JP5672911B2 - Suspension substrate, suspension substrate with outer frame, method for manufacturing suspension substrate, method for manufacturing suspension substrate with outer frame, suspension, suspension with element, and hard disk drive - Google Patents

Description

  The present invention relates to a suspension substrate capable of preventing adverse effects on elements due to static electricity.

  2. Description of the Related Art A suspension board on which elements such as a magnetic head slider are mounted is known as a circuit board used for an HDD (Hard Disk Drive). The suspension substrate usually has a basic structure in which a metal support substrate (for example, SUS), an insulating layer (for example, polyimide resin), and a wiring (for example, Cu) are laminated in this order, and the element is usually mounted on one end. And an external circuit board connection area having a connection terminal for connection to the external circuit board at the other end.

  It is known that gold plating is provided on the surface of the connection terminal of the suspension substrate in order to perform gold-gold bonding (ultrasonic bonding, USB) with the connection terminal of the external circuit board. In order to form such a plated portion, it is usually necessary to use a plated wire when manufacturing a suspension substrate. Here, FIG. 23A is a schematic plan view illustrating the suspension substrate in the manufacturing stage, and the multi-sided suspension substrate 110 is in a state before being separated from the outer frame portion 120. FIG. 23B is an enlarged view of the region S in FIG. 23A, and the plating wire 101 is connected to a conductor layer (for example, Cu) of the outer frame portion 120. After the plating portion is formed on the connection terminal using the plating wire 101, the suspension substrate 110 is separated from the outer frame portion 120 along the Cut Line in FIG. 23B to obtain a piece of the suspension substrate 110.

  On the other hand, it is known that the elements of the suspension substrate are easily affected by static electricity. In the worst case, the elements may be destroyed by static electricity. Therefore, a technique for preventing an adverse effect on elements due to static electricity is known. For example, in patent document 1, it is a flexible wiring board for relaying a suspension board and a control circuit board, Comprising: The flexible short circuit formation part for forming the short circuit part which short-circuits each wiring is formed A printed circuit board is disclosed. This technology is related to relay boards, not suspension boards. However, static electricity generated by friction due to vibrations, etc. is accumulated between wirings, and the accumulated static electricity adversely affects elements such as magnetic heads. This is intended to prevent the above. Patent Document 2 discloses a method for removing a plating wire by chemical etching.

Japanese Patent No. 3091185 JP 2009-272549 A

  As shown in FIG. 23B described above, the suspension substrate 110 is separated from the outer frame portion 120 along the Cut Line after the plating portion is formed on the connection terminal using the plating wire 101. The surface is in a state where the plated wire 101 is exposed. Therefore, when an element is mounted on the suspension substrate, the above cut surface to the element are electrically connected. In such a case, for example, when an electrostatic jig comes into contact with the cut surface, the influence of static electricity reaches the element through the plated wire and the wiring. As a result, in the worst case, the element may be destroyed by static electricity.

  The present invention has been made in view of the above circumstances, and a main object of the present invention is to provide a suspension substrate that can prevent an adverse effect on elements due to static electricity.

  In order to solve the above-described problem, in the present invention, an external circuit formed on the head portion side and having an element mounting area for mounting elements and a connection terminal formed on the tail portion side and connected to an external circuit board. A substrate connection region, a wiring for electrically connecting the element mounting region and the external circuit board connection region, and a plating wire for electrically connecting to the connection terminal with one end of the tail portion as one end A suspension support board, comprising: a metal support board; an insulating layer formed on the metal support board; the wiring formed on the insulating layer; and a connection terminal constituting the connection terminal It has a wiring part, the said plated wire, and the cover layer which covers the said plated wire, The said plated wire is disconnected at the opening part, The edge part of the said cover layer in the said opening part, and the said opening part Serial end portion of the insulating layer, to provide a substrate for suspension, characterized in that protrudes from an end portion of the plated wire described above disconnected.

  According to the present invention, it is possible to prevent an adverse effect on the element due to static electricity by disconnecting the plated wire at the opening. Further, since the exposed surface (cut surface) of the plated wire is protected by the overhanging cover layer and insulating layer, it is possible to prevent an adverse effect on the element due to static electricity. Further, the corrosion of the plated wire can be effectively suppressed by the overhang of the cover layer and the insulating layer.

  In the present invention, an element mounting region formed on the head portion side for mounting an element, an external circuit board connection region formed on the tail portion side and having a connection terminal for connection to an external circuit substrate, A suspension substrate having wiring for electrically connecting between an element mounting region and the external circuit board connection region, and a plating wire for electrical connection with the connection terminal, a metal support substrate, An insulating layer formed on the metal support substrate, the wiring formed on the insulating layer, a wiring portion for connecting terminals constituting the connecting terminal, the plated wire, and a cover layer covering the plated wire And the end of the cover layer and the end of the insulating layer at the end of the plating wire of the tail portion protrude from the end of the plating wire. Providing a substrate.

  According to the present invention, the exposed surface (cut surface) of the plated wire is protected by the overhanging cover layer and insulating layer, thereby preventing adverse effects on the element due to static electricity. Further, the corrosion of the plated wire can be effectively suppressed by the overhang of the cover layer and the insulating layer.

  In the above invention, the suspension board preferably has a test terminal for confirming the performance of the element after the element is mounted between the connection terminal and the end of the tail portion. This is because the quality of the product can be determined by providing the test terminal. The product quality test may be performed at an external circuit board connection terminal.

  In the above invention, it is preferable that two or more test terminals are shared by the shared wiring portion, and the shared wiring portion is disconnected at the opening for short-circuit prevention. This is because the number of plating wires can be reduced by providing the shared wiring portion, and as a result, the opening can be made smaller.

  In the said invention, it is preferable that the edge part of the said insulating layer protrudes rather than the edge part of the said cover layer. This is because when the opening of the insulating layer is formed, the cover layer can be prevented from being deteriorated or peeled off.

  According to the present invention, there is provided a suspension substrate with an outer frame having a suspension substrate and an outer frame portion integrated on the tail portion side of the suspension substrate, wherein the suspension substrate is disposed on the head portion side. An element mounting area for mounting an element, an external circuit board connection area formed on the tail side and having a connection terminal for connection to an external circuit board, the element mounting area, and the external circuit board connection area A wiring for electrically connecting between the outer frame portion and a plating wire for electrically connecting the connection terminal, and the suspension substrate includes a metal support substrate and the metal support An insulating layer formed on the substrate, the wiring formed on the insulating layer, a wiring portion for connecting terminal constituting the connecting terminal, the plated wire, and the plating And the plating wire is disconnected at the opening, and the end of the cover layer in the opening and the end of the insulating layer in the opening are disconnected. A suspension substrate with an outer frame is provided that protrudes beyond the end of the outer frame.

  According to the present invention, the exposed surface (cut surface) of the plated wire is protected in the opening by the overhanging cover layer and insulating layer, thereby preventing adverse effects on the element due to static electricity. Further, the corrosion of the plated wire can be effectively suppressed by the overhang of the cover layer and the insulating layer.

  In the above invention, it is preferable that the suspension substrate is separated from the suspension substrate with an outer frame on the outer frame side of the opening.

  In the above invention, the suspension substrate is preferably separated from the suspension substrate with an outer frame at the opening.

  In the present invention, an element mounting region formed on the head portion side for mounting an element, an external circuit board connection region formed on the tail portion side and having a connection terminal for connection to an external circuit substrate, For a suspension having wiring that electrically connects between an element mounting region and the external circuit board connection region, and a plating wire that is electrically connected to the connection terminal with one end of the tail portion as one end A method for manufacturing a substrate, comprising: preparing a laminated member having a metal supporting substrate, an insulating layer formed on the metal supporting substrate, and a conductor layer formed on the insulating layer; A first metal etchant that forms the wiring, the connection terminal wiring portion that constitutes the connection terminal, and the plating wire from the layer, and removes the metal support substrate at the position where the opening is to be formed A cover layer forming step of forming a cover layer on the plating wire so as not to cover the plating wire at a position where the opening is to be formed, and etching after the cover layer forming step. An insulating layer etching step for removing the insulating layer at a position for forming a portion, and after the insulating layer etching step, forming a protective layer for protecting the plated wire at a position for forming the opening from plating, On the surface of the connection terminal wiring part on which the protective layer is not formed, a plating part forming process for forming a plating part, and a protective layer peeling process for peeling the protective layer after the plating part forming process, After the protective layer peeling step, a second metal etching step for removing the plating wire at the position where the opening is to be formed by etching and forming the opening, and In the second metal etching step, an end portion of the cover layer in the opening portion and an end portion of the insulating layer in the opening portion protrude from an end portion of the plating wire in the opening portion. A method of manufacturing a suspension substrate is provided, wherein the plating wire is etched.

  According to the present invention, it is possible to obtain a suspension substrate in which an adverse effect on elements due to static electricity is prevented by disconnecting a plated wire at an opening. In particular, when forming the plating portion, by forming a protective layer that protects the plating wire at the position where the opening is to be formed from plating, there is an advantage that the removal of the plating wire is facilitated. In addition, by etching the plating wire so that the edge of the cover layer in the opening and the edge of the insulating layer in the opening protrude beyond the edge of the broken plating wire, adverse effects on the element due to static electricity It is possible to obtain a suspension substrate that prevents the above.

  In the present invention, an element mounting region formed on the head portion side for mounting an element, an external circuit board connection region formed on the tail portion side and having a connection terminal for connection to an external circuit substrate, A method for manufacturing a suspension substrate, comprising: a wiring for electrically connecting between an element mounting region and the external circuit board connection region; and a plating wire for electrical connection with the connection terminal. A laminated member having a substrate, an insulating layer formed on the metal supporting substrate, and a conductor layer formed on the insulating layer is prepared, and the wiring and the connection terminals are connected from the conductor layer by etching. A first metal etching step for forming the connecting terminal wiring portion and the plated wire, and removing the metal support substrate at a position where the tail portion is formed, and the tail portion. A cover layer forming step for forming a cover layer on the plated wire so as not to cover the plated wire at a position to be formed, and a position for forming the tail portion by etching after the cover layer forming step. After the insulating layer etching step for removing the insulating layer, and after the insulating layer etching step, a protective layer for protecting the plated wire at the position where the tail portion is formed from plating is formed, and the protective layer is formed. After the plating part forming step for forming the plating part on the surface of the wiring part for the connecting terminal not present, the protective layer peeling step for peeling the protective layer after the plating part forming step, and after the protective layer peeling step A second metal etching step of removing the plated wire at a position where the tail portion is formed by etching and forming the opening, and the second metal In the etching step, the plating wire is etched so that the end of the cover layer and the end of the insulating layer at the end of the plating wire of the tail portion protrude from the end of the plating wire. A method for manufacturing a suspension substrate is provided.

  According to the present invention, by etching the plating wire so that the end portion of the cover layer and the end portion of the insulating layer at the end portion of the plating wire of the tail portion protrude from the end portion of the plating wire, A suspension substrate that prevents adverse effects on the element can be obtained.

  In the said invention, it is preferable to form the said protective layer using a dry film resist. This is because the opening can be provided at an arbitrary place.

  In the said invention, it is preferable to form the said protective layer using the mask which protects the outer frame part of the said laminated member from plating. This is because there is an advantage that the number of steps does not increase as compared with a protective layer using a dry film resist.

  In the above invention, in the insulating layer etching step, an end of the insulating layer at a position where the opening is formed protrudes from an end of the cover layer at a position where the opening is formed. The insulating layer is preferably etched. This is because when the opening of the insulating layer is formed, the cover layer can be prevented from being deteriorated or peeled off.

  Further, in the present invention, there is provided a method of manufacturing a suspension substrate with an outer frame having a suspension substrate and an outer frame portion integrated on the tail portion side of the suspension substrate, wherein the suspension substrate is a head An element mounting area for mounting an element, an external circuit board connection area formed on the tail side and having a connection terminal for connection to an external circuit board, the element mounting area, and the external circuit A wiring for electrically connecting between the substrate connection regions, and a plating wire for electrically connecting the outer frame portion and the connection terminal, and formed on the metal support substrate and the metal support substrate A laminated member having an insulating layer formed on the insulating layer and a conductor layer formed on the insulating layer, and a connecting terminal constituting the wiring and the connecting terminal from the conductor layer by etching. A first metal etching step for forming the wiring portion and the plated wire and removing the metal support substrate at a position where the opening is to be formed; and not covering the plated wire at the position where the opening is to be formed Thus, a cover layer forming step for forming a cover layer on the plated wire, and an insulating layer etching step for removing the insulating layer at a position where the opening is formed by etching after the cover layer forming step, After the insulating layer etching step, a protective layer for protecting the plated wire at the position where the opening is to be formed is formed from plating, and on the surface of the connection terminal wiring portion where the protective layer is not formed. Etching after the plating layer forming step for forming the plating portion, the protective layer peeling step for peeling the protective layer after the plating portion forming step, and the protective layer peeling step. Removing the plating wire at the position where the opening is to be formed and forming the opening, and in the second metal etching step, the cover in the opening A suspension with an outer frame, wherein the plating wire is etched so that an end portion of the layer and an end portion of the insulating layer in the opening portion protrude from an end portion of the plating wire in the opening portion. Provided is a method for manufacturing an industrial substrate.

  According to the present invention, by etching the plating wire so that the end portion of the cover layer in the opening portion and the end portion of the insulating layer in the opening portion protrude from the end portion of the broken plating wire, A suspension substrate with an outer frame that prevents adverse effects on the element can be obtained.

  The present invention also provides a suspension including the above-described suspension substrate.

  According to the present invention, by using the above-described suspension substrate, it is possible to provide a suspension in which adverse effects on elements due to static electricity are prevented.

  The present invention also provides an element-equipped suspension comprising the above-described suspension and an element mounted on the element mounting region of the suspension.

  According to the present invention, by using the suspension described above, it is possible to provide a suspension with an element that prevents adverse effects on the element due to static electricity.

  The present invention also provides a hard disk drive including the above-described suspension with an element.

  According to the present invention, a hard disk drive with higher functionality can be obtained by using the above-described suspension with an element.

  In this invention, there exists an effect that the bad influence to the element by static electricity can be prevented.

It is a schematic plan view which shows an example of the board | substrate for suspensions of this invention. It is an enlarged view which shows the periphery of the tail part T of FIG. It is AA sectional drawing and BB sectional drawing of FIG. It is a schematic diagram which illustrates the tail part of the board | substrate for suspensions of this invention. It is a schematic diagram which illustrates the opening part in this invention. It is a schematic plan view which illustrates the tail part of the board | substrate for suspensions of this invention. It is a schematic diagram explaining the board | substrate for suspensions of this invention. It is a schematic plan view explaining the board | substrate for suspensions of this invention. It is a schematic diagram which illustrates the tail part in this invention. It is a schematic plan view which shows an example of the board | substrate for suspension with an outer frame of this invention. It is a schematic plan view which shows an example of the tail part of the board | substrate for suspension obtained by this invention. It is a schematic sectional drawing which illustrates the manufacturing method of the board | substrate for suspensions of this invention. It is a schematic sectional drawing which illustrates the manufacturing method of the board | substrate for suspensions of this invention. It is a schematic sectional drawing which illustrates the manufacturing method of the board | substrate for suspensions of this invention. It is a schematic sectional drawing which illustrates the manufacturing method of the board | substrate for suspensions of this invention. It is a schematic plan view which shows the board | substrate for suspensions of a manufacture stage. It is a schematic sectional drawing which illustrates the opening part in this invention. It is a schematic diagram which illustrates the opening part in this invention. It is a schematic sectional drawing which illustrates the opening part in this invention. It is a schematic plan view which shows an example of the suspension of this invention. It is a schematic plan view which shows an example of the suspension with an element of this invention. It is a schematic plan view which shows an example of the hard disk drive of this invention. It is a schematic plan view which illustrates the board | substrate for suspensions of a manufacture stage.

  Hereinafter, a suspension substrate, a suspension substrate with an outer frame, a method for manufacturing a suspension substrate, a method for manufacturing a suspension substrate with an outer frame, a suspension with an element, and a hard disk drive according to the present invention will be described in detail.

A. Suspension substrate The suspension substrate of the present invention can be roughly divided into two embodiments. The suspension substrate of the present invention will be described by dividing it into a first embodiment and a second embodiment.

1. First Embodiment First, the suspension substrate of the first embodiment will be described. The suspension substrate according to the first embodiment is formed on the head portion side, and an external circuit board connection region formed on the tail portion side and having a connection terminal formed on the tail portion side and connected to the external circuit board. Wiring for electrically connecting the element mounting region and the external circuit board connection region, and a plating wire for electrically connecting to the connection terminal, with the end of the tail portion as one end. A suspension substrate having a metal support substrate, an insulating layer formed on the metal support substrate, the wiring formed on the insulating layer, and a connection terminal wiring portion constituting the connection terminal, And the plating wire, wherein the plating wire is disconnected at the opening.

  FIG. 1 is a schematic plan view showing an example of a suspension substrate according to the first embodiment. For the sake of convenience, the description of the insulating layer and the cover layer is omitted, and this also applies to FIG. 2, FIG. 4 (a), FIG. 6, FIG. A suspension substrate 20 shown in FIG. 1 is formed on the head portion H side, and has an element mounting region X for mounting elements, and a connection terminal 12 formed on the tail portion T side for connecting to an external circuit board. The external circuit board connection area Y, the wiring 13 (13a to 13d) for electrically connecting the element mounting area X and the external circuit board connection area Y, the end of the tail portion T as one end, And a plated wire 14 for electrical connection. The wirings 13a and 13b and the wirings 13c and 13d form a wiring pair, one for recording and the other for reproduction. The suspension substrate of the first embodiment is characterized in that the plating wire 14 is disconnected at the opening 16. Further, in FIG. 1, a test terminal region Z having a test terminal 15 for confirming the performance of the element after the element is mounted is formed between the connection terminal 12 and the end of the tail part T. ing.

  FIG. 2 is an enlarged view showing the periphery of the tail portion T of FIG. In FIG. 2, from the head part (not shown) side, wiring 13 (13a-13d), connection terminal 12 (12a-12d), test terminal 15 (15a-15d), and plating wire 14 (14a-14d) Are arranged in this order, and the plating wires 14a to 14d are disconnected at the opening 16 before the end of the tail portion T. Since the test terminal 15 is not required after the performance of the element after the element mounting is confirmed, the test terminal 15 is usually cut between the external circuit board connection region Y and the test terminal region Z in FIG. 2) and the test terminal is removed.

  3A is a cross-sectional view taken along the line AA in FIG. 2, and FIG. 3B is a cross-sectional view taken along the line BB in FIG. The suspension substrate shown in FIGS. 3A and 3B includes a metal support substrate 1, an insulating layer 2 formed on the metal support substrate 1, a wiring 13a formed on the insulating layer 2, and a connection. It has a connection terminal wiring part 3a constituting the terminal 12a, a test terminal wiring part 3a 'constituting the test terminal 15a, and a plating wire 14a. Further, the suspension substrate shown in FIGS. 3A and 3B has a cover layer 4 covering the wiring 13a and the plating wire 14a, and includes a connection terminal wiring portion 3a and a test terminal wiring portion 3a ′. And plating parts 17 and 18 respectively on the surface. The connection terminal wiring portion 3a is preferably, for example, a flying lead shape in which both surfaces of the connection terminal wiring portion 3a are exposed, and the test terminal wiring portion 3a ′ is, for example, a test terminal wiring portion. It may be a flying lead shape in which both surfaces of 3a ′ are exposed, or may be a pad shape in which only the surface on the cover layer 4 side of the wiring portion 3a ′ of the test terminal is exposed.

  1 to 3 described above show the suspension board having the test terminals 15 (15a to 15d), the suspension board of the first embodiment is shown in FIGS. 4 (a) and 4 (b). As shown in FIG. 4, a suspension board that does not have the test terminals 15 may be used. 4B is a cross-sectional view taken along the line AA in FIG. 4A, and the reference numerals shown are the same as those in FIGS.

Thus, according to the first embodiment, it is possible to prevent an adverse effect on the element due to static electricity by disconnecting the plating wire at the opening. As shown in FIG. 23 described above, when the suspension substrate is separated from the outer frame portion, the cut surface (end portion of the tail portion) is in a state where the plating wire is exposed. For this reason, when a statically charged jig comes into contact with the cut surface after mounting the element, in the worst case, the element may be destroyed by static electricity. On the other hand, since the suspension substrate of the first embodiment has the plated wire disconnected, even if a statically charged jig comes into contact with the cut surface, the element is adversely affected by the static electricity. Can be prevented. According to the knowledge of the present inventors, when the suspension substrate is not provided with an opening for preventing electrostatic breakdown, the element is broken by static electricity at a rate of about 0.1% to 1.0%. To do.
Hereinafter, the suspension substrate of the first embodiment will be described separately for the suspension substrate member and the configuration of the suspension substrate.

(1) Suspension Board Member First, the suspension board member of the first embodiment will be described. The suspension substrate according to the first embodiment includes at least a metal support substrate, an insulating layer, wiring, a connection terminal wiring portion, and a plating wire.

  The metal support substrate in the first embodiment is usually used as a support substrate for a suspension substrate. The material of the metal support substrate is not particularly limited, but is preferably a metal having a spring property. Examples of the material for the metal support substrate include SUS. Moreover, although the thickness of a metal support substrate changes with kinds of the material, it exists in the range of 10 micrometers-20 micrometers, for example.

  The insulating layer in the first embodiment is a layer formed on the metal support substrate. Examples of the material for the insulating layer include polyimide resin (PI). In addition, the material of the insulating layer may be a photosensitive material or a non-photosensitive material. Moreover, the thickness of an insulating layer exists in the range of 5 micrometers-10 micrometers, for example.

  The wiring in the first embodiment, the connection terminal wiring portion and the plating wire are formed on the insulating layer. The suspension substrate of the first embodiment includes a test terminal wiring part (see FIG. 3A), a wiring part for electrically connecting the connection terminal and the test terminal, and a later-described common wiring part. May be further included. Moreover, when these are named generically as a conductive part, it is preferable that a conductive part is formed from the same conductor layer. Examples of the material for the conductive portion include copper (Cu). In addition, the thickness of the conductive portion is, for example, in the range of 5 μm to 18 μm, and preferably in the range of 9 μm to 12 μm. In the first embodiment, the plating portion is usually formed on the surface of the wiring portion for the connection terminal and the wiring portion of the test terminal using a plating wire. An example of the plating part is a gold plating part. Moreover, the nickel plating part may be formed as a foundation | substrate of a gold plating part. The thickness of the plating portion is, for example, in the range of 0.1 μm to 4.0 μm.

  The suspension substrate of the first embodiment preferably has a cover layer that covers the conductor. Examples of the material for the cover layer include polyimide resin (PI). The material of the cover layer may be a photosensitive material or a non-photosensitive material. The thickness of the cover layer is not particularly limited, but is preferably thinner than the insulating layer. The thickness of the cover layer is, for example, in the range of 2 μm to 30 μm, and preferably in the range of 2 μm to 10 μm.

(2) Configuration of Suspension Substrate Next, the configuration of the suspension substrate of the first embodiment will be described. The suspension substrate of the first embodiment is characterized in that the plating wire is disconnected at the opening. Fig.5 (a) is a schematic plan view which shows an example of the opening part in a 1st embodiment, FIG.5 (b) is AA sectional drawing of Fig.5 (a). In FIG. 5 (a), if the distance plated wire 14 disconnected (the opening size of the plated wire 14 at the opening 16) and the _{L 1,} the value of _{L 1} is preferably 20μm or more, in 40μm or more More preferably, it is more preferably 50 μm or more. When the value of L ₁ is too small, there is a possibility which can not be opened insulation layer and the cover layer. On the other hand, the value of L ₁ is preferably 1000 μm or less, more preferably 500 μm or less, and even more preferably 300 μm or less. When the value of L ₁ is too large, the effect of blocking static electricity unchanged, conversely, because plated wire exposed at the opening may be subject to static electricity.

Further, in FIG. 5 (b), the aperture size of the cover layer 4 in the opening portion 16 (opening size in the lengthwise direction of the plated wire 14) and L _2, the aperture size of the insulating layer 2 at the opening 16 (plated wire 14 If the aperture size) in the length direction is _{L 3,} the values of _{L 2} and _{L 3} is not particularly limited, respectively, preferably in the range of 30μm~300μm, 50μm~280μm It is more preferable to be within the range. In the first embodiment, the opening size L ₃ of the insulating layer 2 is preferably smaller than the opening size L ₂ of the cover layer 4. In particular, as shown in FIG. 17 to be described later, in the first embodiment, it is preferable that the end of the insulating layer 2 in the opening 16 protrudes beyond the end of the cover layer 4 in the opening 16. That is, it is preferable that the insulating layer 2 protrudes beyond the cover layer 4 in the opening 16. This is because when the opening of the insulating layer is formed, the cover layer can be prevented from being deteriorated or peeled off. This effect will be described in detail with reference to FIGS. 17 and 18 described later. In this case, the difference in opening size (L ₂ -L ₃ ) is not particularly limited, but is preferably in the range of 10 μm to 100 μm, and more preferably in the range of 20 μm to 50 μm. preferable.

Further, in the first embodiment, as shown in FIG. 5, the aperture size L ₁ of the plated wire 14, it is preferably larger than the aperture size L ₃ of the aperture size L ₂ and the insulating layer 2 of the cover layer 4. In particular, as shown in FIG. 5B, in the first embodiment, the end of the cover layer 4 in the opening 16 and the end of the insulating layer 2 in the opening 16 are the ends of the plated wire 14 that is broken. It is preferable to protrude from the portion. That is, it is preferable that the insulating layer 2 and the cover layer 4 protrude beyond the plating wire 14 in the opening 16. This is because the exposed surface (cut surface) of the plated wire is protected by the overhanging cover layer and insulating layer, and corrosion of the plated wire can be more effectively suppressed. The difference between L ₁ and L ₂ (L ₁ -L ₂ ) is not particularly limited, but is preferably in the range of 10 μm to 200 μm, and more preferably in the range of 30 μm to 100 μm. . Similarly, the difference between L ₁ and L ₃ (L ₁ −L ₃ ) is not particularly limited, but is preferably in the range of 10 μm to 200 μm, and is in the range of 30 μm to 100 μm. Is more preferable.

Further, in FIG. 5 (b), an end portion of the cover layer 4 in the opening 16, the difference between the end of the plated wire 14 at the opening 16 and L _21, and the end portion of the insulating layer 2 at the opening 16 The difference between the end of the plated wire 14 in the opening 16 is L ₃₁ , and the difference between the end of the insulating layer 2 in the opening 16 and the end of the metal supporting substrate 1 in the opening 16 is L ₄₁ . . The value of L ₂₁ include, but are not limited to, for example, is preferably at least the thickness of the plated wire. This is because the protruding cover layer can protect the entire end portion of the plated wire if the end portion of the cover layer extends beyond the end portion of the plated wire more than the thickness of the plated wire. Thereby, corrosion of a plating wire can be prevented more effectively. Specifically, the value of L ₂₁ is preferably 10 μm or more, more preferably in the range of 20 μm to 60 μm, and still more preferably in the range of 30 μm to 50 μm. Further, the value of L ₃₁ is not particularly limited, but is preferably equal to or greater than the thickness of the plated wire, for example. Specifically, the value of L ₃₁ is preferably 20 μm or more, more preferably in the range of 30 μm to 90 μm, and still more preferably in the range of 40 μm to 80 μm. Similarly, the value of L ₄₁ is not particularly limited, but is preferably 20 μm or more. This is because when the insulating layer 2 in the opening 16 is etched, the opening cross section of the metal support substrate 1 can be sufficiently protected, and the above cross section can be prevented from being attacked by the insulating layer etchant. Further, as shown in FIG. 13C, in forming the plating portion 17 on the connection terminal wiring portion 3, the opening cross section of the metal supporting substrate can be sufficiently covered with a dry film resist or the like. Even when the support substrate and the wiring layer are electrically connected, it is possible to prevent plating from being deposited on the cross section of the opening of the metal support substrate, and to cover the entire terminal portion by plating.

  The planar view shape of the opening in the first embodiment is not particularly limited, and examples thereof include a rectangle, a circle, an ellipse, a cross, and a comb. Furthermore, the installation position of an opening part will not be specifically limited if it is a position which can disconnect a plating wire. Further, the opening in the first embodiment may be provided for one plated wire (for example, FIG. 6), or provided for two or more plated wires (for example, FIG. 2, 4). In the first embodiment, when there are a plurality of plating wires having one end as an end portion of the tail portion, a desired effect can be obtained as long as at least one of the plating wires is disconnected at the opening portion. It is preferable that all of the lines are disconnected at the opening. This is because the adverse effect of static electricity caused by the end of the tail portion can be completely prevented.

  In addition, as described with reference to FIG. 2 described above, the suspension substrate 20 according to the first embodiment has the element after the element is mounted between the connection terminal 12 (12a to 12d) and the end of the tail part T. Test terminals 15 (15a to 15d) for confirming the performance of the plating wire 14 between the test terminals 15 (15a to 15d) and the end of the tail portion T, and the plated wire 14 is disconnected at the opening 16 It is preferable. Although the installation position of the test terminal is not particularly limited, it is usually installed on the tail side of the connection terminal. This is because if the performance of the element after the element mounting can be confirmed, the test terminal is unnecessary.

  In the first embodiment, it is preferable that two or more test terminals are shared by the shared wiring section, and the shared wiring section is disconnected at the opening for short-circuit prevention. This is because by providing the shared wiring portion, the number of plating wires can be reduced, and as a result, the opening can be made smaller. In addition, there is an advantage that design design is facilitated by reducing the number of plated wires. Specifically, as shown in FIG. 6, two or more test terminals 15 (15 a to 15 d) are shared by the shared wiring portion 31, and the shared wiring portion 31 is disconnected at the short-circuit preventing opening 32. Can be mentioned. In this case, when the plating portion is provided on the connection terminal (not shown) and the test terminal 15, the short-circuit preventing opening 32 and the opening 16 are not formed, and therefore, only one plating wire 14 is sufficient. In the first embodiment, it is preferable that the short-circuit preventing opening 32 and the opening 16 are formed at the same time when the suspension substrate is manufactured.

  As described above, in the first embodiment, it is preferable that two or more test terminals are shared by the shared wiring portion. However, like the test terminals, two or more connection terminals (external circuit board and May be shared by the shared wiring portion. Also in this case, the shared wiring portion needs to be disconnected at the opening for preventing a short circuit.

2. Second Embodiment Next, the suspension substrate of the second embodiment will be described. The suspension substrate according to the second embodiment is formed on the head portion side, an element mounting region for mounting elements, and an external circuit substrate connection region formed on the tail portion side and having connection terminals for connection to the external circuit substrate. A suspension substrate having a wiring for electrically connecting the element mounting region and the external circuit board connection region, and a plating wire for electrically connecting to the connection terminal. A substrate, an insulating layer formed on the metal support substrate, a wiring formed on the insulating layer, a wiring portion for connecting terminals constituting the connecting terminal, the plated wire, and the plated wire And an end of the cover layer and an end of the insulating layer at the end of the plated wire of the tail portion protrude from the end of the plated wire. Than is.

  FIG. 7 is a schematic diagram illustrating the suspension substrate according to the second embodiment. FIG. 7A is an enlarged view showing the periphery of the tail portion T as in FIG. 2, and FIG. 7B is a cross-sectional view taken along line AA in FIG. 7A. 7A, from the head part (not shown) side, wiring 13 (13a to 13d), connection terminal 12 (12a to 12d), test terminal 15 (15a to 15d), and plating wire 14 (14a) -14d) are arranged in this order. Further, in the suspension substrate of the second embodiment, the end of the cover layer 4 and the end of the insulating layer 2 at the end of the plating wire 14a of the tail portion T protrude from the end of the plating wire 14a. Is a major feature.

  Further, as shown in FIG. 8, when the individual suspension board is separated from the outer frame portion 21, if the suspension board is separated at the opening 16 as in Cut Line 1, the suspension board of the second embodiment is used. A substrate is obtained. On the other hand, when the suspension substrate is separated on the outer frame 12 side from the opening 16 as in Cut Line 2, the suspension substrate of the first embodiment described above is obtained.

Thus, according to the second embodiment, the exposed surface (cut surface) of the plating wire is protected by the overhanging cover layer and insulating layer, thereby preventing adverse effects on the element due to static electricity. Further, the corrosion of the plated wire can be effectively suppressed by the overhang of the cover layer and the insulating layer. Further, as in Cut Line 1 shown in FIG. 8, for example, by detaching the suspension substrate at the opening where the metal support substrate and the lead wire do not exist, the wear of the cutting tool can be suppressed, and at the time of cutting There is an advantage that generation of metal waste can be suppressed.
Hereinafter, the suspension substrate according to the second embodiment will be described separately for the suspension substrate member and the suspension substrate configuration.

(1) Suspension Substrate Member The suspension substrate member of the second embodiment is the same as that described in the first embodiment, and is not described here.

(2) Configuration of Suspension Substrate Next, the configuration of the suspension substrate of the second embodiment will be described. The configuration of the suspension substrate of the second embodiment is the same as that described in the first embodiment, except that the end of the plating wire in the opening is changed to the end of the plating wire in the tail. is there.

Further, as shown in FIG. 8 described above, the suspension substrate of the second embodiment can be obtained, for example, by separating the suspension substrate at the opening. Fig.9 (a) is a schematic plan view which shows an example of the tail part in a 2nd embodiment, FIG.9 (b) is AA sectional drawing of Fig.9 (a). 9 (a), the case where the distance plated wire 14 disconnected (the opening size of the plated wire 14 at the opening 16) and the L _1, L _1, when disconnecting the suspension substrate, overhanging insulating layer and The size is preferably such that the cutting tool does not contact the cover layer. Size and the cutting tool, considering the accuracy of the time of cutting, the value of L ₁ is preferably at 80μm or more, more preferably 100μm or more, and still more preferably 120μm or more. On the other hand, the value of L ₁ is preferably 500 μm or less, more preferably 400 μm or less, and even more preferably 300 μm or less.

Further, in FIG. 9 (b), the aperture size of the cover layer 4 in the opening portion 16 (opening size in the lengthwise direction of the plated wire 14) and L _2, the aperture size of the insulating layer 2 at the opening 16 (plated wire 14 If the aperture size) in the length direction is _{L 3,} the values of _{L 2} and _{L 3} is not particularly limited, respectively, preferably in the range of 60Myuemu～280myuemu, 100 m to 200 m It is more preferable to be within the range.

In the second embodiment, as shown in FIG. 9 (b), the end portion of the cover layer 4 and the end portion of the insulating layer 2 at the end portion of the plating wire 14 of the tail portion T are usually formed of the plating wire 14. It protrudes from the end. That is, in the tail portion T, the insulating layer 2 and the cover layer 4 protrude from the plated wire 14. The exposed surface (cut surface) of the plated wire is protected by the overhanging cover layer and insulating layer, and corrosion of the plated wire can be effectively suppressed. 9B, the difference between the end portion of the cover layer 4 in the tail portion T and the end portion of the plating wire 14 in the tail portion T is L _21, and the end portion of the insulating layer 2 in the tail portion T and the tail The difference between the end portion of the plated wire 14 in the portion T is L ₃₁ , and the difference between the end portion of the insulating layer 2 in the tail portion T and the end portion of the metal support substrate 1 in the tail portion T is L ₄₁ . The value of L ₂₁ include, but are not limited to, for example, is preferably at least the thickness of the plated wire. This is because the protruding cover layer can protect the entire end portion of the plated wire if the end portion of the cover layer extends beyond the end portion of the plated wire more than the thickness of the plated wire. Thereby, corrosion of a plating wire can be prevented more effectively. Specifically, L ₂₁ is preferably 10 μm or more, more preferably in the range of 20 μm to 60 μm, and even more preferably in the range of 30 μm to 50 μm. Further, the value of L ₃₁ is not particularly limited, but is preferably equal to or greater than the thickness of the plated wire, for example. Specifically, the value of L ₃₁ is preferably 20 μm or more, more preferably in the range of 30 μm to 90 μm, and still more preferably in the range of 40 μm to 80 μm. Similarly, the value of L ₄₁ is not particularly limited, but is preferably 20 μm or more. This is because when the insulating layer 2 in the opening 16 is etched, the opening cross section of the metal support substrate 1 can be sufficiently protected, and the above cross section can be prevented from being attacked by the insulating layer etchant. Further, as shown in FIG. 13C, in forming the plating portion 17 on the connection terminal wiring portion 3, the opening cross section of the metal supporting substrate can be sufficiently covered with a dry film resist or the like. Even when the support substrate and the wiring layer are electrically connected, it is possible to prevent plating from being deposited on the cross section of the opening of the metal support substrate, and to cover the entire terminal portion by plating.

B. Next, the suspension board with an outer frame of the present invention will be described. A suspension substrate with an outer frame of the present invention is a suspension substrate with an outer frame having a suspension substrate and an outer frame portion integrated on the tail portion side of the suspension substrate, and the suspension substrate includes: An element mounting area formed on the head portion side for mounting elements, an external circuit board connection area formed on the tail portion side and having connection terminals for connection to an external circuit board, the element mounting area, and the external A wiring for electrically connecting circuit board connection regions; and a plating wire for electrically connecting the outer frame portion and the connection terminal; and the suspension substrate includes a metal support substrate , An insulating layer formed on the metal support substrate, the wiring formed on the insulating layer, a wiring portion for connecting terminal constituting the connecting terminal, and the plated wire A cover layer covering the plated wire, the plated wire is disconnected at the opening, and the end of the cover layer in the opening and the end of the insulating layer in the opening are It protrudes from the edge part of the broken plating wire, It is characterized by the above-mentioned.

  FIG. 10 is a schematic plan view showing an example of a suspension substrate with an outer frame according to the present invention. FIG. 10A is a schematic plan view showing an example of a suspension substrate with an outer frame according to the present invention, and FIG. 10B is an enlarged view of a region S in FIG. A suspension substrate 22 with an outer frame shown in FIG. 10 includes a suspension substrate 20 and an outer frame portion 21 integrated on the tail portion T side of the suspension substrate 20. In the suspension substrate 20, the plating wire 14 is disconnected at the opening 16.

  In addition, as shown in FIG. 8 described above, when the suspension substrate is separated from the outer frame portion 21 at the opening 16 as in the case of Cut Line 1, the second embodiment is separated. A suspension substrate is obtained. On the other hand, when the suspension substrate is separated on the outer frame 12 side from the opening 16 as in Cut Line 2, the suspension substrate of the first embodiment described above is obtained.

  According to the present invention, the exposed surface (cut surface) of the plated wire is protected in the opening by the overhanging cover layer and insulating layer, thereby preventing adverse effects on the element due to static electricity. Further, the corrosion of the plated wire can be effectively suppressed by the overhang of the cover layer and the insulating layer.

  The suspension substrate in the present invention is the same as the content described in the above “A. Suspension substrate”, and therefore the description thereof is omitted here. Moreover, the outer frame part in the present invention is not particularly limited, and examples thereof include a metal support substrate, an insulating layer, and a conductor layer laminated in this order.

C. Next, a method for manufacturing a suspension substrate according to the present invention will be described. The manufacturing method of the suspension substrate of the present invention can be roughly divided into two embodiments. The method for manufacturing the suspension substrate of the present invention will be described separately for the first embodiment and the second embodiment.

1. First Embodiment A method for manufacturing a suspension substrate according to the first embodiment is a method for manufacturing a suspension substrate according to the first embodiment described above, and includes a first metal etching step, a cover layer forming step, an insulating layer etching step, It has a plating part formation process, a protective layer peeling process, and a 2nd metal etching process, It is characterized by the above-mentioned.

  Next, a method for manufacturing the suspension substrate according to the first embodiment will be described with reference to FIGS. Here, FIG. 11 is a schematic plan view showing an example of the tail portion of the suspension substrate obtained by the first embodiment. Note that the wiring 13 in FIG. 11 has a bent portion in front of the connection terminal 12, but this is for easy understanding of how the wiring 13 is formed. It is not necessary to have a bent portion. Further, the suspension substrate shown in FIG. 11 has the wiring 13, the connection terminal 12, the plating wire 14, and the opening 16 around the tail portion T. Also, the schematic cross-sectional views shown in FIGS. 12 to 15 all correspond to the AA cross-section of FIG.

  In FIG. 12, first, a laminated member having the metal support substrate 1, the insulating layer 2, and the conductor layer 3A is prepared (FIG. 12 (a)). Next, a predetermined resist pattern is formed on both surfaces of the laminated member, and the wiring 13, the connection terminal wiring portion 3 and the plating wire 14 are formed from the conductor layer 3A by wet etching, and the opening 16 and the connection terminal 12 are formed. The metal support substrate 1 at the position where the film is formed is removed (FIG. 12B). Next, the cover layer 4 is formed on the plating wire 14 and the wiring 13 so as not to cover the plating wire 14 and the connection terminal wiring portion 3 at the position where the opening 16 is formed (FIG. 12C). )). Next, a predetermined resist pattern is formed on both surfaces of the laminated member on which the cover layer 4 is formed, and the insulating layer 2 at a position where the opening 16 and the connection terminal 12 are formed is removed by wet etching (FIG. 12 ( d)).

  Thereafter, DFR (dry film resist) is disposed as the protective layer 41 on both surfaces of the laminated member (FIG. 13A). Next, by exposing and developing the DFR, the plating wire 14 at the position where the opening 16 is formed is protected from plating, and the connection terminal wiring portion 3 at the position where the connection terminal 12 is formed is exposed. The layer 41 is formed (FIG. 13B). Next, the plating portion 17 made of gold plating is formed on the surface of the connection terminal wiring portion 3 using the plating wire 14 (FIG. 13C), and the protective layer 41 is peeled off (FIG. 13D). )).

  Thereafter, DFR is disposed as a resist layer 42 on both surfaces of the laminated member (FIG. 14A). Next, DFR is exposed and developed to form a resist layer 42 that exposes the plating wire 14 at the position where the opening 16 is to be formed (FIG. 14B). Next, the plating wire 14 exposed from the resist layer 42 is removed by wet etching (FIG. 14C). Finally, the resist layer 42 is peeled off to obtain the suspension substrate 20.

  13A to 13C described above, DFR is used as the protective layer 41. However, in the first embodiment, as the protective layer 41, a mask that protects the outer frame portion of the laminated member from plating (for example, Rubber mask) may be used. As shown in FIG. 23 described above, the suspension substrate 110 in the manufacturing stage is integrated with the outer frame portion 120. The conductor layer (for example, Cu) of the outer frame portion 120 needs to be protected when a plating portion is provided on the connection terminal, and usually a mask is formed. Compared with the case where DFR is used as a protective layer by using the mask used at that time as a protective layer for preventing plating deposition on the wiring of the opening (FIGS. 13A to 13C). The process can be simplified.

  Specifically, in the method for manufacturing the suspension substrate shown in FIGS. 12 to 14, it is preferable to perform the step of FIG. 15 instead of the step of FIG. In FIG. 15, a mask (for example, a rubber mask) that protects the outer frame portion of the laminated member from plating is disposed as the protective layer 41 (FIG. 15A). Next, the plating portion 17 made of gold plating is formed on the surface of the connection terminal wiring portion 3 using the plating wire 14 (FIG. 15B), and the protective layer 41 is removed (FIG. 15C). )). In addition, as shown in FIG. 16, the conventional rubber mask is for preventing plating deposition on the outer frame portion 120, and its end portion is formed on the outer frame portion 120 side with respect to Cut Line. . On the other hand, when the rubber mask is used as the protective layer, the end portion thereof is formed on the suspension substrate side beyond the cut line. In this case, the plated wire removal portion is formed on the suspension substrate side from the cut line.

As described above, according to the first embodiment, it is possible to obtain a suspension substrate in which adverse effects on the element due to static electricity are prevented by disconnecting the plating wire at the opening. In particular, when forming the plating portion, by forming a protective layer that protects the plating wire at the position where the opening is to be formed from plating, there is an advantage that the removal of the plating wire is facilitated.
Hereinafter, the manufacturing method of the suspension substrate according to the first embodiment will be described step by step.

(1) First Metal Etching Step First, the first metal etching step in the first embodiment will be described. In this step, a laminated member having a metal supporting substrate, an insulating layer formed on the metal supporting substrate, and a conductor layer formed on the insulating layer is prepared and etched from the conductor layer This is a step of forming the wiring, the connecting terminal wiring portion constituting the connecting terminal, and the plated wire, and removing the metal support substrate at the position where the opening is to be formed (FIG. 12 (a), ( b)). At this time, it is preferable to remove the metal support substrate at a position where the connection terminal is formed. In addition, this process includes both the case where the etching of the conductor layer and the etching of the metal support substrate are performed simultaneously, and the case where both processes are performed as separate processes.

  The laminated member used in the first embodiment has a metal support substrate, an insulating layer, and a conductor layer. Since these members are the same as those described in “A. Suspension substrate”, description thereof is omitted here.

  In the first embodiment, the wiring, the connecting terminal wiring portion, and the plated wire are formed from the conductor layer by etching. At this time, when obtaining a suspension substrate having test terminals, it is preferable to simultaneously form the wiring portions of the test terminals. In the first embodiment, the metal support substrate at the position where the opening and the connection terminal are formed is removed by etching. At this time, it is preferable to simultaneously form jig holes in the suspension substrate.

  The method for etching the conductor layer and the metal support substrate is not particularly limited. For example, a predetermined resist pattern is formed on the surfaces of the metal support substrate and the conductor layer, and the exposed portion exposed from the resist pattern is wet etched. The method of doing can be mentioned. The type of etchant used for wet etching is preferably selected as appropriate according to the types of the metal support substrate and the conductor layer. For example, when the material of the metal support substrate is SUS and the material of the conductor layer is Cu, Further, an iron chloride etching solution or the like can be used.

(2) Cover layer forming step Next, the cover layer forming step in the first embodiment will be described. This step is a step of forming a cover layer for forming a cover layer on the plated wire so as not to cover the plated wire at the position where the opening is to be formed (FIG. 12C). At this time, normally, a cover layer is formed on the wiring so as not to cover the connection terminal wiring portion.

  The cover layer used in the first embodiment is the same as that described in the above “A. Suspension substrate”, and therefore the description thereof is omitted here. When obtaining a suspension substrate having test terminals, it is preferable to form a cover layer so as not to cover the wiring portion of the test terminals. The method for forming the cover layer is preferably selected as appropriate according to the material of the cover layer. For example, when the cover layer material is a photosensitive material, a desired pattern can be obtained by performing exposure and development after coating and drying the cover layer material. On the other hand, if the cover layer material is a non-photosensitive material, a desired resist pattern is formed after the cover layer material is applied and dried, and the exposed portion exposed from the resist pattern is wet-etched. Pattern can be obtained.

(3) Insulating Layer Etching Step Next, the insulating layer etching step in the first embodiment will be described. This step is a step of removing the insulating layer at the position where the opening is to be formed by etching after the cover layer forming step (FIG. 12D). At this time, in the case where a flying lead-like connection terminal is formed, it is preferable to remove the insulating layer at a position where the connection terminal is formed.

  In the first embodiment, the insulating layer at the position where the opening is to be formed is removed by etching. At this time, when a suspension substrate having test terminals is obtained, it is preferable to simultaneously form an insulating layer at a position where the test terminals are formed. Further, it is preferable to remove other unnecessary insulating layers by this step.

  Although the method for etching the insulating layer is not particularly limited, for example, a method may be mentioned in which a predetermined resist pattern is formed on the surface of the laminated member and the exposed portion exposed from the resist pattern is wet-etched. The type of etching solution used for wet etching is preferably selected as appropriate according to the type of insulating layer. For example, when the material of the insulating layer is a polyimide resin, an alkaline etching solution or the like can be used.

In the first embodiment, as shown in FIG. 17, the insulating layer 2 is etched so that the end of the insulating layer 2 at the position where the opening 16 is formed is located at the position where the opening 16 is formed. It is preferable to protrude from the end of the layer 4. This is because when the opening of the insulating layer is formed, the cover layer can be prevented from being deteriorated or peeled off. This effect will be described with reference to FIG. As shown in FIG. 18A, consider a case where the end of the cover layer 4 protrudes beyond the end of the insulating layer 2 in the opening 16. Here, when the opening 16 is observed from the bottom surface direction 43 in FIG. 18A, a part of the cover layer 4 is exposed as shown in FIG. 18B. Therefore, when the insulating layer 2 is etched, the exposed cover layer 4 is etched by the etching solution of the insulating layer 2, and the cover layer may be deteriorated or peeled off. Moreover, when the resist layer used when etching the plating wire 14 is peeled, the exposed cover layer 4 may be deteriorated or peeled off by a stripping solution (for example, alkaline stripping solution) for stripping the resist layer. There is also sex. On the other hand, as shown in FIG. 17, the etching of the cover layer 4 by the etching solution of the insulating layer 2 can be prevented by causing the end of the insulating layer 2 to protrude beyond the end of the cover layer 4. it can. From the viewpoint of preventing deterioration and peeling of the cover layer, the opening size L ₃ of the insulating layer ₂ is the same as the opening size L ₂ of the cover layer 4 as shown in FIG. Ideally, however, there is a possibility that a mask misalignment in resist formation may actually occur when the opening of the insulating layer is etched. Therefore, it is preferable that the end portion of the insulating layer protrudes from the end portion of the cover layer in consideration of alignment accuracy. 17, an end portion of the cover layer 4 in the opening 16, if the difference between the end portion of the insulating layer 2 at the opening 16 was set to L _32, the value of L ₃₂ may, for example, not less 10μm or more Preferably, it is in the range of 10 μm to 30 μm, more preferably in the range of 15 μm to 25 μm.

(4) Plating part forming process Next, the plating part forming process in the first embodiment will be described. In this step, after the insulating layer etching step, a protective layer that protects the plated wire at the position where the opening is formed from plating is formed, and the connection terminal wiring portion in which the protective layer is not formed is formed. This is a step of forming a plating portion on the surface (FIGS. 13A to 13C, FIGS. 15A and 15B).

  In the first embodiment, the plating wire at the position where the opening is formed is protected from plating. This is because if the plated wire is covered with plating, it is difficult to remove the plated wire. In the case of obtaining a suspension substrate having test terminals, the protective layer is usually not formed on the wiring portion of the testing terminal as in the case of the connecting terminal wiring portion. In the first embodiment, the plated portion is usually formed by an electrolytic plating method.

  An example of the protective layer used in the first embodiment is a dry film resist. By using a dry film resist, an opening can be provided at an arbitrary location. On the other hand, the mask which protects the outer frame part of a laminated member from plating as another example of a protective layer can be mentioned. An example of such a mask is a mechanical mask, and an example of the material is rubber. A protective layer using such a mask has an advantage that the number of steps does not increase as compared with a protective layer using a dry film resist.

(5) Protective layer peeling process Next, the protective layer peeling process in a 1st embodiment is demonstrated. This step is a step of peeling the protective layer after the plating portion forming step (FIGS. 13D and 15C). The method for peeling off the protective layer is not particularly limited, and examples thereof include a method using a peeling solution. The type of stripping solution is preferably selected as appropriate according to the type of protective layer used.

(6) Second Metal Etching Step Next, the second metal etching step in the first embodiment will be described. This step is a step of removing the plating wire at the position where the opening is to be formed by etching after the protective layer peeling step to form the opening (FIGS. 14A to 14D). ).

  In the first embodiment, the plating wire at the position where the opening is formed is removed by etching. At this time, it is preferable to simultaneously etch an unnecessary metal support substrate (for example, the metal support substrate 1 at the right end in FIG. 14C). Specifically, it is preferable that the outer shape processing of the suspension substrate is performed in the second metal etching step.

  Although the method for etching the plating wire is not particularly limited, for example, a method may be mentioned in which a predetermined resist pattern is formed on the surface of the laminated member, and the exposed portion exposed from the resist pattern is wet-etched. The etching solution is as described above.

  Further, in the first embodiment, as shown in FIG. 14 (d), the end of the cover layer 4 in the opening 16 and the end of the insulating layer 2 in the opening 16 are etched by etching the plating wire 14. It is preferable that the opening 16 protrude beyond the end of the plated wire 14. Rather than simply removing the plated wire 14, the exposed surface (cut surface) of the plated wire is protected by the overhanging cover layer and insulating layer by positively etching the plated wire 14, and the plated wire is corroded. It is because it can suppress more effectively. 14C and 14D, a resist layer 42 is formed so as to cover the cover layer 4 at a position to be the opening 16, and an end portion of the resist layer 42 is on the plating wire 14. When the plating wire 14 is positively etched, it is preferable to provide an opening in the resist layer 42 so that the end of the resist layer 42 is not on the plating wire 14 but on the cover layer 4. In addition, when the metal support substrate is etched simultaneously with the etching of the plating wire 14, it is preferable to positively etch the plating wire 14 in a time longer than the time for completing the etching of the metal support substrate.

  Moreover, in FIG. 19, although the opening area | region is formed in both the resist layer 42 formed in the cover layer 4 side, and the resist layer 42 formed in the insulating layer 2 side, the edge part of the cover layer 4 is When the insulating layer 2 protrudes beyond the end portion, the cover layer 4 can be prevented from being deteriorated by the stripping solution unless an opening region is provided in the resist layer 42 formed on the insulating layer 2 side. Similarly, as shown in FIG. 17, when the end portion of the insulating layer 2 protrudes from the end portion of the cover layer 4, insulation is provided unless an opening region is provided in the resist layer formed on the cover layer 4 side. Deterioration of the layer 2 can be prevented. From such a point of view, it is preferable not to provide an opening region in the resist layer on the layer side having the end portions that do not protrude at the end portions of the insulating layer and the cover layer.

2. Second Embodiment Next, a method for manufacturing the suspension substrate of the second embodiment will be described. The suspension substrate according to the second embodiment is a method of manufacturing the suspension substrate according to the second embodiment described above, and includes a first metal etching step, a cover layer forming step, an insulating layer etching step, a plating portion forming step, and a protective layer. It has a peeling process and a 2nd metal etching process, It is characterized by the above-mentioned.

  According to the present invention, by etching the plating wire so that the end portion of the cover layer and the end portion of the insulating layer at the end portion of the plating wire of the tail portion protrude from the end portion of the plating wire, A suspension substrate that prevents adverse effects on the element can be obtained. In addition, the manufacturing method of the suspension substrate of the second embodiment is the content described in the first embodiment except that the end of the plated wire in the opening is changed to the end of the plated wire in the tail. The description here is omitted.

D. Next, a method for manufacturing a suspension substrate with an outer frame according to the present invention will be described. The manufacturing method of a suspension substrate with an outer frame according to the present invention is a manufacturing method of a suspension substrate with an outer frame that can obtain the suspension substrate of the first embodiment or the second embodiment described above, It has an etching process, a cover layer forming process, an insulating layer etching process, a plating part forming process, a protective layer peeling process, and a second metal etching process. According to the present invention, a suspension substrate with an element as shown in FIG. 10 described above can be obtained.

  According to the present invention, by etching the plating wire so that the end portion of the cover layer in the opening portion and the end portion of the insulating layer in the opening portion protrude from the end portion of the broken plating wire, A suspension substrate with an outer frame that prevents adverse effects on the element can be obtained. Each step in the manufacturing method of the suspension frame-equipped suspension substrate of the present invention is basically the same as the contents described in “C. Manufacturing method of suspension substrate 1. First embodiment”. The outer frame portion can be formed by appropriately adjusting the etching target region when processing the laminated member.

  Further, the present invention is characterized by having a cutting step of cutting at the opening portion of the suspension substrate using the suspension substrate with outer frame obtained by the above-described method for manufacturing the suspension substrate with outer frame. A suspension substrate manufacturing method can also be provided (Cut Line 2 in FIG. 10). Thereby, the suspension substrate of the first embodiment described above can be obtained.

  Further, in the present invention, the cutting step of cutting on the outer frame portion side of the opening of the suspension substrate using the suspension substrate with outer frame obtained by the method for manufacturing the suspension substrate with outer frame described above. It is also possible to provide a method of manufacturing a suspension substrate characterized by having (Cut Line 1 in FIG. 10). Thereby, the suspension substrate of the second embodiment described above can be obtained.

E. Suspension Next, the suspension of the present invention will be described. The suspension of the present invention includes the above-described suspension substrate.

  According to the present invention, by using the above-described suspension substrate, it is possible to provide a suspension in which adverse effects on elements due to static electricity are prevented.

  FIG. 20 is a schematic plan view showing an example of the suspension of the present invention. A suspension 60 shown in FIG. 20 includes the above-described suspension substrate 20 and a load beam 51 provided on the surface of the suspension substrate 20 opposite to the surface on which the element mounting region X is formed. is there.

  The suspension of the present invention has at least a suspension substrate, and usually further has a load beam. The suspension substrate is the same as the content described in “A. Suspension substrate”, and therefore, the description thereof is omitted here. The load beam can be the same as the load beam used for a general suspension.

F. Next, the suspension with an element of the present invention will be described. A suspension with an element of the present invention includes the above-described suspension and an element mounted in an element mounting region of the suspension.

  According to the present invention, by using the suspension described above, it is possible to provide a suspension with an element that prevents adverse effects on the element due to static electricity.

  FIG. 21 is a schematic plan view showing an example of the suspension with an element of the present invention. A suspension 70 with an element shown in FIG. 21 has the above-described suspension 60 and an element 61 mounted in the element mounting region X of the suspension 60.

  The suspension with an element of the present invention has at least a suspension and an element. The suspension is the same as that described in the above “E. Suspension”, and the description is omitted here. In addition, examples of elements mounted in the element mounting area include a magnetic head slider, an actuator, and a semiconductor. The actuator may have a magnetic head or may not have a magnetic head.

G. Next, the hard disk drive of the present invention will be described. The hard disk drive of the present invention is characterized by including the above-described suspension with an element.

  According to the present invention, a hard disk drive with higher functionality can be obtained by using the above-described suspension with an element.

  FIG. 22 is a schematic plan view showing an example of the hard disk drive of the present invention. A hard disk drive 80 shown in FIG. 22 includes the above-described suspension 70 with an element, a disk 71 on which data is written and read by the suspension 70 with an element, a spindle motor 72 that rotates the disk 71, and the elements of the suspension 70 with an element. Arm 73 and voice coil motor 74 for moving the above, and a case 75 for sealing the above members.

  The hard disk drive of the present invention has at least a suspension with an element, and usually further includes a disk, a spindle motor, an arm, and a voice coil motor. Since the suspension with an element is the same as the content described in “F. Suspension with an element”, description thereof is omitted here. As other members, the same members as those used in a general hard disk drive can be used.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the technical idea described in the claims of the present invention has substantially the same configuration and exhibits the same function and effect regardless of the case. It is included in the technical scope of the invention.

[Example 1]
First, a laminated member having SUS304 (metal support member 1) having a thickness of 18 μm, a polyimide resin layer (insulating layer 2) having a thickness of 10 μm, and an electrolytic copper layer (conductor layer 3A) having a thickness of 9 μm was prepared (FIG. 12 ( a)). Next, a resist pattern was formed on both surfaces of the laminated member using a dry film resist. Then, it etched using the ferric chloride liquid, and resist stripping was performed after the etching. Thereby, the wiring 13, the wiring part 3 for connection terminals, and the plating wire 14 were formed from the conductor layer 3A. Further, the metal support substrate 1 at the position where the opening 16 and the connection terminal 12 are formed was removed (FIG. 12B).

  Thereafter, a cover layer 4 made of a polyimide resin was formed on the plating wire 14 and the wiring 13 so as not to cover the plating wire 14 and the connection terminal wiring portion 3 at the position where the opening 16 is to be formed (FIG. 12 (c)). Next, in order to pattern the insulating layer 2, a predetermined resist pattern was formed using a dry film resist, and the exposed polyimide resin was removed by wet etching (FIG. 12D). Next, in order to form the plating portion 17, a predetermined resist pattern is formed using a dry film resist, and the plating portion 17 is formed on the surface of the connection terminal wiring portion 3 by electrolytic Au plating (see FIG. 13 (a)-(c)). Next, the resist pattern was peeled off (FIG. 13D).

Thereafter, a predetermined resist pattern is formed using a dry film resist for the purpose of removing the plating wire 14 from the opening 16 and processing the outer shape of the metal support substrate 1, and exposing the exposed plating wire 16 and metal support substrate 1. Etching was performed using a ferric chloride solution (FIG. 14D). At this time, the plated wire 14 was positively etched to set L ₂₁ in FIG. 5B to 40 μm, L ₃₁ to 55 μm, and L ₄₁ to 30 μm. As a result, the suspension frame-equipped suspension substrate 22 shown in FIG. 10 was obtained. Finally, the obtained suspension substrate 22 with the outer frame was cut at a position closer to the outer frame portion 21 than the opening 16 (Cut Line 2 in FIG. 8) to obtain an individual suspension substrate 20.

[Example 2]
An individual suspension substrate 20 was obtained in the same manner as in Example 1 except that the obtained suspension substrate 22 with outer frame was cut at the position of the opening 16 (Cut Line 1 in FIG. 8). .

  DESCRIPTION OF SYMBOLS 1 ... Metal support substrate, 2 ... Insulating layer, 3A ... Conductor layer, 3 ... Connection terminal wiring part, 4 ... Cover layer, 12 ... Connection terminal, 13 ... Wiring, 14 ... Plating wire, 15 ... Test terminal, 16 DESCRIPTION OF SYMBOLS ... Opening part 17, 18 ... Plating part, 20 ... Suspension board | substrate, 21 ... Outer frame part, 22 ... Suspension board | substrate with outer frame, 31 ... Shared wiring part, 32 ... Opening part for short circuit prevention, 41 ... Protection Layer, 42 ... resist layer, 110 ... suspension substrate, 120 ... outer frame portion, H ... head portion, T ... tail portion, X ... element mounting region, Y ... external circuit board connection region, Z ... test terminal region

Claims (6)

An element mounting region formed on the head portion side for mounting an element, an external circuit board connection region formed on the tail portion side and having a connection terminal for connection to an external circuit substrate, the element mounting region, and the external circuit A method for manufacturing a suspension substrate, comprising: a wiring for electrically connecting between substrate connection regions; and a plated wire for electrically connecting to an end of the tail portion and electrically connecting to the connection terminal. ,
A laminated member having a metal supporting board, an insulating layer formed on the metal supporting board, and a conductor layer formed on the insulating layer is prepared, and the wiring and the connection are formed from the conductor layer by etching. A first metal etching step of forming a connection terminal wiring portion constituting a terminal, and forming the plated wire and removing the metal support substrate at a position where an opening is formed;
A cover layer forming step of forming a cover layer on the plated wire so as not to cover the plated wire at the position where the opening is formed;
After the cover layer forming step, an insulating layer etching step for removing the insulating layer at a position where the opening is formed by etching;
After the insulating layer etching step, forming a protective layer that protects the plated wire at the position where the opening is to be formed from plating, on the surface of the connection terminal wiring portion where the protective layer is not formed, A plating part forming step for forming a plating part;
After the plating part forming step, a protective layer peeling step for peeling the protective layer;
After the protective layer peeling step, the second metal etching step of removing the plating wire at the position where the opening is formed by etching and forming the opening,
Have
In the second metal etching step, after forming the second protective layer on both surfaces of the laminated member so that both surfaces of the plating wire of the opening are exposed , the end of the cover layer in the opening, and the A method for manufacturing a suspension substrate, comprising: etching the plating wire so that an end portion of the insulating layer in the opening protrudes beyond an end portion of the plating wire in the opening. An element mounting region formed on the head portion side for mounting an element, an external circuit board connection region formed on the tail portion side and having a connection terminal for connection to an external circuit substrate, the element mounting region, and the external circuit A method for manufacturing a suspension substrate, comprising: a wiring that electrically connects between substrate connection regions; and a plating wire that is electrically connected to the connection terminal,
A laminated member having a metal supporting board, an insulating layer formed on the metal supporting board, and a conductor layer formed on the insulating layer is prepared, and the wiring and the connection are formed from the conductor layer by etching. A first metal etching step of forming a connection terminal wiring portion constituting a terminal, and forming the plating wire and removing the metal support substrate at a position where the tail portion is formed;
A cover layer forming step of forming a cover layer on the plated wire so as not to cover the plated wire at a position where the tail portion is formed;
After the cover layer forming step, an insulating layer etching step for removing the insulating layer at a position where the tail portion is formed by etching;
After the insulating layer etching step, forming a protective layer that protects the plated wire at the position where the tail portion is formed from plating, on the surface of the connection terminal wiring portion where the protective layer is not formed, A plating part forming step for forming a plating part;
After the plating part forming step, a protective layer peeling step for peeling the protective layer;
After the protective layer peeling step, the second metal etching step for removing the plating wire at the position where the tail portion is formed by etching and forming the tail portion ;
Have
In the second metal etching step, after the second protective layer is formed on both surfaces of the laminated member so that both surfaces of the plated wire in the opening are exposed, the cover at the end of the plated wire in the tail portion is formed. A method of manufacturing a suspension substrate, comprising: etching the plating wire such that an end portion of the layer and an end portion of the insulating layer protrude from an end portion of the plating wire. The method for manufacturing a suspension substrate according to claim 1, wherein the protective layer and the second protective layer are formed using a dry film resist. The method for manufacturing a suspension substrate according to claim 1 , wherein the protective layer is formed using a mask that protects the outer frame portion of the laminated member from plating. In the insulating layer etching step, the insulating layer is formed so that an end of the insulating layer at a position where the opening is formed protrudes from an end of the cover layer at a position where the opening is formed. The method for manufacturing a suspension substrate according to any one of claims 1 to 4, wherein etching is performed. A method for manufacturing a suspension substrate with an outer frame, comprising a suspension substrate and an outer frame portion integrated on the tail portion side of the suspension substrate,
The suspension substrate is formed on the head portion side and mounts an element mounting region, and is formed on the tail portion side and has an external circuit board connection region having a connection terminal for connection to an external circuit substrate, Wiring for electrically connecting between the element mounting region and the external circuit board connection region, and a plating wire for electrically connecting the outer frame portion and the connection terminal,
A laminated member having a metal supporting board, an insulating layer formed on the metal supporting board, and a conductor layer formed on the insulating layer is prepared, and the wiring and the connection are formed from the conductor layer by etching. A first metal etching step of forming a connection terminal wiring portion constituting a terminal, and forming the plated wire and removing the metal support substrate at a position where an opening is formed;
A cover layer forming step of forming a cover layer on the plated wire so as not to cover the plated wire at the position where the opening is formed;
After the cover layer forming step, an insulating layer etching step for removing the insulating layer at a position where the opening is formed by etching;
After the insulating layer etching step, forming a protective layer that protects the plated wire at the position where the opening is to be formed from plating, on the surface of the connection terminal wiring portion where the protective layer is not formed, A plating part forming step for forming a plating part;
After the plating part forming step, a protective layer peeling step for peeling the protective layer;
After the protective layer peeling step, the second metal etching step of removing the plating wire at the position where the opening is formed by etching and forming the opening,
Have
In the second metal etching step, after forming the second protective layer on both surfaces of the laminated member so that both surfaces of the plating wire of the opening are exposed , the end of the cover layer in the opening, and the A method of manufacturing a suspension substrate with an outer frame, wherein the plating wire is etched so that an end of the insulating layer in the opening protrudes beyond an end of the plating wire in the opening.

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