JP5662926B2 - LED lighting heat sink - Google Patents

Description

  The present invention relates to a heat sink for LED lighting, in which LED lighting using a light emitting diode (LED) element as a light source radiates heat generated during light emission to the surrounding space.

  Lighting that uses a light emitting diode (LED) element as a light source is gradually penetrating the market due to its low power consumption and long life. Among these, in-vehicle LED lighting, such as automobile headlights, has attracted particular attention in recent years. Application of the in-vehicle LED lighting has begun to replace LED lighting in other fields such as buildings. ing.

  However, the LED element which is a light emitting source of this LED illumination is very weak to heat, and there is a problem that when the temperature exceeds the allowable temperature, the light emission efficiency is lowered, and further, the life is affected. In order to solve this problem, since it is necessary to dissipate heat at the time of light emission of the LED element to the surrounding space, the LED lighting is provided with a large heat sink.

  Many LED die heat sinks made of aluminum (including an aluminum alloy) are used, and Patent Documents 1 to 4 disclose heat sinks having typical configurations among these heat sinks. Is disclosed. These heat sinks have a substrate part in which the LED light source is arranged and fixed on the front side, and a plurality of parallelly arranged fin parts protruding at intervals on the back side of the substrate part. In addition, by increasing the surface area of the fin portion, the heat dissipation increases, and a certain heat dissipation property can be obtained.

  However, the basic structure of the conventional heat sink H is as shown in FIG. 8, in which an LED element (light source) L is disposed and fixed on the front side, and an interval is provided on the back side of the substrate unit 10. A plurality of fin portions 20 arranged in parallel and projecting in parallel, and when this is incorporated and applied to a housing for in-vehicle lighting such as an automobile headlight or tail lamp, a limited narrow space Will be installed.

  For this reason, the heat radiation space where the substrate part 10 and the fin part 20 are located is also in a closed volume and there is almost no air convection, so in such an installation environment almost no heat dissipation by convection can be expected, Heat dissipation by radiation is the center, and the heat sink structure in which the heat radiation area is increased by fins or the like as described above has a problem that heat radiation by radiation is insufficient and efficient heat dissipation cannot be achieved as a whole.

  That is, in the case of radiation, the size of the projected area in the X, Y, and Z axis directions (three-dimensional directions) displayed in the lower right of the figure affects the efficiency, and the radiation efficiency increases as the projected area increases. Will be improved. In the heat sink of FIG. 8, the projected area in the Y direction may be the sum of the plane of the substrate portion 10 and the plane of the fin portion 20, but that in the Z direction is the sum of the side surface of the substrate portion and the side surface of the fin portion 20. Since it is tooth-shaped and has a lot of space, it becomes a small area less than 50% of the total area obtained by multiplying the length of the substrate portion 10 and the height of the fin portion 20. Further, the projected area in the X direction is the total of the front surface of the substrate portion 10 and the front surface of the fin portion 20, and even though there are four fin portions 10, these are the same projected area as one and overlap each other. The radiation efficiency is low.

  In addition, it is considered to increase the heat dissipation by providing a large number of fin portions 20 of the conventional heat sink. However, since the structure is integrally formed by aluminum die casting, the productivity at the time of mass production is low, and die casting is performed. Many post-treatments such as a degreasing process for removing the release material later and a shot blasting process for smoothing the casting surface are necessary, which has a disadvantage that the manufacturing cost becomes very high.

JP 2007-172932 A JP 2007-193960 A JP 2008-117558 A JP 2009-277535 A JP 2010-278350 A

  The present invention solves the above-described problems, can be manufactured from a plate-like aluminum material (aluminum plate) by a relatively simple processing method, and is applied and installed in a closed space. However, an object of the present invention is to provide a heat sink for LED lighting that can efficiently dissipate heat.

According to the first aspect of the present invention, in the LED lighting heat sink made of a plate-like aluminum material, the aluminum material blank is bent and integrally formed, and the horizontal plane portion and the vertical front surface are formed. And the mounting portion of the LED element is formed on the surface of the horizontal plane portion or / and the vertical front portion of the substrate portion. The horizontal plane portion of the substrate portion or / And a heat sink for LED lighting characterized by having a vertical side surface portion perpendicular to these at one or both ends of the vertical front portion .

  The invention according to claim 2 is the heat sink for LED lighting according to claim 1, wherein the plate-like aluminum material is a plastic working material.

According to a third aspect of the invention, a horizontal flat portion and / or LED lighting heat sink according to claim 2, the thickness of the vertical front face portion is configured thicker than that of the vertical side portion of the substrate portion.

The invention according to claim 4 is the heat sink for LED lighting according to claim 2 or 3 , wherein the vertical side surfaces, or the horizontal side surfaces and / or the vertical front surface of the substrate portion are overlapped with each other. is there.

Invention of claim 5, claim 1-4 mounting portion of the LED elements formed on a horizontal plane portion and / or the surface of the vertical front portion of the substrate section and is formed by coining It is a heat sink for LED illumination as described in above.

The invention according to claim 6 is the heat sink for LED lighting according to any one of claims 1 to 5 , which is mounted on a vehicle.

According to the present invention, the following excellent effects are provided.
(B) The projected area in the three-dimensional direction of the heat sink is large, and therefore the heat from the LED light source can be efficiently used even in the space where there is no (or few) convection due to air where the application and installation location (place) are closed. It is possible to radiate the heat and the heat dissipation can be advantageously improved as a whole.
(B) Since it is a heat sink with a simple structure formed from an aluminum plate, it is relatively easy to punch a rolled plate such as a sheet or coil, or a plate processed by extrusion, and then fold a blank obtained by cutting or the like. In addition, since it is lightweight, it is suitable as a heat sink for LED lighting such as in-vehicle use.

It is a perspective view which shows basic embodiment of the heat sink for LED lighting which concerns on this invention. The manufacturing method of the heat sink for LED lighting of embodiment of FIG. 1 is demonstrated, It is a perspective view which shows the form of the plate-shaped aluminum material and blank which consist of coil materials, and the blank after coining process. It is a perspective view explaining the principle and effect | action of heat dissipation in the heat sink for LED illumination of embodiment of FIG. It is a perspective view which shows the form of the blank after coining explaining the manufacturing method of the heat sink for LED illumination of other embodiment which concerns on this invention which has the same overall shape as embodiment of FIG. It is a perspective view which shows the form of the blank after coining explaining the manufacturing method of the heat sink for LED illumination of other embodiment which concerns on this invention which has the same overall shape as embodiment of FIG. It is a perspective view which shows another embodiment of the heat sink for LED illumination which concerns on this invention from which embodiment differs from the embodiment of FIG. The manufacturing method of the heat sink for LED lighting of embodiment of FIG. 6 is demonstrated, It is a perspective view which shows the form of the plate-shaped aluminum material and blank which consist of coil materials, and the blank after coining process. It is a perspective view which shows the fundamental structure of the conventional heat sink for LED lighting.

Hereinafter, the present invention will be described in detail with reference to embodiments shown in the accompanying drawings.
First, based on FIG. 1 which shows basic embodiment of the heat sink for LED illumination which concerns on this invention, the concept of the whole shape is demonstrated concretely.
Here, as shown in FIG. 1, the heat sink H according to the present invention is formed of a plate-like aluminum (including its alloy) material having a constant and equal thickness, and has a stepped shape as a whole. 1. That is, in this board part 1, from the upper part of the stairs, the horizontal plane part and the vertical front part perpendicular to each other are alternately arranged in the order of the vertical front part B1, the horizontal plane part A, and the vertical front part B2 having the same rectangular shape. The shape (structure) is integrated continuously. A bulged LED element mounting portion L is provided at the center of the surface of the horizontal plane portion A of the substrate portion 1.

  Further, side plate portions 2 perpendicular to the substrate portion 1 are integrally provided at both ends of the heat sink H on both sides of the substrate portion 1. That is, the vertical front part B1 on the upper part of the substrate part 1 has a vertical side face part C1 and a vertical side face part C2 that are arranged at right angles to the front face part B1 and are continuously arranged toward the rear thereof. Further, the vertical side surface portion C3 and the vertical side surface portion C4, which are arranged at right angles to the horizontal flat surface portion A and continuously downward, are arranged at both ends of the horizontal flat surface portion A of the substrate portion 1, respectively. Have. Furthermore, the vertical front part B2 at the lower part of the substrate part 1 has a vertical side part C5 and a vertical side part C6 which are arranged at right angles to the front part B2 and continuously toward the front on both sides thereof.

  The thickness of the substrate portion 1 and the side plate portion 2 constituting the heat sink H is generally 0.5 to 5 mm from the viewpoint of rigidity, heat dissipation and weight reduction, although it depends on the overall size and the like. Is desirable.

  The aluminum material is not particularly limited, but it is desirable to use a JIS 1000 series pure aluminum, a JIS 3000 series aluminum alloy, a JIS 5000 series aluminum alloy, etc. that are excellent in thermal conductivity and formability.

A method of manufacturing the heat sink H of the basic embodiment will be described below with reference to FIG.
First, as shown in the upper diagram of FIG. 2, a plate-like aluminum coil material 10 manufactured by rolling is punched, and one sheet corresponding to the planar shape of the developed view matched to the three-dimensional shape of the heat sink H of FIG. A blank 11 is obtained. As shown in the lower diagram of FIG. 2, the blank 11 has a rectangular shape as a whole. The blank 11 has two portions on both sides thereof and four notches K in total. The notch K is located at a position obtained by dividing the length of the blank 11 into three equal parts, and has a belt-like shape extending in parallel from the end on the long side of the blank 11 to the center with a predetermined length. The aluminum coil material 10 may be a sheet material manufactured by rolling instead.

  Next, a rectangular parallelepiped LED element mounting portion L bulging upward by coining is formed at the center of the surface of the blank 11.

  Next, each part of the blank 11 is bent. 2, the same reference numerals as those corresponding to the names of the respective parts constituting the three-dimensional shape of the heat sink H in FIG. 1 is a board | substrate part, 2 is a side-plate part. A broken line portion is a boundary line between successive portions, and indicates a bend line (fold) at the time of bending.

  Therefore, first, the B1 surface portion of the blank 11 is bent upward at a right angle around the bend line X that is the boundary line between the C1 surface portion and the C2 surface portion and the A surface portion, and the B2 surface portion is integrated with the C5 surface portion and the C6 surface portion. 1 is bent downward at a right angle around a bend line X that is a boundary line with the A surface portion, and is formed in a staircase shape composed of an upper vertical front portion B1, an intermediate horizontal plane portion A, and a lower vertical front portion B2 in FIG. The substrate portions 1 that are alternately continuous are formed. Next, the C1 surface portion and the C2 surface portion are bent at a right angle rearward (downward in FIG. 2) around the bend line X that is a boundary line between the B1 surface portion and continuous to both end portions of the vertical front portion B1 in FIG. The formed vertical side surface portion C1 and vertical side surface portion C2 are formed. Next, the C5 surface portion and the C6 surface portion are bent at a right angle forward (downward in FIG. 2) around the bend line X that is a boundary line between the B2 surface portion and continuous to both end portions of the vertical front portion B2 in FIG. The formed vertical side surface portion C5 and vertical side surface portion C6 are formed. Further, the C3 surface portion and the C4 surface portion are bent downward at a right angle around a bend line X that is a boundary line between the A surface portion and the vertical side surface portion C3 that is continuous with both sides of the horizontal plane portion A in FIG. The vertical side surface portion C4 is formed.

  Production of the LED lighting heat sink H of the embodiment of FIG. 1 is completed by bending the blank 11 described above. In addition, the processing order of each part in the bending process of the blank 11 for manufacture of the heat sink H of this embodiment is not specifically limited to the method mentioned above. Even if the order of processing is appropriately changed, the heat sink H can be similarly manufactured.

  As described above, the heat sink H for LED lighting in the embodiment of FIG. 1 can be easily manufactured by simply punching, coining and bending an aluminum plate obtained by plastic processing such as rolling. Moreover, since the structure is a combination of thin plate materials, it is extremely lightweight and has sufficient rigidity. Further, the manufacturing cost can be greatly reduced as compared with the conventional die-cast one.

  Next, the principle and action of heat radiation when the LED lighting is performed by installing the heat sink H according to the present invention in a closed space without air convection will be described with reference to FIG. 3 by taking the embodiment shown in FIG. 1 as an example. Here, the radiation direction of the heat Q from each part is indicated by an arrow, and the surrounding closed space is indicated by S.

  First, when the LED element mounted on the LED element mounting portion L of the horizontal plane portion A is caused to emit light, heat generated by the LED element is conducted to the horizontal plane portion A through the LED element mounting portion L. Subsequently, the heat conducted to the horizontal plane portion A is conducted to the vertical plane portions B1 and B2 and the vertical side surface portions C3 and C4. Then, the heat Q conducted to the horizontal plane portion A enters the surrounding closed space (heat radiation space) S in the direction perpendicular to the front and back surfaces of the plane portion (the vertical direction in the figure, the arrow of the heat Q from the back surface is omitted). Radiated. Further, the heat Q transmitted to the vertical front portions B1 and B2 is radiated from the front and back surfaces of the flat surface portion to the same space S in the perpendicular direction (the front-rear direction in the figure, the arrow of the heat Q from the B2 back surface is omitted). Further, the heat Q transmitted to the vertical side surface portions C3 and C4 is radiated from the surface of the side surface portion to the same space S in the perpendicular direction (right and left directions in the drawing, and the arrow of the heat Q from the back surface is omitted). The

  On the other hand, a part of the heat Q conducted to the vertical front part B1 is conducted to the vertical side parts C1 and C2, and the surrounding space S in the right-angle direction (right and left directions in the figure) from the front and back surfaces of the both side parts. To be emitted. Further, a part of the heat Q conducted to the vertical front part B2 is conducted to the vertical side parts C5 and C6, and the surrounding space S in the right-angle direction (right and left directions in the figure) from the front and back surfaces of the both side parts. To be emitted.

  In addition, since the vertical side surfaces C1 to C6 are such that C1 and C2, C3 and C4, and C5 and C6 face each other, heat radiation due to radiation is less than that of the horizontal plane portion A and the vertical front portions B1 and B2. For example, in the case of C1 and C2, the heat Q from the surface of C1 (the right side in the figure) and the surface of C2 (the left side in the figure) is directly radiated to the surrounding space S in the perpendicular direction, and is sufficiently dissipated. On the other hand, the heat Q radiated from the back surface of the back surface C1 (the left surface in the figure) in the perpendicular direction and the heat Q radiated from the C2 back surface (the right surface in the figure) at a right angle intersect each other. This is because heat is absorbed and heat dissipation to the surrounding space S is hindered.

  As described above, the heat sink according to the present invention represented by the basic embodiment of FIG. 1 is composed of a step-like substrate portion in which the horizontal plane portion and the vertical front portion are alternately continued. In the closed heat radiation space where the efficiency of heat dissipation is dominated by radiation and the convection is less likely to occur, the projected area in the X, Y, Z direction, that is, the three-dimensional direction is very large. It can be seen that the radiation efficiency is high and the heat dissipation is excellent.

Next, another embodiment according to the present invention having the same overall shape as the embodiment of FIG. 1 will be described. Although the heat sink itself of this embodiment is not illustrated, it is provided at the stepped substrate portion 1 (horizontal plane portion A, vertical front portion B1 and vertical front portion B2) of FIG. The vertical side surface portions (C1, C2, C3, C4, C5, and C6) differ only in thickness, and the other portions have exactly the same shape as that of FIG.
This embodiment will be specifically described based on FIG. 4 showing the form of the blank after coining.

The blank 11 has a rectangular shape as a whole, has two portions on each side, and four notches K in total, and has a thick substrate portion 1 at the center and a thickness on both sides. It is a blank having a different thickness in the width direction composed of the thin side plate portion 2.
The manufacturing method of this blank 11 will be described. Two types of plate-like aluminum coil materials with different thicknesses produced by rolling are prepared, and one thick plate obtained by punching or cutting each. Two thin plates are welded together. W shows a weld bead part. Then, a strip-like cutout K extending in parallel with a predetermined length is formed from the end to the center side at a position obtained by dividing the length into three equal parts.

  The heat sink H according to this embodiment can be easily manufactured by bending the blank 11 described in the previous embodiment. The heat sink H according to the present embodiment has the same three-dimensional shape as that shown in FIG. 1, but the substrate portion 1 constituting the step shape, that is, the vertical front portion B1, the horizontal plane portion A, and the vertical front portion B2 in FIG. Is thicker than the thickness of the side plate portion 2, that is, the vertical side surface portions C1, C2, C3, C4, C5 and C6. Specifically, the thickness of the substrate portion 1 is preferably 0.5 to 5 mm, and the thickness of the side plate portion 2 is preferably 0.25 to 2.5 mm.

  According to this embodiment, compared to the embodiment shown in FIG. 1, the rigidity of the stepped substrate portion 1 that becomes the skeleton of the heat sink can be further increased, and at the same time, the thermal conductivity can be maintained higher. The heat dissipation can be further improved.

  Next, still another embodiment according to the present invention having the same overall shape as that of the embodiment of FIG. 1 will be specifically described based on FIG. 5 showing the form of the blank after coining similarly to the above. This blank 11 has a rectangular shape as a whole, has two portions on each side, and four notches K in total, and has a thick substrate portion 1 at the center and a thickness on both sides. It consists of the thin side plate part 2, and the shape of the blank is the same as described above. However, this blank 11 is different from the one obtained by welding and integrating plates obtained from two types of plate-like aluminum coil materials having different thicknesses.

  That is, the blank 11 is made of an aluminum extruded material having a thick substrate portion 1 at the center and thin side plates 2 on both sides. In order to manufacture the blank 11, extrusion may be performed using a mold corresponding to the cross-sectional shape, and then a notch K may be provided. In addition, by performing the bending process described in the previous embodiment on the blank 11, the heat sink H according to the present embodiment can be easily manufactured in the same manner.

  Also in this embodiment, compared to the embodiment shown in FIG. 1, it is possible to further increase the rigidity of the stepped substrate portion 1 that becomes the skeleton of the heat sink H and at the same time maintain higher thermal conductivity. The heat dissipation can be further improved. In addition, since the blank 11 having a uniform and different thickness in the width direction can be manufactured by extrusion without punching or welding, the heat sink manufacturing process is more than that shown in FIG. It will be easy.

  The heat sink of FIG. 1 is an embodiment showing a basic overall shape, and the present invention is not limited to this. For example, the one in FIG. 1 has a one-step staircase shape composed of three surfaces consisting of upper and lower vertical surface portions B1 and B2 and a horizontal plane portion A therebetween, but further increases the projected area to the heat radiation space. Therefore, these may be configured to have four or more surfaces and the number of steps may be two or more. In FIG. 1, the horizontal plane part A and the vertical front parts B1 and B2 constituting the staircase are all rectangular (rectangular) having the same length and width, but these lengths and widths are changed. Different rectangles may be alternately arranged, that is, the stairs (one step) may have different widths, depths, and heights. Furthermore, the staircase may have an irregular shape shifted in the width direction (left and right) by the step.

  Further, FIG. 1 shows that the vertical side surface portions C1, C2, C3, C4, and 5, 6 are provided on both sides of the vertical front surface portion B1, the horizontal flat surface portion A, and the vertical front surface portion B2, respectively. Of these, all or one of the side surfaces C1, C2 and C5, C6 at both ends of the side surfaces B1, B2 may be omitted.

Next, another embodiment of the heat sink for LED lighting according to the present invention, which is different in overall shape from the embodiment of FIG. 1, will be described with reference to FIG.
Here, the LED lighting heat sink of this embodiment is formed of a plate-like aluminum (including its alloy) material having a constant and equal wall thickness as in the embodiment of FIG. It is comprised by the board | substrate part 1 which has. 1 differs from the embodiment shown in FIG. 1 in that the substrate portion 1 further includes a horizontal plane portion A1 that is disposed at the upper part of the vertical front portion B1 at a right angle to the rear and continuously toward the rear. It has a two-step staircase shape.

Next, in the present embodiment, the structure of the side plate portion 2 provided at both end portions of the substrate portion 1 is greatly different from that in FIG. At the end portions on both sides of the horizontal plane portion A, there are vertical side surface portions C1 and C2 which are arranged continuously at right angles to the lower end (the lower end position of the vertical front surface portion B2) downward. In addition, the vertical side surfaces arranged continuously at the ends of the both sides of the vertical front portion B1 at right angles to the front of the vertical front portion B1 up to the middle of the entire width of the horizontal plane portion A2 (width of two thirds). C31 and C32. And it has the perpendicular | vertical side part C33 and C34 which were arrange | positioned continuously at the edge part of the both sides of horizontal plane part A2 at right angles to this, and the downward direction.

  Further, the vertical side surfaces C1 and C2 are superposed so as to protrude forward at respective upper and lower positions and to circumscribe and partially cover the surfaces (rear side) of the vertical side surfaces C31, C32, C33 and C34. The flange parts P1 and P2 are provided. Further, the vertical side surfaces C33 and C34 are also provided with overlapping flange portions P3 projecting forward at the positions of the respective central portions and circumscribing and covering a part (rear side) of the surfaces of the vertical side surfaces C5 and C6. .

The production method of the heat sink H of the above-described embodiment will be described below with reference to FIG.
First, as shown in the upper drawing of FIG. 7, a plate-like aluminum coil material 10 manufactured by rolling is punched out, and one sheet corresponding to the planar shape of the developed view matched to the three-dimensional shape of the heat sink H of FIG. A blank 11 is obtained. As shown in the lower diagram of FIG. 7, the blank 11 has a T-shape as a whole and is provided with a total of six cutout portions K1 to K3 around the blank 11. That is, it has one notch K1 at both lower portions (both sides in the figure) of the head 11a, and two notches K2 and K3 at both sides of the body 11b. The cutout portion K1 has a two-stage key shape, the cutout portion K2 has a band shape, and the cutout portion K3 has a one-step key shape.

  Next, a rectangular parallelepiped LED element mounting portion L bulging upward by coining is formed at the center of the surface of the blank 11.

  Next, each part of the blank 11 is bent. In the lower diagram of FIG. 7, the same reference numerals as those corresponding to the names of the respective parts constituting the three-dimensional shape of the heat sink H of FIG. 1 is a board | substrate part, 2 is a side-plate part. A broken line portion is a boundary line between successive portions, and indicates a bend line (fold) at the time of bending.

  Therefore, first, the B1 surface portion of the blank 11 is bent upward at a right angle around the bend line X that is a boundary line with the A2 surface portion integrally with the C31 surface portion, the C32 surface portion, the A1 surface portion, the C1 surface portion, and the C2 surface portion. Further, the B2 surface part is bent downward at a right angle around the bend line X that is a boundary line with the A2 surface part integrally with the C5 surface part and the C6 surface part. Further, the A1 surface portion is bent at a right angle rearward (downward in FIG. 7) around the bend line X which is a boundary line between the C1 surface portion and the C2 surface portion and the B1 surface portion. In this way, the board | substrate part 1 which continued in order of the horizontal plane part A1, the vertical front part B1, the horizontal plane part A2, and the vertical front part B2 from the upper part of FIG.

  After the stepped substrate portion 1 is formed, the C5 surface portion and the C6 surface portion are bent at a right angle forward (upward in FIG. 7) around the bend line X that is a boundary line between the B1 surface portion and the vertical front of FIG. A vertical side surface portion C5 and a vertical side surface portion C6 which are continuous with the both end portions of the portion B2 are formed. Next, the C33 surface portion and the C34 surface portion are bent at a right angle forward (downward in FIG. 7) about the bend line X that is a boundary line between the A2 surface portion and continuous with both side end portions of the horizontal plane portion A2 in FIG. The vertical side surface portion C33 and the vertical side surface portion C34 thus formed are formed.

  By this molding, the overlapping flange portion P3 of the C33 surface portion and the C34 surface portion overlaps and joins the surfaces of the C5 surface portion and the C6 surface portion, respectively. That is, as shown in FIG. 6, the overlapping flange portion P3 of the vertical side surface portion C33 and the vertical side surface portion C34 covers and joins part of the vertical side surface portion C5 and the vertical side surface portion C6 (rear side), and this portion has a double structure. become.

  Next, the C31 surface portion and the C32 surface portion are bent at a right angle forward (upward in FIG. 7) around the bend line X that is a boundary line between the C1 surface portion and the B1 surface portion. A continuous vertical side surface portion C31 and vertical side surface portion C32 are formed.

  Subsequently, the C1 surface portion and the C2 surface portion are bent downward at a right angle around the bend line X that becomes the boundary line between the A1 surface portion and the vertical side surface portion C1 continuous to both ends of the horizontal plane portion A1 in FIG. And the vertical side surface portion C2 is formed.

  By this molding, the overlapping flange portions P1 of the C1 surface portion and the C2 surface portion are overlapped in contact with the surfaces of the C31 surface portion and the C32 surface portion, respectively, and the overlapping flange portions P2 of the C1 surface portion and the C2 surface portion are respectively C33 surface portion and C34. Overlapping in contact with the surface of the surface portion. That is, as shown in FIG. 6, the overlapping flange portion P <b> 1 above the vertical side surface portion C <b> 1 and the vertical side surface portion C <b> 2 is overlapped so as to cover a part (rear side) of the vertical side surface portion C <b> 31 and vertical side surface portion 32. The overlapping flange portion P2 below C1 and the vertical side surface portion C2 is overlapped so as to cover a part (rear side) of the vertical side surface portion C33 and the vertical side surface portion 34, and both of these portions have a double structure.

  The bending of the blank 11 as described above completes the manufacture of the LED illumination heat sink H of the embodiment of FIG. The processing order of each part in the bending process of the blank 11 for manufacturing the heat sink H of the present embodiment is not particularly limited to the method described above as in the embodiment of FIG. However, in the case of the present embodiment, since it is more complicated than that of FIG. 1, the vertical side surface portion on the side to be joined is bent so that the respective portions do not interfere with each other at the time of bending. It is necessary to pay attention so that the processing order is fixed, for example, after the processing.

  According to this embodiment, compared with the embodiment shown in FIG. 1, the horizontal plane portion A1, the vertical side portions C1 and C2, the vertical side portions 31 and 32, etc. are added or the three-dimensional direction is increased by increasing the area thereof. Therefore, the radiation efficiency of the heat sink is higher and the heat dissipation is further improved. Moreover, it is the structure which formed the superposition | polymerization flange part P1-P3 in the vertical side surface parts C1 and C2, C33, and C34, respectively, overlapped and joined and connected to other vertical side surface parts C31 and C32, C33 and C34, C5 and C6. Therefore, the heat generated from the LED element is radiated through heat conduction immediately to the end of each vertical side surface (fin) away from the LED element, thereby exhibiting higher heat dissipation. Furthermore, since the vertical side surfaces are overlapped to form a double plate structure, the rigidity of the heat sink is increased compared to the single structure in FIG. 1, and the strength, durability and stability are improved. Can be achieved.

  In this embodiment, the vertical side surfaces are overlapped with each other via the overlapping flange portion. However, the present invention is not limited to this, and the horizontal side surface portion and / or the vertical front surface portion of the vertical side surface portion and the substrate portion are not limited thereto. A superposed structure is also acceptable.

  In addition, the double structure portion between the vertical side surfaces in the present embodiment may be combined with a double material integrally by a joining method such as screw fastening or rivet fastening, caulking fastening, welding, brazing, As a result, the rigidity of the heat sink can be greatly increased.

1: Substrate part 2: Side plate part 10: Aluminum coil material 11: Blank A, A1, A2: Horizontal plane part B1, B2: Vertical front part C1-C6, C31-C34: Vertical side part K, K1-K3: Notch Portions P1 to P3: Overlapping flange portion L: LED element mounting portion Q: Heat S: Closed space (heat radiation space)

Claims (6)

In LED heat sink made of plate-like aluminum material, it is formed integrally by bending the aluminum material blank, and the horizontal plane part and the vertical front part are alternately continuous steps And a mounting portion for the LED element is formed on the surface of the horizontal plane portion and / or vertical front portion of the substrate portion, and one or both sides of the horizontal plane portion and / or vertical front portion of the substrate portion. A heat sink for LED lighting, comprising a vertical side surface perpendicular to these at the end of the LED.   The heat sink for LED lighting according to claim 1, wherein the plate-like aluminum material is a plastic working material. The heat sink for LED lighting according to claim 2 , wherein a thickness of a horizontal plane part and / or a vertical front part of the substrate part is thicker than that of the vertical side part. The heat sink for LED lighting according to claim 2 or 3 , wherein the vertical side surfaces or the horizontal side surfaces and / or the vertical front surface of the same substrate are overlapped with each other. The heat sink for LED lighting according to any one of claims 1 to 4 , wherein the mounting portion of the LED element formed on the surface of the horizontal plane portion or / and the vertical front portion of the substrate portion is formed by coining. LED lighting heat sink according to any one of claims 1 to 5, intended to be mounted in the vehicle.