JP5707916B2 - Semiconductor cooling device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a structure of a semiconductor cooling device and a manufacturing method thereof.

  In hybrid vehicles and electric vehicles, power converters such as an inverter for converting DC power of a battery into three-phase AC power for driving a motor and a boost converter for converting battery voltage into a voltage for driving a motor are often used. ing. This power converter performs power conversion and voltage conversion by switching operation of a switching element such as an IGBT. In recent years, as electric vehicles and hybrid vehicles have become larger, switching elements have also turned on and off large currents. On the other hand, since the switching element generates a large amount of heat during operation, such a power converter is provided with a water-cooling type cooling device that cools the switching element.

  In a water-cooled cooling device, a casing that covers a cooling fin portion of a heat sink in which a cooling fin is attached is attached to the back side of a flat plate on which a switching element, which is a semiconductor element, is attached. Is used to cool the semiconductor element (see, for example, Patent Document 1).

JP2007-1110025

  However, when the cooling water flows around the heat sink, the cooling water flows in the gap between the tip of the heat sink and the inner surface of the casing, which may cause a short path of the cooling water and reduce the cooling efficiency. there were. Therefore, Patent Document 1 proposes that a cushion material is sandwiched between the tip of the heat sink and the inner surface of the casing to prevent this short path and improve the cooling efficiency.

  However, the method proposed in Patent Document 1 has a problem that the structure becomes complicated because it is necessary to separately attach a cushion material in the casing through which the cooling water flows.

  Therefore, an object of the present invention is to improve the cooling efficiency of a semiconductor cooling device with a simple configuration.

The semiconductor cooling device of the present invention is a semiconductor cooling device that cools a semiconductor element with cooling water, wherein the semiconductor element is attached to one surface and a cooling projection is provided on the other surface. A plate, a side wall of each cooling water channel protruding in a direction along the protruding direction of the protrusion from both side ends of the semiconductor element cooling plate, and the semiconductor element cooling plate between the semiconductor element cooling plate and the protrusion of the semiconductor element cooling plate of the base plate defining the first gap, projecting in the direction opposite to the semiconductor element cooling plate from said base plate, it extends in the flow direction of the cooling water and a partition plate for partitioning the cooling water flow path, of the base plate A cooling water channel partition member disposed with a second gap between the side end surface and the inner surface of each of the cooling water channel side walls, and the cooling water channel partition member is arranged on the semiconductor element cooling plate. Tip of protrusion There characterized Rukoto are molded integrally in a state of biting into the surface of the base plate.

  The method for manufacturing a semiconductor cooling device of the present invention includes a first upper mold on which a semiconductor element cooling plate provided with a cooling projection is set, and the semiconductor element cooling plate that is aligned with the first upper mold. And a first lower mold for forming a first space at a side end of the semiconductor element, and a first gap between the semiconductor element cooling plate and the semiconductor element cooling plate that is in contact with the protrusion of the semiconductor element cooling plate A second lower mold having a third recess for forming a cooling water flow path partition member having a base plate to be formed, and a second lower mold for forming the cooling water flow path partition member in alignment with the second lower mold. A step of preparing a second upper mold for forming a space; and a combination of the first upper mold and the first lower mold, and injecting resin into the first space to cool the semiconductor element cooling plate Insert molding, combining the second upper mold and the second lower mold, A step of injecting resin into the space to form the cooling water flow path partition member, and the first upper mold, the first lower mold, the second upper mold, and the second lower mold, respectively The first upper mold and the first lower mold are separated while the semiconductor element cooling plate insert-molded in the first upper mold remains in a state of a predetermined temperature or more, and the second The step of separating the second upper mold and the second lower mold in a state where the cooling water flow path partition member formed in the lower mold remains, and the cooling of the semiconductor element remaining in the first upper mold Aligning the first upper mold on the second lower mold so that the tip of the projection of the plate bites into the surface of the cooling water flow path partition member remaining on the second lower mold; It is characterized by including.

  In the method for manufacturing a semiconductor cooling device of the present invention, the tip of the protrusion of the semiconductor element cooling plate is aligned with the first upper mold and the first lower mold when set to the first upper mold. The second upper mold is aligned with the third recess to form a second space for forming the cooling water flow path partition member. It is also suitable as having a recessed part.

  In the method for manufacturing a semiconductor cooling device of the present invention, the step of aligning the first upper mold on the second lower mold includes sliding the second lower mold or the first upper mold. It is also preferable that the second lower mold and the first upper mold are combined.

  In the method for manufacturing a semiconductor cooling device of the present invention, the first space of the first upper mold is each upper cooling water flow path protruding in a direction along the protruding direction of the protrusion from both side ends of the semiconductor element cooling plate. Forming a side wall, and the second lower mold includes each second recess for forming each lower cooling water flow channel side wall disposed at a position corresponding to each upper cooling water flow channel side wall, The step of insert molding injects resin into the first space to simultaneously mold the upper cooling water flow channel side walls, and the step of molding the cooling water flow channel partition member includes resin in the second recesses. The first upper mold is separated from the first lower mold in a state where the molded upper cooling water channel side walls remain, and the second upper cooling water channel side walls are formed simultaneously. The lower mold retains the side walls of the lower cooling water passages that have been molded. In this state, resin is injected between each of the upper cooling water flow channel side walls separated from the second upper mold and remaining in the first upper mold and each lower cooling water flow channel side wall remaining in the second lower mold. It is also preferable to include a step of joining each of the upper cooling water flow channel side walls and each of the lower cooling water flow channel side walls.

  The present invention has an effect that the cooling efficiency of the semiconductor cooling device can be improved with a simple configuration.

It is explanatory drawing which shows the cross section of the semiconductor cooling device in embodiment of this invention. It is a perspective view which shows the structure of the semiconductor cooling device in embodiment of this invention. In the manufacturing method of the semiconductor cooling device in the embodiment of the present invention, it is explanatory drawing which shows the process of insert-molding a semiconductor element cooling plate on the upper channel side wall. It is explanatory drawing which shows the process of shape | molding a cooling water flow path partition plate and each lower water channel side wall in the manufacturing method of the semiconductor cooling device in embodiment of this invention. In the manufacturing method of the semiconductor cooling device in an embodiment of the present invention, it is explanatory drawing which shows the process of putting together the 1st upper model on the 2nd lower model, and joining each upper channel side wall and each lower channel side wall. .

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in FIG. 1, the semiconductor cooling device 100 of the present embodiment includes a metal semiconductor element cooling plate 20 in which the semiconductor element 10 is attached to an upper surface 21 that is one surface, and both sides of the semiconductor element cooling plate 20. The cooling water flow surrounded by each cooling water flow channel side wall 40a provided on the lid, the lid 50 attached to the lower end of each cooling water flow channel side wall 40a, the semiconductor element cooling plate 20, each cooling water flow channel side wall 40a and the lid 50 A cooling water flow path partition member 30 provided in the path 60 and partitioning the cooling water flow path 60 is provided. Each cooling water flow path side wall 40a is formed by connecting an upper cooling water flow path side wall 41a and a lower cooling water flow path side wall 43a with a connecting portion side wall 42a.

  The cooling water channel partition member 30 includes a base plate 32 that defines a gap 64 between the semiconductor element cooling plate 20, a cooling water supply channel 61 that extends downward from the base plate 32, and a cooling water discharge channel 62. And a partition plate 31 for partitioning. A gap 63 on the cooling water supply channel 61 side and a gap 65 on the cooling water discharge channel 62 side are provided between the side end surface of the base plate 32 and the inner surface of each cooling water channel side wall 40a. As shown in FIG. 1, a cooling protrusion 23 is provided on the lower surface 22 of the semiconductor element cooling plate 20. The projection 23 has a conical shape with a pointed tip, and the tip bites into the surface 33 of the base plate 32 of the cooling water flow path partition member 30.

  In FIG. 1, the arrow indicates the direction of the cooling water flow, and the mark marked with “X” in the circle of the cooling water supply channel 61 indicates that the cooling water flows from the front of the paper to the back. A mark with a dot in the circle of the discharge channel 62 indicates that the cooling water flows from the back of the paper toward the front. The cooling water that has flowed into the cooling water supply channel 61 flows into the gap 64 between the surface 33 of the base plate 32 and the lower surface 22 of the semiconductor element cooling plate 20 through the gap 63 on the cooling water supply channel 61 side. Since the tip of the protrusion 23 bites into the surface 33 of the base plate 32, the cooling water flowing into the gap 64 flows around the protrusion 23 to cool the lower surface 22 of the semiconductor element cooling plate 20. Then, the cooling water flowing through the gap 64 flows into the cooling water discharge channel 62 from the gap 65.

  As shown in FIG. 2, the semiconductor cooling device 100 moves the plate-shaped upper casing 41 including the upper cooling water flow channel side wall 41 a, the box-shaped lower casing 40 including the lower cooling water flow channel side wall 43 a, and the lid 50 up and down. It is configured to overlap in the direction. The upper casing 41 is resin-molded integrally with the upper cooling water flow channel side wall 41a and the upper cooling water flow channel side wall 41a, which are resin-molded so as to insert the metal semiconductor element cooling plate 20, and between the upper cooling water flow channel side wall 41a. And an upper plate 41b for connecting the two. The lower casing 40 is formed by integrally molding a lower cooling water flow channel side wall 43a, an end plate 40b provided with a cooling water inlet 66 and a cooling water outlet 67, and has upper ends 40c of the lower cooling water flow channel side walls 43a on both sides. Are connected by a plate-like connecting portion 40d. The surface 33 of the base plate 32 of the cooling water flow path partition member 30 is in close contact with the lower surface of the connection portion 40d, and an opening is formed between the connection portions 40d. And the clearance gaps 63 and 65 are formed in the both sides of this opening. Further, the end surface in the cooling water flow direction of the cooling water flow path partition member 30 having a T-shaped cross section is integrally molded with the lower cooling water flow path side wall 43a and the end plate 40b so as to be connected to the inner surface of the end plate 40b of the lower casing 40. It has been done. The lower end 31f of the partition plate 31 of the cooling water flow path partition member 30 and the lower end 40f of the lower cooling water flow path side wall 43a are flush with each other, and a lid 50 is attached from below so as to be in contact with the lower ends 31f and 40f. Yes.

  In the semiconductor cooling device 100 of this embodiment, when the upper casing 41 is connected to the lower casing 40, the tip of the protrusion 23 provided on the lower surface 22 of the semiconductor element cooling plate 20 is the base plate 32, as shown in FIG. Since the cooling water does not short pass between the tip of the protrusion 23 and the surface 33 of the base plate 32, the cooling water surely flows around the protrusion 23. The semiconductor element 10 can be cooled effectively.

  Next, the manufacturing method of the semiconductor cooling device of this embodiment is demonstrated. First, the manufacturing process of the upper casing 41 will be described with reference to FIG. As described above, the upper casing 41 is obtained by insert-molding the metal semiconductor element cooling plate 20 on the upper cooling water flow passage side wall 41a with resin. The first upper mold 71 and the first lower mold 75 are used for molding.

  As shown in FIG. 3, the first upper mold 71 has a flat plate-like central portion 72 set so that the upper surface 21 of the metal semiconductor element cooling plate 20 is in close contact with the central portion thereof, and both sides of the central portion 72. And a side portion 73 protruding from the surface. The inner surface of the central portion 72 and the inner surface of the side portion 73 form a groove-shaped recess 74, and the tip of the side portion 73 is a flat surface that forms a mating surface 80 with the first lower die 75. The first lower mold 75 includes a side part 78 that is flush with the mating surface 80 that is aligned with the tip of the side part 73 of the first upper mold 71, and the side part 73 of the first upper mold 71. A rib 77 is provided such that the outer surface thereof is located inside the inner surface of the upper cooling water passage side wall 41a rather than the inner surface thereof. The inner surface between the ribs 77 is a recess 79.

  As shown in FIG. 3, the first upper die 71 is set so that the upper surface 21 of the metal semiconductor element cooling plate 20 is in close contact with the inner surface of the central portion 72 of the first upper die 71. The lower surface of the side portion 73 of the first upper mold 71 is aligned with the upper surface. This surface is a mating surface 80 between the first upper mold 71 and the first lower mold 75. When the first upper mold 71 and the first lower mold 75 are combined, the upper end surface of the rib 77 of the first lower mold 75 is located on the peripheral portion of the lower surface 22 of the semiconductor element cooling plate 20 where the protrusions 23 are not provided. In close contact with each other, the first upper mold recess 74 is combined to form a sealed first space 91 into which resin is injected at the positions of both side ends of the semiconductor element cooling plate 20. Further, the tip of the protrusion 23 on the lower surface 22 of the semiconductor element cooling plate 20 set on the first upper mold 71 is the same surface or the same surface as the mating surface 80 of the first upper mold 71 and the first lower mold 75. It protrudes slightly to the first lower mold 75 side.

  After the first upper mold 71 and the first lower mold 75 are combined as described above, the first upper mold 71 and the first lower mold 75 are heated to a temperature at which resin molding can be performed, and then FIG. As shown by the arrow A, resin is injected into the space 91. The injected resin becomes the left and right upper cooling water flow channel side walls 41a and is in close contact with the semiconductor element cooling plate 20 to fix the semiconductor element cooling plate 20 to the upper cooling water flow channel side wall 41a. Thus, the semiconductor element cooling plate 20 is insert-molded on the upper cooling water flow passage side wall 41a.

  Next, the manufacturing process of the lower casing 40 will be described with reference to FIG. As described above, the lower casing 40 is obtained by integrally molding the lower cooling water flow path side wall 43a and the cooling water flow path partition member 30 with resin. The second upper mold 81 and the second lower mold 85 are used for molding.

  As shown in FIG. 4, the second lower mold 85 includes two second recesses 92 that are spaces for injecting resin for the lower cooling water flow passage side wall 43 a on both sides of a rectangular parallelepiped rectangular section, and a central portion 88. And a T-shaped third recess 93 for injecting resin for the cooling water flow path partition member 30 is formed. The upper end surface of the side portion 87 of the lower mold 85 that defines the periphery of the second recess 92 is a mating surface 90 that is matched with the second upper mold 71. The second upper mold 81 includes a fourth recess 84 having a depth d for forming a portion having a thickness d of the surface 33 of the lower cooling water flow passage side wall 43a provided in the central portion 82, and a second recess 84. A protrusion 84 a having a height e is provided so as to fit into the second recess 92 of the lower mold. And the lower end surface of the side part 83 of the both sides of the 4th recessed part 84 protrudes toward the 2nd lower mold | type 75 side by thickness d from the surface of the 4th recessed part 84, and the protrusion 84a is the 1st. 4 protrudes from the lower end surfaces on both sides of the concave portion 84 by a height e.

  As shown in FIG. 4, when the second upper mold 81 and the second lower mold 85 are combined, the lower surface of the second upper mold side portion 83 is in close contact with the mating surface 90 of the second upper mold. Then, the protrusion 84a enters the second recess 92 of the second lower mold 85, and the second recess 92 is a sealed space. The fourth recess 84 of the second upper mold 81 is aligned with the third recess 93 provided in the second lower mold 85 and injects resin for the T-shaped cooling water flow path partition member 30. A sealed second space 95 is formed. Then, after the second upper mold 81 and the second lower mold 85 are combined, the second upper mold 81 and the second lower mold 85 are heated to a temperature at which resin molding is possible, and then the arrows in FIG. As shown in B, resin is injected into the second recess 92 and the second space 95. The injected resin forms the left and right lower cooling water flow channel side walls 43a and forms a T-shaped cooling water flow channel partition member 30. The resin is also injected into the fourth concave portion 84 having the depth d of the second upper mold to form the upper end surface including the surface 33 of the cooling water flow path partition member 30, so that the cooling water flow path partition member 30 molded with resin is formed. The surface 33 protrudes from the mating surface 90 of the second upper mold 81 and the second lower mold 85 by a height d. On the other hand, the upper surface of the lower cooling water flow passage side wall 43a is lower than the mating surface 90 of the second upper mold 81 and the second lower mold 85 by a height e.

  When the first upper mold 71 and the first lower mold 75 shown in FIG. 3 are combined, heated, injected with resin, and then cooled as it is, the injected resin in the first space 91 is solidified. come. When the temperature of the first upper mold 71 and the first lower mold 75 is such that the resin injected into the space 91 has solidified to some extent but has not completely solidified, or is in a state of a predetermined temperature or higher. Thus, the first upper mold 71 and the first lower mold 75 shown in FIG. 3 are separated in the vertical direction. Separation is performed by fixing the first upper mold 71 and pulling the first lower mold downward. When the first upper mold 71 and the first lower mold 75 are separated, the first upper mold 71 is insert-molded into the upper cooling water flow channel side wall 41a solidified to some extent and the upper cooling water flow channel side wall 41a. The semiconductor element cooling plate 20 remains. Further, when the second upper mold 81 shown in FIG. 4 is separated from the second lower mold 85, the second lower mold 85 has a lower cooling water flow channel side wall 43a solidified to some extent and a T-shaped cooling water flow channel. The partition member 30 remains. Since the upper end portion of the T-shaped cooling water flow path partition member 30 is formed in the second upper die 81 by a fourth recess 84 having a depth d, the surface 33 is aligned with the second lower die 85. It protrudes by a height d from the surface 90. On the other hand, since the upper end height of the upper surface of the lower cooling water flow passage side wall 43a is determined by the second upper mold protrusion 84a, it is depressed by the height e from the mating surface 90 of the second lower mold 85. ing.

  Then, as shown in FIG. 5, the first upper mold 71 is slid together with the upper cooling water passage side wall 41 a and the semiconductor element cooling plate 20 to be aligned with the second lower mold, and the first upper mold 71 is aligned. The surface 80 and the mating surface 90 of the second lower mold 85 are brought into close contact with each other. The surface 33 of the T-shaped cooling water flow path partition member 30 protrudes by a height d from the mating surface 90 of the second lower mold 85, and the semiconductor element cooling plate 20 set on the first upper mold 71. The tip of the projection 23 on the lower surface 22 protrudes to the same side as the mating surface 80 of the first upper mold 71 and the first lower mold 75 or slightly to the first lower mold 75 side. Therefore, when the mating surface 80 of the first upper mold 71 is brought into close contact with the mating surface 90 of the second lower mold 85, the tip of the projection 23 on the lower surface 22 of the semiconductor element cooling plate 20 is as shown in FIG. It has not yet completely solidified and bites into the surface 33 of the soft cooling water flow path partition member 30. When the tip of the protrusion 23 on the lower surface 22 of the semiconductor element cooling plate 20 set on the first upper mold 71 is flush with the mating surface 80 of the first upper mold 71 and the first lower mold 75 The biting depth is the protruding height d of the surface 33 of the T-shaped cooling water flow path partition member 30. On the other hand, the lower end surface of the upper cooling water flow channel side wall 41a is flush with the mating surface 80 of the lower end surface of the side portion 73 of the first upper mold 71, and the upper end surface of the lower cooling water flow channel side wall 43a is the second lower mold. Since the height e is lower than the 85 mating surface 90, a space 94 is formed between the lower end surface of the upper cooling water flow channel side wall 41a and the upper end surface of the lower cooling water flow channel side wall 43a. . Then, as shown by an arrow C in FIG. 5, when connection resin is injected into the space 94, a connection portion side wall 42 a that connects the upper cooling water flow channel side wall 41 a and the lower cooling water flow channel side wall 43 a is formed. And the lower casing 40 are integrated.

Thereafter, the first upper mold 71 and the second lower mold 85 are cooled to completely solidify the injected resin, and then the first upper mold 71 and the second lower mold 85 are separated. Then, the upper casing 41 and the lower casing 40 integrated with each other are taken out. Then, as shown in FIG. 2, when the lid 50 is attached to the lower end surface of the lower casing 40 from below, the semiconductor cooling device 100 is completed.

  In the manufacturing method of the semiconductor cooling device 100 described above, the upper casing 41 including the semiconductor element cooling plate 20 is resin-molded using the first upper mold 71 and the first lower mold 75, and the T-shaped cooling water flow The lower casing 40 including the road partition member 30 is resin-molded with the second upper die 81 and the second lower die 85, and the first upper portion on which the semiconductor element cooling plate 20 remains before the resin is completely hardened. The mold 71 is aligned with the second lower mold 85 where the cooling water flow path partition member 30 remains, and the tip of the protrusion 23 provided on the semiconductor element cooling plate 20 is placed on the surface 33 of the base plate 32 of the cooling water flow path partition member 30. It is possible to suppress the formation of a gap between the tip of the protrusion 23 of the semiconductor element cooling plate 20 and the surface 33 of the base plate 32 of the cooling water flow path partition member 30 by a simple manufacturing method of biting in, and cooling. It is possible to produce the rate of good semiconductor cooling device 100.

  In the present embodiment described above, the tip of the protrusion 23 on the lower surface 22 of the semiconductor element cooling plate 20 is flush with the mating surface 80 of the first upper mold 71 and the first lower mold 75, and the T-shaped cooling is performed. Although it has been described that the surface 33 of the water flow path partition member 30 protrudes from the mating surface 90 of the second lower mold 85 by a height d, the tip of the protrusion 23 on the lower surface 22 of the semiconductor element cooling plate 20 is the first. If, for example, a height d projects from the mating surface 80 of the upper mold 71 and the first lower mold 75 to the first lower mold 75 side, the second upper mold 81 is located at the central portion 82. It is good also as a flat shape in which the 4th recessed part 84 is not provided.

  DESCRIPTION OF SYMBOLS 10 Semiconductor element, 20 Semiconductor element cooling plate, 21 Upper surface, 22 Lower surface, 23 Protrusion, 30 Cooling water flow path partition member, 31 Partition plate, 31f, 40f Lower end, 32 Base plate, 33 Surface, 40 Lower casing, 40a Cooling water flow path Side wall, 40b End plate, 40c Upper end, 40d Connection part, 40f Lower end, 41 Upper casing, 41a Upper cooling water channel side wall, 41b Upper plate, 42a Connection part side wall, 43a Lower cooling water channel side wall, 50 Lid, 60 Cooling water channel 61 cooling water supply flow path, 62 cooling water discharge flow path, 63, 64, 65 gap, 66 cooling water inlet, 67 cooling water outlet, 71, 81 upper mold, 72, 82, 88 central part, 73, 78, 79,83,87 side, 74,79 recess, 74a protrusion, 75,85 lower mold, 77 rib, 80,90 mating surface, 84 4 of the recess 84a projections, 91,94,95 space, 92 second recess, 93 third recess, 100 semiconductor cooling device.

Claims (5)

A semiconductor cooling device for cooling a semiconductor element with cooling water,
A semiconductor element cooling plate having the semiconductor element mounted on one surface and a cooling protrusion provided on the other surface;
Each cooling water flow path side wall protruding in the direction along the protruding direction of the protrusion from both side ends of the semiconductor element cooling plate,
A base plate that is in contact with the protrusions of the semiconductor element cooling plate and defines a first gap between the semiconductor element cooling plate, and protrudes from the base plate in a direction opposite to the semiconductor element cooling plate; A partition plate extending in the direction and partitioning the cooling water flow path , wherein the side end surface of the base plate is disposed with a second gap between the inner surface of each cooling water flow channel side wall; and , equipped with a,
The cooling water flow path dividing member is a semiconductor cooling device distal end of the protrusion of the semiconductor element cooling plate and said Rukoto are molded integrally in a state of biting into the surface of the base plate. A method for manufacturing a semiconductor cooling device, comprising:
A first upper mold on which a semiconductor element cooling plate provided with a cooling protrusion is set, and a first space are formed at the side edge of the semiconductor element cooling plate in alignment with the first upper mold. Preparing a first lower mold;
A second recess having a third recess for forming a cooling water flow path partition member provided with a base plate in contact with the protrusion of the semiconductor element cooling plate and defining a first gap between the semiconductor element cooling plate and the semiconductor element cooling plate; A step of preparing a lower mold and a second upper mold that forms a second space for forming the cooling water flow path partition member in accordance with the second lower mold;
Combining the first upper mold and the first lower mold, injecting resin into the first space, and insert-molding a semiconductor element cooling plate;
Combining the second upper mold and the second lower mold, injecting resin into the second space, and molding the cooling water flow path partition member;
The first upper mold, the first lower mold, the second upper mold, and the second lower mold are in a state in which the respective resins are at a temperature or higher such that the respective resins are not completely solidified . The first upper mold and the first lower mold are separated in a state where the semiconductor element cooling plate insert-molded in one upper mold remains, and the cooling water flow path partition molded into the second lower mold Separating the second upper mold and the second lower mold with the member remaining;
The second lower mold so that the tip of the protrusion of the semiconductor element cooling plate remaining in the first upper mold bites into the surface of the cooling water flow path partition member remaining in the second lower mold. Aligning the first upper mold on the substrate,
The manufacturing method of the semiconductor cooling device characterized by including this. It is a manufacturing method of the semiconductor cooling device according to claim 2 ,
The tip of the protrusion of the semiconductor element cooling plate protrudes from the same surface as the mating surface of the first upper die and the first lower die or more than the mating surface when set on the first upper die. And
The second upper mold has a fourth recess that is aligned with the third recess and forms a second space for molding the cooling water flow path partition member;
A method for cooling a semiconductor device. It is a manufacturing method of the semiconductor cooling device according to claim 2 or 3 ,
The step of aligning the first upper mold on the second lower mold comprises:
Combining the second lower mold and the first upper mold by sliding the second lower mold or the first upper mold;
A method for manufacturing a semiconductor cooling device. It is a manufacturing method of the semiconductor cooling device according to any one of claims 2 to 4 ,
The first upper mold first space forms each upper cooling water flow path side wall protruding in a direction along the protruding direction of the protrusion from both side ends of the semiconductor element cooling plate,
The second lower mold includes second recesses for forming the lower cooling water flow channel side walls disposed at positions corresponding to the upper cooling water flow channel side walls,
The insert molding step injects resin into the first space to simultaneously mold the upper cooling water flow path side walls,
The step of forming the cooling water flow path partition member is formed by injecting resin into each of the second recesses and simultaneously forming the lower cooling water flow path side walls,
The first upper mold is separated from the first lower mold in a state where the molded upper cooling water flow channel side walls remain, and the second lower mold is a state in which the molded lower cooling water flow channel side walls remain. Separated from the second upper mold,
Resin is injected between each of the upper cooling water flow channel side walls remaining on the first upper mold and each of the lower cooling water flow channel side walls remaining on the second lower mold, to thereby form each of the upper cooling water flow channel side walls and each of the above. Joining the lower cooling water flow path side wall;
The manufacturing method of the semiconductor cooling device characterized by the above-mentioned.

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