JP5701367B1 - Transmission line - Google Patents

Abstract

A small transmission line capable of reducing reflection and loss is realized. In a transmission line 100 including a dielectric substrate 101, a signal line 102, a pair of ground pads 104, a ground layer 105, and a through hole 104A, a direction along the signal line 102 of the ground pad 104 is provided. Is longer than the length WP of the ground pad 104 in the direction intersecting the signal line 102. [Selection] Figure 1

Description

  The present invention relates to a transmission line for transmitting a high-frequency signal.

  With the demand for higher speed and larger capacity of wireless communication, the frequency of electromagnetic waves used for wireless communication is increasing. For this reason, the frequency of transmission signals processed in the wireless device is also increasing. Specifically, in an electronic device, it is necessary to process a high-frequency signal having a frequency (30 GHz or more and 300 GHz or less) corresponding to a millimeter wave. In such an electronic device, for example, a configuration in which an integrated circuit that transmits a high-frequency signal and a planar circuit are connected by a microstrip line is used. In such a connection configuration, in order to efficiently transmit a high-frequency signal, a low-loss and low-reflection connection using a microstrip line is necessary. For example, when a coplanar line in which a signal line and a ground pad are formed on the same plane and a microstrip line in which the signal line and the ground layer are stacked are connected by a conversion circuit, the signal line of the microstrip line Since the impedances of the coplanar line and the ground pad are different from each other, discontinuous portions of the transmission path are formed, and there is a possibility that characteristic deterioration due to reflection may occur.

  Under such a background, for example, Patent Document 1 listed below discloses a connection auxiliary pad that is not electrically connected to these pads between a high-frequency signal pad and a ground pad in order to suppress reflection. A microwave integrated circuit is disclosed. In particular, Patent Document 1 below discloses that the width of the high-frequency signal pad is set to a width that can obtain the same impedance as that of a high-frequency prober or measuring instrument in order to enable highly accurate characteristic measurement. ing.

  Further, in Patent Document 2 below, a high-frequency component adopting a configuration in which a coplanar line ground electrode and a microstrip line ground electrode are connected by electromagnetic coupling or capacitive coupling in a coplanar line and microstrip line conversion unit. A transmission conversion circuit is disclosed. According to this high-frequency transmission conversion circuit, it is easy to manufacture, and it is said that transmission efficiency can be improved without affecting transmission characteristics. Further, by defining the width of the ground electrode of the high-frequency transmission conversion circuit, it is said that conversion loss in a relatively wide band near the set frequency can be reduced.

  Further, in Patent Document 3 below, in the conversion line between the coplanar line and the microstrip line, the strip conductor of the microstrip line and the center conductor of the coplanar line are connected by a tapered conductor portion, The structure which forms the taper part which satisfy | fills a predetermined relational formula also in the ground layer is disclosed. According to this configuration, it is said that a low reflection and low loss conversion line can be realized while suppressing a change in characteristic impedance.

JP 2004-63737 A (published February 26, 2004) JP 2008-85750 A (published April 10, 2008) Japanese Patent Laid-Open No. 10-335910 (published December 18, 1998)

  However, since the technique of Patent Document 1 requires the connection auxiliary pad to be disposed between the high-frequency signal pad and the ground pad, each component member is disposed particularly in the line width direction of the high-frequency signal pad. Therefore, it is difficult to reduce the size of the microwave integrated circuit. Further, the technique of Patent Document 2 does not have flexibility in adjusting the characteristics because a through-hole is not used for connection between the ground electrode of the coplanar line and the ground electrode of the microstrip line. Suitable properties cannot be easily obtained. Moreover, since the technique of the said patent document 3 needs to form the taper part which satisfy | fills a predetermined relational expression in the ground layer of a coplanar line, manufacture of the said ground layer is not easy. Moreover, the technique of the above-mentioned patent document 3 must secure a sufficient area for arranging a ground layer (in particular, the size is not limited) having a tapered portion in the line width direction of the central conductor of the coplanar line. In other words, it is not easy to reduce the size of the conversion circuit. As described above, conventionally, a transmission line capable of reducing reflection and loss could not be realized by a small transmission line.

  The present invention has been made in view of the above problems, and an object of the present invention is to realize a compact transmission line capable of reducing reflection and loss.

  In order to solve the above problems, a transmission line according to the present invention includes a dielectric substrate, a linear signal line formed on the surface of the dielectric substrate, and the signal line on the surface of the dielectric substrate. A pair of rectangular ground pads, ground layers formed on the back surface of the dielectric substrate, and through holes formed in the dielectric substrate. A through hole penetrating the body substrate and electrically connecting each of the ground pads and the ground layer, and a length LP of the ground pad along the signal line is equal to the signal line of the ground pad. It is characterized by being longer than the length WP in the intersecting direction.

  According to the transmission line, since the ground pad has a rectangular shape whose longitudinal direction is a direction along the signal line (for example, a direction parallel to the signal line), sufficient capacitive coupling is established between the signal line and the ground pad. And balance with the inductivity of the ground pad, it is possible to obtain suitable characteristics (low reflection and low loss). Further, according to the above transmission line, the ground pad has a rectangular shape having a short direction in a direction intersecting with the signal line (for example, a direction orthogonal to the signal line), and therefore the width of the dielectric substrate (crossing the signal line). Direction width) can be kept small. Therefore, according to the transmission line, low reflection and low loss can be achieved by a small transmission line. Furthermore, according to the transmission line, the ground pad is rectangular, and therefore can be easily manufactured.

  In the transmission line, it is preferable that two through holes arranged side by side in the direction along the signal line are provided for each of the pair of ground pads.

  According to the above configuration, the parallel inductance is suitably adjusted by the two through holes, and the capacitive and inductive properties due to the rectangular shape of the ground pad can be preferably canceled, and as a result, favorable characteristics are obtained. be able to.

  In the above transmission line, each of the pair of ground pads is preferably formed with a notch that faces the signal line between the two through holes.

  According to the above configuration, the current path length in the ground pad is increased, and thereby inductance is provided, so that the insertion loss of the ground pad can be further suppressed.

  In the transmission line, it is preferable that the pair of ground pads are provided at both ends of the signal line.

  According to the above configuration, when excitation is performed by an integrated circuit connected to the transmission line, a probe for measurement evaluation, or the like, excitation by a stable electromagnetic field portion is possible.

  In the transmission line, a transition part connecting the PWW (Post Wall Waveguide) provided on the signal line and the signal line and the PWW, from the connection part to the signal line It is preferable to further include a transition portion whose line width gradually increases toward the connection portion with the PWW.

  According to the above configuration, the same effect as that of the transmission path can be obtained even in the transmission path including the PWW. In particular, according to the above configuration, by providing the transition portion, mismatch between the signal line and the PWW can be suppressed.

  In the transmission line, it is preferable that a value (G / λ) obtained by dividing a gap G between the signal line and the ground pad by a free space wavelength of 60 GHz is 0.01 or less.

  As described above, the inventors have verified that by specifying G / λ, the reflection is sufficiently suppressed, the electromagnetic field is symmetric, and a particularly good operation is possible.

  In the transmission line, a value obtained by dividing the distance H from the end of the ground pad in the direction along the signal line to the center of the through hole closer to the end by a free space wavelength of 60 GHz (H / λ) is preferably 0.04 or less.

  By defining H / λ as described above, it is clear from the inventors' verification that reflection is sufficiently suppressed and particularly good operation is possible.

  In the transmission line, a value (L / λ) obtained by dividing a distance L from an edge of the ground pad facing the signal line to the center of the through hole by a free space wavelength of 60 GHz is 0.01 or more and 0. It is preferable to be within the range of 0.05 or less.

  It is clear from the inventors' verification that the reflection is sufficiently suppressed and a particularly good operation is possible by defining L / λ as described above.

  In the transmission line, a value (S / λ) obtained by dividing the length S of the cutout portion in the direction intersecting the signal line by a free space wavelength of 60 GHz is in a range of 0.02 to 0.06. Preferably there is.

  As described above, the inventors have verified that the S / λ is regulated so that reflection is sufficiently suppressed and particularly good operation is possible.

  In the transmission line, it is preferable that a value (T / λ) obtained by dividing the length T of the notch along the signal line by a free space wavelength of 60 GHz is 0.04 or more.

  It is clear from the inventors' verification that the reflection is sufficiently suppressed and a particularly good operation is possible by defining T / λ as described above.

  In the transmission line, a value (WP / λ) obtained by dividing the length WP of the ground pad by a free space wavelength of 60 GHz is in a range of 0.06 to 0.1, and the ground pad In the direction intersecting with the signal line, it is preferable to arrange the through hole at a position that is ½ of the length WP.

  As described above, it is clear from the inventors' examination that the reflection is sufficiently suppressed by specifying WP / λ as described above, and that particularly good operation is possible.

  In the transmission path, a value (LP / λ) obtained by dividing the length LP of the ground pad by a free space wavelength of 60 GHz is 0.17 or more, and the direction along the signal line of the ground pad In the above, it is preferable that the through hole is arranged at a position of 1/4 of the length LP.

  It is clear from the inventors' verification that the LP / λ is defined as described above, whereby reflection is sufficiently suppressed and particularly good operation is possible.

  In the above transmission line, it is preferable that the G / λ is in the range of 0.014 to 0.016 or in the range of 0.014 to 0.035.

  As described above, it is clear from the inventors' verification that a broadband characteristic can be obtained by defining G / λ.

  In the transmission line, the H / λ is in a range of 0.015 or more and 0.052 or less, in a range of 0.076 or more and 0.082 or less, or in a range of 0.015 or more and 0.101 or less. It is preferable.

  As described above, it is clear from the inventors' verification that a broadband characteristic can be obtained by defining H / λ.

  In the transmission line, the S / λ is preferably in the range of 0.0213 to 0.0457 or in the range of 0.015 to 0.17.

  As described above, it is clear from the inventors' verification that a wide band characteristic can be obtained by defining S / λ.

  In the transmission line, the T / λ is in the range of 0.012 to 0.036, in the range of 0.012 to 0.072, or in the range of 0.006 to 0.116. It is preferable.

  As described above, it is clear from the inventors' verification that a wide band characteristic can be obtained by defining T / λ.

  In the transmission line, the L / λ is in the range of 0.015 to 0.033, in the range of 0.0457 to 0.0518, in the range of 0.064 to 0.0762, or 0 It is preferable to be within the range of .0152 or more and 0.0762 or less.

  As described above, it is clear from the inventors' verification that a wide band characteristic can be obtained by defining L / λ.

  In the transmission line, the WP / λ is in the range of 0.101 to 0.106, in the range of 0.115 to 0.125, in the range of 0.132 to 0.143, or 0 It is preferably within the range of not less than 0.915 and not more than 0.152.

  As described above, it is clear by the inventors that wideband characteristics can be obtained by defining WP / λ.

  In the transmission line, the LP / λ is preferably in the range of 0.229 to 0.259, or in the range of 0.229 to 0.289.

  As described above, it is clear from the inventors' verification that a wide band characteristic can be obtained by defining LP / λ.

  According to the present invention, it is possible to realize a small transmission line that can reduce reflection and loss.

It is a figure which shows the structure of the transmission line which concerns on embodiment of this invention. The structure of the some transmission line from which the shape of a ground pad mutually differs is shown. (A) is a graph which shows the transmission characteristic (S21) of each transmission line shown in FIG. (B) is a graph which shows the reflection characteristic (S11) of each transmission line shown in FIG. 3 is a graph showing insertion loss due to a pair of ground pads in each transmission line shown in FIG. 2. It is a top view which shows the modification of the transmission line which concerns on this embodiment. 6 is a graph showing insertion loss due to one ground pad in each of the transmission path shown in FIG. 3 and the transmission path shown in FIG. 5. FIG. 3A is a plan view illustrating a configuration of a transmission line according to the first embodiment. FIG. 7B is a side view illustrating the configuration of the transmission line according to the first embodiment. 8 is a graph showing a transmission coefficient | S21 | and a reflection coefficient | S11 | of the transmission line of Example 1 shown in FIG. It is a figure which shows the dimension of the ground pad made into change object in Examples 2-8. 6 is a graph showing changes in transmission coefficient | S21 | and reflection coefficient | S11 | when the interval (G) is changed in the transmission line of Example 1. FIG. 6 is a graph showing changes in transmission coefficient | S21 | and reflection coefficient | S11 | when the distance (H) is changed in the transmission line of Example 1. 6 is a graph showing changes in transmission coefficient | S21 | and reflection coefficient | S11 | when the distance (L) is changed in the transmission line of Example 1. FIG. 6 is a graph showing changes in transmission coefficient | S21 | and reflection coefficient | S11 | when the length (S) is changed in the transmission line of Example 1. FIG. 5 is a graph showing changes in transmission coefficient | S21 | and reflection coefficient | S11 | when the length (T) is changed in the transmission line of Example 1. 6 is a graph showing changes in transmission coefficient | S21 | and reflection coefficient | S11 | when the length (WP) is changed in the transmission line of Example 1. 6 is a graph showing changes in transmission coefficient | S21 | and reflection coefficient | S11 | when the length (LP) is changed in the transmission line of Example 1. FIG. FIG. 9 is a graph corresponding to Example 2 and shows a change in specific bandwidth when the interval (G) is changed in the transmission line of Example 1. FIG. It is a graph corresponding to Example 3, and is a graph showing a change in specific bandwidth when the distance (H) is changed in the transmission line of Example 1. It is a graph corresponding to Example 4, Comprising: In the transmission line of Example 1, it is a graph which shows the change of a specific bandwidth when changing distance (L). It is a graph corresponding to Example 6, and is a graph showing a change in specific bandwidth when the length (T) is changed in the transmission line of Example 1. It is a graph corresponding to Example 5, and is a graph showing a change in specific bandwidth when the length (S) is changed in the transmission line of Example 1. It is a graph corresponding to Example 7, Comprising: In the transmission line of Example 1, it is a graph which shows the change of a specific bandwidth when length (WP) is changed. It is a graph corresponding to Example 8, and is a graph showing a change in specific bandwidth when the length (LP) is changed in the transmission line of Example 1. In the transmission line of this embodiment, it is the schematic which shows the simulation result of the current distribution in a ground pad. It is a figure which shows the modification of a ground pad in the transmission line of this embodiment. It is a graph which shows the insertion loss by a pair of ground pad in each transmission line shown in FIG.

  Hereinafter, a transmission line according to an embodiment of the present invention will be described with reference to the accompanying drawings.

[Configuration of Transmission Line 100]
First, the configuration of the transmission line 100 according to the embodiment of the present invention will be described with reference to FIG. FIG. 1 is a diagram showing a configuration of a transmission line 100 according to an embodiment of the present invention. FIG. 1A is a plan view showing the configuration of the transmission line 100. FIG. 1B is a side view of the transmission line 100 shown in FIG.

  The transmission line 100 of this embodiment is a transmission line for transmitting a high-frequency signal such as a microwave or a millimeter wave, and is also a conversion circuit that converts a coplanar line and a microstrip line. As shown in FIG. 1, the transmission line 100 of this embodiment includes a dielectric substrate 101, a signal line 102, a plurality of ground pads 104, and a ground layer 105.

  The dielectric substrate 101 is a thin plate member. As shown in FIG. 1, the dielectric substrate 101 has a rectangular shape when the transmission line 100 is viewed in plan. For the dielectric substrate 101, for example, a thin plate-like dielectric material is used. A signal line 102 and a plurality of ground pads 104 are formed on the surface of the dielectric substrate 101. A ground layer 105 is formed on the back surface of the dielectric substrate 101. The signal line 102, the ground pad 104, and the ground layer 105 are thin film members. For the signal line 102, the ground pad 104, and the ground layer 105, for example, a thin-film conductor foil (for example, copper foil) is used.

  The signal line 102 has an elongated shape that extends linearly on the surface of the dielectric substrate 101. In the example shown in FIG. 1, the signal line 102 extends through the center of the dielectric substrate 101 and is parallel to a pair of opposite sides (left side and right side in the figure) of the dielectric substrate 101. It is.

  Ground pads 104 are formed on both sides of the end of the signal line 102 in the vicinity of the signal line 102. That is, the end of the signal line 102 is sandwiched between the pair of ground pads 104. That is, the pair of ground pads 104 are arranged symmetrically with respect to the signal line 102. As shown in FIG. 1, each ground pad 104 has a rectangular shape. In each ground pad 104, the side facing the signal line 102 is along the signal line 102, and is particularly parallel to the signal line 102. That is, the distance between the signal line 102 and the ground pad 104 is constant. As shown in FIG. 1, in the transmission line 100 of the present embodiment, a pair of ground pads 104 are provided at both ends of the signal line 102.

  The dielectric substrate 101 is formed with a plurality of through holes 104 </ b> A that penetrate the dielectric substrate 101 and connect the ground pads 104 to the ground layer 105. In particular, as shown in FIG. 1, in the transmission line 100 of the present embodiment, two through holes 104 </ b> A are provided for each ground pad 104.

  In each of both ends of the signal line 102, the signal line 102 and the pair of ground pads 104 constitute a GSG (GND-Signal-GND) pad 110. For example, at one end (the upper end in the drawing) of the signal line 102, the GSG pad 110 </ b> A is formed by the pair of ground pads 104 and the signal line 102 disposed between the pair of ground pads 104. Configure. Similarly, at the other end (lower end in the figure) of the signal line 102, a pair of ground pads 104 and a signal line 102 disposed between the pair of ground pads 104 provide a GSG pad. 110B is configured.

  In the transmission line 100 configured in this way, a microstrip line is formed by the signal line 102 and the ground layer 105 that are stacked on each other. In the transmission line 100, the signal line 102 and the pair of ground pads 104 arranged on the same plane form a coplanar line. The ground layer 105 of the microstrip line and the ground pad 104 of the coplanar line are electrically connected to each other through a through hole 104A penetrating the dielectric substrate 101. Thus, the transmission line 100 functions as a conversion circuit that converts the coplanar line and the microstrip line.

  Here, in the transmission line 100 of this embodiment, it should be noted that the length of the ground pad 104 in the direction along the signal line 102 (vertical direction in FIG. 1A; hereinafter referred to as “vertical direction”). (LP) is larger than the length (WP) of the ground pad 104 in the direction intersecting the signal line 102 (the horizontal direction in FIG. 1A, hereinafter referred to as “lateral direction”). Is a point. That is, each ground pad 104 has a vertically long rectangular shape in which the vertical direction is the longitudinal direction and the horizontal direction is the short direction. Accordingly, in each ground pad 104, two through holes 104A are arranged side by side in the vertical direction.

[Comparison with other transmission lines]
Here, with reference to FIGS. 2 to 4, the superiority of the ground pad 104 of the transmission line 100 according to the present embodiment will be described. FIG. 2 shows a configuration of a plurality of transmission paths (transmission paths A to F) having different ground pad shapes. A transmission line B shown in FIG. 2B is the transmission line 100 of the present embodiment, and the dimensions of each part in the transmission line 100 are specifically defined. On the other hand, the transmission paths A, C, D, E, and F shown in FIGS. 2A, 2C, 2D, 2E, and 2F are comparative transmission paths, and The shape of the ground pad is different from the transmission line 100. However, the transmission paths A, C, D, E, and F are newly proposed by the inventor and do not indicate conventional techniques.

  In order to compare changes in characteristics due to the shape of the ground pad, the transmission paths A to F adopt the following common configuration for portions other than the ground pad.

Dielectric substrate material: Liquid crystal polymer substrate Dielectric substrate thickness: 0.1 mm
Dielectric constant of dielectric substrate: 3
Dielectric loss tangent of dielectric substrate: 0.003
Through-hole diameter: 0.1 mm
Signal line length: 10 mm
Signal line width: 0.2 mm
Distance between signal line and ground pad: 0.05mm
The specific configuration of the ground pads of the transmission lines A to F is as shown in FIG.

(Ground pad for transmission line A)
Total length in the vertical direction: 0.5 mm
Overall length in the horizontal direction: 0.5 mm
Number of through holes: 1 (1 column x 1 row)
(Ground pad for transmission line B)
Total length in the vertical direction: 1.0 mm
Overall length in the horizontal direction: 0.5 mm
Number of through holes: 2 (1 column x 2 rows)
Through-hole spacing: 0.5 mm
(Ground pad of transmission line C)
Total length in the vertical direction: 0.5 mm
Overall length in the horizontal direction: 1.0 mm
Number of through holes: 2 (2 columns x 1 row)
Through-hole spacing: 0.5 mm
(Ground pad of transmission line D)
Total length in the vertical direction: 1.0 mm
Overall length in the horizontal direction: 1.0 mm
Number of through holes: 4 (2 columns x 2 rows)
Through-hole spacing (row direction): 0.5 mm
Through-hole spacing (row direction): 0.5 mm
(Ground pad for transmission line E)
The ground pad of the transmission line E is obtained by adding one through hole to the center of the ground pad with respect to the ground pad of the transmission line D.

(Ground pad for transmission line F)
The ground pad of the transmission line F is the edge of the ground pad facing the signal line so that the distance from the signal line gradually increases as it goes to the center of the signal line with respect to the ground pad of the transmission line B. Is a curved configuration.

[Comparison of transmission and reflection characteristics]
FIG. 3A is a graph showing the transmission characteristics (S21) of each transmission line shown in FIG. FIG. 3B is a graph showing the reflection characteristic (S11) of each transmission line shown in FIG. As shown in FIG. 3, it can be seen that the transmission characteristic (S21) and the reflection characteristic (S11) in the transmission path change by changing the shape of the ground pad. In particular, paying attention to the reflection characteristics of each transmission line, in the transmission lines A, C, and F, the reflection (S11) in each frequency band is -10 dB or more at the maximum, and more than the transmission lines B, D, and E It can be seen that the reflection (S11) is large. That is, it can be seen that the transmission lines B, D, and E are more suppressed in reflection than the transmission lines A, C, and F, that is, low reflection is possible. In transmission lines B, D, and E, the length of the portion of the ground pad extending along the signal line is longer than that of transmission lines A, C, and F. This is thought to be due to the fact that the matching of the capacitive coupling, the series inductance of the ground pad, and the parallel inductance of the through hole are sufficiently matched.

(Comparison of insertion loss)
FIG. 4 is a graph showing insertion loss due to a pair of ground pads in each transmission path shown in FIG. In each transmission line, the insertion loss of the ground pad as shown in FIG. 4 is obtained, for example, by preparing two transmission lines with different signal line lengths and obtaining transmission and reflection characteristics for each. Can be calculated. As shown in FIG. 4, it can be seen that the insertion loss of the ground pad changes by changing the shape of the ground pad. In particular, it can be seen that the transmission paths B, D, and E have a smaller insertion loss in the frequency band of 60 GHz or higher than the transmission paths A, C, and F. In addition, since the transmission line B having a vertically long rectangular shape has a smaller overall length in the horizontal direction of the ground pad than the transmission lines D and E having a square shape, it is advantageous also from the viewpoint of miniaturization of the transmission line. It can be said that it is a configuration. In particular, it can be seen from FIG. 4 that the insertion loss is increased in the transmission line C in which the ground pad has a shape (laterally long rectangular shape) in contrast to the transmission line B. This is because the transmission path B increases the inductance and the capacitance, so that both can be balanced. On the other hand, the transmission path C increases the inductance, but the capacitance decreases and the balance cannot be achieved. It is thought that it is from. Further, it can be said that the transmission path C has a configuration in which it is difficult to reduce the size of the transmission path because the total length of the ground pad in the lateral direction is increased. In addition, although the transmission path F is the same as the transmission path B in the total length in the vertical direction of the ground pad, the ground pad is not a vertically long rectangular shape along the signal line, and the distance from the signal line gradually increases. It has a shape. For this reason, the transmission line F does not have sufficient capacitance, and good characteristics are not obtained.

[Superiority of transmission line 100]
Based on the above, the configuration that “the shape of the ground pad is rectangular and the vertical length (LP) of the ground pad is made longer than the horizontal length (WP) of the ground pad” is adopted. Thus, the transmission line 100 (transmission line B) of the present embodiment can be said to be a transmission line that can be reduced in reflection and loss while being relatively small. In particular, in the transmission line 100 (transmission line B) of the present embodiment, the inductance is suitably adjusted by providing two through holes for each ground pad 104. Further, in the transmission line 100 of the present embodiment, a pair of ground pads 104 are provided at both ends of the signal line 102. As a result, the transmission line 100 of the present embodiment can be excited by a stable electromagnetic field portion when excited by an integrated circuit connected to the transmission line 100, a probe for measurement evaluation, or the like. Furthermore, the transmission path 100 (transmission path B) of the present embodiment can be easily manufactured because the shape of the ground pad 104 is rectangular.

[Modification]
FIG. 5 is a plan view showing a modification of the transmission line 100 according to the present embodiment. The transmission line 100 shown in FIG. 5 is different from the transmission line 100 shown in FIG. 1 in that a slit 104B is formed in each ground pad 104. The slit 104 </ b> B is a portion of the ground pad 104 that is cut out in a rectangular shape toward the inside of the ground pad 104 at the edge facing the signal line 102. In particular, in the present modification, the slit 104B is located at the center in the longitudinal direction of the ground pad 104 (that is, between the two through holes 104A and ½ of the longitudinal length (LP) of the ground pad). ).

  FIG. 6 is a graph showing insertion loss due to one ground pad in each of the transmission path B shown in FIG. 3 and the transmission path 100 shown in FIG. Here, in the transmission line 100 shown in FIG. 5, in addition to the transmission line B shown in FIG. 3, each ground pad 104 is further provided with a slit 104B whose size is defined as follows.

Length of slit in the vertical direction (T): 0.15 mm
Slit horizontal length (S): 0.1 mm
As shown in FIG. 6, the transmission path 100 (improved transmission) of FIG. 5 in which the slit 104B is formed as compared with the transmission path B (transmission path before improvement) of FIG. 3 in which the slit 104B is not formed. It is clear that the insertion loss of the ground pad is small in most of the frequency bands of 30 GHz to 70 GHz. In particular, by forming a slit in the ground pad, the frequency band width where the insertion loss is −0.1 dB or more with respect to the width of the entire frequency band (frequency band of 30 GHz to 70 GHz) is reduced from 17% to 31%. It can be seen from the graph of FIG.

  This is because, by forming a slit in the ground pad, a current flows so as to bypass the slit in the ground pad, so that the current path length in the ground pad becomes long, thereby giving inductance to the ground pad. It is. In addition, capacitance is loaded on the ground pad by the slit. As a result, a matching pattern is formed on the ground pad by a lumped constant element (which can be regarded as a lumped constant because the wavelength is a few tenths of a wavelength). Can be reduced. In particular, it is possible to match impedance in a wide frequency band as compared with a distributed constant element such as a stub.

[Example 1]
In Example 1, an example in which the transmission line 100 according to the present embodiment is applied to a transmission line including a PWW (Post Wall Waveguide) will be described. FIG. 7 is a diagram illustrating the configuration of the transmission line 100A according to the first embodiment. FIG. 7A is a plan view illustrating a configuration of a transmission line 100A according to the first embodiment. FIG. 7B is a side view illustrating the configuration of the transmission line 100A according to the first embodiment.

  In the transmission line 100A of the first embodiment, a PWW 120 and a transition unit 130 are provided on the signal line 102 with respect to the transmission line 100 of FIG. In FIG. 7A, the dielectric substrate 101 is not shown. The PWW 120 is a hollow waveguide made of a cylindrical conductor. The PWW 120 functions as a transmission medium that transmits a high-frequency signal as an electromagnetic wave by an electric field and a magnetic field formed inside (cavity). As shown in FIG. 7A, a plurality of openings 122 are formed in a vertical direction along the left side of the rectangular PWW 120 in the upper surface of the PWW 120, and the right side of the rectangular PWW 120 in the figure. A plurality of openings 122 are also formed in the vertical direction along the line.

  The transition unit 130 is a part that connects the signal line 102 and the PWW 120. The transition portion 130 has a straight portion that extends linearly from the connection portion with the signal line 102 and a taper portion whose line width gradually increases from the straight portion toward the connection portion with the PWW 120. In particular, the transmission line 100A according to the first embodiment includes a transition unit 130A that connects the signal line 102 and the PWW 120 on one end side of the signal line 102 (upper side in the drawing, the GSG pad 110A side), and the signal line 102. On the other end side (the lower side in the figure, the GSG pad 110B side) of the signal line 102 and the PWW 120.

  The dimensions of each part in the transmission line 100A of the first embodiment are as shown in FIG.

Dielectric substrate material: Liquid crystal polymer substrate Dielectric substrate thickness: 0.175 mm
Longitudinal length of the straight portion of the transition portion: 1.0 mm
Longitudinal length of tapered portion of transition portion: 1.0 mm
Horizontal length (maximum) of tapered portion of transition portion: 0.4 mm
PWW length in the vertical direction: 4.8 mm
PWW lateral length: 4.0 mm
PWW opening diameter: 0.2 mm
Further, in the transmission line 100A of the first embodiment, the dimensions of each part applied to the ground pad 104 are as shown in FIG.

Length in the vertical direction (LP): 0.85mm
Lateral length (WP): 0.4 mm
Through hole diameter: 0.1 mm
Length in the vertical direction of slit (T): 0.1 mm
Slit horizontal length (S): 0.15 mm
Distance from the center of the through hole to the left and right edges (L): 0.15 mm
Distance from center of through hole to upper edge or lower edge (H): 0.2125 mm
[Transmission and reflection characteristics]
FIG. 8 is a graph showing the transmission coefficient | S21 | and reflection coefficient | S11 | of the transmission line 100A of the first embodiment shown in FIG. In the graph of FIG. 8, the width of the frequency band where the reflection coefficient | S11 | is −15 dB or less is 32% of the whole, and the width of the frequency band where the reflection coefficient | S11 | is −20 dB or less is 23% of the whole. Further, the width of the frequency band where the transmission coefficient | S21 | is −1.5 dB or more is 30% of the whole.

  Next, Examples 2 to 8 will be described. In Examples 2 to 8, it was verified how the characteristics change by changing the size of each part of the ground pad 104 by 20 μm using the transmission line 100A of Example 1 as a reference. Note that the dimensions of the ground pad 104 to be changed in Examples 2 to 8 are as shown in FIG. 9 and below. FIG. 9 is a diagram illustrating each part of the ground pad 104 to be changed in the second to eighth embodiments.

(Subject to change)
Vertical length of ground pad (LP)
Horizontal length of ground pad (WP)
Vertical length of slit (T)
Horizontal length of slit (S)
Distance between signal line and ground pad (G)
Distance from the outer edge of the through hole to the inner edge of the ground pad (L)
Distance from the outer peripheral edge of the lower through hole to the lower edge of the ground pad (H)
[Example 2]
In the second embodiment, the gap (G) is changed from the transmission line 100A of the first embodiment. FIG. 10 is a graph showing changes in the transmission coefficient | S21 | and the reflection coefficient | S11 | when the gap (G) is changed in the transmission line 100A of the first embodiment. In the second embodiment, the gap (G) is changed from 30 μm to 110 μm. However, since the present structure is intended for a good operation in a frequency band near 60 GHz, the graph of FIG. A value (G / λ) obtained by standardizing the interval (G) with the wavelength of free space (λ = 5 mm) at 60 GHz is used. From the graph of FIG. 10, it can be confirmed that when G / λ is 0.01 or less, the reflection is −20 dB or less, and particularly good operation is possible.

Example 3
In the third embodiment, the distance (H) is changed from the transmission line 100A of the first embodiment. FIG. 11 is a graph showing changes in the transmission coefficient | S21 | and the reflection coefficient | S11 | when the distance (H) is changed in the transmission line 100A of the first embodiment. In the third embodiment, the distance (H) is changed from 70 um to 270 um. However, as in the second embodiment, in the graph of FIG. 11, the distance (H) is a free-space wavelength (λ) at 60 GHz. = 5 mm), the value normalized (H / λ) is used. From the graph of FIG. 11, although the transmission coefficient | S21 | changes little with H / λ, with respect to the reflection coefficient | S11 |, if H / λ is 0.04 or less, the reflection is −20 dB or less, and − It can be seen that it approaches 25 dB, and it can be confirmed that particularly good operation is possible.

Example 4
In the fourth embodiment, the distance (L) is changed from the transmission line 100A of the first embodiment. FIG. 12 is a graph showing changes in the transmission coefficient | S21 | and the reflection coefficient | S11 | when the distance (L) is changed in the transmission line 100A of the first embodiment. As in the second embodiment, the graph of FIG. 12 uses a value (L / λ) obtained by normalizing the distance (L) with a free space wavelength (λ = 5 mm) at 60 GHz. From the graph of FIG. 12, it can be confirmed that both the transmission coefficient | S21 | and the reflection coefficient | S11 | From the graph of FIG. 12, with respect to the reflection coefficient | S11 |, it can be confirmed that | S11 | is −20 dB or less if at least L / λ is in the range of 0.01 to 0.05.

Example 5
In the fifth embodiment, the length (S) is changed from the transmission line 100A of the first embodiment. FIG. 13 is a graph showing changes in the transmission coefficient | S21 | and the reflection coefficient | S11 | when the length (S) is changed in the transmission line 100A of the first embodiment. As in the second embodiment, the graph of FIG. 13 uses a value (S / λ) obtained by normalizing the length (S) with a free space wavelength (λ = 5 mm) at 60 GHz. From the graph of FIG. 13, it can be confirmed that both the transmission coefficient | S21 | and the reflection coefficient | S11 | From the graph of FIG. 13, with respect to the reflection coefficient | S11 |, it can be confirmed that | S11 | is −20 dB or less if at least S / λ is in the range of 0.02 to 0.06.

Example 6
In the sixth embodiment, the length (T) is changed from the transmission line 100A of the first embodiment. FIG. 14 is a graph showing changes in the transmission coefficient | S21 | and the reflection coefficient | S11 | when the length (T) is changed in the transmission line 100A of the first embodiment. Similarly to Example 2, the graph of FIG. 14 uses a value (T / λ) obtained by normalizing the length (T) with the wavelength of free space (λ = 5 mm) at 60 GHz. From the graph of FIG. 14, it can be confirmed that the transmission coefficient | S21 | changes little depending on T / λ, and the reflection coefficient | S11 | is | S11 when T / λ is 0.04 or more. It can be confirmed that | is -20 dB or less.

Example 7
In the seventh embodiment, the length (WP) is changed from the transmission line 100A of the first embodiment. Accordingly, the center of the through hole is shifted to the midpoint of the length (WP) each time. FIG. 15 is a graph showing changes in the transmission coefficient | S21 | and the reflection coefficient | S11 | when the length (WP) is changed in the transmission line 100A of the first embodiment. Similarly to the second embodiment, the graph of FIG. 15 uses a value (WP / λ) obtained by normalizing the length (WP) with a wavelength of free space (λ = 5 mm) at 60 GHz. From the graph of FIG. 15, it can be confirmed that both the transmission coefficient | S21 | and the reflection coefficient | S11 | From the graph of FIG. 15, with respect to the reflection coefficient | S11 |, it can be confirmed that | S11 | is −20 dB or less when at least WP / λ is in the range of 0.06 to 0.1.

Example 8
In the eighth embodiment, the length (LP) is changed from the transmission line 100A of the first embodiment. FIG. 16 is a graph showing changes in the transmission coefficient | S21 | and the reflection coefficient | S11 | when the length (LP) is changed in the transmission line 100A of the first embodiment. As in the second embodiment, the graph of FIG. 16 uses a value (LP / λ) obtained by normalizing the length (LP) with a free space wavelength (λ = 5 mm) at 60 GHz. From the graph of FIG. 16, it can be confirmed that there is little change in the transmission coefficient | S21 | depending on LP / λ, and for the reflection coefficient | S11 |, when LP / λ is 0.17 or more, | S11 It can be confirmed that | is -20 dB or less.

[Supplementary examples]
For each of the above Examples 2 to 8, the implementation results shown in the graph were re-evaluated as the specific bandwidth (Frequency (relative) Band Width: FBW). Here, each of the bands in which | S11 | is 10 dB, 15 dB, and 20 dB or more is re-evaluated as a specific bandwidth. In this re-evaluation, λ is obtained by dividing the effective dielectric constant of the substrate. The effective dielectric constant is calculated as 2.3 at 60 GHz. As a measure of the specific bandwidth, considering the recent trends of IEEE 802.11ad and WiGig Alliance, a bandwidth of 9 GHz and a specific bandwidth of about 16% are desirable. It is said.

  FIG. 17 is a graph corresponding to the second embodiment, and is a graph showing a change in specific bandwidth when the gap (G) is changed in the transmission line 100A of the first embodiment. In the graph of FIG. 17, a value (G / λ) obtained by normalizing the gap (G) with the wavelength of free space (λ = 5 mm) at 60 GHz is used. From the graph of FIG. 17, it can be confirmed that, for a band where | S11 | = 20 dB or more, by setting G / λ within a range of 0.014 or more and 0.016 or less, a favorable operation can be performed. In addition, in a band where | S11 | = 10 dB or more and a band where | S11 | = 15 dB or more, by setting G / λ within the range of 0.014 or more and 0.035 or less, good operation can be performed. It can be confirmed that this is possible.

  FIG. 18 is a graph corresponding to the third embodiment, and is a graph showing a change in the specific bandwidth when the distance (H) is changed in the transmission line 100A of the first embodiment. In the graph of FIG. 18, the value (H / λ) obtained by normalizing the distance (H) with the wavelength of free space (λ = 5 mm) at 60 GHz is used. From the graph of FIG. 18, for the band where | S11 | = 20 dB or more, H / λ should be in the range of 0.015 to 0.052, or 0.076 to 0.082. Thus, it can be confirmed that a broadband characteristic can be obtained. For a band where | S11 | = 10 dB or more and a band where | S11 | = 15 dB or more, by setting H / λ within a range of 0.015 to 0.101, wideband characteristics ( It can be confirmed that the specific bandwidth is 20% or more.

  FIG. 19 is a graph corresponding to the fourth embodiment, showing a change in the specific bandwidth when the distance (L) is changed in the transmission line 100A of the first embodiment. In the graph of FIG. 19, the value (L / λ) obtained by normalizing the distance (L) with the wavelength of free space (λ = 5 mm) at 60 GHz is used. From the graph of FIG. 19, regarding the band where | S11 | = 20 dB or more, L / λ is in the range of 0.015 or more and 0.033 or less, in the range of 0.0457 or more and 0.0518 or less, or 0. It can be confirmed that broadband characteristics can be obtained by setting the value within the range of 064 to 0.0762. Further, for a band where | S11 | = 10 dB or more and a band where | S11 | = 15 dB or more, by setting L / λ within a range of 0.0152 or more and 0.0762 or less, a wideband characteristic can be obtained. It can be confirmed that it is obtained.

  FIG. 20 is a graph corresponding to the sixth embodiment, showing a change in the specific bandwidth when the length (T) is changed in the transmission line 100A of the first embodiment. In the graph of FIG. 20, the value (T / λ) obtained by normalizing the length (T) with the wavelength of free space (λ = 5 mm) at 60 GHz is used. From the graph of FIG. 20, it can be confirmed that, for a band where | S11 | = 20 dB or more, wide characteristics can be obtained by setting T / λ within the range of 0.012 to 0.036. In addition, for a band where | S11 | = 15 dB or more, it can be confirmed that a wide band characteristic can be obtained by setting T / λ within a range of 0.012 to 0.072. For a band where | S11 | = 10 dB or more, it can be confirmed that a wide band characteristic can be obtained by setting T / λ within the range of 0.006 to 0.116.

  FIG. 21 is a graph corresponding to the fifth embodiment, and is a graph showing the change in the specific bandwidth when the length (S) is changed in the transmission line 100A of the first embodiment. In the graph of FIG. 21, the value (S / λ) obtained by normalizing the length (S) with the wavelength of free space (λ = 5 mm) at 60 GHz is used. From the graph of FIG. 21, it can be confirmed that, for the band where | S11 | = 20 dB or more, by setting S / λ within the range of 0.0213 or more and 0.0457 or less, wideband characteristics can be obtained. Further, for a band where | S11 | = 10 dB or more and a band where | S11 | = 15 dB or more, by setting S / λ within the range of 0.015 or more and 0.17 or less, wideband characteristics can be obtained. It can be confirmed that it is obtained.

  FIG. 22 is a graph corresponding to the seventh embodiment, and is a graph showing a change in the specific bandwidth when the length (WP) is changed in the transmission line 100A of the first embodiment. In the graph of FIG. 22, the value (WP / λ) obtained by normalizing the length (WP) with the wavelength of free space (λ = 5 mm) at 60 GHz is used. From the graph of FIG. 22, for the band where | S11 | = 20 dB or more, WP / λ is in the range of 0.101 or more and 0.106 or less, in the range of 0.115 or more and 0.125 or less, or 0. It can be confirmed that a wide band characteristic can be obtained by setting it within the range of 132 to 0.143. In addition, for a band where | S11 | = 10 dB or more and a band where | S11 | = 15 dB or more, by setting WP / λ within the range of 0.0915 to 0.152, wideband characteristics can be obtained. It can be confirmed that it is obtained.

  FIG. 23 is a graph corresponding to the eighth embodiment, showing a change in the specific bandwidth when the length (LP) is changed in the transmission line 100A of the first embodiment. In the graph of FIG. 23, a value (LP / λ) obtained by normalizing the length (LP) with a wavelength of free space (λ = 5 mm) at 60 GHz is used. From the graph of FIG. 23, it can be confirmed that, for the band where | S11 | = 20 dB or more, by setting LP / λ within the range of 0.229 or more and 0.259 or less, broadband characteristics can be obtained. Also, with respect to a band where | S11 | = 10 dB or more and a band where | S11 | = 15 dB or more, by setting LP / λ within the range of 0.229 or more and 0.289 or less, wideband characteristics can be obtained. It can be confirmed that it is obtained.

[Supplementary information on dimension adjustment method in each embodiment]
(1) In Example 2, the gap (G) was changed by moving the ground pad in the horizontal direction without changing the size and shape of the ground pad.

  (2) In Example 3, the distance (H) was changed by moving the two through holes in the vertical direction without changing the distance between the two through holes and the position in the horizontal direction. In particular, when the distance Δa1 from the outer peripheral edge of the lower through hole to the lower edge of the ground pad is 100 μm or less, the lower limit is set, and the distance from the outer peripheral edge of the upper through hole to the upper edge of the ground pad The distance (H) was changed so that the distance Δa2 was 100 μm or less as the upper limit value and was within the range from the lower limit value to the upper limit value. Note that the position of the slit is not changed.

  (3) In Example 4, the distance (L) was changed by moving the two through holes in the horizontal direction without changing the interval between the two through holes and the position in the vertical direction. In particular, the case where the distance Δb1 from the outer peripheral edge of the through hole to the inner edge (signal line side) edge of the ground pad is 100 μm or less is set as the lower limit, and the distance from the outer peripheral edge of the through hole to the outer edge of the ground pad The distance (L) was changed so that the distance Δb2 was 100 μm or less as the upper limit value and was within the range of the upper limit value from the lower limit value.

  (4) In Example 5, the length (S) was changed by changing the depth of the notch from the inner (signal line side) edge of the ground pad. The lower limit of the length (S) was 50 μm.

  (5) In Example 6, the length (T) was changed without changing the center position of the slit in the vertical direction from the midpoint of the length (LP). The lower limit value of the length (T) was 50 μm.

  (6) In Example 7, while changing the said length (WP), according to this, the center position in the horizontal direction of a through hole was shifted to the midpoint of the said length (WP) each time.

  (7) In Example 8, while changing the length (LP), the center position of the slit in the vertical direction was shifted to the midpoint of the length (LP) accordingly.

  (8) In the eighth embodiment, the length (LP) is changed, and the center position of one through hole in the vertical direction is set to 1/4 of the length (LP) accordingly. The center position in the vertical direction of the other through hole is shifted to a point that is 3/4 of the length (LP).

  FIG. 24 is a schematic diagram illustrating a simulation result of current distribution in the ground pad 104 in the transmission line 100 of the present embodiment. In FIG. 24, the magnitude of the current in the ground pad 104 is represented by the size of arrows. As shown in FIG. 24A, in the frequency band where the impedance is not matched, a strong current flows in the vicinity of the port of the signal line 102 (the lower end portion in the figure), thereby greatly affecting the reflection. On the other hand, as shown in FIG. 24B, in the frequency band in which the impedance is matched, a strong current flows near the center of the ground pad 104 where the slit is formed, and then this current flows to the through hole. Flows in. From such a current distribution, it can be seen that by forming the slit 104B in the ground pad 104, the series and parallel inductances strongly flow in the GSG pad, and impedance matching can be realized.

[Additional Notes]
The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope shown in the claims. That is, embodiments obtained by combining technical means appropriately modified within the scope of the claims are also included in the technical scope of the present invention.

  For example, the size of the ground pad 104 is not limited to that shown in the embodiment. Further, the number of through holes is not limited to two. For example, in the transmission line 100 of the embodiment, the ground pad 104 is extended in the vertical direction and the horizontal direction under the restriction that the ground pad 104 is a vertically long rectangular shape, and accordingly, a slit 104B or a through hole 104A is added. May be.

[Modification of ground pad]
Hereinafter, modified examples of the ground pad 104 will be described with reference to FIGS. 25 and 26. FIG. 25 is a diagram showing a modification of the ground pad 104 in the transmission line 100 of the present embodiment. Transmission paths A to D shown in FIGS. 25A to 25D are different in the shape of the ground pad 104 and the arrangement of the through holes of the transmission path 100 of the embodiment. However, these transmission lines A to D are common in that the ground pad 104 has a vertically long rectangular shape. The transmission path A has the same configuration as the transmission path B shown in FIG.

  The specific configuration of the ground pads of the transmission paths A to D shown in FIG. 25 is as shown below.

(Ground pad for transmission line A)
Total length in the vertical direction: 1.0 mm
Overall length in the horizontal direction: 0.5 mm
Number of through holes: 2 (1 column x 2 rows)
Through-hole spacing: 0.5 mm
(Ground pad for transmission line B)
Total length in the vertical direction: 2.0 mm
Overall length in the horizontal direction: 0.5 mm
Number of through holes: 4 (1 column x 4 rows)
Through-hole spacing: 0.5 mm
(Ground pad of transmission line C)
Total length in the vertical direction: 2.0 mm
Overall length in the horizontal direction: 1.0 mm
Number of through holes: 8 (2 columns x 4 rows)
Through-hole spacing: 0.5 mm
(Ground pad of transmission line D)
Total length in the vertical direction: 3.0 mm
Overall length in the horizontal direction: 1.0 mm
Number of through holes: 12 (2 columns x 6 rows)
Through-hole spacing: 0.5 mm
(Comparison of insertion loss)
FIG. 26 is a graph showing insertion loss due to a pair of ground pads in each transmission path shown in FIG. From the graph of FIG. 26, it can be seen that the transmission path A has a small insertion loss in the entire frequency band. Further, it can be seen that the transmission line D hardly changes with a small insertion loss in the frequency band of 60 GHz or higher compared to the transmission lines B and C. Thus, it can be seen that a good insertion loss characteristic can be obtained in a target frequency band by appropriately designing the shape of the ground pad and the arrangement of the through holes.

  The present invention can be suitably used as various transmission paths for transmitting high-frequency signals. In particular, it can be suitably used as a transmission line that is mounted on a small electronic device and that transmits a high-frequency signal corresponding to millimeter waves or the like.

100 Transmission Line 101 Dielectric Substrate 102 Signal Line 104 Ground Pad 104A Through Hole 104B Slit (Notch)
105 Ground layer 110 GSG pad 120 PWW
130 Transition part

Claims (17)

A dielectric substrate;
A linear signal line formed on the surface of the dielectric substrate;
A pair of rectangular ground pads formed on both sides of the end of the signal line on the surface of the dielectric substrate;
A ground layer formed on the back surface of the dielectric substrate;
A through-hole formed in the dielectric substrate, the through-hole penetrating the dielectric substrate and electrically connecting each of the ground pads and the ground layer;
With
The length LP of the direction along the signal line of the ground pads is much larger than in the direction of the length WP intersecting the signal lines of the ground pads,
For each of the pair of ground pads,
Two through-holes arranged side by side in the direction along the signal line are provided,
Each of the pair of ground pads includes
A transmission path characterized in that a notch is formed between the two through holes so as to face the signal line . The pair of ground pads are
The transmission line according to claim 1 , wherein the transmission line is provided at each of both ends of the signal line. A PWW (Post Wall Waveguide) provided on the signal line;
A transition part for connecting the signal line and the PWW, the transition part gradually increasing in line width from the connection part with the signal line toward the connection part with the PWW;
Transmission line according to claim 1 or 2, further comprising a. A dielectric substrate;
A linear signal line formed on the surface of the dielectric substrate;
A pair of rectangular ground pads formed on both sides of the end of the signal line on the surface of the dielectric substrate;
A ground layer formed on the back surface of the dielectric substrate;
A through-hole formed in the dielectric substrate, the through-hole penetrating the dielectric substrate and electrically connecting each of the ground pads and the ground layer;
With
The length LP of the ground pad in the direction along the signal line is larger than the length WP in the direction of intersecting the signal line of the ground pad,
Den sending passage you characterized in that the gap G between the ground pad and the signal line, divided by the 60GHz of free space wavelength (G / lambda) is 0.01 or less. A dielectric substrate;
A linear signal line formed on the surface of the dielectric substrate;
A pair of rectangular ground pads formed on both sides of the end of the signal line on the surface of the dielectric substrate;
A ground layer formed on the back surface of the dielectric substrate;
A through-hole formed in the dielectric substrate, the through-hole penetrating the dielectric substrate and electrically connecting each of the ground pads and the ground layer;
With
The length LP of the ground pad in the direction along the signal line is larger than the length WP in the direction of intersecting the signal line of the ground pad,
For each of the pair of ground pads,
Two through-holes arranged side by side in the direction along the signal line are provided,
A value (H / λ) obtained by dividing the distance H from the end of the ground pad in the direction along the signal line to the center of the through hole closer to the end by the free space wavelength of 60 GHz is 0. Den sending passage you, characterized in that 04 is less than or equal to. A dielectric substrate;
A linear signal line formed on the surface of the dielectric substrate;
A pair of rectangular ground pads formed on both sides of the end of the signal line on the surface of the dielectric substrate;
A ground layer formed on the back surface of the dielectric substrate;
A through-hole formed in the dielectric substrate, the through-hole penetrating the dielectric substrate and electrically connecting each of the ground pads and the ground layer;
With
The length LP of the ground pad in the direction along the signal line is larger than the length WP in the direction of intersecting the signal line of the ground pad,
For each of the pair of ground pads,
Two through-holes arranged side by side in the direction along the signal line are provided,
A value (L / λ) obtained by dividing the distance L from the edge of the ground pad facing the signal line to the center of the through hole by the free space wavelength of 60 GHz is 0.01 or more and 0.05 or less. Den sending passage you characterized in that it is an internal. A value (S / λ) obtained by dividing the length S of the cutout portion in the direction intersecting the signal line by a free space wavelength of 60 GHz is in a range of 0.02 to 0.06. The transmission line according to claim 1 . The length T of direction along the signal line of the notch, the value obtained by dividing the 60GHz the free space wavelength (T / lambda) is, according to claim 1, characterized in that 0.04 or more Transmission line. A dielectric substrate;
A linear signal line formed on the surface of the dielectric substrate;
A pair of rectangular ground pads formed on both sides of the end of the signal line on the surface of the dielectric substrate;
A ground layer formed on the back surface of the dielectric substrate;
A through-hole formed in the dielectric substrate, the through-hole penetrating the dielectric substrate and electrically connecting each of the ground pads and the ground layer;
With
The length LP of the ground pad in the direction along the signal line is larger than the length WP in the direction of intersecting the signal line of the ground pad,
For each of the pair of ground pads,
Two through-holes arranged side by side in the direction along the signal line are provided,
A value (WP / λ) obtained by dividing the length WP of the ground pad by a free space wavelength of 60 GHz is in the range of 0.06 to 0.1, and the signal line of the ground pad in cross direction, Den sending passage you, characterized in that the through-holes are arranged in one half of the position of the length WP. A dielectric substrate;
A linear signal line formed on the surface of the dielectric substrate;
A pair of rectangular ground pads formed on both sides of the end of the signal line on the surface of the dielectric substrate;
A ground layer formed on the back surface of the dielectric substrate;
A through-hole formed in the dielectric substrate, the through-hole penetrating the dielectric substrate and electrically connecting each of the ground pads and the ground layer;
With
The length LP of the ground pad in the direction along the signal line is larger than the length WP in the direction of intersecting the signal line of the ground pad,
For each of the pair of ground pads,
Two through-holes arranged side by side in the direction along the signal line are provided ,
A value (LP / λ) obtained by dividing the length LP of the ground pad by a free space wavelength of 60 GHz is 0.17 or more, and the length in the direction along the signal line of the ground pad is Den sending passage characterized in that a the through hole at a position of 1/4 of the LP. A dielectric substrate;
A linear signal line formed on the surface of the dielectric substrate;
A pair of rectangular ground pads formed on both sides of the end of the signal line on the surface of the dielectric substrate;
A ground layer formed on the back surface of the dielectric substrate;
A through-hole formed in the dielectric substrate, the through-hole penetrating the dielectric substrate and electrically connecting each of the ground pads and the ground layer;
With
The length LP of the ground pad in the direction along the signal line is larger than the length WP in the direction of intersecting the signal line of the ground pad,
A value (G / λ) obtained by dividing an interval G between the signal line and the ground pad by a free space wavelength of 60 GHz is in a range of 0.014 or more and 0.016 or less, or 0.014 or more and 0.035. Den sending passage you being in the range of less. A dielectric substrate;
A linear signal line formed on the surface of the dielectric substrate;
A pair of rectangular ground pads formed on both sides of the end of the signal line on the surface of the dielectric substrate;
A ground layer formed on the back surface of the dielectric substrate;
A through-hole formed in the dielectric substrate, the through-hole penetrating the dielectric substrate and electrically connecting each of the ground pads and the ground layer;
With
The length LP of the ground pad in the direction along the signal line is larger than the length WP in the direction of intersecting the signal line of the ground pad,
For each of the pair of ground pads,
Two through-holes arranged side by side in the direction along the signal line are provided,
A value (H / λ) obtained by dividing the distance H from the end of the ground pad in the direction along the signal line to the center of the through hole closer to the end by the free space wavelength of 60 GHz is 0. A transmission line characterized by being in the range of .015 to 0.052, in the range of 0.076 to 0.082, or in the range of 0.015 to 0.101 . A value (S / λ) obtained by dividing the length S of the notch in the direction intersecting the signal line by a free space wavelength of 60 GHz is within a range of 0.0213 to 0.0457, or 0.015 The transmission line according to claim 1 , wherein the transmission line is in a range of 0.17 or less . A value (T / λ) obtained by dividing the length T of the notch along the signal line by a free space wavelength of 60 GHz is within a range of 0.012 to 0.036, and 0.012 to 0. The transmission line according to claim 1 , wherein the transmission line is within a range of 0.072 or less, or within a range of 0.006 or more and 0.116 or less . A dielectric substrate;
A linear signal line formed on the surface of the dielectric substrate;
A pair of rectangular ground pads formed on both sides of the end of the signal line on the surface of the dielectric substrate;
A ground layer formed on the back surface of the dielectric substrate;
A through-hole formed in the dielectric substrate, the through-hole penetrating the dielectric substrate and electrically connecting each of the ground pads and the ground layer;
With
The length LP of the ground pad in the direction along the signal line is larger than the length WP in the direction of intersecting the signal line of the ground pad,
For each of the pair of ground pads,
Two through-holes arranged side by side in the direction along the signal line are provided,
A value (L / λ) obtained by dividing the distance L from the edge of the ground pad facing the signal line to the center of the through hole by a free space wavelength of 60 GHz is 0.015 or more and 0.033 or less. range, in the range of 0.0457 or more 0.0518 or less, in the range of 0.064 or more 0.0762 or less, or, feed transfer you being in the range of 0.0152 or more 0.0762 or less Road. A dielectric substrate;
A linear signal line formed on the surface of the dielectric substrate;
A pair of rectangular ground pads formed on both sides of the end of the signal line on the surface of the dielectric substrate;
A ground layer formed on the back surface of the dielectric substrate;
A through-hole formed in the dielectric substrate, the through-hole penetrating the dielectric substrate and electrically connecting each of the ground pads and the ground layer;
With
The length LP of the ground pad in the direction along the signal line is larger than the length WP in the direction of intersecting the signal line of the ground pad,
For each of the pair of ground pads,
Two through-holes arranged side by side in the direction along the signal line are provided,
A value (WP / λ) obtained by dividing the length WP of the ground pad by a free space wavelength of 60 GHz is in the range of 0.101 to 0.106, in the range of 0.115 to 0.125, 0.132 or 0.143 in the range, or, Den sending passage you being in the range of 0.0915 or more 0.152 or less. A dielectric substrate;
A linear signal line formed on the surface of the dielectric substrate;
A pair of rectangular ground pads formed on both sides of the end of the signal line on the surface of the dielectric substrate;
A ground layer formed on the back surface of the dielectric substrate;
A through-hole formed in the dielectric substrate, the through-hole penetrating the dielectric substrate and electrically connecting each of the ground pads and the ground layer;
With
The length LP of the ground pad in the direction along the signal line is larger than the length WP in the direction of intersecting the signal line of the ground pad,
For each of the pair of ground pads,
Two through-holes arranged side by side in the direction along the signal line are provided,
A value (LP / λ) obtained by dividing the length LP of the ground pad by a free space wavelength of 60 GHz is in a range of 0.229 or more and 0.259 or less, or in a range of 0.229 or more and 0.289 or less. Den sending passage you characterized in that it is an internal.

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