JP5699787B2 - Electronic component package sealing member, electronic component package, and electronic component - Google Patents

Description

  The present invention is used as a second sealing member of an electronic component package that hermetically seals the electrodes of the electronic component element by a first sealing member on which the electronic component element is mounted and a second sealing member. The present invention relates to an electronic component package sealing member, an electronic component package using the electronic component package sealing member, and an electronic component in which an electrode of an electronic component element is hermetically sealed in the electronic component package.

  The internal space of an electronic component package such as a piezoelectric vibration device (hereinafter referred to as an electronic component package) is hermetically sealed to prevent deterioration of the characteristics of the electrodes of an electronic component element such as a piezoelectric vibration piece mounted in the internal space. Is done.

  As this type of electronic component package, there is one in which it is constituted by two sealing members such as a base and a lid, and its casing is constituted by a rectangular parallelepiped package. In such an internal space of the package, the electronic component element is held and joined to the base. And the electrode of the electronic component element in the internal space of the package is hermetically sealed by joining the base and the lid.

  For example, Patent Document 1 discloses a piezoelectric vibrator 100 in which a lid 107 is bonded to a flat base 104 on which a piezoelectric vibrating piece 102 is mounted as shown in FIG. In the package of the piezoelectric vibrator 100, the lid 107 includes a top portion 108 and a wall portion 109 that extends downward along the outer peripheral edge of the main surface 112 of the top portion 108, as shown in FIGS. 12 and 13. And includes a cavity 111 (concave portion) having a rectangular shape in plan view and surrounded by a top portion 108 and a wall portion 109. The cavity 111 of the lid 107 serves as a storage space for storing the piezoelectric vibrating piece 102 mounted on the base 104.

  The lid 107 of the package of the piezoelectric vibrator 100 is made of a glass material, and is formed, for example, by forming a cavity 111 on a base material of a single rectangular plate by wet etching or the like.

JP 2009-194859 A

  By the way, in recent years, electronic components tend to be thinned with the downsizing of electronic devices on which the electronic components are mounted, and the lid 107 of the package of the piezoelectric vibrator 100 as shown in FIGS. It tends to be thinner.

  However, since the lid 107 of the package of the piezoelectric vibrator 100 as shown in FIGS. 12 and 13 is formed by forming a rectangular cavity in a single plate made of glass material, The thickness of 108 and the wall part 109 became thin, and sufficient intensity | strength with respect to the impact from the outside was not securable.

  The present invention has been made in view of such a situation, and has a cavity for housing an electronic component element, and has a sufficient strength even when it is thinned. An object of the present invention is to provide an electronic component package using the electronic component package sealing member, and an electronic component in which an electrode of an electronic component element is hermetically sealed in the electronic component package.

An electronic component package sealing member according to the present invention is an electronic component package that hermetically seals the electrodes of the electronic component element by a first sealing member on which the electronic component element is mounted and a second sealing member. A sealing member for an electronic component package used as the second sealing member, which is formed by being surrounded by a top portion and a wall portion provided along the entire outer peripheral edge of one main surface of the top portion. The one main surface of the top portion has a long side and a short side shorter than the long side, and the wall portion is provided to extend from the one main surface. The first long side portion along the long side of the one main surface and the second long side portion facing the first long side portion, the first long side portion and the second long side portion In at least one of the above, the central portion including the center point is formed wider than at least one of both end portions, and the wide portion The inner surface on the cavity side and the outer surface on the opposite side of the cavity are formed in a tapered shape on the mating surface side of the first sealing member and the second sealing member. It is characterized by being.

  In the electronic component package sealing member having such a configuration, in at least one of the first long side portion and the second long side portion of the wall portion, the central portion including the center point is compared with at least one of the both end portions. The strength of the central portion in the longitudinal direction, which is formed in a wide width and is easily affected by an external impact, is improved. Therefore, according to the sealing member for an electronic component package of the present invention, the strength provided in the case of being thinned can be improved, and even in the case of being thinned, the sealing for an electronic component package having sufficient strength is achieved. A stop member can be provided.

  In the electronic component package sealing member according to the present invention, at least one of the first long side portion and the second long side portion, the central portion is formed wider than both end portions. Also good.

  Further, in the electronic component package sealing member according to the present invention, in at least one of the first long side portion and the second long side portion, a portion extending from one end portion to the central portion is compared with the other end portion. , It may be formed wide.

  In this case, in addition to the central portion in the longitudinal direction that is easily affected by external impact, the strength at both ends in the longitudinal direction is improved. For this reason, the strength provided in the case where the thickness is reduced can be further improved.

  In the electronic component package sealing member according to the present invention, the shape of the cavity may be a point-symmetric shape with respect to the center point of the one principal surface.

  In this case, since the cavity is formed in a point-symmetric shape with respect to the center point of the one main surface of the top part, the center part is in both the first long side part and the second long side part of the wall part. , It is wider than at least one of both ends. Therefore, it is possible to further improve the strength of the central portion in the longitudinal direction that is easily affected by an external impact, and it is possible to further improve the strength provided when the thickness is reduced. In addition, since the shape of the cavity is point-symmetric with respect to the center point of one main surface of the top, the first sealing member on which the electronic component element is mounted is used for the electronic component package according to the present invention. When joining the sealing member, it is not necessary to consider the mounting direction of the electronic component element, and alignment with the first sealing member on which the electronic component element is mounted is facilitated.

  An electronic component package according to the present invention is an electronic component package that hermetically seals the electrodes of the electronic component element by a first sealing member on which the electronic component element is mounted and a second sealing member, The second sealing member is an electronic component package sealing member according to the present invention described above.

  In the electronic component package having such a configuration, the second sealing member is the electronic component package sealing member according to the present invention described above, and has a longitudinal central portion that is easily affected by an external impact. It is an improvement. For this reason, the electronic component package according to the present invention has sufficient strength even when it is thinned.

  The electronic component according to the present invention is characterized in that the electrodes of the electronic component element are hermetically sealed by the electronic component package according to the present invention described above.

  In the electronic component having such a configuration, the second sealing member that hermetically seals the electronic component element is the above-described electronic component package sealing member according to the present invention, and is easily affected by an external impact. The strength at the center of the direction is improved. For this reason, the electronic component according to the present invention has sufficient strength even when it is thinned.

  Further, in the electronic component according to the present invention, the substrate of the electronic component element includes two legs that are vibration parts, a base, and a joint that is joined to one main surface of the first sealing member. The two leg portions are provided so as to protrude from one end face of the base portion in a direction orthogonal to the width direction of the base portion, and the joint portion has a tip portion of the base portion. It is provided so as to project toward the other end surface of the base portion in one direction in the width direction, and in the outer shape of the substrate of the electronic component element, the position of the side surface of the leg portion and the position of the side surface of the base portion There may be a tip of the tip of the joined part on the outside in one direction.

  Further, in the electronic component according to the present invention, the substrate of the electronic component element includes two legs that are vibration parts, a base, and a joint that is joined to one main surface of the first sealing member. The two leg portions are provided so as to protrude from one end face of the base portion in a direction orthogonal to the width direction of the base portion, and the joint portion has a tip portion of the base portion. In the outer shape of the substrate of the electronic component element, the position of the tip of the tip of the joint and the side of the leg in the outer shape of the board of the electronic component element toward one direction in the width direction In addition, the side surface of the base portion may be on the outer side in the one direction.

  Further, in the electronic component according to the present invention, the substrate of the electronic component element includes two legs that are vibration parts, a base, and a joint that is joined to one main surface of the first sealing member. The two leg portions are provided so as to protrude from one end surface of the base portion in a direction orthogonal to the width direction of the base portion, and the tip portions of the two leg portions are the leg portions. The joint portion is formed to protrude from the other end surface of the base portion with the tip portion directed in one direction in the width direction of the base portion. In the outer shape of the substrate of the component element, the side surface of the distal end portion of the leg portion may be located outward in the one direction from the position of the distal end of the distal end portion of the joint portion and the side surface of the base portion.

  According to the present invention, an electronic component package sealing member having a cavity for accommodating an electronic component element and having sufficient strength even when thinned, and using the electronic component package sealing member And an electronic component in which the electrodes of the electronic component element are hermetically sealed.

1 is a schematic configuration diagram showing the internal space of the crystal resonator according to the first embodiment, and is a schematic cross-section of the crystal resonator when the whole is cut along the line AA of the base shown in FIG. FIG. FIG. 2 is a schematic plan view of the base according to the first embodiment. FIG. 3 is a schematic rear view of the base according to the first embodiment. FIG. 4 is a schematic back view of the lid according to the first embodiment. FIG. 5 is a schematic plan view of the quartz crystal resonator element according to the first embodiment. 6 is an explanatory diagram for explaining a storage state of the crystal vibrating piece in the cavity of the lid according to the first embodiment, and is a schematic view of the lid in which the crystal vibrating piece is arranged in the cavity when viewed from the top side. It is a top view. FIG. 7 is a schematic back view of the lid according to the second embodiment. FIG. 8 is an explanatory diagram for explaining a storage state of the crystal resonator element in the cavity of the lid according to the second embodiment, and is a schematic plan view of the cover in which the crystal resonator element is disposed in the cavity when viewed from the top side. FIG. FIG. 9 is a schematic back view of a lid according to another embodiment. FIG. 10 is a schematic plan view showing the outer shape of a quartz crystal resonator element according to another embodiment. FIG. 11 is a schematic plan view showing the outer shape of a quartz crystal resonator element according to another embodiment. FIG. 12 is a schematic cross-sectional view showing the internal space of a conventional piezoelectric vibrator. FIG. 13 is a schematic back view of the lid of the piezoelectric vibrator shown in FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiment, the present invention is applied to a package of a crystal resonator that is a piezoelectric vibration device as an electronic component package, and the present invention is applied to a tuning fork type crystal vibration piece that is a piezoelectric vibration piece as an electronic component element. The case where it is applied is shown.

<Embodiment 1>
As shown in FIG. 1, the crystal resonator 1 (electronic component according to the present invention) according to the first embodiment includes a crystal vibrating piece 2 (electronic component element according to the present invention) made of a tuning-fork type crystal piece, The crystal vibrating piece 2 is held, and a base 4 (first sealing member in the present invention) for hermetically sealing the crystal vibrating piece 2 is disposed so as to face the base 4 and held by the base 4. Lid 7 (sealing member for electronic component package as the second sealing member according to the present invention) for hermetically sealing the excitation electrodes 31 and 32 (electrodes of the electronic component element according to the present invention) of the crystal vibrating piece 2 And are provided.

  In this crystal unit 1, the base 4 and the lid 7 are joined by a joining material 12 including a brazing material made of an alloy of Au and Sn, and by this joining, a main body housing including an internal space 11 that is hermetically sealed. Composed. In the internal space 11, the crystal vibrating piece 2 is ultrasonically bonded to the base 4 by an FCB method (Flip Chip Bonding) using conductive bumps 13 such as gold bumps. In the first embodiment, the conductive bump 13 is a plated bump made of a non-fluid member such as a gold bump. The base 4 and the crystal vibrating piece 2 may be joined by a conductive resin joining material.

  Next, each configuration of the crystal resonator 1 will be described.

  The base 4 is made of a glass material such as borosilicate glass, and as illustrated in FIGS. 1 to 3, a wall portion extending upward from the bottom portion 41 along the outer periphery of the bottom surface 41 and one main surface 42 of the base 4. 44 is formed into a box-like body. Such a base 4 is formed into a box-like body by wet-etching a base material of a single rectangular parallelepiped plate.

  The inner surface of the wall portion 44 of the base 4 is formed into a taper shape. The top surface of the wall 44 is a joint surface with the lid 7, and a first joint layer 48 for joining with the lid 7 is provided on the joint surface. The first bonding layer 48 has a laminated structure of a plurality of layers, and includes a sputtered film 481 formed by sputtering on the top surface of the wall portion 44 of the base 4 and a plated film 482 formed by plating on the sputtered film. It consists of. The sputtered film 481 includes a Ti film (not shown) formed by sputtering on the top surface of the wall 44 of the base 4 and an Au film (not shown) formed by sputtering on the Ti film. Become. The plating film 482 is made of an Au film plated on the sputter film 481.

  On one main surface 42 of the base 4, a cavity 45 having a rectangular shape in plan view surrounded by a bottom 41 and a wall 44 is formed. A pedestal 46 is etched on the bottom surface 451 of the cavity 45 along the entire one end 452 in the longitudinal direction. The crystal vibrating piece 2 is mounted on the pedestal portion 46. The wall surface of the cavity 45 is the inner surface of the wall portion 44 and is formed in a tapered shape as described above.

  Further, as shown in FIGS. 1 and 3, the other main surface 43 (back surface of the casing) of the base 4 has a taper that is inclined from the other main surface 43 toward the one main surface 42 along the entire outer peripheral edge 47. A surface 471 is formed.

  The base 4 includes a pair of electrode pads 51 and 52 that are electromechanically bonded to the excitation electrodes 31 and 32 of the crystal vibrating piece 2, and external terminal electrodes 53 that are electrically connected to external components and external devices. 54, an electrode pad 51 and an external terminal electrode 53, and a wiring pattern 55 for electrically connecting the electrode pad 52 and the external terminal electrode 54 are formed. These electrode pads 51, 52, external terminal electrodes 53, 54 and wiring pattern 55 constitute a base 4 electrode. The electrode pads 51 and 52 are formed on the surface of the pedestal portion 46.

  The electrode pads 51 and 52 include a first sputtered film 61 formed by sputtering on the substrate of the base 4, a second sputtered film 62 formed on the first sputtered film 61, and an upper surface of the second sputtered film. And an Au plating film 63 formed on the substrate. The first sputtered film 61 constituting the electrode pads 51 and 52 is formed by sputtering a Ti film (not shown) formed on the main surface 42 of the base 4 by sputtering and sputtering on the Ti film by sputtering. The second sputtered film 62 includes a Ti film (not shown) formed by sputtering on the first sputtered film 61 and a sputtering method on the Ti film. It consists of an Au film (not shown) formed by sputtering. The Au plating film 63 is made of an Au film formed by plating on the second sputter film 62.

  The wiring pattern 55 is formed from the main surface 42 of the base 4 through the inner side surface 491 of the through hole 49 (see below) so as to electrically connect the electrode pads 51 and 52 and the external terminal electrodes 53 and 54. 4 is formed on the other main surface 43. The wiring pattern 55 includes a first sputtered film 61 formed on the substrate of the base 4, and the second sputtered film 61 located on the one main surface 42 of the base 4 has a second sputtered film 61. A sputtered film 62 and an Au plated film 63 are formed. The first sputtered film 61, the second sputtered film 62, and the Au plated film 63 of the wiring pattern 55 are respectively the first sputtered film 61, the second sputtered film 62, and the Au plated film 63 of the electrode pads 51 and 52 described above. It is set as the same structure.

  As shown in FIG. 3, the external terminal electrodes 53 and 54 are provided on the tapered surface 471 of the other main surface 471. Specifically, it is provided at both ends of the other main surface 43 in the longitudinal direction, and is arranged side by side along the longitudinal direction.

  In addition, the external terminal electrodes 53 and 54 include a second sputtered film 62 formed on the first sputtered film 61 constituting the wiring pattern 55 formed on the other main surface 43 of the base 4, and the second sputtered film 62. The Ni plating film 64 formed thereon and the Au plating film 65 formed on the Ni plating film 64 are configured. The second sputtered film 62 of the external terminal electrodes 53 and 54 has the same configuration as that of the second sputtered film 62 of the electrode pads 51 and 52 and the wiring pattern 55 described above. In the external terminal electrodes 53 and 54, the Ni plating film 64 is made of an Ni film plated on the second sputtered film 62, and the Au plating film 65 is made of an Au film plated on the Ni plating film 64. .

  In addition, as shown in FIGS. 1 to 3, the excitation electrode 31, 32 of the crystal vibrating piece 2 is led out from the cavity 45 to the outside of the cavity 45 by the wiring pattern 55 through the electrode pads 51, 52. A through-hole 49 is formed for this purpose.

  The through hole 49 is formed by wet etching simultaneously with the formation of the cavity 45 when the base 4 is formed by wet etching by photolithography. As shown in FIGS. 1 to 3, the two through holes 49 are formed in the base 4. It is formed so as to penetrate between both main surfaces 42 and 43. An inner side surface 491 of the through hole 49 has an inclination with respect to the one main surface 42 and the other main surface 43 of the base 4 and is formed in a tapered shape. As shown in FIG. 1, the diameter of the through hole 49 is maximum at the end portion on the other main surface 43 side of the base 4 and is minimum at the end portion on the one main surface 42 side of the base 4. Thus, in the first embodiment, the inner side surface 491 of the through hole 49 is inclined with respect to the one main surface 42 and the other main surface 43 of the base 4, and the one main surface 42 and the through hole of the base 4. The angle θ formed by the inner surface 491 of 49 is about 45 degrees, but is not limited to this. For example, the angle θ formed by one main surface 42 of the base 4 and the inner side surface 491 of the through hole 49 is greater than 45 degrees, and may be 70 to 90 degrees as a specific example. When the angle θ formed by one main surface 42 of the base 4 and the inner side surface 491 of the through hole 49 is close to 90 degrees, the area occupied by the through hole 49 in the base 4 is reduced, and the degree of freedom of the location where the wiring pattern 55 is formed is reduced. Can be increased. As a method for forming the through hole 49, a method other than the wet etching method, for example, a shot blasting method such as a dry etching method or a sand blasting method, or a drilling method using a drill may be employed. is there.

  A first sputtered film 61 made of Ti and Cu, which is a part of the wiring pattern 55, is formed on the inner side surface 491 of the through hole 49. Further, a filler made of Cu is filled on the first sputtered film 61 inside the through hole 49 to form a filled layer 66, and the through hole 49 is blocked by the filled layer 66. ing. The filling layer 66 is constituted by a Cu plating layer formed by electrolytic plating on the surface of the first sputtered film 61.

  A resin pattern 67 made of a resin material is formed on the other main surface 43 of the base 4. In the first embodiment, the resin pattern 67 is formed on the other main surface 43 of the base 4 in the entire region except the region where the external terminal electrodes 53 and 54 are formed. The resin pattern 67 closes the end portion on the other main surface 43 side of the through-hole 49 in which the filling layer 66 is formed, and the sealing strength of the through-hole 49 is ensured. The bonding strength of the resin pattern 67 to the base material (glass material) of the base 4 is such that the resin pattern 67 is formed in the entire region except the formation region of the external terminal electrodes 53 and 54 on the other main surface 43 as described above. Thus, the sufficient contact area between the base material constituting the base 4 and the resin pattern 67 is ensured. Further, in the base 4 according to the first embodiment, as a manufacturing method thereof, when a method of forming a large number of bases 4 on a wafer and separating the bases 4 formed on the wafer by dicing is adopted, Since the periphery of the outer peripheral edge 47 of the base 4 serving as a wafer cutting portion is covered with the resin pattern 67, occurrence of chipping of the wafer (glass material) due to dicing is suppressed.

  Polybenzoxazole (PBO) is used for the resin material constituting the resin pattern 67. In addition, the resin material which comprises the resin pattern 67 is not limited to PBO, Any resin material with favorable adhesiveness with the material (for example, glass material) which comprises the base 4 can be used. Therefore, as the resin material constituting the resin pattern 67, for example, benzocyclobutene (BCB), epoxy, polyimide, or the like may be used in addition to PBO. Further, the resin material constituting the resin pattern 67 used in the first embodiment, that is, PBO, is a resin material having photosensitivity, and is a resin material capable of pattern formation by a photolithography method. Here, the photosensitive resin material has a broad concept including a photosensitive resin composition including a photosensitive agent and a resin in addition to a resin material made of a photosensitive resin.

  The lid 7 is made of a glass material such as borosilicate glass. As shown in FIGS. 1 and 4, the lid 7 is provided along the entire outer periphery of the top portion 71 and the one main surface 72 of the top portion 71. And a wall portion 73 extending downward from one main surface 72 of 71. Such a lid 7 is formed by wet-etching a base material of a single rectangular parallelepiped.

  One main surface 72 of the top portion 71 has a rectangular shape composed of two sides (long sides) 721 and 722 in the longitudinal direction and two sides (short sides) 723 and 724 in the short direction.

  Both side surfaces (inner side surface 731 and outer side surface 732) of the wall portion 73 of the lid 7 are formed in a taper shape, and the lid 7 is surrounded by one main surface 72 of the top portion 71 and the inner side surface 731 of the wall portion 73. The cavity 75 is provided.

  Further, as shown in FIG. 4, the wall portion 73 has a first long side portion 81 along one side 721 in the longitudinal direction of the one major surface 72 of the top portion 71 and another side 722 in the longitudinal direction of the one major surface 72. A second long side portion 82 (second long side portion 82 facing the first long side portion 81), a first short side portion 83 along one side 723 in the short direction of the one main surface 72, and one main surface 72 and a second short side portion 84 along the other side 724 in the short direction.

  Further, a central portion 812 (a portion having a width indicated by W3 in FIG. 4) including the center point C1 of the first long side portion 81 (center point C1 located at the center of the first long side portion 81 in plan view) Compared with both end portions 811 and 813 of the first long side portion 81 (a portion having a width indicated by W1 and a portion having a width indicated by W2 in FIG. 4), the first long side portion 81 is formed wider. Specifically, in the wall portion 73, the width of the central portion 812 of the first long side portion 81 (the width along the short direction of the one main surface 72) W3 is the both end portions 811 and 813 of the first long side portion 81. Width (width along the short direction of one main surface 72) W1 and W2. Similarly, a center portion 822 (a portion having a width indicated by W6 in FIG. 4) including the center point C2 of the second long side portion 82 (center point C2 located at the center of the second long side portion 82 in plan view) is. The second long side portion 82 is formed wider than both end portions 821 and 823 (a portion having a width indicated by W4 and a portion having a width indicated by W5 in FIG. 4). Specifically, in the wall portion 73, the width of the central portion 822 of the second long side portion 82 (the width along the short direction of the one main surface 72) W6 is the both end portions 821 and 823 of the second long side portion 822. (Width along the short side direction of one main surface 72) W4, W5 is set wider.

  The first long side portion 81 has a center point C3 at the center of the second long side portion 82 and the main surface 72 of the top portion 71 (a central point located at the center of the main surface 72 in plan view). The first short side portion 83 is shaped symmetrically with the second short side portion 84 and the center of one main surface 72 of the top portion 71 as the center point C3.

  Further, as described above, both side surfaces (the inner side surface 731 and the outer side surface 732) of the wall portion 73 are formed in a tapered shape. Specifically, the center portions 812 and 822 of the first long side portion 81 and the second long side portion 82 that are formed wide, and both end portions 811 and 813 of the first long side portion 81 and the second long side portion 82 are formed. 821 and 823, and the first short side portion 83 and the second short side portion 84, both side surfaces (the inner side surface 731 and the outer side surface 732) are tapered.

  With such a configuration of the wall portion 73, the cavity 75 surrounded by the one principal surface 72 of the top portion 71 and the inner side surface 731 of the wall portion 73 is pointed with respect to the center point C <b> 3 of the one principal surface 72 of the top portion 71. It has a symmetric shape, and the spaces S1 and S3 (one end portion 811 of the first long side portion 81, one end portion 821 of the second long side portion 82, and the first short side portion 83 of both ends in the longitudinal direction of the cavity 75 are formed. The space S1 surrounded by the inner side surface 731 and the one main surface 72 of the top portion 71, the other end portion 813 of the first long side portion 81, the other end portion 823 of the second long side portion 82, and the second A space S3 surrounded by the inner side surface 731 of the short side portion 84 and the one main surface 72 of the top portion 71 is a space S2 in the central portion in the longitudinal direction of the cavity 75 (the central portion 812 of the first long side portion 81). And a space S2 surrounded by the inner side surface 731 of the central portion 822 of the second long side portion 82 and the one main surface 72 of the top portion 71. A wide (wide in the lateral direction of the main surface 72) than.

  The wall portion 73 is formed with a second bonding layer 74 for bonding to the base 4.

  As shown in FIGS. 1 and 4, the second bonding layer 74 of the lid 7 is formed from the top surface 733 to the outer surface 732 of the wall portion 73 of the lid 7. The second bonding layer 74 has a laminated structure in which a Ti film (not shown) made of Ti is formed, and an Au film (not shown) made of Au is formed on the Ti film. The Au film is formed by sputtering using a sputtering method.

  The bonding material 12 for bonding the base 4 and the lid 7 is laminated on the second bonding layer 74 of the lid 7 before the base 4 and the lid 7 are bonded. In this bonding material 12, an Au / Sn film (not shown) made of an alloy of Au and Sn is formed on the second bonding layer 74 of the lid 7 by plating, and an Au film (not shown) is formed on the Au / Sn film. (Omitted) consists of a plurality of laminated structures plated. The Au film has a laminated structure of a plurality of layers in which an Au strike plating film is formed by plating and an Au plating film is formed by plating on the Au strike plating film. In such a bonding material 12, the Au / Sn film is melted by heating to become an AuSn alloy film. The bonding material 12 may be configured by plating an AuSn alloy film on the second bonding layer 74 of the lid 7. In the first embodiment, the bonding material 12 is laminated on the second bonding layer 74 of the lid 7 before the bonding between the base 4 and the lid 7, but is laminated on the first bonding layer 48 of the base 4. May be.

  The crystal vibrating piece 2 is a crystal Z plate formed by wet etching from a crystal element plate (not shown) that is a crystal piece of anisotropic material.

  As shown in FIG. 5, the crystal vibrating piece 2 includes two leg portions 21 and 22 that are vibration portions, a base portion 23, and a joint portion 24 that is joined to the electrode pads 51 and 52 of the base 4. From the piezoelectric vibration element plate (substrate) 20 in which two leg portions 21 and 22 protrude from one end surface 231 of the base portion 23 and a joint portion 24 protrudes from the other end surface 232 of the base portion 23. Become.

  As shown in FIG. 5, the base 23 has a symmetrical shape in plan view. Further, the side surface 233 of the base portion 23 is formed so that the portion on the one end surface 231 side has the same width as the one end surface 231 and the portion on the other end surface 232 side gradually narrows toward the other end surface 232 side. .

  As shown in FIG. 5, the two leg portions 21 and 22 are provided so as to protrude from the one end surface 231 of the base portion 23 in the same direction (a direction orthogonal to the width direction of the base portion 23). The tip portions 211 and 221 of the two leg portions 21 and 22 are formed wider than the other portions of the leg portions 21 and 22 (wide in the direction orthogonal to the protruding direction), and further, The tip corner is curved. Further, a groove portion 25 is formed on both main surfaces of the two leg portions 21 and 22 in order to improve the CI value (series resistance value).

  As shown in FIG. 5, the joint portion 24 is provided so as to protrude from the central portion in the width direction of the other end surface 232 of the base portion 23. The joint portion 24 includes a short side portion 241 that protrudes in a direction perpendicular to the other end surface 232 of the base portion 23, and a front end portion of the short side portion 241 that is connected to the front end portion of the short side portion 241 and folded at a right angle in plan view. The long side portion 242 is bent and extends in one direction X in the width direction of the base portion 23, and the tip end portion 243 of the joint portion 24 faces in one direction X in the width direction of the base portion 23. That is, the joint portion 24 is formed in an L shape in plan view. Further, in the outer shape of the piezoelectric vibration element plate 20, the distal end of the distal end portion 243 of the joint portion 24 is one portion in the width direction of the base portion 23 rather than the position of the side surface 233 of the base portion 23 and the side surfaces 212 and 222 of the leg portions 21 and 22. Located outside of direction X. Further, the joint portion 24 is provided with a joint portion 27 to be joined to the electrode pads 51 and 52 of the base 4 via the conductive bumps 13.

  In the quartz crystal resonator element 2 having the above-described configuration, the first and second excitation electrodes 31 and 32 configured at different potentials, and the first and second excitation electrodes 31 and 32 are connected to the electrode pad 51 of the base 4. , 52 are formed with lead electrodes 33, 34 drawn from the first and second excitation electrodes 31, 32.

  Part of the first and second excitation electrodes 31 and 32 is formed inside the groove 25 of the legs 21 and 22. For this reason, even if the crystal vibrating piece 2 is downsized, the vibration loss of the legs 21 and 22 is suppressed, and the CI value can be suppressed low.

  The first excitation electrode 31 is formed on both main surfaces of one leg portion 21, both side surfaces of the other leg portion 22, and both main surfaces of the tip end portion 221. Similarly, the second excitation electrode 32 is formed on both main surfaces of the other leg portion 22, both side surfaces of the one leg portion 21, and both main surfaces of the tip end portion 211.

  The extraction electrodes 33 and 34 are formed on the base portion 23 and the joint portion 24, and the first excitation electrodes formed on both main surfaces of the one leg portion 21 by the extraction electrode 33 formed on the base portion 23. 31 is connected to the first excitation electrodes 31 formed on both side surfaces of the other leg portion 22 and both main surfaces of the tip portion 221, and the extraction electrode 34 formed on the base portion 23 causes the other leg portion 22 to The second excitation electrodes 32 formed on both main surfaces are connected to the second excitation electrodes 32 formed on both side surfaces of one leg portion 21 and both main surfaces of the tip portion 211.

  The base 23 is formed with two through holes 26 penetrating both main surfaces of the piezoelectric vibration element plate 20, and the through holes 26 are filled with a conductive material. Through these through holes 26, extraction electrodes 33 and 34 are routed between both main surfaces of the base portion 23.

  In the crystal resonator 1 having the above-described configuration, as shown in FIG. 1, the joint portion 24 of the crystal resonator element 2 is connected to the pedestal portion 46 formed on the one main surface 42 of the base 4 through the conductive bump 13. Electromechanically ultrasonically bonded by the method. By this bonding, the excitation electrodes 31 and 32 of the quartz crystal vibrating piece 2 are electromechanically bonded to the electrode pads 51 and 52 of the base 4 via the extraction electrodes 33 and 34 and the conductive bumps 13, and are attached to the base 4. A crystal vibrating piece 2 is mounted. Then, the lid 7 is temporarily bonded to the base 4 on which the crystal vibrating piece 2 is mounted by the FCB method, and then heated in a vacuum atmosphere, whereby the bonding material 12, the first bonding layer 48, and the second bonding layer. 74 is melted, whereby the second bonding layer 74 of the lid 7 is bonded to the first bonding layer 48 of the base 4 via the bonding material 12, and the crystal resonator element 2 is hermetically sealed. Is manufactured. The conductive bump 13 is a plated bump made of a non-fluid member. The plating bump is a metal film formed by plating, specifically, a metal film formed by plating on a base metal layer (seed layer) by electrolytic plating or the like. The film thickness of the metal film can be adjusted by changing the plating conditions, and the metal film can be formed on the base metal layer in a thick film. In addition, since the shape of the upper surface of the metal film changes according to the shape of the base metal layer, the shape of the top surface of the metal film is made flat or convex by appropriately adjusting the shape of the base metal layer. be able to.

  In such a crystal unit 1, as shown in FIG. 4, in the wall portion 73 of the lid 7, the center portion 812 including the center point C <b> 1 of the first long side portion 81 is the both end portions of the first long side portion 81. Compared to 811 and 813, the center portion 822 that is formed wider and includes the center point C <b> 2 of the second long side portion 82 is formed wider than both end portions 821 and 823 of the first long side portion 82. Yes. For this reason, in the lid 7, the strength of the central portion in the longitudinal direction that is easily affected by an external impact is improved. Therefore, the above-described crystal resonator 1 has sufficient strength even when the lid 7 is thinned due to the thinning of the lid 7.

  Further, in the cavity 75 of the lid 7, the spaces S1 and S3 at both ends in the longitudinal direction are wider in the lateral direction than the center space S2 including the center point C3. 6 (only the outer shape of the lid 7 and the crystal vibrating piece 2 is shown), one space S3 of these both end portions is the tip portions 211, 2 of the two legs 21 and 22 of the crystal vibrating piece 2. The other space S <b> 1 is a storage space for storing the base portion 23 and the joint portion 24 of the crystal vibrating piece 2. Such a cavity 75 of the lid 7 has a point-symmetric shape with respect to the center point C3 of the main surface 72 of the top portion 71, and the main surface 42 of the base 4 on which the crystal vibrating piece 2 is mounted ( When the lid 7 is joined to the lid 7 (see FIG. 1), the crystal vibrating piece 2 mounted on the base 4 can be accommodated in the cavity 75 of the lid 7 even if the lid 7 is inverted by 180 °. Specifically, as shown in FIG. 6, one space S3 at both ends of the cavity 75 is a storage space for storing the tip portions 211 and 221 of the two legs 21 and 22 of the crystal vibrating piece 2, The other space S1 can be used as a storage space for storing the base portion 23 and the joint portion 24 of the crystal vibrating piece 2, and the lid 7 shown in FIG. One space S3 is a storage space for storing the base portion 23 and the joint portion 24 of the crystal vibrating piece 2, and the other space S1 is the tip portions 211 and 221 of the two legs 21 and 22 of the crystal vibrating piece 2. It is also possible to provide a storage space for storing. For this reason, when the lid 7 is joined to one main surface 42 of the base 4 on which the crystal vibrating piece 2 is mounted, it is not necessary to consider the mounting direction of the crystal vibrating piece 2 on the base 4 and the crystal vibrating piece 2 is mounted. The lid 7 can be easily aligned with the base 4 formed.

  Further, when the lid 7 is joined to the main surface 42 of the base 4 on which the crystal vibrating piece 2 is mounted by the joining material 12, the joining material laminated on the second joining layer 74 formed on the wall portion 73 of the lid 7. 12 is heated from both ends 811, 813, 821, 823 of the first long side portion 81 and the second long side portion 82 of the wall portion 73 to the first long side portion 81 and the second long side portion 82. It is easy to flow toward the center portions 812 and 822, and the melt of the bonding material 12 tends to accumulate in the center portions 812 and 822 of the first long side portion 81 and the second long side portion 82 of the wall portion 73. In the first aspect, since the first long side portion 81 of the wall portion 73 of the lid 7 and the central portions 812 and 822 of the second long side portion 82 are formed wide, the first long side portion 81 of the wall portion 73 and Even if the melt of the bonding material 12 accumulates in the central portions 812 and 822 of the second long side portion 82, the melt It never enters the interior space 11 of the package of the vibrator 1, stable vibration characteristics can be obtained.

<Embodiment 2>
As shown in FIGS. 7 and 8, the crystal resonator 1 according to the second exemplary embodiment has the shape described above in which the shape of the wall portion 76 of the lid 7 and the outer shape of the legs 28 and 29 of the crystal vibrating piece 2 are as described above. This is different from Form 1. The other configuration is the same as that of the crystal unit 1 according to the first embodiment, and the effects and modifications of the same configuration are the same as those of the first embodiment. For this reason, with respect to the crystal resonator 1 according to the second embodiment, differences from the crystal resonator 1 according to the first embodiment are mainly described below.

  In the crystal unit 1 according to the second embodiment, the lid 7 is made of a glass material such as borosilicate glass, and as shown in FIG. 7, the entire outer peripheral edge of the top 71 and the one main surface 72 of the top 71. And a wall portion 76 extending downward from one main surface 72 of the top portion 71. Such a lid 7 is formed by wet-etching a base material of a single rectangular parallelepiped.

  Both side surfaces (inner surface 761 and outer surface 762) of the wall portion 76 of the lid 7 are formed in a taper shape, and the lid 7 is surrounded by one main surface 72 of the top portion 71 and the inner surface 761 of the wall portion 76. The cavity 77 is provided.

  As shown in FIG. 7, the wall portion 76 of the lid 7 includes a first long side portion 85 along one side 721 in the longitudinal direction of the one main surface 72 of the top portion 71 and the other side 722 in the longitudinal direction of the one main surface 72. The second long side portion 86 along the short side direction of the one main surface 72, the first short side portion 87 along the short side direction 723 of the one main surface 72, and the second short side portion along the short side direction 724 of the one main surface 72. 88. Here, the first end 851 in the longitudinal direction of the first long side 85 and the one end 861 in the longitudinal direction of the second long side 86 correspond (opposite via the first short side 87), and the first long The other end portion 853 in the longitudinal direction of the side portion 85 corresponds to the other end portion 863 in the longitudinal direction of the second long side portion 86 (facing via the second short side portion 88). Further, in the first long side portion 85, a portion including the center point C1 of the first long side portion 85 (center point C1 located at the center of the first long side portion 85 in plan view) is referred to as a center portion 852. In the two long side portions 86, a portion including the center point C <b> 2 of the second long side portion 86 (center point C <b> 2 positioned at the center of the second long side portion 86 in plan view) is referred to as a center portion 862.

  A portion (the portion having a width indicated by W8 in FIG. 7) from the other end portion 853 of the first long side portion 85 to the central portion 852 is one end portion 851 (W7 in FIG. 7) of the first long side portion 85. Compared to the portion having the width shown), the shape is wider. Specifically, in the wall portion 76, the width of the portion extending from the other end portion 853 of the first long side portion 85 to the central portion 862 (the width along the short direction of the one major surface 72) W8 is the first long side. The width of the one end portion 851 of the portion 85 (the width along the short direction of the one main surface 72) W7 is set. Further, a portion (a portion having a width indicated by W10 in FIG. 7) extending from one end portion 861 to the central portion 862 of the second long side portion 86 is a portion having a width indicated by W9 in FIG. ) And wider than that. Specifically, in the wall portion 76, the width (width along the short direction of the one principal surface 72) W10 of the portion extending from the one end portion 861 to the central portion 862 of the second long side portion 86 is the second long side portion. 86 is set wider than the width W9 of the other end portion 863 (the width along the short direction of the one main surface 72).

  The first long side portion 85 has a center point C3 at the center of the second long side portion 86 and the main surface 72 of the top portion 71 (a central point located at the center of the main surface 72 in plan view). It is shaped symmetrically. The first short side portion 87 is shaped symmetrically with the second short side portion 88 and the center of the main surface 72 of the top portion 71 as the center point C3.

  Further, as described above, both side surfaces (the inner side surface 761 and the outer side surface 762) of the wall portion 76 are formed in a tapered shape. Specifically, a portion extending from the other end 853 of the first long side 85 to the center 852, one end 851 of the first long side 85, and one end 861 of the second long side 86 formed in a wide shape. To the center portion 862, the other end portion 863 of the second long side portion 86, and the first short side portion 87 and the second short side portion 88, both side surfaces (inner side surface 761 and outer side surface 762). ) Is tapered.

  With such a configuration of the wall portion 76, the cavity 77 surrounded by the one main surface 72 of the top portion 71 and the inner side surface 761 of the wall portion 76 is formed on the main surface 72 of the top portion 71 as shown in FIG. It has a point-symmetric shape with respect to the center point C3, and spaces S4 and S6 at both ends in the longitudinal direction of the cavity 77 (one end portion 851 of the first long side portion 85, one end portion 861 of the second long side portion 86, and Other than the space S4 surrounded by the inner side surface 761 of the first short side portion 87 and the one main surface 72 of the top portion 71, the other end portion 853 of the first long side portion 85, and the second long side portion 86. A space S6 surrounded by the end portion 863 and the inner side surface 761 of the second short side portion 88 and the one main surface 72 of the top portion 71 is a space S5 (first length in the longitudinal direction) of the cavity 77. A central portion 852 of the side portion 85, an inner side surface 761 of the central portion 862 of the second long side portion 86, and a main surface 72 of the top portion 71. Than the spatial S5) surrounded the wide (wide in the lateral direction of the main surface 72).

  Further, a second bonding layer 74 for bonding to the base 4 is formed on the wall portion 76.

  As shown in FIG. 7, the second bonding layer 74 of the lid 7 is formed from the top surface 763 to the outer surface 762 of the wall portion 76 of the lid 7. The second bonding layer 74 has a laminated structure in which a Ti film (not shown) made of Ti is formed, and an Au film (not shown) made of Au is formed on the Ti film. The Au film is formed by sputtering using a sputtering method.

  Further, as shown in FIG. 8 (only the outer shape of the lid 7 and the quartz crystal vibrating piece 2 is shown), the quartz crystal vibrating piece 2 of the quartz crystal resonator 1 according to Embodiment 2 is two vibrating parts. The crystal vibrating piece 2 according to the first embodiment (see FIG. 5) is that the tip portions 281 and 291 of the leg portions (vibrating portions) 28 and 29 are formed with the same width as other portions of the leg portions 28 and 29. Unlike FIG. 5), the other configuration is the same as that of the crystal vibrating piece 2 according to the first embodiment. In the outer shape of the piezoelectric vibration element plate 20 of the quartz crystal resonator element 2 according to the second embodiment, the distal end of the distal end portion 243 of the joint portion 24 is the side surface 233 of the base portion 23 and both side surfaces 282 and 292 of the leg portions 28 and 29. It is located outside the one direction X in the width direction of the base 23 rather than the position.

  In such a crystal resonator 1, as shown in FIG. 7, in addition to the first long side portion 85 of the wall portion 76 of the lid 7 and the central portions 852 and 862 of the second long side portion 86, the first long side portion The other end portion 853 of 85 and the one end portion 861 of the second long side portion are formed wider than the one end portion 851 of the first long side portion 85 and the other end portion 863 of the second long side portion 86. . For this reason, in the lid 7, in addition to the central portion in the longitudinal direction that is easily affected by external impact, the strength of both end portions in the long side direction is improved. Therefore, the above-described crystal resonator 1 has sufficient strength even when the lid 7 is thinned due to the thinning of the lid 7.

  Further, in the cavity 77 of the lid 7, the spaces S4 and S6 at both ends in the longitudinal direction are wider in the lateral direction than the space S5 at the center in the longitudinal direction. Specifically, as shown in FIG. 7, the space S4 at one end portion in the longitudinal direction is such that the side end portion S41 on the first long side 85 side of the cavity 77 is larger than the space S5 at the center portion in the longitudinal direction. Projects outward. Further, in the space S6 at the other end portion in the longitudinal direction, the side end portion S61 on the second long side portion 86 side protrudes outward of the cavity 77 from the space S5 at the central portion in the longitudinal direction. For this reason, for example, as shown in FIG. 8, the quartz crystal resonator element 2 is arranged in the width direction of the base 23 rather than the tip 243 of the joint 24 (the side 233 of the base 23 and the positions of both sides of the legs 28 and 29. Can be accommodated in the cavity 77 with the tip 243) having the tip outward in one direction X toward the first long side 85. That is, in the cavity 77, the side end S41 (the side end S41 protruding outward of the cavity 77) on the first long side 85 side of the space S4 at one end in the longitudinal direction is connected to the joint 24. A storage space for storing the distal end portion 243 can be used. Such a cavity 77 of the lid 7 has a point-symmetric shape with respect to the center point C3 of the main surface 72 of the top portion 71, and the main surface 42 of the base 4 on which the crystal vibrating piece 2 is mounted ( When the lid 7 is joined to the lid 7 (see FIG. 1), the crystal vibrating piece 2 mounted on the base 4 can be accommodated in the cavity 75 of the lid 7 even if the lid 7 is inverted by 180 °. Specifically, in the cavity 77, as shown in FIG. 8, the side end portion S41 on the first long side portion 85 side of the space S4 at one end portion in the longitudinal direction (projects toward the outside of the cavity 77). The side end portion S41) can be used as a storage space for storing the tip end portion 243 of the joint portion 24 of the quartz crystal vibrating piece 2, and the second long side portion 86 side of the space S6 at the other end portion in the longitudinal direction. The side end portion S61 (the side end portion S61 protruding toward the outside of the cavity 77) may be used as a storage space for storing the distal end portion 243 of the joint portion 24 of the crystal vibrating piece 2. For this reason, when the lid 7 is joined to one main surface 42 of the base 4 on which the crystal vibrating piece 2 is mounted, it is not necessary to consider the mounting direction of the crystal vibrating piece 2 on the base 4 and the crystal vibrating piece 2 is mounted. The lid 7 can be easily aligned with the base 4 formed.

  In addition, when the lid 7 is bonded to the main surface 42 of the base 4 on which the crystal vibrating piece 2 is mounted by the bonding material 12, the bonding material laminated on the second bonding layer 74 formed on the wall portion 76 of the lid 7. 12 is heated from both ends 851, 853, 861, and 863 of the first long side 85 and second long side 86 of the wall 76 to the first long side 85 and the second long side 86. The melt of the bonding material 12 tends to accumulate in the central portions 852 and 862 of the first long side portion 85 and the second long side portion 86 of the wall portion 76. In Form 2, since the first long side portion 85 of the wall portion 76 of the lid 7 and the central portions 852 and 862 of the second long side portion 86 are formed wide, the first long side portion 85 of the wall portion 76 and Even if the melt of the bonding material 12 accumulates in the central portions 852 and 862 of the second long side portion 86, the melt It never enters the interior space 11 of the package of the vibrator 1, stable vibration characteristics can be obtained.

  In the base 4 (see FIGS. 1 to 3) of the crystal unit 1 according to the first and second embodiments, the base 45 may not have the cavity 45 formed therein. That is, the base 4 may have a flat plate shape, and the effects of the present invention can be obtained even in the crystal resonator 1 using such a flat plate-like base 4.

  Further, in the base 4 (see FIGS. 1 to 3) of the crystal unit 1 according to the first and second embodiments, the first bonding layer 48 includes a Ti film and an Au film formed by sputtering on the base material of the base 4. The sputtered film 481 is made of an Au film plated on the sputtered film 481. However, the present invention is not limited to this structure. For example, the first bonding layer 48 includes a sputtering film formed of a Ti film and an Au film formed by sputtering on a base material of the base 4, a Ni plating film formed by plating on the sputtering film, and a Ni plating film. It may be composed of an Au plating film formed by plating thereon. As described above, when the Ni plating film is interposed between the sputtering film and the Au plating film, the corrosion of the sputtering film (Au film) by the brazing material (AuSn alloy) included in the second bonding layer 75 can be prevented. In addition, the strength of joining the base 4 and the lid 7 can be improved.

  In the crystal resonator 1 according to the first and second embodiments described above, the electrode pads 51 and 52 and the wiring pattern 55 on the side of the main surface 42 of the base 4 are formed of the Ti film and Cu formed on the base 4 substrate. A first sputtered film 61 made of a film, a second sputtered film 62 made of a Ti film and an Au film formed on the first sputtered film 61, and Au formed by plating on the second sputtered film 62 The electrode configuration of the electrode pads 51 and 52 and the wiring pattern 55 is not limited to this, but a sputtered film made of a Ti film and a Cu film on the substrate of the base 4. A structure in which a sputtered film composed of a Ti film and an Au film is formed directly without using an Au film, and an Au film is plated on the sputtered film may be employed. That is, the sputtered film of the wiring pattern 55 on the inner surface 491 of the through hole 49 may be composed of a Ti film and an Au film. Thus, when the sputtered film on the inner side surface 491 of the through hole 49 is composed of a Ti film and an Au film, the filling layer 66 is formed by plating on the sputtered film of the wiring pattern 55 on the inner side surface 491 of the through hole 49. If the AuSn plating layer is used, the adhesion strength between the sputtered film of the wiring pattern 55 on the inner surface 491 and the filling layer 66 can be improved.

  Further, in the base 4 of the crystal resonator 1 according to the first and second embodiments, the external terminal electrodes 53 and 54 are Ti films formed on the first sputtered film 61 constituting the wiring pattern 55 as described above. And a second sputtered film 62 made of Au film, a Ni plated film 64 made of Ni plated on the second sputtered film 62, and Au made of Au plated on the Ni plated film 64 However, the present invention is not limited to this configuration. For example, an Au plating film made of Au directly on the second sputter film 62 (not through the Ni plating film 64 made of Ni). May be formed. Alternatively, an Au / Cu alloy plating film or a Pd plating film is formed on the second sputtered film 62 instead of the Ni plating film 64, and the Au / Cu alloy plating film or the Pd plating film is formed on the Au / Cu alloy plating film or the Pd plating film. A plating film may be formed.

  Further, in the crystal resonator 1 according to the first and second embodiments, the resin pattern 67 is formed on the other main surface 43 of the base 4 in the entire region except the region where the external terminal electrodes 53 and 54 are formed. The resin pattern 67 may be formed only at the end portion of the through hole 49 on the other main surface 43 side and the periphery thereof. Alternatively, the resin pattern 67 may not be formed.

  Further, in the crystal resonator 1 according to the first and second embodiments, the other main surface 43 of the base 4 is formed with a tapered surface along the entire outer peripheral edge 47, but the present invention has such a configuration. It is not limited to. For example, the other main surface 43 of the base 4 may be formed with a tapered surface only at a portion of the outer peripheral edge 47 facing the external terminal electrodes 53 and 54. Or the other main surface 43 of the base 4 may be comprised by the flat surface as a whole.

  In addition, in the lid 7 (see FIGS. 4 and 7) of the crystal unit 1 according to the first and second embodiments, an AuSn alloy is used as the brazing material included in the second bonding layer 75. The bonding layer 75 is not particularly limited as long as it includes a brazing material capable of forming a bonding material for bonding the base 4 and the lid 7. For example, the bonding layer 75 is configured using a Sn alloy brazing material such as CuSn. It may be what was done.

  Further, in the lid 7 (see FIGS. 4 and 7) of the crystal resonator 1 according to the first and second embodiments, the surfaces constituting the cavities 75 and 77 (that is, the inner surfaces 731 and 761 of the wall portions 73 and 76, And the one main surface 72) of the top part 71 may be coat | covered with the getter material (for example, Ti or Cr etc.) which has the effect which adsorb | sucks gas. In this case, the gas in the internal space 11 of the crystal unit 1 can be adsorbed to the getter material to suppress the amount of gas in the internal space 11, so that the electrodes of the electronic component elements such as the piezoelectric vibrating piece are deteriorated. It is possible to prevent the CI value (series equivalent resistance) from deteriorating.

  Further, in the lid 7 (see FIGS. 4 and 7) of the crystal unit 1 according to the first and second embodiments, the first long side portions 81 and 85 and the second long side portion 82 of the wall portions 73 and 76, 86, both central portions 812, 822, 852, and 862 are formed to be wide, but the present invention is not limited to such a configuration, and the first long side portion and the second long side portion of the wall portion are not limited thereto. As long as at least one of the central portions is formed wider than at least one of both end portions thereof, any material may be used. For example, as shown in FIG. 9, the lid 7 is formed such that the central portion 892 of the first long side portion 89 has the same width as other portions including both end portions 891 and 893, while the second long side portion The central portion 912 of 91 (the portion having the width indicated by W13 in FIG. 9) is compared with the end portions 911 and 913 (the portion having the width indicated by W11 and the portion having the width indicated by W12 in FIG. 9). It is also possible to include a wall portion 78 that is formed to be wide. Also in the lid 7 having such a configuration, the strength of the central portion in the longitudinal direction of the lid 7 can be improved by the central portion 912 of the second long side portion 91 formed to be wide.

  In addition, in the lid 7 of the crystal unit 1 according to the first and second embodiments, one main surface 72 of the top portion 71 is rectangular, but the present invention is limited to such a configuration. The top part may be any one as long as it has a long side and a short side shorter than the long side. For example, the top has a parallelogram shape composed of two long sides and two short sides, or the length of one side (long side) is set longer than the length of the other side (short side). It may have a pentagonal main surface.

  In the first and second embodiments, glass is used as the material for the base 4 and the lid 7. However, the base 4 and the lid 7 are not limited to those made of glass. For example, it may be configured using quartz.

  In addition to the crystal vibrating piece 2, an IC chip may be mounted on the base 4 according to the first and second embodiments to configure an oscillator. When an IC chip is mounted on the base 4, electrodes corresponding to the electrode configuration of the IC chip are formed on the base 4.

  Further, in the quartz crystal resonator element 2 hermetically sealed in the package (see FIGS. 1 and 6) of the quartz crystal resonator 1 according to the first embodiment, the tip of the tip portion 243 of the joint portion 24 is a piezoelectric vibrator element plate. The outer shape of the base portion 23 is not limited to the piezoelectric vibrating piece 2 shown in FIG. That is, the quartz crystal resonator element 2 hermetically sealed in the package of the quartz crystal resonator 1 according to the first embodiment is most outward along the one direction X in the width direction of the base portion 23 in the outer shape of the piezoelectric vibrator element plate 20. There may be a side surface 233 of the base portion 23 or a side surface 212 of the leg portion 21, and the package of the crystal unit 1 according to the first embodiment has, for example, the outer shape shown in FIGS. 10 and 11. It is possible to hermetically seal the crystal vibrating piece 2.

  Specifically, in the crystal resonator element 2 having the outer shape shown in FIG. 10, the length of the long side portion 242 extending in one direction X of the width direction of the base portion 23 is the length of the crystal resonator element 2 shown in FIG. 5. It is set shorter than the side portion 242, and the tip portions 281 and 291 of the two leg portions (vibrating portions) 28 and 29 are formed to have the same width as the other portions of the leg portions 28 and 29. Unlike the quartz crystal vibrating piece 2 shown in FIG. 5, in the outer shape of the piezoelectric vibrating base plate 20, the width direction of the base portion 23 is larger than the positions of the tip end portion 243 of the joint portion 24 and the side surfaces 282 and 292 of the leg portions 28 and 29. There is a side surface 233 of the base 23 outside the one direction X. In other words, the quartz crystal vibrating piece 2 having the outer shape shown in FIG. 10 has the side surface 233 of the base portion 23 at the outermost side along the one direction X in the width direction of the base portion 23 in the outer shape of the piezoelectric vibrating base plate 20. Other configurations are the same as those of the quartz crystal vibrating piece 2 shown in FIG. 5, and the same components have the same functions and effects as those of the quartz crystal vibrating piece 2. Further, even in the quartz crystal resonator 1 in which the quartz crystal resonator element 2 having the outer shape shown in FIG. 10 is hermetically sealed, the same operational effects as those of the quartz crystal resonator 1 according to the first embodiment can be obtained.

  Further, in the crystal resonator element 2 having the outer shape shown in FIG. 11, the length of the long side portion 242 extending in one direction X in the width direction of the base portion 23 is the long side portion 242 of the crystal resonator element 2 shown in FIG. 5. Unlike the crystal vibrating piece shown in FIG. 5, the piezoelectric vibrating element is different from the quartz vibrating piece shown in FIG. 5 in that the width of the base 23 is set slightly larger than the width of the base 23 of the quartz vibrating piece 2 shown in FIG. In the outer shape of the plate 20, the side surface 233 of the base portion 23 is located outside the front end of the front end portion 243 of the joint portion 24 in one direction X in the width direction of the base portion 23. The side surface 212 of the tip end portion 211 of the leg portion 21 is located outside the position in one direction X. That is, the quartz crystal vibrating piece 2 having the outer shape shown in FIG. 11 is one more than the position of the tip of the tip portion 243 facing the one direction X of the joint portion 24 and the side surface 233 of the base portion 23 in the outer shape of the piezoelectric vibrating base plate 20. Outside the direction X, there is a side surface 212 of the tip 211 of the leg 21. In other words, in the outer shape of the piezoelectric vibration element plate 20, the side surface 212 of the distal end portion 211 of the leg portion 21 is at the outermost side along the one direction X in the width direction of the base portion 23. Other configurations are the same as those of the quartz crystal vibrating piece 2 shown in FIG. 5, and the same components have the same functions and effects as those of the quartz crystal vibrating piece 2. Further, even in the crystal resonator 1 in which the crystal resonator element 2 having the outer shape shown in FIG. 11 is hermetically sealed, the same operational effects as those of the crystal resonator 1 according to the first embodiment can be obtained.

  As mentioned above, although the embodiment at the time of applying the electronic component package according to the present invention to the package of the crystal unit 1 is shown, this is a preferred embodiment, and the electronic component package according to the present invention is an electronic component. Any element may be used as long as the electrode of the element is sealed by the first sealing member and the second sealing member. Therefore, the electronic component package according to the present invention includes the first sealing member and the second sealing member, and the excitation electrode of the piezoelectric vibrating piece formed of a piezoelectric material other than quartz, for example, lithium tantalate or lithium niobate. The piezoelectric vibration device package may be hermetically sealed.

  The present invention can be implemented in various other forms without departing from the spirit or main features thereof. For this reason, the above-described embodiment is merely an example in all respects and should not be interpreted in a limited manner. The scope of the present invention is indicated by the claims, and is not restricted by the text of the specification. Further, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention.

1 Crystal resonator (electronic parts)
11 Internal space 12 Bonding material 13 Conductive bump 2 Crystal vibrating piece (electronic component element)
20 Piezoelectric vibrating base plate 21, 22 Leg portion 211, 221 Tip portion 212, 222 Side surface 23 Base portion 231 One end surface 232 Other end surface 233 Side surface 24 Joint portion 241 Short side portion 242 Long side portion 243 Tip portion 25 Groove portion 26 Through hole 27 Joint Location 28, 29 Leg part 281, 291 Tip part 282, 292 Side face 31, 32 Excitation electrode 33, 34 Extraction electrode 4 Base (first sealing member)
41 Bottom 42 One main surface 43 Other main surface 44 Wall portion 45 Cavity 451 Bottom surface 452 One end portion 46 Base portion 47 Outer peripheral edge 471 Tapered surface 48 First bonding layer 481 Sputtered film 482 Plating film 49 Through hole 491 Inner side surface 51, 52 Electrode Pad 53, 54 External terminal electrode 55 Wiring pattern 61 First sputtered film 62 Second sputtered film 63 Au plated film 64 Ni plated film 65 Au plated film 66 Filling layer 67 Resin pattern 7 Lid (electronic component as second sealing member) Package sealing material)
71 Top portion 72 Primary surface 721,722 Longitudinal side 723,724 Short side direction 73 Wall portion 731 Outer side surface (outer peripheral edge portion)
732 Inner surface 733 Top surface 74 Second bonding layer 75 Cavity 76 Wall 761 Outer surface (outer peripheral edge)
762 inner surface 763 top surface 77 cavity 78 wall portion 781 outer side surface (outer peripheral edge portion)
782 Inner side surface 783 Top surface 79 Cavity 81 First long side portion 811 One end portion 812 Central portion 813 The other end portion 82 Second long side portion 821 One end portion 822 Central portion 823 The other end portion 83 First short side portion 84 Second short Side part 85 First long side part 851 One end part 852 Central part 853 Other end part 86 Second long side part 861 One end part 862 Central part 863 Other end part 87 First short side part 88 Second short side part 89 First long side Side portion 891 One end portion 892 Central portion 893 The other end portion 91 Second long side portion 911 One end portion 912 Central portion 913 The other end portion 92 First short side portion 93 Second short side portion

Claims (9)

Electronic component package used as the second sealing member of an electronic component package that hermetically seals the electrodes of the electronic component element by a first sealing member on which the electronic component element is mounted and a second sealing member Sealing member for
A cavity formed by being surrounded by the top and a wall provided along the entire outer peripheral edge of one main surface of the top;
The one main surface of the top has a long side and a short side shorter than the long side,
The wall portion includes a first long side portion that extends from the one main surface and extends along the long side of the one main surface, and a second long side portion that faces the first long side portion. And
In at least one of the first long side portion and the second long side portion, a central portion including a center point is formed wider than at least one of both end portions,
The inner surface on the cavity side and the outer surface on the opposite side of the cavity are formed in a taper shape on the wide molded portion and on the mating surface side of the first sealing member and the second sealing member. An electronic component package sealing member characterized by the above. The electronic component package sealing member according to claim 1,
In at least one of the first long side portion and the second long side portion, the central portion is formed wider than both end portions. An electronic component package sealing member, wherein: The electronic component package sealing member according to claim 1,
In at least one of the first long side portion and the second long side portion, a part extending from one end portion to the central portion is formed wider than the other end portion. Sealing member. An electronic component package sealing member according to any one of claims 1 to 3,
The shape of the cavity is a point-symmetric shape with respect to the center point of the one principal surface. An electronic component package sealing member, wherein: An electronic component package that hermetically seals the electrodes of the electronic component element by a first sealing member on which the electronic component element is mounted and a second sealing member,
The electronic component package according to claim 1, wherein the second sealing member is a sealing member for an electronic component package according to claim 1.   An electronic component, wherein an electrode of the electronic component element is hermetically sealed by the electronic component package according to claim 5. The electronic component according to claim 6,
The substrate of the electronic component element is composed of two leg portions that are vibration portions, a base portion, and a joint portion that is joined to one main surface of the first sealing member,
The two leg portions are provided so as to protrude from one end surface of the base portion in a direction orthogonal to the width direction of the base portion,
The joint portion is provided to protrude from the other end surface of the base portion with a tip portion directed in one direction in the width direction of the base portion.
In the outer shape of the substrate of the electronic component element, the tip of the tip of the joint is located outward in the one direction from the position of the side of the leg and the position of the side of the base. Electronic parts. The electronic component according to claim 6,
The substrate of the electronic component element is composed of two leg portions that are vibration portions, a base portion, and a joint portion that is joined to one main surface of the first sealing member,
The two leg portions are provided so as to protrude from one end surface of the base portion in a direction orthogonal to the width direction of the base portion,
The joint portion is provided to protrude from the other end surface of the base portion with a tip portion directed in one direction in the width direction of the base portion.
In the outer shape of the substrate of the electronic component element, the side surface of the base portion is located outward in the one direction with respect to the position of the front end portion of the joint portion and the side surface of the leg portion. parts. The electronic component according to claim 6,
The substrate of the electronic component element is composed of two leg portions that are vibration portions, a base portion, and a joint portion that is joined to one main surface of the first sealing member,
The two leg portions are provided so as to protrude from one end surface of the base portion in a direction orthogonal to the width direction of the base portion,
The tip portions of the two leg portions are formed wider than other portions of the leg portions,
The joint portion is provided to protrude from the other end surface of the base portion with a tip portion directed in one direction in the width direction of the base portion.
In the outer shape of the substrate of the electronic component element, the side surface of the distal end portion of the leg portion is located outward in the one direction from the position of the distal end portion of the joint portion and the side surface of the base portion. Features electronic components.

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