JP5602171B2 - LIGHTING DEVICE, IMAGING DEVICE, AND PORTABLE TERMINAL - Google Patents

LIGHTING DEVICE, IMAGING DEVICE, AND PORTABLE TERMINAL Download PDF

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JP5602171B2
JP5602171B2 JP2012055618A JP2012055618A JP5602171B2 JP 5602171 B2 JP5602171 B2 JP 5602171B2 JP 2012055618 A JP2012055618 A JP 2012055618A JP 2012055618 A JP2012055618 A JP 2012055618A JP 5602171 B2 JP5602171 B2 JP 5602171B2
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light
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JP2012163965A (en
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寛規 岩永
昌朗 天野
健二 下村
一昭 大塚
英人 古山
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Toshiba Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Description

本発明は、LED等の発光素子を利用した照明装置、この照明装置を搭載した撮像装置、及びこの撮像装置を搭載した携帯端末に関する。   The present invention relates to an illuminating device using a light emitting element such as an LED, an imaging device equipped with the illuminating device, and a portable terminal equipped with the imaging device.

最近の携帯電話機には、カメラが一体的に設けられているものが多いが、そのような携帯電話機に設けられたカメラでは、特に被写体が暗い場合、鮮明な画像を撮影することは困難である。撮像性能は、携帯機器に搭載されるフラッシュの明るさや演色性等の性能に大きく依存するが、鮮明な画像を撮影するに充分な明るさ及び演色性を示すフラッシュは、未だ見出されていないからである。   Many recent mobile phones are provided with an integrated camera, but with such a mobile phone, it is difficult to capture a clear image, particularly when the subject is dark. . The imaging performance largely depends on the brightness and color rendering properties of the flash mounted on the mobile device, but no flash that has sufficient brightness and color rendering properties to capture clear images has been found yet. Because.

近年、携帯端末の小型軽量化の観点から、LEDフラッシュが注目を集めている。携帯機器に搭載されるLEDフラッシュとしては、まず明るいことが要求される。このため、現在フラッシュ用途には、通常、複数のLEDチップが使用される。しかしながら、限られたバッテリーを使用するため、でき得る限り高効率であることが望まれる。また、フラッシュ用途の場合、被写体がある方向、即ち特定方向の明るさが重要であるため、LEDチップの特性としては、光度(cd)が重要な特性となる。   In recent years, LED flash has been attracting attention from the viewpoint of reducing the size and weight of portable terminals. As an LED flash mounted on a portable device, it is first required to be bright. For this reason, a plurality of LED chips are usually used for current flash applications. However, since a limited battery is used, it is desired to be as efficient as possible. Further, in the case of flash use, since the brightness in a certain direction, that is, the brightness in a specific direction is important, the luminous intensity (cd) is an important characteristic as a characteristic of the LED chip.

従って、光度向上を目的として、LEDチップの近傍周囲に反射板を設けること、1つのLEDチップの周囲に複数のLEDチップを環状に配置すること(例えば、特許文献1参照)、複数のLEDチップをその中心が一直線上にあるように配置すること(例えば、特許文献2及び3参照)等の種々の工夫がなされている。しかしながら、満足な明るさを示すLEDフラッシュは、未だ実現されていないのが現状である。   Therefore, for the purpose of improving luminous intensity, a reflector is provided in the vicinity of the LED chip, a plurality of LED chips are annularly arranged around one LED chip (see, for example, Patent Document 1), and a plurality of LED chips. Various ideas have been made such as arranging the centers so that their centers are in a straight line (see, for example, Patent Documents 2 and 3). However, at present, LED flashes exhibiting satisfactory brightness have not yet been realized.

特開2005−158958号公報JP 2005-158958 A 特開2005−109212号公報JP 2005-109212 A 特開平10−22529号公報Japanese Patent Laid-Open No. 10-22529

本発明は、以上のような事情に鑑みてなされたものであり、明るさ及び演色性に優れた照明装置、この照明装置を用いた、遠距離でも明るい画像が得られるとともに人物撮影にも適した撮像装置、及びこの撮像装置を搭載する携帯機器を提供することを目的とする。   The present invention has been made in view of the circumstances as described above, and is an illuminating device excellent in brightness and color rendering, and is suitable for taking a picture of a person while using this illuminating device to obtain a bright image even at a long distance. It is an object of the present invention to provide an image pickup apparatus and a portable device equipped with the image pickup apparatus.

上記課題を解決するため、本発明の第1の態様は、基体上に配置され矩形状上面及び側面を発光面とする3個以上の発光素子を具備し、前記発光素子は、該発光素子が配置されていない集光領域を囲むように配置され、それぞれの前記発光素子の側面の1つが、前記集光領域の略中央部に向いていることを特徴とする照明装置を提供する。   In order to solve the above-described problems, a first aspect of the present invention includes three or more light-emitting elements that are disposed on a substrate and have a rectangular upper surface and side surfaces as light-emitting surfaces, and the light-emitting element includes: Provided is an illuminating device which is arranged so as to surround a light collecting region which is not arranged, and one of the side surfaces of each of the light emitting elements faces a substantially central portion of the light collecting region.

このような照明装置において、集光領域には、それぞれの発光素子の発光側面の1つに対向する傾斜面を有する錐体又は錐台を配置することができる。錐体又は錐台としては、角錐体又は角錐台を用いることができる。   In such an illuminating device, a cone or a frustum having an inclined surface facing one of the light emitting side surfaces of each light emitting element can be arranged in the condensing region. As the frustum or frustum, a pyramid or a frustum can be used.

本発明の第2の態様は、矩形状上面及び側面を発光面とする3個以上の発光素子が基体上に配置されてなり、前記3個以上の発光素子は、該発光素子が配置されていない集光領域を隔てて側面の1つが互いに対向して配置された第1及び第2の発光素子と、これら第1及び第2の発光素子に近接して配置された第3の発光素子とを含み、前記第3の発光素子の隣り合う側面が共有する辺のうち二辺はそれぞれ、前記第1の発光素子の隣り合う側面が共有する一辺及び前記第2の発光素子の隣り合う側面が共有する一辺に向き合って位置することを特徴とする照明装置を提供する。   According to a second aspect of the present invention, three or more light emitting elements having a rectangular upper surface and side surfaces as light emitting surfaces are arranged on a substrate, and the three or more light emitting elements are arranged with the light emitting elements. A first light emitting element and a second light emitting element disposed on one of the side surfaces facing each other across a non-condensing region; and a third light emitting element disposed adjacent to the first and second light emitting elements; Of the sides shared by the adjacent side surfaces of the third light emitting element are respectively one side shared by the adjacent side surfaces of the first light emitting element and the adjacent side surface of the second light emitting element. Provided is an illuminating device characterized by being positioned to face one shared side.

このような照明装置において、第1及び第3の発光素子それぞれの隣り合う側面が共有する一辺は、第1及び第3の発光素子の略中心軸を通る垂直面上にほぼ存在し、第2及び第3の発光素子それぞれの隣り合う側面が共有する一辺は、第2及び第3の発光素子の略中心軸を通る垂直面上にほぼ存在する構成とすることができる。   In such an illuminating device, one side shared by adjacent side surfaces of the first and third light emitting elements is substantially present on a vertical plane passing through the substantially central axis of the first and third light emitting elements, and the second The one side shared by the adjacent side surfaces of the third light emitting element and the third light emitting element may be substantially present on a vertical plane passing through the substantially central axis of the second and third light emitting elements.

なお、本発明の第1及び第2の態様に係る照明装置において、3個以上の発光素子が配置された領域の周囲及び底面の少なくとも一方に反射板を設置することができる。   In the illumination device according to the first and second aspects of the present invention, a reflector can be installed around at least one of the periphery and the bottom of the region where three or more light emitting elements are arranged.

また、発光素子は、近紫外光または青色に発光するものとすることができる。
更に、以上の照明装置は、フラッシュとして用いることができる。
本発明の第3の態様は、かかるフラッシュを搭載したことを特徴とする撮像装置を提供する。
また、本発明の第4の態様は、かかる撮像装置を搭載したことを特徴とする携帯端末を提供する。
In addition, the light emitting element can emit light in the near ultraviolet light or blue.
Further, the above lighting device can be used as a flash.
According to a third aspect of the present invention, there is provided an imaging apparatus having such a flash mounted thereon.
Moreover, the 4th aspect of this invention provides the portable terminal characterized by mounting this imaging device.

本発明の照明装置によると、複数の発光素子を、側面からの発光が隣接又は対向する発光素子により遮られないように配置しているため、光取り出し効率の大幅な向上を図ることができる。その結果、低電力で充分な明るさ及び演色性を示すフラッシュが提供され、かかるフラッシュを搭載した撮像装置、携帯端末が提供される。   According to the illuminating device of the present invention, the plurality of light emitting elements are arranged so that the light emission from the side surface is not blocked by the adjacent or opposing light emitting elements, so that the light extraction efficiency can be greatly improved. As a result, a flash exhibiting sufficient brightness and color rendering with low power is provided, and an imaging device and a portable terminal equipped with such a flash are provided.

本発明の一実施形態に係るLEDフラッシュを示す断面図。Sectional drawing which shows the LED flash which concerns on one Embodiment of this invention. 本発明の第1の実施形態に係るLEDフラッシュにおけるLEDチップの配列を示す上面図及び断面図。The top view and sectional drawing which show the arrangement | sequence of the LED chip in the LED flash which concerns on the 1st Embodiment of this invention. 従来のLEDフラッシュにおけるLEDチップの配列を示す上面図及び断面図。The top view and sectional drawing which show the arrangement | sequence of the LED chip in the conventional LED flash. 本発明の第1の実施形態に係るLEDフラッシュと従来のLEDフラッシュの発光強度を比較して示す特性図。The characteristic view which compares and shows the emitted light intensity of the LED flash which concerns on the 1st Embodiment of this invention, and the conventional LED flash. 本発明の第2の実施形態に係るLEDフラッシュにおけるLEDチップの配列を示す上面図。The top view which shows the arrangement | sequence of the LED chip in the LED flash which concerns on the 2nd Embodiment of this invention. 他の従来のLEDフラッシュにおけるLEDチップの配列を示す上面図。The top view which shows the arrangement | sequence of the LED chip in another conventional LED flash. 本発明の第3の実施形態に係るLEDフラッシュにおけるLEDチップの配列を示す上面図。The top view which shows the arrangement | sequence of the LED chip in the LED flash which concerns on the 3rd Embodiment of this invention. 図7に示すLEDチップの配列の変形例を示す上面図。The top view which shows the modification of the arrangement | sequence of the LED chip shown in FIG. 本発明の第4の実施形態に係るLEDフラッシュにおけるLEDチップの配列を示す上面図。The top view which shows the arrangement | sequence of the LED chip in the LED flash which concerns on the 4th Embodiment of this invention.

以下、発明を実施するための最良の形態について説明する。   The best mode for carrying out the invention will be described below.

図1に、本発明の一実施形態に係る、発光源として複数のLEDチップを配置した照明装置の一般的な構造を示す。この照明装置は、図1に示すように、上方に開口する凹部を有する基体1の凹部の底面には、複数個のLEDチップ2が配置されており、これらLEDチップ2は蛍光層3により覆われている。LEDチップ2それぞれの上部電極は、第1のワイヤ4により第1の電極5に接続されている。LEDチップ2それぞれの下部電極は、第2のワイヤ6により第2の電極7に接続されている。   FIG. 1 shows a general structure of a lighting device according to an embodiment of the present invention in which a plurality of LED chips are arranged as a light source. As shown in FIG. 1, in this lighting device, a plurality of LED chips 2 are arranged on the bottom surface of a recess of a base 1 having a recess opening upward, and these LED chips 2 are covered with a fluorescent layer 3. It has been broken. The upper electrode of each LED chip 2 is connected to the first electrode 5 by the first wire 4. The lower electrode of each LED chip 2 is connected to the second electrode 7 by the second wire 6.

蛍光層3は、ポリマーマトリクス中に蛍光体粒子を分散させたものであり、LEDチップ2は、例えばGaN系半導体材料から構成されるものである。LEDチップの代わりに、例えば同様の波長の光を発光するレーザーダイオード等の発光素子を用いることもできる。   The fluorescent layer 3 is obtained by dispersing phosphor particles in a polymer matrix, and the LED chip 2 is made of, for example, a GaN-based semiconductor material. Instead of the LED chip, for example, a light emitting element such as a laser diode that emits light of the same wavelength may be used.

図1に示す構成の照明装置は、LEDチップ2により電気エネルギーが光エネルギーに直接変換され、この光は、蛍光層3内に含まれる蛍光体により、異なる波長の光に変換され、発光する原理で動作する。   In the illuminating device having the configuration shown in FIG. 1, electrical energy is directly converted into light energy by the LED chip 2, and this light is converted into light of a different wavelength by a phosphor contained in the fluorescent layer 3 to emit light. Works with.

本発明の第1の態様に係る照明装置は、LEDチップが配置されていない集光領域を囲むように配置された矩形発光上面を有する複数のLEDチップを具備し、それぞれのLEDチップの発光側面の1つが、前記集光領域の中央部に向いていることを特徴とする。   An illumination device according to a first aspect of the present invention includes a plurality of LED chips having a rectangular light emitting upper surface disposed so as to surround a light collecting region where no LED chip is disposed, and the light emitting side surface of each LED chip. Is directed to the central portion of the light condensing region.

なお、LEDチップの矩形発光上面及び発光側面の角は、丸みを帯びていてもよい。   The corners of the rectangular light emitting top surface and the light emitting side surface of the LED chip may be rounded.

図2は、本発明の第1の態様の第1の実施形態に係る照明装置における、LEDチップの配列を示す。図2の(a)は上面図、(b)はそのA−A断面図をそれぞれ示す。図2に示すように、基体10上には、矩形断面を有する4個のLEDチップ11a〜11dが、集光領域12を囲むように配置されている。集光領域12には、LEDチップは配置されていない。また、それぞれのLEDチップ11a〜11dの発光側面の1つが、集光領域12の中央部に向いている。   FIG. 2 shows an arrangement of LED chips in the lighting apparatus according to the first embodiment of the first aspect of the present invention. 2A is a top view, and FIG. 2B is an AA cross-sectional view thereof. As shown in FIG. 2, four LED chips 11 a to 11 d having a rectangular cross section are arranged on the base 10 so as to surround the light collection region 12. No LED chip is arranged in the light condensing region 12. In addition, one of the light emitting side surfaces of the LED chips 11 a to 11 d faces the central portion of the light collection region 12.

図3は、従来の照明装置におけるLEDチップの配列を示す。図3の(a)は上面図、(b)はそのB−B断面図をそれぞれ示す。図3に示すLEDチップの配列では、基体20上に、矩形断面を有する4個のLEDチップ21a〜21dが、狭い間隔を隔てて2列に配置されている。LEDチップ21の間に集光領域は存在しない。また、それぞれのLEDチップ21a〜21dの発光側面の1つは、隣接するLEDチップ21a〜21dの発光側面の1つに近接して対向している。   FIG. 3 shows an arrangement of LED chips in a conventional lighting device. 3A is a top view, and FIG. 3B is a sectional view taken along the line BB. In the array of LED chips shown in FIG. 3, four LED chips 21 a to 21 d having a rectangular cross section are arranged in two rows at a narrow interval on the base 20. There is no light collection region between the LED chips 21. In addition, one of the light emitting side surfaces of each of the LED chips 21a to 21d is close to and faces one of the light emitting side surfaces of the adjacent LED chips 21a to 21d.

一般に、LEDチップは矩形断面を有し、即ち、六面体である。発光は上面だけでなく、側面からも生ずる。従って、LEDチップからの光取り出し効率を高めるには、側面からの発光をいかに利用するかが重要である。   In general, the LED chip has a rectangular cross section, that is, a hexahedron. Luminescence occurs not only from the top but also from the side. Therefore, in order to increase the light extraction efficiency from the LED chip, how to use the light emission from the side surface is important.

図3に示すLEDチップの配置では、LEDチップ21a〜21dの側面からの強い発光が、隣接するLEDチップ21a〜21dが影となって散乱または吸収され、照明装置の外に光を取り出すことができる効率が減少してしまう。   In the arrangement of the LED chips shown in FIG. 3, the strong light emission from the side surfaces of the LED chips 21a to 21d is scattered or absorbed by the adjacent LED chips 21a to 21d as shadows, and the light is taken out of the lighting device. The efficiency that can be reduced.

これに対し、図2に示す本発明の第1の実施形態に係る照明装置では、LEDチップ11a〜11dの集光領域12に向いている発光側面は、他のLEDチップ11a〜11dの側面と近接して向かい合っていないため、相互に発光が遮られることはなく、側面からの発光を効率よく取り出すことができる。   On the other hand, in the illuminating device according to the first embodiment of the present invention shown in FIG. 2, the light emitting side surface facing the light collection region 12 of the LED chips 11 a to 11 d is different from the side surfaces of the other LED chips 11 a to 11 d. Since they are not close to each other, light emission is not blocked from each other, and light emission from the side surfaces can be taken out efficiently.

本発明者らは、4個の青色発光LEDチップを図2に示すように配置し、蛍光体を含まないシリコーン樹脂で封止した状態で20mAの電流を流し、発光させて、発光の強度を測定した。同様に、4個の青色発光LEDチップを図3に示すように配置し、蛍光体を含まないシリコーン樹脂で封止した状態で20mAの電流を流し、発光させて、発光の強度を測定した。その結果を図4に示す。   The present inventors arranged four blue light emitting LED chips as shown in FIG. 2, and caused the light to emit light by passing a current of 20 mA in a state of being sealed with a silicone resin not containing a phosphor. It was measured. Similarly, four blue light emitting LED chips were arranged as shown in FIG. 3, and a current of 20 mA was passed in a state sealed with a silicone resin not containing a phosphor to emit light, and the intensity of light emission was measured. The result is shown in FIG.

図4から、4個の青色発光LEDチップを図2に示すように配置した場合には、図3に示すように配置した場合に比べ、大幅に発光強度が増加したことがわかる。   From FIG. 4, it can be seen that when the four blue light emitting LED chips are arranged as shown in FIG. 2, the emission intensity is significantly increased as compared to the case where they are arranged as shown in FIG. 3.

図5は、本発明の第2の実施形態に係るLEDチップの配列を示す図である。図5に示すLEDチップの配列では、基体30上に、矩形断面を有する3個のLEDチップ31a〜31cが、集光領域32を囲むように配置されている。集光領域32には、LEDチップは配置されていない。また、それぞれのLEDチップ31a〜31cの発光側面の1つが、集光領域32の中央部に向いている。   FIG. 5 is a diagram showing an array of LED chips according to the second embodiment of the present invention. In the LED chip arrangement shown in FIG. 5, three LED chips 31 a to 31 c having a rectangular cross section are arranged on the base 30 so as to surround the light collection region 32. No LED chip is disposed in the light collection region 32. In addition, one of the light emitting side surfaces of each of the LED chips 31 a to 31 c faces the central portion of the light collection region 32.

図5に示すLEDチップの配列は、図2に示すLEDチップの配列とは異なり、集光領域32を隔てて対向するLEDチップが存在しないため、LEDチップの側面から出る光(矢印で示す)が全く遮られることが無い配列である。   The LED chip array shown in FIG. 5 differs from the LED chip array shown in FIG. 2 in that there are no LED chips facing each other across the condensing region 32, and therefore light emitted from the side surface of the LED chip (indicated by an arrow). Is an arrangement that is completely unobstructed.

なお、LEDチップの数が奇数の場合は、図5に示すような配列が実現され、偶数の場合は、図2に示すような配列となる。いずれも集光領域を囲むように配列されていない従来のLEDチップの配列より、LED素子の光取り出し効率が大幅に向上する。   When the number of LED chips is an odd number, an arrangement as shown in FIG. 5 is realized, and when the number is an even number, an arrangement as shown in FIG. 2 is obtained. In any case, the light extraction efficiency of the LED element is greatly improved as compared with the conventional arrangement of LED chips that are not arranged so as to surround the light collection region.

図6に示すLEDチップの配列は、図3に示すLEDチップの配列と同様、3個のLEDチップ41a〜41cが、狭い間隔を隔てて配置されている。LEDチップ41a〜41cの間に集光領域は存在しない。このようなLEDチップの配列では、図3に示すLEDチップの配列ほどではないが、LEDチップ41a〜41dの対向する側面からの光(矢印で示す)は隣接するLEDチップにより遮られるため、光の取り出し効率は低い。   The LED chip arrangement shown in FIG. 6 is similar to the LED chip arrangement shown in FIG. 3, in which three LED chips 41a to 41c are arranged with a narrow interval. There is no condensing region between the LED chips 41a to 41c. In such an array of LED chips, although not as much as the array of LED chips shown in FIG. 3, light from the opposite side surfaces of LED chips 41a to 41d (indicated by arrows) is blocked by the adjacent LED chips. The extraction efficiency is low.

図7は、本発明の第3の実施形態に係るLEDチップの配列を示す図である。図7に示すLEDチップの配列では、基体50上に、矩形発光上面を有する2個のLEDチップ51a,51bが、集光領域52を隔てて配置されているとともに、更に1個のLEDチップ51cが、LEDチップ51a,51bに近接して、それぞれの隣り合う側面が共有する一辺が向き合うように配置されている。即ち、このLEDチップの配列は、図2に示すLEDチップの配列では、集光領域12は、四方をLEDチップにより囲まれているのに対し、図7に示すLEDチップの配列では、集光領域52は、三方をLEDチップにより囲まれている。   FIG. 7 is a diagram showing an array of LED chips according to the third embodiment of the present invention. In the LED chip arrangement shown in FIG. 7, two LED chips 51 a and 51 b having a rectangular light emitting upper surface are arranged on the base 50 with a light-collecting region 52 therebetween, and further one LED chip 51 c. However, the LED chips 51a and 51b are arranged close to each other so that the sides shared by the adjacent side faces face each other. That is, in this LED chip arrangement, in the LED chip arrangement shown in FIG. 2, the condensing region 12 is surrounded on all sides by the LED chips, whereas in the LED chip arrangement shown in FIG. The region 52 is surrounded by LED chips on three sides.

図7に示すようなLEDチップの配列でも、LEDチップ51aないし51cの発光側面からの光は、隣接するLEDチップ51aないし51cにより遮られることがないため、高い光の取り出し効率を得ることができる。   Even in the arrangement of the LED chips as shown in FIG. 7, light from the light emitting side surfaces of the LED chips 51a to 51c is not blocked by the adjacent LED chips 51a to 51c, so that high light extraction efficiency can be obtained. .

図8は、図7に示すようなLEDチップの配列の変形例であり、4個のLEDチップを配置した例である。いずれの配列でも、LEDチップの側面からの光は、隣接するLEDチップにより遮られることがないため、高い光の取り出し効率を得ることができる。   FIG. 8 is a modification of the arrangement of LED chips as shown in FIG. 7, and is an example in which four LED chips are arranged. In any arrangement, the light from the side surface of the LED chip is not blocked by the adjacent LED chip, so that high light extraction efficiency can be obtained.

図9は、本発明の第4の実施形態に係るLEDチップの配列を示し、図5に示すLEDチップ31a〜31cの配列の集光領域32に錐形多面体62を配置した照明装置を示す。図9に示す構成では、LEDチップ31a〜31cの側面からの発光は集光領域32に到達した後、錐形多面体62で反射されて、上方に出射する。その結果、光を効率よくLEDチップ31a〜31cの外に取り出すことができる。なお、錐形多面体は、錐体及び錐台を含み、錐体は、角錐及び円錐を含み、錐台は、角錐台及び円錐台を含む。   FIG. 9 shows an array of LED chips according to the fourth embodiment of the present invention, and shows an illuminating device in which a conical polyhedron 62 is arranged in the light collecting region 32 of the array of LED chips 31a to 31c shown in FIG. In the configuration shown in FIG. 9, light emitted from the side surfaces of the LED chips 31 a to 31 c reaches the condensing region 32, is then reflected by the conical polyhedron 62, and is emitted upward. As a result, light can be efficiently taken out of the LED chips 31a to 31c. The pyramidal polyhedron includes a cone and a frustum, the cone includes a pyramid and a cone, and the frustum includes a pyramid and a frustum.

錐形多面体62は、アルミニウム等の金属により構成するか、又はプラスチック等の成形体の表面に金属膜を蒸着したものとすることができる。   The conical polyhedron 62 may be made of a metal such as aluminum or a metal film deposited on the surface of a molded body such as plastic.

以下に、本発明の実施例及び比較例を示し、本発明の効果をより具体的に説明する。なお、いずれの例においても、図1に示す構造のLEDフラッシュを作成し、チップ配列のみを変えて光度(cd)の測定を行った。蛍光層には、黄色発光蛍光体としてYAG(イットリウム アルミニウム ガーネット)系蛍光体をシリコンポリマーに30wt%分散したものを、LEDチップには青色発光(発光中心波長=460nm、InGaN)LEDチップを用いた。また、反射板の位置、特性はすべて同一である。   Examples of the present invention and comparative examples will be shown below, and the effects of the present invention will be described more specifically. In each example, an LED flash having the structure shown in FIG. 1 was prepared, and the luminous intensity (cd) was measured by changing only the chip arrangement. For the fluorescent layer, a yellow light emitting phosphor, YAG (yttrium aluminum garnet) based phosphor dispersed at 30 wt% in a silicon polymer, and a blue light emitting (emission center wavelength = 460 nm, InGaN) LED chip was used as the LED chip. . Further, the position and characteristics of the reflector are all the same.

実施例1
図2に示すLEDチップの配列のLEDフラッシュを10個作成した。これらのLEDフラッシュについて、それぞれのチップに20mAの電流を流して発光させたところ、光度は7.5−9.0cdであった。
Example 1
Ten LED flashes having the LED chip arrangement shown in FIG. 2 were prepared. About these LED flashes, when a current of 20 mA was passed through each chip to emit light, the luminous intensity was 7.5-9.0 cd.

比較例1
図2に示すLEDチップの配列のLEDフラッシュを10個作成した。これらのLEDフラッシュについて、それぞれのチップに20mAの電流を流して発光させたところ、光度は6.2−7.1cdであった。この結果と実施例1の結果との比較から、同一個数のLEDチップであっても、実施例1のチップ配列とすることにより、光度は27%程度向上することが分かった。
Comparative Example 1
Ten LED flashes having the LED chip arrangement shown in FIG. 2 were prepared. About these LED flashes, when a current of 20 mA was passed through each chip to emit light, the luminous intensity was 6.2-7.1 cd. From a comparison between this result and the result of Example 1, it was found that the luminous intensity was improved by about 27% by using the chip arrangement of Example 1 even with the same number of LED chips.

実施例2
図5に示すLEDチップの配列のLEDフラッシュを10個作成した。これらのLEDフラッシュについて、それぞれのチップに20mAの電流を流して発光させたところ、光度は6.0−7.5cdであった。この結果から、LEDチップの個数は3つであるにも関わらず、比較例1の4個のLEDチップを備えたLEDフラッシュとほぼ同等の光度を得ることができたことがわかる。
Example 2
Ten LED flashes having the LED chip arrangement shown in FIG. 5 were produced. When these LED flashes were caused to emit light by passing a current of 20 mA through each chip, the luminous intensity was 6.0 to 7.5 cd. From this result, it can be seen that although the number of LED chips is three, it was possible to obtain almost the same luminous intensity as the LED flash having four LED chips of Comparative Example 1.

比較例2
図6に示すLEDチップの配列のLEDフラッシュを10個作成した。これらのLEDフラッシュについて、それぞれのチップに20mAの電流を流して発光させたところ、光度は4.5−5.5cdであった。
Comparative Example 2
Ten LED flashes having the LED chip arrangement shown in FIG. 6 were produced. When these LED flashes were made to emit light by passing a current of 20 mA through each chip, the luminous intensity was 4.5 to 5.5 cd.

実施例3
図9に示すように、3個のLEDチップを配列させるとともに、集光領域に、表面に銀を蒸着した三角錐形状のポリマーブロックを配置したLEDフラッシュを10個作成した。これらのLEDフラッシュについて、それぞれのチップに20mAの電流を流して発光させたところ、光度は6.5−8.0cdであった。
Example 3
As shown in FIG. 9, ten LED flashes were prepared in which three LED chips were arranged and a triangular pyramid-shaped polymer block having silver deposited on the surface was arranged in the light condensing region. About these LED flashes, when a current of 20 mA was passed through each chip to emit light, the luminous intensity was 6.5 to 8.0 cd.

この結果から、実施例2のLEDチップの配列と同一のLEDチップの配列であるにもかかわらず、実施例2のLEDフラッシュよりも光度の増加がみられた。これは、LEDチップの配列による光取り出し効率の向上効果に加え、集光領域に反射体を配置したことにより、LEDチップの前方に集光したことによるものと考えられる。   From this result, although the LED chip array was the same as the LED chip array of Example 2, the luminous intensity was increased as compared with the LED flash of Example 2. This is considered to be due to the fact that the light is collected in front of the LED chip by arranging the reflector in the light collecting region in addition to the effect of improving the light extraction efficiency by the arrangement of the LED chip.

なお、本発明は上述した実施形態及び実施例に限定されることはない。例えば、発光素子としては、LEDチップを用いたが、本発明はこれに限らず、発光素子としてレーザーダイオードを用いることも可能である。   The present invention is not limited to the above-described embodiments and examples. For example, an LED chip is used as the light emitting element, but the present invention is not limited to this, and a laser diode can also be used as the light emitting element.

その他、本発明は上記実施形態そのままに限定されるものではなく、実施段階ではその要旨を逸脱しない範囲で構成要素を変形して具体化できる。また、上記実施形態に開示されている複数の構成要素の適宜な組み合わせにより、種々の発明を形成できる。例えば、実施形態に示される全構成要素から幾つかの構成要素を削除してもよい。さらに、異なる実施形態にわたる構成要素を適宜組み合わせてもよい。   In addition, the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

1,10,20,30,40,50…基体、2,11a,11b,11c,11d…LEDチップ、3…蛍光層、4…第1のワイヤ、5…第1の電極、6…第2のワイヤ、12,32,52…集光領域、62…錐形多面体。   DESCRIPTION OF SYMBOLS 1,10,20,30,40,50 ... Base | substrate, 2, 11a, 11b, 11c, 11d ... LED chip, 3 ... Fluorescent layer, 4 ... 1st wire, 5 ... 1st electrode, 6 ... 2nd Wire, 12, 32, 52 ... condensing region, 62 ... conical polyhedron.

Claims (8)

基体上に配置され矩形状上面及び側面を発光面とし、近紫外光または青色に発光する3個の発光素子と、これら発光素子を覆う単一の蛍光層を具備する照明装置であって、前記3個の発光素子は、該発光素子が配置されていない集光領域を隔てて側面の1つが互いに対向して配置された第1及び第2の発光素子と、これら第1及び第2の発光素子に近接し、集光領域を隔てて対向する発光素子なしに配置された第3の発光素子とを含み、前記第3の発光素子の隣り合う側面が共有する辺のうち二辺はそれぞれ、前記第1の発光素子の隣り合う側面が共有する一辺及び前記第2の発光素子の隣り合う側面が共有する一辺に向き合って位置し、前記第3の発光素子から前記集光領域を経て取り出される光は、他の発光素子により遮られることなく取り出されることを特徴とする照明装置。 A lighting device comprising three light emitting elements disposed on a substrate and having a rectangular upper surface and side surfaces as light emitting surfaces and emitting light in near ultraviolet light or blue, and a single fluorescent layer covering these light emitting elements, The three light-emitting elements include first and second light-emitting elements that are disposed so that one of the side surfaces faces each other across a light-collecting region where the light-emitting elements are not disposed, and the first and second light-emitting elements. A third light emitting element disposed without a light emitting element facing the element and facing the condensing region, and two of the sides shared by adjacent side surfaces of the third light emitting element are each The first light-emitting element is located facing one side shared by adjacent side faces and the second side face shared by the second light-emitting element, and is taken out from the third light-emitting element through the condensing region. Light is not blocked by other light emitting elements Ri issued lighting apparatus according to claim Rukoto. 第4の発光素子をさらに含み、前記第4の発光素子の隣り合う側面が共有する辺のうちの一辺のみが、前記第1の発光素子の隣り合う側面が共有する一辺、前記第2の発光素子の隣り合う側面が共有する一辺、または前記第3の発光素子の隣り合う側面が共有する一辺に向き合って位置することを特徴とする請求項に記載の照明装置。 A second light emitting element, further including a fourth light emitting element, wherein only one side shared by adjacent side faces of the fourth light emitting element is one side shared by adjacent side faces of the first light emitting element; 2. The lighting device according to claim 1 , wherein the lighting device is positioned facing one side shared by adjacent side surfaces of the elements or one side shared by adjacent side surfaces of the third light emitting element. 前記第1及び第3の発光素子それぞれの前記隣り合う側面が共有する一辺は、前記第1及び第3の発光素子の略中心軸を通る垂直面上にほぼ存在し、前記第2及び第3の発光素子それぞれの前記隣り合う側面が共有する一辺は、前記第2及び第3の発光素子の略中心軸を通る垂直面上にほぼ存在することを特徴とする請求項1に記載の照明装置。   One side shared by the adjacent side surfaces of each of the first and third light emitting elements is substantially present on a vertical plane passing through a substantially central axis of the first and third light emitting elements, and the second and third light emitting elements are present. The lighting device according to claim 1, wherein one side shared by the adjacent side surfaces of each of the light emitting elements substantially exists on a vertical plane passing through a substantially central axis of the second and third light emitting elements. . 前記3個の発光素子が配置された領域の周囲及び底面の少なくとも一方に反射板が設置されていることを特徴とする請求項1乃至のいずれか1項に記載の照明装置。 The lighting device according to any one of claims 1 to 3 , wherein a reflecting plate is installed at least one of a periphery and a bottom surface of the region where the three light emitting elements are arranged. 請求項1〜のいずれかに記載の照明装置からなることを特徴とするフラッシュ。 Flash characterized in that it consists illumination device according to any one of claims 1-4. 請求項に記載のフラッシュを搭載したことを特徴とする撮像装置。 An imaging apparatus comprising the flash according to claim 5 . 請求項に記載の撮像装置を搭載したことを特徴とする携帯端末。 A portable terminal comprising the imaging device according to claim 6 . れぞれの発光素子の側面からの光が隣接する発光素子により遮られることがないように、前記集光領域を囲むように配置されていることを特徴とする請求項1に記載の照明装置。 So as not to be blocked by the light-emitting element light from the side surface of the light emitting element of their respective are adjacent illumination according to claim 1, characterized in that it is arranged so as to surround the condensing area apparatus.
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