JP5594884B2 - Electronic equipment cooling structure - Google Patents
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- JP5594884B2 JP5594884B2 JP2010225049A JP2010225049A JP5594884B2 JP 5594884 B2 JP5594884 B2 JP 5594884B2 JP 2010225049 A JP2010225049 A JP 2010225049A JP 2010225049 A JP2010225049 A JP 2010225049A JP 5594884 B2 JP5594884 B2 JP 5594884B2
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- 238000001816 cooling Methods 0.000 title claims description 36
- 238000009423 ventilation Methods 0.000 claims 2
- 230000005540 biological transmission Effects 0.000 description 14
- 239000000758 substrate Substances 0.000 description 6
- 238000007664 blowing Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 101000600488 Pinus strobus Putative phosphoglycerate kinase Proteins 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
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Description
本発明は、内部に電力増幅部、電源ユニットおよび電子部品を実装した複数のプリント基板が収納された電子機器の冷却構造に関するものである。 The present invention relates to a cooling structure for an electronic device in which a plurality of printed circuit boards in which a power amplifying unit, a power supply unit, and an electronic component are mounted are housed.
従来、ＦＰＵ（Field Pickup Unit）等の放送用無線中継装置は屋外での使用が大半であるため防雨構造が必須であり、密閉構造を採用してきた。また、可搬型であるがゆえに小型軽量化が求められており、また、近年は他の電子機器と同様に電子回路のディジタル化が進み、多機能化および高性能化が図られている。
当然のことながら、機器の消費電力が増加した上で密閉筐体を小型化するため、内部温度上昇が高くなり、電子機器の寿命低下および性能劣化を招く要因となっている。このような背景のもと、ＦＰＵ等の放送用無線中継装置には高効率な放熱構造を適用する必要がある。
Conventionally, broadcast radio relay devices such as FPU (Field Pickup Unit) are mostly used outdoors, so a rainproof structure is essential, and a sealed structure has been adopted. In addition, since it is portable, a reduction in size and weight has been demanded, and in recent years, electronic circuits have been digitized in the same manner as other electronic devices, and multifunctional and high performance have been achieved.
As a matter of course, since the power consumption of the device is increased and the hermetic casing is reduced in size, the internal temperature is increased, which causes a decrease in the life and performance of the electronic device. Under such a background, it is necessary to apply a high-efficiency heat dissipation structure to a broadcast wireless relay device such as an FPU.
そこで、従来技術の一例として、特許文献１には、密閉筐体の外部に強制空冷を行うための冷却装置を取り付けた電子機器が開示されている。 Therefore, as an example of the prior art, Patent Document 1 discloses an electronic apparatus in which a cooling device for performing forced air cooling is attached to the outside of a sealed casing.
特許文献１における放熱構造では、電子機器１の筐体内部に配置された電力増幅部や電源ユニット等の発熱部品３から発生した熱は、筐体下部に位置するフィン型ヒートシンク４を介して筐体外部へ高効率に放熱されるが、筐体カバー２内に実装された電子回路部からの発熱は筐体内部での自然対流のみで放熱するしかない。
しかし、背景技術で述べたように、近年はディジタル化の促進によりプリント基板上に搭載した集積回路からの発熱量が多くなってきたことと、筐体の小型化によりフィン型ヒートシンク４の上面に電子部品を密着取り付けするスペースが狭くなっているため、フィン型ヒートシンク４からの放熱だけでは密閉筐体内で発熱する熱量全体を高効率に筐体外部へ放熱することができないという問題があった。
In the heat dissipation structure in Patent Document 1, heat generated from the heat-generating component 3 such as a power amplifying unit and a power supply unit arranged inside the casing of the electronic device 1 is transmitted through the fin-type heat sink 4 located at the bottom of the casing. Although heat is radiated with high efficiency to the outside of the body, the heat generated from the electronic circuit mounted in the housing cover 2 can only be radiated by natural convection inside the housing.
However, as described in the background art, in recent years, the amount of heat generated from the integrated circuit mounted on the printed circuit board has been increased due to the promotion of digitization, and on the upper surface of the fin heat sink 4 due to the downsizing of the casing. Since the space for tightly attaching the electronic components is narrow, there is a problem that the entire amount of heat generated in the sealed housing cannot be radiated to the outside of the housing with high efficiency only by heat radiation from the fin-type heat sink 4.
本発明は、このような従来の事情に鑑みなされたものであり、密閉構造の電子機器筐体内で発生する熱量全体を高効率に筐体外部へ放熱する電子機器の冷却構造を提供することを目的とする。 The present invention has been made in view of such conventional circumstances, and provides a cooling structure for an electronic device that efficiently dissipates the entire amount of heat generated in the sealed electronic device housing to the outside of the housing. Objective.
上述した課題を解決し、目的を達成するため、本発明は、密閉構造の筐体と、当該筐体内部を冷却するファンとを備えた電子機器の冷却構造において、発熱部品を実装する異なる長さの２枚の回路基板を有し、前記２枚の回路基板の発熱部品実装面が互いに対向すると共に、ダクトの一部となるよう配置し、前記ファンから前記ダクトの中に冷却風を送風する電子機器の冷却構造であって、前記ファンからの冷却風が前記２枚の回路基板の内の長さが短い回路基板に実装された発熱部品に直接当たるように設けられた風穴部分に前記ファンを傾斜させて設置することを特徴とする。 In order to solve the above-described problems and achieve the object, the present invention provides a cooling structure for an electronic device including a sealed housing and a fan for cooling the inside of the housing. The two circuit boards are arranged so that the heat generating component mounting surfaces of the two circuit boards face each other and become part of the duct, and the cooling air is blown from the fan into the duct. In the cooling structure of the electronic device, the cooling air from the fan is provided in the air hole portion provided so as to directly hit the heat generating component mounted on the circuit board having a short length of the two circuit boards. It is characterized by installing the fan at an angle .
上述した課題を解決し、目的を達成するため、本発明は、更に、前記２枚の回路基板の内の長さが長い回路基板の端面付近に設けられた風穴から前記ファンにより引き込まれた対流により前記長さが長い回路基板の端面付近に実装された発熱部品を冷却することを特徴とする。 In order to solve the above-described problems and achieve the object, the present invention further provides convection drawn by the fan from an air hole provided in the vicinity of an end surface of the circuit board having a long length between the two circuit boards. Thus, the heat generating component mounted in the vicinity of the end face of the circuit board having a long length is cooled .
上述した課題を解決し、目的を達成するため、本発明は、更に、前記ファンからの送風ルートにガイドを設けることにより、前記ファンの送風のショートパスを防止し、発熱部品によって温度上昇した空気を前記筐体に熱伝達した後、前記ファンにもどすようにすることを特徴とする。 In order to solve the above-mentioned problems and achieve the object, the present invention further provides a guide in the air blowing route from the fan, thereby preventing a short path of air blowing from the fan and increasing the temperature of the air by the heat-generating component. After the heat is transferred to the housing, it is returned to the fan.
本発明によれば、対向配置した発熱部品実装基板間にファンから送風することにより、冷却風の熱伝達量を増加させることができるという効果がある。また、最も発熱する部品にファンから直接冷却風をぶつけることにより、冷却効果が増大し、発熱部品の温度上昇を抑えることができるという効果がある。また、ガイド板を用いて空気の漏れを防ぐことにより、ファンからの送風のショートパスが防止でき、温度上昇した空気を筐体に熱伝達させた後、ファンにもどすことによって、内部の温度上昇を抑制することができるという効果がある。 According to the present invention, there is an effect that it is possible to increase the heat transfer amount of the cooling air by blowing air from the fan between the heat generating component mounting substrates arranged to face each other. Further, by directly hitting the cooling air from the fan to the most heat-generating component, the cooling effect is increased, and the temperature rise of the heat-generating component can be suppressed. In addition, by using the guide plate to prevent air leakage, it is possible to prevent a short path of air blown from the fan. After the heated air is transferred to the housing, the internal temperature rises by returning it to the fan. There is an effect that can be suppressed.
以下に、本発明の実施の形態に係る電子機器の冷却構造を採用した放送用無線中継装置について、図１から図６を参照しながら説明する。
放送用無線中継装置は、テレビジョン放送素材をマイクロ波回線で伝送するものである。一般的には、図５に示すように、送信制御部１０１と送信高周波部１０２から成る送信側装置と、受信高周波部２０１と受信制御部２０２から成る受信側装置で構成され、送信高周波部１０２と受信高周波部２０１との間でディジタル信号をマイクロ波で搬送して送受信を行う。また、送信高周波部１０２及び受信高周波部２０１は、中継の際に屋外で使用することが多いため、筐体構造はそれぞれ防滴構造となっている。
また、高周波部と制御部を一体化し、高周波部内部に制御機能（画像/音声信号圧縮機能、ディジタル変調機能）を備えた放送用無線中継装置がある。このような放送用無線中継装置は、特に、ヘリコプター等の移動体に搭載して使用される。また、図６に示すように、送信装置１００と受信装置２００で構成され、送信装置１００と受信装置２００との間でディジタル信号をマイクロ波で搬送し送受信が行われる。
Hereinafter, a broadcast radio relay apparatus that employs a cooling structure for an electronic device according to an embodiment of the present invention will be described with reference to FIGS.
The broadcast wireless relay device transmits a television broadcast material through a microwave line. In general, as shown in FIG. 5, the transmission high frequency unit 102 includes a transmission side device including a transmission control unit 101 and a transmission high frequency unit 102 and a reception side device including a reception high frequency unit 201 and a reception control unit 202. The digital signal is transmitted and received between the receiving high-frequency unit 201 and the microwave. In addition, since the transmission high-frequency unit 102 and the reception high-frequency unit 201 are often used outdoors during relaying, the casing structure has a drip-proof structure.
In addition, there is a broadcasting wireless relay device in which a high frequency unit and a control unit are integrated and a control function (image / audio signal compression function, digital modulation function) is provided inside the high frequency unit. Such a broadcast wireless relay device is used by being mounted on a moving body such as a helicopter. Also, as shown in FIG. 6, the transmission device 100 and the reception device 200 are configured, and digital signals are transmitted and received between the transmission device 100 and the reception device 200 by microwaves.
そこで、本発明の実施の形態に係る電子機器の冷却構造を採用した放送用無線中継装置が、上記した高周波部と制御部を一体化した送信装置１００である場合について、図１から図４を参照しながら説明する。
図１は、本発明の実施の形態に係る電子機器の冷却構造を採用した放送用無線中継装置の垂直断面図であり、図２は、図１のＡ部詳細図である。また、図３は、本発明の実施の形態に係る電子機器の冷却構造を採用した放送用無線中継装置の水平断面図である。また、図４は、本発明の実施の形態に係る電子機器の冷却構造を採用した放送用無線中継装置の内部基板実装箇所の分解斜視図である。
Therefore, in the case where the broadcast wireless relay device adopting the electronic device cooling structure according to the embodiment of the present invention is the transmission device 100 in which the high-frequency unit and the control unit are integrated, FIGS. The description will be given with reference.
FIG. 1 is a vertical cross-sectional view of a broadcast radio relay apparatus that employs a cooling structure for an electronic device according to an embodiment of the present invention, and FIG. 2 is a detailed view of part A of FIG. FIG. 3 is a horizontal cross-sectional view of a broadcast radio relay apparatus that employs a cooling structure for electronic equipment according to an embodiment of the present invention. FIG. 4 is an exploded perspective view of a place where the internal substrate is mounted in the broadcast radio relay apparatus adopting the electronic device cooling structure according to the embodiment of the present invention.
放送用無線中継装置の内部には、マイクロ波周波数を発生する部分と搬送電力を増幅する電力増幅部（以下、ＰＡという）１４及びＤＣ電源（以下、ＰＳという）１５があり、ＰＡ１４とＰＳ１５は送信出力に応じて発熱量が増加する。また、放送用無線中継装置は屋外で使用することが多く、筐体１の構造は防滴仕様の密閉構造である。そのため、図１に示すように、ＰＡ１４及びＰＳ１５で発生した熱は筐体１の底部に配置した放熱器１３から放熱している。ＰＡ１４内部の発熱デバイスの温度上昇をメーカの保証温度内に抑えるため、放熱器１３の横に遠心ファン１２を設け、遠心ファン１２から放熱器１３に形成されたフィンに沿って冷却風を送り、放熱器１３の熱抵抗を下げるようにしている。 Inside the broadcast radio relay apparatus, there are a part that generates a microwave frequency, a power amplifying unit (hereinafter referred to as PA) 14 that amplifies carrier power, and a DC power source (hereinafter referred to as PS) 15. The calorific value increases according to the transmission output. Moreover, the broadcast wireless relay device is often used outdoors, and the structure of the housing 1 is a drip-proof sealed structure. Therefore, as shown in FIG. 1, the heat generated in the PA 14 and PS 15 is radiated from the radiator 13 disposed at the bottom of the housing 1. In order to keep the temperature rise of the heat generating device inside the PA 14 within the manufacturer's guaranteed temperature, a centrifugal fan 12 is provided beside the radiator 13, and cooling air is sent from the centrifugal fan 12 along the fins formed in the radiator 13, The heat resistance of the radiator 13 is lowered.
一方、放送用無線中継装置は可搬型のため、装置の容積が小さく、ＰＡ１４やＰＳ１５以外の発熱デバイスから発生する熱を効率よく筐体１から放熱させるために、装置内部に軸流ファン９を搭載し内部の空気を攪拌させ、発熱デバイスの温度上昇を下げる必要がある。
そこで、矢印を使って空気の流れを示すと、図１、図２のように、軸流ファン９から放出された空気は基板取付金具２に設けた風穴ｂ２１より侵入し、発熱部品ｃ７に接合された放熱フィン８に沿って矢印２４のように流れる。そのときの風圧によって、メイン基板４に実装された発熱部品ｂ６付近の空気が引っ張られて、風穴ａ２０より空気が取り込まれ、対流が生じて発熱部品ｂ６が冷却されるようになる。
これらの空気はメイン基板４とエンコーダ基板３の間を通り、メイン基板４、エンコーダ基板３の発熱部品ａ５等の熱を吸収し暖められ、基板取付金具２に設けた風穴ｄ２３より排出され、表示制御基板１１に突き当たる。
On the other hand, since the broadcast radio relay apparatus is portable, the volume of the apparatus is small, and in order to efficiently dissipate the heat generated from the heat generating devices other than PA14 and PS15 from the housing 1, an axial fan 9 is provided inside the apparatus. It is necessary to agitate the internal air and reduce the temperature rise of the heat generating device.
Accordingly, when the flow of air is shown using arrows, as shown in FIGS. 1 and 2, the air discharged from the axial fan 9 enters through the air holes b21 provided in the board mounting bracket 2 and is joined to the heat generating component c7. It flows as indicated by an arrow 24 along the radiating fin 8. At that time, the air pressure near the heat generating component b6 mounted on the main board 4 is pulled by the wind pressure, and the air is taken in from the air hole a20, and convection is generated to cool the heat generating component b6.
These air passes between the main board 4 and the encoder board 3, absorbs heat from the main board 4, the heat generating component a5 of the encoder board 3, etc., is warmed, and is discharged from the air holes d23 provided in the board mounting bracket 2. It strikes against the control board 11.
次に、図３に示すように、表示制御基板１１に突き当たった空気は筐体１の側面左右方向二手に分かれ、マザー基板１６と筐体側面部ａ１８との間、カゼガイドｂ１７と筐体側面部ｂ１９との間を通過する。その際に、暖められた空気は筐体側面部ａ１８または筐体側面部ｂ１９を介して筐体外部と熱交換し、冷却される。冷却された空気は再び軸流ファン９に吸入される。このような空気の循環を繰り返すことによって効率良く筐体内部の冷却が行われる。 Next, as shown in FIG. 3, the air that hits the display control board 11 is split into two in the lateral direction of the side surface of the housing 1, and between the mother board 16 and the housing side surface portion a 18, the case guide b 17 and the housing side surface portion It passes between b19. At that time, the warmed air is cooled by exchanging heat with the outside of the housing via the housing side surface portion a18 or the housing side surface portion b19. The cooled air is again sucked into the axial fan 9. By repeating such air circulation, the inside of the housing is efficiently cooled.
ここで、図４を基に、放送用無線中継装置の内部基板実装箇所の構成について説明する。
筐体１に固定された基板取付金具２にマザー基板１６をネジａ２５にて取り付け、これにメイン基板４、エンコーダ基板３をガイドレールに沿ってスライドし、マザー基板１６のコネクタ２７に嵌合させる。その後、カゼガイドｂ１７を基板取付金具２にネジｂ２６にて取付ける。これにより、上面メイン基板４、下面エンコーダ基板３、側面カゼガイドｂ１７、マザー基板１６、入口風穴ｂ２１、出口風穴ｄ２３としたダクト構造となる。また、メイン基板４、エンコーダ基板３の部品面を対向するように取付けることで、ダクト構造内部に発熱部品が集中し、そこに冷却風を流すことで放熱効率を向上させる構造としている。
Here, based on FIG. 4, the structure of the internal substrate mounting location of the broadcast wireless relay device will be described.
The mother board 16 is attached to the board mounting bracket 2 fixed to the housing 1 with screws a25, and the main board 4 and the encoder board 3 are slid along the guide rail to be fitted to the connector 27 of the mother board 16. . Thereafter, the case guide b17 is attached to the board mounting bracket 2 with screws b26. As a result, a duct structure having the upper main board 4, the lower encoder board 3, the side case guide b17, the mother board 16, the inlet air hole b21, and the outlet air hole d23 is obtained. Further, the heat generating components are concentrated inside the duct structure by attaching the component surfaces of the main substrate 4 and the encoder substrate 3 so as to face each other, and the heat radiation efficiency is improved by flowing cooling air there.
以上説明したように、本発明により、対向配置した発熱部品実装基板間にファンから送風することにより、冷却風の熱伝達量を増加させることができる。また、最も発熱する部品にファンから直接冷却風をぶつけることにより、冷却効果が増大し、発熱部品の温度上昇を抑えることができる。また、ガイド板を用いて空気の漏れを防ぐことにより、ファンからの送風のショートパスが防止でき、温度上昇した空気を筐体に熱伝達させた後、ファンにもどすことによって、内部の温度上昇を抑制することができる。 As described above, according to the present invention, it is possible to increase the heat transfer amount of the cooling air by blowing air from the fan between the heat-generating component mounting boards arranged to face each other. Further, by directly applying cooling air from the fan to the part that generates the most heat, the cooling effect is increased and the temperature rise of the heat-generating part can be suppressed. In addition, by using the guide plate to prevent air leakage, it is possible to prevent a short path of air blown from the fan. After the heated air is transferred to the housing, the internal temperature rises by returning it to the fan. Can be suppressed.
１：筐体、２：基板取付金具、３：エンコーダ基板、４：メイン基板、５：発熱部品ａ、６：発熱部品ｂ、７：発熱部品ｃ、８：放熱フィン、９：軸流ファン、１０：カゼガイドａ、１１：表示制御基板、１２：遠心ファン、１３：放熱器、１４：ＰＡ、１５：ＰＳ、１６：マザー基板、１７：カゼガイドｂ、１８：筐体側面部ａ、１９：筐体側面部ｂ、２０：風穴ａ、２１：風穴ｂ、２２：風穴ｃ、２３：風穴ｄ、２４：空気の流れ、２５：ネジａ、２６：ネジｂ、２７：コネクタ、１００：送信装置、１０１：送信制御部、１０２：送信高周波部、２００：受信装置、２０１：受信高周波部、２０２：受信制御部。 1: Housing, 2: Board mounting bracket, 3: Encoder board, 4: Main board, 5: Heat generation component a, 6: Heat generation component b, 7: Heat generation component c, 8: Heat radiation fin, 9: Axial fan, 10: Case guide a, 11: Display control board, 12: Centrifugal fan, 13: Radiator, 14: PA, 15: PS, 16: Mother board, 17: Case guide b, 18: Side face part a, 19: Housing Body side part b, 20: air hole a, 21: air hole b, 22: air hole c, 23: air hole d, 24: air flow, 25: screw a, 26: screw b, 27: connector, 100: transmission device, 101: transmission control unit, 102: transmission high-frequency unit, 200: reception device, 201: reception high-frequency unit, 202: reception control unit.
Claims (2)
発熱部品を実装する異なる長さの２枚の回路基板を有し、前記２枚の回路基板の発熱部品実装面が互いに対向すると共に、ダクトの一部となるよう配置し、前記ファンから前記ダクトの中に冷却風を送風する電子機器の冷却構造であって、
前記ファンからの冷却風が前記２枚の回路基板の内の長さが短い回路基板に実装された発熱部品に直接当たるように設けられた風穴部分に前記ファンを傾斜させて設置し、前記２枚の回路基板の内の長さが長い回路基板の端面付近に設けられた風穴から前記ファンにより引き込まれた対流により前記長さが長い回路基板の端面付近に実装された発熱部品を冷却することを特徴とする電子機器の冷却構造。 In a cooling structure of an electronic device provided with a sealed housing and a fan for cooling the inside of the housing,
The two circuit boards having different lengths for mounting the heat generating components are arranged, the heat generating component mounting surfaces of the two circuit boards are opposed to each other, and are arranged to be a part of the duct. A cooling structure for an electronic device that blows cooling air into
The fan is inclined and installed in an air hole portion provided so that the cooling air from the fan directly hits a heat generating component mounted on a circuit board having a short length of the two circuit boards. Cooling a heat-generating component mounted near the end face of the long circuit board by convection drawn by the fan from an air hole provided in the vicinity of the end face of the long circuit board among the circuit boards. A cooling structure for electronic equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010225049A JP5594884B2 (en) | 2010-10-04 | 2010-10-04 | Electronic equipment cooling structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010225049A JP5594884B2 (en) | 2010-10-04 | 2010-10-04 | Electronic equipment cooling structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012079978A JP2012079978A (en) | 2012-04-19 |
| JP5594884B2 true JP5594884B2 (en) | 2014-09-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2010225049A Expired - Fee Related JP5594884B2 (en) | 2010-10-04 | 2010-10-04 | Electronic equipment cooling structure |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6224315B2 (en) * | 2012-11-19 | 2017-11-01 | 株式会社日立国際電気 | Electronics |
| JP6974291B2 (en) * | 2018-11-09 | 2021-12-01 | 東芝三菱電機産業システム株式会社 | Semiconductor device |
| CN114423217B (en) * | 2020-10-28 | 2023-11-24 | 清华大学 | Waterproof safety inspection instrument |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6034839B2 (en) * | 1977-11-24 | 1985-08-10 | 株式会社日立製作所 | Cooling structure for electrical equipment |
| JPH04259291A (en) * | 1991-02-14 | 1992-09-14 | Hitachi Ltd | Electronic device |
| JPH0888490A (en) * | 1994-09-20 | 1996-04-02 | Hitachi Ltd | Cooler for vehicle controller |
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| JP2012079978A (en) | 2012-04-19 |
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