JP5638871B2 - Heat flow sensor - Google Patents

Description

  The present invention relates to a planar heat flow sensor used for heat transfer measurement.

  In general, for example, the measurement of the thermal conductivity of a heat insulating material plays an indispensable role in the development of a heat insulating material as a building material.

  This improvement in the accuracy of measurement of thermal conductivity is also desirable for preventing waste of space and resources due to excessive use of the heat insulating material and avoiding waste of energy due to insufficient heat insulation construction.

  The heat insulating material used for such building materials has a thermal conductivity of 0.02 W / k. Since it is around m (average temperature 20 ° c), measurement of thermal conductivity is not easy.

  Even if it is a heat insulating material that is difficult to measure with such a simple substance, it is a building material in which inner and outer wall panel materials are combined in a state that is actually used as a part of a building or in a state close to that state. A heat flow sensor that measures heat insulation performance relatively easily by measuring the heat flux passing between the inner and outer surfaces is known.

  In such a heat flow sensor, a so-called thermopile that integrates thermoelectromotive force and improves measurement accuracy by arranging a plurality of thermocouples in a plane and connecting them in series is used (see, for example, Patent Document 1). ).

  For example, in order to measure the heat insulation performance of building materials of a building, the heat flow sensor is directly inserted into the building material as a measured object in which multiple elements are combined, or the thermopile is connected to the inner and outer surfaces of the building material. The current temperature gradient is measured.

  In such a thermopile, the influence of the conventional heat flow sensor on the temperature distribution on the outer surface of the building material to be measured is suppressed as much as possible so as not to occur.

  In addition, the sensor base material that constitutes the heat flow sensor itself is also configured to reduce the thermal resistance by a glass epoxy resin plate or the like, and the heat flux from the inner and outer surfaces of the object to be measured is highly accurate. It is possible to measure with.

For this reason, even if the object to be measured cannot be decomposed, such as a building material of an existing building, the heat flow can be measured from the outside without damaging the object to be measured.
JP 2004-37097 A

  In such a conventional heat flow sensor, when the thickness of the insulating material constituting the sensor substrate and the material of the metal material of the thermocouple are determined between the thermocouples of each heat flow sensor, In order to measure heat flow with high accuracy, it is advisable to maintain a large temperature difference between measurement representative points located at both ends of each thermocouple so that the thermoelectromotive force is maximized. Yes.

  Generally, when the thermal resistance of the heat flow sensor itself is reduced, the heat flow sensitivity is also reduced.

  That is, when a copper material having a relatively high thermal conductivity is used for one metal material of the thermocouple, heat is transmitted through the copper metal material, and the temperature difference between both side surfaces of the sensor base material is reduced.

  For this reason, if a copper metal material that is electrically connected in series is used for one of the thermocouples, the temperature difference between the measurement representative points located at both ends of the other metal material, such as tongue stantan, shrinks and decreases. There was a problem that the generation efficiency of the thermoelectromotive force was lowered.

  Therefore, the present invention is optimized so as to improve the heat flow sensitivity while maintaining the temperature difference between the measurement representative points located on both sides of the sensor substrate while taking advantage of the thermopile that can connect the thermocouple in series. An object of the present invention is to provide an improved heat flow sensor.

  In order to achieve this object, according to a first aspect of the present invention, a plurality of first and second through holes arranged vertically and horizontally are formed in an insulating sensor substrate, and each of the first and second through holes is formed. The first and second conductive metals made of different metal materials are alternately arranged, and the first conductive metal has a higher thermal conductivity than the second conductive metal, and the sensor It is a heat flow sensor in which the first and second metal connectors disposed in the first and second through holes are connected in series by a plurality of surface metal layers formed on both side surfaces of the substrate.

And, the heat flow cross-sectional area in the plurality of surface metal layers in which heat conduction is performed between the measurement representative points located on both side surfaces of the sensor base material is set to be small at least in one place. Therefore, a heat-resistant transfer part that reduces the amount of heat conduction transmitted through the first conductive metal in the first through hole is provided.

  According to a second aspect of the present invention, in the heat-resistant portion, the peripheral edge of the first through hole formed on at least one of the surface metal layers and connected to the first conductive metal in the first through hole. A first heat receiving / dissipating surface portion formed in the portion and a second through hole peripheral portion where the second conductive metal is connected to the first conductive metal located on the surface side of the second through hole. 2. The heat flow sensor according to claim 1, wherein a heat conduction amount is reduced by reducing a cross-sectional area of the first conductive metal between the heat receiving and radiating surface portion and having a narrow shape in plan view.

  Further, according to a third aspect of the present invention, the surface area of the first heat receiving and radiating surface portion formed on the surface metal layer at the peripheral portion of the first through hole is formed on the surface metal layer of the peripheral portion of the second through hole. 3. The heat flow sensor according to claim 1, wherein the heat flow sensor is formed to be smaller than a surface area of the second heat receiving and radiating surface portion.

  Further, in the present invention, at least one of the surface metal layers is extended toward the vicinity of the first heat receiving and radiating surface portion so as to be integrated with the second heat receiving and radiating surface portion, An extended light receiving and radiating surface portion that expands the heat receiving and radiating area is formed, and a shield that surrounds the first heat receiving and radiating surface portion so as to separate the periphery of the first heat receiving and radiating surface portion from the extended light receiving and radiating surface portion. The heat flow sensor according to any one of claims 1 to 3 provided with a heat groove part is characterized.

  And as for what was described in Claim 5, the said thermal-insulation groove part was extended along the side edge of the said narrow part, the periphery of the said 1st heat receiving / radiating surface part, this extended receiving / radiating surface part, The heat flow sensor according to claim 4, which is configured so as to be separated at equal intervals.

According to the first aspect of the present invention configured as described above, the first and second conductive materials made of different metal materials are formed by the first conductive metal having a higher thermal conductivity than the second conductive metal. between sex metals, be connected in series, the heat flow cross-sectional area of the plurality of surface metal layers are at least any one location, said flame heat transfer portion configured to be smaller, the first The amount of heat conduction transmitted through the first conductive metal in the through hole is reduced.

  For this reason, between each surface metal layer formed in the both sides | surfaces of a sensor base material, there is little heat transfer amount transmitted via this 1st electroconductive metal, and the temperature difference of each surface metal layer can fully be maintained.

  Therefore, the second conductive metal disposed in the second through hole efficiently generates the thermoelectromotive force required for measurement between each surface metal layer, and the measurement accuracy of the thermal conductivity. Can be increased.

  Further, when the plurality of surface metal layers are formed on both side surfaces of the sensor base material by plating, the first and second conductive metals to be paired are formed on each surface metal layer while forming the heat-resistant transfer portion. Can be connected in series, and manufacturing is easy.

  In addition, according to the second aspect of the present invention, the vertical cross-sectional area of the narrow portion contributing to heat transfer of the first and second surface metal layers is set to be small in a plan view, so that the measurement is performed. The amount of heat conduction between the representative point and the peripheral edge of the connection portion of the first metal connector can be reduced.

  For this reason, these narrow portions make it difficult for heat to move between the first and second surface metal layers as a hardly heat transfer portion.

  Therefore, even if it is connected in series using copper having low electrical resistance and good conductivity, it is transmitted between the front and back surfaces of the wiring board via the first metal connector made of copper in the first through hole. Heat conduction can be reduced.

  Therefore, the temperature difference between the front and back first and second surface metal layers is maintained.

  Further, in the present invention, the surface area of the first heat receiving and radiating surface portion formed on the surface metal layer at the peripheral portion of the first through hole is formed on the surface metal layer of the peripheral portion of the second through hole. It is formed to be smaller than the surface area of the second heat receiving / radiating surface portion.

  For this reason, the amount of heat received and radiated on the first heat receiving and radiating surface portion is small, and the temperature difference between the front and back first and second surface metal layers is easily received and radiated from these first heat receiving and radiating surface portions. Therefore, there is little risk of reduction.

  Further, according to a fourth aspect of the present invention, in the surface metal layer, an extended receiving and radiating surface portion extending from the second receiving and radiating surface portion toward the vicinity of the first receiving and radiating surface portion is provided. These are separated by the heat shielding groove provided in the surface metal layer.

  For this reason, even if the extended heat receiving / radiating surface portion is extended to the periphery of the first heat receiving / radiating surface portion in order to increase the heat receiving / radiating area with good arrangement efficiency, the extended heat receiving / radiating surface portion receives heat. The generated heat is shielded by the heat shield groove portion without being transferred to the first heat receiving / radiating surface portion.

  Therefore, the temperature of the measurement representative point provided on the second heat receiving and radiating surface portion can be set as a spatial average of the heat received in a wide range, and the temperature difference between the measurement representative points can be maintained. Accuracy can be improved.

  And as for what was described in Claim 5, the said thermal-insulation groove part was extended along the side edge of the said narrow part, the periphery of the said 1st heat receiving / radiating surface part, this extended receiving / radiating surface part, It is comprised so that between may be isolate | separated at equal intervals.

  For this reason, in any portion of the heat shield groove portion, the interval in the crossing groove direction (direction perpendicular to the longitudinal direction, which is the extending direction of the heat shield groove portion) is equal, and the first metal connector is used to form the first metal connector. 1 The heat flow transmitted between the peripheral edge of the heat receiving / radiating surface portion and the extended light receiving / radiating surface portion can be reduced.

  Therefore, the temperature difference between the measurement representative points is excellent and the measurement accuracy can be improved.

It is a partially expanded perspective view of the surface metal layer formed on each side surface of the omitted sensor base material, showing the main part of the heat flow sensor of the embodiment of the present invention. It is a typical exploded perspective view explaining the connection composition of the surface metal layer formed in the both sides of a sensor base material with the heat flow sensor of an embodiment. It is a typical block diagram which shows an example of the calibration apparatus for exclusive use based on the absolute value method. In embodiment, it is a top view which shows an example of the sensor base material used for the heat flow sensor of FIG. It is a comparative example of embodiment, and is a top view of the heat flow sensor using the sensor base material of FIG. FIG. 6 is a plan view showing a surface on the opposite side of the heat flow sensor of FIG. 5 in a comparative example of the embodiment. It is a top view of the heat flow sensor of Example 1 of an embodiment. It is Example 1 of an embodiment, and is a top view showing the field of the opposite side of the heat flow sensor of Drawing 7. It is a detailed top view explaining the connection between the surface metal layers of the front and back sides by the heat flow sensor of Example 1 of an embodiment. In the heat flow sensor of Example 1 of an embodiment, it is an enlarged top view explaining the composition of the surface metal layer near the 1st terminal. It is a heat flow sensor of Example 1 of an embodiment, and is a sectional view in the position which meets an AA line in Drawing 10. In the heat flow sensor of Example 2 of an embodiment, it is an enlarged top view explaining composition of a surface metal layer near the 1st terminal. It is a heat flow sensor of Example 2 of an embodiment, and is a sectional view in a position which meets a BB line in FIG. Each example of the embodiment is a principle diagram for explaining the case where the law of intermediate metal is applied, (a) is a schematic configuration diagram of a general thermocouple provided in the sensor substrate, ( b) is an equivalent circuit diagram showing the junction temperatures T1 and T2 of the metals A and B in (a), and (c) is a schematic diagram of a thermocouple provided in the sensor substrate of a typical embodiment of the present application. (D) is an equivalent circuit diagram showing the junction temperatures T1 and T2 of the metals A and B in (c), and (e) is the temperature T1 and T3 at both ends of the connection of the third metal C. It is a circuit diagram explaining the rule of the typical intermediate metal equivalent to (d) when it becomes the same temperature T1 = T3.

  Hereinafter, a heat flow sensor according to an embodiment of the present invention will be described with reference to the drawings.

  1 to 13 show a heat flow sensor and a calibration device for measuring thermal conductivity.

  First, the configuration of the heat flow sensor 3 as a comparative example of this embodiment shown in FIGS. 4 to 6 will be described.

  The sensors to be measured 3a, 3b,... Used for the heat flow sensor 3 can individually measure the absolute temperature of the measurement representative point, and output a voltage proportional to a local temperature difference or a temperature gradient. .

  The configuration of the measured sensors 3a and 3b is substantially the same, and will be described in detail mainly using the measured sensor 3a.

  The heat flow sensor 3 uses an insulating wiring board 4 made of epoxy resin as shown in FIG.

  The wiring board 4 has a large number (or a plurality) of first through holes 5 arranged in a matrix in the vertical and horizontal directions and a large number (or a plurality of) second through holes 6 arranged in a matrix in the vertical and horizontal directions. Is formed.

  The multiple (or plural) first through holes 5 include through hole rows 5L1, 5L2, 5L3... 5Li... 5Ln, and through-hole rows 5C1, 5C2, 5C3. And are arranged at equal intervals.

  In addition, a large number (or a plurality of) second through holes 6 include through hole rows 6L1, 6L2, 6L3... 6Li... 6Ln and through hole rows 6C1, 6C2, 6C3. Are arranged at equal intervals.

  The through-hole rows 5L1, 5L2, 5L3 ... 5Li ... 5Ln and the through-hole rows 6L1, 6L2, 6L3 ... 6Li ... 6Ln are alternately arranged, and the through-hole rows 5C1, 5C2 , 5C3... 5Ci... 5Cn and the through-hole rows 6C1, 6C2, 6C3... 6Ci.

  Moreover, the through-hole rows 5L1, 5L2, 5L3... 5Li... 5Ln and the through-hole rows 6L1, 6L2, 6L3. , 5C2, 5C3... 5Ci... 5Cn and the through-hole rows 6C1, 6C2, 6C3... 6Ci.

  For convenience of explanation, an example in which a large number (or a plurality of) first through holes 5 and a large number (or a plurality of) second through holes 6 are formed in a matrix is shown. Of the first through holes 5 and the second through holes 6, portions not used for wiring may be omitted.

  In the comparative example of the present embodiment, as shown in FIG. 5 or FIG. 6, a wiring that omits a portion that is not used for wiring among a large number (or a plurality) of first through holes 5 and second through holes 6. A substrate 4 is used.

  Also, each first through-hole 5 shown in FIG. 4 has a copper-made cylindrical first metal connector (first conductive metal) having a higher thermal conductivity than constantan as the second conductive metal. 7) are respectively inserted and formed on the side surface of the inner cylinder as shown in FIG. 5 or FIG.

  Further, a solid second metal connector (second conductive metal) 8 made of constantan is inserted in each second through-hole 6 so as to be integrated with the side surface of the inner cylinder. Has been.

  Of these, the first metal connector 7 is formed by plating copper on the inner surface of the first through hole 5 in a layered manner, and the second metal connector 8 is formed of a linear constantan that passes through the second through hole. By fitting into the hole 6, the fitting is formed.

  Further, on one side surface 4a of the wiring substrate 4, a large number (or a plurality) of first surface metal layers 9 having a substantially rectangular shape in plan view are arranged as shown in FIG. As shown in FIG. 6, a large number (or a plurality) of second surface metal layers 10 having a substantially rectangular shape in a plan view are arranged on the side surface 4b opposite to the side 4a.

  In order to form the heat flow sensor 3 having the first and second surface metal layers 9 and 10, first, a linear constantan is inserted into the second through hole 6 and fitted as the second metal connector 8. To do.

  Next, the epoxy resin layers on both side surfaces 4a and 4b of the wiring board 4 are cut or scraped over the whole, and the end portion of the first through hole 5 and the second metal connector (second conductive material). The end face of the metal 8 is exposed.

  Thereafter, a copper layer (not shown) is formed on both side surfaces 4a and 4b of the wiring board 4 by plating the entire side surfaces 4a and 4b of the wiring board 4 with a predetermined thickness. Layer) is formed over substantially the entire surface.

  At this time, the inner surface of the first through hole 5 is also plated with copper, and the first surface metal layer 9 made of a copper layer (conductive metal layer) shown in FIGS. 5 and 6 and the second surface. The metal layers 10 are connected to each other, and are inserted into the first through holes 5 as first metal connectors (first conductive metals) 7.

  In addition, the thickness of a copper layer (conductive metal layer) (not shown) is formed to be substantially equal as an intermediate product formed on both side surfaces 4a and 4b of the wiring board 4.

  In addition, the copper layer generated by this copper plating and deposited on the entire side surfaces 4a and 4b of the wiring board 4 is bonded to both ends of each of the second metal connectors 8, and the first each The copper layers of both side surfaces 4a and 4b are electrically connected to each other by entering into the first through holes 5 from both ends of the through holes 5.

  Next, among the surfaces of the copper layer (conductive metal layer) (not shown) formed on the entire side surfaces 4a and 4b of the wiring board 4, the first and second surface metal layers 9 and 10 are formed by photoetching. By leaving necessary portions, a large number (or a plurality) of first and second surface metal layers 9 and 10 are formed.

  Moreover, by the photoetching process, the first metal connection body 7 and the second metal connection body 8 are arranged in series in the first and second surface metal layers 9, 10. .

  That is, in FIG. 5, a plurality of strip-shaped (rectangular) first surface metal layers 9 are arranged in a zigzag manner on the side surface 4a, and in FIG. 6, a plurality of strip-shaped (rectangular) second surface metal layers. The layers 10 are arranged in a zigzag manner on the side surface 4b.

  The first surface metal layer 9 and the second surface metal layer 10 are arranged at positions where both end portions overlap in the in-plane / outside direction of the wiring board 4, and the first metal connector 7 and the second surface metal layer 10. The first and second terminals 11 and 12 are connected to both ends of the series circuit of the first and second surface metal layers 9 and 10 connected in series via the two metal connectors 8. ing.

  In this embodiment, the first metal connector (first conductive metal) 7 is made of copper having a thermal conductivity of 403 W / m · K, and the second metal connector (second conductive metal) 8. Is constantan with a thermal conductivity of 22 W / m · K, the thermal conductivity of copper is approximately 18 times the thermal conductivity of constantan.

  As a result, if the cross-sectional areas of the first metal connector 7 and the second metal connector 8 are the same, the amount of heat transferred from the side surface 4b of the wiring board 4 to the side surface 4a is that of the first metal connector 7 made of copper. However, since it is about 18 times more than the second metal connector 8 made of constantan, it becomes difficult to measure the heat transfer coefficient of the object to be measured.

  Therefore, in order to accurately measure the heat transfer coefficient, the amount of heat transferred from one surface of the wiring board 4 to the other surface via the first metal connector 7 and the second metal connector 8 is determined. Must be set to be approximate or identical.

  For this reason, in this comparative example, the first metal connector (first conductive metal) 7 and the second metal connector (second conductive metal) 8 have a heat transfer coefficient (heat flow rate, that is, heat transfer amount), The cross-sectional area of the first metal connector 7 inside the first through hole 5 is set so as to be relatively small with a small diameter, or is hollow, and the wiring board 4 is substantially the same. By adjusting through-holes that pass through between the outer and outer surfaces, they are approximated or adjusted to be the same.

  That is, when the first metal connection body 7 is made of a copper metal material and the second metal connection body 8 is made of a constantan metal material, the inside of the first through hole 5 is formed. The cross-sectional area of the first metal connection body 7 is made uniform in the longitudinal direction which is the in-plane and outward direction of the wiring board 4, and from the cross-sectional area in the second through-hole 6 of the second metal connection body 8. However, the heat transfer coefficient (heat flow rate, that is, the amount of heat transfer) of the first metal connection body 7 and the second metal connection body 8 is approximated by setting it to be as small as possible within the energization range or about 1/18. Or it can comprise so that it may become substantially the same.

  Next, the effect of the heat flow sensor of the comparative example of this embodiment will be described.

  As described above, in the heat flow sensor 3 of the comparative example of the embodiment, the heat transfer coefficient of the first metal connector 7 and the second metal connector 8 can be set to be the same based on the thermal conductivity. .

  In such a configuration, since the connection portion between the first and second surface metal layers 9 and 10 and the second metal connector 8 is a thermocouple, a plurality of thermocouples are provided on both side surfaces 4a of the wiring board 4. , 4b are arranged at substantially equal intervals in a planar shape.

  Since the large number of thermocouples are connected in series, the sum of electromotive forces generated by the large number of thermocouples can be taken out via the first and second terminals 11 and 12, and this Temperature is measured from electric power to improve measurement accuracy.

  Accordingly, the base body 3c interposed between the heating unit side base 1 and the cooling unit side base 2 in FIG. 3 is sandwiched, and the heat from the heating unit side base 1 is transferred to the base body 3c. When the temperature is transmitted to the cooling unit side substrate 2 side, the temperature measured by the measured sensor 3a on the heating unit side substrate 1 side and the measured sensor 3b on the cooling unit side substrate 2 side are measured. From the difference from the temperature, the heat transfer coefficient of the base body 3c can be obtained.

  However, the copper plating applied to the inner surface of each of the first through holes 5 is performed between the first and second surface metal layers 9 and 10 having a strip shape (rectangular shape) in plan view. Then, the rod-shaped or cylindrical first metal connector (first conductive metal) 7 that is integrated is formed by the same kind of metal.

  For this reason, the thermal conductivity of copper is approximately 18 times higher than the thermal conductivity of Constantan, and the first surface metal layer 9 of the heating unit side substrate 1 and the cooling unit side substrate 2 The temperature difference with the second surface metal layer 10 is reduced.

  Therefore, the heat flow that flows from the first surface metal layer 9 toward the second surface metal layer 10 provided on the back surface side is reduced, and the thermoelectromotive force required for highly accurate measurement is reduced. There was a problem that it was difficult to improve the generation efficiency.

  Therefore, in the heat flow sensor shown in the example of the embodiment of the present invention, when the thickness and material are specified, even if a plurality of thermocouples made of dissimilar metals that are easy to create are directly connected, The shape and structure of the thermopile are set so that a high thermoelectromotive force can be obtained.

  The thermopile constituted by the heat flow sensor 3 and the like of this embodiment is calibrated by a dedicated calibration device 100 based on the absolute value method as shown in FIG.

  First, from the configuration of the calibration device 100, the calibration device 100 includes a heating unit side base material 1 and a cooling unit side base material 2, and includes a heating unit side base material 1 and a cooling unit side base material 2. Recessed portions 1b and 2b facing each other are formed on the facing surfaces 1a and 2a.

  A plurality of measured sensors 3a, 3b,... Constituting the heat flow sensor 3 of the present invention are attached to the recesses 1b and 2b so as to exhibit a planar shape at predetermined intervals.

  Of these, the measured sensor 3a is provided flush with the facing surface 1a, and the measured sensor 3b located on the opposite side of the base body 3c is provided flush with the facing surface 2a. It has been.

  And when calibrating this heat flow sensor 3 using this calibration apparatus 100, this heat flow sensor 3 is mounted on the heat sink 101 as a base, and the upper surface of this heat flow sensor 3 is the same shape. The thin film-shaped heat source heater 102 is covered.

  Further, a thin heat flow sensor 103 for a guard and a heat source heater 104 for a thin film guard are laminated on the heat source heater 102, and the uppermost surface portion is covered with a heat insulating material 105. Yes.

  In the calibration device 100 of the embodiment configured as described above, the guard heat flow sensor output is obtained by receiving the zero reference potential and performing PI control of the difference from the output from the guard thin heat flow sensor 103. Controlled to be zero.

  It is known that the energy of the heat flux passing through the heat flow sensor 3 becomes substantially equal to the power supplied to the heat source heater 102 after the system of the calibration device 100 is stabilized.

  At this time, the energy value of the heat flux required for accurate calibration is obtained from the output voltage value of the generated heat flow sensor 3.

  1 to 3, 4, and 7 to 11 show a heat flow sensor 13 of Example 1 of the embodiment of the present invention.

  In addition, the same code | symbol is attached | subjected and demonstrated about the same thru | or equivalent part as the said embodiment and a comparative example.

  In the heat flow sensor 13 of Example 1, a plurality of first surface metal layers 19 and a plurality of second surfaces are used instead of the plurality of first and second surface metal layers 9 and 10 in the embodiment. A metal layer 20 is formed.

  As in the comparative example, a plurality of first surface metal layers 19 and a plurality of second surface metal layers 20 formed on both side surfaces of the wiring substrate 4 are used to form the first and second layers. Through holes 5 ..., 6 ... (in FIG. 4, through hole rows 5L1, 5L2, 5L3 ... 5Li ... 5Ln, through hole rows 5C1, 5C2, 5C3 ... 5Ci ... 5Cn, and through holes 6L1, 6L2, 6L3... 6Li... 6Ln and through-hole rows 6C1, 6C2, 6C3... 6Ci. The bodies 7 ..., 8 ... are electrically connected in series as shown in FIG. 1, FIG. 2 or FIG. 11 while forming a plurality of thermocouples, as shown in FIG. The thermoelectromotive force generated between the first terminal 11 and the second terminal 12 of each pair is added (or canceled). Are matching), it is configured to be detectable. In the first embodiment, as shown in FIG. 1, the disconnection of the second metal connection body 8 made of the second conductive metal between the measurement representative points D1, D2,. The cross-sectional area (see the diameter d1 in the drawing) of the first metal connecting bodies 7 made of the first conductive metal is smaller than the area (see the diameter d2 in the drawing) over the entire length (diameter d1> d2). Accordingly, the cross-sectional area is set to be proportional to the square).

  For this reason, each 1st surface metal layer 19 connected via the 1st metal connection body 7 ... comprised with the 1st electroconductive metal in said 1st through-hole 5 ..., and the 2nd surface metal layer 20 ..., the amount of heat conduction to be transmitted is reduced by the decrease in the cross-sectional area, so that the temperature difference is easily maintained.

Further, this first surface metal layer 19 ..., the second surface metal layer 20 ... and, as flame heat transfer section Ru reduce the amount of heat conduction, each narrow part 19a ... and 20a ... are provided .

  These narrow portions 19a ... and 20a ... are first through-holes 5 ... where the first conductive metals are connected to each other ... first circular heat-radiating surface portions 19b ... 20b... And the second conductive metal is formed of a rectangular portion formed in the peripheral portion of the second through hole connected to the first conductive metal located on the surface side of the second through hole 6. Between the second heat receiving and radiating surface portions 19c, 20c, a long bridge shape having a narrow plan view width is formed so as to be integrated.

  The narrow portion 19a or 20a is narrower than the continuous second heat receiving and radiating surface portions 19c, 20c,... (Approximately 1/3 in this embodiment 1) so that the narrow portions 19a or 20a are substantially the same. By setting the shape to 1/10), the cross-sectional area of the first metal connector 7 is configured to be small in the direction of heat flow flowing from the front surface side to the back surface side.

  For this reason, the heat conduction amount transmitted from the first heat receiving / dissipating surface portion 19b to the second surface metal layer 20 provided on the back surface side through the first metal connector 7 in the first through hole 5 is reduced. Further, on the back surface side, the second heat receiving / dissipating surface portion provided with the representative point D2 from the first heat receiving / dissipating surface portion 20b formed on the second surface metal layer 20 through the narrow portion 20a on the back surface side. The amount of heat conduction to 20c can be reduced.

  Further, in the heat flow sensor 13 of the first embodiment, of the first surface metal layer 19 as the surface metal layer and the second surface metal layer 20 as the surface metal layer, the first heat receiving and radiating surface portion 19b as the hardly heat transfer portion. .., 20b... Is limited to the periphery of the upper and lower ends of the first metal connector 7 to be connected, and has a substantially circular shape with a small diameter.

  Moreover, in the first embodiment, as shown in FIG. 2, the surface areas of the first heat receiving and radiating surface portions 19b and 20b formed on the first and second surface metal layers 19 and 20 at the peripheral portion of the first through hole 5 are shown. Is formed to be smaller than the surface area of the second heat receiving and radiating surface portions 19c, 20c formed in the first and second surface metal layers 19, 20 at the peripheral portion of the second through hole 6.

  Further, in these first and second surface metal layers 19 and 20, the left and right sides are integrated so as to be integrated from both side surfaces of the narrow end portions 19a and 20a of the second heat receiving and radiating surface portions 19c and 20c. A pair of extended receiving / radiating surface portions 19d, 19d and 20d, 20d are formed to have the same thickness direction dimension.

  These extended receiving and radiating surface portions 19d, 19d and 20d, 20d are integrally extended toward the vicinity of the outer edges of the first receiving and radiating surface portions 19b and 20b, respectively, and received by the second receiving and radiating surface portions 19c and 20c. Each heat dissipation area is configured to be enlarged.

  Further, in the first embodiment, the outer peripheral edges of the first heat receiving / radiating surface portions 19b and 20b and the inner edges of the extended heat receiving / radiating surface portions 19d and 19d and 20d and 20d are separated from each other. Heat shield groove portions 21 and 21 surrounding the first heat receiving and radiating surface portions 19b and 20b are provided.

  These heat shield grooves 21 and 21 extend along both side edges of the narrow portions 19a and 20a.

  By separating the outer peripheral edge of each of the first heat receiving / radiating surface portions 19b, 20b and the inner edge facing the outer peripheral edge of the extended receiving / radiating surface portions 19d, 20d at substantially equal intervals. It is configured so that heat is difficult to transfer.

  Next, the function and effect of the heat flow sensor of the first embodiment will be described.

  In the heat flow sensor 13 of Example 1, in addition to the operational effects of the heat flow sensor 3 of the embodiment and the comparative example, each copper first surface metal layer having a higher thermal conductivity than the constantan. 19 and the second surface metal layer 20 connect the first and second conductive metals made of different metal materials in series.

  Each of the first surface metal layer 19 and the second surface metal layer 20 has narrow portions 19a and 20a as the heat-resistant heat transfer portions, the first heat receiving and heat radiating surface portions 19b and 20b, and the second heat receiving and heat radiating surface portion 19c. , 20c so as to be electrically connected to each other.

  For this reason, the first surface metal layer 19 and the second surface metal layer 20 are made of copper having a relatively high thermal conductivity, and have a substantially uniform thickness direction dimension by performing the copper plating process. Even if configured, the heat flow cross-sectional area can be set small.

  Therefore, the heat conduction amount transmitted through the first metal connectors 7 in the first through holes 5 is reduced.

  For this reason, between the first and second surface metal layers 19 and 20 made of copper formed on both side surfaces of the wiring board 4, the amount of heat transferred through the first metal connector 7 can be easily reduced. I can do it.

  For example, as in the comparative example, in order to equalize the amount of heat to move, the heat flow cross-sectional area of the first metal connector 7 made of copper is set to about 1/18, and the size control is performed, and the first metal connector 7 It is not necessary to set the amount of heat transferred from one surface of the wiring board 4 to the other surface via the second metal connection body 8 to be approximate or the same. A sufficient temperature difference between the metal layers 19 and 20 can be maintained.

  For this reason, by applying plating treatment to both side surfaces 4a and 4b located on the front and back sides of the wiring board 4, the first conductive metal first in the first through holes 5 formed simultaneously. One thermocouple can also be easily formed by one metal connector 7.

  Therefore, in the second metal connection body 8 disposed in the second through hole 6, measurement is performed between the first and second surface metal layers 9 and 10 made of the first conductive metal. The required thermoelectromotive force is generated efficiently, and a measurement value having a desired size can be easily obtained.

  Therefore, the measurement accuracy of thermal conductivity can be increased.

  Further, it is known that when the copper plating process is performed, the thickness direction dimension of the deposited copper film layer is substantially uniform.

  Therefore, a copper plating process is performed on both side surfaces 4a and 4b of the wiring board 4 with copper which is the first conductive metal, so that the plurality of first and second surface metal layers 19. When the substrate 4 is formed, the cross-sectional area through which the heat flow passes can be adjusted only by managing the dimensions in the width direction of the narrow portions 19a,.

  In this way, while forming the narrow portions 19a ..., 20a ..., the first and second metal connectors 7 ..., 8 ... that are paired with the first and second surface metal layers 19 ... 20 ... They can be connected in series, and there is no need to separately provide another heat-resistant transfer part.

  In addition, since the dimensional control of the first metal connectors 7 in the first through holes 5 can be omitted or easily performed, the number of manufacturing steps and the number of inspection steps is not increased, and the heat flow having high measurement accuracy is achieved. A sensor 13 is provided.

  Moreover, in the heat flow sensor 13, the narrow portions 19a ..., 20a ... formed in a narrow shape in plan view reduce the cross-sectional area, thereby reducing the first and second surface metal layers 19, 20 respectively. In addition to reducing the amount of heat conduction from the second heat receiving and radiating surface portions 19c and 20c, the surface area is set to be small together with the circular first receiving and radiating surface portions 19b and 20b.

  For this reason, the narrow portion 19a and the second heat receiving / dissipating surface portion 19c of the first and second surface metal layers 19 are not easily affected by the heat from the object to be measured located on the surface side of the heat flow sensor 13, Moreover, the amount of heat received is not easily radiated from the second heat receiving / radiating surface portion 20c and the narrow portion 20a of the second surface metal layer 20.

  Therefore, the heat on the first surface metal layer 19 side is not easily taken, and also in this respect, the temperature difference can be maintained and the measurement accuracy can be improved.

  Further, in the heat flow sensor 13 of the first embodiment, the minimum radial direction that is formed in the peripheral portion of each of the first through holes 5 and is required for connection with the end portion of the first metal connector 7. The surface areas of the first heat receiving / dissipating surface portions 19b and 20b formed on the first and second surface metal layers 19 and 20 having dimensions are formed on the surface metal layer of the second through hole 6. It is formed so as to be smaller than the surface area of the second rectangular heat receiving and radiating surface portions 19c, 20c.

  Moreover, in the first embodiment, the left and right pair of extended receiving and radiating surface portions 19d and 19d and 20d and 20d have the same thickness direction dimension on the second receiving and radiating surface portions 19c and 20c. It is formed so as to be integrated.

  For this reason, the first heat receiving / radiating surface portion 19b on the front surface side can be approximated to the temperature of the object to be measured than the second heat receiving / radiating surface portion 19c, It is possible to approximate the temperature of the heat dissipation state rather than the second heat receiving / radiating surface portion 20c, and it is easy to maintain the temperature difference between the representative point D1 and the representative point D, and the measurement accuracy can be improved.

  Further, in the heat flow sensor 13 of the first embodiment, the heat shielding groove portions 21 and 21 surrounding the first heat receiving and radiating surface portions 19b and 20b are provided, and the both side edges of the narrow portions 19a and 20a are spaced at equal intervals. The first and second heat receiving / radiating surface portions 19b and 20b are formed so as to surround the outer peripheral edge.

  For this reason, both the side edges of the narrow portions 19a and 20a and the outer peripheral edges of the first heat receiving and radiating surface portions 19b and 20b and the extended heat receiving and radiating surface portions 19d and 19d are separated at equal intervals. It is hard for heat transfer to occur.

  As described above, when the dimension in the thickness direction of the wiring board 4 and the material of the dissimilar metal are specified, a plurality of pairs of thermocouples made of dissimilar metals that are easy to create can be processed in a single copper plating process. , It can be formed in a configuration connected in series.

  Therefore, in the heat flow sensor 13 of this embodiment, the sum of electromotive forces generated by the plurality of thermocouples connected in series is taken out via the first and second terminals 11 and 12, and spatially. Higher measurement accuracy can be obtained by measuring the averaged temperature from the electromotive force of the heat flow sensor 13 that provides an output voltage larger than that of a single thermocouple.

  Further, in the first embodiment, by setting the vertical cross-sectional area of the narrow portions 19a and 20a contributing to heat transfer of the first and second surface metal layers 19 and 20 as a narrow shape in plan view, The amount of heat conduction between the measurement representative points D1, D2 and the peripheral edge of the connection portion of the first metal connector 7 can be reduced.

  For this reason, the narrow portions 19a and 20a are difficult to transfer heat between the first and second surface metal layers 19 and 20 as a hardly heat transfer portion.

  Accordingly, the amount of heat conduction transmitted between the front and back surfaces of the wiring substrate 4 through the first metal connection body 7 made of copper in the first through holes 5 is reduced, so that the electrical resistance is small and the conductivity is low. Even if connected in series using good copper, the temperature difference between the first and second surface metal layers 19 and 20 on the front and back sides is kept large to some extent.

  Further, the surface area of the first heat receiving / dissipating surface portion 19b formed on the first surface metal layer 19 at the peripheral portion of the first through hole 5 is formed on the surface metal layer at the peripheral portion of the second through hole. It is formed to be smaller than the surface area of the heat receiving / radiating surface portion 19c.

  For this reason, the amount of heat received and radiated from the first and second heat receiving / radiating surface portions 19b and 20b is small, and the temperature difference between the first and second surface metal layers 19 and 20 on the front and back surfaces can be easily reduced. There is little possibility of a decrease due to heat reception / radiation from the heat receiving / radiating surface portions 19b, 20b.

  Other configurations and functions and effects are the same as or equivalent to those of the above-described embodiment and comparative example, and thus description thereof is omitted.

  12 to 13 show a heat flow sensor according to Example 2 of the embodiment of the present invention.

  In addition, the same code | symbol is attached | subjected and demonstrated about the same or equivalent part as the comparative example of the said embodiment, and Example 1. FIG.

  In the heat flow sensor 23 of the second embodiment, instead of the plurality of first and second surface metal layers 19, 20... Of the heat flow sensor 13 of the first embodiment, a plurality of first surface metal layers 29. Are formed on the front and back side surfaces 14a and 14b of the wiring substrate 14 as a sensor base material, respectively.

  In the case of the heat flow sensor 23 of the second embodiment, as shown in FIGS. 12 and 13, through holes 17a penetrating between the first and second surface metal layers 29, 30 are respectively connected to the metal connector. Openings are formed inside 17.

  In the example shown in FIGS. 12 and 13, both ends of the first metal connector 17 and the second metal connector 8 are plated and photo-etched in the same manner as in the above-described embodiment, so that the first and second Bonded to the surface metal layers 29 and 30.

  In this case, each of the first metal connectors 17... Is reduced so that the heat conductivity of the first metal connector 17 is reduced or the heat conductivity of the second metal connector 8 is the same. The cross-sectional area in the first through hole 5 is set at a relatively small ratio.

  In the heat flow sensor 23 of Example 2 of the embodiment configured as described above, in addition to the function and effect of the heat flow sensor 13 of Example 1, it further penetrates between the first and second surface metal layers 29 and 30. Through-holes 17a to be opened are formed in the first metal connectors 17 respectively.

  For this reason, as shown in FIG. 13, the first conductive metal is satisfactorily attached when the inner wall of each of the first through holes 5 is plated, and the first and first conductive metals are good. The two-surface metal layers 29 and 30 can be reliably bonded to each other, and the manufacturing is easy.

  Moreover, the first metal connector 17 is formed of the conductive metal by the narrow portions 19a formed in the plurality of first surface metal layers 29 and the plurality of second surface metal layers 30, respectively. Even if the cross-sectional area of the portion is not managed in detail, the amount of heat transfer passing through the first metal connector 17 can be reduced, and the temperature difference between the front and back side surfaces 14a and 14b of the wiring board 14 can be reduced. Is preserved.

  Therefore, an optimized heat flow sensor 23 that can obtain heat flow sensitivity capable of detecting a weak heat flux and improve measurement accuracy is provided.

  Other configurations and functions and effects are substantially the same as those of the above-described embodiment and Example 1, and thus description thereof is omitted.

  The embodiment of the present invention has been described in detail above with reference to the drawings. However, the specific configuration is not limited to this embodiment, and design changes that do not depart from the gist of the present invention are not limited to this embodiment. Included in the invention.

  That is, in Example 2 of the embodiment shown in FIGS. 12 and 13, the first metal connection body 17 is formed into a cylindrical shape by copper plating, and the through hole 17 a is formed in the first metal connection body 17. However, the present invention is not necessarily limited to this. For example, as shown in FIGS. 10, 11 and 12, in combination with the narrow portion 19a or 20a of the first embodiment, You may simplify the dimension management of the cross-sectional area in which heat transfer is performed.

  Further, the narrow portion 19a or 20a in Example 1 of the embodiment has substantially the same thickness direction dimension, and is narrower than the continuous second receiving and radiating surface portions 19c. In Example 1, by setting to about 1/3 to 1/10), the cross-sectional area of the first metal connector 17 made of the first conductive metal is a cross-sectional direction orthogonal to the heat flow direction. Although it is configured to be small, the present invention is not limited to this. For example, it is set to about 3/4 to 1/100. There are no particular limitations on the dimensions, shape, area ratio, position to be formed, and quantity as long as the cross-sectional area to be formed.

  For example, in the comparative example of the embodiment, the cross-sectional area of the first metal connection body 7 inside the first through-hole 5 is more energized than the cross-section area in the through-hole 6 of the second metal connection body 8. Is set to be as small as possible or about 1/18, the heat transfer coefficient (heat flow rate, that is, heat transfer amount) of the first metal connection body 7 and the second metal connection body 8 is approximate or substantially Although it is configured to be the same, the cross-sectional area of the first metal connector 7 is small within a range in which energization is possible at least in one position in the longitudinal direction which is the in-plane or outward direction of the wiring board 4. Or, it may be set to about 1/18 as long as it reduces the amount of heat conduction to be transmitted, and is combined with the narrow portion 19a or 20a as a heat-resistant heat transfer portion. In particular, the shape, quantity and material of the first metal connector 7 are limited. Not shall.

  Further, as described above, the measured sensors 3a, 3b of the heat flow sensor 3 according to the embodiment of the present invention have a plurality of through holes 5 ..., 6 ... arranged in the vertical and horizontal directions, and an insulating sensor base material. The first and second conductive metals (first and second metals) made of dissimilar metal materials are formed in the plurality of first through holes 5 and the second through holes 6. In the heat flow sensor, the connecting bodies 7 and 8) are alternately arranged, and the first and second conductive metals (first and second metal connecting bodies 7 and 8) are connected in series.

  Among these, in the said embodiment, although the said 1st, 2nd electroconductive metal is comprised with the metal material made from copper and a tongue stantan, it is not restricted to this in particular, For example, a 1st electroconductive metal is, It may be iron, nickel, chromium, chromel alloy, and as the second conductive metal, any alumel alloy mainly composed of nickel, or any combination of the above constantan, can be used as a thermocouple. It may be a heterogeneous metal.

  Alternatively, a thermocouple in which a niclosyl alloy mainly containing nickel, chromium and silicon and a nisil alloy mainly containing nickel and silicon may be used. In this case, it is known that the thermoelectromotive force is stable over a wide range from a low temperature to a high temperature (about -200 degrees to about 1200 degrees).

  Further, a thermocouple in which a platinum rhodium alloy containing 10% to 30% rhodium and a platinum rhodium alloy containing about 6% rhodium may be used. In this case, it is known that the heating use limit temperature can be measured with high accuracy until it reaches a high temperature of about 1600 degrees to 1700 degrees.

  Further, a gold-iron-chromel (AF) thermocouple in which a chromel alloy mainly composed of nickel and chromium and a gold-iron alloy containing 0.07% iron may be used.

  Further, an iridium / rhodium thermocouple in which iridium / rhodium alloy containing 50% rhodium and iridium are combined may be used.

  Alternatively, a tungsten-rhenium thermocouple in which a tungsten-rhenium alloy containing 5% rhenium and a tungsten-rhenium alloy containing 26% rhenium are combined may be used.

  Further, a nickel-molybdenum thermocouple in which nickel-molybdenum alloy containing 18% molybdenum and nickel are combined may be used.

  A platinum thermocouple composed of an alloy mainly composed of palladium, platinum, and gold and an alloy mainly composed of gold and palladium may be used. The shape of the first and second conductive metals, Even if the thermocouple is configured by any combination of dissimilar metals in quantity and material, the thermocouples are arranged in a plurality of through holes 5 and 6 arranged vertically and horizontally on the insulating wiring board 4 and connected in series. Any device may be used as long as it constitutes a plurality of pairs of thermocouples connected to each other.

  In the principle diagram described by applying the schematic intermediate metal rule shown in FIG. 14, a general thermocouple detects the temperature difference between the junction temperatures T1 and T2 of the two metals A and B. At this time, as shown in (b), the equivalent circuit diagram showing the junction temperatures T1 and T2 of the metals A and B is replaced.

  In the thermocouple provided in the sensor substrate of the typical embodiment of the present application as shown in FIG. 14C, an equivalent circuit showing the junction temperatures T1 and T2 of the two types of metals A and B. As shown in FIG. 14E, the temperatures T1 and T3 at both ends of the third metal C connected are the same temperature T1 = T3. This is the case.

  Under such conditions, as shown in FIG. 14 (e), the law of intermediate metal can be applied, and the metal A and B can be separated from the temperature between the junction points even if a different kind of third metal C is used. It is known that the voltage generated due to the difference between T1 and T2 is the same as the voltage generated due to the difference between the temperatures T1 and T2 between the junctions when the third metal C is not present. T2 difference can be detected.

  Therefore, like the said embodiment, the 1st, 2nd surface metal layers 19 and 20 are comprised with a copper layer so that it may become the same kind as the copper 1st metal connection body 7 ... which comprises one side of a thermocouple. There is no need, not only copper, but the surface metal layer having the same temperature T1 = T3, the metal A, B as a metal C having different conductivity, such as an alloy composed of each metal You may comprise using either.

  For example, the present invention is not limited to copper, nickel, and alloys thereof, and any of the above metals can be treated as one intermediate metal under the condition that they exist in the same plane. By entering into the configuration as above, it is not limited to two types of metals, but may be configured to combine a plurality of three or more types of metals, the composition ratio of each of the metals A to C, each of the metals A, B, and A combination of types such as metal C ... is not particularly limited.

  As described above, the first and second metal connectors 7 and 8 of the above embodiment are plated on the both side surfaces 4 a and 4 b of the wiring board 4 from the same material as the first metal connector 7. Are connected in series by a plurality of first and second surface metal layers 9, 10,.

  According to this configuration, when the plurality of first and second surface metal layers 9, 10,... Are formed on both side surfaces 4 a and 4 b of the wiring substrate 4 by plating, the plurality of first and second metal connections are formed. The bodies 7, 8... Can be connected in series at a time.

  For this reason, it is easy to manufacture the heat flow sensors 3 and 13, and the connection quality can be improved, and also in this respect, the measurement accuracy of the heat transfer coefficient can be increased.

  In the heat flow sensor 3 according to the embodiment of the present invention, the first and second metal connectors 7 and 8 are copper and constantan, respectively, and the first and second surface metals constituting the surface metal layer. The layers 9 ..., 10 ... are made of the same copper metal material as the first conductive metal.

  According to this structure, the said 1st, 2nd surface metal layers 9 ..., 10 ... can be easily formed by giving a substantially uniform thickness direction dimension by a plating process.

  Therefore, as shown in FIG. 1, according to the thermal conductivity of the first and second metal connectors 7 and 8, together with the ratio of the diameters d1 and d2 of the first and second metal connectors 7 and 8 By managing the widthwise dimensions of the narrow portions 19a and 20a, the narrow portions 19a and 20a are easily disposed in the first through hole 5 formed of the first conductive metal having a relatively high thermal conductivity. It is possible to reduce the amount of heat passing through the first metal connectors 7.

  Therefore, the temperature difference between the measurement representative points D1 and D2 of the first and second surface metal layers 19 and 20 formed on the both side surfaces 4a and 4b (front and back surfaces) of the wiring board 4 is maintained, and the thermoelectromotive force is maintained. Can be made the largest.

  In addition, the first and second surface metal layers 19 and 20 are connected in series at the measurement representative points D1 and D2 located at both side ends of the second metal connector 8.

  Moreover, in this embodiment, as shown in FIG. 1, in the plurality of first surface metal layers 19..., The second heat receiving / radiating surface portions 19 c are located on the surface side of the second through holes 6. , Provided in a rectangular portion formed so as to be located at the peripheral portion of the second through-hole 6 connected to the first conductive metal, and extended integrally formed from the rectangular portion. The heat receiving and radiating surface portions 19d and 19d are attached to the object to be measured with a relatively large surface area to improve the heat receiving efficiency.

  Further, in the plurality of second surface metal layers 20..., Second through holes in which the second heat receiving / radiating surface portions 20 c are connected to the first conductive metal located on the surface side of the second through holes 6. 6 In addition to the rectangular portion formed so as to be located at the peripheral portion, it has extended receiving and radiating surface portions 20d and 20d formed integrally extending from the rectangular portion, and has a relatively large surface area. Since heat can be dissipated, a large amount of heat can be set, and the temperature of the back side surface 4b of the wiring board 4 can be lowered and stabilized easily.

  For this reason, the temperature difference is measured between the measurement representative point D1 of the first surface metal layer 19 approximated to the temperature of the object to be measured and the measurement representative point D2 of the second surface metal layer 20 formed by lowering the temperature. It is easy to spread and the measurement accuracy can be improved.

  In addition, since the narrow portion 20a on the back surface side has a small cross-sectional area, the heat transferred to the back surface side by the first conductive metal in the first through hole 5 reaches the vicinity of the measurement representative point D2. Difficult to communicate.

  Also in this respect, it is easy to maintain the temperature difference between the measurement representative points D1 and D2, and the accuracy of temperature measurement and heat flux measurement can be improved.

  In addition, a pair of heat shield groove portions 21 and 21 are formed in each copper material constituting the first and second surface metal layers 19 and 20 along the extending direction of the narrow portions 19a and 20a. Yes.

  In the first and second surface metal layers 19 and 20 of Example 1 of this embodiment, the second heat receiving and radiating surface portions 19c and 20c are integrated toward the vicinity of the first heat receiving and radiating surface portions 19b and 20b. The extended heat-receiving / radiating surface portions 19d, 20d are formed in a non-contact manner by the heat-shielding groove portions 21, 21, except for the connection base end portion with the second heat-receiving / heat-dissipating surface portions 19c, 20c. It is separated.

  For this reason, the extended receiving and radiating surface portions 19d and 20d can have a relatively wide area along the outer edges of the first and second surface metal layers 19 and 20 having a substantially rectangular shape in plan view. The area for receiving and radiating heat can be expanded while the arrangement efficiency is improved by arranging them alternately and improving the arrangement efficiency.

  Furthermore, even if these extended receiving and radiating surface portions 19d and 20d extend to the periphery of the first receiving and radiating surface portions 19b and 20b, the heat received by the extended receiving and radiating surface portions 19d and 20d, or Heat received by the second heat receiving / radiating surface portions 19c, 20c is not transferred to the first heat receiving / radiating surface portions 19b, 20b, and the heat shield groove portions 21, 21 provided with no copper material. Is shielded by heat.

  Therefore, it is possible to measure the temperature of the measurement representative points D1 and D2 provided on the second heat receiving and radiating surface portions 19c and 20c in a state where the heat received in a wide range is equalized and is spatially averaged.

  Moreover, there is no heat radiation in the direction of the first heat receiving / radiating surface portions 19b, 20b, the temperature difference between the measurement representative points D1, D2 located on the front and back surfaces of the wiring board 4 can be maintained, and the measurement accuracy is further improved. Can be improved.

  Furthermore, in the heat flow sensor 13 of the first embodiment, the heat shield groove portions 21 and 21 are extended along the side edge of the narrow portion 19a.

  And between the peripheral edge of this narrow part 19a and the peripheral edge of the said 1st heat receiving / radiating surface part 19b, 20b, and these extended receiving / radiating surface parts 19d, 19d by the said heat shield groove part 21,21. , So as to be separated at equal intervals.

  For this reason, the space | interval of the crossing groove direction (direction orthogonal to the longitudinal direction which is the extending direction of the heat shield groove part 21) is equal in any location of the heat shield groove portions 21 and 21, and the first metal connection is established in any location. Heat transfer to the body 7 is similarly difficult.

  Therefore, the temperature difference between the measurement representative points D1 and D2 is excellent, and the measurement accuracy of the heat transfer coefficient can be improved.

  Furthermore, in the heat flow sensor 13 of Example 1 of the embodiment of the present invention, the first and second metal connectors 7 and 8 are formed by the narrow portions 19a and 20a that can be visually recognized after the formation as the hardly heat transfer portions. It is not necessary to set the ratio of the cross-sectional areas when the heat flow passes in and out of the plane of the wiring board 4 so that the heat flow rate is substantially the same.

  Thus, the management of the size of the cross-sectional areas of the first and second metal connectors 7 and 8 embedded in the first and second through holes 5 and 6 of the wiring board 4 becomes unnecessary.

  For this reason, the heat absorption by the sensor itself of the object to be detected and the optimization of the temperature difference required in the detection of the heat can be provided on the material of the different metals A, B, etc., on the sensor substrate. The heat flow sensor 3 can be easily adjusted by setting the size and shape of the through-holes, and can be easily prepared with high measurement accuracy in which thermocouples are evenly arranged in a relatively large area.

  Moreover, in the heat flow sensor 23 of Example 2 as a modification of Example 1 shown in FIGS. 12 and 13, the surface metal layer (first metal connector 17...) When the first and second surface metal layers 29, 30) are formed by applying the copper plating, the through direction is substantially at the center in the radial direction of the portion attached to the inner surface of the through hole (first through hole 5). Through holes 17a are formed so as to have a cylindrical shape at the same time.

  According to this configuration, the first conductive metal (first metal connector 17) can be easily formed, and the first conductive metal (first metal connector 17) and the surface metal layer (first, first metal connector 17) are formed. Since it is not necessary to separately connect the second surface metal layers 29 and 30), the manufacture of the heat flow sensor is facilitated.

  And like these heat flow sensors 23 of Example 2, it is not restricted to what the through hole 17a ... is formed in the said 1st metal connection body 17 ..., For example, in the said 2nd metal connection body 8 ... part, The through holes may be formed in the same manner as the through holes 17a, and both the first metal connectors 17 and the second metal connectors 8 are the same size as or different from the through holes 17a. The inner diameter may be formed so as to penetrate through with different cross-sectional areas.

  The heat flow sensor according to the present invention is used for the development of heat insulating materials as building materials in the field of construction, etc., and even after construction, it can be easily measured by measuring temperature, radiant heat, or It can be used to measure heat flux.

  In addition, by using a thermopile configured in a pile shape, it is possible to measure a wide range of objects to be measured that have a planar shape, and use a spatial average of heat received over a wide range as a heat flow sensor. Therefore, it is suitable for use in other fields where good measurement accuracy is required, such as human body temperature measurement, various industrial equipment, OA equipment, and heat flux measurement of transportation equipment such as vehicles.

3, 13, 23 Heat flow sensor 4, 14 Wiring board (sensor base material)
4a, 4b, 14a, 14b Side surface 5 First through hole 6 Second through hole 7, 17 First metal connector (first conductive metal)
17a Through hole 8 Second metal connector (second conductive metal)
9, 19, 29 First surface metal layer 10, 20, 30 Second surface metal layer 19a, 20a Narrow part (hard heat transfer part)
19b, 20b 1st heat receiving / radiating surface part 19c, 20c 2nd heat receiving / radiating surface part 19d, 20d Extended receiving / radiating surface part 21, 21 Heat shield groove part D1, D2 Measurement representative point

Claims (5)

A plurality of first and second through holes arranged vertically and horizontally are formed in an insulating sensor base material, and first and second conductive metals made of different metal materials are formed in the first and second through holes, respectively. Alternatingly disposed, the first conductive metal has a higher thermal conductivity than the second conductive metal, and is formed by a plurality of surface metal layers formed on both side surfaces of the sensor substrate. The first and second metal connectors disposed in the first and second through holes are heat flow sensors connected in series,
By setting the heat flow cross-sectional area in the plurality of surface metal layers where heat conduction is performed between each measurement representative point located on both side surfaces of the sensor substrate to be small at least in one place, A heat flow sensor comprising: a heat-resistant transfer portion that reduces a heat conduction amount transmitted through the first conductive metal in the first through hole.   The first heat receiving / dissipating surface portion formed on the peripheral portion of the first through hole formed in at least one of the surface metal layers and connected to the first conductive metal in the first through hole. In plan view between the second conductive metal and a second heat receiving and radiating surface portion comprising a peripheral portion of the second through hole connected to the first conductive metal located on the surface side of the second through hole. 2. The heat flow sensor according to claim 1, wherein the heat conduction amount is reduced by reducing the cross-sectional area of the first conductive metal as a narrow shape.   The surface area of the first heat receiving and radiating surface portion formed on the surface metal layer at the peripheral portion of the first through hole is smaller than the surface area of the second heat receiving and radiating surface portion formed on the surface metal layer at the peripheral portion of the second through hole. The heat flow sensor according to claim 1, wherein the heat flow sensor is formed as follows.   The at least one surface metal layer has an extended heat receiving and radiating surface portion extending toward the vicinity of the first heat receiving and radiating surface portion so as to be integrated with the second heat receiving and radiating surface portion, and expanding a heat receiving and radiating area. The heat-insulating groove part surrounding the first heat-receiving / dissipating surface part is provided so as to form and separate between the peripheral edge of the first heat-receiving / heat-dissipating part and the extended heat-receiving / radiating surface part. The heat flow sensor according to any one of 1 to 3.   The heat shield groove portion is extended along a side edge of the narrow portion, and is configured to separate the peripheral edge of the first heat receiving / radiating surface portion from the extended heat receiving / radiating surface portion at equal intervals. The heat flow sensor according to claim 4.

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