JP5678462B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP5678462B2
JP5678462B2 JP2010090250A JP2010090250A JP5678462B2 JP 5678462 B2 JP5678462 B2 JP 5678462B2 JP 2010090250 A JP2010090250 A JP 2010090250A JP 2010090250 A JP2010090250 A JP 2010090250A JP 5678462 B2 JP5678462 B2 JP 5678462B2
Authority
JP
Japan
Prior art keywords
light emitting
light
emitting element
wavelength conversion
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010090250A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011222743A (ja
JP2011222743A5 (enExample
Inventor
将嗣 市川
将嗣 市川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2010090250A priority Critical patent/JP5678462B2/ja
Priority to US13/079,272 priority patent/US8723409B2/en
Publication of JP2011222743A publication Critical patent/JP2011222743A/ja
Publication of JP2011222743A5 publication Critical patent/JP2011222743A5/ja
Application granted granted Critical
Publication of JP5678462B2 publication Critical patent/JP5678462B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2010090250A 2010-04-07 2010-04-09 発光装置 Expired - Fee Related JP5678462B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010090250A JP5678462B2 (ja) 2010-04-09 2010-04-09 発光装置
US13/079,272 US8723409B2 (en) 2010-04-07 2011-04-04 Light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010090250A JP5678462B2 (ja) 2010-04-09 2010-04-09 発光装置

Publications (3)

Publication Number Publication Date
JP2011222743A JP2011222743A (ja) 2011-11-04
JP2011222743A5 JP2011222743A5 (enExample) 2013-05-16
JP5678462B2 true JP5678462B2 (ja) 2015-03-04

Family

ID=45039331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010090250A Expired - Fee Related JP5678462B2 (ja) 2010-04-07 2010-04-09 発光装置

Country Status (1)

Country Link
JP (1) JP5678462B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013033854A (ja) * 2011-08-02 2013-02-14 Koito Mfg Co Ltd 光波長変換部材
JP6251987B2 (ja) * 2013-06-14 2017-12-27 岩崎電気株式会社 照明器具
JP6221387B2 (ja) * 2013-06-18 2017-11-01 日亜化学工業株式会社 発光装置とその製造方法
JP7481610B2 (ja) * 2019-12-26 2024-05-13 日亜化学工業株式会社 発光装置
JP7522343B2 (ja) * 2020-08-26 2024-07-25 日亜化学工業株式会社 面発光光源及びその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3707688B2 (ja) * 2002-05-31 2005-10-19 スタンレー電気株式会社 発光装置およびその製造方法
JP2005026401A (ja) * 2003-07-01 2005-01-27 Matsushita Electric Ind Co Ltd 発光ダイオード
JP4587675B2 (ja) * 2004-01-23 2010-11-24 京セラ株式会社 発光素子収納パッケージおよび発光装置
KR100665219B1 (ko) * 2005-07-14 2007-01-09 삼성전기주식회사 파장변환형 발광다이오드 패키지
JP2008205170A (ja) * 2007-02-20 2008-09-04 Nec Lighting Ltd 発光半導体デバイス
JP2009123909A (ja) * 2007-11-14 2009-06-04 Mitsubishi Chemicals Corp 発光装置、発光装置の製造方法、サブマウントおよびサブマウントの製造方法
KR20100077213A (ko) * 2007-11-19 2010-07-07 파나소닉 주식회사 반도체 발광장치 및 반도체 발광장치의 제조방법
JP2009212134A (ja) * 2008-02-29 2009-09-17 Toshiba Corp 窒化アルミニウムパッケージ、発光装置、バックライトおよび照明装置
US8159131B2 (en) * 2008-06-30 2012-04-17 Bridgelux, Inc. Light emitting device having a transparent thermally conductive layer

Also Published As

Publication number Publication date
JP2011222743A (ja) 2011-11-04

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