JP5610398B2 - Light emitting element substrate and light emitting device - Google Patents

Description

  The present invention relates to a light emitting element substrate and a light emitting device, and more specifically to a light emitting element substrate on which a light emitting element is mounted and a light emitting device using the light emitting element substrate.

  Conventionally, a light-emitting element substrate for mounting a light-emitting element such as an LED on a surface is known (for example, Japanese Patent Application Laid-Open No. 2010-56460 (hereinafter referred to as “Patent Document 1”), Japanese Patent Application Laid-Open No. 2010-245258. Gazette (hereinafter referred to as “Patent Document 2”), Japanese Patent Application Laid-Open No. 2010-199167 (hereinafter referred to as “Patent Document 3”). For example, in Patent Document 1, the planar shape is circular, and a base in which a plurality of through holes penetrating from the main surface to the back surface is formed; a metal member filled in the through hole; There is disclosed a substrate for a light emitting element including a metal layer disposed on a surface and connected to a metal member filled in a through hole. In Patent Document 1, when a light emitting element is mounted on the surface of a metal layer, a plurality of through holes are arranged at equal intervals on a circumference where the distance from the light emitting element is constant, thereby reducing variation in heat dissipation. It can be done.

  In Patent Document 2, a metal core substrate, an oxidation-resistant coating layer that covers the surface of the core substrate and is configured by a metal layer or enamel layer, an insulating layer formed on the oxidation-resistant coating layer, A light emitting element substrate is disclosed that includes a wiring layer formed on an insulating layer. In Patent Document 2, since the oxidation-resistant coating layer is formed on the surface of the core substrate, the core substrate can be prevented from being oxidized during the firing of the insulating layer, and the durability of the light-emitting element substrate can be improved. I can do it.

  Moreover, in patent document 3, it has an inclined side wall surrounding the circumference | surroundings of the part arrange | positioned on a ceramic board | substrate, the conductor wiring formed on the ceramic board | substrate, and being arrange | positioned on a ceramic board | substrate, and is light-emitting A light emitting device package including a reflector for condensing light from the device to the front side and a copper plate bonded to the back surface of the ceramic substrate is disclosed.

JP 2010-56460 A JP 2010-245258 A JP 2010-199167 A

  However, the conventional light emitting element substrate described above has the following problems. That is, in the light emitting element substrate disclosed in Patent Document 1, in order to obtain uniform heat dissipation, a through hole is formed in the base, the inside of the through hole is filled with a metal, and a metal layer is formed on the surface of the base. Since a complicated configuration such as forming a film is employed, there is a problem in that the manufacturing cost increases. In addition, the light emitting element substrate disclosed in Patent Document 2 employs a laminated structure of an oxidation-resistant coating layer and an insulating layer on the core substrate surface, and thus is similar to the technique disclosed in Patent Document 1. There has been a problem that the manufacturing cost increases due to an increase in the number of manufacturing steps of the light emitting element substrate. The package disclosed in Patent Document 3 also has a complicated configuration in which a copper plate is arranged to improve heat dissipation and a block-like reflector is arranged to increase the utilization efficiency of light emitted from the light emitting element. However, there was a problem that the manufacturing cost also increased.

  Further, when an oxidation-resistant coating layer or an insulating layer is formed on the surface of the core substrate as in Patent Document 2, as a result, the heat dissipation (thermal conductivity) of the light emitting element substrate is caused by the presence of these insulating layers. It was difficult to ensure sufficient heat dissipation. On the other hand, in order to increase the output of the light emitting element, the substrate for the light emitting element is required to have further heat dissipation.

  Further, when a block reflector as in Patent Document 3 is used, there is a problem that it is difficult to reduce the size and weight of the light emitting element substrate to reduce the height and size.

In addition, in order to increase the utilization efficiency of light emitted from the light emitting element (increase the reflectance), the inventor has also studied the use of a white resin such as epoxy resin or aromatic nylon as the material of the substrate for the light emitting element. Although the white resin is excellent in moldability, it has a problem that it is discolored (yellowed) by heat and light, resulting in a decrease in light reflectance. In addition, in order to improve the light utilization efficiency, we also considered applying silver plating to the surface of the light emitting element substrate. However, such silver plating is still discolored due to the presence of a small amount of SiO ₂ , As a result, there has been a problem that the reflectance of light decreases.

  Thus, conventionally, it has been difficult to manufacture a light emitting element substrate having excellent characteristics such as light utilization efficiency and heat dissipation at low cost.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a substrate for a light-emitting element and a light-emitting device that have excellent characteristics and can suppress an increase in manufacturing cost. Is to provide.

The light emitting element substrate according to the present invention includes a base substrate and a coating layer. The coating layer is formed in contact with the surface of the base substrate. The coating layer is either transparent or translucent to visible light after heating to 260 ° C., or white when opaque to visible light . The material constituting the coating layer is one selected from the group consisting of EFEP, PTFE, and white fluororesin. The material constituting the coating layer is cross-linked.

  In this way, since the substrate for the light-emitting element has a simple configuration consisting of the base substrate and the covering layer, the light emission can be performed more than when a through-hole is formed in the substrate and a reflector is disposed as in the conventional case. An increase in the manufacturing cost of the element substrate can be avoided. In addition, even after the process of fixing the light emitting element on the coating layer of the light emitting element substrate by the solder reflow process, the coating layer remains transparent, translucent, or white. The light-emitting element can be fixed on the substrate by a solder reflow process, and the light (visible light) emitted from the light-emitting element is incident on the surface of the white coating layer or transparent or Reflection is possible at the contact interface between the translucent coating layer and the base substrate. For this reason, the process of mounting the light emitting element on the light emitting element substrate can be easily performed, and the utilization efficiency of the light emitted from the light emitting element can be improved.

  Here, the term “transparent to visible light” means that for visible light, the ratio of the intensity of transmitted light to the intensity of incident light per unit thickness (for example, 1 mm) of the material constituting the coating layer is 90% or more. It means that there is. Moreover, translucency with respect to visible light means that the ratio of the intensity of transmitted light to the intensity of incident light per unit thickness (for example, 1 mm) of the material constituting the coating layer is 50% or more and 90% for visible light. Means less than.

  A light emitting device according to the present invention includes the light emitting element substrate and a light emitting element mounted on a coating layer of the light emitting element substrate. In this case, it is possible to obtain a light-emitting device that suppresses an increase in manufacturing cost and has excellent heat dissipation characteristics and high utilization efficiency of light emitted from the light-emitting element.

  According to the present invention, it is possible to obtain a light emitting element substrate and a light emitting device that have excellent characteristics and can suppress an increase in manufacturing cost.

It is a cross-sectional schematic diagram which shows Embodiment 1 of the board | substrate for light emitting elements by this invention. It is a cross-sectional schematic diagram which shows the modification of the light emitting element use substrate shown in FIG. It is a cross-sectional schematic diagram which shows Embodiment 2 of the board | substrate for light emitting elements by this invention. It is a cross-sectional schematic diagram which shows the modification of Embodiment 2 of the light emitting element use substrate shown in FIG. It is a cross-sectional schematic diagram which shows the light emitting element module using the board | substrate for light emitting elements by this invention. It is a cross-sectional schematic diagram which shows the 1st modification of the light source module by this invention shown in FIG. It is a cross-sectional schematic diagram which shows the 2nd modification of the light source module by this invention shown in FIG. It is a cross-sectional schematic diagram which shows the light source unit by this invention. It is a cross-sectional schematic diagram which shows the other example of the light source unit by this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and description thereof will not be repeated.

(Embodiment 1)
A light-emitting element substrate 1 according to the present invention will be described with reference to FIG.

  Referring to FIG. 1, a light emitting element substrate 1 according to the present invention includes a plate-like base substrate 2 and a coating layer 3 formed on the main surface of the base substrate 2. Although any material such as a metal material or a resin material can be used for the base substrate 2, it is preferable to use a metal material if the heat dissipation is particularly important. As the material of the base substrate 2, for example, aluminum or an aluminum alloy, copper or a copper alloy, or a metal such as magnesium, rhodium, nickel, silver, or stainless steel can be used. Moreover, when using a resin material as a material which comprises the base substrate 2, resin materials, such as a liquid crystal polymer (LCP), a polyimide (PI), an epoxy resin, and PEEK, can be used, for example.

  As the coating layer 3, a material that is transparent or translucent to visible light or a white material can be used. More preferably, the covering layer 3 is made of a transparent, translucent or white material for light emitted from the light emitting element mounted on the light emitting element substrate 1. Here, the transparency with respect to the light emitted from the light-emitting element means that the light with a specific wavelength emitted from the light-emitting element corresponds to the intensity of incident light per unit thickness (for example, 1 mm) of the material constituting the coating layer 3. It means that the ratio of the intensity of transmitted light is 90% or more. Moreover, translucent with respect to the light emitted from the light emitting element means that the light having a specific wavelength emitted from the light emitting element is transmitted with respect to the intensity of the incident light per unit thickness (for example, 1 mm) of the material constituting the coating layer 3. It means that the light intensity ratio is 50% or more and less than 90%.

  Examples of the material of the coating layer 3 include cross-linked EFEP (copolymer of ethylene, hexafluoropropylene, and tetrafluoroethylene), transparent PTFE (polytetrafluoroethylene), PFA, FEP, or a fluororesin that is a white resin material. Resin materials such as EFEP, cross-linked ETFE, or cross-linked EFEP, ETFE, PTFE, PFA, FEP which are transparent resin materials can be used. The thickness T2 of the base substrate 2 can be set to 1 μm or more and 1000 μm or less, for example. The thickness T2 of the base substrate 2 is preferably 10 μm or more and 300 μm or less. Moreover, the thickness T1 of the coating layer 3 can be, for example, not less than 1 μm and not more than 200 μm. The thickness T1 of the coating layer 3 is preferably 5 μm or more and 30 μm or less. Thus, by making the thickness T1 of the coating layer 3 sufficiently thin, the heat from the light emitting element mounted on the coating layer 3 can be quickly transmitted to the base substrate 2 side.

  That is, when the light emitting element substrate 1 having such a configuration is used, when the light emitting element is arranged on the surface of the light emitting element substrate 1 to emit light, the heat generated from the light emitting element is sufficiently thin. 3 can be quickly transmitted to the base substrate 2. Further, by dissipating the heat from the base substrate 2, it is possible to suppress the temperature rise in the light emitting element and to suppress the occurrence of the problem that the light emission capability of the light emitting element is deteriorated due to the temperature rise. Even if a part of the light emitted from the light emitting element arranged on the coating layer 3 is incident on the coating layer 3 side, the light is emitted at the interface between the coating layer 3 and the base substrate 2 or the surface of the coating layer 3. Can be reflected. As a result, since the surface of the coating layer 3 or the surface of the base substrate 2 can be used as a reflector, the utilization efficiency of light emitted from the light emitting element can be increased. Moreover, since the structure of the light emitting element substrate 1 is a relatively simple structure, the manufacturing cost can be reduced as compared with the case of forming a through hole.

  Next, with reference to FIG. 2, the modification of Embodiment 1 of the light emitting element use substrate by this invention is demonstrated.

  The light emitting element substrate 1 shown in FIG. 2 basically has the same structure as the light emitting element substrate 1 shown in FIG. 1, but the structure of the base substrate 2 is the light emitting element substrate 1 shown in FIG. Is different. That is, in the light emitting element substrate 1 shown in FIG. 2, the base substrate 2 is configured by the base substrate 21 and the reflective layer 22 formed on the surface of the base substrate 21. As the base substrate 21, the same material as that of the base substrate 2 shown in FIG. 1 can be used. Further, as the reflective layer 22, for example, a metal film can be formed. As the metal film constituting the reflective layer 22, for example, a metal film formed by plating aluminum, copper, or other metals may be used. Here, the thickness T4 of the base substrate 21 can be set to, for example, 10 μm or more and 1000 μm or less. Further, the thickness T4 of the base substrate 21 is preferably 10 μm or more and 500 μm or less, more preferably 10 μm or more and 300 μm or less. Moreover, the thickness T3 of the reflective layer 22 can be, for example, 10 μm or more and 100 μm or less. The thickness T3 of the reflective layer 22 is preferably 10 μm or more and 50 μm or less, and more preferably 10 μm or more and 30 μm or less. The covering layer 3 is made of a material that is transparent or translucent with respect to light emitted from the light emitting element 5.

  Also with the light emitting element substrate 1 having such a configuration, the same effects as those of the light emitting element substrate 1 shown in FIG. 1 can be obtained. In the light emitting element substrate 1 shown in FIG. 2, since the reflective layer 22 is formed, a part of the light emitted from the light emitting element arranged on the covering layer 3 is incident on the covering layer 3 side. In addition, the light can be reliably reflected by the reflective layer 22. As a result, the utilization efficiency of the light emitted from the light emitting element can be increased.

(Embodiment 2)
With reference to FIG. 3, Embodiment 2 of the light emitting element use substrate by this invention is demonstrated.

  Referring to FIG. 3, light emitting element substrate 1 basically has the same structure as light emitting element substrate 1 shown in FIG. 1, but base substrate 2 at the interface between base substrate 2 and coating layer 3. Have different surface properties. Specifically, in the light emitting element substrate 1 shown in FIG. 3, the upper surface of the base substrate 2 (the surface constituting the interface between the coating layer 3 and the base substrate 2) is the surface 4 on which the uneven portions are formed. It has become.

  Also with the light emitting element substrate 1 having such a structure, the same effect as that of the light emitting element substrate 1 shown in FIG. 1 can be obtained. Further, since a plurality of uneven portions are formed on the surface 4 of the base substrate 2, when a part of the light emitted from the light emitting element by the uneven portions is incident on the base substrate 2 side, the light is reflected on the surface 4. Can be irregularly reflected. As a result, the deviation in the emission direction of the light emitted from the light emitting element mounted on the light emitting element substrate 1 can be reduced.

  Next, with reference to FIG. 4, the modification of Embodiment 2 of the board | substrate for light emitting elements by this invention is demonstrated.

  The light emitting element substrate 1 shown in FIG. 4 basically has the same structure as the light emitting element substrate 1 shown in FIG. 3, but the configuration of the base substrate 2 is different. In other words, in the light emitting element substrate shown in FIG. 4, the base substrate 2 is composed of the base substrate 21 and the reflective layer 22 disposed on the upper surface of the base substrate 21. The upper surface of the base substrate 21 (the surface on which the reflective layer 22 is formed) is uneven as in the surface 4 of the base substrate 2 shown in FIG. In addition, since the thickness of the reflective layer 22 is sufficiently thin and substantially uniform, the upper surface of the reflective layer 22 has an uneven shape that follows the unevenness of the surface of the base substrate 21. Even with such a configuration, the same effects as those of the light-emitting element substrate 1 shown in FIG. 3 can be obtained.

  In the light emitting element substrate 1 shown in FIGS. 3 and 4, the thickness T <b> 1 of the coating layer 3 is defined as the thickness in the region where the thickness of the coating layer 3 is the thickest. The thickness T4 of the base substrate 21 is defined as the thickness in the region where the thickness of the base substrate 21 is the thinnest.

(Embodiment 3)
A light emitting device module according to the present invention will be described with reference to FIG.

  As shown in FIG. 5, the light emitting element module according to the present invention is a light source module 10, and the circuit element 6 and the light emitting element 5 are arranged on the surface of the light emitting element substrate 1 according to the present invention (on the coating layer 3). Has been. The light emitting element 5 and the circuit element 6 are electrically connected. In the light source module 10 shown in FIG. 5, the light emitting elements 5 are arranged so as to be stacked on the plurality of circuit elements 6. As the light emitting element 5, for example, an arbitrary light emitting element such as an LED can be used. The circuit element 6 and the light emitting element 5 are electrically connected to a conductive layer (not shown) formed on the surface of the covering layer 3. The light emitting element 5 may emit light in a direction perpendicular to the upper surface of the coating layer 3, but is a direction intersecting the upper surface or a direction parallel to the upper surface. An element that emits light may be used.

  According to the light source module 10 having such a configuration, heat from the light emitting element 5 is transmitted to the base substrate 2 side through the sufficiently thin coating layer 3, so that an excessive temperature rise of the light emitting element 5 can be effectively suppressed. . Even if a part of the light emitted from the light emitting element 5 arranged on the coating layer 3 is incident on the coating layer 3 side, the light is emitted at the interface between the coating layer 3 and the base substrate 2 or the surface of the coating layer 3. Can be reflected. As a result, the utilization efficiency of light emitted from the light emitting element can be increased. In the light source module 10 shown in FIG. 5, the light emitting element 5 is stacked on the circuit element 6, but the light emitting element 5 may be directly connected to the light emitting element substrate 1.

Next, a first modification of the light source module according to the present invention will be described with reference to FIG.
The light source module 10 shown in FIG. 6 basically has the same structure as the light source module 10 shown in FIG. 5, but a plurality of circuit elements 6 and light emitting elements 5 are arranged on the covering layer 3. Is different. That is, in the light source module 10 shown in FIG. 6, four light emitting elements 5 are arranged on the upper surface of the covering layer 3. The connection structure of the circuit element 6 and the light emitting element 5 is basically the same as that of the light source module 10 shown in FIG. Also with the light source module 10 having such a configuration, the same effect as that of the light source module 10 shown in FIG. 5 can be obtained.

A second modification of the light source module according to the present invention will be described with reference to FIG.
The light source module 10 shown in FIG. 7 basically has the same structure as the light source module 10 shown in FIG. 6 except that the lens member 7 is arranged so as to cover the light emitting element 5. The lens member 7 covers the upper surface of the light emitting element 5, and the lens member 7 has a hemispherical lens structure in the region located on the light emitting element 5. With such a structure, the light emitted from the light emitting element 5 is emitted from the surface of the lens member 7 in a state where the light is aligned in a direction substantially perpendicular to the upper surface of the coating layer 3. As a result, the light emitted from the light source module 10 becomes light whose traveling direction is substantially aligned in a direction perpendicular to the upper surface of the light emitting element substrate 1.

  In addition, since the lens member 7 is disposed so as to cover the light emitting element 5 in this way, heat radiation from the lens member 7 side is reduced, but by using the light emitting element substrate 1 according to the present invention, the light emitting element is obtained. Since the heat dissipation from the substrate 1 is sufficiently high, the temperature rise of the light emitting element 5 is suppressed. For this reason, deterioration of the characteristics of the light emitting element 5 due to the temperature rise can be avoided.

(Embodiment 4)
The light source unit according to the present invention will be described with reference to FIG.

  A light source unit 20 shown in FIG. 8 is a backlight device used for a flat display such as a liquid crystal display device, and is disposed on the surface of the light emitting element substrate 1 according to the present invention and the light emitting element substrate 1. The circuit element 6 and the light emitting element 5, the control circuit element 32 arrange | positioned on the surface of the board | substrate 1 for light emitting elements, and the diffusion plate 31 arrange | positioned in the position facing the light emitting element 5 are provided. The diffusing plate 31 diffuses the light emitted from the light emitting element 5 toward the diffusing plate 31, and suppresses the deviation in the emitting direction of the light transmitted through the diffusing plate 31 and emitted upward (in the light emitting direction). This is to reduce the emission angle dependency. The control circuit element 32 is used to control the light emission state of the plurality of light emitting elements 5 formed on the surface of the light emitting element substrate 1. The control circuit element 32 is electrically connected to the circuit element 6 and the light emitting element 5 by a conductive line (not shown) formed on the surface of the light emitting element substrate 1.

  Since such a light source unit 20 uses the light emitting element substrate 1 according to the present invention, the heat from the light emitting element 5 can be effectively dissipated and the temperature rise of the light emitting element 5 can be suppressed. Further, by reflecting the light incident on the light emitting element substrate 1 side at the interface between the coating layer 3 and the base substrate 2 or the surface of the coating layer 3, the light can be emitted toward the diffusion plate 31 side. . For this reason, the utilization efficiency of the light radiate | emitted from the light emitting element 5 can be improved.

With reference to FIG. 9, another example of the light source unit according to the present invention will be described.
The light source unit 20 shown in FIG. 9 includes a light emitting element substrate 1 according to the present invention, a plurality of circuit elements 6 and light emitting elements 5 arranged on the surface of the light emitting element substrate 1, and the light emitting element substrate 1. A control circuit element 32 and a power supply circuit element 33 are provided at the ends. The control circuit element 32 is electrically connected to the light emitting element 5 and the circuit element 6 and performs light emission control of the light emitting element 5. The power supply circuit element 33 is for controlling the power supplied to the circuit element 6 and the light emitting element 5. The control circuit element 32 and the power supply circuit element 33 are electrically connected to the circuit element 6 and the light emitting element 5 by a conductive line (not shown).

  Also in the light source unit 20 having such a configuration, by using the light emitting element substrate 1 according to the present invention, the temperature rise of the light emitting element 5 can be suppressed, and the utilization efficiency of the light emitted from the light emitting element 5 can be increased.

  Here, although there is a part which overlaps with description mentioned above, the characteristic structure of this invention is enumerated.

  A light emitting device substrate 1 according to the present invention includes a base substrate 2 and a coating layer 3. The covering layer 3 is formed so as to contact the surface of the base substrate 2. The coating layer 3 is either transparent or translucent to visible light after heating to 260 ° C., or white when opaque to visible light.

  In this case, since the light-emitting element substrate 1 has a simple configuration including the base substrate 2 and the covering layer 3, when a through-hole is formed in the substrate or a reflector is disposed as in the prior art. Thus, an increase in the manufacturing cost of the light emitting element substrate 1 can be avoided. Further, even after the process of fixing the light emitting element 5 on the coating layer 3 of the light emitting element substrate 1 by the solder reflow process, the coating layer 3 remains transparent, translucent, or white. The light emitting element 5 can be fixed on the light emitting element substrate 1 by a solder reflow process, and light incident on the coating layer 3 side from the light (visible light) emitted from the light emitting element 5 is white. Reflection is possible on the surface of the coating layer 3 or on the contact interface between the transparent or translucent coating layer 3 and the base substrate 2. For this reason, the process of mounting the light emitting element 5 on the light emitting element substrate 1 can be easily performed, and the utilization efficiency of light emitted from the light emitting element 5 can be improved.

  In the light emitting element substrate 1, as shown in FIGS. 2 and 4, the coating layer 3 may be transparent or translucent to visible light after being heated to 260 ° C. May include a reflective layer 22 constituting a surface in contact with the coating layer 3.

  In this case, light incident on the coating layer 3 side (reflection layer 22 side) out of light emitted from the light emitting element 5 on the surface of the reflection layer 22 is reliably reflected from the surface of the reflection layer 22 to the coating layer 3 side. be able to. For this reason, the utilization efficiency of the light radiate | emitted from the light emitting element 5 can be improved.

  In the light emitting element substrate 1, the reflective layer 22 may have a thickness of 10 μm to 100 μm. Further, the base substrate 2 may include a reflective layer 22 and a base substrate 21 that contacts the back surface of the reflective layer 22 opposite to the top surface that contacts the coating layer 3. The material constituting the reflective layer 22 may be a metal. Moreover, the thickness of the base substrate 21 may be not less than 10 μm and not more than 1000 μm. In this case, since the thickness of the base substrate 2 is sufficiently thin and the material of the base substrate 21 is a metal and has good heat conduction characteristics, heat is easily transmitted from the light emitting element 5 through the light emitting element substrate 1. . For this reason, since the heat radiation in the light emitting element 5 is insufficient, the temperature of the light emitting element 5 rises and the characteristics of the light emitting element 5 are deteriorated or the light emitting ability of the light emitting element 5 cannot be sufficiently exhibited. it can.

  In the light emitting element substrate 1, the material constituting the base substrate 2 may include any of metal, resin, and ceramics. Such a material is preferably used as the base substrate 2 of the light emitting element substrate 1 from the viewpoint of strength and workability.

  In the light emitting element substrate 1, as a material constituting the base substrate 2, for example, aluminum (Al), an aluminum alloy, copper (Cu), or a copper alloy can be used as a metal. Moreover, liquid crystal polymer (LCP) and polyimide (PI) can be used as the resin, and aluminum nitride (AlN) can be used as the ceramic. By using such a material, it is possible to maintain the strength of the light emitting element substrate and obtain preferable heat dissipation characteristics.

  In the light emitting element substrate, the material constituting the coating layer 3 is selected from the group consisting of EFEP (copolymer of ethylene, hexafluoropropylene, and tetrafluoroethylene), PTFE (polytetrafluoroethylene), and white fluororesin. There may be one. In this case, the coating layer 3 that can sufficiently withstand the heating temperature in the solder reflow process for fixing the light emitting element 5 can be obtained. Moreover, although a crosslinked fluororesin can also be used as the material of the coating layer 3, such a resin has good thermal conductivity and can be thinly coated. For this reason, the thermal conductivity of the light emitting element substrate can be kept good. When the coating layer 3 as described above is formed on the base substrate 2, the surface of the base substrate 2 is usually etched to improve the adhesion of the coating layer 3. The light reflection characteristics and transparency of the element substrate were deteriorated. However, by using the resin as the coating layer 3 as described above, the coating layer 3 can be fixed (for example, fixed or adhered) on the base substrate 2 without etching the base substrate 2. The reflection characteristics and transparency of the film can be kept good.

  In the light emitting element substrate 1, the base substrate 2 may have a thickness of 10 μm to 1000 μm, and the coating layer 3 may have a thickness of 1 μm to 20 μm. In this case, since the covering layer 3 and the base substrate 2 are sufficiently thin, heat from the light emitting element 5 can be quickly dissipated to the outside through the light emitting element substrate 1.

  A light source module 10 or a light source unit 20 as a light emitting device according to the present invention includes the light emitting element substrate 1 and a light emitting element 5 mounted on the coating layer 3 of the light emitting element substrate 1. In this case, it is possible to obtain a light emitting device that suppresses an increase in manufacturing cost, has excellent heat dissipation characteristics, and has high utilization efficiency of light emitted from the light emitting element 5.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above-described embodiment but by the scope of claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

  The present invention is particularly advantageously applied to a light emitting element substrate on which a light emitting element such as a laser diode (LD) or LED is mounted and a light emitting device using the light emitting element substrate.

  DESCRIPTION OF SYMBOLS 1 Light emitting element substrate, 2 Base substrate, 3 Cover layer, 4 Surface, 5 Light emitting element, 6 Circuit element, 7 Lens member, 10 Light source module, 20 Light source unit, 21 Base substrate, 22 Reflective layer, 31 Diffusing plate, 32 Control circuit element, 33 power circuit element.

Claims (5)

A base substrate;
A coating layer formed to contact the surface of the base substrate,
The coating layer is either transparent or translucent to visible light after being heated to 260 ° C., or white when opaque to the visible light ,
The material constituting the coating layer is one selected from the group consisting of EFEP, PTFE, and white fluororesin, and the material constituting the coating layer is a cross-linked substrate for a light emitting device. The coating layer is transparent or translucent to visible light after being heated to 260 ° C.,
The base substrate is
The light emitting element substrate according to claim 1, comprising a reflective layer that constitutes the surface in contact with the coating layer. The light emitting element substrate according to claim 1, wherein the material constituting the base substrate includes any of metal, resin, and ceramics. 4. The light emitting element substrate according to claim 1 , wherein the base substrate has a thickness of 10 μm to 1000 μm, and the coating layer has a thickness of 1 μm to 20 μm. A substrate for a light emitting device according to claim 1;
And a light emitting device mounted on the cover layer of the light emitting device substrate.

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