JP5690522B2 - Substrate bonding apparatus and method for manufacturing bonded substrate - Google Patents

Description

The present invention relates to a substrate bonding apparatus for bonding two substrates and a method for manufacturing a bonded substrate .

  As described in Patent Document 1, the substrate bonding apparatus is provided so that an upper stage for holding an upper substrate and the upper stage are opposed to each other when bonding a pair of substrates through a sealant. A lower stage for holding a lower substrate to be bonded to the upper substrate, and moving the upper stage in the vertical direction, the upper substrate held on the upper stage, and the lower substrate held on the lower stage, And a detection device for detecting a relative displacement amount between the first driving device that changes the distance between the upper substrate and the upper substrate held on the upper stage and the lower substrate held on the lower stage. And the relative position of the upper substrate held on the upper stage and the lower substrate held on the lower stage by moving the lower stage based on the amount of displacement detected by the detection device. It provided was a second drive device for performing, and a control device for controlling the first driving unit and the second driving device.

  Then, the control device performs coarse alignment (A) below and fine alignment (B) below.

(A) Coarse alignment The upper substrate and the lower substrate are set at a rough alignment position where the distance between the upper substrate and the lower substrate is a predetermined distance, and a rough alignment mark provided on the upper substrate is detected by the detection device at the rough alignment position. Coarse alignment is performed so that the amount of positional deviation from the coarse alignment mark provided on the lower substrate falls within an allowable range. This rough alignment is performed once to a plurality of times until the positional deviation amount of the rough alignment marks on both the substrates falls within the allowable range. In this rough alignment, a low-magnification camera suitable for the accuracy of the loading position when loading and holding each substrate on each stage is used as a detection device. The carry-in position accuracy is accompanied by a large positional deviation as compared with the alignment accuracy required in fine alignment.

(B) Precise alignment After eliminating the large positional deviation based on the loading position accuracy of each substrate by coarse alignment, set the upper substrate and the lower substrate to the precise position where their facing distance is narrower than the rough alignment position, At the precise alignment position, precise alignment is performed in which the amount of positional deviation between the fine alignment mark provided on the upper substrate and the fine alignment mark provided on the lower substrate detected by the detection device falls within an allowable range. This fine alignment is performed once to a plurality of times until the positional deviation amount of the fine alignment marks on both the substrates falls within an allowable range. In this fine alignment, a high-magnification camera is used to align the fine alignment marks provided on each substrate with high accuracy. Since a high-magnification camera has a narrow depth of focus, it is necessary to position the fine alignment marks on both substrates within this narrow depth of focus, and the opposing interval between both substrates is reduced as described above.

JP2003-131241

  However, when fine alignment is performed by narrowing the facing distance between the two substrates from the rough alignment position to the precise alignment position, a new positional deviation (horizontal positional deviation) is caused by reducing the distance between the two substrates. Sometimes. This is mainly due to the inclination of the moving direction of the upper stage by the first driving device. As described above, when the two substrates set at the precise alignment positions after the coarse alignment are accompanied by a new positional shift, the number of fine alignments increases and the productivity deteriorates.

  The object of the present invention is to reduce the interval between two substrates from the rough alignment position to the fine alignment position, and perform rough alignment and fine alignment at each position to bond the substrates. Is to improve productivity.

In the substrate bonding apparatus according to the present invention, when two substrates are bonded together with an adhesive, the first stage holding one substrate and the first stage are provided facing each other. A second stage for holding the other substrate to be bonded to one substrate, a first driving device for changing the facing distance between the first stage and the second stage, and the first stage. And a detection device that detects a relative displacement amount between the one substrate and the other substrate held on the second stage, and a displacement amount detected by the detection device. At least one of the first stage and the second stage is moved, and the relative relationship between the one substrate held on the first stage and the other substrate held on the second stage Position And a control device for controlling the first drive device and the second drive device, wherein the control device connects the one substrate and the other substrate to each other. The first driving device and the first driving device and the first substrate and the other substrate are set so as to have a rough alignment position where the facing distance is a predetermined distance, and relative alignment between the one substrate and the other substrate is performed at the rough alignment position. In addition to controlling the second driving device, the one substrate after the rough alignment and the other substrate are set to an alignment position where the facing distance is narrower than the rough alignment position. In the substrate bonding apparatus that controls the first driving device and the second driving device so as to perform relative fine alignment between the one substrate and the other substrate, the control device includes two sheets. Pasting the substrate When repeating a plurality of combinations, the target value of the rough alignment of the two subsequent substrates is canceled out by the positional deviation amount of the two substrates detected at the first fine alignment after the rough alignment of the two preceding substrates. Value.

In the method for manufacturing a bonded substrate according to the present invention, one substrate and the other substrate are set at a rough alignment position where the facing distance between them is a predetermined distance, and the one substrate and the substrate are aligned at the rough alignment position. Rough alignment with the other substrate is performed, and the one substrate after the rough alignment and the other substrate are set to an alignment position where the facing interval is narrower than the rough alignment position, and the alignment position is In the method of manufacturing a bonded substrate , wherein the first substrate and the second substrate are relatively precisely aligned, and the first and second substrates are bonded after the accurate alignment. When a plurality of sets of substrates are repeated, the target values of the rough alignment of the subsequent two substrates are detected at the first fine alignment after the rough alignment of the two preceding substrates. It is obtained by way a value that cancels the positional deviation amount of the substrate.

According to the present invention, it is possible to improve the productivity while reducing the number of times of performing the precise alignment for keeping the positional deviation amount of the two substrates set at the precise position within the allowable range.

FIG. 1 is a schematic view showing a substrate bonding apparatus. FIG. 2 is a schematic diagram showing a rough alignment state. FIG. 3 is a schematic diagram showing a fine alignment state. FIG. 4 is a schematic diagram showing the alignment state of the preceding substrate and the alignment state of the subsequent substrate.

  As shown in FIG. 1, the substrate bonding apparatus 10 includes a vacuum chamber 13, and a lower stage (first stage) 11 that holds a lower substrate 31 such as a glass substrate is provided therein. An upper stage (second stage) 12 is provided inside the vacuum chamber 13 so as to face the lower stage 11, and holds an upper substrate 32 such as a glass substrate bonded to the lower substrate 31. It is like that. The vacuum chamber 13 includes an evacuation valve 14 connected to a vacuum source (not shown), and an air release valve connected to a gas supply source (not shown) for supplying a gas such as nitrogen or air. 15 is attached so that evacuation and release to the atmosphere can be performed as necessary.

  A holding mechanism (not shown) such as an electrostatic chuck is provided on the surface of the lower stage 11 and the upper stage 12 so that the lower substrate 31 or the upper substrate 32 can be held. Further, the upper stage 12 is provided with a Z-axis motor (first driving device) 23 for moving the upper stage 12 in the Z direction (vertical direction), and between the lower substrate 31 and the upper substrate 32. The vertical distance (opposite spacing) can be changed. Further, the lower stage 11 is provided with a lower stage driving unit (second driving device) 26 for moving the lower stage 11 in the X direction, the Y direction, and the θ direction. Can be aligned relative to each other in the plane direction (XY plane direction).

  Here, on the surface of the lower substrate 31 held by the lower stage 11, an adhesive made of an ultraviolet curable resin so as to draw a closed loop pattern surrounding a desired area corresponding to the display area of the liquid crystal display panel. The sealing agent 33 is applied. In addition, a predetermined amount of liquid crystal 34 is dropped inside the closed-loop sealant 33 in a form of being scattered at a plurality of locations. Near the four corners of the lower substrate 31 and the upper substrate 32, coarse alignment marks for alignment and fine alignment marks (not shown) are provided.

  As shown in FIG. 1, below the vacuum chamber 13, a low magnification CCD that images each of a rough alignment mark and a fine alignment mark (not shown) provided on the lower substrate 31 and the upper substrate 32. A camera (detection device) 16 and a high magnification CCD camera (detection device) 17 are provided. Further, above the vacuum chamber 13, illumination devices 28 and 29 for irradiating illumination light near the rough alignment mark and the fine alignment mark (not shown) provided on the lower substrate 31 and the upper substrate 32. Is provided. The CCD cameras 16 and 17 and the illumination devices 28 and 29 each have four sets of coarse alignment marks and fine alignment marks (not shown) provided near the four corners of the lower substrate 31 and the upper substrate 32, respectively. Each of the four is provided correspondingly. In the lower stage 11, cavities 11 a and 11 b are provided in portions corresponding to the imaging optical paths of the CCD cameras 16 and 17, and portions of the outer wall of the vacuum chamber 13 corresponding to the imaging optical paths of the CCD cameras 16 and 17 are provided. Are provided with transparent bodies 13a and 13b. Further, in the upper stage 12, cavities 12 a and 12 b are provided in portions corresponding to the illumination light paths of the illumination devices 28 and 29, and a portion corresponding to the illumination light paths of the illumination devices 28 and 29 on the outer wall of the vacuum chamber 13. Are provided with transparent bodies 13c and 13d. As the transparent bodies 13a, 13b, 13c, and 13d, any material can be used as long as it is a material that transmits light and has a sufficient strength as an outer wall of the vacuum chamber 13. For example, a hard glass or resin is used. A material etc. can be used.

  Here, the image processing device 20 is connected to the CCD cameras 16 and 17, and the image processing results obtained by the CCD cameras 16 and 17 are processed by the image processing device 20, whereby the lower substrate 31 and the upper substrate 32. It is possible to detect a relative positional deviation amount in the plane direction between them (a vector amount having both direction and amount information). The CCD cameras 16 and 17 and the image processing device 20 constitute a detection device.

  Further, a controller 21 (control device) is connected to the image processing device 20, and the controller 21 controls the lower stage driving unit 26 via the motor controller 22, whereby the CCD cameras 16 and 17 and the image processing are performed. The lower stage 11 can be moved in the X direction, the Y direction, and the θ direction based on the amount of displacement detected by the apparatus 20. The controller 21 and the motor controller 22 constitute a control device. Here, a Z-axis motor 23 is also connected to the motor controller 22, and the upper stage 12 can be moved in the Z direction by controlling the Z-axis motor 23 by the controller 21 and the motor controller 22. It has become. The camera controller 18 is also connected to the motor controller 22, and the camera 21 is controlled by the controller 21 and the motor controller 22, so that the CCD cameras 16 and 17 are moved in the X, Y, and Z directions. It can be moved to.

  The controller 21 reduces the distance between the lower substrate 31 and the upper substrate 32 by a predetermined amount, and performs the relative alignment in the planar direction of the lower substrate 31 and the upper substrate 32 at each distance. The motor 23 and the lower stage drive unit 26 are controlled.

  Here, the controller 21 displays a rough alignment mark and a fine alignment mark (not shown) provided on the lower substrate 31 and the upper substrate 32 in accordance with the vertical position of the lower substrate 31 or the upper substrate 32 in the CCD camera. The camera drive unit 18 is controlled via the motor control unit 22 so as to be positioned within the depth of focus of 16 and 17, and the position of the CCD cameras 16 and 17 in the Z direction can be changed. In order to change the focal position of the CCD cameras 16 and 17, the focal distance of the CCD cameras 16 and 17 may be changed by controlling an autofocus mechanism provided in the CCD cameras 16 and 17. Further, the controller 21 controls the illumination devices 28 and 29 so as to irradiate the lower substrate 31 and the upper substrate 32 with illumination light with different illuminances according to the position of the lower substrate 31 or the upper substrate 32. Yes.

Next, the substrate bonding operation by the substrate bonding apparatus 10 will be described.
(1) A loading space for the lower substrate 31 and the upper substrate 32 is formed by separating the vacuum chamber 13 vertically and the like, and the lower stage 11 and the upper stage 12 are disposed in a state of being sufficiently separated from each other. The upper substrate 32 is held at 12 and the lower substrate 31 is held at the lower stage 11. At this time, the sealant 33 is applied to the surface of the lower substrate 31 in advance so as to draw a closed loop pattern surrounding a desired area corresponding to the display area of the manufactured liquid crystal display panel, A predetermined amount of liquid crystal 34 is dropped at a plurality of locations inside the closed-loop sealant 33.

  Near the four corners of the lower substrate 31 and the upper substrate 32, coarse alignment marks 31R and 32R (FIG. 2A) for alignment and fine alignment marks 31F and 32F (FIG. 3A) are provided. ) Is provided.

  In this state, the evacuation valve 14 connected to a vacuum source (not shown) is opened to evacuate the vacuum chamber 13, and the vacuum chamber 13 is evacuated.

  (2) First, rough alignment using the rough alignment marks 31R and 32R on the lower substrate 31 and the upper substrate 32 is performed.

  The Z-axis motor 23 is controlled by the controller 21 and the motor controller 22, and the upper stage 12 is lowered by a predetermined amount. As shown in FIG. 2 (A), the lower substrate 31 and the upper substrate 32 have a predetermined interval between them. Set the rough alignment position to be the distance.

  Next, the controller 21 controls the camera driving unit 18 via the motor controller 22 to change the position of the low-magnification CCD camera 16 in the Z direction, so that the rough substrates provided on the lower substrate 31 and the upper substrate 32 are changed. The alignment marks 31R and 32R are simultaneously positioned within the focal depth of the low magnification CCD camera 16 (FIGS. 2B and 2C). At this time, the lighting devices 28 and 29 may be controlled by the controller 21 so that the illumination light is irradiated to the lower substrate 31 and the upper substrate 32 with different illuminances according to the position of the upper substrate 32.

  Then, the low-alignment CCD camera 16 images the rough alignment marks 31R and 32R provided on the lower substrate 31 and the upper substrate 32, respectively, and then the image processing device 20 uses the lower substrate 31 based on the imaging result. A relative positional deviation amount between the upper substrate 32 and the upper substrate 32 is detected.

  Thereafter, the controller is arranged so that the positional deviation amounts in the X and Y directions of the rough alignment marks 31R and 32R on the lower substrate 31 and the upper substrate 32 detected in this way are corrected to the target value (0, 0). 21 and the motor controller 22 control the lower stage drive unit 26 and move the lower stage 11 in the X direction, the Y direction, and the θ direction, so that the lower substrate 31 and the upper substrate 32 are relatively positioned in the planar direction. Coarse alignment is performed. Thereafter, the low-magnification CCD camera 16 images the rough alignment marks 31R and 32R on the upper and lower substrates 31 and 32, and detects the amount of positional deviation between the upper and lower substrates 31 and 32 again. If the positional deviation amount is within the allowable range, the rough alignment is completed, and if it is outside the allowable range, the rough alignment is performed again.

  As described above, the rough alignment is performed once to a plurality of times until the positional deviation amount of the rough alignment marks 31R and 32R on both the substrates 31 and 32 falls within an allowable range with respect to the target value.

  (3) Next, fine alignment using the fine alignment marks 31F and 32F on the lower substrate 31 and the upper substrate 32 is performed.

  The Z axis motor 23 is controlled by the controller 21 and the motor controller 22, and the upper stage 12 is lowered by a predetermined amount so that the facing distance between the lower substrate 31 and the upper substrate 32 is narrowed as shown in FIG. Set to position.

  Next, the controller 21 controls the camera driving unit 18 via the motor controller 22 to change the position of the high-magnification CCD camera 17 in the Z direction, so that the precision provided on the lower substrate 31 and the upper substrate 32 is changed. The alignment marks 31F and 32F are simultaneously positioned within the focal depth of the high magnification CCD camera 17 (FIGS. 3B and 3C). At this time, the lighting devices 28 and 29 may be controlled by the controller 21 so that the illumination light is irradiated to the lower substrate 31 and the upper substrate 32 with different illuminances according to the position of the upper substrate 32.

  Then, the high-alignment CCD camera 17 images fine alignment marks 31F and 32F provided on the lower substrate 31 and the upper substrate 32, respectively, and then the image processing device 20 uses the lower substrate 31 based on the imaging result. A relative positional deviation amount between the upper substrate 32 and the upper substrate 32 is detected.

  Thereafter, the controller is configured so that the amount of positional deviation in the X and Y directions of the fine alignment marks 31F and 32F of the lower substrate 31 and the upper substrate 32 detected in this way is corrected to the target value (0, 0). 21 and the motor controller 22 control the lower stage drive unit 26 and move the lower stage 11 in the X direction, the Y direction, and the θ direction, so that the lower substrate 31 and the upper substrate 32 are relatively positioned in the planar direction. Perform precision alignment, which is a combination. Thereafter, the high-alignment CCD camera 17 images the fine alignment marks 31F and 32F on the upper and lower substrates 31 and 32, and detects the amount of positional deviation between the upper and lower substrates 31 and 32 again. If the positional deviation amount is within the allowable range, the fine alignment is completed, and if it is out of the allowable range, the fine alignment is performed again.

  As described above, the fine alignment is performed once to a plurality of times until the positional deviation amounts of the fine alignment marks 31F and 32F on both the substrates 31 and 32 fall within the allowable range with respect to the target value.

  (4) After the fine alignment between the lower substrate 31 and the upper substrate 32 is completed, the Z axis motor 23 is controlled by the controller 21 and the motor controller 22 so that the upper substrate 32 is superimposed on the lower substrate 31. Thereafter, the holding of the upper substrate 32 by the upper stage 12 is released, the atmosphere release valve 15 is opened, and the inside of the vacuum chamber 13 is opened to the atmosphere. At this time, the lower substrate 31 held on the lower stage 11 and the upper substrate 32 held on the upper stage 12 are bonded together via a sealing agent 33, and between the lower substrate 31 and the upper substrate 32. The liquid crystal 34 is uniformly filled in the space, and a liquid crystal substrate is manufactured.

  (5) Finally, the upper stage 12 is raised and the liquid crystal substrate is separated from the upper stage 12. Finally, after releasing the holding of the lower substrate 31 by the lower stage 11, the manufactured liquid crystal substrate is dispensed to the downstream process. At the time of paying out, the vacuum chamber 13 is separated into upper and lower parts to form a carry-out space for the liquid crystal substrate.

  However, according to the present invention, the facing distance between the two substrates 31 and 32 is narrowed from the rough alignment position to the precise alignment position, and rough alignment and fine alignment are performed at each of these positions to make the substrates 31 and 32 to be aligned. When bonding, the following configuration is provided in order to reduce the number of precision alignments and improve productivity.

  When the substrate bonding apparatus 10 repeats a plurality of sets of bonding of the lower substrate 31 and the upper substrate 32, the target value of the rough alignment of the subsequent two substrates 31, 32 is set to the value of the preceding two substrates 31, 32. A value (−X, −Y) for canceling the positional deviation amounts (X, Y) of the two substrates 31 and 32 detected at the time of the first (first) fine alignment after the completion of the rough alignment. That is, it is as follows (A) and (B).

(A) Bonding of two preceding substrates 31 and 32 (FIG. 4A)
In the rough alignment of the two preceding substrates 31 and 32, the controller 21 sets the target value at the end of correction of the positional deviation amounts of the rough alignment marks 31R and 32R in the X and Y directions to (0, 0). The coarse alignment is performed as described in (2) above.

  After the rough alignment is completed, the fine alignment is performed. At this time, the controller 21 detects the positional deviation amount (X of the two substrates 31 and 32 detected by the high magnification CCD camera 17 at the first fine alignment after the rough alignment. , Y) is stored in the storage device 27.

(B) Bonding of two subsequent substrates 31 and 32 (FIG. 4B)
In the rough alignment of the subsequent two substrates 31 and 32, the controller 21 sets the target value at the end of correction of the positional deviation amounts of the rough alignment marks 31R and 32R in the X direction and the Y direction as described above (A). The value (X, Y) (stored value of the storage device 27) of the two substrates 31, 32 detected during the fine alignment immediately after the rough alignment of the two preceding substrates 31, 32 cancels the value (the stored value of the storage device 27). -X, -Y) and coarse alignment is performed as described in (2) above.

  The controller 21 performs coarse alignment according to the target values (−X, −Y), and then narrows the facing distance between the two substrates 31 and 32 to the precise position. Alignment is performed as described in (3) above.

  When the two substrates 31 and 32 are changed from the rough alignment position to the alignment position, the horizontal displacement between the upper and lower substrates 31 and 32 caused by the inclination of the moving direction of the stage 11 is canceled out and adjusted. Alignment will be. Thereby, the fine alignment which makes the positional deviation amount of the fine alignment marks 31F and 32F of the both substrates 31 and 32 the target value (0, 0) can be completed by one or a few implementations.

  Note that the controller 21 uses, for example, the first set of positional deviation amounts (X1, Y1), 2 as the positional deviation amounts detected during the fine alignment of each of the two substrates 31 and 32 forming the plurality of preceding sets. When the set positional deviation amount (X2, Y2)... And the average value of each positional deviation amount is (Xa, Ya), the target value of the rough alignment of the subsequent two substrates 31 and 32 is The average value (Xa, Ya) of these misregistration amounts can be a value (-Xa, -Ya) that cancels out.

  Further, the controller 21 detects the target value of the rough alignment of the subsequent substrates 31 and 32 based on the amount of positional deviation detected during the fine alignment of the preceding substrates 31 and 32 during the precise alignment of the subsequent substrates 31 and 23. It is possible to reset based on the amount of displacement. That is, the target value of the rough alignment is reset when the amount of positional deviation detected by the fine alignment first performed after the rough alignment on the subsequent substrates 31 and 32 becomes equal to or larger than a preset value. This is because the amount of misalignment that occurs between the substrates 31 and 32 when the setting is changed from the rough alignment position to the precise alignment position due to changes in mechanical behavior over time due to changes in the ambient temperature or the like. This is because it is considered that the current coarse alignment target value cannot sufficiently cancel the positional deviation. Further, this reset may be performed periodically. For example, when repeating the bonding of each of the two substrates 31 and 32 forming a plurality of sets, for example, it may be performed every time a set number of bonding ends, such as every 100 sets of bonding, or every 30 minutes. It may be performed every time the set time elapses. Note that the target value of the rough alignment after the reset is set to a value that cancels out the positional deviation amount detected at the time of the first fine alignment after the rough alignment with respect to the two substrates 31 and 32 that are bonded immediately before the reset. good.

Therefore, according to the board | substrate bonding apparatus 10, there exist the following effects.
(a) When repeating the bonding of the two substrates 31 and 32 forming a plurality of sets, the two substrates 31 and 32 detected during the fine alignment immediately after the rough alignment of the two preceding substrates 31 and 32 are performed. The amount of misalignment (X, Y) is a mechanical behavior caused by the inclination of the moving direction of the upper stage 11 when the preceding substrates 31 and 32 are changed from the rough alignment position to the precise alignment position. Therefore, when the subsequent two substrates 31 and 32 are changed from the rough alignment position to the exact alignment position, the same mechanical misalignment is likely to occur. Accordingly, by setting the target value of the rough alignment of the subsequent two substrates 31 and 32 to the value (−X, −Y) that cancels the above-described positional deviation amount (X, Y), both of the subsequent substrates 31. , 32, which is likely to occur when the rough alignment position is changed to the precise alignment position, cancels the relative positional deviation between the substrates 31 and 32 based on the narrowing of the distance between the two substrates 31 and 32, and is detected at the beginning of fine alignment. Therefore, the amount of misalignment between the substrates 31 and 32, which will be performed, can be improved (as small as the misalignment allowed in the rough alignment). As a result, the productivity can be improved while reducing the number of precision alignments that can be performed within the allowable range of the precision alignment for the amount of positional deviation between the two substrates 31 and 32 set at the precision alignment positions. .

  (b) Based on the average value of each positional deviation detected at the time of each fine alignment of each of the two substrates 31 and 32 forming a plurality of preceding groups, the target value of the rough alignment of the subsequent two substrates 31 and 32 is determined. Determine. Due to the mechanical behavior, the amount of positional deviation between the two substrates 31 and 32, which is easily accompanied when the subsequent two substrates 31 and 32 are changed from the rough alignment position to the precise alignment position, is predicted with high accuracy. The target value of the rough alignment of the substrates 31 and 32 can be set with high accuracy. As a result, the number of precision alignments can be stably reduced, so that productivity and yield can be further improved.

  (c) The positional deviation detected during the fine alignment of the subsequent substrates 31 and 32 based on the target value of the coarse alignment of the subsequent substrates 31 and 32 based on the positional deviation amount detected during the fine alignment of the preceding substrates 31 and 32. Reset based on amount. Even when the mechanical behavior changes with time due to a change in the atmospheric temperature or the like, the target value of the rough alignment of the subsequent two substrates 31 and 32 can be updated, and the target value can be set with higher accuracy. This also makes it possible to stably reduce the number of precision alignments, so that productivity and yield can be further improved.

  (d) At the time of rough alignment, by using the low magnification CCD camera 16 as a detection device, the two substrates 31 and 32 are moved to each stage by a transfer robot or the like including a relatively large mechanical error compared to the vertical movement of the upper stage 11. 11 and 12, even when both of the substrates 31 and 32 are accompanied by a large positional deviation, rough alignment of both the substrates 31 and 32 within the field of view of the low-power CCD camera 16 is achieved. Mark can be detected reliably.

  By using the high-magnification CCD camera 17 as a detection device during fine alignment, the fine alignment marks on both the substrates 31 and 32 can be aligned with high accuracy.

  The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration of the present invention is not limited to this embodiment, and even if there is a design change or the like without departing from the gist of the present invention. It is included in the present invention. For example, the upper stage 11 is moved up and down (Z direction) and the lower stage 12 is moved horizontally (X, Y, and θ directions). However, the present invention is not limited to this. It may be configured to be relatively movable in the X direction, the Y direction, the Z direction, and the θ direction.

  Although the description has been given assuming that the alignment of the two substrates 31 and 32 is performed in a reduced pressure atmosphere, the present invention is not limited to this, and it may be performed in an atmospheric pressure or a pressurized atmosphere.

  Moreover, although the example of performing coarse alignment and fine alignment as two alignments having different positioning accuracy by switching the distance (opposite spacing) between the two substrates 31 and 32 in two stages is not limited to this. Alternatively, the alignment with different accuracy may be performed three times or more. For example, the first alignment is performed by setting the facing distance between the two substrates 31 and 32 as a predetermined distance, and then the second alignment is performed with higher precision than the first alignment by narrowing the facing distance, and further the facing distance. The third alignment is performed with higher accuracy than the second alignment by narrowing the angle. In such a case, as the target value for the first alignment, the positional deviation between the two substrates 31 and 32 detected during the first second alignment after the first alignment in the preceding two substrates 31 and 32. The position of the two substrates 31 and 32 detected at the time of the first third alignment after the second alignment on the preceding two substrates 31 and 32 is used as the second alignment target value. A value that cancels the amount of deviation can be used.

  Further, the rough alignment target value is set to a value that cancels out the positional deviation amount of the two substrates detected during the first fine alignment after the rough alignment of the two preceding substrates. Although (0,0) has been described as an example in which the amount of displacement (X, Y) of the two substrates 31, 32 detected at the time of fine alignment is replaced with a value (-X, -Y) to cancel, the present invention is limited to this. Instead of the target value (0, 0), the rough alignment is performed, and then the two substrates 31 corresponding to the value (−X, −Y) for canceling the positional deviation amount (X, Y) at the time of fine alignment. , 32 includes shifting the relative position.

  According to the present invention, the distance between two substrates is narrowed from the rough alignment position to the precise alignment position, and when performing rough alignment and fine alignment at each of these positions and bonding the substrates, Reduction and improvement in productivity and yield can be achieved.

10 Substrate pasting device 11 Lower stage (first stage)
11a, 11b Cavity 12 Upper stage (second stage)
12a, 12b Cavity 13 Vacuum chamber 13a, 13b, 13c, 13d Transparent body 14, 15 Vacuum exhaust valve 16 Low magnification CCD camera (detection device)
17 High magnification CCD camera (detection device)
18, 19 Camera drive unit 20 Image processing device (detection device)
21 Controller (control device)
22 Motor controller 23 Z-axis motor (drive device)
24, 25 UV irradiation fiber 26 Lower stage drive unit 27 Storage devices 28, 29 Illumination device 31 Lower substrate 32 Upper substrate 33 Sealant 34 Liquid crystal

Claims (4)

When bonding two substrates together with an adhesive,
A first stage for holding one substrate;
A second stage that is provided opposite to the first stage and holds the other substrate bonded to the one substrate;
A first driving device for changing a facing distance between the first stage and the second stage;
A detection device that detects a relative displacement amount between the one substrate held on the first stage and the other substrate held on the second stage;
At least one of the first stage and the second stage is moved based on the amount of displacement detected by the detection device, and the one substrate and the second stage held on the first stage A second driving device for performing relative alignment with the other substrate held on the substrate;
A control device for controlling the first drive device and the second drive device;
The control device sets the one substrate and the other substrate at a rough alignment position where a facing distance between them is a predetermined distance, and the one substrate and the other substrate are positioned at the rough alignment position. The first driving device and the second driving device are controlled so as to perform relative rough alignment, and the one substrate and the other substrate after the rough alignment are roughly aligned with each other. The first driving device and the second driving device are set so that the alignment position is narrower than the position, and relative alignment between the one substrate and the other substrate is performed at the alignment position. In the substrate laminating apparatus that controls the driving device,
When the controller repeats a plurality of sets of two substrates, the controller detects the target value of the rough alignment of the two subsequent substrates during the first fine alignment after the rough alignment of the two preceding substrates. A substrate bonding apparatus characterized in that the amount of misalignment between the two substrates is a value that cancels out.   2. The substrate according to claim 1, wherein the control device determines the target value so that an average value of each displacement amount detected at the time of each fine alignment of each of the two substrates forming the plurality of sets is a value that cancels out. Bonding device. One substrate and the other substrate are set at a rough alignment position where a distance between the substrates is a predetermined distance, and the rough alignment is performed between the one substrate and the other substrate at the rough alignment position. The subsequent one of the substrates and the other substrate are set to an alignment position where the facing distance is narrower than the rough alignment position, and the relative alignment between the one substrate and the other substrate at the alignment position In the manufacturing method of the bonded substrate board, in which the fine alignment is performed and the first and second substrates are bonded after the fine alignment,
When a plurality of sets of bonding of the first and second substrates are repeated, the target values of the rough alignment of the subsequent two substrates are detected at the first fine alignment after the rough alignment of the two preceding substrates. A method for manufacturing a bonded substrate, characterized in that the amount of positional deviation between two substrates is canceled out. The bonded substrate manufacturing method according to claim 3 , wherein the target value is determined so that an average value of each displacement amount detected at each fine alignment of each of the two substrates forming the plurality of preceding sets is a value to be canceled. Method.

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