JP5686718B2 - Film capacitor film - Google Patents

Description

  The present invention relates to a film for a film capacitor. More specifically, the present invention relates to a film for a film capacitor suitable for a lightweight film capacitor having excellent voltage resistance.

  Currently, a dielectric layer is a film obtained from one of four types of resins, polypropylene resin (PP resin), polyethylene terephthalate resin (PET resin), polyphenylene sulfide resin (PPS resin), and polyethylene naphthalate resin (PEN resin). A film for a film capacitor has been put into practical use by forming a metal vapor deposition layer as an electrode on the surface of the dielectric layer.

  However, PP resin and PET resin film capacitor films are inferior in heat resistance because the use temperature of PP resin is 105 ° C. or less and the use temperature of PET resin is 125 ° C. or less. On the other hand, with the spread of hybrid vehicles, heat resistance of 150 ° C. or higher is required for capacitors used for inverters. For this reason, in order to apply a film capacitor film made of PP resin or PET resin to a hybrid vehicle capacitor, (1) a method of installing a large cooling device ignoring the demand for weight reduction, (2) space A method of ignoring efficiency and installing a capacitor on the driver's seat or the like far away from the engine room of the heat source has to be adopted, and the weight reduction and cost are problems to be solved.

  A film for a film capacitor made of PPS resin has good heat resistance at a use temperature of 160 ° C. or lower, but has a low dielectric breakdown strength and inferior voltage resistance, so that the use range is limited. In addition, the film for film capacitors made of PEN resin has good heat resistance at a use temperature of 160 ° C. or less, but has a large dielectric loss and a large temperature dependence of dielectric loss tangent, so the use range is limited.

  On the other hand, a film made of polyetherimide resin (PEI resin) has attracted attention as a film for a film capacitor (see, for example, Patent Documents 1 and 2). Films for film capacitors made of polyetherimide resin are excellent in heat resistance at a glass transition point Tg of 200 ° C. or higher, high in dielectric breakdown strength, excellent in voltage resistance, and low in frequency dependence and temperature dependence of dielectric loss tangent. Therefore, it is suitable as a film for a film capacitor.

JP 2007-300126 A JP 2011-108714 A

  However, the film for a film capacitor made of the thermoplastic resin as described above has a phenomenon that the withstand voltage per unit thickness decreases as the thickness of the film increases. For this reason, when a capacitor film with a high withstand voltage is required, the desired withstand voltage cannot be achieved simply by increasing the thickness of the film capacitor film proportionally. Therefore, it is necessary to use a film having a large thickness in anticipation of this, which is a serious problem in designing and manufacturing a lightweight capacitor.

  Then, this invention is made | formed in view of the said problem, Comprising: It aims at providing the film for film capacitors suitable for comprising the compact and lightweight film capacitor which has a high withstand voltage production.

In order to solve such a problem, the film capacitor film of the present invention is characterized by a film capacitor film comprising a film laminate formed by laminating a plurality of films containing a thermoplastic resin composition. The single layer film has a thickness in the range of 1-5 μm, and the film laminate is defined by dividing the desired breakdown voltage by the minimum value of the breakdown strength of the single layer film. The gist of the present invention is to make it possible to provide a thinner film for a film capacitor that has a total thickness and is made of a single-layer thermoplastic resin composition film.

  The dielectric breakdown strength per unit thickness of the film made of the thermoplastic resin composition decreases with an increase in the thickness of the film, both of the average value and the minimum value. Therefore, for example, the dielectric breakdown strength per 1 μm of a film having a thickness of 5 μm is larger than the dielectric breakdown strength per 1 μm of a film having a thickness of 10 μm. Therefore, a laminated film obtained by laminating two layers having a thickness of 5 μm has a thickness of 10 μm. The dielectric breakdown strength with respect to the entire thickness is larger than that of the single layer film.

  The thickness of the film for a film capacitor is determined in consideration of the minimum dielectric breakdown strength of the film according to the required withstand voltage (dielectric breakdown voltage) value. Accordingly, as a film corresponding to the required withstand voltage value, the overall thickness can be reduced by laminating a plurality of thin films rather than using a single layer film.

  Furthermore, the dielectric breakdown strength per unit thickness of a laminated film obtained by laminating a plurality of thin films is equal to the average value of the dielectric breakdown strength per unit thickness of each film constituting the laminated film. However, the minimum value increases. Therefore, the thickness of the film capacitor film with respect to the required withstand voltage value can be further reduced by taking into account the increase in the minimum value of the laminated film obtained by laminating a plurality of thin films. it can.

  When the number of laminated films in the laminated film is two layers, the cost increase factor can be suppressed in the production apparatus and the production process.

  When a thermoplastic resin composition is formed from a crystalline resin composition such as polypropylene resin (PP resin), polyethylene terephthalate resin (PET resin), polyphenylene sulfide resin (PPS resin), and polyethylene naphthalate resin (PEN resin), biaxial A stretched film can be used.

  When a thermoplastic resin composition is formed from an amorphous resin composition, a molten resin extruded from a T-die, such as a crystalline thermoplastic resin, is cooled and solidified with a casting device, and then biaxially stretched to produce a film. The molten resin is extruded with a T-die and cooled with a cooling roll to obtain the final thickness.

  Among the amorphous thermoplastic resin compositions, when a polyetherimide resin (PEI resin) -based resin composition is used, a film for a film capacitor having excellent heat resistance and voltage resistance can be obtained.

  In the slidability modified PEI resin composition film manufactured using a cooling roll roughened by applying means such as embossing on the surface, the voltage resistance is further improved.

  ADVANTAGE OF THE INVENTION According to this invention, the film for film capacitors suitable for comprising the compact and lightweight film capacitor which has a high withstand voltage production can be provided.

It is a schematic diagram which shows the manufacturing apparatus of the single layer film of the thermoplastic resin composition which concerns on embodiment of this invention. It is a schematic diagram which shows the manufacturing apparatus of the two-layer laminated film of the thermoplastic resin composition which concerns on embodiment of this invention. It is a figure which shows the relationship of the dielectric breakdown strength and inner surface roughness, and a nominal film thickness of the film which concerns on Comparative Examples 1-4 of Example of this invention and Example 1. FIG. It is a figure which shows the relationship between the dielectric breakdown strength of the film which concerns on Comparative Examples 5-8 of embodiment of this invention, and Example 2, an inner surface roughness, and a nominal film thickness.

  Hereinafter, modes for carrying out the present invention (hereinafter referred to as embodiments) will be described in detail.

  First, the film for a film capacitor according to the present invention is composed of a laminated film obtained by laminating a plurality of films having a thickness of 1 to 5 μm, which is made of a thermoplastic resin composition.

  The thermoplastic resin composition includes polyethylene resin (PE resin), polypropylene resin (PP resin), polyamide resin (PA resin), polyacetal resin (POM resin), polyethylene terephthalate resin (PET resin), ultrahigh molecular weight polyethylene resin (UHPE). Resin), polybutylene terephthalate resin (PBT resin), polymethylpentene resin (TPX resin), polyphenylene sulfide resin (PPS resin), polyether ether ketone resin (PEEK resin), liquid crystal polymer resin (LCP resin), polytetrafluorocarbon One or more crystalline thermoplastic resin compositions selected from the group comprising ethylene resin (PTFE resin) and syndiotactic polystyrene resin can be used.

  The above-mentioned crystalline thermoplastic resin composition is generally finished to the final film thickness using a biaxial stretching method after being extruded with a T-die, but without being applied with the biaxial stretching method, it is extruded after being extruded with a T-die. It can also be finished between the roll and the cooling roll to the final film thickness.

  The thermoplastic resin composition also includes polystyrene resin (PS resin), acrylonitrile / styrene resin (AS resin), acrylonitrile / butadiene / styrene resin (ABS resin), methacrylic resin (PMMA resin), vinyl chloride resin (PVC resin), Polycarbonate resin (PC resin), cycloolefin polymer resin (COP resin), polyetherimide resin (PEI resin), polyallelate resin (PAR resin), polysulfone resin (PSF resin), polyethersulfone resin (PES resin) One or a plurality of amorphous thermoplastic resin compositions selected from the group including polyamideimide resin (PAI resin) and the like can be used.

  Since the amorphous thermoplastic resin composition has poor ductility, the biaxial stretching method is not applied, and after extrusion with a T die, the film is sandwiched between a crimping roll and a cooling roll to be finished to a final film thickness.

  Films for film capacitors made of polyetherimide resin (PEI resin) have a glass transition point Tg of 200 ° C. or higher, excellent heat resistance, high dielectric breakdown strength, excellent voltage resistance, frequency dependence of dielectric loss tangent and temperature Since the dependency is small, it is suitable as a film for a film capacitor.

  Specific examples of the polyetherimide resin (PEI resin) include Ultem 1000-1000 (trade name, manufactured by SABIC Innovative Plastics Japan) having a Tg of 211 ° C., and ULTEM 1010-1000 (SABIC Innovative Plastic having a Tg of 223 ° C. And a product name of ULTEM CRS5001-1000 having a Tg of 235 ° C. (trade name, manufactured by SABIC Innovative Plastics Japan).

  As the PEI resin, a block copolymer, a random copolymer, or a modified body with another copolymerizable monomer can be used as long as the effects of the present invention are not impaired. For example, Ultem XH6050-1000 (SABIC Innovative Plastics Japan, trade name) having a Tg of 252 ° C., which is a polyetherimide sulfone copolymer, can be used. One PEI resin may be used alone, or two or more PEI resins may be alloyed or blended.

  As the PEI resin composition, a thermoplastic polyimide resin such as polyimide resin (PI resin) or polyamideimide resin (PAI resin), polyether ether ketone resin (PEEK resin) or Aromatic polyether sulfone resin such as polyarylene ketone resin such as ether ketone resin (PK resin), polysulfone resin (PSU resin), polyether sulfone resin (PES resin) or polyphenylene sulfone resin (PPSU resin) Polyphenylene sulfide resin (PPS resin), polyphenylene sulfide sulfone resin, polyarylene sulfide resin such as polyphenylene sulfide ketone resin, and known thermoplastic resins such as liquid crystal polymer resin (LCP resin) can be added. As the liquid crystal polymer, any of liquid crystal polymers of type I, type II or type III can be used.

  The PEI resin composition may be a resin composition of a PEI resin alone or a resin composition in which 1.0 to 30.0 parts by mass of a fluororesin is added to 100 parts by mass of the PEI resin.

  The fluororesin is polytetrafluoroethylene resin (PTFE resin), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer resin (PFA resin), tetrafluoroethylene-hexafluoropropyl copolymer resin (FEP resin), tetrafluoroethylene. -One or more resins selected from the group including ethylene copolymer resin (ETFE resin), polyvinylidene fluoride resin (PVDF resin), and polychlorotrifluoroethylene resin (PCTFE resin) can be used. .

  It is preferable that the thickness of the single layer of said thermoplastic resin film used by embodiment of this invention is 1-5 micrometers. If it is less than 1 μm, the tensile strength of the film is lowered, and there is a possibility that a problem may occur in the step of laminating a plurality of films. When the thickness exceeds 5 μm, the dielectric breakdown strength per unit thickness of the film is reduced, so that the effect of improving the dielectric breakdown voltage is reduced even if the films are laminated.

  In the embodiment of the present invention, as shown in Table 1, as Comparative Examples 1 to 4, a single-layer polyetherimide resin (PEI resin) film having a thickness of 5 to 9 μm, and as Comparative Examples 5 to 8 having a thickness of 5 to 9 μm A slidable modified single-layer polyetherimide resin (PEI resin) film was produced, and the dielectric breakdown strength and the surface roughness of the surface in contact with the cooling roll (inner surface) were measured. Next, as Example 1, a laminated film obtained by laminating two single-layer polyetherimide resin (PEI resin) films having a thickness of 5 μm, and as Example 2, a slidable modified single-layer polyetherimide resin (PEI resin having a thickness of 5 μm). ) A laminated film in which two layers of films were laminated was produced, and the dielectric breakdown strength was measured.

  The film for a film capacitor in the present invention is produced by a melt extrusion method using a T die. After kneading and preparing a molding material composed of a thermoplastic resin composition using a twin-screw extruder kneader, a film capacitor film is melt-extruded from a lip portion at the tip of a T die placed at the tip of a single-screw extruder, The film for a film capacitor is cooled by being sandwiched between a pressure-bonding roll and a cooling roll in the take-up machine, and then wound around a take-up tube with a winder to provide a film for a film capacitor.

  Based on FIG. 1, the manufacturing method of the single layer polyetherimide resin (PEI resin) film which concerns on Comparative Examples 1-4 of embodiment of this invention is demonstrated.

  As shown in FIG. 1, the manufacturing apparatus of the single layer polyetherimide resin (PEI resin) film which concerns on Comparative Examples 1-4 is the material input hopper 2 which inputs a molding material, the extruder 1, T dice | dies 7, and a cooling roll. 10, a crimping roll 9, a take-up machine 11, and a winder 15.

  The extruder 1 mixes the PEI resin composition molding material with an extrusion screw (not shown), conveys it in the direction of arrow B while stirring, and heats the molding material with electric heating means incorporated in the cylinder 1. Melt. The molding material composed of the PEI resin composition that is melted and conveyed in this manner is fed to the filter means via the connecting pipe 4. Then, the unmelted molding material is separated by the filter 5 and the molten molding material is fed to the gear pump 6. In the gear pump 6, the molding material is pushed out to the T die 7 while increasing the pressure of the molten molding material. In the T die 7, the melt molding material is extruded at a predetermined pressure, and a film 8 having a predetermined thickness and a predetermined width is formed from a lip portion (not shown) of the T die 7. The film 8 thus formed is taken up on the outer peripheral surface of the standard surface cooling roll 10a of the take-up machine 11 and adjusted to a predetermined thickness by pressing with the pressure-bonding roll 9, and is cooled and solidified. It can be manufactured by being transported by 12, 13 and wound on a winder 15.

  The manufacturing apparatus of the single layer polyetherimide resin (PEI resin) film which concerns on Comparative Examples 5-8 is provided with the rough surface cooling roll 10b which has the rough surface by embossing etc. instead of the standard surface cooling roll 10a in FIG. ing.

  The slidability modified single-layer polyetherimide resin (PEI resin) film according to Comparative Examples 5 to 8 is formed on the outer peripheral surface of the rough surface cooling roll 10 b having the rough surface of the take-up machine 11. Taking the sheet and pressing it with the pressure roll 9, the rough surface of the rough surface cooling roll 10 b is adjusted to a predetermined thickness while being transferred to the film surface, cooled and solidified, and transported by the pair of transport rolls 12 and 13 for winding. It can be wound around the machine 15 and manufactured.

  Based on FIG. 2, the two-layer polyetherimide resin (PEI resin) laminated film and the two-layer slidable modified polyetherimide resin (PEI resin) laminated film according to Examples 1 and 2 of the embodiment of the present invention. A manufacturing method will be described.

  As shown in FIG. 2, the apparatus for producing the two-layer polyetherimide resin (PEI resin) laminated film and the two-layer slidability modified polyetherimide resin (PEI resin) laminated film according to Examples 1 and 2 is sent out. Except for providing the machine 17, it is the same as FIG.

  The two-layer PEI resin laminated film according to Example 1 is obtained by using a molten PEI resin molding material as a lip portion (not shown) of the T dice 7 in the same manner as in the production of the single-layer PEI resin film according to Comparative Examples 1 to 4. The film 8 that has been extruded from and formed into a predetermined thickness and width is taken on the outer peripheral surface of the standard surface cooling roll 10a of the take-up machine 11 together with the molded, cooled, and solidified single-layer PEI resin film sent out from the feed-out machine 17. In addition to being adjusted to a predetermined thickness by pressing with the pressure roll 9, cooling and solidification can be performed, and the rolls can be transported by a pair of transport rolls 12 and 13 and wound around a winder 15.

  The two-layer slidability-modified PEI resin laminated film according to Example 2 is obtained by applying a molten PEI resin molding material to T as in the production of the single-layer slidability-modified PEI resin film according to Comparative Examples 5 to 8. Extruding from the lip portion (not shown) of the die 7 and forming the film 8 formed into a predetermined thickness and width into a predetermined thickness, and sending it out from the delivery machine 17, together with the cooled single-layer slidability modified PEI resin film, the take-up machine 11 Is taken up on the outer peripheral surface of the rough surface cooling roll 10b having a rough surface by embossing or the like, laminated and pressed by the pressure roll 9, and adjusted to a predetermined thickness while transferring the rough surface of the rough surface cooling roll 10b to the film surface At the same time, it can be cooled and solidified, transported by a pair of transporting rolls 12 and 13, and wound around a winder 15 to be manufactured.

  In the method shown in FIG. 2, a single-layer film that has been cooled and solidified and a single-layer film newly extruded from a T-die are laminated. Although a laminated film can be manufactured, the cost increase factor on the apparatus side becomes large.

  A laminated film having three or more laminated layers can also be produced by the same method.

(Measurement and evaluation)
(Film thickness)
Using a contact-type thickness meter (trade name: Electronic Micrometer Myrotron 1240, manufactured by Mahr), the thickness was determined from the average thickness of 95 points at 19 points in the film width direction and 5 points in the film flow direction.

(Surface roughness)
Arithmetic average roughness Ra and maximum height Rz were measured according to JISB0601-2001. Ten-point average roughness Rz94 was measured according to JISB0601-1994.

(Dielectric breakdown strength of film)
The dielectric breakdown strength of the film was measured by a short-time dielectric breakdown test by an air method in accordance with JIS C2110-1994. This measurement was performed in an environment of 23 ° C. The shape of the electrode was a columnar shape (upper shape diameter: 25 mm, height: 25 mm, lower shape diameter: 25 mm, height: 15 mm).

(Comparative Examples 1-4), (Example 1)
In the comparative examples 1 to 4, the nominal thicknesses are 5 μm, 6 μm, and 8 μm in order, using the apparatus shown in FIG. A single-layer film of 9 μm was produced. As the PEI resin, amorphous ULTEM 1010 (trade name, manufactured by Innovative Plastics Japan) having a Tg of 217 ° C. was used. In Example 1, a film having a nominal thickness of 5 μm of Comparative Example 1 was used to produce a two-layer laminated film using the apparatus shown in FIG. 2 equipped with the standard surface cooling roll 10a.

  Tables 1 and 3 show the measurement results of dielectric breakdown strength (V / μm), thickness (μm), and inner surface roughness (μm) on the cooling roll side of the films produced in Comparative Examples 1 to 4 and Example 1. Show. From the results of Comparative Examples 1 to 4, it can be seen that, in the PEI resin single layer film, the dielectric breakdown strength per 1 μm of thickness decreases as the nominal thickness increases from 5 μm. On the other hand, in the two-layer laminated film having a nominal thickness of 5 μm × 2 (= 10 μm) in Example 1, the average dielectric breakdown strength per 1 μm thickness is equivalent to the single-layer film having a thickness of 5 μm in Comparative Example 1. However, the minimum value is remarkably increased from 196 V / μm of the single-layer film having a thickness of 5 μm in Comparative Example 1 to 226 V / μm.

(Comparative Examples 5 to 8), (Example 2)
In the comparative examples 5 to 8, the nominal thicknesses are in order by using the apparatus shown in FIG. Single-layer films of 5 μm, 6 μm, 8 μm, and 9 μm were prepared. As the PEI resin, amorphous ULTEM 1010 (trade name, manufactured by Innovative Plastics Japan) having a Tg of 217 ° C. was used. In Example 2, a film having a nominal thickness of 5 μm of Comparative Example 5 was used to produce a two-layer laminated film using the apparatus shown in FIG. 2 provided with the rough surface cooling roll 10b.

  Tables 1 and 4 show the measurement results of dielectric breakdown strength (V / μm), thickness (μm), and inner surface roughness (μm) on the cooling roll side of the films prepared in Comparative Examples 5 to 8 and Example 2. Show. From the results of Comparative Examples 5 to 8, it can be seen that, in the PEI resin single layer film, the dielectric breakdown strength per 1 μm of thickness decreases as the nominal thickness increases from 5 μm. On the other hand, in the two-layer laminated film having a nominal thickness of 5 μm × 2 (= 10 μm) in Example 2, the average dielectric breakdown strength per 1 μm thickness is equivalent to the single-layer film having a thickness of 5 μm in Comparative Example 5. However, the minimum value is significantly increased from 213 V / μm of the single-layer film having a thickness of 5 μm in Comparative Example 5 to 254 V / μm.

  When the surface roughness relating to Comparative Examples 5 to 8 and Example 2 regarding the slidability modified PEI film of FIG. 3 and Comparative Examples 1 to 4 and Example 2 regarding the PEI film of FIG. The arithmetic average roughness Ra is the same, but the maximum height Rz is clearly higher in the slidable modified PEI film of FIG.

  Hereinafter, application of the slidability modified PEI film in the case where a dielectric breakdown voltage of 2000 V or higher is required for the film for film capacitor before metallization will be described. For convenience of explanation, the margin is not considered.

  When a film for a film capacitor having a dielectric breakdown voltage of 2000 V or more is formed by applying a single-layer slidability modified PEI film, the dielectric breakdown strength (Min) of a film having a thickness of 9 μm in Comparative Example 8 in Table 1 ) As a reference, a thickness exceeding 2000/137 = 14.7 μm is required. On the other hand, when a film for a film capacitor having a dielectric breakdown voltage of 2000 V or more is formed by applying a two-layer slidable modified PEI film, the dielectric breakdown strength of a film having a thickness of 5 μm in the comparative example of Table 1 On the basis of (Min), a thickness of 2000/213 = 9.4 μm is required, which is about 64% of the thickness of the above-mentioned single layer film of 14.7 μm.

  Furthermore, as can be seen from Example 2 in Table 1, the dielectric breakdown strength (Min) of the two-layer laminated film of the slidable modified PEI obtained by laminating two single-layer films having a thickness of 5 μm is 254 V / μm, which is a comparison. The dielectric breakdown strength (Min) of the single-layer film having a thickness of 5 μm in Example 5 is significantly higher than that of 213 V / μm. If the dielectric breakdown strength (Min) of the second embodiment is applied, the thickness can be further reduced to 2000/254 = 7.9 μm for the required dielectric strength 2000V. This 7.9 μm is about 54% of the thickness of the monolayer film of 14.7 μm. When the thickness of 7.9 μm is composed of two single-layer films, the thickness of the single-layer film is 3.95 μm, but since this thickness is thinner than 5 μm, the dielectric breakdown strength of the single-layer film having a thickness of 3.95 μm ( Min) is higher than the dielectric breakdown voltage (Min) of a single-layer film having a thickness of 5 μm. Therefore, it is easily derived that the withstand voltage of the slidable modified PEI two-layer laminated film having a thickness of 3.95 μm × 2 sufficiently exceeds 2000V.

  Thus, when the required withstand voltage is 2000 V or less, a remarkable thickness reduction is achieved by applying a two-layer laminated film obtained by laminating two layers of a slidability modified PEI single-layer film having a thickness of 1 to 5 μm. . Even if the required withstand voltage exceeds 2000 V, a significant thickness reduction is achieved by applying a multi-layer laminated film in which three or more slidable modified PEI single-layer films having a thickness of 1 to 5 μm are laminated.

  Use of the same resin composition and thickness for each single-layer film constituting the laminated film is preferable in terms of design and production.

  As mentioned above, although this invention was demonstrated using embodiment, it cannot be overemphasized that the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above embodiment. Further, it is apparent from the description of the scope of claims that embodiments with such changes or improvements can also be included in the technical scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Extruder 1a Extrusion screw 1b Cylinder 1c Material input port 2 Material input hopper 3 Gas supply pipe 4 Connection pipe 5 Filter 6 Gear pump 7 T die 7a Lip part 8 Film 9 Crimp roll 10a Standard surface cooling roll 10b Rough surface cooling roll 11 Take-up machine 12, 13 Conveying roll pair 14 Thickness measuring device 15 Winding machine 15a, 15b, 15c Guide roll 16 Winding tube 17 Feeder

Claims (6)

A film for a film capacitor,
A film laminate formed by laminating a plurality of films containing a thermoplastic resin composition,
The single-layer film has a thickness in the range of 1-5 μm;
A film for a film capacitor, wherein the film laminate has a total thickness defined by dividing a desired dielectric breakdown voltage by a minimum value among dielectric breakdown strengths of the single-layer film. The film for a film capacitor according to claim 1 , wherein the film laminate is formed by laminating two single-layer films. Film for film capacitors according to claim 1 or 2 wherein the thermoplastic resin composition is characterized in that it comprises a crystalline resin composition. Film for film capacitors according to claim 1 or 2, characterized in that the thermoplastic resin composition comprises a non-crystalline resin composition. The film for a film capacitor according to claim 4 , wherein the amorphous resin composition is a polyetherimide resin composition. 6. The film for a film capacitor according to claim 5 , wherein the polyetherimide resin composition is a slidable modified polyetherimide resin composition.

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