JP5709991B2 - 圧力センサ - Google Patents
圧力センサ Download PDFInfo
- Publication number
- JP5709991B2 JP5709991B2 JP2013518126A JP2013518126A JP5709991B2 JP 5709991 B2 JP5709991 B2 JP 5709991B2 JP 2013518126 A JP2013518126 A JP 2013518126A JP 2013518126 A JP2013518126 A JP 2013518126A JP 5709991 B2 JP5709991 B2 JP 5709991B2
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- JP
- Japan
- Prior art keywords
- electrode
- piezoelectric film
- pressure sensor
- piezoelectric
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000007423 decrease Effects 0.000 claims description 14
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- 239000010408 film Substances 0.000 description 131
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- 238000010438 heat treatment Methods 0.000 description 7
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- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
- 238000001755 magnetron sputter deposition Methods 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
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- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 3
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
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- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910019589 Cr—Fe Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
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- 229910052786 argon Inorganic materials 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
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- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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- 238000004528 spin coating Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Description
11、21:第1の電極
12、22:第2の電極
13、23:圧電膜
14、24:相互拡散層
15:被覆材
Claims (5)
- 異なる極の第1の電極および第2の電極と、前記第1の電極の主面と前記第2の電極の主面との間に配置された圧電体とを含む圧力センサにおいて、前記第1の電極の側面または側面から主面にかけて電気的接続のための接続部を有し、前記圧電体は前記接続部を除く前記第1の電極の主面および側面に被着されているとともに、前記圧電体の端部と前記第1の電極との間に相互拡散層があることを特徴とする圧力センサ。
- 前記第1の電極の側面および主面の全ての領域に前記圧電体が被着されているとともに、前記第1の電極の側面または側面から主面にかけて前記圧電体に開口部が設けられていて、前記接続部は前記圧電体の開口部から露出する前記第1の電極の一部であり、前記圧電体の端部が前記開口部の周縁に位置する前記圧電体の縁であることを特徴とする請求項1に記載の圧力センサ。
- 前記圧電体の端部の全ての領域と前記第1の電極との間に相互拡散層があることを特徴とする請求項1または請求項2に記載の圧力センサ。
- 前記第1の電極の側面に位置する前記圧電体の端部は被覆材にて被覆されていることを特徴とする請求項1または請求項2に記載の圧力センサ。
- 前記相互拡散層は前記接続部から遠ざかるにしたがって厚みが薄くなることを特徴とする請求項1乃至請求項4のうちいずれかに記載の圧力センサ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013518126A JP5709991B2 (ja) | 2011-05-30 | 2012-05-30 | 圧力センサ |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011120653 | 2011-05-30 | ||
JP2011120653 | 2011-05-30 | ||
JP2013518126A JP5709991B2 (ja) | 2011-05-30 | 2012-05-30 | 圧力センサ |
PCT/JP2012/063945 WO2012165486A1 (ja) | 2011-05-30 | 2012-05-30 | 圧力センサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2012165486A1 JPWO2012165486A1 (ja) | 2015-02-23 |
JP5709991B2 true JP5709991B2 (ja) | 2015-04-30 |
Family
ID=47259338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013518126A Active JP5709991B2 (ja) | 2011-05-30 | 2012-05-30 | 圧力センサ |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5709991B2 (ja) |
WO (1) | WO2012165486A1 (ja) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02132870A (ja) * | 1988-11-14 | 1990-05-22 | Toyota Motor Corp | 積層圧電素子 |
JP4590868B2 (ja) * | 2003-02-12 | 2010-12-01 | 株式会社デンソー | 積層型圧電体素子及びその製造方法 |
JP4741197B2 (ja) * | 2004-05-06 | 2011-08-03 | 京セラ株式会社 | 積層型圧電素子およびこれを用いた噴射装置 |
-
2012
- 2012-05-30 JP JP2013518126A patent/JP5709991B2/ja active Active
- 2012-05-30 WO PCT/JP2012/063945 patent/WO2012165486A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JPWO2012165486A1 (ja) | 2015-02-23 |
WO2012165486A1 (ja) | 2012-12-06 |
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