the high-voltage electrode 4, and the arrangement position of the high-voltage electrode 4 (penetration) so that the gas flow rate in the discharge region 40 is 10 m / s or more. Since at least one of the distance to the micropores 15) and the introduction speed of the supply gas 43 is adjusted, the decay of the short-lived radicals can be suppressed and the object to be treated can be efficiently sprayed.

  Further, in the first embodiment, the diameter of the through microhole 15 (and the introduction speed of the supply gas 43) is such that the gas outflow speed at the outlet of the through microhole 15 is 100 m in the air discharge in the dry air. Since the nitrogen discharge containing a trace amount of oxygen is set to 50 m / s, the generated radicals are hardly attenuated in the through microholes 15 and the outlet of the through microholes 15 jumps out. Therefore, the surface of the object to be treated can be irradiated with radicals while suppressing the decay of radicals, and a good surface treatment can be realized.

  In the first embodiment, the discharge region 40 is concentrated in the vicinity of the high-voltage conductor 11, but a plate-shaped heat spreader having a high heat transfer coefficient in the surface direction (the high-voltage electrode extension direction) and having an insulating property. 7 is provided in close contact with the surface opposite to the discharge surface of the high-voltage electrode 4, so that variations in the temperature distribution of the high-voltage electrode 4 are alleviated and temperature equalization of the high-voltage electrode 4 is promoted. The stress is reduced, and electrode cracking due to thermal stress (electrode breakage) can be prevented. When, for example, alumina coating is used as the dielectric coating 12 for the high-voltage electrode 4, the heat spreader 7 is made of a thicker alumina or a nitride ceramic having a higher thermal conductivity than the dielectric coating 12 of the high-voltage electrode 4. It is good to.

  Further, in the first embodiment, the formation of the through minute hole 15 can be realized by machining, laser processing, pipe embedding, and the like, but it is possible to avoid the hole shape from becoming tapered due to the nature of the processing. There may not be. In such a case, when it becomes unavoidable, the diameter of the inlet side of the through microhole 15 on the discharge space 1 side is maximized so that the gas flow velocity at the outlet becomes maximum in the tapered through microhole 15. It is desirable to form the through micropores 15 so that the diameter of the outlet side is the maximum and the diameter of the outlet side is the minimum.

  In the first embodiment, a part of the high-voltage conductor 11 incorporated in the high-voltage electrode 4 is exposed without applying the covering dielectric 12 to a part of the surface opposite to the discharge surface of the high-voltage electrode 4. A power supply method in which a conductive member connected to the high-frequency and high-voltage power supply 30 is brought into contact with the portion (power supply hole 21) to apply a high voltage, and part or all of the conductive member is elastically Since it consists of a body, the thermal stress concerning the high voltage electrode 4 can be relieved and an electrode crack can be prevented. In the first embodiment, the conductive member is composed of the power supply bar 17 and the conductive elastic body 18 so that the conductive elastic body 18 is elastic.

Embodiment 2. FIG.
FIG. 8 is a cross-sectional view showing the configuration of the surface treatment apparatus according to Embodiment 2 of the present invention. FIG. 9 is a diagram showing the high-voltage electrode 4 and the ground electrode 6 in the second embodiment. The configuration of the second embodiment is basically the same as that of the first embodiment, but the configuration of the high-voltage electrode 4 and the ground electrode 6 and the supply position of the supply gas 43 are different. The following description will mainly focus on differences from the first embodiment.

  In the second embodiment, as shown in FIG. 9, both the high voltage electrode 4 and the ground electrode 6 have a substantially rectangular plate shape. In the ground electrode 6, as shown in FIG. 9, a plurality of through-holes 15 are evenly arranged in the vertical and horizontal directions. In the example of FIG. 9, a total of 35 through-holes 15 of 7 columns × 5 rows are provided. However, the present invention is not limited to this, and it is arbitrary as long as it is arranged as evenly as possible vertically and horizontally. The number of suffices.

  The high-voltage electrode 4 includes a high-voltage electrode composed of substantially circular conductor expansion portions 13 arranged vertically and horizontally and a line-shaped (line-shaped) bus line 14 connecting the conductor expansion portions 13. A conductor 11 is provided. Each conductor enlarged portion 13 is basically provided corresponding to the arrangement position of the through minute hole 15 of the ground electrode 6 and they are opposed to each other, but as can be seen from the one-dot chain line in FIG. The center of the conductor enlarged portion 13 does not coincide with the center of the through hole 15 and the conductor enlarged portion 13 is provided slightly offset by a predetermined minute distance upstream in the gas flow direction. However, in the example of FIG. 9, the center of the conductor enlarged portion 13 and the center of the through minute hole 15 coincide with each other in the fourth row from the center end. The reason why the conductor expansion portion 13 is electrically connected by the bus line 14 is to supply a high voltage to all the conductor expansion portions 13 at a time by a single high-frequency high-voltage power supply 30, and the number of parts is reduced. This is because the number of steps is not increased and the assembly process is easy and requires less man-hours.

  In the present embodiment, the heat spreader 7 and the high-voltage electrode 4 extend from one inner wall of the side frame 3 to the other inner wall facing each other because the high-voltage electrode 4 is plate-shaped. And both ends of the high-voltage electrode 4 are in contact with the inner wall of the side frame 3. Thus, in the present embodiment, the lower surface of the outer peripheral portion of the substantially rectangular high-voltage electrode 4 along the inner wall of the side frame 3 without providing the discharge portion spacer 52 and the end spacer 51 shown in FIG. A frame-like spacer 5 is provided to support the frame.

  In the first embodiment, the gas inlet hole 42 is provided in the holding lid 2 and the supply gas 43 is poured into the discharge space 1 from above. However, in the present embodiment, as described above, the heat spreader 7 and the high pressure are supplied. Since the electrode 4 extends from one inner wall of the side frame 3 to the other inner wall facing the electrode 4, it is difficult to supply the supply gas 43 from above. As shown in FIG. 9, the supply gas 43 is supplied from the outer peripheral portions of the high-voltage electrode 4 and the ground electrode 6 to the discharge space 1. In FIG. 9, the supply gas 43 is supplied only from the left and right directions. However, the supply gas 43 is not limited to this, and the supply gas 43 may be supplied from the entire outer circumferential direction. In the example of FIG. 9, since the supply gas 43 flows from the left and right direction, the left and right direction is upstream of the gas flow direction, and therefore the direction in which the center of the conductor enlarged portion 13 is offset with respect to the center of the through microhole 15 However, when the supply gas 43 is supplied from the entire circumference of the outer circumference, the entire circumference of the outer circumference is upstream in the gas flow direction, so that the offset direction is also directed toward the outer circumference. Offset so that it spreads radially.

  The difference between the second embodiment and the first embodiment is mainly only the points described above, and the other configurations are the same. Therefore, the same reference numerals are given here, and description thereof is omitted.

  In the second embodiment, in the configuration of FIGS. 8 and 9, the supply gas 43 is poured from the gas supply means (not shown) into the discharge space 1 from the outer peripheral portions of the high voltage electrode 4 and the ground electrode 6. The supply gas 43 becomes an active particle-containing gas 41 by discharge, and flows out from the discharge space 1 through the through microhole 15, but the gauge pressure in the discharge space 1 becomes about 50 kPaG due to the conductance of the through microhole 15. . Since the outlet pressure of the through microhole 15 is uniform for each hole at atmospheric pressure, and the conductance of the through microhole 15 is sufficiently smaller than the conductance of the gas flow path including the discharge space 1, Regardless of the distance, the flow rate flowing out from each through microhole 15 is made uniform. In this way, radicals generated by the discharge are supplied to an object to be processed (not shown) through the through fine holes 15 to perform surface treatment.

  FIG. 9 shows the positional relationship between the through hole 15 and the high-voltage conductor 11 according to the second embodiment. In the present embodiment, the conductor enlarged portion 13 of the high-voltage conductor 11 in the discharge space 1 is shown. A dielectric barrier discharge is mainly generated in a region defined by the above, and active radicals are generated. By offsetting the center of the conductor enlarged portion 13 from the center of the through-microhole 15, the conductor enlarged portion 13 is biased to the upstream side of the through-microhole 15 in the gas flow direction. Can efficiently flow into the through-hole 15 and no discharge is generated in a region that does not reach the radical reach distance, so that a surface treatment with high energy efficiency can be realized. In addition, although a discharge is generated immediately below the bus line 14, the electric power input to the bus line 14 can be reduced in proportion to the area of the bus line 14, so that the physical strength and the electrical reliability can be ensured. By forming the bus line 14 as thin as possible, wasteful energy consumption can be reduced.

FIG. 11 shows a gas flow rate in a surface treatment apparatus having a discharge space height of 0.7 mm, a discharge area of 36 cm ² , a diameter of through micropores of 0.1 mm, and a number of fine holes of 138 in the configuration of the second embodiment. The result of irradiating radicals while moving a polyethylene plate at a transport speed of 25 mm / s at a discharge power of 175 W at 14 slm is shown. Experiments were performed by changing the distance between the surface treatment apparatus and the object to be treated, and the treatment ability was evaluated by measuring the contact angle of pure water. Since the radicals attenuate at an arrival distance of 10 mm, the treatment effect is not observed, but it can be seen that the hydrophilicity is improved and the contact angle is reduced as the distance approaches. In FIG. 11, the result of air discharge using the supply gas 43 as air is plotted as □, and the result of nitrogen discharge using the supply gas 43 as nitrogen gas is plotted as ◯. Although the processing efficiency is lower than that of discharge, the processing is realized by the high-speed radical extraction of the present embodiment. Note that the nitrogen discharge here contains a small amount of oxygen, and discharge up to an oxygen concentration of 1000 ppm is expressed as nitrogen discharge.

  As described above, in the second embodiment, nitrogen gas or air is used as the supply gas 43, radicals are generated by discharge, and the treatment for hydrophilicity of the object to be processed is performed. However, the effect of the present invention is not limited to hydrophilization. In principle, the dielectric barrier discharge can form a stable discharge for any gas species. Further, the short lifetime of radicals in the vicinity of atmospheric pressure is an event that generally holds true regardless of the type of discharge gas. Therefore, the present invention can be used for any gas species for the purpose of realizing a remote plasma process that efficiently utilizes radicals. Among them, atomic radicals such as atomic nitrogen, atomic hydrogen, and atomic oxygen are generated at a relatively high density by discharge at atmospheric pressure or higher, and are irradiated with oxidation, nitridation, reduction, hydrophilization, Since various effects such as cleaning are exhibited, the application of the present invention is effective.

  As described above, in the second embodiment, the same effect as that obtained in the first embodiment can be obtained. Further, in the second embodiment, the same effect as in the first embodiment is obtained. On the other hand, since the high-voltage electrode 4, the high-voltage conductor 11 provided on the high-voltage electrode 11, and the ground electrode 6 are made different from each other and are formed of planar plate-like members, they have a relatively large area. It is suitable for the surface treatment of the object to be treated, and since a large area of the object to be treated can be surface treated at a time, the efficiency is high.

Embodiment 3 FIG.
FIG. 12 is a partial cross-sectional view of the surface treatment apparatus according to the third embodiment of the present invention, a cross-sectional view of the layer on which the conductor 11 of the high-voltage electrode 4 is present, and an apparatus for the ground electrode 6 It is the figure seen from the upper surface. In the third embodiment, on the surface of the ground electrode 6, only the peripheral portion of the through hole 15 is formed to be raised in a cylindrical island shape, and the thickness of the ground electrode 6 is increased only in that portion. This is mainly different from the first and second embodiments. Hereinafter, a portion formed by raising these cylindrical islands will be referred to as a ground electrode protrusion 20. In addition, the cross-sectional shape of the ground electrode protrusion 20 is substantially rectangular as shown in FIG. In the present embodiment, as in the second embodiment, the high-voltage electrode 4 and the ground electrode 6 have a substantially rectangular plate shape. However, the present embodiment is different from the second embodiment in that the shape of the high-voltage conductor 11 is also a substantially rectangular plate. Since other configurations are the same as those in the first or second embodiment, the description thereof is omitted here.

  The third embodiment will be described below with reference to FIG. In the portion where the cylindrical ground electrode protrusion 20 of the ground electrode 6 is formed, the height of the discharge region 40 between the high voltage electrode 4 becomes narrow, and when a high voltage is applied, the ground electrode protrusion Discharge occurs only in the portion 20. Note that the center of the through-hole 15 does not coincide with the center of the ground electrode protrusion 20 and, like the second embodiment, the ground electrode protrusion is arranged so that the discharge region 40 is biased upstream in the gas flow direction. The part 20 is formed by being slightly offset upstream in the gas flow direction.

  As described above, according to the third embodiment, the same effects as those of the first and second embodiments described above can be obtained. Further, in the third embodiment, the ground electrode around each through microhole 15 can be obtained. Since the ground electrode protrusion 20 is provided so as to increase the surface height of the electrode 6, the discharge space height between the high voltage electrode 4 is narrowed at a place where the ground electrode protrusion 20 is present, and a high voltage is generated. When applied, since the discharge is generated only in the ground electrode protrusion 20 region, the discharge power can be concentrated only in the discharge region 40 that can contribute to the generation of radicals that can reach the through microhole 15. Therefore, it is possible to realize a surface treatment apparatus in which the gas temperature is not excessively increased.

Embodiment 4 FIG.
FIG. 13 is a cross-sectional view of a surface treatment apparatus according to Embodiment 4 of the present invention, a view of a cross section of a layer in which the conductor 11 of the high-voltage electrode 4 is present, and an upper surface of the ground electrode 6. It is the figure seen from. In the fourth embodiment, the high-voltage conductor 11 of the high-voltage electrode 4 is composed of a plurality of strip-shaped conductors 21 arranged in parallel to each other, and the ground electrode protrusions 20 of the ground electrode 6 are arranged in parallel to each other. The third embodiment is different from the third embodiment in that the plurality of band-shaped protrusions 22 are arranged in the structure, and the plurality of band-shaped conductors 21 and the plurality of band-shaped protrusions 22 are orthogonal to each other. In addition, each strip | belt-shaped conductor 21 is connected by the bus line 14 similarly to the conductor expansion part 13 of Embodiment 2. FIG. In addition, as shown in FIG. 13, the cross-sectional shape of the belt-like protrusion 22 is substantially rectangular. Other configurations are the same as those in the third embodiment.

  Hereinafter, the fourth embodiment will be described with reference to FIG. When a high voltage is applied to the high-voltage electrode 4, the band-shaped strip conductor 21 constituting the high-voltage conductor 11 of the high-voltage electrode 4 and the strip-shaped ground electrode protrusion 20 of the ground electrode 6 overlap each other. Discharge occurs only in the following (hereinafter referred to as the overlap region). The through microholes 15 are formed in the vicinity of these overlap regions, but the center of the through microholes 15 does not coincide with the center of the overlap region, and the discharge region 40 is moved in the gas flow direction as in the second embodiment. The band-shaped protrusion 22 is formed by being slightly offset to the upstream side in the gas flow direction so as to be offset and exist on the upstream side.

  Moreover, the strip | belt-shaped conductor 21 and the strip | belt-shaped projection part 22 do not necessarily need to orthogonally cross, but the overlap area | region which intersects with a fixed angle should just exist. Moreover, it is not necessary to have a uniform width, and the conductor in the non-discharge region may be thin.

  As described above, according to the fourth embodiment, the same effects as those of the first to third embodiments described above can be obtained, and furthermore, in the fourth embodiment, radical generation that can reach the through micropores 15 is achieved. Since the discharge power can be concentrated only in the discharge region that can contribute to the above, it is possible not only to realize a surface treatment apparatus that has good energy efficiency of the treatment and does not excessively increase the gas temperature, but also because the provision of the band-shaped protrusion 22 makes the ground electrode 6 The strength is increased and the distortion of the ground electrode 6 that causes an increase in the internal pressure of the discharge space 1 is suppressed. Even when the ground electrode 6 thinner than the ground electrode 6 used in the third embodiment is used, a stable discharge can be formed. , Radical arrival time is shortened, and more efficient surface treatment can be realized.

Embodiment 5 FIG.
FIG. 14 is a view showing a cross section of a surface treatment apparatus according to Embodiment 5 of the present invention. In the fifth embodiment, a flow path 19 is provided inside the ground electrode 6 for flowing a heat medium of a temperature adjusting fluid, and a metal ground electrode is provided by flowing the heat medium through the flow path 19. It can be controlled at a constant temperature. Since other configurations are the same as those of the first to fourth embodiments, the description thereof is omitted here. FIG. 14 shows a configuration in which the flow path 19 according to the present embodiment is provided in the configuration of the second embodiment shown in FIG. 8. Needless to say, the channel 19 can also be applied to the third and fourth channels.

  Hereinafter, the fifth embodiment will be described with reference to FIG. In the fifth embodiment, the temperature of the ground electrode 6 is controlled by the temperature of the temperature adjusting heat medium that flows through the flow path 19. Specifically, at the initial stage of discharge, a medium having a temperature higher than that of the ground electrode 6 is caused to flow through the flow path 19 to increase the temperature of the ground electrode 6. The medium is caused to flow through the flow path 19 to suppress the temperature rise of the ground electrode 6. The temperature of the heat medium may be changed as appropriate by detecting the temperature of the ground electrode 6 with a temperature sensor or the like. However, two types of temperatures are prepared in advance: a temperature for heating the ground electrode 6 and a temperature for cooling. Alternatively, the temperature of the ground electrode 6 may be adjusted by selecting one of those temperatures prepared in advance.

  As an effect of increasing the temperature of the ground electrode 6 at the initial stage of discharge, there is an effect that the conversion of oxygen radicals to ozone (O3) can be suppressed and efficient surface treatment with oxygen radicals can be realized. On the other hand, as an effect of cooling the temperature of the ground electrode 6 when the discharge is continuously performed, the temperature of the ground electrode 6 rises in the case of continuous discharge for a long time. In addition, it is possible to prevent an excessive increase in gas temperature, prevent damage such as electrode cracking due to thermal stress, and perform surface treatment on an organic processing object such as heat-sensitive resin. effective.

  For example, air, water, oil, an organic solvent, or the like can be used as a temperature adjusting heat medium that flows through the flow path 19. Moreover, although the example which provides the flow path 19 in the ground electrode 6 was demonstrated, if it has a function which adjusts the temperature of the ground electrode 6, it is thermally applied to the ground electrode 6 by brazing, welding, etc., for example. It may be arranged in close contact with the ground electrode 6.

  As described above, in the present embodiment, the same effects as those of the first to fourth embodiments can be obtained. Further, in the present embodiment, a flow path for flowing a heat medium for temperature adjustment. In the initial stage of discharge, a medium having a temperature higher than that of the ground electrode 6 is passed through the flow path 19 to increase the temperature of the ground electrode 6. On the other hand, when the discharge is continuously performed, Since the medium is flowed through the flow path 19 to suppress the temperature rise of the ground electrode 6, the conversion of oxygen radicals to ozone (O 3) can be suppressed at the initial stage of discharge, and efficient surface treatment with oxygen radicals is possible. On the other hand, when the discharge is continuously performed, an excessive increase in gas temperature is prevented, damage such as electrode cracking due to thermal stress is prevented, and an organic processing object such as a heat-sensitive resin Surface treatment for It is possible.

  DESCRIPTION OF SYMBOLS 1 Discharge space, 2 Holding lid, 3 Side frame, 4 High voltage electrode, 5 Spacer, 6 Ground electrode, 7 Heat spreader, 8 Rubber-like elastic body, 11 High voltage conductor, 12 Dielectric coating, 13 Conductor expansion part, 14 Bus Line, 15 Through-hole, 16 Insulator, 17 Feed bar, 18 Conductive elastic body, 19 Channel, 20 Ground electrode protrusion, 21 Strip conductor, 22 Strip ground electrode protrusion, 30 High frequency high voltage power supply, 40 Discharge Area, 41 Active particle containing gas, 42 Gas flow direction, 43 Supply gas, 51 End spacer, 52 Discharge part spacer.

Claims (7)

A flat high voltage electrode having a high voltage conductor coated with a dielectric;
A ground electrode having a conductor surface disposed opposite to the high-voltage electrode and having through-holes formed therein;
A discharge space formed between the high-voltage electrode and the ground electrode;
Gas supply means for introducing gas into the discharge space;
A high-frequency high-voltage power source for applying an alternating voltage to the high-voltage electrode,
A gas is introduced into the discharge space at a predetermined speed, and a discharge is generated by applying the alternating voltage to the high-voltage electrode in a state where the pressure in the discharge space is kept higher than the outlet pressure of the through-hole. A surface treatment apparatus for performing a surface treatment of the object to be treated by spraying a gas containing active particles generated by the discharge from the through fine holes to the object to be treated that is opposed to the through fine holes. Because
The end portion of the high-voltage conductor is located at a position shifted to the upstream side in the gas flow direction in the discharge space from the installation position of the through-holes provided in the ground electrode disposed to face the high-voltage conductor. The high-voltage conductor is arranged to be present,
The ground electrode has a ground electrode projection formed by projecting a part of the ground electrode to the high-voltage electrode side around the through-hole,
The surface treatment apparatus, wherein the ground electrode protrusion is provided at a position shifted to the upstream side in the gas flow direction in the discharge space from the installation position of the through hole. A flat high voltage electrode having a high voltage conductor coated with a dielectric;
A ground electrode having a conductor surface disposed opposite to the high-voltage electrode and having through-holes formed therein;
A discharge space formed between the high-voltage electrode and the ground electrode;
Gas supply means for introducing gas into the discharge space;
A high-frequency high-voltage power source for applying an alternating voltage to the high-voltage electrode,
A gas is introduced into the discharge space at a predetermined speed, and a discharge is generated by applying the alternating voltage to the high-voltage electrode in a state where the pressure in the discharge space is kept higher than the outlet pressure of the through-hole. A surface treatment apparatus for performing a surface treatment of the object to be treated by spraying a gas containing active particles generated by the discharge from the through fine holes to the object to be treated that is opposed to the through fine holes. Because
The end portion of the high-voltage conductor is located at a position shifted to the upstream side in the gas flow direction in the discharge space from the installation position of the through-holes provided in the ground electrode disposed to face the high-voltage conductor. The high-voltage conductor is arranged to be present,
The ground electrode has a band-shaped protrusion formed by protruding a part of the ground electrode into a band shape on the high-voltage electrode side in the vicinity of the through-hole,
The high-voltage conductor of the high-voltage electrode is composed of a strip-shaped conductor,
The band-shaped protrusion and the band-shaped conductor overlap at a certain angle,
The surface treatment apparatus characterized in that the overlapping region is provided at a position shifted to the upstream side in the gas flow direction in the discharge space from the installation position of the through-hole. The gas supply means includes
When the gas is air,
Surface treatment apparatus according to claim 1 or 2 gas flow rate of the gas flow in the discharge space, characterized in that the introduction of the adjustment to the gas to be equal to or greater than the 10 m / s. The gas supply means includes
When the gas is a nitrogen discharge in a nitrogen gas, the gas flow rate at the outlet of the through-hole is at a speed exceeding 50 m / s,
When the gas is an air discharge in the air, the gas flow rate at the outlet of the through-hole is at a speed exceeding 100 m / s.
The surface treatment apparatus according to any one of claims 1 to 3 , wherein the gas is introduced. The high voltage electrode has an exposed portion not covered with the dielectric;
The high-frequency high-voltage power source is a device in which a conductive member is brought into contact with the exposed portion of the high-voltage electrode, and the alternating voltage is applied via the conductive member.
Surface treatment apparatus according to any one of claims 1 to 4 a part or the whole of the conductive member is characterized by being composed of an elastic material. Wherein a flow path for flowing a medium for temperature adjustment to adjust the temperature of the ground electrode, any one of claims 1, characterized in that provided on either the inside or outside of the ground electrode 5 1 The surface treatment apparatus according to item. The heat spreader surface treatment apparatus according to any one of claims 1 to 6, characterized by being composed of alumina or a nitride ceramic.

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