JP5611620B2 - Sensor failure detection method, sensor failure detection device, and program - Google Patents

Description

  The present invention relates to a sensor failure detection method, a sensor failure detection device, and a program.

  In a manufacturing process of a semiconductor device, a processing apparatus for performing a film forming process of an object to be processed, for example, a semiconductor wafer is used. Various sensors are attached to such a processing apparatus, and for example, it is detected whether a semiconductor wafer is stored at a predetermined position inside the apparatus. In addition, various methods for performing higher-level device management using data obtained by this sensor have been proposed.

  For example, Patent Document 1 discloses that a semiconductor manufacturing apparatus provided with a sensor is connected to a management computer, a host computer, and a workstation including a failure diagnosis expert system, thereby detecting an occurrence of an abnormality early and appropriately. A semiconductor manufacturing apparatus management method has been proposed.

JP-A-7-282146

  However, in such a device, even if the attached sensor failed or there was a problem with the sensor installation, there was no way to detect the failure of the sensor itself or the installation failure, and a problem actually occurred. Later, the failed sensor is located and replaced. For this reason, when trouble occurs, many defective products have to be generated, or the apparatus being produced must be completely stopped, resulting in a problem that the yield of the product and the operation rate of the apparatus are deteriorated.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a sensor failure detection method, a sensor failure detection device, and a program capable of detecting a sensor failure or the like.

In order to achieve the above object, a sensor failure detection method according to the first aspect of the present invention includes:
A sensor status change determining step for determining whether or not the status of the sensor arranged in the semiconductor processing apparatus has changed;
When it is determined that the sensor status has changed in the sensor status change determination step, an abnormal pattern determination step for determining whether the sensor corresponds to an abnormal pattern;
When it is determined that the sensor corresponds to the abnormal pattern by the abnormal pattern determination step, a creation step of creating information on the change of the sensor,
A display step of displaying information on changes in the sensor created in the creation step on a display unit of the semiconductor processing apparatus;
A storage step of storing information relating to changes in the sensor created in the creation step;
Equipped with a,
In the abnormal pattern determination step, a pattern in which the ON / OFF of the sensor arranged on the axis changes even though the axis is not operating, a pattern in which the sensor repeats ON / OFF during the sensor reaction, or a cylinder retry If at least one of the patterns in which the sensor does not turn on before the cylinder retry corresponds, it is determined that the sensor corresponds to an abnormal pattern .

In the sensor, an allowable range of the repetition frequency of the abnormal pattern is defined,
Based on the information regarding the abnormal pattern of the sensor stored by the storage step, a repetition frequency specifying step for specifying the repetition frequency of the abnormal pattern by the sensor;
An allowable range determination step of determining whether or not the repetition frequency of the abnormal pattern by the sensor specified by the repetition frequency specification step is within the allowable range;
May be further provided.
In this case, in the display step, for example, when it is determined by the tolerance determination step that the repetition frequency of the abnormal pattern by the sensor is within the tolerance, the information regarding the change in the sensor created in the creation step is Not displayed on the display unit of the semiconductor processing apparatus.

The sensor failure detection apparatus according to the second aspect of the present invention is:
Sensor status change determining means for determining whether or not the status of the sensor disposed in the semiconductor processing apparatus has changed;
When it is determined that the sensor status has changed by the sensor status change determining means, an abnormal pattern determining means for determining whether or not the sensor corresponds to an abnormal pattern;
When it is determined that the sensor corresponds to the abnormal pattern by the abnormal pattern determination unit, a creation unit that generates information on the change of the sensor;
Display means for displaying information relating to changes in the sensor created by the creating means on a display unit of the semiconductor processing apparatus;
Storage means for storing information relating to changes in the sensor created by the creating means;
Equipped with a,
The abnormal pattern discriminating means is a pattern in which the ON / OFF of the sensor arranged on the axis changes even though the axis is not operating, a pattern in which the sensor repeats ON / OFF during a sensor reaction, or a cylinder retry If at least one of the patterns in which the sensor does not turn on before the cylinder retry corresponds, it is determined that the sensor corresponds to an abnormal pattern .

The storage means stores an allowable range of the repetition frequency of the abnormal pattern of the sensor,
Based on the information regarding the abnormal pattern of the sensor stored by the storage means, a repetition frequency specifying means for specifying the repetition frequency of the abnormal pattern by the sensor;
Tolerance range determining means for determining whether or not the repetition frequency of the abnormal pattern by the sensor specified by the repetition frequency specifying means is within the allowable range;
May be further provided.
In this case, for example, if the display unit determines that the repetition frequency of the abnormal pattern by the sensor is within the allowable range by the allowable range determination unit, the display unit displays information on the sensor change generated by the generation unit. Not displayed on the display unit of the semiconductor processing apparatus.

The program according to the third aspect of the present invention is:
Computer
Sensor status change determining means for determining whether the status of a sensor arranged in the semiconductor processing apparatus has changed,
When the sensor status change determining means determines that the sensor status has changed, an abnormal pattern determining means for determining whether the sensor corresponds to an abnormal pattern;
Creating means for creating information on changes in the sensor when the abnormal pattern determining means determines that the sensor corresponds to the abnormal pattern;
Display means for displaying information on changes in the sensor created by the creating means on a display unit of the semiconductor processing apparatus;
Storage means for storing information relating to changes in the sensor created by the creating means;
To function as,
The abnormal pattern discriminating means is a pattern in which the ON / OFF of the sensor arranged on the axis changes even though the axis is not operating, a pattern in which the sensor repeats ON / OFF during a sensor reaction, or a cylinder retry If at least one of the patterns in which the sensor does not turn on before the cylinder retry corresponds, it is determined that the sensor corresponds to an abnormal pattern .

  According to the present invention, it is possible to detect a sensor failure or the like.

It is a figure which shows the structure of the processing apparatus which concerns on embodiment of this invention. It is a figure which shows the structural example of the control part of FIG. It is a figure which shows an example of the sensor change information memorize | stored in a sensor information storage part. It is a flowchart for demonstrating the sensor failure detection process of this Embodiment. It is a figure which shows an example of the tolerance | permissible_range defined for the sensor. It is a flowchart for demonstrating the sensor failure detection process of other embodiment.

  Hereinafter, the present embodiment will be described taking as an example the case where the sensor failure detection method, the sensor failure detection device, and the program of the present invention are applied to the processing device shown in FIG.

  As shown in FIG. 1, the processing chamber 10 of the processing apparatus 1 according to the present embodiment is partitioned into a work area S1 and a loading area S2 by a partition wall 11. The work area S1 is an area for transporting the carrier C, which is a sealed transport container containing a large number of semiconductor wafers W, for example, 25, and storing the carrier C, and is maintained in an air atmosphere. ing. On the other hand, the loading area S2 is a region for performing a heat treatment, for example, a film formation process or an oxidation process on the semiconductor wafer W, and is maintained in an inert gas, for example, a nitrogen gas atmosphere.

  In the work area S1, a load port 21, a carrier transporter 22, a transfer stage 23, and a storage unit 24 are provided.

  The load port 21 mounts the carrier C carried in by an external transport mechanism (not shown) from the transport port 20 provided at a side position of the processing chamber 10. For example, a door D is provided outside the processing chamber 10 at a position corresponding to the transfer port 20, and the transfer port 20 is configured to be freely opened and closed by the door D.

  The carrier transporter 22 is provided between the load port 21 and the transfer stage 23, and transports the carrier C in the work area S1. The carrier transporter 22 includes a support column 25 and a horizontal arm 26 provided on a side surface of the support column 25. The support column 25 is long in the processing chamber 10 in the vertical direction. The horizontal arm 26 is configured to be movable up and down by a motor M provided on the lower side of the support column 25. Further, the horizontal arm 26 is provided with a transfer arm 27 made of, for example, a joint arm, and the transfer arm 27 is raised and lowered by raising and lowering the horizontal arm 26. The transfer arm 27 is configured to be movable in the horizontal direction by a motor (not shown). As described above, the horizontal arm 26 is configured such that the carrier C is delivered by moving the transport arm 27 up and down and horizontally.

  The transfer stage 23 is provided on the work area S <b> 1 side of the partition wall 11 and places the carrier C transported by the carrier transporter 22. The transfer stage 23 is attached, for example, at two locations on the top and bottom. In the transfer stage 23, the semiconductor wafer W is taken out from the placed carrier C to the loading area S2 by the transfer mechanism 42 described later. Further, the partition 11 at the side of the transfer stage 23 is open. A shutter 30 is provided on the loading area S2 side of the partition wall 11 so as to close the opening.

  The storage unit 24 is provided on the upper side in the work area S1 and stores the carrier C. The storage unit 24 is provided, for example, in groups of 4 columns vertically and 2 columns horizontally, and the storage unit 24 is installed so as to sandwich the support column 25 (carrier C transport area). ing.

  In the loading area S2, a heat treatment furnace 40, which is a vertical processing unit having a lower end opened as a furnace port, is disposed. Below the heat treatment furnace 40, a wafer boat 41, which is a holder for holding a large number of semiconductor wafers W, is installed so as to be movable up and down by an elevator mechanism (not shown).

  A transfer mechanism 42 is provided between the wafer boat 41 and the partition wall 11. The transfer mechanism 42 delivers the semiconductor wafer W between the carrier C placed on the transfer stage 23 and the wafer boat 41. In addition, the transfer mechanism 42 is provided with, for example, an arm 43 that can transfer a plurality of semiconductor wafers W in a lump. The transfer mechanism 42 is rotatable about a vertical axis by a motor (not shown), and is configured to be movable up and down along a lifting shaft 44.

  Various sensors are arranged in the processing chamber 10 of the processing apparatus 1. For example, an encoder is combined with the motor M, and the height position of the horizontal arm 26 is detected by the encoder value in the encoder. In addition, position sensors such as an end limit sensor and a base position sensor for detecting the motor position and the cylinder position are arranged in various motors and cylinders. Further, the wafer boat 41 is provided with a wafer position sensor for detecting whether or not the semiconductor wafer W to be stored is stored and the storage position. The heat treatment furnace 40 is provided with a plurality of temperature sensors for measuring the temperature in the heat treatment furnace 40 and a plurality of pressure sensors for measuring the pressure in the heat treatment furnace 40.

  These various sensors are connected to a control unit 100 for controlling the processing apparatus 1. FIG. 2 shows the configuration of the control unit 100. As shown in FIG. 2, the control unit 100 is connected to various sensors such as an operation panel 121 and a position sensor 122, a motor M, and the like. The control unit 100 outputs a control signal to, for example, the motor M, the horizontal arm 26, the transfer mechanism 42, and the like based on data from various sensors such as the position sensor 122.

The operation panel 121 includes a display unit (display screen) and operation buttons, transmits operator operation instructions to the control unit 100, and displays various information from the control unit 100 on the display screen. Further, when a failure of the sensor is detected, the operation panel 121 displays that the sensor is broken.
Various sensors such as the position sensor 122 detect the motor position, the cylinder position, and the like, and notify the control unit 100 of the detected information (position, etc.).

  As shown in FIG. 2, the control unit 100 includes a sensor information storage unit 101, a recipe storage unit 102, a ROM 103, a RAM 104, an I / O port 105, a CPU 106, and a bus 107 that interconnects these. , Is composed of.

  The sensor information storage unit 101 stores information (sensor change information) related to sensor abnormality detection (change). As shown in FIG. 3, the sensor change information includes, for example, the date and time when the abnormality was detected, the name of the sensor that became abnormal, the reason for determining the abnormality, and the like, and this information is stored in the sensor information storage unit 101. Yes. The reason for determining the abnormality will be described later in the sensor failure detection process. For example, the axis is turned ON / OFF without operating, the sensor reaction is repeatedly turned ON / OFF, and the cylinder retry is repeated.

  The recipe storage unit 102 stores a process recipe for determining a control procedure according to the type of processing executed by the processing apparatus 1. The process recipe is a recipe prepared for each process (process) actually performed by the user. This recipe includes a predetermined operation program for each part of the apparatus.

The ROM 103 is a recording medium that includes an EEPROM, a flash memory, a hard disk, and the like, and stores an operation program of the CPU 106 and the like.
The RAM 104 functions as a work area for the CPU 106.
For example, the I / O port 105 supplies information from the sensor to the CPU 106 and outputs a control signal output from the CPU 106 to each unit of the apparatus.

A CPU (Central Processing Unit) 106 constitutes the center of the control unit 100 and executes an operation program stored in the ROM 103. Further, the CPU 106 controls the operation of the processing apparatus 1 along the process recipe stored in the recipe storage unit 102 in accordance with an instruction from the operation panel 121.
The bus 107 transmits information between the units.

  Next, a sensor failure detection method (sensor failure detection process) for detecting a sensor abnormality will be described. In the sensor failure detection method of the present invention, for example, after ON / OFF is repeated once every 10 minutes for about 0.1 second, the ON / OFF repeat frequency increases (the repeat interval becomes shorter), and the sensor fails. If the sensor itself is starting to break down, the axis detected by the sensor is poorly adjusted, the sensor is not properly attached, or the teaching is poor, will it fail to function as a sensor in the future ( This is a warning (warning). That is, the sensor failure detection method of the present invention detects a sensor failure in advance and gives a warning. FIG. 4 is a flowchart for explaining sensor failure detection processing.

  First, the control unit 100 (CPU 106) determines whether or not the status of the sensor disposed in the processing device 1 has changed (the sensor is ON / OFF) (step S1). If the CPU 106 determines that the sensor is not ON / OFF (step S1: No), the CPU 106 ends this process. When the CPU 106 determines that the sensor has been turned ON / OFF (step S1: Yes), the CPU 106 determines whether the sensor corresponds to an abnormal pattern (step S2).

Examples of the case where the sensor corresponds to the abnormal pattern include the following cases.
(1) Sensors that turn ON / OFF even when the shaft is not operating Sensors that should not turn ON / OFF unless the shaft moves, such as the cylinder shaft operating position sensor and motor shaft end limit sensor If changed, the sensor is detected as abnormal. This abnormal pattern often occurs when the sensor changes, for example, for about 0.1 seconds, and often occurs when the sensor alone starts to fail.

(2) Sensor that repeats ON / OFF during sensor reaction When the sensor reacts, the sensor settles in the target state (ON or OFF) after repeating ON / OFF of the sensor. In this way, a sensor that repeats ON / OFF until the target state is reached is detected as abnormal. This abnormal pattern often occurs when the sensor position is poorly attached or teaching is poor, or when the sensor alone starts to fail.

(3) Sensor that repeats cylinder retry Cylinder retry is a function that, when a time-out occurs in cylinder operation, turns off the output in the operation direction and then turns it on again to complete the cylinder operation. . When this function is activated and a cylinder is retried, a sensor that does not turn on before the cylinder is retried is detected as abnormal. This abnormal pattern often occurs in the case of cylinder shaft misalignment rather than sensor failure.

  When the CPU 106 determines that the sensor does not correspond to the abnormal pattern (step S2: No), the CPU 106 ends this process. When the CPU 106 determines that the sensor corresponds to the abnormal pattern (step S2: Yes), the CPU 106 creates sensor change information (information relating to sensor abnormality detection) and displays the created sensor change information on the operation panel 121 (step S1). S3).

  As described above, a warning (warning) for notifying the operator of the processing apparatus 1 of a sensor failure is performed when turning ON / OFF or repeating ON / OFF at the time of sensor reaction even though the shaft is not operating. Therefore, it is possible to inform the operator of the processing apparatus 1 of the sensor that has begun to fail. Further, when the sensor position is poorly attached or taught, or when the cylinder shaft is poorly adjusted, a warning is issued, so that the operator of the processing apparatus 1 can be notified of the sensor attachment failure.

  Finally, the CPU 106 stores sensor change information in the sensor information storage unit 101 (step S4), and ends this process.

  As described above, according to the present embodiment, since a sensor failure is detected in advance and a warning (warning) is made, the operator of the processing apparatus 1 can check the sensor that has begun to fail. . For this reason, the safety | security of the processing apparatus 1 can be improved by repairing a sensor with bad condition at an early stage. In addition, when a trouble occurs, the failure location of the sensor can be confirmed immediately, and a prompt action can be taken. As a result, damage to the processing apparatus 1 can be prevented, and the operating rate of the processing apparatus 1 can be improved.

  In addition, according to the present embodiment, in the case of a sensor attachment failure or the like, a warning can be given in advance, so that startup can be performed reliably and failure of the processing apparatus 1 can be prevented. In addition, if a sensor or the like that is poorly attached is confirmed at the time of shipment of the apparatus, the processing apparatus 1 that operates reliably can be shipped.

  Furthermore, according to the present embodiment, since sensor change information is stored in the sensor information storage unit 101, a list of sensors that have become abnormal patterns can be confirmed.

  In addition, this invention is not restricted to said embodiment, A various deformation | transformation and application are possible. Hereinafter, other embodiments applicable to the present invention will be described.

  In the embodiment described above, the present invention has been described by taking an example in which, when it is determined that a sensor corresponds to the abnormal pattern, the change information of the sensor is displayed on the operation panel 121 and a warning is given. For example, the sensor corresponds to the abnormal pattern. The change information of the sensor may be displayed on the operation panel 121 for warning only in a predetermined case.

  For example, when the possibility of a sensor failure is still low, the operator of the processing apparatus 1 may not be warned of the sensor failure. Specifically, the change information of the sensor is determined only when the repetition frequency of the abnormal pattern by the sensor exceeds a predetermined range (the interval at which the abnormal pattern is repeated is shorter than the predetermined range) among those determined that the sensor corresponds to the abnormal pattern. Is displayed on the operation panel 121 to warn. As such a method, for example, the sensor information storage unit 101 stores a predetermined range (allowable range) for repeating the abnormal pattern according to the sensor as shown in FIG. There is a method for determining whether or not there is a failure warning. FIG. 6 shows a flowchart for explaining the sensor failure detection process.

  As shown in FIG. 6, the CPU 106 determines whether or not the sensor disposed in the processing device 1 has been turned ON / OFF (step S1), and determines that the sensor has not been turned ON / OFF (step S1: No), this process ends. When the CPU 106 determines that the sensor is turned ON / OFF (step S1: Yes), the CPU 106 determines whether the sensor corresponds to the abnormal pattern (step S2), and determines that the sensor does not correspond to the abnormal pattern (step S2). : No), this process is terminated.

  When the CPU 106 determines that the sensor corresponds to the abnormal pattern (step S2: Yes), the CPU 106 repeats the abnormal pattern repeat frequency (repeats the abnormal pattern) based on the sensor change information stored in the sensor information storage unit 101. (Interval) is specified (step S11). Next, the CPU 106 determines whether or not the identified repetition frequency is within an allowable range (step S12). Specifically, the CPU 106 compares the allowable range stored in the sensor information storage unit 101 for the corresponding sensor with the identified repetition frequency (interval), and determines whether the repetition frequency is within the allowable range. To do. If the CPU 106 determines that it is within the allowable range (step S12: Yes), the CPU 106 proceeds to step S4.

  If the CPU 106 determines that it is not within the allowable range (step S12: No), it creates sensor change information (information relating to sensor abnormality detection) and displays the created sensor change information on the operation panel 121 (step S3). Finally, the CPU 106 stores sensor change information in the sensor information storage unit 101 (step S4), and ends this process.

  As described above, in the sensor failure detection process of this example, only when the repetition frequency of the abnormal pattern is not within the allowable range, the change information of the sensor is displayed on the operation panel 121 and warned. Therefore, the sensor may still fail. In such a situation, it is possible not to warn the operator of the processing apparatus 1 of a sensor failure. If it is determined that the value is within the allowable range, the process proceeds to step S4, and sensor change information is stored in the sensor information storage unit 101 even when the possibility that the sensor will fail is low.

  Note that the allowable range is not limited to that stored in the sensor information storage unit 101. For example, the CPU 106 automatically determines from the time until the processing device 1 finishes processing and stops, the estimated life of the sensor, and the like. May be specified. The CPU 106 controls the operation of the processing apparatus 1 in accordance with the process recipe stored in the recipe storage unit 102 in accordance with an instruction from the operation panel 121. For example, the CPU 106 uses an instruction from the operation panel 121 and a process recipe. Based on this, the time until the processing device 1 ends the processing and stops is specified. Further, the CPU 106 calculates the estimated life of the sensor based on the sensor change information stored in the sensor information storage unit 101, for example.

  In the above embodiment, the sensor abnormal pattern includes the case of repeated cylinder retries that occur due to poor adjustment of the cylinder axis, but the present invention only needs to detect and warn in advance of sensor failure, The sensor abnormality pattern may not include the case where the cylinder retry is repeated.

  In the above embodiment, the present invention has been described by taking the case where the present invention is applied to the processing apparatus shown in FIG. 1 as an example. However, for example, the present invention is applied to a single wafer processing apparatus or a batch processing apparatus. Is also possible. The present invention is not limited to the processing of semiconductor wafers, and can be applied to processing of FPD substrates, glass substrates, PDP substrates, and the like.

  The control unit 100 according to the embodiment of the present invention can be realized using a normal computer system, not a dedicated system. For example, the control unit 100 that executes the above-described processing is configured by installing the program from a recording medium (such as a flexible disk or a CD-ROM) that stores the program for executing the above-described processing in a general-purpose computer. be able to.

  The means for supplying these programs is arbitrary. In addition to being able to be supplied via a predetermined recording medium as described above, for example, it may be supplied via a communication line, a communication network, a communication system, or the like. In this case, for example, the program may be posted on a bulletin board (BBS) of a communication network and provided by superimposing it on a carrier wave via the network. Then, the above-described processing can be executed by starting the program thus provided and executing it in the same manner as other application programs under the control of the OS.

  The present invention is useful for detecting a sensor failure or the like.

DESCRIPTION OF SYMBOLS 1 Processing apparatus 21 Load port 22 Carrier transfer machine 23 Transfer stage 25 Support column 26 Horizontal arm 27 Transfer arm 40 Heat treatment furnace 41 Wafer boat 42 Transfer mechanism 43 Arm 44 Lifting shaft 100 Control unit 101 Model storage unit 102 Recipe storage unit 103 ROM
104 RAM
105 I / O port 106 CPU
107 bus 121 operation panel 122 position sensor C carrier M motor W semiconductor wafer

Claims (5)

A sensor status change determining step for determining whether or not the status of the sensor arranged in the semiconductor processing apparatus has changed;
When it is determined that the sensor status has changed in the sensor status change determination step, an abnormal pattern determination step for determining whether the sensor corresponds to an abnormal pattern;
When it is determined that the sensor corresponds to the abnormal pattern by the abnormal pattern determination step, a creation step of creating information on the change of the sensor,
A display step of displaying information on changes in the sensor created in the creation step on a display unit of the semiconductor processing apparatus;
A storage step of storing information relating to changes in the sensor created in the creation step;
Equipped with a,
In the abnormal pattern determination step, a pattern in which the ON / OFF of the sensor arranged on the axis changes even though the axis is not operating, a pattern in which the sensor repeats ON / OFF during the sensor reaction, or a cylinder retry A sensor failure detection method , wherein when a sensor corresponds to at least one pattern that does not turn ON before cylinder retry, the sensor is determined to be an abnormal pattern . In the sensor, an allowable range of the repetition frequency of the abnormal pattern is defined,
Based on the information regarding the abnormal pattern of the sensor stored by the storage step, a repetition frequency specifying step for specifying the repetition frequency of the abnormal pattern by the sensor;
An allowable range determination step of determining whether or not the repetition frequency of the abnormal pattern by the sensor specified by the repetition frequency specification step is within the allowable range;
Further comprising
In the display step, when it is determined in the allowable range determination step that the repetition frequency of the abnormal pattern by the sensor is within the allowable range, information on a change in the sensor generated in the generation step is displayed on the semiconductor processing apparatus. The sensor failure detection method according to claim 1, wherein the sensor failure detection method is not displayed on the screen. Sensor status change determining means for determining whether or not the status of the sensor disposed in the semiconductor processing apparatus has changed;
When it is determined that the sensor status has changed by the sensor status change determining means, an abnormal pattern determining means for determining whether or not the sensor corresponds to an abnormal pattern;
When it is determined that the sensor corresponds to the abnormal pattern by the abnormal pattern determination unit, a creation unit that generates information on the change of the sensor;
Display means for displaying information relating to changes in the sensor created by the creating means on a display unit of the semiconductor processing apparatus;
Storage means for storing information relating to changes in the sensor created by the creating means;
Equipped with a,
The abnormal pattern discriminating means is a pattern in which the ON / OFF of the sensor arranged on the axis changes even though the axis is not operating, a pattern in which the sensor repeats ON / OFF during a sensor reaction, or a cylinder retry A sensor failure detection device , wherein when a sensor falls under at least one pattern that does not turn on before cylinder retry, the sensor is judged to fall under an abnormal pattern . The storage means stores an allowable range of the repetition frequency of the abnormal pattern of the sensor,
Based on the information regarding the abnormal pattern of the sensor stored by the storage means, a repetition frequency specifying means for specifying the repetition frequency of the abnormal pattern by the sensor;
Tolerance range determining means for determining whether or not the repetition frequency of the abnormal pattern by the sensor specified by the repetition frequency specifying means is within the allowable range;
Further comprising
When the tolerance determining unit determines that the repetition frequency of the abnormal pattern by the sensor is within the allowable range, the display unit displays information on the sensor change created by the creating unit on the display of the semiconductor processing apparatus. The sensor failure detection device according to claim 3, wherein the sensor failure detection device is not displayed on the screen. Computer
Sensor status change determining means for determining whether the status of a sensor arranged in the semiconductor processing apparatus has changed,
When the sensor status change determining means determines that the sensor status has changed, an abnormal pattern determining means for determining whether the sensor corresponds to an abnormal pattern;
Creating means for creating information on changes in the sensor when the abnormal pattern determining means determines that the sensor corresponds to the abnormal pattern;
Display means for displaying information on changes in the sensor created by the creating means on a display unit of the semiconductor processing apparatus;
Storage means for storing information relating to changes in the sensor created by the creating means;
To function as,
The abnormal pattern discriminating means is a pattern in which the ON / OFF of the sensor arranged on the axis changes even though the axis is not operating, a pattern in which the sensor repeats ON / OFF during a sensor reaction, or a cylinder retry A program characterized in that, when a sensor corresponds to at least one pattern that does not turn ON before cylinder retry, the sensor is determined to be an abnormal pattern .

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