JP5681378B2 - Plating member and manufacturing method thereof - Google Patents

Description

  The present invention relates to a plating member including a silver-copper-containing alloy plating layer and a manufacturing method thereof, and more particularly to a plating member including a silver-copper-containing alloy plating layer excellent in heat resistance and durability and a manufacturing method thereof.

  Electrical contacts such as connectors and switches are relatively inexpensive, and nickel (Ni) is used to prevent diffusion and improve durability in metal parts such as copper (Cu) alloys and stainless steel, which have excellent mechanical properties and electrical conductivity. ) Or Ni alloy base plating, and a material on which silver (Ag) plating excellent in electrical conductivity and corrosion resistance is applied is often used.

  However, when the material plated with Ag on Ni plating is heated by mounting reflow, resin welding, or heat generated by electric resistance generated when energizing the member, the adhesion between Ag and Ni (heat resistant) There is a problem that the adhesiveness is reduced. As a method for improving this point, a method of forming a Cu plating layer between an Ag plating layer and a Ni plating layer has been proposed (see, for example, Patent Document 1).

Further, members with repeated insertion / extraction, sliding, and keystroke are required to have higher durability.
As a method for improving the durability of the plating material, a method of forming an organic film on the surface has been proposed (see, for example, Patent Document 2).

JP 2004-263274 A JP-A-6-212491

  In the method of Patent Document 1, it is necessary to form three different types of plating layers, and the number of plating steps increases, which may be disadvantageous in terms of cost and productivity. Moreover, since the outermost layer is an Ag plating layer and the material silver is a material with low hardness, the plating material described in Patent Document 1 has a thick Ag plating layer in order to improve durability. Can be considered. However, the method of thickening the Ag plating has a problem that the consumption of expensive silver increases and the manufacturing cost increases.

  In the method of Patent Document 2, the durability is improved, but the contact resistance on the surface of the plating material is increased. Also, in the plating material manufacturing process, depending on the plating material manufacturing conditions, such as contact between the organic film after forming the organic film on the surface and cleaning chemicals or machine oil, heat during reflow or resin welding, and rubbing during pressing There was also a concern that the durability could not be sufficiently improved due to the decomposition, shaving or peeling of the organic film.

The plating member of the present invention includes a plate-like metal member made of Cu, Cu alloy, and stainless steel , a base plating layer made of nickel or a nickel alloy provided on the metal member, and provided on the base plating layer. And a silver-copper-containing alloy plating layer having a thickness of 0.2 μm to 5 μm and a copper content of 0.5% by mass to 30% by mass, and an electrical contact part of a connector or switch Used for.

The method for producing a plated member according to the present invention includes a step of forming a base plating layer made of nickel on a metal member made of Cu, Cu alloy, and stainless steel by electrolytic plating, and a thickness on the upper surface of the base plating layer. Of a silver-copper-containing alloy plating layer having a copper content of 0.5 to 30% by mass and containing a cyanine silver salt and a cyanine copper salt and a polyethyleneimine added thereto. And a step of forming by electroplating treatment.

The method for producing a plated member of the present invention includes a step of forming a base plating layer made of nickel on a metal member made of Cu, Cu alloy, and stainless steel by electrolytic plating, and silver on the upper surface of the base plating layer. A step of forming a strike plating layer, and a silver-copper-containing alloy plating layer having a thickness of 0.2 μm to 5 μm and a copper content of 0.5% by mass to 30% by mass on the upper surface of the silver strike plating layer And a step of forming by electrolytic plating using a plating solution containing cyanogen silver salt and cyanogen copper salt and having polyethyleneimine added thereto.

  According to the present invention, the following effects can be obtained.

  1stly, the plating member of this invention is excellent in durability, such as abrasion resistance, and can improve the adhesiveness (heat-resistant adhesiveness) with respect to the heat | fever at the time of mounting reflow, and the heat_generation | fever by an electrical resistance.

  Secondly, since the plated member of the present invention has high durability in sliding and insertion / extraction and excellent heat-resistant adhesion, it is suitable for electrical contacts such as connectors and switches.

  3rdly, according to the manufacturing method of the plating member of this invention, a base plating layer and an Ag-Cu containing alloy plating layer should just be formed on a metal member, and the thickness of an Ag-Cu containing alloy plating layer is 0.00. Since about 1 μm to 15 μm is sufficient, the consumption of expensive silver can be suppressed and the manufacturing cost can be reduced.

It is a section schematic diagram for explaining the plating member of the embodiment of the present invention. It is a characteristic view which shows the relationship between contact resistance and the frequency | count of friction about the plating member and comparative example of embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 and 2.

  FIG. 1 is a schematic cross-sectional view illustrating a plated member according to an embodiment of the present invention.

  In the plated member 10 of this embodiment, the base plating layer 3 is formed on the metal member 1, and the silver (Ag) -copper (Cu) -containing alloy plating layer 5 is formed on the base plating layer 3.

  The metal member 1 is generally used for a connector or a switch, and the material is not particularly limited, but Cu, Cu alloy, and stainless steel can be used as an example.

  The base plating layer 3 is formed on the metal member 1. The material of the base plating layer 3 is preferably nickel (Ni) or Ni alloy. The presence of the underlying plating layer 3 between the metal member 1 and the Ag—Cu-containing alloy plating layer 5 can improve the adhesion of the Ag—Cu-containing alloy plating layer 5. In addition, the base plating layer 3 serves as a barrier layer for diffusion of the metal member 1 component (constituent element) into the Ag—Cu-containing alloy plating layer 5, and prevents diffusion of the metal member 1 component into the Ag—Cu alloy plating layer 5. When the base plating layer 3 is a Ni alloy, the Ni content is preferably 60% by mass or more, and when the Ni content is less than 60% by mass, the constituent elements of the metal member 1 are diffused into the Ag—Cu alloy plating layer 5. May not be sufficiently prevented.

  The thickness of the base plating layer 3 is preferably 0.01 μm to 10 μm. If the thickness is less than 0.01 μm, diffusion of the metal member 1 to the Ag—Cu-containing alloy plating layer 5 may not be sufficiently prevented, and surface characteristics such as solderability of the plating member 10 may be impaired. is there. Further, when the thickness is greater than 10 μm, when the plated member 10 is bent, a working crack may occur. When the plating member 10 is processed by press molding or the like, from the viewpoint of preventing the occurrence of processing cracks, the thickness of the base plating layer 3 is preferably 0.01 μm to 5 μm, from the viewpoint of preventing diffusion and preventing processing cracks, 0.05 μm to 1 μm is more preferable.

  The Ag—Cu-containing alloy plating layer 5 is formed on the base plating layer 3. By forming the Ag—Cu-containing alloy plating layer 5, the heat-resistant adhesion and durability of the plating member 10 can be improved.

  The Cu content of the Ag—Cu alloy plating layer is preferably 0.5% by mass to 30% by mass. When the Cu content is less than 0.5% by mass, the adhesion between the Ag-Cu-containing alloy plating layer 5 and the underlying plating layer 3 may not be sufficiently increased when the plating member 10 is heated. The hardness of the Ag—Cu-containing alloy plating layer 5 may not be sufficiently high, and the durability of the plating member 10 may not be sufficiently high. From the viewpoint of adhesion, the Cu content is more preferably 1% by mass to 30% by mass.

  On the other hand, when Cu content rate is higher than 30 mass%, the corrosion resistance of the plating member 10 may fall, or the contact resistance of the plating member after heat processing may become high. One possible reason for this is that the surface of the Ag—Cu-containing alloy plating layer 5 is likely to be oxidized if the Cu composition ratio becomes too high. The Ag—Cu-containing alloy plating layer 5 can contain 5% by mass or less of a metal element other than Ag and Cu. From the viewpoint of corrosion resistance and conductivity, the content of metal elements other than Ag and Cu is more preferably 1% by mass or less, and further preferably 0.5% by mass or less. This metal element is, for example, tin (Sn), bismuth (Bi), or the like.

  The thickness of the Ag—Cu-containing alloy plating layer 5 can be 0.1 μm to 15 μm. When the thickness is less than 0.1 μm, the durability of the plated member 10 may be lowered. When the thickness is more than 15 μm, the consumption of Ag increases, which is uneconomical. Considering durability and economy, the thickness of the Ag—Cu-containing alloy plating layer 5 is more preferably 0.2 μm to 10 μm, and further preferably 0.2 μm to 5 μm.

  When the metal member 1 is a material other than Cu or Cu alloy, a Ni strike plating layer may be provided between them in order to improve adhesion between the metal member 1 and the underlying plating layer 3.

  Moreover, in order to improve the adhesiveness of the base plating layer 3 and the Ag-Cu containing alloy plating layer 3, an Ag strike plating layer (or an Ag-Cu alloy strike plating layer) may be provided therebetween.

Next, with reference to FIG. 1, the manufacturing method of the plating member of this invention is demonstrated below.
<Pre-plating of metal parts>
The metal member 1 can be degreased and acid cleaned. A known method can be used for degreasing and acid cleaning. For example, alkaline electrolytic degreasing, degreasing using an organic solvent or a cleaning solution, acid cleaning using hydrochloric acid or sulfuric acid, and the like.
<Ni strike plating>
Ni strike plating is preferably performed on the metal member 1 before the base plating layer 3 made of Ni or Ni alloy is formed. By forming the Ni strike plating layer, the adhesion between the metal member 1 and the base plating layer 3 can be improved. When the metal member 1 is Cu or Cu alloy, Ni strike plating can be omitted.

Ni strike plating is performed at a current density of 1 A / dm ^{2 to} 10 A / dm ^{2 using} , for example, an aqueous solution containing nickel chloride 50 g / L to 300 g / L and concentrated hydrochloric acid 50 mL / L to 200 mL / L as a plating solution. . Thereby, a Ni strike plating layer with a film thickness of about 0.1 μm or less can be formed. Concentrated hydrochloric acid 100 mL / L is a liquid containing concentrated hydrochloric acid (37 mass% hydrochloric acid (HCL) aqueous solution) in 1 L of solution. Concentrated hydrochloric acid has a specific gravity of 1.19, and 44 mL of HCl is contained in 100 mL of concentrated hydrochloric acid, and the concentrated hydrochloric acid 100 mL / L solution is a 4.4 mass% hydrochloric acid (HCL) solution.
<Formation of base plating layer>
A base plating layer 3 is formed on the metal member 1 (Ni strike plating layer). The base plating layer 3 can be formed by a known plating method capable of forming a Ni or Ni alloy plating layer. As a preferred example, the electrolytic plating treatment is performed by immersing the metal member 1 in a plating solution. Here, as the plating solution, a solution containing Ni ions is used. As the Ni compound added to the plating solution, a known Ni compound such as nickel sulfate hexahydrate or nickel sulfamate can be used. In addition, an additive such as a commercially available brightener may be added to the plating solution.

The electrolytic current density in the electrolytic plating process is preferably 1.0 A / dm ² or more and 10.0 A / dm ² or less. If the current density is less than 1.0 A / dm ^2, the film formation rate of the base plating layer 3 is slow, and if it is greater than 10.0 A / dm ² , defects such as plating burns may occur.
<Ag strike plating>
After forming the base plating layer 3, it is preferable to perform Ag strike plating. The adhesion between the base plating layer 3 and the Ag—Cu-containing alloy plating layer 5 can be improved by the Ag strike plating layer. Ag strike plating is performed at a current density of 0.2 A / dm ^{2 to} 10 A / dm ^{2 using} , for example, an aqueous solution containing silver cyanide 1 g / L to 10 g / L and potassium cyanide 30 g / L to 120 g / L as plating solution. Do. Thereby, an Ag strike plating layer having a film thickness of about 0.1 μm or less can be formed. Ag-Cu alloy strike plating is carried out by adding copper cyanide salt to a plating solution containing silver cyanide salt and potassium cyanide so that the Cu content of the formed strike plating layer is 30% by mass or less. You may give it.
<Formation of Ag-Cu-containing alloy plating layer>
An Ag—Cu-containing alloy plating layer 5 is formed on the base plating layer 3 (Ag strike plating layer or Ag—Cu alloy strike plating layer). Formation of the Ag—Cu-containing alloy plating layer 5 is performed by immersing the metal member 1 on which the base plating layer 3 is formed in a plating solution and performing electrolytic plating treatment. Here, as the plating solution, a solution containing cyan silver salt and cyan copper salt can be used. In addition, additives such as polyethyleneimine, potassium antimony tartrate, and potassium selenate cyanate may be added to the plating solution. By adding polyethyleneimine to the plating solution, there is an effect that “burning” hardly occurs on the surface of the Ag—Cu-containing alloy plating layer. The amount of polyethyleneimine added can be 0.05 g / L to 10 g / L in the plating solution. Polyethyleneimine having an average molecular weight of 300 to 30,000 can be used.

The electrolytic current density of the electrolytic plating treatment is preferably 0.5 A / dm ² or more and 10.0 A / dm ² or less. If the current density is less than 0.5 A / dm ^2, the deposition rate of the Ag—Cu-containing alloy plating layer 5 is slow, and if it exceeds 10.0 A / dm ² , defects such as plating burns may occur. Moreover, Cu content in an Ag-Cu containing alloy plating layer can be adjusted by changing a current density.

  Thus, the plating member 10 of this embodiment includes the base plating layer 3 made of Ni or Ni alloy on the metal member 1 and the Ag—Cu-containing alloy plating layer having a Cu content of 0.5 mass% to 30 mass%. 5 are sequentially laminated.

  Thereby, it is excellent in electrical conductivity, in particular, compared with a plating member in which a Ni undercoat layer is formed on the metal member 1 and an Ag plating layer is formed on the undercoat layer, heat resistance adhesion, durability and A plating material with improved hardness can be provided.

  Moreover, compared with the method of patent document 2 which forms an organic membrane | film | coat on the surface, hardness and durability can be improved.

  Although FIG. 1 shows the case where the base plating layer 3 and the Ag—Cu-containing alloy plating layer 5 are formed on one main surface of the metal member 1, these plating layers are formed on both main surfaces of the metal member 1. It may be formed. That is, the base plating layer 3 may be formed on both main surfaces of the metal member 1, and the Ag—Cu-containing alloy plating layer 5 may be formed on both main surfaces of the base plating layer 3.

  Next, although the Example of this invention is described, this invention is not limited to this Example.

<Electrolytic degreasing and pickling of metal parts>
As the metal member 1, stainless steel (SUS301) having a length of 70 mm, a width of 70 mm, and a thickness of 0.06 mm was prepared. The metal member 1 is used as an anode, the other SUS plate as a cathode, the metal member 1 is subjected to electrolytic degreasing in an alkaline degreasing solution at a voltage of 5 V for 15 seconds, and then the metal member 1 is used as a cathode and the other SUS plate is used as an anode. Then, electrolytic degreasing was performed at a voltage of 5 V for 15 seconds. After electrolytic degreasing, the metal member 1 was washed with water, then pickled for 15 seconds in a 10 mass% hydrochloric acid aqueous solution, and washed with water.
<Ni strike plating>
An aqueous solution containing nickel chloride (150 g / L) and concentrated hydrochloric acid (100 ml / L) was used as a plating solution. Ni strike plating for 10 seconds at a current density of 2 A / dm ^{2 using} a metal member 1 that has been pickled as a cathode and a Ni electrode plate as an anode in a plating solution that is stirred (400 rpm) by a magnetic stirrer. Went.
<Under plating>
A plating solution composed of an aqueous solution containing nickel sulfamate (350 g / L), nickel chloride (20 g / L), and boric acid (35 g / L) was prepared. In the plating solution that is stirred (400 rpm) by a magnetic stirrer, the metal member 1 subjected to Ni strike plating is used as a cathode, the Ni electrode plate is used as an anode, and a current density of 2 A / dm ² is applied. Base plating was applied so that the thickness was 0.2 μm.
<Ag strike plating>
A plating solution comprising an aqueous solution containing potassium potassium cyanide (3 g / L) and potassium cyanide (90 g / L) was prepared. In a plating solution agitated by a magnetic stirrer (400 rpm), the metal member 1 on which the base plating was performed was used as a cathode, and a titanium electrode plate coated with platinum was used as an anode, with a current density of 1 A / dm ^2. Ag strike plating was performed for 2 seconds.
<Ag-Cu containing alloy plating>
A plating solution comprising an aqueous solution containing potassium potassium cyanide (18 g / L), copper potassium cyanide (120 g / L), and polyethyleneimine (molecular weight 600, 5 g / L) was prepared. An Ag-Cu-containing alloy under the conditions of a current density of 1 A / dm ^{2 using} a metal member 1 subjected to Ag strike plating as a cathode and an Ag electrode plate as an anode in a plating solution stirred (400 rpm) with a magnetic stirrer Plating was performed until the thickness of the plating layer 5 became 0.5 μm, and the plated member 10 was obtained. The Cu content of the Ag—Cu-containing alloy plating layer 5 of Example 1 is 1% by mass.
<Evaluation of plating member>
About the plating member 10 obtained above, the evaluation method shown below evaluated the heat-resistant adhesion, hardness, sliding resistance (durability), contact resistance, and Cu content of the Ag-Cu-containing alloy plating layer 5. .

  Table 1 shows the evaluation results for the plated member 10 of Example 1 described above, the plated member 10 of Example 2 described later, and the plated members of Comparative Example 1 and Comparative Example 2.

図２は、摺動回数と接触抵抗の関係を示し、横軸が摺動回数［回］であり、縦軸が接触抵抗［ｍΩ］である。実線が実施例１の結果であり、一点鎖線が実施例２の結果である。細実線および細破線がそれぞれ、比較例１および比較例２の結果である。
＜Ａｇ−Ｃｕ含有合金めっき層のＣｕ含有量＞
得られためっき部材１０を硝酸水溶液と混合して、溶解液を得た。この溶解液中のＡｇの含有量Ａ１（ｍｇ／Ｌ）、Ｃｕの含有量Ｃ１（ｍｇ／Ｌ）を、ＩＣＰ装置（ジャーレルアッシュ社製のＩＲＩＳ／ＡＲ）を用いてプラズマ分光分析法によって測定した。そして、Ａｇ−Ｃｕ含有合金めっき層５に含まれるＣｕの含有量Ｃを以下の式１により算出し、表１に示した。

FIG. 2 shows the relationship between the number of sliding times and the contact resistance, where the horizontal axis is the number of sliding times [times] and the vertical axis is the contact resistance [mΩ]. The solid line is the result of Example 1, and the alternate long and short dash line is the result of Example 2. A thin solid line and a thin broken line are the results of Comparative Example 1 and Comparative Example 2, respectively.
<Cu content of Ag-Cu-containing alloy plating layer>
The obtained plated member 10 was mixed with an aqueous nitric acid solution to obtain a solution. The Ag content A1 (mg / L) and the Cu content C1 (mg / L) in this solution were measured by plasma spectroscopy using an ICP device (IRIS / AR manufactured by Jarrel Ash). did. The Cu content C contained in the Ag—Cu-containing alloy plating layer 5 was calculated by the following formula 1 and shown in Table 1.

C = (C1) / (C1 + A1) (Formula 1)
<Method for evaluating heat-resistant adhesion>
The obtained plated member 10 is heated on a hot plate at 260 ° C. for 5 minutes, cooled to 25 ° C., and then the surface of the plated member 10 is cut with a cutter at 2 mm intervals (cross cut), and the cross cut portion In accordance with the plating adhesion test method (tape test method) described in JIS-H8504, a peeling test was performed. At this time, the tape was manufactured by Nichiban Co., Ltd., No. 405 was used. When peeling of the Ag-Cu-containing alloy plating layer 5 was not visually confirmed, it was determined that the heat-resistant adhesion was good. When peeling of the Ag—Cu-containing alloy plating layer 5 was observed, it was determined that the heat-resistant adhesion was poor.
<Evaluation method of hardness>
Vickers hardness was measured using a micro hardness meter (manufactured by Matsuzawa Seiki Co., Ltd., DMH-1) under conditions of a load of 10 gf and a pressing time of 15 seconds.
<Sliding resistance (durability) evaluation method>
Using an electrical contact simulator (manufactured by Yamazaki Seiki Laboratory Co., Ltd., CRS-1 type), the measurement conditions were a load of 30 gf, a sliding speed of 50 mm / min, a sliding distance of 1000 μm, a sliding frequency of 500 times, an indenter Ag rivet current of 10 mA, The contact resistance of the plated member 10 was measured at an open voltage of 100 mV.

When the contact resistance increased to 50 mΩ or more, it was determined that the Ag—Cu-containing alloy plating layer 5 was partially removed by sliding. Table 1 shows the number of sliding times when the contact resistance is 50 mΩ or more. When the contact resistance was less than 50 mΩ even when the number of times of sliding copper was 500 times, the number of sliding times was listed as> 500 times in Table 1. FIG. 2 shows the relationship between the number of sliding times and the contact resistance.
<Evaluation method of contact resistance>
The contact resistance of the plated member was measured under the condition of a load of 100 gf using an electrical contact simulator CRS-1 manufactured by Yamazaki Seiki Laboratory.

A plating member 10 was obtained in the same manner as in Example 1 except that the current density in forming the Ag—Cu-containing alloy plating layer 5 in Example 1 was changed from 1 A / dm ² to 3 A / dm ^2. And evaluated. The results are shown in Table 1 and FIG. The Cu content of the Ag—Cu-containing alloy plating layer 5 of Example 2 is 30% by mass.
[Comparative Example 1]
Except having changed the formation process of the Ag-Cu containing alloy plating layer 5 in Example 1 into the following and forming Ag plating layer, the plating member was obtained similarly to Example 1 and evaluated. The results are shown in Table 1 and FIG.
<Ag plating layer formation>
A plating solution comprising an aqueous solution containing potassium potassium cyanide (150 g / L) and potassium cyanide (90 g / L) was prepared. In a plating solution that is stirred by a magnetic stirrer (400 rpm), a Ni strike plating and a Ni undercoat layer are formed, and the Ag strike plated metal member is used as a cathode, and the Ag electrode plate is used as an anode. Plating was performed under the condition of dm ² until the thickness of the Ag plating layer became 0.5 μm.
[Comparative Example 2]
A plated member was obtained and evaluated in the same manner as in Comparative Example 1 except that after the Ni undercoat layer was formed in Comparative Example 1 and Cu plating was performed by the following method, Ag plating was then formed. The results are shown in the table and FIG.
<Cu plating layer formation>
A plating solution comprising an aqueous solution containing potassium potassium cyanide (40 g / L) and potassium cyanide (40 g / L) was prepared. The thickness of the Ag plating layer under the condition of a current density of 3 A / dm ^{2 using} a metal member plated with Ni as a cathode and a Cu electrode plate as an anode in a plating solution agitated by a magnetic stirrer (400 rpm). The plating was performed until the thickness became 0.1 μm.

  The evaluation results will be described with reference to Table 1.

  In Comparative Example 1, the heat-resistant adhesion is inferior, and when the peel test is performed on the plated member after the heat treatment, the Ag plating layer is peeled off. Further, in the sliding resistance test, the contact resistance increased to 40 mΩ or more after 200 times, and it was found that the durability was inferior to the plated members of Example 1 and Example 2.

  In Comparative Example 2, the heat resistant adhesion is good, but in the sliding resistance test, the contact resistance increases to 40 mΩ or more after 230 times. On the other hand, Example 1 and Example 2 were excellent in heat-resistant adhesion and high in hardness, and no significant increase in contact resistance was observed even after 500 sliding tests.

  Thus, according to this embodiment, since heat-resistant adhesion and sliding resistance are improved, it is possible to provide a material suitable for a component that is heated by reflow or a component that requires durability. .

DESCRIPTION OF SYMBOLS 1 Metal member 3 Lower layer plating layer 5 Ag-Cu containing alloy plating layer 10 Plating member

Claims (6)

A plate-like metal member made of Cu, Cu alloy, stainless steel ;
An undercoat layer provided on the metal member and made of nickel or a nickel alloy;
A silver-copper-containing alloy plating layer which is provided on the base plating layer and has a thickness of 0.2 μm to 5 μm and a copper content of 0.5% by mass to 30% by mass;
The plating member used for the electrical contact part of a connector or a switch characterized by comprising.   The plated member according to claim 1, wherein the base plating layer is nickel.   The plated member according to claim 1 or 2, wherein the plated member has a Vickers hardness Hv of 177 to 193.   The silver strike plating layer is formed on the base plating layer, and the silver-copper-containing alloy plating layer is provided on the silver strike plating layer. The plating member as described in. Forming a base plating layer made of nickel on a metal member made of Cu, Cu alloy, stainless steel by electrolytic plating;
A silver-copper-containing alloy plating layer having a thickness of 0.2 μm to 5 μm and a copper content of 0.5% by mass to 30% by mass on the upper surface of the base plating layer, including cyan silver salt and cyan copper salt Forming by electrolytic plating using a plating solution to which polyethyleneimine is added;
The method for producing a plated member according to any one of claims 1 to 3, further comprising: Forming a base plating layer made of nickel on a metal member made of Cu, Cu alloy, stainless steel by electrolytic plating;
Forming a silver strike plating layer on the upper surface of the base plating layer;
On the upper surface of the silver strike plating layer, a silver-copper-containing alloy plating layer having a thickness of 0.2 μm to 5 μm and a copper content of 0.5% by mass to 30% by mass is added with cyan silver salt and cyan copper salt. A step of forming by electroplating using a plating solution to which polyethyleneimine is added,
The method for producing a plated member according to claim 4, comprising:

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