JP5657905B2 - shield - Google Patents
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- JP5657905B2 JP5657905B2 JP2010073603A JP2010073603A JP5657905B2 JP 5657905 B2 JP5657905 B2 JP 5657905B2 JP 2010073603 A JP2010073603 A JP 2010073603A JP 2010073603 A JP2010073603 A JP 2010073603A JP 5657905 B2 JP5657905 B2 JP 5657905B2
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本発明は、電磁波ノイズの輻射を抑える組込用カバーシールド、シールド構造及び組込用カバーシールドの実装方法に関する。 The present invention relates to a built-in cover shield that suppresses radiation of electromagnetic noise, a shield structure, and a mounting method for a built-in cover shield.
電子機器、例えば携帯電話機のＣＰＵ（Ｃｅｎｔｒａｌ Ｐｒｏｃｅｓｓｉｎｇ Ｕｎｉｔ）の動作速度の向上に伴い、高周波数の電磁波ノイズが、輻射によって携帯電話機内の各アンテナを経由して受信帯域へ回り込む、又は受信信号と干渉するおそれが生じるようになった。この電磁波ノイズの輻射を抑えるために、ＣＰＵの周囲をシールドする実装用シールドと、実装用シールドを覆う組込用カバーシールドとを組み合わせてシールドとして組み込む。しかし、実装用シールドは、ＣＰＵの破壊防止の樹脂塗布を行うために開口しており、加えて、実装用シールドと組込用カバーシールドとのそれぞれに設計上の公差が存在するため、電磁波ノイズの輻射を確実に抑えることができない。そして、導通を確実にするために公差をゼロに設定にしてしまうと組込性の問題が発生する。以下に例を示す。 As the operating speed of an electronic device such as a mobile phone CPU (Central Processing Unit) increases, high-frequency electromagnetic noise circulates to the reception band via each antenna in the mobile phone due to radiation or interferes with the received signal. There is a risk of doing so. In order to suppress radiation of the electromagnetic noise, a mounting shield that shields the periphery of the CPU and an embedded cover shield that covers the mounting shield are combined and incorporated as a shield. However, the mounting shield is opened to apply the resin to prevent destruction of the CPU, and in addition, there is a design tolerance between the mounting shield and the built-in cover shield. The radiation of can not be suppressed reliably. Then, if the tolerance is set to zero in order to ensure conduction, a problem of incorporation will occur. An example is shown below.
図２２から図２６を参照して、実装用シールドと組込用カバーシールドとの実装方法について説明する。図２２は、電子素子、例えばＣＰＵ１００を搭載した基板を示している。図２３は、ＣＰＵ１００を搭載した基板上の実装用シールド１０１を示している。図２４は、実装用シールドに、組込用カバーシールド１０２−１を被せた状態を示している。図２５は、図２４のＣ−Ｃ直線における破断面を示す図であり、ＣＰＵ及び基板を省略している。図２６は、寸法公差を設けていない場合の組込用カバーシールド１０２−２の破断面を示す図である。
With reference to FIGS. 22 to 26, a mounting method of the mounting shield and the built-in cover shield will be described. FIG. 22 shows a substrate on which an electronic element, for example, the
まず、図２２に示すように、ＣＰＵ１００を基板上に搭載し、図２３に示すように、実装用シールド１０１が半田付けで実装され、実装用シールド１０１とＣＰＵ１００との間に破壊防止の樹脂塗布が成される。そして、図２４に示すように、実装用シールド１０１に、組込用カバーシールド１０２−１が組み込まれるが、図２５に示すように、両シールドの間には隙間ｘがある。図２５におけるｘは寸法公差であり、実装用シールド１０１に、組込用カバーシールド１０２−１を実装する際には必須の寸法である。この寸法公差があるため、組込用カバーシールド１０２−１と、実装用シールド１０１との間で確実に導電できない。しかし、図２６に示すように、寸法公差を無くした場合には、実装用シールド１０１に組込用カバーシールド１０２−２を組み込むことができない。
First, as shown in FIG. 22, the
特許文献１に示した発明では、実装用シールドに組込用カバーシールドを組み合わせる構成としているが、バネ性を持つ側板部は、内側に膨出する膨出部を加工する必要がある。また、基板に実装される部品を交換するために、実装用シールドを部品のサイズに合わせて設けてあり、組込用カバーシールドと組み合わせても確実なシールドができないという課題があった。 In the invention shown in Patent Document 1, the mounting cover shield is combined with the mounting shield. However, the side plate portion having the spring property needs to process the bulging portion that bulges inward. Further, in order to replace the component mounted on the substrate, a mounting shield is provided in accordance with the size of the component, and there is a problem that a reliable shield cannot be achieved even when combined with the built-in cover shield.
そこで、本発明では、容易かつ確実に電磁波ノイズの輻射を抑え、かつ組込性を向上させることができる組込用カバーシールド、シールド構造及び組込用カバーシールドの実装方法を提供することを目的とする。 Accordingly, an object of the present invention is to provide a built-in cover shield, a shield structure, and a mounting method for a built-in cover shield that can easily and reliably suppress radiation of electromagnetic wave noise and improve the built-in property. And
上記目的を達成するために、本発明の組込用カバーシールドは、弾性のある導電体で構成され、天面の対向面は開口されており、前記天面に対する４側面のうち、少なくとも２面は前記天面に垂直で、前記天面に対する４側面のうち、前記天面に垂直な２側面に対向する２側面は前記天面に対して、隣接する２面が内曲げとなる構造を有する。 In order to achieve the above object, the built-in cover shield of the present invention is made of an elastic conductor, the opposing surface of the top surface is open, and at least two of the four side surfaces with respect to the top surface. Is perpendicular to the top surface, and of the four side surfaces with respect to the top surface, two side surfaces opposite to the two side surfaces perpendicular to the top surface have a structure in which two adjacent surfaces are inwardly bent with respect to the top surface. .
上記目的を達成するために、本発明のシールド構造は、導電体で構成され、両面が開口しており、開口に垂直な側面で囲まれた実装用シールドと、弾性のある導電体で構成され、天面の対向面は開口しており、前記天面に対する４側面のうち、少なくとも２面は前記天面に垂直で、前記天面に対する４側面のうち、前記天面に垂直な２側面に対向する２側面は前記天面に対して弾性のある内曲げとなる構造を有する組込用カバーシールドとを備え前記実装用シールドに前記組込用カバーシールドを嵌め込む場合、前記組込用カバーシールドの前記内曲げとなる内曲２側面に対抗する対抗２側面と、前記対抗２側面が接触する前記実装用シールドの前記側面との間に生じる寸法公差を、前記内曲げの弾性で前記寸法公差分の隙間を埋めることを特徴とする。 In order to achieve the above object, the shield structure of the present invention is composed of a conductor, both surfaces are open, and is composed of a mounting shield surrounded by a side surface perpendicular to the opening, and an elastic conductor. The opposite surface of the top surface is open, and at least two of the four side surfaces with respect to the top surface are perpendicular to the top surface, and among the four side surfaces with respect to the top surface, the two side surfaces are perpendicular to the top surface. When the two opposing side surfaces are provided with a built-in cover shield having an inward bending structure that is elastic with respect to the top surface, when the built-in cover shield is fitted into the mounting shield, the built-in cover The dimension tolerance generated between the opposing two side surfaces that oppose the two inner curved side surfaces that are the inner bending of the shield and the side surface of the mounting shield that contacts the opposing two side surfaces is determined by the elasticity of the inner bending. To fill the gap It shall be the butterfly.
また、上記目的を達成するために、本発明の組込用カバーシールドの実装方法は、弾性のある導電体で構成され、天面の対向面は開口しており、前記天面に対する４側面のうち、少なくとも２面は前記天面に垂直で、前記天面に対する４側面のうち、前記天面に垂直な２側面に対向する２側面は前記天面に対して弾性のある内曲げとなる構造を有する組込用カバーシールドを、導電体で構成され、両面が開口しており、開口に垂直な側面で囲まれた実装用シールドに嵌め込む際に、前記組込用カバーシールドの前記内曲げとなっている側面の内側が、前記実装用シールドの前記側面の外側に接触するように押し当てて、前記組込用カバーシールドを接触した側面と反対方向に移動させた後、前記実装用シールドに嵌合するように前記組込用カバーシールドを、前記内曲げとなる内曲２側面に対抗する対抗２側面と、前記対抗２側面が接触する前記実装用シールドの前記側面との間に生じる寸法公差を、前記内曲げの弾性で前記寸法公差分の隙間を埋めて嵌め込む。 Further, in order to achieve the above object, the mounting cover shield mounting method of the present invention is made of an elastic conductor, the top surface is opposed to the top surface, and the four side surfaces with respect to the top surface are open. Among them, at least two surfaces are perpendicular to the top surface, and of the four side surfaces with respect to the top surface, two side surfaces opposite to the two side surfaces perpendicular to the top surface are inwardly bent with respect to the top surface. The built-in cover shield is made of a conductor, has both sides opened, and is fitted into the mounting shield surrounded by the side surface perpendicular to the opening, the inward bending of the built-in cover shield The mounting shield is moved so that the inner side of the side surface is in contact with the outer side of the side surface of the mounting shield and the mounting cover shield is moved in the direction opposite to the side surface in contact with the mounting shield. The built-in cable The chromatography shield, and counter 2 side against reentrant two sides to be bend in the, dimensional tolerances occurring between the side surface of the mounting shield the counter 2 side are in contact, said an elastic bending in the Fit the gap of the dimensional tolerance .
本発明によれば、容易かつ確実に電磁波ノイズの輻射を抑え、かつ組込性を向上させることができる。 According to the present invention, radiation of electromagnetic wave noise can be easily and reliably suppressed, and the incorporation property can be improved.
添付の図面を参照して本発明の実施形態を説明する。以下に説明する実施形態は本発明の実施の例であり、本発明は、以下の実施の例に制限されるものではない。なお、本明細書及び図面において符号が同じ構成要素は、相互に同一のものを示すものとする。 Embodiments of the present invention will be described with reference to the accompanying drawings. Embodiment described below is an example of implementation of this invention, and this invention is not restrict | limited to the following example of implementation. In the present specification and drawings, the same reference numerals denote the same components.
まず、図１、図２及び図３を参照して、本発明のシールド構造の構成を説明する。図１は、本発明のシールド構造の構成の概略図であり、組込用カバーシールドの天面と対向する開口側から見た図である。図２は、図１のＡ−Ａ線における破断面を示す図であり、天面を上方として示している。図３は、本発明のシールド構造の構成の概略図であり、組込用カバーシールドの天面から見た透視図である。図１において、本発明のシールド構造は、導電体で構成され、両面が開口しており、開口に垂直な側面１６−１で囲まれた実装用シールドと、弾性のある導電体で構成され、天面１０−１の対向面は開口しており、天面１０−１に対する側面１１−１のうち、少なくとも１面は天面１０−１に垂直で、天面１０−１に対する側面１１−１のうち、天面１０−１に垂直な側面１１−１に対向する側面１２−１は天面１０−１に対して内曲げとなる構造を有する組込用カバーシールドとを備える。 First, the configuration of the shield structure of the present invention will be described with reference to FIG. 1, FIG. 2, and FIG. FIG. 1 is a schematic view of the configuration of the shield structure of the present invention, as viewed from the opening side facing the top surface of the built-in cover shield. FIG. 2 is a diagram showing a fracture surface taken along the line AA in FIG. FIG. 3 is a schematic view of the configuration of the shield structure according to the present invention, and is a perspective view seen from the top surface of the built-in cover shield. In FIG. 1, the shield structure of the present invention is composed of a conductor, both surfaces are open, and is composed of a mounting shield surrounded by a side surface 16-1 perpendicular to the opening, and an elastic conductor, The opposing surface of the top surface 10-1 is open, and at least one of the side surfaces 11-1 with respect to the top surface 10-1 is perpendicular to the top surface 10-1, and the side surface 11-1 with respect to the top surface 10-1. Of these, the side surface 12-1 facing the side surface 11-1 perpendicular to the top surface 10-1 includes an embedded cover shield having a structure that is bent inward with respect to the top surface 10-1.
組込用カバーシールドの天面１０−１及び側面１１−１は、導電体で構成された平面である。側面１１−１は、隣接する面で、それぞれ天面１０−１に対して垂直な面である。内曲げした側面１２−１は、隣接する２面で、それぞれ天面に対して内曲げの面である。実装用シールドの開口に垂直な側面１６−１は、基板上に半田付けされて実装され、基板上の素子、例えばＣＰＵを囲い、発生する電磁波ノイズの輻射の影響を抑える。図２に示すように、組込用カバーシールドが実装用シールドを覆うことで、実装用シールドの側面１６−１と、組込用カバーシールドの内曲げされた側面１２−１とが導通する。さらに、側面１１−１は、内曲げされた側面１２−１の弾性力によって、実装用シールドの側面１６−１に押し付けられて導通する。図３に示すように、隣接する２面を垂直、隣接する２面を内曲げとしているため、実装用シールドの側面１６−１と、組込用カバーシールドの側面１１−１とを、内曲げされた側面１２−１の弾性を利用して導通させることができる。なお、実装用シールドの形状は、図１、図２及び図３に示した形状に限られず、例えば、天面を塞いだ形状であってもよい。 The top surface 10-1 and the side surface 11-1 of the built-in cover shield are flat surfaces made of a conductor. The side surface 11-1 is an adjacent surface and is a surface perpendicular to the top surface 10-1. The inwardly bent side surfaces 12-1 are two adjacent surfaces, which are inwardly bent with respect to the top surface. The side surface 16-1 perpendicular to the opening of the mounting shield is soldered and mounted on the substrate, surrounds an element on the substrate, for example, a CPU, and suppresses the influence of generated electromagnetic noise. As shown in FIG. 2, the mounting cover shield covers the mounting shield, whereby the side surface 16-1 of the mounting shield and the side surface 12-1 bent inward of the mounting cover shield are electrically connected. Further, the side surface 11-1 is pressed against the side surface 16-1 of the mounting shield by the elastic force of the inwardly bent side surface 12-1, and becomes conductive. As shown in FIG. 3, since the two adjacent surfaces are vertical and the two adjacent surfaces are inwardly bent, the side surface 16-1 of the mounting shield and the side surface 11-1 of the built-in cover shield are inwardly bent. It is possible to conduct using the elasticity of the side surface 12-1. The shape of the mounting shield is not limited to the shape shown in FIGS. 1, 2, and 3, and may be a shape that closes the top surface, for example.
以上のように構成することで、本発明のシールド構造は、容易かつ確実に電磁波ノイズの輻射を抑え、かつ組込性を向上させることができる。 By comprising as mentioned above, the shield structure of this invention can suppress radiation of electromagnetic wave noise easily and reliably, and can improve incorporating property.
また、図１に示すように、内曲げとなっている側面１２−１が隣接する側面１１−１との間に切込み１３−１を有してもよい。隣接する側面１１−１との間に切込み１３−１によって、内曲げされた側面１２−１及び隣接する側面１１−１が独立する。よって、内曲げされた側面１２−１の弾性力が有効に働き、実装用シールドの側面１６−１と組込用カバーシールドの側面１１−１との導通及び実装用シールドの側面１６−１と組込用カバーシールドの内曲げされた側面１２−１と導通を確実にでき、かつ組込性を向上させることができる。 Moreover, as shown in FIG. 1, you may have the notch | incision 13-1 between the side surface 11-1 which the side surface 12-1 used as an internal bending adjoins. The inwardly bent side surface 12-1 and the adjacent side surface 11-1 are independent by the notch 13-1 between the adjacent side surface 11-1. Therefore, the elastic force of the inwardly bent side surface 12-1 works effectively, and the connection between the side surface 16-1 of the mounting shield and the side surface 11-1 of the mounting cover shield and the side surface 16-1 of the mounting shield It is possible to ensure conduction with the side surface 12-1 bent inward of the cover shield for incorporation, and to improve the assemblability.
次に、図４から図７を参照して、本発明の組込用カバーシールドの実装方法を説明する。図４から図７は、本発明の組込用カバーシールドの実装方法の手順を示す概略図である。なお、図１におけるＡ−Ａ直線における破断面を示す図を図７とし、図４から順に、組込用カバーシールドを実装用シールドに組み込む手順を追って示している。まず、図４に示すように、組込用カバーシールドは、弾性のある導電体で構成され、天面１０−２の対向面は開口しており、天面１０−２に対する側面１１−２のうち、少なくとも１面は天面１０−２に垂直で、天面１０−２に対する側面１１−２のうち、天面１０−２に垂直な側面１１−２に対向する側面１２−２は天面１０−２に対して内曲げとなる構造を有する。実装用シールドは、導電体で構成され、両面が開口しており、開口に垂直な側面１６−２に囲まれている。そして、組込用カバーシールドを実装用シールドに嵌め込む際に、図５に示すように、組込用カバーシールドの内曲げとなっている側面１２−２の内側が、実装用シールドの側面１６−２の外側に接触するように押し当てる。内曲げになっている側面１２−２を、組み込む際に外側に広げながら、実装用シールドに被せる。この時点では、図６に示すように、実装用シールドの側面１６−２と、組込用カバーシールドの側面１１−２との間には、寸法公差分の隙間がある。さらに、図７に示すように、組込用カバーシールドを接触した側面１６−２と反対方向に移動させた後、実装用シールドに嵌合するように組込用カバーシールドを嵌め込む。内曲げとなっている組込用カバーシールドの側面１２−２が、弾性変形することで、実装用シールドの側面１６−２の外側に、組込用カバーシールドの側面１１−２が押し当てられる。これにより、寸法公差分の隙間が埋まり、組込用カバーシールドと、実装用シールドとが導通する。 Next, with reference to FIG. 4 to FIG. 7, the mounting method of the cover shield for incorporation of the present invention will be described. 4 to 7 are schematic views showing the procedure of the mounting method of the built-in cover shield according to the present invention. FIG. 7 is a diagram showing a fractured surface along the line AA in FIG. 1, and the procedure for incorporating the mounting cover shield into the mounting shield is shown in order from FIG. First, as shown in FIG. 4, the built-in cover shield is made of an elastic conductor, the surface facing the top surface 10-2 is open, and the side surface 11-2 with respect to the top surface 10-2 is open. Among them, at least one surface is perpendicular to the top surface 10-2, and of the side surface 11-2 with respect to the top surface 10-2, the side surface 12-2 facing the side surface 11-2 perpendicular to the top surface 10-2 is the top surface. 10-2 has an internal bending structure. The mounting shield is made of a conductor, has both sides opened, and is surrounded by a side surface 16-2 perpendicular to the opening. When the built-in cover shield is fitted into the mounting shield, as shown in FIG. 5, the inner side of the side surface 12-2 that is the inward bending of the built-in cover shield is the side surface 16 of the mounting shield. -2 Press against the outside. The side surface 12-2 that is bent inward is covered with the mounting shield while being spread outward when being assembled. At this time, as shown in FIG. 6, there is a dimensional tolerance gap between the side surface 16-2 of the mounting shield and the side surface 11-2 of the built-in cover shield. Further, as shown in FIG. 7, after moving the built-in cover shield in the direction opposite to the side surface 16-2 in contact, the built-in cover shield is fitted so as to be fitted to the mounting shield. The side surface 12-2 of the built-in cover shield is pressed against the outside of the side surface 16-2 of the mounting shield by elastically deforming the side surface 12-2 of the built-in cover shield that is inwardly bent. . As a result, the gap of the dimensional tolerance is filled, and the built-in cover shield and the mounting shield are conducted.
以上の手順を実行することで、本発明の組込用カバーシールドを、容易かつ確実に組み込むことができ、電磁波ノイズの輻射を抑えることができる。 By executing the above procedure, the built-in cover shield of the present invention can be easily and reliably incorporated, and radiation of electromagnetic noise can be suppressed.
また、図１、図３、図８及び図９を参照して、本発明のシールド構造の実施形態を示す。図８は、本発明のシールド構造の実施形態を示す概略図である。図９は、本発明のシールド構造の実施形態を示す平面図であり、天面から見た透視図である。図１に示す隣接する２つの側面１１−１の延長面に交わる稜線１４−１に、図８に示す面取り１５−１が設けられてもよい。また、実装用シールドは、図１に示す隣接する２つの側面１６−１の延長面の交わる稜線１７−１のうち、図８に示す組込用カバーシールドの面取り１５−１されている部分に対応する、図１に示す稜線１７−１に、図８に示す面取り１８−１が設けられてもよい。図１に示す稜線１４−１は、側面１１−１が隣接している場合、延長面が交わった際にできる直線である。同様に、稜線１７−１は、側面１６−１が隣接している場合、延長面が交わった際にできる直線である。図８における面取り１５−１又は面取り１８−１とは、図１に示す稜線１４−１及び稜線１７−１を、ある角度で切断した形状とすることである。角度は例えば、４５度である。組込用カバーシールドの面取り１５−１を実装用シールドの面取り１８−１の向きに配置すれば、組込用カバーシールドを、向きを違えることなく組み込むことができ、組込性を向上させることができる。 Moreover, with reference to FIG.1, FIG.3, FIG.8 and FIG. 9, embodiment of the shield structure of this invention is shown. FIG. 8 is a schematic view showing an embodiment of the shield structure of the present invention. FIG. 9 is a plan view showing an embodiment of the shield structure of the present invention, and is a perspective view seen from the top surface. The chamfer 15-1 shown in FIG. 8 may be provided on the ridge line 14-1 that intersects with the extended surfaces of the two adjacent side surfaces 11-1 shown in FIG. Further, the mounting shield is formed on the chamfered portion 15-1 of the built-in cover shield shown in FIG. 8 in the ridge line 17-1 where the extended surfaces of the two adjacent side surfaces 16-1 shown in FIG. 1 intersect. A corresponding chamfer 18-1 shown in FIG. 8 may be provided on the ridge line 17-1 shown in FIG. The ridge line 14-1 shown in FIG. 1 is a straight line formed when the extended surfaces intersect when the side surface 11-1 is adjacent. Similarly, the ridge line 17-1 is a straight line formed when the extended surfaces intersect when the side surface 16-1 is adjacent. The chamfer 15-1 or the chamfer 18-1 in FIG. 8 is a shape obtained by cutting the ridge line 14-1 and the ridge line 17-1 shown in FIG. 1 at a certain angle. The angle is 45 degrees, for example. If the chamfering 15-1 of the built-in cover shield is arranged in the direction of the chamfering 18-1 of the mounting shield, the built-in cover shield can be incorporated without changing the direction, and the assemblability is improved. Can do.
次に、図１０から図１３を参照して、本発明の組込用カバーシールドの実装方法の実施形態を説明する。図１０から図１３は、本発明の組込用カバーシールドの実装方法の手順を示した概略図である。なお、図８のＢ−Ｂ直線における断面図を図１３とし、図１０から順に、組込用カバーシールドを実装用シールドに組み込む手順を追って示している。まず、図１０において、組込用カバーシールドは、弾性のある導電体で構成され、天面１０−３の対向面は開口しており、天面１０−３に対する側面１１−３のうち、少なくとも１面は天面１０−３に垂直で、天面１０−３に対する側面１１−３のうち、天面１０−３に垂直な側面１１−３に対向する側面１２−３は天面に対して内曲げとなる構造を有し、隣接する２つの側面１１−３の延長面に交わる稜線が面取り１５−１されている。そして、実装用シールドは、導電体で構成され、両面が開口しており、開口に垂直な側面１６―３で囲まれ、隣接する２つの側面１６−３の延長面の交わる稜線のうち、組込用カバーシールドの面取り１５−１が設けられている部分に対応する稜線が面取り１８−１されている。組込用カバーシールドを実装用シールドに嵌め込む際に、実装用シールドの面取り１８−１されている部分と組込用カバーシールドの面取り１５−１を設けている部分とが対応するように、組込用カバーシールドを配置する。次に、図１１において、組込用カバーシールドの内曲げとなっている側面１２−３の内側が、実装用シールドの側面１６−３の外側に接触するように押し当てながら、最初に実装用シールドの面取り１８−１と、組込用カバーシールドの面取り１５−１とを嵌合させる。 Next, with reference to FIGS. 10 to 13, an embodiment of the mounting method for the cover shield for incorporation of the present invention will be described. FIG. 10 to FIG. 13 are schematic views showing the procedure of the mounting method for the built-in cover shield of the present invention. FIG. 13 is a cross-sectional view taken along the line B-B in FIG. 8, and the procedure for incorporating the mounting cover shield into the mounting shield is shown in order from FIG. 10. First, in FIG. 10, the built-in cover shield is made of an elastic conductor, the facing surface of the top surface 10-3 is open, and at least of the side surface 11-3 with respect to the top surface 10-3. One surface is perpendicular to the top surface 10-3, and of the side surface 11-3 with respect to the top surface 10-3, the side surface 12-3 facing the side surface 11-3 perpendicular to the top surface 10-3 is A ridge line that has an internal bending structure and intersects the extended surfaces of two adjacent side surfaces 11-3 is chamfered 15-1. The mounting shield is made of a conductor, has both sides open, is surrounded by a side surface 16-3 perpendicular to the opening, and is a set of ridge lines that intersect the extended surfaces of two adjacent side surfaces 16-3. A ridge line corresponding to a portion where the chamfer 15-1 of the cover cover is provided is chamfered 18-1. When fitting the built-in cover shield into the mounting shield, the portion where the chamfering 18-1 of the mounting shield corresponds to the portion where the chamfering 15-1 of the mounting cover shield is provided. Install the cover shield for installation. Next, in FIG. 11, the inner side of the side surface 12-3 which is the inward bending of the built-in cover shield is pressed so as to come into contact with the outer side of the side surface 16-3 of the mounting shield. The chamfer 18-1 of the shield and the chamfer 15-1 of the built-in cover shield are fitted.
そして、図１２に示すように、内曲げになっている側面１２−３を、組み込む際に外側に広げたまま、実装用シールドに被せる。この時点では、実装用シールドの側面１６−３と、組込用カバーシールドの側面１１−３との間には、寸法公差分の隙間がある。さらに、図１３に示すように、組込用カバーシールドを接触した側面１６−３と反対方向に移動させた後、実装用シールドに嵌合するように組込用カバーシールドを嵌め込む。移動は組込用カバーシールドの側面１２−３の弾性を利用してもよい。内曲げとなっている組込用カバーシールドの側面１２−３の、弾性変形が元に戻ることで、実装用シールドの側面１６−３の外側に、組込用カバーシールドの側面１１−３が押し当てられる。これにより、寸法公差分の隙間が埋まり、組込用カバーシールドと、実装用シールドとが導通する。以上の手順を実行することで、実装用シールドの面取り１８−１及び組込用カバーシールドの面取り１５−１を、組み込み時のガイドとして使用し、組込用カバーシールドの面取り１５−１を、実装用シールドの面取り１８−１の向きに配置すれば、向きを違えることなく組み込むことができ、組込性を向上させることができる。 Then, as shown in FIG. 12, the side surface 12-3 that is bent inward is covered with the mounting shield while being spread outward when assembled. At this time, there is a dimensional tolerance gap between the side surface 16-3 of the mounting shield and the side surface 11-3 of the built-in cover shield. Further, as shown in FIG. 13, after moving the built-in cover shield in the direction opposite to the side surface 16-3 in contact, the built-in cover shield is fitted so as to be fitted to the mounting shield. The movement may use the elasticity of the side surface 12-3 of the built-in cover shield. When the elastic deformation of the side surface 12-3 of the built-in cover shield that is bent inward is restored, the side surface 11-3 of the built-in cover shield is located outside the side surface 16-3 of the mounting shield. Pressed. As a result, the gap of the dimensional tolerance is filled, and the built-in cover shield and the mounting shield are conducted. By performing the above procedure, the chamfering 18-1 of the mounting shield and the chamfering 15-1 of the cover shield for assembly are used as a guide at the time of assembly, and the chamfer 15-1 of the cover shield for assembly is If it arrange | positions in the direction of the chamfering 18-1 of the mounting shield, it can be integrated without changing the direction, and the installation property can be improved.
次に、図１４から図１７を参照して、本発明の組込用カバーシールドの実施形態の構成を説明する。図１４及び図１７は、本発明の組込用カバーシールドの実施形態の構成の概略図である。なお、図１５及び図１７は、組込用カバーシールドの天面側から見た透視図である。図１４に示すように、天面１０−４の開口側の少なくとも一部に絶縁体１９−１を有してもよい。絶縁体１９−１は、例えば、組込用カバーシールドに貼付された絶縁テープである。具体的には、図１５に示すように、絶縁体１９−１は、組込用カバーシールドの開口部側に存在する電子素子２３−１、例えばＣＰＵを、組込用カバーシールドに直接接触しないようにすることで、短絡を防ぐことができる。また、図１６に示すように、実装用シールドの面取り１８−２と、組込用カバーシールドの面取り１５−２とを、組み込み時のガイドとして使用してもよい。図１７に示すように、組込用カバーシールドの面取り１５−２を、実装用シールドの面取り１８−２の向きに配置すれば、向きを違えることなく組み込むことができ、組込性を向上させつつ、絶縁体１９−２を確実に機能させることができる。 Next, with reference to FIG. 14 to FIG. 17, the configuration of the embodiment of the built-in cover shield of the present invention will be described. 14 and 17 are schematic views of the configuration of the embodiment of the built-in cover shield of the present invention. 15 and 17 are perspective views seen from the top side of the built-in cover shield. As shown in FIG. 14, you may have the insulator 19-1 in at least one part of the opening side of the top | upper surface 10-4. The insulator 19-1 is, for example, an insulating tape attached to a built-in cover shield. Specifically, as shown in FIG. 15, the insulator 19-1 does not directly contact the electronic element 23-1, for example, the CPU existing on the opening side of the built-in cover shield, with the built-in cover shield. By doing so, a short circuit can be prevented. Further, as shown in FIG. 16, the chamfering 18-2 of the mounting shield and the chamfering 15-2 of the cover shield for assembly may be used as a guide during assembly. As shown in FIG. 17, if the chamfering 15-2 of the mounting cover shield is arranged in the direction of the chamfering 18-2 of the mounting shield, it can be assembled without changing the direction, and the mounting property is improved. In addition, the insulator 19-2 can function reliably.
次に、図１８を参照して、本発明の組込用カバーシールドの構成を説明する。図１８は、本発明の組込用カバーシールドの構成の概略図であり、天面と対向する開口側から見た図である。図１８において、本発明の組込用カバーシールドは、弾性のある導電体で構成され、天面１０−６の対向面は開口されている。天面１０−６に対する側面１１−６のうち、少なくとも１面は天面１０−６に垂直で、天面１０−６に対する側面１１−６のうち、天面１０−６に垂直な側面１１−６に対向する側面１２−６は天面１０−６に対して内曲げとなる。組込用カバーシールドの天面１０−６及び側面１１−６は、導電体で構成された平面である。側面１１−６は、隣接する面で、それぞれ天面１０−６に対して垂直な面である。内曲げした側面１２−６は、隣接する２面で、それぞれ天面に対して内曲げの面である。隣接する２面を垂直、隣接する２面を内曲げとしているため、内曲げされた側面１２−６は、実装用シールドの側面に接触することで、弾性を利用して側面１１−６を実装用シールドの側面に接触させて導通させる。側面１１−６と実装用シールドとの間には寸法公差の隙間があるが、内曲げされた側面１２−６の弾性力により、寸法公差の隙間を埋めることができる。なお、実装用シールドの形状は、例えば、天面を塞いだ形状であってもよい。組込用カバーシールドが実装用シールドを覆うことで、実装用シールドの側面と、組込用カバーシールドの内曲げされた側面１２−６とが導通する。さらに、側面１１−６は、内曲げされた側面１２−６の弾性力によって、実装用シールドの側面に押し付けられて導通する。 Next, with reference to FIG. 18, the structure of the built-in cover shield of this invention is demonstrated. FIG. 18 is a schematic view of the configuration of the built-in cover shield of the present invention, as viewed from the opening side facing the top surface. In FIG. 18, the built-in cover shield of the present invention is made of an elastic conductor, and the surface facing the top surface 10-6 is opened. At least one of the side surfaces 11-6 with respect to the top surface 10-6 is perpendicular to the top surface 10-6, and among the side surfaces 11-6 with respect to the top surface 10-6, the side surface 11- perpendicular to the top surface 10-6. 6 is inwardly bent with respect to the top surface 10-6. The top surface 10-6 and the side surface 11-6 of the built-in cover shield are flat surfaces made of a conductor. The side surface 11-6 is an adjacent surface and is a surface perpendicular to the top surface 10-6. Inwardly bent side surfaces 12-6 are two adjacent surfaces, which are inwardly bent with respect to the top surface. Since the two adjacent surfaces are vertical and the two adjacent surfaces are inwardly bent, the side surface 12-6 bent inward is in contact with the side surface of the mounting shield, and the side surface 11-6 is mounted using elasticity. Contact with the side of the shield for electrical conduction. Although there is a dimensional tolerance gap between the side surface 11-6 and the mounting shield, the dimensional tolerance gap can be filled by the elastic force of the inwardly bent side surface 12-6. The shape of the mounting shield may be, for example, a shape that covers the top surface. When the built-in cover shield covers the mounting shield, the side surface of the mounting shield and the side surface 12-6 bent inward of the built-in cover shield become conductive. Further, the side surface 11-6 is pressed against the side surface of the mounting shield by the elastic force of the inwardly bent side surface 12-6 to conduct.
以上のように構成することで、本発明のシールド構造は、容易かつ確実に電磁波ノイズの輻射を抑え、かつ組込性を向上させることができる。 By comprising as mentioned above, the shield structure of this invention can suppress radiation of electromagnetic wave noise easily and reliably, and can improve incorporating property.
次に、図１８及び図１９を参照して、本発明の組込用カバーシールドの実施形態の構成を説明する。図１９は、本発明の組込用カバーシールドの実施形態の構成の概略図であり、天面と対向する開口側から見た図である。ここで、内曲げとなっている側面１２−７が隣接する側面１１−７との間に切込み１３−６を有してもよい。本発明の組込用カバーシールドの弾性力が有効に働き、実装用シールドの側面と組込用カバーシールドの側面１１−７との導通及び実装用シールドの側面と組込用カバーシールドの側面１２−７と導通を確実にでき、組込性を向上させることができる。ここで、図１８に示す隣接する２つの側面１１−７の延長面に交わる稜線１４−３に、図１９に示すように面取り１５−３を設けてもよい。図１８に示す稜線１４−３は、側面１１−６が隣接している場合、延長面が交わった際にできる直線である。図１９に示す面取り１５−３とは、図１８に示す稜線１４−３を、ある角度で切断した形状とすることである。角度は例えば４５度である。 Next, with reference to FIG.18 and FIG.19, the structure of embodiment of the built-in cover shield of this invention is demonstrated. FIG. 19 is a schematic view of the configuration of the embodiment of the built-in cover shield of the present invention, as viewed from the opening side facing the top surface. Here, the side surface 12-7 that is inwardly bent may have a cut 13-6 between the adjacent side surface 11-7. The elastic force of the built-in cover shield of the present invention works effectively, the conduction between the side surface of the mounting shield and the side surface 11-7 of the mounting cover shield, and the side surface of the mounting shield and the side surface 12 of the mounting cover shield. It is possible to ensure electrical connection with -7 and improve the incorporation. Here, as shown in FIG. 19, a chamfer 15-3 may be provided on the ridge line 14-3 that intersects the extended surfaces of the two adjacent side surfaces 11-7 shown in FIG. 18. A ridge line 14-3 shown in FIG. 18 is a straight line formed when the extended surfaces intersect when the side surfaces 11-6 are adjacent to each other. The chamfer 15-3 shown in FIG. 19 is a shape obtained by cutting the ridge line 14-3 shown in FIG. 18 at a certain angle. The angle is, for example, 45 degrees.
以上説明したように、本発明の組込用カバーシールドについて、面取り１５−１を基準の向きに配置すれば、向きを違えることなく組み込むことができ、組込性を向上させることができる。 As described above, the built-in cover shield of the present invention can be incorporated without changing the orientation if the chamfer 15-1 is arranged in the reference direction, and the incorporation property can be improved.
次に、図２０及び図２１を参照して、本発明の組込用カバーシールドの実施形態の構成を説明する。図２０及び図２１は、本発明の組込用カバーシールドの実施形態の構成の概略図であり、天面と対向する開口側から見た図である。図２０に示すように、天面の開口側の少なくとも一部に絶縁体１９−３を有してもよい。絶縁体１９−３は、例えば、組込用カバーシールドに貼付された絶縁テープである。組込用カバーシールドが覆う基板上の素子、例えばＣＰＵが組込用カバーシールドに接触して短絡しないようにできる。また、図２１に示すように、組込用カバーシールドの面取り１５−４を、組み込み時のガイドとして使用してもよい。実装用シールドの面取りを組込用カバーシールドの面取り１５−４の向きに配置すれば、向きを違えることなく組み込むことができ、組込性を向上させつつ、絶縁体１９−４を確実に機能させることができる。 Next, with reference to FIG.20 and FIG.21, the structure of embodiment of the built-in cover shield of this invention is demonstrated. 20 and 21 are schematic views of the configuration of the embodiment of the built-in cover shield of the present invention, as viewed from the opening side facing the top surface. As shown in FIG. 20, you may have the insulator 19-3 in at least one part of the opening side of a top | upper surface. The insulator 19-3 is, for example, an insulating tape attached to a built-in cover shield. It is possible to prevent an element on the substrate covered by the built-in cover shield, for example, a CPU, from coming into contact with the built-in cover shield and short-circuiting. Further, as shown in FIG. 21, a chamfer 15-4 of the cover shield for incorporation may be used as a guide at the time of assembly. If the chamfering of the mounting shield is arranged in the direction of the chamfering 15-4 of the built-in cover shield, it can be assembled without changing the direction, and the insulator 19-4 functions reliably while improving the assembling property. Can be made.
１０−１，１０−２，１０−３，１０−４，１０−５，１０−６，１０−７，１０−８，１０−９：天面
１１−１，１１−２，１１−３，１１−４，１１−５，１１−６，１１−７，１１−８，１１−９：側面
１２−１，１２−２，１２−３，１２−４，１２−５，１２−６，１２−７，１２−８，１２−９：内曲げした側面
１３−１，１３−２，１３−３，１３−４，１３−５，１３−６，１３−７，１３−８：切込み
１４−１，１４−２，１４−３，１４−４，１４−５，１４−６：稜線
１５−１，１５−２，１５−３，１５−４：面取り
１６−１，１６−２，１６−３，１６−４，１６−５：実装用シールドの側面
１７−１，１７−２：実装用シールドの稜線
１８−１，１８−２：実装用シールドの面取り
１９−１，１９−２，１９−３，１９−４：絶縁体
２３−１，２３−２：電子素子
１００：ＣＰＵ
１０１：実装用シールド
１０２−１，１０２−２：組込用カバーシールド
10-1, 10-2, 10-3, 10-4, 10-5, 10-6, 10-7, 10-8, 10-9: top surfaces 11-1, 11-2, 11-3, 11-4, 11-5, 11-6, 11-7, 11-8, 11-9: Side surfaces 12-1, 12-2, 12-3, 12-4, 12-5, 12-6, 12 -7, 12-8, 12-9: internally bent side surfaces 13-1, 13-2, 13-3, 13-4, 13-5, 13-6, 13-7, 13-8: cut 14- 1, 14-2, 14-3, 14-4, 14-5, 14-6: Ridge lines 15-1, 15-2, 15-3, 15-4: Chamfers 16-1, 16-2, 16- 3, 16-4, 16-5: Mounting shield side surfaces 17-1, 17-2: Mounting shield ridges 18-1, 18-2: Mounting shield chamfers 19-1, 19-2, 19 − , 19-4: insulators 23-1: Electronic device 100: CPU
101: Mounting shield 102-1, 102-2: Built-in cover shield
Claims (6)
両面が開口しており、
開口に垂直な側面で囲まれた実装用シールドと、
弾性のある導電体で構成され、
天面の対向面は開口しており、
前記天面に対する４側面のうち、少なくとも２面は前記天面に垂直で、
前記天面に対する４側面のうち、前記天面に垂直な２側面に対向する２側面は前記天面に対して弾性のある内曲げとなる構造を有する組込用カバーシールドと、を備え
前記実装用シールドに前記組込用カバーシールドを嵌め込む場合、前記組込用カバーシールドの前記内曲げとなる内曲２側面に対抗する対抗２側面と、前記対抗２側面が接触する前記実装用シールドの前記側面との間に生じる寸法公差を、前記内曲げの弾性で前記寸法公差分の隙間を埋める
ことを特徴とするシールド構造。 Composed of conductors,
Both sides are open,
A mounting shield surrounded by a side perpendicular to the opening;
Consists of an elastic conductor,
The opposite surface of the top is open,
Of the four side surfaces with respect to the top surface, at least two surfaces are perpendicular to the top surface,
Of the four side surfaces with respect to the top surface, two side surfaces opposite to the two side surfaces perpendicular to the top surface include a built-in cover shield having a structure that is inwardly bent with respect to the top surface.
When the mounting cover shield is fitted into the mounting shield, the mounting cover shield comes into contact with the opposing two side surfaces facing the inner curved two side surfaces as the inner bend and the opposing two side surfaces. Dimensional tolerance generated between the shield and the side surface is filled with the dimensional tolerance gap by the elasticity of the inner bending.
Shield structure characterized in that.
前記実装用シールドは、隣接する２つの前記側面の延長面の交わる稜線のうち、前記組込用カバーシールドの面取りされている部分に対応する稜線が面取りされていることを特徴とする請求項１又は２に記載のシールド構造。 The built-in cover shield has a chamfered ridgeline where two adjacent side surfaces extend.
The mounting shield of the ridge of intersection of extension plane of two adjacent sides, claim ridge corresponding to chamfered by being part of said set write cover shield, characterized in that it is chamfered 1 Or the shield structure of 2 .
導電体で構成され、両面が開口しており、開口に垂直な側面で囲まれた実装用シールドに嵌め込む際に、
前記組込用カバーシールドの前記内曲げとなっている側面の内側が、前記実装用シールドの前記側面の外側に接触するように押し当てて、
前記組込用カバーシールドを接触した側面と反対方向に移動させた後、前記実装用シールドに嵌合するように前記組込用カバーシールドを、前記内曲げとなる内曲２側面に対抗する対抗２側面と、前記対抗２側面が接触する前記実装用シールドの前記側面との間に生じる寸法公差を、前記内曲げの弾性で前記寸法公差分の隙間を埋めて嵌め込む組込用カバーシールドの実装方法。 It is composed of an elastic conductor, and the surface facing the top surface is open. Of the four side surfaces with respect to the top surface, at least two surfaces are perpendicular to the top surface, and among the four side surfaces with respect to the top surface, An embedded cover shield having a structure in which two side surfaces facing two side surfaces perpendicular to the top surface are inwardly bent with respect to the top surface,
Constructed of a conductor, open on both sides, and when fitted into a mounting shield surrounded by a side surface perpendicular to the opening,
The inside of the side surface that is the inward bending of the built-in cover shield is pressed so as to contact the outside of the side surface of the mounting shield,
After the built-in cover shield is moved in the opposite direction to the side surface in contact with the mounting shield, the built-in cover shield is opposed to the inner curved two side surfaces which are the inward bends so as to be fitted to the mounting shield. The dimensional tolerance generated between the two side surfaces and the side surface of the mounting shield in contact with the two opposing side surfaces is embedded in the embedded cover shield that is fitted by filling the gap of the dimensional tolerance with the elasticity of the inner bend . Implementation method.
導電体で構成され、両面が開口しており、開口に垂直な側面で囲まれ、隣接する２つの前記側面の延長面の交わる稜線のうち、前記組込用カバーシールドの面取りされている部分に対応する稜線が面取りされている実装用シールドに、嵌め込む際に、
前記実装用シールドの前記面取りされている部分と前記組込用カバーシールドの前記面取りされている部分とが対応するように、前記組込用カバーシールドを配置し、
前記組込用カバーシールドの前記内曲げとなっている側面の内側が、前記実装用シールドの前記側面の外側に接触するように押し当てて、
前記組込用カバーシールドを接触した側面と反対方向に移動させた後、前記実装用シールドに嵌合するように前記組込用カバーシールドを、前記内曲げとなる内曲２側面に対抗する対抗２側面と、前記対抗２側面が接触する前記実装用シールドの前記側面との間に生じる寸法公差を、前記内曲げの弾性で前記寸法公差分の隙間を埋めて嵌め込む組込用カバーシールドの実装方法。 It is composed of an elastic conductor, and the surface facing the top surface is open. Of the four side surfaces with respect to the top surface, at least two surfaces are perpendicular to the top surface, and among the four side surfaces with respect to the top surface, The two side surfaces opposite to the two side surfaces perpendicular to the top surface have an internal bending structure that is elastic with respect to the top surface, and the ridgeline where the extension surfaces of the two adjacent side surfaces intersect is chamfered. Cover shield for
It is composed of a conductor, has both sides open, is surrounded by side surfaces perpendicular to the opening, and is a chamfered portion of the built-in cover shield in a ridgeline where two adjacent side surfaces extend. When fitting into a mounting shield whose corresponding ridgeline is chamfered,
Placing the built-in cover shield so that the chamfered portion of the mounting shield corresponds to the chamfered portion of the built-in cover shield;
The inside of the side surface that is the inward bending of the built-in cover shield is pressed so as to contact the outside of the side surface of the mounting shield,
After the built-in cover shield is moved in the opposite direction to the side surface in contact with the mounting shield, the built-in cover shield is opposed to the inner curved two side surfaces which are the inward bends so as to be fitted to the mounting shield. The dimensional tolerance generated between the two side surfaces and the side surface of the mounting shield in contact with the two opposing side surfaces is embedded in the embedded cover shield that is fitted by filling the gap of the dimensional tolerance with the elasticity of the inner bend . Implementation method.
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