JP5600095B2 - Multi-layer spiral structure common mode filter and manufacturing method thereof - Google Patents

Description

  The present invention relates to a common mode filter, and more particularly to a laminated common mode filter and a method for manufacturing the same.

  Common mode noise is noise transmitted in the same direction on all conductors. In order to suppress common mode noise, a common mode filter or choke can be provided on a wiring that transmits the noise. Conventionally, a common mode filter is mainly configured by winding two sets of coil members having the same number of turns on an iron core. When the common mode current flows through the common mode filter, magnetic fields in the same direction are generated in the two coils, and a high impedance appears in the common mode filter, thereby achieving an effect of suppressing the common mode current.

  Chip-type common mode filters have been developed to meet the demand for portable electronic devices. In Patent Document 1, two coil conductor layers, two lead-out electrode layers, a plurality of insulation layers, and two magnetic layers are disclosed. A chip-type common mode filter including the above is disclosed. Each coil conductive layer includes one coil, and the two lead wire electrode layers extend the ends of the two coils to the edge of the chip-type common mode filter for electrical connection to the outside. I'm out. The insulating layer is used to electrically isolate the coil conductive layer and the lead wire electrode layer. The coil conductive layer, the lead wire electrode layer, and the insulating layer are disposed between the two magnetic layers.

US Pat. No. 7,145,427 B2

  Due to the size limitation, the above-mentioned chip-type common mode filter usually remarkably controls the increase of the common mode impedance or the cut-off frequency by adjusting the coil structure again. It is difficult to make it. If the common mode impedance is increased by increasing the number of turns of the coil, the area required for mounting the chip type common mode filter becomes wide, which is disadvantageous for application to a portable electronic device.

  According to one embodiment of the present invention, a common mode filter having a multilayer spiral structure includes a first coil, a second coil, a first insulating layer, a third coil, and a second insulating layer. A fourth coil and a third insulating layer are provided. The first coil is connected in series with the third coil, and the second coil is connected in series with the fourth coil. The second coil is disposed between the first coil and the third coil, and the third coil is disposed between the second coil and the fourth coil. The first insulating layer separates the first coil and the second coil. The second insulating layer separates the second coil and the third coil. The third insulating layer separates the third coil and the fourth coil. At least one of the first insulating layer, the second insulating layer, and the third insulating layer includes a magnetic material.

  According to one aspect of the present invention, a common mode filter having a multilayer spiral structure includes a first coil, a second coil, a third coil, a fourth coil, and a magnetic material portion. . The second coil is disposed between the first coil and the third coil. The third coil is disposed between the second coil and the fourth coil. The first coil is connected in series to the third coil. The second coil is connected in series to the fourth coil. The magnetic material part is penetrated by the 1st coil, the 2nd coil, the 3rd coil, and the 4th coil.

  According to one aspect of the present invention, a method for manufacturing a common mode filter having a multilayer spiral structure includes the steps of: forming a first coil having an inner end portion and an outer end portion on a material layer; Covering the first coil, forming a second coil having an inner end and an outer end on the first insulating layer, and a second insulating layer Forming and covering the second coil; forming a first contact hole to expose the inner end or the outer end of the first coil; and the first Filling a contact hole with a first metal to form a first conductive stud; and a third having an inner end and an outer end connected to one of the first conductive studs Forming a coil on the second insulating layer; and a third insulation. Forming a layer to cover the third coil; forming a second contact hole to expose the inner end or the outer end of the second coil; Filling the second contact hole with a second metal to form a second conductive stud, and a first end having an inner end and an outer end connected to the second conductive stud. Forming a fourth coil on the third insulating layer; forming a fourth insulating layer to cover the fourth coil; the first coil; the second coil; Forming a recess penetrating the third coil and the fourth coil, and filling the recess with a magnetic material.

  In the above, the technical features and advantages of the present invention have already been described in a fairly broad and general sense so that the detailed description of the invention that follows can be better understood. Other technical features and advantages constituting the claimed target of the present invention are described below. A person skilled in the art in the technical field of the present invention can easily achieve the same object as the present invention by modifying or designing other structures or manufacturing processes using the technical idea and specific embodiments disclosed below. It should be possible. Those skilled in the art of the present invention should also understand that these equivalent structures cannot depart from the spirit and scope of the present invention as defined in the appended claims.

  The common mode filter in one embodiment of the present invention has a high maximum impedance value, and the frequency band is wide at the same impedance value. Therefore, the common mode filter having a multilayer spiral structure surely shows performance superior to that of the conventional common mode filter. Furthermore, it is possible to increase the common mode impedance of the common mode filter and increase the inductance value of the common mode filter.

1 is an exploded schematic view of a common mode filter in one embodiment of the present invention. Schematic cross-sectional view of the common mode filter of FIG. Schematic cross-sectional view of a common mode filter in another embodiment of the present invention Schematic cross-sectional view of a common mode filter in another embodiment of the present invention Schematic cross-sectional view of a common mode filter in another embodiment of the present invention The top view of a part of common mode filter in other embodiments of the present invention Sectional drawing of the common mode filter in other Example of this invention Schematic cross section showing the manufacturing process procedure of the common mode filter of one embodiment of the present invention Schematic cross section showing the manufacturing process procedure of the common mode filter of one embodiment of the present invention Schematic cross section showing the manufacturing process procedure of the common mode filter of one embodiment of the present invention Graph of relationship between impedance value and frequency of common mode filter in one embodiment of the present invention Graph of relationship between impedance value and frequency of known common mode filter Schematic of hetero-laminated substrate in one embodiment of the present invention Schematic of hetero-laminated substrate in another embodiment of the present invention Schematic of a hetero-laminated substrate in yet another embodiment of the present invention

  In one aspect, the present invention discloses a common mode filter having two coil sets. Each coil set includes a plurality of coils connected in series, and adjacent coils are isolated by an insulating layer. The coils of the two coil sets are alternately stacked. When the number of turns of the coil set is increased, the common mode impedance of the common mode filter can be increased, and the cutoff frequency of the difference mode signal can be effectively suppressed. Further, even if the number of turns of each coil set is increased, the area necessary for the common mode filter can be kept unchanged.

  In some embodiments, the common mode filter may further include a plurality of insulating layers for electrically isolating the plurality of coils connected in series, and at least one of the plurality of insulating layers includes a magnetic material. As a result, the magnetic field lines generated in the coil can be enclosed, and the inductance value and common mode impedance of the common mode filter can be increased.

  In another embodiment, the common mode filter can include a magnetic material portion that extends through a plurality of coils connected in series, thereby increasing the inductance value and the common mode impedance of the common mode filter.

  Further, the common mode filter may further include two material layers, and the coil is provided between the two material layers. Since at least one of the two material layers can include a magnetic material, the common mode filter can have an excellent filtering effect.

  FIG. 1 is an exploded schematic view of a common mode filter 100 according to an embodiment of the present invention. Please refer to FIG. The common mode filter 100 includes a first coil layer 3, a first insulating layer 4, a second coil layer 5, a second insulating layer 6, a third coil layer 7, and a third insulating layer. 8 and a fourth coil layer 9, the first insulating layer 4 isolates the first coil layer 3 and the second coil layer 5, and the second insulating layer 6 The second coil layer 5 and the third coil layer 7 are separated from each other, and the third insulating layer 8 separates the third coil layer 7 and the fourth coil layer 9 from each other.

  Materials such as the first insulating layer 4, the second insulating layer 6, and the third insulating layer 8 can include polyimide, epoxy resin, or benzocyclobutene resin (BCB). At least one of the first insulating layer 4, the second insulating layer 6, and the third insulating layer 8 includes a magnetic material such as an iron magnetic material. In one example, the magnetic material can include nickel zinc ferrite or manganese zinc ferrite.

  The first insulating layer 4, the second insulating layer 6, the third insulating layer 8, and the like may be manufactured by a spin coating process, a dipping process, a spray process, or a screen-printing process. a thin film formation process, or the like.

  The first coil layer 3 includes a first coil 31, the second coil layer 5 includes a second coil 51, and the third coil layer 7 includes a third coil 71. The fourth coil layer 9 includes a fourth coil 91. The second coil 51 is disposed between the first coil 31 and the third coil 71, and the third coil 71 is disposed between the second coil 51 and the fourth coil 91. Has been. The first coil 31 and the third coil 71 are connected in series, and the second coil 51 and the fourth coil 91 are connected in series. Since the first coil 31 and the third coil 71 connected in series and the second coil 51 and the fourth coil 91 connected in series are electromagnetically connected, the first coil 31 and the third coil 91 connected in series are connected. Common mode noise can be removed by the one coil 31 and the third coil 71 and the second coil 51 and the fourth coil 91 connected in series.

  The first coil 31, the second coil 51, the third coil 71, and the fourth coil 91 may have a rectangular spiral as shown in FIG. 1, but may be, for example, a circular spiral. Other spiral shapes are also possible.

  In one embodiment, the first coil 31, the second coil 51, the third coil 71, and the fourth coil 91 are mostly overlapped in the vertical direction.

  In one embodiment, the first coil 31, the second coil 51, the third coil 71, and the fourth coil 91 can be wound with the same number of turns.

  In one embodiment, the first coil layer 3, the second coil layer 5, the third coil layer 7 and the fourth coil layer 9 are vacuum film formation processes (evaporation or sputtering) or plating. (Plating) process. The material of the first coil layer 3, the second coil layer 5, the third coil layer 7 and the fourth coil layer 9 is silver, palladium, aluminum, chromium, nickel, titanium, gold, copper, platinum or the like Alloys can be included.

  The common mode filter 100 can further include a first material layer 1 and a second material layer 11, of which the first coil 31, the second coil 51, the third coil 71, and the fourth coil. 91 is disposed between the first material layer 1 and the second material layer 11.

  In one embodiment, at least one of the first material layer 1 or the second material layer 11 includes a magnetic material such as an iron magnetic material. In other words, the first material layer 1 is a magnetic material layer and the second material layer 11 is a nonmagnetic material or an insulating layer, or the first material layer 1 is a nonmagnetic material or an insulating layer. The second material layer 11 is a magnetic material layer. In one embodiment, the magnetic material layer includes a magnetic substrate. The nonmagnetic material layer includes a nonmagnetic material substrate. The insulating layer includes an insulating substrate. In one embodiment, the magnetic material includes nickel zinc ferrite or manganese zinc ferrite. In one embodiment, the nonmagnetic material layer includes aluminum oxide, aluminum nitride, glass, or quartz. In one embodiment, the magnetic material layer includes a polymeric material and magnetic powder. The polymeric material can include polyimide, epoxy resin or benzocyclobutene resin. The magnetic powder contains nickel zinc ferrite or manganese zinc ferrite.

  Please refer to FIG. In one embodiment, the first material layer 1 comprises a hetero-laminated substrate. In another embodiment, the second material layer 11 includes a hetero laminated substrate. The hetero laminated substrate includes an insulating material layer 111 and a magnetic material layer 112. The insulating material layer 111 and the magnetic material layer 112 can be diffusion-bonded between them by a simultaneous firing method. The insulating material layer 111 and the magnetic material layer 112 can be bonded with an adhesive. The insulating material layer 111 and the magnetic material layer 112 can each be formed by thick film printing.

  The insulating material layer 111 or the magnetic material layer 112 can be an outer layer. In one embodiment, the magnetic material layer 112 can be fabricated according to the size of the coil. As shown in FIG. 13, the magnetic material layer 112 can be generally smaller than the insulating material layer 111. In other embodiments, the area of the magnetic material layer 112 may substantially correspond to the area of the insulating material layer 111.

  Please refer to FIG. 14 and FIG. The magnetic material layer 112 ′ or 112 ″ may include a plurality of independent magnetic material blocks 1121 ′ or 1121 ″. The magnetic material block 1121 ′ or 1121 ″ is arranged on the main surface of the insulating material layer 111.

  The first material layer 1 and / or the second material layer 11 includes a magnetic material and restricts the magnetic field range of the common mode filter 100, so that the common mode filter 100 can have an excellent filtering effect. .

  Refer to FIG. 1 again. The common mode filter 100 further includes a side insulating layer 2 and a side insulating layer 10. The side insulating layer 2 is formed on the first material layer 1. The first coil layer 3 is formed on the side insulating layer 2. The first insulating layer 4 covers the first coil layer 3. The second coil layer 5 is formed on the first insulating layer 4. The second insulating layer 6 covers the second coil layer 5. The third coil layer 7 is formed on the second insulating layer 6. The third insulating layer 8 covers the third coil layer 7. The fourth coil layer 9 is formed on the third insulating layer 8. The side insulating layer 10 covers the fourth coil layer 9. The second material layer 11 is disposed on the side insulating layer 10.

  1 and 2, the first coil 31 has an inner end portion 32, the third coil 71 has an inner end portion 72, and the first insulating layer 4. Includes a contact hole 41, and the second insulating layer 6 includes a contact hole 61, of which the contact hole 41 includes the inner end portion 32 of the first coil 31 and the third coil. The contact hole 61 is also formed between the inner end 32 of the first coil 31 and the inner end 72 of the third coil 71. The first coil 31 and the third coil 71 can be electrically connected through the contact hole 41 and the contact hole 61.

  Further, the common mode filter 100 may further include a conductive stud 12, and the conductive stud 12 passes through the contact hole 41 and the contact hole 61, and the inner end portion 32 of the first coil 31 and the third coil. The inner end 72 of 71 can be connected.

  The second coil 51 has an inner end 52, the fourth coil 91 has an inner end 92, the second insulating layer 6 may further comprise a contact hole 62, and a third insulation The layer 8 may include a contact hole 81, of which the contact hole 62 and the contact hole 81 are formed between the inner end 52 of the second coil 51 and the inner end 92 of the fourth coil 91. As a result, the inner end 52 of the second coil 51 and the inner end 92 of the fourth coil 91 can be electrically connected by the contact hole 62 and the contact hole 81.

  The common mode filter 100 can further include a conductive stud 13. The conductive stud 13 penetrates the contact hole 62 and the contact hole 81 and connects the inner end 52 of the second coil 51 and the inner end 92 of the fourth coil 91.

  In one embodiment, the conductive stud 12 and the conductive stud 13 can be manufactured by a vacuum film formation process (evaporation or sputtering) or a plating process. The material of the conductive stud 12 and the conductive stud 13 can include silver, palladium, aluminum, chromium, nickel, titanium, gold, copper, platinum, or an alloy thereof.

  In one embodiment, the material of the side insulating layers 2 and 10 may include polyimide, epoxy resin, or benzocyclobutene resin (BCB). The method for manufacturing the side insulating layers 2 and 10 may include a spin coating process, a dipping process, a spraying process, a screen printing process, or a thin film forming process.

  The outer end portions 33, 53, 73, or 93 in each of the first coil 31, the second coil 51, the third coil 71, and the fourth coil 91 extend to correspond to the corresponding electrodes 34, 54, 74, or 94 can be connected. The electrode 34, 54, 74 or 94 is adjacent to the periphery of the common mode filter 100. The first coil 31, the second coil 51, the third coil 71, and the fourth coil 91 are electrically connected to the outside through corresponding electrodes 34, 54, 74, or 94.

  In one embodiment, the thickness of the side insulating layer 2 can be between 1 μm and 20 μm.

  In one embodiment, when the first material layer 1 is an insulating substrate, the first coil layer 3 can be formed directly on the first material layer 1. In this case, the side insulating layer 2 does not need to be formed on the first material layer 1.

  In one embodiment, the common mode filter 100 may further include an adhesive layer (not shown) that bonds the side insulating layer 10 and the second material layer 11 together.

  FIG. 3 is a schematic cross-sectional view of a common mode filter 300 according to another embodiment of the present invention. Please refer to FIG. The common mode filter 300 includes a first material layer 1, an external insulating layer 35, a first lead layer 14, a side insulating layer 2, a first coil layer 3, a first insulating layer 4, 2nd coil layer 5, 2nd insulating layer 6, 3rd coil layer 7, 3rd insulating layer 8, 4th coil layer 9, side part insulating layer 10, and 2nd The lead layer 15, the external insulating layer 36, and the second material layer 11 are provided.

  The outer insulating layer 35 is formed on the first material layer 1. The first lead layer 14 is formed on the outer insulating layer 35. The side insulating layer 2 covers the first lead layer 14. The first coil layer 3 is formed on the side insulating layer 2. The first insulating layer 4 covers the first coil layer 3. The second coil layer 5 is formed on the first insulating layer 4. The second insulating layer 6 covers the second coil layer 5. The third coil layer 7 is formed on the second insulating layer 6. The third insulating layer 8 covers the third coil layer 7. The fourth coil layer 9 is formed on the third insulating layer 8. The side insulating layer 10 covers the fourth coil layer 9. The second lead layer 15 is formed on the side insulating layer 10. The outer insulating layer 36 covers the second lead layer 15. The second material layer 11 is disposed on the outer insulating layer 36.

  In one embodiment, at least one of the first insulating layer 4, the second insulating layer 6, and the third insulating layer 8 includes a magnetic material such as an iron magnetic material. In one example, the magnetic material can include nickel zinc ferrite or manganese zinc ferrite.

  In one embodiment, at least one of the first material layer 1 and the second material layer 11 includes a magnetic material.

  In one embodiment, at least one of the first material layer 1 and the second material layer 11 includes a hetero-laminated substrate.

  The material of the outer insulating layers 35 and 36 may include polyimide, epoxy resin, or benzocyclobutene resin, and the manufacturing method may include a spin coating process, a dipping process, a spraying process, a screen printing process, or a thin film forming process. it can.

  The first coil layer 3 includes a first coil 31, and the first coil 31 has an inner end portion 32 and an outer end portion 33. The second coil layer 5 includes a second coil 51, and the second coil 51 has an inner end portion 52 and an outer end portion 53. The third coil layer 7 includes a third coil 71, and the third coil 71 has an inner end portion 72 and an outer end portion 73. The fourth coil layer 9 includes a fourth coil 91, and the fourth coil 91 has an inner end portion 92 and an outer end portion 93.

  The first insulating layer 4 includes a contact hole 41, the second insulating layer 6 includes a contact hole 61, and the conductive stud 12 penetrates the contact hole 41 and the contact hole 61, The inner end portion 32 of the coil 31 and the inner end portion 72 of the third coil 71 are connected, and the first coil 31 and the third coil 71 are connected in series. The second insulating layer 6 further includes a contact hole 63, the third insulating layer 8 includes a contact hole 82, and the conductive stud 17 penetrates the contact hole 63 and the contact hole 82, The outer end 53 of the coil 51 and the outer end 93 of the fourth coil 91 are connected, and the second coil 51 and the fourth coil 91 are connected in series.

  The conductive studs 12 and 17 can be manufactured by a vacuum film formation process (evaporation or sputtering) or a plating process. The conductive stud 17 can include silver, palladium, aluminum, chromium, nickel, titanium, gold, copper, platinum or an alloy thereof.

  The first lead layer 14 includes lead wires 141. One end portion of the lead wire 141 extends to the periphery 301 of the common mode filter 300, thereby functioning to be electrically connected to the outside. The other end portion of the lead wire 141 is connected to the inner end portion 52 of the second coil 51 through a contact hole on the side insulating layer 2 and the first insulating layer 4. The second lead layer 15 includes lead wires 151. One end portion of the lead wire 151 extends to the periphery 301 of the common mode filter 300, thereby functioning to be electrically connected to the outside. The other end portion of the lead wire 151 is connected to the inner end portion 92 of the fourth coil 91 through a contact hole in the side insulating layer 10. The outer end portion 33 of the first coil 31 extends adjacent to the periphery 301 of the common mode filter 300 and is connected to a corresponding electrode adjacent to the periphery 301 of the common mode filter 300. The outer end portion 73 of the third coil 71 also extends adjacent to the periphery 301 of the common mode filter 300 and is connected to a corresponding electrode adjacent to the periphery 301 of the common mode filter 300.

  The material of the first lead layer 14, the first coil layer 3, the second coil layer 5, the third coil layer 7, the fourth coil layer 9 and the second lead layer 15 is silver, palladium, aluminum , Chromium, nickel, titanium, gold, copper, platinum or alloys thereof. The first lead layer 14, the first coil layer 3, the second coil layer 5, the third coil layer 7, the fourth coil layer 9, and the second lead layer 15 are formed in a vacuum film forming process (evaporation). Or sputtering) or a plating process.

  In addition to the connection method shown in FIG. 3, there may be other connection methods for the first coil 31, the second coil 51, the third coil 71, and the fourth coil 91. In another embodiment, the outer end portion 33 of the first coil 31 and the outer end portion 73 of the third coil layer 7 are connected, and the first coil 31 and the third coil layer 7 are connected in series. doing. The inner end 52 of the second coil 51 and the inner end 92 of the fourth coil layer 9 are connected, and the second coil 51 and the fourth coil layer 9 are connected in series. Further, lead wires are connected to the inner end portion 32 of the first coil 31 and the inner end portion 72 of the third coil 71, respectively, so as to make an external electrical connection.

  FIG. 4 is a schematic cross-sectional view of a common mode filter 400 according to another embodiment of the present invention. Please refer to FIG. The common mode filter 400 includes a first material layer 1, an external insulating layer 35, a first lead layer 14 ′, a side insulating layer 2, a first coil layer 3, and a first insulating layer 4. The second coil layer 5, the second insulating layer 6, the third coil layer 7, the third insulating layer 8, the fourth coil layer 9, the side insulating layer 10, and the second A lead layer 15 ′, an external insulating layer 36, and a second material layer 11.

  The outer insulating layer 35 is formed on the first material layer 1. The first lead layer 14 ′ is formed on the outer insulating layer 35. The side insulating layer 2 covers the first lead layer 14 '. The first coil layer 3 is formed on the side insulating layer 2. The first insulating layer 4 covers the first coil layer 3. The second coil layer 5 is formed on the first insulating layer 4. The second insulating layer 6 covers the second coil layer 5. The third coil layer 7 is formed on the second insulating layer 6. The third insulating layer 8 covers the third coil layer 7. The fourth coil layer 9 is formed on the third insulating layer 8. The side insulating layer 10 covers the fourth coil layer 9. The second lead layer 15 ′ is formed on the side insulating layer 10. The outer insulating layer 36 covers the second lead layer 15 '. The second material layer 11 is disposed on the outer insulating layer 36.

  In one embodiment, at least one of the first insulating layer 4, the second insulating layer 6, and the third insulating layer 8 includes a magnetic material such as an iron magnetic material. In one example, the magnetic material can include nickel zinc ferrite or manganese zinc ferrite.

  The first coil layer 3 includes a first coil 31, and the first coil 31 has an inner end portion 32 and an outer end portion 33. The second coil layer 5 includes a second coil 51, and the second coil 51 has an inner end portion 52 and an outer end portion 53. The third coil layer 7 includes a third coil 71, and the third coil 71 has an inner end portion 72 and an outer end portion 73. The fourth coil layer 9 includes a fourth coil 91, and the fourth coil 91 has an inner end portion 92 and an outer end portion 93.

  The first insulating layer 4 includes a contact hole 42, the second insulating layer 6 includes a contact hole 64, and the conductive stud 18 penetrates the contact hole 42 and the contact hole 64, The outer end portion 33 of the coil 31 and the outer end portion 73 of the third coil 71 are connected, and the first coil 31 and the third coil 71 are connected in series. The second insulating layer 6 further includes a contact hole 65, the third insulating layer 8 includes a contact hole 83, and the conductive stud 19 penetrates the contact hole 65 and the contact hole 83, The outer end 53 of the coil 51 and the outer end 93 of the fourth coil 91 are connected, and the second coil 51 and the fourth coil 91 are connected in series.

  The conductive studs 18 and 19 can be manufactured by a vacuum film formation process (evaporation or sputtering) or a plating process. Conductive studs 18 and 19 can include silver, palladium, aluminum, chromium, nickel, titanium, gold, copper, platinum or alloys thereof.

  The first lead layer 14 ′ includes lead wires 141 and 142. One end portion of the lead wire 141 extends to the periphery 301 of the common mode filter 400 and functions to be electrically connected to the outside. The other end portion of the lead wire 141 is connected to the inner end portion 52 of the second coil 51 through a contact hole on the side insulating layer 2 and the first insulating layer 4. One end of the lead wire 142 extends to the periphery 301 of the common mode filter 400 and functions to be electrically connected to the outside. The other end portion of the lead wire 142 is connected to the inner end portion 32 of the first coil 31 through a contact hole on the side insulating layer 2. The second lead layer 15 ′ includes two lead wires 151 and 152. One end of the lead wire 151 extends to the periphery 301 of the common mode filter 400 and functions to be electrically connected to the outside. The other end of the lead wire 151 is connected to the inner end 72 of the third coil 71 through the contact holes of the side insulating layer 10 and the third insulating layer 8. One end of the lead wire 152 extends to the periphery 301 of the common mode filter 400 and functions to be electrically connected to the outside. The other end of the lead wire 152 is connected to the inner end 92 of the fourth coil 91 through a contact hole in the side insulating layer 10.

  The material of the first lead layer 14 ′, the first coil layer 3, the second coil layer 5, the third coil layer 7, the fourth coil layer 9 and the second lead layer 15 ′ is silver, palladium. , Aluminum, chromium, nickel, titanium, gold, copper, platinum or alloys thereof. Further, the first lead layer 14 ′, the first coil layer 3, the second coil layer 5, the third coil layer 7, the fourth coil layer 9 and the second lead layer 15 ′ are formed in a vacuum film formation process. (Evaporation or sputtering) or a plating process.

  In one embodiment, at least one of the first material layer 1 and the second material layer 11 includes a magnetic material.

  In one embodiment, at least one of the first material layer 1 and the second material layer 11 includes a hetero-laminated substrate.

  FIG. 5 is a schematic cross-sectional view of a common mode filter 500 according to another embodiment of the present invention. Please refer to FIG. The common mode filter 500 includes a first material layer 1, a first coil layer 3, a first insulating layer 4, a second coil layer 5, a second insulating layer 6, and a third coil layer. 7 ′, the third insulating layer 8, the fourth coil layer 9 ′, the fourth insulating layer 25, the fifth coil layer 21, the fifth insulating layer 26, and the sixth coil layer. 22, the sixth insulating layer 27, the lead layer 23, the seventh insulating layer 28, the lead layer 24, and the second material layer 11, and the first insulating layer 4 includes the first insulating layer 4. The coil layer 3 and the second coil layer 5 are electrically isolated, and the second insulating layer 6 electrically isolates the second coil layer 5 and the third coil layer 7 '. The third insulating layer 8 electrically isolates the third coil layer 7 ′ and the fourth coil layer 9 ′. The fourth insulating layer 25 electrically isolates the fourth coil layer 9 ′ from the fifth coil layer 21. The fifth insulating layer 26 electrically isolates the fifth coil layer 21 and the sixth coil layer 22. The sixth insulating layer 27 electrically isolates the sixth coil layer 22 and the lead layer 23. The seventh insulating layer 28 electrically isolates the lead layer 23 and the lead layer 24.

  In one embodiment, the first insulating layer 4, the second insulating layer 6, the third insulating layer 8, the fourth insulating layer 25, the fifth insulating layer 26, the sixth insulating layer 27, and the seventh insulating layer. The material of layer 28 can include polyimide, epoxy resin or benzocyclobutene resin (BCB). Of the first insulating layer 4, the second insulating layer 6, the third insulating layer 8, the fourth insulating layer 25, the fifth insulating layer 26, the sixth insulating layer 27, and the seventh insulating layer 28 At least one of these includes a magnetic material such as an iron magnetic material. In one example, the magnetic material can include nickel zinc ferrite or manganese zinc ferrite.

  The first coil layer 3 includes a first coil 31, the second coil layer 5 includes a second coil 51, and the third coil layer 7 ′ includes a third coil 71. The fourth coil layer 9 ′ includes the fourth coil 91, the fifth coil layer 21 includes the fifth coil 211, and the sixth coil layer 22 includes the sixth coil 221. It has. The first coil layer 3, the second coil layer 5, the third coil layer 7 ′, the fourth coil layer 9 ′, the fifth coil layer 21 and the sixth coil layer 22 are provided to overlap each other. Of these, the first coil 31, the third coil 71, and the fifth coil 211 are connected in series. The second coil 51, the fourth coil 91, and the sixth coil 221 are connected in series. In addition, the first coil 31, the second coil 51, the third coil 71, the fourth coil 91, the fifth coil 211, and the sixth coil 221 are the first material layer 1 and the second material. It is arranged between the layers 11.

  In the embodiment, the side insulating layer 2 can be formed on the first material layer 1. The first coil layer 3 is formed on the side insulating layer 2. Further, the side insulating layer 10 can be formed and covers the lead layer 24. The second material layer 11 is disposed on the lead layer 24.

  The material of the side insulating layer 2 and the side insulating layer 10 includes polyimide, epoxy resin, or benzocyclobutene resin, and the manufacturing method includes a spin coating process, a dipping process, a spraying process, a screen printing process, or a thin film forming process. be able to.

  The conductive stud 12 passes through the contact hole 41 of the first insulating layer 4 and the contact hole 61 of the second insulating layer 6, and the inner end 32 of the first coil 31 and the inner end of the third coil 71. The unit 72 is connected. The outer end 33 of the first coil 31 is connected to the electrode 34.

  The conductive stud 13 passes through the contact hole 62 of the second insulating layer 6 and the contact hole 81 of the third insulating layer 8, and the inner end 52 of the second coil 51 and the inner end of the fourth coil 91. The unit 92 is connected. The outer end 53 of the second coil 51 is connected to the electrode 54.

  The conductive stud 75 passes through the contact hole 82 of the third insulating layer 8 and the contact hole 252 of the fourth insulating layer 25, and the outer end 73 of the third coil 71 and the outer end of the fifth coil 211. Part 213 is connected.

  The conductive stud 95 passes through the contact hole 251 of the fourth insulating layer 25 and the contact hole 261 of the fifth insulating layer 26, and the outer end portion 93 of the fourth coil 91 and the outer end of the sixth coil 221. Part 223 is connected.

  The conductive stud 214 passes through the contact hole 262 of the fifth insulating layer 26 and the contact hole 271 of the sixth insulating layer 27, and connects the inner end portion 212 of the fifth coil 211 and the lead wire 231 of the lead layer 23. One end is connected. The other end of the lead wire 231 is connected to the electrode.

  The conductive stud 224 passes through the contact hole 272 of the sixth insulating layer 27 and the contact hole 281 of the seventh insulating layer 28, and connects the inner end portion 222 of the sixth coil 221 and the lead wire 241 of the lead layer 24. One end is connected. The other end of the lead wire 241 is connected to the electrode.

  First coil layer 3, second coil layer 5, third coil layer 7 ', fourth coil layer 9', fifth coil layer 21, sixth coil layer 22, lead layer 23 and lead layer The 24 materials can include silver, palladium, aluminum, chromium, nickel, titanium, gold, copper, platinum or an alloy thereof, and can be manufactured by a vacuum film formation process (evaporation or sputtering) or a plating process.

  The material of the conductive studs 12, 13, 75, 95, 214, and 224 may include silver, palladium, aluminum, chromium, nickel, titanium, gold, copper, platinum, or an alloy thereof, and a vacuum film formation process (evaporation). Or sputtering) or a plating process.

  In one embodiment, at least one of the first material layer 1 and the second material layer 11 includes a magnetic material.

  In one embodiment, at least one of the first material layer 1 and the second material layer 11 includes a hetero-laminated substrate.

  FIG. 6 is a plan view of a part of a common mode filter 100 ′ according to another embodiment. FIG. 7 is a cross-sectional view of a common mode filter 100 'in another embodiment. Please refer to FIG. 6 and FIG. The common mode filter 100 ′ includes a first coil layer 3, a second coil layer 5, a third coil layer 7, a fourth coil layer 9, and a magnetic material portion (601, 602, 603, or 604). And. The first coil layer 3 includes a first coil 31, the second coil layer 5 includes a second coil 51, and the third coil layer 7 includes a third coil 71. The fourth coil layer 9 includes a fourth coil 91. The second coil 51 is disposed between the first coil 31 and the third coil 71, and the third coil 71 is disposed between the second coil 51 and the fourth coil 91. Has been. The first coil 31 and the third coil 71 are connected in series, and the second coil 51 and the fourth coil 91 are connected in series. Since the first coil 31 and the third coil 71 connected in series and the second coil 51 and the fourth coil 91 connected in series are electromagnetically connected, the first coil 31 and the third coil 91 connected in series are connected. Common mode noise can be removed by the first coil 31 and the third coil 71 and the second coil 51 and the fourth coil 91 connected in series. Since the magnetic material portion (601, 602, 603, or 604) is penetrated through the first coil 31, the second coil 51, the third coil 71, and the fourth coil 91, the common mode filter 100 ' An excellent common mode impedance value can be provided.

  In one embodiment, the common mode filter 100 ′ includes a magnetic material portion 601, of which the first coil 31, the second coil 51, the third coil 71, and the fourth coil 91 are the magnetic material portion 601. It is arrange | positioned so that it may surround.

  In one embodiment, the common mode filter 100 ′ includes a magnetic material portion 601, and the magnetic material portion 601 includes the first coil 31, the second coil 51, the third coil 71, and the fourth coil 91. It is penetrated at the center of the coil.

  In one embodiment, the common mode filter 100 ′ includes a magnetic material portion (602, 603, or 604), and the magnetic material portion (602, 603, or 604) includes the first coil 31 and the second coil 51. The third coil 71 and the fourth coil 91 are provided in a winding gap (inter-turn spaces) 96.

  In one embodiment, the common mode filter 100 ′ includes a magnetic material portion 601 and at least one magnetic material portion (602, 603, or 604).

  FIGS. 8 to 10 are schematic cross-sectional views showing a manufacturing process procedure of the common mode filter 100 ′ according to one embodiment of the present invention. The common mode filter 100 ′ of the embodiment of FIG. 10 is similar to the common mode filter 100 of the embodiment of FIG. 1 except that the common mode filter 100 ′ includes a magnetic material portion 601. Therefore, the structure of the coil layer in the common mode filter 100 ′ and the connection method between the coils can be referred to FIG. 1. Please refer to FIG. 1 and FIG. First, the material layer 1 is prepared. In one embodiment, the material layer 1 can be an insulating material layer. In one embodiment, the material layer 1 can be a magnetic material layer. In one embodiment, the material layer 1 can be the hetero-laminated substrate shown in FIGS. 13 to 15, and the hetero-laminated substrate includes an insulating material layer and a magnetic material layer. The insulating material layer and magnetic material layer can be co-fired or adhesive bonded. The insulating material layer and the magnetic material layer may be formed by thick film printing. The magnetic material layer can include nickel zinc ferrite or manganese zinc ferrite. The magnetic material layer can include a polymer material and a magnetic powder. The polymeric material can include polyimide, epoxy resin or benzocyclobutene resin. The magnetic powder contains nickel zinc ferrite or manganese zinc ferrite. The insulating material layer can include aluminum oxide, aluminum nitride, glass or quartz.

  Thereafter, the side insulating layer 2 is formed on the first material layer 1. The material of the side insulating layer 2 can include a polymer material, which includes polyimide, epoxy resin, or benzocyclobutene resin. The method for manufacturing the side insulating layer 2 can include a spin coating process, a dipping process, a spraying process, a screen printing process, a thin film forming process, and the like.

  Still referring to FIG. 1 and FIG. A first coil layer 3 is formed on the side insulating layer 2, and the first coil layer 3 includes a first coil 31 and an electrode 34 (FIG. 1). The outer end 33 of one coil 31 is connected to the electrode 34 (FIG. 1). In manufacturing the first coil layer 3, first, a metal layer can be deposited by a vacuum film forming process (evaporation or sputtering) or a plating process. Thereafter, the metal layer is patterned by a microlithography process. The metal layer can include silver, palladium, aluminum, chromium, nickel, titanium, gold, copper, platinum or an alloy thereof.

  In particular, the first coil 31 can be formed by a frame plating process. In the frame plating process, first, an electrode layer is formed on the side insulating layer 2. The electrode layer can be formed by sputtering or vapor deposition. A chromium film or a titanium film can be formed under the electrode layer to improve adhesion. Next, a mask layer having a coil pattern is formed by a microlithography process. Subsequently, a plating process is performed to form a plating layer. Thereafter, the mask layer is peeled off. Thereafter, the first coil 31 can be formed by removing the electrode layer in an etching process.

  Thereafter, the first insulating layer 4 is formed to cover the first coil layer 3. The first insulating layer 4 can include a polymer material, which includes polyimide, epoxy resin, or benzocyclobutene resin. The manufacturing method of the 1st insulating layer 4 can include a spin coating process, a dipping process, a spray process, a screen printing process, or a thin film formation process.

  Thereafter, a second coil layer 5 is formed on the first insulating layer 4, and the second coil layer 5 includes a second coil 51 and an electrode 54 (FIG. 1). Of these, the outer end 53 of the second coil 51 is connected to the electrode 54 (FIG. 1). The material of the second coil layer 5 includes a metal including silver, palladium, aluminum, chromium, nickel, titanium, gold, copper, platinum, or an alloy thereof. The metal material of the second coil layer 5 can be deposited by a vacuum film formation process (evaporation or sputtering) or a plating process. Micropatterning can be used for patterning the second coil layer 5. In one embodiment, the second coil 51 may be manufactured by the frame plating process described above.

  Thereafter, the second insulating layer 6 is formed to cover the second coil layer 5. The second insulating layer 6 can include a polymeric material, which includes polyimide, epoxy resin, or benzocyclobutene resin. The manufacturing method of the second insulating layer 6 can include a spin coating process, a dipping process, a spraying process, a screen printing process, a thin film forming process, and the like.

  Next, referring to FIG. Contact holes 41 and 61 are formed on the inner end portion 32 of the first coil 31 by a microlithography process to expose the inner end portion 32 of the first coil 31. Thereafter, a metal is deposited in the contact holes 41 and 61 by a vacuum film forming process (evaporation or sputtering) or a plating process to form the conductive stud 12.

  Reference is again made to FIGS. 1 and 8. A third coil layer 7 is formed on the second insulating layer 6. The third coil layer 7 includes a third coil 71 and an electrode 74 (FIG. 1), of which the outer end 73 of the third coil 71 is connected to the electrode 74 (FIG. 1). The inner end 72 of the third coil 71 is connected to the conductive stud 12. The material of the third coil layer 7 includes a metal including silver, palladium, aluminum, chromium, nickel, titanium, gold, copper, platinum, or an alloy thereof. The metal material of the third coil layer 7 can be deposited by a vacuum film formation process (evaporation or sputtering) or a plating process. Micropatterning can be used for patterning the third coil layer 7. In one embodiment, the third coil 71 may be manufactured by the frame plating process described above.

  Thereafter, a third insulating layer 8 is formed to cover the third coil layer 7. The third insulating layer 8 can include a polymeric material, which includes polyimide, epoxy resin, or benzocyclobutene resin. The manufacturing method of the third insulating layer 8 can include a spin coating process, a dipping process, a spraying process, a screen printing process, or a thin film forming process.

  Subsequently, contact holes 62 and 81 are formed by a microlithography process to expose the inner end 52 of the second coil 51. Thereafter, a metal is deposited in the contact holes 62 and 81 by a vacuum film forming process (evaporation or sputtering) or a plating process to form the conductive stud 13.

  Thereafter, a fourth coil layer 9 is formed on the third insulating layer 8. The fourth coil layer 9 includes a fourth coil 91 and an electrode 94 (FIG. 1), of which the outer end 93 of the fourth coil 91 is connected to the electrode 94 (FIG. 1). The inner end 92 of the fourth coil 91 is connected to the conductive stud 13. The material of the fourth coil layer 9 includes a metal including silver, palladium, aluminum, chromium, nickel, titanium, gold, copper, platinum, or an alloy thereof. The metal material of the fourth coil layer 9 can be deposited by a vacuum film formation process (evaporation or sputtering) or a plating process. The patterning of the fourth coil layer 9 can use a microlithography process. In one embodiment, the fourth coil 91 may be manufactured by the frame plating process described above.

  Thereafter, the side insulating layer 10 is formed to cover the fourth coil layer 9. The side insulating layer 10 may include a polymer material including polyimide, epoxy resin, or benzocyclobutene resin.

  Further, a concave portion 605 penetrating the first insulating layer 4, the second insulating layer 6, and the third insulating layer 8 is formed to expose the side insulating layer 2. In one embodiment, the recess 605 can expose the surface that supports the first coil layer 3. In another embodiment, the recess 605 can penetrate the surface that supports the first coil layer 3.

  Please refer to FIG. The magnetic material 606 covers the side insulating layer 10 and fills the recess 605. The magnetic material 606 can include a resin. The magnetic material 606 can cover the side insulating layer 10 by a printing method. Subsequently, the magnetic material 606 is cured.

  The hardened magnetic material 606 is polished to leave a desired portion. In one embodiment, the hardened magnetic material 606 on the side insulating layer 10 can be removed. In another embodiment, the cured magnetic material 606 on the side insulating layer 10 can be polished as a thin film layer covering the side insulating layer 10.

  Please refer to FIG. A material layer 11 is disposed on the side insulating layer 10. In one embodiment, the material layer 11 can be an insulating material layer including polyimide, epoxy resin, or benzocyclobutene resin. In one embodiment, the material layer 11 can comprise a magnetic substrate.

  In one embodiment, the material layer 11 can be adhered onto the side insulating layer 10 by the adhesive layer 701.

  Since the common mode filter including the magnetic material portion of other embodiments in the present application can be completed by the manufacturing process shown in FIGS. 8 to 10, the detailed description of the manufacturing process is omitted here.

  FIG. 11 is a graph showing the relationship between the impedance value and the frequency of a common mode filter having a multilayer spiral structure according to an embodiment of the present invention. FIG. 12 shows a relationship graph between the impedance value and frequency of a known common mode filter. Comparing the graphs shown in FIG. 11 and FIG. 12, it can be seen that the common mode filter having a multilayer spiral structure has a high maximum impedance value, and the frequency band is wide at the same impedance value. Therefore, the common mode filter having a multilayer spiral structure surely shows performance superior to that of the conventional common mode filter. Furthermore, by adding a magnetic material into the insulating layer of the common mode filter having a multilayered spiral structure, the common mode impedance of the common mode filter can be increased and the inductance value of the common mode filter can be enhanced. Further, since the magnetic material portion is embedded in the common mode filter having a multilayered spiral structure, the common mode impedance of the common mode filter can be increased and the inductance value of the common mode filter can be increased.

  The technical contents and technical features of the present invention are as described above. However, those skilled in the technical field of the present invention will not depart from the technical idea and scope of the present invention, which is limited by the appended claims. It should be understood that the teachings and disclosure of the present invention are capable of various substitutions and additions. For example, the above-described many manufacturing steps can be performed in different ways, or can be changed to other steps, or the two types described above can be combined.

  Further, the scope of rights of the present application is not limited to the manufacturing process, equipment, manufacturing, material components, apparatus, method, or procedure of the specific examples disclosed above. Those of ordinary skill in the art of the present invention will be present or will be developed at a later date based on the manufacturing processes, equipment, manufacturing, material components, apparatus, methods or procedures taught and disclosed herein. Regardless, it may also be used in the present invention that achieves substantially the same effect and achieves substantially the same result in substantially the same manner as disclosed in the embodiments of the present application. You should understand what you can do. Accordingly, the appended claims are intended to include such manufacturing processes, equipment, manufacturing, material components, apparatus, methods or procedures.

DESCRIPTION OF SYMBOLS 1 1st material layer 2 Side part insulating layer 3 1st coil layer 4 1st insulating layer 5 2nd coil layer 6 2nd insulating layer 7, 7 '3rd coil layer 8 3rd insulating layer 9, 9 'Fourth coil layer 10 Side insulating layer 11 Second material layer 12, 13, 17, 18, 19, 75, 95, 214, 224 Conductive stud 14, 14' First lead layer 15 15 '2nd lead layer 21 5th coil layer 22 6th coil layer 23, 24, 231, 241 Lead layer 25 4th insulating layer 26 5th insulating layer 27 6th insulating layer 28 7th Insulating layer 31 First coil 32, 52, 72, 92, 212, 222 Inner end 33, 53, 73, 93, 213, 223 Outer end 34, 54, 74, 94 Electrode 35, 36 External insulating layer 41, 42, 61-65, 81-83, 251, 252, 26 , 262, 271, 272, 281 Contact hole 51 Second coil 71 Third coil 91 Fourth coil 96 Winding gap 100, 100 'Common mode filter 111 Insulating material layer 112, 112', 112 '' Magnetic material Layers 141, 142, 151, 152, 231, 241 Lead wire 211 Fifth coil 221 Sixth coil 300 Common mode filter 301 Surrounding 400 Common mode filter 500 Common mode filter 601-604 Magnetic material portion 605 Recessed portion 606 Magnetic material 701 Adhesive layer 1121 ', 1121''magnetic material block

Claims (15)

A first coil;
A second coil;
A first insulating layer separating the first coil and the second coil;
A third coil connected in series to the first coil;
A second insulating layer separating the second coil and the third coil;
A fourth coil connected in series to the second coil;
A third insulating layer separating the third coil and the fourth coil;
A first material layer;
A second material layer;
With
The second coil is disposed between the first coil and the third coil;
The third coil is disposed between the second coil and the fourth coil;
The first coil, the second coil, the third coil, and the fourth coil are provided between the first material layer and the second material layer,
The first insulating layer, at least one of said second insulating layer and said third insulating layer is observed containing a magnetic material,
One of the first material layer and the second material layer is a hetero laminated substrate having a magnetic material layer and an insulating material layer,
A common mode filter having a multilayered spiral structure, wherein the magnetic material layer has a plurality of independent magnetic material blocks . The common mode filter having a multilayer spiral structure according to claim 1 , wherein the magnetic material layer and the insulating material layer are bonded by diffusion bonding or adhesive bonding.   The inner end of the first coil and the inner end of the third coil are connected, and the inner end of the second coil and the inner end of the fourth coil are connected. The common mode filter having a multilayered spiral structure according to claim 1. The outer end of the first coil, the outer end of the second coil, the outer end of the third coil, and the outer end of the fourth coil are adjacent to the periphery of the common mode filter. The common mode filter having a multilayered spiral structure according to claim 3 .   The inner end of the first coil and the inner end of the third coil are connected, and the outer end of the second coil and the outer end of the fourth coil are connected. The common mode filter having a multilayered spiral structure according to claim 1. The first end is connected to the inner end of the second coil, the second end is adjacent to the periphery of the common mode filter, and the first end Is connected to the inner end of the fourth coil, and the second end further includes a second lead wire adjacent to the periphery of the common mode filter. Item 6. A common mode filter having a multilayer spiral structure according to Item 5 .   The outer end of the first coil and the outer end of the third coil are connected, and the outer end of the second coil and the outer end of the fourth coil are connected. The common mode filter having a multilayered spiral structure according to claim 1. A first lead having an end connected to the inner end of the second coil;
A second lead having an end connected to the inner end of the third coil;
The multi-layer spiral common mode filter according to claim 7 , further comprising: A first coil;
A second coil;
A third coil connected in series to the first coil;
A fourth coil connected in series to the second coil;
A magnetic material portion penetrating through the first coil, the second coil, the third coil, and the fourth coil;
A first material layer;
A second material layer;
With
The second coil is disposed between the first coil and the third coil;
The third coil is disposed between the second coil and the fourth coil ;
The first coil, the second coil, the third coil, and the fourth coil are provided between the first material layer and the second material layer,
One of the first material layer and the second material layer is a hetero laminated substrate having a magnetic material layer and an insulating material layer,
A common mode filter having a multilayered spiral structure, wherein the magnetic material layer has a plurality of independent magnetic material blocks . A first insulating layer that separates the first coil and the second coil;
A second insulating layer that separates the second coil and the third coil;
A third insulating layer that separates the third coil and the fourth coil;
Further comprising
The common mode filter having a multilayer spiral structure according to claim 9 , wherein at least one of the first insulating layer, the second insulating layer, and the third insulating layer contains a magnetic material. . The common mode filter having a multilayer spiral structure according to claim 9 , wherein the first coil, the second coil, the third coil, and the fourth coil surround the magnetic material portion. 10. The multilayer according to claim 9 , wherein the magnetic material portion is provided in a winding gap between the first coil, the second coil, the third coil, and the fourth coil. Spiral structure common mode filter. Forming a magnetic material layer having a plurality of independent magnetic material blocks on the insulating material layer to obtain a hetero-laminated substrate;
Forming a first coil having an inner end and an outer end on the hetero-laminated substrate ;
Forming a first insulating layer and covering the first coil;
Forming a second coil having an inner end and an outer end on the first insulating layer;
Forming a second insulating layer and covering the second coil;
Forming a first contact hole to expose the inner end or the outer end of the first coil;
Filling the first contact hole with a first metal to form a first conductive stud;
Forming on the second insulating layer a third coil having an inner end and an outer end, one of which is connected to the first conductive stud;
Forming a third insulating layer to cover the third coil;
Forming a second contact hole to expose the inner end or the outer end of the second coil;
Filling the second contact hole with a second metal to form a second conductive stud;
Forming on the third insulating layer a fourth coil having an inner end and an outer end, one of which is connected to the second conductive stud;
Forming a fourth insulating layer to cover the fourth coil;
Forming a recess penetrating the first coil, the second coil, the third coil, and the fourth coil;
Filling the recess with a magnetic material;
Providing a material layer on the fourth insulating layer;
Of manufacturing a common mode filter having a multi-layered spiral structure. The first coil, the second coil, the third coil, and the fourth coil surround the concave portion, or the concave portion is the first coil, the second coil, and the third coil. The manufacturing method according to claim 13 , wherein the manufacturing method is performed so as to penetrate a winding gap between the coil and the fourth coil. The first insulating layer, the second insulating layer, the third insulating layer, or the material layer contains polyimide, an epoxy resin, or a benzocyclobutene resin, and the first insulating layer, the second insulating layer, 14. The manufacturing method according to claim 13 , wherein at least one of the insulating layer and the third insulating layer includes a magnetic material.

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