JP5632777B2 - Method of cleaning PCB decontaminated equipment - Google Patents

Method of cleaning PCB decontaminated equipment Download PDF

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JP5632777B2
JP5632777B2 JP2011051051A JP2011051051A JP5632777B2 JP 5632777 B2 JP5632777 B2 JP 5632777B2 JP 2011051051 A JP2011051051 A JP 2011051051A JP 2011051051 A JP2011051051 A JP 2011051051A JP 5632777 B2 JP5632777 B2 JP 5632777B2
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pcb
coating film
wall
paint
contaminated equipment
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JP2012187456A (en
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小倉 正裕
正裕 小倉
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Shinko Pantec Co Ltd
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Kobelco Eco Solutions Co Ltd
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Description

本発明は、PCB汚染機器無害化施設の浄化方法に関する。   The present invention relates to a purification method for a PCB-contaminated equipment detoxification facility.

PCB(ポリ塩化ビフェニル)は、安定性、不燃性、電気絶縁性に優れていることから、過去においてコンデンサやトランス等の電気機器の絶縁油に多用されていたが、後に、その難分解性と毒性とが明らかとなり現在では使用が禁じられている。
そして、その使用を規制するとともにPCBを含有する絶縁油が既に含まれているコンデンサやトランス等の機器(以下「PCB汚染機器」ともいう)については回収措置がとられて下記特許文献1に示されているように管理区域が設けられた特別な施設において無害化処理がなされている。
このようなPCB汚染機器無害化施設の前記管理区域においては、PCB汚染機器からPCB含有絶縁油を抜油したり、PCB汚染機器を解体処理するような工程が実施されるために、空気中に低濃度ながらもPCBを含有させており、該管理区域から屋外への排気は、活性炭フィルターを通じて行われたりしている。
PCB (polychlorinated biphenyl) has been widely used in insulating oils for electrical equipment such as capacitors and transformers in the past because of its excellent stability, nonflammability, and electrical insulation properties. Toxicity is apparent and its use is now prohibited.
In addition, with regard to devices such as capacitors and transformers (hereinafter also referred to as “PCB-contaminated devices”) that restrict their use and already contain PCB-containing insulating oil (hereinafter also referred to as “PCB-contaminated devices”), the following Patent Document 1 shows that As is done, detoxification is done in special facilities with controlled areas.
In the management area of such a PCB-contaminated equipment detoxification facility, a process such as extracting the PCB-containing insulating oil from the PCB-contaminated equipment or disassembling the PCB-contaminated equipment is performed. PCB is contained even though it is concentrated, and the exhaust from the management area to the outside is performed through an activated carbon filter.

ところで、コンデンサやトランス等のPCB汚染機器は、これまでの無害化処理によって処理対象数を大きく減少させており、今後は、PCB汚染機器の無害化処理をどのように終結させるかが新たなる課題となる。
例えば、PCB汚染機器の無害化処理が終了した時点においては、PCB汚染機器からのPCB含有絶縁油の抜油に利用される装置や、PCB汚染機器を解体する装置などのPCBがある程度付着している装置の無害化処理を実施する必要がある。
また、これらの設備が設置されているPCB汚染機器無害化施設の建物そのものを最終的には無害化処理する必要が生じる。
例えば、前記管理区域の間仕切壁、床、天井などは、PCBを含んだ空気に長期に渡って曝露され続けているために、その壁面からある程度の深さに達するまでの間に処理を要する濃度以上にPCBが浸透しているおそれを有する。
しかし、このような壁面からPCBを除去してPCB汚染機器無害化施設を浄化することについては殆ど検討されている事例がなく、有効な方法が確立されていない。
By the way, PCB contaminated equipment such as capacitors and transformers has been greatly reduced in the number of objects to be treated by the conventional detoxification process, and in the future, how to end the detoxification process of PCB contaminated equipment will be a new issue. It becomes.
For example, at the time when the detoxification process of the PCB contaminated equipment is finished, PCBs such as a device used for removing the PCB-containing insulating oil from the PCB contaminated device and a device for disassembling the PCB contaminated device are attached to some extent. It is necessary to carry out detoxification processing of the equipment.
In addition, it is necessary to finally detoxify the building itself of the PCB-contaminated equipment detoxification facility where these facilities are installed.
For example, since the partition walls, floors, ceilings, etc. of the management area continue to be exposed to air containing PCB for a long period of time, the concentration that requires treatment before reaching a certain depth from the wall surface. As described above, there is a possibility that PCB has penetrated.
However, there has been almost no study on the removal of PCB from such a wall to purify a PCB-contaminated equipment detoxification facility, and an effective method has not been established.

特開2003−035044号公報JP 2003-035044 A

本発明は、このような問題点に鑑み、効率良くPCB汚染機器無害化施設を浄化することができるPCB汚染機器無害化施設の浄化方法を提供することを課題としている。   In view of such problems, an object of the present invention is to provide a method for purifying a PCB-contaminated equipment detoxification facility that can efficiently purify the PCB-contaminated equipment detoxification facility.

上記課題を解決するためのPCB汚染機器無害化施設の浄化方法に係る本発明は、PCBを含んだ空気に曝露されたPCB汚染機器無害化施設のコンクリート製の壁の表面に液体塗料で塗膜を形成させ、該塗膜を硬化させた後に該硬化させた塗膜とともに前記壁の表面を削り取り、前記壁の表面に付着しているPCBを前記壁から除去することを特徴としている。 In order to solve the above-mentioned problems, the present invention relating to a method for purifying a PCB-contaminated equipment detoxification facility is provided with a liquid paint on the surface of a concrete wall of a PCB-contaminated equipment detoxification facility exposed to PCB-containing air. to form, together with the coating film is cured after curing the coating film scraped surface of the wall, a PCB adhering to the front side of the wall is characterized by removing from said wall.

PCB汚染機器の無害化処理が行われる施設の間仕切壁、床、天井は、種々の素材で形成されており、例えば、表面平滑な金属板などで形成されているようであれば洗浄剤を含浸させた布帛などで表面付着しているPCBを拭き取り除去することが容易に実施し得るものの一般的なコンクリートや軽量気泡コンクリート(ALC)などのように表面に微細な凹凸が形成されているもので壁面が形成されている場合には微細な凹入部分にまでPCBの除去効果を発揮させることは困難である。
一方で本発明においては、液体塗料を用いることから壁面への追従性に優れた塗膜を形成させることができる。
そして、この塗膜を硬化させた後に剥離することによって壁面に付着しているPCBを前記塗膜に付着させて除去することから微細な凹入部分にまでPCBの除去効果を発揮させ得る。
Partition walls, floors, and ceilings of facilities where PCB decontamination equipment is detoxified are made of various materials. For example, if they are made of a smooth metal plate, impregnated with a cleaning agent Although it is easy to wipe off and remove PCBs that are attached to the surface with a cloth that has been removed, it has fine irregularities formed on the surface, such as general concrete and lightweight cellular concrete (ALC). In the case where the wall surface is formed, it is difficult to exert the PCB removing effect even in the fine recessed portion.
On the other hand, in the present invention, since a liquid paint is used, it is possible to form a coating film excellent in followability to the wall surface.
Then, after the coating film is cured and then peeled off, the PCB adhering to the wall surface can be adhered to the coating film and removed, so that the PCB removal effect can be exhibited even in the fine recessed portion.

なお、上記のような場合において、塗膜を形成させることなく所謂“削(はつ)り”と呼ばれる作業を行ってALC等の表面の一部を除去しようとするとPCBを含んだ微細な粉塵を大量発生させてしまい、壁面に固定されているPCBを拡散させてしまう結果、かえって多大な手間を要するおそれがある。
一方で、本発明のごとく、塗膜を形成させた上であれば、“削り”作業を実施しても、塗膜によってALCの破片が細かく散らばることが防止され、粉塵の発生が抑制され得る。
従って、本発明は、このような点においても効率的なPCB除去が実施可能なものであるといえる。
即ち、本発明によれば効率的にPCB汚染機器無害化施設を浄化することができる。
In the above case, if a part of the surface of ALC or the like is removed by performing a so-called “sharpening” operation without forming a coating film, fine dust containing PCB As a result, the PCB fixed to the wall surface is diffused, and as a result, a great deal of labor may be required.
On the other hand, if the coating film is formed as in the present invention, even if the “shaving” operation is performed, the ALC fragments are prevented from being finely scattered by the coating film, and the generation of dust can be suppressed. .
Therefore, it can be said that the present invention can implement efficient PCB removal also in this respect.
That is, according to the present invention, the PCB-contaminated equipment detoxification facility can be purified efficiently.

本発明の実施の形態について以下に説明する。
本実施形態に係るPCB汚染機器無害化施設の浄化方法においては、PCBを含んだ空気に曝露されたPCB汚染機器無害化施設の壁面に液体塗料で塗膜を形成させる塗膜形成工程、該塗膜を硬化させる硬化工程、該硬化した塗膜を剥離する剥離工程を実施し、該剥離工程において前記壁面に付着しているPCBの除去を実施する。
Embodiments of the present invention will be described below.
In the method for purifying a PCB-contaminated equipment detoxification facility according to the present embodiment, a coating film forming step of forming a coating film with a liquid paint on the wall surface of the PCB-contaminated equipment detoxification facility exposed to air containing PCB, A curing process for curing the film and a peeling process for peeling the cured coating film are performed, and the PCB attached to the wall surface is removed in the peeling process.

なお、PCB汚染機器無害化施設を構成している浄化対処物としては、例えば、日常的にPCBを含んだ空気に曝露されている作業室の間仕切壁、床、天井等が挙げられるが、以下には、コンクリート製の間仕切壁の浄化を行う場合を例に挙げて各工程について説明する。   In addition, examples of the purification countermeasures constituting the PCB-contaminated equipment detoxification facility include partition walls, floors, ceilings, and the like that are routinely exposed to air containing PCB. In the following, each step will be described by taking as an example the case of purifying a concrete partition wall.

(塗膜形成工程)
当該塗膜形成工程において前記間仕切壁の壁面に塗布する塗料としては、特に限定されるものではないが、エポキシ樹脂系塗料、アクリル樹脂系塗料、ポリウレタン系塗料などが採用可能である。
また、前記塗料は、水系溶媒によってポリマー成分が希釈されている水系塗料であっても有機溶媒によってポリマー成分が希釈されている有機溶媒系のものであってもよい。
この塗料として、水系の塗料を採用すると、塗膜形成作業の作業環境を有機溶媒系の塗料を用いる場合に比べてクリーンなものとすることができる。
一方で、有機溶媒系の塗料を用いると、塗料に含まれている有機溶媒によって壁面よりも内部に浸透しているPCBを表面側に抽出させる作用を期待することができる。
(Coating film formation process)
In the coating film forming step, the coating applied to the wall surface of the partition wall is not particularly limited, but an epoxy resin-based paint, an acrylic resin-based paint, a polyurethane-based paint, or the like can be employed.
The paint may be an aqueous paint in which a polymer component is diluted with an aqueous solvent or an organic solvent in which a polymer component is diluted with an organic solvent.
When a water-based paint is used as the paint, the working environment of the coating film forming operation can be made cleaner than when an organic solvent-based paint is used.
On the other hand, when an organic solvent-based paint is used, it is possible to expect an action of extracting PCB penetrating into the interior from the wall surface to the surface side by the organic solvent contained in the paint.

なお、本実施形態においては、後段において詳述するが、間仕切壁の表面部を削って壁面を塗膜側に付着させた状態で該塗膜を間仕切壁から剥離する剥離工程を実施する。
この間仕切壁の削(はつ)りは、塗膜の上から打撃を与えることによって実施させるため、打撃力の伝達性に優れた硬質な塗膜を形成させることが好ましく、前記のような塗料の中でも比較的硬質な塗膜を形成させることができるエポキシ樹脂系塗料を採用することが好ましい。
In addition, in this embodiment, although explained in full detail in the back | latter stage, the peeling process which peels this coating film from a partition wall in the state which shaved the surface part of the partition wall and made the wall surface adhere to the coating film side is implemented.
Since this partition wall shaving is performed by giving a blow from above the coating film, it is preferable to form a hard coating film with excellent impact force transferability. Among these, it is preferable to employ an epoxy resin-based paint that can form a relatively hard coating film.

また、用いる塗料としては、その塗布領域を把握することができるように壁面とは異なる色合いに着色されていることが好ましい。
このようにして塗料を壁面とは異なる色合いに着色しておくことにより、後段の剥離工程において間仕切壁の表面部を削った結果、多くのコンクリート片を発生させた場合でも、どのコンクリート片が間仕切壁の壁面を形成していたかが色合いの異なる塗膜の付着によって把握することができ、PCB濃度の高いコンクリート片を容易に把握することができるという効果も発揮される。
Moreover, as a coating material to be used, it is preferable that it is colored in a different hue from the wall surface so that the application region can be grasped.
By coloring the paint in a color different from that of the wall in this way, even if a large number of concrete pieces are generated as a result of shaving the surface of the partition wall in the subsequent peeling step, which concrete piece is the partition. Whether the wall surface of the wall has been formed can be grasped by the adhesion of a coating film having a different hue, and the effect that a concrete piece having a high PCB concentration can be easily grasped is also exhibited.

この塗料によって形成させる塗膜は、ある程度の厚みを有していないと剥離が困難となる一方で、過度に厚みを厚くしても硬化に要する時間を長期化させるおそれを有する。
このようなことから、用いる塗料の材質にもよるが、形成させる塗膜の乾燥厚みは、通常、0.2mm〜2mm程度とされる。
The coating film formed with this paint is difficult to peel off unless it has a certain thickness. On the other hand, even if the thickness is excessively thick, the time required for curing may be prolonged.
For this reason, although depending on the material of the paint used, the dry thickness of the coating film to be formed is usually about 0.2 mm to 2 mm.

なお、塗料の粘度が低いと上記のような厚みを確保することが困難になる一方で過度に粘度が高いと壁面に対する濡れ広がりが不十分になって、壁面の凹凸への追従が不十分になるおそれを有する。
このようなことから、塗料は施工時に粘性を有していれば良く、塗料の粘度は、例えば40℃の状態で1Pa・s以下、更には、0.01Pa・s〜0.1Pa・s程度とされる。
なお、ここでいう粘度とは、回転粘度計などの非ニュートン流体用の粘度計によって測定されるものを意図している。
If the viscosity of the paint is low, it is difficult to ensure the thickness as described above. On the other hand, if the viscosity is excessively high, wetting and spreading to the wall surface is insufficient, and the wall surface is not sufficiently tracked. There is a risk of becoming.
For this reason, it is sufficient that the paint has a viscosity at the time of construction. The viscosity of the paint is, for example, 1 Pa · s or less at a temperature of 40 ° C., and further about 0.01 Pa · s to 0.1 Pa · s. It is said.
In addition, the viscosity here is intended to be measured by a viscometer for non-Newtonian fluid such as a rotational viscometer.

この塗料の間仕切壁への塗布方法としては、ローラー塗布、はけ塗り、スプレー塗布等といった一般的な方法を採用することができる。   As a method for applying the paint to the partition wall, a general method such as roller coating, brush coating, spray coating, or the like can be employed.

(硬化工程)
前記塗膜形成工程において形成させた塗膜は、要すれば、輻射加熱が可能なヒーターや温風ヒーターなどを用いて硬化促進を図ってもよく、硬化塗膜が形成されるまでの間、室温のままにしておき、単に一定の硬化期間を設けるようにしてもよい。
また、要すれば、この硬化工程を実施して、塗膜を硬化させた後で、再び塗料を重ね塗りして塗膜の厚膜化を図ってもよい。
さらには、硬化した塗膜の上に、粘着シートを貼り付けるなどして後段における剥離工程でのコンクリート片の飛散抑制を図るようにしてもよい。
(Curing process)
The coating film formed in the coating film forming step may be accelerated by using a heater capable of radiant heating or a hot air heater, if necessary, until the cured coating film is formed. It may be left at room temperature and simply provided with a certain curing period.
In addition, if necessary, after the curing step is performed and the coating film is cured, the coating film may be applied again to increase the thickness of the coating film.
Furthermore, you may make it aim at suppression of scattering of the concrete piece in the peeling process in a latter stage, such as sticking an adhesive sheet on the cured coating film.

(剥離工程)
前記のように本実施形態においては、間仕切壁の表面を削る形で剥離工程を実施する。
即ち、本実施形態においては、硬化させた塗膜を間仕切壁の表面部とともに間仕切壁から剥離する工程を実施し、この間仕切壁の壁面に付着しているPCBから内部に浸透しているPCBまでをも塗膜に付着させた形で除去させる。
このような態様による剥離工程は、チゼルやロッドを装着させたチッパーなどの工事用具を用いて実施することができる。
なお、そのような場合には、微細なコンクリート片を周囲に飛散させないように、例えば、間仕切壁から1〜2m離れた位置において対向するように工事用シートなどのシート材を配置し、その間に作業員を配して剥離工程を実施させることが好ましい。
(Peeling process)
As described above, in the present embodiment, the peeling step is performed in the form of cutting the surface of the partition wall.
That is, in this embodiment, the step of peeling the cured coating film from the partition wall together with the surface portion of the partition wall is performed, and from the PCB adhering to the wall surface of the partition wall to the PCB penetrating into the interior Is also removed in a form adhered to the coating film.
The peeling process by such an aspect can be implemented using construction tools, such as a chipper to which a chisel or a rod is attached.
In such a case, for example, a sheet material such as a construction sheet is arranged so as to be opposed to each other at a position 1 to 2 m away from the partition wall so as not to scatter fine concrete pieces around. It is preferable to perform an exfoliation process with an operator.

なお、この剥離工程においては、過度に深い位置まで間仕切壁の表面部を削ると、処理対象物の量を必要以上に増大させることになるため、コンクリートやモルタルなどであれば、通常、平均して5mm〜10mm深さまで削るようにすればよい。   In this exfoliation process, if the surface of the partition wall is cut to an excessively deep position, the amount of the object to be processed is increased more than necessary. Then, it may be cut to a depth of 5 mm to 10 mm.

この剥離工程後、間仕切壁からPCBが十分除去され、当該間仕切壁が十分に浄化されているかどうかは、剥離させた後の部材について、部材採取試験法によりPCB濃度を測定し、0.01mg/kg以下であることにより確認する。
といった方法で確認することができる。
なお、剥離工程で得られる塗膜とコンクリートとを混在させた処理対象物は、プラズマ溶解炉などを利用して含有するPCBを熱分解させるとともにスラグ化して無害化させればよい。
After this peeling step, PCB is sufficiently removed from the partition wall, and whether the partition wall is sufficiently purified is determined by measuring the PCB concentration by the member sampling test method for the member after peeling, and 0.01 mg / Confirm that it is less than kg.
It can be confirmed by such a method.
In addition, what is necessary is just to make the processing target object which mixed the coating film and concrete obtained at a peeling process thermally decompose PCB contained using a plasma melting furnace etc., and to make it harmless by making it slag.

本実施形態に係るPCB汚染機器無害化施設の浄化方法は、必ずしも、PCB汚染機器無害化施設全体を取り壊す場合においてのみ実施されるものではなく、設備レイアウトの変更に伴って管理区域を変更したりするような場合においても実施が可能なものである。
即ち、削った部分を新たなコンクリートで埋め戻してこの間仕切壁で仕切られている部屋を非管理区域として改めて利用することもでき、逆に、非管理区域であった部屋と管理区域であった部屋との間の間仕切壁を取り除いて2部屋続きの状態にして新たに利用するのに際して、この間仕切壁から一旦PCBに汚染されている部分を取り除く場合においても本発明を採用することも可能である。
The method for purifying a PCB-contaminated equipment detoxification facility according to the present embodiment is not necessarily performed only when the entire PCB-contaminated equipment detoxification facility is demolished. Even in such a case, implementation is possible.
In other words, the shaved part can be backfilled with new concrete, and the room partitioned by this partition wall can be used again as an unmanaged area, and conversely, it was a room and a managed area that were unmanaged areas. It is also possible to adopt the present invention even when a part contaminated with PCB is once removed from the partition wall when the partition wall between the rooms is removed and newly used in a state where two rooms are connected. is there.

また、本実施形態においては、間仕切壁を浄化の対象としているが、天井や床の壁面に対して付着しているPCBを除去するような場合も本発明が意図する範囲である。
さらには、本実施形態においては、浄化対象物である壁の表面部を塗膜側に付着させて前記浄化対象物から塗膜を剥離しているが、例えば、塗膜と壁面との界面で塗膜を剥離するような場合も塗膜にPCBを付着させて除去する上においては本発明が意図する範囲のものである。
Further, in this embodiment, the partition walls are targeted for purification, but the present invention also intends to remove PCB attached to the ceiling or floor wall.
Furthermore, in this embodiment, the surface portion of the wall that is the purification object is attached to the coating film side to peel the coating film from the purification object. For example, at the interface between the coating film and the wall surface, The case where the coating film is peeled is also within the range intended by the present invention in removing PCB by attaching it to the coating film.

なお、本実施形態においては壁面(間仕切壁)表面を削ることによって剥離工程を実施したが、これに限定されず、単に表面に塗布した塗料のみを剥離するようにしても良い。特に壁面が非含浸性の部材であればPCBに暴露し、付着しているのは表面だけであるため、表面に強固に付着したPCBのみを除去すれば足りる。
即ち、塗料を塗布することによって壁面表面のPCBが塗料に吸着されるため、この塗料により形成された塗膜のみを剥離すればよい。
また、剥離の方法も打撃による剥離に限定されず、塗膜が柔軟性を有しているような場合には、塗膜の一部を切り起したり、塗膜の端をめくり上げて掴みしろを形成させ、該掴みしろを壁面から離れる方向に引張って塗膜を剥離するようにしてもよくこのような方法によれば塗膜粉砕時の飛散を抑制しうる。
その他にも上記例示の方法に各種変更を加えて本発明を実施することができ、PCBの除染技術に係る事項については、本発明の効果が著しく損なわれない範囲においては、本発明に採用が可能なものである。
In the present embodiment, the peeling step is performed by scraping the wall surface (partition wall) surface. However, the present invention is not limited to this, and only the paint applied to the surface may be peeled off. In particular, if the wall surface is a non-impregnated member, it is exposed to the PCB and only the surface adheres to it, so it is sufficient to remove only the PCB firmly adhered to the surface.
That is, since the PCB on the wall surface is adsorbed by the paint by applying the paint, only the coating film formed by this paint needs to be peeled off.
Also, the peeling method is not limited to peeling by impact, and when the coating film has flexibility, a part of the coating film is cut up or the edge of the coating film is turned up and gripped. The coating may be peeled off by forming a margin and pulling the gripping margin away from the wall surface. According to such a method, scattering at the time of pulverizing the coating can be suppressed.
In addition, the present invention can be implemented with various modifications to the above-exemplified methods, and the matters relating to the PCB decontamination technology are adopted in the present invention as long as the effects of the present invention are not significantly impaired. Is possible.

Claims (4)

PCBを含んだ空気に曝露されたPCB汚染機器無害化施設のコンクリート製の壁の表面に液体塗料で塗膜を形成させ、該塗膜を硬化させた後に該硬化させた塗膜とともに前記壁の表面を削り取り、前記壁の表面に付着しているPCBを前記壁から除去することを特徴とするPCB汚染機器無害化施設の浄化方法。 A coating film is formed with a liquid paint on the surface of a concrete wall of a PCB-contaminated equipment detoxification facility exposed to PCB-containing air, and after the coating film is cured , scraped surface cleaning method of PCB contaminated equipment detoxifying facility and removing the PCB adhering to the front side of the wall from the wall. 削り取ったコンクリートが飛散することを抑制し得るように壁表面に対向するようにシート材を配置して前記壁の表面を削る請求項1記載のPCB汚染機器無害化施設の浄化方法。 The method for purifying a PCB-contaminated equipment detoxification facility according to claim 1, wherein the surface of the wall is shaved by arranging a sheet material so as to face the wall surface so that the scraped concrete can be prevented from scattering. 前記液体塗料がエポキシ樹脂系塗料である請求項1又は2記載のPCB汚染機器無害化施設の浄化方法。The method for purifying a PCB-contaminated equipment detoxification facility according to claim 1 or 2, wherein the liquid paint is an epoxy resin-based paint. 前記液体塗料が、塗布される壁と異なる色合いに着色されている請求項1乃至3の何れか1項に記載のPCB汚染機器無害化施設の浄化方法。The method for purifying a PCB-contaminated equipment detoxification facility according to any one of claims 1 to 3, wherein the liquid paint is colored in a color different from a wall to which the liquid paint is applied.
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