JP5724641B2 - IC tag and method of manufacturing IC tag - Google Patents

Description

  The present invention relates to an IC tag and a method for manufacturing such an IC tag.

  In recent years, IC tags capable of reading and writing information in a non-contact manner are attached to products to enable management of various information required in the market. Such IC tags are used in many fields such as books, transportation, distribution, and handling of luggage, and various types of IC tags are known.

  For example, Patent Document 1 describes a material in which a gel substance is filled between an exterior body and an inlet in order to relieve bending stress applied to an IC tag and prevent disconnection of an antenna.

  Patent Document 2 describes an IC tag package that can prevent internal components from being damaged due to external mechanical shocks, etc. In this IC tag package, a resin film and a gel resin are enclosed. Thus, the buffer layer is formed by heating and pressurizing.

  In Patent Document 3, a re-adhesive sheet 15 in which a base sheet 16 and a self-adhesive resin or a washable adhesive material 17 are laminated, an inlay adhesive material 14, an inlay 13, and a surface base material 11 are sequentially provided. An RFID label laminated and bonded is disclosed.

JP 2010-250504 A Japanese Patent Laid-Open No. 11-102424 Utility Model Registration No. 3120052

  However, although the IC tags described in Patent Documents 1 and 2 have a shock-absorbing property against external impacts, they are entirely covered with an exterior film, and thus do not have self-adhesiveness or re-adhesiveness. In this case, in order to attach the IC tag to the adherend, an adhesive material is separately required.

  On the other hand, the IC tag of Patent Document 3 has self-adhesiveness and re-adhesiveness, but simply has a structure in which a re-adhesion sheet is provided on one side of the inlet, so that it particularly lacks cushioning and impact resistance from the side. Conceivable.

  The present invention has been made in consideration of such points, and has an IC tag and a method of manufacturing the IC tag that have self-adhesiveness, can be reapplied, and have improved buffering and impact resistance. The purpose is to provide.

The present invention relates to an IC tag, an inlet including an inlet base, an antenna provided on the inlet base, an IC chip bonded to the antenna, a bottom surface on which the inlet is placed, and a side surface extending from the bottom surface. A support base that is open on one side, and a cushioning material that is filled in the support base and is partially exposed from the one side opening of the support base and has self-adhesiveness. Ri Do from the gel material, the supporting substrate is an IC tag comprising the cured gel material.

  The present invention is the IC tag, wherein the gel material is made of urethane resin or acrylic resin.

  The present invention is the IC tag, wherein the moisture content of the gel material is 0.01% by weight to 1.0% by weight.

  The present invention is the IC tag characterized in that the entire one side of the support base material is open as viewed from the plane.

  The present invention is an IC tag characterized in that a part of one side of a supporting substrate is opened when viewed from a plane.

  The present invention is an IC tag characterized in that a release sheet is attached to the surface of a portion exposed from one side opening of the cushioning material.

  The present invention relates to an IC tag manufacturing method for manufacturing an IC tag, a step of producing a support base material by curing a curable gel material in a mold, and a step of placing an inlet on the bottom surface of the support base material And a step of filling a self-adhesive cushioning material in the support base material.

  According to the present invention, the support substrate has a bottom surface on which the inlet is placed and a side surface extending from the bottom surface, and one side thereof is open, and the cushioning material is filled in the support substrate. The part is exposed from one side opening of the supporting base material and has self-adhesiveness. As a result, it is possible to realize both reattachment of the IC tag and enhancement of cushioning and impact resistance.

FIG. 1 is a cross-sectional view showing an IC tag according to a first embodiment of the present invention (a cross-sectional view taken along the line II in FIG. 2). FIG. 2 is a plan view showing the IC tag according to the first embodiment of the present invention. FIG. 3 is a cross-sectional view showing the IC tag according to the first embodiment of the present invention, to which a release sheet is attached. FIG. 4 is a cross-sectional view showing a method of manufacturing an IC tag according to the first embodiment of the present invention. FIG. 5 is a cross-sectional view showing a state where the IC tag according to the first embodiment of the present invention is attached to an adherend. FIG. 6 is a cross-sectional view showing a state where the IC tag according to the first embodiment of the present invention is attached to an adherend. FIG. 7 is a cross-sectional view showing a state where the IC tag according to the first embodiment of the present invention is attached to an adherend. FIG. 8 is a sectional view showing an IC tag according to the second embodiment of the present invention (sectional view taken along line VIII-VIII in FIG. 9). FIG. 9 is a plan view showing an IC tag according to a second embodiment of the present invention. FIG. 10 is a cross-sectional view showing an IC tag according to a second embodiment of the present invention, to which a release sheet is attached. 11 is a cross-sectional view showing an IC tag according to a third embodiment of the present invention (cross-sectional view taken along line XI-XI in FIG. 9). FIG. 12 is a plan view showing an IC tag according to a third embodiment of the present invention. FIG. 13 is a cross-sectional view showing an IC tag according to a third embodiment of the present invention, to which a release sheet is attached. FIG. 14 is a cross-sectional view showing a method of manufacturing an IC tag according to the third embodiment of the present invention. FIG. 15 is a cross-sectional view showing a state where an IC tag according to a comparative example is attached to an adherend.

First Embodiment Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. 1 to 7 are views showing a first embodiment of the present invention.

  First, the outline of the IC tag according to the present embodiment will be described with reference to FIGS.

  As shown in FIGS. 1 to 3, the IC tag 10 according to the present embodiment includes an inlet 20, a support base 30 that supports the inlet 20, and a buffer material 40 filled in the support base 30. ing.

  Among these, the inlet 20 includes an elongated flat plate-like inlet base material 21, an antenna 22 provided on the inlet base material 21, and an IC chip 23 bonded to the antenna 22.

  The inlet substrate 21 may be a plastic film or paper, such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride. , Various materials such as vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, polystyrene, ABS, polyacrylic ester, polypropylene, polyethylene, polyurethane, resin impregnated paper, coated paper, etc. Can be used. In addition, the thickness of the inlet base material 21 can be 20 micrometers-100 micrometers, for example, and can typically be 50 micrometers.

  The antenna 22 includes a central portion 22a and zigzag end portions 22b provided on both sides of the central portion 22a. Of these, the IC chip 23 is mounted at one location of the central portion 22a.

  In addition, as a material of the antenna 22, metals or alloys, such as aluminum, copper, a copper alloy, phosphor bronze, SUS, silver, can be mentioned. Further, the antenna 22 can have various planar shapes, and may be a loop shape, a spiral coil shape, a patch shape, or other shapes in addition to the zigzag shape described above. The thickness of the antenna 22 can be set to, for example, 10 μm to 50 μm, and typically 25 μm.

  The IC chip 23 has a data storage area (memory), and an ordinary chip having an input / output function, a control function, signal modulation, demodulation, and a control function can be used. The IC chip 23 receives power and signals obtained from the antenna 22 and performs writing and reading of the memory. As the IC chip 23, an IC chip made of a single component may be mounted, or an interposer may be mounted. The thickness of the IC chip 23 can be set to, for example, 150 μm to 250 μm.

  On the other hand, the support base material 30 that supports the inlet 20 has a U-shaped or concave cross-section (see FIGS. 1 and 3), a bottom surface 31 on which the inlet 20 is placed, and side portions of the bottom surface 31. And a side surface 32 extending upward. Of these, the bottom surface 31 has a rectangular shape as viewed from above. The side surface 32 is provided over the entire outer periphery of the bottom surface 31 and has a rectangular shape when viewed from the plane. In addition, the support base 30 is open on one side (the upper side in FIG. 1), and an opening 33 is formed. In the present specification, that the entire support base 30 is open means that the entire region located inside the side surface 32 is open.

  In the present embodiment, the bottom surface 31 of the support base material 30 has a rectangular shape as viewed from above, but is not limited to this, and is, for example, a circular shape, an elliptical shape, or a polygonal shape such as a triangle. It may consist of

  As a material of the support substrate 30, polypropylene (PP), polyethylene (PE), polyethylene terephthalate (PET), ABS resin, or the like can be used. In addition, the thickness of the bottom face 31 among the support base materials 30 can be 0.5 mm-5.0 mm, for example, and the thickness of the side surface 32 can be 0.5 mm-5.0 mm, for example.

  Further, the buffer material 40 is filled so as to cover the inlet 20 in the support base material 30, and a part thereof is exposed from the opening 33 on one side of the support base material 30 (upper side in FIG. 1). In this case, the buffer material 40 is filled in the entire inside of the side surface 32. In FIG. 1, the buffer material 40 is shown to rise from the opening 33, but the buffer material 40 may be provided flush with the upper end 32 a of the side surface 32.

  The buffer material 40 is made of a self-adhesive gel material (hereinafter also simply referred to as a gel material 40). In addition, self-adhesive means the property which can be easily affixed to a to-be-adhered body with the adhesive force of itself, without using an adhesive agent or an adhesive. Further, the gel material 40 once adhered is in close contact with the adherend and does not easily peel off even when a horizontal force is applied or is rubbed by another object, but the finger or the like from the end. When peeled off, it has the property of easily peeling off. Furthermore, the gel material 40 can be reapplied after being peeled off (has re-adhesiveness).

  It is preferable that the gel material which comprises such a buffer material 40 consists of urethane type resin, such as a polyurethane gel, or acrylic resin. In particular, it does not contain much water, and is preferably made of a gel material having a water content of 0.01% by weight to 1.0% by weight, for example. The reason is that if the gel material 40 contains a lot of water, the gel material 40 shortens the communication distance of the IC chip 23, which is not preferable.

  As the adhesive strength of the gel material 40, the ball No. in the inclined ball tack test (test based on JIS Z 0237) was used. It preferably has an adhesive strength of 1 or more. More preferably, it has an adhesive strength of 4 or more. The upper limit of the adhesive strength is not particularly limited, but considering practicality at the time of re-adhesion, the ball No. It is preferable to be about 20.

  In addition, as shown in FIG. 3, the peeling sheet 50 may be affixed on the surface of the part exposed from the opening 33 of one side among the buffer materials 40. FIG. In this case, by peeling the release sheet 50, the buffer material 40 is exposed from the opening 33, and the IC tag 10 can be attached to the adherend 60 (see FIG. 5).

  The release sheet 50 can be made of a paper base material coated with a low contact angle drug (usually silicone). Fine paper, kraft paper, glassine paper, parchment paper, supercalendered paper, etc. are used as the paper base material. These can be directly coated with silicone, or coated with polyethylene or clay / binder, and then coated with silicone. May be used. PET, OPP (biaxially oriented polypropylene), and PE can be used as they are, or coated with silicone and used as a release paper substrate.

  Next, a method for manufacturing such an IC tag 10 will be described with reference to FIGS.

  First, the support base material 30 which has the bottom face 31 which mounts the inlet 20, and the side surface 32 extended upwards from the side part of the bottom face 31 is produced (FIG. 4A). In this case, the support base material 30 can be produced by, for example, injection molding using polypropylene (PP), polyethylene (PE), polyethylene terephthalate (PET), ABS resin, or the like.

  Next, an inlet 20 including an inlet base material 21, an antenna 22, and an IC chip 23 is prepared in advance, and this inlet 20 is placed on the bottom surface 31 of the support base material 30 (FIG. 4B). ). In this case, the inlet 20 may be fixed to the bottom surface 31 by applying an adhesive to the back surface of the inlet base material 21.

  Subsequently, the support material 30 is filled with a buffer material 40 having self-adhesiveness (FIG. 4C). In this case, the buffer material 40 in the liquid state is injected from the opening 33 using the nozzle 45 for filling.

  After filling a predetermined amount of the buffer material 40, the buffer material 40 is cured in the support base material 30 (FIG. 4D). When the buffer material 40 consists of polyurethane gel, the buffer material 40 can be hardened by heating the buffer material 40 to the temperature of 25 to 85 degreeC, for example.

  In this manner, the IC tag 10 including the inlet 20, the support base material 30 that supports the inlet 20, and the buffer material 40 filled in the support base material 30 is obtained.

  Next, the release sheet 50 is affixed to the surface of the portion exposed from the one-side opening 33 in the buffer material 40 (FIG. 4E).

  In the above, after the cushioning material 40 is cured (FIG. 4D), the release sheet 50 is attached to the cushioning material 40 (FIG. 4E). The buffer material 40 may be cured after the release sheet 50 is attached.

  Next, the operation of the IC tag 10 having such a configuration will be described with reference to FIGS.

  As shown in FIG. 5, the IC tag 10 is attached to the adherend 60 with the release sheet 50 peeled off and the cushioning material 40 facing the adherend 60 side. At this time, the buffer material 40 is bonded to the adherend 60, and the bottom surface 31 of the support base 30 faces the opposite side of the adherend 60 (upward in FIG. 5).

  In this case, the buffer material 40 has self-adhesiveness that can be attached to the adherend 60. Therefore, when the IC tag 10 is attached to the adherend 60, the IC tag 10 can be easily attached to the adherend 60 simply by peeling off the release sheet 50 without using a separate adhesive or adhesive. it can. Moreover, after peeling off the IC tag 10 from the adherend 60, it can be re-applied to the adherend 60 (having re-adhesiveness).

  Here, it is considered that an impact is applied to the bottom surface 31 and the side surface 32 of the IC tag 10. In this case, the stress generated inside the IC tag 10 is dispersed or absorbed by the flexibility of the buffer material 40, thereby reducing the impact applied to the IC chip 23 (the buffering property is enhanced).

  Specifically, as shown in FIG. 6, when an impact is applied to the bottom surface 31, this impact is dispersed or absorbed by the cushioning material 40 filled in the support base 30 (see the arrow in FIG. 6). That is, the stress due to impact does not concentrate on a specific location. As a result, the stress applied to the IC chip 23 can be relaxed.

  In the present embodiment, the buffer material 40 is bonded to the bottom surface 31 and the side surface 32 inside the support base material 30. Accordingly, as shown in FIG. 7, when an impact is applied to the side surface 32, the stress due to the impact is dispersed or absorbed by the buffer material 40, and the stress is not concentrated at a specific location. This prevents the IC tag 10 from being peeled from the adherend 60 (impact peel resistance is improved) (see arrow in FIG. 7).

  Further, in the present embodiment, since the buffer material 40 is filled in the support base material 30, the buffer material 40 and the support base material 30 (the bottom surface 31) are larger than the bonding area between the buffer material 40 and the adherend 60. Further, the adhesion area with the side surface 32) is wider. Thus, when the IC tag 10 is peeled from the adherend 60, the buffer material 40 can be reliably peeled from the adherend 60, and the support base material 30 remains attached to the adherend 60. There is no risk that only will peel off.

Second Embodiment Next, a second embodiment of the present invention will be described with reference to the drawings. 8 to 10 are views showing a second embodiment of the present invention. The second embodiment shown in FIGS. 8 to 10 is different from the plan view in that a part of one side of the support base 30A is opened, and the other configuration is the first embodiment described above. This is substantially the same as the embodiment. 8 to 10, the same parts as those of the first embodiment shown in FIGS. 1 to 7 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 8 to 10, the IC tag 10A according to the present embodiment includes an inlet 20, a support base 30A that supports the inlet 20, and a cushioning material 40 filled in the support base 30A. ing.

  In the present embodiment, the support base 30 </ b> A is provided with a bottom surface 31 on which the inlet 20 is placed, a side surface 32 that extends upward from the side of the bottom surface 31, and a ceiling that covers a part of the bottom surface 31. Surface 34.

  In this case, the support base material 30 </ b> A has an opening on a part of one side (the upper side in FIG. 8), and an opening 33 is formed on a part of the top surface 34. The cushioning material 40 is exposed from the opening 33 provided on one side of the support base material 30A. In the present specification, that a part of the support base 30A is opened means that a part of the region located inside the side surface 32 is opened.

  As the material of the supporting base material 30A, for example, polypropylene (PP), polyethylene (PE), polyethylene terephthalate (PET), ABS resin, or the like is used similarly to the material of the supporting base material 30 in the first embodiment described above. Can do.

  In addition, the configurations of the inlet 20, the buffer material 40, and the release sheet 50 are the same as those in the first embodiment, and detailed description thereof is omitted here.

Third Embodiment Next, a third embodiment of the present invention will be described with reference to the drawings. 11 to 14 are views showing a third embodiment of the present invention. The third embodiment shown in FIGS. 11 to 14 is different in that the support base material 30B is made of a curable gel material, and other configurations are substantially the same as those in the first embodiment described above. . 11 to 14, the same parts as those of the first embodiment shown in FIGS. 1 to 7 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 11 to 13, the IC tag 10B according to the present embodiment includes an inlet 20, a support base material 30B that supports the inlet 20, and a cushioning material 40 filled in the support base material 30B. ing.

  In the present embodiment, the support base material 30 </ b> B has a bottom surface 31 on which the inlet 20 is placed and a side surface 32 that extends upward from a side portion of the bottom surface 31. In this case, one side (the upper side in FIG. 11) of the support base material 30 </ b> B is open over the whole, and an opening 33 is formed.

  In the present embodiment, support substrate 30B is made of a curable gel material. Specific examples of the material of the support base material 30B include urethane resins such as polyurethane gel or acrylic resins. In this case, support base material 30B and buffer material 40 may consist of the same kind of gel material, and may consist of a different kind of gel material. In addition, the thickness of the bottom face 31 of the support base material 30B can be set to 1.0 mm to 5.0 mm, for example, and the thickness at the upper end 32a of the side surface 32 can be set to 1.0 mm to 5.0 mm, for example.

  Further, a part of the buffer material 40 is exposed from the opening 33 on one side (the upper side in FIG. 11) of the support base material 30B.

  As shown in FIG. 11, in the present embodiment, the side surface 32 of the support base material 30B has a cross-sectional shape with a curved inner lower end 32b. However, the present invention is not limited to this, and FIG. Similar to the first embodiment shown, the lower end of the side surface 32 may have a linear cross-sectional shape.

  In addition, the configurations of the inlet 20, the buffer material 40, and the release sheet 50 are the same as those in the first embodiment, and detailed description thereof is omitted here.

  Next, a manufacturing method of the IC tag 10B having such a configuration will be described with reference to FIGS.

  First, a liquid component constituting a curable gel material, for example, a urethane resin such as polyurethane gel or an acrylic resin is injected into the mold 65. The mold 65 has an internal shape corresponding to the support base material 30B. Next, the liquid component is cured in the mold 65, thereby producing the support base 30B (FIG. 14A). In this case, by adding a curing agent to the liquid component constituting the curable gel material in advance, the degree of cure of the gel material is increased, and the gel material is cured so as not to have self-adhesiveness. be able to.

  After the support base 30B is cured, the support base 30B is taken out from the mold 65 (FIG. 14B). The support base material 30 </ b> B thus obtained has a bottom surface 31 on which the inlet 20 is placed and a side surface 32 that extends upward from a side portion of the bottom surface 31.

  Next, an inlet 20 including an inlet base material 21, an antenna 22, and an IC chip 23 is prepared in advance, and this inlet 20 is placed on the bottom surface 31 of the support base material 30B (FIG. 14C). ). In this case, the inlet 20 may be fixed to the bottom surface 31 by applying an adhesive to the back surface of the inlet base material 21.

  Subsequently, the buffer material 40 having self-adhesiveness is filled in the support base material 30B (FIG. 14D). In this case, the buffer material 40 in the liquid state is injected from the opening 33 using the nozzle 45 for filling.

  After filling a predetermined amount of the buffer material 40, the buffer material 40 is hardened in the support base material 30B (FIG. 14E). When the buffer material 40 is made of polyurethane gel, for example, the buffer material 40 can be cured by heating the buffer material 40 to a temperature of 25 ° C. to 80 ° C. In this way, the IC tag 10B shown in FIG. 11 is obtained.

  Next, the release sheet 50 is attached to the surface of the portion exposed from the one-side opening 33 in the cushioning material 40 (FIG. 14F).

  In the above, after the cushioning material 40 is cured (FIG. 14 (e)), the release sheet 50 is attached to the cushioning material 40 (FIG. 14 (f)). The buffer material 40 may be cured after the release sheet 50 is attached to the substrate.

  By the way, it is also possible to combine the second embodiment shown in FIGS. 8 to 10 and the third embodiment shown in FIGS. That is, in FIGS. 11 to 14, the support base material 30 </ b> B may have a top surface, and only a part of one side of the support base material 30 </ b> B may be opened as viewed from the plane.

Comparative Example Here, an example of an IC tag according to a comparative example will be described. FIG. 15 is a cross-sectional view showing a state where an IC tag according to a comparative example is attached to an adherend. In FIG. 15, the same parts as those in the embodiment shown in FIGS. 1 to 7 are denoted by the same reference numerals.

  In FIG. 15, the support base material 130 of the IC tag 100 has a bottom surface 131, a side surface 132, and a top surface 134. Of these, no opening is formed in the top surface 134, and the entire bottom surface 131 is covered by the top surface 134. In this case, the support base material 130 has a rectangular cross section, and a cavity 135 is formed inside thereof. In addition, the gel material 140 is attached to the entire outside region of the top surface 134, and thereby the IC tag 100 is attached to the adherend 60.

  However, in the IC tag 100 shown in FIG. 15, for example, when an impact is applied from the side surface 132 (see the arrow in FIG. 15), the stress due to the impact is not dispersed. For this reason, stress tends to concentrate on the region P between the side surface 132 and the top surface 134, and as a result, the IC tag 100 is easily peeled off from the adherend 60.

  On the other hand, according to the present invention, when the impact is applied to the side surface 32 as described above, the shock absorbing material 40 in the support base material 30 disperses or absorbs the stress due to the impact, so that the IC tag 10 is attached. Peeling from the body 60 can be prevented.

10, 10A, 10B IC tag 20 Inlet 21 Inlet base material 22 Antenna 23 IC chip 30, 30A, 30B Support base material 31 Bottom surface 32 Side surface 33 Opening 34 Top surface 40 Buffer material 50 Release sheet 60 Substrate

Claims (7)

In IC tag,
An inlet including an inlet base, an antenna provided on the inlet base, and an IC chip bonded to the antenna;
A support substrate having a bottom surface on which the inlet is placed, a side surface extending from the bottom surface, and one side opening;
The support base material is filled, and a part of the support base material is exposed from one side opening of the support base material and has a self-adhesive cushioning material,
Cushioning material, Ri Do from the gel material, the supporting substrate, IC tag comprising the cured gel material.   2. The IC tag according to claim 1, wherein the gel material is made of urethane resin or acrylic resin.   The IC tag according to claim 2, wherein the moisture content of the gel material is 0.01 wt% to 1.0 wt%.   The IC tag according to any one of claims 1 to 3, wherein one side of the support base is open as viewed from a plane.   The IC tag according to any one of claims 1 to 3, wherein a part of one side of the support base is open as viewed from a plane.   The IC tag according to any one of claims 1 to 5, wherein a release sheet is attached to a surface of a portion of the cushioning material exposed from the one side opening. In the manufacturing method of the IC tag which manufactures the IC tag of Claim 1 ,
A step of producing a support substrate by curing a curable gel material in a mold;
Placing the inlet on the bottom surface of the support substrate;
And a step of filling a self-adhesive cushioning material in the support substrate.

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