JP5681422B2 - Substrate processing apparatus, parameter editing method, and setup parameter update program - Google Patents

Description

  The present invention relates to a substrate processing apparatus composed of a plurality of components for processing a substrate, and more particularly to a substrate processing apparatus for editing parameters for control.

  When the substrate processing apparatus is delivered, adjustment work such as wiring confirmation, operation confirmation, and vacuum chamber leak check of each actuator included in the substrate processing apparatus is performed.

  For example, when executing a leak check command, it is assumed that no alarm has occurred in the corresponding process chamber. For example, if one of the hard interlock signals is not connected or has failed. Corresponding hard interlock alarm occurs and leak check cannot be executed. At this time, the level of the hard interlock alarm, which is one of the device parameter items, is changed from “a level that generates an alarm if an abnormality occurs” to “a level that is ignored even if an alarm occurs”. It needs to be changed so that no alarm is generated.

  After connecting the hard interlock signal or after repairing the failure of the hard interlock signal, when the normal operation is performed without returning the device parameter changed at the time of adjustment, the changed device parameter The substrate processing is executed along Therefore, even if the hard interlock occurs, the parameters remain changed so that the operation of the substrate processing apparatus does not stop. Therefore, depending on the content of the generated alarm, a defective product can be generated or operated safely. There is a risk of disappearing.

  On the other hand, a substrate processing apparatus in which a maintenance command for instructing an operation at the time of maintenance is set for each component constituting the substrate processing apparatus, the maintenance command is parameterized, and a maintenance command monitor screen is provided to enable setting on the operation screen. Is disclosed in Patent Document 1.

  However, in the case of maintenance work for each part as well as adjustment work at the time of delivery, if normal operation is performed without returning the parameters after the work is completed, there is a risk that defective products will be produced or that safe operation will not be possible. There was this.

WO2010 / 32499

  In view of such circumstances, the present invention solves a decrease in reliability related to the setting of apparatus parameters, can be safely adjusted, and can perform apparatus processing that can set apparatus parameters that can be easily and reliably transferred from maintenance work to normal operation. A device is provided.

  The present invention includes an operation unit having a display unit for editing device parameters, a storage unit for storing the device parameters, and a control unit for executing the device parameters downloaded from the operation unit. The apparatus parameters include a setup parameter used in a setup mode for adjustment work, repair of a failure, and regular maintenance work, and an operation parameter used in an operation mode for normal operation. The present invention relates to a substrate processing apparatus configured so that the operation parameters are not affected even when edited.

  According to the present invention, an operation unit having a display unit for editing device parameters, a storage unit for storing the device parameters, and a control unit for executing the device parameters downloaded from the operation unit. The apparatus parameters include a setup parameter used in a setup mode for adjustment work, repair of a failure, and periodic maintenance work, and an operation parameter used in an operation mode for normal operation. Even if the parameters are edited, the operation parameters are not affected, so even if the setup parameters are edited and then operated normally, the risk of defective products and normal operation is prevented. Demonstrate the excellent effect of being able to.

It is a schematic block diagram of the substrate processing apparatus in this invention. It is a block diagram which shows the structure of the control system for controlling the substrate processing apparatus in this invention. It is a schematic sectional drawing which shows the structure of the processing furnace in this invention. It is a block diagram which shows the detail of the operation part in this invention. It is an effect explanatory view showing the flow of operation parameter update in the present invention. It is an effect explanatory view showing the flow of the setup parameter update in the present invention. It is a sequence diagram explaining switching from the operation mode of the apparatus mode to the setup mode in the present invention. It is a sequence diagram explaining switching from the setup mode of the apparatus mode to the operation mode in the present invention.

  Embodiments of the present invention will be described below with reference to the drawings.

  First, a substrate processing apparatus according to the present invention will be described with reference to FIG. FIG. 1 shows a schematic configuration of a single-wafer type substrate processing apparatus which is an example of a substrate processing apparatus, including a plurality of wafer transfer robots and process chambers, and a carrier delivery load. It has a parallel redundant configuration in which two lock chambers are connected. A carrier is used for transporting the substrate (wafer) in the substrate processing apparatus.

  The single-wafer type substrate processing apparatus 1 includes two channels, and includes a first processing module 2 and a second processing module 3. The first processing module 2 includes a first process chamber 4 serving as a substrate processing chamber capable of being air-tightly connected in-line, and vacuum-tight as a front chamber provided in front of the first process chamber 4. And a first vacuum lock chamber 5.

  The second processing module 3 includes a second process chamber 6 as a vacuum-tight substrate processing chamber connected in-line, and a vacuum-tightness as a front chamber provided in a front stage of the second process chamber 6. And a second vacuum lock chamber 7.

  The first process chamber 4 and the first vacuum lock chamber 5 are hermetically connected via a first gate valve 8, and the second process chamber 6 and the second vacuum lock chamber 7 are The second gate valve 9 is connected in an airtight manner.

  In the first vacuum lock chamber 5, a first vacuum robot handler 11 as a second substrate transfer device is disposed between the first process chamber 4 and the first vacuum lock chamber 5 in a wafer 18. Can be transported. In the second vacuum lock chamber 7, a second vacuum robot handler 12 as a second substrate transfer device is disposed between the second process chamber 6 and the second vacuum lock chamber 7 in a wafer 18. Can be transported.

  Each of the first vacuum lock chamber 5 and the second vacuum lock chamber 7 has a multistage stage capable of holding a wafer 18, for example, two upper and lower stages, and the upper stage of the multistage stage. The first buffer stage (LS) 19 and the second buffer stage (LS) 20 hold the wafer 18, and the lower first clean stage (CS) 21 and second clean stage (CS) 22 use the wafer 18. Can be cooled.

  The first vacuum lock chamber 5 is airtightly connected to an atmospheric loader 13 serving as an atmospheric transfer chamber via a first loader door 16, and the second vacuum lock chamber 7 is connected to a second loader door 17. The air loader 13 is airtightly connected. The atmospheric loader 13 is equipped with a loader handler 15 as a single first substrate transfer device, and an aligner 14 as a substrate position correcting device. The loader handler 15 can load and unload the wafer 18 into and from the first vacuum lock chamber 5 and the second vacuum lock chamber 7, and the loader handler 15 has a first load port 23 (described later), a second load port The aligner 14 can correct the deviation of the wafer 18 during the transfer and align the notch in a certain direction (hereinafter referred to as alignment). Yes.

  On the opposite side of the first vacuum lock chamber 5 and the second vacuum lock chamber 7, a first load port 23 and a second load port 24 are provided as substrate storage portions. The first load port 23 and the second load port 24 are configured so that the first carrier 25 and the second carrier 26 that can hold a plurality of wafers 18 can be delivered to the outside of the substrate processing apparatus 1. In addition, at least the carrier ID can be read / written.

  The first vacuum robot handler 11 and the second vacuum robot handler 12, the loader handler 15, the first gate valve 8 and the second gate valve 9, the first loader door 16 and the first vacuum robot handler 11 described above. 2 loader doors 17, gas introduction / exhaust mechanisms, temperature control / plasma discharge mechanisms of the first process chamber 4 and the second process chamber 6, and the first vacuum lock chamber 5 and the second vacuum lock. The cooling mechanism and the like of the chamber 7 are controlled by an operation unit 28 that is a controller for control.

  In the configuration of the substrate processing apparatus 1 in the present embodiment, the set of the first process chamber 4 and the set of the first vacuum lock chamber 5 are paired, and the set of the second process chamber 6 and the set of the first process chamber 4 are combined. Two lines are connected to the atmospheric loader 13 with a set of two vacuum lock chambers 7 as another pair. In the configuration of the present embodiment, there are two lines, but more lines may be used.

  An operation unit 28 for controlling substrate processing is connected to the substrate processing apparatus 1, and the operation unit 28 is configured to have means for carrying control and process control. FIG. 2 is a block diagram showing a control system of the substrate processing apparatus 1.

  In FIG. 2, reference numeral 27 denotes a HOST controller connected to an operation unit 28 provided in each of the plurality of substrate processing apparatuses 1 via a required communication means, for example, a LAN 29, and the HOST controller 27 is connected via the operation unit 28. Thus, an automatic operation instruction can be given to each substrate processing apparatus 1.

  The operation unit 28 includes a transfer control unit 31 that performs transfer control in the substrate processing step, and process control in the first process chamber 4 and the second process chamber 6 in the substrate processing step. The first process control unit 32 and the second process control unit 33 that perform the above are connected via a required communication means such as a LAN 34.

  The transfer control unit 31 includes a vacuum robot control unit 35 that controls driving of the first vacuum robot handler 11 and the second vacuum robot handler 12, and an atmospheric robot control unit 36 that controls driving of the loader handler 15. , A flow rate control unit 37 for controlling the flow rate controller, valve, pump, etc., controlling the supply / exhaust system of the first vacuum lock chamber 5, the second vacuum lock chamber 7, and the atmospheric loader 13, and an exhaust control unit 38 is connected.

  The first process control unit 32 includes a flow rate control unit 39 that controls the flow rate of the gas supplied to the first process chamber 4, a pressure control unit 40 that controls the pressure in the first process chamber 4, A temperature control unit 41 that controls the temperature in the first process chamber 4 and a valve control unit 42 that controls opening and closing of the valve when supplying and exhausting gas in the first process chamber 4 are connected. ing. The configuration of the second process control unit 33 is the same as the configuration of the first process control unit 32, and thus the description thereof is omitted.

  The operation unit 28 stores input instruction data, set parameter data, recipes, and various programs, and has a function of displaying screens such as monitor display, logging data, alarm analysis, and device parameter editing. In accordance with the instruction data, parameter data, recipe, etc., a control command including apparatus parameters (described later) is transmitted to the transfer control unit 31, the first process control unit 32, and the second process control unit 33, and the substrate Operation control of the entire processing process is performed.

  In the substrate processing apparatus 1 according to the present embodiment, three apparatus modes, that is, an operation mode, a manual mode, and a setup mode are set. The operation mode is an apparatus mode assuming automatic operation of the substrate processing apparatus 1 according to an instruction from the HOST controller 27, and is configured to automatically perform processing that can be automated so that the substrate processing apparatus 1 can be continuously operated automatically. Therefore, most manual operations, that is, manual instructions from the operation unit 28 cannot be performed.

  The manual mode is an apparatus mode that assumes manual operation of the substrate processing apparatus 1 by a manual instruction from the operation unit 28, and does not accept an instruction from the HOST controller 27. Further, the setup mode is an apparatus mode that assumes manual operation by manual instructions from the operation unit 28 during repair and maintenance work of the substrate processing apparatus 1, and does not accept instructions from the HOST controller 27. It is like.

  The three device modes described above can be switched between the operation mode and the manual mode, and between the manual mode and the setup mode, but cannot be switched between the operation mode and the setup mode.

  In addition to setting the apparatus mode, in order to operate the substrate processing apparatus 1, the first process chamber 4 and the second process chamber 6, the first vacuum robot handler 11 and the second process chamber 2 are used. It is necessary to set apparatus parameters for the vacuum robot handler 12, the loader handler 15 and the like. In this embodiment, three parameters are defined as device parameters: a first process chamber parameter, a second process chamber parameter, and a system parameter.

  The first process chamber parameter has a control range of the first process chamber 4, the second process chamber parameter has a control range of the second process chamber 6, and a system parameter has a control range of the first process chamber 4. Other than the process chamber 4 and the second process chamber 6, that is, the first vacuum robot handler 11, the second vacuum robot handler 12, the loader handler 15, and the entire apparatus, one for each substrate processing apparatus 1. Is set.

  The transfer control unit 31, the first process control unit 32, and the second process control unit 33 control each control unit in accordance with the system parameter, the first process chamber parameter, and the second process chamber parameter, respectively. It is supposed to do.

  Further, the first process chamber parameter, the second process chamber parameter, and the system parameter include 2 corresponding to each apparatus mode, such as an operation parameter used in the operation mode and the manual mode, and a setup parameter used in the setup mode. Each type of parameter is set, and each control unit is controlled in accordance with either the operation parameter or the setup parameter.

  The first process chamber 4 and the second process chamber 6 can be set to maintenance or non-maintenance by the operation unit 28. When the first process chamber 4 and the second process chamber 6 are designated as non-maintenance, they are subject to automatic operation using operation parameters, and when maintenance is designated, they are not subject to automatic operation. When maintenance is designated, setup parameters are used for the first process chamber parameter and the second process chamber parameter regardless of the apparatus mode.

  In the transfer process of the wafer 18 in the substrate processing apparatus 1, when the system parameter output from the operation unit 28 is received by the transfer control unit 31, for example, in the case of the first processing module 2. First, a transfer instruction of the wafer 18 is transmitted from the transfer control unit 31 to the atmospheric robot control unit 36. The atmospheric robot control unit 36 transfers the corresponding wafer 18 from the first carrier 25 to the first buffer stage 19 of the first vacuum lock chamber 5 in accordance with an instruction from the transfer control unit 31. After the transfer of the wafer 18, the first vacuum lock chamber 5 is depressurized to a predetermined negative pressure by the exhaust control unit 38, and after the wafer 18 is transferred into the first process chamber 4, the first vacuum lock chamber 5 is transferred to the first process chamber 4. The process control unit 32 issues instructions to the control units 39 to 42 according to the first process chamber parameters transmitted from the operation unit 28, whereby the film formation process for the wafer 18 is performed.

  Next, the details of the process chamber of the substrate processing apparatus 1 will be described with reference to FIG. In the following, the first process chamber 4 will be described, and the second process chamber 6 has the same configuration as the first process chamber 4 and will not be described.

  In the present embodiment, the first process chamber 4 is a plasma processing apparatus 44, and the plasma processing apparatus 44 includes a vacuum vessel 46 that forms a processing chamber 45. A wafer loading / unloading port 47 for loading / unloading the wafer 18 as a substrate to be processed into / from the processing chamber 45 is opened on the side surface of the vacuum container 46, and the wafer loading / unloading port 47 is opened and closed by a gate valve 48. It has become like that.

  One end of an exhaust line 49 is connected to the bottom surface of the vacuum vessel 46, and the other end of the exhaust line 49 is connected to a vacuum exhaust device 51 as vacuum exhaust means. In the middle of the exhaust line 49, an exhaust conductance adjusting valve 52 is provided as exhaust conductance adjusting means. An exhaust conductance adjustment valve control device 53 is electrically connected to the exhaust conductance adjustment valve 52, and a pressure sensor 54 for detecting the pressure in the processing chamber 45 is electrically connected to the exhaust conductance adjustment valve control device 53. It is connected to the. The exhaust conductance adjustment valve control device 53 controls the exhaust conductance adjustment valve 52 based on instructions from the pressure sensor 54 and the first process control unit 32 to adjust the pressure in the processing chamber 45. The

  An anode electrode (anode) 55 is installed in the processing chamber 45 of the vacuum vessel 46. A gas passage 56 is formed inside the anode electrode 55, and a shower plate 57 is fitted on the lower surface of the anode electrode 55 so as to define the gas passage 56. A large number of outlets 58 are formed in the shower plate 57 so as to blow out gas in a shower shape. A gas introduction line 59 as a gas introduction means is connected to the gas passage 56 of the anode electrode 55, and various gases are introduced into the gas passage 56 from the gas introduction line 59. Yes.

  Further, a cathode electrode (cathode) 61 is installed in the lower part of the processing chamber 45 of the vacuum vessel 46. The cathode electrode 61 is also configured to serve as a substrate mounting table (susceptor) that holds the wafer 18 in a state where the wafer 18 is placed. (Not shown).

  A high-frequency oscillator 62 as a high-frequency power supply means is connected between the anode electrode 55 and the cathode electrode 61 via an impedance matching unit 63, and the high-frequency oscillator 62 is connected to the first process control unit 32. And a communication line 64. The high-frequency oscillator 62 applies high-frequency power between the anode electrode 55 and the cathode electrode 61 via the impedance matching unit 63 according to an instruction from the first process control unit 32.

  A voltmeter 65 as a self-bias voltage detection means is connected to the cathode electrode 61, and the voltmeter 65 feeds back a detection result to the first process control unit 32 via a communication line 66. It is configured. Note that a storage device 67 such as an HDD, a display device 68 such as a monitor, and an input device 69 such as a mouse and a keyboard are connected to the first process control unit 32, but the storage device 67 and the display device 68. Needless to say, the input device 69 may be replaced by the operation unit 28.

  The first process control unit 32 incorporates a function of managing a traveling wave power amount and a cumulative self-bias voltage as a software function. The first process control unit 32 proceeds as data related to plasma processing. A wave power value is acquired from the high-frequency oscillator 62 via the communication line 64 and stored in the storage device 67. The first process control unit 32 acquires a self-bias voltage value as data related to plasma processing from the voltmeter 65 via the communication line 66 and stores it in the storage device 67. .

  Next, film formation on the wafer 18 by the plasma processing apparatus 44 will be described.

  When the wafer 18 to be deposited is transferred to the wafer loading / unloading port 47, the gate valve 48 is opened, and the wafer 18 is loaded into the processing chamber 45 from the wafer loading / unloading port 47, which also serves as a susceptor. It is mounted on the cathode electrode 61. After the wafer 18 is held on the cathode electrode 61, the wafer loading / unloading port 47 is closed by the gate valve 48, and the inside of the processing chamber 45 is adjusted by the vacuum exhaust device 51 by the exhaust line 49 and the exhaust conductance. Exhaust through valve 52.

  In a state where the inside of the processing chamber 45 is maintained at a predetermined pressure, a raw material gas is introduced into the gas passage 56 from the gas introduction line 59, and the shower is introduced into the processing chamber 45 from the outlet 58 of the shower plate 57. Is blown out. As a method for maintaining the pressure in the processing chamber 45 constant, the exhaust conductance adjusting valve 52 is controlled based on a signal output from the pressure sensor 54 and input to the exhaust conductance adjusting valve control device 53. A feedback control method is used.

  In the state where the inside of the processing chamber 45 is maintained at a predetermined pressure, the power value set by the input device 69 in the first process control unit 32 is supplied to the high-frequency oscillator 62 through the communication line 64. The high frequency power is generated from the high frequency oscillator 62. The high frequency power generated by the high frequency oscillator 62 is applied to the anode electrode 55 through the impedance matching unit 63, and when high frequency power is applied to the anode electrode 55, the anode electrode 55 and the cathode electrode 61 In the meantime, plasma is generated. The plasma generated in this manner decomposes or activates the raw material gas blown into the processing chamber 45 in the form of a shower, deposits it on the wafer 18 placed on the cathode electrode 61, and forms a film. It is formed.

  Next, the details of the configuration of the operation unit 28 in this embodiment will be described with reference to FIG.

  The operation unit 28 includes a CPU 71, an input / output unit 72, a display unit 73 such as a monitor, a setting instruction unit 74 such as a mouse and a keyboard, and a storage unit 75 such as a memory and an HDD. The display unit 73 and the setting instruction unit 74 may be integrated by using the display unit 73 as a touch panel.

  The storage unit 75 includes a parameter data storage area 76 and a file storage area 77 corresponding to each control unit, that is, the transfer control unit 31, the first process control unit 32, and the second process control unit 33, respectively. And a common program storage area 78 for each control unit. In the parameter data storage area 76, a control data buffer 79 and an editing data buffer 80 are formed.

  Each file storage area 77 stores an operation parameter data file 82 and a temporary area 81. Here, the operational parameter data file 82 is a data file storing the edited operational parameters. The program storage area 78 stores parameters editing program 83, operation parameter update program 84, setup parameter update program 85, device mode switching program 86, operation → setup switching program 87, setup → operation switching program 88, and the like. Has been.

  The parameter data storage area 76 and the file storage area 77 have the same configuration with respect to any of the transfer control unit 31, the first process control unit 32, and the second process control unit 33. Therefore, hereinafter, the first process control unit 32 will be described, and description of the transfer control unit 31 and the second process control unit 33 will be omitted.

  The control data buffer 79 and the editing data buffer 80 are used in common in the manual mode and the setup mode, and the control data buffer 79 controls the first process control unit 32 in the manual mode. Operation parameters are written, and the setup parameters are written in the setup mode.

  In the manual mode, the editing data buffer 80 is a buffer into which the operation parameters read from the operation parameter data file 82 are written when the operation parameters are edited, and is written into the editing data buffer 80. The operation parameters can be edited, and the operation parameters of the control data buffer 79 are updated based on the edited operation parameters.

  By updating the operation parameters of the control data buffer 79, the respective control units 39 to 42 are controlled by the first process control unit 32 in accordance with the updated operation parameters.

  In the setup mode, the editing data buffer 80 is a buffer in which operational parameters of the control data buffer 79 are written as setup parameters when editing the setup parameters. The set-up setup parameters can be edited, and the setup parameters in the control data buffer 79 are updated based on the edited setup parameters.

  By updating the setup parameter of the control data buffer 79, the respective control units 39 to 42 are controlled by the first process control unit 32 in accordance with the updated setup parameter.

  The temporary area 81 is an area for temporarily storing the edited operation parameter of the editing data buffer 80 as a temporary file in the manual mode. The operation parameter data file 82 is a file in which operation parameters temporarily stored in the temporary area 81 are stored as a data file.

  The parameter editing program 83 edits operation parameters and setup parameters written in the editing data buffer 80 in accordance with an instruction input from the setting instruction unit 74 by an operator. The operation parameter update program 84 updates the operation parameter of the control data buffer 79 with the edited operation parameter. The setup parameter update program 85 updates the setup parameters of the control data buffer 79 with the edited setup parameters.

  The device mode switching program 86 has a function of switching the display on the display unit 73 to the device mode switching screen in accordance with an instruction input from the setting instruction unit 74 by an operator. Has a function of switching the device mode from the manual mode to the setup mode in accordance with an instruction input by the operator from the setting instruction unit 74. The setup → operation switching program 88 is provided by the operator from the setting instruction unit 74. It has a function of switching the device mode from the setup mode to the manual mode in accordance with the input instruction.

  Next, with reference to FIG. 5, the updating of operation parameters will be described. The operation parameters can be updated only when the device mode is the manual mode.

  When updating the operation parameter, the operator presses the edit button displayed on the display unit 73 via the setting instruction unit 74. When the edit button is pressed, the parameter editing program 83 is activated, and the display on the display unit 73 is switched to the parameter editing screen.

  On the parameter editing screen, the operation parameters written in the editing data buffer 80 are displayed, and the operator can display the first process control unit displayed on the display unit 73 via the setting instruction unit 74. After changing the operation parameter of 32 to a desired value, the save button displayed on the display unit 73 is pressed via the setting instruction unit 74. Further, the same processing as described above is performed for the operation parameters of the transport control unit 31 and the second process control unit 33.

  When an operator presses the save button displayed on the display unit 73 via the setting instruction unit 74, the operation parameter update program 84 is activated, and the operation parameter update program 84 stores the edited operation parameter. Is stored as a temporary file in the temporary area 81 (I in FIG. 5), and a download message containing the edited contents is created from the edited operation parameters. For example, when only the first process chamber parameter is edited, the created download message is transmitted only to the first process control unit 32 via the input / output unit 72 by the operation parameter update program 84. (II in FIG. 5).

  The first process control unit 32 determines from the download message received from the operation unit 28 whether each control unit 39 to 42 can be controlled with the edited operation parameter, and uses the determination result as a download response message. It transmits to the said operation part 28 (III in FIG. 5). The received download response message is determined by the operation parameter update program 84 to be normal. If the response is normal, the edited operation parameter stored in the editing data buffer 80 is used as the control data buffer. Write to 79 and overwrite the operation parameter before editing (IV in FIG. 5). At the same time, the name of the operation parameter saved as a temporary file in the temporary area 81 is changed and saved as the operation parameter data file 82 which is a data file (V in FIG. 5), and finally in the temporary area 81. The operation parameter update is completed by deleting the stored operation parameter.

  When the update of the operation parameter is completed, the transfer control unit 31, the first process control unit 32, and the second process control unit 33 follow the operation parameter written in the control data buffer 79. Each control unit is controlled and manual operation is started.

  If the download response message received from the corresponding control unit is an abnormal response determination, the download message may be generated and transmitted again, or the editing data buffer 80 may be retransmitted by an alarm or the like. The operator may be prompted to edit the operation parameters.

  Next, referring to FIG. 6, the update of the setup parameter will be described. The setup parameter can be updated only when the apparatus mode is the setup mode.

  When updating the setup parameters, the operator presses an edit button displayed on the display unit 73 via the setting instruction unit 74. When the edit button is pressed, the parameter editing program 83 is activated, and the display on the display unit 73 is switched to the parameter editing screen.

  The parameter editing screen displays the setup parameters written in the editing data buffer 80, and the operator can display the first process control unit 32 displayed on the display unit 73 via the setting instruction unit 74. After the setup parameter is changed to a desired value, the download button displayed on the display unit 73 is pressed via the setting instruction unit 74. Further, the same processing as described above is performed for the setup parameters of the transfer control unit 31 and the second process control unit 33. Note that the parameter edit screen in the setup mode does not display a parameter save button unlike the parameter edit screen in the manual mode.

  When the operator presses the download button displayed on the display unit 73 via the setting instruction unit 74, the setup parameter update program 85 is activated, and the setup parameter update program 85 is edited from the edited setup parameter. Create a download message containing the content. For example, when only the first process chamber parameter is edited, the created download message is transmitted only to the first process control unit 32 via the input / output unit 72 by the setup parameter update program 85. (I in FIG. 6).

  The first process control unit 32 determines whether each control unit 39 to 42 can be controlled with the operation parameter edited from the received download message, and transmits the determination result to the operation unit 28 as a download response message. (II in FIG. 6). The received download response message is judged to be normal by the setup parameter update program 85, and in the case of a normal response, the control data is the setup parameter after editing stored in the editing data buffer 80. The setup parameter of the buffer 79 is overwritten (III in FIG. 6). The setup parameter update is completed when overwriting is completed. At this time, the setup parameter update program 85 does not access the temporary area 81 and the operation parameter data file 82 at all during the setup parameter update process.

  When the update of the setup parameter is completed, the transfer control unit 31, the first process control unit 32, and the second process control unit 33 follow the setup parameter written in the control data buffer 79. Each control unit is controlled, and repair and maintenance work is started.

  When the download response message received from the control unit is an abnormal response determination, the download message may be transmitted again, or the editing data buffer 80 may be edited again by an alarm or the like. The operator may be prompted.

  The first process control unit 32 starts control of the control units 39 to 42 by updating the operation parameter and the setup parameter written in the control data buffer 79. Since the common data buffer 79 is used in the manual mode and the setup mode, the control by the first process control unit 32 is not distinguished between the operation parameter and the setup parameter. Similarly, the conveyance control unit 31 and the second process control unit 33 are not distinguished from each other by the operation parameter and the setup parameter when controlling each control unit.

  Next, a case where the apparatus mode is switched from the manual mode to the setup mode will be described with reference to FIG.

  The display unit 73 always displays a device mode switching button, and when the operator presses the device mode switching button via the setting instruction unit 74, the device mode switching program 86 is activated, and the device The display on the display unit 73 is switched to the device mode switching screen by the mode switching program 86.

  An operation → setup switching button is displayed on the device mode switching screen. When the operator presses the operation → setup switching button via the setting instruction unit 74, the operation → setup switching program 87 is activated. The operation → setup switching program 87 stores all operation parameters, that is, operation parameters stored in the editing data buffer 80 of the transport control unit 31, and stores them in the editing data buffer 80 of the first process control unit 32. The operation parameters stored in the editing data buffer 80 of the second process control unit 33 are overwritten with the operation parameters stored in the control data buffer 79, respectively.

  This is because the initial value of the setup parameter is set to the same value as the operation parameter that controls the control units 31 to 33 until immediately before. Note that when the operator has pressed the operation → setup switching button via the setting instruction unit 74 in a state where editing of the operation parameters of the editing data buffer 80 has not been completed, the operation parameter being edited is It is overwritten with the operation parameters of the control data buffer 79 and erased.

  After the editing data buffer 80 is updated, the parameter editing program 83 is automatically activated, the display on the display unit 73 is switched to the parameter editing screen, and the same processing as the setup parameter update described above is performed. .

  The operator changes the setup parameters of the transfer control unit 31, the first process control unit 32, and the second process control unit 33 to desired numerical values via the setting instruction unit 74, and then the setting instruction unit When a download button displayed on the display unit 73 is pressed via 74, a download message including edit contents is created from the setup parameter of the editing data buffer 80, and the corresponding control unit, in FIG. A download message and a download response message are sequentially transmitted and received between the transfer control unit 31 and the first process control unit 32.

  If the download response message from the transport control unit 31 for the transmitted download message is a normal response, the download message is then transmitted to the first process control unit 32, and the first process control unit 32 If the download response message is a normal response, first, the operation parameter of the control data buffer 79 is overwritten and updated with the edited setup parameter of the transport control unit 31, and the same applies to the first process control unit 32. Update the setup parameters.

  The setup parameter stored in the control data buffer 79 is updated, so that the switching from the manual mode to the setup mode is completed. When the update of the setup parameter is completed, the transfer control unit 31, the first process control unit 32, and the second process control unit 33 control each control according to the setup parameter written in the control data buffer 79. Control and maintenance work is started.

  In addition, since the case where the download response message from the said conveyance control part 31 and the said 1st process control part 32 is an abnormal response is the same as that of the case of the update of a setup parameter, description is abbreviate | omitted.

  Next, a case where the apparatus mode is switched from the setup mode to the manual mode will be described with reference to FIG.

  When the operator presses the device mode switching button displayed on the display unit 73 via the setting instruction unit 74, the device mode switching program 86 is activated, and the device mode switching program 86 starts the display unit 73. Is switched to the device mode switching screen.

  A setup → operation switching button is displayed on the device mode switching screen. When the operator presses the setup → operation switching button via the setting instruction unit 74, the setup → operation switching program 88 is activated. The setup → operation switching program 88 reads operation parameters from the operation parameter data file 82 of the transport control unit 31, and reads operation parameters from the operation parameter data file 82 of the first process control unit 32, Operation parameters are read from the operation parameter data file 82 of the second process control unit 33.

  After the operation parameters are read, a download message including the contents of the operation parameters read by the setup → operation switching program 88 is created. In FIG. A download message and a download response message are sequentially exchanged with the first process control unit 32 and the second process control unit 33.

  If the download response message from the transport control unit 31 for the transmitted download message is a normal response, the download message is then transmitted to the first process control unit 32. If the download response message from the first process control unit 32 is normal, the download message is then transmitted to the second process control unit 33. If the download response message from the second process control unit 33 is also a normal response, first, the operation parameters are read again from the operation parameter data file 82 of the transfer control unit 31, and the transfer control unit is read with the read operation parameters. The setup parameters stored in the control data buffer 79 and the editing data buffer 80 of 31 are overwritten and updated, and the same applies to the first process control unit 32 and the second process control unit 33. Then, the setup parameters are overwritten and updated with the operation parameters read from the operation parameter data file 82.

  The setup parameters stored in the control data buffer 79 and the editing data buffer 80 are overwritten and deleted with the operation parameters by switching the apparatus mode from the manual mode to the setup mode. It is set by the operator every time the apparatus 1 is repaired or maintained. Accordingly, the setup parameters stored in the control data buffer 79 and the editing data buffer 80 are created as temporary files that exist only in the setup mode.

  Updating the control data buffer 79 and the editing data buffer 80 completes the switching from the setup mode to the manual mode. After completion of the switching, when an instruction to execute the process is input by the operator via the setting instruction unit 74, the transfer control unit 31, the first process control unit 32, and the second process control unit 33 Then, each control unit is controlled according to the operation parameters written in each control data buffer 79, and the manual operation is started. Note that, when the operation parameter is updated before the operator inputs a process execution instruction, the same process as the operation parameter update described above is performed.

  The case where the download response message from the transfer control unit 31, the first process control unit 32, and the second process control unit 33 is an abnormal response is the same as the operation parameter update. Therefore, explanation is omitted.

  As described above, the substrate processing apparatus according to the present embodiment uses the control data buffer 79 and the editing data buffer 80 which are the same for operation parameters and setup parameters. Therefore, when updating the setup parameters, the setup parameter update program 85 does not access the temporary area 81 and the operation parameter data file 82, which is a data file, so that the setup parameter is updated. It is possible to prevent the editing of setup parameters from affecting the operation parameters during automatic operation, and to prevent the risk of defective product manufacturing and operation by performing automatic operation with the operation parameters changed. be able to.

  When the device mode is switched from the setup mode to the manual mode, the operation parameters are read from the operation parameter data file 82 stored in the parameter data storage area 76 and changed for repair and maintenance. Since the setup parameters of the data buffer 79 and the editing data buffer 80 are automatically overwritten with the read operation parameters, the operation parameters can be automatically restored simply by changing the device mode, and repair and maintenance are performed. The return work time from work can be reduced.

  Furthermore, when editing the setup parameters in the setup mode, the download message is created and sent only to the control unit that performed the edit, so unnecessary processing is skipped during repair and maintenance work. It is possible to reduce the time for repair and maintenance work itself.

  Note that the substrate processing apparatus of this embodiment is applicable not only to a single wafer apparatus but also to a batch type apparatus including a vertical apparatus and a horizontal apparatus. Further, as a substrate processing apparatus, not only a semiconductor manufacturing apparatus but also an apparatus for processing a glass substrate such as an LCD apparatus can be applied.

  The film forming process using the substrate processing apparatus applied to this embodiment includes, for example, a process for forming a CVD, PVD, oxide film, nitride film, a process for forming a film containing a metal, and the like. Needless to say, the present invention can also be applied to other substrate processing apparatuses such as an exposure apparatus, a lithography apparatus, a coating apparatus, and a CVD apparatus using plasma.

(Appendix)
The present invention includes the following embodiments.

  (Supplementary Note 1) An operation unit having a display unit for editing device parameters, a storage unit for storing the device parameters, and a control unit for executing the device parameters downloaded from the operation unit. The apparatus parameters include a setup parameter used in a setup mode for adjustment work, repair of a failure, and regular maintenance work, and an operation parameter used in an operation mode for normal operation. A substrate processing apparatus configured so that the operation parameters are not affected even when edited.

  (Supplementary note 2) The substrate processing apparatus according to supplementary note 1, wherein the storage unit stores the operation parameters as a file.

  (Supplementary note 3) The substrate processing apparatus according to supplementary note 1, wherein the operation unit creates the setup parameter as a temporary file in a setup mode and downloads the setup parameter to the control unit.

  (Supplementary note 4) The substrate processing apparatus according to supplementary note 1 or supplementary note 2, wherein the operation unit does not access the operation parameter in a setup mode.

  (Supplementary note 5) The substrate processing apparatus according to supplementary note 3 or supplementary note 4, wherein the operation unit overwrites and deletes the setup parameter with the operation parameter when shifting to the manual mode.

  (Supplementary note 6) The substrate processing apparatus according to supplementary note 3 or supplementary note 4, wherein the operation unit downloads the operation parameter to the control unit when shifting to the manual mode.

  (Supplementary Note 7) Substrate processing including a step of editing device parameters via a display unit, and a step of executing the device parameters downloaded from an operation unit having a storage unit in which the control unit stores the device parameters. The process of editing the apparatus parameters is a process of editing the setup parameters used in the setup mode during adjustment work, repair of failure, and periodic maintenance work, and the operation mode in normal operation. A method of controlling a substrate processing apparatus, wherein the operation parameter is not affected in the step of editing the setup parameter.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 1st processing module 3 2nd processing module 28 Operation part 31 Conveyance control part 32 1st process control part 33 2nd process control part 44 Plasma processing apparatus 73 Display part 74 Setting instruction | indication part 75 Memory | storage Section 76 Parameter data storage area 77 File storage area 78 Program storage area 79 Control data buffer 80 Editing data buffer 82 Operation parameter data file 84 Operation parameter update program 85 Setup parameter update program 87 Operation → Setup switching program 88 Setup → Operation switching program

Claims (8)

A display unit for editing device parameters including setup parameters used in the setup mode for maintenance work and operation parameters used in the normal operation mode and manual mode, and the device parameters are stored. A parameter data storage area to store, a file storage area to store at least an operation parameter data file for storing the operation parameters, and a program storage area to store at least a setup parameter update program for overwriting the setup parameters with the edited setup parameters A substrate processing apparatus comprising at least an operation unit having a storage unit, and a process control unit for controlling a processing chamber for processing a substrate,
The operation unit is
Displaying the setup parameter written in the parameter data storage area on the edit screen, after the setup parameter is edited on the edit screen, download the edited setup parameter to the process control unit,
The process control unit
It is determined whether the processing chamber can be controlled with the downloaded setup parameter after editing, and the determination result is downloaded to the operation unit,
The operation unit is
Determine whether the determination result is normal, if normal, overwrite the edited setup parameter in the parameter data storage area ,
The substrate processing apparatus, wherein the setup parameter update program is configured not to access the file storage area .   The substrate processing apparatus according to claim 1, wherein a save button for saving parameters is not displayed on the edit screen. The operation unit is
When the determination result received from the process control unit is abnormal, the setup parameter after editing is downloaded again, or an alarm is generated and the editing screen is displayed again. 1. A substrate processing apparatus. Furthermore, it is comprised so that the apparatus mode switching button may be displayed on the said display part,
The substrate processing apparatus according to claim 1, wherein the operation unit is configured to be able to switch between three apparatus modes, the operation mode, the setup mode, and the manual mode, by the apparatus mode switching button. The substrate processing apparatus according to claim 4 , wherein the substrate processing apparatus is configured so that switching between the operation mode and the setup mode is not possible. The substrate processing apparatus according to claim 4 , wherein the setup parameter stored in the parameter data storage area is overwritten with the operation parameter when switching from the setup mode to the manual mode. A parameter editing method comprising a step of editing a device parameter including a setup parameter used in a setup mode during maintenance work, and an operation parameter used in an operation mode in normal operation and in a manual mode, The step of editing the apparatus parameter includes a step of editing the setup parameter written in the parameter data storage area, and a step of editing the operation parameter,
In the step of editing the setup parameter,
Displaying the setup parameters written in the parameter data storage area on an edit screen;
After the setup parameter is edited on the editing screen, downloading the setup parameter after editing;
Determining whether it is possible to control the processing chamber for processing the substrate with the downloaded setup parameters after editing, and downloading the determination result;
Determining whether the determination result is normal, and if normal, overwriting the edited setup parameter in the parameter data storage area;
Yes, and the parameter editing method characterized by the operational parameters data file that stores the operational parameters so as not to access the file storage area for at least storing. A setup parameter update program for updating a setup parameter executed by the substrate processing apparatus of claim 1,
A process of downloading the edited setup parameter after the setup parameter is edited;
Overwriting the edited setup parameter in the parameter data storage area;
Setup parameter update program including.

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