JP5622282B2 - 基板裏面洗浄装置 - Google Patents

基板裏面洗浄装置 Download PDF

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Publication number
JP5622282B2
JP5622282B2 JP2011215884A JP2011215884A JP5622282B2 JP 5622282 B2 JP5622282 B2 JP 5622282B2 JP 2011215884 A JP2011215884 A JP 2011215884A JP 2011215884 A JP2011215884 A JP 2011215884A JP 5622282 B2 JP5622282 B2 JP 5622282B2
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Japan
Prior art keywords
back surface
cleaning
cleaning liquid
substrate
wafer
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JP2011215884A
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Japanese (ja)
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JP2013077664A5 (https=
JP2013077664A (ja
Inventor
浩文 後藤
浩文 後藤
稔 久保田
稔 久保田
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2011215884A priority Critical patent/JP5622282B2/ja
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    • H01L21/30—

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  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2011215884A 2011-09-30 2011-09-30 基板裏面洗浄装置 Active JP5622282B2 (ja)

Priority Applications (1)

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JP2011215884A JP5622282B2 (ja) 2011-09-30 2011-09-30 基板裏面洗浄装置

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Application Number Priority Date Filing Date Title
JP2011215884A JP5622282B2 (ja) 2011-09-30 2011-09-30 基板裏面洗浄装置

Publications (3)

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JP2013077664A JP2013077664A (ja) 2013-04-25
JP2013077664A5 JP2013077664A5 (https=) 2013-11-21
JP5622282B2 true JP5622282B2 (ja) 2014-11-12

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JP2011215884A Active JP5622282B2 (ja) 2011-09-30 2011-09-30 基板裏面洗浄装置

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JP (1) JP5622282B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017098295A (ja) * 2015-11-18 2017-06-01 トヨタ自動車株式会社 半導体装置の製造装置及び製造方法
JP7512779B2 (ja) * 2020-09-04 2024-07-09 東京エレクトロン株式会社 液処理方法及び液処理装置
JP2023167537A (ja) * 2022-05-12 2023-11-24 新電元工業株式会社 レジスト塗布装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3573504B2 (ja) * 1994-11-04 2004-10-06 株式会社ルネサステクノロジ 半導体装置の製造方法
JPH11162964A (ja) * 1997-11-28 1999-06-18 Seiko Epson Corp 半導体製造装置の製造方法
JP2005311150A (ja) * 2004-04-23 2005-11-04 Seiko Epson Corp スピンコータ及び基板裏面の洗浄方法
JP4900949B2 (ja) * 2007-03-01 2012-03-21 東京エレクトロン株式会社 基板処理装置

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JP2013077664A (ja) 2013-04-25

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