JP5601081B2 - Imaging element unit and imaging apparatus - Google Patents

Description

  The present invention relates to an imaging element unit and an imaging apparatus.

An image sensor holding structure is known in which an image sensor is indirectly positioned by a plate-like support member supporting an image sensor package including an image sensor and a structure of an image pickup apparatus supporting the support member. Yes.
[Prior art documents]
[Patent Literature]
[Patent Document 1] JP-A-2005-65015

  The image sensor is required to maintain its position after being precisely positioned with respect to the subject luminous flux. Therefore, the support member that supports the image sensor has a certain thickness to provide high rigidity. ing. The image pickup device package includes elements such as a lead frame that outputs a signal of the image pickup device to an external circuit and a protective glass that seals the image pickup device, and also has a constant thickness. If the support member and the image pickup device package are simply stacked and integrated as has been done so far, the thickness of the image pickup device unit as a whole increases, and as a result, the thickness of the entire image pickup apparatus using this increases. It was.

  In order to solve the above-described problem, an image sensor unit according to a first aspect of the present invention includes an image sensor package that includes an image sensor that photoelectrically converts an optical image and has a stepped portion on the outer periphery. A support member that supports the imaging device package, and the support member includes a parallel surface of the stepped portion parallel to the light receiving surface while having a gap between the vertical surface of the stepped portion perpendicular to the light receiving surface of the image pickup device. The gap is filled with an adhesive to support the image sensor package.

  In order to solve the above-described problem, an imaging apparatus according to a second aspect of the present invention includes the above-described imaging element unit.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

It is a disassembled perspective view of the main structures which comprise the camera which concerns on this embodiment. It is a disassembled perspective view which shows a mode that an image pick-up element unit is assembled | attached to a box part. It is a perspective view which shows a mode that the box part and the image pick-up element unit were united. It is a disassembled perspective view of an image sensor unit. It is sectional drawing of an image pick-up element unit. It is a principal part enlarged view of an image sensor unit. It is a front view of an image sensor unit. It is a principal part enlarged view of the image pick-up element unit as another Example.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is an exploded perspective view of main structures constituting a camera 10 as an imaging apparatus according to the present embodiment. The camera 10 is formed by assembling an exterior member to the main body 20. The exterior member is mainly composed of a front exterior member 11, an upper exterior member 12, and a rear exterior member 13, and is assembled to the main body 20 from each direction as shown.

  The main body portion 20 is formed by combining a frame portion 30 as a skeleton structure of the entire camera 10 and a box portion 40 that is a box-shaped support. The box unit 40 forms an optical path for guiding the subject luminous flux transmitted through the interchangeable lens to an image sensor, which will be described later. Preventive measures are taken. The box portion 40 itself is resin-molded by, for example, engineering plastic.

  The camera 10 is an interchangeable lens camera, and a camera mount 41 for mounting an interchangeable lens is fixed to the box unit 40. The camera mount 41 employs a so-called bayonet system, for example. The mount surface of the camera mount 41 serves as a reference surface for the flange back. When the interchangeable lens comes into contact with the mount surface and is attached to the camera mount 41 by the bayonet, the optical path of the subject luminous flux from the interchangeable lens through the inside of the box unit 40 to the image sensor is completed.

  In addition to the camera mount 41 being fixed to the box part 40, a mirror part 42, a pentaprism 43 and a finder part 44 are also attached. The mirror part 42 is pivotally supported by the box part 40 and can take a state where it is obliquely installed in the subject light beam transmitted through the interchangeable lens and a state where it is retracted from the subject light beam. The mirror unit 42 guides the subject light flux to the finder unit 44 in the oblique state, and guides the subject light beam to the image sensor in the retracted state.

  In addition, although the camera 10 in this embodiment employs a single-lens reflex camera equipped with an optical viewfinder, it may be an interchangeable lens camera without an optical viewfinder. In that case, the mirror part 42, the pentaprism 43, and the finder part 44 are omitted.

  FIG. 2 is an exploded perspective view showing how the image sensor unit 50 is assembled to the box 40. FIG. 3 is a perspective view showing a state in which the box portion 40 and the image sensor unit 50 are integrated. In these drawings, the mirror part 42, the pentaprism 43 and the finder part 44 are omitted.

  The image pickup device unit 50 is fixed to the box portion 40 along the arrow direction in FIG. 3 so that the light receiving surface of the image pickup device faces the opening provided on the back side of the box portion 40. In the fixing operation with respect to the image sensor unit 50, six-axis adjustment is performed so that the light receiving surface is not tilted and decentered with respect to the photographing optical axis. That is, the imaging element unit 50 is fixed to the box unit 40 while being subjected to 6-axis adjustment as a unit after assembling each element to be described later constituting the unit into a unit.

  FIG. 4 is an exploded perspective view of the image sensor unit 50. The image pickup device unit 50 is arranged and unitized from the mount side so as to become the press frame pressing frame 110, the LPF holder 130, the sensor holder 150, the image pickup device package 170, and the sensor substrate 190 from the mount side when fixed to the box portion 40. Is done.

  The LPF holder 130 is a holding frame that holds the optical low-pass filter 140. The optical low-pass filter 140 is an optical filter that suppresses the spatial frequency of the subject image. The LPF holder 130 is placed on the surface side that is the mount side of the sensor holder 150 while holding the optical low-pass filter 140. The press frame 110 is a thin metal sheet formed by press working, and when the LPF holder 130 is positioned with respect to the sensor holder 150 with the LPF holder 130 interposed therebetween, the LPF holder 130 is attached from the mount side toward the surface of the sensor holder 150. Demonstrate the urging power.

  The image pickup device package 170 is fixed to the sensor holder 150 from the back side of the sensor holder 150 integrally with the sensor substrate 190 while being electrically connected to the sensor substrate 190. That is, the sensor holder 150 functions as a support member that supports the imaging element package 170. Therefore, the sensor holder 150 has high rigidity as a support member. The sensor holder 150 is formed, for example, as a metal plate that has been punched by a press machine. Stainless steel or the like is used as the metal plate. Specific configurations of the sensor holder 150 and the imaging element package 170 will be described later. In this way, the respective elements are assembled based on the sensor holder 150, and the imaging element unit 50 is formed as a whole.

  FIG. 5 is a cross-sectional view of the image sensor unit 50. Hereinafter, a structure for attaching the image sensor package 170 to the sensor holder 150 will be described. Therefore, in the following description and drawings, the pressing frame 110, the LPF holder 130, the optical low-pass filter 140, and the sensor holder 150 are omitted.

  The image pickup device package 170 has an internal space sealed by a protective glass 171, and an image pickup device 172 is disposed in the sealed internal space. The image sensor 172 is, for example, a CMOS sensor, and converts an object optical image formed on the light receiving surface 173 through the protective glass 171 into an electrical signal. The converted electric signal is transmitted to the electric circuit of the sensor substrate 190 via the lead frame 178. The protective glass 171 may have functionality such as an IR filter that cuts infrared light.

  The image sensor package 170 is formed of ceramic, for example. A stepped portion 174 is provided on the outer peripheral portion on the surface side of the image pickup device package 170. That is, a surface that is one step lower than the surface that receives the protective glass 171 is formed along the outer periphery.

  The sensor holder 150 has an opening 151 that guides the subject light flux to the image sensor 172. The image pickup device package 170 is fixed in contact with the periphery of the opening 151 of the sensor holder 150 at the stepped portion 174. A specific structure for fixing will be described later.

  When the sensor holder 150 supports the image sensor package 170 using the stepped portion 174, the thickness of the sensor holder 150 falls within the thickness of the image sensor package 170 as shown in the figure. That is, the height of the stepped portion 174 is set so that the sensor holder 150 does not protrude with respect to the thickness of the imaging element package 170. By setting the height of the stepped portion 174 in this way, it is possible to reduce the overall thickness of the image sensor unit 50, and thus contribute to reducing the overall thickness of the camera 10 using this. To do. In addition, since the end surface of the opening 151 does not protrude with respect to the protective glass 171, the effect that stray light reflected by the end surface of the opening 151 does not easily enter the light receiving surface 173 can be expected.

  In particular, as shown in the figure, when the imaging device package 170 is configured to contact the sensor holder 150 with a stepped portion 174 provided on the light receiving surface 173 side, the surface of the protective glass 171 and the surface of the sensor holder 150 are substantially flush with each other. Can be placed on top. Such an arrangement facilitates assembly in the manufacturing process.

  FIG. 6 is an enlarged view of a main part of the image sensor unit 50. As shown in the drawing, the stepped portion 174 is formed to include a vertical surface 175 perpendicular to the light receiving surface 173 and an abutting surface 176 as a parallel parallel surface.

  The abutting surface 176 is formed so as to be slightly raised from the peripheral surface 177, and is provided at three locations on the peripheral surface 177 continuous in the outer peripheral portion. The abutting surface 176 is processed with high surface accuracy as a polished surface, and comes into contact with the sensor holder 150 in the back surface area adjacent to the opening 151 of the sensor holder 150. The abutting surface 176 is arranged so that the opening 151 of the sensor holder 150 is not located directly above and the periphery of the abutting surface 176 is separated from the opening 151. That is, the ridgeline of the opening 151 is opposed to the peripheral surface 177.

  The opening 151 is opposed to the vertical surface 175 of the step 174 with a gap. Then, the gap 160 is filled with the adhesive 160, and the sensor holder 150 and the image pickup device package 170 are fixed to each other. The opening 151 and the vertical surface 175 are roughened to increase the bonding area. As the opening 151 formed by punching, a rough surface formed by punching may be used as it is without performing surface finishing.

  For example, an epoxy hard curing adhesive is used as the adhesive 160. In particular, an adhesive having a curing shrinkage that decreases in volume toward the center when cured is preferable. By using an adhesive having curing shrinkage, the sensor holder 150 and the image pickup device package 170 can be attracted to each other, thereby improving the adhesion.

  The periphery of the abutting surface 176 is arranged so as to be separated from the opening 151, and a space exists between the ridgeline of the opening 151 and the peripheral surface 177. This space plays a role of an adhesive reservoir when the filled adhesive 160 wraps around. Therefore, it is possible to prevent the adhesive 160 from entering between the abutting surface 176 and the back surface region of the sensor holder 150, and to maintain the positional accuracy of the sensor holder 150 and the imaging device package 170.

  FIG. 7 is a front view of the image sensor unit 50. Also in this figure, the pressing frame 110, the LPF holder 130, the optical low-pass filter 140, and the sensor holder 150 are omitted.

  As described above, with respect to the optical axis direction perpendicular to the light receiving surface 173 of the image sensor 172, the abutting surface 176 raised from the peripheral surface 177 is in contact with the back surface of the sensor holder 150, and the sensor The holder 150 and the image sensor package 170 are positioned with respect to each other. The adhesive 160 is filled in at least three places in the gap between the opening 151 and the vertical surface 175. In particular, when an adhesive having curing shrinkage is used, the adhesive 160 is filled so as to include a gap adjacent to the abutting surface 176 in order to improve the contact between the abutting surface 176 and the back surface of the sensor holder 150. It is preferable to do.

  With respect to the surface direction parallel to the light receiving surface 173 of the image sensor 172, the vertical surface 175 contacts the contact portion 152 provided in the opening 151, and the sensor holder 150 and the image sensor package 170 are positioned relative to each other. The contact portion 152 is formed as an abutting portion raised from the opening 151 toward the center of the opening, and is provided at three locations around the opening 151. The opening 151 facing the gap filled with the adhesive 160 is roughened, but the contact surface of the contact portion 152 that contacts the vertical surface 175 is polished and has high surface accuracy. Similarly, the region of the vertical surface 175 in contact with the contact portion 152 is also polished and has high surface accuracy.

  That is, the abutting surface 176 is abutted against the back surface of the sensor holder 150 in the optical axis direction, and the vertical surface 175 of the stepped portion 174 is in contact with the contact portion 152 of the sensor holder 150 in the direction perpendicular to the optical axis. The sensor holder 150 and the image pickup device package 170 are positioned with respect to each other. Then, the adhesive 160 is filled into the gap formed between the opposing vertical surface 175 and the opening 151 to fix each other.

  The abutting surface 176 is formed by protruding from the peripheral surface 177 of the image pickup device package 170, and the contact portion 152 is formed by protruding from the opening 151 toward the center of the opening. May be formed. Further, it may be raised from both sides.

  FIG. 8 is an enlarged view of a main part of an image sensor unit 50 as another embodiment. Also in this figure, the pressing frame 110, the LPF holder 130, the optical low-pass filter 140, and the sensor holder 150 are omitted.

  A difference from the above-described structure described with reference to FIG. 6 is that a stepped portion 184 is provided on the back surface side of the image sensor package 170. In this case, the abutting surface 186 parallel to the light receiving surface 173 contacts the sensor holder 150 in a surface region adjacent to the opening 151 of the sensor holder 150.

  The opening 151 is opposed to the vertical surface 185 of the stepped portion 184 with a gap. Then, the gap 160 is filled with the adhesive 160, and the sensor holder 150 and the image pickup device package 170 are fixed to each other.

  Even in such a configuration, it is possible to reduce the overall thickness of the image sensor unit 50, and thus contribute to reducing the overall thickness of the camera 10 using this. Further, since there is no possibility that the subject light flux is reflected by the opening 151, it is also effective as a countermeasure against stray light.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

DESCRIPTION OF SYMBOLS 10 Camera, 11 Front exterior member, 12 Upper surface exterior member, 13 Rear exterior member, 20 Main body part, 30 Frame part, 40 Box part, 41 Camera mount, 42 Mirror part, 43 Penta prism, 44 Finder part, 50 Image sensor unit , 110 Press frame, 130 LPF holder, 140 Optical low-pass filter, 150 Sensor holder, 151 Opening part, 152 Contact part, 160 Adhesive, 170 Imaging element package, 171 Protective glass, 172 Imaging element, 173 Light receiving surface, 174 Stepped part 175 vertical surface, 176 abutting surface, 177 peripheral surface, 178 lead frame, 184 stepped portion, 185 vertical surface, 186 abutting surface, 190 sensor substrate

Claims (9)

Imaging in which a first step portion for installing an image pickup device that photoelectrically converts an optical image and a second step portion that is different from the first step portion are provided on the outer peripheral portion on the light receiving surface side of the image pickup device. An element package;
A support member that supports the imaging device package;
The support member is in contact with the parallel surface of the second step portion parallel to the light receiving surface while having a gap between the support member and the vertical surface of the second step portion perpendicular to the light receiving surface of the image sensor, and the gap An image sensor unit that is filled with an adhesive and supports the image sensor package. The image sensor package has a transmission member on the light receiving surface side of the image sensor,
Wherein when the support member is in contact with the parallel surfaces, the surface of the surface and the transmitting member of said support member capturing device unit according to claim 1 positioned on the same plane.   3. The image sensor unit according to claim 1, wherein the parallel surface is provided so as to protrude from the periphery as an abutting surface, and is provided at a position in contact with the support member at a distance from an end of the support member. .   The imaging according to any one of claims 1 to 3, wherein a contact portion that contacts each other as an abutment portion is provided on at least a part of the vertical surface and the end surface of the support member that faces the vertical surface. Element unit.   The image sensor unit according to claim 1, wherein the adhesive is filled in at least three places in the gap.   The imaging device unit according to claim 1, wherein the support member is a pressed metal plate.   The image sensor unit according to claim 1, wherein at least one of the vertical surface and the end surface of the support member facing the vertical surface is roughened.   8. The image sensor unit according to claim 1, wherein a thickness of the support member when the support member supports the image sensor package falls within a thickness of the image sensor package. 9.   The imaging device provided with the image pick-up element unit of any one of Claim 1 to 8.

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