JP5623340B2 - Lighting device - Google Patents

Description

  The present invention relates to a lighting device including a semiconductor light emitting device.

  2. Description of the Related Art In recent years, development of a semiconductor light-emitting device and a lighting device that use a semiconductor light-emitting element such as a light-emitting diode (LED) as a light-emitting unit has been advanced (see, for example, Patent Document 1). 2. Description of the Related Art A semiconductor light emitting device having a semiconductor light emitting element has attracted attention with respect to power consumption or product life.

JP 2009-283449 A

  Here, the semiconductor light emitting element outputs light having high directivity. For this reason, in the illuminating device, when the position of the semiconductor light emitting element is changed or the reflection state is changed, the illuminating position and the light intensity are changed, so that the illuminating state is changed. An object of this invention is to provide the illuminating device which can output light more stably and can illuminate a predetermined area | region stably.

  An illuminating device according to an embodiment of the present invention is a housing having an opening, the housing having a locking portion protruding in the opening toward the center of the opening, and the inside of the housing. The semiconductor light emitting device that emits light toward the opening and the light emitting device that is disposed between the opening edge of the opening and the semiconductor light emitting device inside the housing and reflects the light emitted from the semiconductor light emitting device toward the opening The reflector has a claw portion that hooks from the semiconductor light emitting device side toward the opening side of the locking portion of the housing, and is disposed with a gap between the light emitting portion of the semiconductor light emitting device. Yes.

  According to the present invention, light can be output more stably, and a predetermined area can be illuminated stably.

FIG. 1 is an exploded perspective view showing a schematic configuration of the illumination device according to the present embodiment. FIG. 2 is an explanatory view of the illumination device shown in FIG. 1 viewed from one direction. 3 is a cross-sectional view of the lighting device shown in FIG. 2 taken along line X ₁ -X ₁ . Figure 4 is an explanatory view of the illumination device as seen from the A ₁ direction shown in FIG. Figure 5 is an explanatory view of the illumination apparatus shown in FIG. 2 from B ₁ direction. Figure 6 is an explanatory view of the illumination apparatus shown in FIG. 2 from C ₁ direction. FIG. 7 is an explanatory view showing a part of the first holding member and the reinforcing member in an enlarged manner. FIG. 8 is an exploded perspective view showing a schematic configuration of the second illumination unit according to the present embodiment. FIG. 9 is an explanatory view of the second illumination unit shown in FIG. 8 as viewed from one direction. 10 is a cross-sectional view taken along line X ₂ -X ₂ of the second illumination unit shown in FIG. 11 is a cross-sectional view taken along line X ₃ -X ₃ of the second illumination unit shown in FIG. Figure 12 is an explanatory view seen from the A ₂ direction a second illumination unit shown in FIG. Figure 13 is an explanatory view of the second illumination unit shown in FIG. 9 B ₂ direction. Figure 14 is an explanatory view of the second illumination unit shown in FIG. 9 C ₂ direction. FIG. 15 is a perspective view showing a schematic configuration of the semiconductor light emitting device shown in FIG. FIG. 16 is a schematic perspective view of a semiconductor light emitting element constituting the semiconductor light emitting device. 17 is a cross-sectional view of the semiconductor light emitting element shown in FIG. 16 taken along line YY.

Embodiments of a lighting device according to the present invention will be described below with reference to the accompanying drawings. In addition, this invention shall not be limited to the following embodiment. FIG. 1 is an exploded perspective view showing a schematic configuration of the illumination device according to the present embodiment. FIG. 2 is an explanatory view of the illumination device shown in FIG. 1 viewed from one direction. 3 is a cross-sectional view of the lighting device shown in FIG. 2 taken along line X ₁ -X ₁ . Figure 4 is an explanatory view of the illumination device as seen from the A ₁ direction shown in FIG. Figure 5 is an explanatory view of the illumination apparatus shown in FIG. 2 from B ₁ direction. Figure 6 is an explanatory view of the illumination apparatus shown in FIG. 2 from C ₁ direction. FIG. 7 is an explanatory view showing a part of the first holding member and the reinforcing member in an enlarged manner.

<Configuration of lighting device>
The lighting device 1 is directly attached to a room such as a ceiling or a wall, or is used outdoors. And the light emitted from the illuminating device 1 can illuminate indoors or outdoors.

  The lighting device 1 includes a holding unit 2, a first lighting unit 3 held by the holding unit 2, a second lighting unit 4 held by the holding unit 2, a first lighting unit 3, and a second lighting unit 4. And a connected wiring portion 5. The wiring unit 5 is a power line that supplies power to the first lighting unit 3 and the second lighting unit 4. The 1st illumination part 3 and the 2nd illumination part 4 of this embodiment are the rod-shape extended in one direction. The wiring unit 5 is disposed inside the holding unit 2, and one end is connected to the first lighting unit 3 and the second lighting unit 4, and the other end is connected to an external power source. The illuminating device 1 can make the wiring part 5 difficult to see from the outside by incorporating a part of the wiring part 5 in the holding part 2.

<Configuration of holding unit>
The holding unit 2 is a mechanism that holds the first lighting unit 3 and the second lighting unit 4, and is fixed to a target to which the lighting device 1 is fixed, such as a ceiling or a base. The holding unit 2 includes a first holding member 10, a second holding member 12, and reinforcing members 14 and 16. Moreover, the holding | maintenance part 2 is equipped with the bolts 18 and 20 and the nut 22 as a fastening element which fastens each part.

  The first holding member 10 faces the first illumination unit 3 and the second illumination unit 4 and has a box shape in which the surface opposite to the surface facing the first illumination unit 3 and the second illumination unit 4 is opened. is there. In the first holding member 10, a region facing the first illumination unit 3 and the second illumination unit 4 has a shape along the first illumination unit 3 and the second illumination unit 4. The 1st illumination part 3 and the 2nd illumination part 4 of this embodiment are elongate rod shape, and the cross-sectional shape of the part which faces the 1st holding member 10 is circular arc shape. For this reason, as shown in FIG. 3 and FIG. 4, the first holding member 10 has the shape of the area facing the first illumination unit 3 and the second illumination unit 4 from the first illumination unit 3 and the second illumination unit 4. A concave arc shape extends in one direction on the far side.

  Further, as shown in FIGS. 5 and 6, the first holding member 10 has lengths in the extending direction of the first illumination unit 3 and the second illumination unit 4, and the first illumination unit 3 and the second illumination unit 4. Shorter than. For this reason, the first holding member 10 faces part of the extending direction of the first lighting unit 3 and the second lighting unit 4. The first holding member 10 faces a part of the first illumination unit 3 and the second illumination unit 4 and is connected to the first illumination unit 3 and the second illumination unit 4 with bolts 20 and nuts 22, thereby The 1 illumination part 3 and the 2nd illumination part 4 are hold | maintained. The bolt 20 is fixed to the first lighting unit 3 or the second lighting unit 4, and the nut 22 is disposed inside the box shape of the first holding member 10. In the first holding member 10, an opening through which the wiring portion 5 passes is formed in each of the region facing the first illumination unit 3 and the region facing the second illumination unit 4.

  The 2nd holding member 12 is a member connected with the object part which installs the illuminating devices 1, such as a ceiling and a base. The second holding member 12 is a plate-like member having a surface facing the contact surface of the first holding member 10 with the first illumination unit 3 and the second illumination unit 4, and the first illumination unit 3 and the second illumination member 3. A protruding portion protruding from the illumination unit 4 is formed. The protrusion of the second holding member 12 is fastened to the first holding member 10 with a bolt 18. The second holding member 12 fastens at least a part of the plate-shaped member while forming a space between the first holding member 10 and the second holding member 12 by fastening the protrusion with the first holding member 10. It can be exposed to the opening surface of the first holding member 10. Further, the second holding member 12 has an opening through which the wiring portion 5 passes.

  The reinforcing members 14 and 16 are plate-like members arranged on the surface of the first holding member 10 on the second holding member 12 side. The reinforcing members 14 and 16 have a shape along the inside of the box shape of the first holding member 10, and the first holding member 10 and the second lighting unit are connected to the connecting portion between the first holding member 10 and the first lighting unit 3. 4 extends to the connecting part. The reinforcing members 14 and 16 are sandwiched between the bolt 20 and the nut 22 and fastened together with the first holding member 10 and the first lighting unit 3 or the first holding member 10 and the second lighting unit 4. Similarly, holes are formed in the first holding member 10. Each bolt hole 14 a, 14 b, 14 c communicates with the hole of the first holding member 10. The reinforcing members 14 and 16 are also sandwiched between the protruding portions of the first holding member 10 and the second holding member 12, and are fastened together with the first holding member 10 and the second holding member 12 by bolts 18. Is done. The reinforcing members 14 and 16 are members having a certain level of rigidity, a fastening portion between the first holding member 10 and the first lighting unit 3, a fastening portion between the first holding member 10 and the second lighting unit 4, and a first fastening member. By being fastened together with each member at the fastening portion between the first holding member 10 and the second holding member 12, deformation of each member at the fastening portion is suppressed, and each member is reinforced.

  Here, as shown in FIG. 7, the holding unit 2 includes the first holding member 10 and the reinforcing member 14, the fastening portion of the first holding member 10 and the first illumination unit 3, the first holding member 10 and the second holding member 10. A plurality of bolt holes into which the bolts 20 can be inserted are provided in the fastening portion with the illumination unit 4. In FIG. 7, three bolt holes 14a, 14b, and 14c of the reinforcing member 14 are formed. The first holding member 10 is similarly formed with three bolt holes, and the respective bolt holes are in communication. The bolt holes 14a, 14b, and 14c are formed at different positions on the arc of the first holding member 10. Thus, the holding | maintenance part 2 switches the position which inserts the volt | bolt 20 by providing bolt hole 14a, 14b, 14c in the several position from which the position in a circular arc differs, and the 1st illumination part 3 with respect to the holding | maintenance part 2 is switched. The direction (angle) of the second illumination unit 4 can be switched. Although the reinforcing member 14 has been described with reference to FIG. 7, the same applies to the reinforcing member 16. Here, in this embodiment, by providing a plurality of bolt holes, the orientation of the first illumination unit 3 and the second illumination unit 4 with respect to the holding unit 2 can be adjusted, but the bolt holes extend in the arc direction. A hole is formed, an angle adjustment mechanism is provided inside the first holding member 10, and the angle adjustment mechanism adjusts the direction in which the first illumination unit 3 and the second illumination unit 4 are supported, whereby the first with respect to the holding unit 2. The orientation of the illumination unit 3 and the second illumination unit 4 may be adjustable.

<Configuration of lighting unit>
Hereinafter, the structure of the 1st illumination part 3 and the 2nd illumination part 4 is demonstrated using FIGS. 8-15. Here, the basic structure of the 1st illumination part 3 and the 2nd illumination part 4 is the same except the point from which an arrangement position and arrangement direction differ. Therefore, in the following, the configuration of the second illumination unit 4 will be described as a representative. FIG. 8 is an exploded perspective view showing a schematic configuration of the second illumination unit according to the present embodiment. FIG. 9 is an explanatory view of the second illumination unit shown in FIG. 8 as viewed from one direction. 10 is a cross-sectional view taken along line X ₂ -X ₂ of the second illumination unit shown in FIG. 11 is a cross-sectional view taken along line X ₃ -X ₃ of the second illumination unit shown in FIG. Figure 12 is an explanatory view seen from the A ₂ direction a second illumination unit shown in FIG. Figure 13 is an explanatory view of the second illumination unit shown in FIG. 9 B ₂ direction. Figure 14 is an explanatory view of the second illumination unit shown in FIG. 9 C ₂ direction. FIG. 15 is a perspective view showing a schematic configuration of the semiconductor light emitting device shown in FIG.

  As shown in FIG. 8, the second illumination unit 4 basically includes a housing 42, a side cover 44, a semiconductor light emitting device 46, a reflector 47, and a light transmissive substrate 48. As for the 2nd illumination part 4, the housing | casing 42 and the semiconductor light-emitting device 46 are fastened with the volt | bolt 62. FIG. Further, in the second illumination unit 4, the housing 42 and the bolt 20 are fixed by the plate unit 60 and the bolt 64. The head of the bolt 20 is sandwiched between the casing 42 and the plate portion 60. The plate portion 60 is fastened to the housing 42 with bolts 64.

  The housing 42 has a function of holding a semiconductor light emitting device 46 having a plurality of semiconductor light emitting elements 52 and a function of dissipating heat generated by the plurality of semiconductor light emitting elements 52 of the semiconductor light emitting device 46 to the outside. . The housing 42 is made of, for example, a metal such as aluminum, copper, or stainless steel, plastic, resin, or the like. As shown in FIGS. 10 and 11, the housing 42 has two curved portions 42 a and 42 b that protrude outward and a plate-like portion that connects the curved portions 42 a and 42 b in plan view (longitudinal sectional view). 42c. Thus, the housing | casing 42 is comprised by the two curved parts 42a and 42b and the plate-shaped part 42c which connects this, and a cross section becomes H shape. The casing 42 has a shape composed of a curved portion 42a and a curved portion 42b, which is an ellipse or a circle in which openings are formed in two opposing directions, respectively (the surface side of the plate-like portion 42c, the plate-like portion 42c). The opening on the surface side where the semiconductor light emitting device 46 is disposed becomes the opening H, and the other opening (the back surface side of the plate-like portion 42c) becomes the opening where the bolt 20 extends.

  The casing 42 has a relative positional relationship between the curved portion 42a and the curved portion 42b, and the inner portion of the casing 42 is inflated outside (increases in distance) between the connection portion with the plate-like portion 42c and the opening H. It is a shape that shrinks to (closer to the distance). That is, the curved portion 42a and the curved portion 42b have a curved shape that is curved outwardly. In addition, the housing 42 is provided with a locking portion 43 that protrudes toward the plate-like portion 42c at the ends of the curved portions 42a and 42b on the opening H side. The retaining portion 43 is a portion that protrudes toward the center of the opening H from the inner wall surface of the curved portion 42a or the curved portion 42b. Further, a groove into which the end portion of the light-transmitting substrate 48 is inserted is formed in the vicinity of the end portion on the opening H side of the bent portion 42 a and the bent portion 42 b of the housing 42.

  The housing 42 efficiently dissipates heat generated by the semiconductor light emitting device 46 to the outside. Further, the casing 42 can maintain the directivity of the light extracted outside by reducing the change in the tilt angle of the semiconductor light emitting device 46. The thermal conductivity of the housing 42 is set to, for example, 16 W / m · K or more and 401 W / m · K or less. Moreover, the housing | casing 42 is uneven | corrugated shape by which the several recessed part was made in the outer peripheral surface of the curved parts 42a and 42b. Thereby, the heat dissipation of the housing | casing 42 can be improved more.

  The side lid portions 44 are respectively disposed at both ends of the casing 42 in the longitudinal direction. The side lid portion 44 is a plate-like member that closes the end portion of the casing 42 in the longitudinal direction, and is fixed to the casing 42 with screws 49. The screw 49 is screwed into a screw hole formed in a connecting portion between the bent portion 42a and the plate-like portion 42c or a connecting portion between the bent portion 42b and the plate-like portion 42c.

  The semiconductor light emitting device 46 includes a plurality of substrates 50, a plurality of semiconductor light emitting elements 52 mounted on the substrate 50, and a connecting member 53 that electrically connects the substrate 50 and the substrate 50. The plate-like portion 42c is fixed to the surface on the opening H side with a bolt 62.

  The substrate 50 has a rectangular parallelepiped shape. The substrate 50 is connected to the substrate 50 adjacent in the extending direction by the connecting member 53. That is, the semiconductor light emitting device 46 has a configuration in which the end surfaces on the short side of the substrate 50 are connected by the connecting member 53. The semiconductor light emitting device 46 is a long plate having a structure in which a plurality of substrates 50 are connected, the longitudinal dimension of which is substantially the same as the opening H of the housing 42. As the substrate 50, for example, a resin substrate such as a printed wiring board made of resin, or a metal plate such as a glass substrate or an aluminum substrate is used. 10, 11, and 15, a hole 50 a into which a later-described protrusion 76 of the reflector 47 is inserted and a hole 50 b into which the bolt 62 is fastened are formed in the substrate 50.

  In the present embodiment, a plurality of semiconductor light emitting elements 52 are mounted on the substrate 50 at equal intervals. The semiconductor light emitting element 52 is a light emitting unit that outputs light. The semiconductor light emitting element 52 will be described later. The intervals at which the plurality of semiconductor light emitting elements 52 are arranged are not limited to equal intervals.

  The semiconductor light emitting device 46 further includes a driving unit (not shown) that is electrically connected to the semiconductor light emitting element 52 of the semiconductor light emitting device 46. The drive unit is electrically connected to an external power source, and electricity is supplied from the external power source. Note that the portion where the driving unit is provided may be a structure provided on the same surface as the semiconductor light emitting element 52 with respect to the substrate 50 as long as it is electrically connected to the semiconductor light emitting element 52 of the semiconductor light emitting device 46. Good.

  The reflector 47 is a member that reflects the light emitted from the semiconductor light emitting element 52 and extracts it to the outside, that is, a member that guides the light emitted from the semiconductor light emitting element 52 to the opening H side. It is disposed between the opening edge and the semiconductor light emitting device 46. The reflector 47 is provided with a cap portion 72 so as to surround the side surface of the semiconductor light emitting element 52. In the reflector 47, the shade portion 72 corresponding to one semiconductor light emitting element 52 is connected to the shade portion 72 corresponding to the adjacent semiconductor light emitting element 52. That is, the reflector 47 has a shape in which the shade portion 72 is connected in a row in the extending direction of the semiconductor light emitting device 46.

  The reflector 47 reflects the light emitted from the semiconductor light emitting element 52, and is made of a heat good conductor with excellent thermal conductivity such as aluminum, copper or stainless steel. The reflector 47 may be configured by evaporating aluminum on the inner wall surface of the reflector 47 made of a polycarbonate resin molded by a mold. The reflector 47 is disposed so as to surround each semiconductor light emitting element 52. The thermal conductivity of the reflector 47 is set to, for example, 10 W / m · K or more and 500 W / m · K or less.

  The shade portion 72 of the reflector 47 is formed so as to expand from the semiconductor light emitting element 52 toward the opening H of the housing 42 (the exit port of the reflector 47). The reflector 47 is a so-called parabolic cylindrical body. Since the area surrounded by the reflector 47 becomes larger toward the exit of the reflector 47, the light emitted from the semiconductor light emitting element 52 can be made difficult to be blocked by the reflector 47, and the irradiation surface of the light emitted from the semiconductor light emitting element 52 can be reduced. Can be wide. The end portion of the shade portion 72 on the semiconductor light emitting element 52 (light emitting portion) side is larger than the semiconductor light emitting element 52 and is spaced from the semiconductor light emitting element 52.

  As shown in FIGS. 10 and 11, the reflector 47 has a claw portion 73 at the end portion of the cap portion 72 on the opening H side. The claw portion 73 has a shape extending toward the substrate 50 (plate-like portion 42 c) from the end portion on the opening H side of the cap portion 72, and the end portion on the substrate 50 side is the distal end portion of the locking portion 43. It extends to the substrate 50 side than the (end portion on the substrate 50 side). The nail | claw part 73 is the shape which the edge part (front-end | tip part) by the side of the board | substrate 50 protruded outside (the direction in the short side direction of the opening part H, and the direction away from the cap part 72). In the claw portion 73, a surface 73 a on the opening H side of a portion protruding outside the tip portion faces the tip portion of the locking portion 43. Further, the claw portion 73 has an outer end portion of the surface 73 a protruding outward from an inner end portion of the distal end portion of the locking portion 43. For this reason, when the nail | claw part 73 tries to move to the opening part H side rather than a fixed position, at least one part of the surface 73a contacts the front-end | tip part of the latching part 43. That is, the claw portion 73 is hooked on the locking portion 43 from the semiconductor light emitting device 46 side toward the opening H side. As shown in FIG. 8, the claw portions 73 have a constant width in the extending direction of the reflector 47, and a plurality of the claw portions 73 are arranged at a constant interval on one reflector 47. The claw portion 73 may have a shape extending to the plurality of shade portions 72. The claw portion 73 may be provided integrally with other portions such as the cap portion 72 or may be provided separately from other portions such as the cap portion 72. When the claw portion 73 is provided separately from other portions, the claw portion 73 can be provided by an elastic body such as a resin.

  In the extending direction of the reflector 47, the reflector 47 has a base 74 formed in a region that does not face the semiconductor light emitting element 52, specifically, a part of the connecting portion between the cap portion 72 and the cap portion 72. . The base 74 protrudes from the cap portion 72 toward the substrate 50 and is basically in contact with the substrate 50. Furthermore, the reflector 47 has a protrusion 76 that protrudes toward the substrate 50 on the base 74. The protrusion 76 is inserted into a hole 50 a formed in the substrate 50.

  The reflector 47 is configured as described above. When the reflector 47 tries to move to the opening H side, the surface 73a of the claw 73 comes into contact with the locking portion 43, and the reflector is closer to the opening H than the position where both are in contact. 47 becomes a structure which cannot move. As described above, the region where the reflector 47 can move is restricted by the claw portion 73 and the retaining portion 43 so that the reflector 47 does not move to the opening H side from a certain position. Further, when the reflector 47 tries to move to the substrate 50 side, the base 74 comes into contact with the substrate 50, and the reflector 47 cannot move to the substrate 50 side from the position where both contact. As described above, the movable region of the reflector 47 is restricted by the base 74 and the substrate 50 so as not to move to the substrate 50 side from a certain position. Further, the reflector 47 has a structure in which the protrusion 76 is inserted into the hole 50 a of the substrate 50, so that the reflector 47 cannot move relative to the substrate 50 on the surface of the substrate 50 (a surface parallel to the opening H). As described above, the movement of the reflector 47 is restricted by the protrusion 76 and the hole 50a on the surface of the substrate 50 so that the relative position between itself and the substrate 50 does not change.

  The light transmissive substrate 48 is provided at the opening edge of the opening H of the housing 42. With the semiconductor light-emitting device 46 mounted on the inside of the housing 42 (the surface on the opening H side of the plate-like portion 42c), the light-transmitting substrate 48 is provided in the housing 42 so as to be disposed in the housing 42. The semiconductor light emitting device 46 can be protected from the outside.

  The light transmissive substrate 48 is made of a material through which light emitted from the semiconductor light emitting device 46 is transmitted, and is a plate made of a light transmissive material such as resin or glass. The light transmissive substrate 48 is held by being inserted into a groove formed at the end of the housing 42. The illumination device 1 can prevent the light transmissive substrate 48 from falling by inserting and holding the light transmissive substrate 48 in the groove of the housing 42. The lighting device 1 is configured as described above.

  The illuminating device 1 has a structure in which the reflector 47 is provided with the claw portion 73 and is in contact with the locking portion 43 provided on the housing 42, so that the reflector 47 and the locking portion 43 are not fixed to the housing 42. The relative position of can be fixed. As described above, the reflector 47 can be maintained at a predetermined position without being fixed to the casing 42, so that the reflector 47 can buffer the stress caused by the deformation of the casing 42 and the like, and the reflector 47 is deformed. Can be suppressed. For example, even if the shape of the housing 42 or the like is deformed, the reflector 47 can shift the contact position according to the deformation. Thereby, it can suppress that force concentrates on a part of reflector 47, deform | transforms, and distortion generate | occur | produces. Moreover, since the illuminating device 1 is provided with the claw portion 73 and the retaining portion 43, the contact area between the reflector 47 and the housing 42 can be reduced, and the contact portion is not fixed. The influence of the heat of the member can be reduced. Thereby, the deformation | transformation by the heat which generate | occur | produces in the reflector 47 can be suppressed.

  Thereby, the illuminating device 1 can suppress the fall of the reflectance of the reflector 47 which arises when the reflector 47 is heated or deform | transformed, can output light more stably, and is predetermined. Can be stably illuminated. Thereby, light can be emitted from the lighting device 1 with a desired light intensity and light distribution.

  The illuminating device 1 can regulate the movement of the reflector 47 toward the substrate 50 by providing the base 74 at the end of the reflector 47 on the substrate 50 side and bringing the base 74 and the substrate 50 into contact with each other. . Thereby, the illuminating device 1 can regulate bidirectional movement in the direction orthogonal to the surface of the substrate 50 by the claw portion 73 and the base 74. Thereby, the illuminating device 1 can control the movement of the reflector 47, without fixing the reflector 47 to another member by adhesion | attachment or screwing. Thereby, the deformation | transformation etc. in the reflector 47 can be suppressed more suitably, and the said effect can be acquired more suitably.

  The illuminating device 1 can restrict the movement of the substrate 50 on the surface (a surface parallel to the opening H) with respect to the substrate 50 by providing a protrusion 76 on the base 74 of the reflector 47 and inserting the protrusion 76 into the hole 50a of the substrate 50. it can. Thereby, it can suppress that the relative position of the board | substrate 50 and the reflector 47 shift | deviates. Since the positional shift between the substrate 50 and the reflector 47 can be suppressed, it is possible to suppress the relative position from shifting at the time of manufacturing and causing an individual difference for each device in the light output from the lighting device 1.

  Here, since the illuminating device 1 of this embodiment can support the reflector 47 in a predetermined position, without fixing it to another member, and can stabilize the light to output more, it is the nail | claw part 73 and the base 74. However, the present invention is not limited to this. The illuminating device 1 can acquire the said effect to some extent by restrict | limiting the position by the side of the opening part H of the reflector 47 by the nail | claw part 73 at least. In addition, since the illumination device 1 is basically used at a position where the opening H is directed downward in the vertical direction, that is, the opening H is directed downward in the vertical direction relative to the semiconductor light emitting device 46, the reflector 47 includes: Gravity acts in the direction of the opening H. For this reason, the position of the reflector 47 can be regulated by regulating the movement of the reflector 47 toward the opening H.

  In the illuminating device 1 of the present embodiment, when the semiconductor light emitting device 46 emits light, part of the light emitted from the semiconductor light emitting device 46 is converted into heat, but the reflector 47 and the semiconductor light emitting device 46 are not directly connected. Thus, the heat of the semiconductor light emitting device 46 is not easily transmitted to the reflector 47 and is radiated from the outer wall surface of the housing 2 to the outside via the housing 2. As a result, the reflector 47 can be prevented from being thermally deformed and displaced from the light emitting portion of the semiconductor light emitting device 46, and the light emitted by the semiconductor light emitting device 46 can be output more stably. A predetermined area can be stably illuminated.

  Further, in the lighting device 1 of the present embodiment, the inner wall surface of the housing 42 surrounding the semiconductor light emitting device 46 and the reflector 47 is curved so as to bulge outward from the housing 42, so that the semiconductor light emitting device 46. The heat generated by the heat is transmitted to the housing 42, but by expanding the inner wall surface of the housing 42, the distance between the semiconductor light emitting element 52 of the semiconductor light emitting device 46 that is a heat source and the claw portion 73 of the reflector 47 is increased. It can be made difficult to be transmitted from the housing 42 to the reflector 47. As a result, the reflector 47 can be prevented from being thermally deformed, the light emitted from the semiconductor light emitting device 46 can be efficiently extracted to the outside, and a predetermined area can be stably illuminated.

  In addition, although the illuminating device 1 of the said embodiment provided the 1st illumination part 3 and the 2nd illumination part 4 as an illumination part which outputs light, the number of illumination parts is not limited. The illuminating device 1 should just be provided with one or more illumination parts, for example, is good also as a structure provided with three illumination parts. Moreover, the illumination part of the illuminating device 1 has an elongated shape (in a fluorescent lamp) in which a plurality of semiconductor light emitting elements 52 of the semiconductor light emitting device 46 are arranged in a row (one row) along the longitudinal direction of the housing as in the above embodiment. Although it is preferable to set it to a close shape, it is not limited to this. The semiconductor light-emitting device 46 only needs to include at least one semiconductor light-emitting element 52, and can be arranged in various ways.

<Configuration of semiconductor light emitting device>
FIG. 16 is a schematic perspective view of a semiconductor light emitting element constituting the semiconductor light emitting device. 17 is a cross-sectional view of the semiconductor light emitting element shown in FIG. 16 taken along line YY. The semiconductor light emitting element 52 includes a mounting substrate 91, an optical semiconductor element 92 provided on the mounting substrate 91, a frame body 93 surrounding the optical semiconductor element 92, and a sealing resin 94 provided in a region surrounded by the frame body 93. The wavelength conversion unit 96 is supported by the frame body 93 and connected to the frame body 93 via an adhesive resin 95.

  The semiconductor light emitting element 52 is, for example, a light emitting diode, and is emitted as light from the optical semiconductor element 92 to the outside by recombination of electrons and holes in the pn junction in the optical semiconductor element 92. The optical semiconductor element 92 has excellent directivity.

  The mounting substrate 91 is provided on the substrate 50. The substrate 50 and the mounting substrate 91 are joined so as to be electrically connected via solder or a conductive adhesive. The mounting substrate 91 can be made of, for example, a ceramic material such as alumina, mullite, or glass ceramic, or a composite material obtained by mixing a plurality of these materials. The mounting substrate 91 can be made of a polymer resin in which metal oxide fine particles are dispersed.

  When the surface of the mounting substrate 91 is a diffusion surface, the light emitted from the optical semiconductor element 92 is irradiated on the surface of the mounting substrate 91 and diffusely reflected. Then, the light emitted from the optical semiconductor element 92 can be emitted in multiple directions by diffuse reflection, and the light emitted from the optical semiconductor element 92 can be suppressed from being concentrated at a specific location.

  Here, the mounting substrate 91 is provided with a wiring conductor, and is electrically connected to the substrate 50 via the wiring conductor. The wiring conductor is made of a conductive material such as tungsten, molybdenum, manganese, or copper. The wiring conductor is obtained, for example, by printing a metal paste obtained by adding an organic solvent to a powder such as tungsten on the mounting substrate 91 in a predetermined pattern.

  The optical semiconductor element 92 is mounted on the mounting substrate 91 and in the mounting region R. Specifically, the optical semiconductor element 92 is electrically connected to a wiring conductor formed on the mounting substrate 91 via, for example, an adhesive material such as solder or a conductive adhesive, or a bonding wire. .

  The optical semiconductor element 92 uses a chemical vapor deposition method such as a metal organic chemical vapor deposition method or a molecular beam epitaxial growth method on a substrate such as sapphire, gallium nitride, aluminum nitride, zinc oxide, silicon carbide, silicon, or zirconium diboride. Thus, the semiconductor layer is grown. The thickness of the optical semiconductor element 92 is not less than 30 μm and not more than 1000 μm, for example.

  The optical semiconductor element 92 includes a first semiconductor layer, a light emitting layer formed on the first semiconductor layer, and a second semiconductor layer formed on the light emitting layer.

  The first semiconductor layer, the light emitting layer, and the second semiconductor layer are, for example, a group III nitride semiconductor, a group III-V semiconductor such as gallium phosphide or gallium arsenide, or a group III nitride such as gallium nitride, aluminum nitride, or indium nitride. A physical semiconductor or the like can be used. Note that the thickness of the first semiconductor layer is, for example, not less than 1 μm and not more than 5 μm. The thickness of the light emitting layer is, for example, 25 nm or more and 150 nm or less. The thickness of the second semiconductor layer is, for example, not less than 50 nm and not more than 600 nm. In addition, the optical semiconductor element 92 configured as described above can emit excitation light having a wavelength range of 370 nm to 420 nm, for example.

  A frame-shaped frame 93 is provided on the mounting substrate 91 so as to surround the optical semiconductor element 92. The frame 93 is connected to the mounting substrate 91 via, for example, solder or an adhesive. The frame 93 is a ceramic material and is made of a porous material such as aluminum oxide, titanium oxide, zirconium oxide, or yttrium oxide. The frame body 93 is made of a porous material, and a large number of fine holes are formed on the surface of the frame body 93.

  The frame 93 is formed so as to surround the optical semiconductor element 92 with a space from the optical semiconductor element 92. The frame 93 is formed such that the inclined inner wall surface extends outward from the lower end to the upper end. The inner wall surface of the frame 93 functions as a reflection surface for excitation light emitted from the optical semiconductor element 92. When the inner wall surface of the frame 93 is a diffusion surface, the light emitted from the optical semiconductor element 92 is diffusely reflected on the inner wall surface of the frame 93. And it can suppress that the light emitted from the optical semiconductor element 92 concentrates on a specific location.

  Further, the inclined inner wall surface of the frame body 93 may form, for example, a metal layer made of tungsten, molybdenum, copper, silver, or the like, and a plated metal layer made of nickel, gold, or the like that covers the metal layer. This plated metal layer has a function of reflecting light emitted from the optical semiconductor element 92. The inclination angle of the inner wall surface of the frame body 93 is set to, for example, an angle of 55 degrees or more and 70 degrees or less with respect to the upper surface of the mounting substrate 91.

  A region surrounded by the frame body 93 is filled with a sealing resin 94. The sealing resin 94 has a function of sealing the optical semiconductor element 92 and transmitting light emitted from the optical semiconductor element 92. The sealing resin 94 is a region surrounded by the frame body 93 in a state where the optical semiconductor element 92 is accommodated inside the frame body 93. For the sealing resin 94, for example, a translucent insulating resin such as a silicone resin, an acrylic resin, or an epoxy resin is used.

  The wavelength conversion unit 96 is supported by the frame body 93 and provided so as to face the optical semiconductor element 92 with a space therebetween. That is, the wavelength conversion unit 96 is provided in the frame body 93 via the sealing resin 94 that seals the optical semiconductor element 92 and the gap.

  The wavelength conversion unit 96 is joined to the frame body 93 via an adhesive resin 95. The adhesive resin 95 is attached from the end of the lower surface of the wavelength conversion unit 96 to the side surface of the wavelength conversion unit 96 and further to the end of the upper surface of the wavelength conversion unit 96.

  As the adhesive resin 95, for example, a thermosetting resin such as a polyimide resin, an acrylic resin, an epoxy resin, a urethane resin, a cyanate resin, a silicone resin, or a bismaleimide triazine resin can be used. Further, as the adhesive resin 95, for example, a thermoplastic resin such as a polyether ketone resin, a polyethylene terephthalate resin, or a polyphenylene ether resin can be used.

  As the material of the adhesive resin 95, a material having a thermal expansion coefficient that is between the thermal expansion coefficient of the frame body 93 and the thermal expansion coefficient of the wavelength conversion unit 96 is selected. By selecting such a material as the material of the adhesive resin 95, when the frame 93 and the wavelength conversion unit 96 are thermally expanded, the two are likely to peel off due to the difference in the coefficient of thermal expansion between the two. Can be suppressed, and both can be well connected.

  By adhering the adhesive resin 95 to the end of the lower surface of the wavelength conversion unit 96, the area to which the adhesive resin 95 is applied can be increased, and the frame 93 and the wavelength conversion unit 96 can be firmly connected. it can. As a result, the connection strength between the frame 93 and the wavelength conversion unit 96 can be improved, and bending of the wavelength conversion unit 96 is suppressed. And it can suppress effectively that the optical distance between the optical semiconductor element 92 and the wavelength conversion part 96 fluctuates.

  The wavelength conversion unit 96 emits light when excitation light emitted from the optical semiconductor element 92 is incident on the inside and the phosphor contained therein is excited. Here, the wavelength conversion unit 96 is made of, for example, a silicone resin, an acrylic resin, an epoxy resin, or the like, and a blue phosphor that emits fluorescence with a wavelength of, for example, 430 nm to 490 nm in the resin, for example, 500 nm to 560 nm. A green phosphor that emits fluorescence, for example, a yellow phosphor that emits fluorescence of 540 to 600 nm, for example, a red phosphor that emits fluorescence of 590 to 700 nm is contained. The phosphor is contained in the wavelength conversion unit 96 so as to be uniformly dispersed. In addition, the thickness of the wavelength conversion part 96 is set to 0.5 mm or more and 3 mm or less, for example.

  Further, the thickness of the end portion of the wavelength conversion unit 96 is set to be constant. The thickness of the wavelength conversion part 96 is set to 0.5 mm or more and 3 mm or less, for example. Here, the constant thickness includes a thickness error of 0.1 mm or less. By making the thickness of the wavelength conversion unit 96 constant, the amount of light excited by the wavelength conversion unit 96 can be adjusted to be uniform, and luminance unevenness in the wavelength conversion unit 96 can be suppressed. it can.

DESCRIPTION OF SYMBOLS 1 Illuminating device 2 Holding part 3 1st illumination part 4 2nd illumination part 5 Wiring part 10 1st holding member 12 2nd holding member 14, 16 Reinforcement member 18, 20, 62, 64 Bolt 22 Nut 42 Case 43 Locking Part 44 side cover part 46 semiconductor light emitting device 47 reflector 48 light transmissive substrate 49 screw 50 board 50a, 50b hole 52 semiconductor light emitting element 53 connecting member 60 plate part 72 shade part 73 claw part 74 foundation 76 projecting part 91 mounting board 92 light Semiconductor element 93 Frame 94 Sealing resin 95 Adhesive resin 96 Wavelength conversion part H Opening part

Claims (3)

A housing having an opening, the housing having a locking portion protruding toward the center of the opening in the opening;
A semiconductor light emitting device disposed inside the housing and emitting light toward the opening;
A reflector that is disposed between the opening edge of the opening and the semiconductor light emitting device inside the housing, and reflects light emitted from the semiconductor light emitting device toward the opening;
A light-transmitting substrate provided at an opening edge of the housing, covering the opening and the reflector, and transmitting light from the semiconductor light emitting device ;
The reflector has a claw portion that is hooked from the semiconductor light emitting device side toward the opening portion side on the locking portion of the housing, and is disposed so as to be spaced from the light emitting portion of the semiconductor light emitting device. A lighting device characterized by that.   The lighting device according to claim 1, wherein the housing is curved so that an inner wall surface of the housing surrounding the semiconductor light emitting device and the reflector swells outward.   3. The lighting device according to claim 1, wherein the light emitting unit of the semiconductor light emitting device includes a plurality of semiconductor light emitting elements, and the plurality of semiconductor light emitting elements are arranged in a line.

Images