JP2012129003A - Lighting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lighting system capable of alleviating illuminance unevenness on an irradiation face of extracted light.SOLUTION: The lighting system 1 is provided with a mounting substrate 2 with its main face 2a curved in convex in cross-section view, a plurality of light-emitting devices 3 fitted on a surface of the main face, and a reflector 4 surrounding each of the plurality of light-emitting devices 3 fitted on the main face 2a and consisting of a pair of reflecting members 11 in cross-section view. As to the reflector 4 surrounding the light-emitting devices 3 positioned at a site not facing a virtual plane S facing a front face of one of the plurality of light-emitting devices 3, a reflecting member 11 positioned near the light-emitting device 3 facing the virtual plane S has a shorter length from the main face 2a to the front end than the reflecting member 11 positioned further away from the light-emitting device 3 facing the virtual plane S.

Description

  The present invention relates to a lighting device including a light emitting element.

  In recent years, development of a lighting device including a plurality of light emitting devices using light emitting elements such as light emitting diodes (LEDs) as a light source has been promoted (see, for example, Patent Documents 1 and 2). A lighting device including a light-emitting element has attracted attention with respect to power consumption or product life. A light emitting device having this light emitting element is required to have a technique for making the illuminance uniform with respect to the irradiated surface, for example, in the field of residential lighting.

JP 2009-135381 A JP 2009-176567 A

  An object of this invention is to provide the illuminating device which can reduce the illumination nonuniformity with respect to the irradiation surface of the light to extract.

  An illuminating device according to an embodiment of the present invention is provided on a mounting substrate whose main surface is convexly curved in a cross-sectional view, a plurality of light emitting devices provided on the main surface, and the main surface. An illuminating device that surrounds each of the plurality of light-emitting devices and includes a reflector made of a pair of reflecting members when viewed in cross-section, and is a virtual device that faces the front of any of the plurality of light-emitting devices. The reflector surrounding the light emitting device located at a position that does not face the plane is far from the light emitting device where the reflecting member at a position close to the light emitting device that faces the virtual plane is directly opposed to the virtual plane. The length from the main surface to the tip is shorter than the position of the reflecting member.

  ADVANTAGE OF THE INVENTION According to this invention, the illuminating device which can reduce the irradiation nonuniformity with respect to the irradiation surface of the taken-out light can be provided.

It is the perspective view which showed the external appearance of the illuminating device which concerns on this embodiment. It is a perspective view when the one part outline | summary of the illuminating device which concerns on this embodiment is shown, and it sees diagonally upward from the bottom. FIG. 2 is a perspective view of a part of the illumination device according to the present embodiment, and is a perspective view when viewed obliquely from above, showing a state where a reflecting plate is provided. It is drawing which showed one reflector among the illuminating devices which concern on this embodiment, Comprising: It is a perspective view when seeing diagonally upward from the bottom. It is drawing which showed one reflector among the illuminating devices which concern on this embodiment, Comprising: It is a perspective view when seeing diagonally upward from the bottom. It is sectional drawing of the illuminating device which concerns on this embodiment. It is a perspective view of one light-emitting device which comprises the illuminating device which concerns on this embodiment. It is sectional drawing of one light-emitting device which comprises the illuminating device which concerns on this embodiment. It is a perspective view when the one part outline | summary of the illuminating device which concerns on a modification is shown, and it sees diagonally upward from the bottom.

  Embodiments of a lighting device according to the present invention will be described below with reference to the accompanying drawings. In addition, this invention shall not be limited to the following embodiment.

  FIG. 1 is a perspective view showing a state in which the lighting device is attached to the utility pole. FIG. 2 is an enlarged perspective view of a portion A in FIG. 1, and is a perspective view when a part of the lighting device is viewed obliquely upward from below. FIG. 4 is a view showing one light-emitting device and a reflector surrounding the light-emitting device among the lighting devices, with respect to a virtual plane directly facing one of the front surfaces of the plurality of light-emitting devices constituting the lighting device. The light-emitting device and reflector located in the location which opposes are shown. FIG. 5 is a view showing one light-emitting device of the lighting device and a reflector surrounding the light-emitting device, and a virtual plane facing the front of any one of the plurality of light-emitting devices constituting the lighting device. The light-emitting device and reflector located in the location which does not face directly are shown. 6 is a part of a cross-sectional view of the lighting device along XX ′ in FIG. 1, and surrounds a plurality of light emitting devices and the respective light emitting devices on a mounting substrate whose main surface is convexly curved. A pair of reflecting members is shown.

  The lighting device 1 according to the present embodiment includes a mounting substrate 2, a plurality of light emitting devices 3 mounted on the mounting substrate 2, and a plurality of reflectors 4 surrounding each of the light emitting devices 3.

  The lighting device 1 is directly attached to a room such as a ceiling or a wall, or is used outdoors. And the light emitted from the illuminating device 1 can illuminate indoors or outdoors.

  The mounting board 2 mounts a plurality of light emitting devices 3. The mounting substrate 2 has a substantially semi-cylindrical shape, and the main surface 2a on which the light emitting device 3 is mounted has a shape that is convexly curved upward. As the mounting substrate 2, for example, a resin substrate such as a printed wiring board made of resin, or a metal plate such as a glass substrate or an aluminum substrate is used.

  A driving device for driving the light emitting device 3 is provided on the lower surface located on the back surface of the main surface 2 a of the mounting substrate 2. The driving device can obtain power from an external power source and cause the light emitting device 3 to emit light. The mounting substrate 2 is provided with via conductors or pattern wirings for electrically connecting the light emitting device 3 and the driving device.

<Configuration of light emitting device>
Here, the light-emitting device 3 used for the illuminating device 1 which concerns on this embodiment is demonstrated. FIG. 7 is a schematic perspective view of the light emitting device 3 and shows a state in which a part of the inside is seen through. FIG. 8 is a cross-sectional view of the light-emitting device 3 along YY ′ in FIG. 7.

  The light emitting device 3 includes a substrate 5, a light emitting element 6 mounted on the substrate 5, a frame 7 provided so as to surround the light emitting element 6 mounted on the substrate 5, and the light emitting element 6 in the frame 7. A sealing resin 8 provided to cover and a wavelength conversion member 9 provided with a space between the sealing resin 8 and supported by the frame body 7 are provided. The wavelength conversion member 9 is connected to the frame body 7 via a bonding material 10.

  The light emitting element 6 is, for example, a light emitting diode, and is emitted as light from the light emitting element 6 to the outside when the electrons and holes in the pn junction in the light emitting element 6 are recombined.

  The substrate 5 has a mounting region R on which an optical semiconductor element is mounted. The mounting substrate 2 and the substrate 5 are joined so as to be electrically connected via solder or a conductive adhesive. The substrate 5 can be made of, for example, a ceramic material such as alumina, mullite, or glass ceramics, or a composite material obtained by mixing a plurality of these materials. The substrate 5 can be made of a polymer resin in which metal oxide fine particles are dispersed.

  When the surface of the substrate 5 is a diffusing surface, the light emitted from the light emitting element 6 is irradiated on the surface of the substrate 5 and diffusely reflected. And the light which the light emitting element 6 emits can be radiated | emitted in multiple directions by diffuse reflection, and it can suppress that the light emitted from the light emitting element 6 concentrates on a specific location.

  Here, the substrate 5 is provided with a wiring conductor, and is electrically connected to the mounting substrate 2 via the wiring conductor. The wiring conductor is made of a conductive material such as tungsten, molybdenum, manganese, or copper. The wiring conductor is obtained, for example, by printing a metal paste obtained by adding an organic solvent to a powder such as tungsten on the substrate 5 in a predetermined pattern.

  The light emitting element 6 is mounted on the mounting region R on the substrate 5. Specifically, the light emitting element 6 is electrically connected to the wiring conductor formed on the substrate 5 via, for example, an adhesive material such as solder or a conductive adhesive, or a bonding wire.

  The light-emitting element 6 uses a chemical vapor deposition method such as a metal organic chemical vapor deposition method or a molecular beam epitaxial growth method on a substrate such as sapphire, gallium nitride, aluminum nitride, zinc oxide, silicon carbide, silicon, or zirconium diboride. Thus, the semiconductor layer is grown. The thickness of the light emitting element 6 is, for example, 30 μm or more and 1000 μm or less.

  The light emitting element 6 includes a first semiconductor layer formed on the base, a light emitting layer formed on the first semiconductor layer, and a second semiconductor layer formed on the light emitting layer.

The first semiconductor layer, the light emitting layer, and the second semiconductor layer are, for example, a group III nitride semiconductor, a group III-V semiconductor such as gallium phosphide or gallium arsenide, or a group III nitride such as gallium nitride, aluminum nitride, or indium nitride. A physical semiconductor or the like can be used. The first
The thickness of the semiconductor layer is, for example, 1 μm or more and 5 μm or less. The thickness of the light emitting layer is, for example, 25 nm or more and 150 nm or less. The thickness of the second semiconductor layer is, for example, not less than 50 nm and not more than 600 nm. In addition, the light emitting element 6 configured as described above can emit excitation light having a wavelength range of 370 nm to 420 nm, for example.

  On the substrate 5, a frame-like frame body 7 is provided so as to surround the light emitting element 6. The frame body 7 is connected to the substrate 5 via, for example, solder or an adhesive. The frame 7 is a ceramic material, and is made of a porous material such as aluminum oxide, titanium oxide, zirconium oxide, or yttrium oxide. The frame body 7 is made of a porous material, and a large number of fine holes are formed on the surface of the frame body 7.

  The frame body 7 is formed so as to surround the light emitting element 6 with a space from the light emitting element 6. Further, the frame body 7 is formed such that the inclined inner wall surface spreads outward from the lower end according to the tip. The inner wall surface of the frame 7 functions as a reflection surface for excitation light emitted from the light emitting element 6. Further, when the inner wall surface of the frame body 7 is a diffusing surface, the light emitted from the light emitting element 6 is diffusely reflected on the inner wall surface of the frame body 7. And it can suppress that the light emitted from the light emitting element 6 concentrates on a specific location.

The frame body 7 is provided on the substrate 5 so as to surround the light emitting element 6, and the height position of the tip of the inner wall surface is set higher than the height position of the upper surface of the light emitting element 6. And the height position of the front-end | tip of the inclined inner wall face of the frame 7 is set higher than the height position of the upper surface of the light emitting element 6, and the excitation light which the light emitting element 6 emits upwards is the frame 7 Can be diffusely reflected on the inner wall surface, and the direction in which the excitation light travels can be diffused. As a result, the excitation light emitted from the light emitting element is irradiated toward the entire lower surface of the wavelength conversion member 9.

  Further, the inclined inner wall surface of the frame body 7 may be formed, for example, with a metal layer made of tungsten, molybdenum, copper, silver, or the like, and a plated metal layer made of nickel, gold, or the like that covers the metal layer. The plated metal layer has a function of reflecting light emitted from the light emitting element 6. The inclination angle of the inner wall surface of the frame body 7 is set to an angle of, for example, 55 degrees or more and 70 degrees or less with respect to the upper surface of the substrate 5.

  Further, a step 7 a is provided inside the upper end of the frame body 7. The step 7 a is for supporting the wavelength conversion member 9. The step 7 a is formed by cutting out a part of the upper part of the frame body 7 inward, and can support the end of the wavelength conversion member 9.

  A region surrounded by the frame body 7 is filled with a sealing resin 8. The sealing resin 8 seals the light emitting element 6 and has a function of transmitting light emitted from the light emitting element 6. The sealing resin 8 is filled in a region surrounded by the frame body 7 in a state in which the light emitting element 6 is accommodated inside the frame body 7 and is lower than the height position of the step 7a. The sealing resin 8 is made of a translucent insulating resin such as a silicone resin, an acrylic resin, or an epoxy resin.

  The wavelength conversion member 9 is supported on the step 7 a of the frame body 7 and is provided to face the light emitting element 6 with a gap therebetween. That is, the wavelength conversion member 9 is provided on the step 7 a of the frame body 7 through the sealing resin 8 that seals the light emitting element 6 and the gap.

  The wavelength conversion member 9 is bonded to the step 7 a via the bonding material 10. The bonding material 10 is attached from the end of the lower surface of the wavelength conversion member 9 to the side surface of the wavelength conversion member 9 and further to the end of the upper surface of the wavelength conversion member 9.

  As the bonding material 10, for example, a thermosetting resin such as a polyimide resin, an acrylic resin, an epoxy resin, a urethane resin, a cyanate resin, a silicone resin, or a bismaleimide triazine resin can be used. In addition, for example, a thermoplastic resin such as a polyether ketone resin, a polyethylene terephthalate resin, or a polyphenylene ether resin can be used for the bonding material 10.

  As the material of the bonding material 10, a material having a coefficient of thermal expansion that is between the coefficient of thermal expansion of the frame body 7 and the coefficient of thermal expansion of the wavelength conversion member 9 is selected. By selecting such a material as the material of the bonding material 10, when the frame body 7 and the wavelength conversion member 9 are thermally expanded, both are about to peel off due to the difference in the coefficient of thermal expansion between them. Can be suppressed, and both can be satisfactorily bonded.

  By bonding the bonding material 10 to the end portion of the lower surface of the wavelength conversion member 9, it is possible to increase the area to which the bonding material 10 is applied and firmly connect the frame body 7 and the wavelength conversion member 9. it can. As a result, the connection strength between the frame body 7 and the wavelength conversion member 9 can be improved, and the bending of the wavelength conversion member 9 is suppressed. And it can suppress effectively that the optical distance between the light emitting element 6 and the wavelength conversion member 9 fluctuates.

The end of the wavelength conversion member 9 is located on the step 7 a of the frame body 7, and the end surface of the wavelength conversion member 9 is surrounded by the frame body 7. Therefore, the light that has entered the wavelength conversion member 9 from the light emitting element 6 may reach the end of the wavelength conversion member 9 inside the wavelength conversion member 9. By reflecting the light traveling from the end of the wavelength conversion member 9 toward the frame body 7 on the inner wall surface of the frame body 7, the reflected light can be returned to the wavelength conversion member 9 again. As a result, the phosphor is excited by the light returned again into the wavelength conversion member 9, and the light output of the light emitting device 2 can be improved.

  The wavelength conversion member 9 emits light when excitation light emitted from the light emitting element 6 enters the inside and the phosphor contained therein is excited. Here, the wavelength conversion member 9 is made of, for example, a silicone resin, an acrylic resin, an epoxy resin, or the like, and a blue phosphor that emits fluorescence of, for example, 430 nm or more and 490 nm or less, for example, fluorescence of 500 nm or more and 560 nm or less of the resin. A green phosphor that emits light, for example, a yellow phosphor that emits fluorescence of 540 to 600 nm, for example, a red phosphor that emits fluorescence of 590 to 700 nm is contained. The phosphor is contained in the wavelength conversion member 9 so as to be uniformly dispersed. In addition, the thickness of the wavelength conversion member 9 is set to 0.5 or more and 3 mm or less, for example.

  Moreover, the thickness of the edge part of the wavelength conversion member 9 is set constant. In addition, the thickness of the wavelength conversion member 9 is set to 0.5 mm or more and 3 mm or less, for example. Here, the constant thickness includes a thickness error of 0.1 mm or less. By making the thickness of the wavelength conversion member 9 constant, the amount of light excited by the wavelength conversion member 9 can be adjusted to be uniform, and uneven brightness in the wavelength conversion member 9 can be suppressed. it can.

<Configuration of lighting device>
In the illumination device 1, a plurality of light emitting devices 3 are mounted on a main surface 2 a of a mounting substrate 2 provided in a substantially cylindrical casing. The plurality of light emitting devices 3 are arranged in a plurality of lines with respect to the mounting substrate 2. Since the plurality of reflectors 4 surround each light emitting device 3, the plurality of reflectors 4 are also arranged in a plurality of lines. The illumination device 1 reflects the light emitted from the light emitting device 3 on the inner wall surface of the reflector 4. The reflected light illuminates the part facing the light emitting device 3 to illuminate the interior of the room.

  The reflector 4 reflects light emitted from the light emitting device 3 and is made of a conductor having excellent thermal conductivity such as aluminum, copper, or stainless steel. Moreover, the reflector 4 may be comprised by vapor-depositing aluminum on the inner wall face of the reflector 4 which consists of polycarbonate resin shape | molded with the metal mold | die. The reflector 4 is disposed so as to surround each light emitting device 3, and is attached so that the base end portion of the reflector 4 is fixed to the lower surface of the mounting substrate 2. The thermal conductivity of the reflector 4 is set, for example, from 10 W / m · K to 500 W / m · K. In addition, the length from the base end part of the reflector 4 to the front-end | tip part of the reflector 4 is set to 5 mm or more and 20 mm or less, for example.

  The reflector 4 is formed so as to expand from the light emitting element 6 toward the exit of the reflector 4. The region surrounded by the reflector 4 is formed so as to gradually increase in width as the distance from the base end portion of the reflector 4 connected to the mounting substrate 2 in a cross-sectional view. The reflector 4 is a so-called parabolic cylindrical body. Since the area surrounded by the reflector 4 becomes larger as the distance from the base end portion of the reflector 4 increases, the light emitted from the light-emitting element 6 can be efficiently emitted from the outlet through the reflector 4. In addition, as for the reflector 4, the diameter of the area | region enclosed by the reflector 4 is set to 3 mm or more and 20 mm or less, for example.

The reflector 4 may not be connected to the mounting substrate 2 in a cross-sectional view at the base end portion. As a result, heat from the light emitting element 6 is not transmitted to the reflector 4 via the mounting substrate 2, and the deformation of the reflector 4 and a decrease in reflectance due to heat are suppressed, and the light emitting device 3 operates normally over a long period of time. can do.

  As shown in FIG. 3, the plurality of light emitting devices 3 on the upper side of the reflector 4 is parallel to the plurality of light emitting devices 3 arranged in a line with respect to the mounting substrate 2, and the intervals increase toward the upper side. A pair of continuous reflectors 4a may be provided. As a result, the light from the light emitting device 3 is collected by the reflector 4 to improve the illuminance of the virtual plane S, and the light from the light emitting device 3 radiated from the emission port without passing through the reflector 4 is reflected. It is reflected by the plate 4a and can irradiate the virtual plane S uniformly. Therefore, the light from the light emitting element 4 is efficiently condensed on the virtual plane S by the reflector 4, the illuminance of the virtual plane S is improved, and the virtual plane S is uniformly irradiated by the reflector 4a. Unevenness in illuminance is suppressed. That is, when there is no reflecting plate 4a, the light from the light emitting device 3 collected by the reflector 4 is irradiated to the virtual plane S, but the light emitted from the emission port without being reflected by the reflector 4 is dispersed. The As a result, in the virtual plane S, only the virtual plane S that is collected and irradiated by the reflector 4 has high illuminance, and an irradiation surface that approximates the shape of the exit is formed, and unevenness in illuminance occurs in the virtual plane S.

  As shown in FIG. 6, the reflector 4 includes a pair of reflecting members 11 when viewed in cross section. Here, the light emitting device 3 at the position facing the virtual plane S facing the front of any one of the plurality of light emitting devices 3 is defined as the light emitting device 3a, and the light emission at the position not facing the virtual plane S is performed. The device 3 is a light emitting device 3b.

  The reflector 4 surrounding the light emitting device 3b located at a position that does not face the virtual plane S is the light emitting device 3a in which the reflecting member 11 at a position near the light emitting device 3a that faces the virtual plane S faces the virtual plane S. The length from the main surface 2a is set shorter than the reflecting member 11 at a position far from the reflecting member 11. The reflecting member 11 of the light emitting device 3a facing the virtual plane S and the reflecting member 11 of the light emitting device 3b not facing the virtual plane S have a difference in length from the proximal end portion to the distal end portion of the reflecting member 11. For example, it is set to 5 mm or more and 20 mm or less.

  Since the main surface 2a has a shape like a part of a semi-cylindrical surface, if the reflectors 4 surrounding all the light emitting devices 3 are symmetrical reflection members 11 in cross-section, The light that is emitted from the plurality of light emitting devices 3 is reflected by the inner wall surface of the reflector 4 on the most light-irradiated surface, for example, the virtual plane S, and there are many regions that do not reach the most light-irradiated surface. Will occur. As a result, there is a possibility that uneven irradiation occurs on the surface to which light is most radiated, and the visibility of the irradiated surface is deteriorated. On the other hand, the illuminating device 1 according to the present embodiment can make the illuminance substantially uniform with respect to the most light-irradiated surface, for example, the virtual plane S, and reduce irradiation unevenness on the most light-irradiated surface. Can do.

  In addition, the reflector 4 surrounding the light emitting device 3a facing the virtual plane S is formed to be bilaterally symmetric when the reflector 4 is viewed in cross section. In the reflector 4 surrounding the light emitting device 3a facing the virtual plane S, the light emitted from the light emitting device 3a mounted on the main surface 2a is obtained by forming the reflecting member 11 symmetrically in cross section. A region that is reflected by the inner wall surface of the reflecting member 11 surrounding the light emitting device 3a and is irradiated toward the virtual plane S toward the outside is taken out so as not to be biased. At this time, since the reflecting member 11 surrounding the light emitting device 3a is bilaterally symmetric, the imaginary plane S that faces the light emitting device 3a can be widely irradiated so as to be bilaterally symmetric in cross section. . Further, when viewed in a plan view, the virtual plane S facing the light emitting device 3a can be widely irradiated so as to be circular.

The plurality of reflectors 4 provided on the main surface 2a are separated from the main surface 2a of the reflecting member 11 at a position closer to the light emitting device 3 facing the virtual plane S as the distance from the light emitting device 3a facing the virtual plane S increases. The length is set to be short. As a result, the main surface 2a is curved when viewed in cross section, but as the distance from the light emitting device 3a increases, the length from the main surface 2a of the reflecting member 11 close to the light emitting device 3a to the tip is shortened. The illuminance of light applied to the virtual plane S can be adjusted in accordance with the curved state of the main surface 2a. If the length from the main surface 2a of the reflecting member 11 surrounding the light emitting device 3b to the tip is adjusted in accordance with the bent state of the main surface 2a at the place where the light emitting device 3b is mounted, the virtual plane S is irradiated. The illuminance of light can be determined. And the irradiation nonuniformity with respect to the irradiation surface equivalent to the virtual plane S of the light taken out from the several light-emitting device 3 can be reduced.

  Further, the reflecting member 11 surrounds the light emitting device 3b located at a position that does not face the virtual plane S, and the reflecting member 11 located near the light emitting device 3a that faces the virtual plane S emits light. The length from the main surface 2a to the tip is set shorter than the reflecting member 11 at a position far from the device 3a, and the tip of the reflecting member 11 at a position near the light emitting device 3a of the reflecting member 11 surrounding the light emitting device 3b. Part protrudes in the direction of the imaginary plane S from the straight line connecting the center of the light emitting surface of the light emitting device 3b and the tip of the reflecting member 11 surrounding the light emitting device 3a at a position close to the light emitting device 3b. Good. As a result, the light from the light emitting device 3b is emitted to the virtual plane S without being blocked by the outer peripheral portion of the reflecting member 11 of the light emitting device 3a, and the illuminance of the virtual plane S is improved and the reflecting member 11 of the light emitting device 3a is improved. The shadow is not generated on the virtual plane S, and the lighting device 1 can irradiate the virtual plane S uniformly.

  Further, the reflecting member 11 surrounding the light emitting device 3c located outside the light emitting device 3b is such that the height of the tip of the reflecting member 11 of the light emitting device 3c located near the light emitting device 3b is the center of the light emitting surface of the light emitting device 3c. May project in the direction of the imaginary plane S rather than on a straight line connecting the portion and the tip of the reflecting member 11 of the light emitting device 3b at a position close to the light emitting device 3c. As a result, the light from the light emitting device 3c is radiated to the virtual plane S without being blocked by the outer periphery of the reflecting member 11 of the light emitting device 3b, and the illuminance of the virtual plane S is improved and the reflecting member 11 of the light emitting device 3b is improved. The shadow is not generated on the virtual plane S, and the lighting device 1 can irradiate the virtual plane S uniformly.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. For example, in the above-described embodiment, the region surrounded by the reflector 4 is formed to be gradually wider toward the lower side, but is not limited thereto. Although the region surrounded by the reflector 4 becomes wider toward the lower side, there may be a part where the width becomes narrower.

<Modification>
Hereinafter, modifications of the embodiment of the present invention will be described. Note that, in the illuminating device 1 according to the modification of the embodiment of the present invention, the same portions as those of the illuminating device 1 according to the embodiment of the present invention are denoted by the same reference numerals, and description thereof will be omitted as appropriate. FIG. 9 is a perspective view of a part of the illumination device 1 according to a modified example, and is an oblique view from above.

  In the illuminating device 1 according to the above-described embodiment, the reflector 4 is on the upper side, and the plurality of light emitting devices 3 are directed upward in parallel to the plurality of light emitting devices 3 arranged in a line with respect to the mounting substrate 2. However, the present invention is not limited to this. A two-stage reflector structure in which the reflector 4 a is provided at the tip of the reflector 4 may be used.

  In the illumination device 1 according to the above-described embodiment, the reflector 4a is provided along a line shape in which the light emitting device 3a, the light emitting device 3b, and the light emitting device 3c are arranged, but the present invention is not limited thereto. The reflector 4a may be provided along the same type of light emitting device 3. That is, the reflecting plate 4a may be provided along each of the plurality of light emitting devices 3a, the plurality of light emitting devices 3b, and the plurality of light emitting devices 3c.

  As shown in FIG. 9, in the case of a two-stage reflector structure in which the reflector 4 and the reflector 4 a are connected, the light from the light emitting element 6 is collected by the reflector 4, thereby improving the illuminance of the virtual plane S. At the same time, the light that has not been applied to the reflector 4 is reflected by the reflecting plate 4a, and the virtual plane S can be applied uniformly. That is, the light from the light emitting element 6 is efficiently condensed on the virtual plane S by the reflector 4, the illuminance of the virtual plane S is improved, and the virtual plane S is uniformly irradiated by the reflector 4a. Unevenness in illuminance is suppressed.

<Manufacturing method of lighting device>
Here, the manufacturing method of the illuminating device 1 is demonstrated. First, the light emitting element 6 is prepared. When the substrate 5 and the frame 7 are made of, for example, an aluminum oxide sintered body, an organic binder, a plasticizer, a solvent, or the like is added to and mixed with the aluminum oxide raw material powder to obtain a mixture.

  The substrate 5 is formed into a sheet-like ceramic green sheet, the frame body 7 is filled with the mixture in the mold and dried, and the unsintered substrate 5 and the frame body 7 are taken out.

  Moreover, a high melting point metal powder such as tungsten or molybdenum is prepared, and an organic binder, a plasticizer, a solvent, or the like is added to and mixed with the powder to obtain a metal paste. And it prints with the predetermined pattern on the ceramic green sheet used as the taken-out substrate 5, laminates and fires a plurality of ceramic green sheets, and cuts into a predetermined shape. The frame body 7 is formed by sintering at a desired temperature.

  Next, after the light emitting element 6 is electrically mounted on the wiring pattern on the substrate 5 via solder, the frame body 7 is adhered on the substrate via an adhesive such as acrylic resin so as to surround the light emitting element 6. . Then, the sealing resin 8 is formed by filling the region surrounded by the frame body 7 with, for example, a silicone resin and curing the silicone resin.

  Next, the wavelength conversion member 9 is prepared. The wavelength conversion member 9 can be produced by mixing a phosphor with an uncured resin and using, for example, a sheet molding technique such as a doctor blade method, a die coater method, an extrusion method, a spin coating method, or a dip method. it can. For example, the wavelength conversion member 9 can be obtained by filling an uncured wavelength conversion member 9 in a mold, curing it, and taking it out.

  And the light-emitting device 3 is producible by adhere | attaching the prepared wavelength conversion member 9 on the level | step difference 7a of the frame 7 through the bonding material 10 which consists of resin, for example.

  Further, a strip-shaped printed board on which the light emitting device 3 is mounted in a line shape in the long side direction is prepared. For example, an electrode pad to which the light emitting device 3 is electrically connected, an input portion for inputting power to the light emitting device 3, and a glass epoxy substrate on which a wiring pattern for electrically connecting them is formed are prepared. 3 is electrically mounted on the electrode pad via solder, and the driving device of the light emitting device 3 is electrically connected to the input unit.

  Next, a housing is prepared. The housing is integrally formed by, for example, an extrusion method. However, it is not always necessary to form by integral molding, and each member may be manufactured separately and fastened with fastening means such as screws, or each member may be bonded and integrated with an adhesive. Good.

Furthermore, a mounting substrate 2 having a curved main surface 2a is prepared. The mounting substrate 2 can be prepared by forming a plate material made of aluminum with a mold so that the main surface 2a is curved, for example. Then, a printed board on which the plurality of light emitting devices 3 are electrically mounted via solder is fixed to the main surface 2a of the mounting substrate 2, and the plurality of reflectors 4 are fixed to the printed board so as to surround each light emitting device 3. .

  Further, a driving device is mounted on the other main surface of the mounting substrate 2. In this way, the light emitting device 2 can be manufactured. Next, the lighting device 1 can be manufactured by housing the light emitting device 3 in a housing.

DESCRIPTION OF SYMBOLS 1 Illumination device 2 Mounting board 3 Light-emitting device 4 Reflector 4a Reflector 5 Substrate 6 Light-emitting element 7 Frame 7a Step 8 Sealing resin 9 Wavelength conversion member 10 Joining material 11 Reflective member R Mounting area S Virtual plane

Claims (4)

A mounting substrate whose main surface is convexly curved in cross-section,
A plurality of light emitting devices provided on the main surface;
A lighting device provided on the main surface, surrounding each of the plurality of light emitting devices, and having a reflector made of a pair of reflecting members when viewed in cross section,
The reflector surrounding the light emitting device located at a position that does not face the virtual plane that faces the front of any one of the plurality of light emitting devices is close to the light emitting device that faces the virtual plane. A lighting device, wherein a length of the reflecting member from the main surface to the tip is shorter than that of the reflecting member at a position far from the light emitting device facing the virtual plane. The lighting device according to claim 1,
The lighting device, wherein the reflector surrounding the light emitting device facing the virtual plane is symmetrical in the left-right direction in a cross-sectional view. The lighting device according to claim 1,
The main surface is a part of a semi-cylindrical surface. The lighting device according to claim 1,
As the plurality of reflectors move away from the light emitting device facing the virtual plane, the length from the main surface to the tip of the reflecting member at a position close to the light emitting device facing the virtual plane becomes shorter. A lighting device characterized by comprising:

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