JP5608154B2 - Heat sink for LED lamp - Google Patents

Heat sink for LED lamp Download PDF

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JP5608154B2
JP5608154B2 JP2011285770A JP2011285770A JP5608154B2 JP 5608154 B2 JP5608154 B2 JP 5608154B2 JP 2011285770 A JP2011285770 A JP 2011285770A JP 2011285770 A JP2011285770 A JP 2011285770A JP 5608154 B2 JP5608154 B2 JP 5608154B2
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heat sink
led
led lamp
pedestal
metal plate
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JP2011285770A
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JP2013135145A (en
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晴之 小西
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株式会社神戸製鋼所
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Priority to JP2011285770A priority Critical patent/JP5608154B2/en
Priority claimed from CN201610926113.3A external-priority patent/CN106895378A/en
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Description

  The present invention relates to a heat sink for an LED lamp in which an LED lamp using a light emitting diode (LED) element as a light source radiates heat generated during light emission to the surroundings.

  Lighting that uses a light emitting diode (LED) element as a light source is gradually penetrating the market due to its low power consumption and long life. These LED lamps include general bulb-type LED bulbs developed to replace existing bulbs such as incandescent bulbs and fluorescent lamps, automotive LED lights such as automobile headlights, and embedded lighting in buildings and other fields. and so on.

  However, the LED element which is the light source of this LED lamp is very weak to heat, and there is a problem that when the temperature exceeds the allowable temperature, the light emission efficiency is lowered and the life is also affected. In order to solve this problem, since it is necessary to dissipate the heat at the time of light emission of the LED element to the surrounding outside air, the LED lamp is provided with a large heat sink.

  As these heat sinks, heat sinks made of die cast (hereinafter also referred to as an aluminum die cast structure) made of aluminum or aluminum alloy are often used. It has also been proposed. For example, the heat sinks shown in Patent Documents 1 to 3 are LED bulb heat sinks, the heat sinks shown in Patent Documents 4 to 6 are onboard LED illumination heat sinks, and the heat sinks shown in Patent Documents 7 to 8 are embedded illumination heat sinks. All the heat sinks shown in the literature are die-cast heat sinks.

  In the heat sink having such an aluminum die cast structure, as shown in FIG. 4, it is common that an attachment portion for attaching the LED substrate 3 is formed integrally with the heat sink body 1. Further, in order to make it easy to secure the locus of light when the LED elements of the LED substrate 3 are attached, the periphery of the attachment portion (the pedestal portion 2) of the LED substrate 3 is higher than the other portions (heat sink body 1). In many cases, the shape was increased.

  However, when trying to manufacture such a die-cast heat sink made of aluminum or aluminum alloy, there is a problem that the manufacturing cost becomes high and the heat sink becomes heavy. In addition, when processing into a complicated shape such as forming a large number of heat dissipating fins on the surface, there is a problem that a mold having a complicated shape is required.

  Thus, since the heat sink of the aluminum die-cast structure has the problem that it is heavy and the manufacturing cost becomes high, it is also considered to manufacture the heat sink with a metal plate material such as aluminum or aluminum alloy. However, it is difficult to form a mounting portion for mounting the LED substrate with only one plate material. As a result, a plurality of parts are required, and the number of parts is increased. Therefore, the manufacturing cost is high.

JP 2009-170114 A JP 2009-4130 A JP 2004-296245 A JP 2009-266436 A JP 2010-3621 A JP 2011-28963 A JP 2008-117558 A JP 2009-163955 A

  The present invention has been made as a solution to the above-described conventional problems. In addition to being able to reduce the weight, there is no need for a separate component for mounting the LED substrate, and the configuration of the component is simplified and the manufacturing cost is reduced. It is an object of the present invention to provide a heat sink for an LED lamp capable of achieving the above.

The invention according to claim 1 is an LED lamp heat sink formed of a metal plate material, and includes a heat sink main body portion and a pedestal portion for mounting the LED substrate that bulges to the surface side from the heat sink main body portion. Further, a backing material is laminated on the back side of the pedestal portion, and the pedestal portion is integrally formed with the heat sink main body portion by coining together with the backing material. It is.

According to a second aspect of the invention, the metal plate is made of aluminum or LED lamp heat sink according to claim 1, wherein the aluminum alloy.

According to the heat sink for LED lamps of the present invention, since it is formed from a metal plate material, it is not necessary to reduce the weight, and it is not necessary to use a mold having a complicated shape at the time of manufacture as in the case of die casting. In addition, since the pedestal for mounting the LED board is integrally molded with the heat sink body by coining along with the backing material, no additional parts for mounting the LED board are required, simplifying the component configuration and manufacturing Cost can be reduced.

Also, by laminating the backing material on the back side of the pedestal, the thickness of the pedestal can be made thicker than the thickness of the heat sink body, and heat generated from the LED board can be efficiently conducted to the surroundings. Can do. Therefore, heat dissipation can be further improved by laminating the backing material on the back side of the pedestal portion.

It is a longitudinal cross-sectional view which shows the heat sink for LED lamps concerning one Embodiment of this invention. It is a longitudinal cross-sectional view which shows the heat sink for LED lamps which concerns on different embodiment of this invention. It is a longitudinal cross-sectional view which shows the state which has manufactured the heat sink for LED lamps concerning one Embodiment of this invention by coining process. It is a longitudinal cross-sectional view which shows the conventional heat sink for LED lamps made from die-casting.

  Hereinafter, the present invention will be described in more detail based on embodiments shown in the accompanying drawings.

  FIG. 1 shows a heat sink A for LED lamps (hereinafter sometimes simply referred to as a heat sink) according to an embodiment of the present invention. The heat sink A is formed by, for example, coining a single metal plate made of aluminum or aluminum alloy having a plate thickness of 0.3 to 5 mm. As the metal plate material used for manufacturing the heat sink A, it is particularly desirable to use a metal material excellent in thermal conductivity and formability such as JIS 1000 series pure aluminum, JIS 3000 series aluminum alloy, JIS 5000 series aluminum alloy. However, other thermal conductivity and formability, such as JIS 6000 series aluminum alloy material, and other metal plate materials such as high strength aluminum alloy material or copper may be used.

  In addition, when the metal plate was made of aluminum or aluminum alloy, the plate thickness of the metal plate was previously exemplified as 0.3 to 5 mm. The reason is that the plate thickness of the metal plate is 5 mm. If the thickness exceeds 1, the mass becomes too heavy and is not suitable for use as the heat sink A of the LED lamp. On the other hand, when the plate thickness is less than 0.3 mm, sufficient strength as a component of the LED lamp is obtained. This is because it is impossible to secure the above-mentioned value and is not suitable for use as the heat sink A of the LED lamp. A more preferable thickness of the metal plate is 0.35 to 2.5 mm.

  Specifically, the LED lamp heat sink A according to the present embodiment includes a heat sink main body 1 and a pedestal 2 having a trapezoidal longitudinal section that bulges to the surface side (upper side in FIG. 1) from the heat sink main body 1. The heat sink A is configured by attaching the LED substrate 3 to the surface side of the pedestal 2. In addition, the LED board 3 mounts a some light emitting diode (LED) element on the surface, such as an aluminum alloy plate. A recess 5 is formed on the back side of the pedestal 2.

  Next, the manufacturing method of the heat sink A for LED lamps which concerns on one Embodiment of this invention is demonstrated based on FIG.

  FIG. 3 shows a mold used for manufacturing the heat sink A for LED lamps, and B is a metal plate used for manufacturing the heat sink A. Among the components constituting the mold, 6 is a die provided with a recess 6a for forming the surface of the pedestal 2 and 7 is a pedestal formed by forming a recess 5 on the back of the pedestal 2. A punch for forming the portion 2 and 8 is a blank holder. Further, 9 is a bolster and 10 is a cushion pin.

  First, after the metal plate B is placed on the upper surface of the blank holder 8, the die 6 is lowered, and the metal plate B is sandwiched between the lowered die 6 and the pair of blank holders 8, 8. When the die continues to descend, the punch 7 approaches the metallic plate material B relatively, and a part (intermediate portion) of the metallic plate material B is pushed up into the recess 6 a of the die 6. At this time, both side portions of the metal plate B are still sandwiched between the die 6 and the pair of blank holders 8 and 8. A part of the pushed-up metal plate material B is strongly compressed at the recess 6 a of the die 6 and the upper surface of the punch 7, and is formed into a trapezoidal shape in the longitudinal section, thereby forming the pedestal portion 2.

  When a part of the metal plate B is compressed by the recess 6 a of the die 6 and the upper surface of the punch 7, a recess 5 is formed on the back side of the pedestal 2. Further, the remaining part of the metal plate B sandwiched between the die 6 and the blank holder 8 becomes the heat sink main body 1.

  FIG. 2 shows an LED lamp heat sink A according to a different embodiment of the present invention. The heat sink A is also formed by subjecting a metal plate material made of aluminum or aluminum alloy having a plate thickness of 0.3 to 5 mm to coining processing. The heat sink main body 1 and the heat sink main body 1 The configuration of the pedestal portion 2 having a trapezoidal longitudinal section that bulges further to the surface side is the same as the embodiment shown in FIG.

  In the following description of this embodiment, the portion of the heat sink A for LED lamps composed of the heat sink body 1 and the base 2 will be referred to as a heat sink body a for convenience.

  The embodiment shown in FIG. 2 is different from the embodiment shown in FIG. 1 in that the backing material 4 is laminated along the back side of the heat sink body a including the pedestal 2 to constitute the heat sink A for LED lamps. It is a point. The backing material 4 is also preferably formed using a metal plate material made of aluminum or aluminum alloy having good thermal conductivity and formability, similar to the heat sink body a, but made of other metal such as copper. It may be formed using a plate material.

  Although the LED lamp heat sink A according to this embodiment is also manufactured by coining, a method of manufacturing the LED lamp heat sink A by performing molding once, and manufacturing the LED heat sink A by performing molding twice. Any of the methods to do

  When the LED lamp heat sink A is manufactured by performing molding once, the metal plate material forming the backing material 4 is laminated on the back surface of the metal plate material forming the heat sink body a. The heat sink A for LED lamps is manufactured by coining using the metal mold | die shown.

  When the LED lamp heat sink A is manufactured by performing the molding twice, first, after the heat sink body a is molded by the method shown in FIG. 3, the recess on the back surface of the pedestal 2 is formed on the back surface of the heat sink body a. 5, the metal plate material for forming the backing material 4 is applied and molded again. In the case where the molding is performed twice in this way, it is preferable that the first molding is preformed and coining is performed in the second molding.

  The heat sink A for LED lamps of the present invention may be a simple plate shape as shown in FIG. 1 or FIG. 2, or the heat sink body 1 may be processed into various shapes according to the shape of the heat sink. . The LED lamp heat sink A can be used as a heat sink for various LED lamps, such as a heat sink for LED bulbs, a heat sink for vehicle-mounted LED lighting, and a heat sink for embedded lighting such as buildings.

A ... Heat sink B for LED lamp ... Metal plate material a ... Heat sink body 1 ... Heat sink body portion 2 ... Pedestal portion 3 ... LED substrate 4 ... Backing material 5 ... Recess 6 ... Dice 6a ... Recess 7 ... Punch 8 ... Blank holder 9 ... Bolster 10 ... Cushion pin

Claims (2)

  1. A heat sink for an LED lamp formed from a metal plate,
    Consists of a heat sink main body and a pedestal for mounting the LED substrate that bulges to the front side from the heat sink main body, and a backing material is laminated on the back side of the pedestal,
    A heat sink for an LED lamp, wherein the pedestal portion is integrally formed with the heat sink main body portion by coining together with the backing material .
  2. The metallic plate material, LED lamp heat sink according to claim 1, wherein is made of aluminum or aluminum alloy.
JP2011285770A 2011-12-27 2011-12-27 Heat sink for LED lamp Active JP5608154B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011285770A JP5608154B2 (en) 2011-12-27 2011-12-27 Heat sink for LED lamp

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2011285770A JP5608154B2 (en) 2011-12-27 2011-12-27 Heat sink for LED lamp
CN201610926113.3A CN106895378A (en) 2011-12-07 2012-12-07 Led lighting heat sink and method for manufacturing same
CN201280054494.0A CN103917824B (en) 2011-12-07 2012-12-07 Led lighting fin and manufacturing method thereof
PCT/JP2012/081769 WO2013085024A1 (en) 2011-12-07 2012-12-07 Led lighting heat sink and method for manufacturing same
KR1020147015181A KR20140096345A (en) 2011-12-07 2012-12-07 Led lighting heat sink and method for manufacturing same

Publications (2)

Publication Number Publication Date
JP2013135145A JP2013135145A (en) 2013-07-08
JP5608154B2 true JP5608154B2 (en) 2014-10-15

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JP2011285770A Active JP5608154B2 (en) 2011-12-27 2011-12-27 Heat sink for LED lamp

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017016923A (en) * 2015-07-02 2017-01-19 株式会社神戸製鋼所 Heat sink of on-vehicle led lamp

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61145898A (en) * 1984-12-19 1986-07-03 Matsushita Electric Ind Co Ltd Printed wiring board
US5220487A (en) * 1992-01-27 1993-06-15 International Business Machines Corporation Electronic package with enhanced heat sinking
US7186010B2 (en) * 2004-06-16 2007-03-06 Osram Sylvania Inc. LED lamp and lamp/reflector assembly
JP2006179541A (en) * 2004-12-21 2006-07-06 Enomoto Co Ltd Lead frame for power led and its manufacturing process
CN102077014B (en) * 2009-02-04 2014-12-17 松下电器产业株式会社 Bulb-shaped lamp and lighting device

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