JP5632800B2 - Manufacturing method of solar cell module - Google Patents

Description

  The present invention relates to a thin film solar cell module and a method for manufacturing the same, and more particularly to the structure of an electrode extraction portion of a thin film solar cell module.

In the thin film solar cell module, a transparent conductive film layer, a thin film semiconductor layer, and a back metal layer are sequentially formed on an insulating substrate, a plurality of unit cells are integrated in a line, and the plurality of unit cells are integrated. It has a structure covered with a filler layer and a cover film or a cover glass. Lead wires are connected to the positive and negative electrodes of the module, the filler layer and the cover film or the thermoplastic anti showed over preparative having the filler layer and the adhesive properties and the other end of the lead wire with covered with a cover glass, An electric output of the solar cell is obtained by passing through the provided slit and the opening provided in the cover film or the cover glass and then melting and solidifying the filler layer.

  Conventionally, the electrode extraction part of the thin-film solar cell module passes the lead wire from the slit and cover film provided in the filler layer, or the opening provided in the cover glass or the insulating piece, and then using the vacuum laminator This is a structure obtained by melting and solidifying the filler layer. In the obtained thin film solar cell module, the portion where the filler layer is melted and solidified and the lead wire are protected with a cover film, a cover glass or an insulating piece, so the filler can be easily taken out without overflowing, It is possible to implement connection with a terminal box. Prior art documents showing these structures include Patent Document 1 and Patent Document 2.

Japanese Utility Model Publication No. 64-018762 JP 2001-77383 A

However, the prior art still requires further improvement. That is, there is a case where the moisture resistance of the solar cell is impaired from the opening provided in the cover film or the cover glass, and there is a problem that the output of the solar cell is reduced due to intrusion of moisture from the opening. It was. For example, when a moisture resistance test (85 ° C. and 85% humidity) is performed for about 2000 hours, a phenomenon in which the solar cell characteristics are remarkably deteriorated may be observed. It was sometimes observed that the electrode was peeled off. As means for solving this issue, it is considered the process of melting solidified vacuum laminator for example cover the thermoplastic anti showed over preparative formulated with desiccant butyl rubber or butyl rubber film or provided in a portion of the opening of the cover glass, . As a result, it was observed that the electrical characteristics did not deteriorate even after 3000 hours had passed after the above moisture resistance test.

In these structures, in the process of melting and solidifying the filler layer using a vacuum laminator, or when storing the thin film solar cell module, the lead wire of the opening provided in the cover film or the cover glass, and the filler thermoplastic anti showed over preparative having a layer or the adhesive is fused or crimped, functions as a power take-out end of the lead wire has a problem to be impaired. That is, a new problem has been found that soldering becomes difficult in the process of attaching the terminal box because the lead wire is fused or crimped.

  As a countermeasure, it has been studied to provide a release sheet that protects the lead wire around the opening, and conventionally, a fabric sheet coated with a fluorine-based resin has been used as the release sheet.

  However, when a fabric sheet coated with this fluororesin is provided, a cover is provided at the time of manufacturing a thin film solar cell including a step of melting and solidifying the filler layer using a vacuum laminator, or when storing the thin film solar cell module. There is a problem that the adhesion strength of the terminal box, which is generally attached to the opening of the thin-film solar cell module with a silicone adhesive, is deteriorated because it cannot prevent the dirt from adhering to the periphery of the opening provided on the film or the cover glass. It was.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method for manufacturing a solar cell module in which the rate of occurrence of product defects is reduced.

  As a result of intensive studies by the inventor, it has been found that the above problem can be solved by the following configuration.

During the process of manufacturing a thin film solar cell including the step of melting and solidifying the filler layer using a vacuum laminator, or when storing the thin film solar cell module, dirt or the like is formed around the opening provided in the cover film or the cover glass. As a method for preventing adhesion, in the step of melting and solidifying the filler layer using a vacuum laminator, a heat-resistant sheet having a silicone release layer on at least one surface is formed on the opening of the cover film or the cover glass. , characterized in that disposed between the thermoplastic moisture barrier sheet having a lead wire and a viscosity adhesion.

  In the heat resistant resin sheet having at least one surface having a silicone release layer, the sheet is preferably a PET resin sheet. In the heat resistant sheet having a silicone release layer, the silicone release layer preferably contains 4% by weight or more of a low molecular weight silicone polymer having a molecular weight of 1500 or less.

  During the process of manufacturing a thin film solar cell including the step of melting and solidifying the filler layer using a vacuum laminator, or when storing the thin film solar cell module, the periphery of the opening provided in the cover film or cover glass is temporarily exposed. Since dirt adheres to the terminal box, a problem arises in that the adhesive strength of the terminal box, which is generally attached to the opening of the thin-film solar cell module with a silicone adhesive, decreases. In the present invention, such a problem is solved by a method for manufacturing a solar cell module including a step of disposing a silicone polymer in the temporarily exposed portion during the manufacturing process.

In the first aspect of the present invention, a plurality of unit cells formed by sequentially forming a transparent conductive film layer, a thin film semiconductor layer, and a back metal layer on an insulating substrate are integrated by being connected in series in a line. And the plurality of unit cells are covered with a filler layer and a cover film or a cover glass having an opening.
The positive and negative electrodes of the module, which are both ends in the series direction of the plurality of unit cells, are connected to one end of a lead wire, and the filler layer and the cover film or cover glass are covered thereon. And
At least around the opening, an adhesive thermoplastic moisture-proof sheet is disposed between the filler layer and the cover film or cover glass, and a silicone release agent layer is disposed on at least one surface. A release treatment sheet made of a conductive resin sheet is disposed on the surface of the cover film or cover glass ,
The release process sheet, a silicone release agent layer is disposed so as to face the front surface of the cover film or the cover glass,
The other end of the lead wire, a first slit provided in the filler layer, a second slit formed in the thermoplastic moisture-proof sheet, an opening provided in the cover film or the cover glass, and the Passed through a third slit provided in the release sheet ,
Melting and solidifying the filler layer ;
Removing the heat-resistant resin sheet of the release treatment sheet from the surface of the cover film or cover glass ; and
A step of attaching a terminal box with a silicone adhesive around the opening on the surface of the cover film or cover glass , in this order,
In the step of melting and solidifying the filler layer, the silicone polymer contained in the silicone release agent layer of the release treatment sheet is obtained by heat treatment for melting the filler layer, and the thermoplastic moisture-proof sheet surface , and it is attached to the opening peripheral side of the cover film or the surface of the cover glass, wherein the releasing treatment steps are performed at the same time, a manufacturing method, the solar cell module.

  The first slit, the second slit, and the third slit are not limited in slit shape, and need only be able to pass a lead wire. Shape, triangular shape, substantially the same shape as the cross-sectional shape of the lead wire, and substantially the same shape as the cross-sectional shape of the lead wire. The first, second, third, and respective slit shapes may be the same or different. If the lead wire has a flat plate shape such as a strip of aluminum foil, for example, the lead wire and the slit can be arranged so as to be substantially in contact with each other, and the excess overlap is reduced. A flat plate-like notch is preferable.

The second of the present invention, pre KiHanare-treated sheet is ing from the both sides were placed silicone release agent layer heat-resistant resin sheet, a manufacturing method of a solar cell module according to claim 1 .

  3rd of this invention is a manufacturing method of the said solar cell module whose said heat resistant resin sheet is a PET resin sheet.

  A fourth aspect of the present invention is the method for producing a solar cell, wherein the silicone release agent layer has a silicone polymer having a molecular weight of 1500 or less of 4% by weight or more.

  5th of this invention is the manufacturing method of the said solar cell module whose said insulating substrate is a glass substrate.

  By using a heat-resistant resin sheet having a silicone release layer, a thin film solar cell manufacturing process including a step of melting and solidifying the filler layer using a vacuum laminator, or during storage of the thin film solar cell module, a cover film, or It is possible to prevent dirt from adhering to the periphery of the opening provided in the cover glass. Therefore, it can prevent that the adhesive strength of the terminal box attached with a silicone adhesive falls.

  More specifically, this effect will be described. In the step of melting and solidifying the filler layer using a vacuum laminator, the low molecular weight release component contained in the heat-resistant sheet having the silicone release layer is present in the periphery of the opening. Transition to a silicone demolded structure is obtained. As a result, during the solar cell manufacturing process including the step of melting and solidifying the filler layer using a vacuum laminator, or when storing the thin film solar cell module, the cover film or the periphery of the opening provided in the cover glass is contaminated. It can prevent adhesion. Moreover, when the terminal box is attached with the silicone adhesive, the low molecular weight silicone release component that has moved to the periphery of the opening is transferred to the silicone adhesive, and does not reduce the attachment strength of the silicone adhesive.

  A first method for preventing ordinary dirt is to change the shape of a single release sheet provided around the opening. However, it is expected that the cost increase due to the shape change and the work of disposing the release sheet become complicated. Moreover, although the method of carrying out the mold release process around an opening part by spray spraying or application | coating is also considered, while the number of processes increases, it is feared that the attachment intensity | strength of a silicone adhesive will be reduced by a mold release process. The method of using a heat-resistant sheet having a silicone release layer is a method that can prevent contamination without increasing the number of steps, complicating the work, and more importantly, The effect is that the effect of not reducing the mounting strength is realized at the same time.

  Conventionally, a heat-resistant sheet having a release layer is usually required to have a low composition of a low molecular weight component, because when the release component of a low molecular weight is transferred from the release layer, there is a risk of lowering adhesiveness and the like. Has been developed. In the above cases, release treatment is possible, such as when using a heat-resistant resin sheet having a fluorine-based release layer, but since it is fluorine-based, affinity and compatibility with silicone adhesives As a result, there was a problem that the possibility of lowering the attachment strength of the silicone adhesive was great.

  On the other hand, in the present invention, since the silicone release agent layer is used, the affinity / compatibility with the silicone adhesive is very good, so that the attachment strength of the terminal box with the silicone adhesive is remarkably improved. An effect can be expressed.

It is an assembly drawing of the solar cell module of the present invention. It is sectional drawing of the assembly of the solar cell module of this invention. It is the schematic of the solar cell module after the lamination process of this invention. It is sectional drawing of the solar cell provided to the terminal box of this invention.

  Hereinafter, specific embodiments will be described with reference to the drawings. The contents described here are intended to explain one form, and are not limited to this, and can be applied to other forms as long as they reflect the technical idea. is there.

FIG. 1 is an assembly view of an example of a thin-film solar cell module 1 used in the present invention, and FIG. 2 is a sectional view thereof. As the transparent insulating substrate used in the thin-film solar battery 2, glass or heat-resistant plastic is used. For example, SiO ₂ is formed on this substrate so that impurities of the substrate do not diffuse into the layers above it. A transparent conductive film layer is formed thereon. As the transparent conductive film layer, SnO ₂ grown in a form in which irregularities are formed by the apex angle of the crystal grains is preferably used. A thermal CVD method is generally used as the formation method. This transparent conductive film layer is provided with a groove using a laser processing method or the like, and a strip-like individual region is formed. A thin film semiconductor layer is formed thereon. As the thin film semiconductor layer, a photovoltaic junction such as amorphous silicon, thin film polycrystalline silicon, CIS, or CdTe is appropriately formed. The material for the transparent electrode is appropriately selected from those suitable for these semiconductors.

  These thin film semiconductor layers are provided with grooves for connection to the adjacent photovoltaic elements, and a back electrode layer is formed on the thin film semiconductor layer. As the back electrode layer, an electrode in which a transparent conductive material such as ZnO and a highly light reflective metal such as Ag are combined is preferably used. These back electrode layers are formed into unit cells 3 divided into individual electrodes by grooves, and with this form, the transparent conductive layer and the back electrode layer are electrically connected to each other through the thin film semiconductor layer separation grooves, Adjacent unit cells 3 are connected in series.

  For example, a bus area for collecting power is provided at both ends to which these unit cells 3 are connected. Bumps of ceramic solder are discretely formed on the portions. Solder-plated copper foil is connected to the bumps to form bus bars 4. The solder-plated copper foil is obtained by coating a copper foil having a thickness of about 0.2 mm and a width of several mm with ordinary eutectic solder or lead-free solder.

  Between the 6 mm lead wire 6 for supplying electric power from the bus bar 4 to the outside and the unit cells 3 connected in series, an insulating sheet portion 5 embedded in the filler 7 is disposed. As the filler 7 of the thin-film solar cell module 1, an ethylene vinyl acetate copolymer (EVA) is generally used. Further, as the material of the cover film 11, a fluorine-based film is used, and in particular, Tedler manufactured by DuPont is generally used, and a three-layer structure of Tedler / Al foil / Tedler is suitable for preventing moisture permeation. Used. PVDF / Al foil / PET and ETFE / Al foil / PET are also used.

As the insulating sheet portion 5, it is preferable to use a material whose reliability has already been confirmed from the viewpoint of reliability. In order to ensure insulation, it is better not to include metal, and a single sheet of Tedler is a suitable choice, but other inexpensive resin films such as PET are also used if they can ensure safety. It is possible. In order to provide the filler 7 between the unit cells 3 and 6 mm lead wires 6 connected in series and the single sheet, a three-layer structure of EVA / single sheet / EVA is preferably used.

  The 6 mm lead wire 6 is bent at the terminal box installation position so that the end of the 6 mm lead wire 6 is perpendicular to the substrate, and the 6 mm lead wire 6 is passed through as shown in FIGS. Then, the entire surface of the substrate is covered with the filler 7 provided with the slits 8.

  The cover film 11 also needs to be provided with an opening 12 for allowing the 6 mm lead wire 6 to pass. However, when a cover including a metal layer is used as the cover film 11 such as a Tedler / Al foil / Tedler three-layer sheet, the opening is used. When the 6 mm lead wire 6 and the metal layer are in electrical contact with each other at the portion 12, all the output of the solar cell is short-circuited by the metal layer, or no output is obtained, or the copper foil and the metal layer of one pole are Even in the case of contact, if a part of the cover film 11 comes into contact with a frame or a fixture to be installed later, electric leakage occurs and this causes a safety problem. In the industrial standard, it is determined that the dielectric strength voltage between the frame or metal fitting and the terminal should be maintained at 1.5 kV or more. Moreover, the form which uses a glass plate instead of the cover film 11 as another form is also considered. In that case, an opening is similarly provided. However, since it is difficult to provide two small openings in glass, there are many cases where one opening through which a lead wire passes is provided.

Further, for the purpose of improving the moisture resistance of the solar cell module 1, a thermoplastic moisture-proof sheet 9 that is slightly larger than the opening 12 of the cover film and is cut between the filler 7 and the cover film 11 is formed on the 6 mm lead wire 6. After setting around, cover film 11 is set. Further, a 6 mm lead wire 6 is taken out from the opening 12 of the cover film 11 and is passed through the slit 14 of the heat-resistant resin sheet 13 having a silicone release layer as shown in FIG. bent so as to be flat ascending to surface.

  The solar cell module 1 assembled in the above process is heat-pressed by a double vacuum tank laminator (abbreviated as vacuum laminator) in which a vacuum chamber is vertically separated by a rubber diaphragm. The solar cell module 1 is set in the apparatus with the glass facing down.

  First, the upper and lower vacuum chambers are evacuated at a temperature of about 100 ° C., and the solar cell module 1 is deaerated. The ultimate vacuum at this time is about 0.5 torr in the catalog of the apparatus. During this time, EVA melts and bubbles inside are removed. Next, the solar cell module 1 is pressure-bonded at atmospheric pressure by introducing the atmosphere into the upper vacuum chamber. As it is, the temperature is raised to about 150 ° C. to crosslink EVA.

  In this step, the silicone polymer migrates from the heat-resistant resin sheet 13 having the silicone release layer to the 6 mm lead wire 6, the surface of the thermoplastic moisture-proof sheet 9, and the surface of the cover film 11 around the opening 12. Mold processing is possible.

  The thin film solar cell module 1 assembled in this manner removes the filler 7 and the cover film 11 protruding from the periphery of the substrate, and has a heat-resistant resin sheet 13 having a silicone release layer attached around the 6 mm lead wire 6. Then, the terminal box 15 is attached to a predetermined place as shown in FIG. 4 to complete the product.

Bonding the terminal box 15 is coated with a silicone emission adhesives 17 to the mounting surface of the terminal box 15 is attached to the solar cell module 1. The 6 mm lead wire 6 taken out from the opening 12 of the cover film 11 is connected to the terminal block 16 of the terminal box 15. The terminal block 16 is preferably filled with solder, and is connected to the terminal block 16 by heating and melting the 6 mm lead wire 6. After connection, filling the terminal box 15 in the silicone over emissions resin 18.

  Here, the thermoplastic moisture-proof sheet 9 is a mixture of a butyl resin and a filler, and the butyl resin is poly (1-butylene), polyisobutylene, and a cross-linked product thereof, and is a mixed portion thereof. May be. As the filler, inorganic fillers such as calcium carbonate, talc, titanium dioxide, mica, silica gel, magnesium hydroxide, and aluminum hydroxide, and organic fillers such as acrylic resin, polystyrene resin, polyethylene resin, and carbon black are preferable.

The heat-resistant resin sheet 13 having the silicone release layer has a structure in which a silicone release layer is formed on the surface of the heat-resistant resin sheet, and the silicone release layer is formed on at least one surface, preferably formed on both surfaces. Has been. Further, in the step of melting and solidifying the filler layer, it is preferable that the surface of the heat-resistant resin sheet 13 having the silicone release layer on which the silicone release layer is formed is directed toward the cover film side.
The heat resistant resin sheet is a heat resistant resin sheet having a softening point or melting point of 150 ° C. or higher, preferably a heat resistant resin sheet having a softening point or melting point of 170 ° C. or higher, more preferably a heat resistant resin sheet having a softening point or melting point of 200 ° C. or higher. It is. When the softening point or the melting point is close to 150 ° C., when the thin-film solar cell module is laminated, the rigidity of the heat-resistant resin sheet is extremely lowered, and wrinkles may occur in the heat-resistant resin sheet 13 having a silicone release layer. It is not preferable. As the heat resistant resin sheet, a polyester resin sheet such as polyethylene terephthalate and polyethylene naphthalate, a polyolefin resin sheet such as polymethylpentene resin, a polycarbonate resin sheet, a polyarylate resin sheet, and a polyamide resin sheet can be used. Preferred are polyester resin sheets such as polyethylene terephthalate and polyethylene naphthalate, and more preferred are polyethylene terephthalate resin sheets.

As the heat-resistant resin sheet 13 having the silicone release layer, one having a thickness of 25 μm to 300 μm can be used. If the thickness is too thin, wrinkles may occur during heating. If the thickness is too thick, the thickness is 6 mm. The workability of the work of inserting the lead wire into the slit 14 of the heat resistant resin sheet having the silicone release layer is deteriorated. Preferably they are 50 micrometers-200 micrometers, More preferably, they are 75 micrometers-125 micrometers.

  For the release layer of the heat-resistant resin sheet 13 having the silicone release layer, a silicone release treatment agent is applied to the heat-resistant resin sheet, and if necessary, a curing treatment such as heat curing, ultraviolet curing, or electron beam effect ( It is formed by baking. As the silicone release treatment agent, an emulsion type, oil type, or baking type silicone release treatment agent can be used, and an oil type or baking type release treatment agent is preferable. As the oil type silicone release agent, polyalkylsiloxane, polymodified alkylsiloxane, and resin modified with polyalkylsiloxane can be used. As the baking type silicone release treatment agent, it is possible to use polyalkylsiloxane, polymodified alkylsiloxane, and a resin modified with polyalkylsiloxane mixed with a crosslinking agent such as peroxide or peroxide-containing silicone compound. it can. Also, polyalkylsiloxane, polymodified alkylsiloxane, and polyalkylsiloxane-modified resin are selected from epoxy groups, isocyanate groups, and unsaturated groups such as aryl groups, vinyl groups, acrylic groups, (meth) acrylic groups, etc. The release layer can be formed by baking a resin having at least one reactive functional group on a heat-resistant resin sheet.

As the silicone emission adhesives 17 for attaching the terminal box 15 has a polyorganosiloxane structure such as polydimethylsiloxane, acetone condensation type, alcohol condensed, it is room temperature curable with an oxime condensation curing method.

When laminating the thin film solar cell module 1, the silicone polymer migrates from the heat resistant resin sheet 13 having the silicone release layer to the surface of the thermoplastic moisture-proof sheet 9 and / or the cover film 11 around the opening 12. In order to facilitate, the release layer of the silicone release treatment sheet preferably contains 4% by weight or more of a low molecular weight silicone polymer having a molecular weight of 1500 or less. However, if the composition of the low molecular weight silicone polymer is too large, it is difficult to produce the heat-resistant resin sheet 13 having the silicone release layer. Therefore, the composition of the low molecular weight silicone polymer having a molecular weight of 1500 or less in the release layer is It is preferably 20% by weight or less, and more preferably 10% by weight or less. Note that the silicone polymer transferred from the heat-resistant resin sheet 13 having the silicone release layer does not become an obstacle to soldering when the 6 mm lead wire 6 is attached because the thickness thereof is extremely thin.

  In addition, during the manufacturing process of the solar cell including the step of melting and solidifying the filler layer using the vacuum laminator, or during storage of the thin film solar cell module, dirt is generated around the opening provided in the cover film or the cover glass. The effect of preventing the adhesion is that a transparent conductive film layer, a thin film semiconductor layer, and a back surface metal layer are sequentially formed on an insulating substrate, and a plurality of unit cells are integrated in a line. In the method of manufacturing a solar cell module in which the unit cell is covered with a filler layer and a cover film or a cover glass, one end of a 6 mm lead wire is connected to the positive and negative electrodes of the module, and the filler layer and the cover film are covered. A slit provided in the filler layer at the other end of the 6 mm lead wire, and an opening provided in the cover film Then, in the step of melting and solidifying the filler layer, a release treatment sheet comprising a silicone release agent layer and a heat-resistant resin sheet is used, and the mold release is performed by heat treatment for curing the filler layer. The silicone polymer is diffused from the treated sheet to simultaneously perform a mold release treatment process for adhering the silicone polymer to the periphery of the opening provided in the cover film, and the periphery of the opening provided in the cover film is stained. In the method of manufacturing a solar cell module, the method includes a step of preventing adhesion of the terminal box, and a terminal box is attached to the opening provided in the film with a silicone adhesive.

  Next, a specific application in which the thin film solar cell module 1 constructed on glass according to an embodiment of the present invention uses a three-layer film of EVA and Tedler / Al foil / Tedler will be described in detail.

  Float glass having a short side of 950 mm, a long side of 980 mm, and a thickness of 5 mm was used as the transparent insulating substrate. This glass is chamfered around the cut surface to prevent thermal cracking and mechanical destruction during the process.

  On this glass, 1000 Å of SiO2 was formed as an alkali barrier by thermal CVD, and 10,000 Å of fluorine-doped SnO2 was formed as a transparent conductive layer. The surface is uneven by the apex angle of the crystal grains. This transparent conductive film layer was provided with a groove by laser processing using the second harmonic of a YAG laser.

  A p-type amorphous silicon carbide was formed as a 100-inch thin film, an i-type amorphous silicon as a 3000-inch thin film, and an n-type amorphous silicon as a 300-inch thin film semiconductor layer by plasma CVD. A groove for connection to the adjacent photovoltaic element was provided using the second harmonic of the YAG laser.

  Further, on the thin film semiconductor layer, a sputtering method was used to form 1000 Å ZnO and 3000 Ａ Ag to form a back electrode layer. These back electrode layers formed grooves using the second harmonic of a YAG laser to obtain individual electrodes. With this configuration, unit cells 3 in which a semiconductor is sandwiched between a transparent electrode and a back electrode are connected in series. The unit cell 3 has a width of about 10 mm.

  Similarly, a bus region for collecting power at both ends of these unit cells 3 using laser processing was provided with a width of 5 mm. The distance between the positive electrode bus region and the negative electrode bus region was 960 mm. In this region, a plurality of grooves for exposing the transparent conductive film layer were provided, and bumps of Cerasolzer were provided in that portion using an ultrasonic soldering iron every 20 mm. Solder-plated copper foil having a width of 2 mm, a copper foil thickness of 0.2 mm, and a solder thickness of 0.1 mm was connected to the bumps to form bus bars 4.

  Further, the peripheral region of the thin-film solar battery 2 was polished using a sand blasting method and provided with a region where no upper layer was present.

  A solder-plated copper foil having a length of 490 mm and a width of 6 mm was connected to a position 60 mm from the substrate end of the bus bar 4. The thickness of this copper foil and the thickness of the solder are the same as the above-mentioned solder plated copper foil.

  Solder-plated copper foils were connected by superimposing them at the place of connection and melting the solder on the copper foil with a soldering iron while pressing. In order to insulate the 6 mm-width solder-plated copper foil (6 mm lead wire 6) and the surface of the unit cell 3, the length is 950 mm, the width is 25 mm, 0.4 mm thickness EVA, 0.05 mm thickness Tedler, and 0 .Three layers of EVA with a thickness of 4 mm were inserted into the gap.

Example 1
The 6 mm lead wire 6 was bent so that the end of the thin film solar cell 2 was perpendicular to the substrate with an interval of 20 mm at the center of the short side of the thin film solar cell 2. On top of that, an EVA sheet having a width of 980 mm and a length of 950, in which two slits 8 having a length of 40 mm were provided at the place, was set. A 6 mm lead wire 6 from both poles was drawn out from the slit 8. The drawer portion was set 30 mm × 60 mm, the thermoplastic anti showed over preparative 9 thick 0.7mm form through the slit 10.

As the cover film 11, a back film having a three-layer structure of Tedler / Al foil / Tedler provided with an opening 12 of approximately 15 mm × 21 mm is taken out from the opening 12 so that the solder-plated copper foil is taken out, and further, 40 mm × 60 mm, through a PET resin sheet slit 14 having a silicone release layer on both sides of the thickness 0.075 mm, bending the 6mm leads 6 to be flat row on the surface of the cover film 11.

  These were laminated with a double vacuum tank laminator (abbreviation vacuum laminator) to obtain the thin film solar cell module 1 of the present invention.

  After removing the silicone resin release treated PET resin sheet from the thin film solar cell module 1, the low molecular silicone polymer migrates to the surfaces of the 6 mm lead wire 6 and the thermoplastic adhesive moisture proof sheet 9 of the thin film solar cell module 1, It was found that the surface was subjected to mold release treatment, and the 6 mm lead wire 6 and the thermoplastic moisture-proof sheet 9 did not adhere to each other. A terminal box 15 having a size of 65 mm × 60 mm is fixed with 4 g of silicone adhesive 17, 6 mm lead wire 6 is soldered to terminal block 16 of terminal box 15, and the inside of the terminal box is potted with silicone resin 18. . When this terminal box 15 was pulled from the solar cell module 1 in the vertical direction, the entire bonding surface was coherently broken, and the maximum tensile strength was 650N.

(Comparative Example 1)
In Example 1, instead of the PET resin sheet subjected to the silicone release treatment, the 6 mm lead wire 6 of the cover film 11 was passed through the slit of the PET resin sheet treated with the fluorine resin release treatment of 40 mm × 60 mm and thickness 0.075 mm. bent so as to be flat ascending to surface.

  These were laminated with a double vacuum tank laminator (abbreviation vacuum laminator) to obtain the thin film solar cell module 1 of the present invention.

  After the PET resin sheet subjected to the fluororesin release treatment is removed from the thin film solar cell module 1, the fluororesin migrates to the lead wires of the thin film solar cell module 1 and the surface of the thermoplastic adhesive moisture-proof sheet 9, and the surface is subjected to the release treatment. It was found that the 6 mm lead wire 6 and the thermoplastic moisture-proof sheet 9 do not stick. The terminal box 15 having a size of 65 mm × 60 mm was fixed with 4 g of silicone, the 6 mm lead wire 6 was soldered to the terminal block 16 of the terminal box 15, and then the inside of the terminal box was potted with the silicone resin 18. When this terminal box 15 was pulled vertically from the solar cell module, peeling occurred at a part of the adhesive surface, and the maximum tensile strength was 350 N.

(Comparative Example 2)
In Example 1, instead of a PET resin sheet subjected to a silicone release treatment, a fabric sheet (manufactured by Chuko Chemical) impregnated with a fluororesin having a size of 40 mm × 60 mm and a thickness of 0.2 mm was used. As a result, it was found that the 6 mm lead wire 6 and the thermoplastic moisture-proof sheet 9 were adhered to each other in the work, and difficulties were caused in the terminal box mounting work. The terminal box was fixed with silicone resin 18 by fixing with 4 g of silicone adhesive 17. When the terminal box 15 was pulled vertically from the solar cell module, the maximum tensile strength was 400N.

1. 1. Thin film solar cell module 2. Thin film solar cell Unit cell 4. 4. Bus bar Insulation sheet 6.6mm lead wire
7). Filler
8). 8. Filler slit Thermoplastic moisture-proof sheet 10. Thermoplastic moisture-proof sheet slit
11. Cover film 12. Cover film opening
13. 13. Release treatment sheet having a silicone release layer 15. Slit of release processing sheet having a silicone release layer Terminal box 16. Terminal block 17. Silicone adhesive 18. Silicone resin

Claims (5)

On an insulating substrate, a transparent conductive film layer, a thin film semiconductor layer, a plurality of unit cells back metal layer are sequentially formed is integrated by being serially connected in line shape, and the plurality In the method of manufacturing a solar cell module in which the unit cell is covered with a filler layer and a cover film or a cover glass having an opening,
Positive and negative electrodes of the modules in series opposite end portions of the plurality of unit cells is connected to one end of the lead wire, on which a filler layer, wherein the cover film or the cover glass is covered et Re ,
At least around the opening, an adhesive thermoplastic moisture-proof sheet is disposed between the filler layer and the cover film or cover glass, and a silicone release agent layer is disposed on at least one surface. A release treatment sheet made of a conductive resin sheet is disposed on the surface of the cover film or cover glass ,
The release process sheet, a silicone release agent layer is disposed so as to face the front surface of the cover film or the cover glass,
The other end of the lead wire, a first slit provided in the filler layer, a second slit formed in the thermoplastic moisture-proof sheet, an opening provided in the cover film or the cover glass, and the Passed through a third slit provided in the release sheet ,
Melting and solidifying the filler layer ;
Removing the heat-resistant resin sheet of the release treatment sheet from the surface of the cover film or cover glass ; and attaching a terminal box with a silicone adhesive around the opening on the surface of the cover film or cover glass Steps in this order,
In the step of melting and solidifying the filler layer, the silicone polymer contained in the silicone release agent layer of the release treatment sheet is obtained by heat treatment for melting the filler layer, and the thermoplastic moisture-proof sheet surface , and said adhering to the opening peripheral edge of the cover film or the surface of the cover glass, the release-process is characterized by being performed at the same time, the method of manufacturing the solar cell module. Before KiHanare-treated sheet is ing from the both sides were placed silicone release agent layer heat-resistant resin sheet, a manufacturing method of a solar cell module according to claim 1.   The method for manufacturing a solar cell module according to claim 1, wherein the heat resistant resin sheet is a PET resin sheet.   The method for producing a solar cell according to claim 1, wherein the silicone release agent layer has a silicone polymer having a molecular weight of 1500 or less of 4% by weight or more.   The method for manufacturing a solar cell module according to claim 1, wherein the insulating substrate is a glass substrate.

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